Electronic device comprising structure for improving heat dissipation performance

Abstract

A foldable electronic device according to one embodiment may comprise: a housing including a first housing part, which includes a first thermally conductive plate, and a second housing part, which includes a second thermally conductive plate and an elastic member; an electronic component disposed in the housing; and a hinge assembly rotatably coupling the first housing part and the second housing part. The first thermally conductive plate can come in contact with the second thermally conductive plate while the foldable electronic device is unfolded. The elastic member can provide, toward the first thermally conductive plate, a force to the second thermally conductive plate while the foldable electronic device is unfolded, so that the second thermally conductive plate applies the force toward the first thermally conductive plate.

Description

Electronic device including a structure for improving heat dissipation performance

[0001] The present disclosure relates to an electronic device comprising a structure for improving heat dissipation performance.

[0002] Electronic devices including large-screen displays can enhance user usability. As the demand for highly portable electronic devices increases, electronic devices may include deformable displays. For example, electronic devices may include foldable displays, such as flexible displays. By including deformable displays, electronic devices can be miniaturized. As electronic components placed within the electronic device perform operations to respond to user requests, heat may be generated within the miniaturized electronic device. Therefore, electronic devices may require a structure to dissipate the heat generated from the electronic components.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0004] A foldable electronic device is disclosed. The foldable electronic device may include a housing comprising a first housing part including a first thermal conductive plate and a second housing part including a second thermal conductive plate and an elastic member, an electronic component disposed within the housing, and a hinge assembly rotatably connecting the first housing part and the second housing part. The first thermal conductive plate may be configured to contact the second thermal conductive plate in the unfolded state of the foldable electronic device so that the first thermal conductive plate and the second thermal conductive plate form a thermal conduction path between the first housing part and the second housing part for heat generated from the electronic component. The elastic member may be configured to provide force to the second thermal conductive plate toward the first thermal conductive plate in the unfolded state of the foldable electronic device so that the second thermal conductive plate applies force toward the first thermal conductive plate.

[0005] A foldable electronic device is disclosed. The foldable electronic device may include a housing comprising a first housing part including a first thermal conductive plate and a second housing part including a guide assembly including a second thermal conductive plate and an elastic member, an electronic component disposed within the housing, and a hinge assembly rotatably connecting the first housing part and the second housing part. The first thermal conductive plate may be configured to contact the second thermal conductive plate in an unfolded state of the foldable electronic device so that the first thermal conductive plate and the second thermal conductive plate form a thermal conduction path between the first housing part and the second housing part for heat generated from the electronic component. The elastic member may provide a repulsive force toward the second thermal conductive plate against a force applied from the second thermal conductive plate to the first thermal conductive plate in the unfolded state of the foldable electronic device so that the second thermal conductive plate is in close contact with the first thermal conductive plate.

[0006] A foldable electronic device is disclosed. The foldable electronic device may include a housing comprising a first housing part including a first thermal conductive plate and a second housing part, a guide assembly comprising a guide plate coupled to the second housing part, a second thermal conductive plate movably coupled to the guide plate, and an elastic member coupled to the guide plate to contact the second thermal conductive plate, an electronic component disposed within the housing, and a hinge assembly rotatably coupled the first housing part and the second housing part. The first thermal conductive plate may be configured to contact the second thermal conductive plate within the unfolded state of the foldable electronic device so that the first thermal conductive plate and the second thermal conductive plate form a thermal conduction path between the first housing part and the second housing part for heat generated from the electronic component. The elastic member can provide a repulsive force toward the second thermal conductive plate against a force applied from the second thermal conductive plate to the first thermal conductive plate within the unfolded state of the foldable electronic device so that the second thermal conductive plate comes into close contact with the first thermal conductive plate.

[0007] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0008] FIG. 2a illustrates the unfolded state of an exemplary electronic device.

[0009] FIG. 2b illustrates the folded state of an exemplary electronic device.

[0010] FIG. 2c is an exploded view of an exemplary electronic device.

[0011] FIG. 2d illustrates the unfolded state of an exemplary electronic device.

[0012] FIG. 2e illustrates the folded state of an exemplary electronic device.

[0013] FIG. 3a illustrates a part of an exemplary electronic device in a folded state.

[0014] FIG. 3b illustrates a part of an exemplary electronic device in an unfolded state.

[0015] FIG. 4 illustrates a part of an exemplary electronic device in an unfolded state.

[0016] FIG. 5a is a top plan view of a first plate of an exemplary electronic device.

[0017] FIG. 5b is a bottom view of the first plate of an exemplary electronic device.

[0018] FIG. 5c is an exploded perspective view of a guide assembly of an exemplary electronic device.

[0019] FIGS. 5d and FIGS. 5e are perspective views of a first plate and a guide assembly of an exemplary electronic device in contact with each other.

[0020] FIG. 6a is a side view of the first plate and guide assembly of an exemplary electronic device.

[0021] FIG. 6b illustrates a portion of a second thermal conductive member of an exemplary electronic device.

[0022] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0023] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0024] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0025] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0026] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0027] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0028] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0029] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0030] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0031] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0032] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0033] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0034] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0035] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0036] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0037] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0038] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0039] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0040] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0041] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0042] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0043] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0044] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0045] FIG. 2a illustrates an unfolded state of an exemplary electronic device (e.g., electronic device (101) according to FIG. 1). FIG. 2b illustrates a folded state of an exemplary electronic device (e.g., electronic device (101) according to FIG. 1). FIG. 2c is an exploded view of an exemplary electronic device (e.g., electronic device (101) according to FIG. 1).

[0046] Referring to FIGS. 2a, 2b, and 2c, the electronic device (101) may include a housing (200) comprising a first housing part (210) and a second housing part (220), a display (230), at least one camera (240) (e.g., camera module (180) of FIG. 1), a hinge structure (250), and / or at least one electronic component (260).

[0047] The first housing part (210) and the second housing part (220) may form at least a portion of the outer surface of the electronic device (101) that can be gripped by a user. At least a portion of the outer surface of the electronic device (101) defined by the first housing part (210) and the second housing part (220) may come into contact with a portion of the user's body when the electronic device (101) is used by the user. According to one embodiment, the first housing part (210) may include a first front surface (211), a first rear surface (212) facing the first front surface (211) and spaced apart from the first front surface (211), and one or more first side surfaces (213) covering at least a portion of the first front surface (211) and the first rear surface (212). In other arrangements, the first front (211) may be considered to be away from the first rear (212). That is, the first front (211) faces a first direction and the first rear (212) faces a second direction opposite to the first direction. The first sides (213) may connect the periphery of the first front (211) and the periphery of the first rear (212). The first front (211), the first rear (212), and the first sides (213) may define the internal space of the first housing part (210). According to one embodiment, the first housing part (210) may provide the space (or environment, area, volume, etc.) formed by the first front (211), the first rear (212), and the first sides (213) as a space for placing or providing components of the electronic device (101). For example, a component (e.g., at least one component) may be placed within a space (e.g., an internal space) formed or bounded by the first front (211), the first rear (212), and the first sides (213).

[0048] The second housing part (220) may include a second front (221), a second rear (222) facing the second front (221) and spaced apart from the second front (221), and one or more second sides (223) covering at least a portion of the second front (221) and the second rear (222). In another arrangement, the second front (221) may be seen to face the opposite side from the second rear (222). For example, the second front (221) faces a third direction, and the second rear (222) faces a fourth direction opposite to the third direction. The second sides (223) may connect the periphery of the second front (221) and the periphery of the second rear (222). The second front (221), the second rear (222), and the second sides (223) may define the internal space of the second housing part (220). According to one embodiment, the second housing part (220) may provide the space formed by the second front (221), the second rear (222), and the second sides (223) that enclose at least a portion of the second front (221) and the second rear (222) as a space (e.g., environment, area, volume, etc.) for mounting or providing components of the electronic device (101). For example, a component (e.g., at least one component) may be placed within the space (e.g., internal space) formed or bounded by the second front (221), the second rear (222), and the second sides (223). According to one embodiment, the second housing part (220) may be coupled to the first housing part (210) so as to be rotatable with respect to the first housing part (210).

[0049] Each of the first housing part (210) and the second housing part (220) may include a first protective member (214) and a second protective member (224), respectively. The first protective member (214) and the second protective member (224) may be disposed on the first front (211) and the second front (221) along the periphery (e.g., edge, rim, bezel, etc.) of the display (230). According to one embodiment, the first protective member (214) and the second protective member (224) may prevent the ingress of foreign substances (e.g., dust or moisture) through the gap between the display (230) and the first housing part (210) and the second housing part (220). For example, the first protective member (214) may surround the edge of the first display portion (231) of the display (230), and the second protective member (224) may surround the edge of the second display portion (232) of the display (230). The first protective member (214) may be formed by being attached to the first sides (213) of the first housing part (210) or formed integrally with the first sides (213). The second protective member (224) may be formed by being attached to the second sides (223) of the second housing part (220) or formed integrally with the second sides (223).

[0050] One or more of the first aspects (213) and one or more of the second aspects (223) may include a conductive material, a non-conductive material, or a combination thereof. For example, the second aspects (223) may include at least one conductive part (225) and at least one non-conductive part (226). The at least one conductive part (225) may include a plurality of conductive parts spaced apart from each other. The at least one non-conductive part (226) may be disposed between the plurality of conductive parts. The plurality of conductive parts may be disconnected from each other by the at least one non-conductive part (226) disposed between the plurality of conductive parts. According to one embodiment, the plurality of conductive parts and the plurality of non-conductive parts may together form an antenna radiator. The electronic device (101) may be able to communicate with an external electronic device through the antenna radiator formed by the plurality of conductive parts and the plurality of non-conductive parts.

[0051] The display (230) may be configured to display visual information. According to one embodiment, the display (230) may be positioned across the first front (211) of the first housing part (210) and the second front (221) of the second housing part (220). For example, the display (230) may include a first display portion (231) positioned on the first front (211) of the first housing, a second display portion (232) positioned on the second front (221) of the second housing, and a third display portion (233) positioned between the first display portion (231) and the second display portion (232). The first display portion (231), the second display portion (232), and the third display portion (233) may form the front of the display (230). According to one embodiment, the display (230) may further include a sub-display (235) disposed on the second rear (222) of the second housing part (220). For example, the display (230) may be referred to as a flexible display. According to one embodiment, the display (230) may include a window exposed toward the outside of the electronic device (101). The window may protect the surface of the display (230) and may include a substantially transparent material to transmit visual information provided by the display (230) to the outside of the electronic device (101). For example, the window may include glass (e.g., UTG, ultra-thin glass) and / or a polymer (e.g., PI, polyimide), but is not limited thereto.

[0052] At least one camera (240) may be configured to acquire an image based on receiving light from an object outside the electronic device (101). According to one embodiment, at least one camera (240) may include first cameras (241), a second camera (242), and / or a third camera (243). The first cameras (241) may be placed in a first housing part (210). For example, the first cameras (241) may be placed inside the first housing part (210), and at least a portion may be visible through the first rear surface (212) of the first housing part (210). The first cameras (241) may be supported by a bracket (not shown) within the first housing part (210). The first housing part (210) may include at least one opening (241a) that overlaps the first cameras (241) when the first rear (212) is viewed from above. The first cameras (241) may acquire an image based on receiving light from outside the electronic device (101) through the at least one opening (241a).

[0053] The second camera (242) may be placed in the second housing part (220). For example, the second camera (242) may be placed inside the second housing part (220) and may be visible through the sub-display (235). The second housing part (220) may include at least one opening (242a) that overlaps the second camera (242) when the second rear (222) is viewed from above. The second camera (242) may acquire an image based on receiving light from outside the electronic device (101) through the at least one opening (242a).

[0054] The third camera (243) may be placed in the first housing part (210). For example, the third camera (243) may be placed inside the first housing part (210) and at least a portion of it may be visible through the first front (211) of the first housing part (210). For another example, the third camera (243) may be placed inside the first housing part (210) and at least a portion of it may be visible through the first display part (231) of the display (230). The first display part (231) of the display (230) may include at least one opening (not shown) that overlaps with the third camera (243) when the display (230) is viewed from above. The third camera (243) may acquire an image based on receiving light from outside the display (230) through at least one opening.

