Coaxial connector

Abstract

This coaxial connector comprises: a case having an upper surface part and a bottom surface part disposed on the opposite side of the upper surface part in a first direction; a fixed terminal and a movable terminal positioned inside the case; and an external terminal having an upper wall part disposed facing the upper surface part in the first direction. A lead part of one terminal among the fixed terminal and the movable terminal comprises: a first portion that is drawn out from the case and is disposed at an interval from other components other than the one terminal; and a second portion that is connected to the first portion and is fixed to a substrate when the one terminal is mounted to the substrate. A barrier part having a solder wettability lower than the solder wettability of the second portion is disposed on the first portion. At least a portion of the barrier part is disposed on the side opposite to the upper wall part with respect to a minimum gap part having the smallest interval in the first direction.

Description

Coaxial connector

[0001] The present disclosure relates to a coaxial connector.

[0002] Patent Document 1 describes a coaxial connector including an insulating case, a fixed terminal and a movable terminal mounted inside the insulating case, and an external terminal mounted outside the insulating case.

[0003] Japanese Patent Application Laid-Open No. 2002-42992

[0004] When the coaxial connector described in Patent Document 1 is mounted on a substrate using solder, the solder or the flux contained in the solder may penetrate inside the insulating case. When the solder or the flux penetrates inside the insulating case, the movement of the movable terminal may be restricted by the solder or the flux, and the coaxial connector may malfunction. However, Patent Document 1 does not describe suppressing the penetration of the solder or the flux inside the insulating case.

[0005] An object of the present disclosure is to provide a coaxial connector capable of suppressing the penetration of solder or flux.

[0006] One aspect of the present disclosure includes a case having a top surface and a bottom surface located opposite to the top surface in a first direction, with an insertion opening formed in the top surface into which a probe pin is inserted; a fixed terminal positioned within the case; a movable terminal positioned within the case in contact with the fixed terminal, which elastically deforms when pressed by the probe pin to release contact with the fixed terminal; and an external terminal having an upper wall portion located facing the top surface in a first direction, and a bottom wall portion located facing the bottom surface in a first direction, which together with the upper wall portion sandwiches the case; one of the fixed terminal and the movable terminal has a lead portion extended from the case; the lead portion has a first portion extended from the case and spaced apart from other components other than the one terminal; and a second portion connected to the first portion and fixed to the substrate when the one terminal is mounted on the substrate. The present invention provides a coaxial connector in which the first portion has a barrier portion having a lower solder wettability than the second portion, and at least a portion of the barrier portion is positioned in the first direction on the side opposite to the upper wall portion with respect to the minimum gap portion where the distance is smallest.

[0007] According to this disclosure, it is possible to provide a coaxial connector that can suppress the ingress of solder or flux.

[0008] Figure 1 is a perspective view of a coaxial connector according to one embodiment of the present disclosure. Figure 2 is an exploded perspective view of the coaxial connector shown in Figure 1. Figure 3 is an exploded perspective view of the coaxial connector shown in Figure 1, viewed from a different direction than in Figure 2. Figure 4 is a perspective view of the coaxial connector shown in Figure 1, in which the external terminals are omitted from the illustration. Figure 5 is a plan view of the coaxial connector shown in Figure 1. Figure 6 is a cross-sectional view along the line VI-VI in Figure 5. Figure 7 is a bottom view of the coaxial connector shown in Figure 1, in which the external terminals and the second case are omitted from the illustration. Figure 8 is a bottom view of the coaxial connector shown in Figure 1. Figure 9 is a side view of the coaxial connector shown in Figure 1. Figure 10 is a cross-sectional view along the line X-X in Figure 5. Figure 11 is a perspective view of a coaxial connector according to one modification of the embodiment described above. Figure 12 is a cross-sectional view of a coaxial connector according to one modification of the embodiment described above, similar to that in Figure 6.

[0009] The coaxial connector according to the embodiments of this disclosure will be described below with reference to the accompanying drawings. The following description is essentially illustrative and is not intended to limit this disclosure, its applications, or its uses. Furthermore, the drawings are schematic, and the proportions of the dimensions may differ from those of actual devices.

[0010] Figure 1 is a perspective view of a coaxial connector 1 according to one embodiment of the present disclosure. The coaxial connector 1 is surface-mounted, for example, to a substrate (not shown) having a high-frequency circuit and an antenna circuit using solder. The coaxial connector 1 is a test coaxial connector placed on a line connecting the high-frequency circuit and the antenna circuit and is used for testing the high-frequency circuit or the antenna circuit. Referring to Figure 1, the coaxial connector 1 has a rectangular parallelepiped shape. The length L of the coaxial connector 1 (shown in Figure 5) is 1 mm. The width W of the coaxial connector 1 (shown in Figure 5) is 1 mm. The height H of the coaxial connector 1 (shown in Figure 6) is 0.55 mm.

[0011] In the following description, the direction along each side of the coaxial connector 1 may be referred to as the X direction for the length, the Y direction for the width, and the Z direction for the height. In particular, in Figure 1, the front right side may be referred to as the +X side, the back left side as the -X side, the front left side as the +Y side, the back right side as the -Y side, the top side as the +Z side, and the bottom side as the -Z side. In this embodiment, the X, Y, and Z directions are orthogonal to each other. In this specification, the side closer to the center of the coaxial connector 1 in each direction may be referred to as the inside, and the side further from the center of the coaxial connector 1 in each direction may be referred to as the outside. The Z direction in this embodiment is an example of the first direction according to this disclosure, the X direction in this embodiment is an example of the second direction according to this disclosure, and the Y direction in this embodiment is an example of the third direction according to this disclosure.

