Foldable electronic device including support plate for supporting display

Abstract

This foldable electronic device comprises a support plate disposed between a hinge assembly and a flexible display, wherein the support plate includes: a lattice portion in which a plurality of openings face the hinge assembly and are arranged along the axial direction of the hinge assembly; and a first recess portion which is spaced apart from the lattice portion and includes a plurality of recesses formed in the axial direction. The first recess portion includes: a first region in which the plurality of recesses are arranged; and a second region which extends from the first region and is adjacent to a side surface of the foldable electronic device, wherein the second region is either free of recesses or includes recesses formed at a lower density than the plurality of recesses formed in the first region, and a first adhesive member may be disposed between the lattice portion and the second region on the support plate.

Description

Foldable electronic device including a support plate that supports a display

[0001] The present disclosure relates to a foldable electronic device comprising a support plate that supports a display.

[0002] As technology advances, foldable electronic devices that can be unfolded or folded have been developed, and research on flexible displays that can be bent is actively underway. Accordingly, the development of a support structure to prevent damage or deformation of the flexible display during the bending process can determine the quality of the foldable electronic device.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0004] According to one embodiment, a foldable electronic device may be provided comprising: a first housing; a second housing; a hinge assembly (330) rotatably connecting the first housing and the second housing; a support plate disposed within the first housing and the second housing, wherein the support plate comprises a first support area (351-a), a second support area (351-b), and a central support area (352) located between the first support area and the second support area; and a flexible display (340) supported by the support plate, wherein the central support area of ​​the support plate comprises a lattice portion (352-1) in which a plurality of openings extending axially in the support plate are formed, a first recess portion (352-2a) formed between the lattice portion and the first support area; and a second recess portion (352-2b) formed between the lattice portion and the second support area.

[0005] Additionally, the first recess portion comprises a first region (41a) in which a plurality of recesses extending in the axial direction are formed within the support plate, a second region (42a) located between the first region (41a) and the first side edge of the foldable electronic device, the second region including recesses formed at a lower density than the plurality of recesses formed within the first region or not including recesses, a third region (42c) located between the first region and the second side edge of the foldable electronic device, the third region including recesses formed at a lower density than the plurality of recesses formed within the first region or not including recesses, a fourth region (41b) in which a plurality of recesses extending in the axial direction are formed within the support plate, a fifth region (42b) located between the fourth region (41b) and the first side edge of the foldable electronic device, the fifth region including recesses formed at a lower density than the plurality of recesses formed within the fourth region or not including recesses. A foldable electronic device may be provided, comprising a fourth region and a sixth region (42d) located between the second side edge of the foldable electronic device, wherein the sixth region includes recesses formed at a lower density than the plurality of recesses formed within the fourth region or does not include recesses.

[0006] Additionally, according to one embodiment, a first housing; a second housing; a hinge assembly (330) rotatably connecting the first housing and the second housing; and a flexible display (340) disposed at least partially within the first housing and the second housing; A foldable electronic device may be provided, comprising: a support plate (350) disposed between the hinge assembly and the flexible display; wherein the support plate comprises a lattice portion (352-1) in which a plurality of openings arranged in the axial direction of the hinge assembly are disposed facing the hinge assembly, and a first recess portion (352-2a) spaced apart from the lattice portion and comprising a plurality of recesses formed in the axial direction; wherein the first recess portion comprises a first region (41a) in which the plurality of recesses are arranged, and a second region (42a) extending from the first region (41a) and adjacent to the side of the foldable electronic device, wherein the second region (42a) comprises recesses formed at a lower density than the plurality of recesses formed in the first region (41a) or does not include the recesses, and a first adhesive member (51a) is disposed between the lattice portion and the second region on the support plate.

[0007] FIG. 1 is a front perspective view of an electronic device according to one embodiment.

[0008] FIG. 2 is a plan view of the rear direction of an electronic device according to one embodiment.

[0009] FIG. 3 is an exploded perspective view of a foldable electronic device according to one embodiment.

[0010] FIG. 4 is a drawing showing one side of a support plate when viewed in a direction looking toward the rear of an electronic device according to one embodiment.

[0011] FIG. 5 is a drawing showing a part of the edge of a first support plate according to one embodiment.

[0012] FIG. 6a is a cross-sectional view of A-A' of FIG. 5 according to one embodiment.

[0013] FIG. 6b is a cross-sectional view of B-B' of FIG. 5 according to one embodiment.

[0014] FIG. 7a is a drawing showing the arrangement of a hinge assembly and a support plate according to one embodiment.

[0015] FIG. 7b is a drawing showing a part of a support plate on which a hinge assembly according to one embodiment is placed.

[0016] FIG. 7c is a drawing illustrating the connection of the components of a hinge assembly and a support plate.

[0017] FIG. 8 is a drawing showing a cross-section of a foldable electronic device in a folded state according to one embodiment.

[0018] FIG. 9 is a drawing showing an example of a recess formed in a second part of a recess portion according to one embodiment.

[0019] FIG. 10 is a drawing showing an example of a recess formed in a second part of a recess portion according to one embodiment.

[0020] FIG. 11 is a drawing showing an example of a recess formed in a second part of a recess portion according to one embodiment.

[0021] FIG. 12 is a drawing showing an example of a recess formed in a second part of a recess portion according to one embodiment.

[0022] FIG. 13 is a drawing showing a flexible display, a support plate, a buffer member, and a printed circuit board according to one embodiment.

[0023] FIG. 14 is a diagram illustrating the configuration of a flexible display according to one embodiment.

[0024] FIG. 15 is a block diagram of an electronic device (1501) in a network environment (1500) according to various embodiments.

[0025] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0026] Embodiments of the present disclosure are described below in detail with reference to the attached drawings so that those skilled in the art can easily implement them. However, the present disclosure may be embodied in various different forms and is not limited to the embodiments described herein. Furthermore, in order to clearly explain the present disclosure in the drawings, parts unrelated to the explanation have been omitted, and similar parts throughout the specification are denoted by similar reference numerals.

[0027] The terms used in this disclosure are described in their current, general form considering the functions mentioned herein; however, they may refer to various other terms depending on the intent of those skilled in the art, case law, the emergence of new technologies, etc. Accordingly, the terms used in this disclosure should not be interpreted solely by their names, but should be interpreted based on the meaning of the terms and the overall content of this disclosure.

[0028] Additionally, terms such as "first," "second," etc., may be used to describe various components, but the components should not be limited by these terms. These terms are used for the purpose of distinguishing one component from another.

[0029] Throughout the specification, when a part is described as being "connected" to another part, this includes not only cases where they are "directly connected," but also cases where they are "electrically connected" with other components interposed between them. Furthermore, when a part is described as "including" a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components.

[0030] Phrases such as "in one embodiment" appearing in various places in this disclosure do not necessarily refer to the same embodiment.

[0031] One embodiment of the present disclosure may be represented by functional block configurations and various processing steps. Some or all of these functional blocks may be implemented by various numbers of hardware and / or software configurations that execute specific functions. For example, the functional blocks of the present disclosure may be implemented by one or more microprocessors or by circuit configurations for a specific function. Additionally, for example, the functional blocks of the present disclosure may be implemented in various programming or scripting languages. The functional blocks may be implemented as algorithms executed on one or more processors. Furthermore, the present disclosure may employ prior art for electronic configuration, signal processing, and / or data processing, etc. Terms such as “mechanism,” “element,” “means,” and “configuration” may be used broadly and are not limited to mechanical and physical configurations.

[0032] Furthermore, the connecting lines or connecting members between the components depicted in the drawings are merely illustrative of functional connections and / or physical or circuit connections. In the actual device, connections between components may be represented by various alternative or added functional connections, physical connections, or circuit connections.

[0033] The present disclosure will be described in detail below with reference to the attached drawings.

[0034] FIG. 1 is a front perspective view of an electronic device according to one embodiment. FIG. 2 is a rear plan view of an electronic device according to one embodiment.

[0035] Referring to FIGS. 1 and 2, the electronic device (200) may include a first housing (210) (e.g., a first housing structure) comprising a first side member (213) (e.g., a side bezel) and a second housing (220) (e.g., a second housing structure) comprising a second side member (223) (e.g., a side bezel), which are foldably joined to each other with respect to a folding axis (F) through at least one hinge device (240, 240-1) (e.g., a hinge module or a hinge structure) with respect to a folding axis (F). For example, the first housing (210) and the second housing (220) may be configured as a foldable housing (e.g., a housing structure). For example, the electronic device (200) may include a first display (230) (e.g., a flexible display, a foldable display, or a main display) positioned to be supported by the first housing (210) and the second housing (220). For example, the first housing (210) may include a first surface (211) and a second surface (212) facing in the opposite direction of the first surface (211) (e.g., in the -z axis direction). For example, the second housing (220) may include a third surface (221) and a fourth surface (222) facing in the opposite direction of the third surface (221) (e.g., in the -z axis direction). For example, the first housing (210) may include a first rear cover (214) coupled with a first side member (213). For example, the second housing (220) may include a second rear cover (224) coupled with a second side member (223). For example, when the electronic device (200) is in a fully unfolded first state (e.g., unfolded state or unfolded state), the first surface (211) and the third surface (221) may be operated so that they face substantially the same direction (e.g., z-axis direction). For example, when the electronic device (200) is in a fully folded second state (e.g., folded state or folded state), the first surface (211) and the third surface (221) may be operated so that they face each other or face opposite directions.For example, the electronic device (200) may be operated to maintain a third state (e.g., an intermediate state) between the first state and the second state.

