Composite gold layer, structural member and electronic device

Abstract

Provided in the embodiments of the present application are a composite gold layer, a structural member and an electronic device. The composite gold layer comprises a metal base layer, a bottom imitation-gold layer, a composite stacked layer and a surface gold layer, which are sequentially arranged on a surface of a substrate, wherein the composite stacked layer comprises at least three film layers stacked on the bottom imitation-gold layer; the at least three film layers comprise at least two of an intermediate pure-gold layer, an intermediate imitation-gold layer and an intermediate mixed-gold layer; and any two adjacent film layers in the composite stacked layer are of different types. The composite gold layer has a specific multi-layer composite structure, and has high hardness while retaining the appearance of gold, thereby obtaining good wear resistance so as to solve, to a certain extent, the problem of existing gold layers being easily worn.

Description

Composite gold layer, structural member and electronic device

[0001] The present application claims priority to the Chinese patent application No. 202411324564.0, filed on September 23, 2024, and entitled "Composite gold layer, structural member and electronic device", the whole content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] Embodiments of the present application relate to the technical field of metal plating, in particular to a composite gold layer, a structural member and an electronic device. BACKGROUND

[0003] Gold is extremely soft in texture, and is prone to wear and tear during use. In order to improve the wear resistance of the gold film layer, the industry usually adopts doping or special plating process to achieve it. Among them, doping is based on the solid solution strengthening mechanism, and some other elements are doped into gold to prepare 18K gold. By doping, the hardness of gold can be improved to about 200HV, but this hardness is still too low, and wear and tear problems are inevitable. And the special plating process includes electroforming hard gold and PVD (Physical Vapor Deposition) gold plating layer, etc. The electroforming hard gold prepares a primer layer on the surface of the substrate, and then prepares a gold layer by electroforming process. The electroforming process optimizes the microstructure of the gold layer to achieve hardening of the gold layer (hardness of 100HV for pure gold, and hardness of 300HV for 18K gold). The PVD gold plating layer is prepared by a physical vapor deposition process. First, a gold-like layer is prepared to achieve the basic hardness of the film layer, and then a gold layer is prepared on the surface of the gold-like layer. The hardness of the PVD gold plating layer is still very low (<300HV). It can be seen that the hardness of the gold layer prepared by the existing processes is still low, and the wear and tear problem of the gold layer during use cannot be effectively solved. SUMMARY

[0004] In view of this, embodiments of the present application provide a composite gold layer, a structural member and an electronic device. The composite gold layer has a specific multi-layer composite structure, which retains the appearance effect of gold while having high hardness, thereby obtaining good wear resistance to a certain extent to solve the problem of easy wear of the existing gold layer.

[0005] In a first aspect, embodiments of the present application provide a composite gold layer, comprising:

[0006] a metal primer layer disposed on a substrate;

[0007] a bottom gold-like layer disposed on the metal primer layer;

[0008] The composite layer stack includes at least three film layers stacked on the bottom gold-imitating layer, the at least three film layers including at least two types of intermediate pure gold layers, intermediate gold-imitating layers and intermediate mixed gold layers, and any two adjacent film layers in the composite layer stack being different types of film layers.

[0009] The surface gold layer is arranged on the composite layer stack.

[0010] The composite gold layer provided by the embodiments has a specific multi-layer composite structure. The metal primer layer can improve the bonding force of the composite gold layer on the substrate surface. The bottom gold-imitating layer and the composite layer stack formed on the metal primer layer in sequence can improve the hardness of the composite gold layer as a whole. The surface gold layer can make the composite gold layer present a golden appearance with a golden texture and improve the appearance effect. The composite gold layer provided by the embodiments can have high hardness and good bonding reliability while retaining the golden appearance effect with a golden texture, and can obtain good wear resistance, effectively solving the problem of easy wear of the gold layer.

[0011] In the embodiments, the at least three film layers include at least one intermediate pure gold layer and at least one intermediate gold-imitating layer stacked alternately.

[0012] Or include at least one intermediate mixed gold layer and at least one intermediate gold-imitating layer stacked alternately.

[0013] Or include at least one intermediate pure gold layer and at least one intermediate mixed gold layer stacked alternately.

[0014] Or include at least one intermediate pure gold layer, at least one intermediate gold-imitating layer and at least one intermediate mixed gold layer stacked. The composite layer stack has a multi-layer stacked structure, which is conducive to improving the overall hardness of the composite layer stack by using the multi-layer interlayer reinforcement effect. The intermediate pure gold layer is conducive to improving the golden texture. The intermediate mixed gold layer has higher hardness than the intermediate pure gold layer, which is conducive to balancing the golden texture and hardness. The intermediate gold-imitating layer has higher hardness than the intermediate pure gold layer and the intermediate mixed gold layer, which is conducive to better improving the overall hardness of the composite layer stack. The composite layer stack includes multiple types of film layers, which is also conducive to regulating and improving the comprehensive performance of the composite layer stack by using the advantages of each type of film layer to meet the actual application needs of various products.

[0015] In the embodiments, the composite gold layer further includes a top mixed gold layer arranged between the composite layer stack and the surface gold layer. The top mixed gold layer can further form a reinforced hard gold structure with the composite layer stack, effectively improving the overall hardness of the composite gold layer and improving the wear resistance.

[0016] In the embodiment of the present application, the film layer closest to the substrate in the composite layer stack and the film layer in contact with the composite layer stack are of different materials; and / or, the film layer farthest from the substrate in the composite layer stack and the film layer in contact with the composite layer stack are of different materials.

[0017] In the embodiment of the present application, the materials of the bottom gold-imitating layer and the intermediate gold-imitating layer include gold-imitating ceramic phase materials. The bottom gold-imitating layer and the intermediate gold-imitating layer have a golden appearance similar to pure gold and have a higher hardness than pure gold.

[0018] In the embodiment of the present application, the material of the intermediate mixed gold layer includes a mixture of gold-imitating ceramic phase materials and pure gold. The mass ratio of the gold-imitating ceramic phase materials and the pure gold can be set according to actual needs.

[0019] In the embodiment of the present application, the material of the top mixed gold layer includes a mixture of gold-imitating ceramic phase materials and pure gold. The mass ratio of the gold-imitating ceramic phase materials and the pure gold can be set according to actual needs.

[0020] In the embodiment of the present application, the gold-imitating ceramic phase material includes one or more of titanium nitride, zirconium nitride, titanium carbonitride, and zirconium carbonitride. The gold-imitating ceramic material described above can obtain a golden effect and has high hardness, which is conducive to improving the overall hardness of the composite gold layer.

[0021] In the embodiment of the present application, the mass percentage content of gold in the intermediate mixed gold layer is 10%-90%. The mass content of gold can be adjusted according to actual needs. The higher the gold content, the stronger the gold texture, but the hardness will decrease.

[0022] In the embodiment of the present application, the thickness of the intermediate gold-imitating layer is 1-200 nm; the thickness of the intermediate mixed gold layer is 1-200 nm; and the thickness of the intermediate pure gold layer is 1-200 nm. The intermediate pure gold layer, the intermediate gold-imitating layer, and the intermediate mixed gold layer have a thickness of nanometer level or close to nanometer level, which is conducive to forming a better interface between adjacent film layers, thereby strengthening the composite layer stack and enhancing the hardness of the composite layer stack.

[0023] In the embodiment of the present application, the total number of film layers in the composite layer stack is 5-50. More film layers are conducive to enhancing the overall hardness of the composite layer stack.

[0024] In the embodiment of the present application, the total thickness of the composite layer stack is 200-1000 nm. Controlling the total thickness of the composite layer stack within a suitable range can keep the total thickness of the composite gold layer at a relatively low level while improving the hardness and controlling the cost.

[0025] In the embodiment, the thickness of the bottom layer imitation gold layer is 210nm-2000nm, and the thickness of the bottom layer imitation gold layer is greater than the thickness of the middle layer imitation gold layer. The setting of the bottom layer imitation gold layer with a suitable thickness is beneficial to improving the overall hardness of the composite gold layer on the one hand, and improving the deposition effect of the composite layer stack as a transition layer on the other hand, improving the bonding of the composite gold layer on the substrate surface, and further enabling the composite gold layer to maintain a suitable total thickness.

[0026] In the embodiment, the mass percentage content of gold in the top layer mixed gold layer is 10%-90%. The mass content of gold can be adjusted according to actual needs. The higher the gold content, the stronger the gold texture, but the hardness will be reduced.

[0027] In the embodiment, the thickness of the top layer mixed gold layer is 210nm-1000nm. The setting of the top layer mixed gold layer with a suitable thickness is beneficial to improving the overall hardness of the composite gold layer on the one hand, and protecting the composite layer stack on the other hand, and is also beneficial to the extremely thin setting of the surface gold layer.

[0028] In the embodiment, the mass percentage content of gold in the top layer mixed gold layer gradually increases from the side close to the substrate to the side away from the substrate. In this way, the appearance effect, wear resistance and cost advantages can be better balanced.

[0029] In the embodiment, the surface gold layer is a pure gold layer with a thickness of 1nm-10nm. Due to the special bottom layer design of the composite gold layer of the embodiment, the firmness of the surface gold layer on the substrate surface can be greatly improved, so that an extremely thin surface gold layer can be set to meet the long-term service needs. The thin thickness of the surface gold layer is also beneficial to cost control.

[0030] In the embodiment, the material of the metal primer layer includes one or more of Cr, Ti and Zr, and the thickness of the metal primer layer is 10nm-800nm. The metal primer layer adopts the above metal material and has a suitable thickness, has high bonding degree with the substrate, can improve the bonding force of the composite gold layer on the substrate surface, reduce the risk of falling off of the composite gold layer, and enable the composite gold layer to be stably combined on the substrate surface for a long time, thereby improving the use reliability.

