Shield case and shield method

Abstract

The present invention further improves electromagnetic compatibility. A shield case 24 comprises: a main plate 24A that is disposed so as to face one surface of an imaging substrate (substrate) 12 on which an electronic component is mounted; and a plurality of plate pieces 24B that are aligned in a circumferential direction around the main plate 24A, and that are bent and extend to contact, with an elastic force, a peripheral end of the imaging substrate 12. The plate pieces 24B are formed so that lengths L1 and L2 over which the plate pieces extend from the main plate 24A are different. A long plate piece 24BA is provided so as to partially overlap the outside of a short plate piece 24BB which is adjacent thereto in the circumferential direction.

Description

Shield Case and Shielding Method

[0001] The present invention relates to a shield case and a shielding method.

[0002] For example, in Patent Document 1, it is shown that in a camera module, a shield case covering the upper surface of a sensor substrate is provided.

[0003] Also, for example, in Patent Document 2, it is shown that in a camera module, a substrate and a shield case are joined by solder filled in a space formed between the side surface of a notch portion of the substrate and the inner side surface of the shield case.

[0004] Also, for example, in Patent Document 3, a shield cover having a ceiling portion, four side wall portions extending at right angles to the four sides of the ceiling portion, extension portions formed on both sides of each side wall portion, and four corner portions extending at right angles to the four corners of the ceiling portion between adjacent side wall portions is shown. In this shield cover, each extension portion is bent and overlapped with each corner portion, and at each corner portion, it is attached to one surface of a circuit board by soldering.

[0005] JP-A-2012-113186 JP-A-2012-047816 JP-A-2007-207950

[0006] In a shield structure, electromagnetic compatibility, that is, it is required not to be an electromagnetic interference source, not to receive electromagnetic interference, or to operate normally even if it receives interference. For this reason, conventionally, as in the above-mentioned patent documents, covering a substrate with a box-shaped shield case has been performed. On the other hand, in recent years, with the improvement of the performance of electronic devices, further improvement of electromagnetic compatibility has been desired.

[0007] An object of the present disclosure is to provide a shield case and a shielding method capable of further improving electromagnetic compatibility.

[0008] To achieve the above objective, a shield case according to one aspect of the present disclosure includes a main plate disposed opposite to one side of a substrate on which electronic components are mounted, and a plurality of plate pieces that are bent and extended in a circumferential direction around the main plate and elastically contact the circumferential edge of the substrate, wherein each adjacent plate piece in the circumferential direction is formed to have a different length extending from the main plate, and the longer plate piece is provided overlapping the outside of the shorter plate piece.

[0009] To achieve the above objective, a shielding method according to one aspect of the present disclosure is a shielding method to which the above shielding case is applied, wherein a long plate piece is brought into contact with the peripheral edge of the substrate and bent, and then a short plate piece is brought into contact with the peripheral edge of the substrate, so that parts of the long plate piece and the short plate piece overlap and come into contact with each other.

[0010] This disclosure can further improve electromagnetic compatibility.

[0011] Figure 1 is a front-view perspective of the camera module according to the embodiment. Figure 2 is a rear-view perspective of the camera module according to the embodiment. Figure 3 is a plan view of the camera module according to the embodiment. Figure 4 is a cross-sectional view taken along line A-A in Figure 3. Figure 5 is a cross-sectional perspective view taken along line B-B in Figure 3. Figure 6 is a front-view perspective of the camera unit of the camera module according to the embodiment. Figure 7 is a rear-view perspective of the camera unit of the camera module according to the embodiment. Figure 8 is a plan view of the camera unit of the camera module according to the embodiment. Figure 9 is a front-view perspective of the shield case according to the embodiment. Figure 10 is a process diagram of the assembly method of the shield case according to the embodiment. Figure 11 is a process diagram of the assembly method of the shield case according to the embodiment. Figure 12 is a process diagram of the assembly method of the shield case according to the embodiment. Figure 13 is a process diagram of the assembly method of the shield case according to the embodiment. Figure 14 is a flowchart of the assembly method of the shield case according to the embodiment. Figure 15 is a process diagram of the manufacturing method of the camera module according to the embodiment. Figure 16 is a plan view of the lower mold of the insert mold for the manufacturing method of the camera module according to the embodiment. Figure 17 is a bottom view of the upper mold of the insert mold for the manufacturing method of the camera module according to the embodiment. Figure 18 is a process diagram of the manufacturing method of the camera module according to the embodiment. Figure 19 is a flowchart of the manufacturing method of the camera module according to the embodiment. Figure 20 is a plan view of another example of the camera module according to the embodiment. Figure 21 is a perspective view of an example of the installation configuration of the camera module according to the embodiment.

