Semiconductor module and method for manufacturing semiconductor module

Abstract

A semiconductor module comprises: a semiconductor device in which a semiconductor element is encapsulated; a cooler that is provided on at least one surface of the semiconductor device, and has an inlet and an outlet; a connection member that is connected to the inlet or the outlet of the cooler and forms a connection flow path; a seal member that surrounds the connection flow path and provides a seal between the cooler and the connection member; and a resin member that encapsulates the semiconductor device, the cooler, and the connection member, wherein the connection member is provided with an annular protrusion on the outer periphery of the seal member, said annular protrusion restricting the entry of the resin member by contact with the cooler and being closer to the cooler than the surface on which the seal member is provided.

Description

Semiconductor module, method for manufacturing a semiconductor module

[0001] The present invention relates to a semiconductor module and a method for manufacturing a semiconductor module.

[0002] Heat generation associated with the use of semiconductor elements cannot be avoided, and semiconductor elements with high power consumption require a combination with a heat dissipation mechanism. Patent Document 1 discloses a power conversion device configured by stacking a plurality of semiconductor modules each incorporating a semiconductor element. The semiconductor module includes the semiconductor element, a heat sink thermally connected to the semiconductor element, a sealing portion that seals the semiconductor element and the heat sink with the heat dissipation surface of the heat sink exposed, a wall portion formed around the sealing portion in a direction orthogonal to the normal direction of the heat dissipation surface and protruding in the normal direction from the heat dissipation surface, and a through-flow refrigerant passage formed between the wall portion and the sealing portion. The plurality of semiconductor modules are stacked in the normal direction of the heat dissipation surface, and lid portions covering the openings on the outer side of the wall portion in the stacking direction are provided on the semiconductor modules arranged at both ends in the stacking direction. The semiconductor module and the lid portion together constitute one module laminate as a whole. Between adjacent semiconductor modules and between the lid portion and the semiconductor module, inside the wall portion, a surface-flow refrigerant passage communicating with the through-flow refrigerant passage and extending along the heat dissipation surface is formed. In the module laminate, the semiconductor module and the lid portion position each other in the stacking direction and are held by a guide member that determines the dimension of the module laminate in the stacking direction. Also, between the wall portions of adjacent semiconductor modules and between the lid portion and the wall portion of the semiconductor module, an elastic seal member made of an elastic body for sealing between the two is provided. A power conversion device characterized by these features is disclosed.

[0003] Japanese Unexamined Patent Application Publication No. 2012-016134

[0004] In the invention described in Patent Document 1, there is room for consideration in ensuring the sealing performance by the seal member.

[0005] A semiconductor module according to a first aspect of the present invention comprises a semiconductor device in which semiconductor elements are sealed; a cooler disposed on at least one surface of the semiconductor device and having an inlet and an outlet; a connecting member connected to the inlet or outlet of the cooler to form a connecting channel; a sealing member surrounding the connecting channel and sealing the space between the cooler and the connecting member; and a resin member sealing the semiconductor device, the cooler, and the connecting member, wherein the connecting member is provided with an annular projection on the outer circumference of the sealing member that restricts the intrusion of the resin member by contact with the cooler and is closer to the cooler than the surface on which the sealing member is disposed. A method for manufacturing a semiconductor module according to a second aspect of the present invention comprises a semiconductor device in which semiconductor elements are sealed, a cooler disposed on at least one surface of the semiconductor device and having an inlet and an outlet, a connecting member connected to the inlet or outlet of the cooler to form a connecting channel, a sealing member surrounding the connecting channel and sealing the space between the cooler and the connecting member, and a resin member sealing the semiconductor device, the cooler, and the connecting member, wherein the connecting member is provided with an annular protrusion on the outer circumference of the sealing member that is closer to the cooler than the surface on which the sealing member is disposed, and the method for manufacturing a semiconductor module comprises an arrangement step of arranging the cooler so as to be in contact with the semiconductor device, arranging the connecting member so as to be in contact with the inlet or outlet of the cooler, and arranging the sealing member between the cooler and the connecting member so as to surround the connecting channel, and sealing the semiconductor device, the cooler, and the connecting member with the resin member that seals them.

[0006] According to the present invention, the intrusion of resin components can be prevented, thereby ensuring the sealing performance of the sealing component.

[0007] Circuit diagram of a semiconductor module Perspective view of the semiconductor module Perspective view of the semiconductor module from the opposite perspective to Figure 2 Exploded view of a semiconductor module with the sealing member removed Cross section of Figure 2, V-V section Plan view of a semiconductor module Cross section of Figure 2, VII-VII section Perspective view of a semiconductor module with a cover attached Plan view of a semiconductor module with a cover attached Cross section of a semiconductor module in the second embodiment Cross section of a semiconductor module in the third embodiment Cross section of a semiconductor module in the fourth embodiment Cross section of a semiconductor module in the fifth embodiment Cross section of a semiconductor module in a modified example of the fifth embodiment Cross section of a semiconductor module in the sixth embodiment

[0008] —First Embodiment— The first embodiment of the semiconductor module will be described below with reference to Figures 1 to 9.