[0036] According to one embodiment, the electronic device (200) may include a first receiver (201) disposed on a first surface (211) of a first housing (210), at least one first sensor module (204) (e.g., an ambient light sensor) and / or at least one first camera module (205) (e.g., a UDC, under display camera). For example, the electronic device (200) may include at least one key (206) disposed on a first side member (213). For example, the electronic device (200) may include at least one second camera module (208) and / or a flash (209) disposed on a second surface (212) of the first housing (210) (e.g., a first rear cover (214)). For example, the electronic device (200) may include a second display (231) disposed on the fourth side (222) of the second housing (220), at least one third camera module (225) (e.g., UDC, under display camera), at least one second sensor module (226) and / or a second receiver (227). For example, the second display (231) may be disposed so as to be visible from the outside through at least a portion of the second rear cover (224). For example, the electronic device (200) may include a speaker (202) disposed on the second side member (223), a microphone (203) disposed on the first side member (213), and / or a connector port (207). At least some of the aforementioned components may be repositioned in the first housing (210) and / or the second housing (220).

[0037] According to one embodiment, the first display (230) (e.g., flexible display) may include a first region (230a) (e.g., first planar portion) corresponding to at least a portion of the first surface (211), a second region (230b) (e.g., second planar portion) corresponding to at least a portion of the third surface (221), and a third region (230c) (e.g., flexible portion) connecting the first region (230a) and the second region (230b), to which the electronic device (200) is deformed in a second state (e.g., folding state) and / or a third state. For example, the third region (230c) may be positioned to overlap at least partially with at least one hinge device (240, 240-1) when the first display (230) is viewed from above (e.g., in the z-axis direction). For example, the first display (230) may be positioned so as not to be seen from the outside in the second state, with the first surface (211) and the third surface (221) facing each other (e.g., inward-fold type). For example, the first display (230) may be positioned so as to be seen from the outside in the second state, with the first surface (211) and the third surface (221) facing in opposite directions (e.g., outward-fold type).

[0038] FIG. 3 is an exploded perspective view of a foldable electronic device according to one embodiment.

[0039] According to one embodiment, the foldable electronic device (300) may include a first housing (310), a second housing (320), a hinge assembly (330), a flexible display (340), a support plate (350), a cushioning member (360), a first rear cover (370), and a second rear cover (380). For example, the foldable electronic device (300) may correspond to the electronic device (200) of FIGS. 1 and 2. For example, the first housing (310) may correspond to the first housing (210) of FIGS. 1 and 2, and the second housing (320) may correspond to the second housing (220) of FIGS. 1 and 2. For example, the hinge assembly (330) may correspond to the hinge device (240) of FIGS. 1 and 2. For example, the flexible display (340) may correspond to the first display (230) of FIGS. 1 and 2. For example, the first rear cover (370) and the second rear cover (380) may correspond to the first rear cover (214) and the second rear cover (224) of FIGS. 1 and 2, respectively.

[0040] According to one embodiment, the hinge assembly (330) can rotatably connect the first housing (310) and the second housing (320). For example, the first housing (310) may be connected to one side of the hinge assembly (330), and the second housing (320) may be connected to the other side opposite to the one side of the hinge assembly (330). According to one embodiment, as the first housing (310) and the second housing (320) are rotated by the hinge assembly (330), the foldable electronic device (300) may be folded or unfolded. For example, when the foldable electronic device (300) is unfolded, the first housing (310), the second housing (320), and the hinge assembly (330) may be arranged side by side with each other. For example, when the foldable electronic device (300) is unfolded, the first housing (310) may be positioned to form a substantially 180-degree angle with the second housing (320). For example, when the foldable electronic device (300) is folded, the first housing (310) and the second housing (320) may be positioned substantially perpendicular to the hinge assembly (330).

[0041] According to one embodiment, as the foldable electronic device (300) changes from an unfolded state to a folded state, the first housing (310) and the second housing (320) may move closer to each other. For example, as the foldable electronic device (300) changes from an unfolded state to a folded state, the first housing (310) and the second housing (320) may be positioned to face each other. According to one embodiment, as the foldable electronic device (300) changes from a folded state to an unfolded state, the first housing (310) and the second housing (320) may move further apart from each other.

[0042] According to one embodiment, the flexible display (340) may be at least partially disposed within the first housing (310) and the second housing (320). For example, the flexible display (340) may be at least partially disposed within the first housing (310) and the second housing (320) across the hinge assembly (330). According to one embodiment, as the foldable electronic device (300) is folded or unfolded, the flexible display (340) may be folded or unfolded.

[0043] According to one embodiment, the flexible display (340) may include a flat portion (341) and a folding portion (342). For example, the folding portion (342) of the flexible display (340) may be a portion that bends while the foldable electronic device (300) is folded or unfolded. For example, the folding portion (342) of the flexible display (340) may be a portion facing the hinge assembly (330), and as the foldable electronic device (300) is folded, the folding portion (342) may be folded to have a predetermined curvature. For example, the flat portion (341) of the flexible display (340) may be a portion that extends from the folding portion (342) and does not fold while the foldable electronic device (300) is folded or unfolded. However, it is not limited to this, and a portion of the flat portion (341) may be bent while the foldable electronic device (300) is folded or unfolded.

[0044] According to one embodiment, a flat portion (341) of a flexible display (340) may be at least partially disposed within a first housing (310) and a second housing (320). For example, the flat portion (341) may be a portion extending from one side of a folding portion (342) and from the other side opposite to that side. For example, the portion of the flat portion (341) extending from one side of the folding portion (342) may be at least partially disposed within the first housing (310), and the portion of the flat portion (341) extending from the other side of the folding portion (342) may be at least partially disposed within the second housing (320).

[0045] According to one embodiment, the folding portion (342) of the flexible display (340) may be positioned to face the hinge assembly (330). For example, when viewed in a direction perpendicular to the flexible display (340) (e.g., the -z-axis direction), the folding portion (342) of the flexible display (340) may overlap at least partially with the hinge assembly (330).

[0046] According to one embodiment, as the folding state of the foldable electronic device (300) changes, the distance between the folding portion (342) of the flexible display (340) and the hinge assembly (330) may change. For example, as the state of the foldable electronic device (300) changes from an unfolded state to a folded state, the folding portion (342) of the flexible display (340) may be moved in a direction closer to the hinge assembly (330). For example, as the state of the foldable electronic device (300) changes from a folded state to an unfolded state, the folding portion (342) of the flexible display (340) may be moved in a direction further away from the hinge assembly (330).

[0047] According to one embodiment, a support plate (350) may be positioned between a flexible display (340) and a hinge assembly (330). For example, the support plate (350) may be positioned to correspond to the flexible display (340). According to one embodiment, the support plate (350) may support the flexible display. For example, in the unfolded state of the foldable electronic device (300), the support plate (350) may support the flexible display (340) so that the flexible display (340) does not sag in the direction toward the hinge assembly (330). According to one embodiment, while the foldable electronic device (300) is being folded, the support plate (350) may be folded together with the flexible display (340). For example, while the foldable electronic device (300) is being folded, the support plate (350) can be folded together with the flexible display (340) so that the flexible display (340) is not interfered with by the support plate (350).

[0048] According to one embodiment, the support plate (350) may be formed of a metal material having ductility and rigidity. For example, the support plate (350) may be formed of a material including titanium, but is not limited thereto.

[0049] According to one embodiment, the support plate (350) may include a support portion (351) and a central support portion (352). Additionally, the support portion (351) may include a first support portion (351-a) and a second support portion (351-b). For example, the support portion (351) may be a portion corresponding to the flat portion (341) of the flexible display (340). For example, the central support portion (352) may be a portion corresponding to the folding portion (342) of the flexible display (340). However, it is not limited thereto, and at least a portion of the support portion (351) may correspond to the folding portion (342) of the flexible display (340), or a portion of the central support portion (351) may correspond to the flat portion (341) of the flexible display (340).

[0050] For example, the support portion (351) may be a portion that does not bend while the foldable electronic device (300) is folded or unfolded. For example, the central support portion (352) may be a portion that bends while the foldable electronic device (300) is folded or unfolded. According to one embodiment, the support portion (351) may be a portion extending from the central support portion (352). However, it is not limited thereto, and the area of ​​the support portion (351) and the central support portion (352) of the support plate (350) may be formed in various ways. Additionally, for example, at least a portion of the support portion (351) may be bent, or a portion of the central support portion (351) may not be bent.

