Handler for electronic component testing

Abstract

The present invention relates to a handler for electronic component testing. The handler for electronic component testing according to the present invention comprises a cold air control heater which controls the temperature of a cooling fluid inputted to a cooling flow path of a test table. The present invention can ensure test reliability, since the electronic component being tested can be quickly and appropriately cooled.

Description

electronic component test handler

[0001] The present invention relates to a handler that supports testing of an electronic component by electrically connecting the electronic component and a tester.

[0002] An electronic component test handler is equipment that handles electronic components to electrically connect them to a tester.

[0003] As the integration density of electronic components, such as semiconductor devices, continues to increase, the line width of circuits is becoming increasingly narrow. Consequently, greater precision is required when connecting electronic components to testers.

[0004] Previously, it was possible to make a proper electrical connection between electronic components and testers with an error range of 20㎛, but now, an error range of 10㎛ or less, or even a few㎛, is required.

[0005] Meanwhile, among electronic components, there are dies that are separated into individual units from the wafer state.

[0006] The die can be completed as a final product by undergoing a packaging process or by stacking it for HBM (High Bandwidth Memory) production and then undergoing a packaging process.

[0007] To perform post-die operations, testing of the die is required.

[0008] Electronic components in die form can be tested by electrically connecting contact pads to a tester.

[0009] Until now, no automated test capable of adequately supporting the testing of electronic components in the dyna HBM state has been proposed. This is because the dies are very thin, making precise contact difficult due to the fine spacing between contact pads, and can easily break or shatter.

[0010] Accordingly, the applicant has proposed Korean published patent No. 10-2021-0088373 (hereinafter referred to as the 'prior art').

[0011] The prior art proposes a technique for aligning the positions of electronic components by repositioning them before connecting them to a tester.

[0012] The prior art scans an electronic component on a test table (named a 'chuck' in the prior art) with a camera to determine its current position and readjusts the position of the electronic component to reduce the error range.

[0013] According to the prior art, the precise positioning of electronic components enables automated testing of electronic components at the die level.

[0014] Electronic components can be used in various temperature environments.

[0015] Considering use in various temperature environments, electronic components are tested under various temperature conditions.

[0016] Electronic components can be tested under low temperature conditions.

[0017] For example, low temperature conditions can be -40 degrees.

[0018] Electronic components can be tested under high temperature conditions.

[0019] For example, high temperature conditions can be +80 degrees.

[0020] The electronic component being tested generates heat due to electrical resistance.

[0021] Self-heating reduces the reliability of the test by compromising the temperature conditions required by electronic components.

[0022] To ensure the reliability of the test, the temperature environment for electronic components must be maintained uniformly during the test.

[0023] In order to maintain the temperature environment of the electronic components, it is necessary to cool or heat the electronic components being tested.

[0024] Heaters are used to heat electronic components, and chillers that supply cooling fluid are used for cooling.

[0025] The heater can be installed adjacent to the electronic component being tested, and the electrical input to the heater can be interrupted rapidly. Therefore, it is relatively easy to raise the temperature of the electronic component through heating by the heater.

[0026] The chiller cannot be installed as close to the electronic components being tested as the heater. The cooling fluid supplied by the chiller must be delivered through various pipes, and in some cases, the chiller may need to be placed outside the handler.

[0027] It takes time for the cooling fluid supplied from the chiller to reach the area where the electronic components are located.

[0028] Even among chillers with the same specifications, there may be differences in performance between them.

[0029] Therefore, cooling electronic components with a chiller is relatively difficult.

[0030] [Prior Art Literature]

[0031] [Patent Literature]

[0032] (Patent Document 1) Republic of Korea Published Patent No. 10-2021-0088373

[0033] The electronic components being tested need to be cooled more quickly.

[0034] Technology is needed to overcome the performance differences of chillers.

[0035] A handler for testing electronic components according to the first embodiment of the present invention comprises: a test table having a cooling channel through which a cooling fluid for cooling the electronic components is moved, wherein electronic components are arranged on an upper surface; a cooler that supplies and then recovers the cooling fluid to the test table; and a controller that controls the cooler to regulate the temperature of the test table; wherein the cooler comprises: a manifold having an entry channel corresponding to the inlet of the cooling channel and an exit channel corresponding to the outlet of the cooling channel; a supply pipe providing a passage through which the cooling fluid moves from the manifold to the entry channel in a chiller that supplies the cooling fluid to the manifold and recovers the cooling fluid from the manifold; a recovery pipe providing a passage through which the cooling fluid moves from the exit channel to the chiller; and a cold air control heater coupled to the manifold and for regulating the temperature of the cooling fluid moving through the entry channel; and wherein the controller controls the cold air control heater to regulate the temperature of the cooling fluid input into the cooling channel through the entry channel.

[0036] The above cooling channel is formed to have a first movement pattern in which a cooling medium entering through the entrance winds around the outer perimeter of the test table toward the center, and a second movement pattern in which a cooling medium adjacent to the first movement pattern at the center leads to the exit channel, and the first movement pattern and the second movement pattern are interconnected in the central area.

[0037] The apparatus further includes a bypass pipe connecting the supply pipe and the return pipe; and a bypass valve for opening and closing the bypass pipe, wherein the controller controls the flow rate entering the cooling path by closing or opening the bypass valve.

[0038] The above bypass valve is equipped as a proportional control valve to regulate the flow rate passing through the bypass valve.

[0039] The above cold air control heater is positioned at a location higher than the above entrance.

[0040] The above cold air control heater is positioned at a location lower than the above entrance.

[0041] The above test table further includes a plurality of temperature sensors for detecting temperature; and the controller controls the cold air control heater by checking the temperature values ​​detected by the plurality of temperature sensors.

[0042] The above test table further includes a component heating heater for heating electronic components on the upper surface; and a plurality of temperature sensors for detecting temperature; and the controller controls the component heating heater and the cold air control heater by checking the temperature values ​​detected by the plurality of temperature sensors.

