Light-emitting device and display apparatus
By designing the bracket and encapsulating adhesive layer to adjust the light emission angle of the light-emitting chip, the problem of color shift in the display device at different angles was solved, resulting in a better user viewing experience.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD
- Filing Date
- 2024-11-07
- Publication Date
- 2026-05-15
AI Technical Summary
Existing display devices suffer from significant color distortion when viewed from different angles due to the large differences in the light emission angles of the light-emitting chips in different directions, resulting in a degraded viewing experience for users.
Design a light-emitting device including a bracket, a first light-emitting chip and two second light-emitting chips. The light emission angle of the chips is adjusted by the encapsulation adhesive layer so that the difference in light emission angle in different directions is small. The emission direction of light is adjusted by the difference in refractive index between the shell and the encapsulation adhesive layer.
It reduces color shift when the display device is viewed from different angles, thus improving the user's viewing experience.
Smart Images
Figure CN2024130534_15052026_PF_FP_ABST
Abstract
Description
Light-emitting devices and display devices Technical Field
[0001] This application relates to the field of light-emitting electronic components technology, such as a light-emitting device and a display device. Background Technology
[0002] In related technologies, in order for a display device to display color images, the display device typically includes a circuit board and multiple sets of light-emitting chips arrayed on the circuit board, and the multiple sets of light-emitting chips include at least three types of light-emitting chips arranged in sequence, which are respectively configured to emit red light, green light and blue light.
[0003] However, existing display devices often suffer from significant differences in the light emission angle of the light-emitting chips in different directions, which leads to large color deviations in the displayed image when facing different angles, resulting in a degraded viewing experience for users.
[0004] Summary of the Invention
[0005] This application provides a light-emitting device with minimal difference in light emission angles in different directions.
[0006] This application provides a display device that, by using the aforementioned light-emitting device, can reduce color shift of the image when the display device is oriented at different angles, thereby improving the user's viewing experience.
[0007] In a first aspect, embodiments of this application provide a light-emitting device, comprising: a support, the support including a lead frame and a housing, the housing having a cup-shaped space with an opening on one side, the lead frame being partially located at the bottom of the cup-shaped space; a first light-emitting chip, the first light-emitting chip being disposed at the bottom of the cup-shaped space and electrically connected to the lead frame; two second light-emitting chips, both of the two second light-emitting chips being disposed at the bottom of the cup-shaped space and electrically connected to the lead frame, the two second light-emitting chips being respectively located on two opposite sides of the first light-emitting chip along a first direction; and an encapsulating adhesive layer, the encapsulating adhesive layer covering the first light-emitting chip and the second light-emitting chips and filling at least a portion of the cup-shaped space; the light emission angle θ11 of the first light-emitting chip in the first direction and the light emission angle θ12 in the second direction satisfying: -5°≤θ11-θ12≤5°; the light emission angle θ21 of at least one second light-emitting chip in the first direction and the light emission angle θ22 in the second direction satisfying: θ21<θ22; wherein, the first direction and the second direction are perpendicular, and both the first direction and the second direction are parallel to the bottom surface of the cup of the housing.
[0008] Secondly, embodiments of this application provide a display device, including a circuit board and a plurality of light-emitting devices as described in the first aspect above, wherein the plurality of light-emitting devices are spaced apart and disposed on the same side of the circuit board. Attached Figure Description
[0009] Figure 1 is a schematic diagram of the structure of the light-emitting device described in the embodiment.
[0010] Figure 2 is a top view of the bracket, the first light-emitting chip, and the second light-emitting chip described in the embodiment.
[0011] Figure 3 shows the light intensity distribution curves of the first light-emitting chip in the first and second directions in the embodiment.
[0012] Figure 4 shows the light intensity distribution curves of the second light-emitting chip in the first and second directions in the embodiment.
[0013] Figure 5 is a graph showing the light intensity distribution curve of the light-emitting device in the first direction as described in the embodiment.
[0014] Figure 6 is a first-direction light intensity distribution curve of the light-emitting device described in the embodiment (when black filler particles are disposed in the encapsulation adhesive layer).
[0015] Figure 7 is a schematic diagram of the structure of the display device described in the embodiment.
[0016] In the diagram: 100, Display device; 1, Light-emitting device; 10, Support; 101, Lead frame; 1010, Pad; 1011, Pin; 102, Housing; 102a, Cup bottom surface; 103, Cup-shaped space; 11, First light-emitting chip; 12, Second light-emitting chip; 13, Encapsulating adhesive layer; 14, Black filler particles; 15, Matte filler particles; 16, Diffuse filler particles; 2, Circuit board. Detailed Implementation
[0017] The technical solutions of the embodiments of this application will now be described with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0018] In the description of this application, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the meaning of the above terms in this application according to the circumstances.
[0019] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the horizontal height of the first feature is higher than the horizontal height of the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the horizontal height of the first feature is lower than the horizontal height of the second feature.
