High-pressure substrate processing apparatus
The high-pressure substrate processing apparatus addresses thermal deformation and contamination issues by using a heat-blocking module with a bypass and cooling system to manage high-temperature gases, ensuring reliable substrate processing.
WO2026095458A1 Publication Date: 2026-05-07HPSP CO LTD
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Patent Information
- Application Number
- PCT/KR2025/016612
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-10-30
- Filing Date
- 2025-10-20
- Publication Date
- 2026-05-07
AI Technical Summary
Technical Problem
High-pressure substrate processing in semiconductor manufacturing can cause thermal deformation of substrates due to the transfer of heat from high-temperature gases, and impurities can contaminate the processing chamber, which is not a concern in vacuum processes.
Method used
A high-pressure substrate processing apparatus with a heat-blocking module, including a bypass plate and cooling plate, is used to divert and cool the high-temperature gases before they reach the substrate, preventing thermal deformation and reducing contamination.
Benefits of technology
The apparatus effectively prevents thermal deformation of substrates by blocking heat transfer from high-temperature gases and minimizes chamber contamination, ensuring reliable and efficient processing.
✦ Generated by Eureka AI based on patent content.
Abstract
A high-pressure substrate processing apparatus is disclosed. The high-pressure substrate processing apparatus may include a reaction chamber, a fluid supply module, and a heat-blocking module. The reaction chamber may comprise: a processing chamber formed to accommodate a reaction gas containing gaseous hydrogen oxide and having a reaction pressure higher than atmospheric pressure; and a loading stage formed to load a substrate to be processed by the reaction gas thereon. The fluid supply module may include a discharge port formed to supply the gaseous hydrogen oxide to the processing chamber. The heat-blocking module may be disposed between the discharge port and the loading table to block heat that is to be transferred to the substrate by the gaseous hydrogen oxide discharged from the discharge port.
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