Easy-to-operate single-sided adhesive super-soft high-thermal-conductivity pad and preparation method therefor

Abstract

The present invention relates to the technical field of thermally-conductive materials, and particularly relates to an easy-to-operate single-sided adhesive super-soft high-thermal-conductivity pad and a preparation method therefor. The pad comprises an ultrathin thermally-conductive film and a silicone-based thermally-conductive pad. Raw materials for preparing the ultrathin thermally-conductive film at least comprise, in parts by weight: 85-220 parts of a ceramic filler, 10-50 parts of vinyl silicone oil, 1-10 parts of a cross-linking agent, 0.5-5 parts of a modifier, 0.1-2 parts of an inhibitor, and 0.2-2 parts of a catalyst. By means of the design of a combination of the ultrathin thermally-conductive film and the thermally-conductive pad, the provided product has a good compressibility and resilience on the premise of ensuring a high thermal conductivity, also has a good operability, and meets actual use requirements.

Description

An easy-to-use single-sided adhesive ultra-flexible high thermal conductivity pad and its preparation method Technical Field

[0001] This invention relates to the field of thermal conductive materials technology, specifically to an easy-to-operate single-sided adhesive ultra-flexible high thermal conductivity pad and its preparation method. Background Technology

[0002] As the performance and functionality of electronic devices improve, the heat generated by these devices also increases, making effective heat dissipation, cooling, and heat dissipation particularly important. For high-performance mobile products such as 5G smartphones and AR / VR devices, the use of high-performance chips and highly integrated designs aimed at reducing weight limits the installation space for heat dissipation components. Therefore, using high thermal conductivity pads can provide better heat dissipation.

[0003] However, current high thermal conductivity pads generally suffer from high hardness, powdering after aging, and oil seepage, failing to effectively fill the air gaps between heat-generating devices and heat sinks or metal bases, thus severely hindering heat transfer between contact surfaces. Ultra-flexible thermal conductive pads can effectively address these issues, allowing for better and more complete contact between the contact surfaces, achieving true face-to-face contact. For example, Chinese patent (authorization announcement number CN115092920B) discloses graphene thermal conductive pads and their preparation method, specifically combining graphene and other thermally conductive fillers with polymer materials to improve the overall compressibility of the graphene thermal conductive pad. However, this presents significant challenges for operator handling. Ultra-flexible pads suffer from low thermal conductivity and poor operability, making them currently unsuitable for use inside high-heat-dissipation devices.

[0004] Therefore, the technical challenge in the field of thermal conductive materials is to ensure that ultra-flexible thermal pads have excellent compressibility and resilience while maintaining high thermal conductivity, and also to provide operators with good handling performance. Summary of the Invention

[0005] To address the aforementioned issues, this invention provides an easy-to-use, single-sided, ultra-flexible, high thermal conductivity pad. By designing an ultra-thin thermally conductive film in conjunction with an organosilicon thermally conductive pad, the product achieves excellent compressibility and resilience while maintaining high thermal conductivity, and also offers good operability to meet practical application requirements.

[0006] This invention provides an easy-to-operate, single-sided adhesive, ultra-flexible, high thermal conductivity pad, comprising an ultra-thin thermal conductive film and an organosilicon thermal conductive pad; by weight, the raw materials for preparing the ultra-thin thermal conductive film include at least: 85-220 parts of ceramic filler, 10-50 parts of vinyl silicone oil, 1-10 parts of crosslinking agent, 0.5-5 parts of modifier, 0.1-2 parts of inhibitor, and 0.2-2 parts of catalyst.

[0007] As a preferred technical solution, the raw materials for preparing the organosilicon thermal pad, by weight, include at least: 150-300 parts of high thermal conductivity modified mixed filler, 2-15 parts of vinyl silicone oil, 0.1-5 parts of methyl silicone oil, 0.1-1 parts of crosslinking agent, 0.1-2 parts of inhibitor, and 0.2-2 parts of catalyst.

[0008] As a preferred technical solution, the mass ratio of the ceramic filler to the modifier is 100:(0.5-5).

