Component mounting device and component mounting method

Abstract

A component mounting device according to one embodiment of the present invention comprises: a first component supply part and a second component supply part, which are disposed in the front-rear direction; a first rail part and a second rail part which are disposed between the first component supply part and the second component supply part and which transfer a loaded PCB in the left-right direction; first and second component mounting parts for picking up components from each of the first component supply part and the second component supply part and mounting the components onto the PCB; and a rail shuttle part for transferring the PCB from the first rail part to the second rail part.

Description

Component mounting device and component mounting method

[0001] Embodiments of the present invention relate to a component mounting device and a component mounting method.

[0002] In the case of Surface Mounting Technology (SMT) equipment, components are supplied from a component supply device and mounted onto a PCB. In this first component supply method, component supply devices are positioned on the front and back sides according to component type, respectively. For PCBs supplied from the position corresponding to the front side, various types of components are supplied and mounted from the component supply devices positioned on the front side through the component transfer and mounting device positioned on the front side. Similarly, for PCBs supplied from the position corresponding to the back side, various types of components are supplied and mounted from the component supply devices positioned on the back side through the component transfer and mounting device positioned on the back side.

[0003] In addition, in the second component supply method, a component transfer and mounting device positioned at the front can pick up a component from a component supply device positioned at the front and mount one type of component on both a PCB supplied at a position corresponding to the front and a PCB supplied at a position corresponding to the rear. Additionally, a component transfer and mounting device positioned at the rear can pick up a component from a component supply device positioned at the rear and mount another type of component on both a PCB supplied at a position corresponding to the rear and a PCB supplied at a position corresponding to the front.

[0004] However, since the first component supply method requires the component supply device, nozzle, and nozzle supply device (ANC) to be configured in duplicate on the front and rear according to the type of component, it becomes difficult to achieve compactness of the component supply system.

[0005] In the case of the second component supply method, compared to the first component supply method, a single component supply device can mount one type of component on both the front and back PCBs, thereby securing double the component mounting performance. Consequently, a greater number of component types can be mounted on the PCB.

[0006] However, in the case of the second component feeding method, the component transfer distance during front-to-back operation of the component transfer and mounting device is longer than that of the first component feeding method, which may result in a decrease in PCB production speed. Additionally, in the case of the second component feeding method, if the component transfer and mounting device positioned at the rear is operating at the front, the device positioned at the front is forced to wait, which may result in a loss of working time.

[0007] According to one aspect of the present invention, the main objective is to provide a component mounting device and a component mounting method that improve the productivity of PCBs supplied to the front and back sides by overcoming the disadvantages of the first component supply method and the second component supply method and utilizing their advantages.

[0008] However, these problems are exemplary, and the problems to be solved by the present invention are not limited thereto.

[0009] A component mounting device according to one embodiment of the present invention comprises: a first component supply unit and a second component supply unit arranged in a front-rear direction; a first rail unit and a second rail unit arranged between the first component supply unit and the second component supply unit and transporting a mounted PCB in a left-right direction; first and second component mounting units that pick up components from the first component supply unit and the second component supply unit, respectively, and mount components on the PCB; and a rail shuttle unit that transports the PCB from the first rail unit to the second rail unit.

[0010] The rail length of the second rail section above can be varied.

[0011] The PCB being transported in the first rail section is transported to the rail shuttle section, and the 2-2 rail section located in the variable area of ​​the second rail section is moved to the 2-1 rail section not located in the variable area of ​​the second rail section, thereby reducing the total length of the rail, and the rail shuttle section carrying the PCB can be moved to the variable area of ​​the second rail section.

[0012] It includes a first up-down rail section that is raised and lowered and connected to the first rail section when rising; and a second up-down rail section that is raised and lowered and connected to the second rail section when rising, wherein when the first up-down rail section is lowered, the rail shuttle section is located above the first up-down rail section, and when the second up-down rail section is lowered, the rail shuttle section can be located above the second up-down rail section.

[0013] The above rail shuttle unit includes a first rail shuttle unit connected to the first rail unit; and a second rail shuttle unit connected to the second rail unit, and when the first rail shuttle unit is connected to the second rail unit while carrying a PCB on which a first component is mounted, the second rail shuttle unit can be connected to the first rail unit.

[0014] The rail shuttle comprises: a first single rail connected to a rail that is relatively far from the second rail section among the two rails of the first rail section; and a second single rail connected to a rail that is relatively far from the first rail section among the two rails of the second rail section, wherein the rail shuttle comprises an inner rail section and an outer rail section, and the PCB can be transported through the first single rail and the first outer rail section of the rail shuttle or through the second single rail and the second outer rail section of the rail shuttle.

[0015] A component mounting method according to an embodiment of the present invention comprises: a step of mounting a first component on a PCB transferred to a first rail section; a step in which a rail shuttle connected to the first rail section receives the PCB on which the first component is mounted from the first rail section and separates from the first rail section and moves to a second rail section; a step in which the rail shuttle is connected to the second rail section; a step in which the PCB placed on the rail shuttle is transferred to the second rail section; a step in which the PCB is placed on the second rail section and the rail shuttle returns to a position where it is connected to the first rail section again; a step in which a second component is mounted on the PCB transferred to the second rail section; and a step in which the PCB on which the first component and the second component are mounted is transferred to an outlet.

[0016] The step of connecting the rail shuttle portion to the second rail portion may include: a step of moving a second-2 rail portion located in a variable area of ​​the second rail portion to a second-1 rail portion not located in a variable area; and a step of moving the rail shuttle portion to the variable area and connecting it to the second-1 rail portion.