[0051] According to one embodiment, the support portion (351) may be a portion that supports the flat portion (341) of the flexible display (340). For example, the support portion (351) may be formed at a position corresponding to the flat portion (341) of the flexible display (340). According to one embodiment, the central support portion (352) may be a portion that supports the folding portion (342) of the flexible display (340). For example, the central support portion (352) may be formed at a position corresponding to the folding portion (342) of the flexible display (340).

[0052] According to one embodiment, in the unfolded state of the foldable electronic device (300), the support portion (351) of the support plate (350) supports the flat portion (341) of the flexible display (340), and the central support portion (352) of the support plate (350) can support the folding portion (342) of the flexible display (340). According to one embodiment, while the foldable electronic device (300) is being folded, the support portion (351) of the support plate (350) supports the flat portion (341) of the flexible display (340), and the central support portion (352) of the support plate (350) can be folded together with the folding portion (342) of the flexible display (340).

[0053] According to one embodiment, the central support portion (352) may be formed wider than the folding portion (342) of the flexible display (340). However, it is not limited thereto, and the areas of the support portion (351) and the central support portion (352) of the support plate (350) may be set in various ways.

[0054] According to one embodiment, a cushioning member (360) may be disposed between a flexible display (340) and a support plate (350). For example, the cushioning member (360) may be disposed on a central support portion (352) of the support plate (350). For example, the cushioning member (360) may be disposed at a position corresponding to a folding portion (342) of the flexible display (340). For example, the cushioning member (360) may be formed with a size sufficient to cover the folding portion (342). However, it is not limited thereto, and the area of ​​the central support portion (352) of the support plate (350), the size of the cushioning member (360), and the area of ​​the folding portion (342) of the flexible display (340) may be changed.

[0055] According to one embodiment, while the foldable electronic device (300) is being folded, the cushioning member (360) can protect the folding portion (342) of the flexible display (340) so that the folding portion (342) is not interfered with by the central support portion (352) of the support plate (350). For example, if the folding portion (342) of the flexible display (340) moves toward the support plate (350) due to an external impact, the cushioning member (360) can prevent the folding portion (342) from being interfered with by the central support portion (352) of the support plate (350). Additionally, according to one embodiment, the cushioning member (360) may be omitted, for example.

[0056] According to one embodiment, the first rear cover (370) can protect the exterior of the first housing (310). For example, the first rear cover (370) can be placed on the side opposite to the flexible display of the first housing (310). According to one embodiment, the second rear cover (380) can protect the exterior of the second housing (320). For example, the second rear cover (380) can be placed on the side opposite to the flexible display of the second housing (320).

[0057] FIG. 4 is a drawing showing one side of a support plate when viewed in a direction looking toward the rear of an electronic device according to one embodiment. FIG. 5 is a drawing showing a part of the edge of a first support plate according to one embodiment.

[0058] Referring to FIGS. 4 and 5, according to one embodiment, the support plate (350) may include a support portion (351) and a central support portion (352). Additionally, the support portion (351) may include a first support portion (351-a) and a second support portion (351-b). For example, the support portion (351) may be a portion corresponding to the flat portion (341) of the flexible display (340). For example, the central support portion (352) may be a portion corresponding to the folding portion (342) of the flexible display (340). According to one embodiment, the central support portion (352) may be a portion between the first support portion (351-a) and the second support portion (351-b).

[0059] According to one embodiment, the central support portion (352) may include a lattice portion (352-1) and a recess portion (352-2). Additionally, the recess portion (352-2) may include a first recess portion (352-2a) and a second recess portion (352-2b).

[0060] According to one embodiment, the lattice portion (352-1) may be formed to include a portion of one side edge of the support plate (350) and a portion of the other side edge. For example, the lattice portion (352-1) may include a plurality of openings arranged spaced apart from each other. The plurality of openings may include, for example, a plurality of openings formed along the folding axis direction of the foldable electronic device (300) or the axial direction (e.g., y-axis direction) of the hinge assembly (330). For example, each of the plurality of openings may be formed to have a length along the folding axis direction of the foldable electronic device (300) or the axial direction (e.g., y-axis direction) of the hinge assembly (330). For example, the plurality of openings may be arranged to partially overlap each other when viewed along the surface of the support plate (350) in a direction perpendicular to the axis of the hinge assembly (330). For example, a plurality of openings may be arranged according to a specified pattern that partially overlaps each other when viewed along the surface of the support plate (350) in a direction perpendicular to the axis of the hinge assembly (330). Additionally, at least some of the plurality of openings may be filled with an elastic material. For example, at least some of the plurality of openings may be filled with a resin material, but are not limited thereto.

[0061] According to one embodiment, at least a portion of the recess portion (352-2) may include a plurality of recesses. At least a portion of the recess portion (352-2) may include a plurality of recesses formed in the folding axis direction of the foldable electronic device (300) or in the axial direction of the hinge assembly (330) (e.g., y-axis direction). For example, the plurality of recesses may be formed by a half-etching process.

[0062] According to one embodiment, the recess portion (352-2) may include a first recess portion (352-2a) and a second recess portion (352-2b). Additionally, a lattice portion (352-1) may be located between the first recess portion (352-2a) and the second recess portion (352-2b).

[0063] According to one embodiment, the first recess portion (352-2a) may include a first region (41a), a second region (42a), and a third region (42c). The first region (41a) may be located between the second region (42a) and the third region (42c).

[0064] According to one embodiment, the first region (41a) of the first recess portion (352-2a) may be a portion in which a plurality of recesses are formed. The first region (41a) may include a plurality of recesses arranged spaced apart from each other. The plurality of recesses of the first region (41a) may include, for example, recesses formed in the folding axis direction of the foldable electronic device (300) or in the axial direction of the hinge assembly (330) (e.g., y-axis direction). For example, each of the plurality of recesses of the first region (41a) may be formed to have a length along the folding axis direction of the foldable electronic device (300) or in the axial direction of the hinge assembly (330) (e.g., y-axis direction). For example, the plurality of recesses of the first region (41a) may be arranged to overlap each other when viewed along the surface of the support plate (350) in a direction perpendicular to the axis of the hinge assembly (330). Additionally, for example, a plurality of recesses of the first region (41a) may be formed to be spaced apart from the edge of the support plate (350) by a specified distance and to have a length along the y-axis direction. For example, the portion between the edge of the support plate (350) and the ends of the plurality of recesses may be the region (42). In this case, for example, the distance (d1, d2, d3, d4) between the edge of the support plate (350) and the ends of the plurality of recesses may fall within the range of 10 mm to 14 mm. For example, the distance (d1, d2, d3, d4) between the edge of the support plate (350) and the ends of the plurality of recesses may preferably have a value of approximately 12 mm.

[0065] According to one embodiment, the second region (42a) of the first recess portion (352-2a) may be an area extending from the first region (41a) and adjacent to the side of the foldable electronic device (300) within the first recess portion (352-2a). For example, the second region (42a) may be a portion extending from the longitudinal ends of a plurality of recesses within the first region (41a) to the edge of the support plate (350), but is not limited thereto. According to one embodiment, no recess may be formed in the second region (42a). According to one embodiment, by the second region (42a) not including a recess, damage to the edge of the central support portion (352) of the support plate (350) from external impact may be prevented or reduced when the foldable electronic device (300) is in a folded state. In addition, as the rigidity of the support plate (350) is secured, even if the thickness of the flexible display (340) supported by the support plate (350) is formed thinly, the durability and surface quality of the flexible display (340) can be improved.

[0066] According to one embodiment, the second region (42a) may include recesses formed at a lower density than the plurality of recesses formed in the first region (41a). For example, the recesses formed at a lower density may be formed by a half-etching process. The recesses formed at a lower density in the second region (42a) may be recesses extending from at least some of the plurality of recesses formed in the first region (41a), but are not limited thereto. At least some of the recesses formed at a lower density in the second region (42a) may be recesses different from the plurality of recesses formed in the first region (41a).

[0067] According to one embodiment, the second region (42a) may include recesses formed on a different surface from the plurality of recesses formed in the first region (41a). For example, a plurality of recesses may be formed on one surface of the first region (41a), and a plurality of recesses may be formed on a surface opposite to that surface in the second region (42a).

[0068] According to one embodiment, the third region (42c) of the first recess portion (352-2a) may be an area extending from the first region (41a) and adjacent to the side of the foldable electronic device (300) within the first recess portion (352-2a). For example, the third region (42c) may be a portion extending from the longitudinal ends of a plurality of recesses within the first region (41a) to the edge of the support plate (350), but is not limited thereto. According to one embodiment, no recess may be formed in the third region (42c). According to one embodiment, by the third region (42c) not including a recess, damage to the edge of the central support portion (352) of the support plate (350) from external impact may be prevented or reduced when the foldable electronic device (300) is in a folded state. In addition, as the rigidity of the support plate (350) is secured, even if the thickness of the flexible display (340) supported by the support plate (350) is formed thinly, the durability and surface quality of the flexible display (340) can be improved.

[0069] According to one embodiment, the third region (42c) may include recesses formed at a lower density than the plurality of recesses formed in the first region (41a). For example, the recesses formed at a lower density may be formed by a half-etching process. The recesses formed at a lower density in the third region (42c) may be recesses extending from at least some of the plurality of recesses formed in the first region (41a), but are not limited thereto. At least some of the recesses formed at a lower density in the third region (42c) may be recesses different from the plurality of recesses formed in the first region (41a).

