Heating mechanism and substrate processing device

Abstract

Provided in the present application are a heating mechanism and a substrate processing device. The heating mechanism comprises a heating plate assembly and at least two pipes, wherein the interior of the heating plate assembly is provided with at least two flow channel cavities spaced apart in a radial direction; the top of the heating plate assembly is provided with at least two sets of fluid outlet holes, and the bottom of the heating plate assembly is provided with at least two pipe connection ports; the input end of each pipe is configured to connect to a hot fluid conveying pipe, and the output end of each pipe is connected to a corresponding pipe connection port. In the heating mechanism of the present application, the thickness of the heating plate assembly is reduced, such that the distance between the upper surface of the heating plate assembly and the lower surface of a substrate is increased, allowing fluid discharged from the top of the heating plate assembly to be drained promptly, preventing the substrate from being immersed in the fluid discharged from the heating plate assembly; in addition, directly inserting different pipes into corresponding pipe connection ports can avoid cross-flow between fluids introduced into different flow channel cavities.

Description

Heating mechanism and substrate processing device TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor equipment, in particular to a heating mechanism and a substrate processing device comprising the same. BACKGROUND

[0002] Integrated circuit manufacturing includes processes such as photolithography, etching, deposition, chemical mechanical polishing (CMP), cleaning, etc. The cleaning process is used to remove various contaminants generated during substrate processing, and is the most frequently used process in integrated circuit manufacturing, almost throughout the entire integrated circuit manufacturing process. Contaminants refer to any substance introduced during integrated circuit manufacturing that can harm the yield and electrical performance of the chip, and specific contaminants include particles, organic matter, metals, and native oxide layers, etc.

[0003] Semiconductor cleaning technology is mainly divided into wet cleaning process and dry cleaning process. In the wet cleaning process, the substrate is fixed on a rotatable substrate clamp, and chemical solution and deionized water are used to process the surface of the rotating substrate during the process. After the wet etching or cleaning process is completed, the substrate is dried.

[0004] Traditional drying processes mostly use nitrogen blowing or isopropyl alcohol (IPA) in combination with high-speed rotation of the substrate. In the current IPA drying process, a liquid nozzle above the substrate distributes dry IPA liquid onto the substrate surface, and a heating mechanism below the substrate heats the substrate to achieve vaporization drying. For example, Chinese application patent with publication number CN115910851A, wherein the heating mechanism includes a heating disc and a metal shaft body, the metal shaft body is supported below the heating disc, a plurality of cavities extending along the length direction of the shaft body are formed inside the metal shaft body, the plurality of cavities inside the shaft body are used as flow channels, fluid flows into the heating disc through these flow channels and flows out from the fluid outlet hole at the top of the heating disc to heat the substrate. A layer of upper flow channel cavities distributed at different radii and a layer of lower flow channel cavities communicating with the internal flow channels of the metal shaft body are formed in the heating disc, the lower flow channel cavities extend along the radial direction from the connection position with the corresponding flow channel in the shaft body to the connection position with the corresponding upper flow channel cavity, that is, double-layer flow channel cavities need to be formed in the heating disc, but this will cause the total thickness of the heating disc to be thick, making the distance between the upper surface of the heating disc and the lower surface of the substrate narrow, so that the fluid sprayed from the heating disc cannot be discharged in time, which can easily cause the substrate to be soaked in the fluid sprayed from the heating disc. SUMMARY

[0005] The technical problem to be solved by the present application is to overcome the defect that the thickness of the heating disc in the heating mechanism is too thick, the distance between the upper surface of the heating disc and the lower surface of the substrate is narrow, and the substrate is easily caused to bubble in the fluid sprayed by the heating disc, and to provide a heating mechanism and a substrate processing device.

[0006] The technical problem is solved by the following technical scheme:

[0007] The present application provides a heating mechanism, which comprises a heating disc assembly and at least two pipes, and the heating disc assembly is internally provided with at least two flow channel cavities which are arranged at intervals in the radial direction, and each flow channel cavity is distributed on a different radius.

[0008] The top of the heating disc assembly is provided with at least two groups of fluid outlet holes, each group of fluid outlet holes is arranged correspondingly to each flow channel cavity and is in communication with the corresponding flow channel cavity, and the top of the heating disc assembly is arranged opposite to the substrate.

[0009] The bottom of the heating disc assembly is provided with at least two pipe connection ports, each pipe connection port is arranged correspondingly to each flow channel cavity and is in communication with the corresponding flow channel cavity.

[0010] The input end of each pipe is connected to a hot fluid conveying pipe, and the output end of each pipe is connected to the correspondingly arranged pipe connection port.

[0011] The present application also provides a substrate processing device, which comprises the heating mechanism as described above, and further comprises:

[0012] A clamping mechanism configured to hold a substrate, and the heating mechanism is arranged below the substrate.

[0013] A shower head mechanism comprising a liquid shower head configured to distribute liquid to the surface of the substrate placed on the clamping mechanism.

[0014] A rotary drive mechanism configured to drive the clamping mechanism to rotate.

[0015] A control mechanism configured to control the heat energy of the fluid in the flow channel cavity on the corresponding radius when the liquid shower head moves to a certain area above the substrate during the movement of the liquid shower head along the radial direction of the substrate from the center of the substrate to the edge of the substrate, so as to control the local temperature of the substrate below the liquid shower head.

[0016] The positive progress effect of the present application is that:

[0017] The thickness of the heating disc assembly of the heating mechanism in the present application is reduced, the distance between the upper surface of the heating disc assembly and the lower surface of the substrate is increased, so that the fluid sprayed from the top of the heating disc assembly can be discharged in time, preventing the substrate from being soaked in the fluid sprayed from the heating disc assembly; in addition, different pipes are directly inserted into their corresponding pipe connection ports, which can avoid the flow between the fluids flowing into different flow channel cavities, and further, the temperature and flow of the fluid in the flow channel cavity at different radii can be controlled separately to control the fluid thermal energy acting on the corresponding area above the radius on the substrate.