[0012] The embodiments for implementing this disclosure (hereinafter referred to as "embodiments") will be described in detail below with reference to the drawings. However, the present disclosure is not limited to the embodiments described below. Furthermore, the components in the embodiments described below include those that are readily conceivable to those skilled in the art, those that are substantially identical, and those that fall within the so-called equivalent range. Moreover, the components disclosed in the embodiments described below can be combined as appropriate.

[0013] Figures 1 to 5 show the camera module according to this embodiment. Figures 6 to 8 show the camera unit of the camera module according to this embodiment.

[0014] In the following explanation, each direction is defined based on the optical axis O of the camera module 1. Specifically, the direction along (parallel to) the optical axis O is defined as the front-to-back direction X, the direction in which the lens 11A points is "forward," and the opposite direction is "backward." The direction perpendicular to the front-to-back direction X horizontally is defined as the width direction Y. The direction perpendicular to both the front-to-back direction X and the width direction Y is defined as the up-and-down direction Z, the direction pointing upward is defined as "upward," and the direction pointing downward is defined as "downward." The front-to-back direction X, the width direction Y, and the up-and-down direction Z are orthogonal in three dimensions.

[0015] The camera module 1 of this embodiment is fixed, for example, inside or outside the vehicle to which it is to be mounted. The camera module 1 includes a camera unit 10, a frame 20, and an exterior resin 30.

[0016] As shown in Figures 4, 6 to 8, the camera unit 10 includes a lens section 11, an imaging substrate (substrate) 12, and an optical axis reference section 13.

[0017] The lens portion 11 holds the lens 11A. As shown in Figure 4, the lens portion 11 includes the lens 11A, the lens defining portion 11B, and the lens holding portion 11C. The lens 11A has an optical axis O extending parallel to the front-rear direction X from the center of its disc shape. The lens defining portion 11B defines the optical axis O of the lens 11A. The lens defining portion 11B is formed in a cylindrical shape so that the optical axis O passes through its interior, and its front surface abuts against the rear surface of the lens 11A, thereby defining the optical axis O of the lens 11A. The lens holding portion 11C holds the lens 11A together with the lens defining portion 11B. The lens holding portion 11C is formed in a ring shape so that the optical axis O passes through its interior, and functions to press the rear surface of the lens 11A against the front surface of the lens defining portion 11B by engaging the female thread 11Ca on its inner circumferential surface with the male thread 11Ba on the outer circumferential surface of the lens defining portion 11B and tightening them together.

[0018] The imaging substrate 12 is formed in the shape of a rectangular plate with thickness in the front-to-back direction X and planes facing in each direction in the up-and-down direction Z and each direction in the width direction Y. An image sensor 12A, which is an electronic component, is mounted on the front surface of the imaging substrate 12. The image sensor 12A has a center that coincides with the optical axis O of the lens portion 11. A connection terminal 12B is fixed to the rear surface of the imaging substrate 12. In addition, although not explicitly shown in the figure, other electronic components that constitute the circuit are mounted on the front and rear surfaces of the imaging substrate 12.

[0019] The optical axis reference unit 13 is fixed to the lens unit 11 and the imaging substrate 12, and aligns the optical axis O of the lens 11A with the center of the image sensor 12A. The optical axis reference unit 13 includes a positioning unit 13A and a fixing unit 13B.

[0020] The fixing portion 13B is formed in a cylindrical shape to fix the lens portion 11 inside. The fixing portion 13B defines the position of the lens portion 11 in two dimensions, in the width direction Y and the vertical direction Z, relative to itself by engaging the female thread 13Ba on its inner circumferential surface with the male thread 11Bb on the outer circumferential surface of the lens defining portion 11B of the lens portion 11. Furthermore, the fixing portion 13B defines the position of the lens portion 11 in the front-to-back direction X of the optical axis O relative to itself by adjusting the tightness of the engagement between the female thread 13Ba and the male thread 11Bb.

[0021] The fixing portion 13B is fixed to the imaging substrate 12 by adhesive 13C on the side opposite to the lens 11A of the fixed lens portion 11 in the front-rear direction X. When fixing the fixing portion 13B to the imaging substrate 12, the optical axis O of the lens 11A and the center of the image sensor 12A are aligned. For this reason, the optical axis reference portion 13 has a positioning portion 13A.

[0022] Multiple positioning sections 13A are provided on the outer circumference of the fixed section 13B (four locations in the embodiment). The positioning sections 13A are provided around the optical axis O of the lens 11A of the fixed lens section 11. The positioning sections 13A are provided at a total of four equal intervals (two locations in the embodiment) in the width direction Y and the vertical direction Z, which are perpendicular to the optical axis O (front-to-back direction X) of the lens 11A, with the optical axis O of the lens 11A as the center. Therefore, all positioning sections 13A coincide in the front-to-back direction X with respect to the optical axis O. In the vertical direction Z, the two upper positioning sections 13A that are aligned in the width direction Y are formed as recesses that open upwards. Also, in the vertical direction Z, the two lower positioning sections 13A that are aligned in the width direction Y are formed as recesses that open downwards.