[0009] As a preferred technical solution, the modifier is selected from at least one of octyltrimethoxysilane, dodecyltrimethoxysilane, n-octyltriethoxysilane, vinyltrimethoxysilane, and hexamethyldisilazane, preferably octyltrimethoxysilane or hexamethyldisilazane.

[0010] As a preferred technical solution, the ceramic filler is selected from at least one of alumina, aluminum nitride, magnesium oxide, and zinc oxide.

[0011] Preferably, the ceramic filler is a combination of alumina and zinc oxide.

[0012] Preferably, the mass ratio of alumina to zinc oxide is (80-200):(5-20), more preferably (80-150):(5-10), and even more preferably (100-150):5.

[0013] Preferably, the alumina is selected from at least one of angular alumina, spherical alumina, and single-crystal alumina.

[0014] Preferably, the particle size of the angular or spherical alumina is 1-70 μm, and more preferably includes at least one of 1 μm, 2 μm, 5 μm, 10 μm, 20 μm, 40 μm, and 70 μm.

[0015] Preferably, the particle size of the single-crystal alumina is 0.3-5 μm, and more preferably includes at least one of 0.3 μm, 1.5 μm, 3 μm, and 5 μm.

[0016] Preferably, the zinc oxide has a particle size of 0.5-3 μm, and more preferably includes at least one of 0.5 μm, 1 μm, and 3 μm.

[0017] Preferably, the aluminum nitride has a particle size of 2-150 μm, and more preferably includes at least one of 2 μm, 10 μm, 20 μm, 80 μm, 100 μm, 120 μm, and 150 μm.

[0018] As a preferred technical solution, the particle size of the ceramic filler is 0.1-20μm.

[0019] Preferably, the ceramic filler is a combination of single-crystal alumina, spherical alumina, and zinc oxide.

[0020] Preferably, by weight, the ceramic filler comprises 20 parts of 0.3μm single-crystal alumina (BaiTu), 40 parts of 2μm spherical alumina (BaiTu), 60 parts of 20μm spherical alumina (BaiTu), and 5 parts of 0.5μm zinc oxide (BaiTu).

[0021] As a preferred technical solution, the particle size of the high thermal conductivity modified mixed filler is 0.1-200μm.

[0022] As a preferred technical solution, the raw materials for preparing the high thermal conductivity modified mixed filler include at least a mixed ceramic filler and a modifier, wherein the mass ratio of the mixed ceramic filler to the silane modifier is 100:(0.2-5).

[0023] As a preferred technical solution, the mixed ceramic filler includes at least: single-crystal alumina, spherical alumina, zinc oxide, and aluminum nitride.

[0024] Preferably, by weight, the mixed ceramic filler comprises: single-crystal alumina (1.5 μm, 5 parts; 5 μm, 10 parts), spherical alumina (1 μm, 5 parts; 2 μm, 15 parts; 40 μm, 30 parts), zinc oxide (0.5 μm, 3 parts), and aluminum nitride (20 μm, 5 parts; 120 μm, 27 parts).

[0025] As a preferred technical solution, the silane modifier is selected from at least one of octyltrimethoxysilane, dodecyltrimethoxysilane, n-octyltriethoxysilane, vinyltrimethoxysilane, and hexamethyldisilazane, preferably octyltrimethoxysilane or hexamethyldisilazane.

[0026] As a preferred technical solution, the preparation method of the high thermal conductivity modified mixed filler is as follows: the mixed ceramic filler is filled into the modification equipment, then a modifier is added, the modification equipment is closed to seal the cavity, and the mixture is first stirred at 10-200 rpm for 0.5-90 min. After stirring, the modification equipment is opened and the powder that has been stirred up is manually scraped off. The modification equipment is then closed again and stirred at 150-500 rpm for 0.5-30 min. After stirring, the modified filler is poured out and baked in an oven at 50-170℃ for 0.5-24 h. After baking, the filler is taken out and cooled to obtain the high thermal conductivity modified mixed filler.

[0027] As a preferred technical solution, the mass ratio of vinyl silicone oil to crosslinking agent in the ultrathin thermal conductive film is (20-30):(3-7), preferably 25:(4-6).

