Electronic device including protection circuit

Abstract

The present disclosure relates to an electronic device. The electronic device comprises: a housing; a connector disposed inside the housing, exposed through the housing, and configured to be electrically connected to an external device; a power delivery integrated chip (PDIC) disposed in the housing; and a power line configured to transfer power from the connector to the power delivery integrated chip when the external device is connected to the connector, the power line including a first power line connected to the connector, a second power line connected between the first power line and a third power line, and the third power line connected to the power delivery integrated chip. The second power line includes: a plurality of sub lines spaced apart from each other and extending from the first power line to the third power line so as to form an inductance for attenuating alternating current (AC) noise that is introduced from the connector when a plurality of external devices are connected to the connector; and a protection circuit configured to reduce the voltage applied to the power line. The protection circuit includes: a first protection circuit connected between the first power line and a ground when the external device is connected to the connector and configured to reduce the voltage applied to the first power line, and a second protection circuit connected between the third power line and the ground and configured to reduce the voltage applied to the third power line.

Description

Electronic device including a protection circuit

[0001] The embodiments of the present disclosure relate to electronic devices, for example, electronic devices including a protection circuit.

[0002] Driven by the remarkable advancements in information and communication technology and semiconductor technology, the distribution and use of various electronic devices are increasing rapidly. In particular, recent electronic devices are being developed to enable portable communication.

[0003] The term "electronic device" refers to a device that performs specific functions according to an installed program, ranging from home appliances to electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video / audio devices, desktop / laptop computers, and in-car navigation systems. For example, these electronic devices can output stored information as sound or video. As the integration density of electronic devices increases and ultra-high-speed, high-capacity wireless communication becomes commonplace, various functions can now be integrated into a single electronic device, such as a mobile communication terminal. For instance, not only communication functions but also entertainment functions like games, multimedia functions like music / video playback, communication and security functions like mobile banking, and functions such as schedule management or electronic wallets are being integrated into a single electronic device. These electronic devices are being miniaturized to allow users to carry them conveniently.

[0004] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0005] The present disclosure relates to an electronic device. In an electronic device, the device comprises a housing, a connector disposed inside the housing and exposed through the housing and configured to be electrically connected to an external device, a power supply circuit (PDIC, power delivery integrated chip) disposed in the housing, and a power line configured to transfer power from the connector to the power supply circuit when an external device is connected to the connector, the power line comprising a first power line connected to the connector, a second power line connected between the first power line and a third power line, and a third power line connected to the power supply circuit, wherein the second power line comprises a power line including a plurality of sub-lines extending from the first power line to the third power line and spaced apart from each other to form an inductance for attenuating alternating current (AC) noise entering from the connector when a plurality of external devices are connected to the connector, and a protection circuit configured to reduce the voltage applied to the power line, wherein when an external device is connected to the connector, the protection circuit is connected between the first power line and a ground portion, and the voltage applied to the first power line An electronic device may be provided comprising a first protection circuit configured to reduce and a second protection circuit connected between a third power line and the ground portion and configured to reduce the voltage applied to the third power line.

[0006] The present disclosure relates to an integrated circuit. In an integrated circuit, a connector configured to be electrically connected to an external device; a power delivery integrated chip (PDIC); and a power line configured to transfer power from the connector to the power delivery circuit when the external device is connected to the connector, comprising a first power line connected to the connector, a second power line connected between the first power line and the third power line, and a third power line connected to the power delivery circuit, wherein the second power line comprises a power line including a plurality of sub-lines extending from the first power line to the third power line and arranged spaced apart from each other to form an inductance for attenuating alternating current (AC) noise entering from the connector when a plurality of external devices are connected to the connector, and a protection circuit configured to reduce the voltage applied to the power line, wherein the protection circuit comprises a first protection circuit configured to reduce the voltage applied to the first power line and connected between the first power line and a ground portion when the external device is connected to the connector, and a An integrated circuit may be provided that includes a second protection circuit connected between the third power line and the ground portion and configured to reduce the voltage applied to the third power line.

[0007] The present disclosure relates to an electronic device comprising: a housing; a connector disposed within the housing, exposed through the housing, electrically connected to an external device, and configured to receive power of 240W or more from the external device; a power delivery integrated chip (PDIC) disposed in the housing; a power line configured to deliver power from the connector to the power delivery circuit when the external device is connected to the connector, comprising a first power line connected to the connector, a second power line connected between the first power line and the third power line, and a third power line connected to the power delivery circuit, wherein the second power line comprises a plurality of sub-lines extending from the first power line to the third power line and spaced apart from each other to form an inductance for attenuating alternating current (AC) noise introduced from the connector when a plurality of external devices are connected to the connector; and a protection circuit configured to reduce the voltage applied to the power line to 240V or more, wherein the protection circuit is configured such that when the external device is connected to the connector An electronic device may be provided comprising a first protection circuit configured to be connected between a first power line and a ground portion and to reduce the voltage applied to the first power line when connected, and a second protection circuit configured to be connected between a third power line and the ground portion and to reduce the voltage applied to the third power line.

[0008] The aspects, configurations, and / or advantages described above regarding one embodiment of the present disclosure may become more apparent from the following detailed description with reference to the accompanying drawings.

[0009] FIG. 1 is a block diagram of an electronic device in a network environment according to one embodiment of the present disclosure.

[0010] FIG. 2 is a perspective view of an electronic device in a folded state according to one embodiment of the present disclosure.

[0011] FIG. 3 is a perspective view of an electronic device in an unfolded state according to one embodiment of the present disclosure.

[0012] FIG. 4 is a plan view showing the interior of a first housing of an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 5 is a diagram showing a circuit diagram connected to an external device of an electronic device according to a comparative example of the present disclosure.

[0014] FIG. 6 is a diagram showing a circuit diagram connected to an external device of an electronic device according to one embodiment of the present disclosure.

[0015] FIG. 7 is a diagram showing a circuit diagram connected to an external device of an electronic device according to one embodiment of the present disclosure.

[0016] FIG. 8 is a diagram showing a circuit diagram connected to an external device of an electronic device according to one embodiment of the present disclosure.

[0017] FIG. 9 is a diagram showing a circuit diagram connected to an external device of an electronic device according to one embodiment of the present disclosure.

[0018] FIG. 10 is a diagram showing a circuit diagram connected to an external device of an electronic device according to one embodiment of the present disclosure.

[0019] Throughout the attached drawings, similar parts, configurations, and / or structures may be assigned similar reference numbers.

