Sensor assembly

Abstract

A sensor assembly (100) comprising casing (102) having inner periphery (104), outer periphery (106), and grooved segment (110) is disclosed. Grooved segment (110) includes at least first slot (112) extending along first axis and at least second slot (114) extending along second axis perpendicular to first axis. Sensor assembly (100) further comprises magnetic core (108) encased within inner periphery (104) and outer periphery (106) of casing (102), and integrated electronic device (130) to be housed in one of first slot (112) and second slot (114). Grooved segment (110) includes first protrusion (116) and second protrusion (118) adjacent to first protrusion (116), spanning across periphery (120) of grooved segment (110) along second axis and extending towards outer periphery (106) of casing (102) along first axis. Trench (122) is formed between first protrusion (116) and second protrusion (118) to hold integrated electronic device (130).

Description

[0001] SENSOR ASSEMBLY

[0002] TECHNICAL FIELD

[0003]

[0001] The present subject matter relates to an assembly for sensing a parameter associated with an object and in particular relates to a sensor assembly for sensing an electrical parameter associated with an electrical conductor.

[0004] BACKGROUND

[0005] [2] Advancements in field of Electrical and Electronics Engineering (EEE) has led to significant increase in the use of electricity-based appliances, devices, instruments, and machines particularly Electric Vehicles (EVs). An Electric Vehicle (EV) relies on Microcontroller Units (MCUs) for managing and monitoring components within the EV including electric motor, battery pack, brake assembly, Battery Management System (BMS), and converters. These components rely on various parameters, such as temperature, pressure, and electrical metrics (for example, electric current, electric voltage, and electric power), which are monitored by sensor assemblies comprising current and voltage sensors. The sensor assemblies detect values related to electrical conductors comprising busbars, signal wires, charging cables, battery cables, High-Voltage (HV) cables and relay this information containing determined value to the Microcontroller Unit (MCU). The MCU uses this information for performing further necessary operations. Sensor assemblies thus play a crucial role in ensuring adequate operation of electricity-based appliances, devices, instruments, and machines, particularly EVs.

[0006] BRIEF DESCRIPTION OF FIGURES [3] Devices and / or systems are now described, in accordance with examples of the present subject matter and with reference to the accompanying figures. It should be noted that the description and figures are merely examples of the present subject matter and are not meant to represent the subject matter itself.

[0007] [4] Figure 1A illustrates a perspective view of a sensor assembly, in accordance with an implementation of the present subject matter;

[0008] [5] Figure 1 B illustrates a schematic top view of a sensor assembly, in accordance with an example implementation of the present subject matter;

[0009] [6] Figure 1 C illustrates a perspective view of a sensor assembly having an integrated electronic device housed therein, in accordance with an example implementation of the present subject matter;

[0010] [7] Figure 1 D illustrates a top view of a sensor assembly having an integrated electronic device housed therein, in accordance with another example implementation of the present subject matter;

[0011] [8] Figure 1 E illustrates a side view of a sensor assembly as depicted in Figure 1 C, in accordance with an example implementation of the present subject matter;

[0012] [9] Figure 1 F illustrates a perspective view of a sensor assembly as depicted in Figure 1 D, in accordance with another example implementation of the present subject matter;

[0013]

[0010] Figure 1 G illustrates an expanded view of a grooved segment of a casing of a sensor assembly in accordance with an example implementation of the present subject matter;

[0014]

[0011] Figure 1 H illustrates a top view of a sensor assembly in accordance with an example implementation of the present subject matter.

[0015]

[0012] Throughout the drawings, identical reference numbers designate similar, but not necessarily identical, elements. The figures are not necessarily to scale, and the size of some parts may be exaggerated to more clearly illustrate the example shown. Moreover, the drawings provide examples and / or implementations consistent with the description; however, the description is not limited to the examples and / or implementations provided in the drawings.

[0016] DETAILED DESCRIPTION

[0017]

[0013] Conventional sensor assemblies sense and determine electrical parameters associated with electrical conductors. The conventional sensor assemblies include Integrated Circuits (ICs) which facilitate the conventional sensor assemblies to sense the presence of the electrical parameters that are to be determined for the electrical conductors and further facilitate the conventional sensor assemblies to obtain determined values of the electrical parameters.

[0018]

[0014] In a conventional sensor assembly, an Integrated Circuit (IC) for sensing and determining an electrical parameter associated with an electrical conductor is housed within a casing of the conventional sensor assembly. The housing of the IC within the casing of the conventional sensor assembly is fabricated using techniques which may include through- hole mounting, surface mounting, chip-on-board mounting, socket mounting, and embedding. In some scenarios, hybrid housing techniques are also employed where multiple housing techniques are used in combinations for housing the IC within the casing of the conventional sensor assembly. Although these housing techniques facilitate a safe and secure housing of the ICs within the casings of the conventional sensor assemblies, the conventional sensor assemblies due to their conventional designs can accommodate the ICs in a unidirectional manner only.

