Display apparatus and electronic device including same

The display device achieves improved elasticity and image quality by integrating a pixel circuit layer, connecting wires, and elastomer layers, addressing the lack of stretchability in existing display panels.

WO2026071782A1PCT designated stage Publication Date: 2026-04-02SAMSUNG DISPLAY CO LTD
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-09-26
Publication Date
2026-04-02

AI Technical Summary

Technical Problem

Existing display panels lack sufficient stretchability, which affects the quality of images when stretched, and there is a need for improved elasticity in flexible and stretchable display devices.

Method used

The display device incorporates a pixel circuit layer, connecting wires, a terminal portion, and a printed circuit board connected by elastomer layers, allowing for improved stretchability and maintaining image quality during deformation.

Benefits of technology

The solution provides a display device with enhanced elasticity, ensuring high-quality image display even when stretched or deformed, utilizing stretchable connecting wires and elastomer layers to absorb stress and maintain electrical connectivity.

✦ Generated by Eureka AI based on patent content.

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Abstract

An embodiment of the present invention provides a display apparatus comprising: a light-emitting diode; a pixel circuit layer including a pixel circuit electrically connected to the light-emitting diode, and having a first pixel surface facing a direction away from the light-emitting diode; a first connection line contacting the first pixel surface and electrically connected to the pixel circuit; a terminal portion having a first terminal surface facing a direction away from the light-emitting diode; a second connection line contacting each of the first pixel surface and the first terminal surface and electrically connecting the pixel circuit to the terminal portion; a printed circuit board including a driving circuit; and a connection portion electrically connecting the printed circuit board to the first terminal surface.
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Description

Display device and electronic device including the same

[0001] Embodiments of the present invention relate to display devices and electronic devices.

[0002] In general, as display panels that visually display electrical signals advance, various display panels with excellent characteristics such as thinness, lightness, and low power consumption, as well as electronic devices containing them, are being introduced. For example, research and development is actively underway on display panels of various structures, such as flexible display panels that can be folded or rolled into a roll shape, and stretchable display panels, as well as electronic devices containing them.

[0003] Embodiments of the present invention aim to provide a display device and an electronic device including the same, which have improved stretchability and realize an image of excellent quality even when stretched. However, these objectives are exemplary and do not limit the scope of the present invention.

[0004] One embodiment of the present invention provides a display device comprising: a light-emitting diode; a pixel circuit layer having a first pixel surface facing away from the light-emitting diode, the pixel circuit being electrically connected to the light-emitting diode; a first connecting wire being in contact with the first pixel surface and electrically connected to the pixel circuit; a terminal portion having a first terminal surface facing away from the light-emitting diode; a second connecting wire being in contact with each of the first pixel surface and the first terminal surface and electrically connecting the pixel circuit and the terminal portion; a printed circuit board including a driving circuit; and a connecting portion electrically connecting the printed circuit board and the first terminal surface.

[0005] In one embodiment, the first pixel plane and the first terminal plane may be arranged in the same plane.

[0006] In one embodiment, a first elastomer layer disposed below the first pixel plane and the first terminal plane so as to overlap with the first connecting wire and the second connecting wire may be further included.

[0007] In one embodiment, the printed circuit board may be in contact with the first elastomer layer.

[0008] In one embodiment, the first elastomer layer may surround the connection portion on a plane.

[0009] In one embodiment, a second elastomer layer disposed on the pixel circuit layer to cover the light-emitting diode may be further included.

[0010] In one embodiment, the pixel circuit comprises a semiconductor layer; and a gate electrode overlapping with the semiconductor layer; and the terminal portion may include a first terminal layer having a first terminal surface and comprising the same material as the gate electrode.

[0011] In one embodiment, a signal line electrically connected to the pixel circuit and in contact with the first connection wire may be further included.

[0012] In one embodiment, the signal line may include a data line.

[0013] In one embodiment, the first connecting wire and the second connecting wire may each be stretchable.

[0014] Another embodiment of the present invention provides an electronic device comprising a display panel having a terminal area, a pixel area, and a connection area, wherein the display panel comprises: a pixel circuit layer disposed in the pixel area and including a pixel circuit; a light-emitting diode disposed on the pixel circuit layer and electrically connected to the pixel circuit; a first connection wiring disposed in the connection area, in contact with the lower surface of the pixel circuit layer and electrically connected to the pixel circuit; a terminal portion disposed in the terminal area; a second connection wiring in contact with the lower surface of the pixel circuit layer and the lower surface of the terminal portion, respectively, and electrically connecting the pixel circuit and the terminal portion; a printed circuit board including a driving circuit; and a connection portion electrically connecting the terminal portion and the printed circuit board.

[0015] In one embodiment, the terminal area, the pixel area, and the connection area may be arranged sequentially along one direction.

[0016] In one embodiment, the connection portion may contact the lower surface of the terminal portion and the lower surface of the pixel circuit layer, respectively.

[0017] In one embodiment, the lower surface of the pixel circuit layer and the lower surface of the terminal portion may be arranged on the same plane.

[0018] In one embodiment, the display panel may further include a first elastomer layer disposed on the lower surface of the terminal portion and the lower surface of the pixel circuit layer so as to overlap with the first connecting wire and the second connecting wire.

[0019] In one embodiment, the printed circuit board may be in contact with the first elastomer layer.

[0020] In one embodiment, the display panel may further include a second elastomer layer disposed on the pixel circuit layer to cover the light-emitting diode.

[0021] In one embodiment, the display panel may further include a signal line that is electrically connected to the pixel circuit and contacts the first connection wiring.

[0022] In one embodiment, the signal line may include a data line.

[0023] In one embodiment, the first connecting wire and the second connecting wire may each be stretchable.

[0024] According to some embodiments of the present invention, a display device that implements an image of excellent quality with improved elasticity and an electronic device including the same may be provided. The aforementioned effects are exemplary and the effects of the present invention are not limited to those described above.

[0025] FIG. 1a is a schematic perspective view of a display device according to one embodiment of the present invention.

[0026] FIG. 1b is a block diagram schematically illustrating a display device according to one embodiment of the present invention.

[0027] FIG. 2 is a schematic perspective view of a display panel according to one embodiment of the present invention.

[0028] FIGS. 3A and FIGS. 3B are perspective views showing the display panel of FIG. 2 extended in a first direction.

[0029] FIG. 3c is a perspective view showing the display panel of FIG. 1 extended in a second direction.

[0030] FIG. 3d is a perspective view showing the display panel of FIG. 1 extended in the first direction and the second direction.

[0031] FIG. 3e is a perspective view showing the display panel of FIG. 1 extended in a third direction.

[0032] FIG. 4 is a schematic plan view of a display panel according to one embodiment of the present invention.

[0033] FIG. 5 is a plan view schematically showing the arrangement of pixels of a display panel according to one embodiment of the present invention.

[0034] FIG. 6 is a cross-sectional view schematically showing a part of a display panel according to one embodiment of the present invention.

[0035] FIGS. 7a to 7c are equivalent circuit diagrams of pixel circuits of a display panel according to one embodiment of the present invention.

[0036] FIGS. 8a and FIGS. 8d are cross-sectional views schematically showing a light-emitting diode of a display panel according to one embodiment of the present invention.

[0037] FIGS. 9a to 9c are cross-sectional views schematically showing a portion of a display panel according to one embodiment of the present invention.

[0038] FIGS. 10a and FIGS. 10b are cross-sectional views schematically illustrating a portion of a terminal portion and a connection portion according to an embodiment of the present invention.

[0039] FIGS. 11a to 11K are cross-sectional views sequentially illustrating the steps of a method for manufacturing a display panel according to an embodiment of the present invention.

[0040] FIGS. 12a to 12g are schematic perspective views illustrating embodiments of an electronic device including a display panel according to one embodiment of the present invention.

[0041] The present invention is capable of various modifications and may have various embodiments; specific embodiments are illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention, and the methods for achieving them, will become clear by referring to the embodiments described below in detail together with the drawings. However, the present invention is not limited to the embodiments disclosed below but can be implemented in various forms.

[0042] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. When describing with reference to the drawings, identical or corresponding components are given the same reference numerals, and redundant descriptions thereof will be omitted.

[0043] In the following embodiments, terms such as first, second, etc. are used not in a limiting sense, but for the purpose of distinguishing one component from another component.

[0044] In the following examples, singular expressions include plural expressions unless the context clearly indicates otherwise.

[0045] In the following embodiments, terms such as "include" or "have" mean that the features or components described in the specification are present, and do not preclude the possibility that one or more other features or components may be added.

[0046] In the following embodiments, when a part such as a film, region, or component is described as being on or above another part, it includes not only cases where it is directly on top of another part, but also cases where another film, region, or component is interposed in between.

[0047] In the drawings, the size of components may be exaggerated or reduced for convenience of explanation. For example, the size and thickness of each component shown in the drawings are depicted arbitrarily for convenience of explanation, so the present invention is not necessarily limited to what is illustrated.

[0048] In the following embodiments, the x-axis, y-axis, and z-axis are not limited to three axes in an orthogonal coordinate system and can be interpreted in a broader sense that includes them. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but they may also refer to different directions that are not orthogonal to each other.

[0049] Where an embodiment can be implemented differently, a specific process sequence may be performed differently from the order described. For example, two processes described consecutively may be performed substantially simultaneously or proceed in the reverse order of the description.

[0050] In this specification, "on a plane" means a plane viewed from a direction perpendicular to the substrate (100, see FIG. 4). That is, "A and B spaced apart from each other on a plane" means "A and B spaced apart from each other when viewed from a direction perpendicular to the substrate (100, see FIG. 4)."

[0051] In this specification, "on a cross-section" means a plane cut in a direction perpendicular to the substrate (100, see FIG. 4). That is, "A and B spaced apart from each other on a plane" means "A and B spaced apart from each other on a plane cut in a direction perpendicular to the substrate (100, see FIG. 4)."

[0052] FIG. 1a is a schematic perspective view of a display device (1) according to one embodiment of the present invention, and FIG. 1b is a schematic block diagram of a display device (1) according to one embodiment of the present invention.

[0053] Referring to FIG. 1a and FIG. 1b, a display device (1) having a display panel (10) according to one embodiment of the present invention is a device for displaying video or still images, and can be used as a display screen for various products such as televisions, laptops, monitors, billboards, and the Internet of Things (IOT), as well as portable electronic devices such as mobile phones, smartphones, tablet personal computers, mobile communication terminals, electronic notebooks, e-books, PMPs (portable multimedia players), navigation systems, and UMPCs (Ultra Mobile PCs). A display device (1) according to one embodiment can be used in wearable devices such as smart watches, watch phones, glasses-type displays, and head-mounted displays (HMDs). A display device (1) according to one embodiment can be used as a CID (Center Information Display) placed on the instrument panel of a vehicle, the center fascia or dashboard of a vehicle, a room mirror display replacing the side mirror of a vehicle, an entertainment device for the rear seat of a vehicle, or a display placed on the back of the front seat.

[0054] FIG. 1a illustrates a display device (1) according to one embodiment being used as a smartphone. The display device (1) may include a display panel (10) and a lower cover (90) disposed below the display panel (10). The display device (1) may include a cover window covering the upper surface of the display panel (10).

[0055] The lower cover (90) forms the exterior of the display device (1) and may have an opening that exposes a portion of the display panel (10) on the front surface. The lower cover (90) may be assembled with the display panel (10) in a shape where the side corresponding to the display panel (10) is open. The lower cover (90) forms the exterior of the lower surface of the display device (1), and a printed circuit board, components, a main circuit board, a battery, a driver, etc. may be placed between the display panel (10) and the lower cover (90). The lower cover (90) may include plastic, metal, or both plastic and metal.