[0055] The second camera (242) and the third camera (243) may be positioned below the display (230) (e.g., in a direction toward the interior of the first housing part (210) or the interior of the second housing part (220). For example, the second camera (242) and the third camera (243) may be under-display cameras (UDC). When the second camera (242) and the third camera (243) are under-display cameras, one area of ​​the display (230) corresponding to the respective positions of the second camera (242) and the third camera (243) may not be an inactive area. For example, when the second camera (242) and the third camera (243) are under-display cameras, one area of ​​the display (230) corresponding to the respective positions of the second camera (242) and the third camera (243) may have a lower pixel density than the pixel density of other areas of the display (230). An inactive area of ​​the display (230) may refer to an area of ​​the display (230) that does not contain pixels or does not emit light outside the electronic device (101). As another example, the second camera (242) and the third camera (243) may be punch-hole cameras. If the second camera (242) and the third camera (243) are punch-hole cameras, an area of ​​the display (230) corresponding to the respective locations of the second camera (242) and the third camera (243) may be an inactive area. For example, if the second camera (242) and the third camera (243) are punch-hole cameras, an area of ​​the display (230) corresponding to the respective locations of the second camera (242) and the third camera (243) may include an opening that does not contain pixels.

[0056] A hinge structure (250) can rotatably connect a first housing part (210) and a second housing part (220) (e.g., a rotatable couple or a movable couple that allows at least partial rotation). The hinge structure (250) can be positioned between the first housing part (210) and the second housing part (220) of the electronic device (101) so that the electronic device (101) can be bent, curved, or folded. For example, the hinge structure (250) can be positioned between a portion of the first sides (213) and a portion of the second sides (223) facing each other. For example, the hinge structure (250) may be positioned between a portion of the corner or side (e.g., the first side (213)) of the first housing part (210) and a portion of the corner or side (e.g., the second side (223)) of the second housing part (220). The hinge structure (250) may be configured to change the electronic device (101) between a folded state and an unfolded state. The hinge structure (250) may change the electronic device (101) to an unfolded state in which the first front (211) of the first housing part (210) and the second front (221) of the second housing part (220) face each other in substantially the same direction, or to a folding state in which the first front (211) and the second front (221) face each other. When the electronic device (101) is in a folded state, the first housing part (210) and the second housing part (220) can be overlapped or superimposed by facing each other.

[0057] When the electronic device (101) is in a folded state, the direction in which the first front (211) faces and the direction in which the second front (221) faces may be different from each other. For example, when the electronic device (101) is in a folded state, the direction in which the first front (211) faces and the direction in which the second front (221) faces may be opposite to each other. For example, the first housing part (210) and the second housing part (220) may be folded inward around a hinge structure, and in the folded state, the first front (211) and the second front (221) may face each other. As another example, when the electronic device (101) is in a folded state, the direction in which the first front (211) faces and the direction in which the second front (221) faces may be tilted relative to each other. When the direction in which the first front (211) faces is tilted relative to the direction in which the second front (221) faces, the first housing part (210) may be tilted relative to the second housing part (220). However, it is not limited thereto. For example, within the folded state of the electronic device (101), the first rear (212) of the first housing part (210) may face the second rear (222) of the second housing part (220) (for example, the electronic device is folded in the opposite direction to that shown in FIG. 2b). When the first rear (212) and the second rear (222) face each other within the folded state of the electronic device (101), the direction in which the first front (211) faces and the direction in which the second front (221) faces may be opposite to each other. When the first rear surface (212) and the second rear surface (222) face each other within the folded state of the electronic device (101), the display (230) may be directly exposed to the outside in the folded state of the electronic device (101). For example, the first housing part (210) and the second housing part (220) may be folded outward around a hinge structure, and the first front surface (211) and the second front surface (212) may each face outward (e.g., external) in the folded state.

[0058] The electronic device (101) may be foldable along a folding axis (f). The folding axis (f) may refer to, but is not limited to, an imaginary line extending through the hinge cover (251) in a direction substantially parallel to the longitudinal direction of the electronic device (101). For example, the folding axis (f) may be an imaginary line extending in a direction substantially perpendicular to the longitudinal direction of the electronic device (101). When the folding axis (f) extends in a direction substantially perpendicular to the longitudinal direction of the electronic device (101), the hinge structure (250) may extend in a direction parallel to the folding axis (f) to connect the first housing part (210) and the second housing part (220). The first housing part (210) and the second housing part (220) may be rotatable by the hinge structure (250) which extends in a direction substantially perpendicular to the longitudinal direction of the electronic device (101).

[0059] The hinge structure (250) may include a hinge cover (251), a first hinge plate (252), a second hinge plate (253), and a hinge module (254). The hinge cover (251) may surround internal components of the hinge structure (250) and form the outer surface of the hinge structure (250). According to one embodiment, the hinge cover (251) surrounding the hinge structure (250) may be visually exposed to the outside of the electronic device (101) through the space between the first housing part (210) and the second housing part (220) when the electronic device (101) is in a folded state. According to an embodiment, when the electronic device (101) is in an unfolded state, the hinge cover (251) may be covered by the first housing part (210) and the second housing part (220) so that it is not visually exposed to the outside of the electronic device (101).

[0060] The first hinge plate (252) and the second hinge plate (253) can be rotatably connected to the first housing part (210) and the second housing part (220) by being coupled to the first housing part (210) and the second housing part (220), respectively. For example, the first hinge plate (252) can be coupled to the first bracket (215) of the first housing part (210), and the second hinge plate (253) can be coupled to the second bracket (227) of the second housing part (220). As the first hinge plate (252) and the second hinge plate (253) are each coupled to the first bracket (215) and the second bracket (227), the first housing part (210) and the second housing part (220) may be rotatable according to the rotation of the first hinge plate (252) and the second hinge plate (253).

[0061] The hinge module (254) can rotate the first hinge plate (252) and the second hinge plate (253). For example, the hinge module (254) may include gears that are rotatably engaged with each other to rotate the first hinge plate (252) and the second hinge plate (253) about a folding axis (f). According to one embodiment, the hinge module (254) may be a plurality or may include a plurality of components. For example, a plurality of hinge modules (254) may each be spaced apart from each other at both ends of the first hinge plate (252) and the second hinge plate (253).

[0062] The first housing part (210) includes a first bracket (215) and a first cover (216), and the second housing part (220) may include a second bracket (227) and a second cover (228). The first bracket (215) and the first cover (216) may support components of the electronic device (101). The first bracket (215) may define the first housing part (210) by being combined with the first cover (216). The first cover (216) may define a portion of the outer surface of the first housing part (210). The second bracket (227) and the second cover (228) may support components of the electronic device (101). The second bracket (227) may define the second housing part (220) by being combined with the second cover (228). The second cover (228) may define a portion of the outer surface of the second housing part (220). For example, the display (230) may be placed on one side of the first bracket (215) and one side of the second bracket (227). The first cover (216) may be placed on the other side of the first bracket (215) opposite to one side of the first bracket (215). The second cover (228) may be placed on the other side of the second bracket (227) opposite to one side of the second bracket (227). The sub-display (235) may be placed between the second bracket (227) and the second cover (228).

[0063] A portion of the first bracket (215) may be surrounded by the first sides (213), and a portion of the second bracket (227) may be surrounded by the second sides (223). For example, the first bracket (215) may be formed integrally with the first sides (213), and the second bracket (227) may be formed integrally with the second sides (223). As another example, the first bracket (215) may be formed separately from the first sides (213), and the second bracket (227) may be formed separately from the second sides (223).

[0064] At least one electronic component (260) can implement various functions to be provided to a user. According to one embodiment, at least one electronic component (260) may include a first printed circuit board (261), a second printed circuit board (262), a flexible printed circuit board (263), a battery (264) (e.g., battery (189) of FIG. 1), and / or an antenna (265) (e.g., antenna module (197) of FIG. 1). The first printed circuit board (261) and the second printed circuit board (262) may each form electrical connections of components within the electronic device (101). For example, components for implementing the overall function of the electronic device (101) (e.g., processor (120) of FIG. 1) may be placed on the first printed circuit board (261), and at least one electronic component for implementing some function of the first printed circuit board (261) may be placed on the second printed circuit board (262). As another example, components for operating a sub-display (235) placed on the second rear surface (222) may be placed on the second printed circuit board (262).

[0065] The first printed circuit board (261) may be disposed within the first housing part (210). For example, the first printed circuit board (261) may be disposed on one side of the first bracket (215). According to one embodiment, the second printed circuit board (262) may be disposed within the second housing part (220). For example, the second printed circuit board (262) may be spaced apart from the first printed circuit board (261) and disposed on one side of the second bracket (227). A flexible printed circuit board (263) may connect the first printed circuit board (261) and the second printed circuit board (262). For example, the flexible printed circuit board (263) may extend from the first printed circuit board (261) to the second printed circuit board (262).

[0066] The battery (264) is a device for supplying power to at least one component of the electronic device (101) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (264) may be disposed substantially coplanar with the first printed circuit board (261) or the second printed circuit board (262).

[0067] The antenna (265) may be configured to receive power or a signal from outside the electronic device (101). According to one embodiment, the antenna (265) may be positioned between the first cover (216) and the battery (264). The antenna (265) may include, for example, a near field communication (NFC) antenna, an antenna module, and / or a magnetic secure transmission (MST) antenna. The antenna (265) may, for example, communicate near-field with an external device or wirelessly transmit and receive power required for charging.

[0068] FIG. 2d illustrates an unfolded state of an exemplary electronic device. FIG. 2e illustrates a folded state of an exemplary electronic device.

[0069] The electronic device (101) illustrated and described exemplarily in FIGS. 2d and 2e may include a housing (200) comprising a first housing part (210) and a second housing part (220) rotatable with respect to the first housing part (210), as in the electronic device (101) illustrated and described exemplarily in FIGS. 2a through 2c. The electronic device (101) illustrated and described exemplarily in FIGS. 2d and 2e may be referred to as a foldable electronic device in that it includes a display (230) comprising a third display portion (233) (foldable portion) deformable by a hinge structure (250) (or hinge assembly) configured to rotate the second housing part (220) with respect to the first housing part (210), as in the electronic device (101) illustrated and described exemplarily in FIGS. 2a through 2c. For example, as with FIGS. 2a through 2c, FIGS. 2d and 2e illustrate examples of foldable electronic devices, which means that they can be folded around a folding axis (f). For example, the folding axis (f) of the electronic device (101) illustrated and described in FIGS. 2d and 2e may be parallel to the x-axis as illustrated. Unlike the electronic device (101) illustrated and described in FIGS. 2a through 2c, the folding axis (f) of the electronic device (101) illustrated and described in FIGS. 2d and 2e may be parallel to the y-axis which is orthogonal to the x-axis. However, the electronic device (101) illustrated and described in FIGS. 2a through 2e is exemplary, and the electronic device (101) may have various foldable form factors (e.g., multi-foldable electronic device).Hereinafter, an electronic device (101) illustrated exemplarily in FIGS. 2d and FIGS. 2e is described with reference to the description of the components having the same reference numerals in FIGS. 2a to 2c.

[0070] The electronic device (101) may include a housing (200) comprising a first housing part (210) and a second housing part (220), and a hinge structure (or hinge assembly) (250). The first housing part (210) may be rotatably connected to the hinge structure (250). The first housing part (210) may rotate relative to the second housing part (220) through the hinge structure (250). The second housing part (220) may be rotatably connected to the hinge structure (250). The second housing part (220) may rotate relative to the first housing part (210) through the hinge structure (250).

[0071] The first housing part (210) may include a first front (211), a first rear (212) facing away from the first front (211), and first sides (213) covering at least a portion of the first front (211) and the first rear (212). The first housing part (210) may provide space for placing components of the electronic device (101). The first housing part (210) may include a conductive material, a non-conductive material, or a combination thereof.