[0009] (Circuit Configuration) Figure 1 is a circuit diagram of the semiconductor module 300. The semiconductor module 300 comprises a first semiconductor element 201, a second semiconductor element 202, a third semiconductor element 211, a fourth semiconductor element 212, a fifth semiconductor element 221, and a sixth semiconductor element 222. Each of the first semiconductor element 201, the second semiconductor element 202, the third semiconductor element 211, the fourth semiconductor element 212, the fifth semiconductor element 221, and the sixth semiconductor element 222 is, for example, a field-effect transistor (FET). However, each of the first semiconductor element 201, the second semiconductor element 202, the third semiconductor element 211, the fourth semiconductor element 212, the fifth semiconductor element 221, and the sixth semiconductor element 222 can also be realized as a combination of an insulated gate bipolar transistor (IGBT) and a diode.

[0010] The semiconductor module 300 includes an upper arm 301 and a lower arm 302. The upper arm 301 mainly consists of a first semiconductor element 201, a third semiconductor element 211, and a fifth semiconductor element 221. The upper arm 301 further includes three positive terminals and three signal terminals. Specifically, the upper arm 301 includes a first positive terminal 101, a second positive terminal 111, a third positive terminal 121, a first signal terminal 104, a third signal terminal 114, and a fifth signal terminal 124. The lower arm 302 mainly consists of a second semiconductor element 202, a fourth semiconductor element 212, and a sixth semiconductor element 222. The lower arm 302 further includes three negative terminals and three signal terminals. Specifically, the lower arm 302 includes a first negative terminal 102, a second negative terminal 112, a third negative terminal 122, a second signal terminal 105, a fourth signal terminal 115, and a sixth signal terminal 125. The three positive terminals and three negative terminals mentioned above are connected to capacitors and the like to receive power from outside the semiconductor module 300.

[0011] The first signal terminal 104, the second signal terminal 105, the third signal terminal 114, the fourth signal terminal 115, the fifth signal terminal 124, and the sixth signal terminal 125 are connected to a control board (not shown) to control the switching operation of the semiconductor element. The semiconductor module 300 has three AC terminals, namely the first AC terminal 103, the second AC terminal 113, and the third AC terminal 123.

[0012] The semiconductor module 300 includes three intermediate connection sections: a first intermediate connection section 106, a second intermediate connection section 116, and a third intermediate connection section 126. The first intermediate connection section 106, the second intermediate connection section 116, and the third intermediate connection section 126 electrically connect the upper arm 301 and the lower arm 302. The first intermediate connection section 106 electrically connects the first semiconductor element 201, the second semiconductor element 202, and the first AC terminal 103. The second intermediate connection section 116 electrically connects the third semiconductor element 211, the fourth semiconductor element 212, and the second AC terminal 113. The third intermediate connection section 126 electrically connects the fifth semiconductor element 221, the sixth semiconductor element 222, and the third AC terminal 123. The first AC terminal 103, the second AC terminal 113, and the third AC terminal 123 output current to the outside of the semiconductor module 300, supplying power to, for example, an AC motor.

[0013] (Hardware Configuration) Figure 2 is an external perspective view of the semiconductor module 300. In Figures 2 and beyond, mutually orthogonal XYZ axes are shown together to clarify the correlation between the drawings. The semiconductor module 300 is roughly rectangular in shape with an extent in the XY plane and thickness in the Z axis direction. Each terminal of the semiconductor module 300 protrudes outward from the long side along the Y axis. The semiconductor module 300 is equipped with a sealing member 400. Parts of each terminal are exposed from the sealing member 400. Specifically, the first positive terminal 101, the second positive terminal 111, the third positive terminal 121, the first signal terminal 104, the third signal terminal 114, the fifth signal terminal 124, the first negative terminal 102, the second negative terminal 112, the third negative terminal 122, the second signal terminal 105, the fourth signal terminal 115, the sixth signal terminal 125, the first AC terminal 103, the second AC terminal 113, and a portion of the third AC terminal 123 are exposed from the sealing member 400.

[0014] The semiconductor module 300 includes a plate-shaped first cooler 310 that extends mainly in the XY plane on the Z-axis positive side. The first cooler 310 has a main cooling surface 311 exposed from the sealing member 400. The main cooling surface 311 has a plurality of cooling fins 312, which are projections extending in the Z-axis direction. The cooling fins 312 contact cooling water to cool the heat inside the semiconductor module 300. The first cooler 310 has a first base opening 313 and a second base opening 314, which are openings that penetrate the first cooler 310 in the Z-axis direction. The first base opening 313 and the second base opening 314 penetrate the first cooler 310 and become flow paths for cooling water into the semiconductor module 300. The first cooler 310 has four first cooler mounting holes 315. One first cooler mounting hole 315 is located near each of the four corners of the first cooler 310. The first cooler mounting hole 315 is positioned to penetrate the first cooler 310 and is used as a hole for passing fastening members, which will be described later. The first cooler 310 includes a first through hole 316 and a second through hole 317. The first through hole 316 is positioned near the first base opening 313. The second through hole 317 is positioned near the second base opening 314.