[0017] The method may further include a step in which a rail shuttle connected to the first rail section receives the PCB on which the first component is mounted from the first rail section, separates from the first rail section, and moves to the second rail section, and then a step in which a first up-down rail section rises and connects to the first rail section, and a step in which, prior to the step in which the rail shuttle section connects to the first rail section, the second up-down rail section lowers and disconnects from the second rail section.

[0018] The step of a rail shuttle unit connected to the first rail unit receiving the PCB on which the first component is mounted from the first rail unit and moving to the second rail unit separated from the first rail unit includes: the step of the first rail shuttle unit separated from the first rail unit moving to the second rail unit; and the step of the second rail shuttle unit separated from the second rail unit moving to the first rail unit, and the step of the PCB being placed on the second rail unit and the rail shuttle unit returning to a position connected to the first rail unit again may include the step of the first rail shuttle unit returning to a position connected to the first rail unit again and the step of the second rail shuttle unit returning to a position connected to the second rail unit again.

[0019] The rail shuttle comprises: a first single rail connected to a rail that is relatively far from the second rail among the two rails of the first rail section; and a second single rail connected to a rail that is relatively far from the first rail among the two rails of the second rail section, wherein the rail shuttle comprises a first and second inner rail section disposed on the inside and a first and second outer rail section disposed on the outside, and the step of the rail shuttle being connected to the second rail section includes the step of the second outer rail section of the rail shuttle being connected to the second front rail section of the second rail section and the second single rail being connected to the second rear rail section of the second rail section, and the step of the rail shuttle returning to a position where it is connected to the first rail section again may include the step of the first outer rail section of the rail shuttle being connected to the first rear rail section of the first rail section and the first single rail being connected to the first front rail section of the first rail section.

[0020] The rail shuttle includes a second single rail connected to a rail located at a relatively far distance from the first rail among the two rails of the second rail section, and the rail shuttle includes a first inner rail section positioned at the front and a second inner rail section and a second outer rail section positioned at the rear, and the step of the rail shuttle being connected to the second rail section includes the step of the second outer rail section of the rail shuttle being connected to the second front rail section of the second rail section and the second single rail being connected to the second rear rail section of the second rail section, and the step of the rail shuttle returning to a position where it is connected to the first rail section again may include the step of the first inner rail section of the rail shuttle being connected to the first front rail section of the first rail section and the second inner rail section of the rail shuttle being connected to the first rear rail section of the first rail section.

[0021] Other aspects, features, and advantages other than those described above will become clear from the following specific details, claims, and drawings for implementing the invention.

[0022] A component mounting device and component mounting method according to one embodiment of the present invention can mount one type of component on each of the front and rear PCBs using a single component supply device, and at the same time, can improve the production speed of the PCB by utilizing a rail shuttle unit to transport the PCB from the front to the rear.

[0023] The effects of the present invention are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art from the description in the claims.

[0024] FIG. 1(a) is a block diagram of a component mounting device according to one embodiment of the present invention. FIG. 1(b) is a conceptual diagram of the main configuration of a component mounting device according to one embodiment of the present invention viewed from above.

[0025] FIG. 2 is a flowchart of a component mounting device according to one embodiment of the present invention.

[0026] FIGS. 3 to 8 are drawings showing the component mounting process of a component mounting device according to one embodiment of the present invention in sequence.

[0027] FIG. 9 is a flowchart showing the main contents of the component mounting process according to FIG. 3 to FIG. 8.

[0028] FIGS. 10 to 15 are drawings illustrating the component mounting process of a component mounting device according to another embodiment of the present invention in sequence.

[0029] FIG. 16 is a flowchart showing the main contents of the component mounting process according to FIG. 10 to FIG. 15.

[0030] FIGS. 17 to 21 are drawings showing the component mounting process of a component mounting device according to another embodiment of the present invention in sequence.

[0031] FIG. 22 is a flowchart showing the main contents of the component mounting process according to FIG. 17 to FIG. 21.

[0032] FIGS. 23 to 28 are drawings showing the component mounting process of a component mounting device according to another embodiment of the present invention in sequence.

[0033] FIG. 29 is a flowchart showing the main contents of the component mounting process according to FIG. 23 to FIG. 28.

[0034] FIGS. 30 and 31 are drawings illustrating a component mounting device and a component mounting process according to another embodiment of the present invention.

[0035] The present invention is capable of various modifications and may have various embodiments; specific embodiments are illustrated in the drawings and described in detail in the description of the invention. However, this is not intended to limit the present invention to specific embodiments, and it should be understood that the invention includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention. In describing the present invention, the same identification numerals are used for identical components, even if they are illustrated in different embodiments.

[0036] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. When describing with reference to the drawings, identical or corresponding components are given the same reference numerals, and redundant descriptions thereof will be omitted.

[0037] In the following embodiments, terms such as first, second, etc. are used not in a limiting sense, but for the purpose of distinguishing one component from another component.

[0038] In the following examples, singular expressions include plural expressions unless the context clearly indicates otherwise.

[0039] In the following embodiments, terms such as "include" or "have" mean that the features or components described in the specification are present, and do not preclude the possibility that one or more other features or components may be added.

[0040] In the drawings, the size of components may be exaggerated or reduced for convenience of explanation. For example, the size and thickness of each component shown in the drawings are depicted arbitrarily for convenience of explanation, so the present invention is not necessarily limited to what is illustrated.

[0041] Where an embodiment can be implemented differently, a specific process sequence may be performed differently from the order described. For example, two processes described consecutively may be performed substantially simultaneously or proceed in the reverse order of the description.

[0042] The terms used in this application are used merely to describe specific embodiments and are not intended to limit the invention. In this application, terms such as “comprising” or “having” are intended to indicate the presence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0043] Hereinafter, a component mounting device according to an embodiment of the present invention will be described with reference to FIGS. 1 and FIGS. 2.