[0012] Figure 2 is an exploded perspective view of the coaxial connector 1 viewed from the +Z side. Figure 3 is an exploded perspective view of the coaxial connector 1 viewed from the -Z side. Referring to Figures 2 and 3, the coaxial connector 1 comprises a case 10. The case 10 has a first case 20 and a second case 30 located on the -Z side of the first case 20. The coaxial connector 1 comprises a fixed terminal 40 and a movable terminal 50 positioned within the case 10, and an external terminal 60 mounted on the outside of the case 10. The fixed terminal 40 is an example of a first terminal according to this disclosure, and the movable terminal 50 is an example of a second terminal according to this disclosure.

[0013] The case 10 holds the fixed terminal 40 and the movable terminal 50. The case 10 is electrically insulating. The case 10 is made of resin.

[0014] Figure 4 is a perspective view of the coaxial connector 1, and the external terminals 60 are not shown in Figure 4. Referring to Figure 4, the case 10 has a rectangular parallelepiped shape as a whole. The case 10 has a top surface 11, a bottom surface 12 located on the opposite side of the top surface 11 in the Z direction, and a side surface 13 connecting the top surface 11 and the bottom surface 12. An insertion opening 14 is formed in the top surface 11 into which the probe pins 2 (shown in Figure 6) of the inspection probe are inserted. The first case 20 and the second case 30 are fixed in a state where they are superimposed in the Z direction. A fixed terminal 40 and a movable terminal 50 are sandwiched between the first case 20 and the second case 30.

[0015] The top surface 11 is formed by the +Z side of the first case 20, i.e., the top surface, and the bottom surface 12 is formed by the -Z side of the second case 30, i.e., the bottom surface. The side surface 13 is formed by the sides of the first case 20 on both sides in the X direction, the sides of the first case 20 on both sides in the Y direction, the sides of the second case 30 on both sides in the X direction, and the sides of the second case 30 on both sides in the Y direction. The side surface 13 comprises a first surface 13a that defines the +X side of case 10 and extends in the Y and Z directions, and a second surface 13b (shown in Figure 5) that defines the -X side of case 10 and extends in the Y and Z directions. The side surface 13 comprises a third surface 13c that defines the +Y side of case 10 and extends in the X and Z directions, and a fourth surface 13d (shown in Figure 5) that defines the -Y side of case 10 and extends in the X and Z directions.

[0016] Referring to Figures 2 and 3, the first case 20 comprises a main body 21, a cylindrical portion 22, a plurality of positioning portions 23A to 23F, and a pair of projections 24A and 24B. In the following description, when it is not necessary to distinguish between each of the plurality of positioning portions 23A to 23F, one of the plurality of positioning portions 23A to 23F may simply be referred to as positioning portion 23. In the following description, when it is not necessary to distinguish between each of the pair of projections 24A and 24B, one of the pair of projections 24A and 24B may simply be referred to as projection 24.

[0017] The main body 21 is a rectangular plate in plan view along the Z direction. An insertion opening 14 is provided in the main body 21. The insertion opening 14 penetrates the main body 21 in the Z direction. The insertion opening 14 is an example of a through hole according to this disclosure.

[0018] The cylindrical portion 22 is a frustoconical shape that protrudes from the upper surface of the main body 21 toward the +Z side. The space defined by the inner circumferential surface of the cylindrical portion 22 communicates with the insertion opening 14 toward the -Z side. The inner circumferential surface of the cylindrical portion 22 has a frustoconical shape that tapers toward the -Z side, that is, toward the insertion opening 14.

[0019] As shown in Figure 3, the positioning portion 23 is a projection that protrudes from the bottom surface of the main body 21 toward the -Z direction. The multiple positioning portions 23A to 23C position the fixed terminal 40 in a plane perpendicular to the Z direction. In other words, the multiple positioning portions 23A to 23C position the fixed terminal 40 in the X and Y directions. The multiple positioning portions 23D to 23F position the movable terminal 50 in a plane perpendicular to the Z direction. In other words, the multiple positioning portions 23D to 23F position the movable terminal 50 in the X and Y directions.

[0020] The projection 24 is a disc-shaped projection that protrudes from the upper surface of the main body 21 toward the +Z direction. The pair of projections 24A and 24B are arranged diagonally opposite each other on the upper surface 11. The pair of projections 24A and 24B position the external terminal 60 in a plane perpendicular to the Z direction. In other words, the pair of projections 24A and 24B position the external terminal 60 in the X and Y directions.

[0021] The second case 30 comprises a main body 31 and a pair of posts 32A and 32B. In the following description, when there is no need to distinguish between the pair of posts 32A and 32B, one of the pair of posts 32A and 32B may simply be referred to as post 32.

[0022] The main body 31 is generally rectangular in shape when viewed in a plan view along the Z direction. At the +Y end of the main body 31, a notch 33 is formed in the center in the X direction, recessed toward the -Y side. Also, at the -Y end of the main body 31, a notch 34 is formed in the center in the X direction, recessed toward the +Y side. As a result, notches 33 and 34 are formed in the bottom surface 12 of the case 10.

[0023] The post 32 is a projection that protrudes from the bottom surface of the main body 31 toward the -Z side. The post 32 protrudes from the bottom surface 12 toward the opposite side of the top surface 11, i.e., toward the -Z side. The pair of posts 32A and 32B are arranged diagonally opposite each other in the second case 30.

