Optical chip, photoelectric conversion module, and related device

Abstract

An optical chip, a photoelectric conversion module, and a related device, which can effectively improve the coupling efficiency of an optical signal between different optical transmission media while avoiding significant optical damage to the optical transmission media. The optical chip comprises a substrate (200); the substrate (200) fixes a first optical transmission medium (210) and N second optical transmission media (211, 212, 213), wherein N is any integer greater than or equal to 2; the substrate (200) further comprises a first coupling module; the first coupling module comprises a first end (302) of the first optical transmission medium (210) and first ends of the second optical transmission media (211, 212, 213); the first ends of the second optical transmission media (211, 212, 213) are located at positions close to the first end (302) of the first optical transmission medium (210); along a target section, the cross-sectional area of the first end of each of the second optical transmission media (211, 212, 213) is less than the cross-sectional area of the first end (302) of the first optical transmission medium (210), and the cross-sectional area of the first end of each of the second optical transmission media (211, 212, 213) tapers in a direction moving away from second ends of the second optical transmission media (211, 212, 213); and the target section intersects the surface of the substrate.

Description

An optical chip, a photoelectric conversion module, and related equipment

[0001] This application claims priority to Chinese patent application filed on October 31, 2024, with application number 202411555011.6 and entitled "An optical chip, photoelectric conversion module and related equipment", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of optical fiber communication, and in particular to an optical chip, a photoelectric conversion module, and related equipment. Background Technology

[0003] Optical chips, as one of the key components in optical fiber communication, undertake many critical functions. Figure 1 shows an example top view of an existing optical chip structure. The optical chip includes a substrate 100, which is used to fix a first optical transmission medium 101, a coupling module 103, and a second optical transmission medium 102. The coupling module 103 is used to couple the optical signal transmitted in the first optical transmission medium 101 to the second optical transmission medium 102.

[0004] To improve coupling efficiency, the cross-sectional dimensions of the end of the second optical transmission medium 102 are smaller than those of the end of the first optical transmission medium 101. This results in a stronger light intensity distribution in the second optical transmission medium 102, causing significant optical damage to the second optical transmission medium 102 under high light intensity. Consequently, the second optical transmission medium 102 will experience substantial losses and high-temperature damage. Summary of the Invention

[0005] This application provides an optical chip, a photoelectric conversion module, and related equipment, which can effectively improve the coupling efficiency of optical signals between different optical transmission media while avoiding large optical damage to the optical transmission media.

[0006] In a first aspect, this application provides an optical chip, including a substrate, wherein a first optical transmission medium and N second optical transmission media are fixed on the substrate, wherein N is any integer greater than or equal to 2. The optical chip further includes a first coupling module, the first coupling module including a first end of the first optical transmission medium and a first end of the second optical transmission media, the first end of the second optical transmission media being located near the first end of the first optical transmission medium. Along a target cross-section, the cross-sectional area of ​​the first end of the second optical transmission medium is smaller than the cross-sectional area of ​​the first end of the first optical transmission medium, and the cross-sectional area of ​​the first end of the second optical transmission medium gradually decreases in a direction away from the second end of the second optical transmission medium. The target cross-section intersects with the surface of the substrate. The first coupling module is used to receive a first optical signal through the first optical transmission medium. The first coupling module is also used to split the first optical signal into N first sub-optical signals and transmit the N first sub-optical signals to the N second optical transmission media respectively. Alternatively, the first coupling module is used to receive N second sub-optical signals through the N second optical transmission media. The first coupling module is also used to combine the N second sub-optical signals to obtain a second optical signal and transmit the second optical signal to the first optical transmission medium.

[0007] As shown in this aspect, the first end of the second optical transmission medium is located close to the first end of the first optical transmission medium, thus enabling evanescent wave coupling of optical signals between the first end of the second optical transmission medium and the first end of the first optical transmission medium. Along the target cross-section, the cross-sectional area of ​​the first end of the second optical transmission medium is smaller than that of the first end of the first optical transmission medium, and the cross-sectional area of ​​the first end of the second optical transmission medium gradually decreases in the direction away from the second end of the second optical transmission medium. This effectively improves the coupling efficiency of optical signals between the first optical transmission medium and N second optical transmission media. To avoid large optical damage to the second optical transmission media, the substrate includes multiple second optical transmission media, effectively reducing the optical power density in each second optical transmission medium. This improves the coupling efficiency of the optical chip while effectively preventing large optical damage to the second optical transmission media.

[0008] Based on the first aspect, in one optional implementation, the first end of the first optical transmission medium has a first orthographic projection on the substrate surface, and the first end of the second optical transmission medium has a second orthographic projection on the substrate surface, wherein the second orthographic projection is at least partially located within the coverage area of ​​the first orthographic projection.

[0009] In this implementation, the second orthographic projection is completely within the coverage area of ​​the first orthographic projection, or the second orthographic projection is partially within the coverage area of ​​the first orthographic projection, so as to ensure the matching between the effective refractive index of the first optical transmission medium and the effective refractive index of the second optical transmission medium, reduce the loss of optical signal coupling between the first optical transmission medium and the second optical transmission medium, and improve the coupling efficiency.

[0010] Based on the first aspect, in one optional implementation, the first end of the first optical transmission medium has a first orthographic projection on the substrate surface, the first end of the second optical transmission medium has a second orthographic projection on the substrate surface, and there is a gap between the first orthographic projection and the second orthographic projection.

[0011] In this implementation, there is a gap between the first orthographic projection and the second orthographic projection to ensure the matching between the effective refractive index of the first optical transmission medium and the effective refractive index of the second optical transmission medium, thereby reducing the coupling loss of the optical signal between the first and second optical transmission media and improving the coupling efficiency.

[0012] Based on the first aspect, in one optional implementation, the first optical transmission medium includes a first transition segment, which is connected between a first end and a second end of the first optical transmission medium. Along the target direction, the width of the first transition segment gradually increases in the direction away from the first end of the first optical transmission medium, and the width of the first end of the first optical transmission medium gradually decreases in the direction away from the second end of the first optical transmission medium. The target direction intersects with the direction in which the first optical transmission medium transmits optical signals.

[0013] In this implementation, the width of the first optical transmission medium is a key factor affecting its effective refractive index. Different widths of the first optical transmission medium can change the propagation mode and distribution of the optical signal in the first optical transmission medium, thereby affecting its effective refractive index. By setting the shape of the width of the first transition section and the shape of the width of the first end of the first optical transmission medium, the matching between the effective refractive index of the first optical transmission medium and the effective refractive index of the second optical transmission medium is ensured, reducing the coupling loss of the optical signal between the first and second optical transmission media and improving the coupling efficiency.

[0014] Based on the first aspect, in one optional implementation, the first coupling module further includes a second transition section, the second transition section being connected between the first end of the first optical transmission medium and the first transition section; along the target direction, the width of the second transition section remains unchanged; or, along the target direction, the width of the second transition section gradually decreases in the direction away from the second end of the first optical transmission medium; or, along the target direction, the width of the second transition section gradually increases in the direction away from the second end of the first optical transmission medium.

[0015] By adopting this implementation method, the shape of the width of the second transition section is set to ensure the matching between the effective refractive index of the first optical transmission medium and the effective refractive index of the second optical transmission medium, thereby reducing the coupling loss of the optical signal between the first and second optical transmission media and improving the coupling efficiency.

[0016] Based on the first aspect, in one optional implementation, along the target direction, the width of the first end of the first optical transmission medium is greater than the width of the first end of the second optical transmission medium, the target direction intersects with the direction in which the first optical transmission medium transmits optical signals, and along the direction perpendicular to the surface of the substrate, the thickness of the first optical transmission medium is greater than the thickness of the second optical transmission medium.

[0017] By adopting this implementation method, the size of the first end cross-section of the first optical transmission medium is effectively greater than the size of the first end cross-section of the second optical transmission medium, thereby ensuring the matching between the effective refractive index of the first optical transmission medium and the effective refractive index of the second optical transmission medium, reducing the coupling loss of optical signal between the first optical transmission medium and the second optical transmission medium, and improving the coupling efficiency.

[0018] Based on the first aspect, in one optional implementation, along a direction perpendicular to the substrate surface, the first optical transmission medium has a first distance from the substrate surface, and the second optical transmission medium has a second distance from the substrate surface, wherein the first distance is different from the second distance.