[0072] The second housing part (220) may include a second front (221), a second rear (222) separated from and facing the second front (221), and second sides (223) covering at least a portion of the second front (221) and the second rear (222). The second housing part (220) may provide a space for placing components of the electronic device (101).

[0073] A hinge structure (250) may be connected to a first housing part (210) and a second housing part (220), respectively. For example, the hinge structure (250) may include a first hinge plate (e.g., the first hinge plate (252) of FIG. 2c) and a second hinge plate (e.g., the second hinge plate (253) of FIG. 2c), which are rotatably configured. The first hinge plate may be connected to the first housing part (210), and the first housing part (210) may be rotated by the first hinge plate. The second hinge plate may be connected to the second housing part (220), and the second housing part (220) may be rotated by the second hinge plate.

[0074] The electronic device (101) can be folded or unfolded along a folding axis (f) passing through a hinge structure (250) depending on the rotation of the first housing part (210) and the second housing part (220). To allow the electronic device (101) to be folded along the folding axis (f), the hinge structure (250) can be positioned between the first housing part (210) and the second housing part (220).

[0075] The hinge structure (250) may include a hinge cover (251) for concealing an internal structure that constitutes the mechanism of the hinge structure. The hinge cover (251) may be visually exposed to the outside or concealed by the first housing part (210) and the second housing part (220) depending on the degree to which the electronic device (101) is folded. For example, while the electronic device (101) is in a folded state (e.g., FIG. 2e), the hinge cover (251) may be at least partially exposed through the space between the first housing part (210) and the second housing part (220). For example, while the electronic device (101) is in an unfolded state (e.g., FIG. 2d), the hinge cover (251) may be concealed by the first housing part (210) and the second housing part (220).

[0076] The electronic device (101) may include a display (230) (e.g., the display module (160) of FIG. 1) disposed within the space provided by the first housing part (210) and the second housing part (220). For example, the display (230) may be at least partially accommodated within a recess formed in the first front (211) of the first housing part (210) and the second front (221) of the second housing part (220). The display (230) may include a first display portion (flat portion) (231) aligned with the first housing part (210), a second display portion (232) spaced apart from the first display portion (231) and aligned with the second housing part (220), and a third display portion (233) aligned with the hinge structure (250) and extending from the first display portion (231) to the second display portion (232). The display (230) may be referred to as a foldable display or a flexible display. A first display portion (231), a second display portion (232), and a third display portion (233) may form the surface of the display (230). The surface of the display (230) may at least partially form the first front surface (211) of the first housing part (210) and the second front surface (221) of the second housing part (220). The first display portion (231), the second display portion (232), and the third display portion (233) may each define a first display area, a second display area, and a third display area of ​​the display (230) where visual information can be displayed.

[0077] The electronic device (101) may include a sub-display (235) (e.g., the display module (160) of FIG. 1) disposed within the first housing part (210). The sub-display (235) may be visible through the second rear surface (222) of the first housing part (210).

[0078] The electronic device (101) may include a plurality of cameras (e.g., the camera module (180) of FIG. 1). For example, the electronic device (101) may include cameras (234, 236). The camera (234) may be positioned within the first housing part (210) so as to acquire an image through a portion of the first rear surface (212). The camera (236) may be positioned below the first display portion (231) of the display (230). The camera (236) may be aligned with an opening that penetrates at least partially the first display portion (231) and may acquire an image through said hole. The camera (236) may be positioned within the screen display area of ​​the display (230), but is not limited thereto.

[0079] The states of the electronic device (101) are described below. The electronic device (101) may include a plurality of states, including an unfolded state (e.g., FIG. 2a and FIG. 2d) and a folded state (e.g., FIG. 2b and FIG. 2e). The electronic device (101) may transform or change in the unfolded state and the folded state. Additionally, the electronic device (101) may include a plurality of intermediate states between the unfolded state and the folded state. Depending on the state of the electronic device (101), the angle between the first housing part (210) and the second housing part (220) may vary.

[0080] Referring to FIG. 2e, the unfolded state of the electronic device (101) may be referred to as the first housing part (210) and the second housing part (220) being in an unfolded state. For example, the unfolded state (e.g., FIG. 2d) may be a state capable of changing into a plurality of folded states. For example, the unfolded state may be a state in which the first housing part (210) and the second housing part (220) form a substantially flat plane as the housing (200) is unfolded (for example, since the first housing part (210) and the second housing part (220) may be arranged or placed on the same plane, the first display part (231), the second display part (232), and the third display part (233) form a substantially flat surface). For example, the unfolded state may be a state in which the deformable third display part (233) of the display (230) is in an unfolded state. For example, within the unfolded state of the electronic device (101), the first housing part (210) and the second housing part (220) may form a first angle (e.g., an angle between the first housing part (210) and the second housing part (220) around the folding axis (f)). The first angle may be approximately 180 degrees. The first display portion (231), the second display portion (232), and the third display portion (233) of the display (230) may form a single substantially flat surface. The direction in which the first front (211) (or the first display portion (231)) of the first housing part (210) faces (e.g., the +z direction) and the direction in which the second front (221) (or the second display portion (232)) of the second housing part (220) faces (e.g., the +z direction) may be substantially the same.

[0081] Referring to FIG. 2e, within the folded state of the electronic device (101), the first housing part (210) and the second housing part (220) can be folded to face each other by rotating about the folding axis (f). The first housing part (210) and the second housing part (220) can be stacked on top of each other to form a second angle smaller than the first angle (e.g., the angle between the first housing part (210) and the second housing part (220) centered on the folding axis (f)). For example, the second angle may be about 0 degrees. The third display part (233) of the display (230) can be bent to correspond to the second angle. The first front surface (211) of the first housing part (210) may face the second front surface (221) of the second housing part (220) or overlap with the second front surface (221). The first housing part (210) and the second housing part (220) may be in contact at least partially, but are not limited thereto. The direction in which the first front surface (211) of the first housing part (210) faces (e.g., +z direction) and the direction in which the second front surface (221) of the second housing part (220) faces (e.g., -z direction) may be opposite to each other. In the unfolded state, at least a portion of the display (230) may not be visible from outside the electronic device (101), and the sub-display (235) may be visible from outside the electronic device (101).

[0082] Although not illustrated, the electronic device (101) may be in a plurality of intermediate states between an unfolded state and a folded state. For example, the intermediate states may be states in which the second housing part (220) is tilted (e.g., angled, non-linear) with respect to the first housing part (210). For example, the intermediate states may be states in which the second front of the second housing part (220) (e.g., the second front (221) in FIG. 2a) is tilted with respect to the first front of the first housing part (210) (e.g., the first front (211) in FIG. 2a). The intermediate states may be states in which the first front (211) and the second front (221) face substantially different directions. For example, intermediate states may be states in which the first display portion (231) on the first housing part (210) of the display (230) faces a different direction from the second display portion (232) on the second housing part (220). For example, intermediate states may be states in which the third display portion (233) between the first display portion (231) and the second display portion (232) is at least partially bent. For example, intermediate states may include states in which the angle between the first housing part (210) and the second housing part (220) is located within a range of greater than 0 degrees and less than 180 degrees.

[0083] FIG. 3a illustrates a portion of an exemplary electronic device in a folded state. FIG. 3b illustrates a portion of an exemplary electronic device in an unfolded state. The electronic device of FIG. 3a and FIG. 3b may correspond to the electronic device (10) of FIG. 1, FIG. 2a-2c or FIG. 2d-2e.

[0084] Referring to FIG. 3a and FIG. 3b, the electronic device (101) may include a housing (200) comprising a first housing part (210) and a second housing part (220), a hinge structure (250), and an electronic component (301).

[0085] The first housing part (210) may include a first plate (310) (or a first thermal conductive plate (310)). The second housing part (220) may include a second plate (320) (or a second thermal conductive plate (320)).

[0086] For example, the first plate (310) may be part of the first housing part (210) that is coupled to the hinge structure (250). For example, the first plate (310) may be configured to rotate the first housing part (210) relative to the hinge structure (250) by being rotatably coupled to the hinge structure (250). For example, the first plate (310) may be provided as part of the first bracket (215) within the first housing part (210) for coupling to the hinge structure (250) or may be fastened to the first bracket (215), but the examples of the present disclosure are not limited thereto. For example, the first plate (310) may receive at least a portion of the heat emitted from the electronic component (301) within the first housing part (210). For example, the electronic component (301) may be one or more components.

[0087] For example, the second plate (320) may be part of a second housing part (220) that is coupled to a hinge structure (250). For example, the second plate (320) may be configured to rotate the second housing part (220) relative to the hinge structure (250) by being rotatably coupled to the hinge structure (250). For example, the second plate (320) may be provided as part of a second bracket (227) within the second housing part (220) to be coupled to the hinge structure (250) or may be fastened to said second bracket (227), but the examples of the present disclosure are not limited thereto.

[0088] The electronic component (301) may be placed within the housing (200). For example, the electronic component (301) may be placed within the first housing part (210) as illustrated. The electronic component (301) may be mounted on, for example, a printed circuit board (e.g., the first printed circuit board (261) of FIG. 2c) within the first housing part (210). For example, as the electronic device (101) operates, heat may be generated from the electronic component (301). At least some of the heat emitted from the electronic component (301) may be transferred to the first plate (310) of the first housing part (210). For example, the electronic component (301) may be referred to as a processor of the electronic device (101) (e.g., processor (120) of FIG. 1) and / or a battery (e.g., battery of FIG. 1 (battery (189) of FIG. 1, battery (264) of FIG. 2c)), but is not limited thereto. For example, the electronic component (301) may include a circuit with a relatively high heat generation amount (e.g., charging circuit, communication circuit).

[0089] It should be noted that although the electronic component (301) is depicted and described as being placed within the first housing part (210) of the housing (200), this is merely illustrative and is not intended to limit the placement of the electronic component (301) within the housing (200). For example, the electronic component (301) may be placed within the second housing part (220) of the housing (200).

[0090] The electronic device (101) may include a display (230) comprising a first display portion (e.g., the first display portion (231) of FIG. 2A) coupled to a first housing part (210), a second display portion (e.g., the second display portion (232) of FIG. 2A) coupled to a second housing part (220), and a third display portion (e.g., the third display portion (233) of FIG. 2A) extending from the first display portion (231) to the second display portion (232) and configured to be bent (or folded by the hinge structure (250)) within a folded state of the electronic device (101). For example, the first display portion (231) may be placed on a first bracket (215) of the first housing part (210). The second display portion (232) may be positioned on the second bracket (227) of the second housing part (220) and spaced apart from the first display portion (231). The third display portion (233) may be positioned on the hinge structure (250). The third display portion (233) may be configured to deform while the state of the electronic device (101) is changed. For example, the third display portion (233) may be at least partially deformed by the first housing part (210) and / or the second housing part (220) which are rotated by the hinge structure (250). For example, the third display portion (233) may be positioned on the first plate (310) of the first housing part (210) and the second plate (320) of the second housing part (220). The third display portion (233) can be at least partially deformed by the first plate (310) and / or the second plate (320).

[0091] The hinge structure (250) can rotatably connect the first housing part (210) and the second housing part (220). The hinge structure (250) can be configured to provide a plurality of states, including a folded state and an unfolded state of the electronic device (101), by rotatably connecting the first plate (310) and the second plate (320). The hinge structure (250) can also provide an intermediate state of the electronic device (101) (e.g., a partially folded state, between an unfolded state and a fully folded state) by rotatably connecting the first plate (310) and the second plate (320).

[0092] For example, the first plate (310) may be coupled to the hinge structure (250) so as to be rotatable with respect to the second plate (320) with respect to the folding axis (e.g., folding axis (f) in FIG. 2a). The second plate (320) may be coupled to the hinge structure (250) so as to be rotatable with respect to the first plate (310). For example, the first housing part (210) may be coupled to the hinge structure (250) so as to be rotatable with respect to the second housing part (220) through the first plate (310). The second housing part (220) may be coupled to the hinge structure (250) so as to be rotatable with respect to the first housing part (210) through the second plate (320). For example, the first plate (310) and the second plate (320) can face each other based on the hinge structure (250).