[0015] Figure 3 is an external perspective view of the semiconductor module 300, showing the opposite side from Figure 2, i.e., the Z-axis negative side. The semiconductor module 300 is equipped with a plate-shaped second cooler 320 that mainly extends in the XY plane on the Z-axis negative side. The second cooler 320 has a cooling main surface 321 exposed from the sealing member 400. Multiple cooling fins 322 are installed on the cooling main surface 321. The cooling fins 322 cool the heat inside the semiconductor module 300 by coming into contact with cooling water. The second cooler 320 has a third base opening 323 and a fourth base opening 324, which are openings that penetrate the second cooler 320 in the Z-axis direction.

[0016] The second cooler 320 has four second cooler mounting holes 325. The second cooler mounting holes 325 are located near each of the four corners of the second cooler 320. The second cooler mounting holes 325 are positioned to penetrate the second cooler 320 and are used as holes for fastening members to pass through. The second cooler 320 has a third through hole 326 and a fourth through hole 327. The third through hole 326 is located near the third base opening 323. The fourth through hole 327 is located near the fourth base opening 324.

[0017] Figure 4 is an exploded view of the semiconductor module 300 with the sealing member 400 removed. This exploded view shows the semiconductor device 150 sandwiched between the first cooler 310 and the second cooler 320. The semiconductor module 300 has the semiconductor device 150. The semiconductor device 150 contains the first semiconductor element 201, second semiconductor element 202, third semiconductor element 211, fourth semiconductor element 212, fifth semiconductor element 221, and sixth semiconductor element 222 shown in Figure 1. The semiconductor device 150 includes an internal sealing member 401. The internal sealing member 401 is not an essential component; the semiconductor elements mounted on the semiconductor device 150 may be sealed using the sealing member 400.

[0018] The semiconductor device 150 is positioned and cooled between the first cooler 310 and the second cooler 320. A first connecting member 340 and a second connecting member 350 are positioned at both ends of the semiconductor device 150 in the Y-axis direction. The first connecting member 340 and the second connecting member 350 connect a flow path formed on the Z-axis positive side of the semiconductor device 150 with a flow path formed on the Z-axis negative side of the semiconductor device 150. Hereinafter, the flow path formed inside the first connecting member 340 will be referred to as the "connecting flow path" or "first connecting flow path," and the flow path formed inside the second connecting member 350 will be referred to as the "connecting flow path" or "second connecting flow path." The first connecting member 340 and the second connecting member 350 are positioned together with the semiconductor device 150, sandwiched between the first cooler 310 and the second cooler 320.

[0019] The first connecting member 340 has a first connecting opening 341. Cooling water flows through the first connecting member 340 through the first connecting opening 341. The first connecting member 340 has a first connecting mounting hole 341a that passes through the first connecting member 340. The second connecting member 350 has a second connecting opening 351. Cooling water flows through the second connecting opening 351 that passes through the second connecting member 350. The second connecting member 350 has a second connecting mounting hole 351a that passes through the second connecting member 350.

[0020] The first base opening 313, the first connecting opening 341, and the third base opening 323 are arranged in a continuous Z-axis direction to form a flow path. The second base opening 314, the second connecting opening 351, and the fourth base opening 324 are arranged in a continuous Z-axis direction to form a flow path. Cooling water supplied from the outside is divided and cooled between the first cooler 310 and the second cooler 320. The cooling water supplied from the outside may enter the semiconductor module 300 from the side of the first cooler 310 and exit from the side of the second cooler 320, or the reverse flow may occur. When cooling water is supplied from the side of the second cooler 320, the cooling water is supplied to the first cooler 310 from the third base opening 323 through the first base opening 313, or from the fourth base opening 324 through the second base opening 314.

[0021] The semiconductor module 300 includes a first sealing member 330, a second sealing member 331, a third sealing member 332, and a fourth sealing member 333, which function as cooling water sealing materials. The first sealing member 330 is positioned between the first base opening 313 and the first connecting opening 341. The second sealing member 331 is positioned between the second base opening 314 and the second connecting opening 351. The third sealing member 332 is positioned between the third base opening 323 and the first connecting opening 341. The fourth sealing member 333 is positioned between the fourth base opening 324 and the second connecting opening 351.

[0022] The first sealing member 330, the second sealing member 331, the third sealing member 332, and the fourth sealing member 333 are rubber sheet-type gaskets or liquid gaskets. The first cooler mounting hole 315, the first connecting mounting hole 341a, and the second cooler mounting hole 325 are arranged in a line along the Z-axis direction, and fastening members (not shown) are placed inside them. The first cooler mounting hole 315, the second connecting mounting hole 351a, and the second cooler mounting hole 325 are arranged in a line along the Z-axis direction, and fastening members (not shown) are placed inside them.

[0023] Figure 5 is a V-V cross-sectional view of the semiconductor module 300 shown in Figure 2, showing the vicinity of the end on the negative Y-axis side. The semiconductor module 300 continues to the right side of Figure 5, and in this figure, the right side can be called the "center side" or "inside" of the semiconductor module 300, and the left side can be called the "outer periphery side" or "outside" of the semiconductor module 300. Reference numeral 329 in Figure 5 will be explained later. The first connecting member 340 has a first annular projection 342, a first seal mounting surface 343, a first stepped portion 344, and a first groove portion 345. The first annular projection 342 is in contact with the first cooler 310 and is located on the side of the sealing member 400, in other words, on the negative X-axis side, or outside the semiconductor module 300, compared to the first seal mounting surface 343, the first stepped portion 344, and the first groove portion 345.