[0019]

[0015] Therefore, a conventional sensor assembly, once designed, can accommodate an IC within its casing only when the IC is housed along a single axis, which may be a horizontal axis or a vertical axis, for which the conventional sensor assembly was designed. Thus, conventional sensor assemblies designed for housing the ICs in a horizontal manner can only accommodate ICs when the ICs are housed horizontally, i.e. along the horizontal axis, and conventional sensor assemblies designed for housing the ICs in a vertical manner can only accommodate the ICs when the ICs are housed vertically, i.e. along the vertical axis. Thus, conventional sensor assemblies designed for horizontal housing of the ICs cannot accommodate ICs in a vertical manner and conventional sensor assemblies designed for vertical housing of the ICs cannot accommodate ICs in a horizontal manner. Therefore, the conventional sensor assemblies are incapable of accommodating the ICs along both axes, i.e. horizontal axis and vertical axis.

[0020]

[0016] Further, a conventional sensor assembly designed for horizontal housing of the IC may have sensing capabilities along the horizontal axis but not vertical axis. Similarly, a conventional sensor assembly designed for vertical housing of the IC may have sensing capabilities along the vertical axis but not horizontal axis. Therefore, the limitation of unidirectional housing of the ICs within conventional sensor assemblies further limits operational capabilities of the conventional sensor assemblies. For instance, a conventional sensor assembly designed for horizontal housing of the IC may not prove efficient and effective in a scenario, where vertical sensing capabilities, i.e. sensing capabilities along vertical axis, of an IC may be required. Therefore, in such a scenario, the conventional sensor assembly, having horizontally housed IC, may provide inaccurate results and may further require replacement by a conventional sensor assembly with vertical housing of IC for accurate results. Thus, once designed, the conventional sensor assemblies have unidirectional sensing capabilities making the conventional sensor assemblies non-flexible and unfeasible for diverse use.

[0021]

[0017] Drawbacks like unidirectional IC housing capabilities and unidirectional sensing capabilities further adds to the manufacturing costs and procurement costs associated with conventional sensor assemblies. This is because one conventional sensor assembly for horizontal application and one conventional sensor assembly for vertical application is needed to be manufactured and procured separately. This not only drives up operational costs for both manufacturers and users but also highly contributes to the carbon footprint associated with conventional sensor assemblies.

[0022]

[0018] Approaches of present subject matter facilitates mitigation of unidirectional IC housing and unidirectional sensing capabilities associated with conventional sensor assemblies. The approaches of the present subject matter discloses bidirectional housing of ICs within sensor assemblies which increases operational capabilities of sensor assemblies by providing bidirectional sensing capabilities. The present subject matter achieves bidirectional IC housing and bidirectional sensing capabilities in sensor assemblies while providing reduced manufacturing costs, reduced procurement costs, and reduced carbon footprint.

[0023]

[0019] In an example, the present subject matter facilitates a sensor assembly including, but is not limited to, a current sensor assembly, voltage sensor assembly, and a power sensor assembly. In an example, the sensor assembly may comprise a casing, a magnetic core, and an integrated electronic device. In an example, the casing of the sensor assembly may include an inner periphery and an outer periphery. In an example, the magnetic core may be encased within the inner periphery and the outer periphery of the casing of the sensor assembly. In an example, the magnetic core may be made of materials with high magnetic permeability. Examples of materials which may be used for the magnetic core of the sensor assembly may include but are not limited to iron, ferrites, silicon steel, and stainless steel.

[0024]

[0020] Further, the integrated electronic device may include, but is not limited to, Integrated Circuit (IC), Field-Programmable Gate Array (FPGA), Printed Circuit Board (PCB), and Micro-Electro-Mechanical System (MEMS). The integrated electronic device may include, a sensing element, including but not limited to resistors, Hall Effect elements (which may comprise Gallium Arsenide, Indium Arsenide, Indium Antimonide, and Graphene), windings, and coils.

[0025]

[0021] The integrated electronic device of the sensor assembly may be housed within a grooved segment of the casing. In an example, the grooved segment of the casing may be a portion of the casing of the sensor assembly which may include one or more continuous or intermittent recesses, channels, ribs, bulges, protrusions, slots, and trenches. In an example, the grooved segment of the casing may comprise at least a first slot extending along a first axis, hereinafter interchangeably referred to as horizontal axis. In an example, the first slot extending along first axis may be a hollow cutout on the surface of the casing of the sensor assembly along the first axis. Further, in an example, the grooved segment of the casing may further include at least a second slot extending along a second axis, hereinafter interchangeably referred to as vertical axis. The second axis may be perpendicular to the first axis. In an example, the second slot extending along the second axis may be a hollow cutout on the surface of the casing of the sensor assembly along the second axis. In an example, one of the first slot and the second slot of the grooved segment may house the integrated electronic device within the grooved segment of the casing.

[0026]

[0022] Further, in an example, the grooved segment of the casing accommodating the integrated electronic device may comprise at least a first protrusion and a second protrusion, adjacent to the first protrusion. The first protrusion and the second protrusion may span across periphery of the grooved segment along the second axis and extend towards the outer periphery of the casing along the first axis. In an example, the first protrusion and the second protrusion extending along the first axis may form a trench between each other. The trench formed between the first protrusion and the second protrusion may span across the periphery of the grooved segment along the second axis. In an example, the trench may hold the integrated electronic device when housed within the grooved segment of the casing of the sensor assembly.

