Method for mechatronically qualifying the optical system of a semiconductor technology installation

Abstract

The invention relates to a method for mechatronically qualifying the optical system (30) of a semiconductor technology (1) installation, wherein the optical system (30) has at least one optical component (32, 34) which can be moved between target positions (46, 52) within a movement region (40); the at least one optical component (32, 34) is moved along at least one possible specified movement path (48) between at least two of the target positions (46, 52) and / or the at least one optical component (32, 34) is held (in a holding position) in the movement region (40) at at least one of the target positions (46, 52); at least one measurement value relating to the movement is detected along the at least one possible specified movement path (46) and recorded and / or the actual position (54) of the at least one optical component (32, 34) is detected and compared with the holding position; and the at least one measurement value and / or the comparison is analyzed with respect to the presence of at least one error of the optical system (30).

Description

[0001] September 9, 2025

[0002] Method for the mechatronic qualification of the optical system of a semiconductor technology system

[0003] Technical field

[0004] The invention relates to a method for the mechatronic qualification of the optical system of a semiconductor technology system. Furthermore, the invention relates to a measuring device for carrying out such a method or an embodiment thereof, as well as a semiconductor technology system with such a measuring device.

[0005] The subject matter of German patent application 102024208866.8 is hereby incorporated by reference.

[0006] background

[0007] Semiconductor technology equipment is a key element in the manufacturing of integrated circuits (ICs) and other microelectronic components. Semiconductor technology equipment, particularly projection exposure systems for microlithography, is used to project microscopic patterns onto semiconductor materials, a crucial step in the semiconductor manufacturing process. Within a projection exposure system, during an exposure process, the image of a photomask is transferred onto a photoresist on a substrate, such as a semiconductor wafer. Subsequently, the exposed areas of the photoresist are either dissolved or the unexposed areas are removed as the photoresist cures under light.

[0008] This creates a lithographic mask that enables further processing through chemical and physical processes, such as introducing material into the open windows or etching recesses beneath them. Thus, within a semiconductor technology system, a structure can be created on an object to be exposed using lithography, particularly microlithography. The photomask structure is typically transferred to the photosensitive photoresist on the object by projection. The resolving power, that is, the ability of the optical system formed by the semiconductor technology system to image the smallest possible structures onto the photoresist, is essentially determined by the wavelength of light used and the system's ability to capture enough diffraction orders of the mask.

[0009] Microlithography refers to the process of transferring micropatterns onto a semiconductor wafer. Projection exposure systems for microlithography typically use ultraviolet or extreme ultraviolet (EUV) radiation to transfer the patterns onto the object being exposed, such as the wafer, via optical lenses or mirrors. EUV lithography can utilize extreme ultraviolet radiation with a wavelength of approximately 13.5 nm. Such short wavelengths enable higher resolution and the fabrication of structures with smaller dimensions. EUV lithography is used in the modern semiconductor industry for the production of advanced integrated circuits (ICs).

[0010] In semiconductor technology systems, particularly in EUV lithography systems and especially in illumination lenses, modules are used that incorporate several active optical components, controlled primarily by actuators such as Lorentz actuators. These optical components include, in particular, mirrors, such as faceted mirrors, and are part of the optical system of the semiconductor technology system. The optical system typically consists of a series of components that use light to create fine patterns on a substrate, such as a wafer to be exposed. Examples of optical components include mirrors, lenses, and a projection system.

[0011] SH / SH 221031WO

[0012] September 9, 2025. The optical components must be positionable within a specified, multidimensional travel path, specifically in six degrees of freedom. These six degrees of freedom comprise three translational and three rotational degrees of freedom. By positioning the optical components, the properties of the optical system, such as the beam path within the semiconductor technology system or the orientation of the pattern generated on the object to be exposed, can be influenced and modified.

[0013] The optical system of a semiconductor technology system typically comprises several hundred optical components, particularly optomechatronic or mechatronic components, which achieve the desired optical effect through precise positioning in multiple degrees of freedom, such as translational and rotational freedom. Optomechatronic components play a central role in processes performed with semiconductor technology systems, especially in lithography, and are crucial for the performance, precision, and reliability of such systems.

[0014] Mechatronic components can, for example, be used for the positioning and movement of optical components within the optical system of a semiconductor technology system and constitute part of an optomechatronic component. Mechatronic components can also be designed as sensor or inspection elements, particularly for verifying the optical system. These sensor or inspection elements can also be part of the optical system.

[0015] The failure of a semiconductor technology system, particularly the optical system, or the presence of faults within the optical system can lead to a loss of quality in the products manufactured using the system, or even to...

[0016] SH / SH 221031WO

[0017] September 9, 2025, could lead to a prolonged plant outage. Enormous costs could result from quality losses or failures.

[0018] Against this background, the technical problem at hand is to provide a method for verifying and ensuring the expected function of a semiconductor technology system, in particular the system's optical system. The optical system can also be referred to as an optomechatronic system.

[0019] The aforementioned technical problem is solved according to a first teaching of the invention by a method for the mechatronic qualification of the optical system of a semiconductor technology system, wherein the optical system comprises at least one optical component that is movable between target positions within a travel range, wherein the at least one optical component is moved along at least one possible predetermined travel path between at least two of the target positions and / or wherein the at least one optical component is held at at least one of the target positions in the travel range (holding position), wherein at least one measured value relating to the travel movement is detected and recorded along the at least one possible predetermined travel path and / or wherein the actual position of the at least one optical component is detected and compared with the holding position.and in which at least one measured value and / or the comparison regarding the presence of at least one defect in the optical system is analyzed.

[0020] The method according to the first teaching of the invention serves the purpose of ensuring that the optical system of a semiconductor technology system functions as expected or of performing maintenance work on the optical system. Furthermore, it enables the optical system to be qualified, and in particular examined for the presence of defects, if a loss of quality is detected in the products manufactured using the semiconductor technology system, especially wafers. Additionally, the optical system can be...

[0021] SH / SH 221031WO

[0022] September 9, 2025. The system will be monitored for the occurrence of errors, and any errors in the optical system can be rectified accordingly. Such a procedure is collectively referred to as the mechatronic qualification of an optical system.

[0023] A fault in the optical system can be a fault in a component of the optical system, for example, an optical component itself, but also in optionally present components such as (position) sensors and / or controllers or actuators, whereby the actuators themselves can also be part of an optical component. Furthermore, a fault in the optical system is also understood to mean the presence of an abnormality in at least one possible predefined travel path.

[0024] The described method can be used in a sequence of various tests for mechatronic qualification, according to the described method or an embodiment thereof. This means that each of the various tests corresponds to the described method or an embodiment thereof. In particular, following the analysis and depending on the result of the analysis, a further test can be selected. This test then involves acquiring further or different measured values, leading to a further analysis until a fault cause can finally be determined.

[0025] The described procedure can therefore comprise a collection of various tests that demonstrate the performance of the optical system's mechatronics and support troubleshooting in the event of problems. Furthermore, these tests can be performed as part of ongoing monitoring to ensure continuous monitoring of the optical system's performance throughout its lifespan and to improve it through preventative maintenance. The tests also enable the calibration of mechatronic components, such as a position controller, or the travel range of the optical system's mechatronic components.

[0026] SH / SH 221031WO

[0027] September 9, 2025 The travel range can be divided into two areas in particular: the regular area and the endstop-restricted area.

