Room-temperature-curable conductive silicone paste composition

Abstract

The present invention relates to a room-temperature-curable conductive silicone paste composition. More specifically, the present invention relates to a room-temperature-curable conductive silicone paste composition, which is used as an adhesive for various electronic device products, is rapidly cured at room temperature, provides excellent adhesion, and improves both electrical conductivity and flexibility, and thus can enhance the performance and durability of electronic devices.

Description

Room temperature curing conductive silicone paste composition

[0001] The present invention relates to a room-temperature curable conductive silicone paste composition. More specifically, the present invention relates to a room-temperature curable conductive silicone paste composition that is used as a conductive adhesive for various electronic devices, cures rapidly at room temperature, provides excellent adhesion, and can improve the performance and durability of electronic devices by simultaneously improving flexibility while enhancing electrical conductivity.

[0002] Currently, various adhesives are essential in the electronics industry, and among them, silicone paste is widely utilized as an adhesive for printed circuit boards (PCBs), sensors, and other electronic components. Silicone paste can perform various functions, such as bonding components, forming conductive paths, fixing components, and providing waterproof coatings.

[0003] Silicone is a type of thermosetting resin that possesses various excellent physical and chemical properties. In particular, silicone exhibits superior heat resistance, chemical resistance, moisture resistance, and mechanical strength, as well as excellent electrical insulation. Thanks to these characteristics, silicone paste contributes to enhancing the reliability and durability of electronic products.

[0004] Generally, the degree of curing of silicone paste is closely related to electrical conductivity, and there are known technologies where electrical conductivity improves as the degree of curing increases. However, as the degree of curing and electrical conductivity increase, flexibility decreases, which has the disadvantage of potentially negatively impacting the durability and reliability of electronic devices in various environments. In particular, in environments where vibration or shock occurs, the hardness of the cured silicone paste can cause cracks or breakage.

[0005] Therefore, there is an urgent need for a room-temperature curing conductive silicone paste composition that can be used as an adhesive for various electronic products, cures rapidly at room temperature, provides excellent adhesion, and improves the performance and durability of electronic devices by simultaneously enhancing electrical conductivity and flexibility.

[0006] The present invention aims to solve the problem of providing a room-temperature curable conductive silicone paste composition that is used as an adhesive for various electronic devices, cures rapidly at room temperature, provides excellent adhesion, and improves the performance and durability of electronic devices by simultaneously improving flexibility while enhancing electrical conductivity.

[0007] To solve the above problem, the present invention,

[0008] A room temperature curable conductive silicone paste composition is provided, characterized by comprising: a base resin composed of a silicone resin having the structure of Chemical Formula 1 below; conductive particles; and an alkoxysilane curing agent.

[0009] [Chemical Formula 1]

[0010]

[0011] R1 and R2 are each independently selected from at least one group consisting of a hydrocarbon group having 1 to 10 carbon atoms, a divalent oxygen, and a substituted or unsubstituted divalent siloxane group, and n is 2 or more.

[0012] Herein, a room temperature curable conductive silicone paste composition is provided, characterized in that, based on the total weight of the composition, the base resin is 10 to 20 weight%, the conductive particles are 65 to 85 weight%, and the alkoxysilane curing agent is 0.1 to 5 weight%.

[0013] In addition, a room temperature curing conductive silicone paste composition is provided, characterized in that the weight-average molecular weight of the silicone resin is 1,200 to 10,000 g / mol.

[0014] In addition, a room temperature curing conductive silicone paste composition is provided, characterized in that the viscosity of the silicone resin is 200 to 800 mPa.s.

[0015] Furthermore, the present invention provides a room temperature curable conductive silicon paste composition characterized in that the conductive particles are composed of silver (Ag) or a silver-copper alloy (AgCu) material.

[0016] In addition, the conductive particles have a specific surface area of ​​2.0 m² 2 A room temperature curable conductive silicone paste composition is provided, characterized by being composed of plate-shaped particles of 1 / g or more.