[0023] In an example implementation, the sensor assembly comprising the casing, the magnetic core, and the integrated electronic device may house the integrated electronic device within the grooved segment of the casing along the first axis. The housing of the integrated electronic device along the first axis may be facilitated by the trench which may hold the integrated electronic device housed within the second slot of the grooved segment.

[0027]

[0024] In another example implementation, the sensor assembly comprising the casing, magnetic core, and the integrated electronic device may house the integrated electronic device within the grooved segment of the casing along the second axis. The housing of the integrated electronic device along the second axis may be facilitated by the trench which may hold the integrated electronic device housed within the first slot of the grooved segment.

[0028]

[0025] The present sensor assembly may provide several technical benefits and advantages compared to conventional sensor assemblies. With the sensor assembly comprising the grooved segment including the first slot extending along the first axis, the second slot extending along the second axis, and the first protrusion and the second protrusion forming the trench, the integrated electronic device may be housed within the grooved segment of the casing along one of the first axis and the second axis. The integrated electronic device may therefore be housed within the grooved segment of the casing in a bidirectional manner.

[0029]

[0026] In an example, the integrated electronic device may be housed within the grooved segment of the casing along the first axis which may be the horizontal axis. The housing of the integrated electronic device in horizontal manner, i.e. along the first axis, may be facilitated by holding the integrated electronic device within the trench between the first protrusion and the second protrusion. The integrated electronic device when held by the trench in the horizontal manner may house the integrated electronic device on the second slot of the grooved segment of the casing. The sensor assembly may thus be capable of housing the integrated electronic device along the first axis in the horizontal manner.

[0030]

[0027] In another example implementation, the integrated electronic device may be housed within the grooved segment of the casing along the second axis which may be the vertical axis. The housing of the integrated electronic device in vertical manner, i.e. along the second axis, may be facilitated by holding the integrated electronic device within the trench between the first protrusion and the second protrusion. The integrated electronic device when held by the trench in the vertical manner may house the integrated electronic device on the first slot of the grooved segment of the casing. The sensor assembly may thus be capable of housing the integrated electronic device along the second axis in the vertical manner.

[0031]

[0028] Therefore, the integrated electronic device may be housed within the casing of the sensor assembly in the grooved segment of the casing along one of both axes, i.e. the first axis and the second axis. In both scenarios the integrated electronic device is housed within the grooved segment of the casing and held by the first protrusion and the second protrusion in the trench formed within the grooved segment. In the first scenario where the integrated electronic device is housed along the first axis the second slot houses the integrated electronic device whereas in the second scenario where the integrated electronic device is housed along the second axis the first slot houses the integrated electronic device. Therefore, as disclosed in the aforementioned subject matter the present invention may facilitate the sensor assembly to have casing capable of housing the integrated electronic device along one of the first axis and the second axis, thereby enabling bidirectional housing of the integrated electronic device within the casing of the sensor assembly.

[0032]

[0029] The sensor assembly’s bidirectional housing capability of the integrated electronic device may further enhance the operational capabilities of the sensor assembly. The sensor assembly when housed with the integrated electronic device along the first axis, i.e. the horizontal axis may provide sensing capabilities along the horizontal axis. Whereas the same sensor assembly when housed with the integrated electronic device along the second axis, i.e. , the vertical axis may provide sensing capabilities along the vertical axis. Therefore, any orientation whether horizontal or vertical, of the integrated electronic device, may be accommodated by the same casing of the sensor assembly as per requirement without impacting the sensing capabilities of the sensor assembly. This greatly enhances the operational capabilities of the sensor assembly and makes the sensor assembly more flexible and suitable for diverse use.

[0033]

[0030] Additionally, the ability to house the integrated electronic device within the sensor assembly along one of the first axis and the second axis may eliminate the requirement of manufacturing and procuring multiple sensor assemblies. With bidirectional housing of the integrated electronic device within the sensor assembly no separate sensor assemblies for horizontal application and vertical application may need to be manufactured and procured. This significantly reduces the manufacturing cost and procurement costs associated with the sensor assemblies as a single sensor assembly may be used for both applications as per requirement. Subsequently, the carbon footprint associated with the sensor assemblies also reduces.

[0034]

[0031] The detailed description of the present subject matter is better understood when read in conjunction with the appended drawings. For the purpose of illustrating the present subject matter, exemplary constructions of the present subject matter are shown in the drawings. However, the present subject matter is not limited to the specific structures and methods disclosed herein.

[0035]

[0032] Detailed embodiments of the present subject matter are disclosed herein; however, it is to be understood that the disclosed embodiments are merely exemplary of the present subject matter, which may be embodied in various forms. Therefore, specific functional and structural details disclosed herein are not to be interpreted as limiting, but merely as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the present subject matter in virtually any appropriately detailed structure.