[0028] As a preferred technical solution, the vinyl content in the vinyl silicone oil is 0.08-10 wt%.

[0029] Preferably, the vinyl silicone oil is selected from at least one of dual-ended vinyl silicone oil, single-ended vinyl silicone oil, and side-chain vinyl silicone oil, and has a viscosity (25°C, ASTM D2196) of 20-1000 mPa·s.

[0030] Preferably, the vinyl silicone oil is a single-ended vinyl silicone oil (Guangdong Chenxi New Material Technology Co., Ltd., CX-352M, vinyl content 0.18wt%).

[0031] As a preferred technical solution, the methyl silicone oil is at least one of hexamethylcyclotrisiloxane, octamethylcyclotetrasiloxane, decamethylcyclopentasiloxane, and dodecylcyclohexasiloxane, with a viscosity (25°C, ASTM D2196) of 20-1000 mPa·s.

[0032] Preferably, the methyl silicone oil is hexamethylcyclotrisiloxane.

[0033] As a preferred technical solution, the crosslinking agent is a mixture of one or more of the following: end-hydrogen-containing silicone oil, side-hydrogen-containing silicone oil, or end-side-hydrogen-containing silicone oil, with a viscosity (25°C, ASTM D2196) of 10-5000 mPa·s.

[0034] Preferably, the crosslinking agent is a combination of end-hydrogen-containing silicone oil (Shanghai Jingri, brand name DH007) and side-hydrogen-containing silicone oil (Shanghai Jingri, brand name H020), and the mass ratio of the end-hydrogen-containing silicone oil to the side-hydrogen-containing silicone oil is (3-8):1, preferably 5:1.

[0035] As a preferred technical solution, the inhibitor is acetylenecyclohexanol.

[0036] As a preferred technical solution, the catalyst is a platinum catalyst.

[0037] This invention optimizes the selection and dosage of raw materials for the ultra-thin thermally conductive film to ensure a tight bond between it and the silicone thermally conductive pad, thereby guaranteeing the overall performance of the composite, easy-to-use, single-sided, ultra-flexible, high-thermal-conductivity pad. Specifically, controlling the mass ratio of vinyl silicone oil to crosslinking agent in the ultra-thin thermally conductive film to (20-30):(3-7) ensures the compression resilience of the composite thermally conductive pad while preventing loose bonding between the ultra-thin thermally conductive film and the thermally conductive pad after curing.

[0038] Furthermore, this invention optimizes the ceramic filler in the ultrathin thermal conductive film to be angular alumina, spherical alumina, or a combination of single-crystal alumina and zinc oxide, thereby further controlling the particle size of the ceramic filler in the ultrathin thermal conductive film to be 0.1-20μm. Combined with the highly thermally conductive modified mixed filler including single-crystal alumina, spherical alumina, zinc oxide, and aluminum nitride introduced into the silicone thermal conductive pad, the thermal conductivity of the composite thermal conductive pad is guaranteed to be above 8-10W / mk.

[0039] Furthermore, this invention introduces octyltrimethoxysilane or hexamethyldisilazane as a modifier into the ultrathin thermal conductive film and controls the mass ratio of ceramic filler to modifier to be 100:(0.5-5), so that the ceramic filler is uniformly dispersed in the organosilicon system, achieving good compatibility between the organic phase and inorganic materials, and reducing the difficulty of subsequent composite with organosilicon thermal conductive pads.

[0040] Another aspect of the present invention provides a method for preparing an easy-to-operate single-sided adhesive ultra-flexible high thermal conductivity pad, comprising at least the following steps:

[0041] (1) Preparation of ultrathin thermally conductive film;

[0042] (2) Add vinyl silicone oil, methyl silicone oil, crosslinking agent and inhibitor to a mixing tank, then add high thermal conductivity modified mixed filler and stir to mix, then add catalyst and stir to mix again to obtain compound rubber.

[0043] (3) After the compounded rubber is extruded onto the ultra-thin thermally conductive film, it is calendered and baked to obtain an easy-to-operate single-sided adhesive ultra-soft high thermal conductivity pad.