[0093] For example, the hinge structure (250) may include a first hinge plate (252) coupled to the first housing part (210) (e.g., coupled to the first plate (310) of the first housing part (210)), and a second hinge plate (253) coupled to the second housing part (220) (e.g., coupled to the second plate (320) of the second housing part (220). For example, the first hinge plate (252) may be coupled (or connected) to the first plate (310) so that the first plate (310) rotates according to the rotation of the first hinge plate (252). The second hinge plate (253) may be coupled (or connected) to the second plate (320) so that the second plate (320) rotates according to the rotation of the second hinge plate (253). In various embodiments, the first hinge plate (252) may be formed integrally with the first plate (310), and / or the second hinge plate (253) may be formed integrally with the second plate (320).

[0094] For example, the hinge structure (250) may include a hinge cover (251) to which a first hinge plate (252) and a second hinge plate (253) are rotatably coupled. The hinge cover (251) may provide a central axis (e.g., folding axis (f) in FIG. 2a) to which the first hinge plate (252) and the second hinge plate (253) rotate relative to each other (e.g., arranged to rotate around the central axis of the hinge cover (251) or rotatably coupled).

[0095] For example, the hinge structure (250) may include a first link (250a) (or a first hinge pin (250a) or a first pivot (250a)) connecting the first hinge plate (252) and the hinge cover (251), and a second link (250b) (or a second hinge pin (250b) or a second pivot (250b)) connecting the second hinge plate (253) and the hinge cover (251). The first link (250a) may provide a rotation axis so that the first hinge plate (252) can rotate about the hinge cover (251). The second link (250b) may provide a rotation axis so that the second hinge plate (253) can rotate about the hinge cover (251). The hinge cover (251) can rotatably connect the first hinge plate (252) and the second hinge plate (253) by providing the first link (250a) and the second link (250b). That is, the first hinge plate (252) can be arranged to rotate or pivot clockwise around the first 250a (providing a rotation axis), and the second hinge plate (253) can be configured to rotate or pivot counterclockwise around the second link (250b) (providing a rotation axis).

[0096] For example, the first plate (310) may be slidably coupled to the first hinge plate (252). The second plate (320) may be slidably coupled to the second hinge plate (253). For example, the hinge structure (250) may include a third link (250c) (or a first hinge rod (250c), or a first link portion (250c)) connecting the first plate (310) and the hinge cover (251), and a fourth link (250d) (or a second hinge rod (250d), or a second link portion (250d)) connecting the second plate (320) and the hinge cover (251). For example, while the first hinge plate (252) rotates against the hinge cover (251) through the first link (250a) (e.g., against the first link (250a)), the first plate (310) can slide against the first hinge plate (252) through the third link (250c). For example, while the second hinge plate (253) rotates against the hinge cover (251) through the second link (250b) (e.g., against the second link (250b)), the second plate (320) can slide against the second hinge plate (253) through the fourth link (250d). For example, the first plate (310) and the second plate (320) are each rotatably connected to the hinge cover (251) through the first hinge plate (252) and the second hinge plate (253), and are slidably connected.

[0097] For example, when referring sequentially to FIG. 3a and FIG. 3b, while the electronic device (101) is changing from a folded state to an unfolded state, the first plate (310) can be slid toward the second plate (320) relative to the first hinge plate (252). In other words, when the first housing part (210) and the second housing part (220) rotate about a central axis, the first plate (310) and the second plate (320) can rotate about the same axis (or an axis parallel to each other but offset laterally), and accordingly, at least a portion of the first plate (310) (e.g., the first surface (310a)) and the second plate (e.g., the second surface (320a)) move toward each other (or rotate and / or slide) as the rotation occurs. The second plate (320) can be slid toward the first plate (310) with respect to the second hinge plate (253) (e.g., according to movement or rotation). For example, while the electronic device (101) is changing from a folded state to an unfolded state, the first plate (310) can be moved toward the second plate (320) by sliding against the first hinge plate (252) (e.g., according to movement or rotation) via the third link (250c). The second plate (320) can be moved toward the first plate (310) by sliding against the second hinge plate (253) via the fourth link (250d). The plates (310, 320) can come into contact with each other within the unfolded state of the electronic device (101) by sliding against the hinge plates (252, 253), respectively.

[0098] The first plate (310) may be configured to be in contact with the second plate (320) within the unfolded state of the electronic device (101) so as to form a heat conduction path (p) between the first housing part (210) and the second housing part (220) for heat generated from the electronic component (301). For example, referring to FIG. 3a, the first plate (310) and the second plate (320) may be spaced apart from each other. Referring to FIG. 3b, the first plate (310) and the second plate (320) may be in contact by facing each other. For example, in the unfolded state of the electronic device (101), the first surface (310a) of the first plate (310) facing the second plate (320) may come into contact with the second surface (320b) of the second plate (320) facing the first plate (310). By the contact between the first surface (310a) and the second surface (320a), a heat conduction path (p) for heat generated from the electronic component (301) may be formed by the plates (310, 320). For example, the plates (310, 320) may be formed from a material with relatively high thermal conductivity (e.g., metal) to increase the thermal conductivity of the heat conduction path (p). The above plates (310, 320) may each be referred to as heat-conductive plates in that they are plates for the heat conduction path (p), but the embodiments supported by the present disclosure are not limited thereto.

[0099] For example, as illustrated, when an electronic component (301) is placed within a first housing part (210), heat generated from the electronic component (301) can be conducted to a first plate (310) of the first housing part (210). In the unfolded state of the electronic device (101), heat conducted from the electronic component (301) to the first plate (310) can be diffused into the second housing part (220) through a second plate (320) in contact with the first plate (310). By diffusing heat generated within the first housing part (210) into the second housing part (220) through the plates (310, 320), the electronic device (101) can improve heat dissipation performance for heat generated from the electronic component (301). However, the embodiments supported by this disclosure are not limited thereto.

[0100] When referring sequentially to FIG. 3a and FIG. 3b, since the plates (310, 320) are each slidably coupled to the hinge plates (252, 253), a contact failure between the plates (310, 320) may occur due to the sliding motion of each of the plates (310, 320) while the electronic device (101) is changing from a folded state to an unfolded state. For example, when referring to FIG. 3b, in the unfolded state, the first surface (310a) of the first plate (310) and the second surface (320a) of the second plate (320) may come into misaligned contact with each other. Due to poor contact between the plates (310, 320), the thermal conductivity of the heat conduction path (p) for heat generated from the electronic component (301) between the first housing part (210) and the second housing part (220) may be reduced. The electronic device (101) may be required to have a structure that guides the position of the plates (310, 320) for alignment contact of the plates (310, 320) within the unfolded state while changing from a folded state to an unfolded state. For example, a structure to facilitate alignment between the plates (310, 320) when the electronic device (101) is unfolded may be exemplified. Such a structure is described through exemplary illustrations in FIG. 4 and below.

[0101] FIG. 4 illustrates a part of an exemplary electronic device in an unfolded state.

[0102] Referring to FIG. 4, the electronic device (101) may include a housing (200) comprising a first housing part (210) (or the first housing (210)) and a second housing part (220) (or the second housing (220)), an electronic component disposed within the housing (200) (e.g., a processor (120) of FIG. 1, an electronic component (301) of FIG. 3a) (or at least one electronic component provided in one of the first housing part (210) and the second housing part (220), and a hinge structure (250) that rotatably connects the first housing part (210) and the second housing part (220). The first housing part (210) may include a first plate (310). The second housing part (220) may include a guide assembly (400) comprising a second plate (320) and an elastic member (410) (or an elastic part (410), or an elastically deformable member (410)). In various examples, the second plate (320) and the elastic member (410) may be included in the guide assembly (400) included in the second housing part (220). The first plate (310) may be configured to be in contact with the second plate (320) within the unfolded state of the electronic device (101) so that the first plate (310) and the second plate (320) form a heat conduction path (e.g., heat conduction path (p) in FIG. 3b) between the first housing part (210) and the second housing part (220) for heat generated from the electronic component (301). However, the embodiments supported by the present disclosure are not limited thereto, and the electronic device (101) illustrated and described exemplarily in FIG. 4 may include the structures and / or configurations of the electronic device (101) illustrated and described exemplarily in FIG. 2a to FIG. 3b. Additionally, redundant descriptions of structures and / or configurations having the same reference numerals as those described in FIG. 2a to FIG. 3b may be omitted below.For example, the description of the electronic device (101) in FIG. 4 may overlap with the description of the electronic device shown in FIG. 1, 2a-2c, 2d-2e, or 3a-3b, except for features provided to solve the technical problems related to the electronic device or hinge structure (250) described above in relation to FIG. 3a-3b.

[0103] The guide assembly (400) may be coupled to the second housing part (220). The guide assembly (400) may be configured to guide the position of the second plate (320) of the guide assembly (400) relative to the first plate (310) (e.g., when an electronic device moves in a folded state). For example, an elastic member (410) may be arranged to guide the position of the second plate (320) relative to the first plate (310). For example, the first plate (310) may be slidably coupled to the first hinge plate (252) of the hinge structure (250). The guide assembly (400) may be slidably coupled to the second hinge plate (253) of the hinge structure (250). The second plate (320) can be moved (shifted) to have a displacement with respect to the guide assembly (400) that slides with respect to the second hinge plate (253). For example, the second plate (320) can have a degree of freedom with respect to the guide assembly (400) within the guide assembly (400), and for example, the second plate (320) can move with respect to the guide assembly (400). The guide assembly (400) can guide the position of the second plate (320) with respect to the first plate (310) while the electronic device (101) changes from a folded state to an unfolded state by configuring the second plate (320) to have a degree of freedom with respect to the guide assembly (400). The structure of the guide assembly (400) is described by example.

[0104] The elastic member (410) of the guide assembly (400) can provide a force (e.g., repulsive force) toward the first plate (310) in response to a force applied from the second plate (320) to the first plate (310) within the unfolded state of the electronic device (101) so that the second plate (320) makes close contact with the first plate (310). For example, the elastic member (410) can press or push the second plate (320) toward the first plate (310) within the unfolded state of the electronic device (101). For example, the elastic member (410) can be configured to be elastically deformed by the second plate (320) within the guide assembly (400). The elastic member (410) can provide a repulsive force (e.g., elastic force, restoring force) to the second plate (320) against a force applied from the second plate (320). By means of the force (e.g., repulsive force), the second plate (320) can be pressed toward the first plate (310) within the unfolded state of the electronic device (101). For example, the elastic member (410) can be in contact with or coupled to the second plate (320) within the guide assembly (400). For example, the elastic member (410) can be in contact with or coupled to a surface opposite to the second surface (320a) configured to be in contact with the first plate (310) of the second plate (320) to press the second plate (320) toward the first plate (310). However, the embodiments of the present disclosure are not limited thereto.

[0105] For example, the elastic member (410) may provide an aligned contact (e.g., contact in which each surface is in contact with each other) between the first surface (310a) of the first plate (310) which slides toward the second plate (320) with respect to the first hinge plate (252) and the second surface (320a) of the second plate (320) of the guide assembly (400) which slides with respect to the second hinge plate (253) while the electronic device (101) changes from a folded state to an unfolded state. For example, while the electronic device (101) changes from a folded state to an unfolded state, the first plate (310) and the guide assembly (400) may each slide with respect to the hinge plates (252, 253). The second surface (320a) of the second plate (320) can come into contact with the first surface (310a) of the first plate (310) that slides with respect to the first hinge plate (252) by moving along the guide assembly (400) that slides with respect to the second hinge plate (253). Since the second plate (320) has a degree of freedom to be shiftable within the guide assembly (400), the second plate (320) can shift with respect to the guide assembly (400) by contact between the first surface (310a) and the second surface (320a) while the guide assembly (400) slides with respect to the second hinge plate (253). While the second plate (320) moves within the guide assembly (400) by contact of the surfaces (310a, 320a) of the plates (310, 320), the elastic member (410) can adjust the position of the second plate (320) so that the second surface (320a) of the second plate (320) comes into alignment contact with the first surface (310a) of the first plate (310) by pressing the second plate (320) toward the first plate (310).However, the embodiments of the present disclosure are not limited thereto. In various embodiments, the second plate (320) and the elastic member (410) may be considered to be included in the second housing part (220) without providing a guide assembly, in which case the second plate (320) may be considered to have a degree of freedom to move or move in the second housing part (220), and the second plate (320) may move relative to the second housing part (220) by contact between the first surface (310a) and the second surface (320a), and a part of the second housing part (220) may slide relative to the second hinge plate (253). Additionally, while the second plate (320) moves within the second housing portion (220) by contact with the surfaces (310a, 320a) of the plates (310, 320), the elastic member (410) can press the second plate (320) toward the first plate (310) while adjusting the position of the second plate (320) so that the second surface (320a) of the second plate (320) comes into alignment contact with the first surface (310a) of the first plate (310).

