Micro-display chip packaging structure, packaging structure group, and ar glasses

Abstract

The present application provides a a micro-display chip packaging structure, a packaging structure group, and AR glasses. The micro-display chip packaging structure comprises: a display chip, a light-emitting surface of the display chip having a light-emitting region and a non-light-emitting region, and the non-light-emitting region being provided with a first electrical connection portion electrically connected to the light-emitting region; and a circuit board, a connection end of the circuit board having a second electrical connection portion, at least a portion of the connection end of the circuit board being stacked with at least a portion of the non-light-emitting region of the display chip, and the first electrical connection portion being correspondingly electrically connected to the second electrical connection portion. In the micro-display chip packaging structure, at least a portion of the connection end of the circuit board is stacked with and electrically connected to the non-light-emitting region of the display chip, thereby facilitating reduction of the lateral size of the packaging structure and facilitating miniaturization of the packaging structure.

Description

Packaging structure of microdisplay chips, packaging structure assembly and AR glasses Technical Field

[0001] This application relates to the field of Micro LED, and further to the packaging structure of micro display chips, the packaging structure assembly, and AR glasses. Background Technology

[0002] Inorganic micro-pixel light-emitting diodes, also known as micro LEDs or μ-LEDs, offer advantages over traditional LEDs, including better strain relaxation, higher light extraction efficiency, more uniform current diffusion, and higher output performance, making them widely used in the field of micro-displays.

[0003] Figure 1 shows a cross-sectional schematic diagram of a conventional microdisplay chip packaging structure. The conventional microdisplay panel includes a reinforcing plate 1p, a display chip 2p, and a circuit board 3p. The display chip 2p and the circuit board 3p are arranged side by side on the same side of the reinforcing plate 1p. The display chip 2p and the circuit board 3p are electrically connected by wires, such as metal wires. A packaging frame 4p is provided at the connection between the display chip 2p and the circuit board 3p.

[0004] In the existing structure of microdisplay panels, the width (X1) of the microdisplay panel is difficult to further reduce because the display chip 2p and the circuit board 3p are arranged side by side on the same side of the reinforcing plate 1p and are electrically connected by metal wires. On the other hand, in the thickness direction, the encapsulation frame 4p must completely wrap the wires, making it equally difficult to further reduce the thickness (X2) of the microdisplay panel.

[0005] In conclusion, the existing packaging structure of microdisplay chips will greatly limit the further miniaturization of microdisplay panel structures, which is not conducive to meeting the future requirements of the microdisplay industry for the size of microdisplay panels.

[0006] Summary of the Invention

[0007] To address the aforementioned technical problems, this application provides a microdisplay chip packaging structure, a packaging structure assembly, and AR glasses. In the microdisplay chip packaging structure, a circuit board stack is disposed on the back of the display chip, which helps to reduce the lateral dimension of the microdisplay chip packaging structure.

[0008] To achieve at least one of the above objectives, this application provides a packaging structure for a microdisplay chip, characterized in that it includes:

[0009] The display chip has a light-emitting surface and a non-light-emitting surface. The light-emitting surface has a light-emitting portion, and the non-light-emitting surface has a first electrical connection portion.

[0010] A circuit board having a second electrical connection portion, at least a portion of the circuit board being stacked with the non-light-emitting surface, and the first electrical connection portion being electrically connected to the second electrical connection portion.

[0011] According to another aspect of this application, a package structure assembly for a microdisplay chip is further provided, comprising:

[0012] The microdisplay chip packaging structure described in any of the preceding claims, wherein the circuit boards of adjacent microdisplay chip packaging structures are integrally connected to each other.

[0013] According to another aspect of this application, an AR glasses system is further provided, comprising:

[0014] Eyeglass frames, including the frame and temples;

[0015] Optical waveguide sheet, mounted on the lens frame;

[0016] The aforementioned microdisplay chip packaging structure assembly is installed at the connection between the lens frame and the temple, with the light-emitting surface of the packaging structure assembly facing the optical waveguide sheet, and the external circuit board segment of the packaging structure disposed inside the temple.