[0056] The display device (1) may include a main processor (510), a wireless communication unit (520), an input unit (530), a sensor unit (540), an output unit (550), an interface unit (560), a memory (570), and / or a power supply unit (580).

[0057] The main processor (510) can control all functions of the display device (1). For example, the main processor (510) can output digital video data to a data driver via a printed circuit board so that the display panel (10) displays an image. The main processor (510) can receive detection data from a touch sensor driver. The main processor (510) can determine whether a user touches based on the detection data and execute an action corresponding to the user's direct touch or proximity touch. The main processor (510) may be an application processor, a central processing unit, or a system chip made of an integrated circuit.

[0058] The camera device (531) processes image frames, such as still images or video, obtained by an image sensor in camera mode and outputs them to the main processor (510). The camera device (531) may include at least one of a camera sensor (e.g., CCD, CMOS, etc.), a photo sensor (or image sensor), and a laser sensor. The camera device (531) may be connected to an image sensor and process an image input to the image sensor.

[0059] The wireless communication unit (520) may include at least one of a broadcast reception module (521), a mobile communication module (522), a wireless internet module (523), a short-range communication module (524), and a location information module (525).

[0060] The broadcast receiving module (521) receives broadcast signals and / or broadcast-related information from an external broadcast management server through a broadcast channel. The broadcast channel may include a satellite channel and a terrestrial channel.

[0061] A mobile communication module (522) transmits and receives wireless signals with at least one of a base station, an external terminal, and a server on a mobile communication network built according to technical standards or communication methods for mobile communication (e.g., GSM (Global System for Mobile communication), CDMA (Code Division Multi Access), CDMA2000 (Code Division Multi Access 2000), EV-DO (Enhanced Voice-Data Optimized or Enhanced Voice-Data Only), WCDMA (Wideband CDMA), HSDPA (High Speed ​​Downlink Packet Access), HSUPA (High Speed ​​Uplink Packet Access), LTE (Long Term Evolution), LTE-A (Long Term Evolution-Advanced), etc.). The wireless signals may include various forms of data such as voice call signals, video call call signals, or text / multimedia message transmission and reception.

[0062] The wireless internet module (523) refers to a module for wireless internet access. The wireless internet module (523) may be configured to transmit and receive wireless signals in a communication network according to wireless internet technologies. Examples of wireless internet technologies include WLAN (Wireless LAN), Wi-Fi (Wireless-Fidelity), Wi-Fi (Wireless Fidelity) Direct, DLNA (Digital Living Network Alliance), etc.

[0063] The short-range communication module (524) is for short-range communication and can support short-range communication by using at least one of Bluetooth, RFID (Radio Frequency Identification), Infrared Data Association (IrDA), UWB (Ultra Wideband), ZigBee, NFC (Near Field Communication), Wi-Fi (Wireless-Fidelity), Wi-Fi Direct, and Wireless USB (Wireless Universal Serial Bus) technologies. The short-range communication module (524) can support wireless communication between the display device (1) and a wireless communication system, between the display device (1) and another electronic device, or between the display device (1) and a network where another electronic device (or an external server) is located, through a short-range wireless communication network. The short-range wireless communication network may be a short-range wireless personal area network. Other electronic devices may be wearable devices capable of exchanging data with (or interoperable with) the display device (1).

[0064] The location information module (525) is a module for obtaining the location (or current location) of the display device (1) and may include a GPS (Global Positioning System) module or a WiFi (Wireless Fidelity) module.

[0065] The input unit (530) may include a video input unit such as a camera device (531) for inputting a video signal, an audio input unit such as a microphone (532) for inputting an audio signal, and an input device (533) for receiving information from a user.

[0066] The camera device (531) processes image frames, such as still images or video, obtained by an image sensor in video call mode or shooting mode. The processed image frames may be displayed on a display panel (10) or stored in memory (570).

[0067] The microphone (532) processes an external acoustic signal into electrical voice data. The processed voice data can be utilized in various ways depending on the function (or application) being performed on the display device (1).

[0068] The main processor (510) can control the operation of the display device (1) to correspond to information input through the input device (533). The input device (533) may include mechanical input means or touch input means, such as a button, dome switch, jog wheel, jog switch, etc., located on the rear or side of the display device (1). The touch input means may be formed by a touchscreen layer of the display panel (10).

[0069] The sensor unit (540) may include one or more sensors that sense at least one of information within the display device (1), surrounding environment information surrounding the display device (1), and user information, and generate a corresponding sensing signal. Based on these sensing signals, the main processor (510) may control the operation or function of the display device (1), or perform data processing, functions, or operations related to an application installed on the display device (1). The sensor unit (540) may include at least one of a proximity sensor, an illumination sensor, an acceleration sensor, a magnetic sensor, a gravity sensor (G-sensor), a gyroscope sensor, a motion sensor, an RGB sensor, an infrared sensor (IR sensor: infrared sensor), a fingerprint sensor, an ultrasonic sensor, an optical sensor, a battery gauge, an environmental sensor (e.g., a barometer, a hygrometer, a thermometer, a radiation detection sensor, a heat detection sensor, a gas detection sensor, etc.), and a chemical sensor (e.g., an electronic nose, a healthcare sensor, a biometric sensor, etc.).

[0070] The output unit (550) is for generating output related to sight, hearing, or touch, and may include at least one of a display panel (10), an acoustic output unit (551), a haptic module (552), and a light output unit (553).

[0071] The display panel (10) displays (outputs) information processed by the display device (1). For example, the display panel (10) can display information on the execution screen of an application running on the display device (1), or UI (User Interface) and GUI (Graphic User Interface) information based on the execution screen information. The display panel (10) may include a display layer that displays an image and a touchscreen layer that detects touch input from a user. As a result, the display panel (10) can function as one of the input devices (533) that provide an input interface between the display device (1) and the user, and at the same time, as one of the output units (550) that provide an output interface between the display device (1) and the user.

[0072] The sound output unit (551) can output sound data received from the wireless communication unit (520) or stored in the memory (570) in signal reception, call mode or recording mode, voice recognition mode, broadcast reception mode, etc. The sound output unit (551) may also output sound signals related to functions performed by the display device (1) (e.g., call signal reception sound, message reception sound, etc.). The sound output unit (551) may include a receiver and a speaker. At least one of the receiver and the speaker may be a sound generating device attached to the lower part of the display panel (10) to vibrate the display panel (10) and output sound. The sound generating device may be a piezoelectric element or a piezoelectric actuator that contracts and expands according to an electrical signal, or an exciter that generates magnetic force using a voice coil to vibrate the display panel (10).

[0073] The haptic module (552) generates various tactile effects that the user can feel. The haptic module (552) can provide vibration to the user as a tactile effect. The haptic module (552) can not only transmit tactile effects through direct contact, but can also be implemented so that the user can feel tactile effects through the sense of touch of fingers or arms.

[0074] The light output unit (553) outputs a signal to indicate the occurrence of an event using light from a light source. Examples of events occurring in the display device (1) may include receiving a message, receiving a call signal, a missed call, an alarm, a schedule notification, receiving an email, receiving information through an application, etc. The signal output by the light output unit (553) is implemented as the display device (1) emits single-color or multiple-color light toward the front or rear. The signal output may be terminated when the display device (1) detects the user's confirmation of the event.

[0075] The interface section (560) serves as a passage for various types of external devices connected to the display device (1). The interface section (560) may include at least one of a wired / wireless headset port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting a device equipped with an identification module, an audio I / O (Input / Output) port, a video I / O (Input / Output) port, and an earphone port. The display device (1) can perform appropriate control related to the connected external device in response to the connection of an external device to the interface section (560).

[0076] The memory (570) stores data that supports various functions of the display device (1). The memory (570) can store a number of applications running on the display device (1), data for the operation of the display device (1), and instructions. At least some of the applications can be downloaded from an external server via wireless communication. The memory (570) can store applications for the operation of the main processor (510) and can temporarily store input / output data, such as phonebooks, messages, still images, videos, etc. Additionally, the memory (570) can store haptic data for various patterns of vibration provided to the haptic module (552) and acoustic data regarding various sounds provided to the acoustic output unit (551). The memory (570) may include at least one type of storage medium among flash memory type, hard disk type, SSD type (Solid State Disk type), SSD type (Silicon Disk Drive type), multimedia card micro type, card type memory (e.g., SD or XD memory, etc.), RAM (random access memory; RAM), SRAM (static random access memory), ROM (read-only memory; ROM), EEPROM (electrically erasable programmable read-only memory), PROM (programmable read-only memory), magnetic memory, magnetic disk, and optical disk.

[0077] The power supply unit (580), under the control of the main processor (510), receives external power and internal power and supplies power to each component included in the display device (1). The power supply unit (580) may include a battery. Additionally, the power supply unit (580) is provided with a connection port, and the connection port may be configured as an example of an interface unit (560) to which an external charger that supplies power for charging the battery is electrically connected. Alternatively, the power supply unit (580) may be configured to charge the battery wirelessly without using the connection port.

[0078] FIG. 2 is a schematic perspective view of a display panel (10) according to an embodiment of the present invention. FIG. 3a and FIG. 3b are perspective views showing the display panel (10) of FIG. 2 extended in a first direction. FIG. 3c is a perspective view showing the display panel (10) of FIG. 1 extended in a second direction. FIG. 3d is a perspective view showing the display panel (10) of FIG. 1 extended in both the first and second directions. FIG. 3e is a perspective view showing the display panel (10) of FIG. 1 extended in a third direction.

[0079] Referring to FIG. 2, the display panel (10) may include a display area (DA) and a non-display area (NDA). The display area (DA) may include a plurality of pixels. The display panel (10) may provide a predetermined image using light emitted from a plurality of pixels. The non-display area (NDA) may be placed outside the display area (DA). The non-display area (NDA) may completely surround the display area (DA).

[0080] The display panel (10) can be extended or shortened in various directions. The display panel (10) can be extended in a first direction (e.g., x direction and / or -x direction) by an external force applied by an external object or a user. In one embodiment, as shown in FIGS. 3a and 3b, the display area (DA) and / or non-display area (NDA) of the display panel (10) can be extended in a first direction (e.g., x direction and / or -x direction). For example, as shown in FIG. 3a, it can be extended along the x direction and -x direction, or as shown in FIG. 3b, it can be extended along the x direction while one side of the display panel (10) remains fixed.

[0081] The display panel (10) can be extended in a second direction (e.g., the y direction and / or the -y direction) by an external force applied by an external object or a user. In one embodiment, as shown in FIG. 3c, the display area (DA) and / or non-display area (NDA) of the display panel (10) can be extended in the y direction and the -y direction. In another embodiment, one side of the display panel (10) can be extended in the y direction or the -y direction while remaining fixed.

[0082] The display panel (10) can be extended in multiple directions, such as a first direction (e.g., x direction and / or -x direction) and a second direction (e.g., y direction and / or -y direction) by an external force applied by an external object or a part of a person's body. As shown in FIG. 3d, the display area (DA) and / or non-display area (NDA) of the display panel (10) can be extended in the ±x direction and ±y direction.

[0083] The display panel (10) can be extended in a third direction (e.g., z direction or -z direction) by an external force applied by an external object or a part of a person's body. In one embodiment, FIG. 3e illustrates a part of the display panel (10), such as a part of the display area (DA), protruding in the z direction. In another embodiment, a part of the display panel (10), such as a part of the display area (DA), may protrude along the z direction (or be sunken along the -z direction).

[0084] FIGS. 3a to 3e illustrate a display device (1) extended in a first direction, a second direction, and / or a third direction, but the present invention is not limited thereto. In another embodiment, the display panel (10) may be deformed into various irregular shapes, such as having two or more axes, being bent or twisted.