[0024] The first annular projection 342 has the function of preventing the sealing member 400 from entering the first stepped portion 344 from the outer circumference during resin molding. Even if the sealing member 400 enters the first stepped portion 344 or the first groove portion 345 to some extent, there is no functional problem as long as a space for air to pass through is secured. In other words, it is not essential that the first annular projection 342 and the first cooler 310 are in complete contact; the gap between the first annular projection 342 and the first cooler 310 should be small enough to prevent the sealing member 400 from entering the first stepped portion 344 from the outer circumference during resin molding.

[0025] The first sealing member 330 is in close contact with the first sealing mounting surface 343 and the first cooler 310, ensuring watertightness. The first groove 345 is located on the negative Z-axis side of the first stepped portion 344, and the distance between the first groove 345 and the first cooler 310 is greater than the distance between the first stepped portion 344 and the first cooler 310. The first groove 345 functions as a buffer when the sealing member 400 penetrates beyond the first annular protrusion 342 or when the first sealing member 330 protrudes, making it easier to contain air and maintain space.

[0026] The first connecting member 340 has a second annular projection 346, a second seal mounting surface 347, a second stepped portion 348, and a second groove portion 349. These correspond to the first annular projection 342, the first seal mounting surface 343, the first stepped portion 344, and the first groove portion 345, and have a symmetrical shape with the X-axis as the line of symmetry. The second connecting member 350, which is located at the Y-axis positive end, has a structure similar to that of the first connecting member 340.

[0027] Figure 6 is a plan view of the semiconductor module 300, showing the vicinity of the end on the negative Y-axis side. The extent of the semiconductor module 300 shown in Figure 6 is substantially the same as that in Figure 5, and Figure 6 can be said to be a view of Figure 5 with a changed viewpoint. In Figure 6, the shape of the first connecting member 340, which is positioned behind the first cooler 310, is shown by a dashed line. The first annular projection 342 is formed on the outer circumference of the first connecting member 340. The first annular projection 342 is installed in a ring shape so as to surround at least the first groove 345, preventing the groove from being filled with resin during resin molding. The first through hole 316 communicates with the first groove 345 and serves as an air passage. Because the semiconductor module 300 is equipped with the first through hole 316, an airtightness test can be performed by applying a predetermined pressure to the flow path of the first base opening 313.

[0028] A third annular projection 342a is formed so as to surround the outer circumference of the first cooler mounting hole 315. As explained with reference to Figure 4, the first cooler mounting hole 315 and the first connecting mounting hole 341a are arranged to be continuous in the Z-axis direction, so it can be said that the third annular projection 342a surrounds the first connecting mounting hole 341a. The region on the Z-axis positive side of the first cooler 310 that overlaps with the third annular projection 342a in the Z-axis direction is called the flat portion 329. The flat portion 329 does not have cooling fins 312 formed on it, and its surface is flat. Therefore, the flat portion 329 can be easily pressed with a mold when resin sealing is performed. Although not shown in Figure 6, the corresponding region on the Z-axis positive side of the first cooler 310 and the Y-axis positive end, and on the Z-axis negative side of the second cooler 320 are similarly called the flat portion 329. The Z-minus side of the first connecting member 340, which is on the opposite side in the Z-axis direction from Figure 6, in other words, the second cooler 320 side of the first connecting member 340, also has the same structure as in Figure 6. Furthermore, the second connecting member 350 also has the same structure as the first connecting member 340.

[0029] Figure 7 is a cross-sectional view taken along line VII-VII of Figure 2, showing the semiconductor module 300 cut along the XZ plane passing through the first cooler mounting hole 315. The first connecting member 340 has a third annular projection 342a and a fourth annular projection 346a. The third annular projection 342a and the fourth annular projection 346a are positioned close to the first connecting mounting hole 341a and surround it. The third annular projection 342a is positioned to contact the first cooler 310 in the Z-axis direction. The third annular projection 342a prevents deformation of the first cooler 310 when the semiconductor module 300 is fixed with the fastening member. The fourth annular projection 346a is positioned to contact the second cooler 320 in the Z-axis direction. The fourth annular projection 346a prevents deformation of the second cooler 320 when the semiconductor module 300 is fixed with the fastening member. The second connecting member 350 has the same structure as the first connecting member 340 shown in Figure 7.

[0030] Figure 8 is a perspective view of the semiconductor module 300 with the cover 500 attached. The cover 500 has a flange portion 501, a fin housing portion 502, and a cover mounting hole 503. The fin housing portion 502 bulges out on the Z-axis positive side and has a space inside for housing the cooling fins 312. The fin housing portion 502, together with the first cooler 310, forms a flow path for the coolant. The flange portion 501 has a cover mounting hole 503, which is a hole that penetrates in the Z-axis direction. The cover mounting hole 503 is positioned to be connected to the first cooler mounting hole 315 of the first cooler 310. Although not shown in Figure 8, fastening members are inserted into the cover mounting hole 503 to fasten the semiconductor module 300 and the cover 500 to a case or the like.