[0070] According to one embodiment, the third region (42c) may include recesses formed on a different surface from the plurality of recesses formed in the third region (42c). For example, a plurality of recesses may be formed on one surface of the first region (41a), and a plurality of recesses may be formed on a surface opposite to that surface in the third region (42c).

[0071] According to one embodiment, the second recess portion (352-2b) may include a fourth region (41b), a fifth region (42b), and a sixth region (42d). The fourth region (41b) may be located between the fifth region (42b) and the sixth region (42d).

[0072] According to one embodiment, the fourth region (41b) of the second recess portion (352-2b) may be a portion in which a plurality of recesses are formed. The fourth region (41b) may include a plurality of recesses arranged spaced apart from each other. The plurality of recesses of the fourth region (41b) may include, for example, recesses formed in the folding axis direction of the foldable electronic device (300) or in the axial direction of the hinge assembly (330) (e.g., y-axis direction). For example, each of the plurality of recesses of the fourth region (41b) may be formed to have a length along the folding axis direction of the foldable electronic device (300) or in the axial direction of the hinge assembly (330) (e.g., y-axis direction). For example, the plurality of recesses of the fourth region (41b) may be arranged to overlap each other when viewed along the surface of the support plate (350) in a direction perpendicular to the axis of the hinge assembly (330). Additionally, for example, a plurality of recesses of the fourth region (41b) may be formed to be spaced apart from the edge of the support plate (350) by a specified distance and to have a length along the y-axis direction. For example, the portion between the edge of the support plate (350) and the ends of the plurality of recesses may be region (42). In this case, for example, the distance (d1, d2, d3, d4) between the edge of the support plate (350) and the ends of the plurality of recesses may fall within the range of 10 mm to 14 mm. For example, the distance (d1, d2, d3, d4) between the edge of the support plate (350) and the ends of the plurality of recesses may preferably have a value of approximately 12 mm.

[0073] According to one embodiment, the fifth region (42b) of the second recess portion (352-2b) may be an area extending from the fourth region (41b) and adjacent to the side of the foldable electronic device (300) within the second recess portion (352-2b). For example, the fifth region (42b) may be a portion extending from the longitudinal ends of a plurality of recesses within the fourth region (41b) to the edge of the support plate (350), but is not limited thereto. According to one embodiment, no recess may be formed in the fifth region (42b). According to one embodiment, by the fifth region (42b) not including a recess, damage to the edge of the central support portion (352) of the support plate (350) from external impact may be prevented or reduced when the foldable electronic device (300) is in a folded state. In addition, as the rigidity of the support plate (350) is secured, even if the thickness of the flexible display (340) supported by the support plate (350) is formed thinly, the durability and surface quality of the flexible display (340) can be improved.

[0074] According to one embodiment, the fifth region (42b) may include recesses formed at a lower density than the plurality of recesses formed in the fourth region (41b). The recesses formed at a lower density in the fifth region (42b) may be recesses extending from at least some of the plurality of recesses formed in the fourth region (41b), but are not limited thereto. At least some of the recesses formed at a lower density in the fifth region (42b) may be recesses different from the plurality of recesses formed in the fourth region (41b).

[0075] According to one embodiment, the fifth region (42b) may include recesses formed on a different surface from the plurality of recesses formed in the fourth region (41b). For example, a plurality of recesses may be formed on one surface of the fourth region (41b), and a plurality of recesses may be formed on a surface opposite to that surface in the fifth region (42b).

[0076] According to one embodiment, the sixth region (42d) of the second recess portion (352-2b) may be an area extending from the fourth region (41b) and adjacent to the side of the foldable electronic device (300) within the second recess portion (352-2b). For example, the sixth region (42d) may be a portion extending from the longitudinal ends of a plurality of recesses within the fourth region (41b) to the edge of the support plate (350), but is not limited thereto. According to one embodiment, a recess may not be formed in the sixth region (42d). According to one embodiment, by the sixth region (42d) not including a recess, damage to the edge of the central support portion (352) of the support plate (350) from external impact may be prevented or reduced when the foldable electronic device (300) is in a folded state. In addition, as the rigidity of the support plate (350) is secured, even if the thickness of the flexible display (340) supported by the support plate (350) is formed thinly, the durability and surface quality of the flexible display (340) can be improved.

[0077] According to one embodiment, the sixth region (42d) may include recesses formed at a lower density than the plurality of recesses formed in the fourth region (41b). The recesses formed at a lower density in the sixth region (42d) may be recesses extending from at least some of the plurality of recesses formed in the fourth region (41b), but are not limited thereto. At least some of the recesses formed at a lower density in the sixth region (42d) may be recesses different from the plurality of recesses formed in the fourth region (41b).

[0078] According to one embodiment, the sixth region (42d) may include recesses formed on a different surface from the plurality of recesses formed in the fourth region (41b). For example, a plurality of recesses may be formed on one surface of the fourth region (41b), and a plurality of recesses may be formed on a surface opposite to that surface in the sixth region (42d).

[0079] According to one embodiment, an adhesive member (51) may be disposed between the region (42) of the recess portion (352-2) and the lattice portion (352-1). The adhesive member (51) may be attached to a surface facing the hinge assembly (330) from the support plate (350) (e.g., a surface facing the -z axis). For example, the region (42) of the recess portion (352-2) may include a second region (42a), a third region (42c), a fifth region (42b), and a sixth region (42d). The adhesive member (51) may include, for example, a first adhesive member (51a), a second adhesive member (51c), a third adhesive member (51b), and a fourth adhesive member (51d). For example, the first adhesive member (51a) may be disposed between the second region (42a) and the lattice portion (352-1). For example, a second adhesive member (51c) may be placed between the third region (42c) and the lattice portion (352-1). For example, a third adhesive member (51b) may be placed between the fifth region (42b) and the lattice portion (352-1), and a fourth adhesive member (51d) may be placed between the sixth region (42d) and the lattice portion (352-1).

[0080] According to one embodiment, the adhesive member (51) may be positioned to have a specified width along the area (42) between the area (42) of the recess portion (352-2) and the lattice portion (352-1). According to one embodiment, the adhesive member (51) may be positioned adjacent to the area (42) between the area (42) of the recess portion (352-2) and the lattice portion (352-1). For example, the adhesive member (51) may be positioned adjacent to the area (42) along the y-axis direction. For example, the adhesive member (51) may be positioned spaced apart from the lattice portion (352-1) by a predetermined distance.

[0081] According to one embodiment, the adhesive member (51) may be attached to an arm plate (not shown) of the hinge assembly (330). An example of the adhesive member (51) being attached to the arm plate (not shown) of the hinge assembly (330) will be described later in FIG. 7b and FIG. 8.

[0082] According to one embodiment, an adhesive member (52) may be disposed on a support portion (351) of a support plate (350) adjacent to a central support portion (352). The adhesive member (52) may be attached to a surface of the support plate (350) facing the hinge assembly (330) (e.g., a surface facing the -z axis). The adhesive member (52) may include, for example, a fifth adhesive member (52a) and a sixth adhesive member (52b).

[0083] According to one embodiment, the adhesive member (52) may be positioned on the central support portion (352) to have a specified width along the boundary between the support portion (351) and the central support portion (352) or adjacent to the boundary. For example, the adhesive member (52) may be positioned on the central support portion (352) adjacent to the support portion (351) along the y-axis direction.

[0084] For example, the adhesive member (52) may be positioned adjacent to the recess portion (352-2) of the support portion (351) along the y-axis direction. For example, the fifth adhesive member (52a) may be positioned adjacent to the first region (41a), the second region (42a), and the third region (42c) of the first recess portion (352-2a). For example, the sixth adhesive member (52b) may be positioned adjacent to the fourth region (41b), the fifth region (42b), and the sixth region (42d) of the second recess portion (352-2b).

[0085] For example, when viewed along the surface of the support plate (350) in a direction perpendicular to the axis of the hinge assembly (330), the adhesive member (52) may be positioned to overlap with the recess portion (352-2).

[0086] According to one embodiment, the adhesive member (52) may be attached to a support member (not shown) connected to an arm plate (not shown) of the hinge assembly (330). An example of the adhesive member (52) being attached to a support member (not shown) connected to an arm plate (not shown) of the hinge assembly (330) will be described later in FIG. 8.

[0087] FIG. 6a is a cross-sectional view of A-A' of FIG. 5 according to one embodiment.

[0088] Referring to FIG. 6a, the central support portion (352) of the support plate (350) according to one embodiment may include a lattice portion (352-1) and a recess portion (352-2). Additionally, the recess portion (352-2) may include a first recess portion (352-2a) and a second recess portion (352-2b). According to one embodiment, the lattice portion (352-1) may include a plurality of openings penetrating the surface facing the hinge assembly (330) and the surface facing the flexible display (340) of the support plate (350). For example, the lattice portion (352-1) may include a plurality of openings penetrating the surface facing the -z axis and the surface facing the +z axis.