[0024] The fixed terminal 40 is electrically connected to either the high-frequency circuit or the antenna circuit when the coaxial connector 1 is mounted on the circuit board.

[0025] The fixed terminal 40 is conductive. The fixed terminal 40 is manufactured by bending a metal member of a predetermined shape obtained by punching out a metal plate. The fixed terminal 40 comprises a base portion 41, two contact portions 42A and 42B, and a lead portion 43. In the following description, when there is no need to particularly distinguish between the two contact portions 42A and 42B, one of the two contact portions 42A and 42B may simply be referred to as contact portion 42.

[0026] The base portion 41 is flat. The base portion 41 is generally U-shaped in a plan view along the Z direction. The base portion 41 is sandwiched between the first case 20 and the second case 30 and fixed within the case 10. The base portion 41 is positioned in the X, Y, and Z directions by being sandwiched between the first case 20 and the second case 30.

[0027] The contact portion 42 is flat. The two contact portions 42A and 42B protrude from the base portion 41, respectively. The two contact portions 42A and 42B extend parallel to each other with a gap between them.

[0028] As shown in Figure 4, the lead portion 43 is drawn out from inside the case 10. The lead portion 43 has a first portion 43a extending from the base portion 41 toward the -Z side, and a second portion 43b connected to the first portion 43a via a bend and extending from the bend toward the +Y side. In other words, the lead portion 43 has an L-shape when viewed along the X direction. The lead portion 43 is located within the notch 33 of the second case 30. The lead portion 43 is spaced apart from other components except the fixed terminal 40. The second portion 43b is exposed to the outside of the coaxial connector 1. The second portion 43b is the part that will be fixed to the pads of the substrate using solder when the coaxial connector 1 is mounted on the substrate.

[0029] The first portion 43a includes a wide portion 43a1 connected to the second portion 43b, and a narrow portion 43a2 having a width narrower than the width of the wide portion 43a1, i.e., the dimension in the X direction, and connected to the wide portion 43a1 on the opposite side from the second portion 43b. The wide portion 43a1 includes a transition portion in which the width narrows as it approaches the narrow portion 43a2.

[0030] When the coaxial connector 1 is mounted on the circuit board, the movable terminal 50 is electrically connected to a circuit different from the circuit to which the fixed terminal 40 is connected among the high-frequency circuit and the antenna circuit.

[0031] The movable terminal 50 is electrically conductive. The movable terminal 50 is manufactured by bending a metal member of a predetermined shape obtained by punching out a metal plate. The movable terminal 50 comprises a base portion 51, a contact portion 52, and a lead portion 53.

[0032] The base portion 51 is flat. The base portion 51 is sandwiched between the first case 20 and the second case 30 and fixed within the case 10. That is, the base portion 51 is positioned in the X, Y, and Z directions by being sandwiched between the first case 20 and the second case 30.

[0033] The contact portion 52 has spring properties. The contact portion 52 is cantilevered to the base portion 51. The contact portion 52 has a first plate portion 52a and a second plate portion 52b that extend in the Y direction and are connected so as to fold back at the connecting portion.

[0034] The first plate portion 52a extends from the base portion 51 towards the +Y side. The first plate portion 52a is also curved convexly towards the +Z side. The +Y side end of the first plate portion 52a is connected to the +Y side end of the second plate portion 52b via a connecting portion.

[0035] The second plate portion 52b extends from the connecting portion toward the -Y side. More specifically, the second plate portion 52b extends diagonally toward the -X side as it moves toward the -Y side from the connecting portion. The second plate portion 52b is curved convexly toward the +Z side. The second plate portion 52b is in contact with the -Z side surface, i.e., the bottom surface, of the contact portion 52 of the fixed terminal 40.

[0036] The lead portion 53 has a first portion 53a extending from the base portion 51 toward the -Z side, and a second portion 53b connected to the first portion 53a via a bent portion and extending from the bent portion toward the -Y side. In other words, the lead portion 53 has an L-shape when viewed along the X direction. The lead portion 53 is located within the notch 34 of the second case 30. The lead portion 53 is spaced apart from other components other than the movable terminal 50. The second portion 53b is exposed to the outside of the coaxial connector 1. The second portion 53b is the part that will be fixed to the pads of the substrate using solder when the coaxial connector 1 is mounted on the substrate.

[0037] The first portion 53a comprises a wide portion 53a1 connected to the second portion 53b, and a narrow portion 53a2 having a width narrower than the width of the wide portion 53a1, i.e., the dimension in the X direction, and connected to the wide portion 53a1 on the opposite side from the second portion 53b. The wide portion 53a1 includes a transition portion in which the width narrows as it approaches the narrow portion 53a2.

[0038] The movable terminal 50 is electrically connected to the fixed terminal 40 when the contact portion 52 of the movable terminal 50 contacts the contact portion 42 of the fixed terminal 40. When the probe pin 2 (shown in Figure 6) of the inspection probe is inserted into the case 10 from the insertion opening 14 and the contact portion 52 is pushed toward the -Z side, the movable terminal 50 elastically deforms, causing the movable terminal 50 and the fixed terminal 40 to separate. As a result, the electrical connection between the movable terminal 50 and the fixed terminal 40 is released, and the inspection probe and the movable terminal 50 are electrically connected.