[0020] Terminal voltage suppression (TVS) diodes have generally been used to prevent or reduce overvoltage at power supply connection terminals. TVS diodes are effective in protecting circuits by limiting overvoltage that occurs for a short period of time, and this has generally provided sufficient protection performance. However, the voltage-reducing effect of TVS diodes is gradually revealing its limitations in modern high-power circuits that require high power consumption.

[0021] In particular, modern standards such as PD 3.1 EPR (Power Delivery 3.1 Extended Power Range) support high-power supplies of 48V and 5A, and the performance of TVS diodes may be insufficient in such environments. In this case, the magnitude of the externally supplied voltage may exceed 240V, and sufficient protection may be difficult due to the limitations of TVS diodes. Under these circumstances, it may become difficult to cope with rapid increases in voltage and current using only TVS diodes.

[0022] In order to reduce a sudden rise in the voltage and / or current of a circuit, there is a need to lower the voltage of the circuit through a method other than the conventional method of using TVS diodes. According to one embodiment, the invention of the present disclosure can effectively limit the voltage applied to the voltage of the power line by dividing at least a portion of the power line into a plurality of parts to form a second power line, and then connecting a protection circuit (e.g., TVS diode) to the circuit before and after the second power line.

[0023] The following description relating to the attached drawings may provide an understanding of various exemplary embodiments of the present disclosure, including the claims and their corresponding contents. While the exemplary embodiments disclosed in the following description include various specific details to aid understanding, they are to be considered as one of various exemplary embodiments. Accordingly, those skilled in the art will understand that various changes and modifications to the various embodiments described in the present disclosure may be made without departing from the scope and technical spirit of the disclosure. Additionally, for clarity and brevity, descriptions of well-known functions and configurations may be omitted.

[0024] The terms and words used in the following description and claims are not limited to their literal meanings but may be used to clearly and consistently describe an embodiment of the present disclosure. Accordingly, it will be apparent to a person skilled in the art that the following description of various embodiments of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the rights or the disclosure defined as equivalent thereto.

[0025] Unless the context clearly indicates otherwise, it should be understood that the singular forms of "a," "an," and "the" include a plural meaning. Thus, for example, "component surface" can be understood to include one or more of the component surfaces.

[0026] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to one embodiment.

[0027] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0028] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0029] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0030] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0031] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0032] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0033] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0034] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0035] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0036] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0037] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0038] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0039] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0040] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0041] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0042] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0043] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0044] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0045] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0046] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0047] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0048] According to one embodiment, commands or data may be transmitted or received between an electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0049] An electronic device according to one embodiment disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiment of this document is not limited to the aforementioned devices.

[0050] The embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0051] As used in one embodiment of this document, the term “module” may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0052] One embodiment of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0053] According to one embodiment, the method according to one embodiment disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0054] According to one embodiment, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to one embodiment, one or more of the components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to one embodiment, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0055] FIG. 2 is a perspective view of an electronic device in a folded state according to one embodiment of the present disclosure. FIG. 3 is a perspective view of an electronic device in an unfolded state according to one embodiment of the present disclosure.

[0056] In the following detailed description, the length direction, width direction, and / or thickness direction (or height direction) of the electronic device may be mentioned, and the length direction may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the thickness direction as the 'Z-axis direction'. In one embodiment, regarding the direction in which the component is oriented, 'negative / positive (- / +)' may be mentioned together with the Cartesian coordinate system illustrated in the drawings. For example, the front of the electronic device and / or housing may be defined as the 'face facing the +Z direction', and the rear as the 'face facing the -Z direction'. In one embodiment, the side of the electronic device and / or housing may include an area facing the +X direction, an area facing the +Y direction, an area facing the -X direction, and / or an area facing the -Y direction. In one embodiment, the 'X-axis direction' may mean both the '-X direction' and the '+X direction'. In the following description of the electronic device (101), the ‘first direction’ may mean the X-axis direction (or a direction parallel to the X-axis), the ‘second direction’ may mean the Y-axis direction (or a direction parallel to the Y-axis), and the ‘third direction’ may mean the Z-axis direction (or a direction parallel to the Z-axis). In the following description of the electronic device (101), the statement that a certain component is ‘disposed on’ another component may mean that the said certain component is placed in the +Z direction relative to the said other component.

[0057] It should be noted that this is based on the orthogonal coordinate system described in the drawings for the sake of brevity of explanation, and that the description of such directions or components does not limit the embodiment(s) of the present disclosure. For example, the orthogonal coordinate system may be defined differently from the present disclosure depending on the design specifications of the electronic device or the user's usage habits.

[0058] Referring to FIGS. 2 and FIGS. 3, the electronic device (101) may include a housing (202), a display (204), and a touchpad module (240). According to one embodiment, the electronic device (101) may be a laptop computer, a notebook computer, or a mobile terminal. The configuration of the electronic device (101) of FIGS. 2 and FIGS. 3 may be partially or entirely identical to the configuration of the electronic device (101) of FIGS. 1.

[0059] According to one embodiment, the housing (202) may form at least a part of the exterior of the electronic device (101) or support a part of the electronic device (101) (e.g., a touch pad module (240)). For example, the housing (202) may accommodate at least one of a display (204), an input device (206), or a touch pad module (240).

[0060] According to one embodiment, the electronic device (101) may be open (e.g., FIG. 3) or closed (e.g., FIG. 2). For example, the housing (202) may include a first housing (210) and a second housing (220) rotatably connected to the first housing (210). According to one embodiment, the electronic device (101) may include a hinge structure (230) connected to the second housing (220). For example, the hinge structure (230) may be connected to the first housing (210) and the second housing (220). According to one embodiment, the first housing (210) may be configured to rotate with respect to the second housing (220) at a specified angle (e.g., 0 to 180 degrees, or 0 to 360 degrees). According to one embodiment, the second housing (220) may be expressed, defined, and / or interpreted as rotating at a specified angle with respect to the first housing (210). For example, when the electronic device (101) is in a closed state (e.g., FIG. 2), the first front (210a) of the first housing (210) may face the second front (220a) of the second housing (220).

[0061] According to one embodiment, the housing (202) may be formed of a metal or non-metal material having a selected size of rigidity. According to one embodiment, at least a portion of the electronic device (101) formed of the metal material may provide a ground plane and may be electrically connected to a ground line formed on a printed circuit board (e.g., the circuit board (370) of FIG. 4). For example, the housing (202) may be electrically connected to the printed circuit board through a capacitive component.