[0106] For example, the elastic member (410) may include a first elastic plate (411) (or first plate (411), first elastic portion (411)) in contact with a first end (325a) of the second plate (320), and a second elastic plate (412) (or second plate (412), second elastic portion (412)) in contact with a second end (325b) of the second plate (320) opposite to the first end (325a). For example, the first end (325a) of the second plate (320) may define a longitudinal end of a second surface (320a) of the second plate (320) in contact with the first plate (310). A second end (325b) opposite to the first end (325a) may define the other longitudinal end of the second surface (320a). The ends (325a, 325b) may each be referred to as the longitudinal end of the second plate (320), but embodiments of the present disclosure are not limited thereto. For example, in the unfolded state of the electronic device (101), the first elastic plate (411) may press the first end (325a) of the second plate (320) toward the first plate (310). The second elastic plate (412) may press the second end (325b) of the second plate (320) toward the first plate (310). Since the elastic plates (411, 412) each press the ends (325a, 325b) of the second plate (320) toward the first plate (310), the second plate (320) can be aligned and in contact with the first plate (310) within the unfolded state of the electronic device (101).

[0107] For example, while the electronic device (101) is changing from a folded state to an unfolded state, the first end (325a) of the second plate (320) may first come into contact with the first plate (310) before the second end (325b) comes into contact with the first plate (310) by the first elastic plate (411) (e.g., force provided by the first elastic plate (411)) (e.g., due to the first elastic plate (411) or as a result of the first elastic plate (411). Since the second plate (320) is shiftable with respect to the guide plate (420), after the first end (325a) contacts the first plate (310), the second end (325b) of the second plate (320) can be contacted by the second elastic plate (412) (e.g., force provided by the second elastic plate (412)) (e.g., due to the second elastic plate (412) or as a result of the second elastic plate (412). By having both ends (325a, 325b) of the second plate (320) contact the first plate (310), the second surface (320a) of the second plate (320) can be in alignment contact with the first surface (310a) of the first plate (310). For example, while the electronic device (101) is changing from a folded state to an unfolded state, the second end (325b) of the second plate (320) may come into contact with the first plate (310) before the first end (325a) by the second elastic plate (412) (e.g., force provided by the second elastic plate (412)) (e.g., due to the second elastic plate (412) or as a result of the second elastic plate (412).Since the second plate (320) is movable relative to the guide plate (420), after the second end (325b) contacts the first plate (310), the first end (325a) of the second plate (320) can be contacted by the first elastic plate (411) (e.g., force provided by the first elastic plate (411)) (e.g., due to the first elastic plate (411) or as a result of the first elastic plate (411). By having both ends (325a, 325b) of the second plate (320) contact the first plate (310), the second surface (320a) of the second plate (320) can be in alignment contact with the first surface (310a) of the first plate (310). However, embodiments of the present disclosure are not limited thereto, and the elastic member (410) may include various elastic structures configured to press the second plate (420) toward the first plate (310) for alignment contact of the plates (310, 320).

[0108] The guide assembly (400) may include a guide plate (420) to which a second plate (320) is movably coupled. For example, the guide plate (420) may provide a portion within the guide assembly (400) on which the second plate (320) is seated. The guide plate (420) may be slidably coupled to a second hinge plate (253). For example, the guide plate (420) may be coupled to the second plate (320) such that the second plate (320) is rotatable or translatable with respect to the guide plate (420). For example, the guide plate (420) may be coupled to an elastic member (410). By being coupled to the guide plate (420), the elastic member (410) may press the second plate (320) which is slidably coupled to the guide plate (420). However, the embodiments of the present disclosure are not limited thereto.

[0109] For example, the first housing part (210) may include a first bracket (215) that supports a first display portion (e.g., the first display portion (231) of FIG. 2A) of a display (e.g., the display (230) of FIG. 2A). The second housing part (220) may include a second bracket (227) that supports a second display portion (e.g., the second display portion (232) of FIG. 2A) of the display (230). For example, the first plate (310) may be fastened to the first bracket (215). For example, the guide plate (420) of the guide assembly (400) may be fastened to the second bracket (227). For example, the first plate (310) may include a first part (311) and a second part (312) coupled to the first bracket (215), and a third part (313) between the first part (311) and the second part (312). The third part (313) may be a part configured to contact the second plate (320). For example, the guide plate (420) may include a first fastening part (425a) and a second fastening part (425b) coupled to the second bracket (227) of the guide assembly (400), similar to the parts (311, 312) of the first plate (310). The second plate (320) may be a part configured to contact the first plate (310) of the guide assembly (400). However, embodiments of the present disclosure are not limited thereto.

[0110] For example, the second plate (320) may be placed together with the first plate (310) in the unfolded state of the electronic device (101) below the third display portion of the display (230) (e.g., the third display portion (233) of FIG. 2A). For example, the first display portion (231) may be placed on the first bracket (215). The second display portion (232) may be placed on the second bracket (227). The third display portion (233) may extend from the first display portion (231) to the second display portion (232). The third display portion (233) may be placed at least partially on the hinge structure (250). The third display portion (233) may be configured to be bent by the hinge structure (250) in the folded state of the electronic device (101). The first plate (310) and the second plate (320) of the guide assembly (400), which are respectively coupled to the hinge plates (252, 253) of the hinge structure (250), may be positioned below the third display portion (233) (DP: all or partly positioned). For example, the plates (310, 320) may overlap with the third portion (233) of the display (230) when viewed from above (e.g., when viewed from the +z direction), but embodiments of the present disclosure are not limited thereto.

[0111] The guide assembly (400) may include a fastening member (430) (or coupling member (430)) that connects the second plate (320) and / or the elastic member (410) to the guide plate (420). For example, the fastening member (430) may be in contact with the elastic member (410), the guide plate (420), and the second plate (320). For example, the fastening member (430) may include a first elastic plate (411) and a first fastening member (431) that is coupled to the guide plate (420) and positioned adjacent to the first end (325a) of the second plate (320). The fastening member (430) may include a second elastic plate (412) and a second fastening member (432) that is coupled to the guide plate (420) and positioned adjacent to the second end (325b) of the second plate (320). However, embodiments of the present disclosure are not limited thereto, and the guide assembly (400) may include various fastening structures for fastening the second plate (320) and / or the elastic member (410) to the guide plate (420) so that the second plate (320) and / or the elastic member (410) do not detach from the guide plate (420).

[0112] The area of ​​the first surface (310a) of the first plate (310) may correspond to the area of ​​the second surface (320a) of the second plate (320) such that the first surface (310a) of the first plate (310) and the second surface (320a) of the second plate (320) overlap within the unfolded state of the electronic device (101), for example. For example, the areas of the first surface (310a) of the first plate (310) and the second surface (320a) of the second plate (320) may be substantially the same (e.g., in terms of surface area). For example, the first surface (310a) of the first plate (310) may come into contact with the second surface (320a) of the second plate (320) so that they overlap each other within the unfolded state of the electronic device (101). The first surface (310a) and the second surface (320a) may face each other so as to be aligned and in contact within the unfolded state. However, embodiments of the present disclosure are not limited thereto.

[0113] The first plate (310) and the second plate (320) may have elasticity. For example, each of the plates (310, 320) may be formed at least partially from an elastic material (e.g., rubber). For example, the first surface (310a) of the first plate (310) may be compressed by pressure applied from the second surface (320a) of the second plate (320). The second surface (320a) may be compressed by pressure applied from the first surface (310a). By having each of the plates (310, 320) elasticity, the electronic device (101) can reduce damage to the plates (310, 320) caused by friction between the plates (310, 320) while the electronic device (101) changes from a folded state to an unfolded state.

[0114] The electronic device (101) may include at least one heat-conducting member for increasing the thermal conductivity of a heat conduction path (p) formed within the unfolded state of the electronic device (101) by the plates (310, 320). The at least one heat-conducting member may be attached to at least one of the first plate (310) and the guide assembly (400). For example, the electronic device (101) may include a first heat-conducting member (450) (or a first heat transfer area / part (450)) attached to the first plate (310) so as to be separated from the second plate (320). For example, the first heat-conducting member (450) may be attached to the upper surface (e.g., upper surface (313a) of FIG. 5a) of a third part (313) configured to be in contact with the second plate (320) among the parts (311, 312, 313) of the first plate (310). The first heat-conducting member (450) may be formed from, for example, graphite, but embodiments of the present disclosure are not limited thereto.

[0115] Through the exemplary illustration below in FIG. 5a, a structure for increasing the thermal conductivity between the first plate (310) and the second plate (320) and an exemplary guide assembly (400) for alignment contact between the first plate (310) and the second plate (320) are described.

[0116] FIG. 5a is a top plan view of a first plate of an exemplary electronic device. FIG. 5b is a bottom view of a first plate of an exemplary electronic device. FIG. 5c is an exploded perspective view of a guide assembly of an exemplary electronic device. FIG. 5d and FIG. 5e are perspective views of a first plate of an exemplary electronic device and a guide assembly in contact with each other. The electronic devices of FIG. 5a, 5b, 5c, 5d, and 5e may be the electronic devices of FIG. 4.

[0117] Referring to FIGS. 5A, 5B, 5C, 5D, and 5E, the electronic device (101) may include a housing (200) comprising a first housing part (210) comprising a first plate (310) and a second housing part (220) comprising a guide assembly (400) comprising a second plate (320) and an elastic member (410). The electronic device (101) may include an electronic component (e.g., a processor (120) of FIG. 1, an electronic component (301) of FIG. 3A) disposed within the housing (200). The electronic device (101) may include a hinge structure (250) that rotatably connects the first housing part (210) and the second housing part (220). The first plate (310) may be configured to be in contact with the second plate (320) within the unfolded state of the electronic device (101) so as to form a heat conduction path (e.g., heat conduction path (p) of FIG. 3b) between the first housing part (210) and the second housing part (220) for heat generated from the electronic component (301). The elastic member (410) may provide a repulsive force toward the second plate (320) against a force applied from the second plate (320) to the first plate (310) within the unfolded state of the electronic device (101) so that the second plate (320) is in close contact with the first plate (310). However, the embodiments supported by the present disclosure are not limited thereto, and the electronic device (101) exemplarily illustrated and described in FIGS. 5a through 5e may include the structures and / or configurations of the electronic device (101) exemplarily illustrated and described in FIGS. 2a through 4. Additionally, redundant descriptions of structures and / or configurations having the same reference numerals as those described in FIGS. 2a through 4 may be omitted below.

[0118] Referring to FIGS. 5A and FIGS. 5B, an exemplary first plate (310) is illustrated. A first portion (311) and a second portion (312) corresponding to the ends of the first plate (310) may each be joined to a first bracket (e.g., a first bracket (215) in FIG. 2C) of a first housing part (210) through a fastener (e.g., a fastener (550) in FIG. 5D). A third portion (313) may correspond to the center of the first plate (310). The third portion (313) or at least a part thereof may be configured to come into contact with a second plate (320) by protruding from the first portion (311) and the second portion (312). For example, in order to increase the thermal conductivity between the first plate (310) and the second plate (320), at least one thermal conductive member may be attached to the third portion (313) of the first plate (310) that is in contact with the second plate (320).