[0020] As shown in Figures 1 to 4, this application provides a light-emitting device 1, including a support 10, a first light-emitting chip 11, two second light-emitting chips 12, and an encapsulating adhesive layer 13. The support 10 includes a lead frame 101 and a housing 102. The housing 102 has a cup-shaped space 103 with an opening on one side. A portion of the lead frame 101 is located at the bottom of the cup-shaped space 103 (i.e., the portion of the cup-shaped space 103 away from its opening). The first light-emitting chip 11 is disposed at the bottom of the cup-shaped space 103 and electrically connected to the lead frame 101. Both second light-emitting chips 12 are disposed at the bottom of the cup-shaped space 103 and electrically connected to the lead frame 101. The two second light-emitting chips 12 are respectively located on two opposite sides of the first light-emitting chip 11 along a first direction S1. The encapsulating adhesive layer 13 covers the first light-emitting chip 11 and the second light-emitting chips 12. The light-emitting chip 12 fills at least part of the cup-shaped space 103. The light emission angle θ11 of the first light-emitting chip 11 in the first direction S1 and the light emission angle θ12 in the second direction S2 satisfy: -5°≤θ11-θ12≤5°. The light emission angle θ21 of at least one second light-emitting chip 12 in the first direction S1 and the light emission angle θ22 in the second direction S2 satisfy: θ21<θ22. The first direction S1 and the second direction S2 are perpendicular to each other, and both the first direction S1 and the second direction S2 are parallel to the bottom surface 102a of the cup of the housing 102 (i.e., the surface of the cup-shaped space 103 away from its own opening).
[0021] By including a support 10, a first light-emitting chip 11, two second light-emitting chips 12, and an encapsulating layer 13 in the light-emitting device 1, and placing both the first light-emitting chip 11 and the second light-emitting chip 12 within the cup-shaped space 103, and placing the two second light-emitting chips 12 on opposite sides of the first light-emitting chip 11 along the first direction S1, the shielding effect of the housing 102, combined with the fact that the refractive index of the encapsulating layer 13 cannot be exactly the same as the refractive index of air, allows the light emitted by the light-emitting chips (i.e., the first light-emitting chip 11 and the second light-emitting chip 12) at the interface between the encapsulating layer 13 and the external space to be refracted, the light-emitting angles of the three light-emitting chips can be adjusted, so that at least the difference in the light-emitting angle of the first light-emitting chip 11 in different directions is small. The light emission angle θ11 of the first light-emitting chip 11 in the first direction S1 and the light emission angle θ12 in the second direction S2 satisfy: -5°≤θ11-θ12≤5°. For example, θ11-θ12 can be -5°, -4.5°, -4°, -3.5°, -3°, -2.5°, -2°, -1.5°, -1°, -0.5°, 0°, 0.5°, 1°, 1.5°, 2°, 2.5°, 3°, 3.5°, 4°, 4.5°, or 5°, etc.
[0022] Furthermore, by ensuring that the light emission angle θ21 of at least one second light-emitting chip 12 in the first direction S1 and the light emission angle θ22 in the second direction S2 satisfy θ21 < θ22, the color deviation direction of the second light-emitting chip 12 is stabilized, which facilitates the evaluation and adjustment of the large-angle light emission effect of the second light-emitting chip 12, and helps to adjust the difference in light emission angle of the second light-emitting chip 12 in different directions to a smaller range.
[0023] The light emission angle θ11 of the first light-emitting chip 11 in the first direction S1 is the angle difference between two points in the light intensity distribution curve obtained by detecting the light emitted by the first light-emitting chip 11 on a plane that is parallel to the first direction S1, perpendicular to the bottom surface 102a of the housing 102, and passes through the center point of the first light-emitting chip 11, where the light intensity is 50% of the peak value of the light intensity distribution curve (i.e., at a relative light intensity of 0.5).
[0024] The light emission angle θ12 of the first light-emitting chip 11 in the second direction S2 is the angle difference between two points in the light intensity distribution curve obtained by detecting the light emitted by the first light-emitting chip 11 on a plane that is parallel to the second direction S2, perpendicular to the bottom surface 102a of the housing 102, and passes through the center point of the first light-emitting chip 11. As shown in Figure 3, Figure 3 exemplarily shows a light intensity distribution curve of the first light-emitting chip 11 in the first direction S1 and the second direction S2. The solid line shows the light emission angle curve of the first light-emitting chip 11 in the first direction S1, and the dashed line shows the light emission angle curve of the first light-emitting chip 11 in the second direction S2.
[0025] The light emission angle θ21 of the second light-emitting chip 12 in the first direction S1 is the angle difference between two points in the light intensity distribution curve obtained by detecting the light emitted by the second light-emitting chip 12 on a plane that is parallel to the first direction S1, perpendicular to the bottom surface 102a of the housing 102, and passes through the center point of the second light-emitting chip 12, where the light intensity is 50% of the peak value of the light intensity distribution curve.
[0026] The light emission angle θ22 of the second light-emitting chip 12 in the second direction S2 is the angle difference between two points in the light intensity distribution curve obtained by detecting the light emitted by the second light-emitting chip 12 on a plane that is parallel to the second direction S2, perpendicular to the bottom surface 102a of the housing 102, and passes through the center point of the second light-emitting chip 12. As shown in Figure 4, Figure 4 exemplarily shows a light intensity distribution curve of the second light-emitting chip 12 in the first direction S1 and the second direction S2. The light emission angle curve of the second light-emitting chip 12 in the first direction S1 is shown by a solid line, and the light emission angle curve of the second light-emitting chip 12 in the second direction S2 is shown by a dashed line.
[0027] Furthermore, it should be noted that in Figures 3 and 4, and subsequently Figures 5 and 6, the light intensity data of multiple light-emitting chips have been normalized. That is, the distribution variation of light intensity is described by the relative values of light intensity at multiple angles and the peak light intensity. Therefore, it can be understood that when the light intensity is the peak value of the light intensity distribution curve, the relative light intensity is 1, and when the light intensity is 50% of the peak value of the light intensity distribution curve, the relative light intensity is 0.5.