[0019] By adopting this implementation method, when the first distance is different from the second distance, the evanescent wave coupling between the first optical transmission medium and the second optical transmission medium is guaranteed, so as to ensure that the optical signal can be successfully coupled between the first optical transmission medium and the second optical transmission medium, thereby ensuring the successful transmission of the optical signal on the optical chip.

[0020] Based on the first aspect, in one optional implementation, the N second optical transmission media include i second optical transmission media and j second optical transmission media, where i is an integer greater than or equal to 1, j is an integer greater than or equal to 1, and the sum of i and j is equal to N. Along the target direction, the first end of the first optical transmission medium is located between the i second optical transmission media and the j second optical transmission media, and the target direction intersects with the direction in which the first optical transmission medium transmits optical signals.

[0021] By adopting this implementation method, along a path perpendicular to the substrate surface, at the first end of the first optical transmission medium, between the first ends of two different second optical transmission media, evanescent wave coupling between the first and second optical transmission media is ensured, so as to ensure that the optical signal can be successfully coupled between the first and second optical transmission media, thereby ensuring the successful transmission of the optical signal on the optical chip.

[0022] Based on the first aspect, in one optional implementation, the first optical transmission medium has a third orthographic projection on the target plane, the second optical transmission medium has a fourth orthographic projection on the target plane, the fourth orthographic projection is within the coverage of the third orthographic projection, and the target plane intersects with the substrate surface.

[0023] By employing this implementation method, when the fourth orthographic projection is within the coverage area of ​​the third orthographic projection, the evanescent wave coupling between the first optical transmission medium and the second optical transmission medium is guaranteed, ensuring that the optical signal can be successfully coupled between the first optical transmission medium and the second optical transmission medium, thereby ensuring the successful transmission of the optical signal on the optical chip.

[0024] Based on the first aspect, in one optional implementation, the substrate includes a first substrate and a second substrate. Along a direction perpendicular to the surface of the first substrate, the surface of the first substrate is positioned opposite to the surface of the second substrate, and a target region is formed between the surface of the first substrate and the surface of the second substrate. The first substrate fixes the first optical transmission medium, and the second substrate fixes the N second optical transmission media. The first optical transmission medium and the N second optical transmission media are all located in the target region.

[0025] Using this implementation method, the optical chip is assembled by a first substrate and a second substrate, which improves the flexibility of optical chip assembly.

[0026] Based on the first aspect, in one optional implementation, there is a gap between the first optical transmission medium and the second optical transmission medium, or, the first optical transmission medium and the second optical transmission medium include a filling medium, wherein the refractive index of the filling medium is less than the refractive index of the first optical transmission medium, and the refractive index of the filling medium is less than the refractive index of the second optical transmission medium.

[0027] In this implementation, a hollow space exists between the first optical transmission medium and the second optical transmission medium, or a filling medium with a low refractive index is included between the first optical transmission medium and the second optical transmission medium. This effectively improves the transmittance between the first optical transmission medium and each of the second optical transmission media, reduces the loss of optical signals during coupling between the first and second optical transmission media, and the low refractive index filling medium or hollow structure can also achieve mode field matching between the optical signals transmitted by the first optical transmission medium and the optical signals transmitted by the second optical transmission medium, reducing losses and distortions during optical signal coupling, thereby improving coupling efficiency and transmission performance.

[0028] Based on the first aspect, in one optional implementation, along the target cross-section, the cross-section of the first optical transmission medium is one of a rectangle, triangle, circle, parallelogram, arc, trapezoid, or ridge.

[0029] By adopting this implementation method, the shape of the cross-section of the first optical transmission medium is set to ensure the matching between the effective refractive index of the first optical transmission medium and the effective refractive index of the second optical transmission medium, thereby reducing the coupling loss of the optical signal between the first and second optical transmission media and improving the coupling efficiency.

[0030] Based on the first aspect, in one optional implementation, the cross-section of the second optical transmission medium along the target section is one of a rectangular, triangular, circular, parallelogram, arc, trapezoidal, or ridge shape.

[0031] By adopting this implementation method, the shape of the cross-section of the second optical transmission medium is set to ensure the matching between the effective refractive index of the first optical transmission medium and the effective refractive index of the second optical transmission medium, thereby reducing the coupling loss of optical signals between the first and second optical transmission media and improving the coupling efficiency.

[0032] Based on the first aspect, in one optional implementation, the substrate further includes a second coupling module, which connects the second ends of the N second optical transmission media and the first end of the third optical transmission medium; the second coupling module is used to receive the N first sub-optical signals from the first coupling module, and to combine the N first sub-optical signals to obtain a first combined optical signal, and to transmit the first combined optical signal to the third optical transmission medium; or, the second coupling module is used to receive a second combined optical signal from the third optical transmission medium, and to split the second combined optical signal into the N second sub-optical signals.

[0033] Using this implementation, the optical chip can achieve single input and single output, and effective refractive index matching can be achieved between the second ends of the N second optical transmission media and the first end of the third optical transmission media. This improves the coupling efficiency between the N second optical transmission media and the third optical transmission media while avoiding large optical damage at the second end of the second optical transmission media.

[0034] Based on the first aspect, in one optional implementation, the optical chip further includes a first optical device and a second optical device, wherein the first optical device is connected to the second end of the first optical transmission medium, and the second optical device is connected to the second end of the second optical transmission medium.

[0035] By adopting this implementation method, the optical chip can effectively improve the coupling efficiency of optical signals transmitted between the first optical device and the second optical device, and avoid large optical damage during the optical signal coupling process.

[0036] Based on the first aspect, in one optional implementation, the substrate further fixes an optical fiber adapter, which connects the transmission optical fiber and the second end of the first optical transmission medium.

[0037] In this implementation, the fiber optic adapter connects to the transmission fiber, and the fiber optic adapter connects the transmission fiber to the second end of the first optical transmission medium. The optical chip improves the coupling efficiency of the optical signal coupled with the transmission fiber, while effectively avoiding large optical damage to the second optical transmission medium.

[0038] Secondly, this application provides a photoelectric conversion module, including an optical chip as described in any of the first aspects above. A second end of the first optical transmission medium is connected to an optical fiber adapter, which is connected to a transmission optical fiber and the first optical transmission medium. The optical chip further includes a detector connected to the second end of the second optical transmission medium. The optical fiber adapter is used to transmit the first optical signal from the transmission optical fiber to the first optical transmission medium, and the detector is used to perform photoelectric conversion on the first sub-optical signal to obtain a first electrical signal. Alternatively, the optical chip further includes a laser connected to the second end of the second optical transmission medium. The laser is used to transmit the second sub-optical signal to the second optical transmission medium, and the optical fiber adapter is used to transmit the second optical signal to the transmission optical fiber. For an explanation of the beneficial effects of this aspect, please refer to the first aspect; specific details will not be repeated here.

[0039] Thirdly, this application provides an optical communication device, including a housing, within which a processing chip and a connector are fixed. The processing chip is connected to a photoelectric conversion module via the connector, the photoelectric conversion module being as described in the second aspect above. The detector is used to send a first electrical signal to the processing chip; or, the processing chip is used to send a second electrical signal to the laser, the laser being used to convert the second electrical signal into a second sub-optical signal.

[0040] Fourthly, this application provides a radar, including a processor and an optical chip connected to the processor. The optical chip is as described in any of the first aspects above, and includes a laser connected to a second end of a second optical transmission medium. The processor is configured to send a first detection electrical signal to the laser, and the laser is configured to convert the first detection electrical signal into a second sub-optical signal and send the second sub-optical signal to the second optical transmission medium. The second optical signal is used to detect relevant information about a target object.

[0041] Fifthly, this application provides a radar, including a processor and an optical chip connected to the processor. The optical chip is as described in any of the first aspects above. The optical chip includes a detector connected to a second end of a second optical transmission medium. The detector is used to receive a first sub-optical signal and convert the first sub-optical signal into a second detection electrical signal. The first sub-optical signal is an optical signal reflected by a target object. The processor is used to obtain relevant information about the target object based on the second detection electrical signal.

[0042] Sixthly, this application provides a vehicle, including a vehicle body and a radar fixed to the vehicle body, the radar being as described in any of the fourth or fifth aspects.

