Substrate support manufacturing and / or reconditioning system

Abstract

A standalone system for manufacturing and / or reconditioning terminal surfaces of a plurality of projections of a substrate support. The system includes one or more rotatable treatment tools arranged to remove matter from the projections of the substrate support when rotating, and a controller arranged to control the operation of the one or more treatment tools.

Description

SUBSTRATE SUPPORT MANUFACTURING AND / OR RECONDITIONING SYSTEMCROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority of US application 63 / 714,019 which was filed on October 30, 2024, and which is incorporated herein in its entirety by reference.FIELD

[0002] The present description relates to a standalone system for manufacturing and / or reconditioning a substrate support.BACKGROUND

[0003] A lithographic apparatus is a machine constructed to apply a desired pattern onto a substrate. A lithographic apparatus can be used, for example, in the manufacture of integrated circuits (ICs). A lithographic apparatus may, for example, project a pattern (also often referred to as “design layout” or “design”) of a patterning device (e.g., a mask) onto a layer of radiation-sensitive material (resist) provided on a substrate (e.g., a wafer). To project a pattern on the substrate the lithographic apparatus may use electromagnetic radiation. The wavelength of this radiation determines the minimum size of features which are patterned on the substrate. Typical wavelengths currently in use are 365 nm (i-line), 248 nm, 193 nm, and 13.5 nm. A lithographic apparatus, which uses extreme ultraviolet (EUV) radiation, having a wavelength within a range of 4 nm to 20 nm, for example 6.7 nm or 13.5 nm, may be used to form smaller features on the substrate than a lithographic apparatus which uses, for example, radiation with a wavelength of 193 nm.SUMMARY

[0004] The substrate is clamped onto a substrate support of a substrate table in the lithographic apparatus when transferring a pattern from the patterning device. A substrate support conventionally has a plurality of projections extending in a first (z) direction (called burls) to support the substrate. The total area of terminal surfaces of the projections that contact the substrate thereby to support the substrate is small compared to the total area of a substrate. Therefore, the chance that a contaminant particle randomly located on the surface of the substrate or the substrate support is trapped between a projection and the substrate is small. Also, in manufacture of the substrate support, the tops of the projections can be made more accurately coplanar than a large surface can be made accurately flat. Another reason for keeping the contact area that supports the substrate small is to reduce the effect of the substrate sticking to the projections due to Van Der Waals forces.

[0005] When a substrate is first loaded onto the substrate support in preparation for exposure, the substrate is supported by so-called e-pins which hold the substrate at multiple positions. To load the substrate onto the substrate support, the e-pins are retracted so that the substrate is supported byprojections of the substrate support.

[0006] The flatness of the terminal surfaces of the projections (i.e., how close to being in the same plane all of the terminal surfaces of the projections are) is of significance. This is because variation in the flatness of the projections is transmitted to the top surface of the substrate which is subjected to irradiation. The roughness of the terminal surfaces of the projections is also of significance because the substrate may stick to the terminal surfaces of the projections if they are too smooth. Accordingly, there are flatness and roughness specifications that substrate supports should meet.

[0007] There is a general need to improve the manufacturing of substrate supports. There is also a general need to improve the reconditioning of used substrate supports that no longer meet flatness and roughness specifications.

[0008] According to a first aspect, there is provided a standalone system for manufacturing and / or reconditioning terminal surfaces of a plurality of projections of a substrate support, the system comprising: one or more rotatable treatment tools arranged to remove matter from the projections of the substrate support when rotating; and a controller arranged to control the operation of the one or more treatment tools.

[0009] According to a second aspect, there is provided a method of manufacturing and / or reconditioning terminal surfaces of a plurality of projections of a substrate support by a standalone system, the method comprising: using one or more rotating treatment tools to remove matter from the projections of the substrate support; and controlling, by a controller, the operation of the one or more treatment tools.BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Embodiments of the invention will now be described, by way of example only, with reference to the accompanying schematic drawings in which corresponding reference symbols indicate corresponding parts, and in which:Figure 1 schematically depicts a lithographic apparatus;Figure 2 depicts in plan a substrate support and a superimposed treatment tool;Figure 3 is a schematic illustration of a system; andFigure 4 schematically shows a standalone system for manufacturing and / or reconditioning a substrate support according to embodiments.DETAILED DESCRIPTION

[0011] In the present document, the terms “radiation” and “beam” are used to encompass all types of electromagnetic radiation, including ultraviolet radiation (e.g., with a wavelength of 365, 248, 193, 157, or 126 nm).

[0012] The term “reticle,” “mask,” or “patterning device” as employed in this text may be broadly interpreted as referring to a generic patterning device that can be used to endow an incoming radiationbeam with a patterned cross-section, corresponding to a pattern that is to be created in a target portion of the substrate. The term “light valve” can also be used in this context. Besides the classic mask (transmissive or reflective, binary, phase-shifting, hybrid, etc.), examples of other such patterning devices include a programmable mirror array and a programmable LCD array.