[0028] To further reduce the difference in light emission angles of the first light-emitting chip 11 in different directions, optionally, the light emission angle θ11 of the first light-emitting chip 11 in the first direction S1 and the light emission angle θ12 in the second direction S2 satisfy: -2°≤θ11-θ12≤2°. For example, θ11-θ12 can be -2°, -1.9°, -1.8°, -1.7°, -1.6°, -1.5°, -1.4°, -1.3°, -1.2°, or -1°. 1°, -1°, -0.9°, -0.8°, -0.7°, -0.6°, -0.5°, -0.4°, -0.3°, -0.2°, -0.1°, 0°, 0.1°, 0.2°, 0.3°, 0.4°, 0.5°, 0.6°, 0.7°, 0.8°, 0.9°, 1°, 1.1°, 1.2°, 1.3°, 1.4°, 1.5°, 1.6°, 1.7°, 1.8°, 1.9°, or 2°, etc.
[0029] Optionally, the light emission angle θ11 of the first light-emitting chip 11 in the first direction S1 and the light emission angle θ12 in the second direction S2 can both be relatively large, so that the light emission effect of the first light-emitting chip 11 in the large-angle light emission direction is also better. For example, the light emission angle θ11 of the first light-emitting chip 11 in the first direction S1 can satisfy: 110°≤θ11≤130°, for example, the light emission angle θ11 can be 110°, 112°, 115°, 117°, 120°, 122°, 125°, 127° or 130°, etc., and the light emission angle θ12 of the first light-emitting chip 11 in the second direction S2 can satisfy: 110°≤θ12≤130°, for example, the light emission angle θ12 can be 110°, 112°, 115°, 117°, 120°, 122°, 125°, 127° or 130°, etc.
[0030] Optionally, the difference between the light emission angle θ21 of the second light-emitting chip 12 in the first direction S1 and the light emission angle θ22 in the second direction S2 can satisfy: 2°≤θ22-θ21≤10°. For example, θ22-θ21 can be 2°, 3°, 4°, 5°, 6°, 7°, 8°, 9° or 10°, so that the difference in light emission angle of the second light-emitting chip 12 in different directions is small.
[0031] The difference in light emission angle of the second light-emitting chip 12 in different directions can be further reduced by adjusting the structural settings such as the encapsulation adhesive layer 13 and the housing 102, so that the difference between the light emission angle θ21 of the second light-emitting chip 12 in the first direction S1 and the light emission angle θ22 in the second direction S2 can satisfy: 2°≤θ22-θ21≤6°. For example, θ22-θ21 can be 2°, 2.5°, 3°, 3.5°, 4°, 4.5°, 5°, 5.5°, or 6°, etc.
[0032] Optionally, the light emission angle θ21 of the second light-emitting chip 12 in the first direction S1 and the light emission angle θ22 in the second direction S2 can both be relatively large, so that the light emission effect of the second light-emitting chip 12 in the large-angle light emission direction is also better. For example, the light emission angle θ21 of the second light-emitting chip 12 in the first direction S1 can satisfy: 110°≤θ21≤135°. For example, the light emission angle θ21 can be 110°, 112°, 115°, 117°, 120°, 122°, 125°, 127°, 130°, 132° or 135°, etc., and the light emission angle θ22 of the second light-emitting chip 12 in the second direction S2 can satisfy: 110°≤θ22≤135°. For example, the light emission angle θ22 can be 110°, 112°, 115°, 117°, 120°, 122°, 125°, 127°, 130°, 132° or 135°, etc.
[0033] Alternatively, the light emission angle θ11 of the first light-emitting chip 11 in the first direction S1 may be greater than the light emission angle θ21 of at least one second light-emitting chip 12 in the first direction S1, so that the light emission angle that the first light-emitting chip 11 can emit in the first direction is larger, thereby compensating for the offset between the first light-emitting chip 11 and the second light-emitting chip 12 in the first direction, and improving the overall light emission effect of the light-emitting device 1 at different angles.
[0034] Alternatively, the light emission angle θ12 of the first light-emitting chip 11 in the second direction S2 may be greater than the light emission angle θ22 of at least one second light-emitting chip 12 in the second direction S2, so that at least the first light-emitting chip 11 has a better light emission effect at a large angle, thereby making the overall light emission effect of the light-emitting device 1 better.
[0035] Alternatively, the light emission angle θ11 of the first light-emitting chip 11 in the first direction S1 can be greater than the light emission angle θ21 of at least one second light-emitting chip 12 in the first direction S1, and the light emission angle θ12 of the first light-emitting chip 11 in the second direction S2 can be greater than the light emission angle θ22 of at least one second light-emitting chip 12 in the second direction S2, so as to improve the overall light emission effect of the light-emitting device 1.
[0036] Since the two second light-emitting chips 12 are respectively located on opposite sides of the first light-emitting chip 11 along the first direction S1, the light emitted by the second light-emitting chip 12 will inevitably be offset relative to the light emitted by the first light-emitting chip 11 in the overall light emission effect of the light-emitting device 1. That is, when the light emission intensity of the light-emitting device 1 is measured, the light intensity distribution curve of the second light-emitting chip 12 will be offset relative to the light intensity distribution curve of the first light-emitting chip 11. Next, the light emission curves of the first light-emitting chip 11 and the second light-emitting chip 12 measured when the light emission intensity of the light-emitting device 1 is measured will be introduced in conjunction with the attached figures.