[0018] SUMMARY

[0019] The features and performances of the present application are further described by the following embodiments and their accompanying drawings.

[0020] Fig. 1 is a structural schematic diagram of a heating mechanism according to an embodiment of the present application.

[0021] Fig. 2 is another angle structural schematic diagram of the heating mechanism according to the embodiment of the present application.

[0022] Fig. 3 is a structural schematic diagram of a mounting shaft according to the embodiment of the present application.

[0023] Fig. 4 is a schematic diagram of the internal pipe distribution of the mounting shaft according to the embodiment of the present application.

[0024] Fig. 5 is a sectional view of a heating disc assembly according to the embodiment of the present application.

[0025] Fig. 6 is a top view of an upper heating disc according to the embodiment of the present application.

[0026] Fig. 7 is a structural schematic diagram of the upper heating disc according to the embodiment of the present application.

[0027] Fig. 8 is a top view of a lower heating disc according to the embodiment of the present application.

[0028] Fig. 9 is a bottom view of the lower heating disc according to the embodiment of the present application.

[0029] Fig. 10 is a structural schematic diagram of a substrate processing device according to an embodiment of the present application.

[0030] Fig. 11 is a partial structural schematic diagram of the substrate processing device according to the embodiment of the present application.

[0031] Fig. 12 is another partial structural schematic diagram of the substrate processing device according to the embodiment of the present application.

[0032] Fig. 13 is a sectional view of the A-A section in Fig. 12.

[0033] Fig. 14 is an enlarged view of B in Fig. 12.

[0034] Fig. 15 is a structural schematic diagram of a clamping mechanism according to the embodiment of the present application.

[0035] Fig. 16 is a sectional view of the clamping mechanism of the second embodiment of the present application.

[0036] Fig. 17 is a schematic view of the shower mechanism of the second embodiment of the present application.

[0037] Fig. 18 is a schematic view of the shower mechanism of the third embodiment of the present application.

[0038] Preferred embodiments of the present application

[0039] The present application will be further described by way of examples, but the present application is not limited to the following examples.

[0040] Example 1

[0041] Please refer to Figs. 1-9, the present application provides a heating mechanism 10, which comprises a heating disc assembly 11 and at least two pipes 12. The heating disc assembly 11 has at least two flow channel cavities 111 arranged in a radial direction and distributed at different radii. The top of the heating disc assembly 11 has at least two groups of fluid outlet holes 112, each group of fluid outlet holes 112 is arranged corresponding to each flow channel cavity 111 and communicates with the corresponding flow channel cavity 111, and the top of the heating disc assembly 11 is arranged corresponding to the substrate. The bottom of the heating disc assembly 11 has at least two pipe connection ports 113, each pipe connection port 113 is arranged corresponding to each flow channel cavity 111 and communicates with the corresponding flow channel cavity 111. The input end of each pipe 12 is connected to a hot fluid conveying pipe (not shown in the figure), and the output end of each pipe 12 is connected to the corresponding pipe connection port 113.

[0042] In other words, the number of pipes 12, the number of pipe connection ports 113, the number of flow channel cavities 111 and the number of groups of fluid outlet holes 112 are arranged corresponding to each other. The heated fluid in the hot fluid conveying pipe enters the corresponding flow channel cavity 111 through the pipe 12 and the pipe connection port 113 in sequence, and then flows out from the fluid outlet hole 112 arranged on the top of the heating disc assembly 11 to heat the substrate and realize vaporization drying.

[0043] In the embodiment, the fluid flows into the heating disc assembly 11 through the pipes 12 to be sprayed from the top of the heating disc assembly 11 to the substrate. The pipes 12 for passing the fluid can be arranged separately, and the output ends of different pipes 12 can be directly inserted into the corresponding pipe connection ports 113 to realize the flow of the fluid. The pipe connection ports 113 at the bottom of the heating disc assembly 11 can be directly communicated with the corresponding flow channel cavities 111. Only one layer of flow channel cavities 111 needs to be arranged in the heating disc assembly 11, which saves the processing procedure and reduces the thickness of the heating disc assembly 11, increases the distance between the upper surface of the heating disc assembly 11 and the lower surface of the substrate, so that the fluid sprayed from the top of the heating disc assembly 11 can be discharged in time to prevent the substrate from being soaked in the fluid sprayed from the heating disc assembly 11. In addition, by directly inserting different pipes 12 into the corresponding pipe connection ports 113, the flow between the fluids passing through different flow channel cavities 111 can be avoided. Further, the temperature and flow of the fluid in the flow channel cavities 111 at different radii can be controlled separately to control the thermal energy of the fluid acting on the corresponding area above the radius of the substrate.

[0044] In the embodiment, the material of the pipe 12 includes plastic. The use of plastic pipes can reduce or avoid the attachment of foreign matters such as debris and burrs inside the pipe 12, avoid the risk of carrying pollution, and ensure the cleanliness of the heated fluid after the fluid flows through the pipe 12. Further, the flow of the fluid in the flow channel cavity 111 is improved to avoid the risk of blockage and ensure the heating effect of the substrate. In addition, during the process of the clean fluid flowing out of the fluid outlet hole 112 to be sprayed to the substrate to heat the substrate, damage to the surface of the substrate can be avoided, and the substrate can also be prevented from being contaminated.