[0017] Technical effects:

[0018] 1) In the microdisplay chip packaging structure, packaging structure assembly and AR glasses provided in this application, the circuit board stack is disposed on the back of the display chip, which can help reduce the lateral size of the microdisplay chip packaging structure.

[0019] 2) In the microdisplay chip packaging structure, packaging structure assembly and AR glasses provided in this application, the circuit board is stacked between the display chip and the support plate. The support plate can provide support for the circuit board and the display chip and can accelerate the dissipation of heat.

[0020] 3) In the micro display chip packaging structure, packaging structure group and AR glasses provided in this application, the back of the display chip has an electrical connection area and a non-electrical connection area. The circuit board is stacked in the electrical connection area and the support plate is stacked in the non-electrical connection area. The stacking of the circuit board and the support plate can further reduce the thickness of the circuit board.

[0021] 4) In the microdisplay chip packaging structure, packaging structure group and AR glasses provided in this application, a plastic encapsulation frame is provided around the display chip, which can provide protection for the display chip around the display chip. Attached Figure Description

[0022] The above and other objects, features and advantages of this disclosure will become more apparent from the more detailed description of exemplary embodiments thereof taken in conjunction with the accompanying drawings, wherein like reference numerals generally denote like parts.

[0023] Figure 1 is a cross-sectional schematic diagram of the packaging structure of a prior art microdisplay chip;

[0024] Figure 2 is a top view of the packaging structure of the microdisplay chip according to the first embodiment of this application;

[0025] Figure 3a is a schematic diagram of the cross-sectional structure of line AA in Figure 2;

[0026] Figure 3b is a schematic diagram of the non-light-emitting surface of the display chip shown in Figure 3a, illustrating the packaging structure of the microdisplay chip.

[0027] Figure 3c is a schematic diagram of a modified embodiment of the packaging structure of the microdisplay chip shown in Figure 3a;

[0028] Figure 3d is a schematic diagram of a second modified embodiment of the packaging structure of the microdisplay chip shown in Figure 3a;

[0029] Figure 3e is a schematic diagram of a modified embodiment of the non-light-emitting surface of the microdisplay chip packaging structure shown in Figure 3b;

[0030] Figure 3f is a schematic diagram of the cross-sectional structure of line BB in Figure 3e;

[0031] Figure 4 is a schematic diagram of a second modified embodiment of the non-light-emitting surface of the microdisplay chip packaging structure provided in this application;

[0032] Figure 5 is a schematic diagram of the cross-sectional structure of the CC line in Figure 4;

[0033] Figure 6 is a schematic diagram of the third modified embodiment of the non-light-emitting surface of the display chip of the micro-display chip packaging structure provided in this application;

[0034] Figure 7 is a schematic diagram of the cross-sectional structure of the DD line in Figure 6;

[0035] Figure 8 is a schematic diagram of three modified embodiments of the packaging structure of the microdisplay chip shown in Figure 3a;

[0036] Figure 9 is a schematic diagram of the fourth modified embodiment of the packaging structure of the microdisplay chip shown in Figure 3a;

[0037] Figure 10 is a schematic diagram of the packaging structure of the microdisplay chip provided in this application;

[0038] Figure 11 is a schematic diagram of the cross-sectional structure of line EE in Figure 10;

[0039] Figure 12 is a schematic diagram of the structure of the AR glasses provided in this application. Detailed Implementation

[0040] Preferred embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While preferred embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0041] Figure 2 is a top view of the packaging structure of the microdisplay chip provided in this application. Referring to Figure 2, the packaging structure of the microdisplay chip includes a display chip 10 and a molding compound frame 40. The molding compound frame 40 surrounds the display chip 10 and provides protection for the display chip 10. Preferably, the material of the molding compound frame 40 is selected from epoxy resin, silicon dioxide, aluminum oxide, etc. Preferably, the molding compound frame 40 is fabricated by a molding process.