[0036]

[0033] The present subject matter overcomes the aforesaid drawbacks of conventional sensor assemblies. The objects, features, and advantages of the present subject matter will now be described in greater detail. Also, the following description includes various specific details and is to be regarded as merely exemplary. Accordingly, those of ordinary skill in the art will recognize that: without departing from the present disclosure and its various embodiments there may be any number of changes and modifications described herein.

[0037]

[0034] It must also be noted that as used herein and in the appended claims, the singular forms "a", "an," and "the" include plural references unless the context clearly dictates otherwise. Although any systems and methods similar or equivalent to those described herein can be used in the practice or testing of embodiments of the present subject matter, the preferred, systems are now described.

[0038]

[0035] Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present subject matter belongs.

[0039]

[0036] In addition to the features and components described herein, the system may include one or more other components, including but not limited to a processor, a memory, an interface, a display screen, a power supply device, and energy storage device.

[0040]

[0037] Figure 1A illustrates a perspective view of a sensor assembly 100 in accordance with an example implementation of the present subject matter. The sensor assembly 100 hereinafter interchangeably referred to as sensor 100 may include but is not limited to a current sensor assembly, voltage sensor assembly, an electric power sensor assembly, and an electromagnetic sensor assembly. In an example, the sensor 100 may comprise a casing 102. The casing 102 may include an inner periphery 104 and an outer periphery 106. In an example, the casing 102 comprising the inner periphery 104 and the outer periphery 106 may be made of predetermined materials which may include but is not limited to Nylon (30 percent glass filled). The use of the predetermined materials including but not limited to Nylon (30 percent glass filled) may provide the sensor 100 with fire resistant properties. Further, the predetermined materials may also provide the sensor 100 with a high dimensional stability thereby facilitating the sensor 100 to maintain its shape and size under varying conditions, leading to precise performance and reduced maintenance. The overall reliability of the sensor 100 may thereby increase causing overall efficiency to improve. Additionally, the high dimensional stability of the predetermined materials used for the casing 102 of the sensor 100 may also facilitate in secure and tight holding of one or more components of the sensor 100 within the casing 102.

[0041]

[0038] In an example, sensor 100 may comprise a magnetic core 108 encased within the inner periphery 104 and the outer periphery 106 of the casing 102. In an example, the magnetic core 108 encased within the casing 102 may be made of materials with high magnetic permeability. Examples of materials which may be used for the magnetic core 108 of the sensor 100 may include but are not limited to iron, ferrites, silicon steel, and stainless steel. In an example, the magnetic core 108 of the sensor 100 may include laminations. In an example, encasing the magnetic core 108 within the inner periphery 104 and the outer periphery 106 of the casing 102 may concentrate magnetic fields in vicinity of the sensor 100. Therefore, the sensing capabilities of the sensor 100 may further improve.

[0042]

[0039] Further, in an example, the sensor 100 may comprise an integrated electronic device (not shown in Figure 1A). Examples of the integrated electronic device may include but are not limited to Integrated Circuit (IC), Field-Programmable Gate Array (FPGA), Printed Circuit Board (PCB), and Micro-Electro-Mechanical System (MEMS). In an example, the integrated electronic device may comprise a sensing element (not shown in Figure 1A). Examples of the sensing element may include but are not limited to resistors, Hall Effect elements (which may comprise Gallium Arsenide, Indium Arsenide, Indium Antimonide, and Graphene), windings, and coils. The sensing element of the integrated electronic device may sense an electrical parameter comprising electric current, electric voltage, electromagnetic flux, electrical field, and magnetic field generated by electric current corresponding to an electrical conductor. Examples of electrical conductor may include but are not limited to busbars, signal wires, charging cables, battery cables, and High-Voltage cables which may be made of electrically conductive materials and may lie within vicinity of the sensor 100.

[0043]

[0040] In an example, the integrated electronic device of the sensor 100 may be housed within a grooved segment 110 (as indicated by a circle in Figure 1A) of the casing 102. In an example, the grooved segment 110 of the casing 102 may be a portion of the casing 102 of the sensor 100 which may include one or more continuous or intermittent recesses, channels, ribs, bulges, protrusions, slots and trenches.

[0044]

[0041] In an example, the grooved segment 110 of the casing 102 may comprise at least a first slot 112. In an example, the grooved segment 110 of the casing 102 may further comprise at least a second slot 114. The first slot 112 and the second slot 114 may be perpendicular to each other. In an example, the first slot 112 may extend along a first axis-XX, hereinafter interchangeably referred to as horizontal axis-XX. In an example, the second slot 114 may extend along a second axis-YY, hereinafter interchangeably referred to as vertical axis-YY. In an example, the first slot 112 extending along first axis-XX and the second slot 114 extending along the second axis-YY may be hollow cutouts on surface of the casing 102 of the sensor 100 along the first axis-XX and the second axis-YY respectively. In an example, the first axis-XX and the second axis-YY may meet at an angle A which may be ninety degrees. In an example, the first slot 112, parallel to the first axis-XX, and the first axis-XX may be perpendicular to the second slot 114, parallel to the second axis-YY, and the second axis- YY. In an example, one of the first slot 112 and the second slot 114 of the grooved segment 110 may house the integrated electronic device within the grooved segment 110 of the casing 102.