[0031] Figure 9 is a plan view of the semiconductor module 300 with the cover 500 attached. The flange portion 501 is positioned to cover the first through hole 316.

[0032] (Manufacturing Method) The manufacturing method for the semiconductor module 300 will be described. The manufacturing method for the semiconductor module 300 consists of three main steps: the first placement step, the second sealing step, and the third cover attachment step. The outline of the placement step is to place the semiconductor device 150, the first cooler 310, the second cooler 320, the first connecting member 340, and the second connecting member 350, as shown in Figure 4. Specifically, the second cooler 320 is first placed inside the mold, the third sealing member 332 is placed so as to surround the third base opening 323, and the fourth sealing member 333 is placed so as to surround the fourth base opening 324. Next, the first connecting member 340 is placed so as to be in contact with the third sealing member 332, the second connecting member 350 is placed so as to be in contact with the fourth sealing member 333, and the semiconductor device 150 is placed between the first connecting member 340 and the second connecting member 350. Furthermore, the first sealing member 330 is positioned to surround the first connecting opening 341 of the first connecting member 340, and the second sealing member 331 is positioned to surround the second connecting opening 351 of the second connecting member 350. Finally, the first cooler 310 is positioned such that the first sealing member 330 is in contact with the first base opening 313, and the second sealing member 331 is in contact with the second base opening 314.

[0033] In the next sealing step, the flat portion 329 is pressed by a mold to bring the annular protrusions into near-close contact with the cooler, and then sealed with resin. Specifically, by pressing the flat portion 329, the gap between the first annular protrusions 342 and the third annular protrusions 342a and the first cooler 310 is reduced, and the gap between the second annular protrusions 346 and the fourth annular protrusions 346a and the second cooler 320 is reduced. In this sealing step, as shown in Figure 5, the semiconductor device 150, the first cooler 310, the second cooler 320, the first connecting member 340, and the second connecting member 350 are sealed by the sealing member 400 and the internal sealing member 401. Note that the sealing member 400 and the internal sealing member 401 are made of the same material, and are named differently depending on their location for the sake of explanation.

[0034] In this process, the first connecting member 340 and the second connecting member 350 prevent the intrusion of resin as follows. The mechanism for preventing the intrusion of resin is the same at four locations in total, namely the Z-positive side and the Z-negative side of the first connecting member 340 and the second connecting member 350, so here we will explain it using the Z-positive side of the first connecting member 340 as a representative example. In the sealing process, the first connecting member 340 receives molding pressure from the sealing member 400 from the outside of the semiconductor module 300, i.e., the left side in Figure 5, and molding pressure from the internal sealing member 401 from the inside of the semiconductor module 300, i.e., the right side in Figure 5.

[0035] The first annular protrusion 342 has a smaller gap, or in other words, a smaller clearance, with the first cooler 310 compared not only with the first groove 345 but also with the first seal mounting surface 343. Since force is the product of area and pressure, the smaller the gap with the first cooler 310, the smaller the force that causes the sealing member 400 to penetrate into the first connecting member 340 based on the molding pressure, thus preventing the sealing member 400 and the internal sealing member 401 from penetrating. In addition, during the sealing process, the flat portion 329 is pressed by the mold, and the force from the mold also prevents the sealing member 400 and the internal sealing member 401 from penetrating the first connecting member 340.

[0036] In the third cover mounting step, the cover 500 is placed on and fixed to the first cooler 310 and the second cooler 320. This fixing is achieved by placing the fastening members shown in the figures into the cover mounting hole 503, the first cooler mounting hole 315, the second connecting mounting hole 351a, and the second cooler mounting hole 325.

[0037] According to the first embodiment described above, the following effects can be obtained: (1) The semiconductor module 300 is arranged on at least one side of the semiconductor device 150 and includes a first cooler 310 having a first base opening 313 which is an inlet and a second base opening 314 which is an outlet; a first connecting member 340 which is connected to the first base opening 313 of the first cooler 310 to form a connecting channel; a first sealing member 330 which surrounds the connecting channel and seals the space between the first cooler 310 and the first connecting member 340; and a sealing resin 400 which seals the semiconductor device 150, the first cooler 310, and the first connecting member 340. The first connecting member 340 is provided with a first annular projection 342 on the outer circumference of the first sealing member 330, which restricts the intrusion of the sealing resin 400 by contacting the first cooler 310, and is closer to the first cooler 310 than the first seal installation surface 343, which is the surface on which the first sealing member 330 is placed. Therefore, it is possible to prevent the sealing resin 400 from entering the interior of the first connecting member 340 and adversely affecting the first sealing member 330 during the manufacturing of the semiconductor module 300.

[0038] (2) The first connecting member 340 is provided with a first groove 345 between the first sealing member 330 and the first annular projection 342. The first cooler 310 has a first through hole 316 that penetrates the first cooler 310 and communicates with the space in the first groove 345. The first groove 345 is further from the first cooler 310 than the first seal installation surface 343. Therefore, when pressure is applied to the flow path and air or water leaks, the leak can be detected through the through hole.

[0039] (3) The semiconductor module 300 includes a cover 500 that forms a flow path together with the first cooler 310. The cover 500 is attached to the first cooler 310 so as to block the first through hole 316. Therefore, by using the cover 500 to block the first through hole 316, leakage of cooling water can be prevented.