[0044] As a preferred technical solution, the preparation method of the ultrathin thermal conductive film is as follows: the modifier, vinyl silicone oil, crosslinking agent and inhibitor are put into a stirring tank, and after stirring and mixing, ceramic filler and catalyst are added. After stirring and mixing, the mixture is placed in a three-roll mill for kneading. After kneading, diluent is added, and after stirring and mixing, it is sprayed onto the base film. After baking and winding, the ultrathin thermal conductive film is obtained.

[0045] As a preferred technical solution, the diluent is an organosilicon diluent, preferably RH-2001-0.65 or Runhe.

[0046] As a preferred technical solution, the amount of diluent added is 0.5-50% based on the mass of the material after kneading.

[0047] As a preferred technical solution, the preparation method of the ultrathin thermal conductive film is as follows: Modifier, vinyl silicone oil, crosslinking agent, and inhibitor are added to a stirring tank and stirred at 10-200 rpm for 0.1-5 min. Ceramic filler and catalyst are added, and the mixture is stirred at 50-500 rpm for 0.5-30 min, maintaining a vacuum during stirring. After mixing, the mixture is placed in a three-roll mill for kneading, controlling the thickness to 5-50 μm. This kneading is performed three times. After kneading, a diluent is added, and the mixture is stirred at 50-500 rpm for 0.5-10 min. The mixture is then sprayed onto a base film, with a spray thickness controlled at 10-100 μm. The oven temperature is controlled at 100-140℃, and the baking time is 10-60 min. After baking, the film is wound up to obtain the ultrathin thermal conductive film.

[0048] As a preferred technical solution, step (2) specifically involves: adding vinyl silicone oil, methyl silicone oil, crosslinking agent, and inhibitor into a stirred tank, then adding a high thermal conductivity modified mixed filler and stirring at 10-50 rpm for 5-30 min, maintaining a temperature of 20-30°C and turning on the vacuum during stirring; then adding a catalyst and stirring at 30-50 rpm for 1-30 min, maintaining a temperature of 10-20°C and turning on the vacuum during stirring; after scraping the wall, continuing to stir at 5-20 rpm for 10-120 min to obtain the compound, maintaining a temperature of 10-20°C and turning on the vacuum during stirring.

[0049] As a preferred technical solution, the baking time in step (3) is 30-100 min, the temperature is 100-140℃, and the rolling thickness is 0.3-5 mm.

[0050] The easy-to-use single-sided adhesive ultra-flexible high thermal conductivity pad provided by this invention can achieve a hardness of Shore00 5-25° while maintaining a compression rebound rate of over 80%. It is also single-sided adhesive, easy to operate, and has high market promotion value. Beneficial effects

[0051] 1. This invention provides an easy-to-use single-sided adhesive ultra-flexible high thermal conductivity pad. By designing an ultra-thin thermal conductive film in conjunction with an organosilicon thermal conductive pad, the provided product has excellent compressibility and resilience while ensuring high thermal conductivity, and good operability, thus meeting practical application requirements.

[0052] 2. This invention optimizes the selection and addition amount of raw materials for the ultra-thin thermally conductive film, ensuring a tight bond between it and the silicone thermally conductive pad. This guarantees the overall performance of the easily operable, single-sided, ultra-flexible, high-thermal-conductivity pad after lamination. Specifically, controlling the mass ratio of vinyl silicone oil to crosslinking agent in the ultra-thin thermally conductive film to (20-30):(3-7) ensures the compression resilience of the laminated thermally conductive pad and prevents loose bonding between the ultra-thin thermally conductive film and the thermally conductive pad after curing.

[0053] 3. This invention optimizes the ceramic filler in the ultrathin thermal conductive film to be angular alumina, spherical alumina, or a combination of single-crystal alumina and zinc oxide, further controlling the particle size of the ceramic filler in the ultrathin thermal conductive film to be 0.1-20μm. Combined with the highly thermally conductive modified mixed filler including single-crystal alumina, spherical alumina, zinc oxide, and aluminum nitride introduced into the organosilicon thermal conductive pad, the thermal conductivity of the composite thermal conductive pad is guaranteed to be above 8-10W / mk.

