BMS low-temperature functionality testing device

Abstract

The present utility model relates to the technical field of low-temperature testing apparatuses. Disclosed is a BMS low-temperature functionality testing device, comprising: a housing, a temperature changing member, and a temperature control assembly; the volume of the housing is less than 150 cm3, the housing is provided with a through hole, the temperature changing member is disposed in the housing, and the temperature changing member is provided with a thermally conductive accommodating portion, used for accommodating a BMS; the thermally conductive accommodating portion at least partially protrudes from the through hole; the temperature control assembly is connected to the housing, and is electrically connected to the temperature changing member, so as to adjust the temperature such that the thermally conductive accommodating portion reaches a temperature required for BMS low-temperature testing. Compared with existing BMS low-temperature testing devices, the overall volume of the BMS low-temperature functionality testing device of the present application is smaller, while ensuring that the BMS can undergo low-temperature testing. When the BMS low-temperature functionality testing device needs to be used outside, the mobile housing can move the BMS low-temperature functionality testing device, which is more convenient to carry, enables the BMS low-temperature functionality testing device to be used indoors or outdoors, has wider application scenarios, can be carried and used at any time as a portable tool, and has better practicability.

Description

A low-temperature functional testing device for BMS Technical Field

[0001] This utility model belongs to the technical field of low temperature testing devices, specifically relating to a BMS low temperature functional testing device. Background Technology

[0002] The main purpose of low-temperature testing of the BMS (Battery Management System) is to verify whether the BMS can function normally under low-temperature conditions, including its charge and discharge performance, temperature control capabilities, fault response, and battery protection functions. Through testing, it can be ensured that the BMS can still guarantee the safety and performance of the battery pack in extreme low-temperature environments.

[0003] However, existing BMS low-temperature testing equipment is usually a large cabinet, which is bulky and difficult to move, so BMS low-temperature testing can usually only be carried out indoors, which is not very practical.

[0004] Utility Model Content

[0005] To address the shortcomings of the existing technology, this utility model provides a low-temperature functional testing device for BMS.

[0006] The technical effects to be achieved by this utility model are realized through the following technical aspects:

[0007] A low-temperature functional testing device for a BMS includes: a housing, a temperature-changing element, and a temperature control assembly;

[0008] The volume of the housing is less than 150 cm³. The housing has a perforation. The temperature-changing element is disposed inside the housing and has a temperature-conducting accommodating portion for accommodating the BMS. The temperature-conducting accommodating portion protrudes at least partially from the perforation. The temperature control component is connected to the housing and electrically connected to the temperature-changing element to adjust the temperature-conducting accommodating portion to reach the temperature required for low-temperature testing of the BMS.

[0009] In some embodiments, the temperature-conducting accommodating portion has a temperature-conducting groove, the depth of which is greater than the height of the BMS.

[0010] In some embodiments, the temperature control component includes a temperature setting module and a control module. The adjustment terminal of the temperature setting module is located on the outside of the housing, and the temperature setting module is electrically connected to the control module, and the control module is electrically connected to the temperature variable element.

[0011] In some embodiments, the temperature setting module includes a temperature setting button, an electronic display, and a temperature setting circuit board. The temperature setting button and the electronic display are electrically connected to the temperature setting circuit board and exposed on the outside of the housing. The temperature setting circuit board is electrically connected to the control module.

[0012] In some embodiments, the temperature control component further includes a temperature setting switch for controlling the start or stop of the temperature setting module, the temperature setting switch being electrically connected to the temperature setting module.

[0013] In some embodiments, the temperature control assembly further includes a power supply and a power socket, the power supply being electrically connected to the temperature setting module, the power socket being embedded in the housing, and the power socket being electrically connected to the power supply.

[0014] In some embodiments, the housing has a heat dissipation channel communicating with the outside, and a heat dissipation component is disposed within the heat dissipation channel.

[0015] In some embodiments, the heat dissipation assembly includes a plurality of heat sinks, each of which is connected to the temperature-changing element to dissipate the heat of the temperature-changing element to the outside.