[0045]

[0042] Further, in an example, the grooved segment 110 of the casing 102 accommodating the integrated electronic device may at least comprise adjacently placed a first protrusion 116 and a second protrusion 118. In an example, the first protrusion 116 and the second protrusion 118 may be rib shaped structures on periphery 120 of the grooved segment 110. The first protrusion 116 and the second protrusion 118 may span across periphery 120 of the grooved segment 110 along the second axis-YY. In an example, the first protrusion 116 and the second protrusion 118 may simultaneously extend outwards towards the outer periphery 106 of the casing 102. The first protrusion 116 and the second protrusion 118 extending along the first axis-XX while spanning across the second axis-YY may form a trench 122 between each other on the periphery 120 of the grooved segment 110. The trench 122 formed between the first protrusion 116 and the second protrusion 118 may be a U-shaped recess. In an example, the trench 122 may span across the periphery 120 of the grooved segment 110 along the second axis-YY. In an example, the trench 122 may hold the integrated electronic device when housed within the grooved segment 110 of the casing 102 of the sensor 100.

[0046]

[0043] In an example implementation, the sensor 100 comprising the casing 102, the magnetic core 108, and the integrated electronic device may house the integrated electronic device within the grooved segment 110 of the casing 102 along the first axis-XX. The housing of the integrated electronic device along the first axis-XX may be facilitated by the trench 122 which may hold the integrated electronic device, guided within the trench 122 by the first protrusion 116 and the second protrusion 118, housed within the second slot 114 of the grooved segment 110.

[0044] In another example implementation, the sensor 100 comprising the casing 102, the magnetic core 108, and the integrated electronic device may house the integrated electronic device within the grooved segment 110 of the casing 102 along the second axis-YY. The housing of the integrated electronic device along the second axis-YY may be facilitated by the trench 122 which may hold the integrated electronic device, guided within the trench 122 by the first protrusion 116 and the second protrusion 118, housed within the first slot 112 of the grooved segment 110.

[0047]

[0045] Figure 1 B illustrates a schematic top view of the sensor 100 in accordance with an example implementation of the present subject matter.

[0048]

[0046] In an example, as shown in Figure 1 B, the grooved segment 110 may comprise a third slot 124, adjacent to the first slot 112. The third slot 124 may be parallel to the first slot 112 and perpendicular to the second slot 114. In an example, the third slot 124 may extend along the first axis-XX. In an example, the third slot 124 extending along first axis-XX may be hollow cutout on surface of the casing 102 of the sensor 100 along the first axis- XX. In an example, the third slot 124, parallel to the first slot 112 and the first axis-XX, may be perpendicular to the second slot 114 and the second axis-YY. In an example, the third slot 124 may facilitate the first slot 112 to house the integrated electronic device within the grooved segment 110 of the casing 102 when the integrated electronic device is placed along the second axis-YY in the sensor 100. In an example, the third slot 124 may be similar to the first slot 112. Even though only the first slot 112, the second slot 114, and the third slot 124 have been shown within the grooved segment 110 of the casing 102 of the sensor 100, the number of such slots may be varied based on requirements which include size and number of integrated electronic devices that may need to be housed within the casing 102. Therefore, the adaptability of the grooved segment 110 of the casing 102 to have variable number of slots may facilitate the sensor 100 to be more flexible and allow widespread usage of the sensor 100.

[0047] In an example, the grooved segment 110 of the casing 102 may further comprise a third protrusion 126 and a fourth protrusion 128 on either side of the second slot 114. In an example, the third protrusion 126 and the fourth protrusion 128 may be rib shaped structures on the periphery 120 of the grooved segment 110. The third protrusion 126 and the fourth protrusion 128 may span across periphery 120 of the grooved segment 110 along the second axis-YY. In an example, the third protrusion 126 and the fourth protrusion 128 may simultaneously extend inwards towards the inner periphery 104 of the casing 102. The first protrusion 116, second protrusion 118, third protrusion 126, and the fourth protrusion 128 may hereinafter be referred to as plurality of protrusions. Even though only the first protrusion 116, the second protrusion 118, the third protrusion 126, and the fourth protrusion 128 have been shown within the grooved segment 110 of the casing 102 of the sensor 100, the number of such protrusions may be varied based on requirements which include size and number of integrated electronic devices that may need to be housed within the casing 102. Further, the third protrusion 126 and the fourth protrusion 128 within the grooved segment 110 may facilitate in secure and tight holding of multiple integrated electronic devices when housed within the casing 102 along one of the first axis-xx and the second axis-YY.

[0049]

[0048] Figure 1 C illustrates a perspective view of the integrated electronic device housed within the sensor in accordance with an example implementation of the present subject matter.