[0039] The external terminal 60 is connected to ground potential when the coaxial connector 1 is mounted on the circuit board. The external terminal 60 is conductive. The external terminal 60 is made of phosphor bronze. The external terminal 60 is formed integrally with the first case 20 by insert molding. The external terminal 60 comprises an upper wall portion 61, a pair of side wall portions 62A and 62B, a pair of bottom wall portions 63A and 63B, and a cylindrical portion 64. In the following description, when it is not necessary to distinguish between the pair of side wall portions 62A and 62B, one of the pair of side wall portions 62A and 62B may simply be referred to as side wall portion 62. In the following description, when it is not necessary to distinguish between the pair of bottom wall portions 63A and 63B, one of the pair of bottom wall portions 63A and 63B may simply be referred to as bottom wall portion 63.

[0040] The upper wall portion 61 is plate-shaped, extending in the X and Y directions. In a plan view along the Z direction, the upper wall portion 61 is generally rectangular. A cylindrical portion 64 is arranged on the upper wall portion 61. As shown in Figure 3, recesses 61a and 61b are formed on the bottom surface of the upper wall portion 61 facing the upper surface portion 11, i.e., the -Z side surface, which fit into the projections 24A and 24B of the first case 20, respectively. The pair of recesses 61a and 61b are arranged diagonally opposite each other on the bottom surface of the upper wall portion 61.

[0041] The side wall portion 62 is plate-shaped and extends in the X and Y directions. The side wall portion 62A is connected to the +X end of the upper wall portion 61 via a bent portion and extends from the bent portion toward the -Z side. The side wall portion 62A is positioned facing the first surface 13a (shown in Figure 5) of the side surface portion 13 in the Y direction. The side wall portion 62B is connected to the -X end of the upper wall portion 61 via a bent portion and extends from the bent portion toward the -Z side. The side wall portion 62B is positioned facing the second surface 13b (shown in Figure 5) of the side surface portion 13 in the Y direction.

[0042] The bottom wall portion 63 is plate-shaped and extends in the X and Y directions. The bottom wall portion 63 is spaced apart from the upper wall portion 61 in the Z direction and is arranged facing the upper wall portion 61. The bottom wall portion 63, together with the upper wall portion 61, sandwiches the case 10. The bottom wall portion 63 is connected to the -Z side end of the corresponding side wall portion 62 via a bent portion. When the coaxial connector 1 is mounted on the substrate, the bottom wall portion 63 is fixed to the pads of the substrate using solder.

[0043] As shown in FIG. 1, the coaxial connector 1 has a guide portion 70 that guides the probe pin 2 (shown in FIG. 6) of the inspection probe into the insertion port 14. The guide portion 70 is cylindrical and protrudes from the upper wall portion 61 in the +Z direction. The guide portion 70 of the present embodiment is composed of the cylindrical portion 22 of the first case 20 and the cylindrical portion 64 of the external terminal 60. The guide portion 70 includes a guide surface 71 formed by the inner peripheral surface of the cylindrical portion 22 and the inner peripheral surface of the cylindrical portion 64. The space defined by the guide surface 71 communicates with the insertion port 14 on the -Z side. The guide surface 71 has a frustum-of-a-conical shape that tapers toward the -Z side, that is, toward the insertion port 14.

[0044] The cylindrical portion 64 protrudes from the upper wall portion 61 in the +Z direction. The cylindrical portion 64 has a frustum-of-a-conical shape that tapers toward the -Z side. The cylindrical portion 64 fits onto the cylindrical portion 22 of the first case 20 from the outside. The cylindrical portion 64 is arranged so as to surround the cylindrical portion 22 of the first case 20. When the probe pin 2 (shown in FIG. 6) of the inspection probe having an outer conductor (not shown) is inserted into the insertion port 14, the cylindrical portion 64 has a function of holding the inspection probe by fitting with the outer conductor.

[0045] As shown in FIG. 3, an outlet 65 for pulling out the fixed terminal 40 to the outside is formed at the +Y side end of the external terminal 60. An outlet 66 for pulling out the movable terminal 50 to the outside is formed at the -Y side end of the external terminal 60. Each of the outlets 65 and 66 is arranged facing the side surface portion 13 in the Y direction. As a result, the third surface 13c of the side surface portion 13 is exposed to the outside through the outlet 65, and the fourth surface 13d of the side surface portion 13 is exposed to the outside through the outlet 66.

[0046] FIG. 5 is a top view of the coaxial connector 1. FIG. 6 is a cross-sectional view taken along line VI-VI of FIG. 5. As shown in FIGS. 5 and 6, the side wall portion 62 is arranged with a gap G between it and the side surface portion 13 in the X direction. The dimension of the gap G along the X direction is set so that solder or flux does not creep between the side surface portion 13 and the side wall portion 62 due to capillary action. For example, the dimension of the gap G along the X direction is preferably 0.05 mm or more, and more preferably 0.07 mm or more. As shown in FIG. 6, the gap G is the largest between the second case 30 and the side wall portion 62 and the smallest between the first case 20 and the side wall portion 62. In other words, the distance in the X direction between the second case 30 and the side wall portion 62 is larger than the distance in the X direction between the first case 20 and the side wall portion 62.

[0047] As shown in FIG. 5, when the upper wall portion 61 is viewed in plan, the guide portion 70 is arranged so as to partially overlap the gap G. Specifically, when the upper wall portion 61 is viewed in plan, the cylindrical portion 64 of the external terminal 60 constituting the guide portion 70 is arranged so as to partially overlap the gap G. The guide portion 70 may be arranged so as to overlap the entire gap G when the upper wall portion 61 is viewed in plan. Here, in FIG. 5, for the sake of clear explanation, the range where the gap G is provided is hatched.