[0085] FIG. 4 is a schematic plan view of a display panel (10) according to one embodiment of the present invention.

[0086] Referring to FIG. 4, the display panel (10) may include a display area (DA) and a non-display area (NDA) surrounding the display area (DA). Pixels (P) are arranged in the display area (DA) of the substrate (100). Each pixel (P) can display an image using light emitted from a light-emitting element, such as a light-emitting diode. Each light-emitting diode can emit light, for example, red, green, or blue.

[0087] Each light-emitting diode may be electrically connected to a pixel circuit, and each pixel circuit may include transistors and a storage capacitor. Each pixel circuit may be electrically connected to peripheral circuits and peripheral wiring located in a non-display area (NDA). Peripheral circuits located in the non-display area (NDA) may include a gate driving circuit (GDC) and a terminal section (PAD). Peripheral wiring may include a driving voltage supply line (W11), a common voltage supply line (W13), and a fan-out line (FW).

[0088] The gate driving circuit (GDC) may include drivers for providing an electrical signal to the gate electrode of each of the transistors electrically connected to the light-emitting elements. Specifically, the gate driving circuit (GDC) may apply a scan signal to each of the pixel circuits corresponding to the pixels (P) through the gate line (GL).

[0089] The gate driving circuit (GDC) may include a first gate driving circuit (GDC1) and a second gate driving circuit (GDC2) positioned on both sides with the display area (DA) in between. The second gate driving circuit (GDC2) may be located on the opposite side of the first gate driving circuit (GDC1) with respect to the display area (DA) and may be approximately parallel to the first gate driving circuit (GDC1). Some of the pixel circuits may be electrically connected to the first gate driving circuit (GDC1), and the rest may be electrically connected to the second gate driving circuit (GDC2). In some embodiments, the second gate driving circuit (GDC2) may be omitted.

[0090] The non-display area (NDA) may include a terminal area (PA) in which a terminal portion (PAD) is placed. The terminal area (PA) may be placed on one side of the non-display area (NDA). The terminal portion (PAD) may be placed on one side of the substrate (100). The terminal portion (PAD) is exposed without being covered by an insulating layer and is connected to the printed circuit board (20). The connection portion (30) may electrically connect the printed circuit board (20) and the terminal portion (PAD). The printed circuit board (20) may include a driving circuit. A display driving portion (32) may be placed on the printed circuit board (20). The display driving portion (32) may generate a control signal to be transmitted to the first gate driving circuit (GDC1) and the second gate driving circuit (GDC2). The display driving unit (32) generates a data signal, and the generated data signal can be transmitted to the pixel circuit of the pixels (P) through the fan-out wiring (FW) and the data line (DL) connected to the fan-out wiring (FW).

[0091] The display driving unit (32) can supply a first power supply voltage (VDD, FIG. 7a) to the driving voltage supply wire (W11) and a second power supply voltage (VSS, FIG. 7a) to the common voltage supply wire (W13). The first power supply voltage (VDD, FIG. 7a) is applied to the pixel circuit of the pixel (P) through the driving voltage line (PL) connected to the driving voltage supply wire (W11), and the second power supply voltage (VSS, FIG. 7a) is connected to the common voltage supply wire (W13) and can be applied to the opposing electrode of the light-emitting element. The driving voltage supply wire (W11) may be provided extending along the x-direction from the lower side of the display area (DA). The common voltage supply wire (W13) may have a loop shape with one side open, so as to partially surround the display area (DA).

[0092] FIG. 5 is a plan view schematically showing the arrangement of pixels of a display panel according to one embodiment of the present invention.

[0093] Referring to FIG. 5, a plurality of pixels (PXr, PXg, PXb) may be arranged in a display area (DA) of a display panel (10). The display area (DA) may include a pixel area (11) and a connecting area (12) outside the pixel area (11). A red pixel (PXr), a green pixel (PXg), and a blue pixel (PXb) may be arranged in the pixel area (11). The red pixel (PXr), the green pixel (PXg), and the blue pixel (PXb) may constitute a single pixel unit (PU). Pixel units (PUs) may be repeatedly arranged in the display area (DA).

[0094] Signal lines electrically connected to adjacent pixels may be disposed in the connection area (12). The signal lines may be electrically connected to the pixel circuit and may come into contact with the first connection wiring (WL1). Each of the signal lines may include a first part disposed in the pixel area (11) and electrically connected to the pixel circuit, and a second part disposed in the connection area (12) and connecting adjacent pixel circuits. At this time, the first part and the second part may include different materials. Hereinafter, the second part of each of the signal lines may be referred to as the connection wiring in the specification.

[0095] The connection area (12) can be stretched relatively more than the pixel area (11) when the display panel (10) is stretched. In one embodiment, the connection wires placed in the connection area (12) may include a material having excellent elasticity and electrical properties at the same time. For example, the connection wires placed in the connection area (12) may include liquid metal, etc. The pixel areas (11) may be arranged at predetermined intervals along a first direction (e.g., x-direction) and a second direction (e.g., y-direction).

[0096] FIG. 6 is a cross-sectional view schematically showing a part of a display panel (10) according to one embodiment of the present invention.

[0097] Referring to FIG. 6, the display area (DA) may include a pixel area (11) and a connection area (12), and the connection area (12) may be an area connecting pixel areas (11) that are arranged adjacent to each other. The pixel area (11) may include a light-emitting diode (LED) and a circuit for driving the light-emitting diode (LED), such as a pixel circuit (PC). A first connection wire (WL1) that electrically connects adjacent pixel circuits (PC) may be arranged in the connection area (12). The terminal area (PA) may be an area where a terminal part (PAD) is arranged. The terminal part (PAD), the pixel area (11), and the connection area (12) may be arranged sequentially along one direction. A second connection wire (WL2) that electrically connects the terminal part (PAD) and the pixel circuit (PC) may be arranged in the terminal area (PA).

[0098] A pixel region (11), a connection region (12), and a terminal region (PA) may be formed on the first elastomer layer (400). In other words, the first elastomer layer (400) may have a pixel region (11), a connection region (12), and a terminal region (PA) defined respectively. A light-emitting diode (LED) and a pixel circuit (PC) may be disposed on the pixel region (11) of the first elastomer layer (400).

[0099] The first elastomer layer (400) can absorb stress that may occur during the stretching of the display panel (10). The first elastomer layer (400) may include an elastic polymer. For example, the first elastomer layer (400) is thermoplastic polyurethane, silicone, thermoplastic rubbers, elastolefin, thermoplastic olefin, polyamide, polyether block amide, synthetic polyisoprene, polybutadiene, chloroprene rubber, butyl rubber, styrene-butadiene, epichlorohydrin rubber, polyacrylic rubber, silicone rubber, fluorosilicone rubber, fluoroelastomers, ethylene-vinyl acetate, It may include at least one of PDMS (polydimethylsiloxane) and Ecoflex.

[0100] A display layer (200) may be disposed on the pixel area (11) of the first elastomer layer (400). The display layer (200) may include an inorganic insulating layer (IIL), a pixel circuit (PC), an organic insulating layer (OIL), and a light-emitting diode (LED). A pixel circuit (PC) may be disposed on the first elastomer layer (400), and an inorganic insulating layer (IIL) may be disposed between the electrodes included in the pixel circuit (PC). An organic insulating layer (OIL) may be disposed on the inorganic insulating layer (IIL) to cover the pixel circuit (PC). A light-emitting diode (LED) may be disposed on the organic insulating layer (OIL) and may be electrically connected to the corresponding pixel circuit (PC). The inorganic insulating layer (IIL) may include an inorganic insulating material such as silicon nitride and / or silicon oxide, and the organic insulating layer (OIL) may include an organic insulating material such as polyimide.

[0101] In one embodiment, a pixel unit (PU) may be disposed on a pixel area (11). As previously described, the pixel unit (PU) may include a red pixel (PXr, FIG. 5), a green pixel (PXg, FIG. 5), and a blue pixel (PXb, FIG. 5). The red pixel (PXr, FIG. 5) may include a first light-emitting diode (LED1), the green pixel (PXg, FIG. 5) may include a second light-emitting diode (LED2), and the blue pixel (PXb) may include a third light-emitting diode (LED3). For example, the first light-emitting diode (LED1) may emit red light, the second light-emitting diode (LED2) may emit green light, and the third light-emitting diode (LED3) may emit blue light. In some embodiments, the light-emitting diode (LED) may emit white light.

[0102] A stretchable first connecting wire (WL1) may be disposed in the connecting region (12) of the first elastomer layer (400). The first connecting wire (WL1) may be disposed within the first elastomer layer (400). The first connecting wire (WL1) may include a material having both excellent elasticity and electrical properties. In one embodiment, the first connecting wires (WL1) disposed in the connecting region (12) may include liquid metal. In another embodiment, the connecting wires may include metal nanostructures and elastic polymers. In yet another embodiment, the connecting wires may include a conductive composite material containing an elastomer. In one embodiment, the second connecting wire (WL2) may include the same material as the first connecting wire (WL1). However, it is not limited thereto, and the second connecting wire (WL2) may include a different material from the first connecting wire (WL1).

[0103] An organic insulating layer (OIL) may be disposed on the connection area (12) of the first elastomer layer (400). In one embodiment, the organic insulating layer (OIL) disposed on the connection area (12) may be a portion of the organic insulating layer (OIL) disposed on the pixel area (11) that extends to the connection area (12). When the display panel (10) is stretched, the connection area (12) may undergo relatively more deformation compared to the pixel area (11). Accordingly, unlike the pixel area (11), a layer containing an inorganic insulating material that is prone to cracking may not exist in the connection area (12).

[0104] A terminal portion (PAD) and a stretchable second connecting wire (WL2) may be disposed in the terminal region (PA) of the first elastomer layer (400). The terminal portion (PAD) may be disposed on the first elastomer layer (400). The second connecting wire (WL2) may be disposed within the first elastomer layer (400). The second connecting wire (WL2) may include a material having both excellent elasticity and electrical properties. In one embodiment, the second connecting wires (WL2) disposed in the terminal region (PA) may include liquid metal. In another embodiment, the connecting wires may include metal nanostructures and elastic polymers. In yet another embodiment, the connecting wires may include a conductive composite material containing an elastomer.

[0105] In one embodiment, a second elastomer layer (300) may be disposed on a light-emitting diode (LED) and a terminal portion (PAD). The second elastomer layer (300) may be disposed on a pixel circuit layer (PCL) to cover the light-emitting diode (LED) and the terminal portion (PAD). The second elastomer layer (300) may be disposed on all of the pixel area (11), the connection area (12), and the terminal area (PA). That is, the second elastomer layer (300) may be disposed to cover the entire display area (DA) and the terminal area (PA). The second elastomer layer (300) may cover the light-emitting diode (LED) and the terminal portion (PAD). The second elastomer layer (300) may absorb stress that may occur when the display panel (10) is stretched. Specifically, the second elastomer layer (300) can serve to prevent stress that may occur when the display panel (10) is stretched from being transmitted to the light-emitting diode (LED), pixel circuit (PC), and terminal part (PAD).

[0106] The second elastomer layer (300) may include an elastic polymer. The second elastomer layer (300) is thermoplastic polyurethane, silicone, thermoplastic rubbers, elastolefin, thermoplastic olefin, polyamide, polyether block amide, synthetic polyisoprene, polybutadiene, chloroprene rubber, butyl rubber, styrene-butadiene, epichlorohydrin rubber, polyacrylic rubber, silicone rubber, fluorosilicone rubber, and fluoroelastomers, ethylene-vinyl acetate, PDMS (polydimethylsiloxane) It may include at least one of the following. In one embodiment, the second elastomer layer (300) may include the same material as the first elastomer layer (400). However, it is not limited thereto, and the second elastomer layer (300) may include a different material from the first elastomer layer (400).

