Photosensitive colored resin composition, display device, and method for manufacturing laminate of organic light-emitting element and external light antireflection film

Abstract

A photosensitive colored resin composition to be used in a cured film formed on an organic light-emitting element, said photosensitive colored resin composition containing a coloring material, an alkali-soluble resin, a photoinitiator and a solvent, also containing one or more substances selected from the group consisting of an alkali-soluble resin having an ethylenically unsaturated bond-containing group in a side chain thereof, and a photopolymerizable compound, and being configured in a manner such that: the coloring material contains a first coloring material having a maximum absorption wavelength of 480-520 nm and a second coloring material having a maximum absorption wavelength of 560-600 nm; the photoinitiator contains at least one compound represented by general formula (A); and a cured film formed using the photosensitive colored resin composition and having a thickness of 3.0μm has a transmittance of 45-85% at 460nm, 530nm, and 620nm, a transmittance of 50% or less at a transmission minimum wavelength of 480-520nm, and a transmittance of 25% or less at a transmission minimum wavelength of 560-600nm. In the formula, each symbol is as stated in the specification.

Description

Photosensitive colored resin composition, display device, and method for manufacturing a laminate of an organic light-emitting element and an anti-reflective coating.

[0001] The present invention relates to a photosensitive colored resin composition, a display device containing a cured product of the photosensitive colored resin composition, and a method for manufacturing a laminate of an organic light-emitting element and an anti-reflective coating using the photosensitive colored resin composition.

[0002] In recent years, organic light-emitting elements have attracted attention as display elements for mobile devices and televisions because they are more advantageous in terms of thinning and flexibility compared to conventional liquid crystal display elements, and in principle have higher light utilization efficiency.

[0003] Such organic light-emitting elements, especially in mobile devices intended for outdoor use, are equipped with a circular polarizer as an anti-reflective coating to prevent reduced visibility due to reflection of ambient light. However, this circular polarizer cuts out not only ambient light but also the light emitted by the organic light-emitting element, significantly reducing the efficiency of light utilization. Furthermore, the rigid nature of the circular polarizer reduces flexibility, making it unsuitable for flexible designs. Therefore, there has been a desire to develop a display device using organic light-emitting elements that offers good outdoor visibility without the need for a circular polarizer.

[0004] In response to this, efforts have been made to suppress ambient light reflection by directly forming a color filter that can replace a polarizing plate on an organic light-emitting element substrate (for example, Patent Document 1). However, forming three color filter layers corresponding to the RGB of the organic light-emitting element as a color filter that can replace a polarizing plate increases the number of processes and thus raises manufacturing costs.

[0005] A technique is known in which, instead of a color filter that can replace a polarizing plate, a colored layer that absorbs a specific wavelength is used to improve color purity in the display area and suppress the deterioration of display quality due to external light reflection (Patent Document 2). Patent Document 2 discloses a colored layer forming composition containing an active energy ray curable resin, a photopolymerization initiator, a dye, and a solvent, wherein the dye contains a first colorant having a maximum absorption wavelength in the range of 470 nm to 530 nm and a full width at half maximum of an absorption spectrum of 15 nm to 45 nm, a second colorant having a maximum absorption wavelength in the range of 560 nm to 620 nm and a full width at half maximum of an absorption spectrum of 15 nm to 55 nm, and a third colorant having the wavelength with the lowest transmittance in the wavelength range of 400 to 780 nm in the range of 650 nm to 780 nm, and an optical film having a 5 μm thick colored layer formed on the second surface side of a transparent substrate having one or more functional layers formed on the first surface side, wherein the colored layer forming composition contains a colored layer forming composition in which the hue values ​​a* and b*, defined by a specific formula, are each in the range of -5 to +5.

[0006] Japanese Patent Publication No. 2017-173828 Japanese Patent Publication No. 2022-140434

[0007] To improve color purity in the display area and suppress the degradation of display quality due to ambient light reflection, using a colored layer that absorbs specific wavelengths reduces the manufacturing process of organic light-emitting element panels that suppress ambient light reflection, thereby lowering manufacturing costs compared to forming a three-color filter layer as an alternative to a polarizing plate. As for the manufacturing method of organic light-emitting element panels, a manufacturing method in which the colored layer that absorbs specific wavelengths is patterned one panel at a time from a large substrate, and a manufacturing method in which the colored layer is patterned one pixel at a time corresponding to the RGB of the organic light-emitting element, are considered efficient and preferable. Therefore, the composition for forming the colored layer that absorbs specific wavelengths is required to have a design that allows for pattern formation. However, the colored layer in Patent Document 2 is not designed to allow for pattern formation. Furthermore, the colored cured film that suppresses ambient light reflection and improves the display quality of organic light-emitting elements as described above requires excellent weather resistance, but the colored layer in Patent Document 2 has poor weather resistance. In addition, the colored cured film formed on the organic light-emitting element that suppresses ambient light reflection and improves the display quality of the organic light-emitting element is required to have the solvent resistance necessary for subsequent processes. The colored layer described in Patent Document 2 had poor solvent resistance, resulting in a problem where color changes occurred due to solvents in subsequent processes.

[0008] The present invention has been made in view of the above circumstances, and aims to provide a photosensitive colored resin composition that suppresses external light reflection to improve the display quality of organic light-emitting elements, has excellent weather resistance, and allows for the formation of a colored cured film with suppressed color change due to solvents by patterning. The present invention also aims to provide a display device containing a colored cured film of the photosensitive colored resin composition, and a method for manufacturing a laminate of an organic light-emitting element and an external light reflection prevention film using the photosensitive colored resin composition.

[0009] In other words, the present invention relates to the following [1] to [9]. [1] A photosensitive colored resin composition for use in a cured film formed on an organic light-emitting element, comprising a colorant, an alkali-soluble resin, a photoinitiator, and a solvent, wherein the colorant comprises at least one selected from the group consisting of an alkali-soluble resin having an ethylenically unsaturated bond-containing group in its side chain and a photopolymerizable compound, the colorant comprises a first colorant having a maximum absorption wavelength of 480 nm to 520 nm and a second colorant having a maximum absorption wavelength of 560 nm to 600 nm, the photoinitiator comprises at least one compound represented by the following general formula (A), and the photosensitive colored resin composition wherein the transmittance at 460 nm, 530 nm, and 620 nm of a cured film with a thickness of 3.0 μm formed using the photosensitive colored resin composition is 45% to 85%, the transmittance at the minimum transmission wavelength of 480 nm to 520 nm is 50% or less, and the transmittance at the minimum transmission wavelength of 560 nm to 600 nm is 25% or less. [2] A photosensitive colored resin composition for use in a cured film formed on an organic light-emitting element, comprising a colorant, an alkali-soluble resin, a photopolymerizable compound, a photoinitiator, and a solvent, wherein the colorant comprises a first colorant having a maximum absorption wavelength of 480 nm to 520 nm and a second colorant having a maximum absorption wavelength of 560 nm to 600 nm, the photoinitiator comprises at least one compound represented by the following general formula (A), and the photosensitive colored resin composition wherein the transmittance at 460 nm, 530 nm, and 620 nm of a cured film with a thickness of 3.0 μm formed using the photosensitive colored resin composition is 55% to 85%, the transmittance at the minimum transmission wavelength of 480 nm to 520 nm is 50% or less, and the transmittance at the minimum transmission wavelength of 560 nm to 600 nm is 25% or less.

[0010] (In the formula, R １ and R ２ Each of these independently represents an alkyl group containing a linear, branched, or cyclic structure with 1 to 8 carbon atoms, and R ３ and R ４ Each of these independently represents an alkyl group having a total of 1 to 8 carbon atoms, including a linear, branched, or cyclic structure, which may be substituted with an alkoxy group; an aryl group having 6 to 14 carbon atoms; an arylalkyl group having 7 to 14 carbon atoms; or an alkoxy group having 1 to 8 carbon atoms.

[0011] [3] The photosensitive colored resin composition according to [1] or [2], wherein the colorant further comprises, as a third colorant, at least one green pigment selected from the group consisting of C.I. Pigment Greens 7, 36, 58, and 59, or a colorant having a maximum absorption wavelength of 650 nm to 750 nm, or both. [4] The photosensitive colored resin composition according to any one of [1] to [3], wherein the colorant further comprises, as a third colorant, at least one green pigment selected from the group consisting of C.I. Pigment Greens 7, 36, 58, and 59. [5] The photosensitive colored resin composition according to any one of [1] to [4], wherein the colorant further comprises, a fourth colorant having a maximum absorption wavelength of 370 nm to 450 nm. [6] The photosensitive colored resin composition according to any one of [1] to [5], wherein the alkali-soluble resin has an ethylenically unsaturated bond equivalent of 500 or less and an acid value of 30 mg KOH / g to 90 mg KOH / g. [7] The photosensitive colored resin composition according to any one of [1] to [6], further comprising at least one inorganic particle with an average particle size of 100 nm or less, selected from the group consisting of zirconium oxide, barium titanate, and titanium oxide, and a dispersant, wherein the dispersant comprises at least one dispersant selected from the group consisting of phosphate ester dispersants, phosphonic acid dispersants, and phosphonic acid ester dispersants. [8] A display device having a cured film of the photosensitive colored resin composition according to any one of [1] to [7] on an organic light-emitting element. [9] A method for manufacturing a laminate of an organic light-emitting element and an anti-reflective film, comprising the steps of forming a coating film by applying a photosensitive colored resin composition according to any one of [1] to [7] above onto an organic light-emitting element; irradiating the coating film with light; a post-bake step of heating the film after light irradiation; and developing the film after light irradiation, thereby forming a cured film of the photosensitive colored resin composition according to any one of [1] to [7] above onto an organic light-emitting element.

[10] The method for manufacturing a laminate of an organic light-emitting element and an anti-reflective film according to [9] above, wherein the heating temperature in the post-bake step is 130°C or lower.

[0012] According to the present invention, it is possible to provide a photosensitive colored resin composition that suppresses external light reflection to improve the display quality of organic light-emitting elements, has excellent weather resistance, and allows for the formation of a colored cured film with suppressed color change due to solvents by patterning. Furthermore, the present invention can provide a display device containing a colored cured film of the photosensitive colored resin composition, and a method for manufacturing a laminate of an organic light-emitting element and an external light-anti-reflection film using the photosensitive colored resin composition.

[0013] Figure 1 is a schematic cross-sectional view showing an example of a display device equipped with an organic light-emitting element according to the present invention. Figure 2 is a schematic cross-sectional view showing another example of a display device equipped with an organic light-emitting element according to the present invention.

[0014] The embodiments and examples of the present invention will be described below with reference to the drawings. However, the present invention can be implemented in many different forms, and the description of the embodiments and examples exemplified below is not intended to be limited to those described. In addition, the drawings may schematically represent the width, thickness, shape, etc. of each part in order to make the explanation clearer, but these are merely examples and do not limit the interpretation of the present invention. In addition, in this specification and each drawing, the same reference numerals are used for elements that are the same as those described above with respect to previously shown drawings, and detailed explanations may be omitted as appropriate. Also, for the convenience of explanation, the terms "above" or "below" may be used in the explanation, but the up and down directions may be reversed. In this specification, when a certain component or region is said to be "above (or below)" another component or region, unless otherwise specified, this includes not only the case where it is directly above (or directly below) the other component, but also the case where it is above (or below) the other component, that is, it includes the case where another component is included between them above (or below) the other component. In this invention, light includes electromagnetic waves with wavelengths in the visible and invisible regions, as well as radiation, and radiation includes, for example, microwaves and electron beams. Specifically, it refers to electromagnetic waves with wavelengths of 5 μm or less, and electron beams. In this invention, (meth)acryloyl represents acryloyl and methacryloyl respectively, (meth)acrylic represents acrylic and methacrylic respectively, and (meth)acrylate represents acrylate and methacrylate respectively. In this specification, the "~" indicating a numerical range is used to mean that the numerical values ​​written before and after it are included as the lower and upper limits. The photosensitive colored resin composition, display device, and method for manufacturing a laminate of an organic light-emitting element and an anti-reflective film according to the present invention will be described in detail below.

[0015] I. Photosensitive Colored Resin Composition The photosensitive colored resin composition according to the present invention is a photosensitive colored resin composition used for a cured film formed on an organic light-emitting element, comprising a colorant, an alkali-soluble resin, a photoinitiator, and a solvent, comprising at least one selected from the group consisting of an alkali-soluble resin having an ethylenically unsaturated bond-containing group in its side chain and a photopolymerizable compound, wherein the colorant comprises a first colorant having a maximum absorption wavelength of 480 nm to 520 nm and a second colorant having a maximum absorption wavelength of 560 nm to 600 nm, and the photoinitiator comprises at least one compound represented by the following general formula (A), The hardened film with a thickness of 3.0 μm formed using the photosensitive colored resin composition has transmittances of 45% to 85% at 460 nm, 530 nm, and 620 nm, transmittance of 50% or less at the minimum transmission wavelength of 480 nm to 520 nm, and transmittance of 25% or less at the minimum transmission wavelength of 560 nm to 600 nm. The photosensitive colored resin composition according to the present invention is a photosensitive colored resin composition used for a cured film formed on an organic light-emitting element, comprising a colorant, an alkali-soluble resin, a photopolymerizable compound, a photoinitiator, and a solvent, wherein the colorant comprises a first colorant having a maximum absorption wavelength of 480 nm to 520 nm and a second colorant having a maximum absorption wavelength of 560 nm to 600 nm, the photoinitiator comprises at least one compound represented by the following general formula (A), and the transmittance of a 3.0 μm thick cured film formed using the photosensitive colored resin composition is 55% to 85% at 460 nm, 530 nm, and 620 nm, the transmittance of the minimum transmission wavelength of 480 nm to 520 nm is 50% or less, and the transmittance of the minimum transmission wavelength of 560 nm to 600 nm may be 25% or less.

[0016] (In the formula, R １ and R ２ Each of these independently represents an alkyl group containing a linear, branched, or cyclic structure with 1 to 8 carbon atoms, and R ３ and R ４ Each of these independently represents an alkyl group having a total of 1 to 8 carbon atoms, including a linear, branched, or cyclic structure, which may be substituted with an alkoxy group; an aryl group having 6 to 14 carbon atoms; an arylalkyl group having 7 to 14 carbon atoms; or an alkoxy group having 1 to 8 carbon atoms.

[0017] The photosensitive colored resin composition according to the present invention is characterized by its use in a cured film formed on an organic light-emitting element. That is, the photosensitive colored resin composition according to the present invention is used in a cured film directly formed on an element substrate equipped with an organic light-emitting element. Since the photosensitive colored resin composition according to the present invention is a photosensitive colored resin composition used in a cured film formed adjacent to or at least one layer in between on an organic light-emitting element, it is possible to manufacture a display device that is thinner and more flexible compared to a display device in which a colored layer formed on a substrate such as a glass substrate is bonded to an organic light-emitting element.

[0018] In the photosensitive colored resin composition according to the present invention, the colorant comprises a first colorant having a maximum absorption wavelength of 480 nm to 520 nm and a second colorant having a maximum absorption wavelength of 560 nm to 600 nm. The transmittance of a 3.0 μm thick cured film formed using the photosensitive colored resin composition at 460 nm, 530 nm, and 620 nm is 45% to 85%, preferably 55% to 85%, the transmittance at the minimum transmitted wavelength of 480 nm to 520 nm is 50% or less, and the transmittance at the minimum transmitted wavelength of 560 nm to 600 nm is 25% or less. Therefore, the colored cured film formed using the photosensitive colored resin composition transmits most of the red light, green light, and blue light emitted from the organic light-emitting element side, and reduces the amount of transmitted light in the wavelength components between the maximum wavelengths of red and green light, and in the wavelength components between the maximum wavelengths of green and blue light. Therefore, for example, wavelength components of the reflected ambient light that reduce the color purity of the display light are absorbed by the colored cured film. This makes it possible to form a colored cured film that suppresses ambient light reflection and improves the display quality of the organic light-emitting element. The photosensitive colored resin composition according to the present invention contains an alkali-soluble resin and a photoinitiator, and contains at least one selected from the group consisting of an alkali-soluble resin having an ethylenically unsaturated bond-containing group in its side chain and a photopolymerizable compound. Therefore, by patterning with an alkaline development treatment, a colored cured film that suppresses ambient light reflection and improves the display quality of the organic light-emitting element can be formed. Alternatively, the photosensitive colored resin composition according to the present invention contains an alkali-soluble resin, a photopolymerizable compound, and a photoinitiator. Therefore, by patterning with an alkaline development treatment, a colored cured film that suppresses ambient light reflection and improves the display quality of the organic light-emitting element can be formed.

[0019] When using a first colorant with a maximum absorption wavelength of 480 nm to 520 nm and a second colorant with a maximum absorption wavelength of 560 nm to 600 nm, there was a problem that weather resistance tended to be poor. Typically, dyes are used as the first and second colorants, and compared to particulate pigments, they have lower durability in outdoor environments and are easily decomposed by light. Furthermore, through the inventors' research, it was found that one of the causes of poor weather resistance after the formation of a colored cured film is that unreacted photoinitiators present in the colored cured film after formation decompose the colorants under light irradiation. In contrast, in the photosensitive colored resin composition of the present invention, by using a compound represented by the general formula (A) as a photoinitiator in combination with the first and second colorants, the decomposition of the first and second colorants in the colored cured film is suppressed, and weather resistance is improved. The compound represented by the general formula (A) has a short conjugated system length and high overall molecular energy, making it extremely sensitive. Therefore, the photoinitiator reacts sufficiently during the exposure process when the pattern is formed, and it is less likely that unreacted photoinitiators will remain in the colored cured film. As a result, even if light is irradiated after the formation of the colored cured film, the decomposition of the first and second colorants is suppressed, and weather resistance is expected to improve.

[0020] Furthermore, when using a first colorant with a maximum absorption wavelength of 480 nm to 520 nm and a second colorant with a maximum absorption wavelength of 560 nm to 600 nm, there was a problem that the colorants would dissolve when a solvent was used on the colored cured film in a subsequent process, causing the color of the colored cured film to change easily. In contrast, in the photosensitive colored resin composition of the present invention, by using a compound represented by the general formula (A) as a photoinitiator in combination with the first and second colorants, the dissolution of the first and second colorants into the solvent is suppressed, and the color change of the colored cured film is suppressed. The compound represented by the general formula (A) does not absorb long wavelength light such as the g-line (435 nm) and h-line (405 nm), but strongly absorbs short wavelength light of i-line (365 nm) or less, resulting in good curability of the cured film surface, and further improves curability by having two oxime ester groups in the molecule. Therefore, even if the cured film comes into contact with a solvent in a subsequent process, it is believed that the dissolution of the colorant from the surface of the cured film is suppressed, and the color change of the cured film due to the solvent is suppressed.

[0021] The photosensitive colored resin composition according to the present invention contains at least a colorant, an alkali-soluble resin, a photoinitiator, and a solvent, and contains at least one selected from the group consisting of an alkali-soluble resin having an ethylenically unsaturated bond-containing group in its side chain and a photopolymerizable compound, and may further contain other components as long as they do not impair the effects of the present invention. Alternatively, the photosensitive colored resin composition according to the present invention contains at least a colorant, an alkali-soluble resin, a photopolymerizable compound, a photoinitiator, and a solvent, and may further contain other components as long as they do not impair the effects of the present invention. Hereinafter, each component of such a photosensitive colored resin composition according to the present invention will be described in detail in order.

[0022] <Colorants> In the photosensitive colored resin composition according to the present invention, the colorants include a first colorant having a maximum absorption wavelength of 480 nm to 520 nm and a second colorant having a maximum absorption wavelength of 560 nm to 600 nm. In this specification, the maximum absorption wavelength refers to the wavelength that gives the maximum value among the maximum values ​​of light absorption in the light absorption spectrum (absorption spectrum). In the light transmittance spectrum, it refers to the wavelength that gives the minimum value among the minimum values, and is also called the transmittance minimum wavelength. The first colorant having a maximum absorption wavelength of 480 nm to 520 nm and the second colorant having a maximum absorption wavelength of 560 nm to 600 nm can be any colorant having a maximum absorption wavelength within the aforementioned wavelength range. At least one compound selected from the group consisting of compounds having any of the following structures: porphyrin, merocyanine, phthalocyanine, azo, cyanine, squarylium, coumarin, polyene, quinone, tetraazaporphyrin, pyromethene, oxazine, and indigo structures, and their metal complexes, can be appropriately selected and used. In particular, using at least one compound selected from the group consisting of compounds having any of the following structures: tetraazaporphyrin, pyromethene, phthalocyanine, and squarylium structures in the molecule is preferred from the viewpoint of durability.

[0023] The first colorant, having a maximum absorption wavelength of 480 nm to 520 nm, may have a peak full width at half maximum (FMAX) of 15 nm to 55 nm, in order to suppress ambient light reflection while suppressing a decrease in the brightness of the display device. The second colorant, having a maximum absorption wavelength of 560 nm to 600 nm, may have a peak full width at half maximum (FMAX) of 15 nm to 70 nm, in order to suppress ambient light reflection while suppressing a decrease in the brightness of the display device. Furthermore, in order to achieve such peak characteristics, the first and second colorants are preferably dyes. In this specification, "dye" means a pigment compound that dissolves in a solvent (an aqueous solvent containing water or an organic solvent). The dye used in the present invention preferably has a dissolution amount of 0.01 g or more, more preferably 0.05 g or more, and even more preferably 0.10 g or more in 100 g of propylene glycol monomethyl ether acetate at 25°C.

[0024] These colorants may be commercially available products selected as appropriate. Examples of first colorants with a maximum absorption wavelength of 480 nm to 520 nm include, but are not limited to, FDB-022 and FDB-007 (trade names, manufactured by Yamada Chemical Industry Co., Ltd.). Examples of second colorants with a maximum absorption wavelength of 560 nm to 600 nm include, but are not limited to, FDG-005, FDG-006, FDG-007, and FDG-024 (trade names, manufactured by Yamada Chemical Industry Co., Ltd.).