[0089] According to one embodiment, in FIG. 6a showing a cross-sectional view along A-A' of FIG. 5, the region (42) of the recess portion (352-2) may not include a recess. By the region (42) not including a recess, damage to the edge of the central support portion (352) of the support plate (350) from external impact can be prevented or reduced when the foldable electronic device (300) is in a folded state.

[0090] According to one embodiment, the adhesive member (51) may be positioned between the area (42) of the lattice portion (352-1) and the recess portion (352-2). Additionally, the adhesive member (52) may be positioned adjacent to the central support portion (352) on the support portion (351) of the support plate (350).

[0091] According to one embodiment, in FIG. 6a showing a cross-sectional view along A-A' of FIG. 5, a region (42) is disposed between the adhesive member (51) and the adhesive member (52), so that even if a recess is not formed in the region (42), the recess portion (352-2) of the support plate (350) can be stably bent while the foldable electronic device (300) is folded and unfolded.

[0092] FIG. 6b is a cross-sectional view of B-B' of FIG. 5 according to one embodiment.

[0093] Referring to FIG. 6b, the central support portion (352) of the support plate (350) according to one embodiment may include a lattice portion (352-1) and a recess portion (352-2). Additionally, the recess portion (352-2) may include a first recess portion (352-2a) and a second recess portion (352-2b). According to one embodiment, the lattice portion (352-1) may include a plurality of openings penetrating the surface facing the hinge assembly (330) and the surface facing the flexible display (340) of the support plate (350). For example, the lattice portion (352-1) may include a plurality of openings penetrating the surface facing the -z axis and the surface facing the +z axis.

[0094] According to one embodiment, in FIG. 6b showing a cross-sectional view along B-B' of FIG. 5, the region (41) of the recess portion (352-2) may include a first region (41a) and a fourth region (41b), and the first region (41a) and the fourth region (41b) may include a plurality of recesses. For example, a plurality of recesses of the region (41) may be formed on a surface facing the hinge assembly (330) from the support plate (350). For example, a plurality of recesses of the region (41) may be formed on a surface facing the -z axis from the support plate (350). However, the location where the plurality of recesses of the region (41) are formed is not limited thereto.

[0095] According to one embodiment, the adhesive member (51) may not be placed between the area (41) of the lattice portion (352-1) and the recess portion (352-2). Additionally, the adhesive member (52) may be placed at a position adjacent to the central support portion (352) on the support portion (351) of the support plate (350).

[0096] According to one embodiment, in FIG. 6b showing a cross-sectional view of FIG. 5 B-B', even if the adhesive member (51) is not formed, the recess portion (352-2) of the support plate (350) can be stably bent through a plurality of recesses formed in the region (41) while the foldable electronic device (300) is folded and unfolded.

[0097] FIG. 7a is a drawing showing the arrangement of a hinge assembly and a support plate according to one embodiment.

[0098] Referring to FIG. 7a, a hinge assembly (330) according to one embodiment may be placed on the rear surface (e.g., the surface in the -z axis direction) of a support plate (350).

[0099] A hinge assembly (330) according to one embodiment may be placed in a central support portion (352) of a support plate (350). For example, the hinge assembly (330) may be placed between adhesive members (52) in the central support portion (352).

[0100] A hinge assembly (330) according to one embodiment may partially overlap with a region (41) in which a plurality of recesses are formed. For example, when viewed in a direction perpendicular to the surface of the support plate (350) facing the hinge assembly (330), the hinge assembly (330) and the region (41) may partially overlap.

[0101] According to one embodiment, the distance between the edge of the support plate (350) and the ends of the plurality of recesses (e.g., d1, d2, d3, d4) may fall within a range of 10 mm to 14 mm. For example, the distance (d1, d2, d3, d4) between the edge of the support plate (350) and the ends of the plurality of recesses may preferably have a value of approximately 12 mm.

[0102] FIG. 7b is a drawing showing a part (70) of a support plate on which a hinge assembly according to one embodiment is placed. FIG. 7c is a drawing for explaining the connection of the components of the hinge assembly and the support plate according to one embodiment.

[0103] Referring to FIG. 7b, a hinge assembly (330) according to one embodiment may be placed on a support plate (350) so as to overlap with the lattice portion (352-1) of a central support portion (352).

[0104] A hinge assembly (330) according to one embodiment may be placed on a support plate (350) so as to partially overlap with a recessed portion (352-2) of a central support portion (352). For example, when viewed in a direction perpendicular to the surface of the support plate (350) facing the hinge assembly (330), the area (41) of the hinge assembly (330) and the recessed portion (352-2) may partially overlap.

[0105] Referring to FIGS. 7b and 7c, an adhesive member (51) of a support plate (350) according to one embodiment may be attached to at least one wing plate (331) of a hinge assembly (330). For example, when viewed in a direction perpendicular to the surface of the support plate (350) facing the hinge assembly (330), a second adhesive member (51c) may be positioned to overlap with the wing plate (331-1), arm member (332), and wing plate (331-3) of the hinge assembly (330). For example, the arm member (332) of the hinge assembly (330) is seated on the bracket (333) of the hinge assembly (330) and can rotate about the hinge axis (e.g., the axis in the y direction) of the hinge assembly (330), and the arm member (332) can be connected to the wing plate (331-1) and the wing plate (331-3). Accordingly, the wing plate (331-1) and the wing plate (331-3) connected to the arm member (332) can rotate in conjunction with each other. Additionally, the second adhesive member (51c) can be attached to the wing plate (331-1) and the wing plate (331-3) of the hinge assembly (330). Accordingly, an adhesive member (51) positioned adjacent to the area (42) where no recess is formed in the recess portion (352-2) is attached to at least one wing plate (331) of the hinge assembly (330), so that the area (42) of the recess portion (352-2) can be effectively bent while the wing plate (331) of the hinge assembly (330) rotates the arm member (332) to allow the foldable electronic device (300) to be folded and unfolded.

[0106] According to one embodiment, the distance (e.g., d1, d2) between the edge of the support plate (350) and the ends of the plurality of recesses may be within a range of 10 mm to 14 mm. For example, the distance (d1, d2) between the edge of the support plate (350) and the ends of the plurality of recesses may preferably have a value of approximately 12 mm.

[0107] FIG. 8 is a drawing showing a cross-section of a foldable electronic device in a folded state according to one embodiment. According to one embodiment, FIG. 8 shows a cross-section of a foldable electronic device (300) including the A-A' cross-section of FIG. 5.

[0108] Referring to FIG. 8, in a folded state (e.g., fully folded state) of a foldable electronic device (300) according to one embodiment, a flexible display (340) and a support plate (350) can be folded together with the foldable electronic device (300).

[0109] According to one embodiment, when the foldable electronic device (300) is in a folded state, the lattice portion (352-1) of the support plate (350) may be bent, for example, to have an approximate radius of curvature R. For example, the lattice portion (352-1) may be bent to be convex toward the hinge assembly (330).

[0110] According to one embodiment, when the foldable electronic device (300) is in a folded state, the region (42) of the recess portion (352-2) of the support plate (350) may be bent. For example, by attaching an adhesive member (51) to the wing plate (331) of the hinge assembly (330) and an adhesive member (52) to a support member (84) within the foldable electronic device (300), the region (42) may be bent convexly toward the flexible display (340). For example, the region (42) may be bent more gently than the lattice portion (352-1). According to one embodiment, the support member (84) to which the adhesive member (52) is attached may support electronic components (82, 84) within the foldable electronic device (300).

[0111] According to one embodiment, the region (42) of the recess portion (352-2) does not include a recess, but can be effectively bent as the adhesive member (51) is attached to the wing plate (331). Additionally, as the region (42) of the recess portion (352-2) is bent and the adhesive member (51) is attached to the wing plate (331), the lattice portion (352-1) can be bent to have a larger curvature R.

[0112] FIG. 9 is a drawing showing an example of a recess formed in a second part of a recess portion according to one embodiment.

[0113] Referring to FIG. 9, a plurality of recesses formed in the region (42) of the recess portion (352-2) of a support plate (350) according to one embodiment may be formed by extending to the region (41) of the recess portion (352-2).

[0114] For example, multiple recesses (9a, 9b, 9c, 9d, 9e, 9f, 9g) in region (41) may be arranged at a lower density than in region (42).

[0115] Additionally, for example, some of the multiple recesses (9a, 9b, 9c, 9d, 9e, 9f, 9g) may be formed spaced apart from the edge of the support plate (350), and the remaining portion may be formed up to the edge of the support plate (350). For example, multiple recesses (9a, 9b, 9c, 9d) formed up to the edge of the support plate (350) and multiple recesses (9e, 9f, 9g) formed up to a position spaced apart from the edge of the support plate (350) may be arranged sequentially in area (41). For example, multiple recesses (9a, 9b, 9c, 9d, 9e, 9f, 9g) may be arranged in the order of recess (9a), recess (9e), recess (9b), recess (9f), recess (9c), recess (9g), and recess (9d).