[0054] 4. This invention introduces octyltrimethoxysilane or hexamethyldisilazane as a modifier into the ultrathin thermal conductive film and controls the mass ratio of ceramic filler to modifier to be 100:(0.5-5), so that the ceramic filler is uniformly dispersed in the organosilicon system, achieving good compatibility between the organic phase and inorganic materials, and reducing the difficulty of subsequent composite with organosilicon thermal conductive pads.

[0055] 5. The easy-to-operate single-sided adhesive ultra-flexible high thermal conductivity pad provided by the present invention can achieve a hardness of Shore00 5-25° while maintaining a compression rebound rate of over 80%. It is also single-sided adhesive, easy to operate, and has high market promotion value. Detailed Implementation

[0056] Example 1

[0057] Embodiment 1 of the present invention provides an easy-to-use, single-sided adhesive, ultra-flexible, high thermal conductivity pad, comprising an ultra-thin thermally conductive film and an organosilicon thermally conductive pad. By weight, the raw materials for preparing the ultra-thin thermally conductive film include: 125 parts ceramic filler, 25 parts vinyl silicone oil, 5 parts crosslinking agent, 0.5 parts modifier, 0.1 parts inhibitor, and 0.5 parts catalyst. By weight, the raw materials for preparing the organosilicon thermally conductive pad include: 200 parts high thermal conductivity modified mixed filler, 5 parts vinyl silicone oil, 1 part methyl silicone oil, 0.5 parts crosslinking agent, 0.1 parts inhibitor, and 0.2 parts catalyst.

[0058] The modifier is octyltrimethoxysilane.

[0059] By weight, the ceramic filler comprises 20 parts of 0.3μm single crystal alumina (BaiTu), 40 parts of 2μm spherical alumina (BaiTu), 60 parts of 20μm spherical alumina (BaiTu), and 5 parts of 0.5μm zinc oxide (BaiTu).

[0060] The raw materials for preparing the high thermal conductivity modified mixed filler include mixed ceramic filler and modifier, wherein the mass ratio of the mixed ceramic filler and silane modifier is 100:1.

[0061] By weight, the mixed ceramic filler comprises: single-crystal alumina (1.5 μm, 5 parts; 5 μm, 10 parts), spherical alumina (1 μm, 5 parts; 2 μm, 15 parts; 40 μm, 30 parts), zinc oxide (0.5 μm, 3 parts), and aluminum nitride (20 μm, 5 parts; 120 μm, 27 parts).

[0062] The silane modifier is octyltrimethoxysilane.

[0063] The preparation method of the high thermal conductivity modified mixed filler is as follows: the mixed ceramic filler is filled into the modification equipment, then the modifier is added, the modification equipment is closed to seal the cavity, and the mixture is stirred at 100 rpm for 20 minutes. After stirring, the modification equipment is opened and the powder that is raised is manually scraped off. The modification equipment is closed again and the mixture is stirred at 300 rpm for 10 minutes. After stirring, the modified filler is poured out and baked in an oven at 150°C for 3 hours. After baking, it is taken out and cooled to obtain the high thermal conductivity modified mixed filler.

[0064] The vinyl silicone oil is a single-ended vinyl silicone oil (Guangdong Chenxi New Material Technology Co., Ltd., CX-352M, vinyl content 0.18wt%).

[0065] The methyl silicone oil is hexamethylcyclotrisiloxane.

[0066] The crosslinking agent is a combination of end-hydrogen-containing silicone oil (Shanghai Jingri, brand name DH007) and side-hydrogen-containing silicone oil (Shanghai Jingri, brand name H020), with a mass ratio of end-hydrogen-containing silicone oil to side-hydrogen-containing silicone oil of 5:1.

[0067] The inhibitor is acetylcyclohexanol.

[0068] The catalyst is a platinum catalyst.