[0017] Here, approximately 90% of the cumulative conductive particles (D 90 The present invention provides a room temperature curable conductive silicone paste composition characterized by having a diameter of 20 micrometers (μm) or less and an aspect ratio of 1.0 to 5.3.

[0018] Meanwhile, the above composition further comprises a dispersant for dispersing conductive particles, and the dispersant comprises oleic acid or stearic acid, thereby providing a room temperature curable conductive silicone paste composition.

[0019] Herein, a room temperature curable conductive silicone paste composition is provided, characterized in that the dispersant is contained in a range of 0.1 to 1.0 weight% relative to the weight of the conductive particles.

[0020] In addition, the above alkoxysilane curing agent provides a room temperature curing type conductive silicone paste composition characterized by having the structure of Chemical Formula 3 below.

[0021] [Chemical Formula 3]

[0022]

[0023] Herein, a room temperature curable conductive silicone paste composition is provided, characterized in that in the above chemical formula 3, one or more of R3 to R6 are alkoxy groups, and the remainder are each independently acrylate groups or epoxy groups.

[0024] In addition, the above alkoxysilane curing agent is an alkoxysilane in which an alkoxy group is introduced to at least two of the functional groups R3 to R6 in Formula 3, thereby providing a room temperature curing type conductive silicone paste composition.

[0025] In addition, the above curing agent provides a room temperature curing conductive silicone paste composition characterized in that an alkoxy group is introduced to two or three of the functional groups R3 to R6 in Chemical Formula 3, and an acrylate group is introduced to the remaining functional groups.

[0026] Meanwhile, the above composition further comprises ceramic particles; and the ceramic particles comprise at least one type from the group consisting of silica, alumina, and nano-fumed silica, thereby providing a room-temperature curable conductive silicone paste composition.

[0027] Here, the present invention provides a room temperature curable conductive silicon paste composition characterized in that the ceramic particles are a mixture of nano-fumed silica and micro-silica.

[0028] In addition, a room temperature curable conductive silicone paste composition is provided, characterized in that the ceramic particles are in the range of 0.1 to 2.0 weight% based on the total weight of the composition.

[0029] And, the above composition further comprises a catalyst; wherein the catalyst comprises at least one of the group consisting of dibutyltin daraurate, dibutyltin diacetate, and amine-based catalysts, thereby providing a room temperature curable conductive silicone paste composition.

[0030] In addition, the above catalyst is mixed with an alcohol-based solvent to provide a room-temperature curable conductive silicone paste composition.

[0031] Furthermore, a room temperature curable conductive silicone paste composition is provided, characterized in that the catalyst is in the range of 3 to 10 weight percent based on the total weight of the composition.

[0032] According to the room-temperature curable conductive silicone paste composition of the present invention, by applying a silicone resin having a silicon-oxygen ring structure as a base resin and a curing agent having an alkoxy group functional group introduced, the electrical conductivity increases with increasing curing degree and flexibility is improved, thereby preventing the occurrence of cracks caused by external shock or vibration, and thus improving the performance and durability of electronic devices.

[0033] In addition, according to the room-temperature curable conductive silicone paste composition of the present invention, chemical compatibility with silicone resin is improved by using a combination of functional groups of the curing agent, so adhesive strength can be effectively improved without using a separate adhesive thickener, and excellent electrical conductivity can be achieved by inducing close contact between conductive particles during the curing reaction with the silicone resin.

[0034] In addition, according to the room temperature curing conductive silicone paste composition of the present invention, the specific surface area of ​​the conductive particles is 2.0 m² 2 By using plate-shaped metal particles of 1 / g or more, it is possible to achieve excellent electrical conductivity while improving flexibility.

[0035] Hereinafter, preferred embodiments of the present invention will be described in detail. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided to ensure that the disclosed content is thorough and complete, and to ensure that the concept of the invention is sufficiently conveyed to those skilled in the art.

[0036] The room temperature curable conductive silicone paste composition according to the present invention may include a base resin comprising a silicone resin having a silicon-oxygen ring structure, conductive particles, and a curing agent.