[0043] The above-mentioned component heating heater is provided in a plate-like shape.

[0044] The above cooling channel, the above entry channel, and the above exit channel are two, and further include a supply branch pipe that branches the supply pipe into two so that the supplied cooling fluid is divided and moved to the two above entry channels; and a recovery coupling pipe that combines the two branched recovery pipes so that the cooling fluid recovered from the two above exit channels is combined and moved to the chiller.

[0045] The above manifold is coupled to the above test table.

[0046] A handler for testing electronic components according to a second embodiment of the present invention comprises: a test table having a cooling channel through which a cooling fluid for cooling the electronic components moves, wherein electronic components are arranged on an upper surface; a cooler that supplies and then recovers the cooling fluid to the test table; and a controller that controls the cooler to regulate the temperature of the test table. The cooler comprises a cooling control heater that regulates the temperature of the cooling fluid moving to the inlet of the cooling channel, and the controller controls the cooling control heater to regulate the temperature of the cooling fluid input into the cooling channel.

[0047] The above cooler further includes a manifold having an entry path corresponding to the inlet of the cooling path and an exit path corresponding to the outlet of the cooling path; and the cold air control heater is coupled to the manifold.

[0048] The above cooler further comprises a first manifold having an entry path corresponding to the inlet of the cooling path; and a second manifold having an exit path corresponding to the outlet of the cooling path; and the cold air control heater is coupled to the first manifold.

[0049] According to the present invention, reliability of the test is ensured because the electronic component being tested can be cooled appropriately and more quickly.

[0050] FIG. 1 is a conceptual plan view of a handler for testing electronic components according to one embodiment of the present invention.

[0051] FIGS. 2 to 15 are reference diagrams for explaining the electronic component test handler of FIG. 1.

[0052] FIGS. 16 to 24 are reference diagrams for explaining a cooler that can be applied to the electronic component test handler of FIG. 1.

[0053] Preferred embodiments according to the present invention are described with reference to the attached drawings, provided that for the sake of brevity, descriptions of well-known or redundant components are omitted or compressed as much as possible.

[0054] <Description of Handlers for Electronic Component Testing>

[0055] FIG. 1 is a conceptual plan view of an electronic component test handler (TH, hereinafter abbreviated as 'handler') according to the present invention.

[0056] The handler (TH) according to the present invention may be divided into a loading section (LU), a relocation section (RP), a connection section (CP), and a moving section (MP), and includes a transport shuttle (100), a first picker hand (210), a second picker hand (310), a test table (300), a vacuum device (400), a relocation mechanism (500), a moving mechanism (600), a cooler (700), and a controller (800).

[0057] The unloading unit (LU) supplies electronic components (ED) to be tested or retrieves electronic components (ED) that have completed testing.

[0058] In the relocation section (RP), the positions of the electronic components (ED) to be tested, supplied from the unloading section (LU), are precisely relocated.

[0059] In the connection section (CP), electronic components whose positions have been precisely repositioned in the relocation section (RP) are electrically connected to the tester.

[0060] In the moving section (MF), electronic components can be moved to exchange electronic components (ED) between the unloading section (LU) and the relocation section (RP).

[0061] The moving section (MF) moves electronic components to be tested from the unloading section (LU) to the relocation section (RP), and moves electronic components (ED) that have completed testing from the relocation section (RP) to the unloading section (LU).

[0062] A transport shuttle (100) for carrying electronic components is installed in the moving part (MP).

[0063] When viewed in a planar view, the transport shuttle (100) of the moving part (MP) has a portion of one side (the right side in the drawing) overlapping with the unloading part (LU).

[0064] A transport shuttle (100) is provided to transport electronic components (ED) between the unloading section (LU) and the relocation section (RP).

[0065] The transport shuttle (100) has a movable transport table (110).

[0066] The transport shuttle (100) may have at least one transport table (110).

[0067] The transport table (110) can move back and forth in one direction.

[0068] The transport table (110) can move back and forth in the X-axis direction.

[0069] In the case where there are multiple transport tables (100), the multiple transport tables (110) may be provided in parallel in the Y-axis direction. In this case, the multiple transport tables (110) need to be implemented to move back and forth in the X-axis direction independently of each other.

[0070] The transport table (110) can move between the first area (A1) on the side overlapping with the unloading section (LU) and the second area (A2) on the side of the relocation section (RP).

[0071] Electronic components can be loaded on the transport table (110).

[0072] The transport table (110) has a vacuum structure that fixes electronic components placed on a flat surface by vacuum pressure.

[0073] As shown in the schematic plan view of FIG. 2, the transport table (110) has vacuum holes (VH) and vacuum grooves (VG) formed therein for vacuum-adsorbing electronic components.

[0074] One vacuum hole (VH) and one vacuum groove (VG) form a pair.

[0075] When viewed in a planar view, the vacuum hole (VH) is positioned near the center of the area occupied by the vacuum groove (VG).

[0076] The vacuum pressure coming through the vacuum hole (VH) acts on the electronic component as it is evenly distributed through the vacuum groove (VG).

[0077] Since the electronic component can be fixed to the transport table (110) by vacuum pressure, no movement of the electronic component occurs during the process of moving in the X-axis direction while being carried on the transport table (110).

[0078] The vacuum holes (VH) and vacuum grooves (VG) can be arranged in a 2x8 matrix form.

[0079] Since the loading capacity of the transport table (110) can be increased or decreased, the number of vacuum holes (VH) and vacuum grooves (VG) can also be increased or decreased.

[0080] In the unloading section (LU), electronic components (ED) are supplied to the handler (TH) or recovered from the handler (TH).

[0081] Electronic components to be tested are supplied to the handler (TH) through the unloading section (LU), and electronic components that have completed testing are recovered from the handler (TH) through the unloading section (LU).