[0042] Figure 3a is a cross-sectional view of line AA in Figure 2. Referring to Figure 3a, the display chip 10 has a light-emitting surface 11 and a non-light-emitting surface 12. The light-emitting surface 11 is the side of the display chip 10 that can emit light, and the non-light-emitting surface 12 is the side that cannot emit light and is opposite to the light-emitting surface 11. In the view shown in Figure 3a, the light-emitting surface 11 refers to the top surface of the display chip 10, and the non-light-emitting surface 12 refers to the bottom surface of the display chip 10. The packaging structure of the microdisplay chip further includes a circuit board 20, which is stacked on the non-light-emitting surface 12 of the display chip 10.

[0043] Referring to Figure 3a, the light-emitting surface 11 has a light-emitting portion 111, and the non-light-emitting surface 12 has a first electrical connection portion 131, which is electrically connected to the light-emitting portion 111. The circuit board 20 has a second electrical connection portion 132, and at least a portion of the circuit board 20 is stacked with the non-light-emitting surface 12, with the first electrical connection portion 131 and the second electrical connection portion 132 correspondingly electrically connected. In this application, the first electrical connection portion 132 of the display chip 10 is disposed on the non-light-emitting surface 12 of the display chip 10, and the circuit board 20 is stacked on the non-light-emitting surface 12 of the display chip 10, which helps to reduce the lateral dimension of the packaging structure and contributes to the miniaturization of the display chip packaging structure.

[0044] Referring to Figure 3a, the display chip 10 includes a driving backplate 141 and a light-emitting mesa array 142. The light-emitting mesa array 142 is disposed on the front side of the driving backplate 141, forming the light-emitting portion 111. The back side of the driving backplate 141 has a plurality of electrical connection contacts 1311, which are electrically connected to the first electrical connection portion 131 and the second electrical connection portion 132. Each of the plurality of electrical connection contacts 1311 corresponds one-to-one with the light-emitting mesa array 142 and is electrically connected to each other. Specifically, the plurality of electrical connection contacts 1311 on the back side of the driving backplate 141 are fabricated using a through-silicon via (TSV) process.

[0045] Referring to Figure 3a, the packaging structure of the microdisplay chip further includes a support plate 30. The support plate 30 is stacked with the circuit board 20, with the circuit board 20 located between the support plate 30 and the display chip 10. The support plate 30 provides support for the circuit board 20 and the display chip 10, resulting in a microdisplay chip packaging structure with high structural strength. In some embodiments, the support plate 30 is made of a heat-conducting material, which accelerates the dissipation of heat generated by the display chip 10 and the circuit board 20. Specifically, examples of materials used for the support plate 30 include, but are not limited to, titanium steel, stainless steel, Invar steel, and copper alloys.

[0046] Referring further to Figure 3a, the packaging structure of the microdisplay chip further includes a molding compound frame 40, which surrounds the display chip 10 and provides protection for the display chip 10. Preferably, the material of the molding compound frame 40 is selected from epoxy resin, silicon dioxide, alumina, etc. Preferably, the molding compound frame 40 is fabricated using a molding process.

[0047] Referring to Figure 3a, the edge of the circuit board 20 extends to the outside of the display chip 10 to form a first support portion 21. The molding compound frame 40 is located above the first support portion 21, and the first support portion 21 provides support for the molding compound frame 40. The edge of the support plate 30 also extends to the outside of the display chip 10 accordingly, and the size of the support plate 30 is approximately the same as the size of the circuit board 20. In the top view structure corresponding to Figure 3A, the molding compound frame 40 surrounds the display chip 10.

[0048] In the embodiment shown in FIG3a, the bottom view of the back structure of the display chip 10 is shown in FIG3b, and the plurality of electrical connection contacts 1311 generally cover the entire back of the drive backplate 141.

[0049] Referring to Figure 3a, the packaging structure of the microdisplay chip provided in this application further includes a transparent cover plate 50 disposed on the outside of the light-emitting surface 11. The transparent cover plate 50 can provide protection for the display chip 10 on the outside of the light-emitting surface 11, reducing the risk of the light-emitting surface 11 of the display chip 10 being scratched. In some embodiments, the transparent cover plate 50 also has the function of converging light.

