Method for preparing electrode assembly

Abstract

Provided in some embodiments of the present application is a method for preparing an electrode assembly. In the method for preparing an electrode assembly, the electrode assembly and a separator are arranged between a first film layer structure and a second film layer structure, and are surrounded by an encapsulation edge formed by the first film layer structure and the second film layer structure. Since the separator is located outside the electrode assembly, at least a portion of the encapsulation edge can be conveniently cut off by cutting a position corresponding to the separator, such that at least a part of a connection between the first film layer structure and the second film layer structure has an opening, and the connection between the first film layer structure and the second film layer structure can be quickly opened from the opening, thereby improving the convenience of production of the electrode assembly, and facilitating an improvement in the production efficiency.

Description

A method for manufacturing an electrode assembly Cross-reference to related applications

[0001] This application claims priority to Chinese Patent Application No. 202411376553.7, filed on September 30, 2024, entitled “A method for manufacturing an electrode assembly”, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the technical field of battery device production, and in particular relates to a method for manufacturing an electrode assembly. BACKGROUND

[0003] Battery devices have advantages such as high specific energy and high power density, and are widely used in electronic devices and vehicles, such as mobile phones, notebook computers, electric vehicles, electric cars, electric planes, electric ships, and electric tools.

[0004] With the increasing demand for battery devices, how to improve the production efficiency of battery devices is increasingly concerned by those skilled in the art. SUMMARY

[0005] In view of the above problems, the present application provides a method for manufacturing an electrode assembly, which is beneficial to improve the convenience of electrode assembly production and improve production efficiency.

[0006] In a first aspect, some embodiments of the present application provide a method for manufacturing an electrode assembly, the method comprising the following steps: providing a first film layer structure, a second film layer structure, and a separator; placing the electrode assembly and the separator between the first film layer structure and the second film layer structure, the first film layer structure and the second film layer structure being sealingly connected to form an encapsulation edge, wherein the separator is located outside the electrode assembly, and the encapsulation edge surrounds the electrode assembly and the separator; performing isostatic pressing on the electrode assembly; cutting at a position corresponding to the separator to remove at least part of the encapsulation edge; separating the first film layer structure from the second film layer structure, and taking out the electrode assembly.

[0007] In the above scheme, the electrode assembly and the separator are arranged between the first film layer structure and the second film layer structure, and are surrounded by the encapsulation edge formed by the first film layer structure and the second film layer structure. Since the separator is located outside the electrode assembly, at least part of the encapsulation edge can be conveniently removed by cutting at a position corresponding to the separator, so that at least part of the connection between the first film layer structure and the second film layer structure is opened, and the connection between the first film layer structure and the second film layer structure can be quickly opened from the opening, thereby improving the convenience of electrode assembly production and improving production efficiency.

[0008] According to the method for manufacturing the electrode assembly provided by some embodiments of the present application, the electrode assembly and the separator are placed between the first film layer structure and the second film layer structure, and the first film layer structure and the second film layer structure are sealingly connected to form an encapsulation edge, wherein the separator is located outside the electrode assembly, and the step of surrounding the electrode assembly and the separator with the encapsulation edge comprises the following steps: placing the electrode assembly and the separator on the first film layer structure, with the separator located outside the electrode assembly; covering the second film layer structure on the first film layer structure, the separator and the electrode assembly; and sealingly connecting the second film layer structure to the first film layer structure to form the encapsulation edge, with the encapsulation edge surrounding the electrode assembly and the separator.

[0009] According to the method for manufacturing the electrode assembly provided by some embodiments of the present application, the separator is configured in an annular structure, and the step of placing the electrode assembly and the separator on the first film layer structure, with the separator located outside the electrode assembly comprises the following steps: placing the electrode assembly on the first film layer structure; and placing the separator on the first film layer structure and outside the electrode assembly.

[0010] According to the method for manufacturing the electrode assembly provided by some embodiments of the present application, the electrode assembly and the separator are placed between the first film layer structure and the second film layer structure, and the first film layer structure and the second film layer structure are sealingly connected to form an encapsulation edge, wherein the separator is located outside the electrode assembly, and the step of surrounding the electrode assembly and the separator with the encapsulation edge comprises the following steps: placing a first magnetic member on the first film layer structure; placing the electrode assembly on the first magnetic member; placing the separator on the first film layer structure, with the separator located outside the electrode assembly and the first magnetic member; placing a second magnetic member on the electrode assembly; covering the second film layer structure on the first film layer structure, the separator and the second magnetic member; and sealingly connecting the second film layer structure to the first film layer structure to form the encapsulation edge, with the first magnetic member, the electrode assembly and the second magnetic member being stacked between the first film layer structure and the second film layer structure, and the encapsulation edge surrounding the first magnetic member, the second magnetic member, the electrode assembly and the separator.

[0011] According to the method for manufacturing the electrode assembly provided by some embodiments of the present application, the step of separating the first film layer structure from the second film layer structure and taking out the electrode assembly comprises the following steps: applying a magnetic force to the first magnetic member and the second magnetic member, so that the first magnetic member and the second magnetic member pull the first film layer structure away from the second film layer structure; and taking out the electrode assembly.

[0012] According to the method for manufacturing the electrode assembly provided by some embodiments of the present application, the step of separating the first film layer structure from the second film layer structure and taking out the electrode assembly comprises the following steps: adsorbing the first film layer structure and the second film layer structure, so that the first film layer structure is separated from the second film layer structure; and taking out the electrode assembly.