[0016] In some embodiments, the heat dissipation assembly further includes a heat dissipation fan disposed within the heat dissipation channel to blow heat from the housing to the outside.

[0017] In some embodiments, the temperature-changing element and the temperature-conducting accommodating portion are made of a temperature-conducting metal.

[0018] In summary, this utility model has at least the following advantages:

[0019] The BMS low-temperature functional testing equipment provided by this utility model adjusts the temperature of the temperature-conducting housing to the temperature required for low-temperature testing of the BMS through a temperature control component. The BMS is then placed in the temperature-conducting housing, allowing the BMS to operate at the specified temperature for low-temperature testing. By controlling the volume of the housing within the BMS low-temperature functional testing equipment to below 150 cm³, and accommodating the temperature-changing component within the housing, with the temperature control component connected to the housing, this invention ensures that the BMS can perform low-temperature testing. Compared to existing BMS low-temperature testing equipment, the overall size of this BMS low-temperature functional testing equipment is smaller. When needed for outdoor use, the BMS low-temperature functional testing equipment can be moved simply by moving the housing, making it more convenient to carry. This allows for use both indoors and outdoors, broadening its application scenarios. Furthermore, it can be carried and used as a portable tool, improving its practicality. Attached Figure Description

[0020] Figure 1 is a schematic diagram of the structure of the BMS low-temperature functional testing device according to an embodiment of this application from one direction;

[0021] Figure 2 is an exploded view of the BMS low-temperature functional testing device according to an embodiment of this application;

[0022] Figure 3 is a schematic diagram of the BMS low-temperature functional testing device from another direction according to an embodiment of this application.

[0023] Marked in the image:

[0024] 10. BMS low-temperature functional testing equipment;

[0025] 100. Housing; 110. Upper housing; 111. Perforation; 120. Lower housing; 130. Heat dissipation channel;

[0026] 200. Temperature-changing component; 210. Temperature-conducting housing; 211. Temperature-conducting groove;

[0027] 300. Temperature control component; 310. Temperature setting module; 320. Control module; 330. Temperature setting switch; 340. Power supply; 341. Power socket; 350. Main power switch; 360. Voltage regulator module; 370. Voltage regulator switch;

[0028] 400. Heat dissipation component; 410. Heat dissipation fan; 420. Heat sink. Embodiments of the present invention

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. The described embodiments are only some embodiments of this utility model, not all embodiments.

[0030] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0031] In the following embodiments and accompanying drawings, referring to the coordinate system of FIG1, the direction pointed to by the X-axis arrow is right, the direction pointed to by the Y-axis arrow is forward, and the direction pointed to by the Z-axis arrow is up.

[0032] Example 1:

[0033] As shown in Figures 1 to 3, this embodiment provides a low-temperature functional testing device 10 for a BMS, including: a housing 100, a temperature-changing element 200, and a temperature control component 300; the volume of the housing 100 is less than 150 cm³, and a perforation 111 is provided on the housing 100; the temperature-changing element 200 is disposed inside the housing 100, and the temperature-changing element 200 is provided with a temperature-conducting accommodating portion 210 for accommodating the BMS; the temperature-conducting accommodating portion 210 is at least partially protruding from the perforation 111; the temperature control component 300 is connected to the housing 100 and electrically connected to the temperature-changing element 200 to adjust the temperature-conducting accommodating portion 210 to reach the temperature required for the low-temperature testing of the BMS.