[0050] Referring to Figure 3a, the size of the transparent cover plate 50 is adapted to the size of the display chip 10, and the molding frame 40 surrounds the transparent cover plate 50. The molding frame 40 surrounding the transparent cover plate 50 not only helps to fix the position of the transparent cover plate 50 but also helps to protect it. Preferably, the top of the transparent cover plate 50 is flush with the top of the molding frame 40. Further, the middle area of ​​the transparent cover plate 50 is in close contact with the surface of the light-emitting mesa array 142, which provides a certain supporting force for the transparent cover plate 50. The gap between the portion of the transparent cover plate 50 that does not correspond to the light-emitting mesa array 142 and the display chip 10 is filled with adhesive 61; in other words, there is adhesive 61 between the non-light-emitting portion of the display chip 10 and the transparent cover plate 50. The adhesive 61 can fix the transparent cover plate 50 to the display chip 10.

[0051] Referring to Figure 3a, the gap between the circuit board 20 and the display chip 10 is filled with protective adhesive 62. The protective adhesive 62 can encapsulate the electrical connection structure between the circuit board 20 and the display chip 10. The protective adhesive 62 also serves to adhere and fix the circuit board 20 and the display chip 10 to each other to a certain extent.

[0052] Referring to FIG. 3c, the edge of the support plate 30 extends to the outside of the circuit board 20 to form a second support portion 31, and at least a portion of the molding frame 40 is located above the second support portion 31. In the embodiment shown in FIG. 3c, the size of the circuit board 20 is larger than the size of the display chip 10 but smaller than the size of the support plate 30, and the size of the support plate 30 is consistent with the size of the molding frame 40.

[0053] Referring to Figure 3d, the size of the circuit board 20 is equal to the size of the display chip 10, the size of the support plate 30 is greater than the size of the circuit board 20, the outer edge of the support plate 30 extends to the outside of the display chip 10 to form the second support portion 31, the molding frame 40 is formed above the second support portion 31, and the molding frame 40 wraps around the outside of the circuit board 20.

[0054] Figure 3e is a modified embodiment of Figure 3b. Referring to Figure 3e, the back side of the display chip 10 has an electrical connection area 151 and a non-electrical connection area 152. The plurality of electrical connection contacts 1311 are provided in the electrical connection area 151, and the electrical connection contacts 1311 are not provided in the non-electrical connection area 152.

[0055] Figure 3f is a cross-sectional view of line BB in Figure 3e. Referring to Figure 3f, the circuit board 20 is stacked in the electrical connection area 151, and the support plate 30 is stacked in the non-electrical connection area 152, with the support plate 30 and the circuit board 20 arranged side by side. The thickness of the support plate 30 is comparable to the thickness of the circuit board 20. Compared to the embodiment where the support plate 30 and the circuit board 20 are stacked together, this embodiment arranges the support plate 30 and the circuit board 20 side by side, which can further reduce the overall thickness of the packaging structure and contribute to the miniaturization of the overall packaging structure.

[0056] Referring to Figure 4, in some embodiments, the electrical connection area 151 is arranged around the non-electrical connection area 152. Figure 5 is a cross-sectional view of the CC line in Figure 4. Referring to Figure 5, the circuit board 20 surrounds the support plate 30. In this modified embodiment, the circuit board 20 surrounds the support plate 30, facilitating electrical connection of the circuit board 20 to the outside world from multiple directions.

[0057] Referring to Figure 6, in some embodiments, the non-electrical connection area 152 is arranged around the electrical connection area 151. Figure 7 is a cross-sectional view of the DD line in Figure 6, with the support plate 30 surrounding the circuit board 20. In this modified embodiment, the support plate 30 surrounding the circuit board 20 provides better protection around the circuit board 20. Referring to Figure 6, in this modified embodiment, the support plate 30 has a notch 32 at a predetermined position, and the circuit board 20 extends to the outside of the support plate 30 through the notch 32 at the position corresponding to the notch 32 to achieve electrical connection with external circuitry.

