Connector component

Abstract

A connector component (10) according to one embodiment connects an optical component (40), optically coupled to light (H), to an optical IC substrate (20) that has a substrate surface (21) with a component mounted thereon and that emits the light (H) from the substrate surface (21) in a direction intersecting the substrate surface (21). The connector component (10) includes a fixing part (11) to which the optical component (40) is fixed and which contacts the substrate surface (21). The fixing part (11) contains a heat-resistant material that withstands the heat of solder reflow. The fixing part (11) has a hole (11h) for reducing the contact area with respect to the substrate surface (21).

Description

Connector component

[0001] The present disclosure relates to a connector component. This application claims priority based on Japanese Application No. 2024-162423 filed on September 19, 2024, and incorporates all the descriptions set forth in the said Japanese application.

[0002] Patent Document 1 describes an optical communication module. The optical communication module includes a PIC substrate detachable from a PCB substrate, a first connector portion fixed to the PIC substrate, and a second connector portion connected to the first connector portion. The second connector portion is detachable from the first connector portion.

[0003] Patent Document 2 describes a connection structure of an optical fiber, a ferrule, and an adapter. The ferrule holds a ribbon fiber including a plurality of optical fibers. The adapter has an opening into which the ferrule holding the ribbon fiber is inserted. The ferrule has a plurality of lenses for optical coupling of each of the plurality of optical fibers.

[0004] U.S. Patent Application Publication No. 2023 / 0209761 Specification, U.S. Patent Application Publication No. 2017 / 0003456 Specification

[0005] The connector component according to the present disclosure has a substrate surface on which components are mounted, and connects an optical component that optically couples with the light to an optical IC substrate that emits light in a direction intersecting the substrate surface from the substrate surface. The connector component includes a fixing portion to which the optical component is fixed and that contacts the substrate surface. The fixing portion includes a heat-resistant material that withstands the heat of solder reflow. The fixing portion has holes for reducing the contact area with the substrate surface.

[0006] Figure 1 is a perspective view showing an optical IC substrate, connector component, and optical component according to an embodiment. Figure 2 is a perspective view showing an optical IC substrate and connector component according to an embodiment. Figure 3 is a schematic diagram showing the optical IC substrate and connector component in the absence and presence of warping. Figure 4 is a schematic diagram showing the optical coupling of the optical IC substrate and optical component in the absence and presence of warping. Figure 5 is a graph showing an example of the relationship between the radius of curvature of warping and the pitch of the optical fiber array. Figure 6 is a graph showing the relationship between the elastic modulus and thermal expansion coefficient of the connector component when the ratio of the contact area of ​​the connector component to the optical IC substrate is 0.33. Figure 7 is a graph showing the relationship between the elastic modulus and thermal expansion coefficient of the connector component when the ratio of the contact area of ​​the connector component to the optical IC substrate is 0.5. Figure 8 is a graph showing the relationship between the elastic modulus and thermal expansion coefficient of the connector component when the ratio of the contact area of ​​the connector component to the optical IC substrate is 1. Figure 9 is a side view showing a connector component according to an embodiment. Figure 10 is a side view of the connector component according to an embodiment, viewed from a different direction than Figure 9. Figure 11 is a side view showing a clip according to an embodiment. Figure 12 is a perspective view showing an optical component according to an embodiment. Figure 13 is a perspective view showing the optical component of Figure 12 with the lens array removed. Figure 14 is a perspective view showing an optical component according to a modified example. Figure 15 is a side view showing an optical component according to a modified example.

[0007] Optical IC substrates with connector components fixed by adhesive are sent to the assembly process, where solder reflow may be performed. During solder reflow, the optical IC substrate with the connector components mounted is heated to a temperature of around 260°C. At this time, deformation and warping may occur in the optical IC substrate and connector components. Connection loss may occur in the optical connection to the optical IC substrate due to the difference in thermal expansion coefficients between the optical IC substrate and the connector components. Therefore, it is necessary to reduce the connection loss that occurs in the optical connection to the optical IC substrate.

[0008] This disclosure aims to provide a connector component that can reduce connection loss that occurs in optical connections to optical IC substrates.

[0009] According to this disclosure, connection losses occurring in optical connections to optical IC substrates can be reduced.

[0010] The embodiments of this disclosure are described below. (1) A connector component according to one embodiment connects an optical component to an optical IC substrate that has a substrate surface on which a component is mounted and emits light from the substrate surface in a direction intersecting the substrate surface. The connector component includes a fixing portion to which the optical component is fixed and which contacts the substrate surface. The fixing portion contains a heat-resistant material that can withstand the heat of solder reflow. The fixing portion has holes to reduce the contact area with the substrate surface.

[0011] This connector component connects an optical IC substrate, which emits light in a direction intersecting the substrate surface, to an optical component that optically couples with the emitted light. The connector component has a fixing portion to which the optical component is fixed, and the fixing portion is in contact with the substrate surface. The fixing portion contains a heat-resistant material that can withstand the heat of solder reflow, so deformation and warping of the connector component can be reduced even when heated by solder reflow. The fixing portion has a hole, which reduces the contact area of ​​the fixing portion with the substrate surface. Because the contact area of ​​the connector component with the optical IC substrate is reduced, even if the optical IC substrate warps, the effect of that warping on the connector component can be reduced. Therefore, connection loss that occurs in optical connection to the optical IC substrate can be reduced.