[0107] FIGS. 7a to 7c are equivalent circuit diagrams of a pixel circuit (PC) of a display panel according to one embodiment of the present invention.

[0108] Referring to FIG. 7a, a light-emitting diode (LED) corresponding to a pixel is electrically connected to a pixel circuit (PC), and the pixel circuit (PC) may include a first transistor (T1), a second transistor (T2), and a storage capacitor (Cst). The pixel circuit (PC) may be electrically connected to signal lines and voltage lines. The signal lines may include a gate line (GL, FIG. 4), such as a scan signal line (GWL), and a data line (DL), and the voltage lines may include a first voltage line (VDDL). In this case, the first voltage line (VDDL) may be connected to a driving voltage supply line (W11, FIG. 4), and the second voltage line (VSSL) may be connected to a common voltage supply line (W13, FIG. 4).

[0109] The second transistor (T2) can be electrically connected to the scan signal line (GWL) and the data line (DL). The scan signal line (GWL) can provide a scan signal (GW) to the gate electrode of the second transistor (T2). The second transistor (T2) can transmit a data signal (Dm) input from the data line (DL) to the first transistor (T1) according to the scan signal (GW) input from the scan signal line (GWL).

[0110] The storage capacitor (Cst) is electrically connected to the second transistor (T2) and the first voltage line (VDDL), and can store a voltage corresponding to the difference between the voltage received from the second transistor (T2) and the first power supply voltage (VDD) supplied by the first voltage line (VDDL).

[0111] The first transistor (T1) is a driving transistor capable of controlling the driving current flowing through the light-emitting diode (LED). The first transistor (T1) can be connected to the first voltage line (VDDL) and the storage capacitor (Cst). The first transistor (T1) can control the driving current flowing from the first voltage line (VDDL) to the light-emitting diode (LED) in correspondence with the voltage value stored in the storage capacitor (Cst). The light-emitting diode (LED) can emit light having a predetermined brightness by the driving current. The first electrode of the light-emitting diode (LED) is electrically connected to the first transistor (T1), and the second electrode can be electrically connected to the second voltage line (VSSL) that supplies the second power supply voltage (VSS).

[0112] FIG. 7a illustrates a pixel circuit (PC) comprising two transistors and one storage capacitor, but in other embodiments, the pixel circuit (PC) may comprise three or more transistors.

[0113] Referring to FIG. 7b, the pixel circuit (PC) may include a first transistor (T1), a second transistor (T2), a third transistor (T3), a fourth transistor (T4), a fifth transistor (T5), a sixth transistor (T6), a seventh transistor (T7), and a storage capacitor (Cst).

[0114] The pixel circuit (PC) is electrically connected to signal lines and voltage lines. The signal lines may include gate lines (GL, FIG. 3), such as scan signal lines (GWL), bypass control lines (GBL), initialization control lines (GIL), and light emission control lines (EML), and data lines (DL). The voltage lines may include first and second initialization voltage lines (VIL1, VIL2) and a first voltage line (VDDL). In this case, the first voltage line (VDDL) may be connected to a driving voltage supply line (W11, FIG. 3), and the second voltage line (VSSL) may be connected to a common voltage supply line (W13, FIG. 3).

[0115] The first voltage line (VDDL) can transmit the first power supply voltage (VDD) to the first transistor (T1). The first initialization voltage line (VIL1) can transmit the first initialization voltage (Vint) that initializes the first transistor (T1) to the pixel circuit (PC). The second initialization voltage line (VIL2) can transmit the second initialization voltage (Vaint) that initializes the first electrode of the light-emitting diode (LED) to the pixel circuit (PC).

[0116] The first transistor (T1) can be electrically connected to the first voltage line (VDDL) via the fifth transistor (T5) and electrically connected to the light-emitting diode (LED) via the sixth transistor (T6). The first transistor (T1) acts as a driving transistor and receives a data signal (Dm) according to the switching operation of the second transistor (T2) and supplies a driving current to the light-emitting diode (LED).

[0117] The second transistor (T2) is a data write transistor and is electrically connected to the scan signal line (GWL) and the data line (DL). The second transistor (T2) is electrically connected to the first voltage line (VDDL) via the fifth transistor (T5). The second transistor (T2) is turned on according to the scan signal (GW) received through the scan signal line (GWL) and performs a switching operation to transmit the data signal (Dm) transmitted to the data line (DL) to the first node (N1).

[0118] The third transistor (T3) is electrically connected to the scan signal line (GWL) and is electrically connected to the light-emitting diode (LED) via the sixth transistor (T6). The third transistor (T3) is turned on according to the scan signal (GW) received through the scan signal line (GWL) and can diode-connect the first transistor (T1).

[0119] The fourth transistor (T4) is a first initialization transistor and is electrically connected to the initialization control line (GIL) and the first initialization voltage line (VIL1). The fourth transistor (T4) is turned on according to the initialization control signal (GI) received through the initialization control line (GIL) and transmits the first initialization voltage (Vint) from the first initialization voltage line (VIL1) to the gate electrode of the first transistor (T1) to initialize the voltage of the gate electrode of the first transistor (T1). The initialization control signal (GI) may correspond to a scan signal of another pixel circuit placed in the previous row of the corresponding pixel circuit (PC).

[0120] The fifth transistor (T5) may be an operation control transistor, and the sixth transistor (T6) may be a light-emitting control transistor. The fifth transistor (T5) and the sixth transistor (T6) are electrically connected to the light-emitting control line (EML) and are simultaneously turned on according to the light-emitting control signal (EM) received through the light-emitting control line (EML) to form a current path so that a driving current can flow from the first voltage line (VDDL) toward the light-emitting diode (LED).

[0121] The seventh transistor (T7) is a second initialization transistor and can be electrically connected to the bypass control line (GBL), the second initialization voltage line (VIL2), and the sixth transistor (T6). The seventh transistor (T7) is turned on according to the bypass control signal (GB) received through the bypass control line (GBL), and can initialize the first electrode of the light-emitting diode (LED) by transmitting the second initialization voltage (Vaint) from the second initialization voltage line (VIL2) to the first electrode of the light-emitting diode (LED).

[0122] The storage capacitor (Cst) includes a first electrode (CE1) and a second electrode (CE2). The first electrode (CE1) is electrically connected to the gate electrode of the first transistor (T1), and the second electrode (CE2) is electrically connected to the first voltage line (VDDL). The storage capacitor (Cst) can maintain the voltage applied to the gate electrode of the first transistor (T1) by storing and maintaining a voltage corresponding to the difference between the voltages of the first voltage line (VDDL) and the gate electrode of the first transistor (T1).

[0123] Referring to FIG. 7c, the pixel circuit (PC) may include a first transistor (T1), a second transistor (T2), a third transistor (T3), a fourth transistor (T4), a fifth transistor (T5), a sixth transistor (T6), a seventh transistor (T7), an eighth transistor (T8), a ninth transistor (T9), a storage capacitor (Cst), and an auxiliary capacitor (Ca).

[0124] The pixel circuit (PC) is electrically connected to signal lines and voltage lines. The signal lines may include gate lines such as a scan signal line (GWL), a bypass control line (GBL), an initialization control line (GIL), and an emission control line (EML), and data lines (DL). The voltage lines may include first and second initialization voltage lines (VIL1, VIL2), a hold voltage line (VSL), and a first voltage line (VDDL). In this case, the first voltage line (VDDL) may be connected to a driving voltage supply line (W11, FIG. 4), and the second voltage line (VSSL) may be connected to a common voltage supply line (W13, FIG. 4).

[0125] The first voltage line (VDDL) can transmit the first power supply voltage (VDD) to the first transistor (T1). The first initialization voltage line (VIL1) can transmit the first initialization voltage (Vint) that initializes the first transistor (T1) to the pixel circuit (PC). The second initialization voltage line (VIL2) can transmit the second initialization voltage (Vaint) that initializes the first electrode of the light-emitting diode (LED) to the pixel circuit (PC). The holding voltage line (VSL) can provide the holding voltage (VSUS) to the second electrode (CE2) of the second node (N2), such as the storage capacitor (Cst), during the initialization period and the data writing period.

[0126] The first transistor (T1) can be electrically connected to the first voltage line (VDDL) via the fifth transistor (T5) and the eighth transistor (T8), and can be electrically connected to the light-emitting diode (LED) via the sixth transistor (T6). The first transistor (T1) acts as a driving transistor and can receive a data signal (Dm) according to the switching operation of the second transistor (T2) and supply a driving current to the light-emitting diode (LED).

[0127] The second transistor (T2) is electrically connected to the scan signal line (GWL) and the data line (DL), and is electrically connected to the first voltage line (VDDL) via the fifth transistor (T5) and the eighth transistor (T8). The second transistor (T2) is turned on according to the scan signal (GW) received through the scan signal line (GWL) and performs a switching operation to transmit the data signal (Dm) transmitted through the data line (DL) to the first node (N1).

[0128] The third transistor (T3) is electrically connected to the scan signal line (GWL) and is electrically connected to the light-emitting diode (LED) via the sixth transistor (T6). The third transistor (T3) is turned on according to the scan signal (GW) received through the scan signal line (GWL) and connects the first transistor (T1) to the diode, thereby compensating for the threshold voltage of the first transistor (T1).

[0129] The fourth transistor (T4) is electrically connected to the initialization control line (GIL) and the first initialization voltage line (VIL1), and is turned on according to the initialization control signal (GI) received through the initialization control line (GIL) to transmit the first initialization voltage (Vint) from the first initialization voltage line (VIL1) to the gate electrode of the first transistor (T1) to initialize the voltage of the gate electrode of the first transistor (T1). The initialization control signal (GI) may correspond to a scan signal of another pixel circuit placed in the previous row of the corresponding pixel circuit (PC).

[0130] The fifth transistor (T5), the sixth transistor (T6), and the eighth transistor (T8) are electrically connected to the light emission control line (EML) and are simultaneously turned on according to the light emission control signal (EM) received through the light emission control line (EML) to form a current path so that driving current can flow from the first voltage line (VDDL) toward the light-emitting diode (LED).

[0131] The seventh transistor (T7) is a second initialization transistor and can be electrically connected to the bypass control line (GBL), the second initialization voltage line (VIL2), and the sixth transistor (T6). The seventh transistor (T7) is turned on according to the bypass control signal (GB) received through the bypass control line (GBL) and transmits the second initialization voltage (Vaint) from the second initialization voltage line (VIL2) to the first electrode of the light-emitting diode (LED) to initialize the first electrode of the light-emitting diode (LED).

[0132] The ninth transistor (T9) can be electrically connected to the bypass control line (GBL), the second electrode (CE2) of the storage capacitor (Cst), and the holding voltage line (VSL). The ninth transistor (T9) is turned on according to the bypass control signal (GB) received through the bypass control line (GBL), and can transmit a holding voltage (VSUS) to the second node (N2), such as the second electrode (CE2) of the storage capacitor (Cst), during the initialization period and the data writing period.

[0133] The eighth transistor (T8) and the ninth transistor (T9) can each be electrically connected to the second node (N2), for example, the second electrode (CE2) of the storage capacitor (Cst). In some embodiments, the eighth transistor (T8) may be turned off and the ninth transistor (T9) may be turned on during the initialization period and the data writing period, and the eighth transistor (T8) may be turned on and the ninth transistor (T9) may be turned off during the light emission period. Since the second node (N2) receives the holding voltage (VSUS) during the initialization period and the data writing period, the uniformity of the brightness of the display device (e.g., LRU, Long Range Uniformity) due to the voltage drop of the first voltage line (VDDL) can be improved.