[0044] FIG. 1(a) is a block diagram of a component mounting device according to an embodiment of the present invention. FIG. 1(b) is a conceptual diagram of the main configuration of a component mounting device according to an embodiment of the present invention viewed from above. FIG. 2 is a flowchart of a component mounting device according to an embodiment of the present invention.

[0045] Referring to FIGS. 1 and 2, the component mounting device according to the present embodiment includes a first component supply unit (110) and a second component supply unit (120) arranged in a front-rear direction; a first rail unit (R1) and a second rail unit (R2) arranged between the first component supply unit and the second component supply unit and transporting a mounted PCB in a left-right direction; first and second component mounting units (210, 220) that pick up components from the first component supply unit (110) and the second component supply unit (120), respectively, and mount components on the PCB; and a rail shuttle unit (S) that transports the PCB from the first rail unit to the second rail unit.

[0046] In Surface Mount Technology (SMT) equipment, the component supply unit is also called a feeder. The component supply unit supplies components to be mounted on the PCB. The component mounting unit mounts the components supplied from the component supply unit to the precise location on the PCB. At this time, the component mounting unit may include a head. Components can be mounted on the PCB through the head.

[0047] According to the present embodiment, the component mounting device can be arranged into two production lines: a front line and a rear line. When the production lines of the component mounting device are formed in a parallel relationship between the front and rear lines, parallel processing of the component mounting operation becomes possible, and the production speed of the PCB can be increased.

[0048] According to the present embodiment, it may include a first component supply unit (110) positioned on the front side and a second component supply unit (120) positioned on the rear side. The first component supply unit (110) may be positioned at a location corresponding to a first rail unit (R1) formed along the production line of the front side. The second component supply unit (120) may be positioned at a location corresponding to a second rail unit (R2) formed along the production line of the rear side.

[0049] The first rail section (R1) and the second rail section (R2) may be formed parallel to each other in a direction facing each other. The first component supply section (110) and the second component supply section (120) may be arranged facing each other, and the first rail section (R1) and the second rail section (R2) may be arranged between the first component supply section (110) and the second component supply section (120).

[0050] The first rail section (R1) and the second rail section (R2) can transport a PCB. The PCB transported through the first rail section (R1) and the second rail section (R2) can have components supplied from the first component supply section (110) or the second component supply section (120) mounted on it. According to the present embodiment, the first component supply section (110) can supply a first component (F). Additionally, the second component supply section (120) can supply a second component (R).

[0051] According to the present embodiment, the system includes first and second component mounting units (210, 220) that each pick up a component and mount it on the PCB. The first component mounting unit (210) can pick up a first component (F) supplied from a first component supply unit (110) and mount it on a PCB transported via a first rail unit (R1) or a second rail unit (R2). The second component mounting unit (220) can pick up a second component (R) supplied from a second component supply unit (120) and mount it on a PCB transported via a second rail unit (R2) or a first rail unit (R1).

[0052] According to the present embodiment, a rail shuttle unit (S) may be included. The rail shuttle unit (S) can burn a PCB transported through the first rail unit (R1) and transport it to the second rail unit (R2). Conversely, it can burn a PCB transported through the second rail unit (R2) and transport it to the first rail unit (R1).

[0053] According to the present embodiment, the first component (F) supplied from the first component supply unit (110) positioned on the front can be supplied to the PCB transferred from the front as well as to the PCB transferred from the rear, so that components can be mounted on both the front and rear PCBs transferred from a single component supply unit. Additionally, the second component (R) supplied from the second component supply unit (120) positioned on the rear can be supplied to the PCB transferred from the rear as well as to the PCB transferred from the front, so that components can be mounted on both the front and rear PCBs transferred from a single component supply unit.

[0054] In addition, according to the present embodiment, when a first component (F) is mounted on a PCB transported through the first rail section (R1) of the front section, the PCB with the first component (F) mounted on it is transported through the rail shuttle section (S) to the second rail section (R2) of the rear section, and a second component (R) can be mounted on the PCB at the rear section, thereby allowing the first and second components (F, R) to be mounted quickly on the PCB.

[0055] The component mounting device according to the present embodiment performs mounting operations on the front and rear sections separately, allowing the first and second component mounting sections to perform operations individually. Additionally, the first and second component supply sections can also perform operations individually. This enables faster PCB production time.

[0056] In addition, the front side has only a first component supply unit that supplies a first component, and the rear side has only a second component supply unit that supplies a second component, so the travel distance of the picked-up component through the first and second component mounting units, which can mount components on both the front and rear PCBs, can be increased.

[0057] However, according to the present embodiment, the first component mounting section can sequentially mount components only on the front side, and the second component mounting section can sequentially mount components only on the back side, thereby reducing the waiting time for mounting and reducing the time for each of the first and second component mounting sections to move to the opposite work area while holding the components, thus enabling faster PCB production time.

[0058] A component mounting method according to the present embodiment comprises the steps of: mounting a first component (F) on a PCB transferred to a first rail section (R1) (S100); a rail shuttle section (S) connected to the first rail section (R1) receiving the PCB on which the first component (F) is mounted from the first rail section (R1) and separating from the first rail section (R1) to move to a second rail section (R2) (S200); connecting the rail shuttle section (S) to the second rail section (R2) (S300); transferring the PCB placed on the rail shuttle section (S) to the second rail section (R2) (S400); placing the PCB on the second rail section (R2) and returning the rail shuttle section (S) to a position where it is connected to the first rail section (R1) again (S500); and mounting a second component (R) on the PCB transferred to the second rail section (R2). It includes a step (S600) and a step (S700) in which the PCB on which the first component (F) and the second component (R) are mounted is transferred to an exit.