[0082] Electronic components can be loaded onto a Jetec Tray, Ring Frame, Ring Tray, or other types of customer trays and supplied to or retrieved from the handler (TH).

[0083] The structure of the loading / unloading section (LU) may vary depending on the type of customer tray.

[0084] Electronic components to be tested in the unloading section (LU) are loaded onto a transport table (110) in the first area (A1), and electronic components that have completed testing and are loaded onto the transport table (110) in the first area (A1) are unloaded from the transport table (110). To this end, a first picker hand (210) is provided in the unloading section (LU).

[0085] The first picker hand (210) is provided to load electronic components onto the transport table (110) or to unload them from the transport table (110).

[0086] For unloading operations by the first picker hand (210), the transport table (110) must be moved toward the unloading section (LU) and be in the first area (A1).

[0087] The first picker hand (210) loads electronic components to be tested onto a transport table (110) in the first area (A1) or unloads electronic components that have been tested from the transport table (110) in the first area (A1).

[0088] The first picker hand (210) may have one or more pickers capable of gripping or releasing electronic components. The pickers may grip electronic components (ED) by vacuum pressure.

[0089] Preferably, four pickers can be installed in pairs on the first picker hand (210) to improve processing capacity.

[0090] For example, as shown in the conceptual diagram of FIG. 3, the first picker hand (210) may have four pickers (P) arranged in a 2x2 matrix form.

[0091] Depending on the embodiment, the number of pickers (P) provided in the first picker hand (210) may be increased or decreased.

[0092] The first picker hand (210) can pick up four electronic components at once, but since the positions of the electronic components may vary, it is preferable to implement the pickers (P) to pick up one electronic component at a time sequentially through individual lifting and lowering movements.

[0093] In the relocation section (RP), electronic components to be tested are unloaded from the transport table (110) and loaded onto the test table (300), and the electronic components loaded onto the test table (300) are relocated.

[0094] In the relocation section (RP), a relocation space (RS) is formed for the relocation of electronic components.

[0095] According to the present embodiment, the relocation portion (RP) is positioned on one side of the connection portion (CP) in the X-axis direction.

[0096] The repositioning part (RP) is equipped with a second picker hand (310).

[0097] The second picker hand (310) takes electronic components to be tested from the transport table (110) or loads electronic components that have been tested onto the transport table (110).

[0098] For unloading operations by the second picker hand (310), the transport table (110) must be moved toward the relocation section (RP) and be in the second area (A2).

[0099] The second picker hand (310) unloads electronic components to be tested from the transport table (110) in the second area (A2) or loads electronic components that have been tested from the transport table (110) in the second area (A2).

[0100] The second picker hand (310) can be configured in the same way as the first picker hand (210).

[0101] The number of pickers (P) provided in the second picker hand (310) may be different from the number of pickers (P) provided in the first picker hand (210).

[0102] The second picker hand (310) loads the electronic components to be tested from the transport table (110) in the second area (A2) onto the test table (300) that has been moved to the relocation area (RP).

[0103] The second picker hand (310) loads the electronic components that have been tested and are loaded on the test table (300) onto the transport table (110) in the second area (A2).

[0104] In order for electronic components to be tested by the second picker hand (310) to be loaded onto the test table (300), the test table (300) must be located in the relocation space (RP).

[0105] The test table (300) is provided to load electronic components that are unloaded from the transport table (110) by the second picker hand (310).

[0106] As shown in the schematic excerpt of FIG. 4, the test table (300) is in the shape of a disc and has a flat top surface.

[0107] The test table (300) may be in the shape of a square plate when viewed from a flat plane, and in this case, the top surface is also flat.

[0108] The electronic components are loaded and arranged on the test table (300) in a manner such that they are placed on the flat upper surface of the test table (300).

[0109] The test table (300) can be moved in the X-axis, Y-axis, and Z-axis directions.

[0110] The test table (300) can be rotated in the Θ-axis direction with the vertical line (V) passing through the center of the test table (300) in the Z-axis direction as the axis of rotation.

[0111] Generally, when an electronic component is moved to a test table (300), shock or inertia accompanying the movement occurs.

[0112] Impact or inertia, etc., can disrupt the position of electronic components loaded on the test table (300). To prevent this, vacuum holes (h) are formed in the area where electronic components are loaded on the test table (300).

[0113] The vacuum structure of the test table (300) for fixing electronic components may be the same as the vacuum structure of the transport table (110).

[0114] When an electronic component is placed on the test table (300) by the second picker hand (310), the electronic component can be placed in the same position due to vacuum pressure. In that state, when the second picker hand (310) releases the grip on the electronic component, the electronic component is fixed in the placed position without shifting.

[0115] The vacuum device (400) provides vacuum pressure to the vacuum holes (h) in the test table (300) through a vacuum circuit (not shown).

[0116] The vacuum device (400) can be configured with only a structure that is installed in a factory and distributes vacuum pressure supplied from outside the handler (TH) to each electronic component (ED) through a vacuum circuit.

[0117] The vacuum pressure provided by the vacuum device (400) is transmitted to the electronic components through the vacuum hole (h), and the electronic components loaded on the test table (300) are fixed in position by the vacuum pressure.

[0118] The vacuum holes (h) are implemented to be selectively opened or closed depending on the control of the vacuum circuit. The electronic components may be selectively fixed to the test table (300) or removed from the test table (300).

[0119] The electronic components are electrically connected to the tester while loaded on the test table (300).

[0120] As shown in the conceptual diagram of FIG. 5, the test table (300) further has a component heating heater (310), a cooling channel (320), and a plurality of temperature sensors (330).

[0121] The component heating heater (310) heats the electronic component on the upper surface.

[0122] As shown in FIG. 6, the component heating heater (310) is provided in a plate shape so that it can be heated evenly over the entire surface of the test table (300).