[0069] Another aspect of Embodiment 1 of the present invention provides a method for preparing an easy-to-operate single-sided adhesive ultra-flexible high thermal conductivity pad, comprising the following steps:

[0070] (1) Preparation of ultrathin thermally conductive film;

[0071] (2) Add vinyl silicone oil, methyl silicone oil, crosslinking agent and inhibitor to a mixing tank, then add high thermal conductivity modified mixed filler and stir to mix, then add catalyst and stir to mix again to obtain compound rubber.

[0072] (3) After the compounded rubber is extruded onto the ultra-thin thermally conductive film, it is calendered and baked to obtain an easy-to-operate single-sided adhesive ultra-soft high thermal conductivity pad.

[0073] The preparation method of the ultrathin thermal conductive film is as follows: Modifier, vinyl silicone oil, crosslinking agent and inhibitor are put into a stirring tank and stirred at 50 rpm for 3 min. Ceramic filler and catalyst are added and stirred at 200 rpm for 3 min. Vacuum is maintained during the stirring process. After mixing, the mixture is placed in a three-roll mill for kneading. The thickness is controlled to be 10 μm. Kneading is performed three times. After kneading, diluent is added and stirred at 200 rpm for 50 min. The mixture is then sprayed onto the base film with a spray thickness controlled to be 20 μm. The oven temperature is controlled to be 120℃ and the baking time is 60 min. After baking, the film is rolled up to obtain the ultrathin thermal conductive film.

[0074] The diluent is an organosilicon diluent, model RH-2001-0.65, Runhe.

[0075] The amount of diluent added is 1% based on the mass of the material after kneading.

[0076] The specific steps (2) are as follows: vinyl silicone oil, methyl silicone oil, crosslinking agent and inhibitor are added to a mixing tank, and then high thermal conductivity modified mixed filler is added and stirred at 10 rpm for 10 min. During stirring, the temperature is maintained at 25°C and a vacuum is turned on. Then the catalyst is added and stirred at 30 rpm for 5 min. During stirring, the temperature is maintained at 17°C and a vacuum is turned on. After scraping the wall, stirring is continued at 10 rpm for 120 min to obtain the compound. During stirring, the temperature is maintained at 17°C and a vacuum is turned on.

[0077] The baking process in step (3) takes 40 minutes, is 120°C, and has a rolling thickness of 0.3 mm.

[0078] Example 2

[0079] Example 2 of the present invention provides an easy-to-operate single-sided adhesive ultra-flexible high thermal conductivity pad and its preparation method. The specific implementation method is the same as that of Example 1, except that, by weight, the raw materials for preparing the ultra-thin thermal conductive film include: 125 parts of ceramic filler, 25 parts of vinyl silicone oil, 2 parts of crosslinking agent, 0.5 parts of modifier, 0.1 parts of inhibitor, and 0.5 parts of catalyst.

[0080] Example 3

[0081] Example 3 of the present invention provides an easy-to-operate single-sided adhesive ultra-flexible high thermal conductivity pad and its preparation method. The specific implementation method is the same as that of Example 1, except that, by weight, the raw materials for preparing the ultra-thin thermal conductive film include: 125 parts of ceramic filler, 25 parts of vinyl silicone oil, 8 parts of crosslinking agent, 0.5 parts of modifier, 0.1 parts of inhibitor, and 0.5 parts of catalyst. After curing, the ultra-thin thermal conductive film and the thermal conductive pad may not be tightly bonded.

[0082] Example 4

[0083] Example 4 of the present invention provides an easy-to-operate single-sided adhesive ultra-flexible high thermal conductivity pad and its preparation method. The specific implementation method is the same as that of Example 1, except that, by weight, the raw materials for preparing the organosilicon thermal conductive pad include: 150 parts of high thermal conductivity modified mixed filler, 5 parts of vinyl silicone oil, 1 part of methyl silicone oil, 0.8 parts of crosslinking agent, 0.1 parts of inhibitor, and 0.2 parts of catalyst.

[0084] Performance testing methods

[0085] The thermal conductivity, hardness, and compression resilience of the easy-to-operate single-sided adhesive ultra-flexible high thermal conductivity pad provided in the embodiments of the present invention were tested using the following methods, and the test results are shown in Table 1.