[0059] The rail shuttle unit (S) can be detached from the first rail unit (R1) and the second rail unit (R2), respectively. The rail shuttle unit (S) moves in the forward and backward directions and can be connected to or separated from the first rail unit (R1), and can be separated from or connected to the second rail unit (R2). When the rail shuttle unit (S) is connected to the first rail unit (R1) or the second rail unit (R2), the PCB can be freely transferred from the first rail unit (R1) to the rail shuttle unit (S) and from the rail shuttle unit (S) to the first rail unit (R1), and the PCB can be freely transferred from the second rail unit (R2) to the rail shuttle unit (S) and from the rail shuttle unit (S) to the second rail unit (R2).

[0060] The PCB transferred to the exit with the first component (F) and the second component (R) mounted thereon can be transferred to the next process step. In this embodiment, the component mounting process was described using two components, two component supply units, and two component mounting units as examples, but the number of components, the number of component supply units, and the number of component mounting units can be formed as more than two.

[0061] According to the present embodiment, when a first component (F) is mounted on a PCB transported through a first rail section (R1) of the front section, the PCB with the first component (F) mounted on it is transported to a second rail section (R2) of the rear section through a rail shuttle section (S), and a second component (R) can be mounted on the PCB at the rear section, thereby allowing the first and second components (F, R) to be mounted quickly on the PCB.

[0062] Hereinafter, with reference to FIGS. 3 to 9, a component mounting device and a component mounting method according to an embodiment of the present invention will be described.

[0063] FIGS. 3 to 8 are drawings showing the component mounting process of a component mounting device according to an embodiment of the present invention in sequence. FIG. 9 is a flowchart showing the main contents of the component mounting process according to FIGS. 3 to 8.

[0064] According to the present embodiment, with reference to FIGS. 3 to 9, the length of the second rail section (R2) can be varied. At this time, the PCB being transported in the first rail section (R1) is transported to the rail shuttle section (S), and the second-2 rail section (R22) located in the variable area of ​​the second rail section (R2) is moved into the interior of the second-1 rail section (R21) which is not located in the variable area of ​​the second rail section (R2), and the total length of the rail is reduced, and the rail shuttle section carrying the PCB can be moved to the variable area (A) of the second rail section (R2).

[0065] According to the present embodiment, the second-1 rail portion (R21) of the second rail portion (R2) may be formed in the shape of a hollow tube with a square cross-section. Additionally, the second-2 rail portion (R22) may be formed in the shape of a hollow tube with a square cross-section smaller than that of the second-1 rail portion (R21). At this time, as the second-2 rail portion (R22) is inserted into the hollow tube of the second-1 rail portion (R21), the rail length of the second rail portion (R2) may be shortened.

[0066] When the second-2 rail section (R22) is inserted into the interior of the second-1 rail section (R21), the rail shuttle section (S) can be transported to the variable area (A), which is the area where the second-2 rail section (R22) was located before insertion. The rail of the transported rail shuttle section (S) is connected to the second-1 rail section (R21) into which the second-2 rail section (R22) is inserted, and the PCB on the rail shuttle section (S) can be transported to the second-1 rail section (R21) of the second rail section (R2) and then components can be mounted.

[0067] According to the present embodiment, the step (S300) of connecting the rail shuttle (S) to the second rail section (R2) may include the step (S310) of moving the second-2 rail section (R22), located in the variable area (A) of the second rail section (R2), into the interior of the second-1 rail section (R21), which is not located in the variable area (A), and the step (S320) of moving the rail shuttle (S) to the variable area (A) and connecting it to the second-1 rail section (R21). The control unit may determine whether the rail section is variable based on the movement position of the rail shuttle and transmit the determined information to the rail variable drive unit. The rail variable drive unit may receive a variable signal of the rail section from the control unit and, depending on the situation, insert and transport the second-2 rail section (R22) into the interior of the second-1 rail section (R21).

[0068] According to the present embodiment, a rail shuttle unit (S) movable in the forward and backward directions is connected to a first rail unit (R1) (see FIG. 3). Subsequently, the rail shuttle unit (S) moves in the rearward direction, and the second rail unit (R2) transports the PCB, which has been mounted, to the exit, while the variable area (A) of the third rail unit (R2) remains in a state where no PCB is mounted (see FIG. 4). Subsequently, the second-2 rail unit (R22) moves into the interior of the second-1 rail unit (R21), which is not located in the variable area (A), and the rail shuttle unit (S) is mounted at the front, and enters the variable area (A) together with the PCB on which the first component (F) is mounted through the first component mounting unit (210) at the front, and is connected to the second-1 rail unit (R21) (see FIG. 5).

[0069] A PCB placed on the rail shuttle section (S) is transferred to the second-1 rail section (R21) (see FIG. 6), and the rail shuttle section (S), which has been moved to the variable area (A), can be moved forward to be connected to the first rail section (R1) again (see FIG. 7). Subsequently, at the second-1 rail section (R21), a second component (R) can be mounted on the PCB through the second component mounting section (220) (see FIG. 8). This embodiment can rapidly produce a PCB by repeating the operations of FIG. 3 to FIG. 8.

[0070] Hereinafter, with reference to FIGS. 10 to 16, a component mounting device and a component mounting method according to an embodiment of the present invention will be described.

[0071] FIGS. 10 to 15 are drawings illustrating the component mounting process of a component mounting device according to another embodiment of the present invention in sequence. FIG. 16 is a flowchart illustrating the main contents of the component mounting process according to FIGS. 10 to 15.

