Electronic device including heat dissipation member

Abstract

The present disclosure relates to an electronic device. According to an embodiment of the present disclosure, an electronic device may comprise: a housing configured to form the exterior of the electronic device; a processor disposed inside the housing; a fingerprint sensor disposed inside the housing and spaced apart from the processor in the longitudinal direction of the electronic device; and a heat dissipation member formed to extend from the processor to the fingerprint sensor in the longitudinal direction of the electronic device and configured to dissipate heat generated by the processor, wherein the heat dissipation member includes a case, a heat transfer material configured to flow in the inner space of the case, and a wick disposed in the inner space of the case, the case includes a first plate bent in a plurality of bending areas to form a recess area in which the fingerprint sensor is disposed, and a second plate coupled to the first plate and bent in the plurality of bending areas corresponding to the recess area, and the bending curvature of the first plate in at least one bending area is formed to be different from the bending curvature of the second plate in at least one bending area.

Description

Electronic device including a heat dissipation member

[0001] The embodiments of the present disclosure relate to electronic devices, for example, electronic devices comprising a heat dissipation member.

[0002] Driven by the remarkable advancements in information and communication technology and semiconductor technology, the distribution and use of various electronic devices are increasing rapidly. In particular, recent electronic devices are being developed to enable portable communication.

[0003] The term "electronic device" refers to a device that performs specific functions according to an installed program, ranging from home appliances to electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video / audio devices, desktop / laptop computers, and in-car navigation systems. For example, these electronic devices can output stored information as sound or video. As the integration density of electronic devices increases and ultra-high-speed, high-capacity wireless communication becomes commonplace, various functions can now be integrated into a single electronic device, such as a mobile communication terminal. For instance, not only communication functions but also entertainment functions like games, multimedia functions like music / video playback, communication and security functions like mobile banking, and functions such as schedule management or electronic wallets are being integrated into a single electronic device. These electronic devices are being miniaturized to allow users to carry them conveniently.

[0004] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0005] The present disclosure relates to an electronic device. According to one embodiment of the present disclosure, the electronic device may comprise: a housing configured to form the exterior of the electronic device; a processor disposed inside the housing; a fingerprint sensor disposed inside the housing spaced apart from the processor and the electronic device in the longitudinal direction; and a heat dissipation member formed extending from the processor to the fingerprint sensor in the longitudinal direction of the electronic device and configured to dissipate heat generated from the processor, comprising a case, a heat transfer material configured to flow in the internal space of the case, and a wick disposed in the internal space of the case, wherein the case comprises a first plate bent in a plurality of bending regions to form a recess region in which the fingerprint sensor is disposed, and a second plate coupled to the first plate and bent in a plurality of bending regions corresponding to the recess region, wherein the bending curvature in at least one bending region of the first plate is formed differently from the bending curvature in at least one bending region of the second plate.

[0006] The present disclosure relates to a heat dissipation member. According to one embodiment of the present disclosure, the heat dissipation member may comprise a case, a heat transfer material configured to flow in the internal space of the case, and a wick disposed in the internal space of the case, wherein the case comprises a first plate bent in a plurality of bending regions to form a recess region and a second plate bent in a plurality of bending regions corresponding to the recess region and coupled to the first plate, wherein the bending curvature in at least one bending region of the first plate is formed differently from the bending curvature in at least one bending region of the second plate.

[0007] The aspects, configurations, and / or advantages described above regarding one embodiment of the present disclosure may become more apparent from the following detailed description with reference to the accompanying drawings.

[0008] FIG. 1 is a block diagram of an electronic device in a network environment according to one embodiment of the present disclosure.

[0009] FIG. 2 is a front perspective view of an electronic device according to one embodiment of the present disclosure.

[0010] FIG. 3 is a rear perspective view of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 4 is an exploded perspective view of an electronic device showing the front of the electronic device according to one embodiment of the present disclosure.

[0012] FIG. 5 is an exploded perspective view of an electronic device showing the rear surface of the electronic device according to one embodiment of the present disclosure.

[0013] FIG. 6 is a bottom view of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 7 is a rear perspective view of a part of an electronic device according to one embodiment of the present disclosure.

[0015] FIG. 8 is an exploded view of a heat dissipation member according to one embodiment of the present disclosure.

[0016] FIG. 9 is a side view of a heat dissipation member according to one embodiment of the present disclosure.

[0017] FIG. 10 is a part of a cross-sectional view of a heat dissipation member according to one embodiment of the present disclosure.

[0018] FIG. 11 is a part of a cross-sectional view of a heat dissipation member according to one embodiment of the present disclosure.

[0019] FIG. 12 is a part of a cross-sectional view of a heat dissipation member according to one embodiment of the present disclosure.

[0020] FIG. 13 is a part of a cross-sectional view in which a portion of a heat dissipation member is cut along line A-A' of FIG. 9 according to one embodiment of the present disclosure.

[0021] FIG. 14 is a part of a cross-sectional view in which a portion of a heat dissipation member is cut along line B-B' of FIG. 9 according to one embodiment of the present disclosure.

[0022] FIG. 15 is a part of a cross-sectional view in which a portion of a heat dissipation member is cut along line C-C' of FIG. 9 according to one embodiment of the present disclosure.

[0023] FIG. 16 is an exploded view of a heat dissipation member according to one embodiment of the present disclosure.

[0024] FIG. 17 is a part of a cross-sectional view in which a portion of a heat dissipation member is cut along line D-D' of FIG. 16 according to one embodiment of the present disclosure.

[0025] FIG. 18 is a part of a cross-sectional view in which a portion of a heat dissipation member is cut along line E-E' of FIG. 16 according to one embodiment of the present disclosure.

[0026] FIG. 19 is a part of a cross-sectional view in which a portion of a heat dissipation member according to one embodiment of the present disclosure is cut.

[0027] FIG. 20 is a part of a cross-sectional view in which a portion of a heat dissipation member according to one embodiment of the present disclosure is cut.

[0028] FIG. 21 is a perspective view of a heat dissipation member according to one embodiment of the present disclosure.

[0029] FIG. 22 is a part of a cross-sectional view in which a portion of a heat dissipation member is cut along line F-F' of FIG. 22 according to one embodiment of the present disclosure.

[0030] FIG. 23 is a part of a cross-sectional view in which a portion of a heat dissipation member is cut along line F-F' of FIG. 22 according to one embodiment of the present disclosure.

[0031] FIG. 24 is a drawing illustrating the effect of a heat dissipation member according to one embodiment of the present disclosure.

[0032] FIG. 25 is an exploded view of a heat dissipation member according to one embodiment of the present disclosure.

[0033] FIG. 26 is an exploded view of a heat dissipation member according to one embodiment of the present disclosure.

[0034] FIG. 27 is an exploded view of a heat dissipation member according to one embodiment of the present disclosure.

[0035] FIG. 28 is a side view of a heat dissipation member according to one embodiment of the present disclosure.

[0036] FIG. 29 is a side view of an electronic device including a heat dissipation member according to one embodiment of the present disclosure.

[0037] FIG. 30 is a drawing illustrating the effect of a heat dissipation member according to one embodiment of the present disclosure.

[0038] Throughout the attached drawings, similar parts, configurations, and / or structures may be assigned similar reference numbers.

[0039] Heat generated by electrical component(s), such as integrated circuit chips, can impair the operating environment of electronic devices. As the performance of various electrical components improves, the integration density of electronic devices increases, and / or the capacity of video or audio data grows, the problem of operating environments being compromised by heat generation may become more severe. Integrated circuit chips equipped with circuit devices, such as processors, can generate more heat than other electrical components. When more heat is generated in a confined area, and / or when the generated heat accumulates inside the electronic device, the operating environment of the electrical component(s) can become even more deteriorated.

[0040] One embodiment of the present disclosure may provide an electronic device comprising a heat dissipation structure that rapidly moves, disperses, or releases heat generated internally, in order to at least resolve the aforementioned problems and / or disadvantages and at least provide the advantages described below.

[0041] According to one embodiment, the heat dissipation member may be partially bent in an area corresponding to the fingerprint sensor, and the bending curvature of the first plate may be formed differently from the bending curvature of the second plate so that the flow of the heat transfer material may be increased.

[0042] According to one embodiment, the heat exchange efficiency of the heat dissipation member can be improved by forming a slit in an area corresponding to the neck portion of the heat dissipation member or by utilizing the arrangement structure of the wick inside the heat dissipation member to horizontally separate the space where the heat transfer material flows.

[0043] The following description relating to the attached drawings may provide an understanding of various exemplary embodiments of the present disclosure, including the claims and their corresponding contents. While the exemplary embodiments disclosed in the following description include various specific details to aid understanding, they are to be considered as one of various exemplary embodiments. Accordingly, those skilled in the art will understand that various changes and modifications to the various embodiments described in the present disclosure may be made without departing from the scope and technical spirit of the disclosure. Additionally, for clarity and brevity, descriptions of well-known functions and configurations may be omitted.

[0044] The terms and words used in the following description and claims are not limited to their literal meanings but may be used to clearly and consistently describe an embodiment of the present disclosure. Accordingly, it will be apparent to a person skilled in the art that the following description of various embodiments of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the rights or the disclosure defined as equivalent thereto.

[0045] Unless the context clearly indicates otherwise, it should be understood that the singular forms of "a," "an," and "the" include a plural meaning. Thus, for example, "component surface" can be understood to include one or more of the component surfaces.