[0028] Within the normal operating range, the at least one optical component can move to any predefined position (target position), including necessary tolerances, for example, by means of internal actuators. Actuators can be provided for this purpose to move the at least one optical component. For the economical operation of the semiconductor technology system, it is crucial that positioning within the normal operating range is performed with high accuracy and that a moved position is maintained with even higher accuracy. Furthermore, it is essential that the movements are completed within a predetermined time.

[0029] The endstop-limited area is preferably defined by mechanical stops, also called endstops, which, for example, restrict excessively long travel movements. The endstop-limited area thus extends beyond the regular area; in particular, it surrounds the regular area. The purpose of the endstop-limited area is to prevent at least one optical component from colliding uncontrollably with a boundary, such as another component of the optical system or a component of the semiconductor technology equipment, and thereby being damaged. Such a collision could be caused, for example, by mechatronic instability, operator error, or vibration during transport of the optical system, such as the lighting system of a lithography system. The endstop-limited area therefore defines the maximum possible travel distances.

[0030] Preferably, the rest position or zero position of the at least one optical component is chosen such that it lies essentially in the middle of the travel range, in particular the regular range. The rest position or zero position is the

[0031] SH / SH 221031WO

[0032] September 9, 2025 Position of the optical component it assumes when no special orientation or positioning of the optical component is required.

[0033] The at least one optical component can consist of several subcomponents, in particular mechatronic subcomponents, which can be positioned precisely. For example, the at least one optical component can be a faceted mirror having several facets or reflective surfaces, each of which can be individually adjusted by means of actuators in several degrees of freedom to achieve the desired optical effect of the at least one optical component. Accordingly, a single facet can represent a subcomponent. Within the scope of the invention, the at least one optical component can also represent a subcomponent, in particular a single facet of a faceted mirror.

[0034] If at least one optical component is held in at least one holding position, its movement in that position can be analyzed, particularly if the control loop is optionally deactivated. For example, the holding position could be the rest position or zero position. In this way, in a self-stabilizing spring-mass system, where the at least one optical component is preferably mounted in a spring-loaded support frame, the rest position can be determined by reading the actual position of the optical component without applying an external force, such as via actuators. A comparison with the expected rest position can reveal whether a damaged spring or stiffness, an integration error, or a faulty position sensor is responsible for determining the position of the at least one optical component.

[0035] Within the scope of this application, holding the at least one optical component at at least one of the target positions in the travel range (holding position) is understood to mean that the at least one optical component

[0036] SH / SH 221031WO

[0037] The device is to be held at the specified target position as the holding position until September 9, 2025. Therefore, the (recorded) actual position of at least one optical component may deviate from the holding position, particularly at least temporarily.

[0038] The aforementioned endstops therefore preferably serve to mechanically limit the travel path of at least one optical component. In normal operation of the semiconductor technology system, such a mechanical limit (endstop) can be in place as an air gap, particularly one mechanically limited, between the at least one optical component and an endstop mounted on the optical component's support frame, also referred to as a mechanical end stop. In the event of a fault, the at least one optical component can then strike the endstop, which can be designed, for example, by selecting suitable materials, so that the impact of the optical component does not cause any damage to the optical component. However, the full travel path can typically only be utilized with a predetermined minimum force if the air gap is free of particles.

[0039] Despite various measures taken in semiconductor technology systems to prevent contamination, particles can still occasionally enter an air gap. Another scenario in which the full travel distance is not available is a defective coating on the air gap side of the optical component or the endstop. For example, an endstop might exhibit flaking, inclusions, or inhomogeneities. Furthermore, the full travel distance may also be unavailable if the endstop was incorrectly mounted relative to the optical component.

[0040] Within the scope of this application, a "travel path" is understood to be a sequence of target positions of the at least one optical component. An "abnormality" is understood to be a structural cause that results in the at least one optical component not moving, at least partially, along the travel path.

[0041] SH / SH 221031WO

[0042] September 9, 2025 travel path can be traversed (i.e., its target position deviates from its 1st position by a predefined value) or the travel path can only be traversed with an increased force (e.g., impermissible for thermodynamic reasons) (i.e., the target force deviates from the 1st force by a predefined value).

[0043] The abnormality could, for example, consist of a particle in the air gap. This particle could be either hard or soft.

[0044] A hard particle can cause a failure if its size can no longer be compensated for by a (soft) coating, for example in the form of an elastomer, on the optical component or the endstop. A soft particle can cause a failure if, in particular, no (soft) coating is provided on the optical component or the endstop.

[0045] In the context of this application, the term "movement" of the optical component refers to a change in the actual position of the optical component, particularly between predetermined target positions. This change in position is preferably described by translational and / or rotational vectors (up to six degrees of freedom) and is preferably obtained by comparing two actual positions of the optical component at different times.

[0046] The term "detection of the optical component's movement" refers to the direct or indirect sensory detection of the optical component's movement, for example, by means of a sensor component within the semiconductor technology system, particularly the optical system, or by means of external sensors. The movement is detected by recording the actual position of the optical component at at least two different points in time.

[0047] At least one fault in the optical system could, for example, be due to insufficient positioning and / or alignment of sensors, actuators, or mechanical limits (endstops), especially in relation to each other.

[0048] SH / SH 221031WO

[0049] September 9, 2025. The functionality of sensors, i.e., sensor components such as sensors, or of one or more actuators, can also be faulty. For example, a reference measuring rod in a sensor might be damaged, or a local disturbance, such as a metallic particle, could negatively affect the signal of an eddy current sensor.

[0050] The components of the optical system, in particular the at least one optical component, are preferably moved within the travel range by means of at least one actuator. Such an actuator makes it possible to precisely control the position of the optical component and to adjust its orientation and positioning in real time. Examples of typically used actuator types are piezoelectric, electromagnetic, pneumatic, or hydraulic actuators.

[0051] In particular, a control loop can be used for the operation of at least one optical component within the traversing area. This is a system that serves to achieve and maintain the desired traversing motion, for example by means of an actuator, and compares the actual traversing motion (actual positions of the optical components) with the desired target positions and makes appropriate adjustments. Such a control loop can, for example, be part of the semiconductor technology system, especially the optical system.

[0052] Such a control loop preferably consists first of a measuring device or sensor for acquiring information about the actual movement. Furthermore, a controller is preferably provided, which serves to interpret the measured data and to make decisions on how the movement should be adjusted to reach the target position(s). For example, a simple proportional-integral-differential (PID) controller or a more complex control system based on specific algorithms can be used.

[0053] SH / SH 221031WO

[0054] September 9, 2025. Furthermore, the aforementioned control loop can include an actuator as a component that performs the actual adjustments to the movement. The actuator can be, for example, a motor, a hydraulic or pneumatic actuator, or a piezoelectric actuator that generates the necessary forces or movements to move the optical component. The actuator can be part of an optical component of the optical system. Additionally, the control loop can include a feedback loop that enables, in particular continuous, communication between the sensor, the controller, and the actuator by transmitting measured data to the controller. In this way, the movement of the optical component can be constantly monitored and adjusted to ensure that the target positions are reached.