[0086] (1) Thermal conductivity: measured according to standard ASTM D 5470-17 using Taiwan Ruiling LW-9389 interface material thermal resistance and thermal conductivity measuring device (at 25℃).

[0087] (2) Hardness: Measured using a Shore 00 hardness tester (at 25°C) according to standard ASTM D2240.

[0088] (3) Compression rebound rate: The compression rebound rate was measured using a rapid compression tester (at 25°C) according to the standard ASTM D575. The compression rate was 20 mm / min, the pressure was held for 10 min, and the thickness was measured after the pressure was released and the thickness was left to stand for 20 min. The compression rebound rate was calculated based on the formula (compression rebound rate = (thickness after rebound - compressed thickness) / compressed thickness * 100%).

[0089] Table 1

Claims

1. An easy-to-handle single-sided adhesive ultra-flexible high thermal conductive gasket, characterized in that, Including ultra-thin thermally conductive films and silicone thermally conductive pads; By weight, the raw materials for preparing the ultrathin thermal conductive film include at least: 85-220 parts of ceramic filler, 10-50 parts of vinyl silicone oil, 1-10 parts of crosslinking agent, 0.5-5 parts of modifier, 0.1-2 parts of inhibitor, and 0.2-2 parts of catalyst.

2. The easy-to-handle single sided adhesive ultra flexible high thermal pad of claim 1, wherein, By weight, the raw materials for preparing the silicone thermal pad include at least: 150-300 parts of high thermal conductivity modified mixed filler, 2-15 parts of vinyl silicone oil, 0.1-5 parts of methyl silicone oil, 0.1-1 parts of crosslinking agent, 0.1-2 parts of inhibitor, and 0.2-2 parts of catalyst.

3. The easy-to-handle single sided adhesive ultra flexible high thermal pad of claim 2, wherein, The mass ratio of vinyl silicone oil to crosslinking agent in the ultrathin thermal conductive film is (20-30):(3-7).

4. The easy-to-handle single sided adhesive ultra flexible high thermal pad of claim 3, wherein, The vinyl content in the vinyl silicone oil is 0.08-10 wt%.

5. The easy-to-handle single sided adhesive ultra flexible high thermal pad of claim 4, wherein, The crosslinking agent is a mixture of one or more of the following: end-hydrogen-containing silicone oil, side-hydrogen-containing silicone oil, or end-side-hydrogen-containing silicone oil.

6. The easy-to-handle single-coated ultra-flexible high thermal conductive gasket of claim 5, wherein, The mass ratio of the ceramic filler to the modifier is 100:(0.5-5).

7. The easy-to-handle single-coated ultra-flexible high thermal conductive gasket of claim 6, wherein, The modifier is selected from at least one of octyltrimethoxysilane, dodecyltrimethoxysilane, n-octyltriethoxysilane, vinyltrimethoxysilane, and hexamethyldisilazane.

8. The easy-to-handle single-coated ultra-flexible high thermal conductive gasket of claim 7, wherein, The ceramic filler is selected from at least one of angular alumina, spherical alumina, single crystal alumina, aluminum nitride, magnesium oxide, and zinc oxide.

9. The easy-to-handle single-coated ultra-flexible high thermal conductive gasket of claim 8, wherein, The methyl silicone oil is at least one of hexamethylcyclotrisiloxane, octamethylcyclotetrasiloxane, decamethylcyclopentasiloxane, and dodecylcyclohexasiloxane.

10. A method of preparing the easy-to-handle single-sided adhesive ultra-flexible high thermal conductive gasket according to any one of claims 2-9, characterized in that, At least the following steps are included: (1) Preparation of ultrathin thermally conductive film; (2) Add vinyl silicone oil, methyl silicone oil, crosslinking agent and inhibitor to a mixing tank, then add high thermal conductivity modified mixed filler and stir to mix, then add catalyst and stir to mix again to obtain compound rubber. (3) After the compounded rubber is extruded onto the ultra-thin thermally conductive film, it is calendered and baked to obtain an easy-to-operate single-sided adhesive ultra-soft high thermal conductivity pad.

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