[0116] According to one embodiment, some of the plurality of recesses (9a, 9b, 9c, 9d, 9e, 9f, 9g) are formed to be spaced apart from the edge of the support plate (350), thereby ensuring the rigidity of the edge of the support plate (350).

[0117] FIG. 10 is a drawing showing an example of a recess formed in a second part of a recess portion according to one embodiment.

[0118] Referring to FIG. 10, a plurality of recesses may be formed on the surface facing the flexible display (340) and the surface facing the hinge assembly (330) of the recess portion (352-2).

[0119] For example, a plurality of recesses (10h, 10i, 10j, 10k, 10l, 10m, 10n) may be formed on the surface of the recess portion (352-2) facing the hinge assembly (330) (e.g., the surface facing the -z axis), and a plurality of recesses (10a, 10b, 10c, 10d, 10e, 10f, 10g) may be formed on the surface of the recess portion (352-2) facing the flexible display (340) (e.g., the surface facing the +z axis).

[0120] For example, in the region (41) of the recess portion (352-2), a plurality of recesses (10a, 10b, 10c, 10d, 10e, 10f, 10g, 10h, 10i, 10j, 10k, 10l, 10m, 10n) may be arranged at a lower density than in the second portion.

[0121] For example, multiple recesses (10h, 10i, 10j, 10k, 10l, 10m, 10n) may be formed by extending from area (42) of the recess portion (352-2) of the support plate (350) to area (41).

[0122] For example, when the support plate (350) is viewed in a vertical direction, a plurality of recesses (10a, 10b, 10c, 10d, 10e, 10f, 10g) may be formed spaced apart from a plurality of recesses (10h, 10i, 10j, 10k, 10l, 10m, 10n).

[0123] According to one embodiment, a plurality of recesses are formed spaced apart on the surface facing the flexible display (340) and the surface facing the hinge assembly (330) of the recess portion (352-2), thereby ensuring the rigidity of the edge of the support plate (350).

[0124] FIG. 11 is a drawing showing an example of a recess formed in a second part of a recess portion according to one embodiment.

[0125] Referring to FIG. 11, a plurality of recesses formed in the region (42) of the recess portion (352-2) of a support plate (350) according to one embodiment are formed to extend to the region (41) of the recess portion (352-2), and the edge portions of the plurality of recesses can be filled with a cushioning material.

[0126] For example, a plurality of recesses (11a, 11b, 11c, 11d, 11e, 11f, 11g) may be formed extending from area (42) of the recess portion (352-2) of the support plate (350) to area (41). For example, at least some of the plurality of recesses (11a, 11b, 11c, 11d, 11e, 11f, 11g) may be formed up to the edge of the support plate (350).

[0127] Additionally, for example, portions adjacent to the edges of the support plate (350) of the plurality of recesses (11a, 11b, 11c, 11d, 11e, 11f, 11g) may be filled with a buffering material. The buffering material is an elastic material and may include a material that can be injected into portions adjacent to the edges of the support plate (350) of the plurality of recesses (11a, 11b, 11c, 11d, 11e, 11f, 11g). For example, the buffering material may include a thermosetting resin or / and a thermoplastic resin and may be formed by injection molding into portions adjacent to the edges of the support plate (350) of the plurality of recesses (11a, 11b, 11c, 11d, 11e, 11f, 11g).

[0128] According to one embodiment, the portions adjacent to the edges of the support plate (350) of the plurality of recesses (11a, 11b, 11c, 11d, 11e, 11f, 11g) are filled with a cushioning material, thereby ensuring the rigidity of the edges of the support plate (350).

[0129] FIG. 12 is a drawing showing an example of a recess formed in a second part of a recess portion according to one embodiment.

[0130] Referring to FIG. 12, the region (42) of the recess portion (352-2) may be formed with a recess (12) including a plurality of protruding portions (13a, 13b, 13c, 13d, 13e, 13f). According to one embodiment, the recess (12) may be formed by etching the remaining portion of the region (42) of the recess portion (352-2) excluding the plurality of protruding portions (13a, 13b, 13c, 13d, 13e, 13f). The plurality of protruding portions (13a, 13b, 13c, 13d, 13e, 13f) may not be etched, thereby having a shape that protrudes relative to the bottom of the recess (12).

[0131] Additionally, a plurality of protrusions (13a, 13b, 13c, 13d, 13e, 13f) may be formed to be spaced apart from the edge of the support plate (350).

[0132] According to one embodiment, a recess (12) including a plurality of protruding parts (13a, 13b, 13c, 13d, 13e, 13f) is formed in a region (42) of a support plate (350), so that the recess portion (352-2) of the support plate (350) can be flexibly bent.

[0133] FIG. 13 is a drawing showing a flexible display, a support plate, a buffer member, and a printed circuit board according to one embodiment.

[0134] Referring to FIG. 13, a support plate (350) may be placed in the lower direction (e.g., -z direction) of a flexible display (340), a cushioning member (14) may be placed in the lower direction (e.g., -z direction) of the support plate (350), and a printed circuit board (15) may be placed in the lower direction (e.g., -z direction) of the cushioning member (14).

[0135] According to one embodiment, the cushioning member (14) may be positioned below the lattice portion (352-1) of the support plate (350) to cover a plurality of openings formed in the lattice portion (352-1). The cushioning member (14) may be formed of, for example, an elastic material and may include, for example, a thermosetting resin or / and a thermoplastic resin, but is not limited thereto.

[0136] According to one embodiment, a printed circuit board (15) is placed below a buffer member (14) so ​​as to electrically connect electronic components placed in a first housing (e.g., 210) and a second housing (e.g., 220) of an electronic device (200). The printed circuit board (15) may include, for example, a flexible printed circuit board (FPCB), but is not limited thereto.

[0137] FIG. 14 is a diagram illustrating the configuration of a flexible display according to one embodiment.

[0138] Referring to FIG. 14, a flexible display (340) according to one embodiment may be formed by stacking a plurality of layers. However, the flexible display (340) may be formed by omitting some components or adding other components, and is not limited to the configurations shown in FIG. 14.

[0139] According to one embodiment, the flexible display (340) may include a first protective layer (1310), a first adhesive layer (1320), glass (1330), a second adhesive layer (1340), a panel (1350), a film (1360), a third adhesive layer (1370), and a second protective layer (1380). For example, the first protective layer (1310) may form an upper surface facing the +z-axis direction of the flexible display (340). For example, the second protective layer (1380) may form a back surface facing the -z-axis direction of the flexible display (340).

[0140] According to one embodiment, the first protective layer (1310) and the second protective layer (1380) can protect the flexible display (340) from external impact. For example, the first protective layer (1310) and the second protective layer (1380) can prevent scratches from occurring on the flexible display (340) or prevent foreign substances from entering the interior of the flexible display (340) from the outside.

[0141] According to one embodiment, the glass (1330) may be disposed on the back surface of the first protective layer (1310). For example, the glass (1330) may be attached to the back surface of the first protective layer (1310) by the first adhesive layer (1320). According to one embodiment, the glass (1330) enables the flexible display (340) to easily receive touch input from a user and can improve the image quality of the flexible display (340). According to one embodiment, the glass (1330) may be formed of a flexible and thin material so that the flexible display (340) can be folded or unfolded.

[0142] According to one embodiment, the panel (1350) may be attached to the back surface of the glass (1330) by a second adhesive layer (1340). According to one embodiment, the panel (1350) may receive touch input from a user or display a screen to a user. For example, the panel (1350) may be formed of a rigid material for the durability of the flexible display (340).

[0143] According to one embodiment, the film (1360) is disposed on the back surface of the panel (1350) to maintain the structural stability of the panel (1350) or to protect the panel (1350) from the outside. According to one embodiment, the second protective layer (1380) can be attached to the back surface of the film (1360) by the third adhesive layer (1370).

[0144] In the above description, the foldable electronic device (300) is described as a device that is folded by a single hinge assembly (330), but is not limited thereto. For example, the foldable electronic device (300) may be a multi-foldable electronic device in which multiple parts are folded by multiple hinge assemblies. In this case, a lattice portion and a recess portion may be formed in the portions corresponding to each of the folded portions of the flexible display on the support plate (350), as shown in FIGS. 3 to 13.

[0145] FIG. 15 is a block diagram of an electronic device (1501) in a network environment (1500) according to various embodiments. Referring to FIG. 15, in the network environment (1500), the electronic device (1501) may communicate with an electronic device (1502) through a first network (1598) (e.g., a short-range wireless communication network) or with an electronic device (1504) or a server (1508) through a second network (1599) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (1501) may communicate with the electronic device (1504) through a server (1508). According to one embodiment, the electronic device (1501) may include a processor (1520), memory (1530), input module (1550), sound output module (1555), display module (1560), audio module (1570), sensor module (1576), interface (1577), connection terminal (1578), haptic module (1579), camera module (1580), power management module (1588), battery (1589), communication module (1590), subscriber identification module (1596), or antenna module (1597). In some embodiments, at least one of these components (e.g., connection terminal (1578)) may be omitted from the electronic device (1501), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (1576), camera module (1580), or antenna module (1597)) may be integrated into a single component (e.g., display module (1560)).