[0046] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to one embodiment of the present disclosure.

[0047] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)). The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations.According to one embodiment, as at least part of the data processing or operation, the processor (120) may store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) can be implemented separately from the main processor (121) or as part thereof.

[0048] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence is performed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0049] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0050] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0051] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0052] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0053] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0054] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) that is directly or wirelessly connected to the electronic device (101).

[0055] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0056] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0057] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0058] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0059] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0060] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0061] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0062] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0063] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0064] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to one embodiment, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0065] According to one embodiment, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0066] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0067] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0068] FIG. 2 is a front perspective view of an electronic device (101) according to one embodiment of the present disclosure. FIG. 3 is a rear perspective view of an electronic device (101) according to one embodiment of the present disclosure.

[0069] In the following detailed description, the length direction, width direction, and / or thickness direction (or height direction) of the electronic device may be mentioned, and the length direction may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the thickness direction as the 'Z-axis direction'. In one embodiment, regarding the direction in which the component is oriented, 'negative / positive (- / +)' may be mentioned together with the Cartesian coordinate system illustrated in the drawings. For example, the front of the electronic device and / or housing may be defined as the 'face facing the +Z direction', and the rear as the 'face facing the -Z direction'. In one embodiment, the side of the electronic device and / or housing may include an area facing the +X direction, an area facing the +Y direction, an area facing the -X direction, and / or an area facing the -Y direction. In one embodiment, the 'X-axis direction' may mean both the '-X direction' and the '+X direction'. In the following description of the electronic device (101), the ‘first direction’ may mean the X-axis direction (or a direction parallel to the X-axis), the ‘second direction’ may mean the Y-axis direction (or a direction parallel to the Y-axis), and the ‘third direction’ may mean the Z-axis direction (or a direction parallel to the Z-axis). In the following description of the electronic device (101), the statement that a component is ‘disposed on’ another component may mean that the component is placed in the +Z direction relative to the other component. This is based on the orthogonal coordinate system described in the drawings for the sake of brevity of explanation, and it should be noted that the description of these directions or components does not limit the embodiment(s) of the present disclosure. For example, the orthogonal coordinate system may be defined differently from the present disclosure depending on the design specifications of the electronic device or the user's usage habits.

[0070] Referring to FIGS. 2 and FIGS. 3, an electronic device (101) according to one embodiment may include a housing (201) comprising a front (201A), a rear (201B), and a side (201C) surrounding the space between the front (201A) and the rear (201B). In one embodiment (not shown), the housing (201) may refer to a structure forming part of the front (201A) of FIG. 2, the rear (201B) and the side (201C) of FIG. 3. According to one embodiment, at least a portion of the front (201A) may be formed by a substantially transparent front plate (202) (e.g., a glass plate including various coating layers, or a polymer plate). The rear (201B) may be formed by a rear plate (211). The rear plate (211) may be formed, for example, by glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side (201C) may be formed by a side bezel structure (or "side member") (212) comprising metal and / or polymer, which is combined with the front plate (202) and the rear plate (211). In some embodiments, the front plate (202) and the side bezel structure (212) may be formed as one body and may comprise the same material. Alternatively, the rear plate (211) and the side bezel structure (212) may be formed as one body and may comprise the same material (e.g., glass, a metal material such as aluminum, or ceramic). According to one embodiment, the front (201A) and / or the front plate (202) may be interpreted as part of a display (210) (e.g., the display module (160) of FIG. 1). According to one embodiment, the housing (201) may include a front plate (202) and a rear plate (211).

[0071] According to one embodiment, the electronic device (101) may include at least one of a display (210), an audio module (203, 204, 205) (e.g., the audio module (170) of FIG. 1), a sensor module (e.g., the sensor module (176) of FIG. 1), a camera module (206, 207) (e.g., the camera module (180) of FIG. 1), a key input device (216, 217) (e.g., the input module (150) of FIG. 1), and a connector hole (213, 214) (e.g., the connection terminal (178) of FIG. 1). In some embodiments, the electronic device (101) may omit at least one of the components (e.g., the connector hole (214)) or additionally include other components.

[0072] According to one embodiment, the display (210) may be visually exposed, for example, through a significant portion of the front plate (202). In some embodiments, at least a portion of the display (210) may be exposed through the front plate (202) forming the front (201A). According to one embodiment, the display (210) may be a flexible display or a foldable display.

[0073] According to one embodiment, the surface of the housing (201) (or the front plate (202)) may include a screen display area formed as the display (210) is visually exposed. For example, the screen display area may include a front (201A).

[0074] In one embodiment (not shown), the electronic device (101) may include a recess or opening formed in a part of the screen display area (e.g., front (201A)) of the display (210), and may include at least one of an audio module (205), a sensor module (not shown), a light-emitting element (not shown), and a camera module (206) aligned with the recess or opening. In one embodiment (not shown), at least one of an audio module (205), a sensor module (not shown), a camera module (206), a fingerprint sensor (not shown), and a light-emitting element (not shown) may be included on the back surface of the screen display area of ​​the display (210).

[0075] In one embodiment (not shown), the display (210) may be combined with or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field type pen input device (215) (e.g., a stylus pen).

[0076] In some embodiments, at least a portion of the key input device (216, 217) may be placed in the side bezel structure (212).

[0077] According to one embodiment, the audio module (203, 204, 205) may include, for example, a microphone hole (203) and a speaker hole (204, 205). A microphone for acquiring external sound may be placed inside the microphone hole (203), and in some embodiments, a plurality of microphones may be placed to detect the direction of sound. The speaker hole (204, 205) may include an external speaker hole (204) and a receiver hole (205) for communication. In some embodiments, the speaker hole (204, 205) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (204, 205) (e.g., a piezo speaker). The audio module (203, 204, 205) is not limited to the above structure and may be designed in various ways, such as by mounting only some audio modules or adding new audio modules, depending on the structure of the electronic device (101).

[0078] According to one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to, for example, an internal operating state of an electronic device (101) or an external environmental state. The sensor module (not shown) may include, for example, a first sensor module (not shown) (e.g., proximity sensor) and / or a second sensor module (not shown) (e.g., fingerprint sensor) disposed on the front (201A) of the housing (201), and / or a third sensor module (not shown) (e.g., HRM (heart rate monitor) sensor) and / or a fourth sensor module (not shown) (e.g., fingerprint sensor) disposed on the rear (201B) of the housing (201). In some embodiments (not shown), the fingerprint sensor may be disposed on the rear (201B) as well as on the front (201A) (e.g., display (210)) of the housing (201). The electronic device (101) may further include at least one of the following sensor modules not shown, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor (not shown). The sensor module (not shown) is not limited to the above structure and can be designed in various ways, such as by mounting only some sensor modules or adding new sensor modules, depending on the structure of the electronic device (101).

[0079] According to one embodiment, the camera module (206, 207) may include, for example, a front camera module (206) placed on the front (201A) of the electronic device (101), a rear camera module (207) placed on the rear (201B), a flash (208), and / or an IR sensor (209). The camera module (206, 207) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (208) may include, for example, a light-emitting diode or a xenon lamp. The camera module (206, 207) is not limited to the above structure and may be designed in various ways, such as by mounting only some camera modules or adding new camera modules, depending on the structure of the electronic device (101).

[0080] According to one embodiment, the electronic device (101) may include a plurality of camera modules (e.g., dual cameras, or triple cameras) each having different attributes (e.g., angle of view) or functions. For example, the rear camera module (207) may include a plurality of camera modules including lenses having different angles of view. For example, the plurality of camera modules may include at least one of a wide-angle camera, an ultra-wide-angle camera, a telephoto camera, or an IR (infrared) camera (e.g., a TOF (time of flight) camera, a structured light camera). Additionally, for example, the plurality of camera modules may include an optical zoom camera with adjustable magnification. According to one embodiment, the electronic device (101) may be configured such that, for the plurality of camera modules, a designated camera module operates or another camera module operates based on a user's selection or under a predetermined environment. According to one embodiment, the IR camera may operate as at least part of a sensor module. For example, the TOF camera may operate as at least part of a sensor module (not shown) for detecting the distance to a subject. According to one embodiment, the front camera module (206) can be implemented as an under display camera (UDC) module.

[0081] According to one embodiment, a key input device (216, 217) (e.g., a volume key) may be placed on the side (201C) of the housing (201). According to one embodiment, the electronic device (101) may not include some or all of the aforementioned key input devices (216, 217), and the key input devices (216, 217) that are not included may be implemented in other forms, such as soft keys, on the display (210). In some embodiments, the key input device (216, 217) may include a sensor module (not shown) placed on the rear (210B) of the housing (201).

[0082] According to one embodiment, a light-emitting element (not shown) may be disposed, for example, on the front (201A) of the housing (201). The light-emitting element (not shown) may provide state information of the electronic device (101) in the form of light, for example. In one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of, for example, the front camera module (206). The light-emitting element (not shown) may include, for example, an LED (light emitting diode), an IR (infrared) LED and / or a xenon lamp.

[0083] According to one embodiment, the connector holes (213, 214) may include, for example, a first connector hole (213) capable of accommodating a connector for transmitting and receiving power and / or data with an external electronic device (e.g., a USB connector) or a connector for transmitting and receiving audio signals with an external electronic device (e.g., an earphone jack), and / or a second connector hole (214) capable of accommodating a storage device (e.g., a subscriber identification module (SIM) card, a secure digital (SD) memory card). According to one embodiment, the first connector hole (213) and / or the second connector hole (214) may be omitted. The connector holes (213, 214) are not limited to the above structure and may be designed in various ways, such as by installing only some connector holes or adding new connector holes, depending on the structure of the electronic device (101).