[0013] Figure 1 schematically depicts a lithographic apparatus of an embodiment. The apparatus comprises: optionally, an illumination system (illuminator) IL configured to condition a radiation beam B (e.g., UV radiation or DUV radiation); a support structure (e.g., a mask table) MT constructed to support a patterning device (e.g., a mask) MA and connected to a first positioner PM configured to accurately position the patterning device MA in accordance with certain parameters; a support table, e.g., a sensor table to support one or more sensors or a substrate table or wafer table WT constructed to hold a substrate (e.g., a resist-coated production substrate) W, connected to a second positioner PW configured to accurately position the surface of the table, for example of a substrate W, in accordance with certain parameters; and a projection system (e.g., a refractive projection lens system) PS configured to project a pattern imparted to the radiation beam B by patterning device MA onto a target portion C (e.g., comprising part of, one, or more dies) of the substrate W.

[0014] The lithographic apparatus may be of a type wherein at least a portion of the substrate W may be covered by an immersion liquid having a relatively high refractive index, e.g., water such as ultrapure water (UPW), so as to fill an immersion space between the projection system PS and the substrate W. An immersion liquid may also be applied to other spaces in the lithography apparatus, for example, between the patterning device MA and the projection system PS. Immersion techniques can be used to increase the numerical aperture of projection systems. The term “immersion” as used herein does not mean that a structure, such as a substrate W, must be submerged in immersion liquid; rather “immersion” only means that an immersion liquid is located between the projection system PS and the substrate W during exposure. The path of the patterned radiation beam B from the projection system PS to the substrate W is entirely through immersion liquid. In an arrangement for providing immersion liquid between a final optical element of the projection system PS and the substrate W a liquid confinement structure extends along at least a part of a boundary of an immersion space between the final optical element of the projection system PS and the facing surface of the stage or table facing the projection system PS.

[0015] In operation, the illuminator IL receives a radiation beam from a radiation source SO, e.g., via a beam delivery system BD. The illumination system IL may include various types of optical components, such as refractive, reflective, magnetic, electromagnetic, electrostatic, and / or other types of optical components, or any combination thereof, for directing, shaping, and / or controlling radiation. The illuminator IL may be used to condition the radiation beam B to have a desired spatial and angularintensity distribution in its cross section at a plane of the patterning device MA. The illuminator IL may include an adjuster AD to adjust the spatial and / or angular intensity distribution, may include an integrator IN to homogenize uneven brightness of radiation, and / or may include a condenser CO to render a divergent radiation beam into a parallel or converging beam to illuminate the patterning device MA.

[0016] The term “projection system” PS used herein should be broadly interpreted as encompassing various types of projection system, including refractive, reflective, catadioptric, anamorphic, magnetic, electromagnetic and / or electrostatic optical systems, or any combination thereof, as appropriate for the exposure radiation being used, and / or for other factors such as the use of an immersion liquid or the use of a vacuum. Any use of the term “projection lens” herein may be considered as synonymous with the more general term “projection system.” The projection system PS may be supported by a reference frame RD, which may be used to support one or more measurement devices, such as position sensor IF. The reference frame RF may be supported by a base frame BF that supports other components of the apparatus.

[0017] The lithographic apparatus may be of a type having two or more support tables, e.g., two or more support tables or a combination of one or more support tables and one or more cleaning, sensor or measurement tables. For example, the lithographic apparatus is a multi-stage apparatus comprising two or more tables located at the exposure side of the projection system, each table comprising and / or holding one or more objects. In an example, one or more of the tables may hold a radiation-sensitive substrate. In an example, one or more of the tables may hold a sensor to measure radiation from the projection system. In an example, the multi-stage apparatus comprises a first table configured to hold a radiation-sensitive substrate (i.e., a support table) and a second table not configured to hold a radiationsensitive substrate (referred to hereinafter generally, and without limitation, as a measurement, sensor and / or cleaning table). The second table may comprise and / or may hold one or more objects, other than a radiation-sensitive substrate. Such one or more objects may include one or more selected from the following: a sensor to measure radiation from the projection system, one or more alignment marks, and / or a cleaning device (to clean, e.g., the liquid confinement structure).

[0018] In operation, the radiation beam B is incident on the pattern (design layout) present on patterning device (e.g., mask) MA, which is held on the support structure (e.g., mask table) MT, and is patterned by the patterning device MA. Having traversed the patterning device MA, the radiation beam B passes through the projection system PS, which focuses the beam onto a target portion C of the substrate W. With the aid of the second positioner PW and position sensor IF (e.g., an interferometric device, linear encoder, 2-D encoder, or capacitive sensor), the substrate table WT can be moved accurately, e.g., so as to position different target portions C in the path of the radiation beam B at a focused and aligned position. Similarly, the first positioner PM and another position sensor (which is not explicitly depicted in Figure 1) can be used to accurately position the patterning device MA with respect to the path of the radiation beam B . Patterning device MA and substrate W may be aligned usingpaterning device alignment marks Ml, M2 and substrate alignment marks Pl, P2. Although the substrate alignment marks Pl, P2 as illustrated occupy dedicated target portions, they may be located in spaces between target portions C (these are known as scribe-lane alignment marks). A controller 500 controls the overall operations of the lithographic apparatus and in particular performs an operation process described further below. Controller 500 can be embodied as a suitably-programmed general purpose computer comprising a central processing unit, volatile and non-volatile storage means, one or more input and output devices such as a keyboard and screen, one or more network connections and one or more interfaces to the various parts of the lithographic apparatus. It will be appreciated that a one-to-one relationship between controlling computer and lithographic apparatus is not necessary. One computer can control multiple lithographic apparatuses. Multiple networked computers can be used to control one lithographic apparatus. The controller 500 may also be configured to control one or more associated process devices and substrate handling devices in a lithocell or cluster of which the lithographic apparatus forms a part. The controller 500 can also be configured to be subordinate to a supervisory control system of a lithocell or cluster and / or an overall control system of a fab.