[0012] (2) In (1) above, the optical component may be an optical fiber component having a plurality of optical fibers arranged along the substrate surface. In this case, connection loss occurring in the optical connection between the plurality of optical fibers and the optical IC substrate can be reduced.

[0013] (3) In (1) or (2) above, the fixing part may be fixed to the substrate surface with an adhesive. In this case, the connector component is fixed to the optical IC substrate with an adhesive, so the positional accuracy of the connector component with respect to the optical IC substrate can be improved.

[0014] (4) In any of (1) to (3) above, the connector component may be a receptacle. In this case, the optical component can be fixed to the connector component by fitting the optical component into the connector component.

[0015] (5) In (2) above, L [mm] is the distance along the substrate surface of the two optical fibers that are furthest apart from each other among the plurality of optical fibers, z [mm] is the thickness of the connector component in the direction intersecting the substrate surface, E (IC) [GPa] is the elastic modulus of the material constituting the optical IC substrate, E (mat) [GPa] is the elastic modulus of the material constituting the connector component, Δα [ppm / °C] is the difference between the thermal expansion coefficient of the material constituting the optical IC substrate and the thermal expansion coefficient of the material constituting the connector component, ΔT [°C] is the temperature change, and A is the ratio of the area of ​​the connector component in contact with the substrate surface to the area of ​​the outer edge of the part of the connector component that contacts the substrate surface, and the radius of curvature R of the optical IC substrate due to temperature change is expressed as R = |z × E (IC) / (2 × Δα × ΔT × E (mat) × A)|, ΔT = 90, and the change in L ΔL is ΔL = z × L / (2 × R), in which case the change in L ΔL may be 6 [μm] or less.

[0016] (6) In (5) above, the amount of change ΔL may be 4 [μm] or less.

[0017] (7) In (5) above, the amount of change ΔL may be 2 [μm] or less.

[0018] Specific examples of connector components according to the embodiments of this disclosure will be described below with reference to the drawings. The present invention is not limited to these examples, but is intended to be shown in the claims and to include all modifications within the scope equivalent to the claims. In the description of the drawings, the same or corresponding elements are denoted by the same reference numerals, and redundant descriptions are omitted where appropriate. The drawings may be simplified or exaggerated in part for ease of understanding, and dimensional ratios, etc., are not limited to those shown in the drawings.

[0019] Figure 1 is a perspective view showing the connector component 10, optical IC substrate 20, clip 30, and optical component 40 according to this embodiment. Figure 2 is a perspective view showing the connector component 10 and optical IC substrate 20. As shown in Figures 1 and 2, for example, the optical IC substrate 20, connector component 10, clip 30, and optical component 40 are arranged in this order along the first direction D1. In the following description, the direction in which the optical component 40 is provided relative to the connector component 10 may be referred to as up, upper, or upward, and the direction in which the connector component 10 is provided relative to the optical component 40 may be referred to as down, lower, or downward. However, these directions are for the convenience of explanation and do not limit the arrangement position or direction of the components.

[0020] For example, the optical IC substrate 20 is a chip substrate. Specifically, the optical IC substrate 20 is a silicon photonics chip (waveguide chip, SPC) that performs optical H input and output. In this case, the optical IC substrate 20 is made of silicon. The thermal expansion coefficient of silicon is 2.6 (ppm / °C). For example, the difference between the thermal expansion coefficient of the connector component 10 and the thermal expansion coefficient of the optical IC substrate 20 is small. The thermal expansion coefficient will be described in detail later.

[0021] The optical IC substrate 20 has thickness in a first direction D1, for example. The optical IC substrate 20 has a substrate surface 21 that extends in a second direction D2 intersecting the first direction D1, and in a third direction D3 intersecting both the first direction D1 and the second direction D2. The optical IC substrate 20 emits light H from the substrate surface 21 in a direction intersecting the substrate surface 21 (for example, the first direction D1). The substrate surface 21 is rectangular in shape, for example, having a pair of short sides 21b and a pair of long sides 21c. The second direction D2 corresponds to the direction in which the short sides 21b extend, and the third direction D3 corresponds to the direction in which the long sides 21c extend. Connector components 10 are mounted on the substrate surface 21. For example, components 22 are mounted on the substrate surface 21. Component 22 is, for example, an electrical IC.

[0022] The optical component 40 is, for example, an optical fiber component having a plurality of optical fibers 41 arranged along the substrate surface 21. The optical fibers 41 are, for example, single-mode fibers. However, the optical fibers 41 may be multimode fibers or polarization-maintaining fibers. The type of optical fiber 41 is not particularly limited. The optical component 40 has, for example, optical fibers 41 and a support member 42 that supports the optical fibers 41. The plurality of optical fibers 41 are arranged along the second direction D2. For example, the plurality of optical fibers 41 are tapered outside the support member 42. The optical component 40 will be described in detail later.