[0025] When a first colorant with a maximum absorption wavelength of 480 nm to 520 nm and a second colorant with a maximum absorption wavelength of 560 nm to 600 nm are included, curing inhibition is likely to occur due to the radical trapping effect of the colorant, which is a dye, making it difficult to achieve good solvent resistance, adhesion, and linearity of the colored pattern. To suppress such curing inhibition, it is preferable to further include as a third colorant at least one green pigment selected from the group consisting of C.I. Pigment Greens 7, 36, 58, and 59, or a colorant with a maximum absorption wavelength of 650 nm to 750 nm, or both. When a third colorant is included at least one green pigment selected from the group consisting of C.I. Pigment Greens 7, 36, 58, and 59, or a colorant with a maximum absorption wavelength of 650 nm to 750 nm, or both, the transmittance at 620 nm can be reduced to 85% or less with a small amount of the third colorant. Therefore, the content of the first colorant having a maximum absorption wavelength of 480 nm to 520 nm and the second colorant having a maximum absorption wavelength of 560 nm to 600 nm can be reduced, thereby reducing the total amount of colorants contained in the solids of the photosensitive colored resin composition. As a result, it becomes possible to relatively increase the amount of patterning components such as alkali-soluble resin, photopolymerizable compound, and photoinitiator contained in the solids of the photosensitive colored resin composition of the present invention, which makes it easier to improve the solvent resistance, adhesion, and linearity of the colored pattern. Among the green pigments used as the third colorant, at least one green pigment selected from the group consisting of C.I. Pigment Green 36, 58, and 59 is preferred, with C.I. Pigment Green 58 or 59 being preferred, as it can efficiently reduce the transmittance at 620 nm without reducing the transmittance at 530 nm. Furthermore, examples of colorants with a maximum absorption wavelength of 650 nm to 750 nm include, but are not limited to, FDR-002, FDR-003, FDR-004, and FDR-005 (all trade names, manufactured by Yamada Chemical Industry Co., Ltd.). A colorant with a maximum absorption wavelength of 650 nm to 750 nm may also be a colorant with a maximum absorption wavelength of 660 nm to 740 nm, or a colorant with a maximum absorption wavelength of 670 nm to 730 nm.

[0026] Furthermore, in order to suppress the external light reflectance in the 380-430 nm region, it is preferable that the colorant further includes a fourth colorant with a maximum absorption wavelength of 370 nm to 450 nm. Including a fourth colorant with a maximum absorption wavelength of 370 nm to 450 nm absorbs external light in that region, further improving visibility.

[0027] Examples of a fourth colorant having a maximum absorption wavelength of 370 nm to 450 nm include compounds having at least one structure selected from the group consisting of benzophenone, benzotriazole, triazine, benzooxazinon, anthracene, indole, metal porphyrin, and methine structures. Among these, compounds having at least one structure selected from the group consisting of benzotriazole and metal porphyrin structures are preferred because they have a broader absorption peak in the visible light region.

[0028] As the fourth colorant with a maximum absorption wavelength of 370 nm to 450 nm, commercially available products may be appropriately selected and used. Examples of fourth colorants with a maximum absorption wavelength of 370 nm to 450 nm include, but are not limited to, Tinuvin 970 (trade name, BASF Japan Ltd.) and FDB-001 (trade name, manufactured by Yamada Chemical Industry Co., Ltd.).

[0029] Other colorants may be included as long as they satisfy the transmittance characteristics of the cured film described later. Various dyes, lake colorants, pigments, etc., can be appropriately selected and used as other colorants. Examples of other colorants include yellow pigments for adjusting transmittance at 460 nm, blue pigments for adjusting transmittance at 620 nm, and black pigments for adjusting transmittance at 460 nm, 530 nm, and 620 nm. An example of a yellow pigment is C.I. Examples include pigment yellows 1, 3, 12, 13, 14, 15, 16, 17, 20, 24, 31, 55, 60, 61, 65, 71, 73, 74, 81, 83, 93, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 116, 117, 119, 120, 126, 127, 128, 129, 138, 139, 150, 151, 152, 153, 154, 155, 156, 166, 168, 175, 185, and derivative pigments of C.I. Pigment Yellow 150. Examples of blue pigments include C.I. Examples of pigment blues include 15, 15:3, 15:4, 15:6, and 60. As for the black pigment, it may be at least one selected from inorganic pigments such as carbon black and titanium black, or organic pigments such as cyanine black, or C.I. Pigment Black 1, 7, etc. As for the black pigment, it is preferable to include carbon black because it has good storage stability and easily improves the effect of suppressing external light reflection. As for the carbon black, there are no particular limitations as long as it is a light-shielding pigment, and known carbon blacks can be used. Specific examples of the carbon black in the black pigment include channel black, furnace black, thermal black, lamp black, and the like.

[0030] The photosensitive colored resin composition according to the present invention contains a colorant such that the transmittance at 460 nm, 530 nm, and 620 nm of a 3.0 μm thick cured film formed using the photosensitive colored resin composition is 55% to 85%, the transmittance at the minimum transmitted wavelength of 480 nm to 520 nm is 50% or less, and the transmittance at the minimum transmitted wavelength of 560 nm to 600 nm is 25% or less. The transmittance at 460 nm of a 3.0 μm thick cured film formed using the photosensitive colored resin composition may be 57% or more, 60% or more, 83% or less, or 80% or less, in order to suppress the reduction in brightness of the display device while suppressing external light reflection. The transmittance at 530 nm of a 3.0 μm thick cured film formed using the photosensitive colored resin composition may be 57% or more, 60% or more, 83% or less, or 80% or less, in order to suppress ambient light reflection while suppressing a decrease in the brightness of the display device. The transmittance at 620 nm of a 3.0 μm thick cured film formed using the photosensitive colored resin composition may be 57% or more, 60% or more, 83% or less, or 80% or less, in order to suppress ambient light reflection while suppressing a decrease in the brightness of the display device.

[0031] The transmittance of a 3.0 μm thick cured film formed using the photosensitive colored resin composition at the minimum transmission wavelength of 480 nm to 520 nm may be 48% or less, 45% or less, or 40% or less, from the viewpoint of suppressing ambient light reflection. This lower limit is not limited, but is usually 0.1% or more. Furthermore, the transmittance of a 3.0 μm thick cured film formed using the photosensitive colored resin composition at the minimum transmission wavelength of 560 nm to 600 nm may be 23% or less, or 20% or less, from the viewpoint of suppressing ambient light reflection. This lower limit is not limited, but is usually 0.1% or more.

[0032] In the photosensitive colored resin composition according to the present invention, the content of each colorant is not particularly limited as long as it satisfies the transmittance of the cured film. In the photosensitive colored resin composition according to the present invention, the content of the first colorant is usually 1% by mass or more and 30% by mass or less, preferably 2% by mass or more, more preferably 3% by mass or more, preferably 25% by mass or less, and more preferably 20% by mass or less, based on the total amount of colorant. In the photosensitive colored resin composition according to the present invention, the content of the second colorant is usually 5% by mass or more and 70% by mass or less, preferably 7% by mass or more, more preferably 10% by mass or more, preferably 65% ​​by mass or less, and more preferably 60% by mass or less, based on the total amount of colorant. In the photosensitive colored resin composition according to the present invention, the content of the first colorant may be 5 parts by mass or more and 50 parts by mass or less, preferably 7 parts by mass or more, more preferably 10 parts by mass or more, preferably 45 parts by mass or less, and more preferably 40 parts by mass or less, based on 100 parts by mass of the total content of the first colorant and the second colorant.

[0033] In the photosensitive colored resin composition according to the present invention, the content of the green pigment as the third colorant may be 0% by mass or more and 50% by mass or less, preferably 3% by mass or more, more preferably 5% by mass or more, preferably 45% by mass or less, and more preferably 40% by mass or less, based on the total amount of colorant. In the photosensitive colored resin composition according to the present invention, the content of the third colorant may be 0 parts by mass or more and 130 parts by mass or less, preferably 10 parts by mass or more, more preferably 20 parts by mass or more, preferably 120 parts by mass or less, and more preferably 110 parts by mass or less, based on 100 parts by mass of the total content of the first colorant and the second colorant.

[0034] In the photosensitive colored resin composition according to the present invention, the content of the fourth colorant may be 0% by mass or more and 85% by mass or less, preferably 30% by mass or more, more preferably 40% by mass or more, preferably 80% by mass or less, and more preferably 75% by mass or less, based on the total amount of colorant. In the photosensitive colored resin composition according to the present invention, the content of the fourth colorant may be 0 parts by mass or more and 500 parts by mass or less, preferably 50 parts by mass or more, more preferably 100 parts by mass or more, preferably 450 parts by mass or less, and more preferably 400 parts by mass or less, based on 100 parts by mass of the total content of the first colorant and the second colorant.

[0035] In the photosensitive colored resin composition according to the present invention, the content of other colorants may be 0% by mass or more and 20% by mass or less, preferably 1% by mass or more, more preferably 2% by mass or more, preferably 15% by mass or less, and more preferably 10% by mass or less, based on the total amount of colorants. In the photosensitive colored resin composition according to the present invention, the content of other colorants may be 0 parts by mass or more and 50 parts by mass or less, preferably 5 parts by mass or more, more preferably 10 parts by mass or more, preferably 45 parts by mass or less, and more preferably 40 parts by mass or less, based on 100 parts by mass of the total content of the first colorant and the second colorant.

[0036] In the photosensitive colored resin composition according to the present invention, the content of the colorant is not particularly limited. The total content of the colorant is preferably in the range of 1% to 25% by mass, more preferably 2% to 20% by mass, relative to the total solid content of the photosensitive colored resin composition, from the viewpoint of the transmittance of the cured film. The upper limit may be 15% by mass or less. If it is above the lower limit, the photosensitive colored resin composition is more likely to satisfy the transmittance characteristics of the cured film, and the external light reflection suppression effect is likely to be good. If it is below the upper limit, excellent storage stability is likely to be obtained, sufficient hardness is likely to be obtained, and good solvent resistance, adhesion of the colored pattern after development, and linearity are likely to be obtained. In this invention, the solid content is everything other than the solvent described later, and includes monomers dissolved in the solvent.

[0037] <Alkali-Soluble Resin> The alkali-soluble resin used in the present invention is one that has an acidic group, acts as a binder resin, and is soluble in the alkaline developer used when forming patterns. It can be appropriately selected and used from among such resins. In the present invention, an alkali-soluble resin can be defined as one with an acid value of 25 mg KOH / g or more.

[0038] Preferred alkali-soluble resins in the present invention include, specifically, (meth)acrylic resins such as (meth)acrylic copolymers having carboxyl groups and styrene-(meth)acrylic copolymers having carboxyl groups, and epoxy (meth)acrylate resins having carboxyl groups. Among these, particularly preferred are reactive alkali-soluble resins having carboxyl groups in their side chains and also having reactive groups in their side chains. This is because the inclusion of reactive groups improves the film strength and solvent resistance of the cured film formed. Examples of reactive groups include at least one selected from the group consisting of ethylenically unsaturated bond-containing groups, epoxy groups, oxetane groups, and blocked isocyanate groups. In the photosensitive resin composition of the present invention, in embodiments that do not contain the photopolymerizable compounds described later, the alkali-soluble resin contains at least an alkali-soluble resin having ethylenically unsaturated bond-containing groups in its side chains.

[0039] (Meth)acrylic resins, such as (meth)acrylic copolymers having carboxyl group-containing structural units and styrene-(meth)acrylic copolymers having carboxyl groups, are (co)polymers obtained by (co)polymerizing, for example, a carboxyl group-containing ethylenically unsaturated monomer and other copolymerizable monomers by known methods. Examples of carboxyl group-containing ethylenically unsaturated monomers include (meth)acrylic acid, vinyl benzoic acid, maleic acid, maleic acid monoalkyl esters, fumaric acid, itaconic acid, crotonic acid, cinnamic acid, and acrylate dimers. Addition reaction products of monomers having hydroxyl groups, such as 2-hydroxyethyl (meth)acrylate, and polybasic acid anhydrides such as maleic anhydride, succinic anhydride, phthalic anhydride, and cyclohexanedicarboxylic acid anhydride, as well as ω-carboxy-polycaprolactone mono(meth)acrylate, can also be used. Furthermore, anhydride-containing monomers such as maleic anhydride, itaconic anhydride, and citraconic anhydride may be used as precursors for the carboxyl group. Furthermore, (meth)acrylic copolymers having a carboxyl group in their constituent units may be obtained, for example, by first generating a polymer having a hydroxyl group, and then adding a polybasic acid anhydride such as maleic anhydride, succinic anhydride, 2-(octa-2-en-1-yl)succinic anhydride, tetrapropenylsuccinic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, 4-methyltetrahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride, 3,6-endomethylenetetrahydrophthalic anhydride, or methyl-3,6-endomethylenetetrahydrophthalic anhydride to the hydroxyl group of the polymer to introduce a carboxyl group.

[0040] In the present invention, the alkali-soluble resin used is preferably a reactive alkali-soluble resin having an ethylenically unsaturated bond-containing group in its side chain. When an ethylenically unsaturated bond-containing group is present, crosslinking can be formed between the alkali-soluble resins themselves, or between the alkali-soluble resin and a photopolymerizable compound, etc., during the curing process of the resin composition. Therefore, using a reactive alkali-soluble resin having an ethylenically unsaturated bond-containing group in its side chain improves the film strength of the cured film due to a synergistic effect. This improves the solvent resistance of the colored cured film, even with low-temperature heat treatment and even when the first and second colorants are included. Furthermore, it improves the development resistance and suppresses thermal shrinkage of the cured film, resulting in excellent adhesion to the substrate. The method for introducing an ethylenically unsaturated bond-containing group into the alkali-soluble resin can be appropriately selected from conventionally known methods. For example, methods include adding a compound having both an epoxy group and an ethylenically unsaturated bond in its molecule, such as glycidyl (meth)acrylate, to the carboxyl group of an alkali-soluble resin to introduce an ethylenically unsaturated bond to the side chain; introducing a structural unit having a hydroxyl group into a polymer and then adding a compound having both an isocyanate group and an ethylenically unsaturated bond in its molecule to introduce an ethylenically unsaturated bond to the side chain; and introducing a structural unit having an epoxy group into a polymer and then adding a compound having both a carboxyl group and an ethylenically unsaturated bond in its molecule to introduce an ethylenically unsaturated bond to the side chain. Furthermore, the number of ethylenically unsaturated bond groups may be further increased by adding a compound having both an isocyanate group and an ethylenically unsaturated bond group (for example, 2-isocyanatoethyl (meth)acrylate) to some of the hydroxyl groups produced by the addition reaction between the epoxy group and the acid.

[0041] Alkali-soluble resins may further have hydrocarbon rings to improve solvent resistance, such as the adhesion of the colored cured film and suppression of swelling by solvents. (Meth)acrylic copolymers having a carboxyl group-containing structural unit and the above-mentioned hydrocarbon ring can be prepared by using an ethylenically unsaturated monomer having a hydrocarbon ring as the aforementioned "other copolymerizable monomer". Examples of the ethylenically unsaturated monomer having a hydrocarbon ring include cyclohexyl (meth)acrylate, dicyclopentanyl (meth)acrylate, adamantyl (meth)acrylate, isobornyl (meth)acrylate, benzyl (meth)acrylate, phenoxyethyl (meth)acrylate, and styrene. Cyclohexyl (meth)acrylate, dicyclopentanyl (meth)acrylate, adamantyl (meth)acrylate, benzyl (meth)acrylate, phenoxyethyl (meth)acrylate, and styrene are preferred because they have a significant effect in maintaining the cross-sectional shape of the colored pattern after development even after heat treatment.

[0042] The alkali-soluble resin used in the present invention may further contain other constituent units such as methyl (meth)acrylate, ethyl (meth)acrylate, and other constituent units having ester groups. Constituent units having ester groups not only function as components that suppress the alkali solubility of the photosensitive colored resin composition, but also as components that improve solubility in solvents and even resolubility in solvents.

[0043] Alkali-soluble resins can be made to have the desired performance by appropriately adjusting the amount of each constituent unit added.

[0044] The amount of carboxyl group-containing ethylenically unsaturated monomer added is preferably 10% by mass or more, and more preferably 20% by mass or more, relative to the total amount of monomer, in order to obtain a good pattern. On the other hand, in order to suppress surface roughness of the pattern after development, the amount of carboxyl group-containing ethylenically unsaturated monomer added is preferably 50% by mass or less, and more preferably 40% by mass or less, relative to the total amount of monomer. When the proportion of carboxyl group-containing ethylenically unsaturated monomer is above the lower limit, the resulting coating film has sufficient solubility in alkaline developer, and when the proportion of carboxyl group-containing ethylenically unsaturated monomer is below the upper limit, the formed pattern tends not to detach from the substrate or surface roughness of the pattern is less likely to occur during development with alkaline developer.

[0045] Furthermore, in (meth)acrylic resins such as (meth)acrylic copolymers and styrene-(meth)acrylic copolymers, which are more preferably used as alkali-soluble resins and have structural units having ethylenically unsaturated bonds in their side chains, the compound having both an epoxy group and an ethylenically unsaturated bond is preferably present in an amount of 50% to 150% by mass, and more preferably 70% to 140% by mass, relative to the amount of carboxyl group-containing ethylenically unsaturated monomer charged.

[0046] The weight-average molecular weight (Mw) of alkali-soluble resins such as carboxyl group-containing copolymers is preferably 3,000 or more, more preferably 5,000 or more, from the viewpoint of binder function after curing, and preferably 30,000 or less, more preferably 20,000 or less, from the viewpoint of pattern formation during development with an alkaline developer. The weight-average molecular weight (Mw) in this invention can be measured using the Shodex GPC System-21H with polystyrene as the standard substance and THF as the eluent.

[0047] The epoxy (meth)acrylate resin having a carboxyl group is not particularly limited, but an epoxy (meth)acrylate compound obtained by reacting a reaction product of an epoxy compound and an ethylenically unsaturated bond-containing monocarboxylic acid with an acid anhydride is suitable. The epoxy compound, ethylenically unsaturated bond-containing monocarboxylic acid, and acid anhydride can be appropriately selected from known ones. For example, they can be appropriately used by referring to paragraphs 0226 to 0240 of Japanese Patent No. 6911365. As for epoxy (meth)acrylate resins having carboxyl groups, when the amount of reactive groups in the side chain is increased, such as by reducing the ethylenically unsaturated bond equivalent as described later, for example, an ethylenically unsaturated bond may be introduced to at least a portion of the epoxy groups of a polymer of epoxy group-containing (meth)acrylate such as glycidyl (meth)acrylate or a copolymer of epoxy group-containing (meth)acrylate and another ethylenically unsaturated monomer by an addition reaction with an ethylenically unsaturated bond-containing monocarboxylic acid such as (meth)acrylic acid, and a carboxyl group may be introduced to at least a portion of the hydroxyl groups produced by the addition reaction by an addition reaction with a polybasic acid anhydride such as maleic anhydride, succinic anhydride, or tetrahydrophthalic anhydride. Other ethylenically unsaturated monomers include, but are not particularly limited to, ethylenically unsaturated monomers having the hydrocarbon ring and alkyl (meth)acrylates. The amount of epoxy group-containing (meth)acrylate added is preferably 10% to 80% by mass, and more preferably 20% to 70% by mass, relative to the total amount of monomer. The amount of monocarboxylic acid containing ethylenically unsaturated bonds charged is preferably 5% to 50% by mass, and more preferably 10% to 40% by mass, relative to the total amount of monomer. The amount of polybasic acid anhydride charged is preferably 1% to 50% by mass, and more preferably 2% to 40% by mass, relative to the total amount of monomer. The amount of other ethylenically unsaturated monomers charged may be 55% by mass or less, and may be 50% by mass or less, relative to the total amount of monomer, with a lower limit of 0% by mass. The epoxy (meth)acrylate resins having carboxyl groups may be used individually or in combination of two or more types.

[0048] The alkali-soluble resin is selected and used with an acid value of 25 mg KOH / g or higher, from the viewpoint of developability (solubility) in the alkaline aqueous solution used as a developer. The alkali-soluble resin is preferably selected with an acid value of 30 mg KOH / g or more and 100 mg KOH / g or less, from the viewpoint of developability in the alkaline aqueous solution used as a developer and adhesion to the substrate, more preferably 30 mg KOH / g or more and 95 mg KOH / g or less, and even more preferably 30 mg KOH / g or more and 90 mg KOH / g or less. The upper limit of the acid value may be 80 mg KOH / g or less, 70 mg KOH / g or less, or 60 mg KOH / g or less. The acid value in this invention can be measured according to JIS K 0070:1992.

[0049] When the alkali-soluble resin has ethylenically unsaturated bonds in its side chains, the ethylenically unsaturated bond equivalent may be in the range of 100 to 1000, in order to obtain effects such as improved film strength of the cured film, improved solvent resistance and development resistance, and excellent adhesion to the substrate. In particular, since the photosensitive resin composition of the present invention is used for cured films formed on organic light-emitting elements and requires low-temperature heat treatment, and curing inhibition by the first and second colorants is likely to occur, it is preferable that the ethylenically unsaturated bond equivalent of the alkali-soluble resin be 500 or less in order to improve the solvent resistance of the cured film. The ethylenically unsaturated bond equivalent of the alkali-soluble resin may be 400 or less, or 300 or less. Here, the ethylenically unsaturated bond equivalent is the weight-average molecular weight per mole of ethylenically unsaturated bonds in the alkali-soluble resin, and is expressed by the following formula (1).

[0050] Formula (1): Ethylene-unsaturated bond equivalent (g / mol) = W (g) / M (mol) (In formula (1), W represents the mass (g) of the alkali-soluble resin, and M represents the number of moles (mol) of ethylenically unsaturated bonds contained in the alkali-soluble resin W (g).)

[0051] The above ethylenically unsaturated bond equivalent may be calculated, for example, by measuring the number of ethylenically unsaturated bonds contained in 1 g of alkali-soluble resin in accordance with the iodine value test method described in JIS K 0070:1992.

[0052] The alkali-soluble resin preferably has an ethylenically unsaturated bond equivalent of 500 or less and an acid value of 25 mg KOH / g to 100 mg KOH / g, and more preferably an acid value of 25 mg KOH / g to 95 mg KOH / g, from the viewpoint of improving the solvent resistance of the cured film. The alkali-soluble resin preferably has an ethylenically unsaturated bond equivalent of 500 or less and an acid value of 30 mg KOH / g to 90 mg KOH / g, from the viewpoint of improving the solvent resistance of the cured film and improving the development adhesion and linearity of the pattern.

[0053] The alkali-soluble resin used in the photosensitive colored resin composition may be used alone or in combination of two or more types. There are no particular restrictions on the content of the alkali-soluble resin, but it is preferably in the range of 20% to 80% by mass, and more preferably 30% to 70% by mass, relative to the total solid content of the photosensitive colored resin composition. If the content of the alkali-soluble resin is above the lower limit, sufficient alkali developability can be obtained, and solvent resistance tends to be good. If the content of the alkali-soluble resin is below the upper limit, film roughness and pattern defects can be suppressed during development, and patterns with good linearity tend to be obtained.

[0054] <Photopolymerizable Compounds> The photopolymerizable compounds used in the photosensitive colored resin composition of the present invention include compounds having a photopolymerizable group in the molecule. The photopolymerizable group can be any group that can be polymerized by a photoinitiator and is not particularly limited, but examples include ethylenically unsaturated bonds, such as vinyl groups, allyl groups, acryloyl groups, or methacryloyl groups. Among the photopolymerizable groups, acryloyl groups or methacryloyl groups are preferably used from the viewpoint of ultraviolet curability. The photopolymerizable compound may be a compound having one or more photopolymerizable groups in one molecule, but from the viewpoint of curability, it is preferable to contain a compound having two or more photopolymerizable groups in one molecule, and more preferably a compound having three or more photopolymerizable groups in one molecule. The photopolymerizable compound may be a compound having nine or fewer photopolymerizable groups in one molecule. In one embodiment of the photosensitive colored resin composition of the present invention, if an alkali-soluble resin having an ethylenically unsaturated bond-containing group in its side chain is included, it is not necessary to include a photopolymerizable compound. In the present invention, the photopolymerizable compound refers to a monomer or oligomer, and the degree of polymerization of the oligomer may be 30 or less, or 10 or less.