[0045] In the embodiment, the material of the pipe 12 can be selected from fluorine-containing plastics such as PFA (tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer) and PTFE (polytetrafluoroethylene), or non-fluorine high-strength engineering plastics such as PVC (polyvinyl chloride), PEEK (polyether ether ketone) and PP (polypropylene). Preferably, the material of the pipe 12 is selected from fluorine-containing plastics such as PFA and PTFE. Since fluorine can enhance chemical resistance, the pipe 12 made of fluorine-containing plastic is more suitable for the process environment. More preferably, the pipe 12 is made of PFA hose, which can be freely bent, is convenient to install, and has low cost.

[0046] In the embodiment, the fluid for heating the substrate passing through the pipe 12 is a liquid, and is preferably hot water. In other embodiments, the heated fluid can be a gas, such as clean air, nitrogen or inert gas.

[0047] In the embodiment, as shown in FIGS. 1-3, the heating mechanism 10 comprises a hollow mounting shaft 13, the inside of the mounting shaft 13 is used to accommodate the pipes 12, the top of the mounting shaft 13 is mounted on the bottom of the heating disc assembly 11, and the wall surface of the mounting shaft 13 is provided with at least two through holes 131, and the pipes 12 inside the mounting shaft 13 extend out of the through holes 131 to connect the pipe connection ports 113. The pipes 12 extend into the hollow cavity of the mounting shaft 13, and the output ends of the pipes 12 extend out of the through holes 131 to be inserted into the pipe connection ports 113 to realize the circulation of fluid. The hollow mounting shaft 13 is used to accommodate a plurality of pipes 12, which is beneficial to provide space layout rationality and effectively regularize wiring.

[0048] In some embodiments, as shown in FIG. 3, the through holes 131 are arranged near the top of the mounting shaft 13, in other words, the part of the pipes 12 extending out of the mounting shaft 13 is arranged near the top of the mounting shaft 13, and most of the pipes 12 are accommodated in the mounting shaft 13, which further improves the wiring regularity of the pipes 12. The at least two through holes 131 are arranged along the circumference of the mounting shaft 13, which improves the layout rationality of the through holes 131 and facilitates the connection of the plurality of pipes 12 extending out of the mounting shaft 13 to the pipe connection ports 113 distributed at different radii. The at least two through holes 131 are arranged in at least two rows along the length direction of the mounting shaft 13, which improves the layout rationality of the through holes 131 and is also convenient for processing.

[0049] Specifically, as shown in FIGS. 1 and 3, the mounting shaft 13 comprises a shaft body part 133 and a mounting part 132, the through holes 131 are arranged on the shaft body part 133, and the shaft body part 133 is mounted on the bottom of the heating disc assembly 11 through the mounting part 132. Preferably, the mounting part 132 is detachably connected with the heating disc assembly 11, which is convenient for disassembly and assembly and facilitates operation.

[0050] In the embodiment, as shown in FIG. 1, the bottom of the heating disc assembly 11 is provided with 14 pipe connection ports 113 distributed at different radii, each pipe connection port 113 is provided with a corresponding pipe joint 1131, and 14 pipes 12 extend out of the through holes 131 of the mounting shaft 13 to connect the pipe joints 1131 and then are inserted into the pipe connection ports 113. The arrangement of the 14 pipes 12 in the mounting shaft 13 is shown in FIG. 4, wherein the pipe joint 1131 can be obtained from the market, and its specific structure is known to those skilled in the art, which will not be described here. In other embodiments, the number of the pipe connection ports 113, the pipe joints 1131 and the pipes 12 can be selected according to actual needs.

[0051] Specifically, as shown in FIG. 3, the number of the through holes 131 corresponds to the number of the pipes 12, which is 14, i.e., one through hole 131 is provided for one pipe 12 to pass through, and the 14 through holes 131 are arranged in two rows, each row having 7 through holes 131 arranged uniformly along the circumference of the mounting shaft 13, and each of the through holes 131 in the second row is arranged between two adjacent through holes 131 in the first row, which is beneficial to improve the rationality of space layout. In other embodiments, the number and arrangement position of the through holes 131 can be selected according to actual needs, for example, two pipes 12 correspond to one through hole 131, i.e., one through hole 131 is provided for two pipes 12 to pass through.

[0052] In the present embodiment, the at least two pipe connecting ports 113 are connected to the middle part of the corresponding flow channel cavities 111. The fluid in the pipes 12 flows to both sides after flowing from the pipe connecting ports 113 to fill the entire flow channel cavities 111. Since the inflow end is arranged at the middle part of the flow channel cavities 111, the consistency of the filling speed of the fluid flowing to both sides after flowing from the pipe connecting ports 113 can be improved, and thus the consistency of the ejection height of the fluid ejected from the fluid ejection holes 112 can be improved.

[0053] In the present embodiment, as shown in FIG. 1 and FIG. 7, the at least two flow channel cavities 111 are arranged in concentric circles, the flow channel cavities 111 at the middle part of the heating disc assembly 11 are connected end to end, and the remaining flow channel cavities 111 are divided into two groups, and the two groups of flow channel cavities 111 are respectively located on the two sides of the flow channel cavities 111 at the middle part of the heating disc assembly 11 and are arranged in half a circle. The radii of the flow channel cavities 111 on the two sides are greater than the radius of the flow channel cavities 111 at the middle part. In this case, the flow channel cavities 111 on the two sides of the flow channel cavities 111 at the middle part are arranged in half a circle to reduce the flow length in the flow channel cavities 111, so that the fluid can quickly fill the entire flow channel cavities 111 after flowing from the pipe connecting ports 113 to the flow channel cavities 111, and thus the speed of the fluid ejected from the fluid ejection holes 112 can be improved.