[0023] The connector component 10 connects an optical component 40 that optically couples with optical H to the optical IC substrate 20. The connector component 10 includes a fixing portion 11 to which the optical component 40 is fixed and which contacts the substrate surface 21. In this embodiment, the fixing portion 11 is rectangular parallelepiped. The length of the fixing portion 11 in the first direction D1 is smaller than the length of the fixing portion 11 in the second direction D2. The length of the fixing portion 11 in the second direction D2 is, for example, smaller than the length of the fixing portion 11 in the third direction D3. The fixing portion 11 has a contact surface 11b that contacts the substrate surface 21, an upper surface 11c that faces away from the contact surface 11b, a pair of first side surfaces 11d that extend in the first direction D1 and the second direction D2, and a pair of second side surfaces 11f that extend in the first direction D1 and the third direction D3. The contact surface 11b and the upper surface 11c each extend in the second direction D2 and the third direction D3.

[0024] The fixing portion 11 has a hole 11h for reducing the contact area with the substrate surface 21. For example, the hole 11h penetrates the fixing portion 11 in a first direction D1. The hole 11h is a hole through which light H passes. For example, a part of an optical component 40 is inserted into the hole 11h. In this case, the connector component 10 is a receptacle having a hole 11h for receiving the optical component 40. As an example, the shape of the hole 11h is a rectangular parallelepiped. For example, the hole 11h extends in a second direction D2 at the center of the third direction D3 of the fixing portion 11. For example, the length of the hole 11h in the second direction D2 is greater than the length of the hole 11h in the first direction D1 and greater than the length of the hole 11h in the third direction D3.

[0025] The area of ​​the contact surface 11b is reduced by the hole 11h. For example, the contact surface 11b is in the shape of a rectangular frame. The ratio of the area of ​​the contact surface 11b (the area of ​​the part that contacts the substrate surface 21) to the area of ​​the outer edge of the contact surface 11b is, for example, 0.9 or less, 0.8 or less, 0.7 or less, 0.6 or less, or 0.5 or less. This ratio may be 0.1 or more, 0.2 or more, 0.3 or more, or 0.4 or more. Hereinafter, this ratio will be referred to as the contact area ratio.

[0026] The connector component 10 is fixed to the substrate surface 21 of the optical IC substrate 20. As shown in Figure 3, the connector component 10 is fixed to the substrate surface 21 by, for example, an adhesive 50. Figure 3 is a schematic diagram showing the connector component 10 fixed to the optical IC substrate 20 by the adhesive 50. For example, solder reflow is performed on the optical IC substrate 20 to which the connector component 10 is fixed. At this time, warping may occur in the optical IC substrate 20 and the connector component 10. Causes of warping include irreversible deformation of the connector component 10 and the optical IC substrate 20 during the reflow process, temperature changes in the operating environment, or curing shrinkage stress of the adhesive 50 during bonding.

[0027] Figure 4 is a schematic diagram showing the optical coupling between the optical IC substrate 20 and the optical component 40 (optical fiber 41). For example, the optical IC substrate 20 has a plurality of optical coupling portions 23 that optically couple with each of the plurality of optical fibers 41. The plurality of optical coupling portions 23 are arranged along the second direction D2. The optical coupling portions 23 are formed, for example, on the substrate surface 21. As an example, the optical coupling portions 23 are grating couplers. Note that the optical coupling portions 23 may be formed inside the optical IC substrate 20 instead of on the substrate surface 21. As shown in Figure 4, if the optical IC substrate 20 warps, compression and tension occur in the optical IC substrate 20, which may cause the positions of the plurality of optical coupling portions 23 to shift. As a result, the optical coupling efficiency between the optical fiber 41 of the optical component 40 and the optical coupling portions 23 of the optical IC substrate 20 may decrease.

[0028] If z is the thickness of the optical IC substrate 20, L is the distance from one of the multiple optical coupling portions 23 located at the end in the second direction D2 to the optical coupling portion 23 located at the end in the direction opposite to the second direction D2, and R is the radius of curvature of the warp that may occur in the optical IC substrate 20, then the change in L ΔL can be approximately calculated by the following equation (1): ΔL = zL / 2R ... (1) For example, if the value of z is 0.5 (mm), the pitch of the optical fiber 41 is 0.25 (mm), and the number of cores of the optical fiber 41 is 12, then the value of L is 2.75 (= 0.25 × 11) (mm). The value of R is positive in the case of a downward convex warp and negative in the case of an upward convex warp. When the value of R is positive, the substrate surface 21 shrinks, and when the value of R is negative, the substrate surface 21 stretches. The degree of warping of the optical IC substrate 20 is measured, for example, by a contact-type measuring instrument or an optical three-dimensional measuring instrument. The measurement of the degree of warping of the optical IC substrate 20 is performed on the back surface of the optical IC substrate 20 (the surface opposite to the substrate surface 21), or in a location on the substrate surface 21 where there are no connector components 10.