[0058] Referring to Figures 5 and 7, in these two embodiments, the circuit board 20 and the support plate 30 have approximately the same thickness; that is, the bottom of the support plate 30 is flush with the bottom of the circuit board 20. In some embodiments, the thicknesses of the circuit board 20 and the support plate 30 may not be flush; for example, the thickness of the support plate 30 may be greater than the thickness of the circuit board 20, or the thickness of the support plate 30 may be less than the thickness of the circuit board 20. The thicknesses of the circuit board 20 and the support plate 30 can be adjusted according to actual needs and should not constitute a limitation of this application.

[0059] Referring to Figure 8, the edge of the transparent cover plate 50 extends to the top of the molding frame 40, and the edge of the transparent cover plate 50 is flush with the edge of the molding frame 40. In the embodiment shown in Figure 8, the size of the transparent cover plate 50 is larger than the size of the display chip 10, the edge of the transparent cover plate 50 extends to the top of the molding frame 40, and the edge of the transparent cover plate 50 is flush with the edge of the molding frame 40.

[0060] Referring to Figure 9, the edge of the transparent cover plate 50 extends to the top of a portion of the molding frame 40, and another portion of the molding frame 40 surrounds the transparent cover plate 50 with its top flush. In the embodiment shown in Figure 9, the top surface of the molding frame 40 is stepped, and the size of the transparent cover plate 50 is larger than the size of the display chip 10 but smaller than the size of the molding frame 40.

[0061] In some embodiments, the thickness of the package structure of the microdisplay chip ranges from 150 to 1000 μm. The width of the package structure of the microdisplay chip ranges from 2 mm to 50 mm.

[0062] Referring to Figure 10, this application further provides a microdisplay chip packaging structure group 100, including: two or more microdisplay chip packaging structures as described above, and the circuit boards 20 of adjacent microdisplay chip packaging structures are integrally connected to each other. Figure 11 is a schematic cross-sectional view of the structure along line EE in Figure 10. Referring to Figure 11, further, the molding frame 40 between two adjacent display chips 10 is shared by the two adjacent display chips 10. Referring to Figure 12, further, the support plates 30 of adjacent microdisplay chip packaging structures are integrally connected.

[0063] Preferably, the microdisplay chip packaging structure group includes three microdisplay chip packaging structures, wherein the three microdisplay chip packaging structures are respectively capable of emitting red light, green light, and blue light. Referring to Figure 10, the three microdisplay chip packaging structures are arranged in an L-shape. In some embodiments, the three microdisplay chip packaging structures can also be arranged in a straight line. The arrangement of the three microdisplay chip packaging structures should not constitute a limitation on this application.

[0064] Referring to Figure 12, another aspect of this application provides AR glasses, including: an eyeglass frame 71 and an optical waveguide 72. The eyeglass frame 71 includes a lens frame 711 and temples 712; the optical waveguide 72 is mounted on the lens frame 711; the aforementioned microdisplay chip packaging structure assembly 100 is mounted at the connection between the lens frame 711 and the temples 712, the light-emitting surface of the packaging structure assembly 100 faces the optical waveguide 72, and the external circuit board segment of the packaging structure assembly 100 is disposed inside the temples 712.

[0065] It should be noted that the aforementioned microdisplay chip packaging structure has a very small volume, with length and width dimensions between 500 μm and 50,000 μm. The light-emitting area of ​​the aforementioned microdisplay chip packaging structure is very small, for example, 1 mm × 1 mm, 2.64 mm × 2.02 mm, 3 mm × 5 mm, etc. The light-emitting area of ​​the aforementioned microdisplay chip packaging structure includes multiple micro-LED pixels arranged in an array, with specific pixel arrangements including 320 × 240, 640 × 480, 1600 × 1200, 1920 × 1080, and 2560 × 1440. The size of a single micro-LED pixel is between 100 nm and 100 micrometers. In some embodiments, the size of a single micro-LED pixel is between 150 nm and 15 micrometers. In some embodiments, the size of a single micro-LED pixel can be less than 10 micrometers.