[0050]

[0049] In an example, as shown in Figure 1 C, an integrated electronic device 130, similar to the integrated electronic device as described in Figures 1A and 1 B, may be housed within the grooved segment 110 of the casing 102. In an example, the integrated electronic device 130 may be placed along the second axis-YY which may be the vertical axis. The integrated electronic device 130 may be housed within the casing 102 in vertical manner, i.e. along the second axis-YY. The integrated electronic device 130 housed along the second axis-YY within the grooved segment 110 of the casing 102 may be held by the trench 122. The trench 122 may hold the integrated electronic device 130 while the first protrusion 116 and the second protrusion 118 guide the integrated electronic device 130 within the trench 122. In an example, the integrated electronic device 130 may comprise one or more terminals 132. In an example, the one or more terminals 132 of the integrated electronic device 130 may include wires, pins, and leads comprising electrically conductive materials capable of exchanging signals including digital and analog signals.

[0051]

[0050] The integrated electronic device 130, housed within the grooved segment 110 along the second axis-YY may facilitate the one or more terminals 132 to be parallel to the second axis-YY. The one or more terminals 132, parallel to the second axis-YY, may pass through the slots parallel to the first axis-XX and perpendicular to the second axis-YY. Therefore, the integrated electronic device 130 housed along the second axis-YY in the casing 102 of the sensor 100 may facilitate the one or more terminals 132, of the integrated electronic device 130, to protrude out from the first slot 112 (not shown in Figure 1 C). Therefore, the first slot 112 may house the integrated electronic device 130 within the grooved segment 110 as the one or more terminals 132 of the integrated electronic device 130 protrude out from the casing 102 in vertical direction, i.e. the second axis- YY and through the slots parallel to the first axis-XX. In an example, the third slot 124 (not shown in Figure 1 C), simultaneously with the first slot 112, may house the integrated electronic device 130 along the second axis-YY.

[0052]

[0051] Figure 1 D illustrates a top view of the integrated electronic device housed within the sensor in accordance with an example implementation of the present subject matter.

[0053]

[0052] In an example, as shown in Figure 1 D, the integrated electronic device 130 may be housed within the grooved segment 110 of the casing 102 along the second axis-YY. Vertical housing, i.e. housing along direction of the second axis -YY may facilitate the integrated electronic device 130 to engage with the first slot 112 (not shown in Figure 1 D) which may house the integrated electronic device 130. In an example, as shown in Figure 1 D, the first protrusion 116 and the second protrusion 118 may provide structural support and guidance for the integrated electronic device 130, ensuring secure and precise positioning within the trench 122 of the grooved segment 110. The trench 122 may allow for secure retention of the integrated electronic device 130 while facilitating easy insertion and removal for maintenance or replacement. This alignment may ensure proper positioning and orientation of the integrated electronic device 130, optimizing its sensing capabilities and overall performance, along the second axis-YY. The trench 122 may further securely hold the integrated electronic device 130 thereby m itigating any effects of vibrations and shocks which the sensor 100 may experience when housed within an electric machine further improving reliability and precision.

[0054]

[0053] Figure 1 E illustrates a side view of the integrated electronic device housed within the sensor in accordance with an example implementation of the present subject matter.

[0055]

[0054] In an example, as shown in Figure 1 E, the housing of the integrated electronic device 130 along the second axis-YY within the casing 102 of the sensor 100 may facilitate the one or more terminals 132 to be parallel to the second axis-YY. The one or more terminals 132 may be perpendicular to the first axis-XX along which the first slot 112 (not shown in Figure 1 E) and the third slot 124 (not shown in Figure 1 E) lie. The one or more terminals 132 may thus be housed within the first slot 112 and the third slot 124 and may be perpendicular to the first slot 112 and the third slot 124. In an example, as shown in Figure 1 E, the one or more terminals 132 of the integrated electronic device 130 may lie outside of the casing 102 of the sensor 100. The protrusion of the one or more terminals 132 may allow for easy access to the one or more terminals 132 for electrical connections while maintaining the integrated electronic device's position along the second axis-YY. This may improve flexibility of sensor 100 during installation, allowing for optimal terminal access based on the specific application requirements.

[0056]

[0055] Figure 1 F illustrates a perspective view of the integrated electronic device housed within the sensor in accordance with an example implementation of the present subject matter.

[0057]

[0056] In an example, as shown in Figure 1 F, the integrated electronic device 130, may be housed within the grooved segment 110 of the casing 102. In an example, the integrated electronic device 130 may be placed along the first axis-XX which may be the horizontal axis. The integrated electronic device 130 may be housed within the casing 102 in horizontal manner, i.e. along the first axis-XX. Horizontal housing, i.e. housing along direction of the first axis -XX may facilitate the integrated electronic device 130 housed along the first axis-XX within the grooved segment 110 of the casing 102 to be held by the trench 122. The trench 122 may hold the integrated electronic device 130 while the first protrusion 116 and the second protrusion 118 guide the integrated electronic device 130 within the trench 122.