[0019] Figure 2 schematically shows a substrate support 60 that is comprised by the substrate table WT. The substrate W is conventionally clamped to the substrate support 60 during exposures. Two clamping techniques are commonly used. In vacuum-clamping, a pressure differential across the substrate W is established, e.g., by connecting the space between the substrate support 60 and the substrate W to an under-pressure that is lower than a higher pressure above the substrate W. The pressure difference gives rise to a force holding the substrate W to the substrate support 60. In electrostatic clamping, electrostatic force is used to exert a force between the substrate W and the substrate support 60. Several different arrangements are known to achieve this. In one arrangement, a first electrode is provide on the lower surface of the substrate W and a second electrode on the upper surface of the substrate support 60. A potential difference is established between the first and second electrodes. In another arrangement, two semi-circular electrodes are provided on the substrate support 60 and a conductive layer is provided on the substrate W. A potential difference is applied between the two semi-circular electrodes so that the two semi-circular electrodes and the conductive layer on the substrate W act like two capacitors in series.

[0020] To load a substrate W onto the substrate support 60 for exposures, the substrate W is picked up by a substrate handler robot and lowered onto a set of e-pins. The e-pins project through the substrate support 60. The e-pins are actuated so that they can extend and retract. The e-pins may be provided with suction openings at their tips to grip the substrate W. The e-pins may comprise six e-pins spaced around the central portion of the substrate support 60. Once the substrate W has setled on the e-pins, the e-pins are retracted so that the substrate W is supported by projections 20 of the substrate support 60.

[0021] Figure 2 depicts a substrate support 60 for use in a lithographic apparatus. The substrate support 60 supports a substrate W. The substrate support 60 comprises a main body 21. The main body 21 has a main body surface 22. A plurality of projections 20 are provided projecting from the main bodysurface 22 in a first (z) direction. A terminal surface of each projection 20 is configured to engage (contact) with the substrate W. The terminal surfaces of the projections 20 substantially conform to a support plane and support the substrate W. Main body 21 and projections 20 may be formed of SiSiC, a ceramic material having silicon carbide (SiC) grains in a silicon matrix. Alternatively, main body 21 and projections 20 may be formed of SiC or other materials known in the art.

[0022] A plurality of through-holes 89 may be formed in the main body 21. Through-holes 89 allow the e-pins to project through the substrate support 60 to receive the substrate W. Each through-hole 89 may be in the form a circular hole 87 although it may have different shape. Through-holes 89 may allow the space between a substrate W and the substrate support 60 to be evacuated. Evacuation of the space between a substrate W and the substrate support 60 can provide a clamping force, if the space above the substrate W is not also evacuated. The clamping force holds the substrate W in place. If the space above the substrate W is also evacuated, as would be the case in a lithographic apparatus using EUV radiation, electrodes can be provided to form an electrostatic clamp according to known techniques.

[0023] Further through-holes 79 are illustrated in Figure 2. Such through-holes may be present, for example, to allow the substrate support 60 to be fixed to the substrate table WT, for example using bolts. Alternatively, the substrate support 60 can be fixed to substrate table WT by vacuum clamping. The support 60 may have a rim structure 85 that has a height in the first direction from the surface 22. The height of the rim structure 85 may be less than that of the projections 22 and may act as a seal to enable (better) formation of low pressure under the substrate.

[0024] The flatness of the terminal surfaces of the projections 20 (i.e., how close to being in the same plane all of the terminal surfaces of the projections 20 are) is significant. This is because variation in the flatness of the projections 20 can be transmitted to the top surface of the substrate W which is subjected to irradiation. There is a flatness specification that the terminal surfaces of the projections 20 should meet otherwise unacceptable errors may be caused by the flatness variation.

[0025] The roughness of the terminal surfaces of the projections 20 is also significant. There is a roughness specification that the terminal surfaces of the projections 20 should meet because the substrate W may stick to the terminal surfaces of the projections 20 if the terminal surfaces are not rough enough.