[0072] According to the present embodiment, with reference to FIGS. 10 to 16, the rail shuttle (S) is included in a first up-down rail section (UDR1) that is raised and connected to the first rail section (R1) when raised, and a second up-down rail section (UDR2) that is raised and connected to the second rail section when raised. When the first up-down rail section (UDR1) is lowered, the rail shuttle (S) is located above the first up-down rail section (UDR1), and when the second up-down rail section (UDR2) is lowered, the rail shuttle (S) can be located above the second up-down rail section (UDR2).

[0073] That is, the first and second up-down rail sections (UDR1, UDR2), which function as buffers, can move up and down to avoid the rail shuttle section (S). At this time, when the first and second up-down rail sections (UDR1, UDR2) rise, they are connected to the first and second rail sections (R1, R2), respectively, to discharge the PCBs on which the mounting process is completed. Additionally, when the rail shuttle section (S) approaches the first and second rail sections (R1, R2), the first and second up-down rail sections (UDR1, UDR2) can descend to avoid contact with the rail shuttle section (S). Although this drawing discloses that the PCBs are transported to the exit only from the second rail section (R2) where mounting is completed, the PCBs on which mounting is completed may also be transported to the exit from the first rail section (R1) depending on the situation. In addition, the PCB with the components mounted can be transferred to the exit in the first up-down rail section (UDR1), the second up-down rail section (UDR2), and the rail shuttle section (S).

[0074] According to the present embodiment, after the step (S200) in which a rail shuttle unit (S) connected to a first rail unit (R1) receives the PCB on which the first component (F) is mounted from the first rail unit (R1) and is separated from the first rail unit (R1) and moved to the second rail unit (R2), the method may further include the step (S210) in which a first up-down rail unit (UDR1) rises and connects to the first rail unit (R1).

[0075] Additionally, prior to the step (S300) in which the rail shuttle unit (S) is connected to the first rail unit (R1), the method may further include a step (S290) in which the second up-down rail unit (UDR2) descends to release the connection with the second rail unit (R2).

[0076] According to the present embodiment, when the rail shuttle unit (S) is connected to the first rail unit (R1), the second up-down rail unit (UDR2) is connected to the second rail unit (R2) (see FIG. 10). Subsequently, when the rail shuttle unit (S) moves to the rear side toward the second rail unit (R2), the mounted PCB can be transported to the exit through the second up-down rail unit (UDR2) (see FIG. 11).

[0077] When the rail shuttle unit (S) is connected to the second rail unit (R2), the second up-down rail unit (UDR2) descends to avoid contact with the rail shuttle unit (S), and the first up-down rail unit (UDR1) rises to be connected to the first rail unit (R1) (see FIG. 12).

[0078] The PCB transferred to the rail shuttle unit (S) is transferred onto the second rail unit (R2) (see FIG. 13), and when the rail shuttle unit (S) moves back to the front where the first rail unit (R1) is located, the first up-down rail unit (UDR1) descends again (see FIG. 13).

[0079] A second component (R) can be mounted on the PCB transferred to the second rail section (R2) through the second component mounting section (220) (see FIG. 15). This embodiment can rapidly produce PCBs by repeating the operations of FIG. 10 to FIG. 16.

[0080] Hereinafter, with reference to FIGS. 17 to 22, a component mounting device and a component mounting method according to an embodiment of the present invention will be described.

[0081] FIGS. 17 to 21 are drawings illustrating the component mounting process of a component mounting device according to another embodiment of the present invention in sequence. FIG. 22 is a flowchart illustrating the main contents of the component mounting process according to FIGS. 17 to 21.

[0082] According to the present embodiment, with reference to FIGS. 17 to 22, the rail shuttle unit includes a first rail shuttle unit (S1) connected to the first rail unit (R1) and a second rail shuttle unit (S2) connected to the second rail unit (R2). When the first rail shuttle unit (S1) is connected to the second rail unit (R2) while carrying a PCB on which the first component (F) is mounted, the second rail shuttle unit (S2) can be connected to the first rail unit (R1) while carrying a PCB on which the first component (F) and the second component (R) are mounted.

[0083] In other words, this embodiment is a method in which a first rail shuttle unit (S1) and a second rail shuttle unit (S2), which function as buffers, cross each other's positions and avoid one another. The method of crossing can be implemented in various ways, and this method has the effect of simplifying the transfer operation of the PCB.

[0084] The second rail shuttle unit (S2) can transport and discharge the completed PCB to the exit. At this time, the first rail shuttle unit (S1) can transport and place the PCB on which the first component (F) is mounted.

[0085] Conversely, the first rail shuttle unit (S1) can transport and discharge the completed PCB to the exit. At this time, the second rail shuttle unit (S2) may transport and place the PCB on which the second component (R) is mounted.

[0086] According to the present embodiment, the step (S200) in which a rail shuttle unit (S) connected to a first rail unit (R1) receives the PCB on which a first component (F) is mounted from the first rail unit (R1) and is separated from the first rail unit (R1) and moved to a second rail unit (R2) may include the step (S220) in which the first rail shuttle unit (S1) separated from the first rail unit (R1) moves to the second rail unit (R2) and the step (S230) in which the second rail shuttle unit (S2) separated from the second rail unit (R2) moves to the first rail unit (R1).

[0087] The step (S500) of the PCB being placed on the second rail section (R2) and the rail shuttle section (S) returning to a position connected to the first rail section (R1) again includes the step (S510) of the first rail shuttle section (S1) returning to a position connected to the first rail section (R1) again and the second rail shuttle section (S2) returning to a position connected to the second rail section (R2) again.

