Self-shielding module and communication apparatus

By using a self-shielding module design, the combination of substrate, dielectric and metal shielding layer solves the weight and size problems of metal shielding solutions in the prior art, realizes the miniaturization and weight reduction of RF power amplifier, and enhances signal shielding effect and layout flexibility.

WO2026092166A1PCT designated stage Publication Date: 2026-05-07HUAWEI TECH CO LTD
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Patent Information

Authority / Receiving Office
WO ยท WO
Patent Type
Applications
Current Assignee / Owner
HUAWEI TECH CO LTD
Filing Date
2025-10-16
Publication Date
2026-05-07

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Abstract

Provided in the present application are a self-shielding module and a communication apparatus. The communication apparatus comprises: a TRX board, at least one heat-dissipation structural member, and at least one self-shielding module, wherein a surface of each of the at least one self-shielding module comprises a metal shielding layer, the at least one self-shielding module is electrically connected to the TRX board, and the at least one heat dissipation structural member and the at least one self-shielding module are disposed on the same surface and / or different surfaces of the TRX board. The self-shielding module provided in the embodiments of the present application does not require a large-weight metal shielding cover, and does not require a large-sized enclosure frame; and a metal shielding layer can implement the signal shielding of power amplifier circuits, thereby making shielding modules of the power amplifier circuits miniaturized and lightweight, and increasing the effective layout areas of the power amplifier circuits.
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Citation Information

Patent Citations

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