[0043] A seventh aspect is an optical fiber communication system, the optical fiber communication system comprising at least a first optical communication device and a second optical communication device, the first optical communication device and the second optical communication device being connected via a transmission optical fiber, the first optical communication device and the second optical communication device being as described in any of the third aspects. Attached Figure Description

[0044] Figure 1 is a top view example of an existing optical chip structure;

[0045] Figure 2 is a top view of the first embodiment of the optical chip provided in this application.

[0046] Figure 3 is a first side view of the optical chip shown in Figure 2;

[0047] Figure 4 is a first cross-sectional view of the optical chip shown in Figure 2;

[0048] Figure 5 is a second side view of the optical chip shown in Figure 2;

[0049] Figure 6 is a second cross-sectional view of the optical chip shown in Figure 2;

[0050] Figure 7 shows a third side view of the optical chip shown in Figure 2;

[0051] Figure 8 shows a third cross-sectional view of the optical chip shown in Figure 2;

[0052] Figure 9 is a top view of an example structure of a second embodiment of the optical chip provided in this application;

[0053] Figure 10 is a cross-sectional view of the optical chip shown in Figure 9;

[0054] Figure 11 is a top view of the third embodiment of the optical chip provided in this application.

[0055] Figure 12 is a side view of the optical chip shown in Figure 11;

[0056] Figure 13 is a top view of the fourth embodiment of the optical chip provided in this application.

[0057] Figure 14a is a top view of the fifth embodiment of the optical chip provided in this application.

[0058] Figure 14b is a side view of an embodiment of the optical chip provided in this application.

[0059] Figure 15 is a top view of the sixth embodiment of the optical chip provided in this application.

[0060] Figure 16 is a top view of the seventh embodiment of the optical chip provided in this application.

[0061] Figure 17 is a top view of the eighth embodiment of the optical chip provided in this application.

[0062] Figure 18 is a structural example diagram of the first embodiment of the photoelectric conversion module provided in this application;

[0063] Figure 19 is a structural example diagram of a second embodiment of the photoelectric conversion module provided in this application;

[0064] Figure 20 is a structural example diagram of the optical communication device provided in this application;

[0065] Figure 21 is a structural example diagram of an embodiment of the radar provided in this application;

[0066] Figure 22 is a structural example diagram of an embodiment of the vehicle provided in this application. Detailed Implementation

[0067] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0068] This application provides an optical chip that can be applied to various types of communication devices. These communication devices can be optical transmission devices, optical access devices, routers, switches, wireless base stations, wireless remote access devices, wireless baseband signal processing devices, etc., or they can be computing servers (commonly referred to as servers), high-performance computers (HPCs), storage servers, or memory resource pools, etc. For example, if the optical fiber communication system used by this communication device is a passive optical network (PON), then the communication device can be an optical network unit (ONU), an optical network terminal (ONT), or an optical line terminal (OLT). As another example, if the optical fiber communication system used by this communication device is an optical transport network (OTN), then the communication device can be an OTN device. Furthermore, if the optical fiber communication system used by this communication device is a data center network (DCN) or a metropolitan area network, then the communication device can be a server, etc. For example, if the optical fiber communication system used by the communication equipment is radio-over-fiber (ROF), then the communication equipment can be a central station (CS) or a base station (BS).

[0069] As a key component in optical fiber communication systems, optical chips perform many crucial functions, such as high-speed modulation of optical signals, detection of optical signals, transmission and routing of optical signals, wavelength division multiplexing (WDM) of optical signals, and demultiplexing of optical signals. Figure 2 is a top view of a first embodiment of the optical chip provided in this application. Figure 3 is a first side view of the optical chip shown in Figure 2, and Figure 4 is a first cross-sectional view of the optical chip shown in Figure 2.

[0070] The optical chip shown in this embodiment includes a substrate 200, on which a first optical transmission medium 210 and N second optical transmission media are fixed, where N is any integer greater than or equal to 2. Figure 2 shows an example structure of the optical chip in the XY plane. The surface of the substrate 200 extends along the XY plane or in a direction parallel to the XY plane. The XY plane includes the X direction and the Y direction. The X direction is the transmission direction of the optical signal in the optical chip, and the Y direction intersects the X direction; for example, the X direction is perpendicular to the Y direction. Figure 3 shows an example structure of the optical chip in the XZ plane. The XZ plane includes the X direction and the Z direction. The Z direction intersects the XY plane; for example, the Z direction is perpendicular to the XY plane. Figure 4 shows an example structure of the optical chip in the YZ plane. The YZ plane includes the Y direction and the Z direction. The Y direction intersects the Z direction; for example, the Y direction is perpendicular to the Z direction.

[0071] Substrate 200 can be a silicon-on-insulator (SOI) substrate. Specifically, substrate 200 includes a substrate layer, a buried oxide layer, and a waveguide layer (or active silicon layer). The waveguide layer includes a first optical transmission medium and N second optical transmission media. The substrate layer serves as the support for the SOI substrate, providing the mechanical strength and stability of the optical chip. The buried oxide layer isolates the waveguide layer and the substrate layer. The refractive index of the buried oxide layer is relatively small, less than that of the waveguide layer, allowing the optical signal to be confined within the waveguide layer for transmission. In this embodiment, N is taken as 3. Therefore, the N second optical transmission media include second optical transmission medium 211, second optical transmission medium 212, and second optical transmission medium 213. Taking the first optical transmission medium 210 as an example, the first optical transmission medium 210 can be made of silicon dioxide (SiO2), silicon nitride (SiN), silicon (Si), lithium niobate (LN), lithium phosphate (LP), indium phosphide (InP), silicon oxynitride (SiON), gallium arsenide (GaAs), germanium (Ge), polymers, fluoride glasses, chalcogenide glasses, etc. For a description of the material of the second optical transmission medium, please refer to the description of the material of the first optical transmission medium; details will not be repeated here. The material of the first optical transmission medium 210 can be the same as or different from the material of the second optical transmission medium; no specific limitation is imposed.

[0072] The optical chip also includes a first coupling module, which comprises a first end of a first optical transmission medium 210 and a first end of a second optical transmission medium. The first end of the second optical transmission medium is located close to the first end of the first optical transmission medium 210. This embodiment does not limit the distance between the first end of the second optical transmission medium and the first end of the first optical transmission medium 210, as long as they are close enough to couple the optical signal via evanescent wave coupling. For example, the distance between the first end of the second optical transmission medium and the first end of the first optical transmission medium 210 can be on the order of tens to hundreds of nanometers. Specifically, when the first optical transmission medium 210 and the second optical transmission medium are sufficiently close, energy exchange will occur between them due to the evanescent field. The specific coupling process can be as follows: the first coupling module receives a first optical signal through the first optical transmission medium 210. The first coupling module is also used to split the first optical signal into N first sub-optical signals and transmit each of the N first sub-optical signals to one of the N second optical transmission media, thereby causing each second optical transmission medium to output one first sub-optical signal at its second end. Alternatively, the first coupling module can receive one second sub-optical signal through each second optical transmission medium. Therefore, the first coupling module can receive N second sub-optical signals through the N second optical transmission media. The first coupling module then combines the N second sub-optical signals to obtain a second optical signal and transmits the second optical signal to the first optical transmission medium, thereby causing the second end of the first optical transmission medium 210 to output one second optical signal. This embodiment does not limit the ratio of the optical power transmitted by different second optical transmission media. For example, different second optical transmission media may transmit the same amount of optical power, or they may transmit different amounts of optical power.