[0048] When the case 10 is viewed in plan with respect to the upper wall portion 61, it extends beyond the guide portion 70 in the Y direction. That is, the third surface 13c of the side surface portion 13 is located on the +Y side of the guide portion 70, and the fourth surface 13d of the side surface portion 13 is located on the -Y side of the guide portion 70.

[0049] As shown in FIG. 6, the guide surface 71 is an inclined surface that extends inclined inward in the X direction as it approaches the insertion port 14. The entire guide surface 71 is arranged on the +Z side of the upper surface portion 11. In other words, the entire guide surface 71 is arranged outside the upper surface portion 11 in the Z direction. Further in other words, the edge portion 71a of the guide surface 71 facing the insertion port 14 is arranged on the +Z side of the upper surface portion 11.

[0050] Figure 7 is a bottom view of the coaxial connector 1, and the second case 30 and the external terminal 60 are omitted from the illustration in Figure 7. Referring to Figure 7, the positioning parts 23A to 23C position the fixed terminal 40 in a plane perpendicular to the Z direction by contacting the base 41 of the fixed terminal 40. In other words, the positioning parts 23A to 23C position the fixed terminal 40 in the X and Y directions. The positioning parts 23A to 23C are arranged to surround the base 41 of the fixed terminal 40.

[0051] Each of the positioning portions 23A to 23C is positioned at least partially inward from the outermost portion of the fixed terminal 40 in the X direction. Specifically, the positioning portions 23A to 23C are positioned on the +X side of the outermost edge 40a of the fixed terminal 40, which is located on the -X side. The outermost edge 40a is provided on the base portion 41 and extends in the Y direction. It is preferable that the entirety of each of the positioning portions 23A to 23C is positioned inward from the outermost portion of the fixed terminal 40 in the X direction.

[0052] The positioning sections 23D to 23F position the movable terminal 50 in a plane perpendicular to the Z direction by contacting the base 51 of the movable terminal 50. In other words, the positioning sections 23D to 23F position the movable terminal 50 in the X and Y directions. The positioning sections 23D to 23F are arranged to surround the base 51 of the movable terminal 50.

[0053] Each of the positioning portions 23D to 23F is positioned at least partially inward from the outermost portion of the movable terminal 50 in the X direction. Specifically, the positioning portions 23D to 23F are positioned on the -X side of the outermost edge 50a of the movable terminal 50, which is located on the +X side. The outermost edge 50a spans the base portion 51 and the contact portion 52 and extends in the Y direction. Preferably, each of the positioning portions 23D to 23F is positioned entirely inward from the outermost portion of the movable terminal 50 in the X direction.

[0054] Figure 8 is a bottom view of the coaxial connector 1. Figure 9 is a side view of the coaxial connector 1 as seen from the +Y side. Figure 10 is a cross-sectional view along the line X-X in Figure 5. In the following description, the fixed terminal 40 will be described mainly, but the movable terminal 50 has a similar configuration to the fixed terminal 40.

[0055] Referring to Figures 8 and 9, the bottom surface 12 of the case 10 is provided with a solder receiving surface 12a. The solder receiving surface 12a is stacked on the bottom wall 63 in the Z direction and extends beyond the bottom wall 63 toward the fixed terminal 40 and the movable terminal 50. The solder receiving surface 12a is a plane that extends in the X and Y directions. The solder receiving surface 12a is in contact with the bottom wall 63. Notches 33 and 34 are provided on the solder receiving surface 12a. When the bottom wall 63 is soldered to the substrate, the solder receiving surface 12a receives the solder or flux (see reference numeral A in Figure 9) that crawls up along the bottom wall 63, preventing the solder or flux from entering the case 10.

[0056] As shown in Figure 8, the smallest gap MG1, where the distance between the lead portion 43 of the fixed terminal 40 and other components is smallest in a plane perpendicular to the Z direction, is provided between the first portion 43a of the lead portion 43 and the solder receiving surface 12a. More specifically, the smallest gap MG1 is provided between the wide portion 43a1 (shown in Figure 9) of the first portion 43a and the solder receiving surface 12a. In Figure 9, the hypothetical boundary between the wide portion 43a1 and the narrow portion 43a2 is shown by a dashed line. The distance between the lead portion 43 and the solder receiving surface 12a in the smallest gap MG1 is greater than the minimum dimension of the gap G along the X direction. That is, the distance between the lead portion 43 and the solder receiving surface 12a in the smallest gap MG1 is greater than the distance in the X direction between the first case 20 and the side wall portion 62.

[0057] The smallest gap MG2, where the distance between the lead portion 53 of the movable terminal 50 and other components is smallest in a plane perpendicular to the Z direction, is formed between the first portion 53a of the lead portion 53 and the solder receiving surface 12a. More specifically, the smallest gap MG2 is provided between the wide portion 53a1 (shown in Figure 3) of the first portion 53a and the solder receiving surface 12a. The distance between the lead portion 53 and the solder receiving surface 12a in the smallest gap MG2 is greater than the minimum dimension of the gap G along the X direction. That is, the distance between the lead portion 53 and the solder receiving surface 12a in the smallest gap MG2 is greater than the distance in the X direction between the first case 20 and the side wall portion 62.

[0058] As shown in Figure 10, the fixed terminal 40 has a base material BM made of stainless steel, for example, SUS301. A base metal film MF1 is placed on the surface of the base material BM of the fixed terminal 40, and a surface metal film MF2 is placed on the base metal film MF1. The base metal film MF1 functions as a base for the surface metal film MF2. The base metal film MF1 is a nickel plating film mainly composed of nickel. The base metal film MF1 may contain components other than nickel or small amounts of impurities. The surface metal film MF2 has a higher solder wettability than the base metal film MF1. The surface metal film MF2 is a gold plating film mainly composed of gold. The surface metal film MF2 may contain components other than gold or small amounts of impurities.