[0034] Specifically, the housing 100 is used to house the components. Because the housing 100 is small in size, the overall size of the BMS low-temperature functional testing equipment 10 can be kept small. The material of the housing 100 can be selected, but is not limited to, plastic. The upper surface of the housing 100 is provided with a perforation 111. The temperature-changing element 200 can be made of a material that is not limited to thermally conductive metal, and the thermally conductive metal can be made of copper, that is, the temperature-changing element 200 can be set as a copper base. A thermally conductive receiving part 210 is provided on the top of the temperature-changing element 200. The material of the thermally conductive receiving part 210 can be made of a material that is not limited to thermally conductive metal, and the thermally conductive metal can be made of copper, that is, the thermally conductive receiving part 210 can be set as a copper tube. The shape of the thermally conductive receiving part 210 is adapted to the shape of the perforation 111. One end of the temperature control component 300 is installed inside the housing 100, and the other end is exposed. The temperature control component 300 can control and adjust the temperature of the temperature-changing element 200 and the thermally conductive receiving part 210 so that the temperature of the thermally conductive receiving part 210 reaches the temperature required for BMS low-temperature testing.

[0035] It is worth noting that by adjusting the temperature of the temperature-conducting housing 210 to the temperature required for low-temperature testing of the BMS through the temperature control component 300, and then placing the BMS in the temperature-conducting housing 210, the BMS can operate at the specified temperature for low-temperature testing. Specifically, by controlling the volume of the housing 100 in the BMS low-temperature functional testing device 10 to below 150 cm³, and by accommodating the temperature-changing component 200 within the housing 100, and by connecting the temperature control component 300 to the housing 100, while ensuring that the BMS can perform low-temperature testing, the overall size of the BMS low-temperature functional testing device 10 in this application is smaller than that of existing BMS low-temperature testing devices. When needing to go out, the BMS low-temperature functional testing device 10 can be moved simply by moving the housing 100, making it more convenient to carry. This allows for use both indoors and outdoors, broadening its application scenarios, and it can also be carried and used as a portable tool, thus improving its practicality.

[0036] In this embodiment, the volume of the shell 100 is approximately the size of a palm, that is, approximately 80 cm³. 3This makes it easier to carry. In another embodiment, the volume of the housing 100 is 120 cm³, and in yet another embodiment, the volume of the housing 100 is 65 cm³. The specific dimensions of the housing 100 are set according to actual production needs and are not limited here, as long as the BMS low-temperature functional testing equipment 10 can be carried portablely.

[0037] Example 2

[0038] This embodiment is a further implementation of embodiment 1. As shown in FIG1, in this embodiment, the temperature-conducting accommodating part 210 has a temperature-conducting groove 211, and the depth of the temperature-conducting groove 211 is greater than the height of the BMS.

[0039] Specifically, the upper surface of the temperature-conducting accommodating part 210 has a temperature-conducting groove 211 that is adapted to the shape of the BMS. By providing the temperature-conducting groove 211, and the depth of the temperature-conducting groove 211 being greater than the height of the BMS, the entire BMS can be incorporated into the temperature-conducting groove 211. This makes it easier to create an environment with the temperature required for low-temperature testing of the BMS, thereby ensuring that the BMS is tested at the required temperature.

[0040] It is understood that the temperature conduction bath 211 can accommodate one or more BMS, and the specific size and shape of the temperature conduction bath 211 are not limited here, as long as it ensures that a low-temperature testing environment is formed for the BMS to be tested while maintaining a relatively small overall size of the BMS low-temperature functional testing equipment 10. For example, the temperature conduction bath 211 can accommodate a single BMS, and the temperature conduction bath 211 can be set as a rectangular bath, with the size of the temperature conduction bath 211 matching the size of a single BMS, and the size of the temperature conduction bath 211 being slightly larger than the size of a single BMS to facilitate the removal of the single BMS; or, for example, the temperature conduction bath 211 can accommodate three BMS.

[0041] To facilitate the use of the temperature control component 300, as shown in Figures 1 and 2, in some embodiments, the temperature control component 300 includes a temperature setting module 310 and a control module 320. The adjustment terminal of the temperature setting module 310 is located on the outside of the housing 100, and the temperature setting module 310 is electrically connected to the control module 320, and the control module 320 is electrically connected to the temperature variable element 200.