[0062] According to one embodiment, at least a portion of the display (204) may be disposed within the second housing (220). For example, at least a portion of the display (204) may be visually exposed to the outside of the electronic device (101) through the second housing (220). The display (204) may form at least a portion of the second front (220a) of the second housing (220). According to one embodiment, the display (204) may be a flexible display in which at least a portion of the area may be deformed into a flat and / or curved surface. For example, the display (204) may be a foldable or rollable display. The configuration of the display (204) may be all or partly the same as the configuration of the display module (160) of FIG. 1.

[0063] According to one embodiment, the display (204) may be combined with or placed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer configured to detect a magnetic field type stylus pen.

[0064] According to one embodiment, the input device (206) can detect user input (e.g., pressure). According to one embodiment, the input device (206) may be placed or accommodated on the first housing (210). According to one embodiment, when the electronic device (101) is closed, the input device (206) may face the display (204). The configuration of the input device (206) of FIG. 2 may be all or partly the same as the configuration of the input module (150) of FIG. 1. For example, the input device (206) may be a keyboard.

[0065] According to one embodiment, the touchpad module (240) may be configured to detect or receive user input. According to one embodiment, the touchpad module (240) may include a capacitive touch sensor, a touch sensor based on resistive sensing, an optical touch sensor, or a surface acoustic touch sensor. For example, the touchpad module (240) detects current, pressure, light, and / or vibration resulting from an input applied by a user to the touchpad module (240), and the processor (e.g., the processor (120) of FIG. 1) and / or the touchpad module (240) may determine the user input based on changes in the detected current, pressure, light, and / or vibration. According to one embodiment, the touchpad module (240) may be referred to as a touchpad, a touchpad device, or a touchpad structure.

[0066] According to one embodiment, a processor (e.g., processor (120) of FIG. 1) and / or a touchpad module (240) can determine the user's input location (e.g., XY coordinates). According to one embodiment, the touchpad module (240) can detect pressure on the touchpad module (240). For example, the touchpad module (240) can detect force in the thickness direction (e.g., Z-axis direction) using a switch and at least one force sensor. According to one embodiment, the touchpad module (240) can detect an external object (e.g., user's finger or stylus) when the external object comes into direct contact with or is in close proximity to the surface of the touchpad module (240).

[0067] According to one embodiment, the touch pad module (240) may be housed in a housing (202). For example, the touch pad module (240) may be connected to a first housing (210), and at least a portion may be exposed to the outside of the first housing (210). According to one embodiment, the touch pad module (240) may be adjacent to an input device (206). According to one embodiment, when the electronic device (101) is closed, at least a portion of the touch pad module (240) may face a display (204). The configuration of the touch pad module (240) may be all or part identical to the configuration of the input module (150) of FIG. 1.

[0068] FIG. 4 is a plan view showing the interior of a first housing (210) of an electronic device (101) according to one embodiment of the present disclosure.

[0069] Referring to FIG. 4, an electronic device (101) (e.g., the electronic device (101) of FIG. 1 to 3) may include a first housing (310) (e.g., the first housing (210) of FIG. 2 and 3), a second housing (e.g., the second housing (220) of FIG. 2 and 3), a hinge structure (330) (e.g., the hinge structure (230) of FIG. 3), at least one fan module (360), a circuit board (370), and / or a heat dissipation member (380). According to one embodiment, the electronic device (101) may omit at least one of the components or additionally include other components (e.g., a support member (340), a conductive member (350)). At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIGS. 1 to 3, and redundant descriptions are omitted below.

[0070] According to one embodiment, the electronic device (101) may include a first housing (310) or a second housing (320) configured to rotate relative to the first housing.

[0071] The first housing (310) may include a first plate (311) that forms the overall appearance of the first housing (310). The first plate (311) provides rigidity to the first housing (310) and can be fixed to various parts. According to one embodiment, at least a portion of the edge of the first plate (311) (e.g., at least a portion of the edge facing the +Y direction in FIG. 4) may have a stepped portion (319) formed therein that is recessed inward toward the first plate (311) compared to other portions. In the stepped portion (319), a portion of the hinge structure (330) of the electronic device (101) (e.g., the hinge structure (230) in FIG. 3) (e.g., the inner space (S) enclosed by the hinge cover (331) in FIG. 10 and the second housing (320)) may be disposed therein.

[0072] According to one embodiment, the hinge structure (330) may include a hinge cover (331) and hinges (337, 338). According to one embodiment, the hinges (337, 338) may include a first hinge (337) and a second hinge (338) spaced apart from the first hinge (337). According to one embodiment, the electronic device (101) may include only one of the first hinge (337) and the second hinge (338). However, in order to perform the unfolding or folding behavior between the first housing (310) and the second housing (320) of the electronic device (101) more stably, the electronic device (101) may include two hinges (337, 338).

[0073] FIG. 4 is a plan view showing the interior of a first housing of an electronic device according to one embodiment of the present disclosure.

[0074] Referring to FIGS. 3 and 4, the hinge cover (331) may cover at least a portion of the hinge (370, 380) connecting the first housing (310) and the second housing (320). According to one embodiment, the internal space (S) enclosed by the hinge cover (331) may include not only at least a portion of the hinge, but also a hinge bracket (333), a clamp (334), and a cable (335), which will be described later in FIG. 6.

[0075] According to one embodiment, one part of the hinge structure (330) may be configured to be connected to the first housing (310) on a plane parallel to one side of the first housing (310), and another part of the hinge structure (330) may be configured to be connected to the second housing (320) on a plane parallel to one side of the second housing (320). According to one embodiment, the axis on which the hinge of the hinge structure (330) rotates may be formed on the same plane as the first housing (310).

[0076] According to one embodiment, the circuit board (370) may be disposed inside the first housing (310). The circuit board (370) may include at least one of a printed circuit board (PCB), a flexible printed circuit board (flexible PCB), or a rigid-flexible printed circuit board (RF-PCB).

[0077] According to one embodiment, at least one electrical component (e.g., processor (120), memory (130), or communication module (190) of FIG. 1) may be placed on the circuit board (370). For example, an audio codec module may be placed on the circuit board (370).