[0031] In the embodiment, the surface hardness of the composite gold layer is greater than or equal to 800HV. The composite gold layer has a high hardness, indicating that it has good wear resistance.

[0032] In the embodiment, the substrate includes one or more of metal, ceramic and high polymer material. The composite gold layer can form a good combination on the surface of various substrates, which is beneficial to meet the application requirements of various products.

[0033] The composite gold layer of the embodiments of the present application is a wear-resistant gold plating layer, which can be formed on the surface of various structural members with a gold-like appearance requirement and high wear resistance requirement. These structural members can be appearance structural members (including functional members, decorative members, etc.) of electronic devices or other field devices. For example, the composite gold layer can be an appearance structural member such as a watch middle frame, a watchband, a watch ring, a watch buckle, a key, etc. used in a watch, or an appearance structural member such as a middle frame, a key, etc. used in a mobile phone.

[0034] The second aspect of the embodiments of the present application provides a structural member, which comprises a substrate and a composite gold layer arranged on the surface of the substrate, and the composite gold layer comprises the composite gold layer of the first aspect of the embodiments of the present application. The structural member can be various appearance structural members of electronic devices or other field devices, which can be functional members or appearance decorative members. The structural member can be, for example, an electronic device shell, a key, etc. The electronic device shell can be a shell of a 3C product such as a mobile phone, a watch, a bracelet, a tablet computer, etc. Exemplarily, the structural member can be an appearance structural member such as a watch middle frame, a watchband, a watch ring, a watch buckle, a key, a camera decorative member, etc. used in a watch, or an appearance structural member such as a middle frame, a key, a camera decorative member, etc. used in a mobile phone or a tablet computer.

[0035] The embodiments of the present application also provide an electronic device, which comprises the structural member of the second aspect of the embodiments of the present application. The electronic device can be, but is not limited to, a 3C product such as a mobile phone, a watch, a bracelet, a tablet computer, etc. BRIEF DESCRIPTION OF DRAWINGS

[0036] FIG. 1 is a schematic diagram of the cross-sectional structure of a composite gold layer 100 according to an embodiment of the present application;

[0037] FIG. 2 is a schematic diagram of the cross-sectional structure of a composite gold layer 100 according to another embodiment of the present application;

[0038] FIG. 3 is a schematic diagram of the cross-sectional structure of a composite gold layer 100 according to yet another embodiment of the present application;

[0039] FIG. 4 is a schematic diagram of the cross-sectional structure of a composite gold layer 100 according to yet another embodiment of the present application;

[0040] FIG. 5 is a schematic diagram of the cross-sectional structure of a composite gold layer 100 according to yet another embodiment of the present application;

[0041] FIG. 6 is a schematic diagram of the cross-sectional structure of a composite gold layer 100 according to yet another embodiment of the present application;

[0042] FIG. 7 is a schematic diagram of the cross-sectional structure of a composite gold layer 100 according to yet another embodiment of the present application;

[0043] FIG. 8 is a schematic diagram of a structural member 200 according to an embodiment of the present application;

[0044] FIG. 9 is a structural schematic diagram of an electronic device 300 provided by an embodiment of the present application. DETAILED DESCRIPTION

[0045] The embodiments of the present application will be described below with reference to the accompanying drawings.

[0046] Gold has a golden appearance of precious metal, and its application in appearance structural members of wearable electronic products such as watches and bracelets can improve the appearance effect of the products and improve the user experience. However, gold itself is extremely soft, and if a pure gold layer is directly arranged on the surface of the appearance structural members of these electronic products, it will be easily worn out during use, affecting the user experience. At present, the industry usually uses doping or special plating processes to enhance the hardness of the gold layer to improve the wear resistance, but the hardness is still relatively low (<300HV), which cannot effectively solve the problem of wear of the gold layer during use. To solve the above problems, the embodiments of the present application provide a composite gold layer, which has a specific multilayer composite structure, retains the appearance effect of gold, has high hardness, and thus has good wear resistance, to a certain extent, solving the problem of easy wear of the existing gold layer.

[0047] Referring to FIGS. 1 and 2, FIG. 1 is a schematic diagram of the cross-sectional structure of a composite gold layer 100 provided by an embodiment of the present application, and FIG. 2 is a schematic diagram of the cross-sectional structure of a composite gold layer 100 provided by another embodiment of the present application. As shown in FIGS. 1 and 2, the composite gold layer 100 includes:

[0048] A metal primer layer 101 is arranged on the substrate 10;

[0049] A bottom gold-imitating layer 102 is arranged on the metal primer layer 101;

[0050] A composite layer stack 103 is arranged on the bottom gold-imitating layer 102; the composite layer stack 103 includes at least three film layers stacked on the bottom gold-imitating layer 102, the at least three film layers include at least two types of intermediate pure gold layers 1031, intermediate gold-imitating layers 1032, and intermediate mixed gold layers 1033, and any two adjacent film layers in the composite layer stack 103 are different types of film layers;

[0051] A surface gold layer 104 is arranged on the composite layer stack 103.

[0052] The composite gold layer 100 provided by the embodiments of the present application has a specific multi-layer composite structure. The metal primer layer 101 can improve the bonding force of the composite gold layer 100 on the surface of the substrate 10. The bottom gold-imitating layer 102 and the composite layer stack 103 formed on the metal primer layer 101 in sequence can improve the hardness of the composite gold layer 100 as a whole. The surface gold layer 104 can make the composite gold layer 100 present a golden appearance with a golden texture and improve the appearance effect. The composite gold layer 100 provided by the embodiments of the present application can have a high hardness and good bonding reliability while retaining the golden appearance effect with a golden texture, and can obtain good wear resistance, thereby effectively solving the problem of easy wear of the gold layer.

[0053] Referring to FIG. 3 and FIG. 4, FIG. 3 is a schematic diagram of the cross-sectional structure of the composite gold layer 100 provided by another embodiment of the present application; and FIG. 4 is a schematic diagram of the cross-sectional structure of the composite gold layer 100 provided by another embodiment of the present application. In order to further improve the hardness of the composite gold layer 100 and improve the wear resistance, in some embodiments of the present application, as shown in FIG. 3 and FIG. 4, the composite gold layer 100 further includes a top mixed gold layer 105 arranged between the composite layer stack 103 and the surface gold layer 104. The top mixed gold layer 105 can further form a reinforced hard gold structure with the composite layer stack 103, effectively improving the hardness of the composite gold layer 100 as a whole and improving the wear resistance.

[0054] In the embodiments of the present application, the substrate 10 can be various materials that need to be provided with the composite gold layer 100 and can be provided with the composite gold layer 100, for example, the substrate 10 can include one or more of metal, ceramic and high polymer material. The metal can be pure metal or alloy, for example, but is not limited to, aluminum alloy, titanium alloy, magnesium alloy, zinc alloy, stainless steel, etc. The shape of the substrate 10 is not particularly limited and can be various shapes required by design. The thickness of the substrate 10, i.e., the size in the stacking direction of the composite gold layer 100, is also not particularly limited.

[0055] In the embodiments of the present application, the material of the metal primer layer 101 can be various metal materials capable of forming a strong bond with the base material 10. The metal primer layer 101 is arranged on the base material 10 and directly contacts the base material 10. The metal primer layer 101 has a high bonding degree with the base material 10, which can improve the bonding force of the composite metal layer 100 on the surface of the base material 10, reduce the risk of falling off of the composite metal layer 100, and enable the composite metal layer 100 to be stably bonded on the surface of the base material 10 for a long time, thereby improving the use reliability. The metal primer layer 101 can be prepared by physical vapor deposition, specifically by magnetron sputtering or ion plating. The magnetron sputtering is conducive to efficiently obtaining a high-quality film layer. In some embodiments of the present application, the material of the metal primer layer 101 can include one or more of chromium (Cr), titanium (Ti), and zirconium (Zr). For example, in some embodiments, the metal primer layer 101 is a chromium layer. In some embodiments, the metal primer layer 101 is a titanium layer. In some embodiments, the metal primer layer 101 is a zirconium layer. It can be understood that the metal primer layer 101 can cover part or all of the surface of the base material 10 according to actual needs.

[0056] In the embodiments of the present application, the metal primer layer 101 can be a single-layer film and is arranged on the base material 10 in a contact manner. The thickness of the metal primer layer 101 can be 10 nm to 800 nm. The introduction of the metal primer layer 101 with a suitable thickness is conducive to the firm adhesion of subsequent film layers on the surface of the base material 10, thereby improving the bonding force of the composite metal layer 100 on the surface of the base material 10. For example, the thickness of the metal primer layer 101 can be 10 nm, 50 nm, 100 nm, 150 nm, 200 nm, 250 nm, 300 nm, 350 nm, 400 nm, 450 nm, 500 nm, 550 nm, 600 nm, 650 nm, 700 nm, 450 nm, or 800 nm.

[0057] In the embodiments of the present application, the bottom gold-imitation layer 102 is a basic layer for improving the overall hardness of the composite metal layer 100. The bottom gold-imitation layer 102 has a golden appearance similar to pure gold and has a higher hardness than pure gold. The material of the bottom gold-imitation layer 102 includes a gold-imitation ceramic phase material. The gold-imitation ceramic phase material can include titanium nitride (TiN), zirconium nitride (ZrN), titanium carbonitride (TiCN), zirconium carbonitride (ZrCN), titanium carbide (TiC), zirconium carbide (ZrC), or a combination thereof. x N y ), zirconium carbonitride (ZrCN), titanium carbide (TiC), zirconium carbide (ZrC), or a combination thereof. x N yone or more of the following: x is greater than 0, y is greater than 0. In some embodiments, the bottom gold-imitation layer 102 is a titanium nitride gold-imitation layer; in some embodiments, the bottom gold-imitation layer 102 is a zirconium nitride gold-imitation layer; in some embodiments, the bottom gold-imitation layer 102 is a titanium carbonitride gold-imitation layer; in some embodiments, the bottom gold-imitation layer 102 is a zirconium carbonitride gold-imitation layer; in some embodiments, the bottom gold-imitation layer 102 is a titanium nitride and zirconium nitride composite gold-imitation layer; in some embodiments, the bottom gold-imitation layer 102 is a titanium carbonitride and zirconium carbonitride composite gold-imitation layer.