[0026] New substrate supports 60 are made and supplied with projections 20 that meet the flatness and roughness specifications. A known technique for making a new substrate support 60 is ion / ionic beam figuring (IBF). IBF uses a beam of charged ions to remove material from a substrate support 60 during the manufacture of the substrate support 60. A problem with IBF is that it is applied to each substrate support 60 for a long time and this slows down the manufacture of substrate supports 60. IBF also degrades the roughness of the projections 20. In the locations where a larger amount of IBF has been applied, the projections 20 have a decreased roughness. IBF can also overcompensate, for example, when it is not possible to distinguish whether there is a projection 20 that is significantly higher than its neighbors or if contamination has occurred.

[0027] Although new substrate supports 60 have projections 20 that meet the flatness and roughness specifications, the flatness and roughness of the projections 20 may degrade during the use of the substrate W. Used substrate supports 60 may need to be reconditioned so that they meet the flatness and roughness specifications.

[0028] It is known to remove a substrate support 60 from a lithographic apparatus and to recondition it using IBF. However, in addition to the above-described problems with the use of IBF, removing a substrate support 60 from a lithographic apparatus is an expensive process that may substantially reduce the throughput of the lithographic apparatus.

[0029] To avoid removing a substrate support 60 from a lithographic apparatus, it is also known to perform an in-situ reconditioning process of a substrate support 60. That is to say, the reconditioning of the substrate support 60 is performed within the lithographic apparatus. In-situ reconditioning of a substrate support 60 is disclosed in United States Patent Application Publication No. US 2020 / 0103770, the contents of which are incorporated herein in its entirety.

[0030] Figure 3 illustrates schematically an example in-situ reconditioning system 1 for reconditioning a substrate support 60 within a lithographic apparatus. The substrate support 60 is positioned on a substrate table WT which can be moved using the second positioner PW. The system 1 uses one or more rotating treatment tools 100, that may be referred to as one or more rotating pucks, to recondition a substrate support 60. The in-situ reconditioning of a substrate support 60 does not use IBF because it is not feasible for IBF to be performed within a lithographic apparatus.

[0031] As shown in Figure 3, the treatment tool 100 is arranged for rotation around the z-axis as illustrated by arrow 110. This is effected by rotation of a shaft 150. The treatment tool 100 can contact the terminal surfaces of the projections 20 of the substrate support 60. Matter is removed due to the movement of the treatment tool 100 over the terminal surfaces of the projections 20 mainly due to the rotation of the treatment tool 100. Relative translational movement in the x and y directions of the treatment tool 100 relative to the substrate support 60 means that the whole top surface of the substrate support 60 can be moved under the treatment tool 100 such that all projections 20 can be reconditioned. There is an actuator, such as force control element 175 or second positioner PW, for applying a variable force, in a direction along the z-axis, between the treatment tool 100 and the substrate support 60.

[0032] Figure 3 only shows a single treatment tool 100. The lithographic apparatus may comprise two or more treatment tools 100. For example, there may be a first treatment tool for reconditioning the projections 20 to meet a flatness specification and a second treatment tool for reconditioning the projections 20 to meet a roughness specification.

[0033] There are a number of potential problems with in-situ reconditioning of a substrate support 60. The in-situ reconditioning system 1 is constrained by the requirement to operate within a lithographic apparatus. This restricts the size, support, and movement of the treatment tool(s). This may limit the functionality of the in-situ reconditioning system 1 such that it may only be appropriate for performing slight reconditioning processes, and not usable for substantial reconditioning processes.

[0034] Another problem is that the lithographic apparatus is not being used for lithographic processes when an in-situ reconditioning process is performed. This reduces the throughput of the lithographic apparatus and increases costs.

[0035] A further problem is that the reconditioning process removes material from the substrate support 60. The removed material is a potential cause of contamination within the lithographic apparatus.

[0036] Embodiments improve on known techniques for the manufacture and / or reconditioning of substrate supports 60. It has been surprisingly discovered that rotating treatment tools are able to recondition a substrate support 60, or make a new substrate support 60, to similar, the same, or better standards than IBF. The use of rotating treatment tools to make a substrate support 60 may be much quicker than using IBF. Embodiments provide a standalone system that uses rotating treatment tools to make and / or recondition a substrate support 60.

[0037] Figure 4 schematically shows a standalone system 400 according to embodiments. The standalone system 400 is for manufacturing and / or reconditioning substrate supports 60. The standalone system 400 of embodiments includes a treatment zone 401, computer system 408, and a measurement system 407.

[0038] The treatment zone 401 is for making and / or reconditioning substrate supports 60. The treatment zone 401 includes a substrate support holder 404 that is arranged to support a substrate support 60 during treatment processes. The substrate support holder 404 is supported by a positioning system that is arranged to move the substrate support holder 404. The positioning system comprises an x- positioner 403 and a y-positioner 402 for moving the substrate support holder 404 in the x-y plane around treatment zone 401. The positioning system may also be configured to move the substrate support holder 404 in the z-direction so that the substrate support holder 404 is moved towards, or away from, a treatment tool. Embodiments also include alternative implementations of the positioning system. For example, the substrate support holder 404 may remain stationary and the treatment tool may be moved in the x-y plane. Alternatively, the substrate support holder 404 may be movable along a first direction and the treatment tool may be movable along a second direction that is orthogonal to the first direction.