[0146] The processor (1520) can, for example, execute software (e.g., program (1540)) to control at least one other component (e.g., hardware or software component) of the electronic device (1501) connected to the processor (1520) and perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (1520) can store commands or data received from other components (e.g., sensor module (1576) or communication module (1590)) in volatile memory (1532), process the commands or data stored in volatile memory (1532), and store the resulting data in non-volatile memory (1534). According to one embodiment, the processor (1520) may include a main processor (1521) (e.g., a central processing unit or an application processor) or an auxiliary processor (1523) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (1501) includes a main processor (1521) and an auxiliary processor (1523), the auxiliary processor (1523) may be configured to use lower power than the main processor (1521) or to be specialized for a specified function. The auxiliary processor (1523) may be implemented separately from the main processor (1521) or as part thereof.

[0147] The auxiliary processor (1523) may control at least some of the functions or states associated with at least one component of the electronic device (1501) (e.g., display module (1560), sensor module (1576), or communication module (1590)) on behalf of the main processor (1521) while the main processor (1521) is in an inactive (e.g., sleep) state, or together with the main processor (1521) while the main processor (1521) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (1523) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (1580) or communication module (1590)). According to one embodiment, the auxiliary processor (1523) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (1501) itself where the artificial intelligence is performed, or through a separate server (e.g., server (1508)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0148] The memory (1530) can store various data used by at least one component of the electronic device (1501) (e.g., processor (1520) or sensor module (1576)). The data may include, for example, input data or output data for software (e.g., program (1540)) and related commands. The memory (1530) may include volatile memory (1532) or non-volatile memory (1534).

[0149] The program (1540) may be stored as software in memory (1530) and may include, for example, an operating system (1542), middleware (1544), or an application (1546).

[0150] The input module (1550) can receive commands or data to be used for a component of the electronic device (1501) (e.g., processor (1520)) from outside the electronic device (1501) (e.g., user). The input module (1550) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0151] The sound output module (1555) can output a sound signal to the outside of the electronic device (1501). The sound output module (1555) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0152] The display module (1560) can visually provide information to an external (e.g., user) of the electronic device (1501). The display module (1560) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (1560) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0153] The audio module (1570) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (1570) can acquire sound through an input module (1550) or output sound through an audio output module (1555) or an external electronic device (e.g., electronic device (1502)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (1501).

[0154] The sensor module (1576) can detect the operating state of the electronic device (1501) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (1576) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0155] The interface (1577) may support one or more specified protocols that can be used for the electronic device (1501) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (1502)). According to one embodiment, the interface (1577) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0156] The connection terminal (1578) may include a connector through which the electronic device (1501) can be physically connected to an external electronic device (e.g., electronic device (1502)). According to one embodiment, the connection terminal (1578) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0157] The haptic module (1579) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (1579) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0158] The camera module (1580) can capture still images and video. According to one embodiment, the camera module (1580) may include one or more lenses, image sensors, image signal processors, or flashes.

[0159] The power management module (1588) can manage the power supplied to the electronic device (1501). According to one embodiment, the power management module (1588) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0160] The battery (1589) can supply power to at least one component of the electronic device (1501). According to one embodiment, the battery (1589) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0161] The communication module (1590) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (1501) and an external electronic device (e.g., electronic device (1502), electronic device (1504), or server (1508)), and the performance of communication through the established communication channel. The communication module (1590) may include one or more communication processors that operate independently of the processor (1520) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (1590) may include a wireless communication module (1592) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (1594) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (1504) through a first network (1598) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (1599) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (1592) can identify or authenticate the electronic device (1501) within a communication network such as the first network (1598) or the second network (1599) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (1596).

[0162] The wireless communication module (1592) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (1592) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (1592) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (1592) can support various requirements specified in the electronic device (1501), external electronic device (e.g., electronic device (1504)), or network system (e.g., second network (1599)). According to one embodiment, the wireless communication module (1592) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0163] An antenna module (1597) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (1597) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (1597) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (1598) or a second network (1599), may be selected from the plurality of antennas, for example, by a communication module (1590). A signal or power may be transmitted or received between the communication module (1590) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (1597).

[0164] According to various embodiments, the antenna module (1597) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0165] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0166] According to one embodiment, commands or data may be transmitted or received between the electronic device (1501) and an external electronic device (1504) through a server (1508) connected to a second network (1599). Each of the external electronic devices (1502, or 1404) may be the same or a different type of device as the electronic device (1501). According to one embodiment, all or part of the operations performed on the electronic device (1501) may be performed on one or more of the external electronic devices (1502, 1404, or 1408). For example, if the electronic device (1501) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (1501) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (1501). The electronic device (1501) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (1501) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (1504) may include an Internet of Things (IoT) device. The server (1508) may be an intelligent server using machine learning and / or neural networks.According to one embodiment, an external electronic device (1504) or server (1508) may be included within the second network (1599). The electronic device (1501) may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0167] According to one embodiment, the electronic device (1501) of FIG. 15 may correspond to an electronic device (200) and a foldable electronic device (300).

[0168] According to one embodiment, a foldable electronic device comprises: a first housing; a second housing; a hinge assembly (330) rotatably connecting the first housing and the second housing; a support plate disposed within the first housing and the second housing, wherein the support plate comprises a first support area (351-a), a second support area (351-b), and a central support area (352) located between the first support area and the second support area; and a flexible display (340) supported by the support plate, wherein the central support area of ​​the support plate comprises a lattice portion (352-1) having a plurality of openings formed extending axially in the support plate, and a first recess portion (352-2a) formed between the lattice portion and the first support area.It includes a second recess portion (352-2b) formed between the lattice portion and the second support area, wherein the first recess portion comprises a first area (41a) in which the plurality of recesses extending in the axial direction are formed within the support plate, a second area (42a) located between the first area (41a) and the first side edge of the foldable electronic device, the second area including recesses formed at a lower density than the plurality of recesses formed within the first area or not including recesses, a third area (42c) located between the first area and the second side edge of the foldable electronic device, the third area including recesses formed at a lower density than the plurality of recesses formed within the first area or not including recesses, a fourth area (41b) in which the plurality of recesses extending in the axial direction are formed within the support plate, a fifth area (42b) located between the fourth area (41b) and the first side edge of the foldable electronic device, and the fifth The region may include recesses formed at a lower density than the plurality of recesses formed within the fourth region or not include recesses, and a sixth region (42d) located between the fourth region and the second side edge of the foldable electronic device, wherein the sixth region may include recesses formed at a lower density than the plurality of recesses formed within the fourth region or not include recesses.;

[0169] In addition, according to one embodiment, the plurality of recesses and the recesses formed at a low density can be formed by a half-etching process.

[0170] In addition, according to one embodiment, the openings may be filled with a resin material.

[0171] Additionally, according to one embodiment, it may further include: a first adhesive member (51a) disposed between the second region of the first recess portion and the lattice portion on the surface of the support plate facing the hinge assembly; a second adhesive member (51c) disposed between the third region of the first recess portion and the lattice portion on the surface of the support plate facing the hinge assembly; a third adhesive member (51b) disposed between the fifth region of the second recess portion and the lattice portion on the surface of the support plate facing the hinge assembly; and a fourth adhesive member (51d) disposed between the sixth region of the second recess portion and the lattice portion on the surface of the support plate facing the hinge assembly.

[0172] Additionally, according to one embodiment, the first adhesive member (51a) may be positioned to have a specified width along the second area between the second area of ​​the first recess portion and the lattice portion, the second adhesive member (51c) may be positioned to have a specified width along the third area between the third area of ​​the first recess portion and the lattice portion, the third adhesive member (51b) may be positioned to have a specified width along the fifth area between the fifth area of ​​the second recess portion and the lattice portion, and the fourth adhesive member (51d) may be positioned to have a specified width along the sixth area between the sixth area of ​​the second recess portion and the lattice portion.

[0173] Additionally, according to one embodiment, the first adhesive member (51a) may attach the portion between the second region of the first recess portion and the lattice portion to the arm plate of the hinge assembly, the second adhesive member (51c) may attach the portion between the third region of the first recess portion and the lattice portion to the arm plate of the hinge assembly, the third adhesive member (51b) may attach the portion between the fifth region of the second recess portion and the lattice portion to the arm plate of the hinge assembly, and the fourth adhesive member (51d) may attach the portion between the sixth region of the second recess portion and the lattice portion to the arm plate of the hinge assembly.

[0174] Additionally, according to one embodiment, it may further include a fifth adhesive member (52a) disposed adjacent to the central support area on the first support area of ​​the support plate; and a sixth adhesive member (52b) disposed adjacent to the central support area on the second support area of ​​the support plate.

[0175] Additionally, according to one embodiment, the fifth adhesive member may be arranged to have a specified width along the boundary of the first support area and the central support area, and the sixth adhesive member may be arranged to have a specified width along the boundary of the second support area and the central support area.

[0176] In addition, according to one embodiment, the fifth adhesive member may be attached to a support member connected to the arm plate of the hinge assembly.