[0023] The optical axis reference unit 13 is installed on a focus adjustment jig (not shown) with the lens unit 11 fixed to the fixing unit 13B, so that the projection of the focus adjustment jig fits into the positioning unit 13A. Thus, the optical axis reference unit 13 is installed on the focus adjustment jig so that the optical axis O of the lens 11A of the lens unit 11 is aligned with the focus adjustment chart (not shown) of the focus adjustment jig. The optical axis O of the lens 11A can be adjusted to match the focus adjustment chart by adjusting the tightness of the engagement between the female screw 13Ba of the fixing unit 13B and the male screw 11Bb of the lens regulating unit 11B. Furthermore, with the optical axis reference unit 13 installed on the focus adjustment jig, the imaging substrate 12 is fixed with adhesive 13C while aligning the center of the image sensor 12A with the focus adjustment chart. In this way, the optical axis reference unit 13 is fixed to the lens unit 11 and the imaging substrate 12, so that the optical axis O of the lens 11A and the center of the image sensor 12A are aligned. As mentioned above, the front-to-back X direction adjustment of the lens 11A can be adjusted to match the focus adjustment chart by adjusting the tightness of the engagement between the female screw 13Ba of the fixing part 13B and the male screw 11Bb of the lens reference part 11B. However, adjustment may also be made by using adhesive to suspend and fix the imaging substrate 12 and the optical axis reference part 13 without using screws.

[0024] Therefore, the camera unit 10 is assembled with the optical axis O of the lens 11A and the center of the image sensor 12A aligned, using the positioning part 13A of the optical axis reference part 13 as a reference. Although not shown in the diagram, in reality, there are multiple lenses inside the lens reference part 11B, and together with the lens 11A, multiple lenses form a lens assembly, and the optical axis O determined by these multiple lenses is aligned with the center of the image sensor 12A.

[0025] Returning to the description of the camera module 1, as shown in Figures 1 to 4, the frame portion 20 is positioned behind the camera unit 10. The frame portion 20 includes a base portion 21, a connector portion 22, a locking portion 23, and a shield case 24.

[0026] The base portion 21 is molded from a synthetic resin material and has a predetermined thickness in the front-to-back direction X, and is formed in a rectangular plate shape with planes facing in each direction in the width direction Y and each direction in the up-and-down direction Z. The base portion 21 has a positioning portion 21A.

[0027] The positioning portions 21A are provided in a total of four locations (two in the embodiment) at equal intervals in the width direction Y on a plane facing each direction in the vertical direction Z. The two upper positioning portions 21A aligned in the width direction Y on the upper plane in the vertical direction Z are formed as recesses that open upward. The two lower positioning portions 21A aligned in the width direction Y on the lower plane in the vertical direction Z are formed as recesses that open downward.

[0028] The connector portion 22 is integrally provided with the base portion 21 and is formed in a cylindrical shape that extends toward the rear. Inside the cylindrical shape of the connector portion 22 is a connecting fitting 22A that is connected to the connection terminal 12B fixed to the imaging substrate 12. The connecting fitting 22A extends forward from the connector portion 22, passing through the base portion 21, and is electrically connected to the connection terminal 12B of the camera unit 10 at the rear of the imaging substrate 12.

[0029] The locking portion 23 is integrally provided with the base portion 21 and is arranged along the connector portion 22. The locking portion 23 is formed as a projection into which the claws of a cable connector (not shown) of a recording device or the like, which is inserted into the connector portion 22 and electrically connected to the connecting fitting 22A, engage.

[0030] The shield case 24, as will be described in detail later, is fixed to the connecting fitting 22A and includes a plurality of plate pieces 24B that extend in the front-rear direction X and have elasticity in the width direction Y and the up-down direction Z. The shield case 24 is arranged so that each plate piece 24B faces the other in the width direction Y and the up-down direction Z. The shield case 24 is supported by the camera unit 10 by sandwiching the imaging substrate 12 of the camera unit 10 between the opposing plate pieces 24B.

[0031] Returning to the description of the camera module 1, as shown in Figures 1 to 4, the exterior resin 30 is formed by insert molding so as to cover the outside of the lens portion 11, the imaging substrate 12, and the optical axis reference portion 13 of the camera unit 10. The exterior resin 30 is integrally formed from a main exterior resin 31 that covers the outside of the imaging substrate 12 and the optical axis reference portion 13, and a sub-exterior resin 32 that covers the outside of the lens portion 11.