[0084] A pen input device (215) (e.g., a stylus pen) can be guided into the interior of the housing (201) through a hole formed on the side of the housing (201) and inserted or removed, and may include a button to facilitate removal. The pen input device (215) may have a separate resonant circuit built in and may be coupled with an electromagnetic induction panel (e.g., a digitizer) included in the electronic device (101). The pen input device (215) may include an EMR (electro-magnetic resonance) method, an AES (active electrical stylus) method, and an ECR (electric coupled resonance) method.

[0085] According to one embodiment, a camera module (206, 207) and / or a sensor module (not shown) may be positioned within the internal space of the electronic device (101) so as to be in contact with the external environment through a designated area of ​​the display (210) and the front plate (202). For example, the designated area may be an area of ​​the display (210) where no pixels are placed. As another example, the designated area may be an area of ​​the display (210) where pixels are placed. When viewed from above the display (210), at least a portion of the designated area may overlap with the camera module (206, 207) and / or the sensor module. As another example, some sensor modules may be positioned within the internal space of the electronic device to perform their functions without being visually exposed through the front plate (202).

[0086] The electronic device (101) disclosed in FIGS. 2 and 3 has a bar-type or plate-type appearance, but is not limited thereto. For example, the illustrated electronic device may be part of a rollable electronic device or a foldable electronic device. "Rollable electronic device" may mean an electronic device in which the display can be bent and deformed so that at least a portion can be wound or rolled and stored inside a housing (e.g., housing (210) in FIG. 2). Depending on the user's needs, the rollable electronic device may be used to expand the screen display area by unfolding the display or by exposing a larger area of ​​the display to the outside. "Foldable electronic device" may mean an electronic device that can be folded so that two different areas of the display face each other or in opposite directions. Generally, in a portable state, the display of a foldable electronic device is folded so that two different regions face each other or in opposite directions, and in an actual usage state, the user can unfold the display so that the two different regions form a substantially flat shape. In one embodiment, the electronic device (101) according to one embodiment of the present disclosure may be interpreted to include not only portable electronic devices such as smartphones, but also various other electronic devices such as laptop computers or home appliances.

[0087] FIG. 4 is an exploded perspective view showing the front of an electronic device according to one embodiment of the present disclosure. FIG. 5 is an exploded perspective view showing the rear of an electronic device according to one embodiment of the present disclosure.

[0088] The embodiments of FIGS. 4 to 5 may be combined with the embodiments of FIGS. 1 to 3, or the embodiments of FIGS. 6 to 18.

[0089] Referring to FIGS. 4 and FIGS. 5, an electronic device (101) (e.g., the electronic device (101) of FIG. 2 or FIG. 3) may include a side structure (310), a first support member (311) (e.g., a bracket), a front plate (320) (e.g., the front plate (202) of FIG. 2), a display (330) (e.g., the display (220) of FIG. 1), at least one printed circuit board (or board assembly) (340a, 340b), a battery (350), a second support member (360) (e.g., a rear case), an antenna, a camera assembly (307), and a rear plate (380) (e.g., the rear plate (211) of FIG. 3). When including a plurality of printed circuit boards (340a, 340b), the electronic device (101) may electrically connect different printed circuit boards by including at least one flexible printed circuit board (340c). For example, the printed circuit boards (340a, 340b) may include a first circuit board (340a) positioned above (e.g., in the +Y-axis direction) and a second circuit board (340b) positioned below (e.g., in the -Y-axis direction) the battery (350), and a flexible printed circuit board (340c) may electrically connect the first circuit board (340a) and the second circuit board (340b).

[0090] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the first support member (311), or the second support member (360)) or additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 1 or FIG. 2, and redundant descriptions are omitted below.

[0091] The first support member (311) may be provided in a flat shape for at least a portion. In one embodiment, the first support member (311) may be placed inside the electronic device (101) and connected to the side structure (310), or may be formed integrally with the side structure (310). The first support member (311) may be formed from, for example, a metal material and / or a non-metal (e.g., a polymer) material. When the first support member (311) is formed at least partially from a metal material, the side structure (310) or a portion of the first support member (311) may function as an antenna. The first support member (311) may have a display (330) attached to one side and a printed circuit board (340a, 340b) attached to the other side. A processor, memory, and / or interface may be mounted on the printed circuit board (340a, 340b). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0092] According to one embodiment, the housing (301) may include a first support member (311) and a side structure (310). According to one embodiment, the housing (301) may be understood as a structure for receiving, protecting, or placing a printed circuit board (340a, 340b) or a battery (350). In one embodiment, the housing (301) may be understood as including a structure that a user can visually or tactilely perceive on the exterior of the electronic device (101), for example, a side structure (310), a front plate (320), and / or a rear plate (380). For example, the housing (301) may include structures that form the exterior of the electronic device (101) (e.g., a side structure (310), a front plate (320), a rear plate (380)). The housing (301) may be the same as the housing (210) described with reference to FIGS. 2 and FIGS. 3. In one embodiment, the phrase “front or rear of the housing (301)” may refer to the first surface (210A) of FIG. 1 or the second surface (210B) of FIG. 2. In one embodiment, the first support member (311) is positioned between the front plate (320) (e.g., the first surface (210A) of FIG. 2) and the rear plate (380) (e.g., the second surface (210B) of FIG. 3) and may function as a structure for positioning electrical / electronic components such as printed circuit boards (340a, 340b) or a camera assembly (307).

[0093] Memory may include, for example, volatile memory or non-volatile memory.

[0094] The interface may include, for example, an HDMI (high definition multimedia interface), a USB (universal serial bus) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (101) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0095] The second support member (360) may include, for example, an upper support member (360a) or a lower support member (360b). In one embodiment, the upper support member (360a) may be arranged to surround a printed circuit board (340a, 340b) (e.g., the first circuit board (340a)) together with a part of the first support member (311). For example, the upper support member (360a) of the second support member (360) may be arranged to face the first support member (311) with the first circuit board (340a) in between. In one embodiment, the lower support member (360b) of the second support member (360) may be arranged to face the first support member (311) with the second circuit board (340b) in between. Circuit devices (e.g., processors, communication modules, or memory) implemented in the form of integrated circuit chips or various electrical / electronic components may be placed on printed circuit boards (340a, 340b), and according to the embodiment, printed circuit boards (340a, 340b) may be provided with an electromagnetic shielding environment from the second support member (360). In one embodiment, the lower support member (360b) may be utilized as a structure capable of placing electrical / electronic components such as a speaker module or an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector). In one embodiment, electrical / electronic components such as a speaker module or an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed on an additional printed circuit board not illustrated. For example, the lower support member (360b) may be placed to enclose an additional printed circuit board (e.g., a second printed circuit board (340b)) together with another part of the first support member (311). A speaker module or interface placed on an additional printed circuit board or lower support member (360b) not shown may be placed correspondingly to the audio module (203, 204, 205) or connector hole (213, 214) of FIG. 2.

[0096] The battery (350) is a device for supplying power to at least one component of the electronic device (101) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially coplanar with, for example, a printed circuit board (340a, 340b). The battery (350) may be disposed integrally inside the electronic device (101) or may be disposed detachably from the electronic device (101).

[0097] Although not illustrated, the antenna may include a conductive pattern implemented on the surface of the second support member (360) through, for example, a laser direct structuring method. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the antenna in the form of a thin film may be placed between the rear plate (380) and the battery (350). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, communicate near-field with an external device or wirelessly transmit and receive power required for charging. In one embodiment, other antenna structures may be formed by a part or combination thereof of the side structure (310) and / or the first support member (311).

[0098] According to one embodiment, the camera assembly (307) may include at least one camera module. Inside the electronic device (101), the camera assembly (307) (or at least one camera module) may receive at least a portion of light incident through an optical hole or a camera window. In one embodiment, the camera assembly (307) may be placed on a first support member (311) at a location adjacent to a printed circuit board (340a, 340b). In one embodiment, the camera module(s) of the camera assembly (307) may be generally aligned with any one of the camera windows and may be wrapped at least partially in a second support member (360) (e.g., an upper support member (360a)).

[0099] According to one embodiment, the electronic device (101) may include camera holes (312, 313, 319). A plurality of camera holes (312, 313, 319) may be spaced apart from each other. The camera assembly (307) may receive light that has passed through the camera holes (312, 313, 319).

[0100] According to one embodiment, the first support member (311) may include a receiving portion (3111). A battery (350) may be placed within the receiving portion (3111). The battery (350) may include a terrace (353). The terrace (353) may protrude toward a printed circuit board (340). The battery (350) may include a battery connecting member (3501) connecting the terrace (353) and the printed circuit board (340).

[0101] According to one embodiment, the electronic device (101) may include a port insertion opening (308). The port insertion opening (308) may be opened in a part of the housing (301). The port insertion opening (308) may be in communication with an external space of the housing (301). The electronic device (101) may be connected to an external device (e.g., a USB port, charging wiring, etc.), and the external device may be inserted into the port insertion opening (308).

[0102] According to one embodiment, the electronic device (101) may include an antenna (309). The antenna (309) may be positioned adjacent to the port insertion opening (308).