[0042] Specifically, an opening is provided on the upper surface of the housing 100, and the electronic display can be, but is not limited to, a digital tube. Thus, the temperature setting module 310 includes a temperature setting button, a digital tube, and a temperature setting circuit board. The temperature setting button and digital tube are embedded in the opening and exposed to the outside environment, allowing the temperature to be displayed via the digital tube, enabling the operator to observe the set temperature value. The temperature setting button and digital tube are connected to the temperature setting circuit board, which is installed inside the housing 100. The control module 320 is also located inside the housing 100. Therefore, the temperature setting button can be manually adjusted, the digital tube displays the temperature, and the temperature setting circuit board sends a corresponding electrical signal to the temperature-changing element 200, causing a corresponding temperature change in the temperature-changing element 200. Thus, when testing the BMS, only the temperature setting button needs to be pressed to adjust the ambient temperature. Compared to the cumbersome steps of existing BMS low-temperature testing equipment, the testing steps of this application are much simpler and more convenient.

[0043] It is understood that the temperature setting module 310, the control module 320, and the temperature variable element 200 are connected by wires. The way the temperature setting button, the digital tube, and the temperature setting circuit board work together, the way the temperature setting circuit board sends electrical signals to the control module 320, and the way the control module 320 regulates the temperature of the temperature variable element 200 are all known to those skilled in the art and are achievable. Therefore, they will not be described in detail in this embodiment.

[0044] To prevent accidental activation, as shown in Figures 1 and 2, in some embodiments, the temperature control assembly 300 further includes a temperature setting switch 330 for controlling the start or stop of the temperature setting module 310, and the temperature setting switch 330 is electrically connected to the temperature setting module 310.

[0045] Specifically, the temperature setting switch 330 is connected in the circuit. The temperature setting switch 330 controls whether the input current is transmitted to the temperature setting circuit board. The additional switch prevents accidental activation of the temperature setting module 310, thus effectively increasing practicality. Furthermore, the method by which the temperature setting switch 330 controls the start or stop of the temperature setting module 310 in the circuit is known to those skilled in the art and is achievable; therefore, it will not be described in detail in this embodiment.

[0046] To facilitate the use of the BMS low-temperature functional testing equipment 10, in some embodiments, the temperature control component 300 further includes a power supply 340 and a power socket 341. The power supply 340 is electrically connected to the temperature setting module 310, and the power socket 341 is embedded in the housing 100 and electrically connected to the power supply 340.

[0047] Specifically, the housing 100 has a through slot, and the power supply 340 is mounted on the lower inner surface of the housing 100. The power supply 340 is used to supply power to components such as the temperature setting module 310, and can transmit current to the temperature setting switch 330. The power socket 341 is embedded in the through slot and is connected to the power supply 340 through a wire. The power supply 340 can be charged through the power socket 341, making it more convenient to use. This increases the practicality of the BMS low temperature function test equipment 10.

[0048] To facilitate the stable use of the BMS low-temperature functional testing equipment 10, as shown in Figure 2, in some embodiments, the temperature control component 300 further includes a voltage regulator module 360, which is located between the power supply 340 and the temperature setting module 310 circuit.

[0049] Specifically, the voltage regulator module 360 ​​can stabilize the input voltage and output a stable voltage for the connected electronic devices. It features voltage stabilization, overload protection, short-circuit protection, and overheat protection. This allows the voltage input from the power supply 340 to be stably output to the temperature setting module 310, resulting in a more stable circuit and enhancing the practicality of the BMS low-temperature function testing equipment 10.

[0050] Furthermore, the temperature control assembly 300 also includes a voltage regulator switch 370 for controlling the start or stop of the voltage regulator module 360, and the voltage regulator switch 370 is electrically connected to the voltage regulator module 360.

[0051] Specifically, the voltage regulator switch 370 is connected in the circuit. By adjusting the voltage regulator switch 370, the start or stop of the voltage regulator module 360 ​​can be controlled. The method by which the voltage regulator switch 370 controls the start or stop of the voltage regulator module 360 ​​in the circuit is known to those skilled in the art and is achievable, and will not be described in detail in this embodiment.

[0052] Furthermore, the temperature control assembly 300 also includes a main power switch 350 for turning the power supply 340 on or off, the main power switch 350 being electrically connected to the power supply 340.