[0134] The storage capacitor (Cst) includes a first electrode (CE1) and a second electrode (CE2). The first electrode (CE1) is electrically connected to the gate electrode of the first transistor (T1), and the second electrode (CE2) is electrically connected to the eighth transistor (T8) and the ninth transistor (T9).

[0135] The auxiliary capacitor (Ca) can be electrically connected to the sixth transistor (T6), the holding voltage line (VSL), and the first electrode of the light-emitting diode (LED). By storing and maintaining a voltage corresponding to the voltage difference between the first electrode of the light-emitting diode (LED) and the holding voltage line (VSL) while the seventh transistor (T7) and the ninth transistor (T9) are turned on, the auxiliary capacitor (Ca) can prevent the problem of the black brightness rising when the sixth transistor (T6) is turned off.

[0136] FIGS. 8a and FIGS. 8d are cross-sectional views schematically showing a light-emitting diode (LED) of a display panel according to one embodiment of the present invention.

[0137] Referring to FIG. 8a, the light-emitting diode (LED) may include an inorganic light-emitting diode containing an inorganic material. The light-emitting diode (LED) may include a first semiconductor layer (231), a second semiconductor layer (232), an intermediate layer (233) between the first semiconductor layer (231) and the second semiconductor layer (232), a first electrode (235) electrically connected to the first semiconductor layer (231), and a second electrode (238) electrically connected to the second semiconductor layer (232). The first electrode (235) and the second electrode (238) of the light-emitting diode (LED) may each be electrically connected to a first electrode pad (241) and a second electrode pad (242) disposed on the same layer. The second electrode pad (242) may be a part of the second voltage line (VSSL, FIG. 7a) or a conductive layer electrically connected to the second voltage line (VSSL, FIG. 7a).

[0138] In some embodiments, the first semiconductor layer (231) may include a p-type semiconductor layer. The p-type semiconductor layer is In x Al y Ga 1-x-y A semiconductor material having the composition formula N (0≤x≤1, 0≤y≤1, 0≤x+y≤1) can be selected from, for example, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, etc., and p-type dopants such as Mg, Zn, Ca, Sr, and Ba can be doped.

[0139] The second semiconductor layer (232) may include, for example, an n-type semiconductor layer. The n-type semiconductor layer is In x Al y Ga 1-x-y A semiconductor material having the composition formula N (0≤x≤1, 0≤y≤1, 0≤x+y≤1) can be selected from, for example, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, etc., and can be doped with n-type dopants such as Si, Ge, and Sn.

[0140] The intermediate layer (233) is a region where electrons and holes recombine, and as electrons and holes recombine, they transition to a lower energy level and can generate light having a corresponding wavelength. The intermediate layer (233) is, for example, In x Al y Ga 1-x-y It can be formed by including a semiconductor material having a composition formula of N (0≤x≤1, 0≤y≤1, 0≤x+y≤1), and can be formed as a single quantum well structure or a multi-quantum well (MQW) structure. In addition, it may include a quantum wire structure or a quantum dot structure.

[0141] FIG. 8a illustrates that the first semiconductor layer (231) includes a p-type semiconductor layer and the second semiconductor layer (232) includes an n-type semiconductor layer, but the present invention is not limited thereto. In another embodiment, the first semiconductor layer (231) may include an n-type semiconductor layer and the second semiconductor layer (232) may include a p-type semiconductor layer.

[0142] FIG. 8a illustrates that the first electrode pad (241) and the second electrode pad (242) are disposed on the same layer, but the present invention is not limited thereto. Referring to FIG. 8b, the first electrode pad (241) and the second electrode pad (242) may be disposed on different layers. For example, a bank layer (230) having an opening that overlaps with at least a portion of the first electrode pad (241) may be disposed on the first electrode pad (241), and the second electrode pad (242) may be disposed on the upper surface of the bank layer (230). The structure of the light-emitting diode (LED) illustrated in FIG. 8b is the same as previously described with reference to FIG. 8a.

[0143] In another embodiment, as shown in FIG. 8c, the second electrode pad (242) may be positioned on both sides centered on the first electrode pad (241) in a cross-sectional view. The bank layer (230) includes an opening that overlaps at least a portion of the first electrode pad (241), and the second electrode pad (242) may be positioned around the opening of the bank layer (230). In some embodiments, the second electrode pad (242) may have a closed-loop shape that completely surrounds the opening of the bank layer (230) and / or the first electrode pad (241) in a planar view. The structure of the light-emitting diode (LED) shown in FIG. 8c is the same as previously described with reference to FIG. 8a.

[0144] FIGS. 8a to 8c illustrate the first electrode (235) and the second electrode (238) of a light-emitting diode (LED) facing in the same direction (e.g., downward direction, -z direction), but the present invention is not limited thereto. As shown in FIG. 8d, the first electrode (235) and the second electrode (238) of the light-emitting diode (LED) may face in opposite directions.

[0145] The bank layer (230) includes an opening that exposes at least a portion of the first electrode pad (241), and the thickness of the bank layer (230) may be substantially the same as the thickness of the light-emitting diode (LED). The opening of the bank layer (230) may be filled with a filling material (FM), and the second electrode pad (242) may be disposed on the upper surface of the bank layer (230) so as to be electrically connected (e.g., in contact) with the second electrode (238) of the light-emitting diode (LED). The filling material may be an organic material having insulating properties.

[0146] FIGS. 9a to 9c are cross-sectional views schematically showing a part of a display panel (10) according to one embodiment of the present invention.

[0147] Referring to FIGS. 9a through 9c, the display panel (10) may include a first elastomer layer (400). As previously described, the first elastomer layer (400) can absorb stress generated during the stretching of the display panel (10). The first elastomer layer (400) may include the same material as described with reference to FIG. 6.

[0148] A display panel (10) may be defined with a pixel area (11), a connection area (12) between the pixel areas (11), and a terminal area (PA). On the pixel area (11) of the first elastomer layer (400), a pixel circuit layer (PCL) including a pixel circuit (PC) and a light-emitting diode (LED) disposed on the pixel circuit layer (PCL) may be disposed.

[0149] A buffer layer (111) is disposed on the first elastomer layer (400), and a pixel circuit (PC) can be disposed on the buffer layer (111) (wherein the expression “on” may mean “on top”). The buffer layer (111) may include an inorganic insulating material such as silicon oxide, silicon nitride, or silicon oxynitride.

[0150] A thin-film transistor (TFT) may include a semiconductor layer (Act), a gate electrode (GE), a source electrode (SE), and a drain electrode (DE). FIG. 9a illustrates a top-gate type in which the gate electrode (GE) is placed on the semiconductor layer (Act) with the gate insulating layer (113) in between, but according to another embodiment, the thin-film transistor (TFT) may be a bottom-gate type.

[0151] The semiconductor layer (Act) may include polysilicon. Alternatively, the semiconductor layer (Act) may include amorphous silicon, oxide semiconductor, organic semiconductor, etc. The gate electrode (GE) may overlap with the semiconductor layer (Act). The gate electrode (GE) may include a metal thin film composed of a low-resistance metal material. The gate electrode (GE) may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed as a multilayer or single layer including the above materials. For example, the gate electrode (GE) may be provided as a metal thin film formed as a triple layer with a titanium (Ti) / aluminum (Al) / titanium (Ti) structure.

[0152] The gate insulating layer (113) between the semiconductor layer (Act) and the gate electrode (GE) may include an inorganic insulating material such as silicon oxide, nitrogen oxide, silicon oxynitride, aluminum oxide, or titanium oxide. The gate insulating layer (113) may be a single layer or a multilayer containing the aforementioned materials.

[0153] The source electrode (SE) and the drain electrode (DE) may be located on the same layer, for example, the second interlayer insulating layer (117), and may contain the same material. The source electrode (SE) and the drain electrode (DE) may contain a metal thin film composed of a low-resistance metal material. The source electrode (SE) and the drain electrode (DE) may contain a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed as a multilayer or single layer containing the above materials. For example, the source electrode (SE) and the drain electrode (DE), like the gate electrode (GE), may be provided with a metal thin film formed as a triple layer of titanium (Ti) / aluminum (Al) / titanium (Ti) structure. The second interlayer insulating layer (117) may include an inorganic insulating material such as silicon oxide, nitrogen oxide, silicon oxynitride, aluminum oxide, and titanium oxide, and may be a single layer or a multilayer containing the aforementioned material.

[0154] A storage capacitor (Cst) may include a first electrode (CE1) and a second electrode (CE2) that overlap with a first interlayer insulating layer (115) in between. The storage capacitor (Cst) may overlap with a thin-film transistor (TFT). In this regard, FIG. 9a illustrates that the gate electrode (GE) of the thin-film transistor (TFT) is the first electrode (CE1) of the storage capacitor (Cst). In another embodiment, the storage capacitor (Cst) may not overlap with the thin-film transistor (TFT). The storage capacitor (Cst) may be covered by a second interlayer insulating layer (117).

[0155] The first interlayer insulating layer (115) may be disposed between the gate insulating layer (113) and the second interlayer insulating layer (117). The first interlayer insulating layer (115) may include an inorganic insulating material such as silicon oxide, nitrogen oxide, silicon oxynitride, aluminum oxide, or titanium oxide, and may be a single layer or a multilayer containing the aforementioned material.

[0156] The second electrode (CE2) of the storage capacitor (Cst) may include a conductive material and may be formed as a multilayer or single layer. The second electrode (CE2) may include a metal thin film composed of a low-resistance metal material. The second electrode (CE2) may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed as a multilayer or single layer including the above materials. For example, the second electrode (CE2) may be provided with a metal thin film formed as a triple layer of a titanium (Ti) / aluminum (Al) / titanium (Ti) structure.

[0157] As illustrated in FIG. 9b, the thin-film transistor (TFT) can be divided into a first transistor (T1, FIG. 7a) and a second transistor (T2, FIG. 7a). Among the two thin-film transistors (TFTs) illustrated in FIG. 9b, the thin-film transistor positioned further away from the terminal portion (PAD) can be designated as the first transistor (T1, FIG. 7a). Additionally, among the two thin-film transistors (TFTs) illustrated in FIG. 9b, the thin-film transistor adjacent to the terminal portion (PAD) can be designated as the second transistor (T2, FIG. 7a). The first transistor (T1, FIG. 7a) can perform the function of a driving transistor as described above with reference to FIG. 7a. In addition, the second transistor (T2, FIG. 7a) is electrically connected to a signal line so that a signal input from the signal line can be transmitted to the first transistor (T1, FIG. 7a).

[0158] The first organic insulating layer (121) may be disposed on the second interlayer insulating layer (117), and the second organic insulating layer (123) may be disposed on the first organic insulating layer (121). Additionally, in the outer region of the pixel region (11) adjacent to the connection region (12), a sub-organic insulating layer (119) may be interposed between the second interlayer insulating layer (117) and the first organic insulating layer (121). The sub-organic insulating layer (119), the first organic insulating layer (121), and the second organic insulating layer (123) may each include an organic insulating material such as polyimide.

[0159] An inorganic insulating layer (IIL, FIG. 6) comprising a buffer layer (111), a gate insulating layer (113), a first interlayer insulating layer (115), and a second interlayer insulating layer (117) may be disposed only in the pixel area (11) and not in the connection area (12). In other words, some areas of the inorganic insulating layer (IIL, FIG. 6) that overlap with the connection area (12) may be removed. At this time, a sub-organic insulating layer (119) may fill the step difference that may occur between the pixel area (11) and the connection area (12). A second organic insulating layer (123) may extend from the pixel area (11) and be partially disposed in the connection area (12).