[0040] (4) The first cooler 310 and the cover 500 each have mounting holes for attaching the cover 500 to the first cooler 310 using mounting members. If the cover 500 were positioned to cover the first through hole 316 and avoid the mounting holes, it would be necessary to position the cover 500 to avoid the area in contact with the fastening members, resulting in wasted space. However, as in the configuration of this embodiment, by providing the cover 500 with cover mounting holes 503 and fastening it simultaneously with the first cooler mounting holes 315 of the first cooler 310, a so-called joint fastening structure is adopted, which eliminates wasted space and allows for miniaturization of the semiconductor module 300.

[0041] (5) The surface of the first cooler 310 opposite to the surface facing the first annular projection 342 has a flat portion 329 which is formed flat. Therefore, the flat portion 329 can be used to reliably press the resin during encapsulation.

[0042] (6) The semiconductor module 300 has a first cooler 310 and a second cooler 320. The first cooler 310 is located on the Z-positive side of the first connecting member 340, and the second cooler 320 is located on the Z-negative side of the first connecting member 340. The first connecting member 340 is connected to the first cooler 310 and the second cooler 320 via a first sealing member 330 and a third sealing member 332. The cooling fins 312 of the first cooler 310 and the cooling fins 322 of the second cooler 320 can be formed by forging, for example, and by making them separate components from the first connecting member 340, the molding of the first cooler 310 and the second cooler 320 is facilitated.

[0043] (7) A method for manufacturing the semiconductor module 300 includes an arrangement step of arranging the first cooler 310 in contact with the semiconductor device 150, arranging the first connecting member 340 in contact with the first base opening 313 which is the inlet of the first cooler 310, and arranging the first sealing member 330 between the first cooler 310 and the first connecting member 340 so as to surround the connecting flow path, and a sealing step of sealing the semiconductor device 150, the first cooler 310, and the first connecting member 340 with a resin member that seals them. Therefore, in the sealing step, the first annular projection 342 prevents the intrusion of the sealing member 400, thus preventing adverse effects on the first sealing member 330 which maintains watertightness.

[0044] (8) At least one of the first cooler 310 and the first connecting member 340 is provided with a first groove portion 345 between the seal member and the first annular convex portion 342. The first cooler 310 is formed with a first through hole 316 that penetrates the first cooler 310 and communicates with the space in the groove portion. The first groove portion 345 is farther from the first cooler 310 than the first seal installation surface 343, which is the surface on which the first seal member 330 is disposed.

[0045] (9) The method for manufacturing the semiconductor module 300 includes a cover fixing step of attaching a cover 500 that forms a flow path together with the first cooler 310 to the first cooler 310 after the sealing step. The cover 500 is attached to the first cooler 310 so as to block the first through hole 316.

[0046] (10) The surface of the first cooler 310 opposite to the surface facing the first annular convex portion 342 has a flat flat portion 329. In the sealing step, after reducing the gap between the first annular convex portion 342 and the first cooler 310 by pressing the flat portion 329, it is sealed with the sealing resin 400. Therefore, the gap between the first annular convex portion 342 and the first cooler 310 can be reduced, and the intrusion of the sealing member 400 can be prevented.

[0047] (11) In the arrangement step, the first cooler is arranged on one side of the first connecting member 340, the second cooler 320 is arranged on the other side, which is opposite to the one side of the first connecting member 340, and the first connecting member 340 is connected to the first cooler 310 and the second cooler 320 via the first seal member 330 and the third seal member 332.

[0048] (Modification 1) In the above-described first embodiment, the semiconductor module 300 includes six semiconductor elements. However, the semiconductor module 300 may include at least one semiconductor element, and the number of semiconductor elements included in the semiconductor module 300 is arbitrary.

[0049] —Second Embodiment— Figure 10 is a cross-sectional view of the semiconductor module 300A in the second embodiment, corresponding to Figure 5 in the first embodiment. The semiconductor module 300A comprises a first connecting member 340A, a first sealing member 330A, and a third sealing member 332A. The first sealing member 330A and the third sealing member 332A are rubber O-rings. The first connecting member 340A has a first seal mounting surface 343A on which the first sealing member 330A is installed, and a second seal mounting surface 347A on which the third sealing member 332A is installed. The first seal mounting surface 343A and the second seal mounting surface 347A have a groove shape and accommodate the O-rings, i.e., the first sealing member 330A and the third sealing member 332A.

[0050] Although not shown in Figure 10, the semiconductor device 150 has a second connecting member 350A, a second sealing member 331A, and a fourth sealing member 333A on the opposite side. The second connecting member 350A has the same structure as the first connecting member 340A. The second sealing member 331A and the fourth sealing member 333A have the same structure as the first sealing member 330A and the third sealing member 332A. Regarding the other structures, the semiconductor module 300A has the same structure as the semiconductor module 300, and the same effect is obtained.