[0037] Please refer to Figures 1, 2 and 5 together. Optionally, the positive light emission directions of the two second light-emitting chips 12 in the first direction S1 are respectively offset from the positive light emission direction of the first light-emitting chip 11 in the first direction S1 along two opposite sides of the first direction S1. The positive light emission direction of the first light-emitting chip 11 and the positive light emission direction of the second light-emitting chip 12 in the first direction S1 are respectively the light emission angle directions corresponding to the peak points (i.e., the relative light intensity of 1.0) of the light intensity distribution curves of the first light-emitting chip 11 and the second light-emitting chip 12 in the first direction S1, which are parallel to the first direction S1, perpendicular to the bottom surface 102a of the housing 102 and passing through the center point of the first light-emitting chip 11. As shown in Figure 5, Figure 5 exemplarily shows a light intensity distribution curve obtained by detecting the light intensity of the entire light-emitting device 1 in the first direction S1. It can be observed that the positive light emission direction of the first light-emitting chip 11 in the first direction S1 is approximately 0°, and the positive light emission directions of the two second light-emitting chips 12 in the first direction S1 are approximately -12° and 6°, respectively.
[0038] Optionally, the light emission angle curves of the two second light-emitting chips 12 are not symmetrical in the first direction S1, so that the light emission color deviation of the two opposite sides of the light-emitting device 1 in the first direction S1 is different. In other words, the light emission color deviation of at least one side of the light-emitting device 1 in the first direction S1 is smaller.
[0039] Understandably, in the light intensity distribution curve, the positive or negative value of the angle only indicates that the angle is located on one side or the other side of the first direction S1 along the 0° angle. That is, the positive or negative value only indicates the direction of the angle, not the magnitude of the angle.
[0040] Optionally, the absolute value of the offset angle between the positive light emission direction of the second light-emitting chip 12 and the positive light emission direction of the first light-emitting chip 11 in the first direction S1 is θ3, where 5°≤θ3≤20°. For example, the absolute value of the offset angle θ3 can be 5°, 6°, 7°, 8°, 9°, 10°, 12°, 14°, 15°, 16°, 18°, or 20°, so that the offset angle between the positive light emission direction of the second light-emitting chip 12 and the first light-emitting chip 11 in the first direction S1 is small, thereby reducing the overall light emission effect of the light-emitting device 1 at different angles.
[0041] Optionally, the maximum light emission direction of the two second light-emitting chips 12 on one side of the first direction S1 is offset relative to the maximum light emission direction of the first light-emitting chip 11 on the same side of the first direction S1 along two opposite sides of the first direction S1. Since the maximum light emission direction of the light-emitting chips in the first direction S1 consists of two different opposite directions along the first direction S1, the comparison of the offset is based on the maximum light emission directions of the two second light-emitting chips 12 and one first light-emitting chip 11 along the same side of the first direction S1. The maximum light emission direction of the first light-emitting chip 11 and the maximum light emission direction of the second light-emitting chip 12 in the first direction S1 are respectively determined by detecting the overall luminous intensity of the light-emitting device 1 on a plane parallel to the first direction S1, perpendicular to the bottom surface 102a of the housing 102, and passing through the center point of the first light-emitting chip 11. The light emission angle direction corresponding to the point where the light intensity is 50% of the peak value of the light intensity distribution curve (i.e., at a relative light intensity of 0.5) in the detected light intensity distribution curves of the first light-emitting chip 11 and the second light-emitting chip 12 is shown in Figure 5. As shown in Figure 5, a light intensity distribution curve obtained by detecting the light intensity of the entire light-emitting device 1 in the first direction S1 is exemplarily shown. It can be observed that the two maximum light emission directions of the first light-emitting chip 11 in the first direction S1 are approximately -64° and 60°, respectively. Of the two second light-emitting chips 12, one has two maximum light emission directions in the first direction S1 that are approximately -67° and 52°, respectively, and the other has two maximum light emission directions in the first direction S1 that are approximately -60° and 64°, respectively.
[0042] Optionally, the absolute value of the offset angle between the maximum light emission direction of the second light-emitting chip 12 on one side of the first direction S1 and the maximum light emission direction of the first light-emitting chip 11 on the same side of the first direction S1 is θ4, where 2°≤θ4≤10°. For example, the absolute value of the offset angle θ4 can be 2°, 3°, 4°, 5°, 6°, 7°, 8°, 9°, or 10°, etc., so that the offset angle between the maximum light emission direction of the second light-emitting chip 12 and the first light-emitting chip 11 on the same side of the first direction S1 is small, thereby reducing the overall light emission effect of the light-emitting device 1 at different angles.
[0043] Optionally, the absolute value of the offset angle of the maximum light emission direction of the second light-emitting chip 12 on one side of the first direction S1 relative to the maximum light emission direction of the first light-emitting chip 11 on the same side of the first direction S1 is θ41, and the absolute value of the offset angle of the maximum light emission direction of the second light-emitting chip 12 on the other side of the first direction S1 relative to the maximum light emission direction of the first light-emitting chip 11 on the other side of the first direction S1 is θ42. The absolute values of the offset angles θ41 and θ42 of the two second light-emitting chips 12 both satisfy: θ41≤θ42. Therefore, the offset angles of the two second light-emitting chips 12 relative to the first light-emitting chip 11 on the same side of the first direction S1 are both relatively small, which can improve the consistency of the light emission effect of the light-emitting device 1 at different angles on that side of the first direction S1.