[0160] The gate line (GL) and the data line (DL) may be placed on the second interlayer insulating layer (117), and the first organic insulating layer (121) may be placed on the gate line (GL) and the data line (DL). In one embodiment, a portion of the data line (DL) placed in the pixel area (11) may extend to the connection area (12) and come into direct contact with the first connecting wire (WL1). A portion of the data line (DL) extending to the connection area (12) may be placed on the sub-organic insulating layer (119). In one embodiment, the end of the portion of the data line (DL) extended to the connection area (12) may come into direct contact with the first connecting wire (WL1). In one embodiment, a portion of the data line (DL) placed in the pixel area (11) may extend to the terminal area (PA) and come into direct contact with the second connecting wire (WL2). A portion of the data line (DL) extending to the terminal area (PA) may be placed on the sub-organic insulating layer (119). In one embodiment, the end of the portion of the data line (DL) extending to the terminal area (PA) may be in direct contact with the second connecting wire (WL2). The first organic insulating layer (121) may cover the data line (DL). The first organic insulating layer (121) may cover at least a portion of the first connecting wire (WL1). The first organic insulating layer (121) may cover at least a portion of the second connecting wire (WL2). Because the first organic insulating layer (121) covers the data line (DL), the data line (DL) may be protected from the first organic insulating layer (121) during the etching process.

[0161] A connecting electrode (CM) and a second voltage line (VSSL) may be disposed on the first organic insulating layer (121). The connecting electrode (CM) can electrically connect a thin-film transistor (TFT) and a light-emitting diode (LED). The second voltage line (VSSL) can be connected to a common voltage supply line (W13, FIG. 4) to transmit a second power supply voltage (VSS, FIG. 7a) to the second electrode (238). The connecting electrode (CM) and the second voltage line (VSSL) may include a metal thin film composed of a low-resistance metal material. The connecting electrode (CM) and the second voltage line (VSSL) may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed as a multilayer or single layer including the above materials. For example, the connecting electrode (CM) and the second voltage line (VSSL) may be provided with a metal thin film formed of a triple layer of titanium (Ti) / aluminum (Al) / titanium (Ti) structure.

[0162] The first electrode pad (241) and the second electrode pad (242) may be disposed on the second organic insulating layer (123). The first electrode pad (241) may be electrically connected to a thin-film transistor (TFT) through a connecting electrode (CM) between the first organic insulating layer (121) and the second organic insulating layer (123). The light-emitting diode (LED) on the first electrode pad (241) and the second electrode pad (242) may be the same as the inorganic light-emitting diode described above with reference to FIG. 8b. Each light-emitting diode (LED), which is an inorganic light-emitting diode, may comprise a first semiconductor layer (231, FIG. 8b), a second semiconductor layer (232, FIG. 8b), an intermediate layer (233, FIG. 8b) between the first semiconductor layer (231, FIG. 8b) and the second semiconductor layer (232, FIG. 8b), a first electrode (235, FIG. 8b) electrically connected to the first semiconductor layer (231, FIG. 8b), and a second electrode (238, FIG. 8b) electrically connected to the second semiconductor layer (232, FIG. 8b). The light-emitting diode (LED) may be covered by a protective layer (240). The protective layer (240) may comprise an organic insulating material such as polyimide.

[0163] The terminal area (PA) may include a first terminal area (PA1), a second terminal area (PA2), and a third terminal area (PA3). The first terminal area (PA1), the second terminal area (PA2), and the third terminal area (PA3) may be arranged sequentially along a direction away from the display area (DA). The second terminal area (PA2) may be arranged between the first terminal area (PA1) and the third terminal area (PA3). That is, along one direction, the third terminal area (PA3), the second terminal area (PA2), the first terminal area (PA1), the pixel area (11), and the connection area (12) may be arranged sequentially.

[0164] A terminal portion (PAD) may be disposed on the second terminal region (PA2) of the first elastomer layer (400). The terminal portion (PAD) may include a first terminal layer (P1), a second terminal layer (P2), and a third terminal layer (P3). The first terminal layer (P1) may be disposed on the lower side of the terminal portion (PAD). The lower surface of the terminal portion (PAD) shall be referred to as the first terminal surface (PAS). That is, the terminal portion (PAD) may have a first terminal surface (PAS) facing away from the light-emitting diode. The lower surface of the first terminal layer (P1) may form the lower surface of the terminal portion (PAD). That is, the first terminal layer (P1) may have a first terminal surface (PAS).

[0165] The first terminal layer (P1) may include the same material as the gate electrode (GE). The first terminal layer (P1) may be formed by the same process as the gate electrode (GE). The first terminal layer (P1) may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed as a multilayer or single layer including the above materials. For example, the first terminal layer (P1) may be provided as a metal thin film formed as a triple layer of titanium (Ti) / aluminum (Al) / titanium (Ti) structure.

[0166] The second terminal layer (P2) may be disposed on the first terminal layer (P1). The second terminal layer (P2) may be electrically connected to the first terminal layer (P1). The second terminal layer (P2) may be in direct contact with the first terminal layer (P1). The second terminal layer (P2) may include the same material as the source electrode (SE) and / or drain electrode (DE). The second terminal layer (P2) may be formed by the same process as the source electrode (SE) and / or drain electrode (DE). The second terminal layer (P2) may include a metal thin film composed of a low-resistance metal material. The second terminal layer (P2) may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed as a multilayer or single layer containing the above materials. For example, the second terminal layer (P2) may be provided as a metal thin film formed as a triple layer of titanium (Ti) / aluminum (Al) / titanium (Ti) structure.

[0167] The third terminal layer (P3) may be disposed on the second terminal layer (P2). The third terminal layer (P3) may be electrically connected to the second terminal layer (P2). The third terminal layer (P3) may be in direct contact with the second terminal layer (P2). The third terminal layer (P3) may include the same material as the connecting electrode (CM). The third terminal layer (P3) may be formed by the same process as the connecting electrode (CM). The third terminal layer (P3) may include a metal thin film composed of a low-resistance metal material. The third terminal layer (P3) may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed as a multilayer or single layer containing the above materials. For example, the third terminal layer (P3) may be provided as a metal thin film formed as a triple layer of titanium (Ti) / aluminum (Al) / titanium (Ti) structure.

[0168] An inorganic insulating layer (IIL, FIG. 6) may be disposed on the third terminal region (PA3) of the first elastomer layer (400). On the third terminal region (PA3), a buffer layer (111) disposed on the first elastomer layer (400), a gate insulating layer (113) disposed on the buffer layer (111), a first interlayer insulating layer (115) disposed on the gate insulating layer (113), and a second interlayer insulating layer (117) disposed on the first interlayer insulating layer (115) may be disposed.

[0169] In the third terminal region (PA3), a first terminal layer (P1) may be interposed between the gate insulating layer (113) and the first interlayer insulating layer (115). The first interlayer insulating layer (115) may cover the end of the first terminal layer (P1). In the third terminal region (PA3), a second terminal layer (P2) may be disposed on the second interlayer insulating layer (117). In the third terminal region (PA3), a third terminal layer (P3) may be disposed on the second terminal layer (P2). The ends of each of the first terminal layer (P1), the second terminal layer (P2), and the third terminal layer (P3) may be disposed in the third terminal region (PA3).

[0170] A first connecting wire (WL1) electrically connected to a pixel circuit (PC) may be disposed in the connection area (12) of the display panel (10). The first connecting wire (WL1) may come into contact with the lower surface of the pixel circuit layer (PCL). The lower surface of the pixel circuit layer (PCL) is referred to as the first pixel surface (PCS). That is, the pixel circuit layer (PCL) may have a first pixel surface (PCS) facing away from the light-emitting diode (LED). The lower surface of the pixel circuit layer (PCL) and the lower surface of the terminal portion (PAD) may be disposed on the same plane. The first pixel surface (PCS) and the first terminal surface (PAS) may be disposed on the same plane.

[0171] The first connecting wire (WL1) may come into contact with the first pixel plane (PCS). The side and bottom surfaces of the first connecting wire (WL1) may be surrounded by the first elastomer layer (400). As the first connecting wire (WL1) has a structure embedded in the first elastomer layer (400), the first elastomer layer (400) can absorb the stress that may be concentrated on the first connecting wire (WL1) when the display panel (10) is stretched.

[0172] Additionally, since the connection area (12) of the display panel (10) may undergo significant deformation, an inorganic insulating layer (IIL, FIG. 6) may not be disposed on the connection area (12) of the first elastomer layer (400), and organic insulating layers (OIL, FIG. 6) may be disposed thereon. For example, a sub-organic insulating layer (119), a first organic insulating layer (121), and a second organic insulating layer (123) disposed in the pixel area (11) may be extended and disposed on the connection area (12).

[0173] A second connecting wire (WL2) that electrically connects a pixel circuit (PC) and a terminal section (PAD) may be disposed in the first terminal area (PA1) of the display panel (10). The second connecting wire (WL2) may come into contact with the lower surface of the pixel circuit layer (PCL) and the lower surface of the terminal section (PAD), respectively. That is, the second connecting wire (WL2) may come into contact with the first pixel surface (PCS) and the first terminal surface (PAS), respectively. The side of the second connecting wire (WL2) and the lower surface of the second connecting wire (WL2) may be surrounded by a first elastomer layer (400). As the second connecting wire (WL2) has a structure embedded in the first elastomer layer (400), the first elastomer layer (400) can absorb the stress that may be concentrated on the second connecting wire (WL2) when the display panel (10) is stretched.

[0174] The first elastomer layer (400) may be disposed on the lower surface of the terminal portion (PAD) and the lower surface of the pixel circuit layer (PCL) respectively to cover the first connection wire (WL1) and the second connection wire (WL2). The first elastomer layer (400) may be disposed on the first pixel surface (PCS) and the first terminal surface (PAS) respectively to cover the first connection wire (WL1) and the second connection wire (WL2) respectively.

[0175] Additionally, since the first terminal area (PA1) of the display panel (10) may undergo significant deformation, an inorganic insulating layer (IIL, FIG. 6) may not be disposed on the first terminal area (PA1) of the first elastomer layer (400), and organic insulating layers (OIL, FIG. 6) may be disposed thereon. For example, a sub-organic insulating layer (119), a first organic insulating layer (121), and a second organic insulating layer (123) disposed in the pixel area (11) may be extended and disposed on the first terminal area (PA1).

[0176] A second elastomer layer (300) may be disposed on the light-emitting diode (LED), the terminal portion (PAD), the first connecting wire (WL1), and the second connecting wire (WL2). The second elastomer layer (300) covers the light-emitting diode (LED), the terminal portion (PAD), the first connecting wire (WL1), and the second connecting wire (WL2), and can absorb stress that may be transmitted to the light-emitting diode (LED), the terminal portion (PAD), the first connecting wire (WL1), and the second connecting wire (WL2).

[0177] The printed circuit board (20) may be positioned to face the first terminal surface (PAS) of the terminal portion (PAD). The connecting portion (30) may electrically connect the printed circuit board (20) and the first terminal surface (PAS). The connecting portion (30) may contact the lower surface of the terminal portion (PAD) and the upper surface of the printed circuit board (20), respectively. The printed circuit board (20) and the connecting portion (30) may each contact the first elastomer layer (400). The first elastomer layer (400) may surround the connecting portion (30).

[0178] For example, as illustrated in FIG. 9a, the first elastomer layer (400) may not cover the printed circuit board (20). The printed circuit board (20) may protrude from the first elastomer layer (400) in a direction away from the light-emitting diode (LED) (e.g., the -z direction). The lower portion of the printed circuit board (20) may not come into contact with the first elastomer layer (400).

[0179] For example, as illustrated in FIG. 9c, the first elastomer layer (400) can cover the printed circuit board (20) (e.g., the lower surface of the printed circuit board (20)). The portion of the printed circuit board (20) that overlaps with the first elastomer layer (400) can be accommodated in the first elastomer layer (400). The portion of the printed circuit board (20) that overlaps with the first elastomer layer (400) may not be exposed to the outside by the first elastomer layer (400).