[0055] During the recording of at least one measured value relating to the movement, for example, the actual position of the optical component, and in particular the temporal evolution of the actual position, the recorded measurement data are preferably initially acquired as raw data. More preferably, the raw data are then processed within the subsequent analysis into evaluated data or evaluation data with an evaluation result. Optionally, additional calibration data is available or is acquired with respect to the optical system, in particular the optical component and / or optionally available position sensors for acquiring the actual position of the optical component. This calibration data can be included in the aforementioned analysis and thus contribute to a more precise evaluation result.

[0056] In the aforementioned method or embodiments thereof, different measured values, for example, at least one measured value relating to the traversing movement, can be recorded as required after and / or during a traversing movement. Furthermore, it is possible to parallelize measurement sequences, i.e., to execute the aforementioned process steps of the described method or embodiments thereof simultaneously, in particular to traverse several optical components of the optical system simultaneously.

[0057] SH / SH 221031WO

[0058] Measurements are to be carried out accordingly on September 9, 2025. In particular, the steps according to the procedure can be combined with the steps of possible embodiments, especially in parallel.

[0059] The aforementioned technical problem is further solved according to the invention by a measuring device for carrying out a method according to the first teaching of the invention or each embodiment thereof, comprising an actuator for moving the at least one optical component within the travel range, a sensor component for detecting a movement of the at least one optical component (detecting the actual position) and / or a force acting on the at least one optical component, and a computer unit for analyzing the at least one measured value with regard to the presence of at least one error of the optical system or for comparison with regard to the presence of at least one error of the optical system.

[0060] The phrase "measuring device has an actuator" means that the measuring device can have at least one actuator, preferably several actuators, for example, for moving an optical component in different directions (e.g., the x and y directions of a Cartesian coordinate system). Similarly, at least one sensor component, preferably several sensor components, can be present. The computing unit is also preferably configured to analyze multiple measured values; for example, a measured value for each degree of freedom of the optical component can be analyzed and previously acquired by the measuring device, in particular the (at least one) sensor component, by detecting a movement of the at least one optical component.

[0061] Furthermore, the aforementioned technical problem is also solved according to the invention by a semiconductor technology system with the previously described measuring device or an embodiment thereof.

[0062] SH / SH 221031WO

[0063] September 9, 2025 The advantages and technical effects mentioned for the method according to the invention also result accordingly for the aforementioned measuring device and for the aforementioned semiconductor technology system with the measuring device described above.

[0064] The following describes further preferred embodiments of the method for the mechatronic qualification of the optical system of a semiconductor technology system, whereby the various embodiments can be combined with one another. In particular, the embodiments of the method described below are also to be understood as embodiments of the measuring device, and the design elements used in the method described below are also to be understood as exemplary embodiments of the measuring device.

[0065] According to one embodiment of the method, the steps of the described method are carried out sequentially or in parallel.

[0066] According to a further embodiment of the method, the stability of the actual position of the at least one optical component at the holding position is determined from the comparison. In particular, the method comprises holding the at least one optical component at at least one of the target positions in the travel range (holding position), detecting the actual position of the at least one optical component, comparing the actual position with the holding position, and analyzing the comparison with regard to the presence of at least one fault in the optical system. From this comparison, the stability of the actual position of the at least one optical component at the holding position, i.e., how stable the at least one optical component is at the holding position, can be determined. For example, the optical component is held at the holding position after reaching it.The position should be maintained at this point, whereby the actual position may deviate from the target position (corresponding to the holding position), at least temporarily. This is determined by comparing the (at least temporarily changing) actual position with the target position.

[0067] SH / SH 221031WO

[0068] September 9, 2025 Holding position: the position stability, i.e., the stability of the actual position, can be determined.

[0069] According to a further embodiment of the method, the force applied for the movement along the at least one possible predetermined travel path is recorded as the at least one measured value relating to the traversing movement, and a force-displacement characteristic curve is recorded, and the force-displacement characteristic curve is analyzed with regard to the presence of at least one fault in the optical system.

[0070] In particular, multiple force-displacement curves can be recorded for each possible travel path. Preferably, a possible travel path is first traversed in one direction (outbound path) and then in the opposite direction (return path). By comparing the force-displacement curves for the outbound and return paths, parameters such as hysteresis and remanence can be determined.

[0071] Furthermore, it is possible to select a large number of possible travel paths so that a large portion of the regular travel range, ideally essentially the entire regular travel range, can be traversed and represented by correspondingly recorded force-displacement characteristic curves. This makes it possible to detect position anomalies, such as deviations from an otherwise linear force-displacement behavior, by observing anomalies in the signal of the actual position, corresponding to a distance traveled after a specific travel time, or to detect position anomalies in the speed.

[0072] The detected positional anomalies can provide clues to malfunctions, for example, in an optional control loop used to detect and control the movement. For instance, a local disturbance in a sensor signal might be identified. Furthermore, a damaged sensor within the control loop could be present, such as a sensor with a damaged [missing information - likely a specific component].

[0073] SH / SH 221031WO

[0074] September 9, 2025 Reference rod or a metallic particle that interferes with the signal of a magnetism-based sensor.

[0075] According to a further embodiment of the method, the travel range consists of a regular range within which the at least one optical component can be moved between target positions during normal operation of the semiconductor technology system, and an endstop-limited range which is limited by mechanical stops (endstops) and extends beyond the regular range. At least one possible travel path is specified according to the contour of the regular range and traversed by the at least one optical component in all possible degrees of freedom. The actual positions and the target positions are determined and recorded according to each possible specified travel path and compared with each other. The comparison is then analyzed with regard to the presence of at least one fault in the optical system.

[0076] According to a further embodiment of the method, at least one further possible travel path with a last target position to be approached (target position), which lies outside the regular area and outside the endstop-restricted area in the direction of movement behind an endstop, is specified and traversed by the at least one optical component.

[0077] According to the two embodiments described above, the regular and the endstop-limited area of ​​the travel range can therefore be measured or scanned in different ways.

[0078] The regular range can be checked by traversing its contour in all possible degrees of freedom and recording the control error, i.e., the difference between specified target positions and determined actual positions. Anomalies in the control error can indicate that the regular travel range is being impermissibly restricted. Such an impermissible restriction

[0079] SH / SH 221031WO

[0080] September 9, 2025, for example, could be caused by particles or by a faulty end stop.

[0081] The endstop-constrained area can be probed by moving at least one optical component from the zero position, rest position, or another suitable starting position to target positions beyond the endstops at various possible points. This ensures that endstop contact occurs during a traverse movement. By repeating this process with different directions of movement, the endstop area—the region within which the endstops are located and their positions—can be probed at discrete points along the travel paths and estimated by a model fit. In particular, it is possible to select a multitude of possible travel paths such that a star-shaped probe of the endstop-constrained area can be performed; that is, the optical component is repeatedly moved from the rest position to various target positions beyond different endstops in the direction of movement.

[0082] When probing the endstop area and determining the potential model fit, a characteristic parameter, such as rotation, scaling, shear, and offset in two degrees of freedom, is preferably determined as a characteristic parameter or at least a measured value. These values ​​can serve as indicators of correct system integration, as increased offset values ​​or rotation angles can indicate insufficient positioning of the sensors, actuators, and endstops relative to each other. Furthermore, the correct functioning of the sensors can be verified, for example, starting with a model of perfectly symmetrically produced endstops, by comparing the measured values ​​in all degrees of freedom with the expected model values.