[0044] In other embodiments, the absolute values of the offset angles θ41 and θ42 of one of the two second light-emitting chips 12 may satisfy: θ41 < θ42, and the absolute values of the offset angles θ41 and θ42 of the other may satisfy: θ41 > θ42.
[0045] In order to make the light-emitting device 1 have a better light emission effect and a higher light emission brightness, the first light-emitting chip 11 is usually a green light chip, and one of the two second light-emitting chips 12 is a red light chip and the other is a blue light chip.
[0046] Optionally, when the power of the red light chip is in the range of 27mW to 37.5mW, the power of the green light chip is in the range of 16.8mW to 26.4mW, and the power of the blue light chip is in the range of 10.5mW to 16.5mW, the detected luminous intensity of the green light chip is I1, the luminous intensity of the red light chip is I2, and the luminous intensity of the blue light chip is I3, where I1 > I2 > I3. Therefore, the energy consumption of the green light chip, red light chip, and blue light chip is low during normal use, and the luminous intensity can meet the usage and design requirements.
[0047] Optionally, black filler particles 14 are provided in the encapsulating adhesive layer 13, so that the encapsulating adhesive layer 13 is black or dark in color, so that the contrast between the encapsulating adhesive layer 13 and the light emitted by the first light-emitting chip 11 and the second light-emitting chip 12 is greater, thereby improving the display contrast of the light-emitting device 1.
[0048] At this point, please refer to Figure 6, which exemplarily shows a light intensity distribution curve obtained by detecting the light intensity of the entire light-emitting device 1 with black filling particles 14 disposed in the encapsulating adhesive layer 13 in the first direction S1. It can be observed that the positive light emission direction of the first light-emitting chip 11 in the first direction S1 is approximately 0°, the positive light emission directions of the two second light-emitting chips 12 in the first direction S1 are approximately -13° and 7°, respectively, the two maximum light emission directions of the first light-emitting chip 11 in the first direction S1 are approximately -61° and 50°, respectively, and of the two second light-emitting chips 12, one has two maximum light emission directions in the first direction S1 that are approximately -66° and 58°, respectively, and the other has two maximum light emission directions in the first direction S1 that are approximately -57° and 65°, respectively.
[0049] Please refer to Figures 1 and 2 together. Optionally, the black filler particles 14 include, but are not limited to, at least one of amorphous carbon powder and black metal oxides, to ensure that the black filler particles 14 are black and have good material stability, making them suitable for filling within the encapsulation layer 13 and unlikely to affect the lifespan of the first light-emitting chip 11 and the second light-emitting chip 12. Optionally, the black metal oxides include, but are not limited to, manganese oxides and copper oxides. The elements included in the black filler particles 14 can be determined by EDS (Energy Dispersive Spectroscopy) detection of the encapsulation layer 13 filled with black filler particles 14.
[0050] The larger the specific surface area of the black filler particles 14, the better the connection stability between the black filler particles 14 and the encapsulating adhesive layer 13. However, the stronger the light absorption capacity of the black filler particles 14, the greater the impact on the overall luminous brightness of the light-emitting device 1. Therefore, the specific surface area of the black filler particles 14 should not be too large. Based on this, the specific surface area of the black filler particles 14 can optionally be in the range of 60(m^2) / g to 85(m^2) / g. For example, the specific surface area of the black filler particles 14 can be 60(m^2) / g, 62(m^2) / g, 65(m^2) / g, 68(m^2) / g, 70(m^2) / g, 72(m^2) / g, 75(m^2) / g, 78(m^2) / g, 80(m^2) / g, 82(m^2) / g, or 85(m^2) / g, etc.
[0051] Because the smaller the particle size of the black filler particles 14, the easier it is to achieve a more uniform light absorption effect when the black filler particles 14 are placed in the encapsulating adhesive layer 13, avoiding the appearance of excessively dark shadows in some areas of the encapsulating adhesive layer 13. As a result, the light emission effect of the light emitted by the light-emitting device 1 at different angles is also better. However, if the particle size of the black filler particles 14 is too small, the manufacturing difficulty of the black filler particles 14 will increase significantly, which will lead to a higher cost for the black filler particles 14. Therefore, the particle size of the black filler particles 14 cannot be too small. Based on this, the particle size of the black filler particles 14 can optionally be in the range of 10nm to 200nm. For example, the particle size of the black filler particles 14 can be: 10nm, 20nm, 30nm, 50nm, 70nm, 100nm, 120nm, 150nm, 180nm or 200nm, etc.
[0052] Optionally, the encapsulating adhesive layer 13 may also contain matte filler particles 15 to reduce the reflectivity of the encapsulating adhesive layer 13 to external light, giving the encapsulating adhesive layer 13 a matte appearance, thereby reducing the impact of external light on the light emission effect of the light-emitting device 1; or, the encapsulating adhesive layer 13 may also contain diffuse filler particles 16 to improve the mixing uniformity of the light emitted by the first light-emitting chip 11 and the second light-emitting chip 12 within the encapsulating adhesive layer 13, thereby further improving the consistency of the light emission effect of the light emitted by the light-emitting device 1 at different angles; or, the encapsulating adhesive layer 13 may also contain matte filler particles 15 and diffuse filler particles 16 to reduce the impact of external light on the light emission effect of the light-emitting device 1 while further improving the consistency of the light emission effect of the light emitted by the light-emitting device 1 at different angles.