[0177] Additionally, according to one embodiment, the first region of the first recess portion may partially overlap with the hinge assembly when viewed in a direction perpendicular to the surface of the support plate facing the hinge assembly.

[0178] Additionally, according to one embodiment, when the foldable electronic device is unfolded, the plurality of openings included in the lattice portion may be arranged to partially overlap each other when viewed along the surface of the support plate facing the hinge assembly in a direction perpendicular to the axis of the hinge assembly.

[0179] Additionally, according to one embodiment, each of the plurality of recesses included in the first region of the first recess portion is formed to have a length in the axial direction of the hinge assembly, and the plurality of recesses may be arranged to be spaced apart from each other in a direction perpendicular to the axis of the hinge assembly.

[0180] According to one embodiment, a foldable electronic device comprises: a first housing; a second housing; a hinge assembly (330) rotatably connecting the first housing and the second housing; and a flexible display (340) disposed at least partially within the first housing and the second housing. The device comprises a support plate (350) disposed between the hinge assembly and the flexible display, wherein the support plate comprises a lattice portion (352-1) in which a plurality of openings arranged in the axial direction of the hinge assembly are disposed facing the hinge assembly, and a first recess portion (352-2a) spaced apart from the lattice portion and comprising a plurality of recesses formed in the axial direction, wherein the first recess portion comprises a first region (41a) in which the plurality of recesses are arranged, and a second region (42a) extending from the first region (41a) and adjacent to the side of the foldable electronic device, wherein the second region (42a) comprises recesses formed at a lower density than the plurality of recesses formed in the first region (41a) or does not include the recesses, and a first adhesive member (51a) may be disposed between the lattice portion and the second region on the support plate.

[0181] In addition, according to one embodiment, the first adhesive member may be disposed on the surface of the support plate facing the hinge assembly.

[0182] Additionally, according to one embodiment, the first adhesive member may be positioned to have a specified width along the second region between the second region of the first recess portion and the lattice portion.

[0183] In addition, according to one embodiment, the first adhesive member may be attached to the arm plate of the hinge assembly.

[0184] Additionally, according to one embodiment, a fifth adhesive member (52a) disposed adjacent to the lattice portion on the support plate may be further included.

[0185] Additionally, according to one embodiment, the fifth adhesive member may be spaced apart from the lattice portion and arranged to have a specified width along the boundary of the lattice portion.

[0186] In addition, according to one embodiment, the fifth adhesive member may be attached to a support member connected to the arm plate of the hinge assembly.

[0187] Additionally, according to one embodiment, the first region of the first recess portion may partially overlap with the hinge assembly when viewed in a direction perpendicular to the surface of the support plate facing the hinge assembly.

[0188] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0189] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0190] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0191] Various embodiments of the present document may be implemented as software (e.g., program (1440)) comprising one or more instructions stored in a storage medium (e.g., internal memory (1436) or external memory (1438)) readable by a machine (e.g., electronic device (1401)). For example, a processor (e.g., processor (1420)) of the machine (e.g., electronic device (1401)) may call at least one of the one or more instructions stored from the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0192] According to one embodiment, the method according to the various embodiments disclosed herein may be provided as included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0193] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In a foldable electronic device, First housing; Second housing; A hinge assembly (330) that rotatably connects the first housing and the second housing; A support plate disposed within the first housing and the second housing, wherein the support plate includes a first support area (351-a), a second support area (351-b), and a central support area (352) located between the first support area and the second support area; A flexible display (340) supported by the above support plate; Includes, The central support area of ​​the above support plate is, A lattice portion (352-1) having a plurality of openings formed in the axial direction of the support plate, and A first recess portion (352-2a) formed between the above lattice portion and the above first support area; A second recess portion (352-2b) formed between the above lattice portion and the above second support area Includes, The above-mentioned first recess portion is, A first region (41a) in which the plurality of recesses extending in the axial direction are formed within the support plate, A second region (42a) located between the first region (41a) and the first side edge of the foldable electronic device, wherein the second region includes recesses formed at a lower density than the plurality of recesses formed within the first region or does not include recesses. A third region (42c) located between the first region and the second side edge of the foldable electronic device, wherein the third region includes recesses formed at a lower density than the plurality of recesses formed within the first region or does not include recesses. A fourth region (41b) in which a plurality of recesses extending in the axial direction are formed within the support plate, A fifth region (42b) located between the fourth region (41b) and the first side edge of the foldable electronic device, wherein the fifth region includes recesses formed at a lower density than the plurality of recesses formed within the fourth region or does not include recesses, and A sixth region (42d) located between the fourth region and the second side edge of the foldable electronic device, wherein the sixth region includes recesses formed at a lower density than the plurality of recesses formed within the fourth region or does not include recesses. A foldable electronic device including 2. In Paragraph 1, A foldable electronic device in which the plurality of recesses and the low-density formed recesses are formed by a half-etching process.

3. In Paragraph 1, A foldable electronic device in which resin material is filled into the above openings.

4. In Paragraph 1, A first adhesive member (51a) disposed between the second region of the first recess portion and the lattice portion on the surface of the support plate facing the hinge assembly; A second adhesive member (51c) disposed between the third region of the first recess portion and the lattice portion on the surface of the support plate facing the hinge assembly; A third adhesive member (51b) disposed between the fifth region of the second recess portion and the lattice portion on the surface of the support plate facing the hinge assembly; A fourth adhesive member (51d) disposed between the sixth region of the second recess portion and the lattice portion on the surface of the support plate facing the hinge assembly; A foldable electronic device including further 5. In Paragraph 4, The first adhesive member (51a) is positioned between the second region of the first recess portion and the lattice portion, having a specified width along the second region, and The second adhesive member (51c) is positioned between the third region of the first recess portion and the lattice portion, having a specified width along the third region, and The third adhesive member (51b) is positioned between the fifth region of the second recess portion and the lattice portion, having a specified width along the fifth region, and The above-mentioned fourth adhesive member (51d) is positioned to have a specified width along the sixth region between the sixth region of the second recess portion and the lattice portion, in a foldable electronic device.

6. In Paragraph 4, The first adhesive member (51a) attaches the portion between the second region of the first recess portion and the lattice portion to the arm plate of the hinge assembly, The second adhesive member (51c) attaches the portion between the third region of the first recess portion and the lattice portion to the arm plate of the hinge assembly, The third adhesive member (51b) attaches the portion between the fifth region of the second recess portion and the lattice portion to the arm plate of the hinge assembly, and The above-mentioned fourth adhesive member (51d) is a foldable electronic device that attaches the portion between the sixth region of the second recess portion and the lattice portion to the arm plate of the hinge assembly.

7. In Paragraph 1, A fifth adhesive member (52a) disposed adjacent to the central support area on the first support area of ​​the support plate; and A sixth adhesive member (52b) disposed adjacent to the central support area on the second support area of ​​the support plate; A foldable electronic device including further 8. In Paragraph 7, The fifth adhesive member is positioned to have a specified width along the boundary of the first support area and the central support area, and A foldable electronic device wherein the sixth adhesive member is positioned to have a specified width along the boundary of the second support area and the central support area.

9. In Paragraph 7, The above-described fifth adhesive member is attached to a support member connected to an arm plate of the hinge assembly, in a foldable electronic device.

10. In Paragraph 1, A foldable electronic device in which the first region of the first recess portion partially overlaps with the hinge assembly when viewed in a direction perpendicular to the surface of the support plate facing the hinge assembly.

11. In Paragraph 1, A foldable electronic device in which, when the foldable electronic device is unfolded, the plurality of openings included in the lattice portion are arranged to partially overlap each other when viewed along the surface of the support plate facing the hinge assembly in a direction perpendicular to the axis of the hinge assembly.

12. In Paragraph 1, Each of the plurality of recesses included in the first region of the first recess portion is formed to have a length in the axial direction of the hinge assembly, and A foldable electronic device in which the plurality of recesses are arranged to be spaced apart from each other in a direction perpendicular to the axis of the hinge assembly.

13. In a foldable electronic device, First housing; Second housing; A hinge assembly (330) that rotatably connects the first housing and the second housing; A flexible display (340) disposed at least partially within the first housing and the second housing; and A support plate (350) disposed between the hinge assembly and the flexible display; Includes, The above support plate is, A lattice portion (352-1) in which a plurality of openings arranged in the axial direction of the hinge assembly are positioned facing the hinge assembly, and A first recess portion (352-2a) spaced apart from the above lattice portion and including a plurality of recesses formed in the axial direction; Includes, The above-mentioned first recess portion is, The first region (41a) in which the above plurality of recesses are arranged, A second region (42a) extending from the first region (41a) and adjacent to the side of the foldable electronic device Includes, The second region (42a) includes recesses formed at a lower density than the plurality of recesses formed in the first region (41a) or does not include said recesses, A foldable electronic device having a first adhesive member (51a) disposed between the lattice portion and the second region on the support plate.

14. In Paragraph 13, A foldable electronic device in which the first adhesive member is disposed on the surface of the support plate facing the hinge assembly.

15. In Paragraph 13, A fifth adhesive member (52a) disposed adjacent to the lattice portion on the support plate; A foldable electronic device including further

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