[0037] The room-temperature curable conductive silicone paste composition according to the present invention uses a silicone resin (Polyorganosiloxane) as the base resin. Generally, silicone resin is a polymer having a structure in which silicon atoms (Si) and oxygen atoms (O) are repeatedly connected, and it can exist in various forms such as silicone rubber, silicone oil, and silicone resin, and possesses excellent heat resistance, elasticity, flexibility, and chemical resistance.

[0038] As the above base resin, the silicone resin having a silicon-oxygen ring structure may have the structure of [Chemical Formula 1] below, and the structure of Chemical Formula 1 may be used alone or in combination of two or more types.

[0039]

[0040] In the above chemical formula 1, R1 and R2 are each independently selected from at least one group consisting of a hydrocarbon group having 1 to 10 carbon atoms, a divalent oxygen, and a substituted or unsubstituted divalent siloxane group, and n is 2 or more, for example, an integer from 2 to 10.

[0041] For example, the silicone resin of [Chemical Formula 1] above may have the structure of [Chemical Formula 2] below.

[0042]

[0043] Referring to Chemical Formulas 1 and 2, the silicone resin as the base resin of the present invention has a structure ((Si-O)n) in which silicon (Si) atoms and oxygen (O) atoms are alternately connected, and this structure forms a siloxane backbone that forms a ring structure of silicon and oxygen. In addition, two functional groups R1 and R2, which are the same or different, are introduced to each silicon (Si) atom constituting the siloxane backbone.

[0044] Functional groups R1 and R2 introduced into the silicone resin as a base resin can induce a condensation reaction with ambient moisture. A condensation reaction refers to a chemical reaction in which two or more molecules combine to form a larger molecule, generally releasing a smaller molecule.

[0045] Here, R1 and R2 may each independently include at least one selected from the group consisting of hydrocarbon groups such as alkyl groups such as methyl, ethyl, propyl, butyl groups; phenyl groups; alkoxy groups such as methoxy, ethoxy groups; divalent oxygen and substituted or unsubstituted divalent siloxane groups.

[0046] The room-temperature curable conductive silicone paste composition according to the present invention has a silicone resin having the structure of Formula 1 as a base resin, thereby allowing oxygen atoms constituting the silicone resin to be easily exposed to the outside so that a condensation reaction can be easily carried out, and thereby effectively improving the flexibility, mechanical properties, adhesion, and stability of the paste. In addition, conductive particles can be uniformly contained within the silicon-oxygen ring structure of the silicone resin, so electrical conductivity can be improved.

[0047] The weight-average molecular weight of the silicone resin used as a base resin may be in the range of 1,200 to 10,000 g / mol. If the molecular weight of the silicone resin is less than 1,200 g / mol, the curing between the functional groups of the curing agent is accelerated first, which may result in a decrease in electrical conductivity, whereas if the molecular weight of the silicone resin is greater than 10,000 g / mol, the viscosity increases, which may cause problems such as difficulty in the manufacturing process and a longer curing time.

[0048] In addition, the viscosity of the silicone resin as a base resin may be in the range of 200 to 800 mPa.s. If the viscosity of the silicone resin is less than 200 mPa.s, the mechanical strength of the paste produced therefrom is reduced, and adhesive strength and durability cannot be sufficiently realized. On the other hand, if the viscosity of the silicone resin exceeds 800 mPa.s, the viscosity increases, making it difficult to mix with other components during the manufacturing process, and there is a problem in that flexibility decreases during curing, which can easily cause cracking or breakage due to external pressure and vibration.

[0049] The room-temperature curable conductive silicone paste composition according to the present invention has a specific surface area of ​​2.0 m² to improve electrical conductivity. 2 It may include conductive particles with a content of 1 / g or more. These conductive particles can maximize power efficiency and reduce heat generation by minimizing electrical resistance within the silicon paste composition of the present invention, thereby preventing performance degradation or damage to electronic devices.