[0029] Figure 5 is a graph showing an example of the relationship between the change in position ΔL of the optical coupling portion 23 and the radius of curvature R of the warp. The vertical axis of the graph in Figure 5 represents half of the change in ΔL (ΔL / 2: unit is μm). The horizontal axis of the graph in Figure 5 represents the absolute value of the radius of curvature R of the warp (unit is mm). As shown in Figure 5, it can be seen that the smaller the curvature of the warp and the larger the radius of curvature R of the warp, the smaller the change in position ΔL of the optical coupling portion 23 becomes. The value of ΔL / 2 is, for example, 3 (μm) or less, 2 (μm) or less, or 1 (μm) or less. When the value of ΔL / 2 is 3 (μm) or less, the absolute value of the radius of curvature R of the warp is 114.58 (mm) or more. When the value of ΔL / 2 is 2 (μm) or less, the absolute value of the radius of curvature R of the warp is 171.88 (mm) or more. When the value of ΔL / 2 is 1 (μm) or less, the absolute value of the curvature radius R of the warp is 343.75 (mm) or more. The maximum positional misalignment between the optical fiber 41 and the optical coupling portion 23 that optically couples to the optical fiber 41 is ΔL / 2. If ΔL is large, the optical connection loss between the optical fiber 41 and the optical coupling portion 23 increases. The value of ΔL / 2 may be 3 (μm) or less, 2 (μm) or less, or even 1 (μm) or less.

[0030] If the difference in thermal expansion coefficients between the connector component 10 and the optical IC substrate 20 (silicon) is Δα and the temperature change is ΔT, then the thermal strain ε of the connector component 10 can be calculated by the following equation (2): ε = Δα × ΔT ... (2) As an example, if the temperature changes from 25°C to 115°C, ΔT is 90 (°C). If the elastic modulus of the connector component 10 is E (mat) and the ratio of the contact area of ​​the contact surface 11b is A, then the effective elastic modulus E (eff) of the connector component 10 can be calculated by the following equation (3), and the thermal stress σ of the connector component 10 can be calculated by the following equation (4): E (eff) = E (mat) × A ... (3) σ = εE (eff) ... (4) The radius of curvature R of the warp can be calculated by the following equation (5). R = zE(Si) / 2σ ... (5) As an example, E(Si) is 131 (GPa) and z is 0.5 (mm). The radius of curvature R of the warp is calculated from equations (3), (4) and (5) as shown in equation (6). R = zE(Si) / (2εE(mat)×A) ... (6) From equation (6), when the ratio A of the contact areas of the contact surface 11b and the elastic modulus E(eff) of the connector part 10 are small, the radius of curvature R of the warp becomes large, and the warp (curvature of the warp) can be reduced.

[0031] Tables 1, 2, and 3 show the relationship between the material of the fixing part 11, its thermal expansion coefficient, elastic modulus (Young's modulus), and the radius of curvature R of the warp. Table 1 shows the case where the connector part 10 has a contact area ratio A of 1 (the connector part 10 does not have a hole 11h), Table 2 shows the case where the connector part 10 has a contact area ratio A of 0.5, and Table 3 shows the case where the connector part 10 has a contact area ratio A of 0.33. In Tables 1, 2, and 3, LCP_A represents a liquid crystal polymer containing glass filler, which reduces the thermal expansion coefficient. LCP_B represents a liquid crystal polymer with a lower glass filler content and a higher thermal expansion coefficient than LCP_A.

[0032] The materials listed in Tables 1, 2, and 3 can all be used as materials for the fixing part 11. If the material for the fixing part 11 is a material with a large absolute value of the radius of curvature R of warping, the warping (curvature of warping) of the connector component 10 can be reduced. If the difference between the thermal expansion coefficient of the material of the connector component 10 and the thermal expansion coefficient of silicon is small, the connection loss of optical H can be reduced.

[0033] The fixing part 11 contains a heat-resistant material that can withstand the heat of solder reflow. "Heat of solder reflow" refers to the heat applied to the fixing part during solder reflow. "Heat-resistant" means that it does not irreversibly change even when exposed to heat. "Change" refers to deformation (for example, deformation due to melting). "Heat-resistant material" refers to a material that does not irreversibly change even when exposed to the heat of solder reflow. Because the fixing part 11 contains a heat-resistant material, warping of the fixing part 11 can be reduced.

[0034] If the absolute value of the radius of curvature R of the warp is 114.58 (mm) or more, the value of ΔL / 2 can be made 3 (μm) or less. Therefore, all of the materials listed in Tables 1, 2, and 3 above can be used as materials for the fixing part 11. In this case, the connector part 10 includes at least one of borosilicate glass, Kovar, Invar, LCP_A, LCP_B, SUS304, and SUS430.

[0035] If the absolute value of the radius of curvature R of the warp is 343.75 (mm) or more, the value of ΔL / 2 can be made 1 (μm) or less. Materials for which the absolute value of the radius of curvature R of the warp is 343.85 (mm) or more are all materials in Table 3 (contact area ratio A = 0.33), all materials except SUS304 in Table 2 (contact area ratio A = 0.5), and all materials except SUS304 and SUS430 in Table 1 (contact area ratio A = 1). The smaller the contact area ratio A, the larger the radius of curvature R of the warp can be made, and the more materials can be used as the material for the fixing part 11.