[0180] However, this is exemplary, and the positional relationship between the first elastomer layer (400) and the printed circuit board (20) may vary depending on the required design elements, such as the thickness of each of the first elastomer layer (400) and the printed circuit board (20).

[0181] FIGS. 10a and FIGS. 10b are cross-sectional views schematically illustrating a portion of a terminal portion (PAD) and a connection portion (30) according to an embodiment of the present invention.

[0182] Referring to FIG. 10a, a terminal portion (PAD) may be connected to a connection portion (30). A first terminal surface (PAS) of the terminal portion (PAD) may be connected to the connection portion (30). The connection portion (30) may include a circuit terminal (30T) and a connection body portion (30B) of the connection portion (30). An integrated circuit may be disposed in the connection body portion (30B). In one embodiment, the terminal portion (PAD) may be electrically connected to the circuit terminal (30T) of the connection portion (30) through an anisotropic conductive film (ACF). For example, the terminal portion (PAD) may be physically and / or electrically connected through the anisotropic conductive film (ACF) even if it does not come into direct contact with the circuit terminal (30T) of the connection portion (30).

[0183] The anisotropic conductive film (ACF) may include an adhesive resin (ADR) and a plurality of conductive balls (CDB) scattered on the adhesive resin (ADR). The adhesive resin (ADR) may fix the plurality of conductive balls (CDB) within a defined area and physically connect the terminal portion (PAD) and the connection portion (30). The plurality of conductive balls (CDB) may electrically connect the circuit terminals (30T) of the terminal portion (PAD) and the connection portion (30).

[0184] In another embodiment, the terminal portion (PAD) can be electrically connected to each other by a plurality of soldering portions and a circuit terminal (30T) of the connection portion (30).

[0185] Referring to FIG. 10b, the terminal portion (PAD) can be directly connected to the connection portion (30). The first terminal surface (PAS) of the terminal portion (PAD) can be directly connected to the connection portion (30). In one embodiment, the terminal portion (PAD) can be electrically connected to the circuit terminal (30T) of the connection portion (30). For example, the terminal portion (PAD) can be electrically connected to the circuit terminal (30T) of the connection portion (30) through a molten portion (MP). The molten portion (MP) may be an alloy containing a part of the terminal portion (PAD) and a part of the circuit terminal (30T) of the connection portion (30). In the molten portion (MP), a part of the terminal portion (PAD) and a part of the circuit terminal (30T) of the connection portion (30) can be melted and joined.

[0186] FIGS. 11a to 11K are cross-sectional views sequentially illustrating the steps of a method for manufacturing a display panel (10) according to one embodiment of the present invention.

[0187] In the description of the method for manufacturing a display panel (10) of one embodiment, the description of the display panel (10) described with reference to FIG. 9a may be applied to the display panel (10).

[0188] In FIGS. 11a to 11K, the same reference numerals as in FIGS. 6 to 9a refer to the same components, so a redundant description thereof is omitted.

[0189] First, referring to FIG. 11a, a lower layer (LL) may be formed to form a display panel (10). The lower layer (LL) may be a layer temporarily placed to form a stretchable display panel (10). That is, the lower layer (LL) is placed to support the display layer (200, FIG. 6) while forming the display layer (200, FIG. 6), but may be removed after the display layer (200, FIG. 6) is formed.

[0190] In one embodiment, the lower layer (LL) may include a substrate (100) and a base layer (110) disposed on the substrate (100). The substrate (100) may be a rigid substrate. For example, the substrate (100) may be a transparent glass substrate with SiO2 as the main component, or a substrate comprising a polymer resin material such as reinforced plastic. The base layer (110) may include a polymer resin. For example, the base layer (110) may include polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, or cellulose acetate propionate, etc. In one embodiment, the thickness of the base layer (110) may be greater than the thickness of the substrate (100).

[0191] On the lower layer (LL), an inorganic insulating layer (IIL) and a part of a thin-film transistor (TFT, FIG. 9a) may be formed. For example, on the lower layer (LL), a buffer layer (111), a semiconductor layer (Act), a gate insulating layer (113), a gate electrode (GE), a first interlayer insulating layer (115), a second electrode (CE2), and a second interlayer insulating layer (117) may be sequentially stacked.

[0192] However, the inorganic insulating layer (IIL) may be disposed only in the pixel area (11) and the third terminal area (PA3), and may not be disposed in the connection area (12), the first terminal area (PA1), and the second terminal area (PA2). For example, a portion of the inorganic insulating layer (IIL) that overlaps with the connection area (12), the first terminal area (PA1), and the second terminal area (PA2) may be removed through an etching process. In the process of forming the gate electrode (GE) in the pixel area (11), a first terminal layer (P1) containing the same material as the gate electrode (GE) may be formed in the terminal area (PA). The first terminal layer (P1) may be disposed within the first terminal area (PA1) spaced apart from the pixel area (11).

[0193] Next, referring to FIG. 11b, a sub-organic insulating layer (119) can be formed on the second interlayer insulating layer (117). The sub-organic insulating layer (119) can be placed in the pixel area (11), the connection area (12), and the first terminal area (PA1). The sub-organic insulating layer (119) can cover the side of the inorganic insulating layer (IIL) from which a portion has been removed. The sub-organic insulating layer (119) can prevent the wiring from being disconnected due to the step difference between the inorganic insulating layer (IIL) and the lower layer (LL). The source electrode (SE, FIG. 9a) and drain electrode (DE, FIG. 9a) of the pixel circuit (PC) can be formed on the second interlayer insulating layer (117), and a data line (DL) can be formed on the second interlayer insulating layer (117) and the sub-organic insulating layer (119).

[0194] A first organic insulating layer (121) may be formed on the pixel circuit (PC), and a connection electrode (CM) and a second voltage line (VSSL) may be formed on the first organic insulating layer (121). A second organic insulating layer (123) may be formed on the connection electrode (CM), and a first electrode pad (241) and a second electrode pad (243) may be formed on the second organic insulating layer (123). In one embodiment, the first organic insulating layer (121) may be formed only on the pixel area (11), and the second organic insulating layer (123) may be formed partially on the connection area (12) and the terminal area (PA) extending from the pixel area (11). However, as shown in FIG. 11b, the second organic insulating layers (123) that are arranged adjacently may be spaced apart from each other within the connection area (12).

[0195] In the process of forming a source electrode (SE, FIG. 9a) and a drain electrode (DE, FIG. 9a) in a pixel area (11), a second terminal layer (P2) containing the same material as the source electrode (SE, FIG. 9a) and the drain electrode (DE, FIG. 9a) may be formed in a terminal area (PA). The second terminal layer (P2) may be spaced apart from the pixel area (11) within the first terminal area (PA1).

[0196] Additionally, in the process of forming a connection electrode (CM) in the pixel area (11), a third terminal layer (P3) containing the same material as the connection electrode (CM) may be formed in the terminal area (PA). The third terminal layer (P3) may be spaced apart from the pixel area (11) within the first terminal area (PA1).

[0197] Next, referring to FIG. 11c, a light-emitting diode (LED) can be formed on a pixel circuit layer (PCL). The light-emitting diode (LED) can be placed on a pixel area (11). The light-emitting diode (LED) can be an inorganic light-emitting diode, as previously described with reference to FIG. 8a. The light-emitting diode (LED) can be covered by a protective layer (240).

[0198] Next, referring to FIG. 11d, the second elastomer layer (300) may be formed to cover the light-emitting diode (LED) and the terminal area (PA). The second elastomer layer (300) may include the same material as described with reference to FIG. 9a. The second elastomer layer (300) can absorb stress that may be transmitted to the light-emitting diode (LED) and the pixel circuit (PC) when the display panel (10) is stretched. Additionally, the second elastomer layer (300) may function to flatten the display panel (10). The second elastomer layer (300) may be formed through a thermal curing process after the material constituting the second elastomer layer (300) is deposited. The thermal curing process may heat the display panel (10) at 150°C or higher for 30 minutes to 2 hours. However, it is not limited to this, and the second elastomer layer (300) may be cured through a UV curing process.

[0199] A carrier film (500) may be formed on the second elastomer layer (300). Although not shown in FIG. 11d, the carrier film (500) may be attached to the upper surface of the second elastomer layer (300) through an adhesive layer interposed between the second elastomer layer (300) and the carrier film (500). The carrier film (500) may be a protective film capable of preventing scratches or dents that occur on the display panel (10) during the process. For example, the carrier film (500) may include an insulating film. However, this is merely an example, and the method of attaching the carrier film (500) may be varied.

[0200] Next, referring to FIGS. 11d and 11e, after detaching the substrate (100) from the lower layer (LL), the display panel (10) can be inverted. Specifically, the substrate (100) can be removed from the base layer (110). By irradiating a laser onto the other side of the substrate (100) opposite to the side of the substrate (100) in contact with the base layer (110), the bonding force between the substrate (100) and the base layer (110) can be weakened. Accordingly, the substrate (100) can be peeled off from the base layer (110). However, this is an example, and the method of removing the substrate (100) can be varied.

[0201] After the substrate (100) is detached, the display panel (10) can be inverted so that the upper and lower surfaces are reversed. For example, the display panel (10) can be inverted so that the carrier film (500) is placed on the lower side and the base layer (110) is placed on the upper side.

[0202] Next, referring to FIG. 11f, the base layer (110) can be removed while the display panel (10) is inverted. The base layer (110) can be completely removed through a dry etching process. As the base layer (110) is removed, the bottom surface of the pixel circuit layer (PCL) and the bottom surface of the terminal portion (PAD) can be exposed. Here, the bottom surface of the pixel circuit layer (PCL) can be seen as the top surface of the pixel circuit layer (PCL) because the display panel (10) is inverted. Also, the bottom surface of the terminal portion (PAD) can be seen as the top surface of the terminal portion (PAD) because the display panel (10) is inverted.

[0203] Next, referring to FIG. 11g, a sacrificial layer (600) can be formed on the bottom surface of the pixel circuit layer (PCL) while the display panel (10) is in an inverted state. The sacrificial layer (600) can be patterned to have a first opening (610OP) overlapping with the connection area (12) and a second opening (620P) overlapping with the first terminal area (PA1). In one embodiment, the sacrificial layer (600) can be formed through a dispensing process or an inkjet printing process. However, this is exemplary, and the method of forming the sacrificial layer (600) can be varied.

[0204] The sacrificial layer (600) may be a layer temporarily used to pattern the first connecting wire (WL1, FIG. 11h) and the second connecting wire (WL2, FIG. 11h). In one embodiment, when the connecting wire (WL1, FIG. 11h) and the second connecting wire (WL2, FIG. 11h) are formed with liquid metal, the sacrificial layer (600) may include a liquid metal adhesion inhibiting material. However, this is exemplary, and the sacrificial layer (600) may not be limited to any material having hydrophobicity.

[0205] Next, referring to FIG. 11h, a first connecting wire (WL1) may be formed within the first opening (610OP) of the sacrificial layer (600). Additionally, a second connecting wire (WL2) may be formed within the second opening (620OP) of the sacrificial layer (600).

[0206] In one embodiment, the first connecting wire (WL1) and the second connecting wire (WL2) may include liquid metal, and the material for forming the first connecting wire (WL1) and the second connecting wire (WL2) may be applied using a roller or a stamp, etc. However, since fine patterning is difficult when using a roller or a stamp, the material for forming the first connecting wire (WL1) may be applied up to the area around the first opening (610OP), and the material for forming the second connecting wire (WL2) may be applied up to the area around the second opening (620OP). At this time, if the sacrificial layer (600) includes a liquid metal adhesion inhibitor as described above, the material for forming the first connecting wire (WL1) and the second connecting wire (WL2) may not be placed on the sacrificial layer (600), but may be placed only within the first opening (610OP) and the second opening (620OP). That is, the first connecting wire (WL1) and the second connecting wire (WL2) can be patterned through the opening of the sacrificial layer (600) containing a hydrophobic material.