[0050] Conductive particles can be composed of metals, such as silver (Ag) or silver (Ag) alloy materials like silver-copper alloy (AgCu), which have excellent electrical conductivity and can optimize electrical connections. Additionally, the size of the conductive particles can be controlled to a micro size, which allows for maximizing conductivity while maintaining adhesion between fine components.

[0051] In particular, it is preferable that the conductive particles constituting the room-temperature curable conductive silicone paste composition according to the present invention consist of plate-shaped particles. Plate-shaped particles refer to particles that are flat and thin like a plate, and particles of this shape are effective in improving electrical conductivity by increasing the contact area between conductive particles compared to spherical particles.

[0052] In this way, when the conductive particles consist of plate-shaped particles, approximately 90% of the cumulative amount of the particles (D 90 ) is 20 micrometers (μm) or less, and the aspect ratio can be configured in the range of 1.0 to 5.3. Here, the diameter of the conductive particle refers to the diameter of a sphere converted to have the same volume, and the cumulative 90% diameter (D 90 ) represents the diameter of the remaining particles excluding the largest or smallest 10% of particles in the particle size distribution.

[0053] In addition, the specific surface area of ​​the conductive particles having a plate-like structure is 2.0 m² 2 It may be composed of / g or more. If, the specific surface area of ​​the conductive particle is 2.0 m² 2 If it is less than / g, the surface area per unit mass of the particle increases excessively, so the hardness of the paste increases and the flexibility may decrease.

[0054] Conductive particles may be included in a range of 65 to 85 weight percent based on the total weight of the silicone paste composition according to the present invention. If the content of conductive particles is less than 65 weight percent, the electrical conductivity of the prepared paste cannot be sufficiently improved, whereas if the content exceeds 85 weight percent, the contact resistance at the contact surface between the conductive particles increases excessively, which may cause a problem of reduced resistance characteristics.

[0055] The room temperature curable conductive silicone paste composition according to the present invention may further include a dispersant to prevent aggregation of conductive particles and to ensure that the particles are evenly dispersed. The dispersant may be of the fatty acid series, preferably oleic acid or stearic acid.

[0056] The dispersant may be included in a range of 0.1% to 1.0% relative to the weight of the conductive particles, preferably in a range of 0.5% to 0.8%. If the content of the dispersant is 0.1% or less relative to the weight of the conductive particles, the conductive particles may not be sufficiently dispersed, and aggregation may occur, whereas if it is included in an amount exceeding 1.0%, the contact area between the conductive particles may decrease, leading to a problem of reduced conductivity.

[0057] In addition, the room temperature curable conductive silicone paste composition according to the present invention may include a curing agent that reacts with a silicone resin as a base resin to induce a curing process, and the curing agent may be a silane-based agent having the structure of Chemical Formula 3 below.

[0058]

[0059] In the above chemical formula 3, R3 to R6 may each independently include at least one group consisting of an alkoxy group, an acrylate group, and an epoxy group, and these functional groups may be composed of two or more functional groups having the same or different structures.

[0060] Functional groups R3 to R6 act as bases to induce chemical bonding with the functional groups of the silicone resin, thereby promoting curing. In this process, the polymer chains of the silicone resin are connected to each other, and a three-dimensional network structure can be formed.

[0061] The curing agent may be an alkoxysilane with a structure comprising at least one alkoxy group among the functional groups R3 to R6 bonded to the silicon atom in Chemical Formula 3. The alkoxy group is a functional group in which an alkyl group is bonded to an oxygen atom. The curing agent composed of an alkoxysilane can improve the flexibility of the paste, prevent corrosion of the conductive particles, and rapidly induce a curing reaction between the silicone resin and the curing agent.

[0062] Preferably, the curing agent may have a structure in which an alkoxy group is introduced to two or three of the functional groups R3 to R6 in Formula 3, and an acrylate group or an epoxy group is introduced to the remaining functional groups, preferably an acrylate group. This configuration can improve not only the flexibility of the cured paste but also the adhesion to the bonded surface.