[0078] According to one embodiment, the circuit board (370) may include a plurality of circuit boards (371, 372, 373). For example, the circuit board (370) may include a first circuit board (371) disposed on one side of the electronic device (101) and a second circuit board (372) disposed on the other side of the electronic device (101). To achieve purposes such as efficient placement between components of the electronic device (101), placement for optimizing heat dissipation performance, and / or placement for preventing or reducing electrical interference, the electronic device (101) may include a plurality of circuit boards (371, 372, 373), wherein some of the circuit boards (371, 372) may be electrically spaced apart from each other. According to one embodiment, the electronic device (101) may include a third circuit board (373) for electrically connecting the first circuit board (371) and the second circuit board (372). For example, the third circuit board (373) may be a flexible circuit board. According to one embodiment, the third circuit board (373) may be replaced with various other connecting members (e.g., connectors) other than a flexible circuit board. In the following embodiments, when referring to circuit boards, the second circuit board (372) may be used as an example, but it should be noted that it is not necessarily limited thereto and the first circuit board (371) may also be applied. For convenience of explanation, the second circuit board (372) may simply be referred to as the 'circuit board (372)'. Furthermore, the description of the second circuit board (372) may also be applied to the first circuit board (371).

[0079] According to one embodiment, the heat dissipation member (380) may be disposed inside the first housing (310). According to one embodiment, the heat dissipation member (380) may be disposed on at least a part of the circuit board (370). For example, the heat dissipation member (380) may be disposed on one side of the circuit board (370) (e.g., the side facing the -Z direction in FIGS. 2 to 4).

[0080] According to one embodiment, the heat dissipation member (380) may include a vapor chamber, a heat pipe, a heat spreader, or a heat sink.

[0081] According to one embodiment, the heat dissipation member (380) may form a heat transfer path for discharging heat generated from the circuit board (370), heat generated from at least one electrical component disposed on the circuit board (370), or heat generated from an electrical component disposed inside the first housing (310) to the outside of the first housing (310).

[0082] According to one embodiment, at least one part of the heat dissipation member (380) may be disposed between at least one fan module (360) and the stepped portion (319) of the first plate (311).

[0083] According to one embodiment, at least one fan module (360) may be disposed inside the first housing (310). According to one embodiment, at least one fan module (360) may include a fan that generates airflow.

[0084] According to one embodiment, at least one fan module (360) can provide airflow to at least one part of the heat dissipation member (380). For example, the airflow provided from at least one fan module (360) can be discharged to the outside of the first housing (310) after passing through at least one part of the heat dissipation member (380). The airflow provided from at least one fan module (360) can be discharged to the outside of the first housing (310) after heat exchange with the heat dissipation member (380). For example, heat accumulated inside the first housing (310) can be discharged to the outside of the first housing (310) through the heat dissipation member (380) and the airflow.

[0085] According to one embodiment, at least one fan module (360) may include a first fan module (361) and a second fan module (362) spaced apart from the first fan module (361).

[0086] According to one embodiment, the first fan module (361) faces at least one part of the heat dissipation member (380), and the second fan module (362) may face a part other than the at least one part of the heat dissipation member (380).

[0087] According to one embodiment, the electronic device (101) may further include a first support member (340) coupled to a first plate (311). According to one embodiment, the support member (340) may be positioned at the edge of the first plate (311). According to one embodiment, the first support member (340) may be positioned facing a hinge cover (331). The first support member (340) may serve to support the first plate (311) and / or other parts (plate, bracket).

[0088] According to one embodiment, the electronic device (101) may include a conductive member (350). The conductive member (350) may be coupled to one surface of the first support member (340). According to one embodiment, the conductive member (350) may be positioned adjacent to the stepped portion (319). According to one embodiment, the first support member (340) may be positioned between the stepped portion (319) and the conductive member (350). According to one embodiment, the conductive member (350) may be positioned between the first support member (340) and the circuit board (370).

[0089] According to one embodiment, a connector (391) to which an external device (e.g., electronic device (102)) is connected may be disposed at one end of the electronic device (101). The same description of the connector (178) described with reference to FIG. 1 may apply to the connector (391). The external device may be, for example, an external electronic device capable of supplying power.

[0090] The connection terminal (391) may include a connector that allows the electronic device (101) to be physically connected to an external device (e.g., electronic device (102)). According to one embodiment, the connection terminal (391) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0091] According to one embodiment, the connection terminal (391) can be connected to an external device (e.g., electronic device (102)) to receive power from the external device (e.g., electronic device (102)). According to one embodiment, the connection terminal (391) can be connected to an external device (e.g., electronic device (102)) to provide various functions, such as transmitting and receiving data.

[0092] According to one embodiment, the connection terminal (391) may be referred to as USB TYPE-C. According to one embodiment, the connection terminal (391) may be a reversible terminal. In the present disclosure and the embodiments below, the connection terminal (391) is described as being USB TYPE-C, but is not limited thereto. The connection terminal (391) may be any other type of terminal as long as it is a terminal capable of delivering high power supplied from an external device (e.g., electronic device (102)) to the electronic device (101) in accordance with PD 3.1 EPR regulations.

[0093] USB Type-C supports a data transfer speed of up to 40Gbps and a power supply of up to 100W, and is a connector capable of bidirectional data transfer and power supply.

[0094] PD 3.1 EPR refers to a technology that receives up to 240W of power through a USB Type-C port. The PD 3.1 EPR standard supports a voltage of 48V and expands the maximum power supply range from 100W, which was supported by conventional technology, to 240W. This enables stable and efficient power supply to equipment requiring high power. Furthermore, it allows for the inclusion of additional safety protection features while maintaining compatibility with existing connection terminals.

[0095] FIG. 5 is a diagram showing a circuit diagram connected to an external device (e.g., electronic device (102)) of an electronic device (101) according to a comparative example of the present disclosure.

[0096] Referring to FIG. 5, the protection circuit (393') used in the comparative example and the protection circuit used in the embodiment of the present invention below (the protection circuit (393) of FIG. 6 to be described later) may include a TVS diode.

[0097] A TVS diode is an electronic device that protects electronic devices from instantaneous voltage fluctuations and may protect the circuit by rapidly dissipating excessive voltage applied to the power line (392). The TVS diode can quickly react when excessive voltage occurs on the power line (392) and clamp the voltage.

[0098] Clamping may mean a process of limiting the voltage applied to the power line (392) so that it does not exceed a specified level, and through clamping, the voltage applied to the power line (392) can be maintained within a specified range to protect the power line (392).

[0099] In the comparative example and the following embodiments of the city, the protection circuit (393, 393') is described as including a TVS diode and clamping the voltage through the TVS diode, but is not limited thereto. The protection circuit (393, 393') may use, for example, other protection elements that can generally protect the electronic device (101) from voltage fluctuations.