[0058] In the embodiments of the present application, the bottom gold-imitation layer 102 is disposed on the side surface of the metal primer layer 101 away from the substrate 10, and directly contacts the metal primer layer 101, i.e., the bottom gold-imitation layer 102 is in contact and stacked on the metal primer layer 101. The thickness of the bottom gold-imitation layer 102 can be 210 nm-2000 nm. The setting of the bottom gold-imitation layer 102 with a suitable thickness is beneficial on the one hand to improve the overall hardness of the composite gold layer 100, and on the other hand to improve the deposition effect of the composite layer 103 as a transition layer, improve the bonding of the composite gold layer 100 on the surface of the substrate 10, and further enable the overall composite gold layer 100 to maintain a suitable total thickness. Exemplarily, the thickness of the bottom gold-imitation layer 102 can be 210 nm, 250 nm, 300 nm, 350 nm, 400 nm, 450 nm, 500 nm, 550 nm, 600 nm, 650 nm, 700 nm, 800 nm, 900 nm, 1000 nm, 1100 nm, 1200 nm, 1300 nm, 1400 nm, 1500 nm, 1600 nm, 1700 nm, 1800 nm, 1900 nm, 2000 nm. In some embodiments of the present application, the thickness of the bottom gold-imitation layer 102 is 500 nm-1500 nm. The relatively thick bottom gold-imitation layer 102 is beneficial to better improve the hardness of the composite gold layer 100 and improve the bonding. In the embodiments of the present application, the bottom gold-imitation layer 102 completely covers the metal primer layer 101, i.e., the orthographic projection of the bottom gold-imitation layer 102 and the metal primer layer 101 in the thickness direction of the composite gold layer 100 completely coincides. The bottom gold-imitation layer 102 can be prepared by physical vapor deposition, specifically by magnetron sputtering or ion plating.

[0059] The bottom gold-imitation layer 102 is a basic layer for improving the overall hardness of the composite gold layer 100. In the embodiments of the present application, the thickness of the bottom gold-imitation layer 102 is greater than the thickness of each intermediate gold-imitation layer 1032, which is beneficial to improve the overall comprehensive performance of the composite gold layer 100.

[0060] In the embodiments of the present application, the composite layer stack 103 is arranged on the side surface of the bottom layer imitation gold layer 102 away from the substrate 10, and is in direct contact with the bottom layer imitation gold layer 102, that is, the composite layer stack 103 is arranged on the bottom layer imitation gold layer 102 in a contact stack. The composite layer stack 103 can be prepared by physical vapor deposition, specifically by magnetron sputtering or ion plating. The composite layer stack 103 is formed by alternately depositing the intermediate imitation gold layer 1032 and the intermediate pure gold layer 1031 or the intermediate mixed gold layer 1033, which can effectively improve the overall hardness of the composite gold layer 100.

[0061] In the embodiments of the present application, the composite layer stack 103 includes at least three film layers arranged in a stack on the bottom layer imitation gold layer 102, the at least three film layers include at least two types of intermediate pure gold layer 1031, intermediate imitation gold layer 1032 and intermediate mixed gold layer 1033, and any two adjacent film layers in the composite layer stack 103 are different types of film layers. For example, the two adjacent film layers are the intermediate pure gold layer 1031 and the intermediate imitation gold layer 1032, or the intermediate pure gold layer 1031 and the intermediate mixed gold layer 1033, or the intermediate imitation gold layer 1032 and the intermediate mixed gold layer 1033. In some embodiments, the at least three film layers can be, for example, 3-60 layers, such as 3 layers, 4 layers, 5 layers, 6 layers, 7 layers, 8 layers, 10 layers, 12 layers, 15 layers, 18 layers, 20 layers, 22 layers, 26 layers, 30 layers, 32 layers, 35 layers, 40 layers, 42 layers, 45 layers, 48 layers, 50 layers, 52 layers, 55 layers, 58 layers, 60 layers.

[0062] In some embodiments of the present application, as shown in FIGS. 1 and 3, the at least three film layers of the composite layer stack 103 include at least one intermediate pure gold layer 1031 and at least one intermediate imitation gold layer 1032 arranged in an alternating stack. In some embodiments of the present application, the composite layer stack 103 includes a plurality of intermediate pure gold layers 1031 and a plurality of intermediate imitation gold layers 1032 arranged in an alternating stack. The plurality of layers can be two or more, for example, 2-30 layers, specifically, for example, 2 layers, 3 layers, 5 layers, 8 layers, 10 layers, 12 layers, 15 layers, 18 layers, 20 layers, 22 layers, 25 layers, 28 layers, 30 layers, etc. In some embodiments, the number of intermediate pure gold layers 1031 and intermediate imitation gold layers 1032 is the same. In some embodiments, the number of intermediate pure gold layers 1031 is one more than the number of intermediate imitation gold layers 1032. In some embodiments, the number of intermediate pure gold layers 1031 is one less than the number of intermediate imitation gold layers 1032.

[0063] The intermediate pure gold layer 1031 is a pure gold material, and the purity can be greater than 99%. The material of the intermediate imitation gold layer 1032 includes imitation gold ceramic phase material, which can include titanium nitride (TiN), zirconium nitride (ZrN), titanium carbonitride (TiCN), zirconium carbonitride (ZrCN), titanium aluminum nitride (TiAlN), zirconium aluminum nitride (ZrAlN), titanium aluminum carbonitride (TiAlCN), zirconium aluminum carbonitride (ZrAlCN), etc. x N y), zirconium carbonitride (ZrC) x N y One or more of the following, wherein x is greater than 0 and y is greater than 0. In some embodiments, the intermediate gold-imitation layer 1032 is a titanium nitride gold-imitation layer; in some embodiments, the intermediate gold-imitation layer 1032 is a zirconium nitride gold-imitation layer; in some embodiments, the intermediate gold-imitation layer 1032 is a titanium carbonitride gold-imitation layer; in some embodiments, the intermediate gold-imitation layer 1032 is a zirconium carbonitride gold-imitation layer; in some embodiments, the intermediate gold-imitation layer 1032 is a composite gold-imitation layer of titanium nitride and zirconium carbonitride; in some embodiments, the intermediate gold-imitation layer 1032 is a composite gold-imitation layer of titanium carbonitride and zirconium carbonitride. When the composite layer stack 103 includes multiple intermediate gold-imitation layers 1032, the multiple intermediate gold-imitation layers 1032 may have the same material or may have different materials. For example, the multilayer intermediate gold-imitation layers 1032 are all titanium nitride gold-imitation layers, or zirconium nitride gold-imitation layers, or titanium carbonitride gold-imitation layers, or zirconium carbonitride gold-imitation layers, or titanium nitride and zirconium carbonitride composite gold-imitation layers. As another example, the multilayer intermediate gold-imitation layers 1032 include two or more of the following: titanium nitride gold-imitation layers, zirconium nitride gold-imitation layers, titanium carbonitride gold-imitation layers, zirconium carbonitride gold-imitation layers, titanium nitride and zirconium nitride composite gold-imitation layers, and titanium carbonitride and zirconium carbonitride composite gold-imitation layers. Exemplarily, some layers in the multilayer intermediate gold-imitation layers 1032 are titanium nitride gold-imitation layers, and other layers are titanium carbonitride gold-imitation layers; or some layers in the multilayer intermediate gold-imitation layers 1032 are zirconium nitride gold-imitation layers, and other layers are zirconium carbonitride gold-imitation layers.

[0064] In this embodiment, the thickness of the intermediate pure gold layer 1031 can be 1nm-200nm. For example, the thickness of the intermediate pure gold layer 1031 can be 1nm, 5nm, 10nm, 15nm, 20nm, 25nm, 50nm, 55nm, 60nm, 65nm, 70nm, 80nm, 90nm, 100nm, 110nm, 120nm, 130nm, 140nm, 150nm, 160nm, 170nm, 180nm, 190nm, or 200nm. The intermediate pure gold layer 1031 having a nanometer-scale or near-nanometer-scale thickness is beneficial for forming a better interface bond with the intermediate imitation gold layer 1032, thereby enhancing the hardness of the composite stack 103. When the composite stack 103 includes multiple intermediate pure gold layers 1031, the multiple intermediate pure gold layers 1031 can have the same thickness or different thicknesses.

[0065] In some embodiments, the intermediate gold-like layer 1032 can have a thickness of 1 nm to 200 nm. For example, the intermediate gold-like layer 1032 can have a thickness of 1 nm, 5 nm, 10 nm, 15 nm, 20 nm, 25 nm, 50 nm, 55 nm, 60 nm, 65 nm, 70 nm, 80 nm, 90 nm, 100 nm, 110 nm, 120 nm, 130 nm, 140 nm, 150 nm, 160 nm, 170 nm, 180 nm, 190 nm, 200 nm. The intermediate gold-like layer 1032 has a thickness at the nanometer scale or close to the nanometer scale, which is conducive to forming a better interface bonding with the intermediate pure gold layer 1031 and enhancing the hardness of the composite layer stack 103. When the composite layer stack 103 includes multiple intermediate gold-like layers 1032, the multiple intermediate gold-like layers 1032 can have the same thickness or different thicknesses.