[0013] According to the method for manufacturing the electrode assembly provided by some embodiments of the present application, the width of the packaging edge is set as L1, and the width of the partition is set as L2, L2>L1.

[0014] According to the method for manufacturing the electrode assembly provided by some embodiments of the present application, the electrode assembly and the partition are vacuum heat sealed between the first film layer structure and the second film layer structure.

[0015] In the first aspect, some embodiments of the present application provide a method for manufacturing an electrode assembly, which comprises the following steps: providing a first film layer structure; providing a first magnetic member and placing the first magnetic member on the first film layer structure; placing an electrode assembly on the first magnetic member; providing a second magnetic member and placing the second magnetic member on the electrode assembly; providing a second film layer structure and sealingly connecting the first film layer structure and the second film layer structure to form a packaging edge, the first magnetic member, the electrode assembly and the second magnetic member being stacked between the first film layer structure and the second film layer structure; performing isostatic pressing on the electrode assembly; and applying a magnetic force to the first magnetic member and the second magnetic member to separate the first film layer structure and the second film layer structure and take out the electrode assembly.

[0016] In the above scheme, since the first magnetic member is clamped between the first film layer structure and the electrode assembly, and the second magnetic member is clamped between the second film layer structure and the electrode assembly, when the first magnetic member and the second magnetic member are separated by the magnetic force, the first film layer structure outside the first magnetic member and the second film layer structure outside the second magnetic member are pulled apart, so that at least part of the connection between the first film layer structure and the second film layer structure is opened, and the connection between the first film layer structure and the second film layer structure can be quickly opened from the opening, which is beneficial to improve the convenience of electrode assembly production.

[0017] The technical solutions provided by the embodiments of the present application at least bring the following beneficial effects:

[0018] Some embodiments of the present application provide a method for manufacturing an electrode assembly, in which the electrode assembly and the partition are arranged between the first film layer structure and the second film layer structure and surrounded by the packaging edge formed by the first film layer structure and the second film layer structure. Since the partition is located outside the electrode assembly, at least part of the packaging edge can be conveniently cut off by cutting the position corresponding to the partition, so that at least part of the connection between the first film layer structure and the second film layer structure is opened, and the connection between the first film layer structure and the second film layer structure can be quickly opened from the opening, which improves the convenience of electrode assembly production and is beneficial to improve the production efficiency.

[0019] The above description is only a summary of the technical solutions of the present application. In order to make the technical means of the present application more clearly understood and implemented according to the content of the description, and in order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the following specific embodiments of the present application are described. BRIEF DESCRIPTION OF DRAWINGS

[0020] Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The accompanying drawings are included to provide a description of the preferred embodiments and are not meant to limit the present application. Furthermore, the same reference numerals are used throughout the several views that follow. In the drawings:

[0021] FIG. 1 is a flowchart of a method for preparing an electrode assembly according to a first embodiment of the present application;

[0022] FIG. 2 is a schematic view of an electrode assembly according to the first embodiment of the present application encapsulated in an encapsulation film;

[0023] FIG. 3 is a schematic view of the encapsulation film after being cut according to the first embodiment of the present application;

[0024] FIG. 4 is a flowchart of step S2 in the method for preparing an electrode assembly according to the first embodiment of the present application;

[0025] FIG. 5 is a flowchart of step S21 in the method for preparing an electrode assembly according to the first embodiment of the present application;

[0026] FIG. 6 is a flowchart of step S2 in the method for preparing an electrode assembly according to a second embodiment of the present application;

[0027] FIG. 7 is a schematic view of an electrode assembly according to the second embodiment of the present application encapsulated in an encapsulation film;

[0028] FIG. 8 is a schematic view of the encapsulation film after being cut according to the second embodiment of the present application;

[0029] FIG. 9 is a flowchart of a method for preparing an electrode assembly according to a third embodiment of the present application;

[0030] FIG. 10 is a schematic view of an electrode assembly according to the third embodiment of the present application encapsulated in an encapsulation film;

[0031] FIG. 11 is a schematic view of the encapsulation film after being cut according to the third embodiment of the present application.

[0032] In the drawings:

[0033] 1, first film layer structure; 2, second film layer structure; 3, separator; 4, encapsulation edge; 5, first magnetic member; 6, second magnetic member; 7, electrode assembly. DETAILED DESCRIPTION

[0034] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0035] Unless otherwise defined, all technical and scientific terms used in the present application have the same meanings as those commonly understood by one of ordinary skill in the art to which the present application belongs; the terms used in the present application are only for the purpose of describing the specific embodiments of the present application and are not intended to limit the present application; the terms "include" and "have" and any variations thereof in the present application and the claims and the above description of drawings are intended to cover the non-exclusive inclusion. The terms "first", "second" and the like in the present application and the claims or the above description of drawings are used to distinguish different objects, not to describe a particular order or primary and secondary relationships.

[0036] In the present application, the phrase "embodiments" means that the specific features, structures or characteristics described in connection with the embodiments can be included in at least one embodiment of the present application. The phrase appears at various places in the specification does not necessarily all refer to the same embodiments, nor is it necessarily independent or alternative embodiments to each other.