[0058]

[0057] In an example, the integrated electronic device 130, housed within the grooved segment 110 along the first axis-XX may facilitate the one or more terminals 132 to be parallel to the first axis-XX. The one or more terminals 132, parallel to the first axis-XX, may pass through the slots parallel to the second axis-YY and perpendicular to the first axis-XX. Therefore, the integrated electronic device 130 housed along the first axis- XX in the casing 102 of the sensor 100 may facilitate the one or more terminals 132, of the integrated electronic device 130, to protrude out from the second slot 114. Therefore, the second slot 114 may house the integrated electronic device 130 within the grooved segment 110 as the one or more terminals 132 of the integrated electronic device 130 protrude out from the casing 102 in horizontal direction, i.e. the first axis-XX and through the slots parallel to the second axis-YY. This alignment may ensure proper positioning and orientation of the integrated electronic device 130, optimizing its sensing capabilities and overall performance, along the first axis-XX.

[0059]

[0058] Further, the alignment of the integrated electronic device 130 along first axis-XX may facilitate the one or more terminals 132 to be parallel to the first axis-XX. The one or more terminals 132 may be perpendicular to the second axis-YY along which the second slot 114 may lie. The one or more terminals 132 may thus be housed within the second slot 112 and may be perpendicular to the second slot 114. In an example, as shown in Figure 1 H, the one or more terminals 132 of the integrated electronic device 130 may lie outside of the casing 102 of the sensor 100. The protrusion of the one or more terminals 132 may allow for easy access to the one or more terminals 132 for electrical connections while maintaining the integrated electronic device's position along the first axis-XX.

[0060]

[0059] Figure 1 G illustrates an expanded view of the grooved segment of the casing of the sensor in accordance with an example implementation of the present subject matter.

[0061]

[0060] In an example, as shown in the Figure 1 G, the first slot 112, the second slot 114, third slot 124, and trench 122 may be aligned to each other along the first axis-XX and the second axis-YY. In an example, this alignment may facilitate the bidirectional housing of the integrated electronic device 130 (not shown in Figure 1 G) within the grooved segment 110 of the casing 102. In an example, the integrated electronic device 130 housed along the first axis-XX, may be held by the trench 122 and guided within the second slot 114 of the grooved segment 110. Conversely, the integrated electronic device 130 housed along the second axis-YY, may be held by the trench 122 and guided within the first slot 112 and the third slot 124 of the grooved segment 110. This alignment of the trench 122, the first slot 112, the second slot 114, and the third slot 124 along the first and second axes enhances the operational flexibility of the sensor 100, allowing it to accommodate the integrated electronic device 130 in either a horizontal or vertical orientation, i.e. along the first axis-XX and the second axis-YY respectively, depending on the specific requirements of the application. This design feature contributes to the adaptability of the sensor 100, making it suitable for diverse use scenarios.

[0062]

[0061] In an example, as shown in Figure 1 G, the first slot 112 may have a length L1. In an example, the length L1 of the first slot may be 2.18 millimetres (mm). In an example, the first slot 112 may have a width W1. In an example, the width W1 of the first slot 112 may be 0.45mm. The length L1 and the width W1 of the first slot 112 may be similar to length and width of the third slot 124, respectively. In an example, the second slot 114 may have a width W2. In an example, the width W2 of the second slot 114 may be 0.79mm. In an example, the trench 122 may have a width W3. The width W3 of the trench 122 may be 1 ,3mm. In an example, the first protrusion 116 may have a width W4. The width W4 of the first protrusion may be 0.85mm. The width W4 of the first protrusion 116 may be similar to a width of the second protrusion 118.

[0063]

[0062] Figure 1 H illustrates top view of the sensor in accordance with an example implementation of the present subject matter.

[0064]

[0063] In an example, as shown in Figure 1 H the inner periphery 104 and the outer periphery 106 of the sensor 100 may be concentric and have a common centre 01. The concentric inner periphery 104 and outer periphery 106 may have respective diameters. In an example, a first diameter, hereinafter interchangeably referred to as diameter D1 of the inner periphery 104 may be a distance between points P1 and P2 on the inner periphery of the casing 102. In an example, a second diameter, hereinafter interchangeably referred to as diameter D2 of the outer periphery 106 may be a distance between points P3 and P4 on the outer periphery 106 of the casing 102. In an example, the diameter D1 may be 16.11 mm. In an example, the diameter D2 may be 27.61 mm. In an example, the diameter D2 may always be greater than the diameter D1. The larger size of the diameter D2 over diameter D1 may form a hollow cavity 134 within the casing 102 of the sensor 100. The hollow cavity 134 may house electrical conductor (not shown in Figures 1A to 1 H), as described in Figure 1A, for which the sensor 100 may sense and determine electrical parameter, as described in Figure 1A.

[0065]

[0064] In an example, as shown in Figure 1 H, the inner periphery 104 of the casing 102 may be circular. In an example, not shown in 1A to 1 H, the outer periphery 106 of the casing 102 may be circular. The circular design of the outer and inner peripheries of the casing 102 may provide a compact and efficient structure for the sensor 100, allowing it to be easily integrated into various systems and devices. The concentric arrangement of the outer and inner peripheries may provide a uniform distribution of magnetic field, which may be generated by the electrical conductor in vicinity of the sensor 100, i.e. within the hollow cavity 134 of the sensor 100, concentrated by the magnetic core 108, facilitating the integrated electronic device to interact with the magnetic core 108 using the sensing element to convert this magnetic into a signal of proportional value, thereby enhancing sensing capabilities of the sensor 100.