[0054] In the present embodiment, as shown in FIG. 5 to FIG. 9, the heating disc assembly 11 includes an upper layer heating disc 114 and a lower layer heating disc 115 arranged in a stack. The bottom of the upper layer heating disc 114 is provided with a first cavity 1141, and the top of the lower layer heating disc 115 is provided with a second cavity 1151 arranged correspondingly to the first cavity 1141, and the first cavity 1141 and the second cavity 1151 form the flow channel cavities 111. The upper layer heating disc 114 and the lower layer heating disc 115 are stacked to form the flow channel cavities 111, which facilitates the machining of the first cavity 1141 and the second cavity 1151 and reduces the processing cost.

[0055] In other embodiments, the upper layer heating disc 114 and the lower layer heating disc 115 can be integrally formed, for example, by 3D printing.

[0056] As shown in FIG. 7 and FIG. 8, the 14 first cavities 1141 formed in the upper heating disc 114 are numbered in order from the center to the edge of the upper heating disc 114, with the cavities gradually increasing in radius, and the specific numbers are 11410, 11411, 11412, 11413, 11414, 11415, 11416, 11417, 11418, 11419, 11420, 11421, 11422, 11423. The corresponding second cavities 1151 in the lower heating disc 115 are numbered as 11510, 11511, 11512, 11513, 11514, 11515, 11516, 11517, 11518, 11519, 11520, 11521, 11522, 11523.

[0057] Please refer to FIG. 6 and FIG. 7 for understanding, the fluid outlet holes 112 are formed in the upper heating disc 114, and the arrangement direction of the plurality of fluid outlet holes 112 in each group of fluid outlet holes 112 corresponds to the extension direction of the corresponding first cavity 1141. In addition, the verticality of the fluid ejected from the fluid outlet hole 112 can be improved by increasing the aspect ratio of the fluid outlet hole 112, thereby enhancing the heating effect.

[0058] Please refer to FIG. 7 for understanding, the first cavity 1141 (numbered 11410) near the center of the upper heating disc 114 is arranged in a full circle, and the remaining first cavities 1141 are arranged in a half circle. As shown in FIG. 8, the second cavity 1151 (numbered 11510) near the center of the lower heating disc 115 includes a first flow-through part 115101 and a second flow-through part 115102, the first flow-through part 115101 is arranged in a full circle, and one end of the second flow-through part 115102 is communicated with the first flow-through part 115101, and the other end is directly communicated with the pipe connection port 113. In other words, the fluid flows into the second flow-through part 115102 through the pipe connection port 113, and flows into the flow channel cavity 111 formed by the first cavity numbered 11410 and the second cavity numbered 11510 from the intersection of the second flow-through part 115102 and the first flow-through part 115101. Such design is to avoid contact interference between the pipe joint 1131 connected to the second cavity numbered 11510 and the mounting shaft 13, and to improve the rationality of space layout. The remaining second cavities 1151 are arranged in a half circle, and the pipe connection port 113 is arranged in the middle of these second cavities 1151.

[0059] In the present embodiment, the material of the upper heating plate 114 and the material of the lower heating plate 115 are the same, and the two materials have the same thermal expansion coefficient. After the heat fluid passes through the flow channel cavity 111, the thermal deformation difference between the upper heating plate 114 and the lower heating plate 115 is avoided, so as to reduce the gap between the upper heating plate 114 and the lower heating plate 115, and further reduce or avoid the situation that the fluid flows out of the gap between the upper heating plate 114 and the lower heating plate 115 and does not act on the substrate. Preferably, the materials of the upper heating plate 114 and the lower heating plate 115 are fluoroplastic, so as to avoid the influence of metal ions in the use environment of the heating mechanism.

[0060] In other embodiments, the materials of the upper heating plate 114 and the lower heating plate 115 are metal.

[0061] In the present embodiment, as shown in FIG. 5, the upper surface of the upper heating plate 114 is provided with a first edge portion 1146 in the shape of a ring. The first edge portion 1146 gradually extends downward from the upper end thereof in the radial direction to the edge of the upper heating plate 114. In other words, the first edge portion 1146 gradually extends downward from the highest point thereof in the radial direction to the edge, and the edge of the upper heating plate 114 is a bevel, so as to avoid the fluid sprayed from the fluid outlet hole 112 to the substrate from falling down and accumulating on the upper heating plate 114. By setting the first edge portion 1146 in the shape of a downward inclined bevel, the fluid is guided, and the liquid is easily discharged. Further, the fluid on the upper surface of the upper heating plate 114 can be discharged in time, so as to further prevent the substrate from being soaked in the fluid sprayed from the heating plate assembly 11.

[0062] More specifically, the upper heating plate 114 includes the first edge portion 1146 and a flat portion 1147 located in the middle. The inner circumferential side of the first edge portion 1146 is connected to the outer circumferential side of the flat portion 1147.

[0063] The angle between the extension direction of the first edge portion 1146 and the extension direction of the flat portion 1147 can be set according to actual needs, as long as it does not affect the opening of the flow channel cavity 111.

[0064] In the embodiment, as shown in FIGS. 2, 6-9, the upper heating disc 114 is provided with at least two circles of first connecting holes 1142, the lower heating disc 115 is provided with second connecting holes 1152 corresponding to the first connecting holes 1142, and the first connecting members 116 pass through the first connecting holes 1142 and the second connecting holes 1152 to fix the upper heating disc 114 and the lower heating disc 115. At least one circle of the first connecting holes 1142 is located at the middle of the upper heating disc 114, and at least one circle of the first connecting holes 1142 is located at the edge of the upper heating disc 114. The detachable connection between the upper heating disc 114 and the lower heating disc 115 is realized by the first connecting members 116, which facilitates the disassembly and assembly. In addition, the connection between the upper heating disc 114 and the lower heating disc 115 is partially located at the middle and partially located at the edge, which can realize the close connection between the upper heating disc 114 and the lower heating disc 115, reduce or avoid the flow mixing between the fluids in the different flow channel cavities 111, and also avoid the fluid flowing out from the gap between the upper heating disc 114 and the lower heating disc 115.