[0088] According to the present embodiment, the first rail shuttle unit (S1) can be connected to the first rail unit (R1), and the second rail shuttle unit (S2) can be connected to the second rail unit (R2) (see FIG. 17). At this time, the first rail shuttle unit (S1) can move backward carrying the first PCB (see FIG. 18) and be connected to the second rail unit (R2). At the same time, the second rail shuttle unit (S2) can move forward carrying the second PCB and be connected to the first rail unit (R1) (see FIG. 19).

[0089] The first PCB of the first rail shuttle unit (S1) connected to the second rail unit (R2) is transferred to the second rail unit (R2), and the second PCB of the second rail shuttle unit (S2) connected to the first rail unit (R1) can be transferred to the exit after mounting is completed (see FIG. 20).

[0090] The first rail shuttle (S1) can be moved to the front and reconnected with the first rail (R1), and the second rail shuttle (S2) can be moved to the rear and reconnected with the second rail (R2). The first PCB can have the second component (R) mounted on the second rail (R2) (see FIG. 21). The present embodiment can rapidly produce PCBs by repeating the operations of FIG. 17 to FIG. 22.

[0091] Hereinafter, with reference to FIGS. 23 to 29, a component mounting device and a component mounting method according to an embodiment of the present invention will be described.

[0092] FIGS. 23 to 29 are drawings illustrating the component mounting process of a component mounting device according to another embodiment of the present invention in sequence. FIG. 29 is a flowchart illustrating the main contents of the component mounting process according to FIGS. 23 to 28.

[0093] According to the present embodiment, with reference to FIGS. 23 to 29, the rail shuttle (S') may include a first single rail (Ra) connected to a rail that is relatively far from the second rail section (R2) among the two rails of the first rail section (R1), and a second single rail (Rb) connected to a rail that is relatively far from the first rail section (R1) among the two rails of the second rail section (R2). At this time, the rail shuttle (S') includes an inner rail section (RI) positioned relatively inward on the rail shuttle, and an outer rail section (RO) positioned relatively outward, and the PCB may be transported through the first single rail (Ra) and the first outer rail section (RO1) of the rail shuttle (S'), or through the second single rail (Rb) and the second outer rail section (RO2) of the rail shuttle (S').

[0094] According to the present embodiment, when discharging a PCB with completed component mounting to the outside through an outlet, an outer rail section and a single rail may be used. Specifically, when discharging a PCB with completed component mounting from the first rail section (R1) to the outside through an outlet, a rail shuttle section (S') is moved to the front where the first rail section (R1) is located, the first outer rail section (RO1) of the rail shuttle section (S') is connected to the first rear rail section (R1b) of the first rail section (R1), and the first single rail (Ra) can be connected to the first front rail section (R1a) of the first rail section (R1).

[0095] Additionally, when the PCB with completed component mounting in the second rail section (R2) is discharged to the outside through the exit, the rail shuttle section (S') is moved to the front where the second rail section (R2) is located, the second outer rail section (RO2) of the rail shuttle section (S') is connected to the second front rail section (R2a) of the second rail section (R2), and the second single rail (Rb) can be connected to the second rear rail section (R2b) of the second rail section (R2).

[0096] In addition, the PCB with the components mounted can be discharged to the outside through the exit from the rail shuttle (S') while it is on the rail shuttle (S').

[0097] In addition, according to the present embodiment, when transporting a PCB from the front to the rear or from the rear to the front through a rail shuttle unit (S'), the inner rail unit (RI) can be connected to the first and second rail units (R1, R2) respectively to transport the PCB. That is, when the rail shuttle unit (S') is connected to the first rail unit (R1), the first and second inner rail units (RI1, RI2) of the rail shuttle unit (S') can be connected to the first front and rear rail units (R1a, R1b) of the first rail unit (R1). In addition, when the rail shuttle unit (S') is connected to the second rail unit (R2), the first and second inner rail units (RI1, RI2) of the rail shuttle unit (S') can be connected to the second front and rear rail units (R2a, R2b) of the second rail unit (R2). At this time, the first and second single rails (Ra, Rb) can descend when the rail shuttle approaches (S') to avoid collision with it, and then ascend again when the rail shuttle moves away.

[0098] According to the present embodiment, the step (S300) of connecting the rail shuttle part (S') to the second rail part (R2) may include the step (S330) in which the second outer rail part (RO2) of the rail shuttle part (S') is connected to the second front rail part (R2a) of the second rail part (R2), and the second single rail (Rb) is connected to the second rear rail part (R2b) of the second rail part (R2).

[0099] Additionally, the step (S500) of the rail shuttle unit (S') returning to a position where it is connected to the first rail unit (R1) again may include the step (S520) in which the first outer rail unit (RO1) of the rail shuttle unit (S') is connected to the first rear rail unit (R1b) of the first rail unit, and the first single rail (Ra) is connected to the first front rail unit (R1a) of the first rail unit (R1).

[0100] According to the present embodiment, the rail shuttle unit (S') may be movable back and forth (see FIG. 23). When the rail shuttle unit (S') is connected to the first rail unit (R1), the inner rail unit (RI) of the rail shuttle unit (S') may be connected to the first rail unit (R1). A PCB located on the first rail unit (R1) may be transferred to the rail shuttle unit (S') (see FIG. 24).

[0101] When the rail shuttle (S') moves to the rear with the PCB mounted thereon, and the second outer rail section (RO2) and the second single rail (Rb) of the rail shuttle (S') are connected to the second rail section (R2), the mounted PCB that was on the second rail section (R2) can be discharged to the exit along the rail route formed by the second outer rail section (RO2) and the second single rail (Rb) (see FIG. 25).

[0102] In addition, the PCB with the components mounted can be discharged to the outside through the exit from the rail shuttle (S') while it is on the rail shuttle (S').