[0207] Next, referring to FIG. 11h and FIG. 11i, the sacrificial layer (600) can be removed. The sacrificial layer (600), which contains a hydrophobic material such as a liquid metal adhesion inhibitor, can be removed through a cleaning process using water. Accordingly, only the first connecting wire (WL1) formed within the first opening (610OP) and the second connecting wire (WL2) formed within the second opening (620OP) can remain on the bottom surface of the display panel (10).

[0208] That is, according to the manufacturing method of a display panel (10) according to one embodiment of the present invention, fine patterning of the first connecting wire (WL1) and the second connecting wire (WL2) is possible, and since the sacrificial layer (600) is completely removed so that no material that could reduce the elasticity of the display panel (10) remains, the stretchability of the display panel (10) can be improved. Meanwhile, if a sacrificial layer (600) containing a hydrophobic material remains, the bonding strength with the upper layer may be weakened. Accordingly, the display panel (10) according to one embodiment of the present invention can also secure structural stability of the display panel (10) by removing the sacrificial layer (600).

[0209] Next, referring to FIG. 11j, the printed circuit board (20) can be electrically connected to the terminal section (PAD). The connection section (30) can electrically connect the printed circuit board (20) and the terminal section (PAD). In the second terminal area (PA2), the connection section (30) and the printed circuit board (20) can come into contact with each other. Also, in the second terminal area (PA2), the connection section (30) and the terminal section (PAD) can come into contact with each other.

[0210] Next, referring to FIG. 11k, a first elastomer layer (400) can be formed on the bottom surface of the pixel circuit layer (PCL). The first elastomer layer (400) can be positioned to cover the first connecting wire (WL1) and the second connecting wire (WL2). The first elastomer layer (400) can come into contact with the printed circuit board (20) and the connecting portion (30), respectively. The first elastomer layer (400) can surround the connecting portion (30).

[0211] The first elastomer layer (400) may include the same material as described with reference to FIG. 9a. The first elastomer layer (400) may function to encapsulate the lower part of the display panel (10) and may absorb stress that may occur when the display panel (10) is stretched.

[0212] After forming the first elastomer layer (400), the display panel (10) can be inverted again to have the structure of the display panel (10) as shown in FIG. 9a. Afterwards, the carrier film (500, FIG. 11j) attached to the upper surface of the display panel (10) can be removed. The carrier film (500, FIG. 11j) can be removed using a release tape. However, this is an example, and the method of removing the carrier film (500, FIG. 11j) can be varied.

[0213] FIGS. 12a to 12g are schematic perspective views illustrating embodiments of an electronic device including a display panel according to one embodiment of the present invention.

[0214] Referring to FIG. 12a, a display panel according to one embodiment of the present invention can be utilized in a wearable electronic device (3100) that can be worn on a part of a user's body. The wearable electronic device (3100) may include a body part (3110) and a display part (3120) provided in the body part (3110). The display panel according to embodiments of the present invention can be used as the display part (3120) of the wearable electronic device (3100). As illustrated in FIG. 13a, the wearable electronic device (3100) may be modified. In one embodiment, it can be used as a smart watch or a smartphone depending on the user's choice.

[0215] FIG. 12b illustrates a medical electronic device (3200). In one embodiment, the medical electronic device (3200) may include a body part (3210) and a light-emitting part (3220). A display panel according to embodiments of the present invention may be used as the light-emitting part (3220) of the medical electronic device (3200). The light-emitting part (3220) may emit light of a specific wavelength band (e.g., infrared, visible light, etc.) to the patient's body. In one embodiment, the body part (3210) may have a stretchable fiber material and may have a structure that can be worn on the body of the user of the light-emitting part.

[0216] FIG. 12c illustrates an educational electronic device (3300). In one embodiment, the educational electronic device may include a display unit (3320) provided within a frame (3310). The display unit (3320) may utilize a display panel according to embodiments of the present invention. The display unit (3320) may provide images such as a sea with waves, a snow-covered mountain, or a volcano with flowing lava, wherein the display unit (3320) may extend in the height direction (e.g., z-direction) to reflect the height of the waves, mountain, or volcano. In some embodiments, a portion of the display unit (3320) may sequentially vary in height along the direction of the lava flow to show the movement of the lava in three dimensions. The educational electronic device (3300) may include a plurality of pins (or stroke units, 3330) arranged on the back of the display unit (3320) so that the display unit (3320) extends in the height direction. The pins (3330) can be implemented to move along a third direction (e.g., z direction or -z direction) so that the image displayed on the display unit (3320) has a three-dimensional height. FIG. 12c describes an educational electronic device (3300), but its use is not limited as long as it provides certain image information.

[0217] The electronic device illustrated in FIGS. 12a to 12c is described as having a variable shape, but the present invention is not limited thereto. As in the embodiments described below, the display panel according to the embodiments of the present invention can be used in an electronic device in which a portion capable of displaying an image (e.g., a screen) is fixed.

[0218] FIG. 12d illustrates a robot (3400) as another electronic device in one embodiment of the present invention. The robot (3400) can move or perceive objects using a camera unit (3440) and can display a predetermined image to a user through a display unit (3420, 3430). In some embodiments, since the display panels according to one embodiment of the present invention can be extended in various directions as described above, they can be assembled to a body frame having a hemispherical shape, and thus the robot (3400) may include a hemispherical display unit (3420, 3430).

[0219] FIG. 12e illustrates a vehicle display device (3500) as another electronic device in one embodiment of the present invention. The vehicle display device (3500) may include a cluster (3510), a Center Information Display (CID) (3520), and / or a passenger display (3530). Since the display panel according to the embodiment of the present invention can be extended in various directions, it can be used for the cluster (3510), the Center Information Display (CID) (3520), and / or the co-driver display (3530) without being constrained by the shape of the vehicle's internal frame.

[0220] FIG. 12e illustrates the cluster (3510), the Center Information Display (CID) (3520), and / or the co-driver display (3530) being separated, but the invention is not limited thereto. In another embodiment, two or more selected from the cluster (3510), the Center Information Display (CID) (3520), and the co-driver display (3530) may be connected as a single unit.

[0221] In some embodiments, the vehicle display device (3500) may include a button (3540) capable of displaying a predetermined image. Referring to the enlarged view of FIG. 12e, the hemispherical button (3540) may include an object (3542) that provides a sense of use of the button while moving in the z-direction or -z-direction, and a display device placed on the object (3542). In some embodiments, if the object (3542) has a three-dimensionally rounded surface, the display device may also have a three-dimensionally rounded surface.

[0222] FIG. 12f illustrates that an electronic device according to one embodiment of the present invention is an electronic device for advertising or display (3600). In some embodiments, the electronic device for advertising or display (3600) may be installed on a fixed structure (3610), such as a wall or a column. If the structure (3610) includes an uneven surface as shown in FIG. 12f, the electronic device for advertising or display (3600) may also be placed along the uneven surface of the structure (3610). In some embodiments, the electronic device for advertising or display (3600) may be installed on the structure (3610) using a heat-shrink film or the like.

[0223] FIG. 12g illustrates that an electronic device according to one embodiment of the present invention is a controller (3700). The controller (3700) may include image-type buttons. For example, the controller (3700) may include first to third button areas (3720, 3730, 3740) in which a portion of the display portion (3710) protrudes in the z-direction or protrudes in the -z-direction (e.g., recessed in the z-direction). In some embodiments, the first and third button areas (3720, 3740) may protrude in the z-direction, and the second button area (3730) may protrude in the -z-direction (or recessed in the z-direction).

[0224] As such, the present invention has been described with reference to an embodiment illustrated in the drawings, but this is merely illustrative, and those skilled in the art will understand that various modifications and variations of the embodiments are possible therefrom. Accordingly, the true technical scope of protection of the present invention should be determined by the technical spirit of the appended claims.

Claims

1. Light-emitting diode; A pixel circuit layer comprising a pixel circuit electrically connected to the light-emitting diode and having a first pixel surface facing away from the light-emitting diode; A first connecting wire that contacts the first pixel surface and is electrically connected to the pixel circuit; A terminal portion having a first terminal surface facing away from the light-emitting diode; A second connecting wire that contacts each of the first pixel surface and the first terminal surface and electrically connects the pixel circuit and the terminal portion; A printed circuit board including a driving circuit; and A display device comprising: a connection portion that electrically connects the printed circuit board and the first terminal plane.

2. In Paragraph 1, A display device in which the first pixel plane and the first terminal plane are arranged on the same plane.

3. In Paragraph 1, A display device further comprising: a first elastomer layer disposed below the first pixel plane and the first terminal plane so as to overlap with the first connecting wire and the second connecting wire.

4. In Paragraph 3, The above printed circuit board is a display device in contact with the first elastomer layer.

5. In Paragraph 3, A display device in which the first elastomer layer surrounds the connection portion on a flat plane.

6. In Paragraph 1, A display device further comprising a second elastomer layer disposed on the pixel circuit layer to cover the light-emitting diode.

7. In Paragraph 1, The pixel circuit above is, semiconductor layer; and A gate electrode overlapping with the semiconductor layer; comprising The above terminal part is, A display device comprising: a first terminal layer having the first terminal plane and including the same material as the gate electrode.

8. In Paragraph 1, A display device further comprising a signal line electrically connected to the pixel circuit and in contact with the first connection wire.

9. In Paragraph 8, The above signal line is a display device including a data line.

10. In Paragraph 1, The first connecting wire and the second connecting wire are each extendable display devices.

11. An electronic device comprising a display panel having a terminal area, a pixel area, and a connection area, The above display panel is, A pixel circuit layer disposed in the above pixel region and including a pixel circuit; A light-emitting diode disposed on the pixel circuit layer and electrically connected to the pixel circuit; A first connecting wire disposed in the above connecting area, in contact with the lower surface of the pixel circuit layer, and electrically connected to the pixel circuit; A terminal portion disposed in the above terminal area; A second connecting wire that contacts the lower surface of the pixel circuit layer and the lower surface of the terminal portion, respectively, and electrically connects the pixel circuit and the terminal portion; A printed circuit board including a driving circuit; and An electronic device comprising: a connection portion that electrically connects the terminal portion and the printed circuit board.

12. In Paragraph 11, An electronic device in which the terminal area, the pixel area, and the connection area are sequentially arranged along one direction.

13. In Paragraph 11, The above connection portion is an electronic device that contacts the lower surface of the terminal portion and the lower surface of the pixel circuit layer, respectively.

14. In Paragraph 11, An electronic device in which the lower surface of the pixel circuit layer and the lower surface of the terminal portion are arranged on the same plane.

15. In Paragraph 11, The above display panel is, An electronic device further comprising: a first elastomer layer disposed on the lower surface of the terminal portion and the lower surface of the pixel circuit layer so as to overlap with the first connecting wire and the second connecting wire.

16. In Paragraph 15, The above printed circuit board is an electronic device in contact with the first elastomer layer.

17. In Paragraph 11, The above display panel is, An electronic device further comprising a second elastomer layer disposed on the pixel circuit layer to cover the light-emitting diode.

18. In Paragraph 11, The above display panel is, An electronic device further comprising a signal line electrically connected to the pixel circuit and in contact with the first connection wiring.

19. In Paragraph 18, The above signal line is an electronic device including a data line.

20. In Paragraph 11, The first connecting wire and the second connecting wire are each extendable electronic devices.

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