[0037] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mount", "connect", "connection", "attach" should be understood broadly, for example, can be fixedly connected, can be detachably connected, or integrally connected; can be directly connected, or indirectly connected through an intermediate medium; can be internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0038] In the present application, the term "and / or" is only a description of the association relationship between the associated objects, which means that there can be three relationships, for example, A and / or B can mean that A exists alone, A and B exist together, and B exists alone. In addition, the character " / " in the present application generally represents an "or" relationship between the associated objects before and after it.

[0039] In the embodiments of the present application, the same reference signs represent the same components, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments. It should be understood that the thickness, length, width, and other dimensions of various components in the embodiments of the present application shown in the drawings, and the overall thickness, length, width, and other dimensions of the integrated device are only exemplary and should not constitute any limitation on the present application.

[0040] In the embodiments of the present application, "parallel" not only includes the case of absolute parallel, but also includes the case of approximately parallel as generally recognized in engineering; at the same time, "perpendicular" not only includes the case of absolute perpendicular, but also includes the case of approximately perpendicular as generally recognized in engineering. Exemplarily, the included angle between two directions is 85°-90°, which can be considered as the two directions being perpendicular; the included angle between two directions is 0°-5°, which can be considered as the two directions being parallel.

[0041] "Multiple" appearing in the present application refers to two or more (including two).

[0042] At present, from the development of market situation, the application of battery device is more and more extensive. The battery device is not only applied to energy storage power supply systems such as hydroelectric, thermal, wind and solar power stations, but also widely applied to electric bicycles, electric motorcycles, electric vehicles and other electric vehicles, military equipment, aerospace and other fields.

[0043] The battery device mentioned in the embodiments of the present application can include one or more battery cell assemblies for providing voltage and capacity. The battery cell assembly can include a plurality of battery cells connected in series, parallel or mixed connection through a busbar component.

[0044] In some embodiments, the battery cell assembly is usually formed by arranging a plurality of battery cells; as an example, the battery cell assembly can be a battery module, which is formed by arranging and fixing a plurality of battery cells into an independent module. As an example, the battery module can be formed by bundling a plurality of battery cells with a cable tie.

[0045] In some embodiments, the battery device can be a battery pack, which includes a box body and one or more battery cell assemblies, and the battery cell assemblies are accommodated in the box body. As an example, the battery cell assembly can be a battery module, which can be accommodated in the box body by fixing the battery module in the box body. As an example, the battery cell assembly can also be accommodated in the box body by directly fixing a plurality of battery cells in the box body.

[0046] The battery cell generally comprises an electrode assembly and an electrolyte. The electrode assembly comprises a positive electrode and a negative electrode. During the charging and discharging of the battery cell, active ions (e.g., lithium ions) are embedded and extracted between the positive electrode and the negative electrode. The electrolyte serves to conduct ions between the positive and negative electrodes. The type of electrolyte is not specifically limited in the present application and can be selected as needed. The electrolyte can be in a liquid, gel or solid state.

[0047] The solid-state battery cell comprises an electrode sheet and a solid-state electrolyte. In the production process of the electrode assembly, in order to improve the electrical performance of the electrode assembly, it is usually necessary to perform isostatic pressing on the electrode assembly. In the prior art, before isostatic pressing is performed on the electrode assembly, the electrode assembly is usually packaged using a packaging film, and after isostatic pressing is completed, the packaging film is torn open so as to further process or handle the electrode assembly.

[0048] At present, after the electrode assembly packaged by the packaging film is subjected to isostatic pressing, the packaging films are often adhered together, and the process of tearing open the packaging films is relatively difficult, which affects the improvement of production efficiency.

[0049] In order to improve the convenience of electrode assembly production and improve production efficiency, some embodiments of the present application provide a preparation method of an electrode assembly, in which the electrode assembly and a partition are arranged between a first film layer structure and a second film layer structure, and are surrounded by a packaging edge formed by the first film layer structure and the second film layer structure. Since the partition is located outside the electrode assembly, at least part of the packaging edge can be conveniently cut off by cutting the position corresponding to the partition, so that at least part of the connection between the first film layer structure and the second film layer structure appears an opening, and the connection between the first film layer structure and the second film layer structure can be quickly opened from the opening, thereby improving the convenience of electrode assembly production and facilitating the improvement of production efficiency.

[0050] Some embodiments of the present application provide a preparation method of an electrode assembly 7, as shown in FIG. 1, which comprises the following steps:

[0051] S1, providing a first film layer structure 1, a second film layer structure 2 and a partition 3.

[0052] The first film layer structure 1 and the second film layer structure 2 can be film layer structures for packaging the electrode assembly 7. The first film layer structure 1 and the second film layer structure 2 both have good sealing and isolation effects, and can well isolate the electrode assembly 7 from the outside after packaging the electrode assembly 7, thereby reducing the possibility of pressure transmission medium penetrating into the electrode assembly 7 during isostatic pressing of the electrode assembly 7.

[0053] For example, the first membrane structure 1 and the second membrane structure 2 can be aluminum-plastic film. Since aluminum-plastic film has good barrier properties, the first membrane structure 1 and the second membrane structure 2 can achieve good isolation from the outside world after encapsulating the electrode assembly 7.

[0054] The separator 3 can be a component used to separate the first membrane structure 1 and the second membrane structure 2. The separator 3 can reduce the adhesion between the first membrane structure 1 and the second membrane structure 2 at the separation position, so that the first membrane structure 1 and the second membrane structure 2 at the corresponding separation position of the separator 3 can be smoothly separated. The separator 3 can be made of a material that is not easy to adhere to the first membrane structure 1 and the second membrane structure 2, such as non-adhesive, so that the first membrane structure 1 and the second membrane structure 2 at the corresponding separation position of the separator 3 can be smoothly separated.