[0032] The main exterior resin 31 is formed of insert resin and, as shown in Figure 4, is positioned in front of the base 21 of the frame 20, covering the outer circumference of the shield case 24, the outer circumference of the optical axis reference portion 13, and the outer circumference of the adhesive 13C, and is positioned to extend into the interior of the shield case 24. Furthermore, as shown in Figure 5, the main exterior resin 31 is positioned so that the exterior reference portion 31A, which fits into the positioning portion 13A of the optical axis reference portion 13, is exposed to the outside.

[0033] The sub-exterior resin 32 is formed integrally with the main exterior resin 31 from an insert resin, and as shown in Figures 4 and 5, it is provided to continuously cover the outer circumference of a part of the lens holding portion 11C of the lens portion 11, the outer circumference of a part of the lens defining portion 11B, and the outer circumference of a part of the optical axis reference portion 13 in the front-to-back direction X.

[0034] Therefore, the exterior resin 30 continuously covers the outer periphery of the camera module 1 in the front-to-back direction X, from the lens holding portion 11C of the lens portion 11 to the frame portion 20.

[0035] Here, we will describe the detailed configuration of the shield case 24 and the shielding method for attaching the shield case 24 to the imaging substrate 12.

[0036] As described above, the shield case 24 is provided on the frame portion 20 and fixed to the connecting fitting 22A of the connector portion 22. As shown in Figures 4 and 9, the shield case 24 is formed of an elastic metal plate and includes a main plate 24A, a plurality of plate pieces 24B, and through holes 24C.

[0037] The main plate 24A is formed in a rectangular shape with thickness in the front-to-back direction X, and two sides facing each direction in the up-and-down direction Z and two sides facing each direction in the width direction Y. The main plate 24A is formed in a rectangular shape that is slightly larger than the rectangular shape of the imaging substrate 12. The main plate 24A is positioned with its front surface facing the rear surface (one of the plate surfaces) of the imaging substrate 12. The main plate 24A is fixed by the connecting fitting 22A passing through it.

[0038] The plate pieces 24B are formed by bending each side around the main plate 24A and extending forward. Therefore, in this embodiment, the plate pieces 24B are formed at four locations around the main plate 24A. The plate piece 24B has first plate pieces 24BA that are bent and extend from each side in the width direction Y of the rectangular main plate 24A, and second plate pieces 24BB that are bent and extend from each side in the vertical direction Z of the rectangular main plate 24A. Therefore, the plate piece 24B has alternating first plate pieces 24BA and second plate pieces 24BB around the rectangular main plate 24A. Each first plate piece 24BA has a length L1 extending from the side of the main plate 24A, as shown in Figure 10, and each second plate piece 24BB has a length L2 extending from the side of the main plate 24A. Furthermore, the length L1 of each first plate piece 24BA is formed to be longer than the length L2 of each second plate piece 24BB. In this way, the plate pieces 24B are formed with different lengths extending from the main plate 24A.

[0039] Each first plate piece 24BA has a tongue portion 24Ba that extends outward at its extended tip. The tongue portion 24Ba is formed by bending it outward, for example, at a 45-degree angle to the plate surface of the first plate piece 24BA. Each first plate piece 24BA also has a bulging portion 24Bb that expands inward midway along its extension. The bulging portion 24Bb extends in the direction in which the first plate piece 24BA extends, and the cross-sectional shape intersecting that direction of extension is formed by bulging inward in an arc shape. Furthermore, each first plate piece 24BA has bent portions 24Bc on both sides adjacent to the second plate piece 24BB in the circumferential direction of the main plate 24A, which are bent so as to overlap the side edges of the second plate piece 24BB from the outside.

[0040] Each second plate piece 24BB has a tongue portion 24Ba bent outward at its extended tip. The tongue portion 24Ba is formed by bending it outward, for example, at 45 degrees relative to the plate surface of the second plate piece 24BB. Each second plate piece 24BB also has a bulging portion 24Bb that expands inward along its extension. The bulging portion 24Bb extends in the direction in which the second plate piece 24BB extends, and the cross-sectional shape intersecting that direction of extension is formed by bulging inward in an arc shape. Each second plate piece 24BB also has projections 24Bd on both ends where the bent portion 24Bc of the first plate piece 24BA overlap, projecting toward the bent portion 24Bc. The projection 24Bd is not limited to the second plate piece 24BB, but may also be provided on the first plate piece 24BA on the bent portion 24Bc that overlaps the side edge of the second plate piece 24BB, so as to protrude toward the second plate piece 24BB.

[0041] The plate piece 24B has alternating first plate pieces 24BA and second plate pieces 24BB around a rectangular main plate 24A facing the rectangular imaging substrate 12. However, for example, the first plate piece 24BA and second plate piece 24BB may be alternating around a hexagonal main plate 24A facing the hexagonal imaging substrate 12. That is, the plate piece 24B has alternating first plate pieces 24BA and second plate pieces 24BB around an even-sided main plate 24A.