[0063] In other words, the room-temperature curable conductive silicone paste composition according to the present invention includes an alkoxy group having excellent chemical compatibility with the silicone resin and an acrylate or epoxy group capable of increasing surface adhesion as functional groups of the curing agent; thus, adhesion can be effectively improved without using a separate adhesion thickener. Furthermore, this combination of functional groups of the curing agent induces close contact between conductive particles during the curing reaction between the curing agent and the base resin, thereby providing excellent electrical conductivity while simultaneously improving flexibility.

[0064] The molecular weight of the curing agent may be in the range of 200 to 500 g / mol. Here, if the molecular weight of the curing agent is less than 200 g / mol, it is difficult to sufficiently induce a curing reaction between the curing agent and the base resin, which may result in a decrease in the mechanical strength of the prepared paste, whereas if the molecular weight exceeds 500 g / mol, flexibility decreases and hardness increases excessively, which may easily lead to cracking or breakage.

[0065] In addition, the room-temperature curable conductive silicone paste composition according to the present invention may further include ceramic particles to improve rheological properties and enhance mechanical strength. The ceramic particles can prevent precipitation or aggregation within the composition and improve fluidity and dispersibility by controlling viscosity and shear force.

[0066] Ceramic particles may be included in a range of 0.1 to 2.0 weight percent based on the total weight of the conductive silicon paste composition according to the present invention. If the content of the ceramic particles is less than 0.1 weight percent, the effect of improving fluidity or dispersibility through the ceramic particles cannot be sufficiently achieved, whereas if the content of the ceramic particles exceeds 2.0 weight percent, aggregation occurs, making uniform dispersion difficult and increasing brittleness.

[0067] The ceramic particles may be micro to nano-sized particles and may include at least one type from the group consisting of silica, alumina, and nano-fumed silica.

[0068] Preferably, the room-temperature curable conductive silicon paste composition according to the present invention may use a mixture of nano-fumed silica and micro-silica as ceramic particles. The nano-fumed silica is a nanometer-sized fine silicon dioxide particle produced through a flame hydrolysis process, and the average particle size of the micro-silica may be 5 micrometers (um) or less.

[0069] In addition, the surface of the nano-fumed silica among the ceramic particles may be hydrophobically treated with a hydrophobic material such as dimethylsiloxane, and the surface of the hydrophobically treated ceramic particles may be composed of methyl groups or hydrogen. In this case, the specific surface area of ​​the nano-fumed silica is 50 to 200 m² 2It is in the range of / g, and it is preferable that the surface moisture content be less than 0.5 wt%. Hydrophobically treated nano-fumed silica facilitates dispersion and mixing among organic solvents and has the advantage of improving water resistance, high temperature stability, and durability of the cured composition.

[0070] In addition, the room temperature curable conductive silicone paste composition according to the present invention may further include a catalyst to induce the promotion of the silicone curing reaction. In the presence of the catalyst, room temperature curing proceeds rapidly, and the curing reaction can be completed within 24 hours.

[0071] The above catalyst may have an active ingredient content of 90% to 100% relative to the total mass, and preferably may include at least one from the group consisting of dibutyltin dilaurate, dibutyltin diacetate, and amine-based catalysts. In addition, the above catalyst is mixed in trace amounts with an alcohol-based solvent to effectively extend the shelf life of the composition and improve storage stability.

[0072] The above catalyst may be contained in a range of 3 to 10 weight percent based on the total weight of the silicone paste composition. If the content of the catalyst is less than 3 weight percent, the effect of reducing curing time or storage stability cannot be sufficiently realized, whereas if the content of the catalyst exceeds 10 weight percent, the curing time may be excessively shortened, which may affect the process.

[0073]

[0074] [Example]

[0075]

[0076] 1. Preparation Example

[0077] A silicone paste composition sample was prepared by mixing the ingredients according to the ingredients and contents listed in Table 1 below. The unit of the content of the constituent ingredients listed in Table 1 is parts by weight.