[0100] According to the comparative example of FIG. 5, a plurality of protection circuits (393') may be connected to the power line (392). When the power supplied from the connection terminal (391) and applied to the power line (392) is high, a plurality of protection circuits (393') may be connected to the power line (392) to protect the power line (392).

[0101] According to the comparative example of FIG. 5, even if multiple protection circuits (393') are connected to the power line (392), the voltage reduction by the multiple protection circuits (393') may not be effective because all of the multiple protection circuits (393') are connected to the same node.

[0102] A node is a term used to denote an electrical connection point within a circuit. A node refers to a specific point where electrical signals or currents cross or connect. In a circuit, a node—a specific point where signals or currents cross or connect—can be altered by passive components (e.g., resistors), and the point where the node changes in this way can be referred to as a node separation.

[0103] According to the comparative example of FIG. 5, the overvoltage of the voltage applied to the power line (392) can be protected by the first protection circuit (393'a), and the second protection circuit (393'b) may have a relatively smaller voltage clamping effect for protecting the power line (392) compared to the first protection circuit (393'a).

[0104] According to the comparative example of FIG. 5, in order to effectively protect the power line (392) from overvoltage using a plurality of protection circuits (393'), the node in the first protection circuit (393'a) and the node in the second protection circuit (393'b) must be separated. According to the comparative example, in order to separate the node in the first protection circuit (393'a) and the node in the second protection circuit (393'b), an additional configuration may be placed between the first protection circuit (393'a) and the second protection circuit (393'b).

[0105] Generally, a passive component (e.g., a resistor) may be placed between the first protection circuit (393'a) and the second protection circuit (393'b) to separate the nodes of the first protection circuit (393'a) and the second protection circuit (393'b), but if a passive component is placed, power efficiency may be reduced because the passive component uses a portion of the power supplied from the connection terminal. According to one embodiment, the invention of the present disclosure can effectively protect the power line (392) from overvoltage by separating the nodes between the first protection circuit (393'a) and the second protection circuit (393'b) without using a passive component.

[0106] With reference to FIGS. 6 to 10, each component included in the electronic device (101) will be described in more detail below.

[0107] FIG. 6 is a diagram showing a circuit diagram connected to an external device (e.g., electronic device (102)) of an electronic device (101) according to one embodiment of the present disclosure.

[0108] In the description of the electronic device (101) described below, the term 'first direction' may mean the direction from the connection terminal (391) to the power supply circuit (394).

[0109] Referring to FIG. 6, the integrated circuit (390) may include a connection terminal (391), a power line (392), a protection circuit (393), and a power supply circuit (394).

[0110] According to one embodiment, the connector (391) may be a terminal connecting an external device (e.g., electronic device (102)) and an electronic device (101), and the electronic device (101) may receive power from the external device (e.g., electronic device (102)) through the connector (391).

[0111] The description of the connection terminal (391) may be applied in the same way as the description of the connection terminal (391) described with reference to FIGS. 1 to 5. For example, the connection terminal (391) may be a USB Type-C terminal. According to one embodiment, the power supplied from the connection terminal (391) may be 240W or more.

[0112] According to one embodiment, a power line (392) is connected at one end to a connection terminal (391) so that power supplied from the connection terminal (391) can be transmitted to a power supply circuit (394).

[0113] According to one embodiment, the part connected to the connection terminal (391) of the power line (392) can be defined as the first power line (3921), and the part connected to the power supply circuit (394) of the power line (392) can be defined as the third power line (3923).

[0114] According to one embodiment, a second power line (3922) connected between a first power line (3921) and a third power line (3923) may be divided into a plurality of sub-lines extending from the first power line (3921) to the third power line (3923), with at least a portion of each sub-line spaced apart from each other. The node between the first power line (3921) and the third power line (3923) may be separated by the second power line (3922).

[0115] According to one embodiment, the power line (392) may be integrated so that the first power line (3921), the second power line (3922), and the third power line (3923) are integrally formed together with a conductive material.

[0116] According to one embodiment, the protection circuitry (393) can prevent or reduce overvoltage from being applied to the power line (392). According to one embodiment, the protection circuitry (393) can lower the voltage applied to the power line (392). According to one embodiment, the protection circuitry (393) can clamp the voltage applied to the power line (392) when an excessive voltage occurs on the power line (392).

[0117] According to one embodiment, a configuration connected between a first power line (3921) and a grounding part (G) to protect the power line (392) from overvoltage can be defined as a first protection circuit (393a), and a configuration connected between a third power line (3923) and the grounding part (G) to protect the power line (392) from overvoltage can be defined as a second protection circuit (393b).

[0118] According to one embodiment, since the node between the first power line (3921) and the third power line (3923) is separated by the second power line (3922), both the first protection circuit (393a) and the second protection circuit (393b) can effectively protect the power line (392) from overvoltage.

[0119] According to one embodiment, the first protection circuit (393a) primarily clamps the voltage applied to the first power line (3921), and the node between the first power line (3921) and the third power line (3923) can be separated by the second power line (3922). Additionally, the second protection circuit (393b) can secondarily clamp the voltage applied to the third power line (3923). As a result, each protection circuit (393) can effectively protect the integrated circuit (390) from overvoltage.

[0120] The power delivery integrated chip (394) can receive power from the power line (392) and deliver the received power to the electronic device (101). As described above, the power delivery integrated chip (394) can receive power by being connected to the third power line (3923).

[0121] FIG. 7 is a diagram showing a circuit diagram connected to an external device (e.g., electronic device (102)) of an electronic device (101) according to one embodiment of the present disclosure.

[0122] Referring to FIG. 7, when a second power line (3922) is placed between the first protection circuit (393a) and the second protection circuit (393b) to protect the integrated circuit (390), the voltage applied to the integrated circuit (390) can be clamped. The clamped voltage may be 240V or higher.

[0123] According to one embodiment, a plurality of sub-lines of the second power line (3922) may be extended from the first power line (3921) to the third power line (3923) and arranged in parallel.

[0124] According to one embodiment, the second power line (3922) may be a sub-line divided into at least two parts to separate the nodes of the power line (392).

[0125] According to one embodiment, the second power line (3922) may be about one-tenth the length of the integrated circuit (390). Additionally, the second power line (3922) may consist of seven spaced-apart sub-lines arranged in parallel. By separating the nodes of the integrated circuit (390) through the second power line (3922) and placing protection circuits (393) on both sides, it is possible to clamp more than 300V of the voltage applied to the integrated circuit (390).