[0123] The cooling channel (320) provides a path for a cooling fluid to travel to cool electronic components within the test table (300).

[0124] As shown in Fig. 7, the cooling channel (320) has an inlet (321) and an outlet (322).

[0125] The cooling fluid enters the cooling channel (320) through the inlet (321).

[0126] The cooling fluid exits from the cooling channel (320) through the outlet (322).

[0127] As shown in FIG. 8, the cooling fluid that enters through the inlet (321) moves toward the center of the test table (300) while moving along the area (indicated by the solid line) according to the first movement pattern (P1), and then moves toward the outlet (322) while moving along the area (indicated by the dotted line) according to the second movement pattern (P2).

[0128] The first movement pattern (P1) has a shape that wraps around the outer circumference of the test table (300) toward the center (O).

[0129] In the first movement pattern (P1), the radius of curvature of the cooling channel (320) gradually decreases.

[0130] The second movement pattern (P2) has a shape that extends to the exit path (322) while adjacent to the first movement pattern (P1) at the center (O).

[0131] The first movement pattern (P1) and the second movement pattern (P2) are interconnected in the center (O) area.

[0132] The direction of movement of the cooling fluid is changed in the center (O) region.

[0133] The cooling fluid that enters the cooling channel (320) through the inlet (321) moves along the first movement pattern (P1) area, then changes its direction of movement in the center (O) area, moves along the second movement pattern (P2) area, and then exits the cooling channel (320) through the outlet (322).

[0134] Because the temperature of the cooling fluid entering the cooling channel (320) gradually rises through heat exchange with the test table (300), it was difficult to achieve even cooling across the entire surface area of ​​the test table (300).

[0135] However, as shown in FIG. 9, by forming a cooling channel (320) having a first movement pattern (P1) and a second movement pattern (P2), even cooling over the entire surface area of ​​the test table (300) becomes possible. Accordingly, electronic components in contact with the test table (300) on the upper surface of the test table (300) can also be cooled evenly.

[0136] Temperature sensors (330) are distributed over the entire surface area of ​​the test table (300).

[0137] The temperature sensors (330) detect the temperature of the test table (300).

[0138] The controller (800) can determine the temperature of the electronic component (ED) in contact with the test table (300) by determining the temperature value of the test table (300).

[0139] The controller (800) checks the temperature values ​​detected by the temperature sensors (330) and controls the component heating heater (310) and the cooler (700) to maintain the temperature of the electronic components (ED) at the test temperature condition.

[0140] The electrical connection between the electronic components loaded on the test table (300) and the tester is made via a test board (TB).

[0141] The test board (TB) has test pins that make electrical contact with electronic components.

[0142] The test board (TB) is fixedly coupled to the handler (TH) at the connection part (CP).

[0143] The electronic components loaded on the test table (300) that has been moved to the connection part (CP) are electrically connected to the test pins of the test board (TB).

[0144] The test board (TB) may have any structure as long as it has a configuration that can be electrically connected to electronic components.

[0145] The test board (TB) is positioned above the test space (TS). Here, the test space (TS) is a space formed in the connection part (CP), and when the test table (300) is in the test space (TS), an electrical connection is made between the electronic component (ED) and the tester by the raising of the test table (300).

[0146] Once installation is complete, the test board (TB) is fixed in a position that cannot be changed.

[0147] The test board (TB) may be a widely known probe card. In this case, it is preferable that the test table (300) be provided in the form of a disc.

[0148] The test board (TB) may have a structure having socket modules. Test pins are provided in the socket modules, and the socket modules are installed in the socket body. In this case, it is preferable that the test table (300) be provided in the shape of a square plate.

[0149] As shown in the bottom view of FIG. 9, the test board (TB) has test zones (TZ) arranged in a one-to-one correspondence with the electronic components arranged on the test table (300).

[0150] The test zones (TZ) correspond one-to-one with the electronic components (ED) loaded on the test table (300).

[0151] One test zone (TZ) is equipped with test pins (t) for electrically connecting to one electronic component.

[0152] The test pins (t) in one test zone (TZ) form a set of clusters that form the test zone (TZ) and are electrically connected to the electronic component (ED).

[0153] When the test board (TB) is a probe card, a set of test pins (t) is densely arranged in the test area (TZ). Here, the set of test pins (t) corresponds to terminals on an electronic component (ED). The test pins (t) on the probe card are also commonly referred to as probe pins.

[0154] In the case where the test board (TB) has a structure with a socket module, a set of test pins (t) are installed in one socket module, and one socket module forms one test zone (TZ). Therefore, when one socket module (22) is replaced, one test zone (TZ) is replaced.

[0155] For reliable testing to be performed, the test zone (TZ) and the electronic components must be aligned.

[0156] In order for the test area (TZ) and the electronic components to be aligned, the positions of the electronic components arranged on the test table (300) must be able to match the test area (TZ).

[0157] If the coordinates of the electronic component on the test table (300) on the XY plane do not match the coordinates of the test zone (TZ), a defect occurs in the electrical connection between the electronic component and the tester.

[0158] As shown in the conceptual example of FIG. 10, if an electronic component (ED) on the test table (300) is in an angular position having a rotation angle (Θ1) twisted in the Θ-axis direction with respect to the test zone (TZ), a failure occurs in the electrical connection between the electronic component (ED) and the tester. To prevent this, all test zones (TZ) of the test board (TB) and all electronic components (ED) on the test table (300) must be aligned.

[0159] The relocation mechanism (500) is provided to realize alignment between the test zone (TZ) and the electronic component.

[0160] According to the present embodiment, the electronic component (ED) is moved from the transport table (110) to the test table (300) by the second picker hand (310). During this process, an error in the position of the electronic component (ED) may occur due to an operating error or operating shock of the second picker hand (310).