[0039] The treatment zone 401 includes a flatness treatment tool 405 and a roughness treatment tool 406 that are arranged to apply treatments to a substrate support 60 that is supported by the substrate support holder 404.

[0040] The flatness treatment tool 405 is arranged to machine the projections 20 of a substrate support 60 so that they meet a flatness specification. The flatness treatment tool 405 may operate in substantially the same way as the above-described treatment tool 100 of the in-situ reconditioning system 1. Accordingly, the flatness treatment tool 405 is rotated and a working surface of the flatness treatment tool 405 and substrate support 60 are brought into contact. The flatness treatment tool 405 and substrate support 60 may be pressed together. That is to say, a variable force may be applied by an actuator, in adirection along the z-axis, between the working surface of the flatness treatment tool 405 and the substrate support 60. The actuator may be a force control element (comparable to force control element 175) and / or a positioner (comparable to positioner PW) as shown in, and described with reference to, Figure 3. Embodiments include a number of alternative implementations to using such an actuator. For example, the flatness treatment tool 405 may sit on the substrate support 60 and the only force pressing the flatness treatment tool 405 into the substrate support 60 may be its weight under gravity. This has an advantage of providing a substantially constant force. One or more masses may be added to, or removed from, the flatness treatment tool 405 to change its weight under gravity and thereby change the applied force of the flatness treatment tool 405 against the substrate support 60. A plurality of masses may be connected and hung in a vertical chain above the substrate support 60. The applied force may be increased by moving the substrate support 60 vertically upwards, i.e., in the + z- direction, to increase the number of hanging masses that are loaded on the flatness treatment tool 405 and thereby the weight countered by the substrate support 60. Alternatively, a spring may be used to press the flatness treatment tool 405 and the substrate support 60 together. Both the speed of rotation and any force used to press the flatness treatment tool 405 into a substrate support 60 are controllable by the computer system 408.

[0041] Embodiments include the flatness treatment tool 405, and its supporting hardware, being the same, or similar, as a treatment tool 100 of an in-situ reconditioning system 1. However, the flatness treatment tool 405 in the standalone system 400 of embodiments, and its supporting hardware, are a lot less restricted in their implementation than a treatment tool 100 of an in-situ reconditioning system 1. Accordingly, embodiments also include the flatness treatment tool 405 having a different size and other properties than the treatment tool 100 of an in-situ reconditioning system 1. For example, the flatness treatment tool 405 may have a larger cross-sectional width (e.g. diameter) of working surface and / or different properties of working surface.

[0042] Embodiments include the treatment zone 401 including a plurality of flatness treatment tools 405 with each flatness treatment tool 405 having a different property. For example, the plurality of flatness treatment tools 405 may differ in size, mass, type, cross-sectional width (e.g. diameter) of working surface, roughness of working surface, and / or hardness of working surface.

[0043] The roughness treatment tool 406 is arranged to machine the projections 20 of a substrate support 60 so that they meet a roughness specification. The roughness treatment tool 406 may operate in substantially the same way as the above-described treatment tool 100 of the in-situ reconditioning system 1. Accordingly, the roughness treatment tool 406 is rotated and a working surface of the roughness treatment tool 406 and substrate support 60 are brought into contact. The roughness treatment tool 406 and substrate support 60 may be pressed together. That is to say, a variable force may be applied by an actuator, in a direction along the z-axis, between the working surface of the roughness treatment tool 406 and the substrate support 60. The actuator may be a force control element (comparable to force control element 175) and / or a positioner (comparable to positioner PW) as shown in, and described with reference to, Figure 3. Embodiments include a number of alternativeimplementations to using such an actuator. For example, the roughness treatment tool 406 may sit on the substrate support 60 and the only force pressing the roughness treatment tool 406 into the substrate support 60 may be its weight under gravity. This has an advantage of providing a substantially constant force. One or more masses may be added to, or removed from, the roughness treatment tool 406 to change its weight under gravity and thereby change the applied force of the roughness treatment tool 406 against the substrate support 60. A plurality of masses may be connected and hung in a vertical chain above the substrate support 60. The applied force may be increased by moving the substrate support 60 vertically upwards, i.e., in the + z- direction, to increase the number of hanging masses that are loaded on the roughness treatment tool 406 and thereby the weight countered by the substrate support 60. Alternatively, a spring may be used to press the roughness treatment tool 406 and the substrate support 60 together. Both the speed of rotation and any force used to press the roughness treatment tool 406 into a substrate support 60 are controllable by the computer system 408.

[0044] Embodiments include the roughness treatment tool 406, and its supporting hardware, being the same, or similar, as a treatment tool 100 of an in-situ reconditioning system 1. However, the roughness treatment tool 406, and its supporting hardware, in the standalone system 400 of embodiments are a lot less restricted in their implementation than a treatment tool 100 of an in-situ reconditioning system 1. Accordingly, embodiments also include the roughness treatment tool 406 having a different size and one or more other properties than the treatment tool 100 of an in-situ reconditioning system 1. For example, the roughness treatment tool 406 may have a larger cross-sectional width (e.g. diameter) of working surface and / or one or more different properties of working surface.