[0083] In a further embodiment of the method, several possible travel paths between the target positions are defined within the travel range.

[0084] SH / SH 221031WO

[0085] On September 9, 2025, if at least one optical component is specified, the at least one optical component is moved along some, preferably all, of the several possible travel paths, and the actual positions and the target positions are determined and recorded according to the respective specified travel path. After reaching the last target position (target position) of a possible travel path, the at least one optical component is stopped for a defined period of time (standstill measurement phase). The following are determined from the comparison of the recorded actual and target positions: the duration of a travel movement on a travel path until a target position is reached, and the distance that the at least one optical component travels beyond a target position, i.e., how far the at least one optical component has traveled beyond a target position."shot out" is, according to the deviation of the actual position from the target position in the direction of the traversing movement, and the stability of the actual position of the at least one optical component on a target position, i.e. how stable the at least one optical component is on the target position, especially within the standstill measurement phase.

[0086] For example, the defined time period for which at least one optical component is stopped after reaching a target position (standstill measurement phase) can be one or more, in particular two or three, seconds.

[0087] According to the embodiment described above, it can be concluded that it is necessary to adjust a potentially existing control loop for position control, in particular to correct the setting of one or more actuators.

[0088] According to a further embodiment of the method, all possible combinations of possible travel paths between the target positions are traversed by the at least one optical component. In this way, for all possible combinations and essentially for the entire travel range,

[0089] SH / SH 221031WO

[0090] September 9, 2025, in particular the regular range, the position control and especially the setting of actuators will be reviewed.

[0091] According to a further embodiment of the method, holding the at least one optical component in the at least one holding position and / or moving the at least one optical component along the at least one possible travel path is carried out by means of a position controller. In this way, holding and / or moving the at least one optical component can be performed with high accuracy and in a measurable manner.

[0092] A position controller is a controller used to control and maintain the position of at least one optical component, typically using a feedback system within a control loop. This system compares the actual position of the at least one optical component with the desired setpoint and, based on this comparison, sends appropriate control commands to the system's actuators to adjust and maintain the position. Examples of position controllers include proportional-integral-differential (PID) controllers, proportional-derivative (PD) controllers, and proportional-integral (PI) controllers.

[0093] When using a position controller, the position controller itself can be checked during the execution of the method or embodiments thereof, for example with regard to its natural frequency or other settings.

[0094] In a further embodiment of the method, the open-loop transfer function and the closed-loop transfer function, in particular of the controlled system controlled by the position controller, are determined for the at least one optical component on the at least one possible travel path. In this way, the dynamic parameters natural frequency, stiffness, and other parameters can be determined, especially at the target positions.

[0095] SH / SH 221031WO

[0096] September 9, 2025: Damping, bandwidth, and other parameters relevant to controller stability will be determined. In particular, these values ​​can be used to adjust and calibrate the position controller's characteristics.

[0097] The closed-loop transfer function of a position controller describes the relationship between the input (reference signal, e.g., target position) and the output (control signal) sent to the actuator to control the position of at least one optical component. The closed-loop transfer function typically considers the internal structure and behavior of the controller, as well as potentially the feedback loop of the controlled system. This allows for the analysis of the controller's behavior, the evaluation of its stability, and, if necessary, its design or adaptation to meet the desired performance requirements.

[0098] The open-loop transfer function describes the relationship between the input and output of a system without any feedback. In other words, the open-loop transfer function shows how the system would behave if no correction or adjustment of the output were made based on the input signal. In a position control system, the open-loop transfer function would describe the direct relationship between the controller's control signal and the system's position, without considering any feedback from a sensor.

[0099] According to another embodiment of the method, a negative result is output if at least one fault in the optical system is present, and / or a positive result is output if no fault in the optical system is present. In this way, the method can easily determine whether the tested semiconductor technology system operates flawlessly within specified tolerances during normal operation (positive result), or whether a fault in the optical system is present (negative result), and whether further steps are necessary.

[0100] SH / SH 221031WO

[0101] September 9, 2025 The described method for the mechatronic qualification of the optical system of a semiconductor technology system, as well as embodiments thereof, can be applied and combined in any order as modular test methods for mechatronic qualification.

[0102] For example, in a possible test procedure, at least one optical component can be moved from a target position to a second target position along a predefined path. The actual position over time, the required travel time, and the overshoot of the optical component beyond the second target position can be determined. The actual position over time can be checked for positional anomalies. After reaching the target position, the positional stability (i.e., the stability of the optical component's position at the target position) can be measured for a predefined period, and the transfer function of the controlled system can be identified.Subsequently, another possible travel path from the second target position to a third target position can be approached, and data can be measured and analyzed according to the previously described procedure.

[0103] In another example of a possible test procedure, at least one optical component can be moved diametrically across the entire travel range, including the endstop-limited area and between target positions that lie beyond the mechanical limits (endstops), and back again. The contact points with the mechanical limits can also be determined in each case to probe the endstop-limited area. Furthermore, the actual position of the optical component during a travel movement, especially its temporal evolution, can be analyzed for positional anomalies, and the following can be determined for each travel movement.

[0104] SH / SH 221031WO

[0105] On September 9, 2025, the force-displacement characteristic curve will be recorded and analyzed with regard to hysteresis and / or remanence.

[0106] Brief description of the drawing

[0107] Exemplary embodiments and variants of the invention are explained in more detail below with reference to the drawings. The aspects of the disclosure can best be understood from the following detailed description in conjunction with the accompanying figures. The figures are schematic and simplified; they show only details to enhance understanding of the claims, while other details are omitted. The same reference numerals are used throughout for identical or corresponding parts. The individual features of each aspect can be combined with any or all features of the other aspects. These and other aspects, features, and / or technical effects are evident from and illustrated in the figures described below.

[0108] Fig. 1 schematically shows a meridional section of a semiconductor technology system for EUV projection lithography,

[0109] Fig. 2 schematically shows an embodiment of an optical system of a semiconductor technology system for EUV projection lithography,

[0110] Fig. 3 schematically shows an example of a travel range according to a first

[0111] Exemplary embodiment of a method for the mechatronic qualification of the optical system of a semiconductor technology system,

[0112] Fig. 4 schematically shows a second embodiment of a method for the mechatronic qualification of the optical system of a semiconductor technology system, and

[0113] SH / SH 221031WO

[0114] September 9, 2025 Fig. 5 schematically shows a third embodiment of a method for the mechatronic qualification of the optical system of a semiconductor technology system.

[0115] In the following description of the various embodiments according to the invention, components and elements with the same function and mode of operation are provided with the same reference numerals, even if the components and elements may differ in their dimensions, shape or condition in the various embodiments.

[0116] The following section describes, with reference to Fig. 1, the essential components of a semiconductor technology system 1 for microlithography. This description of the basic structure of the semiconductor technology system 1 and its components is not intended to be restrictive.

[0117] One embodiment of a lighting system 2 of the semiconductor technology system 1 has, in addition to a light or radiation source 3, a lighting optic 4 for illuminating an object field 5 in an object plane 6. In an alternative embodiment, the light source 3 can also be provided as a separate module from the rest of the lighting system. In this case, the lighting system does not include the light source 3.

[0118] A reticule 7 arranged in the object field 5 is exposed. The reticule 7 is held by a reticule holder 8. The reticule holder 8 can be moved, particularly in one scanning direction, via a reticule displacement drive 9.