[0065] Specifically, please understand in combination with FIGS. 6-9, the number of the first connecting holes 1142 is two circles, one circle of the first connecting holes 1142 is arranged at the middle of the upper heating disc 114, and three first connecting holes 1142 are evenly distributed between the first cavities numbered 11411 and 11413, and the other three first connecting holes 1142 are evenly distributed between the first cavities numbered 11410 and 11412; the other circle of the first connecting holes 1142 is arranged at the edge of the upper heating disc 114, and there are 12 first connecting holes 1142, which are evenly arranged along the circumference of the upper heating disc 114.

[0066] More specifically, the first connecting members 116 are threaded fasteners. In other embodiments, other types of first connecting members 116 can be used to realize the connection between the upper heating disc 114 and the lower heating disc 115.

[0067] As shown in FIGS. 1, 8 and 9, the lower heating disc 115 is also provided with mounting holes 1156, and the second connecting members 134 pass through the mounting portions 132 and the mounting holes 1156 to fix the mounting shaft 13 and the heating disc assembly 11. The mounting holes 1156 are evenly arranged along the circumference of the lower heating disc 115 and located at the middle of the lower heating disc 115, that is, the mounting shaft 13 is mounted at the middle of the heating disc assembly 11. In the embodiment, the second connecting members 134 are threaded fasteners. In other embodiments, other types of second connecting members 134 can be used to realize the connection between the mounting shaft 13 and the lower heating disc 115.

[0068] As shown in FIG. 4, FIG. 6 to FIG. 9, the middle part of the upper heating disc 114 is provided with a first opening 1143, and the middle part of the lower heating disc 115 is provided with a second opening 1153 corresponding to the first opening 1143. The heating mechanism 10 further comprises a first pipe 14 configured to sequentially extend into the second opening 1153 and the first opening 1143, and the first pipe 14 is used to introduce nitrogen or inert gas. The nitrogen or inert gas is sprayed out of the first opening 1143 through the first pipe 14. During the process of dispensing the chemical liquid to the front surface of the substrate, the chemical liquid on the front surface of the substrate is thrown outward due to the centrifugal force because the substrate is rotating at a high speed. The chemical liquid has a certain probability to move downstream along the edge of the substrate and even to overcome the gravity to move to the back surface of the substrate. In order to prevent the chemical liquid from eroding the back surface of the substrate, the nitrogen or inert gas introduced from the first pipe 14 blows away the chemical liquid to protect the back surface of the substrate.

[0069] As shown in FIG. 4, FIG. 6 to FIG. 9, the middle part of the upper heating disc 114 is provided with a third opening 1144, and the middle part of the lower heating disc 115 is provided with a fourth opening 1154 corresponding to the third opening 1144. The heating mechanism 10 further comprises a second pipe 15 configured to sequentially extend into the fourth opening 1154 and the third opening 1144, and the second pipe 15 is used to introduce liquid. The liquid is preferably pure water. The liquid is sprayed out of the third opening 1144 through the second pipe 15 to blow away the chemical liquid on the substrate to protect the substrate.

[0070] In the embodiment, please understand in combination with FIG. 4, FIG. 6 to FIG. 9, the middle part of the upper heating disc 114 is further provided with a fifth opening 1145, and the middle part of the lower heating disc 115 is provided with a sixth opening 1155 corresponding to the fifth opening 1145. The heating mechanism 10 further comprises a third pipe 16 configured to sequentially extend into the sixth opening 1155 and the fifth opening 1145, and the third pipe 16 is used to introduce hot fluid. During the drying process, the fluid in the pipe 12 is sprayed to the substrate through the flow channel cavity 111 and the fluid outlet hole 112 in sequence. Due to the high-speed rotation of the substrate, the fluid sprayed to the front surface of the substrate is extended outward due to the centrifugal force, resulting in poor heating effect in the middle part of the substrate. In this case, the hot fluid in the third pipe 16 can also heat the substrate to improve the heating effect in the middle part of the substrate by additionally arranging a flow channel in the middle part of the heating disc assembly 11. It should be noted that the fluid in the third pipe 16 is the same as the fluid in the pipe 12. In addition, it should be noted that the "middle part" in "the middle part of the upper heating disc 114 is further provided with a fifth opening 1145" does not specifically mean the center of the upper heating disc 114, and can be arranged away from the center of the upper heating disc 114 or located at the center of the upper heating disc 114.

[0071] Specifically, the fifth opening 1145 is located between the first opening 1143 and the third opening 1144, and the sixth opening 1155 is located between the second opening 1153 and the fourth opening 1154.

[0072] The distribution of the pipes 12, 14, 15 and 16 in the mounting shaft 13 is shown in FIG. 4. The first pipe 14, the second pipe 15 and the third pipe 16 are located in the middle of the mounting shaft 13, and the remaining 14 pipes 12 are arranged around the first pipe 14, the second pipe 15 and the third pipe 16.