[0103] Subsequently, the rail shuttle section (S') is moved further rearward, and the inner rail section (RI) of the rail shuttle section (S') can be connected to the second rail section (R2). Subsequently, the PCB that was placed on the rail shuttle section (S') can be transferred to the second rail section (R2). At this time, the second single rail (Rb) can descend to avoid collision with the rail shuttle section (S') (see FIG. 26).

[0104] After that, the rail shuttle section (S') is connected again through the first rail section (R1) and the inner rail section (RI), and the first single rail (Rb) descends to avoid collision with the rail shuttle section (S'). The PCB with the first component mounted can be transferred from the first rail section (R1) to the rail shuttle section (S') (see FIG. 27).

[0105] Afterward, the rail shuttle (S') carries the PCB with the first component mounted and moves toward the second rail (R2), and the component can be mounted on the front and rear sides while repeating the operation described above (see FIG. 28). This embodiment can rapidly produce a PCB by repeating the operation of FIG. 23 to FIG. 28.

[0106] According to the present embodiment, the first single rail (Ra) may overlap with the first outer rail section (RO1) in the front-rear direction without descending and avoiding, thereby becoming one body. Additionally, the second single rail (Rb) may overlap with the second outer rail section (RO2) without descending and avoiding, thereby becoming one body.

[0107] FIG. 30 is a diagram showing a component mounting device and a component mounting process according to another embodiment of the present invention.

[0108] Referring to FIG. 30, the component mounting device according to the present embodiment may include a second single rail (Rb) connected to a rail that is relatively far from the first rail section (R1) among the two rails of the second rail section (R2). At this time, the rail shuttle section (S') may include a first inner rail section (RI1) positioned at the front, a second inner rail section (RI2) positioned at the rear, and a second outer rail section (RO2).

[0109] The first inner rail section (RI1) and the second inner rail section (RI2) of the rail shuttle section (S'') can be connected to the first front rail section (R1a) and the first rear rail section (R1b) of the first rail section (R1), respectively. With the rail shuttle section (S'') connected to the first rail section (R1), a PCB can be transferred from the first rail section (R1) to the rail shuttle section (S''). Additionally, the PCB transferred to the rail shuttle section (S'') can be discharged to the outside through the outlet when component mounting is completed. At this time, the second single rail (Rb) can descend when the rail shuttle section approaches to avoid collision with the rail shuttle section (S''), and then ascend again when the rail shuttle section moves away.

[0110] The rail shuttle unit (S'') can be moved to the rear corresponding to the second rail unit (R2) while the PCB is loaded. At this time, the second outer rail unit (RO2) of the rail shuttle unit (S'') is connected to the second front rail unit (R2a) of the second rail unit (R2), so that the PCB on the second rail unit (R2) can be discharged to the outside by passing through the exit via the second single rail (Rb) and the second outer rail unit (RO2). Additionally, the first inner rail unit (RI1) and the second inner rail unit (RI2) of the rail shuttle unit (S'') are respectively connected to the second front rail unit (R2a) and the second rear rail unit (R2b) of the second rail unit (R2), so that the PCB transported through the rail shuttle unit (S'') can be transported to the second rail unit (R2).

[0111] According to the present embodiment, the step (S300) of connecting the rail shuttle part (S'') to the second rail part (R2) may include the step (S330) in which the second outer rail part (RO2) of the rail shuttle part (S'') is connected to the second front rail part (R2a) of the second rail part (R2), and the second single rail (Rb) is connected to the second rear rail part (R2b) of the second rail part (R2).

[0112] Additionally, the step (S500) of the rail shuttle unit (S'') returning to a position where it is connected to the first rail unit (R1) again may include the step (S530) in which the first inner rail unit (RI1) of the rail shuttle unit (S'') is connected to the first front rail unit (R1a) of the first rail unit (R1), and the second inner rail unit (RI2) of the rail shuttle unit (S'') is connected to the first rear rail unit (RIb) of the first rail unit (R1).

[0113] Although the present invention has been described with reference to the embodiments illustrated in the drawings, this is merely illustrative. Those skilled in the art will fully understand that various modifications and equivalent alternative embodiments are possible from the embodiments. Accordingly, the true technical scope of protection of the present invention should be determined based on the appended claims.

[0114] The specific technical details described in the embodiments are merely examples and do not limit the technical scope of the embodiments. To make the description of the invention concise and clear, descriptions of general prior art and configurations may be omitted. Furthermore, the connections of lines or connecting members between components depicted in the drawings are illustrative of functional connections and / or physical or circuit connections, and may be replaced or represented by various additional functional, physical, or circuit connections in actual devices. Additionally, unless specifically stated with terms such as "essential" or "importantly," a component may not be strictly necessary for the application of the present invention.

[0115] The term "the above" or similar designations in the description of the invention and claims may refer to both singular and plural forms unless specifically limited otherwise. Furthermore, where a range is described in the embodiments, it is considered to include the invention with respect to individual values ​​within said range (unless otherwise stated), and is equivalent to describing each individual value constituting said range in the description of the invention. Additionally, regarding the steps constituting the method according to the embodiments, the steps may be performed in a suitable order unless explicitly stated or otherwise stated. The embodiments are not necessarily limited by the order in which the steps are described. The use of all examples or exemplary terms (e.g., etc.) in the embodiments is merely for the purpose of describing the embodiments in detail, and the scope of the embodiments is not limited by said examples or exemplary terms unless otherwise limited by the claims. Furthermore, a person skilled in the art will understand that various modifications, combinations, and changes may be made according to design conditions and factors within the scope of the claims or equivalents to which they are added.