[0036] Figure 6 is a graph showing the relationship between the modulus of elasticity (GPa) and the coefficient of thermal expansion (ppm / °C) when the ratio of contact area A is 0.33. Figure 7 is a graph showing the relationship between the modulus of elasticity (GPa) and the coefficient of thermal expansion (ppm / °C) when the ratio of contact area A is 0.5. Figure 8 is a graph showing the relationship between the modulus of elasticity (GPa) and the coefficient of thermal expansion (ppm / °C) when the ratio of contact area A is 1. In the graphs of Figures 6, 7, and 8, the darkest shaded area shows the range of modulus of elasticity where (ΔL / 2) < 3, the shaded area to the lower left shows the range of modulus of elasticity where (ΔL / 2) < 2, and the white area to the lower left shows the range of modulus of elasticity where (ΔL / 2) < 1. As shown in Figures 6, 7, and 8, the smaller the ratio of contact area A, the wider the range of modulus of elasticity and the range of the coefficient of thermal expansion where (ΔL / 2) < 3 can be.

[0037] Figure 9 is a side view of the connector component 10. Figure 10 is a side view of the connector component 10 viewed from a different direction than that shown in Figure 9. As shown in Figures 1, 9, and 10, the connector component 10 has a hook portion 12 on which the clip 30 hooks. The hook portion 12 protrudes from the fixing portion 11 along a third direction D3. The hook portion 12 protrudes from a first side surface 11d of the fixing portion 11. The first side surface 11d may extend obliquely with respect to the first direction D1. For example, a pair of first side surfaces 11d may extend obliquely with respect to the first direction D1 such that they move closer to each other as they extend downward.

[0038] The connector component 10 has a pair of hooks 12 aligned along a third direction D3. The hooks 12 have a pair of side surfaces 12b aligned along a second direction D2, a pair of lower surfaces 12c aligned along the second direction D2, and a protruding surface 12f extending in the first direction D1 and the second direction D2. The side surfaces 12b extend along the first direction D1 and the third direction D3. For example, the lower end of the side surfaces 12b and the lower end of the protruding surface 12f are rounded 12d.

[0039] For example, the lower surface 12c extends diagonally upward as it moves away from the side surface 12b. When viewed along the third direction D3, the pair of lower surfaces 12c are mountain-shaped. For example, the inclination angle of the lower surface 12c with respect to the second direction D2 is 0.5° or more and 20° or less. The lower surface 12c extends diagonally upward as it moves away from the protruding surface 12f. For example, the inclination angle of the lower surface 12c with respect to the third direction D3 is 0.5° or more and 20° or less. The hook portion 12 has the above shape, making it easier to hook the clip 30 onto the lower surface 12c of the hook portion 12.

[0040] As shown in Figure 2, the fixing part 11 has, for example, guide holes 11j for positioning the optical component 40. The guide holes 11j are, for example, precision holes whose position is adjusted with high precision. When viewed along the first direction D1, the guide holes 11j are circular in shape. The fixing part 11 has a pair of guide holes 11j. The pair of guide holes 11j are aligned along the second direction D2. The distance between the centers of the pair of guide holes 11j and the diameter of the guide holes 11j are adjusted so that the dimensional tolerance is 3 μm or less (or 1 μm or less). The position of the optical component 40 relative to the fixing part 11 is fixed by fitting the guide pins 43 (see Figure 12), which will be described later, of the optical component 40 into the guide holes 11j.

[0041] Figure 11 is a diagram illustrating the clip 30. As shown in Figures 1 and 11, the clip 30 comprises, for example, a base 31 extending in a second direction D2 and a third direction D3, a pair of gripping portions 32 extending upward from each end of the base 31 in the second direction D2, and a clamping portion 33 for gripping the hook portion 12 of the connector component 10. The clip 30 is made of, for example, metal. The clip 30 is manufactured, for example, by sheet metal processing.

[0042] The base 31 is, for example, plate-shaped. The base 31 has a thickness in the first direction D1. The base 31 has a hole 31b through which the optical component 40 passes. The hole 31b penetrates the base 31 in the first direction D1. The hole 31b is, for example, rectangular. The clip 30 has a pair of gripping portions 32. The pair of gripping portions 32 are arranged along the second direction D2. The gripping portion 32 is, for example, plate-shaped. The gripping portion 32 has a thickness in the second direction D2. The pair of gripping portions 32 are, for example, portions that can be gripped by a finger toward the center of the clip 30 in the second direction D2.

[0043] The clip 30 has a pair of clamping portions 33. The pair of clamping portions 33 are arranged along the third direction D3 (a direction perpendicular to the plane of the paper in FIG. 11). The clamping portion 33 has a pair of claws 33b that sandwich the hooking portion 12. The pair of claws 33b are arranged along the second direction D2. The pair of claws 33b open and close by moving along the second direction D2. When the pair of claws 33b are closed, the clamping portion 33 sandwiches the hooking portion 12. When the pair of claws 33b are open, the clamping of the hooking portion 12 by the clamping portion 33 is released.