[0073] Referring to Figure 4, which is an example diagram of the structure of the optical chip cut by the target cross-section, Figure 4 illustrates the structural features of the optical chip on this target cross-section. This embodiment uses the YZ plane as the target cross-section as an example. It can be understood that the target cross-section is perpendicular to the surface of the substrate 200. It should be clarified that this embodiment uses the perpendicularity of the target cross-section to the surface of the substrate 200 as an example, and is not limited to any particular case where the target cross-section intersects the surface of the substrate 200. Along the target cross-section, the cross-sectional area of ​​each second optical transmission medium is smaller than the cross-sectional area of ​​the first optical transmission medium 210. For example, along the target cross-section, the cross-sectional area of ​​the second optical transmission medium 211 is smaller than the cross-sectional area of ​​the first optical transmission medium 210, the cross-sectional area of ​​the second optical transmission medium 212 is smaller than the cross-sectional area of ​​the first optical transmission medium 210, and the cross-sectional area of ​​the second optical transmission medium 213 is smaller than the cross-sectional area of ​​the first optical transmission medium 210. Specifically, for example, along the target direction, the width of the first end of the first optical transmission medium is greater than the width of the first end of the second optical transmission medium. For example, the target direction is direction Y, and the target direction Y intersects with the direction in which the first optical transmission medium 210 transmits optical signals (for example, the direction in which the first optical transmission medium 210 transmits optical signals is direction X). Similarly, along the direction Z, the thickness of the first end of the first optical transmission medium is greater than the thickness of the first end of the second optical transmission medium.

[0074] For example, the first optical transmission medium 210 is made of SiN, with a SiO2 cladding layer around the SiN, and the second optical transmission medium is made of Si, with a SiO2 cladding layer around the Si. The area surrounding the first optical transmission medium 210 can be air or materials such as optical adhesive, and the area surrounding each second optical transmission medium can also be air or materials such as optical adhesive. The first optical transmission medium 210 has a low effective refractive index. To improve the coupling efficiency of optical signal transmission between the first and second optical transmission media, the effective refractive index of the second optical transmission medium needs to be equal to or similar to that of the first optical transmission medium 210. When the effective refractive indices of the first end of the first optical transmission medium 210 and the first end of the second optical transmission medium are equal or similar, it helps to achieve phase matching, reduces reflection and scattering of the optical signal during the coupling process between the first and second optical transmission media, reduces losses during optical signal coupling, and improves the reliability of the optical signal coupling process. To this end, the effective refractive index of the second optical transmission medium is adjusted to be equal to or similar to that of the first optical transmission medium 210 by narrowing the size of the first end of the second optical transmission medium. Furthermore, the cross-sectional area of ​​the first end of each second optical transmission medium gradually decreases in the direction away from the second end of the first optical transmission medium 210. Taking the second optical transmission medium 211 as an example, the first end of the second optical transmission medium 211 forms a relatively narrow tip 230. This embodiment uses the example of a linear decrease in the cross-sectional area of ​​the first end of the second optical transmission medium in the direction away from the second end of the first optical transmission medium 210, without limitation. Alternatively, the cross-sectional area of ​​the first end of the second optical transmission medium may decrease non-linearly in the direction away from the second end of the first optical transmission medium 210. The second optical transmission medium includes a core layer (such as Si as shown in the example above) and a cladding layer (such as SiO2 as shown in the example above). When a tip is formed at the first end of the second optical transmission medium, the narrower first end of the second optical transmission medium enables the optical signal to be coupled efficiently between the second optical transmission medium and the first optical transmission medium. Moreover, the tip 230 can also reduce the reflection of the optical signal during the coupling process between the first optical transmission medium and the second optical transmission medium, thereby reducing the loss during the coupling process.

[0075] However, when a tip 230 is formed at the first end of the second optical transmission medium 211, the optical power density at the first end of the second optical transmission medium 211 is increased. Excessive optical power density at the first end of the second optical transmission medium 211 can lead to significant optical damage. This significant optical damage causes material damage to the second optical transmission medium, affecting its transmission performance. Under excessively high optical power density, the second optical transmission medium will experience significant optical nonlinear absorption, further leading to greater losses and high-temperature damage. Significant optical damage affects the performance of the optical chip, such as increasing insertion loss and return loss, thereby reducing the overall performance of the optical chip. To avoid significant optical damage in this embodiment, the first coupling module includes multiple second optical transmission media. With multiple second optical transmission media, the optical power density in each second optical transmission medium is effectively reduced. This improves the coupling efficiency between the first optical transmission medium and the N second optical transmission media while effectively preventing significant optical damage.

[0076] The optical chip shown in this embodiment, if the optical signal is input from the second end of the first optical transmission medium and outputs through N second optical transmission media, can be understood as achieving N-way output of the optical signal without the need for a beam splitter, reducing the number of optical devices included in the optical chip. Therefore, the structure of the optical chip enables multi-channel optical signal output applications, simplifies the packaging structure of the optical chip, and improves the reliability and integration of the optical chip. Because the optical chip does not require a separate beam splitter, the sensitivity to the length between different second optical transmission media is reduced, as is the length fluctuation between different second optical transmission media, thereby reducing losses. Similarly, if the optical signal is input from N second optical transmission media and outputs through the second end of the first optical transmission medium, the optical chip shown in this embodiment can be understood as achieving N-way input of the optical signal without the need for a separate beam combiner, reducing the number of optical devices included in the optical chip. Therefore, the packaging structure of the optical chip is simplified, improving the reliability and integration of the optical chip. Because the optical chip does not require a separate beam combiner, the sensitivity to the length between different second optical transmission media is reduced, as is the length fluctuation between different second optical transmission media, thereby reducing losses.

[0077] The following are various examples of the height positional relationship between the first optical transmission medium and N second optical transmission media along the Z direction:

[0078] Height Example 1

[0079] Referring to Figures 3 and 4, along a direction perpendicular to the surface of the substrate 200 (i.e., direction Z), the first optical transmission medium 210 has a first distance from the surface of the substrate 200, and the second optical transmission medium has a second distance from the surface of the substrate 200, wherein the first distance is greater than the second distance. Specifically, along direction Z, the first optical transmission medium 210 and each of the second optical transmission media may be perforated, or a filling medium may be included between the first optical transmission medium 210 and each of the second optical transmission media. The refractive index of the filling medium is less than that of the first optical transmission medium, and the refractive index of the filling medium is less than that of the second optical transmission medium. For example, the filling medium may be an oxide layer or an optical adhesive layer, etc., to improve the transmittance between the first optical transmission medium and each of the second optical transmission media, reduce the loss of optical signals during the coupling process between the first and second optical transmission media, and the low-refractive-index filling medium or perforated structure can also achieve mode field matching between the optical signals transmitted by the first optical transmission medium and the optical signals transmitted by the second optical transmission medium, reducing losses and deformations during optical signal coupling, thereby improving coupling efficiency and transmission performance.

[0080] Height Example 2

[0081] Referring to Figures 5 and 6, where Figure 5 is a second side view of the optical chip shown in Figure 2, and Figure 6 is a second cross-sectional view of the optical chip shown in Figure 2. In this example, the first distance between the first optical transmission medium 210 and the surface of the substrate 200 is less than the second distance between the second optical transmission medium and the surface of the substrate 200.

[0082] Height Example 3

[0083] Referring to Figures 7 and 8, where Figure 7 is a third side view of the optical chip shown in Figure 2, and Figure 8 is a third cross-sectional view of the optical chip shown in Figure 2. Along direction Z, the N second optical transmission media include i second optical transmission media and j second optical transmission media, where i is an integer greater than or equal to 1, j is an integer greater than or equal to 1, and the sum of i and j equals N. For example, the i second optical transmission media includes at least second optical transmission medium 211, and the j second optical transmission media includes at least second optical transmission medium 212 and second optical transmission medium 213. Along direction Z, the first optical transmission medium 210 is located between the i second optical transmission media and the j second optical transmission media. For example, the first end of the first optical transmission medium 210 is located between second optical transmission medium 211 and second optical transmission medium 212, and the first end of the first optical transmission medium 210 is located between second optical transmission medium 211 and second optical transmission medium 213. Therefore, the first distance between the first optical transmission medium 210 and the surface of the substrate 200 is greater than the second distance between the second optical transmission medium 212 and the surface of the substrate 200, and the first distance between the first optical transmission medium 210 and the surface of the substrate 200 is less than the second distance between the second optical transmission medium 211 and the surface of the substrate 200.

[0084] The following are various examples of the orthographic projection positional relationships between the first optical transmission medium and N second optical transmission media:

[0085] Orthographic projection example 1

[0086] As shown in Figure 2, the first end of the first optical transmission medium 210 has a first orthographic projection on the surface of the substrate 200, and the first end of each second optical transmission medium has a second orthographic projection on the surface of the substrate 200. The second orthographic projection is completely within the coverage area of ​​the first orthographic projection.