[0059] The movable terminal 50 has a base material BM made of stainless steel, for example, SUS301. A base metal film MF1 is placed on the surface of the base material BM of the movable terminal 50, and a surface metal film MF2 is placed on the base metal film MF1. The base metal film MF1 functions as a base for the surface metal film MF2. The base metal film MF1 is a nickel plating film mainly composed of nickel. The base metal film MF1 may contain components other than nickel or small amounts of impurities. The surface metal film MF2 has a higher solder wettability than the base metal film MF1. The surface metal film MF2 is a gold plating film mainly composed of gold. The surface metal film MF2 may contain components other than gold or small amounts of impurities.

[0060] Referring to Figures 9 and 10, a barrier portion B is located in the first portion 43a of the lead portion 43. The barrier portion B is shown with hatching in Figure 9. The barrier portion B is the portion where the underlying metal film MF1, which is a nickel plating film, is exposed on the surface. As a result, the solder wettability of the barrier portion B is lower than that of the second portion 43b, where the surface metal film MF2 is distributed throughout.

[0061] At least a portion of barrier portion B is positioned on the side opposite to the upper wall portion 61 with respect to the minimum gap portion MG1, i.e., on the -Z side. In other words, at least a portion of barrier portion B is positioned on the side opposite to the upper wall portion 61 with respect to the solder receiving surface 12a, i.e., on the -Z side. Furthermore, at least a portion of barrier portion B is positioned in the wide portion 43a1.

[0062] The barrier portion B is formed by limiting the area where the surface metal film MF2 is formed and exposing the underlying metal film MF1. Alternatively, the barrier portion B may be formed by removing the surface metal film MF2 by etching, exposing the underlying metal film MF1 or the base material BM. The barrier portion B may also be formed by irradiating the surface metal film MF2 with a laser to diffuse the gold contained in the surface metal film MF2 and oxidize the nickel contained in the underlying metal film MF1. In the above description, the fixed terminal 40 was used as an example, but the barrier portion B may also be placed on the movable terminal 50.

[0063] As shown in Figure 8, the pair of posts 32A and 32B are positioned differently from the guide portion 70 in a plan view along the Z direction. In other words, the pair of posts 32A and 32B are positioned so as not to overlap with the guide portion 70 in a plan view along the Z direction. Furthermore, the pair of posts 32A and 32B are positioned so as to partially overlap with the corresponding pair of protrusions 24A and 24B in a plan view along the Z direction. The pair of posts 32A and 32B are positioned to protrude from the solder receiving surface 12a toward the -Z side.

[0064] The coaxial connector 1 according to this embodiment provides the following effects.

[0065] (1) The coaxial connector 1 comprises a case 10 having an upper surface portion 11 and a bottom surface portion 12 located on the opposite side of the upper surface portion 11 in the Z direction, with an insertion opening 14 formed in the upper surface portion 11 into which a probe pin 2 is inserted; a fixed terminal 40 positioned within the case 10; a movable terminal 50 positioned within the case 10 in contact with the fixed terminal 40, which elastically deforms when pressed by the probe pin 2 to release contact with the fixed terminal 40; and an external terminal 60 having an upper wall portion 61 positioned facing the upper surface portion 11 in the Z direction, and a bottom wall portion 63 positioned facing the bottom surface portion 12 in the Z direction, which together with the upper wall portion 61 sandwiches the case 10; one of the terminals of the fixed terminal 40 and the movable terminal 50 is provided with lead portions 43, 53 drawn out from the case 10; the lead portions 43, 53 are The device comprises first parts 43a and 53a that are pulled out from the case 10 and spaced apart from other components except for one terminal, and second parts 43b and 53b that are connected to the first parts 43a and 53a and fixed to the substrate when one terminal is mounted on the substrate, wherein the first parts 43a and 53a are provided with barrier parts B having a lower solder wettability than the second parts 43b and 53b, and at least a portion of the barrier parts B is positioned on the opposite side of the upper wall part 61 from the minimum gap parts MG1 and MG2 with the smallest spacing in the Z direction.

[0066] With this configuration, since the barrier portion B is positioned on the opposite side of the upper wall portion 61 from the minimum gap portions MG1 and MG2 in the Z direction, i.e., on the -Z side, it is possible to suppress the rise of solder or flux to the minimum gap portions MG1 and MG2. As a result, when mounting the coaxial connector 1 to the substrate, it is possible to suppress the intrusion of solder or flux into the case 10 through the minimum gap portions MG1 and MG2.

[0067] (2) The bottom portion 12 is arranged stacked on the bottom wall portion 63 in the Z direction and has a solder receiving surface 12a that extends beyond the bottom wall portion 63 toward one terminal in a plane perpendicular to the Z direction.

[0068] With this configuration, when the coaxial connector 1 is mounted on the circuit board, the solder receiving surface 12a catches the solder or flux that crawls up along the bottom wall portion 63, thereby preventing the solder or flux from entering the case 10.

[0069] (3) The minimum gaps MG1 and MG2 are provided between the lead portions 43 and 53 and the solder receiving surface 12a.

[0070] With this configuration, the solder receiving surface 12a catches some of the solder or flux that crawls up along the lead portions 43 and 53, thereby preventing the solder or flux from entering the case 10.