[0044] The claw 33b protrudes from the base 31 along the third direction D3 and extends downward. The claw 33b has, for example, a curved portion 33c that curves so as to protrude outward in the third direction D3 from the base 31, and a hook-shaped portion 33d that protrudes toward the lower surface 12c of the hooking portion 12 below the curved portion 33c. Since the claw 33b has the curved portion 33c, the claw 33b can be easily bent in the third direction D3. When viewed along the third direction D3, the pair of hook-shaped portions 33d are arranged along the second direction D2. The hook-shaped portion 33d has a protruding portion 33f located below the lower surface 12c of the hooking portion 12. When viewed along the third direction D3, the pair of protruding portions 33f protrude in a direction approaching each other. When the pair of claws 33b are closed, the pair of protruding portions 33f are located below the lower surface 12c. When the pair of claws 33b are open, the pair of protruding portions 33f move from the lower surface 12c toward both ends in the second direction D2.

[0045] In the clip 30, when the pair of gripping portions 32 are gripped toward the center in the second direction D2, the pair of claws 33b interlock and the pair of protruding portions 33f move in a direction away from each other. As a result, the pair of claws 33b are in an open state. Adjust the orientation of the clip 30 with respect to the connector component 10 so that the pair of claws 33b are positioned at both ends in the second direction D2 of the hooking portion 12 in the state where the pair of claws 33b are open, and place the base 31 on a holding portion 42f of the optical component 40 described later.

[0046] When the pair of gripping portions 32 are released, the pair of claws 33b interlock and the pair of protruding portions 33f move in a direction approaching each other and enter under the lower surface 12c of the hooking portion 12. As a result, the clip 30 is in a state of being hooked on the hooking portion 12. The clip 30 can be removed from the connector component 10 by gripping the pair of gripping portions 32 to open the pair of claws 33b and pulling up the clip 30 from the connector component 10.

[0047] FIG. 12 is a perspective view showing the optical component 40. As shown in FIGS. 1 and 12, the optical component 40 includes a plurality of optical fibers 41, a support member 42, and a lens array 44. As an example, the lens array 44 is in the shape of a rectangular parallelepiped. The lens array 44 is fixed to the support member 42. For example, the lens array 44 is fixed to the support member 42 with an adhesive. The lens array 44 enters the hole 11h of the connector component 10. The material of the lens array 44 is, for example, silicon or glass. This glass is, for example, fused silica glass or high refractive index glass.

[0048] The lens array 44 has a plurality of lens portions 44b. At least a portion of the plurality of lens portions 44b are optically coupled to the optical coupling portion 23 of the optical IC substrate 20. For example, a plurality of lens portions 44b are arranged along a second direction D2, and a plurality of lens portions 44b are arranged along a third direction D3. In the lens array 44, the plurality of lens portions 44b are arranged in a two-dimensional array. In this case, the lens portions 44b can be arranged at high density in the lens array 44. The number of lens portions 44b arranged along the second direction D2 is greater than the number of lens portions 44b arranged along the third direction D3. As an example, the number of lens portions 44b arranged along the second direction D2 is 16, and the number of lens portions 44b arranged along the third direction D3 is 3. The lens array 44 may have an anti-reflective coating attached to the lens portions 44b. In this case, reflection of light H at the lens portions 44b can be prevented.

[0049] Figure 13 is a perspective view showing the lens array 44 removed from the optical component 40. As shown in Figures 12 and 13, the support member 42 is an optical fiber array that holds a plurality of arranged optical fibers 41. The support member 42 has, for example, an insertion portion 42b into which the plurality of optical fibers 41 are inserted, and a holding portion 42f that holds the cores of the plurality of optical fibers 41 and exposes the tip surfaces 41b of the optical fibers 41.

[0050] The insertion portion 42b is, for example, shaped like a rectangular parallelepiped. Multiple optical fibers 41 are inserted into the insertion portion 42b from a direction opposite to the first direction D1. For example, the material of the insertion portion 42b is SUS (Steel Use Stainless) or engineering plastic. This engineering plastic is, for example, polyphenylene sulfide (PPS) or liquid crystal polymer (LCP).

[0051] The holding portion 42f is, for example, plate-shaped. The holding portion 42f has thickness in the first direction D1. The holding portion 42f is positioned below the hole 31b of the clip 30 when the optical component 40 and the clip 30 are assembled to the connector component 10 (see Figure 1). The holding portion 42f has an end face 42d into which the tip surface 41b of the optical fiber 41 is exposed, and an optical fiber holding hole 42c for holding the core wire of the optical fiber 41.

[0052] The end face 42d is, for example, rectangular in shape. For example, the length of the end face 42d in the second direction D2 is longer than the length of the end face 42d in the third direction D3. The holding portion 42f has a plurality of optical fiber holding holes 42c. For example, the material of the holding portion 42f is glass or silicon. This glass is, for example, borosilicate glass or fused silica glass. Each of the plurality of optical fiber holding holes 42c is inserted into and held by each of the plurality of optical fiber holding holes 42c. For example, the number and arrangement of the optical fiber holding holes 42c are the same as the number and arrangement of the optical fiber 41.

[0053] For example, at the end face 42d, multiple optical fiber holding holes 42c are arranged along the second direction D2, and multiple optical fiber holding holes 42c are arranged along the third direction D3. At the holding portion 42f, multiple optical fiber holding holes 42c are arranged in a two-dimensional array. In this case, the optical fiber holding holes 42c can be arranged at high density in the holding portion 42f. The number of optical fiber holding holes 42c arranged along the second direction D2 is greater than the number of optical fiber holding holes 42c arranged along the third direction D3.