[0045] Embodiments include the treatment zone 401 including a plurality of roughness treatment tools 406 with each roughness treatment tool 406 having one or more different properties. For example, the plurality of roughness treatment tools 406 may differ in size, mass, type, cross-sectional width (e.g. diameter) of working surface, roughness of working surface, and / or hardness of working surface.

[0046] The computer system 408 is a controller arranged to control treatment processes of a substrate support 60. This may include determining the regions of a substrate support 60 that need to be treated, determining how to perform each treatment, and controlling the performed treatment operations by controlling at least the positioning system, flatness treatment tool 405, and roughness treatment tool 406. In an embodiment, the treatment processes are determined in dependence on an optimization process for attempting to minimize the routing of the flatness treatment tool 405 and / or the roughness treatment tool 406 in dependence on respective measurements of the flatness and / or roughness of the substrate support 60. The computer system 408 may determine to perform processes based on one or more models for attempting to optimize the processes, such as models for predicting the amount of material removal.

[0047] The measurement system 407 is arranged to measure the flatness and / or roughness of the substrate support 60. These measurements allow determinations of whether a substrate support 60 meets flatness and / or roughness specifications, and determinations of what treatments should be used to meetflatness and / or roughness specifications. It should be noted that embodiments also include a standalone system 400 that does not include a measurement system 407. A separate system from the standalone system 400 may be used to obtain flatness and / or roughness measurements of a substrate support 60.

[0048] Advantageously, the standalone system 400 of embodiments is separate from a lithographic apparatus and this avoids at least some of the problems experienced by an in-situ reconditioning system 1. A further advantage is that the standalone system 400 of embodiments uses one or more rotating treatment tools (i.e., flatness treatment tool 405 and / or roughness treatment tool 406) to make and / or recondition a substrate support 60 and this avoids at least some of the problems experienced by IBF. The use of rotating treatment tools is a new approach to making new substrate supports 60. The use of rotating treatment tools in a standalone system 400 is also a new approach to reconditioning substrate supports 60.

[0049] There are a number of further advantages of the standalone system 400 according to embodiments.

[0050] The specification of some of the hardware within the standalone system 400 may be lower than that of a lithographic apparatus. In particular, the positioning system in the standalone system 400 only needs to be accurate enough for performing the treatment processes and it does not need to be accurate enough for lithographic processes. This reduces costs because a positioning system with relatively low accuracy may be used.

[0051] There is more flexibility in the hardware that may be used due to the increased implementation freedom of a standalone system 400. For example, a larger actuator may be used to apply a variable force, in a direction along the z-axis, between the flatness / roughness treatment tools 405, 406 and the substrate support 60. The use of a larger actuator allows a wider range of forces to be applied, and with more accuracy, than with the actuator of an in-situ reconditioning system 1.

[0052] The reconditioning of substrate supports 60 within a standalone system 400 is simpler than using IBF or in-situ reconditioning in a lithographic apparatus. It may also avoid some calibration operations of a lithographic apparatus that would otherwise be required.

[0053] The standalone system 400 has a lower footprint and overall size than a lithographic apparatus.

[0054] Embodiments include a number of modifications and variations to the above-described techniques.

[0055] The standalone system 400 according to embodiments may include one or more further tools for treating a substrate support than a flatness treatment tool 405 and roughness treatment tool 406. For example, the standalone system 400 may include one or more brushes, tools that do not rotate, and / or a system for cleaning debris from the surface of the substrate support.

[0056] Embodiments are not restricted to the relative movement between the substrate support 60 and the treatment tools 405, 406 being provided by the positioning system. The relative movement may alternatively, or additionally, be provided by a movement system of the flatness treatment tool 405 and / or roughness treatment tool 406.

[0057] The standalone system 400 according to embodiments may implement any of the techniques disclosed in US 2020 / 0103770.

[0058] Although specific reference may be made in this text to the use of lithographic apparatus in the manufacture of ICs, it should be understood that the lithographic apparatus described herein may have other applications, such as the manufacture of integrated optical systems, guidance and detection patterns for magnetic domain memories, flat-panel displays, liquid-crystal displays (LCDs), thin film magnetic heads, etc. The skilled artisan will appreciate that, in the context of such alternative applications, any use of the terms “wafer” or “die” herein may be considered as synonymous with the more general terms “substrate” or “target portion," respectively. The substrate referred to herein may be processed, before or after exposure, in for example a track (a tool that typically applies a layer of resist to a substrate and develops the exposed resist), a metrology tool, and / or an inspection tool. Where applicable, the disclosure herein may be applied to such and other substrate processing tools. Further, the substrate may be processed more than once, for example, to create a multi-layer IC, so that the term substrate used herein may also refer to a substrate that already contains one or multiple processed layers.