[0066] A driving backplane is disposed on the back of the micro-LED pixel array. The driving backplane is electrically connected to the micro-LEDs in the micro-LED pixel array. The driving backplane can acquire signals such as image data from the outside world and can control the corresponding micro-LEDs to emit light or not emit light. The driving backplane is a TFT (Thin Film Transistor) board or an IC (Integrated Circuit) board. For example, the driving backplane of the above-mentioned micro-display chip packaging structure integrates a frame buffer, a column driving circuit, and a row driving circuit. The frame buffer includes a first pixel storage area, and the micro-LED pixel array includes a second pixel storage area. A complete frame of pixel grayscale data from the outside world can first enter the first pixel storage area of ​​the frame buffer. The column driving circuit can load the pixel grayscale data in the first pixel storage area of ​​the frame buffer into the second pixel storage area of ​​the micro-LED pixel array. The row driving circuit can scan the pixel grayscale data in the second pixel storage area and generate a pulse modulation signal to achieve the purpose of displaying different grayscale levels. When driving multiple micro-LED pixels in the micro-LED pixel array, either a single pixel can be driven independently, or multiple pixel units can be driven independently. The specific driving method should not constitute a limitation of this application.

[0067] It should be noted that relational terms in this document, such as “first” and “second”, are used only to distinguish an entity or operation from another entity or operation, without requiring or implying any actual relationship or order between these entities or operations. Furthermore, the words “including,” “having,” and “containing,” as well as other similar forms, are intended to be equivalent in meaning and are open-ended; one or more items following any of these words do not imply an exhaustive list of such items or that the list is limited to only one or more items.

[0068] As used herein, unless expressly stated otherwise, the term "or" covers all possible combinations unless impractical. For example, if a component is stated to include A or B, then unless expressly stated otherwise or impractical, the component may include A, or B, or A and B. As a second example, if a component is stated to include A, B, or C, then unless expressly stated otherwise or impractical, the component may include A, or B, or C, or A and B, or A and C, or B and C, or A and B and C.

[0069] In the foregoing description, numerous specific details have been described, which may vary depending on the implementation. Certain modifications and alterations may be made to the described embodiments. Other embodiments will be apparent to those skilled in the art in light of the specification and practice of this application disclosed herein. The specification and examples are intended to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims. The sequence of steps shown in the accompanying drawings is also intended for illustrative purposes only and is not intended to limit one to any particular order of steps. Therefore, those skilled in the art will understand that these steps may be performed in different orders while achieving the same method.

[0070] Exemplary embodiments have been disclosed in the accompanying drawings and description. However, many variations and modifications can be made to these embodiments. Therefore, although specific terminology has been used, it is used in a general and descriptive sense only and not for limiting purposes.

Claims

1. A package structure of a micro display chip, characterized in that, include: The display chip has a light-emitting surface and a non-light-emitting surface. The light-emitting surface has a light-emitting portion, and the non-light-emitting surface has a first electrical connection portion. A circuit board having a second electrical connection portion, at least a portion of the circuit board being stacked with the non-light-emitting surface, and the first electrical connection portion being electrically connected to the second electrical connection portion.

3. The package structure of a microdisplay chip according to claim 1, wherein, The display chip includes a driving backplane and a light-emitting mesa array. The light-emitting mesa array is disposed on the front side of the driving backplane to form the light-emitting part. The back side of the driving backplane has a plurality of electrical connection contacts, which form the first electrical connection part.

4. The package structure of a microdisplay chip according to claim 3, wherein, The electrical contact points on the back of the drive backplane are fabricated using a through-silicon via process.

5. The package structure of a microdisplay chip according to any one of claims 1-4, wherein, The device further includes a support plate, which is stacked with the circuit board, and the circuit board is located between the support plate and the display chip.

6. The package structure of a microdisplay chip according to claim 5, wherein, It further includes a molding compound surrounding the display chip.

7. The package structure of a microdisplay chip according to claim 6, wherein, The material of the plastic sealing frame is selected from epoxy resin, silicon dioxide, and aluminum oxide.

8. The package structure of a microdisplay chip according to claim 6, wherein, The plastic sealing frame is formed by the molding process.

9. The package structure of a microdisplay chip according to claim 6, wherein, The edge of the circuit board extends to the outside of the display chip to form a first support portion, and the plastic encapsulation frame is located above the first support portion.