[0066] In the composite layer stack 103, the intermediate pure gold layer 1031 and the intermediate gold-like layer 1032 each have a thickness at the nanometer scale or close to the nanometer scale, which can enable the composite layer stack 103 to have a unique microstructure feature, form a nanoscale interface bonding between the film layers in the composite layer stack 103, and further bring a strengthening effect to the composite layer stack 103 and enhance the hardness of the composite layer stack 103. The thickness of the intermediate pure gold layer 1031 and the intermediate gold-like layer 1032 is controlled at a relatively small value, which is conducive to better enhancing the hardness of the composite layer stack 103. In some embodiments, the thickness of the intermediate pure gold layer 1031 can be 1 nm to 100 nm, and the thickness of the intermediate gold-like layer 1032 can be 1 nm to 100 nm.

[0067] In some other embodiments, as shown in FIGS. 2 and 4, the composite layer stack 103 includes at least one intermediate gold-like layer 1032 and at least one intermediate mixed gold layer 1033 arranged in an alternating stack. The intermediate mixed gold layer 1033 has a higher hardness than the intermediate pure gold layer 1031, and the alternating stack of the intermediate mixed gold layer 1033 and the intermediate gold-like layer 1032 can better enhance the overall hardness of the composite layer stack. In some embodiments, the composite layer stack 103 includes multiple intermediate gold-like layers 1032 and multiple intermediate mixed gold layers 1033 arranged in an alternating stack. The multiple layers can be two or more, for example, 2 to 30 layers, such as 2 layers, 3 layers, 5 layers, 8 layers, 10 layers, 12 layers, 15 layers, 18 layers, 20 layers, 22 layers, 25 layers, 28 layers, 30 layers, etc. In some embodiments, the number of the intermediate gold-like layers 1032 is the same as the number of the intermediate mixed gold layers 1033. In some embodiments, the number of the intermediate gold-like layers 1032 is one more than the number of the intermediate mixed gold layers 1033. In some embodiments, the number of the intermediate gold-like layers 1032 is one less than the number of the intermediate mixed gold layers 1033. Compared with the intermediate pure gold layer 1031, the intermediate mixed gold layer 1033 has a higher hardness, which is conducive to enhancing the overall hardness of the composite layer stack 103.

[0068] In this embodiment, the material and thickness of the intermediate gold-imitation layer 1032 are as described above and will not be repeated here. The intermediate gold-mixed layer 1033 is made of a mixture of a gold-imitation ceramic phase material and pure gold. The gold-imitation ceramic phase material may include titanium nitride (TiN), zirconium nitride (ZrN), and titanium carbonitride (TiC). x N y ), zirconium carbonitride (ZrC) x N y One or more of the following, wherein x is greater than 0 and y is greater than 0. In some embodiments, the intermediate gold-mixed layer 1033 is a mixture of titanium nitride and gold; in some embodiments, the intermediate gold-mixed layer 1033 is a mixture of zirconium nitride and gold; in some embodiments, the intermediate gold-mixed layer 1033 is a mixture of titanium carbonitride and gold; in some embodiments, the intermediate gold-mixed layer 1033 is a mixture of zirconium carbonitride and gold. In some embodiments, the intermediate gold-mixed layer 1033 may also be a mixture of titanium nitride, zirconium nitride and gold, or a mixture of titanium carbonitride, zirconium carbonitride and gold. The mass percentage of gold in the intermediate gold-mixed layer 1033 may be 10%-90%. Exemplarily, the mass percentage of gold in the intermediate gold-mixed layer 1033 may be 10%, 15%, 20%, 25%, 30%, 40%, 50%, 60%, 70%, 80%, or 90%. In some embodiments, the mass percentage of gold in the intermediate gold-mixed layer 1033 can be 10%-40%. Controlling the mass percentage of gold in the intermediate gold-mixed layer 1033 to a relatively small value is beneficial for improving the overall hardness of the composite laminate 103 while controlling costs.

[0069] When the composite layer stack 103 includes multiple intermediate gold-mixed layers 1033, the intermediate gold-mixed layers 1033 may have the same gold content or different gold contents. In some embodiments, the mass percentage of gold in the multiple intermediate gold-mixed layers 1033 increases layer by layer from the side closest to the substrate 10 to the side furthest from the substrate 10. This arrangement is beneficial for better balancing cost, appearance, and wear resistance. In some embodiments, the mass percentage of gold in the multiple intermediate gold-mixed layers 1033 may vary layer by layer within any range of 10%-90%. In some embodiments, the mass percentage of gold in the multiple intermediate gold-mixed layers 1033 increases layer by layer from 10% to 40%.

[0070] When the composite layer stack 103 includes multiple intermediate mixed gold layers 1033, the intermediate mixed gold layers 1033 can have the same material or different materials. For example, the multiple intermediate mixed gold layers 1033 are all titanium nitride and gold mixed layers, or zirconium nitride and gold mixed layers, or titanium carbonitride and gold mixed layers, or zirconium carbonitride and gold mixed layers, or titanium nitride, zirconium nitride and gold mixed layers, or titanium carbonitride, zirconium carbonitride and gold mixed layers. For another example, the multiple intermediate mixed gold layers 1033 include two or more of the following: titanium nitride and gold mixed layers, zirconium nitride and gold mixed layers, titanium carbonitride and gold mixed layers, zirconium carbonitride and gold mixed layers, titanium nitride, zirconium nitride and gold mixed layers, titanium carbonitride, zirconium carbonitride and gold mixed layers. Illustratively, the multiple intermediate mixed gold layers 1033 include some layers of titanium nitride and gold mixed layers and some layers of titanium carbonitride and gold mixed layers, or some layers of zirconium nitride and gold mixed layers and some layers of zirconium carbonitride and gold mixed layers.

[0071] In some embodiments, the intermediate mixed gold layers 1033 can have a thickness of 1 nm to 200 nm. Illustratively, the intermediate mixed gold layers 1033 can have a thickness of 1 nm, 5 nm, 10 nm, 15 nm, 20 nm, 25 nm, 50 nm, 55 nm, 60 nm, 65 nm, 70 nm, 80 nm, 90 nm, 100 nm, 110 nm, 120 nm, 130 nm, 140 nm, 150 nm, 160 nm, 170 nm, 180 nm, 190 nm, 200 nm. The intermediate mixed gold layers 1033 have a thickness of nanometer scale or close to nanometer scale, which is beneficial to form a better interface bonding with the intermediate pure gold layers 1031 and enhance the hardness of the composite layer stack 103. When the composite layer stack 103 includes multiple intermediate imitation gold layers 1032, the multiple intermediate mixed gold layers 1033 can have the same thickness or different thicknesses.

[0072] In the composite layer stack 103, the intermediate imitation gold layers 1032 and the intermediate mixed gold layers 1033 have a thickness of nanometer scale or close to nanometer scale, which can make the composite layer stack 103 have a unique microstructure feature, form a nanometer scale interface bonding between the film layers in the composite layer stack 103, and further bring a strengthening effect to the composite layer stack 103 and enhance the hardness of the composite layer stack 103. The thickness of the intermediate imitation gold layers 1032 and the intermediate mixed gold layers 1033 is controlled to be relatively small, which is beneficial to better enhance the hardness of the composite layer stack 103. In some embodiments, the thickness of the intermediate imitation gold layers 1032 can be 1 nm to 100 nm, and the thickness of the intermediate mixed gold layers 1033 can be 1 nm to 100 nm.

[0073] In some embodiments of the present application, as shown in FIG. 5, the at least three film layers of the composite layer stack 103 include at least one intermediate pure gold layer 1031 and at least one intermediate mixed gold layer 1033, which are alternately stacked. In this embodiment, the materials and thicknesses of the intermediate pure gold layer 1031 and the intermediate mixed gold layer 1033 are as described above, and will not be repeated here.

[0074] In some embodiments of the present application, as shown in FIGS. 6 and 7, the at least three film layers of the composite layer stack 103 include at least one intermediate pure gold layer, at least one intermediate imitation gold layer, and at least one intermediate mixed gold layer, which are stacked. In this embodiment, the materials and thicknesses of the intermediate pure gold layer 1031, the intermediate imitation gold layer 1032, and the intermediate mixed gold layer 1033 are as described above, and will not be repeated here. In this embodiment, the composite layer stack 103 can include the intermediate pure gold layer 1031, the intermediate imitation gold layer 1032, and the intermediate mixed gold layer 1033, which are alternately stacked as shown in FIG. 6, or stacked in a non-specific order as shown in FIG. 7. When the composite layer stack 103 includes the intermediate pure gold layer 1031, the intermediate imitation gold layer 1032, and the intermediate mixed gold layer 1033, which are alternately stacked, the stacking order of the three types of film layers is not limited, and for example, can be sequentially stacked in the order of the intermediate pure gold layer 1031, the intermediate imitation gold layer 1032, and the intermediate mixed gold layer 1033, or sequentially stacked in the order of the intermediate mixed gold layer 1033, the intermediate imitation gold layer 1032, and the intermediate pure gold layer 1031. When the composite layer stack 103 includes the intermediate pure gold layer 1031, the intermediate imitation gold layer 1032, and the intermediate mixed gold layer 1033, which are stacked in a non-specific order, the stacking order of the three types of film layers is not limited, and can be regularly stacked or irregularly stacked, and the number of layers of each type of film layer can be the same or different.

[0075] In some embodiments of the present application, the total thickness of the composite layer stack 103 can be 200 nm-1000 nm. For example, the total thickness of the composite layer stack 103 can be 200 nm, 250 nm, 300 nm, 350 nm, 400 nm, 450 nm, 500 nm, 550 nm, 600 nm, 650 nm, 700 nm, 750 nm, 800 nm, 850 nm, 900 nm, 950 nm, or 1000 nm. Controlling the total thickness of the composite layer stack 103 within an appropriate range can help improve hardness and control costs while keeping the total thickness of the composite gold layer 100 at a relatively low level.