[0053] Specifically, the main power switch 350 can power on and off the BMS low-temperature functional testing equipment 10 by turning the power supply 340 on or off. The method by which the main power switch 350 controls the power supply 340 is known to those skilled in the art and is feasible, and will not be described in detail in this embodiment.

[0054] It is understood that the main power switch 350, temperature setting switch 330, and voltage regulator switch 370 can be embedded in the housing 100 through openings and connected to the corresponding electronic components via wires. The specific arrangement of the main power switch 350, temperature setting switch 330, and voltage regulator switch 370 depends on actual production needs and is not limited here; it is only necessary to ensure that the corresponding control components are turned on or off. For example, the main power switch 350, temperature setting switch 330, and voltage regulator switch 370 can be arranged side-by-side on the upper surface of the housing 100. The main power switch 350 controls the power supply to the power supply 340, allowing current to be output to the temperature setting switch 330 and voltage regulator switch 370; the voltage regulator switch 370 controls whether the voltage output from the power supply 340 is output to the temperature setting module 310 through the voltage regulator module 360; and the temperature setting switch 330 controls whether the input current is output to the temperature setting module 310.

[0055] Example 3

[0056] This embodiment is a further implementation of embodiment 1 or 2. In this embodiment, the housing 100 has a heat dissipation channel 130 communicating with the outside, and a heat dissipation component 400 is provided in the heat dissipation channel 130.

[0057] Specifically, a heat dissipation channel 130 is provided in the middle of the housing 100, and the heat dissipation channel 130 is arranged through the left and right sides of the housing 100 so that the internal components of the housing 100 can communicate with the outside. A heat dissipation component 400 is provided inside to prevent the temperature-changing component 200 and other electronic devices from being affected by heat during operation. It can also be combined with the temperature control component 300 to enable the temperature-changing component 200 to quickly reach the required temperature.

[0058] To facilitate the use of the heat dissipation component 400, in some embodiments, the heat dissipation component 400 includes a plurality of heat sinks 420, each heat sink 420 being connected to the temperature-changing element 200 to dissipate the heat of the temperature-changing element 200 to the outside.

[0059] Specifically, each heat sink 420 is mounted side-by-side on the lower end of the temperature-changing element 200, and the power supply 340 is located below each heat sink 420, so that the power supply 340, each heat sink 420, and the temperature-changing element 200 are all located on the left side of the heat dissipation channel 130. The heat sink 420 is connected to the outside through the heat dissipation channel 130, so that heat can be dissipated to the outside in a timely manner. The material of the heat sink 420 can be selected from, but is not limited to, aluminum.

[0060] To facilitate the use of the heat dissipation assembly 400, as shown in Figures 1 and 2, in some embodiments, the heat dissipation assembly 400 further includes a heat dissipation fan 410, which is disposed in the heat dissipation channel 130 to blow the heat inside the housing 100 to the outside.

[0061] Specifically, the cooling fan 410 is installed on the right side of the heat dissipation channel 130 and is positioned close to the outside. The cooling fan 410 and the temperature variable element 200 are spaced apart, and the airflow is directed towards the heat sinks 420 and the temperature variable element 200 located on the left side, so as to blow the heat inside the housing 100 to the outside in a timely manner. The cooling fan 410 can be, but is not limited to, a fan.

[0062] For ease of assembly and repair, as shown in Figures 2 and 3, in some embodiments, the housing 100 includes an upper housing 110 and a lower housing 120, which are detachably connected.

[0063] Specifically, the upper shell 110 has a through hole 111, an opening, and a perforation for mounting the temperature-conducting housing 210, the temperature setting module 310, and three switches. The lower shell 120 has a through groove on its front side for mounting the power socket 341. The upper shell 110 and the lower shell 120 each have air ducts along the X-axis, and when the upper shell 110 and the lower shell 120 are closed, the two air ducts form a heat dissipation channel 130. When the internal components need to be repaired, the upper shell 110 and the lower shell 120 can be disassembled to facilitate the repair of the internal components.