[0066]

[0065] In an example, a system (not shown in Figures 1A to 1 H) may include the sensor 100. The system may further include the electrical conductor, the electrical parameter of which may need to be determined. The electrical conductor may pass through the hollow cavity 134 of the sensor 100.

[0067]

[0066] The electrical conductor may be associated with a variety of electrical and electronic devices, systems, or networks, such as power supply systems, communication networks, control systems, or data processing systems. The system may also include a processing unit configured to receive one or more signals from the sensor 100. The one or more signals may include at least a primary signal corresponding to determined value of the electrical parameter corresponding to the electrical conductor. The processing unit may be any device or component capable of processing signals, such as a microcontroller, a microprocessor, a digital signal processor, or a field-programmable gate array. The processing unit may process the one or more signals to perform various functions, such as monitoring, controlling, or regulating the operation of the electrical conductor, the sensor 100, system, or network associated with the electrical conductor.

[0068]

[0067] In an example, the processing unit may be integrated with the sensor 100. In other cases, the processing unit may be separate from the sensor 100 and may be connected to the sensor 100 via a wired or wireless connection. The processing unit may receive the one or more signals from the sensor 100 via this connection. In an example, the sensor 100 and the processing unit may be part of a larger system, device or machine. For example, the sensor 100 and the processing unit may be part of an electric vehicle, a power supply system, a communication network, a control system, or a data processing system. In such cases, the sensor 100 may determine an electrical parameter associated with an electrical conductor of the larger system or device, and the processing unit may process the one or more signals from the sensor 100 to monitor, control, or regulate the operation of the larger system or device.

[0069]

[0068] In an example, the sensor 100 may be designed to determine electrical parameter associated with electrical conductor. The electrical conductor may pass through the hollow cavity 134 of the sensor 100. The hollow cavity 134 may be formed between the inner periphery 104 and the outer periphery 106 of the casing 102. The electrical conductor may pass through the hollow cavity 134 of the sensor 100, and the sensor 100 may determine electrical parameter associated with the electrical conductor. The determined electrical parameter may be provided to processing unit for further necessary operations.

[0070]

[0069] Although examples for the present disclosure have been described in language specific to structural features and / or methods, it is to be understood that the appended claims are not necessarily limited to the specific features or methods described. Rather, the specific features and methods are disclosed and explained as examples of the present disclosure.

Claims

We claim:1 . A sensor assembly (100) comprising: a casing (102) having at least an inner periphery (104), an outer periphery (106), and a grooved segment (110), wherein the grooved segment (110) comprises: at least a first slot (112) extending along a first axis (XX); and at least a second slot (114) extending along a second axis (YY) perpendicular to the first axis (XX); a magnetic core (108) encased within the inner periphery (104) and the outer periphery (106) of the casing (102); and an integrated electronic device (130) to be housed in one of the first slot (112) and the second slot (114) of the grooved segment (110) to interact with the magnetic core (108).

2. The sensor assembly (100) as claimed in claim 1 , wherein the grooved segment (110) comprises: at least a first protrusion (116); and at least a second protrusion (118) adjacent to the first protrusion (116), wherein the first protrusion (116) and the second protrusion (118) span across a periphery (120) of the grooved segment (110) along the second axis (YY) and extend towards the outer periphery (106) of the casing (102) along the first axis (XX).

3. The sensor assembly (100) as claimed in claim 2, wherein the sensor assembly (100) comprises a trench (122) formed between the first protrusion (116) and the second protrusion (118) along the second axis (YY) to hold the integrated electronic device (130) housed within the grooved segment (110).

4. The sensor assembly (100) as claimed in claim 3, wherein the trench (122), the first slot (112), and the second slot (114) are aligned to each other along the first axis (XX) and the second axis (YY).

5. The sensor assembly (100) as claimed in claim 1 , wherein the integrated electronic device (130), housed within the grooved segment (110) along the first axis (XX), comprises one or more terminals (132) that are to protrude out from the second slot (114).

6. The sensor assembly (100) as claimed in claim 1 , wherein the integrated electronic device (130), housed within the grooved segment (110) of the casing (102) along the second axis (YY), comprises one or more terminals (132) that are to protrude out from the first slot (112).

7. The sensor assembly (100) as claimed in claim 1 , wherein the outer periphery (106) of the casing (102) and the inner periphery (104) of the casing (102) are circular.

8. The sensor assembly (100) as claimed in claim 1 , wherein the outer periphery (106) of the casing (102) and the inner periphery (104) of the casing (102) are concentric.

9. The sensor assembly (100) as claimed in claim 1 , wherein the inner periphery (104) of the casing (102) has a first diameter (D1 ) and the outer periphery (106) of the casing has a second diameter (D2), larger than the first diameter (D1 ), to form a hollow cavity (134) within the casing (102) of the sensor assembly (100).

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