[0055] S2. Place the electrode assembly 7 and the separator 3 between the first film structure 1 and the second film structure 2. Referring to Figure 2, the first film structure 1 and the second film structure 2 are sealed together to form an encapsulation edge 4, wherein the separator 3 is located outside the electrode assembly 7, and the encapsulation edge 4 surrounds the electrode assembly 7 and the separator 3.

[0056] In step S2, by placing the electrode assembly 7 and the separator 3 between the first film structure 1 and the second film structure 2, so that the edge portions of the first film structure 1 and the second film structure 2 are sealed together, the first film structure 1 and the second film structure 2 can form an encapsulation film, so that the electrode assembly 7 and the separator 3 can be encapsulated in the encapsulation film.

[0057] The encapsulation edge 4 can be the part where the first film layer structure 1 and the second film layer structure 2 are sealed together, and it is located at the edge of the encapsulation film. Since the encapsulation edge 4 formed by the sealing connection of the first film layer structure 1 and the second film layer structure 2 surrounds the electrode assembly 7 and the spacer 3, the electrode assembly 7 and the spacer 3 can be encapsulated between the first film layer structure 1 and the second film layer structure 2.

[0058] By placing the separator 3 on the outside of the electrode assembly 7, the portion corresponding to the separator 3 can be cut from the outside of the electrode assembly 7 near the edge when cutting the encapsulation film. This allows the encapsulation film to form an opening from the outside of the electrode assembly 7 near the edge, making it easier to quickly open the encapsulation film and improving the convenience of removing the encapsulation film.

[0059] S3. Perform isostatic pressing on electrode assembly 7.

[0060] In step S3, the electrode assembly 7 encapsulated between the first film structure 1 and the second film structure 2 is subjected to isostatic pressing, so that the electrode assembly 7 can obtain better electrical performance.

[0061] The isostatic pressing of the electrode assembly 7 can refer to placing the electrode assembly 7 in a closed high-pressure container, using the medium (liquid or gas) in the container to apply ultra-high pressure to the electrode assembly 7 in all directions, so that the electrode assembly 7 is better shaped and can obtain better electrical performance.

[0062] S4, cutting at a position corresponding to the separator 3 to cut off at least part of the packaging edge 4.

[0063] In step S4, the first film layer structure 1, the second film layer structure 2, and the separator 3 between the first film layer structure 1 and the second film layer structure 2 are cut by a cutter, as shown in FIG. 3, so that part of the separator 3 can be cut off together with the packaging edge 4, so that the first film layer structure 1 and the second film layer structure 2 separated by the separator 3 are easy to open, and the first film layer structure 1 and the second film layer structure 2 can be easily separated.

[0064] Cutting at a position corresponding to the separator 3 can be cutting the packaging film along the thickness direction of the first film layer structure 1, and cutting off part of the separator 3. Since the packaging edge 4 is around the outer periphery of the electrode assembly 7 and the separator 3, cutting off part of the separator 3 can cut off at least part of the packaging edge 4, so that the packaging film can form an opening.

[0065] S5, separating the first film layer structure 1 from the second film layer structure 2, and taking out the electrode assembly 7.

[0066] In the above step S5, separating the first film layer structure 1 from the second film layer structure 2 can be pulling the first film layer structure 1 and the second film layer structure 2 in opposite directions along the opening formed by the cutting in the foregoing steps, so that the first film layer structure 1 and the second film layer structure 2 are separated, and the electrode assembly 7 wrapped in the first film layer structure 1 and the second film layer structure 2 is taken out for subsequent processing.

[0067] In the above method, since the separator 3 is located outside the electrode assembly 7, at least part of the packaging edge 4 can be easily cut off by cutting at a position corresponding to the separator 3, so that at least part of the connection between the first film layer structure 1 and the second film layer structure 2 is opened, and the connection between the first film layer structure 1 and the second film layer structure 2 can be quickly opened from the opening, improving the convenience of producing the electrode assembly 7 and improving the production efficiency.

[0068] In some embodiments of the present application, referring to FIG. 4, step S2 includes:

[0069] S21, placing the electrode assembly 7 and the separator 3 on the first film layer structure 1, and the separator 3 is located outside the electrode assembly 7.

[0070] In step S21, the electrode assembly 7 and the separator 3 are placed on the first film layer structure 1. The first film layer structure 1 can be laid flat on a plane first, and then the electrode assembly 7 and the separator 3 are placed on the first film layer structure 1. The electrode assembly 7 can be placed on the first film layer structure 1 first, and then the separator 3 is placed on the first film layer structure 1. Alternatively, the separator 3 can be placed on the first film layer structure 1 first, and then the electrode assembly 7 is placed on the first film layer structure 1. The skilled person can choose according to the actual situation.

[0071] The separator 3 is located outside the electrode assembly 7. The separator 3 and the electrode assembly 7 can be placed side by side on the first film layer structure 1, and the separator 3 is closer to the edge of the first film layer structure 1 than the electrode assembly 7. Alternatively, the separator 3 can surround the outer periphery of the electrode assembly 7, so that the overall structure of the separator 3 is closer to the edge of the first film layer structure 1 than the electrode assembly 7.