[0103] FIG. 6 is a bottom view of an electronic device according to one embodiment of the present disclosure. FIG. 7 is a rear perspective view of a part of an electronic device (101) according to one embodiment of the present disclosure.

[0104] Referring to FIG. 6, the electronic device (101) may include a housing (301). The housing (301) may include a first support member (311). The description of the housing (301) may be applied in the same way as the description of the housing (301) described with reference to FIG. 1 through 5. For example, the housing (301) may include a first support member (311). The description of the first support member (311) may be applied in the same way as the description of the first support member (311) described with reference to FIG. 1 through 5.

[0105] According to one embodiment, the electronic device (101) may include a heat dissipation member (400). The heat dissipation member (400) may be disposed in a housing (301). The heat dissipation member (400) may be disposed in a first support member (310).

[0106] According to one embodiment, the electronic device (101) may include a heat source. The heat source may be at least one component (e.g., the processor (120) of FIG. 1) disposed in the internal space of the housing (301). Additionally, the heat source may be contained within the housing (301). The description of the heat source may be the same as the description of the processor (120) described with reference to FIG. 1 through 5.

[0107] Referring to FIG. 7, the electronic device (101) may include a fingerprint sensor (390). The fingerprint sensor (390) may be placed inside the housing (301) and may be placed spaced apart from the heat source (e.g., the processor (120) of FIG. 1). The fingerprint sensor (390) may detect a signal transmitted from outside the housing (301). The fingerprint sensor (390) may detect a user's fingerprint in contact with a display (e.g., the display (330) of FIG. 2).

[0108] In the present disclosure and the embodiments below, the fingerprint sensor (390) is described as a sensor that detects fingerprints, but is not limited thereto. For example, the fingerprint sensor (390) may be a different type of interference component if at least one part of the heat dissipation member (400) can be interfered with when the heat dissipation member (400) is placed inside the housing.

[0109] According to one embodiment, the heat dissipation member (400) may be positioned to exchange heat with a heat source. At least a portion of the heat dissipation member (400) may have a shape corresponding to the heat source. The heat dissipation member (400) may be positioned to overlap with the heat source when viewed from above. The heat dissipation member (400) may be positioned at a location corresponding to the heat source. For example, the heat dissipation member (400) may transfer heat generated from a processor (e.g., processor (120) of FIG. 1) positioned at the heat source.

[0110] According to one embodiment, the heat dissipation member (400) may be positioned to overlap with the aforementioned battery (battery (350) of FIG. 5) when viewed from above. At least a portion of the heat dissipation member (400) may be positioned at a location corresponding to the aforementioned battery (battery (350) of FIG. 5). The heat dissipation member (400) may be positioned to cover the aforementioned battery (battery (350) of FIG. 5).

[0111] According to one embodiment, the heat dissipation member (400) may be positioned to overlap with the fingerprint sensor (390) when viewed from above. At least a portion of the heat dissipation member (400) may be positioned at a location corresponding to the fingerprint sensor (390). The heat dissipation member (400) may be positioned to cover the fingerprint sensor (390).

[0112] FIG. 8 is an exploded view of a heat dissipation member (400) according to one embodiment of the present disclosure.

[0113] Referring to FIG. 8, the heat dissipation member (400) may include a first plate (410), a wick (420), and a second plate (430). According to one embodiment, the first plate (410) and the second plate (430) may be combined to form an internal space. Additionally, a heat transfer material and a wick (420) may be disposed in the internal space. The first plate (410) and the second plate (430) may form a case (410, 430) configured to protect the heat transfer material and the wick (420) from external impact.

[0114] According to one embodiment, the first plate (410) and / or the second plate (430) may comprise at least one of aluminum, titanium, stainless steel, and copper. However, the material of the first plate (410) and / or the second plate (430) is not limited thereto and may include a material that generally constitutes a housing.

[0115] According to one embodiment, a fluid (e.g., water, acetone, methanol, etc.) which is a heat transfer material and a wick (420) may be disposed in the internal space to exchange heat generated from a heat source (e.g., the processor (120) of FIG. 1). According to one embodiment, the wick (420) may be composed of a porous material such as mesh or powder. As a result, the heat dissipation member (400) can improve the heat exchange efficiency of the electronic device (101).

[0116] The wick (420) may include a first wick portion (421) and a second wick portion (422). According to one embodiment, the first wick portion (421) may include a first-1 wick portion (4211), a first-2 wick portion (4212), and a first-3 wick portion (4213), and the second wick portion (422) may be placed on top of the first-3 wick portion (4213).

[0117] According to one embodiment, the first-1 wick portion (4211) may be positioned at a location corresponding to a heat source (e.g., the processor (120) of FIG. 1). The first-1 wick portion (4211) may be positioned to cover the second plate (430) at a location corresponding to a heat source (e.g., the processor (120) of FIG. 1). A space for accommodating fluid may be formed above the first-1 wick portion (4211).

[0118] According to one embodiment, the first-second wick portion (4212) may be positioned over at least a portion of the battery (e.g., the battery (350) of FIG. 5). The first-second wick portion (4212) may be positioned to cover the second plate (430) over at least a portion of the battery (e.g., the battery (350) of FIG. 5). Additionally, the first-second wick portion (4212) may be positioned to extend in a first direction (e.g., X-axis direction) at an edge adjacent to the heat source (e.g., the processor (120) of FIG. 1) of the battery (e.g., the battery (350) of FIG. 5).

[0119] According to one embodiment, the first-third wick portion (4213) may be formed to extend from one end of the first-second wick portion (4212) in a second direction (e.g., -Y-axis direction) at a position corresponding to the battery (e.g., battery (350) in FIG. 5) and the fingerprint sensor (e.g., fingerprint sensor (390) in FIG. 7). The first-third wick portion (4213) may be positioned to cover the second plate (430) at a position corresponding to the battery (e.g., battery (350) in FIG. 5) and the fingerprint sensor (e.g., fingerprint sensor (390) in FIG. 7). Additionally, the first-third wick portion (4213) may be a plurality of wicks substantially parallel to the second direction (e.g., Y-axis direction).

[0120] According to one embodiment, a slit (S) may be formed in the first wick portion (421) that penetrates at least a portion of the first-1 wick portion (4211) and at least a portion of the first-2 wick portion (4212). According to one embodiment, the slit (S) may be formed to penetrate the portion adjacent to the first-2 wick portion (4212) of the first-1 wick portion (4211). According to one embodiment, the slit (S) may be formed in a narrow area in the first direction (e.g., X-axis direction) of the internal space formed by the case (410, 430). According to one embodiment, the slit (S) may be formed in a second area (e.g., the second area (a2) of FIG. 9) to be described later. According to one embodiment, the slit (S) can effectively allow a heat transfer material to flow in a second region (e.g., the second region (a2) of FIG. 9) to be described later.

[0121] In the present disclosure and the embodiments below, the first wick portion (421) is described as being divided into a plurality of portions (e.g., first-1 wick portion (4211), first-2 wick portion (4212), first-3 wick portion (4213)), but the first wick portion (421) can be integrated to form a single wick.

[0122] In the present disclosure and the embodiments below, the structure of the first wick portion (421) is specifically defined, but is not limited thereto. The structure of the first wick portion (421) may have various shapes of FIGS. 16 to 24 described later, provided that it increases the fluidity of the heat transfer material and thus increases the heat exchange efficiency of the electronic device (101).

[0123] According to one embodiment, the second wick portion (422) is positioned at a location corresponding to the battery (e.g., battery (350) in FIG. 5) and the fingerprint sensor (e.g., fingerprint sensor (390) in FIG. 7) and may be positioned over at least one part of the first-third wick portion (4213). According to one embodiment, the second wick portion (422) is positioned at a location corresponding to the battery (e.g., battery (350) in FIG. 5) and the fingerprint sensor (e.g., fingerprint sensor (390) in FIG. 7) and may be a plurality of wicks (420) formed extending in a second direction (e.g., -Y-axis direction) from the first-second wick portion (4212).

[0124] In the present disclosure and the embodiments below, the first-third wick portion (4213) and the second wick portion (422), which are positioned at locations corresponding to the battery (e.g., battery (350) in FIG. 5) and the fingerprint sensor (e.g., fingerprint sensor (390) in FIG. 7), are described as two different wicks (420), but are not limited thereto. The wick (420) may be a structure in which the first-third wick portion (4213) and the second wick portion (422) are combined and integrated, or it may be a single wick in a folded form as shown in the example of FIG. 20 described later.

[0125] FIG. 9 is a side view of a heat dissipation member (400) according to one embodiment of the present disclosure. FIG. 10 is a part of a cross-sectional view of a heat dissipation member (400) according to one embodiment of the present disclosure. FIG. 11 is a part of a cross-sectional view of a heat dissipation member (400) according to one embodiment of the present disclosure. FIG. 12 is a part of a cross-sectional view of a heat dissipation member (400) according to one embodiment of the present disclosure.

[0126] Referring to FIG. 9, the area corresponding to the processor (e.g., the processor (120) of FIG. 1) in the internal space of the heat dissipation member (400) can be defined as the first area (a1). Additionally, the area corresponding to the battery (e.g., the battery (350) of FIG. 5) in the internal space of the heat dissipation member (400) can be defined as the third area (a3). Furthermore, the area corresponding to the fingerprint sensor (390) in the internal space of the heat dissipation member (400) can be defined as the fourth area (a4), and the area connecting the first area (a1) and the third area (a2) can be defined as the second area (a2).