[0078]

[0079] Item Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Resin 1 100 100 100 - 100 100 100 100 Resin 2 --- 100 ---- Conductive Particle 1 534.8 - 534.8 534.8 430 534.8 534.8 - Conductive Particle 2 ---- 134.8 --- Conductive Particle 3 - 534.8 - 430 Conductive Particle 4 --- 134.8 Dispersant 5 545.45.45.45.45.45.45.45.4 Curing Agent 1 2020 - 2020 7.8 2.5 20 Curing Agent 2 -- 20 - ---- Ceramic Particles 8.98.98.98.98.98.17.68.9 Catalyst 3.63.63.63.63.63.23.083.6 Adhesion thickener 1.11.11.51.11.50.970.941.5

[0080] - Resin 1: Silicone resin having a ring structure

[0081] - Resin 2: Silicone resin having a chain structure and lacking a ring structure

[0082] - Conductive particle 1: Plate-shaped Ag particle (Specific surface area: 3.0 m² 2 / g)

[0083] - Conductive particle 2: Spherical Ag particle (Specific surface area: 0.7 m² 2 / g)

[0084] - Conductive particle 3: Plate-shaped Ag particle (specific surface area: 1.5 m² 2 / g)

[0085] - Conductive particle 4: Spherical Ag particle (Specific surface area: 1.0 m² 2 / g)

[0086] - Dispersant: Oleic acid

[0087] - Curing Agent 1: Acrylate-based alkoxysilane

[0088] - Curing Agent 2: Epoxy-based alkoxysilane

[0089] - Ceramic particles: A mixture of nano-fumed silica and micro-silica

[0090] - Catalyst: A mixture of catalyst and alcohol solvent

[0091]

[0092] 2. Evaluation of physical properties

[0093] After the samples according to the examples and comparative examples were fully cured, the adhesion strength, volume resistance, and hardness were measured, and the results are shown in Table 2 below.

[0094] Adhesion strength was measured by applying the sample onto a glass substrate in accordance with the ASTM-D1002 standard, mounting a metal test chip, allowing it to fully cure at room temperature, and then using a Universal Tensile Testing Machine (UTM) to measure the tensile strength until the metal test chip detached.

[0095] Volume resistivity was calculated by measuring the sheet resistance and thickness of the cured sample after applying each sample to a glass substrate according to the ASTM-D991 standard, and this process was repeated 5 times to record the average value as the final volume resistivity.

[0096] Hardness was measured five times using a Durometer A-type hardness meter according to the ASTM-D2240 standard, and the average value was recorded as the final hardness.

[0097] Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Adhesion (gf) 1,100 1,000 1,230 650 1,000 980 820 900 Volume Resistance (cm) 0.000 10.000 20.000 80.00 10.00 20.000 80.000 820.000 9 Hardness (shore A) 40 50 50 70 45 65 60 60

[0098] According to Tables 1 and 2 above, Examples 1 to 3 apply an appropriate amount of plate-shaped conductive particles and an alkoxysilane-based curing agent to a silicone resin having a silicon-oxygen ring structure; as the degree of curing increases, electrical conductivity increases while flexibility is simultaneously improved. This can contribute to improving the performance and durability of electronic devices by preventing the occurrence of cracks caused by external shocks or vibrations. In addition, Example 1 has a specific surface area of ​​2.0 m² 2 It was confirmed that flexibility can be further improved and excellent electrical conductivity achieved by applying a curing agent of plate-shaped metal particles and acrylate-based alkoxysilanes with a content of 1g or more. In Comparative Example 1, the silicone resin had a chain structure without a silicon-oxygen ring structure, resulting in reduced electrical conductivity and flexibility. In Comparative Examples 2 and 5, spherical Ag particles were mixed, which reduced the contact area between conductive particles and consequently decreased electrical conductivity. In Comparative Examples 3 and 4, the curing reaction was not sufficiently carried out due to insufficient curing agent content, resulting in reduced flexibility.

[0099] Although this specification has been described with reference to preferred embodiments of the present invention, those skilled in the art may modify and change the present invention in various ways without departing from the spirit and scope of the present invention as described in the claims below. Therefore, if a modified embodiment basically includes the components of the claims of the present invention, it should be considered to be included within the technical scope of the present invention.