[0119] Figure 1 shows a Cartesian xyz coordinate system for illustrative purposes. The x-direction runs perpendicular to the plane of the drawing. The y-direction runs horizontally, and the z-direction runs vertically. The scan direction

[0120] SH / SH 221031WO

[0121] September 9, 2025, runs along the y-direction in Fig. 1. The z-direction runs perpendicular to the object plane 6.

[0122] The semiconductor technology system 1 includes a projection optic 10. The projection optic 10 serves to image the object field 5 into an image field 11 in an image plane 12. The image plane 12 is parallel to the object plane 6. Alternatively, an angle other than 0° between the object plane 6 and the image plane 12 is also possible.

[0123] A structure on the reticulum 7 is imaged onto a photosensitive layer of a wafer 13 located in the image plane 12 within the image field 11. The wafer 13 is held by a wafer holder 14. The wafer holder 14 can be moved, particularly along the y-direction, via a wafer transfer drive 15. The movement of the reticulum 7 via the reticulum transfer drive 9 and of the wafer 13 via the wafer transfer drive 15 can be synchronized.

[0124] Radiation source 3 is an EUV radiation source. Specifically, radiation source 3 emits EUV radiation 16, which is also referred to below as useful radiation, illumination radiation, or illumination light. The useful radiation has a wavelength in the range between 5 nm and 30 nm. Radiation source 3 can be a plasma source, for example, an LPP source (laser-produced plasma) or a DPP source (gas-discharged produced plasma). It can also be a synchrotron-based radiation source. Radiation source 3 can be a free-electron laser (FEL).

[0125] The illumination radiation 16 emanating from the radiation source 3 is focused by a collector 17. The collector 17 can be a collector with one or more ellipsoidal and / or hyperboloid reflective surfaces.

[0126] SH / SH 221031WO

[0127] September 9, 2025. The at least one reflective surface of the collector 17 can be illuminated by the illuminating radiation 16 at grazing incidence (Gl), i.e., with angles of incidence greater than 45°, or at normal incidence (NI), i.e., with angles of incidence less than 45°. The collector 17 can be structured and / or coated, on the one hand to optimize its reflectivity for the useful radiation and, on the other hand, to suppress stray light.

[0128] After the collector 17, the illumination radiation 16 propagates through an intermediate focus in an intermediate focal plane 18. The intermediate focal plane 18 can represent a separation between a radiation source module, comprising the radiation source 3 and the collector 17, and the illumination optics 4.

[0129] The lighting optics 4 comprise a deflecting mirror 19 and, downstream in the beam path, a first faceted mirror 20. The deflecting mirror 19 can be a planar deflecting mirror or, alternatively, a mirror with an effect that influences the beam beyond the pure deflection effect.

[0130] Alternatively or additionally, the deflecting mirror 19 can be designed as a spectral filter that separates a useful wavelength of the illumination radiation 16 from stray light of a different wavelength. If the first faceted mirror 20 is arranged in a plane of the illumination optics 4 that is optically conjugate to the object plane 6 as the field plane, it is also referred to as a field faceted mirror. The first faceted mirror 20 comprises a plurality of individual first facets 21, which are also referred to as field facets in the following. Only a few of these facets 21 are shown in Fig. 1 as examples.

[0131] The first facets 21 can be designed as macroscopic facets, in particular as rectangular facets or as facets with an arcuate or semicircular border contour. The first facets 21 can be designed as planar facets or alternatively as convexly or concavely curved facets.

[0132] SH / SH 221031WO

[0133] September 9, 2025. As is known, for example, from DE 10 2008 009 600 Al, the first facets 21 can themselves each be composed of a plurality of individual mirrors, in particular a plurality of micromirrors. The first facet mirror 20 can in particular be designed as a microelectromechanical system (MEMS system). For details, reference is made to DE 10 2008 009 600 Al.

[0134] Between the collector 17 and the deflecting mirror 19, the illumination radiation 16 runs horizontally, i.e. along the y-direction.

[0135] In the beam path of the illumination optics 4, a second faceted mirror 22 is arranged downstream of the first faceted mirror 20. If the second faceted mirror 22 is arranged in a pupil plane of the illumination optics 4, it is also referred to as a pupil faceted mirror. The second faceted mirror 22 can also be arranged at a distance from a pupil plane of the illumination optics 4. In this case, the combination of the first faceted mirror 20 and the second faceted mirror 22 is also referred to as a specular reflector. Specular reflectors are known from US 2006 / 0132747 A1, EP 1 614008 B1, and US 6,573,978 B1.

[0136] The second facet mirror 22 comprises a plurality of second facets 23. In the case of a pupil facet mirror, the second facets 23 are also referred to as pupil facets.

[0137] The second facets 23 can also be macroscopic facets, which may, for example, have round, rectangular, or hexagonal edges, or alternatively, facets composed of micromirrors. Reference is also made to DE 10 2008009 600 Al in this regard.

[0138] The second facets 23 can have planar or alternatively convex or concave curved reflective surfaces.

[0139] SH / SH 221031WO

[0140] September 9, 2025. The illumination optics 4 thus form a double-faceted system. This basic principle is also known as a honeycomb condenser (Fly's Eye Integrator).

[0141] It can be advantageous not to arrange the second faceted mirror 22 exactly in a plane that is optically conjugate to a pupil plane of the projection optics 10. In particular, the pupil faceted mirror 22 can be arranged tilted relative to a pupil plane of the projection optics 7, as described, for example, in DE 10 2017 220 586 A1.

[0142] With the aid of the second faceted mirror 22, the individual first facets 21 are imaged into the object field 5. The second faceted mirror 22 is the last beam-shaping, or indeed the last, mirror for the illumination radiation 16 in the beam path before the object field 5.

[0143] In another embodiment of the illumination optics 4, not shown, a transmission optic can be arranged in the beam path between the second facet mirror 22 and the object field 5, which contributes in particular to imaging the first facets 21 into the object field 5. The transmission optic can have exactly one mirror, or alternatively two or more mirrors, which are arranged one behind the other in the beam path of the illumination optics 4. The transmission optic can in particular comprise one or two mirrors for normal incidence (Nl mirrors, normal incidence mirrors) and / or one or two mirrors for grazing incidence (Gl mirrors, grazing incidence mirrors).

[0144] In the embodiment shown in Fig. 1, the lighting optics 4 has exactly three mirrors after the collector 17, namely the deflecting mirror 19, the field facet mirror 20 and the pupil facet mirror 22.

[0145] In another embodiment of the lighting optics 4, the deflecting mirror 19 can also be omitted, so that the lighting optics 4 after the collector 17 then consists exactly

[0146] SH / SH 221031WO

[0147] September 9, 2025, can have two mirrors, namely the first faceted mirror 20 and the second faceted mirror 22.

[0148] The mapping of the first facets 21 by means of the second facets 23 or with the second facets 23 and a transmission optic into the object plane 6 is regularly only an approximate mapping.

[0149] The projection optics 10 comprises a plurality of mirrors Mi, which are numbered according to their arrangement in the beam path of the semiconductor technology system 1.