[0072] By locating the separator 3 outside the electrode assembly 7, the separator 3 can be easily cut when cutting from the part close to the edge of the packaging film.

[0073] S22. Cover the first film layer structure 1, the separator 3 and the electrode assembly 7 with the second film layer structure 2.

[0074] In step S22, the second film layer structure 2 is covered on the first film layer structure 1, so that the second film layer structure 2 can cover the separator 3 and the electrode assembly 7, so that the edge of the first film layer structure 1 and the edge of the second film layer structure 2 can be sealed and connected to wrap the separator 3 and the electrode assembly 7.

[0075] S23. Seal and connect the second film layer structure 2 and the first film layer structure 1 to form a packaging edge 4, and the packaging edge 4 surrounds the electrode assembly 7 and the separator 3.

[0076] In step S23, the second film layer structure 2 and the first film layer structure 1 are sealed and connected to form a packaging edge 4. The edge of the second film layer structure 2 can be sealed and connected to the edge of the first film layer structure 1 to form a packaging film with a circumferential edge portion having a packaging edge 4. The packaging edge 4 surrounds the electrode assembly 7 and the separator 3, so that the packaging edge 4 is located at the edge portion of the packaging film, and the electrode assembly 7 and the separator 3 can be wrapped by the packaging film.

[0077] In some embodiments, the separator 3 is configured as an annular structure.

[0078] By configuring the partition 3 as a ring structure, the partition 3 can be sleeved on the outer periphery of the electrode assembly 7, so that after cutting the partition 3 at the corresponding position, the packaging film can form an opening that surrounds the electrode assembly 7 in a whole circle, so that the opening formed by cutting can better separate the first film layer structure 1 and the second film layer structure 2, and facilitate the separation of the first film layer structure 1 and the second film layer structure 2.

[0079] In some embodiments, referring to FIG. 5, the above step S21 includes:

[0080] S211, placing the electrode assembly 7 on the first film layer structure 1.

[0081] In step S21, first, step S211 is performed to place the electrode assembly 7 on the first film layer structure 1, so that the electrode assembly 7 can be more conveniently placed in the central region of the first film layer structure 1, facilitating the electrode assembly 7 to be located in the central region of the packaging film, so that the packaging film can achieve better packaging effect on the electrode assembly 7.

[0082] S212, placing the partition 3 on the first film layer structure 1 and sleeving the electrode assembly 7 outside.

[0083] After step S211 is performed, step S212 is performed, so that the partition 3 can be quickly placed on the first film layer structure 1 by sleeving on the outer periphery of the electrode assembly 7, which is conducive to improving the placement efficiency of the partition 3.

[0084] In some embodiments of the present application, the above step S5 includes:

[0085] S51, adsorbing the first film layer structure 1 and the second film layer structure 2 to separate the first film layer structure 1 from the second film layer structure 2.

[0086] In the above step S51, the first film layer structure 1 and the second film layer structure 2 are adsorbed from the outside by the suction cup to exert a mutual separation force on the first film layer structure 1 and the second film layer structure 2, so that at least part of the first film layer structure 1 and the second film layer structure 2 can be separated, facilitating the subsequent removal of the electrode assembly 7 from the packaging film.

[0087] S52, taking out the electrode assembly 7.

[0088] In the above step S52, the operator can detach the packaging film through the opening to take out the electrode assembly 7 when the first film layer structure 1 and the second film layer structure 2 are pulled apart and the opening is formed on the packaging film; or the operator can directly take down the electrode assembly 7 when the first film layer structure 1 and / or the second film layer structure 2 are completely separated from the electrode assembly 7 after the first film layer structure 1 and the second film layer structure 2 are pulled apart.

[0089] In some embodiments of the present application, the width of the packaging edge 4 is set as L1, and the width of the partition 3 is set as L2, L2>L1.

[0090] By setting the relationship between the width L1 of the packaging edge 4 and the width L2 of the partition 3 as L2>L1, the partition 3 has sufficient width, and when the packaging film formed by the first film layer structure 1 and the second film layer structure 2 is cut, the partition 3 can be cut to the corresponding position more easily.

[0091] In some embodiments, the electrode assembly 7 and the partition 3 are vacuum heat sealed between the first film layer structure 1 and the second film layer structure 2.

[0092] The vacuum heat sealing of the electrode assembly 7 and the partition 3 between the first film layer structure 1 and the second film layer structure 2 can mean that the electrode assembly 7 is packaged in the first film layer structure 1 and the second film layer structure 2 by using the vacuum heat sealing method. The first film layer structure 1 and the second film layer structure 2 are connected by heat melting, and the area between the first film layer structure 1 and the second film layer structure 2 accommodating the electrode assembly 7 and the partition 3 is pumped to form a vacuum area. The vacuum heat sealing packaging method not only makes the first film layer structure 1 and the second film layer structure 2 have good sealing property, but also makes the transmission medium not easy to penetrate into the electrode assembly 7, and makes the electrode assembly 7 can be better affected by the pressure transmitted by the transmission medium.

[0093] In some embodiments of the present application, referring to FIG. 6, step S2 can further include:

[0094] S21, placing a first magnetic member 5 on the first film layer structure 1.