[0053] When the encapsulating adhesive layer 13 also contains matting filler particles 15, optionally, the matting filler particles 15 are white oxides including but not limited to titanium, magnesium, zirconium, and silicon, thus the matting filler particles 15 have good material stability. The elements included in the matting filler particles 15 can be measured by EDS (Energy Dispersive Spectroscopy) to detect the encapsulating adhesive layer 13 filled with matting filler particles 15.
[0054] Since a smaller particle size of the matting filler particles 15 results in a better matting effect and a lower light reflection capability, a smaller particle size is generally better. However, excessively small particle sizes significantly increase the manufacturing difficulty of the matting filler particles 15, leading to higher costs. Therefore, the particle size of the matting filler particles 15 is crucial. The particle size should not be too small. Therefore, the particle size of the matting filler particles 15 can optionally be in the range of 0.8 μm to 8 μm. For example, the particle size of the matting filler particles 15 can be 0.8 μm, 1 μm, 1.2 μm, 1.5 μm, 1.8 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm, 5 μm, 5.5 μm, 6 μm, 6.5 μm, 7 μm, 7.5 μm or 8 μm, etc.
[0055] Optionally, on the cross-section of the encapsulating adhesive layer 13 obtained by cutting a plane perpendicular to the cup bottom surface 102a of the housing 102, the matte filler particles 15 are evenly distributed, so that the matte position distribution of the matte filler particles 15 is more even, and the appearance of the encapsulating adhesive layer 13 can present a more uniform matte effect.
[0056] When the encapsulating adhesive layer 13 also contains light-scattering filler particles 16, optionally, the light-scattering filler particles 16 are white oxides containing elements including but not limited to titanium, magnesium, zirconium, and silicon, thus the material stability of the light-scattering filler particles 16 is good. The elements included in the light-scattering filler particles 16 can be measured by EDS (Energy Dispersive Spectroscopy) to detect the encapsulating adhesive layer 13 filled with light-scattering filler particles 16.
[0057] Since a larger particle size of the light-scattering filler particle 16 results in better light reflection and a better light-scattering effect, a larger particle size of the light-scattering filler particle 16 is better. However, if the particle size of the light-scattering filler particle 16 is too large, it will lead to excessive light blocking by a single light-scattering filler particle 16, which will reduce the uniformity of the light emission effect of the light-emitting device 1. Therefore, the particle size of the light-scattering filler particle 16 should not be too large. Based on this, the particle size of the light-scattering filler particle 16 can optionally be in the range of 4μm to 15μm. For example, the particle size of the light-scattering filler particle 16 can be 4μm, 5μm, 6μm, 7μm, 8μm, 9μm, 10μm, 11μm, 12μm, 13μm, 14μm or 15μm, etc.
[0058] Optionally, on the cross-section of the encapsulating adhesive layer 13 cut by a plane perpendicular to the cup bottom surface 102a of the housing 102, the light-scattering filling particles 16 are evenly distributed, so that the light-scattering position distribution of the light-scattering filling particles 16 is more even, which can make the light emitted through the encapsulating adhesive layer 13 more consistent in different directions.
[0059] Furthermore, when the encapsulating adhesive layer 13 contains black filler particles 14 and at least one of matte filler particles 15 and diffuse filler particles 16, the larger the specific surface area and the smaller the particle size of the black filler particles 14, the easier it is for the black filler particles 14 to adhere to other filler particles (i.e., at least one of matte filler particles 15 and diffuse filler particles 16), thereby weakening the white appearance of the other filler particles and making the color of the encapsulating adhesive layer 13 gray, so as to improve the display contrast of the light-emitting device 1.
[0060] When the encapsulating adhesive layer 13 contains black filler particles 14, or when it contains black filler particles 14 and at least one of matte filler particles 15 and diffuse filler particles 16, since some of the filler particles are located close to the surface of the encapsulating adhesive layer 13 away from the lead frame 101, these filler particles can affect the surface shape of the encapsulating adhesive layer 13 away from the lead frame 101, resulting in an uneven microstructure on the surface of the encapsulating adhesive layer 13 away from the lead frame 101. Optionally, the surface of the encapsulating adhesive layer 13 away from the lead frame 101 has a roughness Ra of 0.5 μm ≤ Ra ≤ 2.0 μm. For example, the roughness Ra of the surface of the encapsulating adhesive layer 13 away from the lead frame 101 can be 0.5 μm, 0.6 μm, 0.7 μm, 0.8 μm, 0.9 μm, 1 μm, 1.1 μm, 1.2 μm, 1.3 μm, 1.4 μm, 1.5 μm, 1.6 μm, 1.7 μm, 1.8 μm, 1.9 μm, or 2 μm, etc. This uneven microstructure helps to further present a matte appearance on the surface of the encapsulating adhesive layer 13 away from the lead frame 101, while having a smaller impact on the light emitted from the encapsulating adhesive layer 13, and can maintain a good level of consistency of the light emitted from the encapsulating adhesive layer 13 in different directions.
[0061] Optionally, the surface of the encapsulating adhesive layer 13 away from the lead frame 101 is a curved surface that protrudes in the direction away from the lead frame 101. This allows the encapsulating adhesive layer 13 to act as a convex lens, further diffusing the light emitted by the first light-emitting chip 11 and the second light-emitting chip 12, thereby further enhancing the light intensity emitted by the light-emitting device 1 at large angles.