[0054] As an example, the number of optical fiber retaining holes 42c aligned along the second direction D2 is 16, and the number of optical fiber retaining holes 42c aligned along the third direction D3 is 2. However, the number of optical fiber retaining holes 42c aligned along the third direction D3 may be 3, and is not particularly limited. The optical fiber retaining holes 42c are formed, for example, by laser processing, etching, or a combination of laser processing and etching. The optical fiber retaining holes 42c are formed to have a dimensional tolerance of less than 2 μm (or less than 1 μm).

[0055] For example, some of the multiple lens portions 44b of the lens array 44 optically couple with the optical fiber 41 inserted into and held in the optical fiber holding hole 42c. The remaining portion of the multiple lens portions 44b does not optically couple with the optical fiber 41. As described above, there are 3 lens portions 44b aligned along the third direction D3, and 2 optical fibers 41 (optical fiber holding holes 42c) aligned along the third direction D3. The lens array 44 has, for example, three sets C consisting of multiple lens portions 44b aligned along the second direction D2, and the three sets C are aligned along the third direction D3. Of the three sets C, the lens portions 44b of the sets C located at each end of the third direction D3 optically couple with the optical fiber 41, while the lens portions 44b of the set C located in the center of the third direction D3 do not optically couple with the optical fiber 41.

[0056] For example, the lens array 44 has three sets C in order to make the pitch (arrangement interval) of the lens portions 44b aligned along the second direction D2 and the pitch of the lens portions 44b aligned along the third direction D3 the same. When the pitch of the lens portions 44b aligned along the second direction D2 and the pitch of the lens portions 44b aligned along the third direction D3 are the same, the lens array 44 can be easily manufactured.

[0057] The optical component 40 has, for example, guide pins 43 for positioning the optical component 40. For example, the guide pins 43 are cylindrical. The guide pins 43 are formed on the holding portion 42f. The guide pins 43 protrude from the end face 42d in the direction opposite to the first direction D1. The optical component 40 has a pair of guide pins 43. The pair of guide pins 43 are aligned along the second direction D2. The position of the optical component 40 relative to the fixing portion 11 is fixed by fitting each guide pin 43 into each guide hole 11j of the connector component 10.

[0058] The effects obtained from the connector component 10 according to this embodiment will now be described. The connector component 10 connects an optical component 40 that optically couples with light H to an optical IC substrate 20 that emits light H in a first direction D1 which intersects the substrate surface 21. The connector component 10 has a fixing portion 11 to which the optical component 40 is fixed, and the fixing portion 11 is in contact with the substrate surface 21. Since the fixing portion 11 contains a heat-resistant material that can withstand the heat of solder reflow, deformation and warping that occur in the connector component 10 can be reduced even when heated by solder reflow. The fixing portion 11 has a hole 11h, and the contact area of ​​the fixing portion 11 with respect to the substrate surface 21 is reduced by the hole 11h. Because the contact area of ​​the connector component 10 with respect to the optical IC substrate 20 is reduced, even if warping occurs in the optical IC substrate 20, the effect of such warping on the connector component 10 can be reduced. Therefore, connection loss that occurs in optical connection to the optical IC substrate 20 can be reduced.

[0059] The optical component 40 may be an optical fiber component having a plurality of optical fibers 41 arranged along the substrate surface 21. In this case, connection loss occurring in the optical connection between the plurality of optical fibers 41 and the substrate surface 21 can be reduced.

[0060] The fixing portion 11 may be fixed to the substrate surface 21 by adhesive 50. In this case, the connector component 10 is fixed to the optical IC substrate 20 by adhesive 50, so the positional accuracy of the connector component 10 relative to the optical IC substrate 20 can be improved.

[0061] The connector component 10 may also be a receptacle. In this case, the optical component 40 can be fixed to the connector component 10 by fitting the optical component 40 into the connector component 10.

[0062] L [mm] is the distance along the substrate surface 21 between the two optical fibers 41 that are furthest apart from each other among the multiple optical fibers 41, z [mm] is the thickness of the connector component 10 in the direction intersecting the substrate surface 21, E (IC) [GPa] is the elastic modulus of the material constituting the optical IC substrate 20, E (mat) [GPa] is the elastic modulus of the material constituting the connector component 10 (fixing part 11), and the thermal expansion coefficients of the material constituting the optical IC substrate 20 and the thermal expansion coefficients of the material constituting the connector component 10. Let Δα [ppm / °C] be the difference between the two values, ΔT [°C] be the temperature change, and A be the ratio of the area of ​​the connector component 10 that contacts the substrate surface 21 to the area of ​​the outer edge of the part of the connector component 10 that contacts the substrate surface 21. The radius of curvature R of the optical IC substrate 20 due to the temperature change is expressed as R = |z × E(IC) / (2 × Δα × ΔT × E(mat) × A)|, ΔT = 90, and the change in L ΔL is ΔL = z × L / (2 × R). In this case, the change in L ΔL may be 6 [μm] or less. Furthermore, the change in L ΔL may be 4 [μm] or less, or 2 [μm] or less.