[0073] Embodiment Two

[0074] Please refer to FIGS. 10-17, the substrate processing device provided by the embodiment of the present application comprises the heating mechanism 10 as described above, and further comprises a control mechanism (not shown), a clamping mechanism 20, a showerhead mechanism 40 and a rotary driving mechanism 60. The clamping mechanism 20 is configured to hold the substrate 30, and the heating mechanism 10 is disposed below the substrate 30. The showerhead mechanism 40 comprises a liquid showerhead 41 configured to distribute liquid to the surface of the substrate 30 placed on the clamping mechanism 20. The rotary driving mechanism 60 is configured to drive the clamping mechanism 20 to rotate. The control mechanism is configured to control the thermal energy (temperature and flow rate) of the fluid in the flow channel cavity 111 at a certain radius corresponding to a region above the substrate 30 when the liquid showerhead 41 moves to the region during the movement of the liquid showerhead 41 along the radial direction of the substrate 30 from the center of the substrate 30 to the edge of the substrate 30, so as to control the local temperature of the substrate 30 below the liquid showerhead 41. During the process, the substrate 30 rotates and the heating disc assembly 11 does not rotate. After the substrate 30 rotates for one round, the area of the substrate 30 heated by each flow channel cavity 111 is a circle or a ring. By dynamically and accurately controlling the heating of the substrate 30 in different regions, the temperature of the substrate 30 and the liquid on the surface of the substrate 30 is accurately controlled, so as to achieve the process purpose of controlling the liquid surface tension and evaporation speed of the substrate 30 at different positions on the surface of the substrate 30 during the drying process, thereby avoiding the damage of the fine pattern structure on the surface of the substrate 30 during the drying process. In the embodiment, the liquid distributed by the liquid showerhead 41 of the showerhead mechanism 40 to the substrate 30 is the drying liquid IPA.

[0075] When the device is used in a wet etching process, the chemical liquid or formula liquid is delivered to the surface of the rotating substrate 30 by the showerhead mechanism 40 to partially corrode or completely remove the film on the surface of the substrate 30. The device can dynamically and accurately control the temperature of the substrate 30 and the liquid on the surface of the substrate 30, so as to obtain good control of the etching rate and uniformity.

[0076] In the embodiment, as shown in FIGS. 11, 12 and 15, the clamping mechanism 20 comprises a clamping disc 21, which comprises a disc body 22 and at least two mounting posts 23 mounted on the upper surface of the disc body 22 and used for clamping the substrate 30, and the heating disc assembly 11 is located between the substrate 30 and the disc body 22. The at least two mounting posts 23 are spaced along the circumference of the disc body 22, and a flow guide groove 24 is formed between adjacent two mounting posts 23. After the fluid sprayed from the fluid outlet hole 112 towards the substrate 30 falls down and accumulates on the heating disc assembly 11, and then falls from the upper surface of the heating disc assembly 11 to the disc body 22, the fluid can be discharged through the flow guide groove 24 between adjacent mounting posts 23, preventing liquid from accumulating on the upper surface of the disc body 22 and avoiding affecting the rotation speed of the clamping disc 21 due to excessive liquid accumulation on the disc body 22 during rotation.

[0077] Specifically, as shown in FIGS. 11 and 12, the number of mounting posts 23 is six, and the six mounting posts 23 are uniformly spaced along the circumference of the disc body 22 and located at the edges of the disc body 22, effectively saving space, and accordingly, the number of flow guide grooves 24 is six. In addition, the mounting post 23 comprises a positioning pin 231 used for clamping the substrate 30.

[0078] As shown in FIGS. 12 and 14, there is a gap between the outer peripheral edge of the heating disc assembly 11 and the mounting post 23, so that the fluid accumulated on the heating disc assembly 11 can fall smoothly onto the disc body 22, and interference between the heating disc assembly 11 and the mounting post 23 can also be avoided.

[0079] In the embodiment, as shown in FIGS. 13, 15 and 16, the groove bottom of the flow guide groove 24 is provided with a second edge portion 241, which gradually extends downward along the radial direction from the upper end thereof to the edge of the flow guide groove 24. In other words, the second edge portion 241 gradually extends downward along the radial direction from the highest point thereof to the edge. The flow guide is realized by setting the second edge portion 241 in the form of a downward inclined slope, which facilitates liquid discharge.

[0080] In the embodiment, as shown in FIGS. 13, 15 and 16, a through hole 221 is formed in the middle of the disc body 22, and the mounting shaft 13 is arranged through the through hole 221; and the upper surface of the disc body 22 is further provided with an annular boss 222 located on the outer circumferential side of the through hole 221. The annular boss 222 is set to prevent the liquid accumulated on the upper surface of the disc body 22 from flowing into the through hole 221.

[0081] In the embodiment, please understand in combination with FIG. 10 and FIG. 17, the nozzle mechanism 40 further comprises a liquid storage tank 42, the liquid storage tank 42 and the liquid nozzle 41 are communicated through a liquid inlet pipe 43, along the input direction of the liquid in the liquid inlet pipe 43, a heater 44 and a valve 45 for pressure relief are sequentially installed on the liquid inlet pipe 43, a booster pump 46 is arranged between the liquid storage tank 42 and the heater 44, the heater 44 is used to heat the liquid to a temperature higher than a preset temperature, so that the liquid can flow out from the liquid nozzle 41 at the preset temperature after pressure relief and temperature drop through the valve 45, wherein the preset temperature is defined as lower than the boiling point of the liquid under normal pressure.

[0082] In the actual process, the applicant found that the liquid is heated to the preset temperature by the heater 44, and then the liquid heated to the preset temperature is supplied to the liquid nozzle 41 through the liquid inlet pipe 43, due to the existence of pipe loss and other factors, the liquid sprayed from the liquid nozzle 41 cannot reach the preset temperature due to heat loss, thereby resulting in poor process effect. Taking IPA as an example, considering that the IPA sprayed from the liquid nozzle 41 can replace the water used for cleaning on the wafer in the previous stage, and the liquid film formed by the IPA on the wafer can be quickly vaporized and dried, etc., the preset temperature is preferably 78-81℃, if the applicant heats the IPA to 80℃ by the heater 44, but the temperature of the liquid sprayed from the liquid nozzle 41 can only reach about 75℃, it can be seen that the temperature of the liquid sprayed from the liquid nozzle 41 cannot reach the heating temperature of the heater 44. Among them, the boiling point of IPA under normal pressure is about 82.5℃, the preset temperature is defined as lower than the boiling point under normal pressure, so as to avoid the liquid from reaching the boiling state when sprayed from the liquid nozzle 41.