[0071] (4) The lead portions 43 and 53 each comprise a base material BM, an underlay metal film MF1 placed on the base material BM, and a surface metal film MF2 placed on the underlay metal film MF1, and the barrier portion B is the portion on which the underlay metal film MF1 is exposed on the surface.

[0072] With this configuration, a barrier portion B can be easily created on the surface of the lead portions 43 and 53. For example, the barrier portion B can be easily created on the surface of the lead portions 43 and 53 by partially forming the surface metal film MF2 on the underlying metal film MF1, or by forming the surface metal film MF2 over the entire surface of the underlying metal film MF1 and then removing a predetermined portion of the surface metal film MF2.

[0073] (5) The base metal film MF1 is a nickel plating film, and the surface metal film MF2 is a gold plating film.

[0074] The surface metal film MF2 is a gold plating film with good solder wettability, while the underlying metal film MF1 is a nickel plating film with lower solder wettability compared to the gold plating film. This ensures good solder wettability in the second portions 43b and 53b, which are fixed to the substrate using soldering, while suppressing solder or flux from creeping up the surface of the lead portions 43 and 53.

[0075] (6) The first portions 43a, 53a include wide portions 43a1, 53a1 connected to the second portions 43b, 53b, and narrow portions 43a2, 53a2 having a width narrower than the width of the wide portions 43a1, 53a1, and connected to the wide portions 43a1, 53a1 on the opposite side from the second portions 43b, 53b, and at least a part of the barrier portion B is arranged in the wide portions 43a1, 53a1.

[0076] With this configuration, since the barrier portion B is located on the wide portions 43a1 and 53a1, it is possible to suppress solder or flux from creeping up to the narrow portions 43a2 and 53a2. Furthermore, because the barrier portion B is located on the wide portions 43a1 and 53a1, the amount of solder or flux that can be suppressed from creeping up by the barrier portion B can be increased compared to the case where the barrier portion B is located only on the narrow portions 43a2 and 53a2. As a result, it is possible to further suppress solder or flux from creeping up on the surface of the lead portions 43 and 53.

[0077] (7) The minimum gaps MG1 and MG2 are provided between the wide portions 43a1 and 53a1 and the solder receiving surface 12a.

[0078] This configuration prevents solder or flux crawling up along the lead portions 43, 53 or the bottom wall portion 63 from crossing the barrier portion B and solder receiving surface 12a located on the wide portions 43a1, 53a1. As a result, it is possible to prevent solder or flux from entering the case 10.

[0079] [Modification] The coaxial connector according to this disclosure is not limited to the configuration of the embodiment described above, and various modifications are possible.

[0080] Figure 11 is a perspective view similar to Figure 1 of a modified coaxial connector 1 according to one embodiment described above. Figure 12 is a cross-sectional view similar to Figure 6 of the coaxial connector 1 shown in Figure 11. In the modified examples shown in Figures 11 and 12, the guide portion 70 is composed of a guide surface 71 formed recessed from the upper wall portion 61 toward the -Z side. The guide surface 71 in this modified example is composed of an inclined surface formed on the upper wall portion 61 and an inclined surface formed on the upper surface portion 11. The guide surface 71 has a frustoconical shape that tapers toward the -Z side, that is, toward the insertion opening 14.

[0081] According to this modified configuration, the guide portion 70 is formed recessed from the upper wall portion 61, which allows the coaxial connector 1 to be made lower in height compared to the case where the guide portion 70 protrudes from the upper wall portion 61.

[0082] In the above embodiment, the barrier portion B was a portion in which an underlying metal film, which is a nickel-plated film, was exposed on the surface. However, the barrier portion according to this disclosure may be made of unplated resin.

[0083] In the above embodiment, the first case 20 and the second case 30 were formed separately, but they may be formed integrally.

[0084] [Note] The coaxial connector relating to this disclosure provides the following embodiments.

[0085] [Aspect 1] A case having an upper surface and a bottom surface located opposite to the upper surface in a first direction, with an insertion opening formed in the upper surface into which a probe pin is inserted; a fixed terminal positioned within the case; a movable terminal positioned within the case in contact with the fixed terminal, which elastically deforms when pressed by the probe pin to release contact with the fixed terminal; an external terminal having an upper wall portion located facing the upper surface in a first direction, and a bottom wall portion located facing the bottom surface in a first direction, which together with the upper wall portion sandwiches the case; one of the fixed terminal and the movable terminal has a lead portion extended from the case; the lead portion has a first portion extended from the case and spaced apart from other components other than the one terminal; and a second portion connected to the first portion and fixed to the substrate when the one terminal is mounted on the substrate. A coaxial connector wherein the first portion has a barrier portion having a lower solder wettability than the second portion, and at least a portion of the barrier portion is positioned in the first direction on the opposite side from the upper wall portion to the minimum gap portion where the distance is smallest.

[0086] [Aspect 2] The coaxial connector according to aspect 1, wherein the bottom portion is arranged stacked on the bottom wall portion in the first direction and has a solder receiving surface that extends beyond the bottom wall portion toward one of the terminals in a plane perpendicular to the first direction.

[0087] [Aspect 3] The coaxial connector according to aspect 2, wherein the minimum gap is provided between the lead portion and the solder receiving surface.

[0088] [Aspect 4] The coaxial connector according to any one of aspects 1 to 3, wherein the lead portion comprises a base material, a base metal film disposed on the base material, and a surface metal film disposed on the base metal film, and the barrier portion is the portion on which the base metal film is exposed on the surface.

[0089] [Aspect 5] The coaxial connector according to any one of aspects 1 to 4, wherein the base metal film is a nickel plating film and the surface metal film is a gold plating film.