[0119] For example, the first heat conduction member (450) may be attached to the upper surface (313a) of the third part (313). For example, the second heat conduction member (510) (or at least one second heat conduction member (510)) may be attached to the lower surface (313b) of the third part (313) opposite to the upper surface (313a). For example, the second heat conduction member (510) may include a first heat conduction part (511) attached or partially disposed below the first part (311), a second heat conduction part (512) attached or partially disposed below the second part (312), and a third heat conduction part (513) disposed between the first heat conduction part (511) and the second heat conduction part (512) and attached or disposed to the lower surface (313b) of the third part (313). However, embodiments of the present disclosure are not limited thereto, and the electronic device (101) may include various heat-conducting members attached to the first plate (310).

[0120] The first plate (310) may include a first guide rail (314) that slidably connects the first plate (310) to the first hinge plate (252). For example, the first guide rail (314) may be formed on the lower surface (313b) of the third portion (313) of the first plate (310) configured to contact the second plate (320). Through the first guide rail (314), the first plate (310) may slide toward the second plate (320) while the electronic device (101) changes from a folded state to an unfolded state. However, embodiments of the present disclosure are not limited thereto. The first plate (310) can be rotated in conjunction with the hinge structure (250) by including parts (311, 312) that are connected to the first bracket (215) and a third part (313) that is slidably connected to the first hinge plate (252).

[0121] Referring to FIG. 5c, an exemplary guide assembly (400) is illustrated. Referring to FIG. 5d and FIG. 5e, an exemplary first plate (310) and a guide assembly (400) for forming a heat conduction path (p) within the unfolded state of the electronic device (101) are illustrated.

[0122] The second plate (320) may include a shaft (321) (or rod (321), protrusion (321), etc.) that is inserted into the shaft hole (421) (or hole (421), opening (421)) of the guide plate (420) and provides a first rotation axis (r1) of the second plate (320) with respect to the guide plate (420). For example, the shaft (321) may be formed at the ends (325a, 325b) of the second plate (320). The shaft (321) may include a first shaft (321a) protruding from the first end (325a) of the second plate (320), and a second shaft (321b) protruding from the second end (325b) of the second plate (320). For example, the directions in which the shafts (321a, 321b) protrude may be opposite to each other. However, the embodiments supported by the present disclosure are not limited thereto. For example, the shaft hole (421) may accommodate the shaft (321) of the second plate (320). The shaft hole (421) may include a first shaft hole (421a) for accommodating the first shaft (321a) and a second shaft hole (421b) for accommodating the second shaft (321b).

[0123] For example, shafts (321a, 321b) may be aligned in a straight line so as to be rotatably coupled to shaft holes (421a, 421b) to provide a first rotation axis (r1) to the second plate (320). For example, the second plate (320) may be coupled to the guide plate (420) via shafts (321) so as to be rotatable in a rotation direction (501) and a rotation direction (502) opposite to the rotation direction (501) with respect to the first rotation axis (r1) with respect to the guide plate (420).

[0124] The second plate (320) may include a protrusion (322) (or rod (322)) that is inserted into a guide hole (422) (or opening (422), hole (422), etc.) of the guide plate (420) and provides a second rotation axis (r2) of the second plate (320) with respect to the guide plate (420). For example, the protrusion (322) may be formed at the center of the second plate (320). The protrusion (322) may be located, for example, on the center of gravity of the second plate (320), but the embodiment is not limited thereto. For example, the guide hole (422) may be penetrated by the protrusion (322) of the second plate (320).

[0125] For example, the protrusion (322) may be rotatably coupled to the guide hole (422) to provide the second plate (320) with a second rotation axis (r2) that is different (e.g., vertical) from the first rotation axis (r1). For example, the second plate (320) may be coupled to the guide plate (420) through the protrusion (322) so as to be rotatable with respect to the guide plate (420) in a rotation direction (503) and a rotation direction (504) opposite to the rotation direction (503) with respect to the second rotation axis (r2).

[0126] The elastic member (410) may be coupled to the guide plate (420) to provide a translation axis (x) to the second plate (320) with respect to the guide plate (420) by pressing the second plate (320) or by applying force to the second plate (320). For example, the second plate (320) may be coupled to the guide plate (420) so as to be translational (or slideable, movable) with respect to the translation axis (x). For example, the size of the shaft hole (421) may be larger than the size of the shaft (321) accommodated within the shaft hole (421) to provide a translation axis (x). For example, the shaft hole (421) is formed so that the shaft (321) can move in the direction (521) and the direction (522) within the shaft hole (421). For example, the size of the guide hole (422) may be larger than the size of the protrusion (322) penetrating the guide hole (422) to provide a translation axis (x). For example, the guide hole (422) is formed so that the protrusion (322) can move in the direction (521) and the direction (522) within the guide hole (422). For example, since the second plate (320) is rotatable about the first rotation axis (r1) and the second rotation axis (r2) with respect to the guide plate (420), the second plate (320) may be movable (or slideable) in the direction (521) corresponding to the translation axis (x) and in the direction (522) opposite to said direction (521).

[0127] For example, while the electronic device (101) is changing from a folded state to an unfolded state, the second plate (320) may be rotated in a direction (503) with respect to the guide plate (420) with respect to the second rotation axis (r2). By rotating the second plate (320) in the direction (503), the first end (325a) of the second plate (320) may come into contact with the first plate (310) before the second end (425b) of the second plate (320). The second end (325b) may be translated (e.g., moved or moved) to come into contact with the first plate (310) by being pressed in a direction (521) parallel to the translation axis (x) by the second elastic plate (412) after the first end (325a) has come into contact with the first plate (310). For example, while the electronic device (101) is changing from a folded state to an unfolded state, the second plate (320) may be rotated in a direction (504) with respect to the guide plate (420) with respect to the second rotation axis (r2). By rotating the second plate (320) in the direction (504), the second end (325b) of the second plate (320) may come into contact with the first plate (310) before the first end (325a) of the second plate (320). The first end (325a) may be translated (e.g., moved or moved) to come into contact with the first plate (310) by being pressed in a direction (521) parallel to the translation axis (x) by the first elastic plate (411) after the second end (325b) has come into contact with the first plate (310). However, embodiments of the present disclosure are not limited thereto, and the elastic member (410) may be configured to bring the second plate (320) into close contact with the first plate (310) by providing a repulsive force against a force applied in the direction (522) from the second plate (320) while the electronic device (101) is changing from a folded state to an unfolded state.

[0128] The translation axis (x) provided by the elastic member (410), the first rotation axis (r1) provided by the shaft (321), and the second rotation axis (r2) provided by the protrusion (322) may be perpendicular to each other. However, embodiments of the present disclosure are not limited thereto. The guide assembly (400) is configured such that the second plate (320) has multiple degrees of freedom with respect to the guide plate (420), thereby allowing the position of the second plate (320) to be realigned or readjusted so that the first plate (310) is in alignment contact with the second plate (320) while the electronic device (101) is changing from a folded state to an unfolded state.

[0129] The electronic device (101) may include a fastener (550) (or attachment part (550), coupler (550)) for fastening the first plate (310) and the guide assembly (400). For example, the fastener (550) may include fasteners (551, 552) for fastening parts (311, 312) of the first plate (310) to the first bracket (215) of the first housing part (210). For example, the fastener (550) may include fasteners (553, 554) that penetrate fastening parts (425a, 425b) of the guide plate (420) to fasten the guide plate (420) to the second bracket (227) of the second housing part (220). For example, the fastener (550) may include fasteners (555, 556) that fasten the elastic member (410) to the guide plate (420). For example, one end of the first elastic plate (411) may be fastened to the guide plate (420) through the fastener (555). The other end of the first elastic plate (411) may be in contact with or coupled to the first end (325a) of the second plate (320) to provide elastic force to the second plate (320). For example, one end of the second elastic plate (412) may be fastened to the guide plate (420) through the fastener (556). The other end of the second elastic plate (412) may be in contact with or coupled to the second end (325b) of the second plate (320) to provide elastic force to the second plate (320). However, the embodiments of the present disclosure are not limited thereto.

[0130] The guide plate (420) of the guide assembly (400) may include a second guide rail that slidably connects the guide assembly (400) to the second hinge plate (253), similar to the first guide rail (314) of the first plate (310). For example, the fastening portions (425a, 425b) of the guide plate (420) may be fastened to the second bracket (227) through fasteners (553, 554). The guide plate (420) may rotate in conjunction with the hinge structure (250) by being slidably connected to the second hinge plate (253) through the second guide rail. However, embodiments of the present disclosure are not limited thereto.

[0131] A first surface (310a) and a second surface (320a) configured to come into contact with each other within the unfolded state of the electronic device (101) may have a shape to increase the contact area (e.g., each may have one). For example, referring to FIG. 5d, the first surface (310a) of the first plate (310) and the second surface (320a) of the second plate (320) may have a corresponding curved shape (or a zig-zag shape). For example, the first surface (310a) and the second surface (320a) may have a wavy or non-linear shape formed to interlock with each other, which provides smooth contact between the first surface (310a) and the second surface (320a). In various examples, the first surface of the first thermal conductive plate has a shape corresponding to the shape of the second surface of the second thermal conductive plate, and when the electronic device (101) is unfolded, the first surface area of ​​the first thermal conductive plate is partially surrounded by the second surface area of ​​the second thermal conductive plate. However, embodiments of the present disclosure are not limited thereto, and the first surface (310a) and the second surface (320a) may have various shapes to increase the contact area.

[0132] According to the above-described embodiment, the guide assembly (400) of the electronic device (101) includes a second plate (320) that is coupled to have a degree of freedom with respect to the guide plate (420), thereby guiding the position of the second plate (320) for forming a heat conduction path (p) while the electronic device (101) changes from a folded state to an unfolded state. The guide assembly (400) includes an elastic member (410) that presses the second plate (320), which is shiftable with respect to the guide plate (420), toward the first plate (310), thereby providing an alignment contact between the first plate (310) and the second plate (320) for forming the heat conduction path (p).

[0133] FIG. 6a is a side view of a first plate and a guide assembly of an exemplary electronic device. FIG. 6b illustrates a portion of a second heat-conducting member of an exemplary electronic device.

[0134] Referring to FIGS. 6a and 6b, the electronic device (101) may include a housing (200) comprising a first housing part (210) comprising a first plate (310) and a second housing part (220) comprising a guide assembly (400) comprising a second plate (320) and an elastic member (410). The electronic device (101) may include an electronic component (e.g., a processor (120) of FIG. 1, an electronic component (301) of FIG. 3a) disposed within the housing (200). The electronic device (101) may include a hinge structure (250) that rotatably connects the first housing part (210) and the second housing part (220). The first plate (310) may be configured to be in contact with the second plate (320) within the unfolded state of the electronic device (101) so as to form a heat conduction path (e.g., heat conduction path (p) of FIG. 3b) between the first housing part (210) and the second housing part (220) for heat generated from the electronic component (301). The elastic member (410) may provide a force (e.g., repulsive force) toward the first plate (310) against a force applied from the second plate (320) to the first plate (310) within the unfolded state of the electronic device (101) so that the second plate (320) is in close contact with the first plate (310). However, the embodiments of the present disclosure are not limited thereto, and the electronic device (101) illustrated and described exemplarily in FIGS. 6a and 6b may include the structures and / or configurations of the electronic device (101) illustrated and described exemplarily in FIGS. 2a through 5e. Additionally, redundant descriptions of structures and / or configurations having the same reference numerals as those described in FIGS. 2a through 5e may be omitted below.

[0135] The electronic device (101) may include a third heat-conducting member (600) interposed between a first plate (310) and a second plate (320) within the unfolded state of the electronic device (101). The third heat-conducting member (600) may include a first variable part (610) attached to a first surface (310a) of the first plate (310), and a second variable part (620) attached to a second surface (320a) of the second plate (320) and in direct contact with the first variable part (610) within the unfolded state of the electronic device (101). The first variable part (610) and the second variable part (620) may be configured to be compressed by each other to provide close contact between the first variable part (610) and the second variable part (620) within the unfolded state.