[0076] In some embodiments of the present application, the total number of film layers in the composite layer stack 103 is 5-50 layers. For example, the total number of film layers in the composite layer stack 103 is 5, 8, 10, 18, 20, 22, 26, 30, 32, 35, 40, 42, 45, 48, or 50 layers.

[0077] In some embodiments, in order to improve the hardness of the composite layer stack 103, the thickness of each single layer film can be reduced and the total number of alternating film layers can be increased under the condition of a certain total thickness.

[0078] In the present application, any two adjacent single layer films in the composite gold layer 100 are different material layers, wherein the different material layers refer to film layers composed of different materials, and do not include the case of film layers composed of the same material with different content ratios, and adjacent film layers composed of the same material with different content ratios are regarded as one single layer film.

[0079] In the embodiments of the present application, the film layer closest to the substrate 10 in the composite layer stack 103 is a different material layer, and / or the film layer farthest from the substrate 10 in the composite layer stack 103 is a different material layer.

[0080] When the film layer closest to the substrate 10 in the composite layer stack 103 is a different material layer (i.e., the bottom gold-imitating layer 102), the film layer closest to the substrate 10 in the composite layer stack 103 can be the intermediate pure gold layer 1031, the intermediate mixed gold layer 1033, or the intermediate gold-imitating layer 1032 which is a different material from the bottom gold-imitating layer 102. For example, the bottom gold-imitating layer 102 is a titanium nitride layer, and the intermediate gold-imitating layer 1032 in contact with the bottom gold-imitating layer 102 is a titanium carbonitride layer.

[0081] The film layer farthest from the substrate 10 in the composite layer stack 103 is a different material layer (the top mixed gold layer 105 or the gold surface layer 104), wherein when the top mixed gold layer 105 is in direct contact with the composite layer stack 103, the film layer farthest from the substrate 10 in the composite layer stack 103 can be the intermediate pure gold layer 1031, the intermediate gold-imitating layer 1032, or the intermediate mixed gold layer 1033 which is a different material from the top mixed gold layer 105. For example, the top mixed gold layer 105 is a titanium nitride and gold mixed layer, and the intermediate mixed gold layer 1033 in contact with the top mixed gold layer 105 is a titanium carbonitride and gold mixed layer. When the gold surface layer 104 is in direct contact with the composite layer stack 103, the film layer farthest from the substrate 10 in the composite layer stack 103 can be the intermediate gold-imitating layer 1032 or the intermediate mixed gold layer 1033.

[0082] Continuing to refer to FIGS. 1 and 3, when the composite layer stack 103 comprises at least one intermediate pure gold layer 1031 and at least one intermediate imitation gold layer 1032 arranged in an alternating stack, the side of the composite layer stack 103 that is in contact with the bottom imitation gold layer 102 is either the intermediate pure gold layer 1031 (as shown in FIG. 1) or the intermediate imitation gold layer 1032 that is of a different material than the bottom imitation gold layer 102. For example, the bottom imitation gold layer 102 is a titanium nitride layer, and the intermediate imitation gold layer 1032 in contact with the bottom imitation gold layer 102 is a titanium carbonitride layer. In this embodiment, when the surface gold layer 104 is in direct contact with the composite layer stack 103, the side of the composite layer stack 103 that is in contact with the surface gold layer 104 (i.e., the outermost layer away from the substrate 10) is the intermediate imitation gold layer 1032 (as shown in FIG. 1). When the top mixed gold layer 105 is in direct contact with the composite layer stack 103, the side of the composite layer stack 103 that is in contact with the top mixed gold layer 105 (i.e., the outermost layer away from the substrate 10) can be either the intermediate pure gold layer 1031 or the intermediate imitation gold layer 1032 (as shown in FIG. 3).

[0083] Continuing to refer to FIGS. 2 and 4, when the composite layer stack 103 comprises at least one intermediate imitation gold layer 1032 and at least one intermediate mixed gold layer 1033 arranged in an alternating stack, the side of the composite layer stack 103 that is in contact with the bottom imitation gold layer 102 can be either the intermediate mixed gold layer 1033 (as shown in FIG. 2) or the intermediate imitation gold layer 1032 that is of a different material than the bottom imitation gold layer 102. For example, the bottom imitation gold layer 102 is a titanium nitride layer, and the intermediate imitation gold layer 1032 in contact with the bottom imitation gold layer 102 is a titanium carbonitride layer. In this embodiment, when the surface gold layer 104 is in direct contact with the composite layer stack 103, the side of the composite layer stack 103 that is in contact with the surface gold layer 104 (i.e., the outermost layer away from the substrate 10) can be either the intermediate mixed gold layer 1033 or the intermediate imitation gold layer 1032 (as shown in FIG. 2). When the top mixed gold layer 105 is in direct contact with the composite layer stack 103, the side of the composite layer stack 103 that is in contact with the top mixed gold layer 105 (i.e., the outermost layer away from the substrate 10) can be either the intermediate imitation gold layer 1032 (as shown in FIG. 4) or the intermediate mixed gold layer 1033 that is of a different material than the top mixed gold layer 105. For example, the top mixed gold layer 105 is a titanium nitride and gold mixed layer, and the intermediate mixed gold layer 1033 in contact with the top mixed gold layer 105 is a titanium carbonitride and gold mixed layer.

[0084] In this embodiment, the top gold-mixed layer 105 is disposed between the composite stack 103 and the surface gold layer 104. The two sides of the top gold-mixed layer 105 are in direct contact with both the composite stack 103 and the surface gold layer 104, meaning the top gold-mixed layer 105 is stacked on the composite stack 103. The introduction of the top gold-mixed layer 105 can form a hard gold structure with the composite stack 103, further improving the hardness of the composite gold layer 100 and enhancing its wear resistance. The material of the top gold-mixed layer 105 includes a mixture of a gold-imitation ceramic phase material and pure gold. The gold-imitation ceramic phase material can include titanium nitride (TiN), zirconium nitride (ZrN), and titanium carbonitride (TiC). x N y ), zirconium carbonitride (ZrC) x N y One or more of the following, wherein x is greater than 0 and y is greater than 0. In some embodiments, the top gold-mixed layer 105 is a mixture of titanium nitride and gold; in some embodiments, the top gold-mixed layer 105 is a mixture of zirconium nitride and gold; in some embodiments, the top gold-mixed layer 105 is a mixture of titanium carbonitride and gold; in some embodiments, the top gold-mixed layer 105 is a mixture of zirconium carbonitride and gold. In some embodiments, the top gold-mixed layer 105 may also be a mixture of two, three, or four of the following gold-imitation ceramic phase materials and gold: titanium nitride, zirconium nitride, titanium carbonitride, and zirconium carbonitride. The mass percentage of gold in the top gold-mixed layer 105 may be 10%-90%. Exemplarily, the mass percentage of gold in the top gold-mixed layer 105 may be 10%, 15%, 20%, 25%, 30%, 40%, 50%, 60%, 70%, 80%, or 90%. In some embodiments, the gold content in the top gold-mixed layer 105 can be 10%-40% by mass. Controlling the gold content in the top gold-mixed layer 105 to a relatively small value is beneficial for improving hardness and wear resistance while controlling costs.

[0085] To better balance aesthetics, wear resistance, and cost, in some embodiments, the mass percentage of gold in the top gold-mixed layer 105 gradually increases from the side closest to the substrate 10 towards the side furthest from the substrate 10. The mass percentage of gold in the top gold-mixed layer 105 can gradually vary within any range of 10% to 90%. In some embodiments, the mass percentage of gold in the top gold-mixed layer 105 gradually increases from 10% to 40%.

[0086] In this embodiment of the application, when the composite layer stack 103 includes an intermediate gold-mixed layer 1033, the thickness of the top gold-mixed layer 105 is greater than the thickness of each intermediate gold-mixed layer 1033.

[0087] In the embodiments of the present application, the thickness of the top mixed gold layer 105 can be 210 nm-1000 nm. The setting of the top mixed gold layer 105 with a suitable thickness is beneficial for improving the overall hardness of the composite gold layer 100 on the one hand, and for protecting the composite layer stack 103, and also for the extremely thin setting of the surface gold layer 104 on the other hand. Exemplarily, the thickness of the top mixed gold layer 105 can be 210 nm, 250 nm, 300 nm, 350 nm, 400 nm, 450 nm, 500 nm, 550 nm, 600 nm, 650 nm, 700 nm, 800 nm, 900 nm, 1000 nm. The top mixed gold layer 105 can be prepared by physical vapor deposition, specifically by magnetron sputtering or ion plating, and more specifically by mixing and sputtering the gold ceramic phase material and pure gold.

[0088] In the embodiments of the present application, the surface gold layer 104 is arranged on the side of the composite layer stack 103 away from the substrate 10, and is the outermost layer of the composite gold layer 100, serving as an appearance surface to make the composite gold layer 100 present a golden appearance effect. In some embodiments, the surface gold layer 104 is in contact with the composite layer stack 103, i.e., the surface gold layer 104 is arranged in contact with the composite layer stack 103; in some embodiments, the surface gold layer 104 is in contact with the top mixed gold layer 105, i.e., the surface gold layer 104 is arranged in contact with the top mixed gold layer 105. The surface gold layer 104 is a pure gold layer, and the gold purity can be greater than 99%.