[0126] Referring to FIG. 7, the second power line (3922) is illustrated as having five divided sub-lines arranged in parallel, and the length of the second power line (3922) is approximately half the length of the entire circuit, but the second power line (3922) is not limited thereto. If the second power line (3922) can separate the node between the first power line (3921) and the third power line (3923), the second power line (3922) can have various shapes.

[0127] According to one embodiment, the second power line (3922) is divided into five parts and configured such that a plurality of them are connected in parallel, and the length of the second power line (3922) in the first direction may be 10 mm. At this time, the protection circuit (393) can clamp 310 V of the voltage applied to the power line (392).

[0128] According to one embodiment, the second power line (3922) may be divided into five parts and configured such that a plurality of them are connected in parallel, and the length of the second power line (3922) in the first direction may be 5 mm. At this time, the protection circuit (393) can clamp 340 V of the voltage applied to the power line (392).

[0129] According to one embodiment, the second power line (3922) is divided into eight parts and configured such that a plurality of them are connected in parallel, and the length of the second power line (3922) in the first direction may be 10 mm. At this time, the protection circuit (393) can clamp 350 V of the voltage applied to the power line (392).

[0130] According to one embodiment, the second power line (3922) may be divided into eight parts and configured such that a plurality of them are connected in parallel, and the length of the second power line (3922) in the first direction may be 5 mm. At this time, the protection circuit (393) can clamp 310 V of the voltage applied to the power line (392).

[0131] According to one embodiment, even though the length and number of divisions of the second power line are changed, the protection circuit (393) can provide a voltage clamping effect of 240V or more to the integrated circuit (390).

[0132] FIG. 8 is a diagram showing a circuit diagram connected to an external device (e.g., electronic device (102)) of an electronic device (101) according to one embodiment of the present disclosure.

[0133] Referring to FIG. 8, the second power line (3922) includes a straight line extending from the first power line (3921) to the third power line (3923), and the plurality of sub-lines can be arranged to form at least one loop.

[0134] According to one embodiment, the second power line (3922) may be a sub-line divided into at least two parts to separate the nodes of the power line (392).

[0135] According to one embodiment, the loop may be multiple, and the multiple loops may be arranged in series.

[0136] According to one embodiment, the thicknesses of the multiple sub-lines arranged in parallel may differ from one another. Although FIG. 7 described above illustrates an example where the thicknesses of the wiring strands divided into multiple parts are all the same, the thicknesses of each sub-line may differ from one another as shown in FIG. 8.

[0137] FIG. 9 is a diagram showing a circuit diagram connected to an external device (e.g., electronic device (102)) of an electronic device (101) according to one embodiment of the present disclosure. FIG. 10 is a diagram showing a circuit diagram connected to an external device (e.g., electronic device (102)) of an electronic device according to one embodiment of the present disclosure.

[0138] Referring to FIGS. 9 and FIGS. 10, three or more protection circuits (393) can be connected to the power line (392).

[0139] According to one embodiment, the first protection circuit may include a plurality of first protection circuits (393a, 393c), and the second protection circuit may include a plurality of second protection circuits (393b, 393d).

[0140] According to one embodiment, as the first protection circuit (393a, 393c) and / or the second protection circuit (393b, 393d) include a plurality of protection circuits (393), the clamping effect of the protection circuit (393) may be increased. For example, if only a single protection circuit (393) is included, the voltage may be clamped up to the limit protection voltage of the single protection circuit (393), but if a plurality of protection circuits (393) (e.g., the first protection circuit (393a, 393c) and / or the second protection circuit (393b, 393d)) are included, the voltage may be clamped based on the protection circuit (393) with the highest limit protection voltage among the plurality of protection circuits (393). As a result, the voltage clamping effect of the protection circuit (393) may be increased.

[0141] According to one embodiment, as the first protection circuit (393a, 393c) and / or the second protection circuit (393b, 393d) include a plurality of protection circuits (393), the reliability of the protection performance of the protection circuit (393) can be improved. For example, even if one of the plurality of protection circuits (393) malfunctions, the other protection circuits (393) can operate normally to clamp the voltage, thereby effectively protecting the electronic device (101) from overvoltage and increasing the reliability of the protection performance.

[0142] According to one embodiment, as the first protection circuit (393a, 393c) and / or the second protection circuit (393b, 393d) include a plurality of protection circuits (393), the recovery time of the protection circuit (393) can be shortened. The recovery time may refer to the time required for the protection circuit (393) to operate stably again after the protection circuit (393) is damaged by high voltage. By using a plurality of protection circuits (393), each protection circuit (393) operates sequentially to clamp the voltage, thereby shortening the recovery time of the protection circuit (393). In addition, as the recovery time of the protection circuit (393) is shortened, the voltage clamping effect of the protection circuit (393) can be increased.

[0143] According to one embodiment, the second power line (3922) may include a plurality of sub-lines connected in series. Additionally, a third protection circuit (393e) may be formed between the plurality of sub-lines to clamp the voltage applied to the power line (392).

[0144] According to one embodiment, since the node of the power line (392) is separated by a loop placed between the first protection circuit (393a) and the third protection circuit (393e), the first protection circuit (393a) and the third protection circuit (393e) can effectively clamp the voltage applied to the power line (392).

[0145] Since the node of the power line (392) is separated by a loop placed between the third protection circuit (393e) and the second protection circuit (393b), the second protection circuit (393b) can also effectively clamp the voltage applied to the power line (392).

[0146] A number of lower lines may be arranged in series on the power line (392), and a protection circuit (393) may be arranged between the number of lower lines arranged in series to clamp the voltage applied to the power line (392).

[0147] Even when the lower lines are arranged in series, the lower lines may have various shapes, such as the arrangement structure of the second power line (3922) described above. For example, they may be in a form where multiple lower lines are arranged in parallel, as in the second power line (3922) described above, or they may be in a form that includes at least one loop and a straight line, as in the second power line (3922) described above.

[0148] According to one embodiment, the third protection circuit (393e) may include a plurality of protection circuits.