[0127] Generally, the heat transfer material inside the heat dissipation member (400) in the first region (a1) can be vaporized by a heat source (e.g., the processor (120) of FIG. 1). Afterward, the heat transfer material vaporized in the first region (a1) can transfer the heat generated from the heat source (e.g., the processor (120) of FIG. 1) in the first region (a1) to a third region (a3) ​​and / or a fourth region (a4), which has a relatively larger area than the first region (a1). As a result, heat exchange of the electronic device (101) can be achieved.

[0128] According to one embodiment, the heat transfer material may be configured to be liquefied in the third region (a3) ​​and / or the fourth region (a4) and then transferred back to the first region (a1) through the first-third wick portion (4213) and / or the second wick portion (422) disposed in the third region (a3) ​​and / or the fourth region (a4). Based on the general operating principle of the heat dissipation member (400), the structure of the wick (420) may have various shapes (e.g., various shapes of FIGS. 16 to 24 to be described later) provided that the movement of fluid within the heat dissipation member (400) can be facilitated.

[0129] Referring to FIGS. 10 to 12, at least one portion of the heat dissipation member (400) may be bent in a fourth region (a4). According to one embodiment, the heat dissipation member (400) may be bent in an area adjacent to the fingerprint sensor (390). As a result, at least one portion of the heat dissipation member (400) may overlap with the fingerprint sensor (390) when viewed from above. According to one embodiment, at least one portion of the heat dissipation member (400) may be bent so that the heat dissipation member (400) can be extended to the fingerprint sensor (390). As a result, the area of ​​the heat dissipation member (400) inside the electronic device (101) increases, and the heat exchange efficiency inside the electronic device (101) can be improved.

[0130] According to one embodiment, the internal space of a heat dissipation member (400) arranged in parallel with the fingerprint sensor (390) in a first direction (e.g., X-axis direction) in an area adjacent to the fingerprint sensor (390) can be defined as a 4-1 area (a41). Additionally, the internal space of the heat dissipation member (400) that overlaps with the fingerprint sensor (390) when viewed from above can be defined as a 4-2 area (a42).

[0131] According to one embodiment, the internal space of the heat dissipation member (400) in which at least a portion of the heat dissipation member (400) is bent in an area adjacent to the fingerprint sensor (390) may be referred to as the fourth-third area (a43). The fourth-third area (a43) may refer to the internal space disposed between the bent portions when at least a portion of the first plate (410) and / or the second plate (430) is bent. Additionally, the internal space of the heat dissipation member (400) between a plurality of bending areas (R) may be referred to as the fourth-third area (a43). According to one embodiment, the fourth-third area (a43) may be bent into various shapes to ensure heat exchange efficiency near the fingerprint sensor (390).

[0132] According to one embodiment, the first plate (410) may be bent in a plurality of bending areas (R11, R12) to form a recess area in which a fingerprint sensor (390) is placed. Additionally, the second plate (430) may be bent in a plurality of bending areas (R21, R22) corresponding to the recess area.

[0133] According to one embodiment, the area corresponding between the 4-1 area (a41) and the 4-3 area (a43) among the bending areas (R) of the first plate (410) may be referred to as the 1-1 bending area (R11), and the area corresponding between the 4-2 area (a42) and the 4-3 area (a43) may be referred to as the 1-2 bending area (R12). In addition, the 1-1 bending area (R11) and the 1-2 bending area (R12) may be formed spaced apart in a third direction (e.g., Z-axis direction) when viewed from a second direction (e.g., Y-axis direction). As a result, an inclined surface may be formed between the 1-1 bending area (R11) and the 1-2 bending area (R12), and this may be referred to as the 1-1 inclined surface (411). According to one embodiment, the first inclined surface (411) may be positioned at a location corresponding to the fourth-third area (a43).

[0134] According to one embodiment, the area corresponding between the 4-1 area (a41) and the 4-3 area (a43) among the bending areas (R) of the second plate (430) may be referred to as the 2-1 bending area (R21), and the area corresponding between the 4-2 area (a42) and the 4-3 area (a43) may be referred to as the 2-2 bending area (R22). In addition, the 2-1 bending area (R21) and the 2-2 bending area (R22) may be formed spaced apart in a third direction (e.g., Z-axis direction) when viewed from a second direction (e.g., Y-axis direction). As a result, an inclined surface may be formed between the 2-1 bending area (R21) and the 2-2 bending area (R22), and this may be referred to as the second inclined surface (431). According to one embodiment, the second inclined surface (431) may be positioned at a location corresponding to the fourth-third area (a43).

[0135] In the present disclosure and the embodiments below, the first plate (410) and the second plate (430) are each bent twice to form two bending regions (R), and a single inclined surface (411, 431) is formed between the two bending regions (R), but this is not limited thereto. For example, if the fluidity of the heat transfer material in the fourth-third region (a43), which represents the internal space between the bending regions (R), can be secured and the heat exchange efficiency improved, a plurality of bending regions (R) may be formed and an inclined surface may be formed between each bending region (R).

[0136] According to one embodiment, in order to ensure fluidity of the heat transfer material in the 4-3 region (a43) and to improve heat exchange efficiency, the bending curvature in at least one bending region (R11, R12) of the first plate (410) and the bending curvature in at least one bending region (R21, R22) of the second plate (430) may be formed differently. Additionally, the first curvature related to the first inclined surface (411) between two adjacent bending regions (R11, R12) on the first plate (410) and the second curvature related to the second inclined surface (431) between two adjacent bending regions (R21, R22) on the second plate (430) may be formed differently from each other.

[0137] According to one embodiment, the spaced-apart gap between the first plate (410) and the second plate (430) at a position corresponding to the 4-1 region (a41) and / or the 4-2 region (a42) may be referred to as the first gap (D1). According to one embodiment, the gap between the flat regions among the gaps between the first plate (410) and the second plate (430) may be referred to as the first gap (D1).

[0138] According to one embodiment, the gap between the first inclined surface (411) and the second inclined surface (431) may be referred to as the second gap (D2). According to one embodiment, the spaced gap between the first plate (410) and the second plate (430) at a position corresponding to the fourth-third region (a43) may be referred to as the second gap (D2). According to one embodiment, the length of the line perpendicular to the tangent at a point at a position corresponding to the fourth-third region (a43) of the first plate (410) and the second plate (430) may be referred to as the second gap (D2). The second gap (D2) may be formed as a single value, but may also have various values.

[0139] According to one embodiment, the first inclined surface (411) and the second inclined surface (431) may be formed with uneven spacing. For example, the second spacing (D2), which is the distance between the first inclined surface (411) and the second inclined surface (431), may be uneven depending on the position where it is measured.

[0140] According to one embodiment, the first inclined surface (411) and the second inclined surface (431) may be formed with a second gap (D2) that is larger than the first gap (D1) between the flat area of ​​the first plate (410) and the flat area of ​​the second plate (430). According to one embodiment, the minimum value of the second gap (D2) may be greater than or equal to the first gap (D1). Additionally, if the fluidity of the heat transfer material in the 4-3 region (a43) can be secured and the heat exchange efficiency improved, at least some value of the second gap (D2) may be greater than the first gap (D1).

[0141] According to one embodiment, the flow of the heat transfer material in the 4-3 region (a43) may vary depending on the bent bending curvature of the 1st plate (410) and / or the 2nd plate (430). According to one embodiment, the bending curvature of the 4-3 region (a43) may be formed into a shape that has good heat exchange efficiency depending on the size and shape of the fingerprint sensor (390), and the shape and internal structure of the heat dissipation member (400).

[0142] In this city, the bending curvature in the 4-3 region (a43) is approximately 30 degrees, and the first plate (410) and the second plate (430) are bent with the same curvature, as described as an example, but is not limited thereto and can be bent into various shapes as shown in FIGS. 13 to 15.

[0143] According to one embodiment, the heat transfer material can flow from the 4-1 region (a41) through the 4-3 region (a43) to the 4-2 region (a42) below the fingerprint sensor (390). As a result, the heat transfer material can flow to the vicinity of the fingerprint sensor (390), and the heat exchange efficiency can be improved.

[0144] Referring to FIGS. 11 and 12, in order to facilitate the smooth flow of the heat transfer material, the 4-3 region (a43) may be configured with at least one part extended. According to one embodiment, in FIGS. 11 and 12, the portion corresponding to the 4-3 region (a43) of the first plate (410) or the second plate (430) may be extended by bending into a curved shape in order to facilitate the smooth flow of the heat transfer material. FIGS. 11 and 12 illustrate, for example, that one of the first plate (410) and the second plate (430) is extended by bending into a curved shape, but is not limited thereto. For example, both the first plate (410) and the second plate (430) may be extended, and when viewed from a second direction (e.g., the Y-axis direction), they may be extended in a bent shape using at least one straight line.

[0145] According to one embodiment, when the bent portion of the first plate (410) and / or the second plate (430) is extended, a space for the heat transfer material to move in the fourth-third region (a43) can be secured, and the heat exchange efficiency of the electronic device (101) can be improved.

[0146] FIG. 13 is a part of a cross-sectional view in which a portion of a heat dissipation member (400) is cut along line A-A' of FIG. 9 according to one embodiment of the present disclosure. FIG. 14 is a part of a cross-sectional view in which a portion of a heat dissipation member (400) is cut along line B-B' of FIG. 9 according to one embodiment of the present disclosure. FIG. 15 is a part of a cross-sectional view in which a portion of a heat dissipation member (400) is cut along line C-C' of FIG. 9 according to one embodiment of the present disclosure.