[0161] The positions of the electronic components (ED) loaded onto the test table (300) by the second picker hand (310) on the XY plane or each position may be different, and the electronic components (ED) loaded onto the test table (300) and the test zones (TZ) of the test board (TB) may not coincide with each other.

[0162] It does not matter if the error tolerance between the electronic component (ED) and the test zone (TZ) is wide. However, the packaged semiconductor device requires a precision of within 30㎛, and in the case of the die or HBM, a precision of within 5㎛ is required.

[0163] In the present invention, when the second picker hand (310) moves electronic components (ED) from the transport table (110) to the test table (300), the electronic components (ED) are loaded into temporary zones and then relocated from the temporary zones to the fixed zones.

[0164] The temporary area may not be a set location, but any location where the electronic component (ED) is placed on the test table (300) by the second picker hand (310).

[0165] The temporary area is a location that is not set or fixed by the controller (800) and is arbitrarily determined by the operation of the second picker hand (310).

[0166] For example, when the second picker hand (310) places an electronic component (ED) on the test table (300), the area where the electronic component (ED) is placed becomes a temporary area.

[0167] Exaggerated Fig. 11 shows an example of a temporary zone (BZ) on a test table (300).

[0168] All temporary zones (BZ) can have their own positions on the X-axis, Y-axis, and Θ-axis.

[0169] The fixed position zone refers to the location where the electronic component (ED) and the test zone (TZ) coincide. The exaggerated figure 8 shows the relationship between the temporary zone (BZ) and the fixed position zone (RZ) on the test table (300).

[0170] The position zone (RZ) may be pre-set, but it may also be set to match the position and arrangement of the test zones (TZ) on the test board (TB) after the electronic components (ED) to be tested are loaded onto the test table (300).

[0171] The positioning zone (RZ) can be obtained from an image precisely scanned by a separate high-magnification camera attached to the test table (300) before the test operation of the handler (TH).

[0172] In Fig. 12, the temporary zone (BZ) may have errors in the X-axis direction, Y-axis direction, and Θ-axis direction with respect to the fixed zone (RZ).

[0173] A relocation mechanism (500) is provided to precisely relocate the position of an electronic component (ED) loaded on a test table (300) in a relocation space (RS).

[0174] The relocation mechanism (500) is provided to relocate the position of an electronic component (ED) loaded on a test table (300) by the second picker hand (310) from a temporary zone (BZ) to a fixed zone (RZ).

[0175] According to the present embodiment, the second picker hand (310) loads the electronic components (ED) to be tested, which are unloaded from the transport table (110), into a temporary zone (BZ). Then, a relocation mechanism (500) is utilized to move the electronic components (ED) in the temporary zone (BZ) to the designated zone (RZ).

[0176] As shown in the schematic diagram of FIG. 13, the relocation mechanism (500) includes a relocation picker (510), a relocation camera (520), and a picker elevator (530).

[0177] The relocation mechanism (500) can be fixedly mounted on the frame forming the skeleton of the handler (TH).

[0178] The repositioning picker (510) can grasp or release the electronic component (ED). The repositioning picker (510) can grasp the electronic component (ED) by vacuum pressure.

[0179] The repositioning picker (510) is fixed in a horizontal position in the X-axis and Y-axis directions.

[0180] The relocation camera (520) is positioned apart from the relocation picker (510).

[0181] The repositioning camera (520) is fixed in position in the horizontal direction, which is the X-axis and Y-axis direction.

[0182] A repositioning camera (520) is provided to photograph electronic components (ED).

[0183] The picker elevator (530) raises the relocation picker (510).

[0184] It is preferable that the picker elevator (530) be equipped with a lifting motor so as to precisely control the lifting speed or lifting distance of the repositioning picker (510).

[0185] As in the example of FIG. 14, the repositioning camera (520) photographs identification marks (M: M1, M2) on the electronic component (ED). The identification marks (M) may be arranged diagonally opposite each other.

[0186] However, the object photographed by the relocation camera (520) to relocate the electronic component (ED) does not need to be limited to the identification mark (M). The object photographed by the relocation camera (520) may be replaced with the corner of the electronic component (ED), the identification pad or identification pattern of the electronic component (ED), or other identifiable objects.

[0187] The relocation picker (510) and the relocation camera (520) are bundled into a single module and fixed. The mutual placement positions of the relocation picker (510) and the relocation camera (520) are fixed.

[0188] The moving mechanism (600) can move the test table (300) in the horizontal direction, which is the X-axis and Y-axis direction.

[0189] The moving mechanism (600) can rotate the test table (300) in the Θ-axis direction.

[0190] The moving mechanism (600) can move the test table (300) up and down in the Z-axis direction.

[0191] As shown in the schematic excerpt of FIG. 15, the moving mechanism (600) includes a rotary moving mechanism (610), a lifting moving mechanism (620), a first moving mechanism (640), and a second moving mechanism (660).

[0192] The rotary mover (610) rotates the test table (300) in the Θ-axis direction.

[0193] The test table (300) can be rotated by the rotary mover (610) so that the angular position of the electronic component (ED) in the Θ-axis direction can be adjusted.

[0194] The elevator (620) raises the test table (300).

[0195] The test table (300) is connected to the lifting mechanism (620) via a rotary moving mechanism (610).

[0196] When the test table (300) is raised by the lifting mechanism (620), the electronic components (ED) of the test table (300) come into contact with the test pins (t), thereby electrically connecting the electronic components (ED) to the tester. When the test table (300) is lowered by the lifting mechanism (620), the contact between the electronic components (ED) and the test pins (t) is released, and the test table (300) becomes capable of moving in a horizontal direction.

[0197] The first moving device (640) moves the test table (300) in the X-axis direction.

[0198] As the test table (300) is moved in the X-axis direction by the first moving device (640), the test table (300) can be selectively positioned in the relocation space (RS) and the test space (TS).

[0199] The second mover (660) moves the test table (300) in the Y-axis direction.