[0089] In the embodiments of the present application, the thickness of the surface gold layer 104 can be 1 nm-10 nm. Exemplarily, the thickness of the surface gold layer 104 can be 1 nm, 2 nm, 3 nm, 4 nm, 5 nm, 6 nm, 7 nm, 8 nm, 9 nm, 10 nm. Due to the special bottom layer design of the composite gold layer 100 of the present application, the firmness of the surface gold layer 104 on the surface of the substrate 10 can be greatly improved, thereby realizing the extremely thin setting of the surface gold layer 104 to meet the long-term service needs. The thin thickness of the surface gold layer 104 is also beneficial for cost control. The surface gold layer 104 can be prepared by physical vapor deposition, specifically by magnetron sputtering or ion plating.

[0090] In the present application, a transmission electron microscope (TEM) can be used to characterize the film layer structure and composition of the composite gold layer 100.

[0091] In the embodiments of the present application, the surface Vickers hardness of the composite gold layer 100 is greater than or equal to 800HV. In some embodiments, the surface Vickers hardness of the composite gold layer 100 is greater than or equal to 850HV. In some embodiments, the surface Vickers hardness of the composite gold layer 100 is greater than or equal to 900HV. In some embodiments, the surface Vickers hardness of the composite gold layer 100 is greater than or equal to 950HV. In some embodiments, the surface Vickers hardness of the composite gold layer 100 is greater than or equal to 1000HV. In some embodiments, the surface Vickers hardness of the composite gold layer 100 is greater than or equal to 1100HV. Hardness represents the ability of a material to resist the indentation of a hard object into its surface. Generally, the higher the hardness, the better the wear resistance. Vickers hardness is a commonly used hardness index, which can be measured by a micro Vickers hardness tester.

[0092] The composite gold layer 100 of the embodiments of the present application is a wear-resistant gold plating layer, which can be formed on the surface of various structural members with a gold-like appearance and high wear resistance requirements. These structural members can be appearance structural members (including functional members, decorative members, etc.) of electronic devices or other field devices. For example, the composite gold layer 100 can be an appearance structural member such as a watch middle frame, a watchband, a watch ring, a watch buckle, a key, etc. used in a watch, or an appearance structural member such as a key, etc. used in a mobile phone.

[0093] The embodiments of the present application also provide a preparation method of the composite gold layer 100 described above, which comprises the following steps:

[0094] S101, depositing a metal primer layer 101 on the substrate 10;

[0095] S102, depositing a bottom gold-imitating layer 102 on the metal primer layer 101;

[0096] S103, depositing a composite layer stack 103 on the bottom gold-imitating layer 102;

[0097] S104, depositing a surface gold layer 104 on the composite layer stack 103; or depositing a top mixed gold layer 105 on the composite layer stack 103, and then depositing a surface gold layer 104 on the top mixed gold layer 105.

[0098] The deposition method of each layer described above can be a physical vapor deposition method, which can be a magnetron sputtering method or an ion plating method. The magnetron sputtering deposition of the metal layer is beneficial to obtaining high deposition rate, high film layer uniformity and high film layer firmness.

[0099] In step S101, before depositing the metal primer layer 101, the substrate 10 can be pretreated. The pretreatment can include cleaning with a cleaning agent and plasma water cleaning to remove dirt on the surface of the substrate 10, and then drying at 50-150℃ for 5-10min.

[0100] The pre-treatment can further include a plasma glow cleaning, which can be specifically placing the substrate into a physical vapor deposition device, vacuumizing the device and raising the temperature to 60-300℃, the vacuum degree being higher than 9.0x10 -3 At 0.5-5Pa, a pulse negative bias of 200-2000V is applied with a duty cycle of 20-80%, and the plasma glow cleaning is performed for 5-30min.

[0101] The deposition of the metal primer layer 101 on the substrate 10 can be specifically as follows:

[0102] The temperature in the physical vapor deposition device is kept at 60-300℃, high-purity argon gas is introduced at a flow rate of 20-100sccm, the bias voltage is -20-200V, the vacuum degree is 0.5-5Pa, the deposition target power is 200-2000W, and the deposition time is 10-45min, to deposit the metal primer layer 101. The metal primer layer 101 can be a chromium layer, a titanium layer, or a zirconium layer. Understandably, the deposition target is selected according to the metal primer layer to be deposited, for example, a chromium primer layer is deposited, and the deposition target is a chromium target.

[0103] sccm, which is the standard cubic centimeter per minute, a unit of volume flow rate.

[0104] The deposition of the metal primer layer 101 on the substrate 10 can be specifically as follows:

[0105] The temperature in the physical vapor deposition device is kept at 60-300℃, argon, nitrogen and acetylene mixed gas with a total flow rate of 20-100sccm is introduced, the flow rate of argon is 20-100sccm, the flow rate of nitrogen is 5-20sccm, the flow rate of acetylene is 1-5sccm, the bias voltage is -20-200V, the vacuum degree is 0.5-5Pa, the power of the deposition target (titanium target and / or zirconium target) is 200-2000W, the deposition time is 10-45min, and a titanium carbonitride gold-like layer or a zirconium carbonitride gold-like layer or a titanium carbonitride and zirconium carbonitride composite gold-like layer is deposited.

[0106] In step S103, during the deposition of the composite layer stack 103 on the bottom gold-like layer 102, the specific preparation of each film layer can be:

[0107] The temperature in the physical vapor deposition device is kept at 60-300℃, high-purity argon with a flow rate of 20-100sccm is introduced, the bias voltage is -200V to -20V, the vacuum degree is 0.5-5Pa, the power of the deposition target is 200-2000W, the deposition time is 1-10min, and an intermediate pure gold layer 1031 is deposited.

[0108] The temperature in the physical vapor deposition device is kept at 60-300℃, argon and nitrogen mixed gas with a total flow rate of 20-100sccm is introduced, the flow rate of argon is 20-100sccm, the flow rate of nitrogen is 5-20sccm, the bias voltage is -200V to -20V, the vacuum degree is 0.5-5Pa, the power of the deposition target (titanium target and / or zirconium target) is 200-2000W, the deposition time is 1-10min, and a titanium nitride gold-like layer or a zirconium nitride gold-like layer or a titanium nitride and zirconium nitride composite gold-like layer is deposited, i.e. an intermediate gold-like layer 1032 is obtained.

[0109] The temperature in the physical vapor deposition device is kept at 60-300℃, argon and nitrogen and acetylene mixed gas with a total flow rate of 20-100sccm is introduced, the flow rate of argon is 20-100sccm, the flow rate of nitrogen is 5-20sccm, the flow rate of acetylene is 1-5sccm, the bias voltage is -200V to -20V, the vacuum degree is 0.5-5Pa, the power of the deposition target (titanium target and / or zirconium target) is 200-2000W, the deposition time is 1-10min, and a titanium carbonitride gold-like layer or a zirconium carbonitride gold-like layer or a titanium carbonitride and zirconium carbonitride composite gold-like layer is deposited, i.e. an intermediate gold-like layer 1032 is obtained.

[0110] The temperature in the physical vapor deposition device is kept at 60-300℃, argon and nitrogen mixed gas with a total flow rate of 20-100sccm is introduced, the argon flow rate is 20-100sccm, the nitrogen flow rate is 5-20sccm, the bias voltage is -200V to -20V, the vacuum degree is 0.5-5Pa, the gold target power is 200-2000W, the deposition target (titanium target and / or zirconium target) power is 200-2000W, the deposition time is 1-10min, and a titanium nitride and gold mixed layer, or a zirconium nitride and gold mixed layer, or a titanium nitride, zirconium nitride and gold mixed layer is deposited, i.e. the intermediate gold mixed layer 1033 is obtained.

[0111] The temperature in the physical vapor deposition device is kept at 60-300℃, argon and nitrogen and acetylene mixed gas with a total flow rate of 20-100sccm is introduced, the argon flow rate is 20-100sccm, the nitrogen flow rate is 5-20sccm, the acetylene flow rate is 1-5sccm, the bias voltage is -200V to -20V, the vacuum degree is 0.5-5Pa, the gold target power is 200-2000W, the deposition target (titanium target and / or zirconium target) power is 200-2000W, the deposition time is 1-10min, and a titanium carbonitride and gold mixed layer, or a zirconium carbonitride and gold mixed layer, or a titanium carbonitride, zirconium carbonitride and gold mixed layer is deposited, i.e. the intermediate gold mixed layer 1033 is obtained.

[0112] In step S104, the specific process of depositing the top layer gold mixed layer 105 on the composite layer stack 103 can be:

[0113] The temperature in the physical vapor deposition device is kept at 60-300℃, argon and nitrogen mixed gas with a total flow rate of 20-100sccm is introduced, the argon flow rate is 20-100sccm, the nitrogen flow rate is 5-20sccm, the bias voltage is -200V to -20V, the vacuum degree is 0.5-5Pa, the gold target power is 200-2000W, the deposition target (titanium target and / or zirconium target) power is 200-2000W, the deposition time is 5-60min, and a titanium nitride and gold mixed layer, or a zirconium nitride and gold mixed layer, or a titanium nitride, zirconium nitride and gold mixed layer is deposited; or

[0114] The total flow rate of the argon and nitrogen and acetylene mixed gas is 20-100 sccm, the flow rate of the argon is 20-100 sccm, the flow rate of the nitrogen is 5-20 sccm, the flow rate of the acetylene is 1-5 sccm, the bias voltage is -200 to -20 V, the vacuum degree is 0.5-5 Pa, the power of the gold target is 200-2000 W, the power of the deposition target (titanium target and / or zirconium target) is 200-2000 W, and the deposition time is 5-60 min, so that the titanium carbonitride and gold mixed layer, or the zirconium carbonitride and gold mixed layer, or the titanium carbonitride, zirconium carbonitride and gold mixed layer is deposited.