[0055] As the photopolymerizable compound, a compound having two or more ethylenically unsaturated bonds is preferably used, and in particular, a polyfunctional (meth)acrylate having two or more acryloyl groups or methacryloyl groups is preferred. Such a polyfunctional (meth)acrylate can be appropriately selected from those that are conventionally known. Specific examples include, for example, those described in Japanese Patent Application Publication No. 2013-029832.

[0056] These polyfunctional (meth)acrylates may be used alone or in combination of two or more. When excellent photocurability (high sensitivity) is required for the photosensitive colored resin composition of the present invention, it is preferable that the polyfunctional (meth)acrylate contains those having three or more polymerizable ethylenically unsaturated bonds (trifunctional or more), and poly(meth)acrylates of trivalent or higher polyhydric alcohols and their dicarboxylic acid modified products are preferable. Specifically, glycerin tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, succinic acid modified product of pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, succinic acid modified product of dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, etc. are preferable.

[0057] Among them, it is preferable from the viewpoint of the linearity of the pattern that the photopolymerizable compound contains a mixture of glycerin diacrylate and glycerin triacrylate.

[0058] The content of the photopolymerizable compound used in the photosensitive colored resin composition is not particularly limited, but is, for example, preferably in the range of 5% by mass to 60% by mass, more preferably 10% by mass to 40% by mass, based on the total solid content of the photosensitive colored resin composition. When the content of the photopolymerizable compound is at least the above lower limit value, photocuring proceeds sufficiently and elution during development of the exposed portion is easily suppressed. Also, when the content of the photopolymerizable compound is at most the above upper limit value, alkali developability is likely to be sufficient. From the viewpoint of solvent resistance, the content of the photopolymerizable compound is preferably 15% by mass or more, and may exceed 20% by mass, based on the total solid content of the photosensitive colored resin composition.

[0059] <Photoinitiator> As the photoinitiator used in the photosensitive colored resin composition of the present invention, it contains at least one kind of compound represented by the following general formula (A).

[0060] (In the formula, R １ and R２ Each of these independently represents an alkyl group containing a linear, branched, or cyclic structure with 1 to 8 carbon atoms, and R ３ and R ４ Each of these independently represents an alkyl group having a total of 1 to 8 carbon atoms, including a linear, branched, or cyclic structure, which may be substituted with an alkoxy group; an aryl group having 6 to 14 carbon atoms; an arylalkyl group having 7 to 14 carbon atoms; or an alkoxy group having 1 to 8 carbon atoms.

[0061] In general formula (A), examples of alkyl groups containing a linear, branched, or cyclic structure with 1 to 8 carbon atoms include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, s-butyl group, t-butyl group, n-pentyl group, isopentyl group, n-hexyl group, n-heptyl group, n-octyl group, isooctyl group, 2-ethylhexyl group, 1,3,3-trimethylbutyl group, cyclopropyl group, cyclopropylmethyl group, cyclopentyl group, cyclopentylmethyl group, cyclopentylethyl group, cyclohexyl group, cyclohexylmethyl group, and cyclohexylethyl group.

[0062] In general formula (A), in an alkyl group having a total of 1 to 8 carbon atoms and containing a linear, branched, or cyclic structure which may be substituted with an alkoxy group, the total number of carbon atoms refers to the total number of carbon atoms including the carbon atoms of the alkoxy group. Examples of alkyl groups having a total of 1 to 8 carbon atoms and containing a linear, branched, or cyclic structure which may be substituted with an alkoxy group include the aforementioned alkyl groups having a linear, branched, or cyclic structure with 1 to 8 carbon atoms, and alkyl groups having a linear, branched, or cyclic structure with a total of 8 or fewer carbon atoms substituted with an alkoxy group. As the alkoxy group, an alkoxy group having 1 to 7 carbon atoms is appropriately selected and used from among the alkoxy groups described later. Examples of alkyl groups having a linear, branched, or cyclic structure with a total of 8 or fewer carbon atoms substituted with an alkoxy group include methoxymethyl group, ethoxymethyl group, methoxyethyl group, methoxy-n-propyl group, methoxyisopropyl group, methoxy-n-butyl group, methoxy-s-butyl group, methoxy-t-butyl group, ethoxy-n-propyl group, ethoxyisopropyl group, etc.

[0063] In general formula (A), examples of aryl groups having 6 to 14 carbon atoms include phenyl, tolyl, xylyl, ethylphenyl, naphthyl, biphenylyl, anthuryl, phenanthrenyl, and other phenyl, biphenylyl, and naphthyl groups substituted with one or more of the above alkyl groups.

[0064] In general formula (A), examples of arylalkyl groups having 7 to 14 carbon atoms include benzyl, α-methylbenzyl, α,α-dimethylbenzyl, and phenylethyl. In general formula (A), examples of alkoxy groups having 1 to 8 carbon atoms include structures in which an alkyl group having 1 to 8 carbon atoms, including a linear, branched, or cyclic structure, is bonded to an oxygen atom, such as a methoxy group, ethoxy group, n-propoxy group, and isopropoxy group.

[0065] R １ and R ２ Each of these independently represents an alkyl group containing a linear, branched, or cyclic structure with 1 to 8 carbon atoms, and may be the same or different. １ and R ２ From the viewpoint of sensitivity, solubility, and compatibility, at least one of the alkyl groups may be a linear, branched, or cyclic structure having 1 to 6 carbon atoms, and may also be a linear or branched alkyl group having 1 to 3 carbon atoms. １ and R ２ From the viewpoint of sensitivity, solubility, and compatibility, each of these may be a linear or branched alkyl group having 1 to 3 carbon atoms, and may be a methyl group, an ethyl group, an n-propyl group, or an isopropyl group.

[0066] R ３ and R ４ Each of these independently represents an alkyl group having a total of 1 to 8 carbon atoms, including a linear, branched, or cyclic structure, which may be substituted with an alkoxy group; an aryl group having 6 to 14 carbon atoms; an arylalkyl group having 7 to 14 carbon atoms; or an alkoxy group having 1 to 8 carbon atoms, and may be the same or different. From the standpoint of ease of synthesis, R ３ and R ４ They may be the same. ３ and R ４From the viewpoint of sensitivity, solubility, and compatibility, each of these may be an alkyl group having a linear, branched, or cyclic structure with 1 to 8 carbon atoms, or an aryl group having 6 to 10 carbon atoms, and may be a methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, cyclopentyl group, cyclopentylmethyl group, cyclopentylethyl group, cyclohexyl group, cyclohexylmethyl group, cyclohexylethyl group, phenyl group, benzyl group, or a methyl group.

[0067] Preferred specific examples of the compound represented by the general formula (A) include, for example, the following compounds.

[0068]

[0069]

[0070]

[0071]

[0072] The compound represented by the above general formula (A) can be synthesized by appropriately selecting the solvent, reaction temperature, reaction time, purification method, etc., according to the materials used, for example, by referring to Japanese Patent Publication No. 2017-512886. Alternatively, commercially available products may be obtained and used as appropriate.

[0073] In the present invention, the photoinitiator may be one compound represented by general formula (A), or two or more compounds may be used in combination.

[0074] In the present invention, the photoinitiator may further include a photoinitiator different from the compound represented by general formula (A), as long as the effects of the present invention are not impaired. There are no particular restrictions on the photoinitiator different from the compound represented by general formula (A), as long as the effects of the present invention are not impaired, and one or more conventionally known photoinitiators can be used in combination. Examples of photoinitiators include polymerization initiators such as photopolymerization initiators, and specifically, for example, those described in Japanese Patent Application Publication No. 2013-029832.

[0075] Examples of photoinitiators different from the compound represented by general formula (A) include aromatic ketones, benzoin ethers, halomethyloxadiazole compounds, α-aminoketones, biimidazoles, N,N-dimethylaminobenzophenone, halomethyl-S-triazine compounds, thioxanthones, oxime esters, and the like. Examples of photoinitiators different from the compound represented by general formula (A) include the photoinitiators described in International Publication No. 2018 / 062105, and other conventionally known photoinitiators can also be appropriately selected and used.

[0076] In the present invention, a highly sensitive oxime-based photoinitiator may be used as a photoinitiator different from the compound represented by general formula (A), in order to improve the solvent resistance of the cured film and improve the development adhesion and linearity of the pattern.

[0077] As an oxime-based photoinitiator different from the compound represented by general formula (A), for example, one may be appropriately selected from among the oxime ester-based photoinitiators described in Japanese Patent Publication No. 2000-80068, Japanese Patent Publication No. 2001-233842, Japanese Publication No. 2010-527339, Japanese Publication No. 2010-527338, Japanese Patent Publication No. 2013-041153, International Publication No. 2015 / 152153, Japanese Patent Publication No. 2010-256891, etc.

[0078] The total content of one or more photoinitiators used in the photosensitive colored resin composition of the present invention is not particularly limited as long as the effects of the present invention are not impaired, but is preferably in the range of 0.1% to 15.0% by mass, more preferably 0.3% to 10.0% by mass, and even more preferably 0.5% to 9.0% by mass, based on the total solid content of the photosensitive colored resin composition. If this content is above the lower limit, photocuring proceeds sufficiently, and solvent resistance and substrate adhesion tend to be good. On the other hand, if it is below the upper limit, line width shift is suppressed, it is easier to form high-definition patterns, and weather resistance also tends to be good.

[0079] The total content of at least one compound represented by the general formula (A) is preferably 50.0% by mass or more, more preferably 70.0% by mass or more, and may be 100% by mass, relative to the total amount of the photoinitiator, in order to form a cured film with good developability and solvent resistance even when subjected to low-temperature heat treatment.

[0080] <Solvent> The solvent used in the present invention is not particularly limited to any organic solvent that does not react with the components in the photosensitive colored resin composition and is capable of dissolving or dispersing them. The solvent can be used alone or in combination of two or more types.Specific examples of solvents include, for example, alcohol-based solvents such as methyl alcohol, ethyl alcohol, N-propyl alcohol, i-propyl alcohol, methoxy alcohol, and ethoxy alcohol; carbitol-based solvents such as methoxyethoxyethanol and ethoxyethoxyethanol; ethyl acetate, butyl acetate, methyl methoxypropionate, ethyl methoxypropionate, ethyl ethoxypropionate, ethyl lactate, methyl hydroxypropionate, ethyl hydroxypropionate, n-butyl acetate, and isobutyl acetate. Ester solvents such as isobutyl butyrate, n-butyl butyrate, ethyl lactate, and cyclohexanol acetate; ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, and 2-heptanone; glycol ether acetate solvents such as methoxyethyl acetate, propylene glycol monomethyl ether acetate, 3-methoxy-3-methyl-1-butyl acetate, 3-methoxybutyl acetate, and ethoxyethyl acetate; methoxyethoxyethyl acetate, ethoxyethoxyethyl acetate Examples of solvents include carbitol acetate solvents such as butyl acetate and butyl carbitol acetate (BCA); diacetates such as propylene glycol diacetate and 1,3-butylene glycol diacetate; glycol ether solvents such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, diethylene glycol monoethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether, propylene glycol monomethyl ether, and dipropylene glycol dimethyl ether; aprotic amide solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, and N-methylpyrrolidone; lactone solvents such as γ-butyrolactone; cyclic ether solvents such as tetrahydrofuran; unsaturated hydrocarbon solvents such as benzene, toluene, xylene, and naphthalene; saturated hydrocarbon solvents such as N-heptane, N-hexane, and N-octane; and organic solvents such as aromatic hydrocarbons such as toluene and xylene.Among these solvents, glycol ether acetate solvents, carbitol acetate solvents, glycol ether solvents, and ester solvents are preferably used in terms of solubility of other components. In particular, the solvent used in the present invention is preferably one or more selected from the group consisting of propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, diethylene glycol methyl ethyl ether, butyl carbitol acetate (BCA), 3-methoxy-3-methyl-1-butyl acetate, ethyl ethoxypropionate, ethyl lactate, and 3-methoxybutyl acetate, in terms of solubility of other components and suitability for application. Furthermore, in the solvent used in the present invention, in terms of colorant dispersibility, solubility of other components, and suitability for application, the content of propylene glycol monomethyl ether acetate may be 50% by mass or more, 70% by mass or more, 80% by mass or more, or 100% by mass, based on the total amount of solvent in the photosensitive colored resin composition. The solvent used in the present invention is one or more selected from the group consisting of propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, diethylene glycol methyl ethyl ether, butyl carbitol acetate (BCA), 3-methoxy-3-methyl-1-butyl acetate, ethyl ethoxypropionate, ethyl lactate, and 3-methoxybutyl acetate, and the content of propylene glycol monomethyl ether acetate may be 50% by mass or more, and may be 70% by mass or more, based on the total amount of the solvent.

[0081] In the photosensitive colored resin composition according to the present invention, the solvent content can be appropriately set within a range that allows for the accurate formation of a colored layer (coating film). The solvent content is usually preferably in the range of 55% to 95% by mass, and more preferably 65% ​​to 88% by mass, based on the total amount of the photosensitive colored resin composition containing the solvent. By having the solvent content within the above range, excellent coatability can be achieved.

[0082] Furthermore, the photosensitive colored resin composition according to the present invention is more likely to contain, in order to form a colored cured film that improves light extraction efficiency, at least one inorganic particle with an average particle size of 100 nm or less, selected from the group consisting of zirconium oxide, barium titanate, and titanium oxide, and a dispersant, wherein the dispersant preferably contains at least one dispersant selected from the group consisting of phosphate ester dispersants, phosphonic acid dispersants, and phosphonic acid ester dispersants.

[0083] Organic light-emitting devices have a problem in that the refractive indices of the light-emitting layer (refractive index of approximately 1.7 to 2.0), the transparent conductive layer, and the encapsulating material (refractive index of approximately 1.9 to 2.3) are considerably higher than the refractive index of the transparent cover material on the light extraction side (refractive index of approximately 1.5). As a result, some of the light emitted from the light-emitting layer undergoes total internal reflection at the interface between the transparent conductive layer and the transparent substrate, or at the interface between the transparent substrate and the air layer, and is confined inside the device, making it impossible to extract all of the emitted light to the outside. In contrast, if the photosensitive colored resin composition according to the present invention further contains at least one inorganic particle selected from the group consisting of zirconium oxide, barium titanate, and titanium oxide, with an average particle size of 100 nm or less, the refractive index of the cured film can be increased by the at least one inorganic particle selected from the group consisting of zirconium oxide, barium titanate, and titanium oxide, thereby improving the light extraction efficiency. (Hereinafter, at least one inorganic particle selected from the group consisting of zirconium oxide, barium titanate, and titanium oxide may simply be referred to as "high refractive index inorganic particle.") Furthermore, when high refractive index inorganic particles with an average particle size of 100 nm or less are used in combination with at least one dispersant selected from the group consisting of phosphate ester-based dispersants, phosphonic acid-based dispersants, and phosphonic acid ester-based dispersants (hereinafter referred to simply as "phosphate-based dispersant" in this specification), the high refractive index inorganic particles can be stably dispersed throughout the colored cured film by the phosphate-based dispersant, thereby improving the refractive index of the colored cured film from about 1.6 to 1.7 or higher. Here, reflection occurs when light enters a medium with refractive index n2 from a medium with refractive index n1, and the reflectance can be calculated using the following formula: R = (n1 - n2) ２ / (n1 + n2)２ From this formula, for example, if the refractive index of the encapsulant on the light-emitting layer is 2.0, the refractive index of the colored cured film provided on the encapsulant is 1.7, and the refractive index of the glass used as the transparent cover material on the light extraction side is 1.5, the reflectance will be 0.66% between the encapsulant and the colored cured film, 0.39% between the colored cured film and the glass, for a total of 1.05%. On the other hand, in the above example, if the refractive index of the colored cured film is 1.56, the reflectance between the encapsulant and the colored cured film is 1.53%, and the reflectance between the colored cured film and the glass is 0.04%, for a total of 1.57%. Thus, by setting the refractive index of the colored cured film to 1.7, the reflectance between layers is reduced, and the light extraction efficiency can be improved. Furthermore, in the photosensitive colored resin composition according to the present invention, if high refractive index inorganic particles with an average particle size of 100 nm or less are dispersed using a phosphate-based dispersant, development residue caused by the dispersant due to the addition of high refractive index inorganic particles can be suppressed. Furthermore, when high refractive index inorganic particles and a phosphate-based dispersant are included, the present invention also includes an oxime-based photoinitiator, which facilitates the curing reaction and allows for good solvent resistance even with low-temperature heat treatment.

[0084] <High refractive index inorganic particles with an average particle size of 100 nm or less> In the present invention, it is preferable to select and use at least one inorganic particle (high refractive index inorganic particle) selected from the group consisting of zirconium oxide, barium titanate, and titanium oxide, which has an average particle size of 100 nm or less, in order to suppress sedimentation and improve stability in the photosensitive resin composition. The average particle size of the high refractive index inorganic particles is preferably smaller, and although there is no particular lower limit, it may be 1 nm or more, or 10 nm or more. On the other hand, the average particle size of the high refractive index inorganic particles may be 90 nm or less, or 70 nm or less, in terms of transparency and resist stability. In the present invention, the average particle size of the high refractive index inorganic particles can be determined as follows. The primary particle diameter is determined by observing the primary inorganic particles with a transmission electron microscope (TEM) and observing the primary particles that have not aggregated. Regarding the particle size distribution of the inorganic particles, after taking a TEM image of the primary particles, the particle size distribution is measured from the TEM image using an image processing device. The average primary particle diameter of inorganic particles is defined as the arithmetic mean diameter based on the number of particles, calculated from the particle size distribution. For example, a transmission electron microscope (H-7000) manufactured by Hitachi, Ltd. can be used, and a Luzex AP manufactured by Nireco Corporation can be used as the image processing device.

[0085] The inorganic particles used in this invention to impart a high refractive index are, from the standpoint of availability, at least one selected from the group consisting of zirconium oxide, barium titanate, and titanium oxide, but titanium oxide may be used in particular.

[0086] In the photosensitive colored resin composition according to the present invention, the content of high refractive index inorganic particles having an average particle size of 100 nm or less may be appropriately adjusted according to the required refractive index. Preferably, the refractive index of the photosensitive colored resin composition is 0.03 or more higher than the refractive index of the composition without high refractive index inorganic particles, and preferably 0.05 or more higher.

[0087] In the photosensitive colored resin composition according to the present invention, the content of high refractive index inorganic particles with an average particle size of 100 nm or less is not particularly limited and can be appropriately adjusted according to the required refractive index. From the viewpoint of dispersibility and dispersion stability, the content of high refractive index inorganic particles with an average particle size of 100 nm or less is preferably in the range of 1% to 50% by mass, more preferably 3% to 45% by mass, relative to the total solid content of the photosensitive colored resin composition. If it is above the lower limit, the cured film of the photosensitive colored resin composition with a predetermined film thickness (usually 1.0 μm to 5.0 μm, for example 3.0 μm) has a sufficient refractive index, and the effect of improving light extraction efficiency is likely to be good. If it is below the upper limit, it is easy to obtain a cured film that has excellent storage stability, sufficient hardness, and adhesion to the substrate. The content of high refractive index inorganic particles with an average particle size of 100 nm or less is preferably in the range of 1% to 30% by mass, more preferably 2% to 28% by mass, and even more preferably 3% to 25% by mass, relative to the total solid content of the photosensitive colored resin composition, from the viewpoint of solvent resistance and developing residue.

[0088] <Dispersant> In the photosensitive colored resin composition of the present invention, when a pigment such as a green pigment is used as the colorant, or when high refractive index inorganic particles are used, a dispersant may be used from the viewpoint of the dispersibility and dispersion stability of the pigment or the high refractive index inorganic particles. When high refractive index inorganic particles are used, it is preferable to include a dispersant containing a phosphate-based dispersant (at least one dispersant selected from the group consisting of phosphate ester-based dispersants, phosphonic acid-based dispersants, and phosphonic acid ester-based dispersants).

[0089] (Phosphate-based dispersant) The phosphate-based dispersant used in the present invention is at least one dispersant selected from the group consisting of phosphate ester dispersants, phosphonic acid dispersants, and phosphonic acid ester dispersants, and may contain a phosphate ester compound, a phosphonic acid compound, or a phosphonic acid ester compound. The phosphate ester compound is phosphoric acid (O=P(OH) ３ Examples include those in which at least one of the three hydrogen atoms contained in ) is replaced by an organic group containing hydrocarbons, and phosphonic acid compounds include phosphoric acid (O=P(OH) ３Examples include those in which one of the three hydroxyl groups contained in phosphoric acid (O=P(OH)) is replaced by an organic group containing hydrocarbons, and phosphonic acid ester compounds include phosphoric acid (O=P(OH) ３ One example is a polymer in which one of the three hydroxyl groups contained in the polymer is replaced with an organic group containing a hydrocarbon, and at least one of the hydrogen atoms of the remaining hydroxyl groups is replaced with an organic group containing a hydrocarbon. The phosphoric acid-based dispersant used in the present invention may contain a phosphoric acid ester compound, a phosphonic acid compound, or a phosphonic acid ester compound in the side chain of the polymer. For example, a polymer having at least one selected from the constituent units represented by general formula (I) described in International Publication No. 2020 / 071041 can also be used.

[0090] The phosphate-based dispersant used in this invention preferably has a weight-average molecular weight of 5000 or less, may be 4000 or less, or may be 3000 or less, from the viewpoint of suppressing developing residue. On the other hand, the phosphate-based dispersant may have a weight-average molecular weight of 100 or more from the viewpoint of dispersibility. Here, the weight-average molecular weight of the phosphate-based dispersant is the value measured by GPC (gel permeation chromatography). The measurement can be performed using an HLC-8220GPC manufactured by Tosoh, with N-methylpyrrolidone to which 0.01 mol / liter of lithium bromide has been added as the elution solvent, and two TSK-GEL ALPHA-M columns (manufactured by Tosoh) as the measurement column.

[0091] The phosphoric acid-based dispersant used in the present invention may be a compound represented by the following general formula (1) from the viewpoint of dispersibility and developability.

[0092] (In the formula, R ａ Each of these independently consists of a (poly)ethylene glycol residue, a (poly)propylene glycol residue, or a (poly)caprolactone residue, R ｂ Each independently represents an alkyl group which may be substituted with a phenyl group, an aryl group which may be substituted with an alkyl group, a (meth)acryloyl group, or a hydrogen atom, where m represents 0 to 3, n represents 1 to 3, and o represents 0 to 1. However, when m is 0, R ｂ(This is an alkyl group which may be substituted with a phenyl group, an aryl group which may be substituted with an alkyl group, or a (meth)acryloyl group.)