[0095] The first magnetic member 5 can be a device that can generate a magnetic force under the action of the magnetic field of a magnet, so as to be attracted by the magnet. In the above step S21, by placing the first magnetic member 5 on the first film layer structure 1, the first magnetic member 5 can be located between the first film layer structure 1 and the electrode assembly 7, so that the first magnetic member 5 can drive the first film layer structure 1 to move away from the electrode assembly 7 under the action of the magnetic field of the external magnet.

[0096] By directly placing the first magnetic member 5 on the surface of the first film layer structure 1, the first magnetic member 5 can be relatively close to the outside of the packaging film, so that the first magnetic member 5 can more easily generate a magnetic force to be attracted by the magnet under the action of the magnetic field of the external magnet.

[0097] S22, placing the electrode assembly 7 on the first magnetic member 5.

[0098] In the above step S22, by placing the electrode assembly 7 on the first magnetic member 5, the first magnetic member 5 is located outside the electrode assembly 7, so that the first magnetic member 5 can drive the first film layer structure 1 away from the electrode assembly 7 when the first magnetic member 5 is away from the electrode assembly 7, facilitating the electrode assembly 7 to be taken out of the packaging film formed by the first film layer structure 1 and the second film layer structure 2.

[0099] S23, placing the partition 3 on the first film layer structure 1, the partition 3 is located outside the electrode assembly 7 and the first magnetic member 5.

[0100] In the above step S23, placing the partition 3 on the first film layer structure 1 and outside the electrode assembly 7 and the first magnetic member 5 can mean that the partition 3 has a ring structure, which is placed on the first film layer structure 1 and is sleeved on the outer periphery of the electrode assembly 7 and the first magnetic member 5, so that after cutting at the corresponding position of the partition 3, the packaging film can form an opening that surrounds the electrode assembly 7 for one full turn, so that the opening formed by cutting can better separate the first film layer structure 1 and the second film layer structure 2.

[0101] S24, placing the second magnetic member 6 on the electrode assembly 7.

[0102] The second magnetic member 6 can be a device that can generate a magnetic force under the action of the magnetic field of a magnet, so as to be attracted by the magnet. In the above step S24, by placing the second magnetic member 6 on the electrode assembly 7, the second magnetic member 6 can be located between the second film layer structure 2 and the electrode assembly 7, so that the second magnetic member 6 can drive the second film layer structure 2 away from the electrode assembly 7 in the process of being driven away from the electrode assembly 7 by the magnetic field of the external magnet.

[0103] By directly placing the second magnetic member 6 on the surface of the second film layer structure 2, the second magnetic member 6 can be relatively close to the outside of the packaging film, so that the second magnetic member 6 can more easily generate a magnetic force to be attracted by the magnet under the action of the magnetic field of the external magnet.

[0104] S25, covering the second film layer structure 2 on the first film layer structure 1, the partition 3 and the second magnetic member 6.

[0105] In the above step S25, by covering the second film layer structure 2 on the first film layer structure 1, the second film layer structure 2 can cover the partition 3, the electrode assembly 7 and the second magnetic member 6, and referring to FIG. 7, so that the edges of the first film layer structure 1 and the edges of the second film layer structure 2 can be sealed and connected to wrap the first magnetic member 5, the second magnetic member 6, the partition 3 and the electrode assembly 7.

[0106] S26, sealingly connecting the second film layer structure 2 with the first film layer structure 1 to form a packaging edge 4, the first magnetic member 5, the electrode assembly 7 and the second magnetic member 6 being stacked between the first film layer structure 1 and the second film layer structure 2, and the packaging edge 4 surrounding the first magnetic member 5, the second magnetic member 6, the electrode assembly 7 and the separator 3.

[0107] In the step S26, the second film layer structure 2 is sealingly connected with the first film layer structure 1 to form a packaging edge 4. In one embodiment, the edge of the second film layer structure 2 is sealingly connected with the edge of the first film layer structure 1 to form a packaging film with a circumferential edge portion having the packaging edge 4. In this embodiment, the packaging edge 4 surrounds the first magnetic member 5, the second magnetic member 6, the electrode assembly 7 and the separator 3, so that the packaging edge 4 is located at the edge portion of the packaging film, and the first magnetic member 5, the second magnetic member 6, the electrode assembly 7 and the separator 3 can be wrapped by the packaging film.

[0108] In this embodiment, the first magnetic member 5, the electrode assembly 7 and the second magnetic member 6 are sequentially stacked, so that the opposite sides of the electrode assembly 7 are provided with members capable of pulling the packaging film under the action of magnetic force, and the packaging films (the first film layer structure 1 and the second film layer structure 2) on the opposite sides of the electrode assembly 7 can be pulled apart.

[0109] In one embodiment, the electrode assembly 7 is prepared based on the first magnetic member 5 and the second magnetic member 6. After the step S4, the electrode assembly 7 is cut as shown in FIG. 8.

[0110] In some embodiments, the electrode assembly 7 is prepared based on the first magnetic member 5 and the second magnetic member 6. The step S5 includes the following steps:

[0111] S51, applying magnetic force to the first magnetic member 5 and the second magnetic member 6 to make the first magnetic member 5 and the second magnetic member 6 pull the first film layer structure 1 and the second film layer structure 2 apart.

[0112] In the step S51, the first magnetic member 5 and the second magnetic member 6 are attracted by the magnetic force and pulled apart under the action of the magnetic force, so that the first film layer structure 1 outside the first magnetic member 5 and the second film layer structure 2 outside the second magnetic member 6 are pulled apart, and the electrode assembly 7 can be easily taken out of the packaging film.