[0115] The specific process of depositing the surface gold layer 104 on the composite layer 103 and depositing the surface gold layer 104 on the top mixed gold layer 105 can be as follows:

[0116] The temperature in the physical vapor deposition device is maintained at 60-300 ℃, high-purity argon with a total flow rate of 20-100 sccm is introduced, the bias voltage is -200 to -20 V, the vacuum degree is 0.5-5 Pa, the power of the deposition target (gold target) is 100-1000 W, and the deposition time is 1-10 min, so that the pure gold layer is deposited.

[0117] Referring to FIG. 8, FIG. 8 is a structural schematic diagram of a structural member 200 provided by an embodiment of the present application. The structural member 200 includes a substrate 10 and a composite gold layer 100 arranged on the surface of the substrate 10. The substrate 10 is the structural member body, and the composite gold layer 100 can partially cover the surface of the substrate 10 or completely cover the surface of the substrate 10, that is, the substrate 10 can be partially covered by the composite gold layer 100 or completely covered by the composite gold layer 100. It can be understood that, in order to improve the appearance effect, the composite gold layer 100 at least covers the surface of the substrate 10 as the appearance surface. The structural member 200 can be various appearance structural members of electronic devices or devices in other fields, which can be functional members or appearance decoration members. The structural member 200 can be, for example, an electronic device shell, a key, etc., and the composite gold layer 100 at least covers the outer surface of the substrate of the structural member 200. The electronic device shell can be a shell of a 3C product such as a mobile phone, a watch, a bracelet, a tablet computer, etc. Exemplarily, the structural member 200 can be an appearance structural member such as a middle frame, a watchband, a watch ring, a watch buckle, a key, a camera decoration member, etc. of a watch, or an appearance structural member such as a middle frame, a key, a camera decoration member, etc. of a mobile phone or a tablet computer. It can be understood that the structural schematic diagram of the structural member 200 in FIG. 8 does not limit the shape and structure of the structural member 200, and the structural member 200 can be designed into various shapes and sizes according to actual needs.

[0118] Referring to FIG. 9, FIG. 9 is a structural schematic diagram of an electronic device 300 provided by an embodiment of the present application. The electronic device 300 comprises a structural member 200. The electronic device 300 can be, but is not limited to, a 3C product such as a mobile phone, a watch, a bracelet, a tablet computer, etc. The structural member 200 can be various appearance structural members of the electronic device 300, which can be functional members or appearance decorative members. For example, the structural member 200 can be an electronic device shell, a key, etc., and the composite gold layer 100 is at least covered on the outer side surface of the substrate of the structural member 200. For example, the structural member 200 can be an appearance structural member such as a watch middle frame, a watchband, a watch ring, a key, a camera decorative member, etc. in a watch, or an appearance structural member such as a middle frame, a key, a camera decorative member, etc. in a mobile phone or a tablet computer. As shown in the embodiment of FIG. 9, the electronic device 300 is specifically a mobile phone, the structural member 200 is specifically a mobile phone middle frame, and the electronic device 300 further comprises a display screen 301 carried on the structural member 200.

[0119] The composite gold layer 100 of the embodiment of the present application is a wear-resistant gold plating layer, which is formed on the surface of various structural members to make the structural member have a golden appearance and high wear resistance, thereby improving the appearance effect of the structural member, reducing the wear risk of the composite gold layer, and improving the user experience.

[0120] The technical solutions of the present application are further described below in multiple embodiments.

[0121] Embodiment 1

[0122] The preparation of the composite gold layer comprises:

[0123] (1) Substrate pretreatment:

[0124] The 316L stainless steel substrate is cleaned by using a cleaning agent. The specific process of the cleaning treatment is as follows: the substrate is cleaned in an ultrasonic device at 90℃ for 10 min by using 3% concentration of wax removal medicine, then cleaned in an ultrasonic device at 80℃ for 10 min by using 5% concentration of oil removal medicine, and then cleaned in an ultrasonic device at 50℃ for 10 min by using deionized water, and finally baked at 100℃ for 5 min to obtain a pretreated substrate;

[0125] (2) Plasma glow cleaning of the substrate:

[0126] The pretreated 316L stainless steel substrate is placed in a magnetron sputtering device, the device is vacuumized and heated to 200℃, the vacuum degree is 5.0x10 -3 Pa, high-purity argon gas is introduced and the vacuum chamber pressure is adjusted to 1.0 Pa, a pulse negative bias of 600 V is applied, the duty cycle is 60%, and plasma glow cleaning is performed for 10 min;

[0127] (3) Preparation of the metal primer layer:

[0128] The temperature in the device is kept at 200°C, high-purity argon gas is introduced at a flow rate of 60 sccm, the bias voltage is -120 V, the vacuum degree is 1.0 Pa, the deposition power of the Cr target is 1000 W, and the deposition time is 20 min, so that a Cr underlayer with a thickness of 550 nm is deposited on the substrate;

[0129] (4) Preparation of the bottom gold-imitation layer:

[0130] The temperature in the device is kept at 200°C, argon and nitrogen mixed gas is introduced at a total flow rate of 60 sccm, the argon flow rate is 55 sccm, the nitrogen flow rate is 5 sccm, the bias voltage is -100 V, the vacuum degree is 1.0 Pa, the deposition power of the Ti target is 1000 W, and the deposition time is 30 min, so that a titanium nitride gold-imitation layer with a thickness of 800 nm is deposited on the Cr underlayer;

[0131] (5) Preparation of the composite layer stack:

[0132] The temperature in the device is kept at 200°C, high-purity argon gas is introduced at a total flow rate of 60 sccm, the bias voltage is -100 V, the vacuum degree is 1.0 Pa, the deposition power of the gold target is 1200 W, and the deposition time is 1 min, so that an intermediate pure gold layer with a thickness of 20 nm is deposited on the titanium nitride gold-imitation layer; argon and nitrogen mixed gas is introduced at a total flow rate of 60 sccm, the argon flow rate is 55 sccm, the nitrogen flow rate is 5 sccm, the bias voltage is -100 V, the vacuum degree is 1.0 Pa, the deposition power of the Ti target is 1200 W, and the deposition time is 2 min, so that a titanium nitride intermediate gold-imitation layer with a thickness of 40 nm is deposited on the intermediate pure gold layer; the intermediate pure gold layer and the titanium nitride intermediate gold-imitation layer are further deposited alternately in the above manner, so that a composite layer stack with a total number of 30 layers is prepared;

[0133] (6) Preparation of the top mixed gold layer:

[0134] The temperature in the device is kept at 200°C, argon and nitrogen are introduced at a total flow rate of 60 sccm, the argon flow rate is 55 sccm, the nitrogen flow rate is 5 sccm, the bias voltage is -120 V, the vacuum degree is 1.0 Pa, the deposition power of the gold target is 800 W, the deposition power of the Ti target is 1200 W, and the deposition time is 20 min, so that a titanium nitride and gold mixed layer with a thickness of 400 nm and a gold mass percentage of 20% (mass fraction) is deposited on the composite layer stack by mixed sputtering.

[0135] (7) Preparation of the surface gold layer:

[0136] The temperature in the device is kept at 200°C, high-purity argon gas is introduced at a total flow rate of 60 sccm, the bias voltage is -100 V, the vacuum degree is 1.0 Pa, the deposition power of the gold target is 600 W, and the deposition time is 1 min, so that a pure gold layer with a thickness of 6 nm is deposited on the titanium nitride and gold mixed layer.

[0137] The composite layer prepared in Example 1 above was tested by using a micro Vickers hardness tester, and the Vickers hardness was 1000 HV.

[0138] Example 2

[0139] The preparation of the composite layer comprises:

[0140] (1)-(4) are the same as in Example 1;

[0141] (5) Preparation of the composite layer stack:

[0142] The temperature in the device was maintained at 200°C, a total flow of 60 sccm of argon and nitrogen mixed gas was introduced, the argon flow was 55 sccm, the nitrogen flow was 5 sccm, the bias voltage was -100 V, the vacuum degree was 1.0 Pa, the deposition power of the gold target was 800 W, the deposition power of the Ti target was 1000 W, and the deposition time was 2 min. A 50 nm thick titanium nitride and gold mixed layer with a gold mass percentage of 30% (mass fraction) was deposited on the bottom layer of titanium nitride gold-like layer by co-sputtering deposition, i.e. the intermediate mixed gold layer. A total flow of 60 sccm of argon and nitrogen mixed gas was introduced, the argon flow was 55 sccm, the nitrogen flow was 5 sccm, the bias voltage was -100 V, the vacuum degree was 1.0 Pa, the deposition power of the Ti target was 1200 W, and the deposition time was 3 min. A 60 nm thick titanium nitride gold-like layer was deposited on the intermediate mixed gold layer. The titanium nitride and gold mixed layer and the titanium nitride intermediate gold-like layer were further deposited alternately in the above manner to prepare a composite layer stack with a total of 20 layers.

[0143] (6) Preparation of the top mixed gold layer:

[0144] The temperature in the device was maintained at 200°C, a total flow of 60 sccm of argon and nitrogen and acetylene mixed gas was introduced, the argon flow was 50 sccm, the nitrogen flow was 8 sccm, the acetylene flow was 2 sccm, the bias voltage was -120 V, the vacuum degree was 1.0 Pa, the deposition power of the gold target was 800 W, the deposition power of the Ti target was 1200 W, and the deposition time was 30 min. A 600 nm thick titanium carbonitride and gold mixed layer with a gold mass percentage of 20% (mass fraction) was deposited on the composite layer stack by co-sputtering deposition.

[0145] (7) Preparation of the surface gold layer:

[0146] The temperature in the device was maintained at 200°C, a total flow of 60 sccm of high-purity argon was introduced, the bias voltage was -100 V, the vacuum degree was 1.0 Pa, the deposition power of the gold target was 500 W, and the deposition time was 1 min. A 5 nm thick pure gold layer was deposited on the titanium carbonitride and gold mixed layer.