Claims

1. A base resin composed of a silicone resin having the structure of Chemical Formula 1 below; Conductive particles; and A room-temperature curable conductive silicone paste composition characterized by including an alkoxysilane curing agent. [Chemical Formula 1] R1 and R2 are each independently selected from at least one group consisting of a hydrocarbon group having 1 to 10 carbon atoms, a divalent oxygen, and a substituted or unsubstituted divalent siloxane group, and n is 2 or more.

2. In Paragraph 1, A room temperature curable conductive silicone paste composition characterized by having a base resin of 10 to 20 weight%, conductive particles of 65 to 85 weight%, and an alkoxysilane curing agent of 0.1 to 5 weight% based on the total weight of the above composition.

3. In Paragraph 1, A room temperature curing conductive silicone paste composition characterized by the weight-average molecular weight of the silicone resin being 1,200 to 10,000 g / mol.

4. In Paragraph 1, A room temperature curable conductive silicone paste composition characterized by the viscosity of the silicone resin being 200 to 800 mPa.s.

5. In Paragraph 1, A room-temperature curable conductive silicon paste composition characterized in that the conductive particles are composed of silver (Ag) or a silver-copper alloy (AgCu) material.

6. In Paragraph 1, The above conductive particles have a specific surface area of ​​2.0 m² 2 A room temperature curable conductive silicone paste composition characterized by being composed of plate-shaped particles of 1 / g or more.

7. In Paragraph 6, Accumulated 90% of the above conductive particles (D 90 A room temperature curable conductive silicone paste composition characterized by having a diameter of 20 micrometers (μm) or less and an aspect ratio of 1.0 to 5.

3.

8. In Paragraph 1, A room-temperature curable conductive silicone paste composition characterized by further comprising a dispersant for dispersing conductive particles, wherein the dispersant comprises oleic acid or stearic acid.

9. In Paragraph 8, A room temperature curable conductive silicone paste composition characterized by containing the above-mentioned dispersant in a range of 0.1 to 1.0 weight% relative to the weight of the conductive particles.

10. In Paragraph 1, A room-temperature curable conductive silicone paste composition characterized by the alkoxysilane curing agent having the structure of Chemical Formula 3 below. [Chemical Formula 3] In the above chemical formula 3, at least one of R3 to R6 is an alkoxy group, and the remainder are each independently an acrylate group or an epoxy group.

11. In Paragraph 10, A room temperature curable conductive silicone paste composition characterized in that the above alkoxysilane curing agent is an alkoxysilane in which an alkoxy group is introduced to at least two of the functional groups R3 to R6 in Chemical Formula 3.

12. In Paragraph 10, A room-temperature curable conductive silicone paste composition characterized in that the curing agent has an alkoxy group introduced to two or three of the functional groups R3 to R6 in Chemical Formula 3, and an acrylate group introduced to the remaining functional groups.

13. In Paragraph 1, A room-temperature curable conductive silicone paste composition characterized by further comprising ceramic particles, wherein the ceramic particles comprise at least one type from the group consisting of silica, alumina, and nano-fumed silica.

14. In Paragraph 13, A room-temperature curable conductive silicon paste composition characterized by the ceramic particles being a mixture of nano-fumed silica and micro-silica.

15. In Paragraph 13, A room temperature curable conductive silicone paste composition characterized in that the ceramic particles are in the range of 0.1 to 2.0 weight% based on the total weight of the composition.

16. In Paragraph 1, A room temperature curable conductive silicone paste composition characterized by further comprising a catalyst, wherein the catalyst comprises at least one type from the group consisting of dibutyltin daraurate, dibutyltin diacetate, and amine-based catalysts.

17. In Paragraph 15, A room-temperature curable conductive silicone paste composition characterized by the above catalyst being mixed with an alcohol-based solvent.

18. In Paragraph 15, A room-temperature curable conductive silicone paste composition characterized in that the catalyst is in the range of 3 to 10 weight percent based on the total weight of the composition.

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