[0113] S52, taking out the electrode assembly 7.

[0114] In step S52, the operator can take out the electrode assembly 7 by tearing the packaging film through the opening after the first film layer structure 1 and the second film layer structure 2 are pulled apart and the opening is formed on the packaging film. Alternatively, the operator can directly take down the electrode assembly 7 after the first film layer structure 1 and the second film layer structure 2 are pulled apart and the first film layer structure 1 and / or the second film layer structure 2 are completely separated from the electrode assembly 7.

[0115] Some embodiments of the present application also provide a method for manufacturing the electrode assembly 7, as shown in FIG. 9. The method comprises the following steps:

[0116] S1, providing the first film layer structure 1.

[0117] In step S1, the provided first film layer structure 1 has good sealing and isolation effect. The first film layer structure 1 should be laid on a plane to facilitate the subsequent covering of other components on the first film layer structure 1.

[0118] S2, providing the first magnetic member 5 and placing the first magnetic member 5 on the first film layer structure 1.

[0119] As in the foregoing technical solution, the first magnetic member 5 can be a device capable of generating a magnetic force under the action of a magnetic field of a magnet, thereby being attracted by the magnet.

[0120] By placing the first magnetic member 5 on the electrode assembly 7, the first magnetic member 5 can be located between the first film layer structure 1 and the electrode assembly 7, so that the first magnetic member 5 can drive the first film layer structure 1 away from the electrode assembly 7 under the action of the magnetic field of the external magnet.

[0121] S3, placing the electrode assembly 7 on the first magnetic member 5.

[0122] In step S3, by placing the electrode assembly 7 on the first magnetic member 5, the first magnetic member 5 is located outside the electrode assembly 7, so that the first magnetic member 5 can drive the first film layer structure 1 away from the electrode assembly 7 when it moves away from the electrode assembly 7, facilitating the removal of the electrode assembly 7 from the packaging film formed by the first film layer structure 1 and the second film layer structure 2.

[0123] S4, providing the second magnetic member 6 and placing the second magnetic member 6 on the electrode assembly 7.

[0124] As in the foregoing technical solution, the second magnetic member 6 can be a device capable of generating a magnetic force under the action of a magnetic field of a magnet, thereby being attracted by the magnet.

[0125] In step S4, the second magnetic member 6 is placed on the electrode assembly 7 so that the second magnetic member 6 can be located between the second film layer structure 2 and the electrode assembly 7, and the second magnetic member 6 can drive the second film layer structure 2 away from the electrode assembly 7 under the magnetic field of the external magnet.

[0126] S5, the second film layer structure 2 is provided, and the first film layer structure 1 and the second film layer structure 2 are sealed and connected to form a packaging edge 4. Referring to FIG. 10, the first magnetic member 5, the electrode assembly 7 and the second magnetic member 6 are stacked between the first film layer structure 1 and the second film layer structure 2.

[0127] In step S5, the provided second film layer structure 2 has good sealing and isolation effect. By covering the second film layer structure 2 on the first film layer structure 1, the first magnetic member 5, the electrode assembly 7 and the second magnetic member 6, and sealing and connecting the edges of the first film layer structure 1 and the second film layer structure 2 to form the packaging edge 4, the first film layer structure 1 and the second film layer structure 2 can package the first magnetic member 5, the electrode assembly 7 and the second magnetic member 6 through the packaging edge 4.

[0128] Among them, the first magnetic member 5, the electrode assembly 7 and the second magnetic member 6 are stacked in turn, so that the electrode assembly 7 has components on the opposite sides which can pull the packaging film under the action of magnetic force, so that the packaging films (the first film layer structure 1 and the second film layer structure 2) on the opposite sides of the electrode assembly 7 can be pulled away.

[0129] S6, the electrode assembly 7 is subjected to isostatic pressing treatment.

[0130] In step S6, the electrode assembly 7 and the first magnetic member 5 and the second magnetic member 6 packaged in the first film layer structure 1 and the second film layer structure 2 are subjected to isostatic pressing treatment, so that the electrode assembly 7 can obtain better electrical performance.

[0131] S7, the first magnetic member 5 and the second magnetic member 6 are subjected to magnetic force to separate the first film layer structure 1 and the second film layer structure 2, and the electrode assembly 7 is taken out.

[0132] In step S7, the first magnetic member 5 and the second magnetic member 6 are subjected to magnetic force by applying magnetic force to the first magnetic member 5 and the second magnetic member 6 which are oppositely arranged on the two sides of the electrode assembly 7 in the packaging film, so that the first magnetic member 5 and the second magnetic member 6 can be attracted by the magnetic force respectively, and separated under the action of the magnetic force, so that the first film layer structure 1 outside the first magnetic member 5 and the second film layer structure 2 outside the second magnetic member 6 are pulled apart, so that the operator can easily take out the electrode assembly 7 from the packaging film.

[0133] In the above scheme, since the first magnetic member 5 is clamped between the first film layer structure 1 and the electrode assembly 7, and the second magnetic member 6 is clamped between the second film layer structure 2 and the electrode assembly 7, when the first magnetic member 5 and the second magnetic member 6 are separated by magnetic attraction, the first film layer structure 1 outside the first magnetic member 5 and the second film layer structure 2 outside the second magnetic member 6 are pulled apart, so that at least part of the connection between the first film layer structure 1 and the second film layer structure 2 is opened, and the connection between the first film layer structure 1 and the second film layer structure 2 can be quickly opened from the opening, which is beneficial to improve the convenience of production of the electrode assembly 7.

