Method for setting up a data centre or server room or a part thereof

Abstract

The invention relates to a method for setting up a data centre or server room, or a part thereof, in which the thermal load of electronic components is dissipated by means of air and an internal cooling liquid, wherein the internal cooling liquid is contained in an isolated internal circuit which can transfer heat to an external cooling-liquid system via a liquid-to-liquid heat exchanger, the method comprising: manufacturing an assembly comprising an equipment base, a rack for housing electronic components, the internal circuit, wherein a cooling element forming part of the internal circuit is arranged on the rack, the liquid-to-liquid heat exchanger, a pump for circulating the internal cooling liquid in the internal circuit, an air-to-liquid heat exchanger which is arranged on the rack and can be connected to an external cooling-liquid system, and a control cabinet in which electrical components of the assembly are electrically connected for connection to a main power supply; transporting the manufactured assembly into the building of the data centre or server room; and connecting the assembly to an external cooling-liquid system present in the building, such that the liquid-to-liquid heat exchanger forms part of an external coolant circuit and such that the air-to-liquid heat exchanger forms part of an external coolant circuit.

Description

[0001] Methods for setting up a data center or server room or part thereof

[0002] The invention relates to a method for setting up a data center or server room or part thereof.

[0003] To meet the increasing demand for computing power, driven in particular by AI-based services, advanced analytics, and rapidly advancing digitalization, processor capacity in data centers and server rooms is experiencing strong growth. At the same time, server density can increase. This leads to a rising heat load per rack; in some cases, the heat load per rack exceeds 80 kW. This necessitates cooling solutions that can efficiently manage this heat while ideally requiring as little space as possible.

[0004] Systems exist in which the heat load of electronic components is also dissipated using a coolant. In these systems, cooling elements through which the coolant flows are positioned in close proximity to the heat sources on the racks. This close proximity ensures rapid and precise heat transfer, thereby optimizing cooling efficiency. The cooling process can be facilitated, in particular, by a network of small pipes that direct the fluid straight to the processors. Once the heat has been absorbed by the coolant, it is dissipated and circulated to a recooler.

[0005] It is also known to include an additional air cooling component in systems with liquid cooling.

[0006] However, such solutions with liquid and air cooling have a disadvantage in that the complexity of the installations is increased compared to solutions using only air cooling, which also increases the risk of errors, particularly during assembly. The object of the invention is to provide a method for setting up a data center or server room, or a part thereof, in which the heat load of electronic components is dissipated by air and coolant, and which is advantageous compared to known methods.

[0007] The problem is solved by a method according to claim 1. Further advantageous embodiments are the subject of the dependent claims or are described below.

[0008] The inventive method provides that the assembly, which includes the inner circuit, is not manufactured in the data center or server room to be set up, but rather beforehand, at another location, typically a factory.

[0009] Manufacturing the internal cooling loop in a factory ensures higher piping quality. Access to the pipes and lighting conditions are generally better in a factory than in the data center or server room being set up. Furthermore, a factory offers better opportunities for cleaning and testing the piping. The best tools are also readily available. An error in the design of the internal cooling loop, such as incorrect components or improperly sized pipes and lines, can cause the server's cooling process to fail, rendering the server unusable. During installation, it is crucial not only to prevent leaks in the internal cooling circuit but also to achieve a very high level of piping cleanliness. Contaminants in the cooling fluid can also lead to cooling system malfunctions.This can already apply to particles larger than 25 microns. Such error risks are significantly reduced by the method according to the invention.

[0010] Commissioning in the data center or server room to be set up using the method according to the invention involves significantly less installation and / or logistical effort for the installer, thereby considerably reducing the risk of errors. This results in savings in the number of skilled personnel required in the data center or server room to be set up, and thus a reduction in costs. Planning the on-site installation is also significantly simplified. Overall, the method according to the invention leads to increased efficiency and thus a reduction in costs.

[0011] The method according to the invention is particularly advantageous when the data center or server room is to be set up in geographical regions where there is little qualified personnel and little technically developed infrastructure. Especially in such situations, the method according to the invention enables significantly better time planning and saves on specialist personnel who would otherwise have to travel from afar.