[0150] In the example shown in Fig. 1, the projection optics 10 comprises six mirrors M1 to M6. Alternatives with four, eight, ten, twelve, or any other number of mirrors Mi are also possible. The projection optics 10 is a double-obscured optic. The penultimate mirror M5 and the last mirror M6 each have an aperture for the illumination radiation 16. The projection optics 10 has an image-side numerical aperture, which can be greater than 0.5 and can also be greater than 0.6, for example, 0.7 or 0.75. Furthermore, the numerical aperture can also be below 0.5; in particular, a low numerical aperture is also possible.

[0151] The reflective surfaces of the mirrors Mi can be designed as freeform surfaces without an axis of rotational symmetry. Alternatively, the reflective surfaces of the mirrors Mi can be designed as aspherical surfaces with exactly one axis of rotational symmetry of the reflective surface shape. The mirrors Mi, like the mirrors of the illumination optics 4, can have highly reflective coatings for the illumination radiation 16. These coatings can be designed as multilayer coatings, in particular with alternating layers of molybdenum and silicon.

[0152] SH / SH 221031WO

[0153] September 9, 2025 The projection optics 10 has a large object-image offset in the y-direction between a y-coordinate of a center of the object field 5 and a y-coordinate of the center of the image field 11. This object-image offset in the y-direction can be approximately as large as a z-distance between the object plane 6 and the image plane 12.

[0154] The projection optics 10 can be designed to be anamorphic. In particular, they exhibit different image scales β. x , ßy in the x and y directions. The two image scales ß x , ßy of the projection optics 10 are preferably located at (ß x , ßy) = (+ / - 0.25, / +- 0.125). A positive magnification β indicates a transformation without image inversion. A negative sign for the magnification β indicates a transformation with image inversion.

[0155] The projection optics 10 thus lead to a reduction in the x-direction, that is, in the direction perpendicular to the scan direction, in a ratio of 4:1.

[0156] The projection optics 10 lead to a reduction of 8:1 in the y-direction, that is, in the scan direction.

[0157] Other magnification ratios are also possible. Magnification ratios with the same sign and absolute values ​​in the x and y directions, for example with absolute values ​​of 0.125 or 0.25, are also possible.

[0158] The number of intermediate image planes in the x- and y-directions in the beam path between the object field 5 and the image field 11 can be the same or, depending on the design of the projection optics 10, different. Examples of projection optics with different numbers of such intermediate images in the x- and y-directions are known from US 2018 / 0074303 Al.

[0159] Each of the pupil facets 23 is exactly one of the field facets 21 for forming one illumination channel for illuminating the object field 5.

[0160] SH / SH 221031WO

[0161] Assigned to September 9, 2025. This can result in illumination according to Köhler's principle. The far field is divided into a multitude of object fields 5 using the field facets 21. The field facets 21 generate a plurality of images of the intermediate focus on the pupil facets 23 assigned to each of them.

[0162] The field facets 21 are each superimposed on the reticulum 7 by an associated pupil facet 23 to illuminate the object field 5. The illumination of the object field 5 is particularly homogeneous. It preferably exhibits a uniformity error of less than 2%. Field uniformity can be achieved by superimposing different illumination channels.

[0163] The illumination of the entrance pupil of the projection optics 10 can be geometrically defined by the arrangement of the pupil facets. By selecting the illumination channels, in particular the subset of pupil facets that guide light, the intensity distribution in the entrance pupil of the projection optics 10 can be adjusted. This intensity distribution is also referred to as the illumination setting or illumination pupil filling.

[0164] Another preferred pupil uniformity in the area of ​​defined illuminated sections of an illumination pupil of the illumination optics 4 can be achieved by a redistribution of the illumination channels.

[0165] Further aspects and details of the illumination of the object field 5 and, in particular, the entrance pupil of the projection optics 10 are described below.

[0166] The projection optics 10 can, in particular, have a homocentric entrance pupil. This can be accessible. It can also be inaccessible.

[0167] The entrance pupil of the projection optics 10 cannot be precisely illuminated by the pupil facet mirror 22. When imaging the

[0168] SH / SH 221031WO

[0169] September 9, 2025. In the projection optics 10, which telecentrically images the center of the pupil facet mirror 22 onto the wafer 13, the aperture rays often do not intersect at a single point. However, a surface can be found where the pairwise determined separation of the aperture rays is minimized. This surface represents the entrance pupil or a surface conjugate to it in real space. In particular, this surface exhibits a finite curvature.

[0170] The projection optics 10 may have different entrance pupil positions for the tangential and sagittal beam paths. In this case, an imaging element, in particular an optical component of the transmission optics, should be provided between the second faceted mirror 22 and the reticle 7. This optical element can accommodate the different positions of the tangential and sagittal entrance pupils.

[0171] In the arrangement of the components of the illumination optics 4 shown in Fig. 1, the pupil facet mirror 22 is arranged in a plane conjugate to the entrance pupil of the projection optics 10. The field facet mirror 20 is arranged tilted relative to the object plane 6. The first facet mirror 20 is arranged tilted relative to an arrangement plane defined by the deflecting mirror 19.

[0172] The first faceted mirror 20 is arranged at an angle to an arrangement plane defined by the second faceted mirror 22.

[0173] Fig. 2 schematically shows an embodiment of an optical system 30 of a semiconductor technology system 1 for EUV projection lithography, for example a system 1 according to Fig. 1.

[0174] The optical system 30 has a first optical component 32 and a second optical component 34. Furthermore, the beam path of the light 36 through the optical system 30 is shown. The first optical component 32 has several, in

[0175] SH / SH 221031WO

[0176] September 9, 2025, this example shows four subcomponents 32a-32d. The subcomponents 32a-32d can be positioned independently and precisely by means of actuators as mechatronic subcomponents. For example, the first optical component 32 can be a faceted mirror 22 with individually positionable facets 23 as shown in Fig. 1.

[0177] A method for the mechatronic qualification of an optical system of a semiconductor technology system or an embodiment thereof according to the present application can serve for the mechatronic qualification of the optical system 30 according to Fig. 2.

[0178] Fig. 3 schematically shows an example of a travel range 40 according to a first embodiment of a method for the mechatronic qualification of the optical system 30 of a semiconductor technology system 1.

[0179] In the example shown, the travel range 40 is divided into two areas: the regular area 42 and the endstop-limited area 44.

[0180] Within the regular range 42, at least one optical component 32, 34 can move to any predefined position (target position AG) 46, including necessary tolerances, for example, by means of an internal actuator. Here, the target positions 46 A, B, C, D, E, F, G are shown within the regular range, each serving as the last target positions 46 (goal positions) to be approached along a possible travel path. The connections or trajectories between the target positions 46 (AG) represent possible travel paths 48 within the regular range 42 and thus within the travel range 40.

[0181] The endstop-limited area 44 is preferably limited by mechanical stops (endstops) (not shown), which, for example, restrict an excessively long travel movement and define the outer boundary of the endstop-limited area.

[0182] SH / SH 221031WO

[0183] Define area 44 on September 9, 2025. The endstop-constrained area 44 therefore extends beyond and surrounds the regular area 42, as shown.

[0184] Fig. 4 schematically shows a second embodiment of a method for the mechatronic qualification of the optical system 30 of a semiconductor technology system 1. The diagram 50 according to Fig. 4 represents the time course of a target position 52 and the actual position 54, each in arbitrary units (bU) in one degree of freedom on the y-axis. Time in arbitrary units (bU) is shown on the x-axis. It is shown how an optical component 32, 34 is moved along a predetermined possible travel path 48, whereby a comparison of the target position 52 with the actual position 54 is carried out.