[0093] R ａ The (poly)ethylene glycol residue in is -(CH ２ CH ２ -O) ｐ１ -CH ２ CH ２ Represented by -, p1 may be between 0 and 30, between 0 and 25, between 1 and 25, or between 3 and 20. R ａ The (poly)propylene glycol residue in is -(CH ２ CH (CH ３ )-O) ｐ２ -CH ２ CH (CH ３ ) is expressed as -, and p2 may be 0 to 30, 0 to 25, 1 to 25, or 3 to 20. R ａ The (poly)caprolactone residue in is -((CH ２ ) ５ CO-O) ｐ３ - (CH ２ ) ５ Represented by CO-, p3 may be 0 to 30, 0 to 25, 1 to 25, or 3 to 20. Thus, in the present invention, (poly)ethylene glycol residue represents each of an ethylene glycol residue and a polyethylene glycol residue, (poly)propylene glycol residue represents each of a propylene glycol residue and a polypropylene glycol residue, and (poly)caprolactone residue represents each of a caprolactone residue and a polycaprolactone residue.

[0094] m represents 0 to 3, and if m is 0, P is directly -(O). ｏ -R ｂ This indicates that a bond exists. If m is 1, it indicates that one of the following is bonded to P via -O-: (poly)ethylene glycol residue (PEG), (poly)propylene glycol residue (PPG), or (poly)caprolactone residue (PCL). If m is 2, it indicates that P is bonded via -(O-R ａ) - There are two types (R ａ The symbol indicates that two types selected from PEG, PPG, and PCL are linked together. Examples include P-O-PEG-O-PCL, P-O-PEG-O-PPG, P-O-PCL-O-PEG, P-O-PPG-O-PCL, etc. When m is 3, P is -(O-R ａ )-- 2 or 3 types (where R ａ The notation indicates that two or three types selected from PEG, PPG, and PCL are linked together, for example, P-O-PEG-O-PCL-O-PEG, P-O-PEG-O-PPG-O-PEG, P-O-PCL-O-PEG-O-PCL, P-O-PEG-O-PPG-O-PCL, etc.

[0095] In the present invention, the phosphate-based dispersant is preferably structured to include a (poly)ethylene glycol residue, and more preferably to include both a (poly)ethylene glycol residue and a (poly)caprolactone residue, as this further improves developability and enhances the suppression of development residue.

[0096] o represents a value between 0 and 1, but when m is 0, o can be between 0 and 1; when m is not 0, o does not have to be 0; and when m is 1 or greater, o can be 1.

[0097] R ｂ The alkyl group which may be substituted with a phenyl group may be an alkyl group having 1 to 35 carbon atoms which may be substituted with a phenyl group, or an alkyl group having 3 to 30 carbon atoms which may be substituted with a phenyl group. ｂ The aryl group which may be substituted with an alkyl group may be a phenyl group which may be substituted with an alkyl group having 1 to 35 carbon atoms, or a phenyl group which may be substituted with an alkyl group having 3 to 30 carbon atoms. ｂ R is preferably an alkyl group having 8 to 23 carbon atoms or a phenyl group substituted with an alkyl group having 8 to 23 carbon atoms. Typical and preferred R ｂExamples include nonylphenyl group, octylphenyl group, dodecyl group, tridecyl group, lauryl group, 2-ethylhexyl group, octadecyl group, oleyl group, and dodecylphenyl group.

[0098] A suitable example of the compound represented by the general formula (1) is R ａ It contains (poly)ethylene glycol residues where p1 is 0 to 25, R ｂ A compound in which is an alkyl group having 1 to 23 carbon atoms or a (meth)acryloyl group, particularly a methyl group, a dodecyl group, a tridecyl group, or a (meth)acryloyl group, R ａ It contains a (poly)ethylene glycol residue with p1 of 0 to 25 and a (poly)caprolactone residue with p3 of 0 to 20, R ｂ A compound in which is an alkyl group having 1 to 23 carbon atoms or a (meth)acryloyl group, particularly a methyl group, a dodecyl group, a tridecyl group, or a (meth)acryloyl group, where m=0 and R ｂ Examples include phosphate ester compounds or phosphonic acid compounds, where the group is a dodecyl group or a tridecyl group.

[0099] n represents a number between 1 and 3, and may be a number between 1 and 2. This phosphate-based dispersant available on the market is usually a mixture of esters, for example, a mixture of monophosphate and diester phosphate. That is, n may be an average value obtained from a mixture of monophosphate and diester phosphate, etc.

[0100] Furthermore, the phosphoric acid-based dispersant used in the present invention may also be used in the form of a phosphate salt obtained by reacting it with a tertiary amine. The phosphoric acid-based dispersant being a phosphate salt with a tertiary amine is preferable from the viewpoint of improving storage stability. Examples of tertiary amines used in the phosphate salt include tertiary amines substituted with hydrocarbon groups, and examples of such hydrocarbon groups include C1-C18 alkyl groups, C2-C18 alkenyl groups, aryl groups, and combinations thereof such as aralkyl groups and alkyl-substituted aryl groups. The C1-C18 alkyl group may be linear, branched, or cyclic, and examples include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, n-nonyl group, n-lauryl group, n-stearyl group, cyclopentyl group, cyclohexyl group, bornyl group, isobornyl group, dicyclopentanyl group, adamantyl group, and lower alkyl-substituted adamantyl group. The number of carbon atoms in the alkyl group is preferably 1 to 12, and more preferably 1 to 6. The C2-C18 alkenyl group may be linear, branched, or cyclic. Examples of such alkenyl groups include vinyl, allyl, and propenyl groups. There are no limitations on the position of the double bond in the alkenyl group, but from the viewpoint of the reactivity of the resulting polymer, it is preferable that the double bond be at the end of the alkenyl group. The number of carbon atoms in the alkenyl group is preferably 2-12, and more preferably 2-8. Examples of aryl groups include phenyl, biphenyl, naphthyl, tolyl, and xylyl groups. The number of carbon atoms in the aryl group is preferably 6-24, and more preferably 6-12. Examples of aralkyl groups include benzyl, phenethyl, naphthylmethyl, and biphenylmethyl groups, and may further have substituents. The number of carbon atoms in the aralkyl group is preferably 7-20, and more preferably 7-14. Furthermore, the aromatic rings such as the aryl group and aralkyl group may have linear or branched alkyl groups having 1 to 30 carbon atoms bonded to them as substituents.

[0101] Furthermore, as tertiary amines used in the phosphate salts in the present invention, specifically, examples include at least one selected from dimethylbenzylamine, diethylbenzylamine, triethylamine, N,N-diisopropylethylamine, quinuclidine, pyridine, diazabicycloundecene, and diazabicyclononene, with at least one selected from the group consisting of dimethylbenzylamine and diethylbenzylamine being preferred from the viewpoint of safety and ease of handling.

[0102] Furthermore, in a phosphoric acid-based dispersant used in the form of a phosphate salt obtained by reacting with a tertiary amine, the content of the tertiary amine is preferably 0.01 moles or more, more preferably 0.05 moles or more, even more preferably 0.1 moles or more, and particularly preferably 0.2 moles or more, relative to the phosphorus portion of the phosphorus-based dispersant. If it is above the lower limit, the effect of improving stability due to salt formation is easily obtained. Similarly, it is preferably 1 mole or less, more preferably 0.8 moles or less, even more preferably 0.7 moles or less, and particularly preferably 0.6 moles or less. If it is below the upper limit, excellent dispersion stability can be obtained. Note that the tertiary amine may be used alone or in combination of two or more. When two or more are combined, it is preferable that their total content is within the above range.

[0103] The phosphate-based dispersant used in the present invention preferably has an acid value of 10 mg KOH / g or more, more preferably 50 mg KOH / g or more, may be 1000 mg KOH / g or less, and may be 500 mg KOH / g or less, from the viewpoint of dispersibility and developability. Here, the acid value can be measured according to JIS K0070:1992.

[0104] The phosphate-based dispersant used in the present invention is preferably used to disperse the high refractive index inorganic particles having an average particle size of 100 nm or less. That is, in the photosensitive colored resin composition of the present invention, it is preferable that the high refractive index inorganic particles are dispersed in a phosphate-based dispersant.

[0105] The content of the phosphoric acid-based dispersant used in the present invention is in the range of 5 to 50 parts by mass, more preferably 10 to 30 parts by mass, per 100 parts by mass of the high refractive index inorganic particles. If the content is above the lower limit, the dispersibility and dispersion stability of the high refractive index inorganic particles are excellent, and the storage stability of the photosensitive colored resin composition is excellent. If the content is below the upper limit, the solvent resistance of the resist is good.

[0106] (Other Dispersants) In the photosensitive colored resin composition of the present invention, when a colorant such as a pigment is dispersed, other dispersants may be further included from the viewpoint of colorant dispersibility and colorant dispersion stability. Other dispersants for dispersing the colorant can be appropriately selected from conventionally known dispersants. As dispersants, for example, surfactants such as cationic, anionic, nonionic, amphoteric, silicone, and fluorine-based surfactants can be used. Among surfactants, polymer dispersants are preferred from the viewpoint of being able to disperse uniformly and finely.

[0107] Examples of polymer dispersants include (meth)acrylate copolymer dispersants; polyurethanes; unsaturated polyamides; polysiloxanes; long-chain polyaminoamide phosphates; polyethyleneimine derivatives (amides obtained by the reaction of poly(lower alkyleneimines) with free carboxyl group-containing polyesters, and their bases); and polyallylamine derivatives (reaction products obtained by reacting polyallylamine with one or more compounds selected from three types of compounds: polyesters having free carboxyl groups, polyamides, or ester-amide copolymers (polyesteramides)).

[0108] In the present invention, it is preferable to use a (meth)acrylate copolymer-based dispersant as a dispersant because it tends to have good solvent resistance even when subjected to low-temperature heat treatment. The (meth)acrylate copolymer-based dispersant has good compatibility with the photopolymerizable compound and at least one photoinitiator of the compound represented by general formula (A), so the photoinitiator tends to be uniformly present in the colored layer (coating film), and as the colored layer hardens uniformly, the amount of unreacted components decreases and the internal stress of the colored hardened film also decreases, so it is presumed that the change in the colored hardened film when immersed in a solvent will be small.

[0109] In the present invention, a (meth)acrylate copolymer-based dispersant refers to a copolymer that contains at least (meth)acrylate-derived structural units. The (meth)acrylate copolymer-based dispersant is preferably a copolymer containing structural units that function as colorant adsorption sites and structural units that function as solvent affinity sites, and it is preferable that the structural units that function as solvent affinity sites contain at least (meth)acrylate-derived structural units.

[0110] The constituent units that function as colorant adsorption sites include constituent units derived from (meth)acrylate and constituent units derived from copolymerizable ethylenically unsaturated monomers. The colorant adsorption sites may be constituent units derived from acidic group-containing ethylenically unsaturated monomers or constituent units derived from basic group-containing ethylenically unsaturated monomers. As constituent units derived from basic group-containing ethylenically unsaturated monomers, the constituent unit represented by the following general formula (I) is preferred because of its excellent dispersibility.

[0111] (In general formula (I), R ７１ A is a hydrogen atom or a methyl group. １ R is a divalent linking group. ７２ and R ７３ Each of these independently represents a hydrocarbon group which may contain a hydrogen atom or a heteroatom, and R ７２ and R ７３ (They may bond to each other to form a ring structure.)

[0112] For explanations of each symbol in the general formula (I) and for copolymers and salt-type copolymers having the constituent units represented by the general formula (I), refer to Japanese Patent Publication No. 2016-224447 and International Publication No. 2016 / 104493 as appropriate.

[0113] The content percentage (mol%) of each constituent unit in a dispersant can be determined from the amount of raw materials used during manufacturing, and can also be measured using analytical instruments such as NMR. Furthermore, the structure of the dispersant can be measured using NMR, various mass spectrometers, etc. Additionally, the dispersant can be decomposed by thermal decomposition as needed, and the resulting decomposition products can be analyzed using high-performance liquid chromatography, gas chromatography-mass spectrometry, NMR, elemental analysis, XPS / ESCA, and TOF-SIMS, etc.

[0114] In the photosensitive colored resin composition according to the present invention, the content of the dispersant is not particularly limited, and should be selected to provide excellent dispersibility and dispersion stability of the high refractive index inorganic particles and colorants. The dispersant, which may include a phosphoric acid-based dispersant and other dispersants, is preferably in the range of 2% to 30% by mass, more preferably 3% to 25% by mass, based on the total solid content of the photosensitive colored resin composition. If the content is above the lower limit, the dispersibility and dispersion stability of the high refractive index inorganic particles and colorants are excellent, and the storage stability of the photosensitive colored resin composition is excellent. If the content is below the upper limit, the developability is good.

[0115] <Thiol Compounds> The photosensitive colored resin composition of the present invention may further contain thiol compounds to improve solvent resistance and substrate adhesion after low-temperature heat treatment. Examples of thiol compounds include monofunctional thiol compounds with one thiol group and polyfunctional thiol compounds with two or more thiol groups. From the viewpoint of suppressing line width shift and improving substrate adhesion, it is more preferable to use monofunctional thiol compounds with one thiol group. Examples of monofunctional thiol compounds include 2-mercaptobenzothiazole, 2-mercaptobenzoxazole, 2-mercaptobenzimidazole, 2-mercapto-5-methoxybenzothiazole, 2-mercapto-5-methoxybenzimidazole, 3-mercaptopropionic acid, methyl 3-mercaptopropionate, ethyl 3-mercaptopropionate, and octyl 3-mercaptopropionate. Examples of polyfunctional thiol compounds include 1,4-bis(3-mercaptobutyryloxy)butane, 1,3,5-tris(3-mercaptobutyloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptobutyrate), pentaerythritol tetrakis(3-mercaptopropionate), dipentaerythritol hexakis(3-mercaptopropionate), and tetraethylene glycol bis(3-mercaptopropionate). The thiol compounds may be used individually or in combination of two or more, and among them, 2-mercaptobenzoxazole or 2-mercaptobenzothiazole are preferred because they improve solvent resistance and substrate adhesion after low-temperature heat treatment. The thiol compound content is typically in the range of 0.5% to 10% by mass, preferably 1% to 5% by mass, relative to the total solid content of the photosensitive colored resin composition. If the content is above the lower limit, the solvent resistance and substrate adhesion after low-temperature heat treatment tend to be excellent. On the other hand, if the content is below the upper limit, the photosensitive colored resin composition of the present invention tends to have good developability and suppressed line width shift.

[0116] <Other Components> The photosensitive colored resin composition of the present invention may further contain various additives as needed. Examples of additives include antioxidants, polymerization inhibitors, chain transfer agents, leveling agents, plasticizers, surfactants, defoamers, silane coupling agents, ultraviolet absorbers, adhesion promoters, and the like. Specific examples of surfactants and plasticizers include those described in Japanese Patent Application Publication No. 2013-029832.

[0117] The photosensitive colored resin composition of the present invention is preferably further enriched with an antioxidant, from the viewpoint of suppressing the amount of line width shift in the cured film. The photosensitive colored resin composition of the present invention, for example, by combining an antioxidant with the compound represented by the general formula (A) above, can control excessive radical chain reactions without impairing curability when forming a cured film, thereby improving linearity when forming fine line patterns and improving the ability to form fine line patterns according to the mask line width design. In addition, heat resistance can be improved, and the decrease in brightness after exposure and post-baking can be suppressed, thereby improving brightness. The antioxidant used in the present invention is not particularly limited and may be appropriately selected from conventionally known ones. Specific examples of antioxidants include, for example, hindered phenol antioxidants, amine antioxidants, phosphorus antioxidants, sulfur antioxidants, and hydrazine antioxidants. From the viewpoint of improving the ability to form fine line patterns according to the mask line width design and heat resistance, it is preferable to use a hindered phenol antioxidant. It may also be a latent antioxidant as described in International Publication No. 2014 / 021023.

[0118] Examples of hindered phenol antioxidants include pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate] (trade name: IRGANOX 1010, manufactured by BASF), 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl) isocyanurate (trade name: IRGANOX 3114, manufactured by BASF), and 2,4,6-tris(4-hydroxy-3,5-di-tert-butylbenzyl Examples include mesitylene (trade name: Irganox 1330, manufactured by BASF), 2,2'-methylenebis(6-tert-butyl-4-methylphenol) (trade name: Sumirizer MDP-S, manufactured by Sumitomo Chemical), 6,6'-thiobis(2-tert-butyl-4-methylphenol) (trade name: Irganox 1081, manufactured by BASF), and 3,5-di-tert-butyl-4-hydroxybenzylphosphonate diethyl (trade name: Irgamod 195, manufactured by BASF). Among these, pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate] (trade name: IRGANOX 1010, manufactured by BASF) is preferred in terms of heat resistance and light resistance.

[0119] The antioxidant content is typically in the range of 0.1% to 10.0% by mass, preferably 0.5% to 5.0% by mass, relative to the total solid content of the photosensitive colored resin composition. If the content is above the lower limit, the ability to form fine line patterns according to the mask line width design is improved, and heat resistance is excellent. On the other hand, if the content is below the upper limit, the photosensitive colored resin composition of the present invention is more likely to be a highly sensitive photosensitive colored resin composition.

[0120] Examples of silane coupling agents include KBM-502, KBM-503, KBE-502, KBE-503, KBM-5103, KBM-903, KBE-903, KBM573, KBM-403, KBE-402, KBE-403, KBM-303, KBM-802, KBM-803, KBE-9007, and X-12-967C (manufactured by Shin-Etsu Silicone Co., Ltd.). Among these, KBM-502, KBM-503, KBE-502, KBE-503, and KBM-5103, which have methacrylic groups and acrylic groups, are preferred from the viewpoint of adhesion to the SiN substrate.

[0121] The silane coupling agent content is typically within the range of 0.05% to 10.0% by mass, preferably 0.1% to 5.0% by mass, relative to the total solid content in the photosensitive colored resin composition. A content above the lower limit and below the upper limit tends to result in a good substrate adhesion improvement effect.

[0122] <Method for Producing a Photosensitive Colored Resin Composition> The photosensitive colored resin composition of the present invention can be prepared by mixing essential components and various optional additive components using known mixing methods. Methods for preparing the photosensitive colored resin composition of the present invention include, for example, (1) simultaneously adding and mixing a colorant, an alkali-soluble resin, a photopolymerizable compound, a photoinitiator, and various optional additive components into a solvent; (2) adding a dispersant, an alkali-soluble resin, a photopolymerizable compound, a photoinitiator, and various optional additive components into a solvent, mixing them, and then adding a colorant and, if necessary, high refractive index inorganic particles to disperse them; (3) first adding a colorant and a dispersant to a solvent to prepare a colorant dispersion, and if necessary, adding high refractive index inorganic particles and a dispersant to the solvent to prepare a high refractive index inorganic particle dispersion. (4) A method of mixing a colorant dispersion, a high refractive index inorganic particle dispersion, a colorant that is not dispersed, an alkali-soluble resin, a photopolymerizable compound, a photoinitiator, and various additive components used as desired; (5) A method of preparing a colorant dispersion by adding a colorant, a dispersant, and an alkali-soluble resin to a solvent, and if necessary, preparing a high refractive index inorganic particle dispersion by adding high refractive index inorganic particles and a dispersant to the solvent, and then adding and mixing the colorant dispersion, the high refractive index inorganic particle dispersion, the colorant that is not dispersed, and further an alkali-soluble resin, a solvent, a photopolymerizable compound, a photoinitiator, and various additive components used as desired; and so on.

[0123] Methods for preparing colorant dispersions and high refractive index inorganic particle dispersions can be appropriately selected from conventionally known dispersion methods. Examples of dispersion machines for performing dispersion treatment include roll mills such as two-roll and three-roll mills, ball mills such as ball mills and vibrating ball mills, paint conditioners, continuous disc-type bead mills, and continuous annular-type bead mills. Preferred dispersion conditions for bead mills are that the bead diameter used is preferably 0.03 mm to 2.00 mm, and more preferably 0.10 mm to 1.0 mm.

[0124] <Applications> The photosensitive colored resin composition according to the present invention is used to form a cured film having a specific transmittance on an organic light-emitting element, and is therefore suitably used for forming a colored cured film that can replace a circular polarizer. When the cured film of the photosensitive colored resin composition according to the present invention is used as a substitute for a circular polarizer, a display device that does not include a polarizer can be made, and therefore the photosensitive colored resin composition according to the present invention is suitably used for display device applications that do not include a polarizer. Furthermore, since the photosensitive colored resin composition according to the present invention is a photosensitive colored resin composition used for a cured film formed on an organic light-emitting element, it is suitably used for display device applications that do not include an external color filter substrate, and for organic light-emitting display device applications that have improved flexibility due to their thin film.

[0125] The cured film of the photosensitive colored resin composition according to the present invention may have a refractive index of 1.65 or higher, or 1.70 or higher, when it contains the high refractive index inorganic particles. The refractive index here can be measured by the method described in the examples below.

[0126] II. Display Device The display device according to the present invention is characterized by having a cured film of the photosensitive colored resin composition according to the present invention on an organic light-emitting element. In the display device according to the present invention, since the cured film of the photosensitive colored resin composition used for the cured film formed on the organic light-emitting element according to the present invention is formed on the organic light-emitting element, an external circular polarizer or an external color filter substrate is unnecessary, and the display device may not have them. In the display device according to the present invention, since the cured film is formed on the organic light-emitting element using the photosensitive colored resin composition used for the cured film formed on the organic light-emitting element according to the present invention, there is no substrate such as an external color filter substrate between the organic light-emitting element and the cured film, thus improving thinness and flexibility.

[0127] An organic light-emitting display device including such an organic light-emitting element according to the present invention will be described with reference to the figures. Figure 1 is a schematic cross-sectional view showing an example of a display device equipped with an organic light-emitting element according to the present invention. As illustrated in Figure 1, the display device 100 according to the present invention includes an element substrate 30 equipped with an organic light-emitting element, an external light reflection prevention film 20 including a colored cured film 9 on the element substrate 30, and further an overcoat layer 11, a transparent adhesive layer 12, and a transparent cover material 13 in that order. The element substrate 30 equipped with the organic light-emitting element has thin-film transistors (TFTs) 2, which are driving elements, arranged on the substrate 1 so as to correspond to each subpixel, and a sealing film 3 is provided thereon, and further electrodes 4 (anode, reflective electrode) corresponding to each subpixel and partition walls 5 that divide each subpixel are provided on the sealing film 3, organic light-emitting elements (6R, 6G, 6B) that constitute R, G, and B subpixels are arranged in the partitions, and electrodes 7 (cathode, transparent electrode) are further provided on the organic light-emitting elements (6R, 6G, 6B). The element substrate 30 equipped with the organic light-emitting element further has a sealing film 8 that covers the organic light-emitting element. The device substrate 30 includes an anti-reflective film 20 containing a colored cured film 9 and a light-shielding portion 10, formed on a sealing film 8 on organic EL elements (6R, 6G, 6B) using the photosensitive colored resin composition of the present invention, and further includes an overcoat layer 11, a transparent adhesive layer 12, and a transparent cover material 13 in that order. In the example of Figure 1, the colored cured film 9 is provided in pattern at the openings of the light-shielding portion 10, one pixel at a time, corresponding to the pixels of the organic EL elements (6R, 6G, 6B). Figure 2 is a schematic cross-sectional view showing another example of a display device equipped with an organic light-emitting element according to the present invention. As illustrated in Figure 2, the display device 100 according to the present invention includes an element substrate 30 equipped with an organic light-emitting element, and on the element substrate 30, an anti-reflective film 20 containing a colored cured film 9, and further includes an overcoat layer 11, a transparent adhesive layer 12, and a transparent cover material 13 in that order. In the example of Figure 2, the colored cured film 9 is provided over the entire organic EL element panel so as to cover the light-shielding portion 10. In the layer configuration shown in Figure 2, a pattern of colored cured film 9 is formed for each panel, so it is necessary to make the photosensitive colored resin composition that forms the colored cured film 9 developable.