[0200] The first mover (640) and the second mover (660) move the test table (300) in a horizontal direction, so they can be grouped and named as horizontal movers.

[0201] The above-mentioned moving mechanism (600) has three functions.

[0202] The first function is to move the test table (300) between the relocation space (RS) and the test space (TS).

[0203] The second function is to electrically connect or disconnect electronic components (ED) to the tester.

[0204] The third function is for the relocation of electronic components (ED) in the relocation space (RS).

[0205] Since the repositioning picker (510) is fixed, the test table (300) moves in the horizontal X-axis and Y-axis directions or rotates in the Θ-axis direction to adjust the position of the electronic component (ED) on the horizontal plane.

[0206] Depending on the implementation, the test table (300) is raised and lowered during the relocation process of the electronic component (ED), thereby enabling the relocation picker (510) to grasp or release the electronic component (ED).

[0207] Here, the operation during the relocation of electronic components (ED) is explained.

[0208] As shown in Fig. 8, the temporary zone (BZ) of the electronic component (ED) may differ from the fixed zone (RZ) in the X-axis, Y-axis, and Θ-axis directions.

[0209] The relocation camera (520) photographs the electronic component (ED) on the test table (300) and identifies the temporary zone (BZ) through the location of the identification mark (M).

[0210] When the temporary zone (BZ) is identified, the first mover (640) and the second mover (660) operate to position the center of the temporary zone (BZ) below the relocation picker (510), and the picker elevator (530) operates to lower the relocation picker (510).

[0211] When the lowered repositioning picker (510) adsorbs and grasps the electronic component (ED) of the test table (300) by vacuum pressure, the picker elevator (530) operates to raise the repositioning picker (510). Afterward, the first mover (640) and the second mover (660) operate to align the center of the position zone (RZ) with the center of the electronic component (ED) grasped by the repositioning picker (510), and the rotary mover (610) operates to align the electronic component (ED) with the position zone (RZ). In this state, the picker elevator (530) operates to lower the repositioning picker (510), thereby allowing the electronic component (ED) grasped by the repositioning picker (510) to settle in the position zone (RZ).

[0212] When the electronic component (ED) is fixed to the test table (300) by vacuum pressure applied through the vacuum hole (h) while the electronic component (ED) is seated in the positioning zone (RZ), the repositioning picker (510) releases the grip of the electronic component (ED). Then, the repositioning picker (510) rises and begins repositioning the next electronic component (ED).

[0213] The cooler (700) supplies cooling fluid to the test table (300) and then recovers it.

[0214] Since the cooler (700) is an important feature of the present invention, it will be explained in a different section later.

[0215] The controller (800) controls the components necessary for the proper operation of the handler (TH), such as the transport shuttle (100), the first picker hand (210), the second picker hand (310), the vacuum (400), the relocation mechanism (500), the moving mechanism (600), and the cooler (700).

[0216] In particular, the controller (800) controls the component heating heater (310) and the cooler (700) to control the temperature of the test table (300), thereby controlling the temperature of the electronic component (ED) on the upper surface of the test table (300).

[0217] Next, the method of operation of the handler (TH) according to the present invention will be explained based on the logistics of electronic components (ED).

[0218] In the unloading section (LU), the first picker hand (210) loads electronic components (ED) to be tested onto a transport table (110) in the first area (A1).

[0219] When all the electronic components (ED) are loaded onto the transport table (110), the transport shuttle (100) operates and moves the transport table (110) to the second area (A2).

[0220] The second picker hand (310) unloads electronic components (ED) from the transport table (110) in the second area (A2) and moves them to the test table (300) in the relocation area (RS). At this time, the locations of the electronic components (ED) loaded onto the test table (300) by the second picker hand (310) are temporary zones (BZ).

[0221] When all the electronic components (ED) to be tested are loaded onto the test table (300), the controller (800) operates the relocation mechanism (500) and the moving mechanism (600) to relocate the electronic components (ED) from the temporary zones (BZ) to the fixed zones (RZ).

[0222] When the rearrangement of electronic components (ED) on the test table (300) is completed, the moving mechanism (600) operates to move the test table (300) to the test space (TS). Afterwards, the lifting mechanism (620) operates to raise the test table (300) toward the test board (TB) so that the electronic components (ED) are electrically connected to the tester.

[0223] When the testing of the electronic components (ED) is finished, the test table (300) is moved to the relocation section (RP) by the moving mechanism (600). Then, the second picker hand (310) moves the electronic components (ED) that have completed testing to the transport tray (110) in the second area (A2), and the transport tray (110) filled with the electronic components (ED) that have completed testing moves to the first area (A1). Subsequently, the first picker hand (210) unloads the electronic components (ED) that have completed testing from the transport table (110) and loads them onto an empty customer tray.

[0224] While the handler (TH) is operating, the controller (800) controls the component heating heater (310) and the cooler (700) to maintain the temperature of the test table (300) at a temperature suitable for the test conditions.

[0225] Based on the basic operation method described above, the electronic component (ED) is supplied to the tester for testing, and is retrieved after the test is completed.

[0226] <Detailed explanation of the chiller>

[0227] FIG. 16 is a configuration diagram of a cooler (700) that can be applied to the handler (TH) of FIG. 1.

[0228] The cooler (700) includes a manifold (710), a chiller (720), a supply pipe (730), a return pipe (740), a bypass pipe (750), a bypass valve (760), and a cold air control heater (770), etc.

[0229] The manifold (710) has an entry path (711) corresponding to the inlet (321) of the cooling channel (320) and an exit path (712) corresponding to the outlet (322) of the cooling channel (320).

[0230] The manifold (710) is made of a metallic material and is connected to the test table (300).

[0231] The chiller (720) supplies cooling fluid to the manifold (710).

[0232] The cooling fluid supplied to the manifold (710) by the chiller (720) is supplied to the test table (300).