[0149] The present disclosure relates to an electronic device. According to one embodiment of the present disclosure, an electronic device (101) comprises: a housing; a connector (391) disposed inside the housing and exposed through the housing and configured to be electrically connected to an external device; a power delivery integrated chip (PDIC) (394) disposed in the housing; and a power line (392) configured to deliver power from the connector (391) to the power delivery circuit (394) when an external device is connected to the connector (391), the power line comprising a first power line (3921) connected to the connector (391), a second power line (3922) connected between the first power line (3921) and the third power line (3923), and a third power line (3923) connected to the power delivery circuit (394), wherein the second power line (3922) receives alternating current (AC) noise introduced from the connector (391) when a plurality of external devices are connected to the connector (391). The electronic device may include a power line (392) comprising a plurality of sub-lines extending from a first power line (3921) to a third power line (3923) and spaced apart from each other to form an inductance for attenuation, and a protection circuit (393) configured to reduce the voltage applied to the power line (392), wherein the protection circuit (393) includes a first protection circuit (393a) configured to reduce the voltage applied to the first power line (3921) and the ground portion (G) when an external device is connected to a connection terminal (391), and a second protection circuit (393b) configured to reduce the voltage applied to the third power line (3923) and the ground portion (G).

[0150] According to one embodiment, the power line (392) may be an electronic device in which the first power line (3921), the second power line (3922), and the third power line (3923) are integrated to be formed integrally with a conductive material, and the first protection circuit (393a) and the second protection circuit (393b) are configured to reduce the voltage applied to the power line (392) to below a preset voltage value, regardless of whether the power supplied from the connection terminal (391) is greater or less than 240W.

[0151] According to one embodiment, the connection terminal (391) is a USB Type-C terminal, and the first protection circuit (393a) and the second protection circuit (393b) may each be an electronic device including a TVS diode.

[0152] According to one embodiment, the first protection circuit (393a) and the second protection circuit (393b) may each be an electronic device comprising a plurality of TVS diodes.

[0153] According to one embodiment, the plurality of sub-lines may be electronic devices that extend from the first power line (3921) to the third power line (3923) and are arranged in parallel.

[0154] According to one embodiment, the second power line (3922) may be an electronic device comprising a straight line extending from the first power line (3921) to the third power line (3923), and the plurality of sub-lines arranged to form at least one loop.

[0155] According to one embodiment, the plurality of sub-lines may be an electronic device comprising a plurality of loops arranged in series, and a third protection circuit (393e) configured to reduce the voltage applied to the second power line (3922), which is connected between a straight line arranged between two adjacent loops among the plurality of loops and the ground portion (G).

[0156] According to one embodiment, the length of the plurality of sub-lines may be an electronic device in which the length in the first direction is 5 mm or more and 10 mm or less.

[0157] According to one embodiment, the length of the plurality of sub-lines is 10 mm in the first direction, and the number of the plurality of sub-lines is 8, and the electronic device may be such that the length of the plurality of sub-lines is 8.

[0158] According to one embodiment, the thickness of the straight line may be thinner than the thickness of the loop, and the electronic device may be such that the thickness of the straight line is thinner.

[0159] According to one embodiment, the power line (392) may be an electronic device comprising at least one of copper and aluminum.

[0160] According to one embodiment, the protection circuit (393) may be an electronic device that reduces a voltage of at least 240V among the voltages applied to the power line (392).

[0161] The present disclosure relates to an integrated circuit. According to one embodiment of the present disclosure, an integrated circuit (390) comprises a connector (391) configured to be electrically connected to an external device, a power delivery integrated chip (PDIC, power delivery integrated chip) (394), and a power line (392) configured to deliver power from the connector (391) to the power delivery circuit (394) when an external device is connected to the connector (391), wherein the power line (392) comprises a first power line (3921) connected to the connector (391), a second power line (3922) connected between the first power line (3921) and the third power line (3923), and a third power line (3923) connected to the power delivery circuit (394), wherein the second power line (3922) is spaced apart from each other to form an inductance for attenuating alternating current (AC) noise flowing in from the connector (391) when a plurality of external devices are connected to the connector (391). The power line (392) includes a plurality of sub-lines that are arranged and extend from a first power line (3921) to a third power line (3923), and a protection circuit (393) configured to reduce the voltage applied to the power line (392), wherein the protection circuit (393) may be an integrated circuit including a first protection circuit (393a) configured to reduce the voltage applied to the first power line (3921) and the grounding portion (G) when an external device is connected to a connection terminal (391), and a second protection circuit (393b) configured to reduce the voltage applied to the third power line (3923) and the grounding portion (G).

[0162] According to one embodiment, the power line (392) may be an integrated circuit in which a first power line (3921), a second power line (3922), and a third power line (3923) are integrated to be formed integrally with a conductive material, and the first protection circuit (393a) and the second protection circuit (393b) are configured to reduce the voltage applied to the power line (392) to below a preset voltage value, regardless of whether the power supplied from the connection terminal (391) is greater or less than 240W.

[0163] According to one embodiment, the connection terminal (391) is a USB Type-C terminal, and the first protection circuit (393a) and the second protection circuit (393b) may each be an integrated circuit including a TVS diode.

[0164] According to one embodiment, the first protection circuit (393a) and the second protection circuit (393b) may each be an integrated circuit comprising a plurality of TVS diodes.

[0165] According to one embodiment, the plurality of sub-lines may be integrated circuits that extend from the first power line (3921) to the third power line (3923) and are arranged in parallel.

[0166] The present disclosure relates to an electronic device. According to one embodiment of the present disclosure, an electronic device (101) comprises: a housing; a connector (391) disposed inside the housing and exposed through the housing, electrically connected to an external device, and configured to receive power of 240W or more from the external device; a power delivery integrated chip (PDIC, 394) disposed in the housing; and a power line (392) configured to deliver power from the connector (391) to the power delivery circuit (394) when an external device is connected to the connector (391), the power line comprising a first power line (3921) connected to the connector (391), a second power line (3922) connected between the first power line (3921) and the third power line (3923), and a third power line (3923) connected to the power delivery circuit (394), wherein the second power line (3922) is connected when a plurality of external devices are connected to the connector (391). The device includes a power line (392) comprising a plurality of sub-lines spaced apart from each other and extending from a first power line (3921) to a third power line (3923) to form an inductance for attenuating alternating current (AC) noise entering from a connection terminal (391), and a protection circuit (393) configured to reduce the voltage applied to the power line (392) by more than 240V, wherein the protection circuit (393) includes a first protection circuit (393a) connected between the first power line (3921) and a ground portion (G) and configured to reduce the voltage applied to the first power line (3921), and a second protection circuit (393b) connected between the third power line (3923) and the ground portion (G) and configured to reduce the voltage applied to the third power line (3923), when an external device is connected to the connection terminal (391). It can be a device.