[0128] The display device 100 according to the present invention, although not shown in the figures, may further include, for example, a touch sensor layer consisting of an insulating film and a transparent electrode layer on the overcoat layer 11, and may further appropriately include known configurations such as a hard coat layer on the touch sensor layer. As described above, since the layers of the colored cured film 9 and the light-shielding portion 10 provided on the element substrate 30 equipped with the organic light-emitting element are used as the external light anti-reflection film 20, the external light anti-reflection film used in the present invention does not include a separate substrate like an external circular polarizer or an external color filter substrate, and can be made thinner and more flexible.

[0129] The display device according to the present invention includes a colored cured film with a thickness of 3.0 μm formed on an organic light-emitting element using the photosensitive colored resin composition of the present invention, wherein the transmittance at 460 nm, 530 nm, and 620 nm is 55% to 85%, the transmittance at the minimum transmitted wavelength of 480 nm to 520 nm is 50% or less, and the transmittance at the minimum transmitted wavelength of 560 nm to 600 nm is 25% or less. With this colored cured film provided on the organic light-emitting element, ambient light is absorbed except for the color that the organic light-emitting element originally emits, and the light emitted by the organic light-emitting element is transmitted, making it possible to suppress ambient light reflection without reducing light utilization efficiency.

[0130] The substrate 1, the thin-film transistor (TFT) 2 which is a driving element, the sealing film 3, the electrode 4 (anode), the partition wall 5 that separates each subpixel, the organic light-emitting elements (6R, 6G, 6B) that constitute the subpixels, the electrode 7 (cathode), etc., used in the display device according to the present invention can be appropriately selected from known configurations. In addition to the light-emitting layer, the organic light-emitting element may also include known configurations such as a hole injection layer, a hole transport layer, an electron injection layer, etc.

[0131] Examples of the sealing film 8 on the organic EL element used in the display device according to the present invention include inorganic films, organic films, and multilayer films formed by laminating them. It is preferable to use a multilayer film because it has a high effect in suppressing the penetration of moisture and oxygen. Specifically, examples include multilayer films formed by laminating an inorganic film such as a metal film, a metal oxide film, SiOx, or SiNx with an organic film.

[0132] The colored cured film 9 used in the display device according to the present invention is a cured film of the photosensitive colored resin composition according to the present invention. The colored cured film may or may not be formed on the opening of the light-shielding portion described later on the sealing film 8 on the organic light-emitting element, or it may not be formed to cover the light-shielding portion. The thickness of the colored cured film is appropriately controlled by adjusting the coating method, the solid content concentration and viscosity of the photosensitive colored resin composition, etc., but is usually in the range of 1 μm to 5 μm.

[0133] The light-shielding portion 10 used in the display device according to the present invention is usually formed in a pattern on the sealing film 8 on the organic light-emitting element, and can be the same as that used as a light-shielding portion in a general color filter. The pattern shape of the light-shielding portion can be appropriately selected in accordance with the shape of the colored cured film, and examples include stripe-shaped and matrix-shaped shapes. The light-shielding portion may be a thin metal film such as chromium produced by sputtering, vacuum deposition, etc. Alternatively, the light-shielding portion may be a resin layer containing light-shielding particles such as carbon nanoparticles, metal oxides, inorganic pigments, and organic pigments in a resin binder. In the case of a resin layer containing light-shielding particles, there are methods such as patterning by developing with a photosensitive resist, patterning with an inkjet ink containing light-shielding particles, and thermal transfer of a photosensitive resist.

[0134] The film thickness of the light-shielding portion is set to approximately 0.2 μm to 0.4 μm in the case of a thin metal film, and to approximately 0.5 μm to 2 μm in the case of a black pigment dispersed or dissolved in a binder resin.

[0135] The overcoat layer 11, transparent adhesive layer 12, and transparent cover material 13 provided on the colored cured film 9 and the light-shielding portion 10 can be appropriately selected from known materials. The overcoat layer 11 may be the same as the sealing film, but it may also be a resin film formed using a solvent. As mentioned above, the transparent cover material 13 can be glass, PET film, etc.

[0136] It should be noted that the display device according to the present invention is not limited to the configuration shown in Figure 1, and may further include other configurations of a display device equipped with a known organic light-emitting element.

[0137] III. Method for Manufacturing a Laminate of Organic Light-Emitting Devices and an Anti-Reflection Film The method for manufacturing a laminate of organic light-emitting devices and an anti-reflection film according to the present invention includes the steps of forming a coating film on an organic light-emitting device by applying the photosensitive colored resin composition according to the present invention; irradiating the coating film with light; a post-bake step of heating the film after light irradiation; and developing the film after light irradiation, thereby forming a cured film of the photosensitive colored resin composition according to the present invention on an organic light-emitting device. Each step will be described below.

[0138] In the step of applying the photosensitive colored resin composition according to the present invention onto an organic light-emitting element, the application does not have to be adjacent to the organic light-emitting element, but may be done with at least one layer in between. As shown in Figure 1, in an element substrate 30 equipped with an organic light-emitting element, electrodes 7 and a sealing film 8 to suppress the penetration of moisture and oxygen are usually provided on the subpixels (6R, 6G, 6B) of the organic light-emitting element. Therefore, the composition may be applied onto the organic light-emitting element via these electrodes and sealing layer.

[0139] For example, a light-shielding portion 10 may be pre-formed on the sealing film 8 by a known method as illustrated above, and the colored hardened film 9 may be applied so as to form a colored hardened film 9 in the opening of the light-shielding portion 10. Alternatively, the colored hardened film 9 may be applied to the sealing film 8 so as to cover the entire surface, including the light-shielding portion 10.

[0140] For example, the photosensitive colored resin composition of the present invention described above is applied to the organic light-emitting element using coating methods such as spray coating, dip coating, bar coating, roll coating, spin coating, die coating, or inkjet coating. Among these coating methods, spin coating and die coating are particularly preferred. Next, the wet coating is dried using a hot plate or oven to form a coating film.

[0141] The resulting coating film is irradiated (exposed) with light through a mask of a predetermined pattern to cause a photopolymerization reaction of the photopolymerizable compound and, if necessary, the alkali-soluble resin. Alternatively, a patterned coating film is irradiated (exposed) with light to cause a photopolymerization reaction of the photopolymerizable compound. Examples of light sources used for exposure include ultraviolet light from low-pressure mercury lamps, high-pressure mercury lamps, metal halide lamps, and electron beams. The amount of exposure is adjusted appropriately depending on the light source used and the thickness of the coating film.

[0142] Next, a post-bake step may be performed to heat the light-irradiated film in order to promote the polymerization reaction after exposure. The heating conditions can be appropriately selected depending on the mixing ratio of each component in the photosensitive colored resin composition used, the thickness of the coating film, etc. The post-bake step may be performed on the light-irradiated film before the development step described later, after the development step, or before or after the development step.

[0143] In the present invention, since a colored cured film is formed directly on an element substrate equipped with an organic light-emitting element, it is preferable that the heating temperature in the post-bake step is 130°C or lower. More preferably, the heating temperature is 100°C or lower, and even more preferably 90°C or lower. The heating temperature may also be 30°C or higher, 35°C or higher, or 40°C or higher.

[0144] Next, the film after light irradiation is developed. The film to be developed after light irradiation may be the film after post-baking. In the development process, the film is developed using a developer solution, and the unexposed areas are dissolved and removed to form a coating film with the desired pattern. Typically, a solution of alkali dissolved in water or a water-soluble solvent is used as the developer solution. A suitable amount of surfactant or the like may be added to this alkaline solution. Furthermore, a general development method can be employed.

[0145] After the development process, the developer solution is usually washed off and the cured film of the photosensitive colored resin composition is dried to form a colored cured film. After the development process, a heat treatment may be performed to sufficiently cure the coating film. In this invention, since the colored cured film is formed directly on the element substrate equipped with an organic light-emitting element, the heating temperature in this post-bake process is preferably 130°C or lower, more preferably 100°C or lower, and even more preferably 90°C or lower. The heating temperature may also be 30°C or higher, 35°C or higher, or 40°C or higher.

[0146] Additionally, the film may be further cured by additional light irradiation (exposure) after development or post-baking.

[0147] The present invention will be described in detail below with reference to examples. These descriptions do not limit the present invention. The weight-average molecular weight of the alkali-soluble resin was measured using a Shodex GPC System-21H with polystyrene as the standard substance and THF as the eluent. The acid value was measured according to JIS K 0070.

[0148] (Synthesis Example 1: Synthesis of Photoinitiator (A-1)) (1) Synthesis of Intermediate (A-1-1) 20.5 g (0.11 mol) of diphenyl sulfide and AlCl in a 500 mL four-necked flask. ３14.7 g (0.11 mol) of the solution and 100 mL of dichloroethane were added and stirred. The mixture was cooled to 0°C in an ice bath, and a mixed solution of 21.4 g (0.23 mol) of propionyl chloride and 100 mL of dichloroethane was added over approximately 2 hours while adjusting the temperature to below 0°C. The temperature was maintained at 0°C and the mixture was stirred for another 2 hours. The reaction solution was then gradually added to 10% hydrochloric acid water at 0°C, the lower layer was separated using a separatory funnel, and the upper layer was extracted with 50 mL of dichloroethane. The extract and the lower layer were then combined. The mixture was then washed with 5% sodium bicarbonate aqueous solution, and further washed three times with 200 mL of water until the pH was neutral. After drying with 10 g of anhydrous magnesium sulfate to remove moisture, the dichloroethane was evaporated by evaporation. After evaporation was complete, the crude product was purified with ethyl acetate and hexane to obtain intermediate (A-1-1) (yield: 30.5 g, purity: 97.6%, yield: 93.0%).

[0149] (2) Synthesis of intermediate (A-1-2) 29.3 g (0.10 mol) of intermediate (A-1-1), 100 mL of tetrahydrofuran, 10.0 g of concentrated hydrochloric acid, and 29.3 g (0.25 mol) of isoamyl nitrite were added to a 250 mL round-bottom flask and stirred at room temperature for 5 hours. The reaction mixture was then placed in a beaker, washed three times with ethyl acetate and 10% saline solution, and separated into layers using a separatory funnel. After that, 50 g of anhydrous magnesium sulfate was added and dried, and the mixture was filtered by suction, and the filtrate was evaporated. After evaporation was complete, the crude product was purified with ethyl acetate and hexane to obtain intermediate (A-1-2) (yield: 26.9 g, purity: 95.3%, yield: 75.4%).

[0150] (3) Synthesis of photoinitiator (A-1) 10.7 g (0.03 mol) of intermediate (A-1-2), 75 mL of tetrahydrofuran, and 3 g of triethylamine were added to a 250 mL round-bottom flask and stirred. 4.9 g (0.063 mol) of acetyl chloride was added dropwise over approximately 0.5 hours. After stirring for 2 hours, a 3% aqueous sodium bicarbonate solution was added to neutralize the mixture until the pH was neutral, and the mixture was separated using a separatory funnel. The mixture was then washed twice with 30 mL of water, dried over 30 g of anhydrous magnesium sulfate, and the solvent was removed by evaporation to obtain a viscous liquid. The viscous liquid was purified with ethyl acetate and hexane, filtered, and dried to obtain photoinitiator (A-1) (yield: 13.1 g, purity: 99.0%, yield: 90.3%).

[0151]

[0152] (Synthesis Example 2: Synthesis of Photoinitiator (A-2)) (1) Synthesis of Intermediate (A-2-1) 9.3 g (0.05 mol) of diphenyl sulfide and AlCl in a 250 mL four-necked flask. ３ 5.3 g (0.05 mol) of 3-cyclopentylpropanoyl chloride and 50 mL of dichloroethane were added and stirred. The mixture was cooled to 0°C in an ice bath, and a mixed solution of 16.9 g (0.105 mol) of 3-cyclopentylpropanoyl chloride and 50 mL of dichloroethane was added over approximately 2 hours while adjusting the temperature to below 0°C. The temperature was maintained at 0°C and the mixture was stirred for another 2 hours. The reaction mixture was then gradually added to 10% hydrochloric acid water at 0°C, the lower layer was separated using a separatory funnel, and the upper layer was extracted with 20 mL of dichloroethane. The extract and the lower layer were then combined. The mixture was then washed with 5% sodium bicarbonate aqueous solution, washed three times with 100 mL of water until the pH was neutral, dried with 5 g of anhydrous magnesium sulfate to remove moisture, and then the dichloroethane was evaporated by evaporation. After evaporation was complete, the crude product was purified with ethyl acetate and hexane to obtain intermediate (A-2-1) (yield: 19.7 g, purity: 96.6%, yield: 90.5%).

[0153] (2) Synthesis of intermediate (A-2-2) 17.4 g (0.04 mol) of intermediate (A-2-1), 50 mL of tetrahydrofuran, 4.5 g of concentrated hydrochloric acid, and 11.7 g (0.10 mol) of isoamyl nitrite were added to a 100 mL round-bottom flask and stirred at room temperature for 5 hours. The reaction mixture was then placed in a beaker, washed three times with ethyl acetate and 10% saline solution, and separated into layers using a separatory funnel. After that, 10 g of anhydrous magnesium sulfate was added and the mixture was dried, followed by suction filtration and evaporation of the filtrate. After evaporation was complete, the crude product was purified with ethyl acetate and hexane to obtain intermediate (A-2-2) (yield: 16.8 g, purity: 95.3%, yield: 85.4%).

[0154] (3) Synthesis of photoinitiator (A-2) 14.8 g (0.03 mol) of intermediate (A-2-2), 75 mL of dichloroethane, and 3 g of triethylamine were added to a 250 mL round-bottom flask and stirred. 4.9 g (0.063 mol) of acetyl chloride was added dropwise over approximately 0.5 hours. After stirring for 2 hours, a 3% sodium bicarbonate aqueous solution was added to neutralize the mixture until the pH was neutral, and the mixture was separated using a separatory funnel. The mixture was then washed twice with 30 mL of water, dried over 30 g of anhydrous magnesium sulfate, and the solvent was removed by evaporation to obtain a viscous liquid. The viscous liquid was purified with ethyl acetate and hexane, filtered, and dried to obtain photoinitiator (A-2) (yield: 16.3 g, purity: 99.0%, yield: 94.1%).

[0155]

[0156] (Synthesis Example 3: Synthesis of Photoinitiator (A-3)) (1) Synthesis of Intermediate (A-3-1) 9.3 g (0.05 mol) of diphenyl sulfide and AlCl in a 250 mL four-necked flask. ３5.3 g (0.05 mol) of decanoyl chloride and 50 mL of dichloroethane were added and stirred. The mixture was cooled to 0°C in an ice bath, and a mixed solution of 9.5 g (0.05 mol) of decanoyl chloride and 50 mL of dichloroethane was added over approximately 2 hours while adjusting the temperature to below 0°C. The temperature was maintained at 0°C and the mixture was stirred for another 2 hours. The reaction mixture was then gradually added to 10% hydrochloric acid water at 0°C, the lower layer was separated using a separatory funnel, and the upper layer was extracted with 20 mL of dichloroethane. The extract and the lower layer were then combined. The mixture was then washed with 5% sodium bicarbonate aqueous solution, washed three times with 100 mL of water until the pH was neutral, dried with 5 g of anhydrous magnesium sulfate to remove moisture, and then the dichloroethane was evaporated by evaporation. After evaporation was complete, the crude product was purified with ethyl acetate and hexane to obtain intermediate (A-3-1) (yield: 16.8 g, purity: 92.1%, yield: 98.5%).

[0157] (2) Synthesis of intermediate (A-3-2) 15.3 g (0.045 mol) of intermediate (A-3-1) and AlCl in a 250 mL four-necked flask. ３ 5.3 g (0.045 mol) of 4-methylvaleryl chloride and 50 mL of dichloroethane were added and stirred. The mixture was cooled to 0°C in an ice bath, and a mixed solution of 6.1 g (0.045 mol) of 4-methylvaleryl chloride and 50 mL of dichloroethane was added over approximately 2 hours while adjusting the temperature to below 0°C. The temperature was maintained at 0°C and the mixture was stirred for another 2 hours. The reaction mixture was then gradually added to 10% hydrochloric acid water at 0°C, the lower layer was separated using a separatory funnel, and the upper layer was extracted with 20 mL of dichloroethane. The extract and the lower layer were then combined. The mixture was then washed with 5% sodium bicarbonate aqueous solution, washed three times with 100 mL of water until the pH was neutral, dried with 5 g of anhydrous magnesium sulfate to remove moisture, and then the dichloroethane was evaporated by evaporation. After evaporation was complete, the crude product was purified with ethyl acetate and hexane to obtain intermediate (A-3-2) (yield: 19.0 g, purity: 96.1%, yield: 96.5%).

[0158] (3) Synthesis of intermediate (A-3-3) 17.7 g (0.04 mol) of intermediate (A-3-2), 50 mL of tetrahydrofuran, 4.5 g of concentrated hydrochloric acid, and 11.7 g (0.10 mol) of isoamyl nitrite were added to a 100 mL round-bottom flask and stirred at room temperature for 5 hours. The reaction mixture was then transferred to a beaker, washed three times with ethyl acetate and 10% saline solution, and separated into layers using a separatory funnel. After that, 10 g of anhydrous magnesium sulfate was added and dried, and the mixture was filtered by suction, and the filtrate was evaporated. After evaporation was complete, the crude product was purified with ethyl acetate and hexane to obtain intermediate (A-3-3) (yield: 16.1 g, purity: 93.3%, yield: 80.8%).

[0159] (4) Synthesis of photoinitiator (A-3) 14.9 g (0.03 mol) of intermediate (A-3-3), 75 mL of dichloroethane, and 3 g of triethylamine were added to a 250 mL round-bottom flask and stirred. 4.9 g (0.063 mol) of acetyl chloride was added dropwise over approximately 0.5 hours. After stirring for 2 hours, a 3% sodium bicarbonate aqueous solution was added to neutralize the mixture until the pH was neutral, and the mixture was separated using a separatory funnel. The mixture was then washed twice with 30 mL of water, dried over 30 g of anhydrous magnesium sulfate, and the solvent was removed by evaporation to obtain a viscous liquid. The viscous liquid was purified with ethyl acetate and hexane, filtered, and dried to obtain photoinitiator (A-3) (yield: 16.6 g, purity: 96.1%, yield: 95.5%).

[0160]

[0161] (Synthesis Example 4: Synthesis of Photoinitiator (A-4)) Intermediate (A-1-2) was synthesized in the same manner as in Synthesis Example 1. 14.8 g (0.03 mol) of intermediate (A-1-2), 75 mL of dichloroethane, and 3 g of triethylamine were placed in a 250 mL round-bottom flask and stirred. 11.0 g (0.063 mol) of cyclohexanepropanoyl chloride was added dropwise over approximately 0.5 hours. After stirring for 2 hours, a 3% sodium bicarbonate aqueous solution was added to neutralize the mixture until the pH was neutral, and the mixture was separated using a separatory funnel. The mixture was then washed twice with 30 mL of water, dried over 30 g of anhydrous magnesium sulfate, and the solvent was removed by evaporation to obtain a viscous liquid. The viscous liquid was purified with ethyl acetate and hexane, filtered, and dried to obtain photoinitiator (A-4) (yield: 17.7 g, purity: 98.5%, yield: 93.2%).

[0162]

[0163] (Synthesis Example 5: Synthesis of Photoinitiator (A-5)) Intermediate (A-1-2) was synthesized in the same manner as in Synthesis Example 1. 14.8 g (0.03 mol) of intermediate (A-1-2), 75 mL of dichloroethane, and 3 g of triethylamine were placed in a 250 mL round-bottom flask and stirred. 8.9 g (0.063 mol) of benzoyl chloride was added dropwise over approximately 0.5 hours. After stirring for 2 hours, a 3% sodium bicarbonate aqueous solution was added to neutralize the mixture until the pH was neutral, and the mixture was separated using a separatory funnel. The mixture was then washed twice with 30 mL of water, dried over 30 g of anhydrous magnesium sulfate, and the solvent was removed by evaporation to obtain a viscous liquid. The viscous liquid was purified with ethyl acetate and hexane, filtered, and dried to obtain photoinitiator (A-5) (yield: 15.7 g, purity: 98.3%, yield: 92.7%).

[0164]

[0165] (Comparative Synthesis Example 1: Synthesis of Photoinitiator (C-1)) (1) Synthesis of Intermediate (C-1-1) 9.8 g (0.05 mol) of 9-ethylcarbazole, 6.7 g (0.05 mol) of AlCl3, and 50 mL of dichloroethane were added to a 250 mL four-necked flask and stirred. The mixture was cooled to 0°C in an ice bath, and a mixed solution of 9.7 g (0.105 mol) of propionyl chloride and 50 mL of dichloroethane was added over approximately 2 hours while adjusting the temperature to below 0°C. The temperature was maintained at 0°C and the mixture was stirred for another 2 hours. Then, the reaction mixture was gradually added to 10% hydrochloric acid water at 0°C, the lower layer was separated using a separatory funnel, the upper layer was extracted with 50 mL of dichloroethane, and the extract and the lower layer were combined. Subsequently, the product was washed with a 5% sodium bicarbonate aqueous solution, and then washed three more times with 100 mL of water until the pH became neutral. After drying with 5 g of anhydrous magnesium sulfate to remove moisture, the dichloroethane was evaporated by evaporation. After evaporation was complete, the crude product was purified with ethyl acetate and hexane to obtain intermediate (C-1-1) (yield: 14.1 g, purity: 96.6%, yield: 92.0%).

[0166] (2) Synthesis of intermediate (C-1-2) 12.3 g (0.04 mol) of intermediate (C-1-1), 50 mL of tetrahydrofuran, 4.5 g of concentrated hydrochloric acid, and 26.4 g (0.10 mol) of isoamyl nitrite were added to a 100 mL round-bottom flask and stirred at room temperature for 5 hours. The reaction mixture was then placed in a beaker, washed three times with ethyl acetate and 10% saline solution, and separated into layers using a separatory funnel. After that, 10 g of anhydrous magnesium sulfate was added and the mixture was dried, followed by suction filtration and evaporation of the filtrate. After evaporation was complete, the crude product was purified with ethyl acetate and hexane to obtain intermediate (C-1-2) (yield: 10.8 g, purity: 95.3%, yield: 73.8%).