[0233] The chiller (720) recovers cooling fluid from the manifold (710).

[0234] The cooling fluid exiting the test table (300) is input into the manifold (710), and the chiller (720) recovers the cooling fluid from the manifold (710).

[0235] The supply pipe (730) provides a passage for the cooling fluid to move from the chiller (720) to the entry path (711) of the manifold (710).

[0236] The recovery pipe (740) provides a passageway to move from the exit (712) of the manifold (710) to the chiller (720).

[0237] The bypass pipe (750) connects the supply pipe (730) and the return pipe (740).

[0238] The bypass valve (750) opens and closes the bypass pipe (760).

[0239] When the bypass valve (750) is opened, a portion of the cooling fluid supplied from the chiller (720) is returned to the chiller (720) through the bypass pipe (750), and the remainder of the cooling fluid is supplied to the test table (300).

[0240] The bypass valve (760) is provided as a proportional control valve to control the flow rate passing through the bypass valve (750).

[0241] The controller (800) controls the flow rate entering the cooling path (320) from the chiller (720) by closing or opening the bypass valve (760).

[0242] The controller (800) more precisely controls the flow rate entering the cooling path (320) from the chiller (720) by controlling the flow rate passing through the bypass valve (760).

[0243] Even if the chiller (720) continuously supplies the same flow rate, the flow rate supplied to the test table (300) is controlled by controlling the flow rate passing through the bypass valve (760).

[0244] When the flow rate supplied to the test table (300) is controlled, the temperature of the test table (300) is also controlled more precisely.

[0245] The chiller (720) may stop operating on its own if the supplied flow rate drops below a critical value. In this case, it becomes difficult to respond quickly if there is a need to control the temperature through the chiller (720).

[0246] The bypass valve (760) contributes to preventing the operation of the chiller (720) from stopping.

[0247] In particular, for high-temperature tests, the flow rate supplied from the chiller (720) to the test table (300) needs to be significantly reduced. In this case, the controller (800) can increase the flow rate passing through the bypass valve (760) to prevent the chiller (720) from stopping operation.

[0248] The cold air control heater (770) controls the temperature of the cooling fluid moving through the entryway (711) of the manifold (710).

[0249] The cold air control heater (770) heats the cooling fluid moving through the entrance (711).

[0250] The heat from the cold air control heater (770) is transferred to the cooling fluid after being conducted through the manifold (710).

[0251] The cold air control heater (770) is connected to the manifold (710).

[0252] The controller (800) controls the cold air control heater (770) to control the temperature of the cooling fluid input into the cooling channel (710) through the entry channel (711).

[0253] For example, in a situation where a -40 degree cooling fluid is required at the test table (300) and the chiller (720) supplies a -60 degree cooling fluid, the controller (800) can increase the output of the cold air control heater (770) to convert the -60 degree cooling fluid into a -40 degree cooling fluid.

[0254] For example, in a situation where a -30 degree cooling fluid is required at the test table (300) and the chiller (720) supplies a -70 degree cooling fluid, the controller (800) can increase the output of the cold air control heater (770) to convert the -60 degree cooling fluid to a -40 degree cooling fluid.

[0255] For example, if a situation arises where a cooling fluid of -40 degrees is required at the test table (300) and a cooling fluid of -30 degrees is required, the controller (800) can increase the output of the cold air control heater (770) to quickly switch the cooling fluid of -40 degrees to a cooling fluid of -30 degrees.

[0256] For example, if a situation arises where a cooling fluid of -30 degrees is required at the test table (300) and a cooling fluid of -40 degrees is required, the controller (800) can lower the output of the cold air control heater (770) to quickly switch the cooling fluid of -30 degrees to a cooling fluid of -40 degrees.

[0257] As shown in Fig. 17, the cold air control heater (770) can be positioned higher than the entrance (711).

[0258] FIG. 18 shows an experimental example in which there is no cold air control heater (770).

[0259] The proximity region (G) close to the manifold (710) has a lower temperature than the remaining regions.

[0260] When attempting a low-temperature test of -40 degrees, the target deviation of the upper surface of the test table (300) is -1 to -1.5 degrees, but the proximity area (G) may have a deviation that deviates from the target deviation.

[0261] If the cold air control heater (770) is positioned higher than the entrance so as to be close to the upper surface of the test table (300), the temperature difference on the upper surface of the test table (300) can be reduced.

[0262] However, according to the arrangement shown in Fig. 17, the design must avoid interference with other structures located in the upper direction of the test table (300) during the process of the test table (300) being raised and lowered. This makes the design of the handler (TH) difficult.

[0263] As shown in Fig. 19, the cold air control heater (770) can be positioned lower than the entrance (711).

[0264] According to the arrangement of Fig. 19, the cold air control heater (770) does not interfere with other structures in the upper direction of the test table (300), so the design for the handler (TH) is made easier.

[0265] Since the chiller (720) occupies a large space, it can be provided separately from the handler (TH).

[0266] As shown in FIG. 20, the cooler (700) in the handler (TH) may be composed only of a manifold (710), supply pipe (730), return pipe (740), bypass pipe (750), bypass valve (760), and cold air control heater (770), excluding the chiller (720), or may be composed only of a manifold (710) and a cold air control heater (770).

[0267] <Additional Details>

[0268] A test table (300) such as Fig. 21 can be applied to the handler (TH).

[0269] Two cooling channels (320A, 320B) are formed in the test table (300).

[0270] The two cooling channels (320A, 320B) do not cross each other.

[0271] The two cooling channels (320A, 320B) each have an inlet (321a, 321b) and an outlet (322a, 322b).

[0272] FIG. 22 shows a manifold (710) corresponding to the test table (300) of FIG. 21.

[0273] The manifold (710) has two entry roads (711a, 711b) and two exit roads (712a, 712b).