[0167] According to one embodiment, the power line (392) may be an electronic device in which a first power line (3921), a second power line (3922), and a third power line (3923) are integrated to be formed integrally with a conductive material.

[0168] According to one embodiment, the connection terminal (391) is a USB Type-C terminal, and the first protection circuit (393a) and the second protection circuit (393b) may each be an electronic device including a TVS diode.

[0169] According to one embodiment, the protection circuit (393) can isolate a node of the power line (392) by isolating at least a portion of the second power line (3922) without a separate passive component. As a result, the protection circuit (393) placed at each end of the power line (392) can clamp and / or lower the voltage of the power line (392).

[0170] According to one embodiment, as protection circuits (393) placed at both ends of the power line (392) clamp and / or lower the voltage of the power line (392), the voltage of the integrated circuit (390) of the electronic device (101) may be prevented or reduced.

[0171] According to one embodiment, the protection circuit (393) can clamp and / or lower the voltage applied to the power line (392) to 240V or higher.

[0172] The electronic device (101) described through the embodiment of the present disclosure described above is not limited by the aforementioned embodiment and drawings, and it will be obvious to those skilled in the art that various substitutions, modifications, and changes are possible within the technical scope of the present invention.

Claims

1. In an electronic device (101), Housing; A connector (391) disposed inside the housing, exposed through the housing, and configured to be electrically connected to an external device; Power supply circuit (PDIC, power delivery integrated chip) (394) placed in the housing; A power line (392) configured to transmit power from a connection terminal (391) to a power supply circuit (394) when an external device is connected to a connection terminal (391), comprising a first power line (3921) connected to the connection terminal (391), a second power line (3922) connected between the first power line (3921) and the third power line (3923), and a third power line (3923) connected to the power supply circuit (394); wherein the second power line (3922) comprises a power line (392) including a plurality of sub-lines that are spaced apart from each other and extend from the first power line (3921) to the third power line (3923) to form an inductance for attenuating alternating current (AC) noise flowing in from the connection terminal (391) when a plurality of external devices are connected to the connection terminal (391); and It includes a protection circuit (393) configured to reduce the voltage applied to the power line (392), and The electronic device comprises a first protection circuit (393a) configured to reduce the voltage applied to the first power line (3921) when an external device is connected to the connection terminal (391), and a second protection circuit (393b) configured to reduce the voltage applied to the third power line (3923) when the protection circuit (393) is connected between the first power line (3921) and the grounding portion (G).

2. In Paragraph 1, The above power line (392) is integrated so that the first power line (3921), the second power line (3922), and the third power line (3923) are formed integrally with a conductive material. The electronic device, wherein the first protection circuit (393a) and the second protection circuit (393b) are configured to reduce the voltage applied to the power line (392) below a preset voltage value, regardless of whether the power supplied from the connection terminal (391) is greater or less than 240W.

3. In Paragraph 1 or 2, The above connection terminal (391) is a USB Type-C terminal, and The electronic device, wherein the first protection circuit (393a) and the second protection circuit (393b) each include a TVS diode.

4. In any one of paragraphs 1 to 3, The electronic device, wherein each of the first protection circuit (393a) and the second protection circuit (393b) comprises a plurality of TVS diodes.

5. In any one of paragraphs 1 to 4, The above plurality of sub-lines extend from the first power line (3921) to the third power line (3923) and are arranged in parallel, electronic devices.

6. In any one of paragraphs 1 to 5, The second power line (3922) includes a straight line extending from the first power line (3921) to the third power line (3923), and An electronic device in which the plurality of sub-lines are arranged to form at least one loop.

7. In any one of paragraphs 1 through 6, The above multiple sub-lines have multiple loops arranged in series, and The electronic device, wherein the protection circuit (393) comprises a third protection circuit (393e) configured to reduce the voltage applied to the second power line (3922), and is connected between a straight line positioned between two adjacent loops among a plurality of loops and the ground portion (G).

8. In any one of paragraphs 1 through 7, An electronic device in which the length of the plurality of sub-lines above is 5 mm or more and 10 mm or less in the first direction.

9. In any one of paragraphs 1 through 8, An electronic device in which the length of the plurality of sub-lines is 10 mm in the first direction and the number of the plurality of sub-lines is 8.

10. In any one of paragraphs 1 through 9, An electronic device in which the thickness of the above straight line is thinner than the thickness of the above loop.

11. In any one of paragraphs 1 through 10, The above protection circuit (393) is an electronic device that reduces a voltage of at least 240V among the voltages applied to the power line (392).

12. In an integrated circuit (390), A connector (391) configured to be electrically connected to an external device; Power supply circuit (PDIC, power delivery integrated chip) (394); A power line (392) configured to transmit power from a connection terminal (391) to a power supply circuit (394) when an external device is connected to a connection terminal (391), comprising a first power line (3921) connected to the connection terminal (391), a second power line (3922) connected between the first power line (3921) and the third power line (3923), and a third power line (3923) connected to the power supply circuit (394); wherein the second power line (3922) comprises a power line (392) including a plurality of sub-lines spaced apart from each other and extending from the first power line (3921) to the third power line (3923) to form an inductance for attenuating alternating current (AC) noise flowing in from the connection terminal (391) when a plurality of external devices are connected to the connection terminal (391); and It includes a protection circuitry (393) configured to reduce the voltage applied to the power line (392), and The above protection circuit (393) is an integrated circuit comprising a first protection circuit (393a) configured to reduce the voltage applied to the first power line (3921) when an external device is connected to the connection terminal (391), and a second protection circuit (393b) configured to reduce the voltage applied to the third power line (3923) when the external device is connected to the connection terminal (391).

13. In Paragraph 12, The above power line (392) is integrated so that the first power line (3921), the second power line (3922), and the third power line (3923) are formed integrally with a conductive material, and The first protection circuit (393a) and the second protection circuit (393b) are integrated circuits configured to reduce the voltage applied to the power line (392) below a preset voltage value, regardless of whether the power supplied from the connection terminal (391) is greater or less than 240W.

14. In Paragraph 12 or 13, The above connection terminal (391) is a USB Type-C terminal, and The first protection circuit (393a) and the second protection circuit (393b) each include a TVS diode, and are integrated circuits.

15. In any one of paragraphs 12 through 14, Each of the first protection circuit (393a) and the second protection circuit (393b) comprises a plurality of TVS diodes, in an integrated circuit.

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