[0136] For example, the third heat-conducting member (600) may be formed from a deformable or elastic material (e.g., rubber). For example, the first variable part (610) may be attached to the first surface (310a) of the first plate (310) facing the second plate (320) within the unfolded state of the electronic device (101). The second variable part (620) may be attached to the second surface (320a) of the second plate (320) facing the first plate (310) within the unfolded state. The variable parts (610, 620) may be compressed by coming into contact with each other within the unfolded state (e.g., when a force is applied to cause compression in the unfolded state). The above variable parts (610, 620) are configured to be compressed within the unfolded state, thereby reducing damage to the plates (310, 320) caused by friction between the plates (310, 320). For example, the fourth surface (620a) of the second variable part (620) may be configured to be in alignment contact with the third surface (610a) of the first variable part (610) by means of the elastic member (410) of the guide assembly (400). However, embodiments of the present disclosure are not limited thereto.

[0137] The third heat-conducting member (600) may include a metal material (630). The metal material (630) may form at least a portion of the third surface (610a) of the first variable part (610) and at least a portion of the fourth surface (620a) of the second variable part (620) configured to be in direct contact with the third surface (610a) of the first variable part (610) within the unfolded state of the electronic device (101).

[0138] For example, referring to FIG. 6a, the third surface (610a) of the first variable part (610) may include a metal material (630) that forms a pattern (p1) having a diagonal shape. The fourth surface (620a) of the second variable part (620), configured to be in contact with the third surface (610a), may include a metal material (630) that forms the pattern (p1) substantially identically to the third surface (610a). For example, referring to FIG. 6b, the third surface (610a) of the first variable part (610) may include a metal material (630) that forms a pattern (p2) having a circular shape. The fourth surface (620a) of the second variable part (620) configured to be in contact with the third surface (610a) may include a metal material (630) forming the pattern (p2) substantially identical to the third surface (610a). For example, the metal material (630) forming at least a portion of the third surface (610a) may be formed to be in contact with the metal material (630) forming at least a portion of the fourth surface (620a). However, embodiments of the present disclosure are not limited thereto. The third heat-conducting member (600) may improve the thermal conductivity of the heat-conducting path (p) formed by the plates (310, 320) within the unfolded state of the electronic device (101) by including the metal material (630) within the deformable variable parts (610, 620). In various examples, the metallic material (630) is generally a material with improved thermal conductivity compared to the deformable or elastic material forming the other part of the third heat-conducting member (600).

[0139] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which this disclosure belongs.

[0140] According to the above description, a foldable electronic device (e.g., the electronic device (101) of FIG. 1) may include a housing comprising a first housing part including a first thermal conductive plate and a second housing part including a second thermal conductive plate and an elastic member, an electronic component disposed within the housing, and a hinge assembly rotatably connecting the first housing part and the second housing part. The first thermal conductive plate may be configured to contact the second thermal conductive plate in the unfolded state of the foldable electronic device so that the first thermal conductive plate and the second thermal conductive plate form a thermal conduction path between the first housing part and the second housing part for heat generated from the electronic component. The elastic member may be configured to provide force to the second thermal conductive plate toward the first thermal conductive plate in the unfolded state of the foldable electronic device so that the second thermal conductive plate applies force toward the first thermal conductive plate.

[0141] According to the above description, a foldable electronic device (e.g., electronic device (101) of FIG. 1) comprises: a housing (e.g., housing (200) of FIG. 2a) comprising a first housing part (e.g., first housing part (210) of FIG. 2a) including a first thermal conductive plate (e.g., first plate (310) of FIG. 3a), and a second housing part (e.g., second housing part (220) of FIG. 2a) including a guide assembly (e.g., guide assembly (400) of FIG. 4) including a second thermal conductive plate (e.g., second plate (320) of FIG. 3a) and an elastic member (e.g., elastic member (410) of FIG. 4); an electronic component disposed within the housing (e.g., processor (120) of FIG. 1, electronic component (301) of FIG. 3a); and a hinge assembly (e.g., hinge of FIG. 2b) that rotatably connects the first housing part and the second housing part. It may include a structure (250). The first thermal conductive plate may be configured to be in contact with the second thermal conductive plate in the unfolded state of the foldable electronic device so that the first thermal conductive plate and the second thermal conductive plate form a heat conduction path (e.g., heat conduction path (p) in FIG. 3b) between the first housing part and the second housing part for heat generated from the electronic component. The elastic member may provide a repulsive force toward the second thermal conductive plate against a force applied from the second thermal conductive plate to the first thermal conductive plate in the unfolded state of the foldable electronic device so that the second thermal conductive plate is in close contact with the first thermal conductive plate.

[0142] For example, the hinge assembly may include a first hinge plate (e.g., the first hinge plate (252) of FIG. 2c) to which the first thermally conductive plate is slidably coupled, and a second hinge plate (e.g., the second hinge plate (253) of FIG. 2c) to which the second thermally conductive plate is slidably coupled. The elastic member may provide an aligned contact between a first surface of the first thermally conductive plate (e.g., the first surface (310a) of FIG. 3a) that slides toward the second thermally conductive plate with respect to the first hinge plate and a second surface of the second thermally conductive plate (e.g., the second surface (310b) of FIG. 3a) that slides toward the first thermally conductive plate with respect to the second hinge plate while the foldable electronic device changes from a folded state to an unfolded state.

[0143] For example, the area of ​​the first surface of the first thermal conductive plate may correspond to the area of ​​the second surface of the second thermal conductive plate such that the first surface of the first thermal conductive plate and the second surface of the second thermal conductive plate overlap within the unfolded state of the foldable electronic device.

[0144] For example, the guide assembly may further include a guide plate (e.g., guide plate (420) of FIG. 4) to which the second thermal conductive plate is movably coupled. The elastic member may be coupled to the guide plate to provide a translational axis (e.g., translational axis (x) of FIG. 5c) to the second thermal conductive plate with respect to the guide plate by pressing the second thermal conductive plate.

[0145] For example, the second thermal conductive plate may include a shaft (e.g., shaft (321) in FIG. 5c) that is inserted into the shaft hole (e.g., shaft hole (421) in FIG. 5c) of the guide plate and provides a first rotation axis (e.g., first rotation axis (r1) in FIG. 5c) of the second thermal conductive plate with respect to the guide plate.

[0146] For example, the second thermal conductive plate may further include a protrusion (e.g., the protrusion (422) in FIG. 5c) that is inserted into the guide hole (e.g., the guide hole (422) in FIG. 5c) of the guide plate and provides a second rotation axis (e.g., the second rotation axis (r2) in FIG. 5c) different from the first rotation axis with respect to the guide plate.

[0147] For example, the translation axis, the first rotation axis, and the second rotation axis may be perpendicular to each other.

[0148] For example, the elastic member may include a first elastic plate (e.g., the first elastic plate (411) of FIG. 4) in contact with one longitudinal end of the second thermal conductive plate (e.g., the first end (325a) of FIG. 4), and a second elastic plate (e.g., the second elastic plate (412) of FIG. 4) in contact with the other longitudinal end of the second thermal conductive plate (e.g., the second end (325b) of FIG. 4).

[0149] For example, the foldable electronic device may further include a thermal conductive member attached to at least one of the first thermal conductive plate and the guide assembly.

[0150] For example, the heat conductive member may include a first heat conductive member (e.g., the first heat conductive member (450) of FIG. 4) formed from graphite, which is attached to the first heat conductive plate so as to be separated from the second heat conductive plate.

[0151] For example, the thermal conductive member may include a second thermal conductive member (e.g., a third thermal conductive member (600) of FIG. 6a) interposed between the first thermal conductive plate and the second thermal conductive plate within the unfolded state of the foldable electronic device. The second thermal conductive member may include a first variable part (e.g., a first variable part (610) of FIG. 6a) attached to a first surface of the first thermal conductive plate, and a second variable part (e.g., a second variable part (620) of FIG. 6a) attached to a second surface of the second thermal conductive plate and in direct contact with the first surface within the unfolded state of the foldable electronic device. The first variable part and the second variable part may be configured to be compressed by each other to provide close contact between the first variable part and the second variable part within the unfolded state of the foldable electronic device.

[0152] For example, the second heat-conducting member may include a metallic material (e.g., the metallic material (630) of FIG. 6a). The metallic material may form at least a portion of the third surface of the first variable part (e.g., the third surface (610a) of FIG. 6a) and at least a portion of the fourth surface of the second variable part (e.g., the fourth surface (620a) of FIG. 6a) configured to be in direct contact with the third surface of the first variable part within the unfolded state of the foldable electronic device.

[0153] For example, the foldable electronic device may further include a flexible display comprising a first display portion (e.g., the first display portion (231) of FIG. 2A) coupled to the first housing part, a second display portion (e.g., the second display portion (232) of FIG. 2A) coupled to the second housing part, and a third display portion (e.g., the third display portion (233) of FIG. 2A) extending from the first display portion to the second display portion and configured to be bent by the hinge assembly within the folded state of the foldable electronic device.

[0154] For example, the first housing part may further include a first bracket (e.g., the first bracket (215) of FIG. 2c) that supports the first display part and is coupled to the first thermal conductive plate. The second housing part may further include a second bracket (e.g., the second bracket (227) of FIG. 2c) that supports the second display part and is coupled to the guide assembly. The second thermal conductive plate may be movable with respect to the second bracket and may be positioned below the third display part together with the first thermal conductive plate within the unfolded state of the foldable electronic device.

[0155] For example, the first thermal conductive plate and the second thermal conductive plate may have elasticity.

[0156] A foldable electronic device according to the above description may include a housing comprising a first housing part including a first thermal conductive plate and a second housing part, a guide assembly comprising a guide plate coupled to the second housing part, a second thermal conductive plate movably coupled to the guide plate, and an elastic member coupled to the guide plate to contact the second thermal conductive plate, an electronic component disposed within the housing, and a hinge assembly rotatably coupling the first housing part and the second housing part. The first thermal conductive plate may be configured to contact the second thermal conductive plate within the unfolded state of the foldable electronic device so that the first thermal conductive plate and the second thermal conductive plate form a thermal conduction path between the first housing part and the second housing part for heat generated from the electronic component. The elastic member can provide a repulsive force toward the second thermal conductive plate against a force applied from the second thermal conductive plate to the first thermal conductive plate within the unfolded state of the foldable electronic device so that the second thermal conductive plate comes into close contact with the first thermal conductive plate.

[0157] For example, the hinge assembly may include a first hinge plate to which the first thermally conductive plate is slidably coupled, and a second hinge plate to which the second thermally conductive plate is slidably coupled. The elastic member may provide an alignment contact between a first surface of the first thermally conductive plate that slides toward the second thermally conductive plate with respect to the first hinge plate and a second surface of the second thermally conductive plate that slides toward the first thermally conductive plate with respect to the second hinge plate while the foldable electronic device changes from a folded state to an unfolded state.

[0158] For example, the elastic member may provide a translational axis to the second thermal conductive plate with respect to the guide plate by pressing the second thermal conductive plate. The second thermal conductive plate may include a shaft inserted into a shaft hole of the guide plate and providing a first rotational axis of the second thermal conductive plate with respect to the guide plate; and a protrusion inserted into a guide hole of the guide plate and providing a second rotational axis different from the first rotational axis with respect to the guide plate.

[0159] For example, the translation axis, the first rotation axis, and the second rotation axis may be perpendicular to each other.

[0160] For example, the foldable electronic device may further include a thermal conductive member attached to at least one of the first thermal conductive plate and the guide assembly.