[0134] In some embodiments, the preparation method of the electrode assembly 7 further comprises the following steps after step S6:

[0135] S61, cutting off at least part of the packaging edge 4.

[0136] In the above step S61, by cutting off at least part of the packaging edge 4, the connection strength between the first film layer structure 1 and the second film layer structure 2 can be reduced, which is beneficial to more easily separate the first film layer structure 1 from the second film layer structure 2, and reduce the difficulty. The electrode assembly 7 with at least part of the packaging edge 4 cut off and the packaging film are shown in FIG. 11.

[0137] Compared with the preparation method of the electrode assembly 7 provided with the partition 3 between the first film layer structure 1 and the second film layer structure 2, the preparation method of the electrode assembly 7 can reduce the consumption of the partition 3, which is beneficial to reduce the cost of preparation of the electrode assembly 7.

[0138] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should be covered in the scope of the claims and the description of the present application. Especially, as long as there is no structural conflict, each technical feature mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A method for preparing an electrode assembly, comprising: providing a first film layer structure, a second film layer structure and a separator; placing the electrode assembly and the separator between the first film layer structure and the second film layer structure, the first film layer structure and the second film layer structure being sealedly connected to form a packaging edge, wherein the separator is located outside the electrode assembly, and the packaging edge surrounds the electrode assembly and the separator; isostatic pressing the electrode assembly; cutting at a position corresponding to the separator to cut off at least part of the packaging edge; separating the first film layer structure from the second film layer structure and taking out the electrode assembly.

2. The method of making an electrode assembly of claim 1, wherein, The step of placing the electrode assembly and the separator between the first film layer structure and the second film layer structure, the first film layer structure and the second film layer structure being sealedly connected to form a packaging edge, wherein the separator is located outside the electrode assembly, and the packaging edge surrounds the electrode assembly and the separator, comprises: placing the electrode assembly and the separator on the first film layer structure, the separator being located outside the electrode assembly; covering the first film layer structure, the separator and the electrode assembly with the second film layer structure; sealingly connecting the second film layer structure with the first film layer structure to form the packaging edge, the first magnetic member, the electrode assembly and the second magnetic member being stacked between the first film layer structure and the second film layer structure, and the packaging edge surrounding the first magnetic member, the second magnetic member, the electrode assembly and the separator.

3. The method of making an electrode assembly according to claim 2, wherein, The step of placing the electrode assembly and the separator on the first film layer structure, the separator being located outside the electrode assembly, comprises: placing the electrode assembly on the first film layer structure; placing the separator on the first film layer structure and outside the electrode assembly.

4. The method of making an electrode assembly of claim 1, wherein, The step of placing the electrode assembly and the separator between the first film layer structure and the second film layer structure, the first film layer structure and the second film layer structure being sealedly connected to form a packaging edge, wherein the separator is located outside the electrode assembly, and the packaging edge surrounds the electrode assembly and the separator, comprises: placing a first magnetic member on the first film layer structure; placing the electrode assembly on the first magnetic member; placing the separator on the first film layer structure, the separator being located outside the electrode assembly and the first magnetic member; placing a second magnetic member on the electrode assembly; covering the first film layer structure, the separator and the second magnetic member with the second film layer structure; sealingly connecting the second film layer structure with the first film layer structure to form the packaging edge, the first magnetic member, the electrode assembly and the second magnetic member being stacked between the first film layer structure and the second film layer structure, and the packaging edge surrounding the first magnetic member, the second magnetic member, the electrode assembly and the separator.

5. The method of making an electrode assembly according to claim 4, wherein, The step of separating the first film layer structure from the second film layer structure and taking out the electrode assembly, comprises: applying a magnetic force to the first magnetic member and the second magnetic member, so that the first magnetic member and the second magnetic member pull the first film layer structure and the second film layer structure apart; taking out the electrode assembly.

6. The method of making an electrode assembly of claim 1, wherein, The step of separating the first film layer structure from the second film layer structure and taking out the electrode assembly comprises: adsorbing the first film layer structure and the second film layer structure to separate the first film layer structure from the second film layer structure; taking out the electrode assembly.

7. The method of making an electrode assembly of claim 1, wherein, The width of the packaging edge is set as L1, and the width of the separator is set as L2, L2>L1.

8. The method of making an electrode assembly of claim 1, wherein, The electrode assembly and the separator are vacuum heat sealed between the first film layer structure and the second film layer structure.

9. A method for preparing an electrode assembly, comprising: providing a first film layer structure; providing a first magnetic member and placing the first magnetic member on the first film layer structure; placing an electrode assembly on the first magnetic member; providing a second magnetic member and placing the second magnetic member on the electrode assembly; providing a second film layer structure and sealingly connecting the first film layer structure and the second film layer structure to form a packaging edge, the first magnetic member, the electrode assembly and the second magnetic member being laminated between the first film layer structure and the second film layer structure; isostatic pressing the electrode assembly; applying a magnetic force to the first magnetic member and the second magnetic member to separate the first film layer structure from the second film layer structure and take out the electrode assembly.

10. The method of making an electrode assembly according to claim 9, wherein, After the step of isostatic pressing the electrode assembly, the method for preparing the electrode assembly further comprises: cutting off at least part of the packaging edge.

Images