[0083] Therefore, the booster pump 46 is arranged before the input end of the heater 44, so that the fluid flowing into the heater 44 is higher than the normal pressure. Since the boiling point of the liquid will rise with the increase of the air pressure, even if the liquid is heated by the heater 44, it can also be ensured that the liquid does not reach the boiling state. The heated liquid can flow out from the liquid nozzle 41 at the preset temperature after pressure relief and temperature drop through the valve 45, thereby ensuring the process effect. Taking IPA as an example, the boiling point of IPA under normal pressure is about 82.5℃, and the boiling point of IPA under two atmospheres is about 101.3℃, the IPA is heated by the heater 44, for example, to 85-95℃, in this process, the air pressure rises, the boiling point of IPA rises, so that the temperature of IPA is higher than the boiling point under normal pressure, but it does not reach the boiling state, the IPA at a temperature of 85-95℃ can be sprayed from the liquid nozzle 41 at a temperature of 78-81℃ after pressure relief and temperature drop through the valve 45 and the liquid inlet pipe 43. It should be noted that in the specific process, the power of the heater 44, the opening degree of the valve 45 and the length of the liquid inlet pipe 43 can be selected according to the actual needs, so that the liquid can be sprayed from the liquid nozzle 41 at the preset temperature.

[0084] In some embodiments, as shown in FIG. 17, a thermometer 47 and a flow meter 48 are arranged between the valve 45 and the liquid spray head 41, and close to the liquid spray head 41. The temperature and flow of the liquid sprayed from the liquid spray head 41 are measured by the thermometer 47 and the flow meter 48, so that whether the liquid sprayed from the liquid spray head 41 reaches the preset temperature and flow can be identified in time, so as to adjust the process parameters such as the power of the heater 44, the opening of the valve 45, and the length of the liquid input pipe 43 during multiple tests, so that the liquid sprayed from the liquid spray head 41 can reach the preset temperature and flow. The first end of the valve 45 is connected to the heater 44, the second end of the valve 45 is connected to the liquid spray head 41, and the third end of the valve 45 is connected to the liquid storage tank 42. Part of the liquid entering the valve 45 is directed to the liquid spray head 41 to be distributed to the surface of the substrate 30, and the other part is directed to the liquid storage tank 42 to achieve pressure relief, and also to achieve recycling of the liquid. In this embodiment, the valve 45 can be a three-way valve.

[0085] In this embodiment, a filter 51 is also arranged between the valve 45 and the liquid storage tank 42 to ensure the cleanliness of the liquid. A fluid delivery pump 49 is arranged between the liquid storage tank 42 and the heater 44.

[0086] In this embodiment, a second pressure meter 52 can also be arranged between the booster pump 46 and the heater 44 to monitor the pressure of the liquid entering the heater 44.

[0087] Embodiment Three

[0088] In embodiment three, a substrate processing device is also provided, which is different from the scheme in embodiment two in that, as shown in FIG. 18, the booster pump 46 is not arranged between the liquid storage tank 42 and the heater 44, and the heater 44 is configured to be partially sealed internally so that the liquid inside the heater 44 is heated and the pressure inside the heater 44 is increased at the same time, and a first pressure meter 53 is arranged between the heater 44 and the valve 45, and the first pressure meter 53 is arranged close to the output end of the heater 44. The liquid is heated by the heater 44 to be higher than the preset temperature, and because in a partially sealed space, when the temperature increases, the movement of gas molecules increases, the frequency of impact on the container wall increases, thereby causing the gas pressure to rise, and the boiling point of the liquid rises with the increase of the gas pressure, so that even if the liquid is heated by the heater 44, the liquid can not reach the boiling state. The heated liquid can be discharged from the liquid spray head 41 at the preset temperature after pressure relief and temperature drop through the valve 45, so as to ensure the process effect.

[0089] The first pressure gauge 53 arranged between the heater 44 and the valve 45 can monitor whether the pressure of the liquid after being heated by the heater 44 is greater than a preset pressure, so as to avoid the liquid from boiling in the heater 44 due to the temperature being higher than the boiling point. The preset pressure is defined as the liquid is heated to a first temperature in the heater 44, and the first temperature is defined as being lower than the boiling point corresponding to the preset pressure of the liquid. Taking IPA as an example, the liquid is heated to 85°C in the heater 44, and the first pressure gauge 53 monitors whether the pressure of the liquid after being heated by the heater 44 is greater than the pressure corresponding to the boiling point of 85°C of IPA. If it is greater than the pressure corresponding to the boiling point of 85°C of IPA, it indicates that the IPA does not boil in the heater 44, otherwise it indicates that the IPA has boiled in the heater 44.

[0090] Although the specific embodiments of the present application are described above, those skilled in the art should understand that this is only an example, and the protection scope of the present application is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of the present application, and these changes and modifications all fall within the protection scope of the present application.

Claims

1. A heating mechanism, characterized by, The heating mechanism comprises a heating disc assembly and at least two pipes, the heating disc assembly is internally provided with at least two flow channel cavities which are arranged in a radial direction and are spaced apart, each of the flow channel cavities is distributed on a different radius; The top of the heating disc assembly is provided with at least two groups of fluid outlet holes, each group of the fluid outlet holes is arranged correspondingly to each of the flow channel cavities and is in communication with the corresponding flow channel cavity, and the top of the heating disc assembly is arranged correspondingly to the substrate; The bottom of the heating disc assembly is provided with at least two pipe connecting ports, each of the pipe connecting ports is arranged correspondingly to each of the flow channel cavities and is in communication with the corresponding flow channel cavity; The input end of each of the pipes is connected to a hot fluid conveying pipe, and the output end of each of the pipes is connected to the corresponding pipe connecting port.