[0147] The composite layer prepared in Example 2 above was subjected to Vickers hardness test using a micro Vickers hardness tester, and the Vickers hardness was 1150 HV.

[0148] Example 3

[0149] The preparation of the composite layer comprises:

[0150] (1) Pretreatment of the substrate:

[0151] The zirconia ceramic substrate and the 316L stainless steel substrate were cleaned using a cleaning agent. The specific process of the cleaning treatment was as follows: the substrates were cleaned in 3% wax removal solution at 90°C for 10 min in an ultrasonic device, then cleaned in 5% oil removal solution at 80°C for 10 min in an ultrasonic device, then cleaned in deionized water at 40°C for 10 min, and finally baked at 120°C for 5 min to obtain the pretreated substrates.

[0152] (2) Plasma glow cleaning of the substrate:

[0153] The pretreated zirconia substrate was placed in a magnetron sputtering device, the device was evacuated and heated to 250°C, the vacuum degree was 5.0x10 -3 Pa, high-purity argon was introduced and the vacuum chamber pressure was adjusted to 1.0 Pa, a pulsed negative bias of 800 V was applied with a duty cycle of 50%, and plasma glow cleaning was performed for 10 min;

[0154] (3) Preparation of the metal primer layer:

[0155] The temperature in the device was maintained at 250°C, high-purity argon was introduced at a flow rate of 60 sccm, the bias voltage was -120 V, the vacuum degree was 1.0 Pa, the Ti target power was 800 W, and the deposition time was 20 min, thereby depositing a Ti primer layer with a thickness of 400 nm on the substrate;

[0156] (4) Preparation of the gold-imitation layer on the primer layer:

[0157] The temperature in the device was maintained at 250°C, a mixture of argon and nitrogen gas was introduced at a total flow rate of 60 sccm, the argon flow rate was 55 sccm and the nitrogen flow rate was 5 sccm, the bias voltage was -120 V, the vacuum degree was 1.0 Pa, the Zr target power was 1000 W, and the deposition time was 40 min, thereby depositing a zirconium nitride gold-imitation layer with a thickness of 1000 nm on the Ti primer layer;

[0158] (5) Preparation of the composite layer:

[0159] The temperature in the device is kept at 250℃, argon and nitrogen and acetylene mixed gas with a total flow of 60sccm is introduced, the flow of argon is 50sccm, the flow of nitrogen is 8sccm, the flow of acetylene is 2sccm, the bias voltage is -120V, the vacuum degree is 1.0Pa, the deposition power of Au target is 1000W, the deposition power of Zr target is 1000W, the deposition time is 2.5min, a layer of zirconium carbonitride and gold mixed layer with a thickness of 70nm and a gold mass percentage of 40%(mass fraction) is deposited on the zirconium nitride gold-like layer, i.e. the middle mixed gold layer; argon and nitrogen and acetylene mixed gas with a total flow of 60sccm is introduced, the flow of argon is 50sccm, the flow of nitrogen is 8sccm, the flow of acetylene is 2sccm, the bias voltage is -100V, the vacuum degree is 1.0Pa, the deposition power of Zr target is 1200W, the deposition time is 4min, a layer of zirconium carbonitride gold-like layer with a thickness of 70nm is deposited on the zirconium carbonitride and gold mixed layer; the zirconium carbonitride and gold mixed layer and the zirconium carbonitride middle gold-like layer are further deposited alternately in the above manner to prepare a composite layer stack with a total number of 8 layers.

[0160] (6) Preparation of the top mixed gold layer:

[0161] The temperature in the device is kept at 250℃, argon and nitrogen and acetylene mixed gas with a total flow of 60sccm is introduced, the flow of argon is 50sccm, the flow of nitrogen is 8sccm, the flow of acetylene is 2sccm, the bias voltage is -120V, the vacuum degree is 1.0Pa, the deposition power of Au target is 1000W, the deposition power of Zr target is 1200W, the deposition time is 40min, a layer of zirconium carbonitride and gold mixed layer with a thickness of 900nm and a gold mass percentage of 30%(mass fraction) is deposited.

[0162] (7) Preparation of the surface gold layer:

[0163] The temperature in the device is kept at 250℃, high-purity argon with a total flow of 60sccm is introduced, the bias voltage is -120V, the vacuum degree is 1.0Pa, the deposition power of Au target is 900W, the deposition time is 1min, a layer of pure gold layer with a thickness of 10nm is deposited on the zirconium carbonitride and gold mixed layer.

[0164] The composite gold layer prepared in Example 3 is subjected to Vickers hardness test by using a micro Vickers hardness tester, and the Vickers hardness is 900HV.

[0165] It should be understood that the first, second and various numerical numbers involved herein are only for the convenience of differentiation, and do not limit the scope of the application.

[0166] In the present application, "and / or" describes the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B can represent the following three cases: A exists alone, A and B exist together, and B exists alone, where A and B can be singular or plural. The character " / " generally represents an "or" relationship between the associated objects before and after it.

[0167] In the present application, "at least one" means one or more, and "multiple" means two or more. "At least one of the following" or the like means any combination of these items, including any combination of single or multiple items. For example, "at least one of a, b, or c", or "at least one of a, b, and c", can represent a, b, c, a-b (i.e., a and b), a-c, b-c, or a-b-c, where a, b, and c can be single or multiple.

[0168] In the present application, "-" represents a range value, including both end point values, for example, the value of a can be 0.5-15, which means that the value of a can be between 0.5 and 15, and includes the end point values 0.5 and 15.

[0169] It should be understood that in various embodiments of the present application, the size of the sequence number of the above-mentioned processes does not mean the order of execution, and part or all of the steps can be executed in parallel or in sequence. The execution order of each process should be determined according to its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

Claims

1. A composite layer, characterized by, The composite gold layer comprises: a metal primer layer disposed on a substrate; a bottom gold-imitating layer disposed on the metal primer layer; a composite layer stack comprising at least three film layers stacked on the bottom gold-imitating layer, the at least three film layers comprising at least two types of intermediate pure gold layer, intermediate gold-imitating layer and intermediate mixed gold layer, and any two adjacent film layers in the composite layer stack being of different types; a top gold layer disposed on the composite layer stack.

2. The composite layer of claim 1, wherein The at least three film layers comprise at least one intermediate pure gold layer and at least one intermediate gold-imitating layer stacked alternately; or comprise at least one intermediate mixed gold layer and at least one intermediate gold-imitating layer stacked alternately; or comprise at least one intermediate pure gold layer and at least one intermediate mixed gold layer stacked alternately; or comprise at least one intermediate pure gold layer, at least one intermediate gold-imitating layer and at least one intermediate mixed gold layer stacked.

3. The composite layer according to claim 1 or 2, characterized in that The composite gold layer further comprises a top mixed gold layer disposed between the composite layer stack and the top gold layer.

4. The composite layer according to any one of claims 1 to 3, characterized in that The film layer of the composite layer stack closest to the substrate and the film layer in contact with the composite layer stack are of different materials; and / or, the film layer of the composite layer stack farthest from the substrate and the film layer in contact with the composite layer stack are of different materials.

5. The composite layer according to any one of claims 1 to 4, wherein The materials of the bottom gold-imitating layer and the intermediate gold-imitating layer comprise gold-imitating ceramic phase materials.

6. The composite layer according to any one of claims 1 to 5, wherein The material of the intermediate mixed gold layer comprises a mixture of gold-imitating ceramic phase materials and pure gold.

7. The composite layer of claim 3, wherein The material of the top mixed gold layer comprises a mixture of gold-imitating ceramic phase materials and pure gold.

8. The composite layer according to any one of claims 4 to 7, wherein The gold-imitating ceramic phase materials comprise one or more of titanium nitride, zirconium nitride, titanium carbonitride and zirconium carbonitride.

9. The composite layer according to any one of claims 1 to 8, wherein In the intermediate mixed gold layer, the mass percentage of gold is 10%-90%.

10. The composite layer according to any one of claims 1 to 9, wherein The thickness of the intermediate gold-imitating layer is 1-200 nm; the thickness of the intermediate mixed gold layer is 1-200 nm; and the thickness of the intermediate pure gold layer is 1-200 nm.

11. The composite layer according to any one of claims 1 to 10, wherein In the composite layer stack, the total number of film layers is 5-50.

12. The composite layer according to any one of claims 1 to 11, wherein The total thickness of the composite layer stack is 200-1000 nm.

13. The composite layer according to any one of claims 1 to 12, wherein The thickness of the bottom gold-imitating layer is 210-2000 nm, and the thickness of the bottom gold-imitating layer is greater than the thickness of the intermediate gold-imitating layer.

14. The composite layer of claim 3, wherein In the top mixed gold layer, the mass percentage of gold is 10%-90%.

15. The composite layer of claim 3, wherein The thickness of the top mixed gold layer is 210-1000 nm.

16. The composite layer of claim 3, wherein From the side close to the substrate to the side far from the substrate, the mass percentage of gold in the top mixed gold layer gradually increases.

17. The composite layer according to any one of claims 1 to 16, wherein The top gold layer is a pure gold layer with a thickness of 1-10 nm.

18. The composite layer according to any one of claims 1 to 17, wherein The material of the metal primer layer comprises one or more of Cr, Ti and Zr; and the thickness of the metal primer layer is 10-800 nm.

19. The composite layer according to any one of claims 1 to 18, wherein The surface hardness of the composite gold layer is greater than or equal to 800 HV.

20. The composite layer according to any one of claims 1 to 19, wherein The substrate comprises one or more of metal, ceramic and polymer material.

21. A structural member, characterized by The structural member comprises a substrate and a composite gold layer disposed on the surface of the substrate, and the composite gold layer comprises the composite gold layer of any one of claims 1-20.

22. An electronic device, comprising: The electronic device comprises the structural member of claim 21.

Images