[0051] —Third Embodiment— Figure 11 is a cross-sectional view of the semiconductor module 300B in the third embodiment, corresponding to Figure 5 in the first embodiment. The semiconductor module 300B includes a first connecting member 340B. The first connecting member 340B has a first groove 345B and a second groove 349B. The first groove 345B is substantially coplanar with the first seal mounting surface 343. In other words, the distance in the Z-axis direction from the first groove 345B and the first seal mounting surface 343 to the first cooler 310 is substantially the same. The second groove 349B is substantially coplanar with the second seal mounting surface 347. In other words, the distance in the Z-axis direction from the second groove 349B and the second seal mounting surface 347 to the second cooler 320 is substantially the same.

[0052] By making the first groove 345B and the first seal mounting surface 343 substantially the same plane, and the second groove 349B and the second seal mounting surface 347 substantially the same plane, the shape can be simplified and productivity can be improved. Although not shown in the figures, a second connecting member 350B is provided on the opposite side of the semiconductor device 150. The second connecting member 350B has the same structure as the first connecting member 340B. Regarding other structures, the semiconductor module 300A has the same structure as the semiconductor module 300, and the same effects can be obtained.

[0053] —Fourth Embodiment— Figure 12 is a cross-sectional view of the semiconductor module 300C in the fourth embodiment, corresponding to Figure 5 in the first embodiment. The semiconductor module 300C comprises a first connecting member 340C, a first cooler 310C, and a second cooler 320C. The first cooler 310C has a first annular projection 342C. The first annular projection 342C is in contact with the first connecting member 340C. The first cooler 310C has a first groove 345C. The second cooler 320C has a symmetrical shape with respect to the first connecting member 340C.

[0054] The first connecting member 340C has a flat surface on which the surface on which the first sealing member 330 is installed and the surface on which the first annular projection 342 is in contact, and is free of irregularities. The first connecting member 340C also has a flat surface on which the surface on which the third sealing member 332 is installed and the surface on which the second annular projection 346 is in contact, and is free of irregularities. By making a part of the first connecting member 340C flat, the shape can be simplified and productivity can be improved. Although not shown, there is a second connecting member 350C on the opposite side of the semiconductor device 150. The second connecting member 350C has the same structure as the first connecting member 340C. Regarding other structures, the semiconductor module 300C has the same structure as the semiconductor module 300, and the same effects can be obtained.

[0055] —Fifth Embodiment— Figure 13 is a cross-sectional view of the semiconductor module 300D in the fifth embodiment, corresponding to Figure 5 in the first embodiment. The semiconductor module 300D includes a first cooler 310D and a first connecting member 340D. The configuration corresponding to the second cooler 320 in the first embodiment is integrally formed from the same material as the first connecting member 340D. Although not shown, the first cooler 310D and the second cooler 320D have symmetrical shapes with respect to the semiconductor device 150. Regarding other structures, the semiconductor module 300D has the same structure as the semiconductor module 300, and the same effects can be obtained.

[0056] According to the fifth embodiment described above, the following effects can be obtained. (12) At least one of the first cooler 310 and the second cooler 320 is formed integrally with the first connecting member 340. The first connecting member 340D and the second cooler 320D are assembled via the first sealing member 330. Therefore, since there is no need to connect the second cooler 320 and the first connecting member 340D, the third sealing member 332 in the first embodiment can be reduced, and the productivity of the process of installing the sealing member can be improved.

[0057] (Modification of the Fifth Embodiment) Figure 14 is a cross-sectional view of a semiconductor module 300D in a modification of the fifth embodiment. In the fifth embodiment, the first connecting member 340 and the second cooler 320 are integrally formed in the first embodiment. However, the first connecting member 340 in the first embodiment may be divided into two in the Z-axis direction and integrally formed with the first cooler 310 and the second cooler 320, respectively. In Figure 14, for convenience, the integrally formed first cooler 310 and the divided first connecting member 340 is called the first cooler 310D, and the integrally formed divided first connecting member 340 and the second cooler 320 is called the first connecting member 340D. In this modification as well, the same effects and advantages as in the fifth embodiment can be obtained.

[0058] —Sixth Embodiment— Figure 15 is a plan view of the semiconductor module 300E in the sixth embodiment, showing the vicinity of the end on the negative Y-axis side. Figure 14 corresponds to Figure 6 in the first embodiment. The semiconductor module 300E includes a first connecting member 340E. The first connecting member 340E has a third annular projection 342aE. The third annular projection 342aE is provided on the outer circumference of the first connecting mounting hole 341a. The third annular projection 342aE has a first through hole 316E. The first through hole 316E is positioned to provide a notch in the third annular projection 342aE. The first through hole 316E communicates with the first connecting mounting hole 341a and serves as an air passage. The first through hole 316E can be used to perform an airtightness test by applying a predetermined pressure to the flow path portion of the first base opening 313. Therefore, there is no need to provide through holes in the first cooler 310 or the second cooler 320, and productivity can be improved by simplifying the shape.

[0059] Although not shown in the diagram, the first connecting member 340E has a similar shape on the Z-axis minus side, sandwiching the semiconductor device 150. The second connecting member 350E, which is located at the Y-axis plus end of the semiconductor module 300E, also has a similar shape to the first connecting member 340E. Regarding other structural aspects, the semiconductor module 300E has the same structure as the semiconductor module 300, and similar effects and advantages can be obtained.