[0167] (3) Synthesis of photoinitiator (C-1) 11.0 g (0.03 mol) of intermediate (C-1-2), 75 mL of dichloroethane, and 3 g of triethylamine were added to a 250 mL round-bottom flask and stirred. 4.9 g (0.063 mol) of acetyl chloride was added dropwise over approximately 0.5 hours. After stirring for 2 hours, a 3% sodium bicarbonate aqueous solution was added to neutralize the mixture until the pH was neutral, and the mixture was separated using a separatory funnel. The mixture was then washed twice with 30 mL of water, dried over 30 g of anhydrous magnesium sulfate, and the solvent was removed by evaporation to obtain a viscous liquid. The viscous liquid was purified with ethyl acetate and hexane, filtered, and dried to obtain photoinitiator (C-1) (yield: 12.8 g, purity: 98.9%, yield: 95.2%).

[0168]

[0169] (Synthesis Example 6: Preparation of Alkali-Soluble Resin 1) 300 parts by mass of PGMEA was charged into a polymerization tank, and the temperature was raised to 100°C under a nitrogen atmosphere. Then, 122.5 parts by mass of glycidyl methacrylate (GMA), 6 parts by mass of perbutyl O (manufactured by NOF Corporation), and 2 parts by mass of a chain transfer agent (n-dodecyl mercaptan) were added dropwise over 1.5 hours. The reaction was then continued while maintaining the temperature at 100°C, and 2 hours after the completion of the dropwise addition of the main chain forming mixture, 0.1 parts by mass of p-methoxyphenol was added as a polymerization inhibitor to stop the polymerization. Next, 59.6 parts by mass of acrylic acid (AA) was added while blowing in air, and the temperature was raised to 110°C. Then, 0.8 parts by mass of triethylamine was added and the addition reaction was carried out at 110°C for 15 hours. Next, while blowing in air, 17.9 parts by mass of succinic anhydride was added and the addition reaction was carried out at 110°C for 5 hours to obtain one alkali-soluble resin solution (weight-average molecular weight (Mw) 9500, ethylenically unsaturated bond equivalent 242, acid value 50 mg KOH / g, solid content 40% by mass).

[0170] (Synthesis Example 7: Preparation of Alkali-Soluble Resin 2) 300 parts by mass of PGMEA was charged into a polymerization tank, and the temperature was raised to 100°C under a nitrogen atmosphere. Then, 127.3 parts by mass of glycidyl methacrylate (GMA), 6 parts by mass of perbutyl O (manufactured by NOF Corporation), and 2 parts by mass of a chain transfer agent (n-dodecyl mercaptan) were added dropwise over 1.5 hours. The reaction was then continued while maintaining the temperature at 100°C, and 2 hours after the completion of the dropwise addition of the main chain forming mixture, 0.1 parts by mass of p-methoxyphenol was added as a polymerization inhibitor to stop the polymerization. Next, 62.0 parts by mass of acrylic acid (AA) was added while blowing in air, and the temperature was raised to 110°C. Then, 0.8 parts by mass of triethylamine was added and the addition reaction was carried out at 110°C for 15 hours. Next, while blowing in air, 10.7 parts by mass of succinic anhydride was added and the addition reaction was carried out at 110°C for 5 hours to obtain two alkali-soluble resin solutions (weight-average molecular weight (Mw) 9200, ethylenically unsaturated bond equivalent 233, acid value 30 mg KOH / g, solid content 40% by mass).

[0171] (Synthesis Example 8: Preparation of Alkali-Soluble Resin 3) 300 parts by mass of PGMEA was charged into a polymerization tank, and the temperature was raised to 100°C under a nitrogen atmosphere. Then, 112.9 parts by mass of glycidyl methacrylate (GMA), 6 parts by mass of perbutyl O (manufactured by NOF Corporation), and 2 parts by mass of a chain transfer agent (n-dodecyl mercaptan) were added dropwise over 1.5 hours. The reaction was then continued while maintaining the temperature at 100°C. Two hours after the completion of the dropwise addition of the main chain forming mixture, 0.1 parts by mass of p-methoxyphenol was added as a polymerization inhibitor to stop the polymerization. Next, 54.9 parts by mass of acrylic acid (AA) was added while blowing in air, and the temperature was raised to 110°C. Then, 0.8 parts by mass of triethylamine was added and the addition reaction was carried out at 110°C for 15 hours. Next, while blowing in air, 32.2 parts by mass of succinic anhydride were added, and the addition reaction was carried out at 110°C for 5 hours to obtain three alkali-soluble resin solutions (weight-average molecular weight (Mw) 9700, ethylenically unsaturated bond equivalent 262, acid value 90 mg KOH / g, solid content 40% by mass).

[0172] (Synthesis Example 9: Preparation of Alkali-Soluble Resin 4) 300 parts by mass of PGMEA was charged into a polymerization tank, and the temperature was raised to 100°C under a nitrogen atmosphere. Then, 128.6 parts by mass of glycidyl methacrylate (GMA), 6 parts by mass of perbutyl O (manufactured by NOF Corporation), and 2 parts by mass of a chain transfer agent (n-dodecyl mercaptan) were added dropwise over 1.5 hours. The reaction was then continued while maintaining the temperature at 100°C, and 2 hours after the completion of the dropwise addition of the main chain forming mixture, 0.1 parts by mass of p-methoxyphenol was added as a polymerization inhibitor to stop the polymerization. Next, 62.6 parts by mass of acrylic acid (AA) was added while blowing in air, and the temperature was raised to 110°C. Then, 0.8 parts by mass of triethylamine was added and the addition reaction was carried out at 110°C for 15 hours. Next, while blowing in air, 8.9 parts by mass of succinic anhydride was added and the addition reaction was carried out at 110°C for 5 hours to obtain four alkali-soluble resin solutions (weight-average molecular weight (Mw) 9200, ethylenically unsaturated bond equivalent 230, acid value 25 mg KOH / g, solid content 40% by mass).

[0173] (Synthesis Example 10: Preparation of Alkali-Soluble Resin 5) 300 parts by mass of PGMEA were charged into a polymerization tank, and the temperature was raised to 100°C under a nitrogen atmosphere. Then, 111.7 parts by mass of glycidyl methacrylate (GMA), 6 parts by mass of perbutyl O (manufactured by NOF Corporation), and 2 parts by mass of a chain transfer agent (n-dodecyl mercaptan) were added dropwise over 1.5 hours. The reaction was then continued while maintaining the temperature at 100°C, and 2 hours after the completion of the dropwise addition of the main chain forming mixture, 0.1 parts by mass of p-methoxyphenol was added as a polymerization inhibitor to stop the polymerization. Next, 54.4 parts by mass of acrylic acid (AA) was added while blowing in air, and the temperature was raised to 110°C. Then, 0.8 parts by mass of triethylamine was added and the addition reaction was carried out at 110°C for 15 hours. Next, while blowing in air, 34.0 parts by mass of succinic anhydride was added and the addition reaction was carried out at 110°C for 5 hours to obtain an alkali-soluble resin solution 5 (weight-average molecular weight (Mw) 9800, ethylenically unsaturated bond equivalent 265, acid value 95 mg KOH / g, solid content 40% by mass).

[0174] (Synthesis Example 11: Preparation of Alkali-Soluble Resin 6) 300 parts by mass of PGMEA were charged into a polymerization tank, and the temperature was raised to 100°C under a nitrogen atmosphere. Then, 114.8 parts by mass of glycidyl methacrylate (GMA), 6 parts by mass of perbutyl O (manufactured by NOF Corporation), and 2 parts by mass of a chain transfer agent (n-dodecyl mercaptan) were added dropwise over 1.5 hours. The reaction was then continued while maintaining the temperature at 100°C, and 2 hours after the completion of the dropwise addition of the main chain forming mixture, 0.1 parts by mass of p-methoxyphenol was added as a polymerization inhibitor to stop the polymerization. Next, 55.9 parts by mass of acrylic acid (AA) was added while blowing in air, and the temperature was raised to 110°C. Then, 0.8 parts by mass of triethylamine was added and the addition reaction was carried out at 110°C for 15 hours. Next, while blowing air in, 11.5 parts by mass of 2-isocyanatoethyl acrylate was added and the addition reaction was carried out at 110°C for 2 hours. Then, 17.8 parts by mass of succinic anhydride was added and the addition reaction was carried out at 110°C for 5 hours to obtain an alkali-soluble resin solution 6 (weight-average molecular weight (Mw) 9600, ethylenically unsaturated bond equivalent 231, acid value 50 mg KOH / g, solid content 40% by mass).

[0175] (Synthesis Example 12: Preparation of Alkali-Soluble Resin 7) 300 parts by mass of PGMEA were charged into a polymerization tank, and the temperature was raised to 100°C under a nitrogen atmosphere. Then, 114.8 parts by mass of glycidyl methacrylate (GMA), 6 parts by mass of perbutyl O (manufactured by NOF Corporation), and 2 parts by mass of a chain transfer agent (n-dodecyl mercaptan) were added dropwise over 1.5 hours. The reaction was then continued while maintaining the temperature at 100°C. Two hours after the completion of the dropwise addition of the main chain forming mixture, 0.1 parts by mass of p-methoxyphenol was added as a polymerization inhibitor to stop the polymerization. Next, 55.9 parts by mass of acrylic acid (AA) was added while blowing in air, and the temperature was raised to 110°C. Then, 0.8 parts by mass of triethylamine was added and the addition reaction was carried out at 110°C for 15 hours. Next, while blowing air in, 11.5 parts by mass of 2-isocyanatoethyl methacrylate was added and the addition reaction was carried out at 110°C for 2 hours. Then, 17.8 parts by mass of succinic anhydride was added and the addition reaction was carried out at 110°C for 5 hours to obtain an alkali-soluble resin solution 7 (weight-average molecular weight (Mw) 9700, ethylenically unsaturated bond equivalent 233, acid value 50 mg KOH / g, solid content 40% by mass).

[0176] (Synthesis Example 13: Preparation of Alkali-Soluble Resin 8) 300 parts by mass of PGMEA were charged into a polymerization tank, and the temperature was raised to 100°C under a nitrogen atmosphere. Then, 116.3 parts by mass of glycidyl methacrylate (GMA), 6 parts by mass of perbutyl O (manufactured by NOF Corporation), and 2 parts by mass of a chain transfer agent (n-dodecyl mercaptan) were added dropwise over 1.5 hours. The reaction was then continued while maintaining the temperature at 100°C, and 2 hours after the completion of the dropwise addition of the main chain forming mixture, 0.1 parts by mass of p-methoxyphenol was added as a polymerization inhibitor to stop the polymerization. Next, 56.6 parts by mass of acrylic acid (AA) was added while blowing in air, and the temperature was raised to 110°C. Then, 0.8 parts by mass of triethylamine was added and the addition reaction was carried out at 110°C for 15 hours. Next, while blowing in air, 27.1 parts by mass of tetrahydrophthalic anhydride was added and the addition reaction was carried out at 110°C for 5 hours to obtain an alkali-soluble resin solution 8 (weight-average molecular weight (Mw) 9500, ethylenically unsaturated bond equivalent 255, acid value 50 mg KOH / g, solid content 40% by mass).

[0177] (Synthesis Example 14: Preparation of Alkali-Soluble Resin 9) 300 parts by mass of PGMEA were charged into a polymerization tank, and the temperature was raised to 100°C under a nitrogen atmosphere. Then, 109.0 parts by mass of glycidyl methacrylate (GMA), 6 parts by mass of perbutyl O (manufactured by NOF Corporation), and 2 parts by mass of a chain transfer agent (n-dodecyl mercaptan) were added dropwise over 1.5 hours. The reaction was then continued while maintaining the temperature at 100°C, and 2 hours after the completion of the dropwise addition of the main chain forming mixture, 0.1 parts by mass of p-methoxyphenol was added as a polymerization inhibitor to stop the polymerization. Next, 53.1 parts by mass of acrylic acid (AA) was added while blowing in air, and the temperature was raised to 110°C. Then, 0.8 parts by mass of triethylamine was added and the addition reaction was carried out at 110°C for 15 hours. Next, while blowing in air, 10.9 parts by mass of 2-isocyanatoethyl acrylate was added and the addition reaction was carried out at 110°C for 2 hours. Then, 27.0 parts by mass of tetrahydrophthalic anhydride was added and the addition reaction was carried out at 110°C for 5 hours to obtain an alkali-soluble resin solution 9 (weight-average molecular weight (Mw) 9700, ethylenically unsaturated bond equivalent 232, acid value 50 mg KOH / g, solid content 40% by mass).

[0178] (Synthesis Example 15: Preparation of Alkali-Soluble Resin 10) 300 parts by mass of PGMEA was charged into a polymerization tank, and the temperature was raised to 100°C under a nitrogen atmosphere. Then, 109.0 parts by mass of glycidyl methacrylate (GMA), 6 parts by mass of perbutyl O (manufactured by NOF Corporation), and 2 parts by mass of a chain transfer agent (n-dodecyl mercaptan) were added dropwise over 1.5 hours. The reaction was then continued while maintaining the temperature at 100°C, and 2 hours after the completion of the dropwise addition of the main chain forming mixture, 0.1 parts by mass of p-methoxyphenol was added as a polymerization inhibitor to stop the polymerization. Next, 53.1 parts by mass of acrylic acid (AA) was added while blowing in air, and the temperature was raised to 110°C. Then, 0.8 parts by mass of triethylamine was added and the addition reaction was carried out at 110°C for 15 hours. Next, while blowing air in, 10.9 parts by mass of 2-isocyanatoethyl methacrylate was added and the addition reaction was carried out at 110°C for 2 hours. Then, 27.0 parts by mass of tetrahydrophthalic anhydride was added and the addition reaction was carried out at 110°C for 5 hours to obtain an alkali-soluble resin solution 10 (weight-average molecular weight (Mw) 9800, ethylenically unsaturated bond equivalent 234, acid value 50 mg KOH / g, solid content 40% by mass).

[0179] (Synthesis Example 16: Preparation of Alkali-Soluble Resin 11) 300 parts by mass of PGMEA was charged into a polymerization tank, and the temperature was raised to 100°C under a nitrogen atmosphere. Then, 115.2 parts by mass of glycidyl methacrylate (GMA), 6 parts by mass of perbutyl O (manufactured by NOF Corporation), and 2 parts by mass of a chain transfer agent (n-dodecyl mercaptan) were added dropwise over 1.5 hours. The reaction was then continued while maintaining the temperature at 100°C, and 2 hours after the completion of the dropwise addition of the main chain forming mixture, 0.1 parts by mass of p-methoxyphenol was added as a polymerization inhibitor to stop the polymerization. Next, 66.9 parts by mass of methacrylic acid (MAA) was added while blowing in air, and the temperature was raised to 110°C. Then, 0.8 parts by mass of triethylamine was added and the addition reaction was carried out at 110°C for 15 hours. Next, while blowing in air, 17.9 parts by mass of succinic anhydride was added and the addition reaction was carried out at 110°C for 5 hours to obtain an alkali-soluble resin solution 11 (weight-average molecular weight (Mw) 9600, ethylenically unsaturated bond equivalent 255, acid value 50 mg KOH / g, solid content 40% by mass).

[0180] (Synthesis Example 17: Preparation of Alkali-Soluble Resin 12) 300 parts by mass of PGMEA were charged into a polymerization tank, and the temperature was raised to 100°C under a nitrogen atmosphere. Then, 108.3 parts by mass of glycidyl methacrylate (GMA), 6 parts by mass of perbutyl O (manufactured by NOF Corporation), and 2 parts by mass of a chain transfer agent (n-dodecyl mercaptan) were added dropwise over 1.5 hours. The reaction was then continued while maintaining the temperature at 100°C, and 2 hours after the completion of the dropwise addition of the main chain forming mixture, 0.1 parts by mass of p-methoxyphenol was added as a polymerization inhibitor to stop the polymerization. Next, 62.9 parts by mass of methacrylic acid (MAA) was added while blowing in air, and the temperature was raised to 110°C. Then, 0.8 parts by mass of triethylamine was added and the addition reaction was carried out at 110°C for 15 hours. Next, while blowing in air, 10.8 parts by mass of 2-isocyanatoethyl acrylate was added and the addition reaction was carried out at 110°C for 2 hours. Then, 17.9 parts by mass of succinic anhydride was added and the addition reaction was carried out at 110°C for 5 hours to obtain an alkali-soluble resin solution 12 (weight-average molecular weight (Mw) 9700, ethylenically unsaturated bond equivalent 232, acid value 50 mg KOH / g, solid content 40% by mass).

[0181] (Synthesis Example 18: Preparation of Alkali-Soluble Resin 13) 300 parts by mass of PGMEA were charged into a polymerization tank, and the temperature was raised to 100°C under a nitrogen atmosphere. Then, 108.3 parts by mass of glycidyl methacrylate (GMA), 6 parts by mass of perbutyl O (manufactured by NOF Corporation), and 2 parts by mass of a chain transfer agent (n-dodecyl mercaptan) were added dropwise over 1.5 hours. The reaction was then continued while maintaining the temperature at 100°C, and 2 hours after the completion of the dropwise addition of the main chain forming mixture, 0.1 parts by mass of p-methoxyphenol was added as a polymerization inhibitor to stop the polymerization. Next, 62.9 parts by mass of methacrylic acid (MAA) was added while blowing in air, and the temperature was raised to 110°C. Then, 0.8 parts by mass of triethylamine was added and the addition reaction was carried out at 110°C for 15 hours. Next, while blowing air in, 10.8 parts by mass of 2-isocyanatoethyl methacrylate was added and the addition reaction was carried out at 110°C for 2 hours. Then, 17.9 parts by mass of succinic anhydride was added and the addition reaction was carried out at 110°C for 5 hours to obtain an alkali-soluble resin 13 solution (weight-average molecular weight (Mw) 9800, ethylenically unsaturated bond equivalent 234, acid value 50 mg KOH / g, solid content 40% by mass).

[0182] (Synthesis Example 19: Preparation of Alkali-Soluble Resin 14) 300 parts by mass of PGMEA were charged into a polymerization tank, and the temperature was raised to 100°C under a nitrogen atmosphere. Then, 109.3 parts by mass of glycidyl methacrylate (GMA), 6 parts by mass of perbutyl O (manufactured by NOF Corporation), and 2 parts by mass of a chain transfer agent (n-dodecyl mercaptan) were added dropwise over 1.5 hours. The reaction was then continued while maintaining the temperature at 100°C, and 2 hours after the completion of the dropwise addition of the main chain forming mixture, 0.1 parts by mass of p-methoxyphenol was added as a polymerization inhibitor to stop the polymerization. Next, 63.5 parts by mass of methacrylic acid (MAA) was added while blowing in air, and the temperature was raised to 110°C. Then, 0.8 parts by mass of triethylamine was added and the addition reaction was carried out at 110°C for 15 hours. Next, 27.1 parts by mass of tetrahydrophthalic anhydride were added while blowing air into the mixture, and the addition reaction was carried out at 110°C for 5 hours to obtain an alkali-soluble resin 14 solution (weight-average molecular weight (Mw) 9700, ethylenically unsaturated bond equivalent 255, acid value 50 mg KOH / g, solid content 40% by mass).

[0183] (Synthesis Example 20: Preparation of Alkali-Soluble Resin 15) 300 parts by mass of PGMEA were charged into a polymerization tank, and the temperature was raised to 100°C under a nitrogen atmosphere. Then, 102.8 parts by mass of glycidyl methacrylate (GMA), 6 parts by mass of perbutyl O (manufactured by NOF Corporation), and 2 parts by mass of a chain transfer agent (n-dodecyl mercaptan) were added dropwise over 1.5 hours. The reaction was then continued while maintaining the temperature at 100°C, and 2 hours after the completion of the dropwise addition of the main chain forming mixture, 0.1 parts by mass of p-methoxyphenol was added as a polymerization inhibitor to stop the polymerization. Next, 59.7 parts by mass of methacrylic acid (MAA) was added while blowing in air, and the temperature was raised to 110°C. Then, 0.8 parts by mass of triethylamine was added and the addition reaction was carried out at 110°C for 15 hours. Next, while blowing air in, 10.3 parts by mass of 2-isocyanatoethyl acrylate was added and the addition reaction was carried out at 110°C for 2 hours. Then, 27.1 parts by mass of tetrahydrophthalic anhydride was added and the addition reaction was carried out at 110°C for 5 hours to obtain an alkali-soluble resin solution 15 (weight-average molecular weight (Mw) 9800, ethylenically unsaturated bond equivalent 233, acid value 50 mg KOH / g, solid content 40% by mass).

[0184] (Synthesis Example 21: Preparation of Alkali-Soluble Resin 16) 300 parts by mass of PGMEA were charged into a polymerization tank, and the temperature was raised to 100°C under a nitrogen atmosphere. Then, 102.8 parts by mass of glycidyl methacrylate (GMA), 6 parts by mass of perbutyl O (manufactured by NOF Corporation), and 2 parts by mass of a chain transfer agent (n-dodecyl mercaptan) were added dropwise over 1.5 hours. The reaction was then continued while maintaining the temperature at 100°C, and 2 hours after the completion of the dropwise addition of the main chain forming mixture, 0.1 parts by mass of p-methoxyphenol was added as a polymerization inhibitor to stop the polymerization. Next, 59.7 parts by mass of methacrylic acid (MAA) was added while blowing in air, and the temperature was raised to 110°C. Then, 0.8 parts by mass of triethylamine was added and the addition reaction was carried out at 110°C for 15 hours. Next, while blowing in air, 10.3 parts by mass of 2-isocyanatoethyl methacrylate was added and the addition reaction was carried out at 110°C for 2 hours. Then, 27.1 parts by mass of tetrahydrophthalic anhydride was added and the addition reaction was carried out at 110°C for 5 hours to obtain an alkali-soluble resin 16 solution (weight-average molecular weight (Mw) 9900, ethylenically unsaturated bond equivalent 235, acid value 50 mg KOH / g, solid content 40% by mass).

[0185] (Synthesis Example 22: Preparation of Alkali-Soluble Resin 17) 300 parts by mass of PGMEA were charged into a polymerization tank, and the temperature was raised to 100°C under a nitrogen atmosphere. Then, 59.2 parts by mass of glycidyl methacrylate (GMA), 94.2 parts by mass of benzyl methacrylate (BzMA), 6 parts by mass of perbutyl O (manufactured by NOF Corporation), and 2 parts by mass of a chain transfer agent (n-dodecyl mercaptan) were added dropwise over 1.5 hours. The reaction was then continued while maintaining the temperature at 100°C, and 2 hours after the completion of the dropwise addition of the main chain forming mixture, 0.1 parts by mass of p-methoxyphenol was added as a polymerization inhibitor to stop the polymerization. Next, 28.8 parts by mass of acrylic acid (AA) was added while blowing air into the tank, and the temperature was raised to 110°C. Then, 0.8 parts by mass of triethylamine was added and the addition reaction was carried out at 110°C for 15 hours. Next, while blowing in air, 17.8 parts by mass of succinic anhydride was added and the addition reaction was carried out at 110°C for 5 hours to obtain an alkali-soluble resin 17 solution (weight-average molecular weight (Mw) 9500, ethylenically unsaturated bond equivalent 500, acid value 30 mg KOH / g, solid content 40% by mass).