[0059] While specific embodiments of the invention have been described above, it will be appreciated that the invention may be practiced otherwise than as described. For example, an embodiment of the invention may take the form of a computer program containing one or more sequences of machine- readable instructions implementing or causing one or more of, or all, the method steps described herein, or a non-transitory data storage medium (e.g. semiconductor memory, magnetic or optical disk) having such a computer program stored therein.

[0060] Any controllers described herein may each or in combination be operable when the one or more computer programs are read by one or more computer processors located within at least one component of the lithographic apparatus. The controllers may each or in combination have any suitable configuration for receiving, processing, and sending signals. One or more processors are configured to communicate with the at least one of the controllers. For example, each controller may include one or more processors for executing the computer programs that include machine-readable instructions for the methods described above. The controllers may include data storage media for storing such computer programs, and / or hardware to receive such media. So the controller(s) may operate according to the machine readable instructions of one or more computer programs.

[0061] Embodiment include the following numbered clauses:1. A standalone system for manufacturing and / or reconditioning terminal surfaces of a plurality of projections of a substrate support, the system comprising: one or more rotatable treatment tools arranged to remove matter from the projections of the substrate support when rotating; and a controller arranged to control the operation of the one or more treatment tools.2. The system according to clause 1, wherein the plurality of projections of the substrate support extend in a first direction, and each of the plurality of projections has a terminal surface arranged to bein contact with a substrate.3. The system according to clause 2, wherein the one or more treatment tools are arranged to move, relative to the substrate support, in a second direction orthogonal to the first direction and a third direction orthogonal to the first direction and the second direction over the terminal surfaces of the projections; and / or wherein the substrate support is arranged to move, relative to the one or more treatment tools, in a second direction orthogonal to the first direction and a third direction orthogonal to the first direction and the second direction.4. The system according to clause 3, further comprising: a substrate support holder arranged to hold the substrate support; and a positioning system arranged to move the substrate support holder in at least the second direction and the third direction and / or to move the one or more treatment tools in at least the second direction and the third direction.5. The system according to clause 4, wherein the positioning system is arranged to move the substrate support and / or the one or more treatment tools in the first direction.6. The system according to any preceding clause, wherein the controller is arranged to control the rotation speed of the one or more treatment tools.7. The system according to any preceding clause, further comprising: one or more actuators or springs, wherein each actuator or spring is arranged to apply a force that presses a treatment tool and the substrate support together; and / or a passive loading system so that the weight of a treatment tool is applied to the substrate support, wherein the experienced weight of the treatment tool by the substrate support is preferably variable.8. The system according to clause 7, wherein the controller is arranged to control the force applied by the actuator.9. The system according to any preceding clause, wherein the one or more treatment tools comprise a flatness treatment tool for changing the flatness of the terminal surfaces of the plurality of projections.10. The system according to clause 9, wherein there are a plurality of flatness treatment tools with each flatness treatment tool having a different size, mass, cross-sectional width of working surface, roughness of working surface, and / or hardness of working surface11. The system according to any preceding clause, wherein the one or more treatment tools comprise a roughness treatment tool for changing the roughness of the terminal surfaces of the plurality of projections.12. The system according to clause 11, wherein there are a plurality of roughness treatment tools with each roughness treatment tool having a different size, mass, cross-sectional width of working surface, roughness of working surface, and / or hardness of working surface.13. The system according to any preceding clause, further comprising a measurement systemarranged to measure the flatness and / or roughness of the terminal surfaces of the plurality of projections.14. The system according to any preceding clause, wherein the controller is arranged to control the operation of the one or more treatment tools in the manufacture and / or reconditioning of a substrate support in dependence on one or more measurements of the flatness and / or roughness of the terminal surfaces of the plurality of projections.15. The system according to any preceding clause, wherein the controller is arranged to control the operation of the one or more treatment tools in the manufacture and / or reconditioning of a substrate support such that the terminal surfaces of the plurality of projections of the substrate support meet a flatness specification and / or a roughness specification.16. A method of manufacturing and / or reconditioning terminal surfaces of a plurality of projections of a substrate support by a standalone system, the method comprising: using one or more rotating treatment tools to remove matter from the proj ections of the substrate support; and controlling, by a controller, the operation of the one or more treatment tools.17. The method according to clause 16, wherein the plurality of projections of the substrate support extend in a first direction, and each of the plurality of projections has a terminal surface arranged to be in contact with a substrate.18. The method according to clause 17, further comprising: moving the one or more treatment tools, relative to the substrate support, in a second direction orthogonal to the first direction and a third direction orthogonal to the first direction and the second direction over the terminal surfaces of the projections; and / or moving the substrate support, relative to the one or more treatment tools, in a second direction orthogonal to the first direction and a third direction orthogonal to the first direction and the second direction.19. The method according to clause 18, further comprising: holding, by a substrate support holder, the substrate support; and moving, by a positioning system, the substrate support holder in at least the second direction and the third direction and / or to moving the one or more treatment tools in at least the second direction and the third direction.20. The method according to clause 19, further comprising moving, by the positioning system, the substrate support and / or the one or more treatment tools in the first direction.21. The method according to any of clauses 16 to 20, further comprising controlling the rotation speed of the one or more treatment tools.22. The method according to any of clauses 16 to 21, further comprising applying a force that presses a treatment tool and the substrate support together; and / or using a passive loading system so that the weight of a treatment tool is applied to the substrate support, wherein the experienced weight of the treatment tool by the substrate support is preferably variable.23. The method according to clause 22, further comprising controlling the applied force.24. The method according to any of clauses 16 to 23, wherein the one or more treatment tools comprise a flatness treatment tool for changing the flatness of the terminal surfaces of the plurality of projections.25. The method according to clause 24, wherein there are a plurality of flatness treatment tools with each flatness treatment tool having a different size, mass, cross-sectional width of working surface, roughness of working surface, and / or hardness of working surface26. The method according to any of clauses 16 to 25, wherein the one or more treatment tools comprise a roughness treatment tool for changing the roughness of the terminal surfaces of the plurality of projections.27. The method according to clause 26, wherein there are a plurality of roughness treatment tools with each roughness treatment tool having a different size, mass, cross-sectional width of working surface, roughness of working surface, and / or hardness of working surface.28. The method according to any of clauses 16 to 27, further comprising measuring, by a measurement system of the standalone system, the flatness and / or roughness of the terminal surfaces of the plurality of projections.29. The method according to any of clauses 16 to 28, further comprising controlling, by a controller of the standalone system, the operation of the one or more treatment tools in the manufacture and / or reconditioning of a substrate support in dependence on one or more measurements of the flatness and / or roughness of the terminal surfaces of the plurality of projections.30. The method according to any of clauses 16 to 29, further comprising controlling the operation of the one or more treatment tools in the manufacture and / or reconditioning of a substrate support such that the terminal surfaces of the plurality of projections of the substrate support meet a flatness specification and / or a roughness specification.