[0087] Orthographic projection example 2

[0088] Referring to Figures 9 and 10, where Figure 9 is a top view of the second embodiment of the optical chip provided in this application, and Figure 10 is a cross-sectional view of the optical chip shown in Figure 9, the optical chip shown in this example includes a substrate 900. The substrate 900 is used to fix a first optical transmission medium 910 and N second optical transmission media. In this example, N=2 is taken as an example. Then, the substrate 900 is used to fix two second optical transmission media, namely, second optical transmission medium 911 and second optical transmission medium 912. For a detailed description of the structure, please refer to the above embodiment, which will not be repeated here. The first end of the first optical transmission medium 910 has a first orthographic projection on the surface of the substrate 900, and the first end of each second optical transmission medium has a second orthographic projection on the surface of the substrate 900. The first orthographic projection and the second orthographic projection partially overlap.

[0089] Orthographic projection example 3

[0090] Referring to Figure 11, which is a top view of a third embodiment of the optical chip provided in this application, the optical chip in this example includes a substrate 1100 for fixing a first optical transmission medium 1110 and N second optical transmission media. In this example, N=2. Therefore, the optical chip includes second optical transmission media 1111 and optical transmission media 1112. For a detailed description of the structure, please refer to the above embodiment; further details will not be repeated here. In this example, the first end of the first optical transmission medium 1110 has a first orthographic projection on the surface of the substrate 1100, and the first end of the second optical transmission media has a second orthographic projection on the surface of the substrate 1100. There is a gap between the first and second orthographic projections. It can be understood that the first and second orthographic projections in this example do not overlap.

[0091] The height relationship between the first and second optical transmission media along direction Z, as shown in this example, can be found in height examples 1 to 3 above, and will not be elaborated further. Optionally, the height relationship between the first and second optical transmission media shown in this example can also be found in Figure 12, which is a side view of the optical chip shown in Figure 11. In this example, the first optical transmission medium 1110 has a third orthographic projection on the target plane, and the second optical transmission medium 1111 has a fourth orthographic projection on the target plane. The target plane is plane XZ. It can be understood that the target plane shown in this example is perpendicular to the surface of the substrate 1100. This example uses the example of the target plane being perpendicular to the surface of the substrate 1100, but it is not limited, as long as the target plane intersects the surface of the substrate 1100. The fourth orthographic projection is within the coverage area of ​​the third orthographic projection. Therefore, along direction Z, the first distance between the first optical transmission medium 1110 and the surface of the substrate 1100 is equal to or approximately equal to the second distance between the second optical transmission medium 1111 and the surface of the substrate 1100.

[0092] Figure 4 shows an example of the structure of the optical chip along the target cross-section, where the target cross-section is the YZ plane and is perpendicular to the substrate surface. Taking a rectangular shape as an example along the target cross-section YZ, the shape is not limited; for example, the cross-section of the first optical transmission medium 210 can also be triangular, circular, parallelogram, arc-shaped, trapezoidal, ridge-shaped, etc. For a description of the cross-sectional shape of the second optical transmission medium along the target cross-section, please refer to the description of the cross-sectional shape of the first optical transmission medium 210 along the target cross-section; details will not be repeated here. For example, along the target cross-section, the shape of the cross-section of the first optical transmission medium 210 and the cross-section of the second optical transmission medium can be the same, and different second optical transmission media can have the same cross-sectional shape. Alternatively, the shape of the cross-section of the first optical transmission medium 210 may be different from the cross-section of the second optical transmission medium, or different second optical transmission media may have different cross-sectional shapes.

[0093] The following is an example diagram illustrating the structure of the first optical transmission medium in the XY plane:

[0094] Example 1

[0095] Referring to Figure 2, the first optical transmission medium 210 includes a first transition section 301, which is located between a first end and a second end of the first optical transmission medium 210. Along the target direction, the width of the first transition section 301 gradually increases away from the second end of the first optical transmission medium 210, wherein the target direction intersects with the direction in which the first optical transmission medium transmits the optical signal. This embodiment uses the example of the width of the first transition section 301 increasing linearly away from the second end of the first optical transmission medium 210 as an example, without limitation. Alternatively, the width of the first transition section 301 may increase non-linearly away from the second end of the first optical transmission medium 210. In this example, the direction in which the first optical transmission medium 210 transmits the optical signal is direction X, and the target direction is direction Y. It can be understood that the target direction shown in this example is perpendicular to the direction in which the first optical transmission medium 210 transmits the optical signal. The width of the first end 302 of the first optical transmission medium gradually tapers away from the second end of the first optical transmission medium 210. For an explanation of the taper, please refer to the above explanation of the taper, which will not be repeated here. The first coupling module also includes a second transition section 303, which connects the first end 302 of the first optical transmission medium and the first transition section 301, and the width of the second transition section 303 remains unchanged along the target direction Y.

[0096] Example 2

[0097] Figure 13 is a top view of a fourth embodiment of the optical chip provided in this application. The optical chip shown in this example includes a substrate 1300, which is used to fix a first optical transmission medium 1310, a second optical transmission medium 1311, and a second optical transmission medium 1312. For details, please refer to the example above; further details will not be repeated here. The first optical transmission medium 1310 includes a first transition segment 1333. The first transition segment 1333 is along the target direction Y. The width of the first transition segment 1333 gradually increases in a direction away from the second end of the first optical transmission medium 1310. For details, please refer to Example 1; further details will not be repeated here. The width of the first end 1331 of the first optical transmission medium gradually decreases in a direction away from the second end of the first optical transmission medium 1310. The first coupling module further includes a second transition section 1332, which is connected between the first end 1331 of the first optical transmission medium and the first transition section 1333, and along the target direction Y, the width of the second transition section 1332 gradually decreases in the direction away from the second end of the first optical transmission medium 1210.

[0098] Example 3

[0099] Figure 14a is a top view of a fifth embodiment of the optical chip provided in this application. The optical chip shown in this example includes a substrate 1400, which is used to fix a first optical transmission medium 1410, a second optical transmission medium 1411, and a second optical transmission medium 1412. For details, please refer to the example above; further details will not be repeated here. The first optical transmission medium 1410 includes a first transition segment 1433. The first transition segment 1433 is along the target direction Y. The width of the first transition segment 1433 gradually increases in a direction away from the second end of the first optical transmission medium 1410. For details, please refer to Example 1; further details will not be repeated here. The width of the first end 1431 of the first optical transmission medium gradually decreases in a direction away from the second end of the first optical transmission medium 1410. The first coupling module further includes a second transition section 1432, which is connected between the first end 1431 of the first optical transmission medium and the first transition section 1433, and along the target direction Y, the width of the second transition section 1432 gradually increases in the direction away from the second end of the first optical transmission medium 1210.

[0100] The structure of the width of the first optical transmission medium in this embodiment is optional and not limited. The width of the first optical transmission medium is a key factor affecting its effective refractive index. By adjusting the width of the first optical transmission medium, the propagation mode and distribution of the optical signal in the first optical transmission medium can be changed, thereby affecting the effective refractive index of the first optical transmission medium. Furthermore, by adjusting the width of the first optical transmission medium, the effective refractive index of the first optical transmission medium can be made equal or approximately equal to that of the second optical transmission medium, so that the optical signal transmitted by the first optical transmission medium and the optical signal transmitted by the second optical transmission medium maintain phase matching and mode matching, thereby improving the coupling efficiency of the optical signal coupling between the first and second optical transmission media.

[0101] Figure 14b is a side view of an embodiment of the optical chip provided in this application. The optical chip shown in this embodiment includes a first substrate 1421 and a second substrate 1422. Along a direction perpendicular to the surface of the first substrate 1422 (e.g., direction Z), the surfaces of the first substrate 1421 and the second substrate 1422 are positioned opposite each other, and a target region 1423 is formed between the surfaces of the first substrate 1421 and the second substrate 1422. The first substrate 1422 is used to fix the first optical transmission medium 1424, and the second substrate 1422 is used to fix N second optical transmission media 1425. For a description of the first optical transmission medium 1424 and the N second optical transmission media 1425, please refer to the above embodiment; specific details will not be repeated here. In this embodiment, the first optical transmission medium 1424 and the N second optical transmission media 1425 are all located in the target region 1423. In this embodiment, the first substrate 1421 and the second substrate 1422 can be assembled by surface mounting to form an optical chip. The surface mounting method can be flip-chip or front-side mounting, etc., and there is no specific limitation.