[0186] (Synthesis Example 23: Synthesis of Block Copolymer 1) 250 parts by mass of THF and 0.6 parts by mass of lithium chloride were added to a 500 mL round-bottom, four-neck separable flask equipped with a condenser, an additive funnel, a nitrogen inlet, a mechanical stirrer, and a digital thermometer, and the flask was thoroughly purged with nitrogen. After cooling the reaction flask to -60°C, 3.8 parts by mass of butyllithium (15% by mass hexane solution), 1.1 parts by mass of diisopropylamine, and 1.0 part by mass of methyl isobutyrate were injected using a syringe. 2.2 parts by mass of 1-ethoxyethyl methacrylate (EEMA), 29.1 parts by mass of 2-(trimethylsilyloxy)ethyl methacrylate (TMSMA), 12.8 parts by mass of 2-ethylhexyl methacrylate (EHMA), 13.7 parts by mass of n-butyl methacrylate (BMA), 9.5 parts by mass of benzyl methacrylate (BzMA), and 17.5 parts by mass of methyl methacrylate (MMA) were added dropwise over 60 minutes using an additive funnel. After 30 minutes, 26.7 parts by mass of dimethylaminoethyl methacrylate (DMMA), the monomer for block A, were added dropwise over 20 minutes. After reacting for 30 minutes, 1.5 parts by mass of methanol was added to stop the reaction. The resulting precursor block copolymer THF solution was reprecipitated in hexane, purified by filtration and vacuum drying, and diluted with PGMEA to a 30% by mass solids solution. 32.5 parts by mass of water were added, the temperature was raised to 100°C, and the reaction was carried out for 7 hours. The constituent units derived from EEMA were deprotected to obtain constituent units derived from methacrylic acid (MAA), and the constituent units derived from TMSMA were deprotected to obtain constituent units derived from 2-hydroxyethyl methacrylate (HEMA). The resulting block copolymer PGMEA solution was reprecipitated in hexane, purified by filtration and vacuum drying, and block copolymer 1 containing the constituent units represented by the general formula (I) (amine value 95 mg KOH / g, acid value 8 mg KOH / g, Tg 38°C) was obtained. The weight-average molecular weight Mw was 10,000.

[0187] (Synthesis Example 24: Preparation of Alkali-Soluble Resin A) 300 parts by mass of PGMEA were charged into a polymerization tank, and the temperature was raised to 100°C under a nitrogen atmosphere. Then, 90 parts by mass of 2-phenoxyethyl methacrylate (PhEMA), 54 parts by mass of MMA, 36 parts by mass of methacrylic acid (MAA), 6 parts by mass of perbutyl O (manufactured by NOF Corporation), and 2 parts by mass of a chain transfer agent (n-dodecyl mercaptan) were continuously added dropwise over 1.5 hours. The reaction was then continued while maintaining the temperature at 100°C, and 2 hours after the completion of the dropwise addition of the main chain forming mixture, 0.1 parts by mass of p-methoxyphenol was added as a polymerization inhibitor to stop the polymerization. Next, while blowing air in, 20 parts by mass of glycidyl methacrylate (GMA) as an epoxy group-containing compound was added, the temperature was raised to 110°C, and then 0.8 parts by mass of triethylamine was added and the addition reaction was carried out at 110°C for 15 hours to obtain alkali-soluble resin A solution (weight-average molecular weight (Mw) 8500, ethylenically unsaturated bond equivalent 1400, acid value 75 mg KOH / g, solid content 40% by mass).

[0188] (Synthesis Example 25: Preparation of Phosphate-Based Dispersant A1) 618 parts by mass of methoxypolyethylene glycol with an average molecular weight of 1000, 353 parts by mass of caprolactone, and 1 part by mass of dibutyltin dilaurate were charged into a flask and heated to 160°C. The mixture was stirred at this temperature until the solid content reached 98% to obtain a monohydroxy compound. 29 parts by mass of phosphorus pentoxide were then charged into the mixture and stirred at 80°C for 5 hours while removing water. Finally, phosphate-based dispersant A1 (molecular weight 2000, general formula (1) R) was added. ａ It contains a polycaprolactone residue with m=2 and p3=5 and a polyethylene glycol residue with p1=22, R ｂ A mixture was obtained in which (a C1 alkyl group and n is 1 or 2).

[0189] (Preparation Example 1: Preparation of Colorant Dispersion G1) 72.1 parts by mass of PGMEA, 15 parts by mass of the alkali-soluble resin A solution (solid content 40% by mass), and 10.2 parts by mass of the PGMEA solution of block copolymer 1 (solid content 35% by mass) were added to a 225 mL mayonnaise bottle and stirred. 0.4 parts by mass of phenylphosphonic acid (trade name: PPA, manufactured by Nissan Chemical Corporation) was added and stirred at room temperature for 30 minutes. 13.3 parts by mass of C.I. Pigment Green 58 (G58, maximum absorption wavelength 663 nm) as a green pigment and 100 parts by mass of 2.0 mm particle size zirconia beads were added. The mixture was shaken for 1 hour in a paint shaker (manufactured by Asada Iron Works Co., Ltd.) as a preliminary crushing, and then 200 parts of 0.1 mm particle size zirconia beads were added and dispersed in a paint shaker for 4 hours as a final crushing to obtain colorant dispersion G1. Furthermore, the block copolymer 1 is salted with phenylphosphonic acid, resulting in a salt-type block copolymer 1.

[0190] (Preparation Example 2: Preparation of Colorant Dispersion G2) Colorant dispersion G2 was obtained in the same manner as colorant dispersion G1, except that C.I. Pigment Green 7 (G7, maximum absorption wavelength 642 nm) was used instead of the green pigment C.I. Pigment Green 58 (G58) in Preparation Example 1.

[0191] (Preparation Example 3: Preparation of Colorant Dispersion G3) Colorant dispersion G3 was obtained in the same manner as colorant dispersion G1, except that C.I. Pigment Green 36 (G36, maximum absorption wavelength 656 nm) was used instead of the green pigment C.I. Pigment Green 58 (G58) in Preparation Example 1.

[0192] (Preparation Example 4: Preparation of Colorant Dispersion G4) Colorant dispersion G4 was obtained in the same manner as colorant dispersion G1, except that C.I. Pigment Green 59 (G59, maximum absorption wavelength 645 nm) was used instead of the green pigment C.I. Pigment Green 58 (G58) in Preparation Example 1.

[0193] (Preparation Example 5: Preparation of Colorant Dispersion Y1) Colorant dispersion Y1 was obtained in the same manner as colorant dispersion G1, except that C.I. Pigment Yellow 150 (Y150) was used instead of the green pigment C.I. Pigment Green 58 (G58) in Preparation Example 1.

[0194] (Preparation Example 6: Preparation of Colorant Dispersion B1) Colorant dispersion B1 was obtained in the same manner as colorant dispersion G1, except that C.I. Pigment Blue 15:6 (B15:6) was used instead of the green pigment C.I. Pigment Green 58 (G58) in Preparation Example 1.

[0195] [Preparation of High Refractive Index Inorganic Particle Dispersion] (Preparation Example 7: Preparation of High Refractive Index Inorganic Particle Dispersion a) 81.25 parts by mass of PGMEA and 3.75 parts by mass of a phosphoric acid-based dispersant with a molecular weight of 2000 (solid content 100% by mass, the above-mentioned phosphoric acid-based dispersant A1) were added to a 225 mL mayonnaise bottle and stirred at room temperature for 30 minutes. 15 parts by mass of zirconia oxide particles with a particle size of 15 nm and 100 parts by mass of zirconia beads with a particle size of 2.0 mm were added, and the mixture was shaken for 1 hour using a paint shaker (manufactured by Asada Iron Works Co., Ltd.) as a preliminary crushing. Then, 200 parts of zirconia beads with a particle size of 0.1 mm were added, and the mixture was dispersed for 4 hours using a paint shaker as a final crushing to obtain High Refractive Index Inorganic Particle Dispersion a.

[0196] (Preparation Example 8: Preparation of High Refractive Index Inorganic Particle Dispersion b) A high refractive index inorganic particle dispersion b was obtained in the same manner as in Preparation Example 7, except that barium titanate particles with a particle size of 15 nm were used instead of zirconia oxide particles with a particle size of 15 nm.

[0197] (Preparation Example 9: Preparation of High Refractive Index Inorganic Particle Dispersion c) A high refractive index inorganic particle dispersion c was obtained in the same manner as in Preparation Example 7, except that titanium oxide particles with a particle size of 15 nm were used instead of zirconia oxide particles with a particle size of 15 nm.

[0198] (Example 1: Production of photosensitive colored resin composition 1) 0.10 parts by mass of FDB-022 (manufactured by Yamada Chemical Industries, Ltd., hereinafter referred to as "Dye-1", maximum absorption wavelength 493 nm) as the first colorant, 0.34 parts by mass of FDG-005 (manufactured by Yamada Chemical Industries, Ltd., hereinafter referred to as "Dye-2-1", maximum absorption wavelength 583 nm) as the second colorant, 1.99 parts by mass of colorant dispersion G1 as the green pigment of the third colorant, and 1.12 parts by mass of Tinuvin970 (manufactured by BASF, hereinafter referred to as "Dye-4", maximum absorption wavelength 380 nm) as the fourth colorant, 18.75 parts by mass of the alkali-soluble resin 1 obtained in Example 6, 4.86 parts by mass of photopolymerizable compound (i) (trade name Aronics M-930, manufactured by Toagosei Co., Ltd., a mixture of glycerin diacrylate and glycerin triacrylate), 0.60 parts by mass of the photoinitiator (A-1) obtained in Synthesis Example 1, 0.04 parts by mass of fluorine-based surfactant (trade name Megafac R-08MH, manufactured by DIC Corporation), and 72.17 parts by mass of PGMEA were added to obtain photosensitive colored resin composition 1.

[0199] (Examples 2-5: Production of photosensitive colored resin compositions 2-5) Photosensitive colored resin compositions 2-5 were obtained in the same manner as in Example 1, except that the photoinitiator (A-2) obtained in Synthesis Example 2, the photoinitiator (A-3) obtained in Synthesis Example 3, the photoinitiator (A-4) obtained in Synthesis Example 4, or the photoinitiator (A-5) obtained in Synthesis Example 5 were used instead of the photoinitiator (A-1) in Example 1, as shown in Table 1.

[0200] (Example 6: Production of Photosensitive Colored Resin Composition 6) 0.09 parts by mass of Dye-1 as the first colorant, 0.52 parts by mass of FDG-006 (manufactured by Yamada Chemical Industries, Ltd., hereinafter referred to as "Dye-2-2", maximum absorption wavelength 585 nm) as the second colorant, 1.62 parts by mass of colorant dispersion G1 as the green pigment of the third colorant, 1.08 parts by mass of Dye-4 as the fourth colorant, 18.75 parts by mass of alkali-soluble resin 1, 4.82 parts by mass of photopolymerizable compound (i), 0.60 parts by mass of photoinitiator (A-1), 0.04 parts by mass of fluorine-based surfactant (product name Megafac R-08MH, manufactured by DIC Corporation), and 72.47 parts by mass of PGMEA were added to obtain Photosensitive Colored Resin Composition 6.

[0201] (Example 7: Production of Photosensitive Colored Resin Composition 7) 0.10 parts by mass of Dye-1 as the first colorant, 0.34 parts by mass of FDG-007 (manufactured by Yamada Chemical Industries, Ltd., hereinafter referred to as "Dye-2-3", maximum absorption wavelength 594 nm) as the second colorant, 1.38 parts by mass of colorant dispersion G1 as the green pigment of the third colorant, 1.14 parts by mass of Dye-4 as the fourth colorant, 18.75 parts by mass of alkali-soluble resin 1, 4.98 parts by mass of photopolymerizable compound (i), 0.60 parts by mass of photoinitiator (A-1), 0.04 parts by mass of fluorine-based surfactant (product name Megafac R-08MH, manufactured by DIC Corporation), and 72.66 parts by mass of PGMEA were added to obtain Photosensitive Colored Resin Composition 7.

[0202] (Example 8: Production of photosensitive colored resin composition 8) 0.10 parts by mass of Dye-1 as the first colorant, 0.34 parts by mass of Dye-2-1 as the second colorant, 1.87 parts by mass of colorant dispersion G1 as the green pigment of the third colorant, 18.75 parts by mass of alkali-soluble resin 1, 6.01 parts by mass of photopolymerizable compound (i), 0.60 parts by mass of photoinitiator (A-1), 0.04 parts by mass of fluorine-based surfactant (trade name Megafac R-08MH, manufactured by DIC Corporation), and 72.27 parts by mass of PGMEA were added to obtain photosensitive colored resin composition 8.

[0203] (Example 9: Production of Photosensitive Colored Resin Composition 9) 0.07 parts by mass of Dye-1 as the first colorant, 0.30 parts by mass of Dye-2-1 as the second colorant, 2.00 parts by mass of colorant dispersion G1 as the green pigment of the third colorant, 1.12 parts by mass of Dye-4 as the fourth colorant, 18.75 parts by mass of alkali-soluble resin 1, 4.94 parts by mass of photopolymerizable compound (i), 0.60 parts by mass of photoinitiator (A-1), 0.04 parts by mass of fluorine-based surfactant (trade name Megafac R-08MH, manufactured by DIC Corporation), and 72.17 parts by mass of PGMEA were added to obtain Photosensitive Colored Resin Composition 9.

[0204] (Example 10: Production of photosensitive colored resin composition 10) 0.10 parts by mass of Dye-1 as the first colorant, 0.22 parts by mass of Dye-2-1 as the second colorant, 2.13 parts by mass of colorant dispersion G1 as the green pigment of the third colorant, 1.12 parts by mass of Dye-4 as the fourth colorant, 18.75 parts by mass of alkali-soluble resin 1, 4.95 parts by mass of photopolymerizable compound (i), 0.60 parts by mass of photoinitiator (A-1), 0.04 parts by mass of fluorine-based surfactant (trade name Megafac R-08MH, manufactured by DIC Corporation), and 72.07 parts by mass of PGMEA were added to obtain photosensitive colored resin composition 10.

[0205] (Example 11: Production of photosensitive colored resin composition 11) 0.18 parts by mass of Dye-1 as the first colorant, 0.34 parts by mass of Dye-2-1 as the second colorant, 2.00 parts by mass of colorant dispersion G1 as the green pigment of the third colorant, 1.05 parts by mass of Dye-4 as the fourth colorant, 18.75 parts by mass of alkali-soluble resin 1, 4.86 parts by mass of photopolymerizable compound (i), 0.60 parts by mass of photoinitiator (A-1), 0.04 parts by mass of fluorine-based surfactant (trade name Megafac R-08MH, manufactured by DIC Corporation), and 72.17 parts by mass of PGMEA were added to obtain photosensitive colored resin composition 11.

[0206] (Example 12: Production of photosensitive colored resin composition 12) 0.13 parts by mass of Dye-1 as the first colorant, 0.46 parts by mass of Dye-2-1 as the second colorant, 2.00 parts by mass of colorant dispersion G1 as the green pigment of the third colorant, 1.11 parts by mass of Dye-4 as the fourth colorant, 18.75 parts by mass of alkali-soluble resin 1, 4.73 parts by mass of photopolymerizable compound (i), 0.60 parts by mass of photoinitiator (A-1), 0.04 parts by mass of fluorine-based surfactant (trade name Megafac R-08MH, manufactured by DIC Corporation), and 72.17 parts by mass of PGMEA were added to obtain photosensitive colored resin composition 12.

[0207] (Example 13: Production of photosensitive colored resin composition 13) 0.09 parts by mass of Dye-1 as the first colorant, 0.30 parts by mass of Dye-2-3 as the second colorant, 1.50 parts by mass of colorant dispersion G1 as the green pigment of the third colorant, 1.20 parts by mass of Dye-4 as the fourth colorant, 18.75 parts by mass of alkali-soluble resin 1, 4.95 parts by mass of photopolymerizable compound (i), 0.60 parts by mass of photoinitiator (A-1), 0.04 parts by mass of fluorine-based surfactant (trade name Megafac R-08MH, manufactured by DIC Corporation), and 72.57 parts by mass of PGMEA were added to obtain photosensitive colored resin composition 13.

[0208] (Example 14: Production of photosensitive colored resin composition 14) 0.10 parts by mass of Dye-1 as the first colorant, 0.34 parts by mass of Dye-2-1 as the second colorant, 3.75 parts by mass of colorant dispersion G1 as the green pigment of the third colorant, 1.03 parts by mass of Dye-4 as the fourth colorant, 18.75 parts by mass of alkali-soluble resin 1, 4.58 parts by mass of photopolymerizable compound (i), 0.60 parts by mass of photoinitiator (A-1), 0.04 parts by mass of fluorine-based surfactant (trade name Megafac R-08MH, manufactured by DIC Corporation), and 70.79 parts by mass of PGMEA were added to obtain photosensitive colored resin composition 14.

[0209] (Example 15: Production of photosensitive colored resin composition 15) 0.10 parts by mass of Dye-1 as the first colorant, 0.34 parts by mass of Dye-2-1 as the second colorant, 1.12 parts by mass of colorant dispersion G1 as the green pigment of the third colorant, 1.17 parts by mass of Dye-4 as the fourth colorant, 18.75 parts by mass of alkali-soluble resin 1, 5.00 parts by mass of photopolymerizable compound (i), 0.60 parts by mass of photoinitiator (A-1), 0.04 parts by mass of fluorine-based surfactant (trade name Megafac R-08MH, manufactured by DIC Corporation), and 72.86 parts by mass of PGMEA were added to obtain photosensitive colored resin composition 15.

[0210] (Example 16: Production of photosensitive colored resin composition 16) 0.10 parts by mass of Dye-1 as the first colorant, 0.34 parts by mass of Dye-2-1 as the second colorant, 1.25 parts by mass of colorant dispersion G2 as the green pigment of the third colorant, 1.14 parts by mass of Dye-4 as the fourth colorant, 18.75 parts by mass of alkali-soluble resin 1, 5.00 parts by mass of photopolymerizable compound (i), 0.60 parts by mass of photoinitiator (A-1), 0.04 parts by mass of fluorine-based surfactant (trade name Megafac R-08MH, manufactured by DIC Corporation), and 72.76 parts by mass of PGMEA were added to obtain photosensitive colored resin composition 16.

[0211] (Example 17: Production of photosensitive colored resin composition 17) 0.10 parts by mass of Dye-1 as the first colorant, 0.34 parts by mass of Dye-2-1 as the second colorant, 2.00 parts by mass of colorant dispersion G3 as the green pigment of the third colorant, 1.11 parts by mass of Dye-4 as the fourth colorant, 18.75 parts by mass of alkali-soluble resin 1, 4.88 parts by mass of photopolymerizable compound (i), 0.60 parts by mass of photoinitiator (A-1), 0.04 parts by mass of fluorine-based surfactant (trade name Megafac R-08MH, manufactured by DIC Corporation), and 72.17 parts by mass of PGMEA were added to obtain photosensitive colored resin composition 17.

[0212] (Example 18: Production of photosensitive colored resin composition 18) 0.10 parts by mass of Dye-1 as the first colorant, 0.34 parts by mass of Dye-2-1 as the second colorant, 1.50 parts by mass of colorant dispersion G4 as the green pigment of the third colorant, 1.15 parts by mass of Dye-4 as the fourth colorant, 18.75 parts by mass of alkali-soluble resin 1, 4.93 parts by mass of photopolymerizable compound (i), 0.60 parts by mass of photoinitiator (A-1), 0.04 parts by mass of fluorine-based surfactant (trade name Megafac R-08MH, manufactured by DIC Corporation), and 72.57 parts by mass of PGMEA were added to obtain photosensitive colored resin composition 18.

[0213] (Examples 19-22: Production of photosensitive colored resin compositions 19-22) Photosensitive colored resin compositions 19-22 were obtained in the same manner as in Example 1, except that in Example 1, alkali-soluble resins 2, 3, 4, or 5 obtained in Synthesis Examples 7-10 were used instead of alkali-soluble resin 1, as shown in Table 1.

[0214] (Example 23: Production of photosensitive colored resin composition 23) A photosensitive colored resin composition 23 was obtained in the same manner as in Example 1, except that photopolymerizable compound (i) was replaced with photopolymerizable compound (ii) (trade name Aronics M-305, manufactured by Toagosei Co., Ltd., a mixture of pentaerythritol triacrylate and tetraacrylate).

[0215] (Example 24: Production of photosensitive colored resin composition 24) A photosensitive colored resin composition 24 was obtained in the same manner as in Example 1, except that photopolymerizable compound (i) was replaced with photopolymerizable compound (iii) (trade name Aronics M-403, manufactured by Toagosei Co., Ltd., a mixture of dipentaerythritol pentaacrylate and hexaacrylate).

[0216] (Example 25: Production of Photosensitive Colored Resin Composition 25) 0.10 parts by mass of Dye-1 as the first colorant, 0.34 parts by mass of Dye-2-1 as the second colorant, 1.99 parts by mass of colorant dispersion G1 as the green pigment of the third colorant, 1.12 parts by mass of Dye-4 as the fourth colorant, 25.00 parts by mass of high refractive index inorganic particle dispersion a, 12.00 parts by mass of alkali-soluble resin 1, 2.86 parts by mass of photopolymerizable compound (i), 0.60 parts by mass of photoinitiator (A-1), 0.04 parts by mass of fluorine-based surfactant (product name Megafac R-08MH, manufactured by DIC Corporation), and 55.92 parts by mass of PGMEA were added to obtain the photosensitive colored resin composition 25.

[0217] (Example 26: Production of photosensitive colored resin composition 26) A photosensitive colored resin composition 26 was obtained in the same manner as in Example 25, except that high refractive index inorganic particle dispersion b was used instead of high refractive index inorganic particle dispersion a.

[0218] (Example 27: Production of photosensitive colored resin composition 27) A photosensitive colored resin composition 27 was obtained in the same manner as in Example 25, except that high refractive index inorganic particle dispersion c was used instead of high refractive index inorganic particle dispersion a.

[0219] (Example 28: Production of photosensitive colored resin composition 28) 0.15 parts by mass of Dye-1 as the first colorant, 0.69 parts by mass of Dye-2-3 as the second colorant, 1.14 parts by mass of Dye-4 as the fourth colorant, 18.75 parts by mass of alkali-soluble resin 1, 4.87 parts by mass of photopolymerizable compound (i), 0.60 parts by mass of photoinitiator (A-1), 0.04 parts by mass of fluorine-based surfactant (trade name Megafac R-08MH, manufactured by DIC Corporation), and 73.75 parts by mass of PGMEA were added to obtain photosensitive colored resin composition 28.