[0147] Referring to FIGS. 13 through 15, the first plate (410) and the second plate (430) may be bent at different parts when bent in an area adjacent to the fingerprint sensor (390). According to one embodiment, when viewed from a third direction (e.g., Z-axis direction), at least one part of the bending portion of the first plate (410) and the bending portion of the second plate may be placed in an overlapping manner. According to one embodiment, when viewed from a third direction (e.g., Z-axis direction), at least one part of the bending portion of the first plate (410) and the fingerprint sensor (390) may be placed in an overlapping manner. Additionally, when viewed from a third direction (e.g., Z-axis direction), at least one part of the bending portion of the second plate (430) may be placed in an overlapping manner with the fingerprint sensor (390).

[0148] According to one embodiment, the bending angle of the first plate (410) and the bending angle of the second plate (430) may be different. In the present disclosure and the embodiments below, the bending angle of the second plate (430) is described as being greater than the bending angle of the first plate (410), but is not limited thereto. For example, as described above, the bending angle of the first plate (410) and the bending angle of the second plate (430) may be the same, and the bending angle of the first plate (410) may be greater than the bending angle of the second plate (430).

[0149] Referring to FIG. 13, according to a cross-section in which the heat dissipation member (400) in the fourth region (a4) is cut along line A-A' parallel to the first direction (e.g., X-axis direction) and passing through the fingerprint sensor (390), the fingerprint sensor (390) may be placed on the first plate (410). According to one embodiment, when viewed from the second direction (e.g., Y-axis direction), the fingerprint sensor (390) may be placed between the bent regions of the first plate (410). According to one embodiment, when viewed from the second direction (e.g., Y-axis direction), at least a portion of the first plate (410) may be bent, and the second plate (430) may not be bent. As a result, additional space is secured for the heat transfer material to flow in the first direction (e.g., X-axis direction), so the heat exchange efficiency due to the flow of the heat transfer material may be improved.

[0150] Referring to FIG. 14, if the heat dissipation member (400) in the fourth region (a4) is cut along line B-B' which is parallel to the second direction (e.g., Y-axis direction) and does not pass through the fingerprint sensor (390), the fingerprint sensor (390) may not be positioned between the areas where the second plate (430) is bent when viewed from the first direction (e.g., X-axis direction). However, in order to effectively move the heat transfer material under the fingerprint sensor (390), at least one part of the second plate (430) may be bent when the heat transfer material flows in the second direction (e.g., -Y-axis direction) from the fourth-1 region (a41). According to one embodiment, the area within the internal space of the heat dissipation member (400) that corresponds to the part where at least one part of the second plate (430) is bent may be referred to as the fourth-3 region (a43). As a result, the heat transfer material can flow in a second direction (e.g., the -Y-axis direction), and the heat exchange efficiency can be improved due to the flow of the heat transfer material.

[0151] Referring to FIG. 15, if the heat dissipation member (400) in the fourth region (a4) is cut along a line C-C' parallel to the second direction (e.g., Y-axis direction) and passing through the fingerprint sensor (390), the fingerprint sensor (390) may be placed on the first plate (410) when viewed from the first direction (e.g., X-axis direction). According to one embodiment, the fingerprint sensor (390) may be placed between a bent portion of the first plate (410) when viewed from the first direction (e.g., X-axis direction). According to one embodiment, at least a portion of the first plate (410) and at least a portion of the second plate (430) may be bent when viewed from the first direction (e.g., X-axis direction). According to one embodiment, the bending angle of the second plate (430) may be greater than the bending angle of the first plate (410), thereby allowing the heat transfer material to effectively move through the fourth-3 region (a43) to the fourth-2 region (a42) below the fingerprint sensor (390). When the heat transfer material flows in the second direction (e.g., the -Y-axis direction) from the fourth-1 region (a41), at least a portion of the first plate (410) and / or the second plate (430) may be bent. According to one embodiment, the area within the internal space of the heat dissipation member (400) corresponding to the portion where at least a portion of the first plate (410) and / or the second plate (430) is bent may be referred to as the fourth-3 region (a43). As a result, the heat transfer material can flow in a second direction (e.g., -Y-axis direction), the heat transfer material can flow under the fingerprint sensor (390), and the heat exchange efficiency due to the flow of the heat transfer material can be improved.

[0152] FIG. 16 is an exploded view of a heat dissipation member (400) according to one embodiment of the present disclosure. FIG. 17 is a part of a cross-sectional view of a heat dissipation member (400) cut along line D-D' of FIG. 16 according to one embodiment of the present disclosure.

[0153] Referring to FIGS. 16 and 17, at least one part of the first plate (410) may be bent to ensure the fluidity of the heat transfer material in the first region (a1). When viewed from a second direction (e.g., the Y-axis direction), at least one part of the first plate (410) may be bent into a trapezoidal shape. According to one embodiment, at least one part of the bent portion of the first plate (410) may come into contact with at least one part of the wick (420). Additionally, the wick (420) that at least one part of the first plate (410) comes into contact with may be a first-1 wick portion (4211). Due to the effect according to FIG. 24 to be described later, when the first plate (410) is bent into a shape like FIG. 17, the heat transfer material in the first region (a1) can be effectively flowed.

[0154] In this city, when viewed from a second direction (e.g., the Y-axis direction), at least one part of the first plate (410) is bent into a trapezoidal shape, but is not limited thereto. For example, when the first region (a1) is viewed from a second direction (e.g., the Y-axis direction), at least one part of the first plate (410) may be square-shaped, and the first plate (410) may not be bent in the first region (a1).

[0155] FIG. 18 is a part of a cross-sectional view in which a portion of a heat dissipation member (400) is cut along line E-E' of FIG. 16 according to one embodiment of the present disclosure.

[0156] Referring to FIG. 18, a wick (420) may be formed by stacking to ensure the fluidity of the heat transfer material in the fourth region (a4). According to one embodiment, the wick (420) is stacked in the fourth region (a4) to separate the space where the heat transfer material flows in the fourth region (a4) into at least two spaces. According to one embodiment, the stacked wick (420) may horizontally separate the space where the heat transfer material flows in the fourth region (a4). According to one embodiment, the stacked wick (420) may separate the space where the heat transfer material flows in the fourth region (a4) into a plurality of spaces arranged in a first direction (e.g., X-axis direction).

[0157] According to one embodiment, a second wick portion (422) may be placed on top of the first-third wick portion (4213). The second wick portion (422) may come into contact with the first-third wick portion (4213) and the first plate (410). As a result, the first-third wick portion (4213) and the second wick portion (422) may horizontally separate the space where the heat transfer material flows in the fourth region (a4).

[0158] FIG. 19 is a part of a cross-sectional view in which a portion of a heat dissipation member (400) according to one embodiment of the present disclosure is cut. FIG. 20 is a part of a cross-sectional view in which a portion of a heat dissipation member (400) according to one embodiment of the present disclosure is cut.

[0159] Referring to FIGS. 19 and 20, the 1-3 wick portion (4213) may also be placed in the 4-2 region (a42), which is the area below the aforementioned fingerprint sensor (390). According to one embodiment, the wick (420) may come into contact with the 1st plate (410) and the 2nd plate (430) in the 4-2 region (a42). As a result, the wick (420) placed in the 4-2 region (a42) can also horizontally separate the space where the heat transfer material flows in the 4-2 region (a42) of the heat dissipation member (400). Furthermore, instead of a structure in which multiple wicks are stacked, a single wick may be bent and formed thickly, thereby allowing the 4-2 region (a42) to be horizontally separated.

[0160] FIG. 21 is a perspective view of a heat dissipation member (400) according to one embodiment of the present disclosure. FIG. 22 is a part of a cross-sectional view of a heat dissipation member (400) cut along line F-F' of FIG. 22 according to one embodiment of the present disclosure. FIG. 23 is a part of a cross-sectional view of a heat dissipation member (400) cut along line F-F' of FIG. 22 according to one embodiment of the present disclosure.

[0161] Referring to FIGS. 21 to 23, at least one protrusion (411) may be formed on the first plate (410) to ensure the fluidity of the heat transfer material in the second region (a2). According to one embodiment, at least one protrusion (411) and / or wick (420) may be arranged in the second region (a2) to separate the space where the heat transfer material flows in the second region (a2) into at least two spaces. According to one embodiment, at least one protrusion (411) and / or wick (420) may horizontally separate the space where the heat transfer material flows in the second region (a2). According to one embodiment, at least one protrusion (411) and / or wick (420) may separate the space where the heat transfer material flows in the fourth region (a4) into a plurality of spaces arranged in a first direction (e.g., X-axis direction). As a result, the fluid flow rate in the second region (a2) is increased, and the heat transfer material can effectively flow to the fourth region (a4).

[0162] Referring to FIG. 22, the wicks (4211a, 4211b) can horizontally separate the second region (a2) by contacting the protrusion (411) in a first direction (e.g., X-axis direction) and contacting the first plate (410) and the second plate (430) in a second direction (e.g., Z-axis direction). According to one embodiment, among the spaces separated by the wicks (4211a, 4211b) in the second region (a2), the space outside the wicks (4211a, 4211b) can be defined as the second-1 wick region (a21), and the space inside the wicks (a22). Additionally, at least one part of the second-2 wick portion (a22) may be a slit (S).