[0102] The optical chip shown in this embodiment can achieve single input and single output. The specific structure is shown in Figure 15, which is a top view example of the sixth embodiment of the optical chip provided in this application. The optical chip shown in this embodiment includes a substrate 1500, which is used to fix a first optical transmission medium 1510 and N second optical transmission media, such as second optical transmission media 1511 and second optical transmission media 1513. For a description of the first optical transmission medium and the N second optical transmission media, please refer to the above embodiment; specific details will not be repeated here. The substrate 1500 is also used to fix a second coupling module 1521 and a third optical transmission medium 1522. For a description of the third optical transmission medium 1522, please refer to the above description of the second optical transmission media; specific details will not be repeated here. This embodiment uses the example that the material of the third optical transmission medium 1522 is the same as that of the second optical transmission media, without limitation. The second coupling module 1521 is connected to the second ends of the N second optical transmission media and the first end of the third optical transmission medium 1522, respectively. For example, the second coupling module 1521 can be a multi-mode interference coupler (MMI), a y-branch beam splitter, or a beam combiner based on micro-optical elements.

[0103] The second coupling module 1521 receives N first sub-optical signals from the first coupling module and combines them to obtain a first combined optical signal. The second coupling module 1521 outputs this first combined optical signal through the third optical transmission medium 1522. Alternatively, the second coupling module 1521 receives a second combined optical signal from the third optical transmission medium 1522 and splits the second combined optical signal into N second sub-optical signals. The first coupling module combines the N second sub-optical signals from the N second optical transmission media for output through the first optical transmission medium.

[0104] Figure 16 is a top view of the seventh embodiment of the optical chip provided in this application. The optical chip shown in this embodiment further includes a first optical device 1601 connected to the second end of the first optical transmission medium 1510, and a second optical device 1602 connected to the second end of the third optical transmission medium 1522. For a description of the first, second, and third optical transmission media included in the optical chip, please refer to the description corresponding to Figure 15; specific details will not be repeated here. This embodiment does not limit the types of the first optical device 1601 and the second optical device 1602. For example, one of the first optical device 1601 and the second optical device 1602 may be a laser, and the other may be an optical modulator. Specifically, for example, the first optical device 1601 may be a laser, and the second optical device 1602 may be an optical modulator. This example does not limit the type of laser. For example, the laser can be a direct modulation laser (DML), an electro-absorption modulated laser (EML), a vertical cavity surface emitting laser (VCSEL), a distributed bragg reflector (DBR), a fabricy-pérot laser, a distributed feedback laser, a modulated grating y-branch (MG-Y) laser, a multi-channel interference (MCI) laser, a V-cavity laser, and a chirped sampled grating-distributed reflector laser (CSG-DR). The optical modulator can be a Mach-Zehnder modulator (MZM) or a micro-ring modulator (MRM), etc. For example, one of the optical devices 1601 and 1602 is an optical modulator, and the other is an optical amplifier.For example, in the first optical device 1601 and the second optical device 1602, one optical device is a laser, and the other is a multiplexer. The multiplexer can be a wavelength division multiplexing (WDM), a Mach-Zehnder interferometer (MZI) filter, an arrayed waveguide grating (AWG), a multimode interference coupler, a reflective echelle grating, or a grating coupler. Alternatively, in the first optical device 1601 and the second optical device 1602, one optical device is a wavelength division demultiplexer (WDD), and the other is a detector. For example, the detector type can be a positive intrinsic-negative diode (PIN diode) or an avalanche photodiode (APD). This embodiment takes the second optical device 1602 connected to the second end of the third optical transmission medium as an example, but it is not limited. In other examples, the optical chip may include one or more second optical devices, and the second optical devices may be directly connected to the second end of one or more second optical transmission media.

[0105] Figure 17 is a top view of the eighth embodiment of the optical chip provided in this application. The optical chip shown in this embodiment includes a substrate 1700, which is used to fix a first optical transmission medium 1702 and N second optical transmission media. For a description of the first optical transmission medium 1702 and the N second optical transmission media, please refer to the above embodiments; specific details will not be repeated here. The substrate 1700 also includes an optical fiber adapter 1701, which is connected between the transmission optical fiber 1703 and the second end of the first optical transmission medium 1702. The optical fiber adapter 1701 can be a ferrule connector (FC), a subscriber connector (SC), a lucent connector (LC), a straight tip (ST), a fiber distributed data interface (FDDI), a multi-fiber push-on connector (MPO), etc. The fiber optic adapter can also be connected to the transmission fiber 1703 via a movable connector, a modular fiber optic access structure, or other means, without limitation. Optionally, an edge coupler may be included between the fiber optic adapter 1701 and the first optical transmission medium 1702. The edge coupler is used to achieve mode matching between the optical signal transmitted by the transmission fiber 1703 and the optical signal transmitted by the first optical transmission medium 1702, thereby improving the coupling efficiency of the optical signal between the transmission fiber 1703 and the first optical transmission medium 1702.

[0106] This application also provides a photoelectric conversion module. Figure 18 is a structural example diagram of the first embodiment of the photoelectric conversion module provided in this application. The photoelectric conversion module provided in this embodiment can also be called an optical transceiver module or an optical module, etc. The photoelectric conversion module shown in this embodiment is used to convert electrical signals into optical signals and transmit optical signals through a transmission optical fiber. Specifically, the photoelectric conversion module includes a substrate 1800, which is used to fix a modulator 1801 and an optical fiber adapter 1802. The optical fiber adapter 1802 is connected to the second end of the first optical transmission medium 1803 and the transmission optical fiber 1805. The modulator 1801 is connected to the second end of the second optical transmission medium 1804. For example, the modulator 1801 is directly connected to the second end of the second optical transmission medium 1804. Then, the second ends of N second optical transmission media 1804 can be connected to one or more lasers. As another example, the modulator 1801 is connected to the second end of a third optical transmission medium (see Figure 15 for the third optical transmission medium). For the description of the first optical transmission medium and the N second optical transmission media, please refer to the above embodiment. Specific details will not be repeated here. The modulator 1801 is used to transmit a second sub-optical signal to the second optical transmission medium 1804. The first coupling module combines N second sub-optical signals to obtain a second optical signal and transmits the second optical signal to the first optical transmission medium 1803. The fiber optic adapter 1802 transmits the second optical signal to the transmission fiber 1805.

[0107] This application also provides a photoelectric conversion module. Figure 19 is a structural example diagram of a second embodiment of the photoelectric conversion module provided in this application. The photoelectric conversion module shown in this embodiment is used to receive optical signals through a transmission optical fiber 1905 and to perform photoelectric conversion on the optical signals to obtain corresponding electrical signals. Specifically, the photoelectric conversion module includes a substrate 1900, which is used to fix an optical fiber adapter 1902 and a detector 1901. The optical fiber adapter 1902 is connected to the second end of the first optical transmission medium 1903 and the transmission optical fiber 1905. The detector 1901 is connected to the second end of the second optical transmission medium 1904. For example, if the detector 1901 is directly connected to the second end of the second optical transmission medium 1904, then the second ends of N second optical transmission media 1904 can be connected to one or more detectors 1901. As another example, the detector 1901 is connected to the second end of a third optical transmission medium (see Figure 15 for the third optical transmission medium). For a description of the first optical transmission medium and the N second optical transmission media, please refer to the above embodiments, which will not be repeated here. The transmission fiber 1905 transmits the received first optical signal to the first coupling module through the first optical transmission medium. The first coupling module splits the first optical signal into N first sub-optical signals and transmits the N first sub-optical signals to the N second optical transmission media respectively. The N second optical transmission media transmit the N first sub-optical signals to the detector 1901. The detector is used to perform photoelectric conversion on the received optical signal to obtain an electrical signal.