[0161] According to a first embodiment of the present disclosure, a foldable electronic device is provided, wherein the foldable electronic device comprises: a housing comprising a first housing part including a first thermally conductive plate; a second housing part including a second thermally conductive plate and an elastic member; an electronic component disposed in the housing; and a hinge assembly rotatably connecting the first housing part and the second housing part, wherein the first thermally conductive plate is configured to contact the second thermally conductive plate in an unfolded state of the foldable electronic device, so that the first and second conductive plates form a thermal conduction path between the first and second housing parts for heat generated from the electronic component, and the elastic member is configured to provide a force toward the first thermally conductive plate to the second thermally conductive plate so that the second thermally conductive plate is pressed toward the first thermally conductive plate and / or aligned toward the first thermally conductive plate in an unfolded state of the foldable electronic device.

[0162] According to a second embodiment, a foldable electronic device of the first embodiment is provided, wherein the second thermal conductive plate and the elastic member are included in a guide assembly included in the second housing part; the hinge assembly includes: a first hinge plate to which the first thermal conductive plate is slidably coupled; and a second hinge plate to which the guide assembly is slidably coupled, and while the foldable electronic device changes from a folded state to an unfolded state, the elastic member aligns a first surface of the first thermal conductive plate sliding against the first hinge plate toward the second thermal conductive plate, and aligns a second surface of the second thermal conductive plate of the guide assembly sliding against the second hinge plate toward the first thermal conductive plate.

[0163] According to a third embodiment, a foldable electronic device of the second embodiment is provided, wherein the area of ​​the first surface of the first thermal conductive plate corresponds to the area of ​​the second surface of the second thermal conductive plate, so that in the unfolded state of the foldable electronic device, the first surface of the first thermal conductive plate overlaps with the second surface of the second thermal conductive plate.

[0164] According to the fourth embodiment, a foldable electronic device of the second embodiment or the third embodiment is provided, wherein the first surface of the first thermal conductive plate has a shape corresponding to the shape of the second surface of the second thermal conductive member, so that in the unfolded state of the foldable electronic device, the area of ​​the first surface of the first thermal conductive plate is partially surrounded by the area of ​​the second surface of the second thermal conductive plate.

[0165] According to a fifth embodiment, a foldable electronic device of the first embodiment is provided, wherein the second thermal conductive plate and the elastic member are included in a guide assembly included in the second housing part; the guide assembly further includes a guide plate to which the second thermal conductive plate is movably coupled, and the elastic member is coupled to the guide plate such that the second thermal conductive plate provides a translational axis movable with respect to the guide plate by providing the force to the second thermal conductive plate.

[0166] According to the sixth embodiment, the foldable electronic device of the fifth embodiment is provided, wherein the second thermal conductive plate is inserted into a shaft hole of the guide plate and includes a shaft configured to provide a first rotation axis of the second thermal conductive plate relative to the guide plate.

[0167] According to the seventh embodiment, the foldable electronic device of the sixth embodiment is provided, wherein the second thermal conductive plate is inserted into a guide hole of the guide plate and further comprises a protrusion configured to provide a second rotation axis different from the first rotation axis of the second thermal conductive plate with respect to the guide plate.

[0168] According to the eighth embodiment, the foldable electronic device of the seventh embodiment is provided, wherein the first rotation axis, the second rotation axis, and the translation axis are perpendicular to each other.

[0169] According to the ninth embodiment, a foldable electronic device of any one of the first to eighth embodiments is provided, wherein the elastic member comprises: a first elastic plate in contact with a first longitudinal end of the second thermal conductive plate; and a second elastic plate in contact with a second longitudinal end of the second thermal conductive plate.

[0170] According to the 10th embodiment, any one of the first to ninth embodiments is provided, and further comprises a thermal conductive member attached to at least one of the first thermal conductive plate and the guide assembly.

[0171] According to the 11th embodiment, a foldable electronic device of the 10th embodiment is provided, wherein the thermal conductive member comprises a first thermal conductive member formed of graphite, which is separated from the second thermal conductive plate and attached to the first thermal conductive plate.

[0172] According to the 12th embodiment, a foldable electronic device of the 10th embodiment or the 11th embodiment is provided, wherein the thermal conductive member comprises a second thermal conductive member configured to be interposed between the first thermal conductive plate and the second thermal conductive plate in the unfolded state of the foldable electronic device, and the second thermal conductive member comprises: a first deformable portion attached to the first thermal conductive plate; and a second deformable portion attached to the second thermal conductive plate and configured to be in direct contact with the first deformable portion in the unfolded state of the foldable electronic device, and wherein the first and second deformable portions are configured to be compressed by each other in the unfolded state of the foldable electronic device.

[0173] According to the 13th embodiment, a foldable electronic device of the 12th embodiment is provided, wherein the second thermal conductive member comprises a metal material, and the metal material is configured to form at least a portion of the surface of the first deformable portion and at least a portion of the surface of the second deformable portion configured to be in direct contact with the surface of the first deformable portion in the unfolded state of the foldable electronic device.

[0174] According to the 14th embodiment, any one of the first to 13 embodiments is provided, and further comprises a flexible display including a first display portion coupled to the first housing part, a second display portion coupled to the second housing part, and a third display portion extending from the first display portion to the second display portion and configured to be bent by the hinge assembly in the folded state of the foldable electronic device, wherein the first housing part supports the first display portion of the flexible display and further comprises a first bracket coupled to the first thermal conductive plate, and the second housing part supports the second display portion of the flexible display and further comprises a second bracket coupled to the second thermal conductive plate, wherein the second thermal conductive plate is movable relative to the second bracket and is disposed below the third display portion together with the first thermal conductive plate in the unfolded state of the foldable electronic device.

[0175] According to the 15th embodiment, a foldable electronic device of any one of the 1st to 14th embodiments is provided, and the first and second thermally conductive plates have elasticity.

[0176] In this specification, the terms 'thermal conductive plate' and 'thermal conductive member' are used, but it will be understood that these terms may be replaced with 'thermal conductive plate' and 'thermal conductive member,' respectively. Additionally, the term 'thermal conductive plate' may be replaced with thermal conductive plate, thermal conductive plate, etc.

[0177] In various embodiments, the electronic device may provide a device having three housing parts capable of forming a stack when fully folded, comprising a third housing part rotatably coupled to one of the first housing part or the second housing part by another hinge assembly (e.g., when the first housing part and the second housing part are folded together and the third housing part and one of the first and second housing parts are folded together). Such an electronic device may have a Z-shape or a G-shape depending on the shape of the device when fully folded. In such an electronic device, the other hinge assembly may conform to any one of the hinge assembly embodiments / examples described herein.

[0178] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs.

[0179] The electronic devices according to the various embodiments disclosed in this document may be of various forms. The electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or consumer electronics. The electronic devices according to the embodiments of this document are not limited to the devices described above.

[0180] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0181] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0182] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0183] According to one embodiment, the method according to the various embodiments disclosed herein may be provided as included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0184] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In a foldable electronic device, A housing comprising a first housing part including a first thermal conductive plate, and a second housing part including a second thermal conductive plate and an elastic member; Electronic components disposed within the above housing; and It includes a hinge assembly that rotatably connects the first housing part and the second housing part, and The above-mentioned first thermal conductive plate is, The first thermal conductive plate and the second thermal conductive plate are configured to come into contact with the second thermal conductive plate within the unfolded state of the foldable electronic device to form a thermal conduction path (p) between the first housing part and the second housing part for heat generated from the electronic component, and The above elastic member is, Configured to provide force to the second thermal conductive plate toward the first thermal conductive plate within the unfolded state of the foldable electronic device so that the second thermal conductive plate applies force toward the first thermal conductive plate, Foldable electronic device.

2. In Paragraph 1, The second thermal conductive plate and the elastic member are included in the guide assembly of the second housing part, and The above hinge assembly is, A first hinge plate to which the first thermally conductive plate is slidably coupled; and The above guide assembly includes a second hinge plate to which it is slidably coupled, and The above elastic member is, Aligning the first surface (a) of the first thermal conductive plate that slides toward the second thermal conductive plate with respect to the first hinge plate and the second surface (a) of the second thermal conductive plate of the guide assembly that slides toward the first thermal conductive plate with respect to the second hinge plate while the foldable electronic device changes from a folded state to an unfolded state. Foldable electronic device.

3. In Paragraph 2, The area of ​​the first surface (a) of the first thermal conductive plate is, A portion corresponding to the area of ​​the second surface (a) of the second thermal conductive plate such that the first surface (a) of the first thermal conductive plate and the second surface (a) of the second thermal conductive plate overlap within the unfolded state of the foldable electronic device. Foldable electronic device.

4. In Paragraph 2 or 3, The first surface of the first thermal conductive plate has a shape corresponding to the shape of the second surface of the second thermal conductive plate such that, in the unfolded state of the foldable electronic device, the area of ​​the first surface of the first thermal conductive plate is partially surrounded by the area of ​​the second surface of the second thermal conductive plate. Foldable electronic device.

5. In Paragraph 1, The second thermal conductive plate and the elastic member are included in the guide assembly of the second housing part, and The above guide assembly is, The above-mentioned second thermal conductive plate further includes a guide plate to which it is movably coupled, and The above elastic member is, A guide plate coupled to provide a translational axis (x) that can move relative to the guide plate by providing force to the second thermal conductive plate. Foldable electronic device.

6. In Paragraph 5, The above second thermal conductive plate is, A shaft comprising a shaft inserted into the shaft hole of the guide plate and configured to provide a first rotational axis (r1) of the second thermal conductive plate with respect to the guide plate. Foldable electronic device.

7. In Paragraph 6, The above second thermal conductive plate is, A projection further comprising a second rotation axis (r2) that is inserted into a guide hole of the guide plate and configured to provide a second rotation axis (r2) different from the first rotation axis (r1) of the second thermal conductive plate with respect to the guide plate. Foldable electronic device.

8. In Paragraph 7, The translation axis (x), the first rotation axis (r1), and the second rotation axis (r2) are perpendicular to each other. Foldable electronic device.

9. In any of the preceding paragraphs, The above elastic member is, A first elastic plate in contact with the first longitudinal end (a) of the second thermal conductive plate; and A second elastic plate comprising a second elastic plate in contact with the second longitudinal end (b) of the second thermal conductive plate, Foldable electronic device.

10. In any of the preceding paragraphs, A heat-conducting member further comprising at least one of the first heat-conducting plate and the guide assembly, Foldable electronic device.

11. In Paragraph 10, The above heat conduction member is, A first thermal conductive member formed from graphite, attached to the first thermal conductive plate so as to be separated from the second thermal conductive plate, Foldable electronic device.

12. In Paragraph 10 or 11, The above thermal conductive member includes a second thermal conductive member interposed between the first thermal conductive plate and the second thermal conductive plate within the unfolded state of the foldable electronic device, and The above second heat conduction member is, A first variable part attached to the first thermal conductive plate; and It includes a second variable part attached to the second thermal conductive plate and in direct contact with the first variable part within the unfolded state of the foldable electronic device, The first variable part and the second variable part above are Configured to be compressed by each other within the unfolded state of the above-mentioned foldable electronic device, Foldable electronic device.

13. In Paragraph 12, The above second heat conduction member is, Includes metallic material, The above metal material is, At least a portion of the surface (a) of the first variable part and at least a portion of the surface (a) of the second variable part configured to be in direct contact with the surface (a) of the first variable part within the unfolded state of the foldable electronic device, Foldable electronic device.

14. In any of the preceding paragraphs, A flexible display further comprising a first display portion coupled to the first housing part, a second display portion coupled to the second housing part, and a third display portion extending from the first display portion to the second display portion and configured to be bent by the hinge assembly within the folded state of the foldable electronic device. The above-mentioned first housing part is, It further includes a first bracket that supports the first display portion and is coupled to the first thermal conductive plate, The above second housing part is, It further includes a second bracket that supports the second display portion and is coupled to the second thermal conductive plate, The above second thermal conductive plate is, A device that is movable with respect to the second bracket and is disposed below the third display portion together with the first thermally conductive plate within the unfolded state of the foldable electronic device. Foldable electronic device.

15. In Paragraph 1, The first thermal conductive plate and the second thermal conductive plate are, elastic, Foldable electronic device.

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