[0042] Each plate piece 24B contacts the peripheral edge of the imaging substrate 12 by elastic force. As shown in Figures 10 to 13, the imaging substrate 12 has a recess 12C formed at its peripheral edge by peeling off a protective film made of resin or the like. Each plate piece 24B has a bulge 24Bb that fits into the recess 12C and contacts the peripheral edge of the imaging substrate 12 by elastic force. In addition, each plate piece 24B is formed with a sharp bend from the main plate 24A so that the tip side (tongue 24Ba side) faces inward in advance, in order to generate an elastic force that contacts the peripheral edge of the imaging substrate 12.

[0043] The through-hole 24C penetrates through the shield case 24 from the inside to the outside. The through-hole 24C is formed by connecting and cutting out a corner portion of the main board 24A and the base end portions that are the side ends of the respective plate pieces 24B adjacent in the circumferential direction and that bend from the main board 24A. This through-hole 24C is provided so as to penetrate and connect the inside and the outside in the box-shaped shield case 24 composed of the main board 24A and the respective plate pieces 24B.

[0044] The shielding method to which this shield case 24 is applied, that is, the method of attaching the shield case 24 to the imaging substrate 12, is shown in the process diagrams of FIGS. 10 to 13 and the flowchart diagram of FIG. 14.

[0045] As shown in FIG. 10, the shield case 24 is arranged with the tips of the respective plate pieces 24B facing the rear surface side of the imaging substrate 12 and is moved in the front-rear direction X so as to approach the imaging substrate 12 relatively. In step S11 of FIG. 14, the shield case 24 contacts the tongue portion 24Ba at the tip of the long first plate piece 24BA with the peripheral edge of the imaging substrate 12 and deflects it outward. As a result, the first plate piece 24BA warps outward, and the bent portions 24Bc at both side ends spread so as to separate from the second plate piece 24BB. At this time, the bulging portion 24Bb of the long first plate piece 24BA has not yet entered the recess 12C at the peripheral edge of the imaging substrate 12.

[0046] Next, the shield case 24 is further moved in the front-rear direction X so as to approach the imaging substrate 12 relatively. In step S12 of FIG. 14, the shield case 24 contacts the tongue portion 24Ba at the tip of the short second plate piece 24BB with the peripheral edge of the imaging substrate 12 and deflects it outward. At this time, since the long first plate piece 24BA warps outward and the bent portions 24Bc at both side ends spread so as to separate from the second plate piece 24BB, the short second plate piece 24BB can deflect outward without interfering with the bent portion 24Bc. That is, the outward deflection of the second plate piece 24BB is not inhibited by the bent portion 24Bc of the first plate piece 24BA.

[0047] Next, the shield case 24 is moved in the front-rear direction X so as to approach the imaging substrate 12 further. In step S13 of FIG. 14, the shield case 24 makes a part of the long first plate piece 24BA and the short second plate piece 24BB contact each other with a part thereof overlapped. At this time, as shown in FIG. 13, the bulging portions 24Bb of the first plate piece 24BA and the second plate piece 24BB enter the recesses 12C at the peripheral edge of the imaging substrate 12, thereby making electrical contact with the peripheral edge of the imaging substrate 12. The contact between each plate piece 24B and the imaging substrate 12 is surely and stably implemented by the bulging portion 24Bb entering the recess 12C. Then, the distance between the bent portions 24Bc at both side ends of the first plate piece 24BA and the second plate piece 24BB is narrowed so as to approach each other, and electrical contact is made with the second plate piece 24BB. The contact between the first plate piece 24BA and the second plate piece 24BB is surely and stably implemented by the protrusion 24Bd.

[0048] FIGS. 15 to 19 show a method for manufacturing a camera module according to an embodiment.

[0049] The camera module 1 is formed by arranging the camera unit 10 and the frame portion 20, which are insert parts, in an insert mold 50 shown in FIGS. 15 to 18 and filling the insert mold 50 with insert resin. The insert mold 50 includes a lower mold 50A and an upper mold 50B. FIG. 18 shows a cross section cut along the planes in the width direction Y and the vertical direction Z at the positions of the reference portion 51A and the positioning portion 13A in a form in which the camera unit 10 and the frame portion 20, which are insert parts, are arranged in the insert mold 50.

[0050] As shown in FIGS. 15 and 16, the lower mold 50A has a cavity 51 and an engagement hole 52. The cavity 51 is for arranging the camera unit 10 and the frame portion 20 and is filled with insert resin. The cavity 51 is formed with a reference portion 51A that fits into the positioning portion 13A of the optical axis reference portion 13 in the camera unit 10 and protrudes from the inner surface. Further, the cavity 51 is formed with a reference portion 51B that fits into the positioning portion 21A of the base portion 21 of the frame portion 20 in the camera module 1. The engagement holes 52 are engaged with each other via a guide (not shown) that is inserted into the engagement holes 52 of the upper mold 50B together.