[0108] This application also provides an optical communication device, and Figure 20 is a structural example diagram of the optical communication device provided in this application. The optical communication device shown in this embodiment includes a housing, a device 2000 fixed inside the housing, and a photoelectric conversion module. Specifically, the device 2000 and the optical communication device can be integrated, or the device 2000 can be an independent pluggable board. This example does not limit the number of photoelectric conversion modules included in the optical communication device. The photoelectric conversion module can be integrated with the device 2000 or pluggable onto the board of the device 2000, etc., without specific limitations. Specifically, the device 2000 has encapsulated a processing chip 2001 and a connector 2002. The processing chip 2001 may have a transmit (TX) interface and a receive (RX) interface, both of which are connected to the connector 2002. The connector 2002 provides an electrical interface that enables a pluggable connection with the photoelectric conversion module. For example, an optical communication device includes a photoelectric conversion module 2011 connected to connector 2002. This photoelectric conversion module 2011 is used to convert electrical signals from processing chip 2001 into optical signals and transmit them concurrently. A description of the structure of photoelectric conversion module 2011 can be found in Figure 18, and will not be repeated here. As another example, an optical communication device includes a photoelectric conversion module 2012 connected to connector 2002. This photoelectric conversion module 2012 is used to receive optical signals, convert the optical signals into electrical signals via photoelectric conversion, and transmit the electrical signals to processing chip 2001. A description of the structure of photoelectric conversion module 2011 can be found in Figure 19, and will not be repeated here. This embodiment does not limit the type of processing chip 2001. For example, processing chip 2001 can be one or more chips, or one or more integrated circuits. For example, the processing chip 2001 can be one or more optical digital signal processors (oDSPs), field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), system-on-chips (SoCs), central processor units (CPUs), network processors (NPs), microcontroller units (MCUs), programmable logic devices (PLDs), network interface cards (NICs), storage interface chips, or other integrated chips, or any combination of the above chips or processing modules, etc., which will not be elaborated further.

[0109] This application also provides an optical fiber communication device, which includes at least a first optical communication device and a second optical communication device. The structures of the first optical communication device and the second optical communication device are shown in Figure 20, and will not be described in detail here. The first optical communication device and the second optical communication device are connected by a transmission optical fiber.

[0110] Figure 21 is a structural example diagram of an embodiment of the radar provided in this application. For example, the radar shown in this embodiment is a lidar, a target detection technology. Lidar emits light signals for detection; these signals are diffusely reflected upon encountering a target object. The lidar determines the target object's distance, azimuth, altitude, speed, attitude, shape, and other characteristics based on the reflected light signals. Lidar is applied to fields such as intelligent driving vehicles, intelligent aircraft, 3D printing, virtual reality (VR), augmented reality (AR), and service robots. The intelligent driving in this embodiment can be unmanned driving, autonomous driving, or assisted driving.

[0111] The lidar 2100 shown in this embodiment includes a processor 2101, a first optical chip 2110, and a second optical chip 2120. The first optical chip includes a substrate, on which a first optical transmission medium and N second optical transmission media are fixed. The first optical chip 2110 also includes a laser connected to the second end of each of the second optical transmission media. For an explanation of the laser's connection to the second optical transmission media, please refer to the description in Figure 18; details will not be repeated here. The laser is also connected to the processor 2101. The processor 2101 sends a first detection electrical signal to the laser. The laser converts the first detection electrical signal into a second sub-optical signal and sends the second sub-optical signal to the second optical transmission media. The first coupling module of the first optical chip 2110 combines the N second sub-optical signals to obtain a second optical signal. The first optical transmission medium of the second optical chip 2120 emits the second optical signal towards the target object. The second optical signal is used to detect relevant information about the target object. For a description of the structure of the second optical chip 2120, please refer to the above embodiment; details will not be repeated here.

[0112] When the second optical signal encounters the target object, it is reflected on the surface of the target object, reflecting the first optical signal back to the lidar. The second optical chip 2120 includes a substrate, on which a first optical transmission medium and N second optical transmission media are fixed. The second optical chip 2120 also includes a detector connected to the second end of the second optical transmission media. For an explanation of the detector's connection to the second optical transmission media, please refer to the corresponding description in Figure 19; details will not be repeated here. The detector is also connected to a processor 2101. The first optical transmission medium receives the first optical signal reflected by the target object. The first coupling module splits the first optical signal to obtain N first sub-optical signals, and transmits these N sub-optical signals to the detector through the N second optical transmission media. The detector receives the first sub-optical signals and converts them into second detection electrical signals. The detector sends the second detection electrical signals to the processor 2101, and the processor 2101 obtains relevant information about the target object based on the second detection electrical signals. Specifically, the processor 2101 can determine the location information of the target object by calculating the time delay between the emission time of the second optical signal and the return time of the first optical signal. This embodiment uses the example of implementing the first optical chip and the second optical chip using different optical chips. In other examples, the first optical chip and the second optical chip can be implemented using the same optical chip, which will not be elaborated on in detail.

[0113] The above embodiment illustrates the application of optical chips to lidar in transportation vehicles. In other examples, optical chips can also be applied to fixed radar (e.g., radar fixed on highways, surveillance radar, radar in industrial settings, etc.). Optical chips can also be applied to radar in unmanned transport vehicles in logistics warehouses or radar in smart home appliances (e.g., automatic cleaning robots), etc., without specific limitations.

[0114] This embodiment also provides a vehicle. For a detailed structural description, please refer to Figure 22, which is an example structural diagram of one embodiment of the vehicle provided in this application. The vehicle shown in this example can be a car, truck, motorcycle, public vehicle, lawnmower, recreational vehicle, amusement park vehicle, tram, golf cart, train, handcart, or drone, etc. This embodiment configures the vehicle 2200 in a fully or partially automated driving mode. The vehicle shown in this embodiment includes a vehicle body, which is used to fix a sensor system 2220, an advanced driving assistance system (ADAS) 2210, peripheral devices 2230, and a computer system 2240.

[0115] Sensing system 2220 includes one or more sensors that sense information about the environment surrounding vehicle 2200. For example, sensing system 2220 may include a positioning system, such as a Global Positioning System (GPS) or BeiDou Navigation Satellite System. Sensing system 2220 also includes an inertial measurement unit (IMU), lidar, and cameras. For a description of lidar, please refer to the embodiment corresponding to Figure 22; specific details are not limited thereto. Sensing system 2220 may also include sensors for monitoring internal systems of vehicle 2200 (e.g., in-vehicle air quality monitor, fuel gauge, oil temperature gauge, etc.). Sensor data from one or more of these sensors can be used to detect objects and their corresponding characteristics (position, shape, orientation, speed, etc.). The positioning system can be used to estimate the geographical location of vehicle 2200. The IMU is used to sense changes in the position and orientation of vehicle 2200 based on inertial acceleration. The IMU may be a combination of an accelerometer and a gyroscope. LiDAR can use radio signals to detect target objects in the environment surrounding vehicle 2200, such as pedestrians, vehicles, or buildings.

[0116] The ADAS2210 continuously senses the surrounding environment during vehicle operation, collects data, identifies, detects, and tracks static and dynamic objects, and combines this data with navigation map data for system calculations and analysis. This allows the driver to anticipate potential hazards, effectively increasing driving comfort and safety. For example, the ADAS2210 can control the vehicle using data acquired by the sensor system 2220. Furthermore, the ADAS2210 can control the vehicle using vehicle driving-related information, such as key data displayed on the vehicle's dashboard (fuel consumption, engine speed, temperature, etc.), vehicle speed, steering wheel angle information, or vehicle attitude data.

[0117] Vehicle 2200 interacts with external sensors, other vehicles, other computer systems, or users via peripheral device 2230. Peripheral device 2230 may include a wireless communication system, an onboard computer, a microphone, and / or a speaker. For example, the onboard computer may provide information to the user of vehicle 2200. The user interface may also operate the onboard computer to receive user input. The onboard computer may be operated via a touchscreen. In other cases, peripheral device 2230 may provide a means for vehicle 2200 to communicate with other devices located within the vehicle. For example, a microphone may receive audio (e.g., voice commands or other audio input) from the user of vehicle 2200. A speaker may output audio to the user of vehicle 2200. The wireless communication system may communicate wirelessly with one or more devices directly or via a communication network.

[0118] Some or all of the functions of vehicle 2200 are controlled by computer system 2240. Computer system 2240 can control the functions of vehicle 2200 based on input received from various systems (e.g., sensor system 2220, ADAS 2210, peripheral devices 2230) and from user interface. Computer system 2240 may include at least one processor that executes instructions stored in memory.