[0163] Referring to FIG. 23, the wicks (4211a, 4211b) can horizontally separate the second region (a2) by contacting the protrusion (411) and the second plate (430) in a first direction (e.g., X-axis direction). According to one embodiment, among the spaces separated by the wicks (4211a, 4211b) in the second region (a2), the space outside the wicks (4211a, 4211b) can be defined as the second-1 wick region (a21), and the space inside the wicks (a22). Additionally, at least one part of the second-2 wick portion (a22) may be a slit (S).

[0164] FIG. 24 is a drawing illustrating the effect of a heat dissipation member (400) according to one embodiment of the present disclosure.

[0165] Referring to FIG. 24, when the cross-sectional area of ​​a fluid flow path is the same and the fluid flows under the same pressure difference, the fluid flow velocity may be faster when the cross-sectional area of ​​the path is square than when the cross-sectional area of ​​the path is rectangular. For example, referring to FIG. 24, in the case of a path with a square cross-sectional area, the average flow velocity may be about 1.6 times faster than that of a path with a rectangular cross-sectional area in a 4:1 ratio. In addition, in the case of a path with a square cross-sectional area, the flow velocity in the internal region of the path may be about 1.4 times faster than the average flow velocity of the path with the square cross-sectional area.

[0166] According to the bending structure and / or arrangement structure of the wick (420) of FIGS. 16 to 23 described above, a flow path having a cross-sectional area of ​​a square or similar shape can be formed to increase the flow velocity of the heat transfer material in the internal space. According to one embodiment, according to the bending structure and / or arrangement structure of the wick (420) of FIGS. 16 to 23, the path through which the heat transfer material flows can be horizontally separated to increase the flow velocity of the heat transfer material in the internal space. As a result, the heat exchange efficiency of the heat dissipation member (400) can be improved.

[0167] FIG. 25 is an exploded view of a heat dissipation member (400) according to one embodiment of the present disclosure.

[0168] Referring to FIG. 25, the wick may include at least two slits (S). The first slit (S1a) may include a first-1 slit (S11a) placed in a second region and a first-2 slit (S12a) formed extending to a fourth region (a4). Additionally, the first-2 slit (S12a) may be substantially parallel to a second direction (e.g., the Y-axis direction). Furthermore, the slit (S) may further include a second slit (S2a) formed in the fourth region (a4) substantially parallel to the second direction (e.g., the Y-axis direction). The slit (S) may be formed in multiple shapes and is not limited to the shapes of the slit (S) in the illustration and the embodiments below. For example, in this city, the first-1 slit (S11a) and the first-2 slit (S12a) are described as being integrated, but they can be formed separately.

[0169] FIG. 26 is an exploded view of a heat dissipation member (400) according to one embodiment of the present disclosure. FIG. 27 is an exploded view of a heat dissipation member (400) according to one embodiment of the present disclosure.

[0170] Referring to FIGS. 26 and 27, the slit structure of FIGS. 8 and 26 described above can be applied to other types of heat dissipation members (400). In the above-described embodiment, the heat dissipation member (400) is configured to completely cover the area corresponding to the heat source, but this is not limited thereto. For example, as shown in the illustration, if heat generated from the heat source can be dispersed, the heat dissipation member (400) may be configured to cover at least a portion of the heat source. Furthermore, in the case of a heat dissipation member (400) as shown in the illustration, the slit (S) structure of FIGS. 8 and 25 described above may also be applied.

[0171] FIG. 28 is a side view of a heat dissipation member (400) according to one embodiment of the present disclosure. FIG. 29 is a side view of an electronic device including a heat dissipation member (400) according to one embodiment of the present disclosure.

[0172] Referring to FIGS. 28 and 29, the heat dissipation member (400) may further include a graphite layer (G). The graphite layer (G) is composed mainly of carbon atoms. The graphite layer (G) is composed of a material having high thermal conductivity and can serve to effectively dissipate heat from the heat dissipation member (400). According to one embodiment, at least a portion of the heat dissipation member (400) may be replaced with the graphite layer (G), such as in the hinge structure of the foldable electronic device (101) in FIG. 28 and the fourth region (a4) which overlaps with the fingerprint sensor (390) in FIG. 29. This increases the thermal conductivity of the electronic device (101), thereby maximizing heat dissipation performance and improving the heat exchange efficiency of the electronic device (101).

[0173] FIG. 30 is a drawing illustrating the effect of a heat dissipation member (400) according to one embodiment of the present disclosure.

[0174] Referring to FIG. 30, at least a portion of the heat dissipation member (400) is bent in the fourth region (a4), which is an area adjacent to the fingerprint sensor (390), to extend the heat dissipation member (400), and by improving the arrangement structure of the wick (420) in the second region (a2) and the fourth region (a4), the hydraulic pressure when the heat transfer material flows becomes stronger than in the comparative example, and as a result, heat exchange can occur more effectively inside the electronic device (101). According to one embodiment, the heat dissipation member (400) is extended to an area corresponding to the fingerprint sensor (390) to increase the heat exchange efficiency of the heat dissipation member (400). According to one embodiment, the heat dissipation member (400) may be partially bent in an area corresponding to the fingerprint sensor (390), and the bending curvature of the first plate (410) may be formed differently from the bending curvature of the second plate (430) so that the flow of the heat transfer material may be increased. According to one embodiment, the bending area of ​​the first plate (410) and the bending area of ​​the second plate (430) may be separated, and as a result, the flow of the heat transfer material may be increased. According to one embodiment, the heat exchange efficiency of the heat dissipation member (400) may be increased by forming a slit (S) in the second area (a2), which is an area corresponding to the neck of the heat dissipation member (400), or by utilizing the arrangement structure of the wick (420) inside the heat dissipation member (400) to horizontally separate the space where the heat transfer material flows.

[0175] The present disclosure relates to an electronic device. According to one embodiment of the present disclosure, an electronic device (101) comprises: a housing (301) configured to form the exterior of the electronic device; a processor disposed inside the housing; a fingerprint sensor (390) disposed spaced apart from the processor inside the housing; and a heat dissipation member (400) configured to contact the processor directly or through a heat-conducting material, wherein the heat dissipation member (400) comprises a case, a heat transfer material configured to flow in the internal space of the case (410, 430), and a wick disposed in the internal space of the case, wherein the case (410, 430) comprises a first plate (410) bent in a fourth region (a4) corresponding to the fingerprint sensor (390) and a second plate (430) bent in the fourth region (a4) coupled to the first plate (410), and the bending curvature of the first plate (410) is the second It may be an electronic device formed differently from the bending curvature of the plate (430).

[0176] According to one embodiment, the heat dissipation member may be an electronic device comprising a first region (a1) corresponding to the processor, a third region (a3) ​​corresponding to the battery, and a second region (a2) connecting the first region (a1) and the third region (a3), wherein the first plate (410) and the second plate (430) are bent in a fourth region (a4), and when viewed from a first direction substantially perpendicular to the longitudinal direction of the electronic device (101), the bent portions of the first plate (410) and the second plate (430) overlap, and when viewed from a second direction substantially parallel to the longitudinal direction of the electronic device (101), the bent portions of the first plate (410) and the second plate (430) do not overlap.

[0177] According to one embodiment, the heat dissipation member (400) may be an electronic device further comprising a slit (S) formed in the wick (420), wherein at least one part of the slit (S) is formed in a second region (a2).

[0178] According to one embodiment, the slit (S) may be an electronic device formed in a plurality of places in a fourth region (a4) substantially parallel to the second direction.

[0179] According to one embodiment, at least one of the plurality of slits formed in the fourth region (a4) may be an electronic device that extends to the second region (a2).

[0180] According to one embodiment, the wick (420) may be an electronic device comprising a plurality of wick layers (421, 422) stacked and arranged in the fourth region (a4).

[0181] According to one embodiment, the plurality of wick layers (421, 422) may be an electronic device that contacts the first plate (410) and the second plate (420) to divide the fourth region (a4) into a plurality of spaces substantially parallel to the second direction.

[0182] According to one embodiment, at least one part of the divided spaces may be an electronic device that overlaps with the fingerprint sensor (390) when viewed from above.

[0183] According to one embodiment, the wick (420) may be an electronic device comprising a first wick portion (421) comprising a first-1 wick portion (4211) disposed in the first region (a1), a first-2 wick portion (4212) disposed at an edge adjacent to the first region (a1) of the third region (a3), and a first-3 wick portion (4213) disposed in the fourth region (a4), and a second wick portion (422) disposed on the first-3 wick portion (4213).

[0184] According to one embodiment, the first-third wick portion (4213) may be an electronic device configured to form a plurality of wicks substantially parallel to the second direction in the fourth region (a4), and the second wick portion (422) may be configured to be positioned on the first-third wick portion (4213) and to be in contact with the second plate (410).

[0185] According to one embodiment, the first-1 wick portion may be an electronic device comprising at least one slit (S).

[0186] According to one embodiment, the heat dissipation member (400) may be an electronic device further comprising a graphite layer (G).

[0187] According to one embodiment, the graphite layer (G) may be an electronic device formed in a fourth region (a4).

[0188] According to one embodiment, the electronic device may be such that the cross-section of the space where the heat transfer material of the fourth region (a4) flows, cut by a plane perpendicular to the second direction, is square.

[0189] According to one embodiment, the case (410, 430) may be an electronic device comprising at least one of aluminum, titanium, stainless steel, and copper.