[0185] The time-varying target position 52 is defined by the predetermined possible travel path 48, for example, a travel path between the target positions 46 A- G from Fig. 3. The actual position 54, on the other hand, represents the temporal sequence of actual positions of the at least one optical component 32, 34, measured, for example, with a position sensor, wherein the at least one optical component 32, 34 is moved along the travel path 48 according to the target position 52 by means of actuators.

[0186] In sections 56a and 56b-c at the beginning and end of diagram 50, as specified by the target position 52, no change in position of at least one optical component 32, 34 takes place, so that the target position 52 and the actual position 54 each form a horizontal line over time. In section 58, however, which can also be referred to as the travel time, between sections 56a and 56b-c, the optical component 32, 34 is moved along the travel path 48 according to the target position 52, so that the target position 52 and the actual position 54 change over time.

[0187] The travel time 58 can in turn be divided into two sections 58a, 58b, whereby the first section 58a represents the time span within which a

[0188] SH / SH 221031WO

[0189] On September 9, 2025, a change in the target position 52 occurs. Within the subsequent section 58b, a further change in the actual position 54 is evident, as the optical component 32, 34, after reaching the specified target position 52 at the end of section 58a, overshoots the specified target position 62. This overshoot is indicated by the reference symbol 60 and manifests itself as the graph of the actual position 54 extending beyond the dashed line 62 representing the target position.

[0190] At the end of section 58b, the optical component 32, 34 has reached the target position 54, which corresponds to the target position 62, within a certain positional accuracy. For example, the actuators of the optical component 32, 34 are controlled by a control loop (not shown) which, if the actual position 52 deviates from the target position 54, controls the actuators of the optical component 32, 34 that cause the process accordingly.

[0191] However, the optical component 32, 34 does not usually come to an instantaneous standstill after reaching the target position 62, but continues to move or "oscillate" to a certain minor degree, corresponding to the required positional accuracy, around the target position 62 as its new resting position. The time period during which the optical component 32, 34 oscillates around the target position 62 is described in section 56b. Finally, in section 56c, the standstill phase or standstill measurement phase occurs, the time period during which the optical component 32, 34 is finally stationary at the target position 62, particularly within a tolerance range, and during which, for example, measurements can be taken at the target position 62.

[0192] Based on diagram 50, and in particular by comparing the target position 52 with the actual position 54 or their temporal progressions, the following can be determined: the duration of a movement along a travel path 48 until the target position 62 is reached (end of section 58, 58a), in particular finally reached (end of section 58b), the distance 60 (also called "overshoot"), which at least

[0193] SH / SH 221031WO

[0194] September 9, 2025, an optical component 32, 34 is moved beyond a target position 62, i.e., how far the at least one optical component has moved or “shot out” beyond a target position, in particular as a deviation of the actual position 54 from the target position 52 corresponding to the target position 62 on the travel path 48 in the direction of the travel movement, and the stability of the actual position 54 of the at least one optical component 32, 34 at a target position 62 (section 56b), i.e., how stable the at least one optical component 32, 34 is at the target position 62, in particular within the “shrinkage phase” 56b or within the standstill measurement phase 56c.

[0195] This determination can be carried out for several, in particular preferably all, possible travel paths 48 within the travel range 40.

[0196] Finally, Fig. 5 schematically shows a third embodiment of a method for the mechatronic qualification of the optical system 30 of a semiconductor technology system 1.

[0197] The diagram shown is an exemplary flowchart 70 of a procedure for the mechatronic qualification of the optical system 30 of a semiconductor technology system 1, which can also be described as a modular test procedure for the purpose of troubleshooting and fault correction.

[0198] In step 72, a fault in the semiconductor technology 1 system is initially reported, whereupon a procedure for the mechatronic qualification of the optical system 30 is started. Subsequently, in step 74, a test is carried out according to a method according to the first teaching of the invention or an embodiment thereof, and an analysis is performed with regard to the presence of at least one fault in the optical system 30, for example, an optical component or a sensor such as a position sensor.

[0199] SH / SH 221031WO

[0200] September 9, 2025. As illustrated by reference numeral 76, the analysis described above reveals, for example, a specific set of symptoms (represented by the path branching off from 76, labeled 1). For instance, the analysis might reveal a so-called "drag error" as a control-related parameter in the analyzed data. A "drag error" is an error that occurs when a control system is unable to regulate or maintain the actual value of a measured quantity at the setpoint. In this case, it occurs when the control loop for regulating the actual position of the optical component is unable to regulate or maintain the setpoint. This error typically arises due to inertia or delays in the system and can occur if the control system does not react quickly enough to changes in the system or is not accurate enough to precisely achieve the setpoint.This can have various reasons, including insufficient control parameters, nonlinear effects in the system, or inaccurate sensors.

[0201] In the case of the symptoms referred to in point 1, a further specific test 78, i.e. a method according to the first teaching of the invention for the mechatronic qualification of the optical system 30 or an embodiment thereof, is carried out.

[0202] However, the analysis may also reveal other specific symptoms (represented by the path branching off from 76, designated by number 2); for example, the result of the analysis may be that the data representing the measurement results show an oscillation of the measured actual position 54.

[0203] In the case of the symptoms referred to in point 2, a further specific test 80, i.e. a method according to the first teaching of the invention for the mechatronic qualification of the optical system 30 or an embodiment thereof, which differs in particular from test 78, is carried out.

[0204] SH / SH 221031WO

[0205] September 9, 2025. After conducting tests 78 and 80, the respective analyses 82 and 84 each reveal a specific set of symptoms, again designated by the number 1. In the example shown in Fig. 5, the symptoms resulting from analyses 82 and 84 each point to a specific cause of failure 86 and 88. For example, cause of failure 86 is the presence of a particle, such as dirt, in the mechanics of an actuator of the optical component. In contrast, cause of failure 88 is an oscillation originating within the component itself, such as a faulty sensor.

[0206] As indicated by further branching arrows (see reference numeral 90), other identified symptoms not described in detail may lead to further tests or to other causes of failure. It may also be necessary, particularly depending on the cause of the failure, to issue a service recommendation for the operation of the semiconductor technology system 1, especially its optical system 30.

[0207] The following embodiments are also disclosed:

[0208] 1. A method for the mechatronic qualification of the optical system of a semiconductor technology system, wherein the optical system comprises at least one optical component that is movable between target positions within a travel range, wherein the at least one optical component is moved along at least one possible predetermined travel path between at least two of the target positions and / or wherein the at least one optical component is held at at least one of the target positions in the travel range (holding position), wherein at least one measurement parameter relating to the travel movement is recorded along the at least one possible predetermined travel path.

[0209] SH / SH 221031WO

[0210] September 9, 2025 and is recorded and / or in which the actual position of at least one optical component is recorded and compared with the holding position, and in which the at least one measured value and / or the comparison is analyzed with regard to the presence of at least one fault of the optical system.

[0211] 2. Method according to embodiment 1, in which the force applied for the movement along the at least one possible predetermined travel path is recorded as the at least one measured value relating to the traversing movement and a force-displacement characteristic curve is recorded, and in which the force-displacement characteristic curve is analyzed with regard to the presence of at least one fault of the optical system.