[0220] (Example 29: Production of photosensitive colored resin composition 29) 0.10 parts by mass of Dye-1 as the first colorant, 0.34 parts by mass of Dye-2-1 as the second colorant, 0.19 parts by mass of FDR-002 (manufactured by Yamada Chemical Industries, Ltd., hereinafter referred to as "Dye-3-1", maximum absorption wavelength 680 nm) as the third colorant, 1.12 parts by mass of Dye-4 as the fourth colorant, 18.75 parts by mass of alkali-soluble resin 1, 5.08 parts by mass of photopolymerizable compound (i), 0.60 parts by mass of photoinitiator (A-1), 0.04 parts by mass of fluorine-based surfactant (product name Megafac R-08MH, manufactured by DIC Corporation), and 73.75 parts by mass of PGMEA were added to obtain photosensitive colored resin composition 29.

[0221] (Example 30: Production of photosensitive colored resin composition 30) 0.10 parts by mass of Dye-1 as the first colorant, 0.34 parts by mass of Dye-2-1 as the second colorant, 0.33 parts by mass of FDR-003 (manufactured by Yamada Chemical Industries, Ltd., hereinafter referred to as "Dye-3-2", maximum absorption wavelength 699 nm) as the third colorant, 1.12 parts by mass of Dye-4 as the fourth colorant, 18.75 parts by mass of alkali-soluble resin 1, 4.95 parts by mass of photopolymerizable compound (i), 0.60 parts by mass of photoinitiator (A-1), 0.04 parts by mass of fluorine-based surfactant (product name Megafac R-08MH, manufactured by DIC Corporation), and 73.75 parts by mass of PGMEA were added to obtain photosensitive colored resin composition 30.

[0222] (Example 31: Production of Photosensitive Colored Resin Composition 31) 0.10 parts by mass of Dye-1 as the first colorant, 0.34 parts by mass of Dye-2-1 as the second colorant, 0.25 parts by mass of FDR-004 (manufactured by Yamada Chemical Industries, Ltd., hereinafter referred to as "Dye-3-3", with a maximum absorption wavelength of 716 nm) as the third colorant, 1.12 parts by mass of Dye-4 as the fourth colorant, 18.75 parts by mass of alkali-soluble resin 1, 5.02 parts by mass of photopolymerizable compound (i), 0.60 parts by mass of photoinitiator (A-1), 0.04 parts by mass of fluorine-based surfactant (product name Megafac R-08MH, manufactured by DIC Corporation), and 73.75 parts by mass of PGMEA were added to obtain the photosensitive colored resin composition 31.

[0223] (Example 32: Production of Photosensitive Colored Resin Composition 32) 0.10 parts by mass of Dye-1 as the first colorant, 0.34 parts by mass of Dye-2-1 as the second colorant, 0.25 parts by mass of FDR-005 (manufactured by Yamada Chemical Industries, Ltd., hereinafter referred to as "Dye-3-4", maximum absorption wavelength 725 nm) as the third colorant, 1.12 parts by mass of Dye-4 as the fourth colorant, 18.75 parts by mass of alkali-soluble resin 1, 5.02 parts by mass of photopolymerizable compound (i), 0.60 parts by mass of photoinitiator (A-1), 0.04 parts by mass of fluorine-based surfactant (product name Megafac R-08MH, manufactured by DIC Corporation), and 73.75 parts by mass of PGMEA were added to obtain Photosensitive Colored Resin Composition 32.

[0224] (Example 33: Production of photosensitive colored resin composition 33) 0.18 parts by mass of Dye-1 as the first colorant, 0.34 parts by mass of Dye-2-1 as the second colorant, 1.95 parts by mass of colorant dispersion G1 as the green pigment of the third colorant, 1.01 parts by mass of Dye-4 as the fourth colorant, 0.91 parts by mass of colorant dispersion Y1 as another colorant (fifth colorant), 18.75 parts by mass of alkali-soluble resin 1, 4.73 parts by mass of photopolymerizable compound (i), 0.60 parts by mass of photoinitiator (A-1), 0.04 parts by mass of fluorine-based surfactant (trade name Megafac R-08MH, manufactured by DIC Corporation), and 71.49 parts by mass of PGMEA were added to obtain photosensitive colored resin composition 33.

[0225] (Example 34: Production of photosensitive colored resin composition 34) 0.13 parts by mass of Dye-1 as the first colorant, 0.66 parts by mass of Dye-2-1 as the second colorant, 1.51 parts by mass of colorant dispersion G1 as the green pigment of the third colorant, 0.86 parts by mass of Dye-4 as the fourth colorant, 18.75 parts by mass of alkali-soluble resin 1, 4.89 parts by mass of photopolymerizable compound (i), 0.60 parts by mass of photoinitiator (A-1), 0.04 parts by mass of fluorine-based surfactant (trade name Megafac R-08MH, manufactured by DIC Corporation), and 72.56 parts by mass of PGMEA were added to obtain photosensitive colored resin composition 34.

[0226] (Example 35: Production of photosensitive colored resin composition 35) 0.10 parts by mass of Dye-1 as the first colorant, 0.32 parts by mass of Dye-2-1 as the second colorant, 1.00 part by mass of colorant dispersion G1 as the green pigment of the third colorant, 1.07 parts by mass of Dye-4 as the fourth colorant, 1.69 parts by mass of colorant dispersion B1 as another colorant (fifth colorant), 18.75 parts by mass of alkali-soluble resin 1, 4.80 parts by mass of photopolymerizable compound (i), 0.60 parts by mass of photoinitiator (A-1), 0.04 parts by mass of fluorine-based surfactant (trade name Megafac R-08MH, manufactured by DIC Corporation), and 71.63 parts by mass of PGMEA were added to obtain photosensitive colored resin composition 35.

[0227] (Example 36: Production of photosensitive colored resin composition 36) 0.10 parts by mass of Dye-1 as the first colorant, 0.34 parts by mass of Dye-2-1 as the second colorant, 1.99 parts by mass of colorant dispersion G1 as the green pigment of the third colorant, 1.12 parts by mass of Dye-4 as the fourth colorant, 30.90 parts by mass of alkali-soluble resin 1, 0.60 parts by mass of photoinitiator (A-1), 0.04 parts by mass of fluorine-based surfactant (product name Megafac R-08MH, manufactured by DIC Corporation), and 64.88 parts by mass of PGMEA were added to obtain photosensitive colored resin composition 36.

[0228] (Examples 37-52: Production of photosensitive colored resin compositions 37-52) Photosensitive colored resin compositions 37-52 were obtained in the same manner as in Example 36, except that, as shown in Table 2, one of the alkali-soluble resins 2-17 obtained in Synthesis Examples 7-22 was used instead of alkali-soluble resin 1.

[0229] (Example 53: Production of photosensitive colored resin composition 53) A photosensitive colored resin composition 53 was obtained in the same manner as in Example 1, except that the alkali-soluble resin 17 obtained in Synthesis Example 22 was used instead of the alkali-soluble resin 1 in Example 1.

[0230] (Comparative Example 1: Production of Photosensitive Colored Resin Composition C1) Photosensitive colored resin composition C1 was obtained in the same manner as in Example 1, except that a photoinitiator (B-1) (trade name OXE-01, manufactured by BASF) was used instead of the photoinitiator (A-1) in Example 1.

[0231]

[0232] (Comparative Example 2: Production of Photosensitive Colored Resin Composition C2) Photosensitive colored resin composition C2 was obtained in the same manner as in Example 1, except that the photoinitiator (C-1) obtained in Comparative Synthesis Example 1 was used instead of the photoinitiator (A-1) in Example 1.

[0233]

[0234] (Comparative Example 3: Production of Photosensitive Colored Resin Composition C3) Photosensitive colored resin composition C3 was obtained in the same manner as in Example 1, except that a photoinitiator (D-1) (trade name OXE-02, manufactured by BASF) was used instead of the photoinitiator (A-1) in Example 1.

[0235]

[0236] (Comparative Example 4: Production of Photosensitive Colored Resin Composition C4) Photosensitive colored resin composition C4 was obtained in the same manner as in Example 1, except that a photoinitiator (E-1) (trade name Omnirad369, manufactured by IGM Resins B.V.) was used instead of the photoinitiator (A-1) in Example 1.

[0237]

[0238] (Comparative Example 5: Preparation of Photosensitive Colored Resin Composition C5) 0.12 parts by mass of Dye-1, 1.50 parts by mass of colorant dispersion G1, 18.75 parts by mass of alkali-soluble resin 1, 6.42 parts by mass of photopolymerizable compound (i), 0.60 parts by mass of photoinitiator (A-1), 0.04 parts by mass of fluorine-based surfactant (trade name Megafac R-08MH, manufactured by DIC Corporation), and 72.57 parts by mass of PGMEA were added to obtain Photosensitive Colored Resin Composition C5.

[0239] (Comparative Example 6: Preparation of Photosensitive Colored Resin Composition C6) 0.34 parts by mass of Dye-2-1, 1.80 parts by mass of colorant dispersion G1, 18.75 parts by mass of alkali-soluble resin 1 obtained in Synthesis Example 6, 6.13 parts by mass of photopolymerizable compound (i), 0.60 parts by mass of photoinitiator (A-1), 0.04 parts by mass of fluorine-based surfactant (trade name Megafac R-08MH, manufactured by DIC Corporation), and 72.33 parts by mass of PGMEA were added to obtain Photosensitive Colored Resin Composition C6.

[0240] (Comparative Example 7: Preparation of Photosensitive Colored Resin Composition C7) 0.10 parts by mass of Dye-1, 0.34 parts by mass of Dye-2-1, 1.99 parts by mass of colorant dispersion G1, 1.12 parts by mass of Dye-4, 8.60 parts by mass of urethane acrylate (UA) (trade name UA-306H, manufactured by Kyoeisha Chemical Co., Ltd., pentaerythritol triacrylate hexamethylene diisocyanate urethane prepolymer) as a photopolymerizable compound, 2.46 parts by mass of photopolymerizable compound (ii), 1.23 parts by mass of photopolymerizable compound (iii), and photoinitiator (F-1) (OmniradTPO, IGM Resins 0.68 parts by mass of B.V. (manufactured by B.V.), 0.04 parts by mass of a fluorine-based surfactant (product name Megafac R-08MH, manufactured by DIC Corporation), and 83.42 parts by mass of PGMEA were added to obtain photosensitive colored resin composition C7.

[0241]

[0242]

[0243] In Tables 1 and 2, the concentration of the colorant is shown as the content (mass%) based on the total solids.

[0244] [Evaluation Method] The photosensitive coloring resin compositions obtained in each of the examples and comparative examples were each applied onto a glass substrate (manufactured by NH Techno Glass Co., Ltd., "NA35") on which a SiNx film was formed, using a spin coater so that the cured film had a thickness of 3.0 μm. After that, it was dried at 80°C for 3 minutes using a hot plate to form a coating film on the substrate. The coating film was exposed to ultraviolet light of 100 mJ / cm ２ using an ultra-high pressure mercury lamp, thereby forming an exposed coating film on each of the SiNx films. Next, spin development was carried out using a 0.05 wt% aqueous potassium hydroxide solution as the developer. After immersing in the developer for 60 seconds, it was washed with pure water for development treatment to obtain a coating film. Then, a cured film with a thickness of 3.0 μm was formed by post-baking in a clean oven at 90°C for 30 minutes. Using the cured film thus obtained, transmittance measurement, solvent resistance evaluation, weather resistance evaluation, and evaluation of light extraction efficiency were performed.

[0245] <Transmittance> Using a microspectrophotometer OSP-SP2 (manufactured by Olympus), the transmittance spectrum from 380 nm to 780 nm was measured, and the transmittance at 380 nm, 460 nm, 530 nm, and 620 nm, the transmittance at the transmission minimum wavelength from 480 nm to 520 nm, and the transmittance at the transmission minimum wavelength from 560 nm to 600 nm were obtained.

[0246] <Solvent Resistance Color Change Evaluation> The chromaticity (L ０ , a ０ , b ０ ) of the cured film prepared on the substrate was measured using a microspectrophotometer OSP-SP2 (manufactured by Olympus). After that, the cured film was immersed in propylene glycol monomethyl ether (PGME) for 10 minutes, then air-dried, and the chromaticity (L １ , a １ , b １ ) was measured again. The chromaticity change of the cured film before and after the solvent resistance test was evaluated by the following formula. The results are shown in a table. ΔEab １ = { (L １ - L ０ ) ２ + (a １ - a ０ ) ２ + (b １ - b ０ )２} １／２ ΔEab １ The smaller the value of ΔEab, the better the solvent resistance is evaluated. (Evaluation criteria for solvent resistance color change) A: ΔEab １ The value is less than 3 B: ΔEab １ The value is 3 or more and less than 5 C: ΔEab １ The value is 5 or more

[0247] <Weather resistance evaluation> For a sample in which a glass substrate was attached via a transparent adhesive layer on a cured film formed on a substrate, and a UV cut film was further attached thereon, using a weather resistance tester (Ci4000 manufactured by ATLAS), the light intensity of 340 nm was 0.63 W / m ２ , the temperature in the tank was 60 °C, and the humidity was 50% RH, and a weather resistance test was conducted for 48 hours. For each cured film for weather resistance evaluation before and after the weather resistance test, the chromaticity (L ０ , a ０ , b ０ ) before the weather resistance test and the chromaticity (L ２ , a ２ , b ２ ) after the weather resistance test were measured using a microspectrophotometer OSP-SP200 (manufactured by Olympus). The chromaticity change of the cured film before and after the weather resistance test was evaluated by the following formula. The results are shown in a table. ΔEab ２ = {(L ２ - L ０ ) ２ + (a ２ - a ０ ) ２ + (b ２ - b ０ ) ２} １／２ ΔEab ２ The smaller the value of ΔEab, the better the weather resistance is evaluated. (Evaluation criteria for weather resistance evaluation) A: ΔEab ２ The value is less than 3 B: ΔEab ２ The value is 3 or more and less than 5 C: ΔEab ２ The value is 5 or more

[0248] <Evaluation of Light Extraction Efficiency (Refractive Index)> The refractive index of the colored cured film was measured using a rotational compensator type high-speed spectroscopic ellipsometer M-2000UI (manufactured by J.A. Woolam Japan Co., Ltd.). The measurement wavelength range was 380 to 780 nm, and the n value was measured every 1 nm, with the average value being taken as the refractive index. If the refractive index of the colored cured film is 1.65 or higher, it can be evaluated that the light extraction efficiency has improved sufficiently.

[0249]

[0250]

[0251] [Summary of Results] The photosensitive colored resin compositions of Examples 1 to 53 were shown to be photosensitive colored resin compositions in which the colorant comprises a first colorant with a maximum absorption wavelength of 480 nm to 520 nm and a second colorant with a maximum absorption wavelength of 560 nm to 600 nm, and the photoinitiator comprises at least one compound represented by general formula (A), and the transmittance of the cured film with a thickness of 3.0 μm at 460 nm, 530 nm, and 620 nm is all 45% to 85%, the transmittance at the minimum transmitted wavelength of 480 nm to 520 nm is 50% or less, and the transmittance at the minimum transmitted wavelength of 560 nm to 600 nm is 25% or less, thereby suppressing external light reflection to improve the display quality of organic light-emitting elements, and the colored layer with excellent weather resistance and suppressed color change due to solvents can be formed by patterning.

[0252] In contrast, the photosensitive colored resin composition of Comparative Example 1, which contains a photoinitiator (B-1) having a diphenyl sulfide skeleton but containing one oxime ester group per molecule, was shown to produce a colored cured film that undergoes color change due to solvents. Furthermore, the photosensitive colored resin composition of Comparative Example 2, which contains a photoinitiator (C-1) having two oxime ester groups per molecule but having a carbazole skeleton, was shown to produce a colored cured film with poor weather resistance and susceptibility to color change due to solvents. Additionally, the photosensitive colored resin composition of Comparative Example 3, which contains a photoinitiator (D-1) having one oxime ester group per molecule and a carbazole skeleton, and the photosensitive colored resin composition of Comparative Example 4, which contains an α-aminoketone-based photoinitiator (E-1), were both shown to produce colored cured films with poor weather resistance and susceptibility to color change due to solvents. Furthermore, the photosensitive colored resin composition of Comparative Example 5, which did not contain a second colorant with a maximum absorption wavelength of 560 nm to 600 nm, showed high transmittance at the minimum transmission wavelength of 560 nm to 600 nm, resulting in insufficient suppression of ambient light reflection. Similarly, the photosensitive colored resin composition of Comparative Example 6, which did not contain a first colorant with a maximum absorption wavelength of 480 nm to 520 nm, showed high transmittance at the minimum transmission wavelength of 480 nm to 520 nm, resulting in insufficient suppression of ambient light reflection. Moreover, the colored resin composition of Comparative Example 7, which did not contain an alkali-soluble resin as described in Patent Document 2, could not be developed and patterned. Furthermore, the cured film of the colored resin composition of Comparative Example 7, which used a photopolymerizable compound and an acyl phosphine oxide-based photoinitiator (F-1) similar to those in Patent Document 2, had poor weather resistance and was a colored cured film that also underwent color changes due to solvents.

[0253] In the examples, it was shown that when the colorant further includes a fourth colorant with a maximum absorption wavelength of 370 nm to 450 nm, external light at 380 nm is absorbed, further suppressing external light reflection. In the examples, it was also shown that when the mixture further includes at least one inorganic particle with an average particle size of 100 nm or less, selected from the group consisting of zirconium oxide, barium titanate, and titanium oxide, and a dispersant, and the dispersant includes at least one dispersant selected from the group consisting of phosphate ester dispersants, phosphonic acid dispersants, and phosphonic acid ester dispersants, the refractive index of the colored cured film increases to 1.65 or more, making it possible to form a colored cured film that improves light extraction efficiency.

[0254] 1 Substrate 2 Thin-film transistor (TFT) 3 Encapsulation film 4 Electrode 5 Partition 6R, 6G, 6B Organic light-emitting element 7 Electrode 8 Encapsulation film 9 Colored cured film 10 Light-shielding part 11 Overcoat layer 12 Transparent adhesive layer 13 Transparent cover material 20 Anti-reflective film 30 Element substrate equipped with organic light-emitting element 100 Display device

Claims

1. A photosensitive colored resin composition used for a cured film formed on an organic light-emitting device, the composition containing a colorant, an alkali-soluble resin, a photoinitiator, and a solvent, and containing at least one selected from the group consisting of an alkali-soluble resin having an ethylenically unsaturated bond-containing group in a side chain and a photopolymerizable compound, the colorant including a first colorant having a maximum absorption wavelength of 480 nm to 520 nm and a second colorant having a maximum absorption wavelength of 560 nm to 600 nm, the photoinitiator including at least one compound represented by the following general formula (A), and the transmittances of the cured film having a thickness of 3.0 μm formed using the photosensitive colored resin composition at 460 nm, 530 nm, and 620 nm all being 45% to 85%, the transmittance at the minimum transmittance wavelength in the range of 480 nm to 520 nm being 50% or less, and the transmittance at the minimum transmittance wavelength in the range of 560 nm to 600 nm being 25% or less. (In the formula, R １ and R ２ each independently represent an alkyl group having a linear, branched or cyclic structure with 1 to 8 carbon atoms, R ３ and R ４ each independently represent an alkyl group having a linear, branched or cyclic structure with 1 to 8 carbon atoms which may be substituted with an alkoxy group, an aryl group with 6 to 14 carbon atoms, an arylalkyl group with 7 to 14 carbon atoms, or an alkoxy group with 1 to 8 carbon atoms.) 2. A photosensitive colored resin composition for use in a cured film formed on an organic light-emitting element, comprising a colorant, an alkali-soluble resin, a photopolymerizable compound, a photoinitiator, and a solvent, wherein the colorant comprises a first colorant having a maximum absorption wavelength of 480 nm to 520 nm and a second colorant having a maximum absorption wavelength of 560 nm to 600 nm, the photoinitiator comprises at least one compound represented by the following general formula (A), and the photosensitive colored resin composition wherein the transmittance at 460 nm, 530 nm, and 620 nm of a cured film with a thickness of 3.0 μm formed using the photosensitive colored resin composition is 55% to 85% each, the transmittance at the minimum transmission wavelength of 480 nm to 520 nm is 50% or less, and the transmittance at the minimum transmission wavelength of 560 nm to 600 nm is 25% or less. (In the formula, R １ and R ２ Each of these independently represents an alkyl group containing a linear, branched, or cyclic structure with 1 to 8 carbon atoms, and R ３ and R ４ Each of these independently represents an alkyl group having a total of 1 to 8 carbon atoms, including a linear, branched, or cyclic structure, which may be substituted with an alkoxy group; an aryl group having 6 to 14 carbon atoms; an arylalkyl group having 7 to 14 carbon atoms; or an alkoxy group having 1 to 8 carbon atoms.

3. The photosensitive colored resin composition according to claim 1 or 2, wherein the colorant further comprises, as a third colorant, at least one green pigment selected from the group consisting of C.I. Pigment Greens 7, 36, 58, and 59, or a colorant having a maximum absorption wavelength of 650 nm to 750 nm, or both.

4. The photosensitive colored resin composition according to claim 1 or 2, wherein the colorant further comprises, as a third colorant, at least one green pigment selected from the group consisting of C.I. Pigment Greens 7, 36, 58, and 59.

5. The photosensitive colored resin composition according to claim 1 or 2, wherein the colorant further comprises a fourth colorant having a maximum absorption wavelength of 370 nm to 450 nm.

6. The photosensitive colored resin composition according to claim 1 or 2, wherein the alkali-soluble resin has an ethylenically unsaturated bond equivalent of 500 or less and an acid value of 30 mg KOH / g to 90 mg KOH / g.

7. The photosensitive colored resin composition according to claim 1 or 2, further comprising at least one inorganic particle with an average particle size of 100 nm or less, selected from the group consisting of zirconium oxide, barium titanate, and titanium oxide, and a dispersant, wherein the dispersant comprises at least one dispersant selected from the group consisting of phosphate ester dispersants, phosphonic acid dispersants, and phosphonic acid ester dispersants.

8. A display device having a cured film of the photosensitive colored resin composition according to claim 1 or 2 on an organic light-emitting element.

9. A method for manufacturing a laminate of an organic light-emitting element and an anti-reflective coating, comprising the steps of forming a coating film by applying the photosensitive colored resin composition described in claim 1 or 2 to an organic light-emitting element; irradiating the coating film with light; a post-bake step of heating the film after light irradiation; and developing the film after light irradiation, thereby forming a cured film of the photosensitive colored resin composition described in claim 1 or 2 on the organic light-emitting element.

10. The method for manufacturing a laminate of an organic light-emitting element and an anti-reflective film according to claim 9, wherein the heating temperature in the post-baking step is 130°C or lower.

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