2. The heating mechanism of claim 1, wherein The material of the pipe comprises plastic.

3. The heating mechanism of claim 1, wherein The heating mechanism comprises a hollow mounting shaft, the inside of the mounting shaft is used for accommodating the pipe, the top of the mounting shaft is mounted to the bottom of the heating disc assembly, and the wall of the mounting shaft is provided with at least two through holes, the pipe inside the mounting shaft extends out of the through hole to connect the pipe connecting port; And / or, the at least two pipe connecting ports are connected to the middle part of the corresponding flow channel cavities.

4. The heating mechanism of claim 1, wherein The heating disc assembly comprises an upper heating disc and a lower heating disc which are arranged in a superimposed manner, the bottom of the upper heating disc is provided with a first cavity, the top of the lower heating disc is provided with a second cavity which is arranged correspondingly to the first cavity, and the first cavity and the second cavity form the flow channel cavity.

5. The heating mechanism of claim 4, wherein The material of the upper heating disc is the same as the material of the lower heating disc.

6. The heating mechanism of claim 4, wherein The upper surface of the upper heating disc is provided with an annular first edge portion which gradually extends downward along the radial direction from the upper end to the edge of the upper heating disc.

7. The heating mechanism of claim 4, wherein The middle part of the upper heating disc is provided with a first opening, the middle part of the lower heating disc is provided with a second opening which is arranged correspondingly to the first opening, the heating mechanism further comprises a first pipe which is configured to extend into the second opening and the first opening in sequence, and the first pipe is used for passing nitrogen or inert gas; And / or, the middle part of the upper heating disc is provided with a third opening, the middle part of the lower heating disc is provided with a fourth opening which is arranged correspondingly to the third opening, the heating mechanism further comprises a second pipe which is configured to extend into the fourth opening and the third opening in sequence, and the second pipe is used for passing liquid; And / or, the middle part of the upper heating disc is further provided with a fifth opening, the middle part of the lower heating disc is provided with a sixth opening, the fifth opening and the sixth opening are arranged correspondingly, the heating mechanism further comprises a third pipe which is configured to extend into the sixth opening and the fifth opening in sequence, and the third pipe is used for passing hot fluid.

8. A substrate processing apparatus, characterized by comprising: The substrate processing device comprises the heating mechanism as claimed in any one of claims 1-7, and further comprises: A clamping mechanism which is configured to hold a substrate, and the heating mechanism is arranged below the substrate; A nozzle mechanism comprising a liquid nozzle configured to dispense liquid to a surface of a substrate placed on the clamping mechanism; A rotation driving mechanism configured to drive the clamping mechanism to rotate; A control mechanism configured to control thermal energy of fluid in the flow channel cavity at a certain radius on the substrate when the liquid nozzle moves to a certain area above the substrate during movement of the liquid nozzle along a radial direction of the substrate from a center of the substrate to an edge of the substrate, so as to control a local temperature of the substrate below the liquid nozzle.

9. The substrate processing apparatus of claim 8, wherein The clamping mechanism comprises a clamping disc, the clamping disc comprises a disc body and at least two mounting columns mounted on an upper surface of the disc body and used for clamping the substrate, and the heating disc assembly is located between the substrate and the disc body; The at least two mounting columns are arranged at intervals along a circumferential direction of the disc body, and a flow guide groove is formed between adjacent two mounting columns.

10. The substrate processing apparatus of claim 9, wherein A second edge portion is arranged at a bottom of the flow guide groove, and the second edge portion gradually extends downward along a radial direction from an upper end thereof to an edge of the flow guide groove.

11. The substrate processing apparatus of claim 9, wherein The heating mechanism comprises a hollow mounting shaft, an inside of the mounting shaft is used for accommodating the pipeline, a top of the mounting shaft is mounted on a bottom of the heating disc assembly, and a wall surface of the mounting shaft is provided with at least two through holes, and the pipeline in the inside of the mounting shaft extends out of the through holes to be connected to the pipeline connection port; A middle part of the disc body is provided with a through hole, and the mounting shaft penetrates through the through hole; An upper surface of the disc body is further provided with an annular boss, and the annular boss is arranged on an outer circumferential side of the through hole.

12. The substrate processing apparatus of claim 8, wherein The nozzle mechanism further comprises a liquid storage tank, the liquid storage tank and the liquid nozzle are communicated through a liquid input pipe, a heater and a valve are sequentially arranged on the liquid input pipe along an input direction of liquid in the liquid input pipe, and the valve is used for pressure relief; The heater is used for heating the liquid to a temperature higher than a preset temperature, so that the liquid can flow out from the liquid nozzle at the preset temperature after pressure relief and temperature drop of the liquid through the valve, wherein the preset temperature is defined as being lower than a boiling point of the liquid under normal pressure; A booster pump is arranged between the liquid storage tank and the heater; Alternatively, the heater is configured to be partially sealed inside, so that the liquid inside the heater is heated and pressurized at the same time, a first pressure gauge is arranged between the heater and the valve, and the first pressure gauge is arranged close to an output end of the heater.

13. The substrate processing apparatus of claim 12, wherein, A thermometer and a flow meter are arranged between the valve and the liquid nozzle, and the thermometer and the flow meter are arranged close to the liquid nozzle; And / or, a first end of the valve is communicated with the heater, a second end of the valve is communicated with the liquid nozzle, and a third end of the valve is communicated with the liquid storage tank.

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