Capacitor module
The capacitor module design addresses the challenge of reducing inductance and impedance by employing a busbar configuration with overlapping extension portions and a sealed case, achieving miniaturization and improved reliability.
Patent Information
- Authority / Receiving Office
- WO Β· WO
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-07-14
- Publication Date
- 2026-03-26
AI Technical Summary
Existing capacitor modules face limitations in reducing inductance without increasing their size, leading to increased impedance and heat generation, which can exceed the guaranteed temperature limits.
The capacitor module design includes a first and second busbar configuration with specific extension and connection portions that overlap to minimize inductance, utilizing a comb-like shape and alternating projections to ensure creepage distance and reduce electric field interference, while being housed within a sealed case to maintain module size.
This configuration effectively reduces inductance and impedance, preventing excessive heat generation and allowing for a miniaturized capacitor module with improved reliability and design flexibility.
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Figure JP2025025126_26032026_PF_FP_ABST
Abstract
Citation Information
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