[0051] As shown in Figures 15 and 17, the upper mold 50B has a cavity 51 and engagement holes 52. The cavity 51 is where the camera unit 10 and the frame portion 20 are placed and filled with insert resin. The cavity 51 has a reference portion 51A that protrudes from its inner surface and fits into the positioning portion 13A of the optical axis reference portion 13 in the camera unit 10. The cavity 51 also has a reference portion 51B that fits into the positioning portion 21A of the base portion 21 of the frame portion 20 in the camera module 1. The engagement holes 52 engage with each other via guides (not shown) that are inserted together into the engagement holes 52 of the lower mold 50A.

[0052] When the camera unit 10 is placed in the insert mold 50, the frame portion 20 is assembled in advance. Therefore, the camera unit 10 and the frame portion 20 assembled to the camera unit 10 are positioned and placed in the cavities 51 of the lower mold 50A and upper mold 50B by fitting their respective positioning portions 13A and 21A to the reference portions 51A and 51B. In the camera unit 10, the optical axis O of the lens 11A and the center of the image sensor 12A are aligned by the positioning portion 13A, and by fitting this positioning portion 13A to the reference portion 51A, the optical axis O of the lens 11A is positioned relative to the cavities 51 of the lower mold 50A and upper mold 50B as shown in Figure 18.

[0053] Then, the lower mold 50A and the upper mold 50B engage their mutual engagement holes 52 to position the optical axis O of the lens 11A relative to their respective cavities 51, thereby positioning the camera unit 10. As shown in Figure 19, in step S1, the camera module 1 is assembled as a camera unit 10 based on the positioning part 13A, comprising the lens part 11, the imaging substrate 12, and the optical axis reference part 13 (see Figures 6 to 8). As described above, the camera unit 10 is assembled based on the positioning part 13A of the optical axis reference part 13, so that the optical axis O of the lens 11A and the center of the image sensor 12A coincide.

[0054] Next, as shown in Figure 19, in step S2, the camera unit 10 is positioned in the insert mold 50 by fitting the positioning portion 13A of the camera unit 10 into the reference portion 51A of the insert mold 50 (see Figure 18). As described above, the camera unit 10 is positioned relative to the insert mold 50 by fitting the positioning portion 13A into the reference portion 51A.

[0055] Next, as shown in Figure 19, the manufacturing method of the camera module 1 involves filling the insert mold 50 with insert resin in step S3. The filled insert resin becomes the exterior resin 30 of the camera module 1. The exterior resin 30 then has a positioning portion 13A and a reference portion 51A that fit together to form the exterior reference portion 31A. Since the reference portion 51A is formed protruding from the inner surface of the cavity 51, the exterior reference portion 31A formed where the reference portion 51A fits with the positioning portion 13A appears as a recessed trace on the outside of the exterior resin 30. In addition, the insert resin filled in the insert mold 50 covers the outside of the shield case 24 and also enters the inside of the shield case 24 through the through hole 24C, filling the space between the main plate 24A and the imaging substrate 12.

[0056] Here, although not explicitly shown in the figure, in the manufacturing method of the camera module 1, if the positioning portion 13A is formed as a convex portion and the reference portion 51A is formed as a recess that is recessed from the inner surface of the cavity 51, the exterior reference portion 31A formed in the portion where the reference portion 51A is fitted with the positioning portion 13A will appear as a convex portion that leaves a trace on the outside of the exterior resin 30.

[0057] Thus, the manufacturing method of the camera module 1 involves insert molding an outer resin 30 so as to cover the outside of the lens portion 11, imaging substrate 12, and optical axis reference portion 13 of the camera unit 10, and manufacturing the camera module 1 so as to expose the outer reference portion 31A, which fits into the positioning portion 13A of the optical axis reference portion 13, on the outside of the outer resin 30.

[0058] As described above, the camera module 1 of the embodiment is characterized by including a lens portion 11 that holds a lens 11A, an imaging substrate 12 on which an image sensor 12A is mounted, an optical axis reference portion 13 fixed to the lens portion 11 and the imaging substrate 12 and having a positioning portion 13A that aligns the optical axis O of the lens 11A with the center of the image sensor 12A, and an exterior resin 30 that is insert-molded to cover the outside of the lens portion 11, the imaging substrate 12, and the optical axis reference portion 13 and exposes an exterior reference portion 31A that fits into the positioning portion 13A of the optical axis reference portion 13.