[0090] [Aspect 6] The coaxial connector according to any one of aspects 1 to 5, wherein the first part comprises a wide portion connected to the second part and a narrow portion having a width narrower than the width of the wide part and connected to the wide part on the opposite side from the second part, and at least a portion of the barrier part is arranged in the wide part.

[0091] [Aspect 7] The coaxial connector according to aspect 6, wherein at least a portion of the wide portion is arranged on the opposite side of the upper wall portion with respect to the solder receiving surface.

[0092] [Aspect 8] The coaxial connector according to aspect 6 or 7, wherein the minimum gap is provided between the wide portion and the solder receiving surface.

[0093] [Aspect 9] A coaxial connector comprising: a case having an upper surface and a bottom surface positioned on one side in a first direction relative to the upper surface, with a through hole formed in the upper surface; a first terminal positioned within the case; a second terminal positioned within the case in contact with the first terminal; and an external terminal having an upper wall portion positioned facing the upper surface in a first direction, and a bottom wall portion positioned facing the bottom surface in a first direction, sandwiching the case together with the upper wall portion, wherein one of the first terminal and the second terminal is provided with a lead portion extended from the case, the lead portion comprising: a first portion extended from the case and positioned at a distance from other parts of the coaxial connector other than the one terminal, and a second portion connected to the end of the first portion on the one side in the first direction, the first portion having a barrier portion having a lower solder wettability than the second portion. A coaxial connector wherein at least a portion of the barrier portion is located on one side of the minimum gap portion with the smallest spacing in the first direction.

[0094] 1 Coaxial connector 2 Probe pin 10 Case 11 Top surface 12 Bottom surface 12a Solder receiving surface 13 Side surface 14 Insertion opening 20 First case 21 Main body 22 Cylinder part 23 Positioning part 24 Projection part 30 Second case 31 Main body 32 Post 33 Notch 34 Notch 40 Fixed terminal 40a Outermost edge 41 Base part 42 Contact part 43 Lead part 43a First part 43b Second part 50 Movable terminal 50a Outermost edge 51 Base part 52 Contact part 52a First plate part 52b Second plate part 53 Lead part 53a First part 53b Second part 60 External terminal 61 Top wall part 61a Recess 61b Recess 62 Side wall 63 Bottom wall 64 Cylinder 65 Outlet 66 Outlet 70 Guide section 71 Guide surface 71a Edge G Gap MG Minimum gap B Barrier section

Claims

1. A case having an upper surface and a bottom surface located opposite the upper surface in a first direction, with an insertion opening formed in the upper surface into which a probe pin is inserted; a fixed terminal positioned within the case; a movable terminal positioned within the case in contact with the fixed terminal, which elastically deforms when pressed by the probe pin to release contact with the fixed terminal; an external terminal having an upper wall portion located facing the upper surface in a first direction, and a bottom wall portion located facing the bottom surface in a first direction, which together with the upper wall portion sandwiches the case; one of the fixed terminal and the movable terminal has a lead portion extended from the case; the lead portion has a first part extended from the case and spaced apart from other components other than the one terminal; and a second part connected to the first part and fixed to the substrate when the one terminal is mounted on the substrate; the first part has a barrier portion having a lower solder wettability than the second part. A coaxial connector wherein at least a portion of the barrier portion is located on the opposite side of the upper wall portion to the minimum gap portion with the smallest distance in the first direction.

2. The coaxial connector according to claim 1, wherein the bottom portion is arranged stacked on the bottom wall portion in the first direction and has a solder receiving surface that extends beyond the bottom wall portion toward one of the terminals in a plane perpendicular to the first direction.

3. The coaxial connector according to claim 2, wherein the minimum gap is provided between the lead portion and the solder receiving surface.

4. The coaxial connector according to any one of claims 1 to 3, wherein the lead portion comprises a base material, an underlay metal film disposed on the base material, and a surface metal film disposed on the underlay metal film, and the barrier portion is the portion on which the underlay metal film is exposed on the surface.

5. The coaxial connector according to claim 4, wherein the underlying metal film is a nickel-plated film and the surface metal film is a gold-plated film.

6. The coaxial connector according to claim 2, wherein the first portion comprises a wide portion connected to the second portion and a narrow portion having a width narrower than the width of the wide portion and connected to the wide portion on the opposite side from the second portion, and at least a portion of the barrier portion is located in the wide portion.

7. The coaxial connector according to claim 6, wherein at least a portion of the wide portion is positioned on the opposite side of the upper wall portion from the solder receiving surface.

8. The coaxial connector according to claim 6 or 7, wherein the minimum gap is provided between the wide portion and the solder receiving surface.

9. A coaxial connector comprising: a case having an upper surface and a bottom surface positioned on one side in a first direction relative to the upper surface, with a through hole formed in the upper surface; a first terminal positioned within the case; a second terminal positioned within the case in contact with the first terminal; and an external terminal having an upper wall positioned facing the upper surface in the first direction, and a bottom wall positioned facing the bottom surface in the first direction, sandwiching the case together with the upper wall; one of the first and second terminals having a lead portion extended from the case; the lead portion comprising: a first portion extended from the case and positioned at a distance from other parts of the coaxial connector other than the one terminal; and a second portion connected to the end of the first portion on the one side in the first direction; the first portion having a barrier portion having a lower solder wettability than the second portion. A coaxial connector wherein at least a portion of the barrier portion is located on one side of the minimum gap portion with the smallest spacing in the first direction.

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