[0012] Preferably, all components of the assembly are mounted on the device base. The device base is preferably a frame construction. All components can be delivered pre-assembled and ready for operation.

[0013] The fluid used in the external coolant system is preferably water. The entire water supply is preferably provided via a central supply line.

[0014] Preferably, the assembly comprises at least two racks.

[0015] Preferably, the assembly comprises a coolant distribution unit, which includes the liquid-liquid heat exchanger and the pump for moving the internal coolant in the internal circuit.

[0016] Preferably, the coolant distribution unit includes a flow rate and temperature differential control system. Preferably, the cooling element is designed as a cooling plate, below which an electronic component can be arranged in the rack.

[0017] Preferably, the electronic component is a processor.

[0018] Preferably, the air-liquid heat exchanger includes a fan, wherein the air-liquid heat exchanger can move air out of the interior of the rack and thereby cool the air.

[0019] Preferably, the air-liquid heat exchanger is arranged on a door located at the rear of a rack.

[0020] Preferably, the fan is an EC fan.

[0021] Preferably, all elements of the assembly are hydraulically and electrically connected and ready for operation.

[0022] Preferably, the heat load dissipation capacity is at least 20 kW.

[0023] The invention is explained with reference to Figure 1, which is a schematic representation of an example of an assembly produced according to the invention.

[0024] The assembly comprises a frame structure 1 as a device base, three racks 2 for housing electronic components, the internal circuit 3, wherein cooling elements 4 are arranged on the racks 2 and are part of the internal circuit 3, a liquid-liquid heat exchanger 5, a pump 6 for circulating the internal coolant in the internal circuit 3, air-liquid heat exchangers 7 arranged on the racks which can be connected to an external cooling water system, and a control cabinet 8 in which electrical components of the assembly are electrically wired for connection to a main electrical supply. The entire water supply is provided via a central supply line.

[0025] 9. The assembly, i.e. all components, can be delivered pre-assembled on the frame structure 1, ready for operation.

Claims

Patent claims 1. A method for setting up a data center or server room, or part thereof, in which the heat load of electronic components is dissipated by air and an internal coolant, wherein the internal coolant is contained in an insulated inner circuit that can transfer heat to an external coolant system via a liquid-liquid heat exchanger, comprising a manufacturing of an assembly comprising an equipment base, a rack for holding electronic components, the inner circuit, wherein a cooling element is arranged on the rack which is part of the inner circuit, the liquid-liquid heat exchanger, a pump for moving the internal coolant in the inner circuit, an air-liquid heat exchanger arranged on the rack which can be connected to an external coolant system, and a control cabinet in which electrical components of the assembly are electrically connected.for connection to a main electrical supply, transport of the manufactured assembly into the data center or server room building, connection of the assembly to an external coolant system present in the building, so that the liquid-liquid heat exchanger is part of an external coolant circuit and so that the air-liquid heat exchanger is part of an external coolant circuit.

2. Method according to claim 2, characterized in that all elements of the assembly are installed on the device base.

3. Method according to one of the preceding claims, characterized in that the assembly comprises at least two racks.

4. Method according to one of the preceding claims, characterized in that the assembly comprises a coolant distribution unit comprising the liquid-liquid heat exchanger and the pump for moving the internal coolant in the internal circuit.

5. Method according to claim 4, characterized in that the coolant distribution unit comprises a control of the flow rate and the temperature difference.

6. Method according to one of the preceding claims, characterized in that the cooling element is designed as a cooling plate, below which an electronic component can be arranged in the rack.

7. Method according to one of the preceding claims, characterized in that the electronic component is a processor.

8. Method according to one of the preceding claims, characterized in that the air-liquid heat exchanger comprises a fan, wherein the air-liquid heat exchanger can move air out of the interior of the rack and thereby cool the air.

9. Method according to claim 8, characterized in that the air-liquid heat exchanger is arranged on a door which is arranged at the rear of a rack.

10. Method according to one of claims 8 to 9, characterized in that the fan is an EC fan.

11. Method according to one of the preceding claims, characterized in that all elements of the assembly are hydraulically and electrically connected and ready for operation.

12. Method according to one of the preceding claims, characterized in that the heat load dissipation capacity is at least 20 kW. - 7 -

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