[0059] In this camera module 1, the exterior reference part 31A, which fits into the positioning part 13A of the optical axis reference part 13, is exposed to the outside of the insert-molded exterior resin 30, thereby providing the exterior reference part 31A as a reference for the optical axis O of the lens 11A. Therefore, the camera module 1 is fixed to the mounting object based on the exterior reference part 31A that is exposed to the outside of the exterior resin 30, so that the orientation of the optical axis O of the lens 11A (the rotational direction around the optical axis O and the tilt direction of the optical axis O) is properly aligned with the imaging area. Since the camera module 1 is fixed to the mounting object based on the exterior reference part 31A, it is not necessary to readjust the mounting to align the orientation of the optical axis O of the lens 11A, and the mounting work can be easily performed. As a result, the imaging accuracy of the imaging area can be further improved with this camera module 1.

[0060] Furthermore, the camera module 1 of the embodiment, as shown in Figure 20, further includes an optical axis marker 31B formed on the outside of the exterior resin 30 based on the exterior reference portion 31A, which indicates the direction of the optical axis O of the lens 11A.

[0061] The optical axis marker 31B is formed on the outside of the outer resin 30 as a linear strip provided parallel to the optical axis O of the lens 11A. In this embodiment, as described above, the positioning portion 13A is provided at four equal intervals in the width direction Y and the up-down direction Z, which are perpendicular to the optical axis O (front-to-back direction X) of the lens 11A. Then, in the insert mold 50, the optical axis marker 31B can be formed on the outside of the outer resin 30 by forming recesses or protrusions of the linear strip so as to be perpendicular to the reference line L which is perpendicular to the optical axis O and connects two reference portions 51A of the lower mold 50A and the upper mold 50B.

[0062] With this camera module 1, the optical axis marker 31B makes it easier to recognize the direction of the optical axis O of the lens 11A, thus simplifying the installation process and improving the imaging accuracy of the imaging area.

[0063] Furthermore, the camera module 1 of the embodiment further includes a fixing member 60 that is attached to the exterior reference section 31A with reference to the mounting target, as shown in Figure 21.

[0064] The fixing member 60 has a support body 61 and an adhesive portion 62. In this embodiment, the support body 61 has a projection 61A that is inserted into and fitted into an exterior reference portion 31A formed in a recess. The adhesive portion 62 is a double-sided adhesive layer that is attached to the plate surface of the support body 61 and is attached to the object to be mounted.

[0065] According to this camera module 1, the fixing member 60 is attached based on the exterior reference part 31A, and the module is fixed to the mounting target via this fixing member 60, making the installation work easier and improving the imaging accuracy of the imaging area. The camera module 1 may also be fixed to the mounting target by directly fitting the exterior reference part 31A into the uneven parts formed on the mounting target. Furthermore, the camera module 1 of this embodiment may include both the fixing member 60 and the optical axis marker 31B.

[0066] The manufacturing method of the camera module 1 of the embodiment is characterized by including the steps of: assembling the lens portion 11, the imaging substrate 12, and the optical axis reference portion 13 as a camera unit 10 based on the positioning portion 13A; fitting the positioning portion 13A into the reference portion 51A of the insert mold 50 to place the camera unit 10 in the insert mold 50; and filling the insert mold 50 with an insert resin that will become the exterior resin 30 so that the exterior reference portion 31A, which is formed by the fitting of the positioning portion 13A and the reference portion 51A, is exposed to the outside of the camera module 1.

[0067] According to the manufacturing method of this camera module 1, the exterior reference part 31A that fits into the positioning part 13A of the optical axis reference part 13 can be exposed to the outside, and the orientation of the optical axis O of the lens 11A (the rotational direction around the optical axis O and the tilt direction of the optical axis O) can be properly aligned with the imaging area and fixed to the mounting object, thereby enabling the manufacture of a camera module 1 that can further improve the imaging accuracy of the imaging area. Moreover, according to the manufacturing method of this camera module 1, by using insert molding, a molten and viscous insert resin is poured and cured to form an exterior resin 30 that covers the outside of the lens part 11, the imaging substrate 12, and the optical axis reference part 13, exposing the exterior reference part 31A that fits into the positioning part 13A of the optical axis reference part 13 to the outside, improving the appearance and not impairing the waterproof and dustproof functions.

[0068] Furthermore, as described above, the shield case 24 of the embodiment is characterized by including a main plate 24A positioned opposite one side of the imaging substrate (substrate) 12 on which electronic components are mounted, and multiple plate pieces 24B that are bent and extended in a line in the circumferential direction around the main plate 24A and elastically contact the circumferential edge of the imaging substrate 12. Each adjacent plate piece 24B in the circumferential direction is formed with different lengths L1 and L2 extending from the main plate 24A, and the longer plate piece 24BA is provided overlapping a portion of the shorter plate piece 24BB on the outside.