[0062] The descriptions above are intended to be illustrative, not limiting. Thus, it will be apparent to one skilled in the art that modifications may be made to the invention as described without departing from the scope of the claims set out below.

Claims

CLAIMS1. A standalone system for manufacturing and / or reconditioning terminal surfaces of a plurality of projections of a substrate support, the system comprising: one or more rotatable treatment tools arranged to remove matter from the projections of the substrate support when rotating; and a controller arranged to control the operation of the one or more treatment tools.

2. The system according to claim 1, wherein the plurality of projections of the substrate support extend in a first direction, and each of the plurality of projections has a terminal surface arranged to be in contact with a substrate.

3. The system according to claim 2, wherein the one or more treatment tools are arranged to move, relative to the substrate support, in a second direction orthogonal to the first direction and a third direction orthogonal to the first direction and the second direction over the terminal surfaces of the projections; and / or wherein the substrate support is arranged to move, relative to the one or more treatment tools, in a second direction orthogonal to the first direction and a third direction orthogonal to the first direction and the second direction.

4. The system according to claim 3, further comprising: a substrate support holder arranged to hold the substrate support; and a positioning system arranged to move the substrate support holder in at least the second direction and the third direction and / or to move the one or more treatment tools in at least the second direction and the third direction.

5. The system according to claim 4, wherein the positioning system is arranged to move the substrate support and / or the one or more treatment tools in the first direction.

6. The system according to any preceding claim, wherein the controller is arranged to control the rotation speed of the one or more treatment tools.

7. The system according to any preceding claim, further comprising: one or more actuators or springs, wherein each actuator or spring is arranged to apply a force that presses a treatment tool and the substrate support together; and / or a passive loading system so that the weight of a treatment tool is applied to the substrate support, wherein the experienced weight of the treatment tool by the substrate support is preferably variable.

8. The system according to claim 7, wherein the controller is arranged to control the force applied by the actuator.

9. The system according to any preceding claim, wherein the one or more treatment tools comprise a flatness treatment tool for changing the flatness of the terminal surfaces of the plurality of projections.

10. The system according to claim 9, wherein there are a plurality of flatness treatment tools with each flatness treatment tool having a different size, mass, cross-sectional width of working surface, roughness of working surface, and / or hardness of working surface11. The system according to any preceding claim, wherein the one or more treatment tools comprise a roughness treatment tool for changing the roughness of the terminal surfaces of the plurality of projections.

12. The system according to claim 11, wherein there are a plurality of roughness treatment tools with each roughness treatment tool having a different size, mass, cross-sectional width of working surface, roughness of working surface, and / or hardness of working surface.

13. The system according to any preceding claim, further comprising a measurement system arranged to measure the flatness and / or roughness of the terminal surfaces of the plurality of projections.

14. The system according to any preceding claim, wherein the controller is arranged to control the operation of the one or more treatment tools in the manufacture and / or reconditioning of a substrate support in dependence on one or more measurements of the flatness and / or roughness of the terminal surfaces of the plurality of projections.

15. The system according to any preceding claim, wherein the controller is arranged to control the operation of the one or more treatment tools in the manufacture and / or reconditioning of a substrate support such that the terminal surfaces of the plurality of projections of the substrate support meet a flatness specification and / or a roughness specification.

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