[0062] Along the direction perpendicular to the bottom surface 102a of the housing 102, the cup-shaped space 103 has a maximum height h1, and the encapsulating adhesive layer 13 has a maximum height h2. The higher the top of the encapsulating adhesive layer 13 protrudes from the housing 102, i.e., the greater h2 is than h1, the greater the curvature of the surface of the encapsulating adhesive layer 13 away from the lead frame 101. The surface of the encapsulating adhesive layer 13 away from the lead frame 101 has a greater curvature than the first light-emitting chip 11 and the second light-emitting chip 12. The better the light diffusion effect, the larger the space occupied by the encapsulating adhesive layer 13. When the light-emitting device 1 is hit, the greater the impact force on the encapsulating adhesive layer 13, the easier it is for the encapsulating adhesive layer 13 to detach from the substrate due to the impact. Therefore, h2 cannot be too large than h1. Based on this, the maximum height h1 of the cup-shaped space 103 and the maximum height h2 of the encapsulating adhesive layer 13 can optionally satisfy: h1≤h2≤1.15h1. For example, h2 can be: h1, 1.01h1, 1.02h1, 1.03h1, 1.04h1, 1.05h1, 1.06h1, 1.07h1, 1.08h1, 1.09h1, 1.1h1, 1.11h1, 1.12h1, 1.13h1, 1.14h1 or 1.15h1, etc.
[0063] The lead frame 101 is a conductive structure for electrically connecting the light-emitting chip to an external control circuit. Optionally, the support 10 also includes a pad 1010 and a pin 1011. The pad 1010 is at least partially located at the bottom of the cup-shaped space 103. The first end of the pin 1011 is electrically connected to the pad 1010, and the other end of the pin 1011 extends from the side of the housing 102 and is attached to the bottom of the housing 102 away from the opening of the cup-shaped space 103, so that the part of the pin 1011 extending out of the housing 102 can be electrically connected to the external control circuit. In other words, the first light-emitting chip 11 and the second light-emitting chip 12 included in the light-emitting device 1 can be electrically connected to the external control circuit in sequence through the pad 1010 and the pin 1011, so that the first light-emitting chip 11 and the second light-emitting chip 12 can be controlled to light up and turn off by the external control circuit.
[0064] The bracket 10 may include multiple pins 1011. The multiple pins 1011 may be configured to be electrically connected to the first light-emitting chip 11 and the two second light-emitting chips 12 respectively, so that the first light-emitting chip 11 and the two second light-emitting chips 12 can be electrically connected to an external control circuit respectively. Alternatively, the multiple pins 1011 may be configured to connect at least two of the first light-emitting chip 11 and the two second light-emitting chips 12 in series, so that the first light-emitting chip 11 and the two second light-emitting chips 12 can be electrically connected to an external control circuit together.
[0065] It is understood that the number of pins 1011 included in the bracket 10 can be selected according to the usage and design requirements, and this embodiment does not limit it.
[0066] As shown in Figure 7, this application also provides a display device 100, including a circuit board 2 and a plurality of light-emitting devices 1 as described in the foregoing technical solutions. The plurality of light-emitting devices 1 are spaced apart on the same side of the circuit board 2. By using the aforementioned light-emitting devices 1 with small differences in light emission angles in different directions, the color shift of the display device 100 when it is displayed at different angles can be reduced, thereby improving the user's viewing experience.
[0067] In the description herein, it should be understood that the terms "upper," "lower," "left," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings, and are used only for ease of description and simplification of operation. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used merely for descriptive distinction and have no special meaning.
[0068] In the description of this specification, references to terms such as "an embodiment," "example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.
[0069] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in multiple embodiments can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
Claims
1. A light-emitting device, comprising: A support, comprising a lead frame and a housing, the housing having a cup-shaped space with an opening on one side, the lead frame portion being located at the bottom of the cup-shaped space; A first light-emitting chip is disposed at the bottom of the cup-shaped space and electrically connected to the lead frame; Two second light-emitting chips are disposed at the bottom of the cup-shaped space and electrically connected to the lead frame. The two second light-emitting chips are respectively located on two opposite sides of the first light-emitting chip along a first direction; and... An encapsulating adhesive layer covers the first light-emitting chip and the second light-emitting chip and fills at least a portion of the cup-shaped space; The light emission angle θ11 of the first light-emitting chip in the first direction and the light emission angle θ12 in the second direction satisfy: -5°≤θ11-θ12≤5°; At least one of the second light-emitting chips has a light emission angle θ21 in the first direction and a light emission angle θ22 in the second direction that satisfies: θ21 < θ22; Wherein, the first direction is perpendicular to the second direction, and both the first direction and the second direction are parallel to the bottom surface of the shell.
2. The light-emitting device according to claim 1, wherein, 2°≤θ22-θ21≤10°.
3. The light-emitting device according to claim 1, wherein, The light emission angle θ11 of the first light-emitting chip in the first direction is greater than the light emission angle θ21 of at least one of the second light-emitting chips in the first direction; or, The light emission angle θ12 of the first light-emitting chip in the second direction is greater than the light emission angle θ22 of at least one of the second light-emitting chips in the second direction; or, The light emission angle θ11 of the first light-emitting chip in the first direction is greater than at least the light emission angle θ21 of the second light-emitting chip in the first direction, and the light emission angle θ12 of the first light-emitting chip in the second direction is greater than at least the light emission angle θ22 of the second light-emitting chip in the second direction.