[0069] With this shield case 24, the shielding effect is enhanced because, for the multiple plate pieces 24B that contact the peripheral edge of the imaging substrate 12, a portion of one plate piece 24B overlaps the outer surface of the other plate piece 24B that is adjacent in the circumferential direction. As a result, this shield case 24 can achieve further improvement in electromagnetic compatibility. In particular, with this shield case 24, since each plate piece 24B adjacent in the circumferential direction is formed with different lengths L1 and L2 extending from the main plate 24A, when contacting the peripheral edge of the imaging substrate 12, the longer plate piece 24BA makes contact first and spreads outward, and then the shorter plate piece 24BB makes contact with the peripheral edge of the imaging substrate 12 and spreads outward, interference between the overlapping portions of adjacent plate pieces 24B can be avoided.

[0070] Furthermore, the shield case 24 of the embodiment has through holes 24C that penetrate from the inside to the outside, and the outside is covered with exterior resin 30 by insert molding, and the inside is also filled with exterior resin 30 as it flows in through the through holes 24C.

[0071] With this shield case 24, the outer resin 30, which is insert-molded to the inside, is also filled between the shield case 24 and the imaging substrate 12 through the through-hole 24C, thereby improving the mounting strength with respect to the imaging substrate 12.

[0072] Furthermore, in the shield case 24 of this embodiment, each plate piece 24B has a bulging portion 24Bb that can contact the peripheral edge of the imaging substrate 12.

[0073] With this shield case 24, the bulging portion 24Bb ensures reliable and stable electrical contact between each plate piece 24B and the peripheral edge of the imaging substrate 12, thereby enhancing the shielding effect and further improving electromagnetic compatibility.

[0074] Furthermore, in the shield case 24 of the embodiment, the plate pieces 24B have projections 24Bd on one side that overlaps with the other, which can contact the other side.

[0075] With this shield case 24, the projection 24Bd ensures reliable and stable electrical contact at the overlapping portions of each plate piece 24B, thereby enhancing the shielding effect and further improving electromagnetic compatibility.

[0076] As described above, the shielding method of the embodiment is characterized by applying the shield case 24, bringing the long plate piece 24BA into contact with the peripheral edge of the imaging substrate 12 and bending it, and then bringing the short plate piece 24BB into contact with the peripheral edge of the imaging substrate 12, so that parts of the long plate piece 24BA and the short plate piece 24BB overlap and come into contact with each other.

[0077] In other words, with this shielding method, by applying the shield case 24, when the longer plate piece 24BA contacts the peripheral edge of the imaging substrate 12 and spreads outward first, and then the shorter plate piece 24BB contacts the peripheral edge of the imaging substrate 12 and spreads outward, interference between the overlapping portions of adjacent plate pieces 24B can be avoided. As a result, with this shielding method, the shield case 24 can be easily and reliably attached to the imaging substrate 12.

[0078] Although the shield case 24 of the above embodiment was described using an example where it is applied to the camera module 1, it is not limited to application to the camera module 1 and can also be applied to other electronic devices.

[0079] Although the optical axis marker 31B is described as a streak formed on the outside of the exterior resin 30 parallel to the optical axis O of the lens 11A, the optical axis marker 31B may also be a streak perpendicular to the optical axis O, serving as a guide for attaching the fixing member 60. If the streak is perpendicular, the end face of the fixing member 60 should be aligned parallel to the optical axis marker 31B.

[0080] This disclosure can further improve electromagnetic compatibility.

[0081] 12 Imaging board (substrate) 24 Shield case 24A Main plate 24B Plate piece 24Bb Swelling part 24Bd Projection part 24C Through hole 30 Exterior resin

Claims

1. A shield case comprising: a main plate positioned opposite one side of a substrate on which electronic components are mounted; and a plurality of plate pieces that are bent and extended in a circumferential direction around the main plate and elastically contact the peripheral edge of the substrate, wherein each adjacent plate piece in the circumferential direction is formed to have a different length extending from the main plate, and the longer plate piece is provided overlapping the outside of the shorter plate piece.

2. The shield case according to claim 1, having through holes that penetrate to the inside and outside, the outside being covered with an exterior resin by insert molding, and the inside being filled with the exterior resin as it flows through the through holes.

3. The shield case according to claim 1, wherein each plate piece has a bulge that can contact the peripheral edge of the substrate.

4. The shield case according to claim 1, wherein the plate pieces have projections on which one overlapping piece can contact the other.

5. A shielding method for applying a shield case comprising: a main plate disposed opposite one side of a substrate on which electronic components are mounted; and a plurality of plate pieces arranged circumferentially around the main plate, bent and extending and elastically contacting the peripheral edge of the substrate, wherein each adjacent plate piece in the circumferential direction is formed to have a different length extending from the main plate, and the longer plate piece is provided overlapping a portion of the shorter plate piece on the outside, the shielding method comprising: bringing the longer plate piece into contact with the peripheral edge of the substrate and bending it, then bringing the shorter plate piece into contact with the peripheral edge of the substrate, so that a portion of the longer plate piece and the shorter plate piece overlap and come into contact with each other.

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