[0063] The embodiments of the connector component described herein have been explained above. However, the present invention is not limited to the embodiments described above. It will be readily apparent to those skilled in the art that the present invention can be modified and altered in various ways within the scope of the claims. For example, the shape, size, number, material and arrangement of each part of the connector component, optical IC substrate, clip and optical component can be appropriately changed within the scope of the above-described gist.

[0064] A modified optical component 40A will be described with reference to Figures 14 and 15. Figure 14 is a perspective view showing the optical component 40A, the clip 30, and the connector component 10. Figure 15 is a side view showing the optical component 40A. The optical component 40A is, for example, a wiring assembly having a plurality of optical fibers 41 and a support member 42A different from the support member 42 described above.

[0065] Inside the support member 42A, the multiple optical fibers 41 are bent. Outside the support member 42A, the multiple optical fibers 41 extend along a third direction D3, and inside the support member 42A, the multiple optical fibers 41 are bent in the direction opposite to the first direction D1. For example, the support member 42A has an insertion portion 42h having a different shape from the insertion portion 42b, and a holding portion 42f.

[0066] The insertion portion 42h has a curved portion 42j that extends from the holding portion 42f in a first direction D1 and curves toward a third direction D3, and an extending portion 42k that extends toward the third direction D3 from the end of the curved portion 42j opposite to the holding portion 42f. The optical fiber 41 is passed through the inside of the extending portion 42k and the inside of the curved portion 42j, and bends inside the curved portion 42j to reach the holding portion 42f. In the optical component 40A equipped with a support member 42A having a curved portion 42j, the height toward the first direction D1 can be reduced because the optical fiber 41 is bent from the first direction D1 to the third direction D3.

[0067] In the embodiments described above, a connector component 10, which is a receptacle, was described. However, the connector component may be something other than a receptacle. For example, the connector component may be a board-to-board connector, and the type of connector component is not particularly limited.

[0068] In the embodiments described above, an example was given in which the connector component 10 is fixed to the optical IC substrate 20 by adhesive 50. However, the connector component may be fixed to the optical IC substrate by means other than adhesive. For example, the connector component may be fixed to the optical IC substrate by interlocking grooves, and the method of fixing the connector component is not particularly limited.

[0069] In the embodiments described above, an optical component 40, which is an optical fiber component, was described. However, the optical component may be something other than an optical fiber component. For example, the optical component may be a waveguide component having an optical waveguide, and the type of optical component is not particularly limited.

[0070] 10...Connector part 11...Fixing part 11b...Contact surface 11c...Top surface 11d...First side surface 11f...Second side surface 11h...Hole 11j...Guide hole 12...Hooking part 12b...Side surface 12c...Bottom surface 12f...Protruding surface 20...Optical IC substrate 21...Substrate surface 21b...Short side 21c...Long side 22...Part 23...Optical coupling part 30...Clip 31...Base 31b...Hole 32...Pinch part 33...Clamping part 33b...Claw 33c...Bent part 33d...Hook-shaped part 33f...Protruding part 40, 40A...Optical component 41...Optical fiber 41b...Tip surface 42, 42A...Support member 42b...Insertion part 42c...Optical fiber holding hole 42d...End surface 42f...Holding part 42h... Insertion section 42j... Curved section 42k... Extension section 43... Guide pin 44... Lens array 44b... Lens section 50... Adhesive C... Assembly H... Light

Claims

1. A connector component for connecting an optical component to an optical IC substrate having a substrate surface on which components are mounted and emitting light from the substrate surface in a direction intersecting the substrate surface, wherein the connector component comprises a fixing portion to which the optical component is fixed and which contacts the substrate surface, the fixing portion contains a heat-resistant material that can withstand the heat of solder reflow, and the fixing portion has holes to reduce the contact area with the substrate surface.

2. The connector component according to claim 1, wherein the optical component is an optical fiber component having a plurality of optical fibers arranged along the substrate surface.

3. The connector component according to claim 1 or claim 2, wherein the fixing portion is fixed to the substrate surface with an adhesive.

4. The connector component according to any one of claims 1 to 3, wherein the connector component is a receptacle.

5. Let L [mm] be the distance along the substrate surface between the two optical fibers that are furthest apart from each other among the plurality of optical fibers, z [mm] be the thickness of the connector component in the direction intersecting the substrate surface, E (IC) [GPa] be the elastic modulus of the material constituting the optical IC substrate, E (mat) [GPa] be the elastic modulus of the material constituting the connector component, Δα [ppm / °C] be the difference between the thermal expansion coefficient of the material constituting the optical IC substrate and the thermal expansion coefficient of the material constituting the connector component, ΔT [°C] be the temperature change, and A be the ratio of the area of ​​the connector component in contact with the substrate surface to the area of ​​the outer edge of the part of the connector component that contacts the substrate surface, and when the radius of curvature R of the optical IC substrate due to the temperature change is expressed as R = |z × E (IC) / (2 × Δα × ΔT × E (mat) × A)|, and ΔT = 90, and the change in L ΔL is ΔL = z × L / (2 × R), The connector component according to claim 2, wherein the amount of change ΔL is 6 [μm] or less.

6. The connector component according to claim 5, wherein the amount of change ΔL is 4 [μm] or less.

7. The connector component according to claim 5, wherein the amount of change ΔL is 2 [μm] or less.

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