[0212] 3. Method according to embodiment 1 or 2, wherein the travel range consists of a regular range within which the at least one optical component can be moved between target positions in the normal operation of the semiconductor technology system, and an endstop-limited range which is limited by mechanical stops (endstops) and extends beyond the regular range, in which at least one possible travel path is specified according to the contour of the regular range and is traversed by the at least one optical component in all possible degrees of freedom, in which the actual positions and the target positions are determined and recorded and compared with each other according to a possible specified travel path, and in which the comparison is analyzed with regard to the presence of at least one fault in the optical system.

[0213] 4. Method according to embodiment 3,

[0214] SH / SH 221031WO

[0215] September 9, 2025, in which at least one further possible travel path with a final target position (goal position) to be approached, which lies outside the regular range and outside the end-stop-restricted range in the direction of movement behind an end stop, is specified and is traversed by the at least one optical component. Method according to one of embodiments 1 to 4, in which several possible travel paths between the target positions for the at least one optical component are specified within the travel range, in which the at least one optical component is moved along some, preferably all, of the several possible travel paths, and in each case the actual positions and the target positions are determined and recorded according to the respective specified travel path.wherein the at least one optical component is stopped for a defined period of time after reaching the last target position of a possible travel path, and wherein the following are determined from the comparison of the recorded actual positions and target positions: the duration of a travel movement on a travel path until a target position is reached, the distance that the at least one optical component travels beyond a target position, and the stability of the actual position of the at least one component at a target position. Method according to embodiment 5, wherein all possible combinations of possible travel paths between the target positions are traversed by the at least one optical component.

[0216] SH / SH 221031WO

[0217] September 9, 2025 7. Method according to one of embodiments 1 to 6, wherein the holding of the at least one optical component at the at least one holding position and / or the movement of the at least one optical component on the at least one possible travel path is carried out by means of a position controller.

[0218] 8. Method according to embodiment 7, wherein the openloop transfer function and the closeddloop transfer function are determined in the method of moving the at least one optical component on the at least one possible travel path by means of the position controller.

[0219] 9. Measuring device for carrying out a method according to one of embodiments 1 to 8, comprising an actuator for moving the at least one optical component within the travel range, a sensor component for detecting a movement of the at least one optical component (detecting the actual position) and / or a force acting on the at least one optical component, and a computing unit for analyzing the at least one measured value with regard to the presence of at least one fault in the optical system or for comparing the presence of at least one fault in the optical system.

[0220] 10. Semiconductor technology system with a measuring device according to embodiment 9.

[0221] SH / SH 221031WO

[0222] September 9, 2025

Claims

9. September 2025 P a t e n t a n s p r ü c h e 1. Method for the mechatronic qualification of the optical system (30) of a semiconductor technology system (1), wherein the optical system (30) comprises at least one optical component (32, 34) that is movable between target positions (46, 52) within a travel range (40), wherein the at least one optical component (32, 34) is moved along at least one possible predetermined travel path (48) between at least two of the target positions (46, 52), wherein at least one measured value relating to the travel movement is acquired and recorded along the at least one possible predetermined travel path (46), and wherein the at least one measured value is analyzed with regard to the presence of at least one fault of the optical system (30), wherein the travel range (40) consists of a regular range (42) within which the at least one optical component (32,34) between target positions (46) in the normal operation of the semiconductor technology system (1), and an endstop-limited area (44) which is limited by mechanical stops (endstops) and extends beyond the regular area (42), in which at least one possible travel path (48) is specified according to the contour of the regular area (42) and is traversed in all possible degrees of freedom of the at least one optical component (32, 34), in which the actual positions (54) and the target positions (52) are determined and recorded and compared with each other according to a possible specified travel path (48), and, in which the comparison is analyzed with regard to the presence of at least one defect of the optical system (30).

2. Method according to claim 1, wherein the at least one optical component (32, 34) is held at at least one of the target positions (46, 52) in the travel range (40) (holding position), wherein the actual position (54) of the at least one optical component (32, 34) is detected and compared with the holding position, and wherein the comparison is analyzed with regard to the presence of at least one fault of the optical system (30).

3. Method according to claim 2, wherein the stability of the actual position (54) of the at least one optical component (32, 34) on the holding position is determined from the comparison.

4. Method according to one of claims 1 to 3, wherein the force applied for the movement along the at least one possible predetermined travel path (48) is recorded as the at least one measured value relating to the traversing movement and a force-displacement characteristic curve is recorded, and wherein the force-displacement characteristic curve is analyzed with regard to the presence of at least one fault of the optical system (30).

5. Method according to one of claims 1 to 4, in which at least one further possible travel path (48) with a last target position (62) to be approached (target position), which lies outside the regular area (42) and outside the endstop-restricted area (44) in the direction of movement behind an endstop, is specified and from which at least one optical component (32, 34) is traversed. SH / SH 221031WO September 9, 2025 6. A method according to any one of claims 1 to 5, wherein several possible travel paths (48) between the target positions (46) for the at least one optical component (32, 34) are specified within the travel range (40), wherein the at least one optical component (32, 34) is moved along some, preferably all, of the several possible travel paths (48), and the actual positions (54) and the target positions (52) are determined and recorded in each case according to the respective specified travel path (48), wherein the at least one optical component (32, 34) is stopped for a defined period of time after reaching the last target position (62) (target position) of a possible travel path (48), and wherein the following is determined from the comparison of the recorded actual positions (54) and target positions (52): the duration of a travel movement on a travel path (48) until a target position (62) is reached, which Route,which the at least one optical component (32, 34) will move beyond a target position (62), and the stability of the actual position (54) of the at least one component (32, 34) at a target position (62).

7. Method according to claim 6, wherein all possible combinations of possible travel paths (48) between the target positions (52) are traversed by the at least one optical component (32, 34).

8. Method according to any one of claims 2 to 7, wherein the holding of the at least one optical component (32, 34) at the at least one holding position is carried out by means of a position controller. SH / SH 221031WO September 9, 2025 9. Method according to one of claims 1 to 8, wherein the method of the at least one optical component (32, 34) on the at least one possible travel path (48) is carried out by means of a position controller.

10. Method according to claim 9, wherein in the method of determining the openloop transfer function and the closeddloop transfer function of the at least one optical component (32, 34) on the at least one possible travel path (48) by means of the position controller.

11. Method according to any one of claims 1 to 10, wherein a negative result is output if at least one fault of the optical system (30) is present, and / or wherein a positive result is output if no fault of the optical system (30) is present.

12. Measuring device for carrying out a method according to one of claims 1 to 11, comprising an actuator for moving the at least one optical component (32, 34) within the travel range, a sensor component for detecting a force acting on the at least one optical component (32, 34), and a computing unit for analyzing the at least one measured value with regard to the presence of at least one fault in the optical system (30).

13. Measuring device according to claim 12, comprising a sensor component for detecting a movement of the at least one optical component (32, 34) (detecting the actual position (54)), and SH / SH 221031WO September 9, 2025 with a computing unit for analyzing the comparison with regard to the presence of at least one defect in the optical system (30).

14. Semiconductor technology system (1) with a measuring device according to claim 12 or 13. SH / SH 221031WO 9. September 2025

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