[0190] The present disclosure relates to a heat dissipation member. According to one embodiment of the present disclosure, the heat dissipation member (400) comprises a case, a heat transfer material configured to flow in the internal space of the case (410, 430), and a wick disposed in the internal space of the case, wherein the case (410, 430) comprises a first plate (410) having at least one portion bent and a second plate (430) having at least one portion bent and coupled to the first plate (410), wherein the bending curvature of the first plate (410) is formed differently from the bending curvature of the second plate (430).

[0191] According to one embodiment, the first plate (410) and the second plate (430) may be heat dissipation members, wherein the first plate (410) and the second plate (430) are bent in a fourth region (a4) which is a region corresponding to the fingerprint sensor (390), and when viewed from a first direction substantially perpendicular to the longitudinal direction of the electronic device (101), the bent portions of the first plate (410) and the second plate (430) overlap, and when viewed from a second direction substantially parallel to the longitudinal direction of the electronic device (101), the bent portions of the first plate (410) and the second plate (430) do not overlap.

[0192] According to one embodiment, the heat dissipation member may further include a slit (S) formed in the wick (420), wherein at least one part of the slit (S) is formed in a second region (a2).

[0193] According to one embodiment, the slit (S) may be a heat dissipation member in which at least one part is formed in a place where the width in the first direction is narrow.

[0194] According to one embodiment, the slit (S) may be a heat dissipation member formed in a plurality of places substantially parallel to the second direction.

[0195] The present disclosure relates to an electronic device. According to one embodiment of the present disclosure, an electronic device (101) comprises: a housing (301) configured to form the exterior of the electronic device; a processor disposed inside the housing; a fingerprint sensor (390) disposed inside the housing spaced apart from the processor and the electronic device in the longitudinal direction; and a heat dissipation member (400) formed extending from the processor to the fingerprint sensor (390) in the longitudinal direction of the electronic device and configured to dissipate heat generated from the processor, wherein the heat dissipation member (400) comprises a case, a heat transfer material configured to flow in the internal space of the case (410, 430), and a wick disposed in the internal space of the case, wherein the case (410, 430) comprises a first plate (410) bent in a plurality of bending areas (R11, R12) to form a recess area in which the fingerprint sensor (390) is disposed, and a plurality of bending areas (R21, R22) coupled with the first plate (410) and corresponding to the recess area. The electronic device may include a bent second plate (430), wherein the bending curvature in at least one bending region (R11, R12) of the first plate (410) is formed differently from the bending curvature in at least one bending region (R21, R22) of the second plate (430).

[0196] According to one embodiment, the first curvature associated with the first inclined surface (411) between two adjacent bending regions (R11, R12) on the first plate (410) and the second curvature associated with the second inclined surface (431) between two adjacent bending regions (R21, R22) on the second plate (430) are formed differently from each other, and the first inclined surface (411) and the second inclined surface (431) are formed unevenly spaced apart, and the electronic device may be formed in such a way.

[0197] According to one embodiment, the first inclined surface (411) and the second inclined surface (431) may be an electronic device formed by being spaced apart by a second gap (D2) that is larger than the first gap (D1) between the flat area of ​​the first plate (410) and the flat area of ​​the second plate (430).

[0198] The present disclosure relates to a heat dissipation member. According to one embodiment of the present disclosure, the heat dissipation member (400) comprises a case, a heat transfer material configured to flow in the internal space of the case (410, 430), and a wick disposed in the internal space of the case, wherein the case (410, 430) comprises a first plate (410) bent in a plurality of bending regions (R11, R12) to form a recess region, and a second plate (430) coupled to the first plate (410) and bent in a plurality of bending regions (R21, R22) corresponding to the recess region, and the bending curvature in at least one bending region (R11, R12) of the first plate (410) is formed differently from the bending curvature in at least one bending region (R21, R22) of the second plate (430).

[0199] According to one embodiment, the first curvature associated with the first inclined surface (411) between two adjacent bending regions (R11, R12) on the first plate (410) and the second curvature associated with the second inclined surface (431) between two adjacent bending regions (R21, R22) on the second plate (430) are formed differently from each other, and the first inclined surface (411) and the second inclined surface (431) are formed unevenly spaced apart, and the heat dissipation member may be formed in such a way.

[0200] According to one embodiment, the heat dissipation member can be extended to an area corresponding to the fingerprint sensor to increase the heat exchange efficiency of the heat dissipation member.

[0201] According to one embodiment, the heat dissipation member may be partially bent in an area corresponding to the fingerprint sensor, and the bending curvature of the first plate may be formed differently from the bending curvature of the second plate so that the flow of the heat transfer material may be increased.

[0202] According to one embodiment, the bending region of the first plate and the bending region of the second plate can be separated, and as a result, the flow of the heat transfer material can be increased.

[0203] According to one embodiment, the heat exchange efficiency of the heat dissipation member can be increased by forming a slit in an area corresponding to the neck portion of the heat dissipation member or by utilizing the arrangement structure of the wick inside the heat dissipation member to horizontally separate the space where the heat transfer material flows.

[0204] The electronic device (101) described through the embodiment of the present disclosure described above is not limited by the aforementioned embodiment and drawings, and it will be obvious to those skilled in the art that various substitutions, modifications, and changes are possible within the technical scope of the present invention.

Claims

In the electronic device (101), Housing (301) configured to form the exterior of an electronic device; A processor disposed inside the above housing; A fingerprint sensor (390) spaced apart from the processor and the electronic device in the longitudinal direction within the housing; and A heat dissipation member (400) is formed extending in the longitudinal direction of the electronic device from the processor to the fingerprint sensor (390) and configured to dissipate heat generated from the processor, comprising a case, a heat transfer material configured to flow in the internal space of the case (410, 430), and a wick disposed in the internal space of the case. The above case (410, 430) comprises a first plate (410) bent in a plurality of bending areas (R11, R12) to form a recess area in which the fingerprint sensor (390) is placed, and a second plate (430) bent in a plurality of bending areas (R21, R22) that are coupled to the first plate (410) and correspond to the recess area. An electronic device in which the bending curvature in at least one bending region (R11, R12) of the first plate (410) is formed differently from the bending curvature in at least one bending region (R21, R22) of the second plate (430). In Article 1, The first curvature associated with the first inclined surface (411) between two adjacent bending regions (R11, R12) on the first plate (410) and the second curvature associated with the second inclined surface (431) between two adjacent bending regions (R21, R22) on the second plate (430) are formed differently from each other, An electronic device in which the first inclined surface (411) and the second inclined surface (431) are formed unevenly spaced apart. In Article 1 or Article 2, An electronic device in which the first inclined surface (411) and the second inclined surface (431) are formed by being spaced apart by a second gap (D2) that is larger than the first gap (D1) between the flat area of ​​the first plate (410) and the flat area of ​​the second plate (430). In any one of paragraphs 1 to 3, The above heat dissipation member is, A first region (a1) corresponding to the above processor; A third region (a3) ​​corresponding to the battery above; and It includes a second region (a2) connecting the first region (a1) and the third region (a3), and The above fourth region (a4) extends from the third region (a3), and The heat dissipation member (400) further includes a slit (S) formed in the wick (420), and The above slit (S) is an electronic device in which at least a portion is formed in a second region (a2). In any one of paragraphs 1 to 4, The above-mentioned heat dissipation member (400) comprises a plurality of slits (S) substantially parallel to the second direction in a fourth region (a4), and at least one of the plurality of slits formed in the fourth region (a4) extends to the second region (a2), an electronic device. In any one of paragraphs 1 to 5, The electronic device, wherein the wick (420) comprises a plurality of wick layers (421, 422) stacked and arranged in the fourth region (a4). In any one of paragraphs 1 to 6, The above plurality of wick layers (421, 422) are in contact with the first plate (410) and the second plate (420) to divide the fourth region (a4) into a plurality of spaces substantially parallel to the second direction, an electronic device. In any one of paragraphs 1 to 7, At least one part of the above divided spaces is an electronic device that overlaps with the fingerprint sensor (390) when viewed from above. In any one of paragraphs 1 through 8, The wick (420) comprises a first wick portion (421) including a first-1 wick portion (4211) disposed in the first region (a1), a first-2 wick portion (4212) disposed at the corner adjacent to the first region (a1) in the third region (a3), and a first-3 wick portion (4213) disposed in the fourth region (a4); and An electronic device comprising a second wick portion (422) positioned on the first-third wick portion (4213) above. In any one of paragraphs 1 through 9, The above 1-3 wick portions (4213) are configured to form a plurality of wicks substantially parallel to the second direction in the above 4 region (a4), and An electronic device, wherein the second wick portion (422) is positioned over the first-third wick portion (4213) and configured to contact the second plate (410). In any one of Articles 1 to 10, The above-mentioned 1-1 wick portion comprises at least one slit (S), an electronic device. In any one of paragraphs 1 to 11, The above heat dissipation member (400) further comprises a graphite layer (G), in an electronic device. In any one of paragraphs 1 to 12, The above graphite layer (G) is formed in the fourth region (a4), an electronic device. In any one of paragraphs 1 to 13, An electronic device in which the cross-section of the space in which the heat transfer material of the fourth region (a4) flows is cut by a plane perpendicular to the second direction is square. In any one of paragraphs 1 to 14, The above case (410, 430) is an electronic device comprising at least one of aluminum, titanium, stainless steel, and copper.

Images