10. The package structure of a microdisplay chip according to claim 9, wherein, The edge of the support plate extends to the outside of the circuit board to form a second support portion, and at least a portion of the plastic encapsulation frame is located above the second support portion.

11. The package structure of a microdisplay chip according to claim 6, wherein, The edge of the circuit board does not extend to the outside of the display chip, while the edge of the support plate extends to the outside of the display chip to form a second support portion, and the molding frame is located above the second support portion.

12. The package structure of a microdisplay chip according to any one of claims 1-4, wherein, The back of the display chip has an electrical connection area and a non-electrical connection area. The electrical connection area has the electrical connection contact point, while the non-electrical connection area does not have the electrical connection contact point.

13. The package structure of a microdisplay chip according to claim 12, wherein, The packaging structure further includes a support plate, the support plate and the circuit board are stacked side by side on the non-light-emitting surface of the display chip, and the position of the support plate corresponds to the position of the non-electrical connection area, and the position of the circuit board corresponds to the position of the electrical connection area.

14. The package structure of a microdisplay chip according to claim 13, wherein, The electrical connection area and the non-electrical connection area are arranged adjacent to each other, and the circuit board and the support plate are arranged side by side.

15. The package structure of a microdisplay chip according to claim 13, wherein, The electrical connection area is arranged around the non-electrical connection area, and the circuit board surrounds the support plate.

16. The package structure of a microdisplay chip according to claim 13, wherein, The non-electrical connection area is arranged around the electrical connection area, and the support plate is arranged around the circuit board.

17. The package structure of a microdisplay chip according to claim 13, wherein, The bottom of the support plate is flush with the bottom of the circuit board.

18. The package structure of a microdisplay chip according to any one of claims 6-11, wherein, The encapsulation structure further includes a transparent cover plate disposed on the outside of the light-emitting surface.

19. The package structure of a microdisplay chip according to claim 18, wherein, The size of the transparent cover plate is adapted to the size of the display chip, the molding frame surrounds the transparent cover plate, and the top of the transparent cover plate is flush with the top of the molding frame.

20. The package structure of a microdisplay chip according to claim 18, wherein, The edge of the transparent cover extends to the top of the plastic seal frame, and the edge of the transparent cover is flush with the edge of the plastic seal frame.

21. The package structure of a microdisplay chip according to claim 18, wherein, The edge of the transparent cover extends to the top of a portion of the plastic seal, and another portion of the plastic seal surrounds the transparent cover and is flush with the top.

22. The package structure of a microdisplay chip according to claim 18, wherein, The gap between the non-light-emitting part of the display chip and the transparent cover plate is filled with adhesive.

23. The package structure of a microdisplay chip according to any one of claims 1-4, wherein, The gap between the circuit board and the display chip is filled with protective adhesive.

24. The package structure of a microdisplay chip according to any one of claims 1-23, wherein, The thickness of the packaging structure of the microdisplay chip ranges from 150 to 1000 μm.

25. The package structure of a microdisplay chip according to claim 24, wherein, The width of the package structure of the microdisplay chip ranges from 2mm to 50mm.

26. A package structure set of microdisplay chips, characterized by include: The packaging structure of two or more microdisplay chips according to any one of claims 1-25, wherein the circuit boards of adjacent packaging structures of the microdisplay chips are integrally connected to each other.

27. The package structure set of microdisplay chips according to claim 26, wherein, The microdisplay chip packaging structure assembly includes three microdisplay chip packaging structures, wherein the three microdisplay chip packaging structures are respectively capable of emitting red light, green light, and blue light.

28. An AR eyewear, characterized by include: Eyeglass frames, including the frame and temples; Optical waveguide sheet, mounted on the lens frame; The microdisplay chip packaging structure assembly according to claim 26 or 27, wherein the packaging structure assembly is installed at the connection between the lens frame and the temple, the light-emitting surface of the packaging structure assembly faces the optical waveguide sheet, and the external circuit board segment of the packaging structure is disposed inside the temple.

Images