[0274] FIG. 23 is a configuration diagram of a cooler (700) to which the test table (300) of FIG. 21 and the manifold (710) of FIG. 22 are applied.

[0275] In the cooler (700) of Fig. 23, a supply branch pipe (781) and a recovery connecting pipe (782) are added.

[0276] The supply branch pipe (781) branches the supply pipe (730) into two.

[0277] The cooling fluid supplied from the chiller (720) to the test table (300) is separated in the supply branch pipe (781) and divided into two entry paths (711a, 711b).

[0278] The recovery connecting pipe (782) connects the recovery pipes (740) that are branched into two.

[0279] The cooling fluid recovered from the test table (300) through two exit paths (712a, 712b) is combined in the recovery coupling pipe (782) and transferred to the chiller (720).

[0280] FIG. 24 shows another example of a cooler (700).

[0281] In the cooler (700) of Fig. 24, a cold air control heater (770) is connected to a point of the supply pipe (730) instead of the manifold (710).

[0282] In the case of the cooler (700) of Fig. 24, the manifold (710) may also be omitted, and the cooler (700) of the handler (TH) may be composed only of a cold air control heater (700).

[0283] One of the important features of the present invention is to cool the cooling fluid moving through the entry path (711) of the manifold (700), so it is also desirable to divide the manifold (710A) having the entry path (711) and the manifold (710) having the exit path (712) as shown in FIG. 25 so that thermal movement between them is blocked.

[0284] Although the above descriptions show the cold air control heater (770) positioned toward the entrance (711), it may be installed widely across the entrance (711) and the exit (712).

[0285] The embodiments described above are merely preferred examples of the present invention and may have various applications. Therefore, the present invention should not be understood as being limited only to the contents described above. Instead, the scope of the present invention should be understood as the separately described claims and their equivalents.

Claims

1. A test table having electronic components arranged on its upper surface and a cooling channel through which a cooling fluid for cooling the electronic components moves; A cooler that supplies cooling fluid to the above test table and then recovers it; and A controller that controls the above cooler to regulate the temperature of the above test table; comprising, The above cooler A manifold having an entry path corresponding to the inlet of the cooling channel and an exit path corresponding to the outlet of the cooling channel; A supply pipe that provides a passage for the cooling fluid to move from the chiller to the inlet path, which supplies the cooling fluid to the above manifold and recovers the cooling fluid from the above manifold; A recovery pipe providing a passage through which a cooling fluid moving from the above exit to the above chiller moves; and A cold air control heater coupled to the above manifold and for controlling the temperature of a cooling fluid moving through the above entryway; comprising, The above controller controls the cold air control heater to regulate the temperature of the cooling fluid input into the cooling channel through the entry path. Handler for testing electronic components.

2. In Paragraph 1, The above cooling channel is formed to have a first movement pattern in which a cooling medium entering through the above entry channel wraps around the outer perimeter of the test table toward the center, and a second movement pattern in which it is adjacent to the first movement pattern at the center and leads to the above exit channel. The first movement pattern and the second movement pattern are interconnected in the central region. Handler for testing electronic components.

3. In Paragraph 1, A bypass pipe connecting the supply pipe and the return pipe; and A bypass valve for opening and closing the above-mentioned bypass pipe; further comprising, The above controller controls the flow rate entering the cooling channel by closing or opening the bypass valve. Handler for testing electronic components.

4. In Paragraph 3, The above bypass valve is equipped as a proportional control valve to regulate the flow rate passing through the bypass valve. Handler for testing electronic components.

5. In Paragraph 1, The above cold air control heater is positioned at a location higher than the above access road. Handler for testing electronic components.

6. In Paragraph 1, The above cold air control heater is positioned at a location lower than the above access road. Handler for testing electronic components.

7. In Paragraph 1, The above test table further includes a plurality of temperature sensors for detecting temperature, and The above controller checks the temperature values ​​detected by the plurality of temperature sensors and controls the cold air control heater. Handler for testing electronic components.

8. In Paragraph 1, The above test table is A component heating heater for heating electronic components on the upper surface; and It further includes a plurality of temperature sensors for detecting temperature, and The above controller checks the temperature values ​​detected by the plurality of temperature sensors and controls the above component heating heater and cold air control heater. Handler for testing electronic components.

9. In Paragraph 8, The above-mentioned component heating heater is provided in a plate shape. Handler for testing electronic components.

10. In Paragraph 1, There are two of the above cooling channels, the above entry channels, and the above exit channels, and A supply branch pipe that branches the above supply pipe into two, causing the supplied cooling fluid to be divided and moved into two of the above entry paths; and It further includes a recovery coupling pipe that combines two branched recovery pipes to allow the cooling fluid recovered from the two aforementioned exit paths to be combined and moved to the chiller; Handler for testing electronic components.

11. In Paragraph 1, The above manifold is coupled to the above test table Handler for testing electronic components.

12. A test table having electronic components arranged on its upper surface and a cooling channel through which a cooling fluid for cooling the electronic components moves; A cooler that supplies cooling fluid to the above test table and then recovers it; and A controller that controls the above cooler to regulate the temperature of the above test table; comprising, The above cooler A cold air control heater for controlling the temperature of a cooling fluid moving to the inlet of the cooling channel; comprising The above controller controls the cold air control heater to regulate the temperature of the cooling fluid input into the cooling channel. Handler for testing electronic components.

13. In Paragraph 12, The above cooler A manifold having an entry path corresponding to the inlet of the cooling channel and an exit path corresponding to the outlet of the cooling channel; further comprising, The above cold air control heater is coupled to the above manifold. Handler for testing electronic components.

14. In Paragraph 12, The above cooler A first manifold having an entry path corresponding to the inlet of the above cooling channel; and A second manifold having an exit path corresponding to the outlet of the above cooling channel; further comprising, The above cold air control heater is coupled to the above first manifold. Handler for testing electronic components.

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