[0119] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0120] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. An optical chip, characterized in that, The optical chip includes a substrate, on which a first optical transmission medium and N second optical transmission media are fixed, where N is any integer greater than or equal to 2. The optical chip also includes a first coupling module, which includes a first end of the first optical transmission medium and a first end of the second optical transmission media. The first end of the second optical transmission media is located close to the first end of the first optical transmission medium. Along a target cross-section, the cross-sectional area of ​​the first end of the second optical transmission medium is smaller than the cross-sectional area of ​​the first end of the first optical transmission medium, and the cross-sectional area of ​​the first end of the second optical transmission medium gradually decreases in the direction away from the second end of the second optical transmission medium. The target cross-section intersects with the surface of the substrate. The first coupling module is used to receive a first optical signal through the first optical transmission medium. The first coupling module is also used to split the first optical signal into N first sub-optical signals and transmit the N first sub-optical signals to the N second optical transmission media respectively. or, The first coupling module is used to receive N second sub-optical signals through the N second optical transmission media. The first coupling module is also used to combine the N second sub-optical signals to obtain a second optical signal and transmit the second optical signal to the first optical transmission media.

2. The optical chip according to claim 1, characterized in that, The first end of the first optical transmission medium has a first orthographic projection on the substrate surface, and the first end of the second optical transmission medium has a second orthographic projection on the substrate surface, wherein the second orthographic projection is at least partially located within the coverage area of ​​the first orthographic projection.

3. The optical chip according to claim 1, characterized in that, The first end of the first optical transmission medium has a first orthographic projection on the substrate surface, and the first end of the second optical transmission medium has a second orthographic projection on the substrate surface, with a gap between the first orthographic projection and the second orthographic projection.

4. The optical chip according to any one of claims 1 to 3, characterized in that, The first optical transmission medium includes a first transition section, which connects the first end of the first optical transmission medium and the second end of the first optical transmission medium. Along the target direction, the width of the first transition section gradually increases in the direction away from the first end of the first optical transmission medium, and the width of the first end of the first optical transmission medium gradually decreases in the direction away from the second end of the first optical transmission medium. The target direction intersects with the direction in which the first optical transmission medium transmits optical signals.

5. The optical chip according to claim 4, characterized in that, The first coupling module further includes a second transition section, which is connected between the first end of the first optical transmission medium and the first transition section. Along the target direction, the width of the second transition segment remains unchanged; or, Along the target direction, the width of the second transition segment gradually decreases in the direction away from the second end of the first optical transmission medium; or, Along the target direction, the width of the second transition segment gradually increases in the direction away from the second end of the first optical transmission medium.

6. The optical chip according to any one of claims 1 to 5, characterized in that, Along the target direction, the width of the first end of the first optical transmission medium is greater than the width of the first end of the second optical transmission medium. The target direction intersects with the direction in which the first optical transmission medium transmits optical signals. Along the direction perpendicular to the surface of the substrate, the thickness of the first optical transmission medium is greater than the thickness of the second optical transmission medium.

7. The optical chip according to any one of claims 1 to 6, characterized in that, Along a direction perpendicular to the substrate surface, the first light transmission medium has a first distance from the substrate surface, and the second light transmission medium has a second distance from the substrate surface, wherein the first distance is different from the second distance.

8. The optical chip according to any one of claims 1 to 5, characterized in that, The N second optical transmission media include i second optical transmission media and j second optical transmission media, where i is an integer greater than or equal to 1, j is an integer greater than or equal to 1, and the sum of i and j is equal to N. Along a direction perpendicular to the substrate surface, the first end of the first optical transmission medium is located between the i second optical transmission media and the j second optical transmission media, and the target direction intersects with the direction in which the first optical transmission medium transmits optical signals.

9. The optical chip according to claim 3, characterized in that, The first optical transmission medium has a third orthographic projection on the target plane, and the second optical transmission medium has a fourth orthographic projection on the target plane. The fourth orthographic projection is within the coverage area of ​​the third orthographic projection, and the target plane intersects with the substrate surface.

10. The optical chip according to any one of claims 1 to 9, characterized in that, The substrate includes a first substrate and a second substrate. Along a direction perpendicular to the surface of the first substrate, the surface of the first substrate is opposite to the surface of the second substrate, and there is a target region between the surface of the first substrate and the surface of the second substrate. The first substrate fixes the first optical transmission medium, and the second substrate fixes the N second optical transmission media. The first optical transmission medium and the N second optical transmission media are all located in the target region.

11. The optical chip according to any one of claims 1 to 10, characterized in that, The first optical transmission medium and the second optical transmission medium are hollowed out, or the first optical transmission medium and the second optical transmission medium include a filling medium, wherein the refractive index of the filling medium is less than the refractive index of the first optical transmission medium and the refractive index of the filling medium is less than the refractive index of the second optical transmission medium.

12. The optical chip according to any one of claims 1 to 11, characterized in that, Along the target cross-section, the cross-section of the first optical transmission medium is one of the following shapes: rectangular, triangular, circular, parallelogram, arc, trapezoid, or ridge.

13. The optical chip according to any one of claims 1 to 12, characterized in that, Along the target cross-section, the cross-section of the second optical transmission medium is one of the following shapes: rectangular, triangular, circular, parallelogram, arc, trapezoidal, or ridge.

14. The optical chip according to any one of claims 1 to 13, characterized in that, The substrate further includes a second coupling module, which connects the second ends of the N second optical transmission media and the first end of the third optical transmission medium. The second coupling module is used to receive the N first sub-optical signals from the first coupling module, and to combine the N first sub-optical signals to obtain a first combined optical signal, and to transmit the first combined optical signal to the third optical transmission medium; or, The second coupling module is used to receive the second combined optical signal from the third optical transmission medium and to split the second combined optical signal into the N second sub-optical signals.

15. The optical chip according to any one of claims 1 to 14, characterized in that, The optical chip further includes a first optical device and a second optical device, wherein the first optical device is connected to the second end of the first optical transmission medium, and the second optical device is connected to the second end of the second optical transmission medium.

16. The optical chip according to any one of claims 1 to 14, characterized in that, The substrate also fixes an optical fiber adapter, which connects the transmission optical fiber and the second end of the first optical transmission medium.

17. A photoelectric conversion module, characterized in that, Includes the optical chip according to any one of claims 1 to 16, wherein the second end of the first optical transmission medium is connected to an optical fiber adapter, and the optical fiber adapter is connected to the transmission optical fiber and the first optical transmission medium; The optical chip further includes a detector connected to the second end of the second optical transmission medium. The optical fiber adapter is used to transmit the first optical signal from the transmission optical fiber to the first optical transmission medium. The detector is used to perform photoelectric conversion on the first sub-optical signal to obtain a first electrical signal. or, The optical chip also includes a laser, which is connected to the second end of the second optical transmission medium. The laser is used to transmit the second sub-optical signal to the second optical transmission medium, and the optical fiber adapter is used to transmit the second optical signal to the transmission optical fiber.

18. An optical communication device, characterized in that, The device includes a housing, in which a processing chip and a connector are fixed. The processing chip is connected to a photoelectric conversion module via the connector, and the photoelectric conversion module is as described in claim 17. The detector is used to send the first electrical signal to the processing chip; or, The processing chip is used to send a second electrical signal to the laser, and the laser is used to convert the second electrical signal into a second sub-optical signal.

19. A radar, characterized in that, The device includes a processor and an optical chip connected to the processor, the optical chip being as described in any one of claims 1 to 16, the optical chip including a laser connected to a second end of the second optical transmission medium; The processor is used to send a first detection electrical signal to the laser, the laser is used to convert the first detection electrical signal into a second sub-optical signal, and send the second sub-optical signal to the second optical transmission medium, the second optical signal being used to detect relevant information about the target object.

20. A radar, characterized in that, The device includes a processor and an optical chip connected to the processor, the optical chip being as described in any one of claims 1 to 16, the optical chip including a detector connected to a second end of the second optical transmission medium; The detector is used to receive the first sub-optical signal and convert the first sub-optical signal into a second detection electrical signal, wherein the first sub-optical signal is the light signal reflected by the target object; The processor is used to obtain relevant information about the target object based on the second detection electrical signal.

21. A means of transportation, characterized in that, Includes a vehicle body and a radar fixed to the vehicle body, the radar as described in claim 19 or 20.

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