Claims

1. A first component supply unit and a second component supply unit arranged in the front-rear direction; A first rail section and a second rail section disposed between the first component supply section and the second component supply section, and transporting the mounted PCB in the left and right directions; A first and second component mounting unit that picks up components from the first component supply unit and the second component supply unit, respectively, and mounts the components on the PCB; and A component mounting device comprising a rail shuttle unit for transporting the PCB from the first rail unit to the second rail unit.

2. In Paragraph 1, A component mounting device in which the rail length of the second rail section is variable.

3. In Paragraph 1, The PCB being transported in the first rail section is transported to the rail shuttle section, and The 2-2 rail portion located in the variable area of ​​the 2 rail portion is moved to the 2-1 rail portion not located in the variable area of ​​the 2 rail portion, and the total length of the rail is reduced, and A component mounting device in which the rail shuttle carrying the above PCB moves to a variable area of ​​the above second rail.

4. In Paragraph 1, A first up-down rail section that is raised and lowered and connected to the first rail section when rising; and It includes a second up-down rail section that is raised and lowered and connects to the second rail section when rising, and When the first up-down rail section is lowered, the rail shuttle section is located on the upper side of the first up-down rail section, and A component mounting device in which, when the second up-down rail section is lowered, the rail shuttle section is located on the upper side of the second up-down rail section.

5. In Paragraph 1, The above rail shuttle unit is, A first rail shuttle connected to the first rail section; and It includes a second rail shuttle connected to the second rail section, and When the first rail shuttle unit is connected to the second rail unit while carrying a PCB on which the first component is mounted, The above-mentioned second rail shuttle is a component mounting device connected to the first rail.

6. In Paragraph 1, A first single rail connected to a rail that is relatively far from the second rail section among the two rails of the first rail section; and It includes a second single rail connected to a rail that is relatively far from the first rail section among the two rails of the second rail section, The above rail shuttle unit includes an inner rail unit and an outer rail unit, and The above PCB is the first single rail and the first outer rail portion of the rail shuttle portion or A component mounting device that is transported through the second single rail and the second outer rail section of the rail shuttle section.

7. A step of mounting a first component on a PCB transferred to the first rail section; A step in which a rail shuttle connected to the first rail section receives the PCB on which the first component is mounted from the first rail section, separates from the first rail section, and moves to the second rail section; A step in which the above rail shuttle part is connected to the above second rail part; A step in which the PCB mounted on the rail shuttle section is transferred to the second rail section; A step in which the PCB is placed on the second rail section, and the rail shuttle returns to a position where it is connected to the first rail section again; A step of mounting a second component on the PCB transferred to the second rail section; and A component mounting method comprising the step of transferring the PCB on which the first component and the second component are mounted to an exit.

8. In Paragraph 7, The step of connecting the above rail shuttle part to the above second rail part is A step of moving a 2-2 rail portion located in the variable area of ​​the 2nd rail portion to a 2-1 rail portion not located in the variable area; and A method for mounting a component, comprising the step of moving the rail shuttle portion to the variable area and connecting it to the second-1 rail portion.

9. In Paragraph 7, After the step in which a rail shuttle connected to the first rail section receives the PCB on which the first component is mounted from the first rail section, and is separated from the first rail section and moved to the second rail section, The first up-down rail section further includes the step of rising and connecting to the first rail section, and Before the step in which the above rail shuttle part is connected to the first rail part, A component mounting method further comprising the step of lowering the second up-down rail portion to release the connection with the second rail portion.

10. In Paragraph 7, The step of a rail shuttle connected to the first rail section receiving the PCB on which the first component is mounted from the first rail section, and separating from the first rail section and moving to the second rail section, A step in which a first rail shuttle separated from a first rail section is moved to a second rail section; and It includes the step of moving a second rail shuttle unit, separated from the second rail unit, to the first rail unit, and The step of the PCB being placed on the second rail section and the rail shuttle returning to a position connected to the first rail section again is A method for mounting a component, comprising the step of the first rail shuttle returning to a position connected to the first rail, and the second rail shuttle returning to a position connected to the second rail.

11. In Paragraph 7, A first single rail connected to a rail that is relatively far from the second rail among the two rails of the first rail section; and It includes a second single rail connected to a rail that is relatively far from the first rail among the two rails of the second rail section, and The above rail shuttle unit includes first and second inner rail units disposed on the inside and first and second outer rail units disposed on the outside, and The step of connecting the above rail shuttle part to the above second rail part is The method includes the step of connecting the second outer rail portion of the rail shuttle portion to the second front rail portion of the second rail portion, and connecting the second single rail to the second rear rail portion of the second rail portion. The step of the rail shuttle returning to a position connected to the first rail section again is A method for mounting a component, comprising the step of connecting a first outer rail portion of the rail shuttle portion to a first rear rail portion of the first rail portion, and connecting a first single rail to a first front rail portion of the first rail portion.

12. In Paragraph 7, It includes a second single rail connected to a rail that is relatively far from the first rail among the two rails of the second rail section, and The above rail shuttle unit includes a first inner rail unit positioned at the front and a second inner rail unit and a second outer rail unit positioned at the rear, and The step of connecting the above rail shuttle part to the above second rail part is The method includes the step of connecting the second outer rail portion of the rail shuttle portion to the second front rail portion of the second rail portion, and connecting the second single rail to the second rear rail portion of the second rail portion. The step of the rail shuttle returning to a position connected to the first rail section again is A method for mounting a component, comprising the step of connecting a first inner rail portion of the rail shuttle portion to a first front rail portion of the first rail portion, and connecting a second inner rail portion of the rail shuttle portion to a first rear rail portion of the first rail portion.

Images