[0064] Example 4

[0065] This embodiment is a further implementation of embodiment 1, 2 or 3, and a heat insulation layer is provided inside the temperature conducting groove 211.

[0066] Specifically, the insulation layer can be selected from, but is not limited to, insulation cotton, in order to facilitate maintaining the test temperature of the BMS.

[0067] Thus, the low-temperature functional testing equipment 10 of this application uses components such as a plastic housing 100, a power supply 340, a voltage regulator module 360, a variable-temperature cooling fan 410, a variable-temperature aluminum heat sink 420, and a thermally conductive copper heat-conducting housing 210. Each component is connected by wires according to a pre-set circuit and fixed inside the portable plastic housing 100, thereby greatly reducing the tooling size and allowing for easy portability anytime, anywhere. It can be used both indoors and outdoors, making it especially convenient for business travelers. Furthermore, the digital display shows the test temperature, making the test results clearer.

[0068] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0069] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A BMS cryogenic functional test apparatus, characterized by, include: Housing (100), temperature-changing element (200), and temperature control assembly (300); The volume of the housing (100) is less than 150 cm³. The housing (100) has a perforation (111). The temperature-regulating element (200) is disposed inside the housing (100). The temperature-regulating element (200) is provided with a temperature-conducting accommodating portion (210) for accommodating the BMS. The temperature-conducting accommodating portion (210) protrudes at least partially from the perforation (111). The temperature control component (300) is connected to the housing (100) and electrically connected to the temperature-regulating element (200) to adjust the temperature-conducting accommodating portion (210) to reach the temperature required for the low-temperature test of the BMS.

2. The BMS cryogenic functional test apparatus of claim 1, wherein, The temperature-conducting accommodating part (210) has a temperature-conducting groove (211), the depth of which is greater than the height of the BMS.

3. The BMS cryogenic functional test apparatus of claim 1, wherein, The temperature control component (300) includes a temperature setting module (310) and a control module (320). The adjustment terminal of the temperature setting module (310) is located on the outside of the housing (100), and the temperature setting module (310) is electrically connected to the control module (320). The control module (320) is electrically connected to the temperature variable element (200).

4. The BMS cryogenic functional test apparatus of claim 3, wherein, The temperature setting module (310) includes a temperature setting button, an electronic display and a temperature setting circuit board. The temperature setting button and the electronic display are electrically connected to the temperature setting circuit board and exposed on the outside of the housing (100). The temperature setting circuit board is electrically connected to the control module (320).

5. The BMS cryogenic functional test apparatus of claim 3, wherein, The temperature control component (300) also includes a temperature setting switch (330) for controlling the start or stop of the temperature setting module (310), and the temperature setting switch (330) is electrically connected to the temperature setting module (310).

6. The BMS cryogenic functional test apparatus of claim 3, wherein, The temperature control component (300) also includes a power supply (340) and a power socket (341). The power supply (340) is electrically connected to the temperature setting module (310), and the power socket (341) is embedded in the housing (100) and electrically connected to the power supply (340).

7. The BMS cryogenic functional test apparatus of claim 1, wherein, The housing (100) has a heat dissipation channel (130) that communicates with the outside, and a heat dissipation component (400) is provided in the heat dissipation channel (130).

8. The BMS cryogenic functional test apparatus of claim 7, wherein, The heat dissipation assembly (400) includes a plurality of heat sinks (420), each of the heat sinks (420) being connected to the temperature-changing element (200) to dissipate the heat of the temperature-changing element (200) to the outside.

9. The BMS cryogenic functional test apparatus of claim 7, wherein, The heat dissipation assembly (400) also includes a heat dissipation fan (410), which is disposed in the heat dissipation channel (130) to blow the heat inside the housing (100) to the outside.

10. The BMS cryogenic functional test apparatus according to any one of claims 1 to 9, wherein, The temperature-changing element (200) and the temperature-conducting accommodating part (210) are made of temperature-conducting metal.

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