[0060] The embodiments and modifications described above may be combined in any way. Although various embodiments and modifications have been described above, the present invention is not limited to these. Other embodiments that can be conceivable within the scope of the technical idea of ​​the present invention are also included within the scope of the present invention.

[0061] 310: First cooler 313: First base opening 314: Second base opening 315: First cooler mounting hole 316: First through hole 320: Second cooler 329: Flat section 330: First sealing member 340: First connecting member 341: First connecting opening 341a: First connecting mounting hole 342: First annular projection 343: First seal mounting surface 344: First stepped section 345: First groove section 400: Sealing member 401: Internal sealing member 500: Cover 501: Flange section 503: Cover mounting hole

Claims

A semiconductor device in which semiconductor elements are enclosed, A cooler having an inlet and an outlet is disposed on at least one side of the semiconductor device, A connecting member that connects to the inlet or outlet of the cooler to form a connecting channel, A sealing member that surrounds the connecting channel and seals the space between the cooler and the connecting member, The semiconductor device, the cooler, and the resin member that seals the connecting member are provided. The connecting member is provided with an annular projection on the outer circumference of the sealing member that restricts the intrusion of the resin member by contacting the cooler, and which is closer to the cooler than the surface on which the sealing member is arranged, in a semiconductor module. 　 In the semiconductor module according to claim 1, At least one of the cooler and the connecting member is provided with a groove between the sealing member and the annular projection. The cooler has a through hole formed therein that penetrates the cooler and communicates with the space within the groove. The groove portion is located in a semiconductor module where the distance from the cooler is greater than the distance from the surface on which the sealing member is placed. 　 In the semiconductor module according to claim 2, The system further includes a cover that forms a flow path together with the aforementioned cooler, The cover is attached to the cooler so as to block the through-hole, and is a semiconductor module. 　 In the semiconductor module according to claim 3, A semiconductor module in which the cooler and the cover each have mounting holes for attaching the cover to the cooler by mounting members. 　 In the semiconductor module according to claim 4, A semiconductor module wherein the surface of the cooler opposite to the surface facing the annular protrusion is formed flat. 　 In the semiconductor module according to any one of claims 1 to 5, The cooler comprises a first cooler and a second cooler. The first cooler is arranged on one side of the connecting member. The second cooler is positioned on the other side of the connecting member, which is the opposite side from the one side mentioned above. The connecting member is a semiconductor module connected to the first cooler and the second cooler via the sealing member. 　 In the semiconductor module according to any one of claims 1 to 5, The cooler comprises a first cooler and a second cooler. At least one of the first cooler and the second cooler is formed integrally with the connecting member. A semiconductor module in which the connecting member and the second cooler are assembled via the sealing member. 　 A method for manufacturing a semiconductor module, comprising: a semiconductor device in which semiconductor elements are sealed; a cooler disposed on at least one surface of the semiconductor device and having an inlet and an outlet; a connecting member connected to the inlet or outlet of the cooler to form a connecting channel; a sealing member surrounding the connecting channel and sealing the space between the cooler and the connecting member; and a resin member sealing the semiconductor device, the cooler, and the connecting member, wherein the connecting member is provided with an annular projection on the outer circumference of the sealing member that is closer to the cooler than the surface on which the sealing member is disposed, Arrangement step of arranging the cooler so as to be in contact with the semiconductor device, and arranging the connecting member so as to be in contact with the inlet or outlet of the cooler, and arranging the sealing member between the cooler and the connecting member so as to surround the connecting flow path, A method for manufacturing a semiconductor module, comprising a sealing step of sealing the semiconductor device, the cooler, and the connecting member with a resin member that seals them. 　 In the method for manufacturing a semiconductor module according to claim 8, At least one of the cooler and the connecting member is provided with a groove between the sealing member and the annular projection. The cooler has a through hole formed therein that penetrates the cooler and communicates with the space within the groove. A method for manufacturing a semiconductor module, wherein the groove is located at a greater distance from the cooler than the surface on which the sealing member is placed. 　 In the method for manufacturing a semiconductor module according to claim 8, The process further includes a cover fixing step, in which a cover that forms a flow path together with the cooler is attached to the cooler after the sealing step, A method for manufacturing a semiconductor module, wherein the cover is attached to the cooler so as to block the through-hole. 　 In the method for manufacturing a semiconductor module according to claim 9, The surface of the cooler opposite to the surface facing the annular protrusion has a flat surface. A method for manufacturing a semiconductor module, wherein in the sealing step, the gap between the annular protrusion and the cooler is reduced by pressing the flat portion, and then the module is sealed with the resin member. 　 In the method for manufacturing a semiconductor module according to any one of claims 8 to 11, The cooler includes a first cooler and a second cooler, A method for manufacturing a semiconductor module, wherein in the arrangement step, the first cooler is arranged on one side of the connecting member, the second cooler is arranged on the other side of the connecting member opposite to the first side, and the connecting member is connected to the first cooler and the second cooler via the sealing member. 　 In the method for manufacturing a semiconductor module according to any one of claims 8 to 11, The cooler includes a first cooler and a second cooler, At least one of the first cooler and the second cooler is formed integrally with the connecting member. A method for manufacturing a semiconductor module, wherein the connecting member and the second cooler are assembled via the sealing member.

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