4. The light-emitting device according to claim 1, wherein, When the light intensity of the light-emitting device as a whole is detected, the positive light emission directions of the two second light-emitting chips in the first direction are respectively offset from the positive light emission direction of the first light-emitting chip in the first direction along two opposite sides of the first direction.
5. The light-emitting device according to claim 1, wherein, When the light intensity of the light-emitting device as a whole is detected, the absolute value of the offset angle of the positive light-emitting direction of the second light-emitting chip in the first direction relative to the positive light-emitting direction of the first light-emitting chip in the first direction is θ3, where 5°≤θ3≤20°.
6. The light-emitting device according to claim 1, wherein, When the light intensity of the light-emitting device as a whole is detected, the maximum light emission direction of the two second light-emitting chips on one side of the first direction is offset from the maximum light emission direction of the first light-emitting chip on the same side of the first direction along the two opposite sides of the first direction. Furthermore, the absolute value of the offset angle of the maximum light emission direction of the second light-emitting chip on one side of the first direction relative to the maximum light emission direction of the first light-emitting chip on the same side of the first direction is θ4, where 2°≤θ4≤10°.
7. The light-emitting device according to claim 1, wherein, When the light intensity of the light-emitting device as a whole is detected, the maximum light emission direction of the two second light-emitting chips in the first direction is offset from the maximum light emission direction of the first light-emitting chip in the first direction along two opposite sides of the first direction. The absolute value of the offset angle of the maximum light emission direction of the second light-emitting chip on one side of the first direction relative to the maximum light emission direction of the first light-emitting chip on one side of the first direction is θ41, and the absolute value of the offset angle of the maximum light emission direction of the second light-emitting chip on the other side of the first direction relative to the maximum light emission direction of the first light-emitting chip on the other side of the first direction is θ42. The absolute values of the offset angles θ41 and θ42 of at least one of the second light-emitting chips satisfy: θ41≤θ42.
8. The light-emitting device according to claim 1, wherein, The first light-emitting chip is a green light chip, and of the two second light-emitting chips, one is a red light chip and the other is a blue light chip; When the power of the red light chip is in the range of 27mW to 37.5mW, the power of the green light chip is in the range of 16.8mW to 26.4mW, and the power of the blue light chip is in the range of 10.5mW to 16.5mW, the luminous intensity of the green light chip is detected as I1, the luminous intensity of the red light chip is I2, and the luminous intensity of the blue light chip is I3. I1 > I2 > I3.
9. The light-emitting device according to any one of claims 1-8, wherein, When the light intensity of the light-emitting device as a whole is detected, the light emission angle curves of the two second light-emitting chips in the first direction are not symmetrical.
10. The light-emitting device according to any one of claims 1-8, wherein, The encapsulating adhesive layer contains black filler particles.
11. The light-emitting device according to claim 10, wherein, The black filler particles include, but are not limited to, at least one of amorphous carbon powder and black metal oxides.
12. The light-emitting device according to claim 11, wherein, The black metal oxides include, but are not limited to, oxides of manganese and oxides of copper.
13. The light-emitting device according to claim 10, wherein, The specific surface area of the black filler particles is in the range of 60(m^2) / g to 85(m^2) / g.
14. The light-emitting device according to claim 10, wherein, The encapsulating adhesive layer also contains at least one of matte filler particles and diffuse filler particles.
15. The light-emitting device according to claim 14, wherein, When the encapsulating adhesive layer further contains matting filler particles, the matting filler particles are white oxides, including but not limited to, titanium, magnesium, zirconium, and silicon elements; or, When the encapsulating adhesive layer further contains light-diffusing particles, the light-diffusing particles are, but are not limited to, white oxides of titanium, magnesium, zirconium, and silicon; or, When the encapsulating adhesive layer is further provided with matte filler particles and diffuse filler particles, the matte filler particles and diffuse filler particles are all white oxides of elements including but not limited to titanium, magnesium, zirconium and silicon.
16. The light-emitting device according to claim 14, wherein, When the encapsulating adhesive layer also contains matting filler particles, the particle size of the matting filler particles is in the range of 0.8 μm to 8 μm; or, When the encapsulating adhesive layer also contains light-scattering filler particles, the particle size of the light-scattering filler particles is in the range of 4μm to 15μm; or, When the encapsulating adhesive layer is further provided with matting filler particles and light-scattering filler particles, the particle size of the matting filler particles is in the range of 0.8μm to 8μm, and the particle size of the light-scattering filler particles is in the range of 4μm to 15μm.
17. The light-emitting device according to claim 14, wherein, When the encapsulating adhesive layer also contains matte filler particles, the matte filler particles are uniformly distributed on the cross-section of the encapsulating adhesive layer obtained by a plane perpendicular to the bottom surface of the shell; or, When the encapsulating adhesive layer also contains light-diffusing particles, the light-diffusing particles are uniformly distributed on the cross-section of the encapsulating adhesive layer obtained by a plane perpendicular to the bottom surface of the housing; or, When the encapsulating adhesive layer is further provided with matting filler particles and light-scattering filler particles, the matting filler particles and light-scattering filler particles are evenly distributed on the cross-section of the encapsulating adhesive layer obtained by cutting a plane perpendicular to the bottom surface of the cup of the shell.
18. The light-emitting device according to claim 10, wherein, The surface of the encapsulating adhesive layer away from the lead frame has a roughness Ra of 0.5 μm ≤ Ra ≤ 2.0 μm.
19. The light-emitting device according to any one of claims 1-8, wherein, The surface of the encapsulating adhesive layer away from the lead frame is an arc-shaped surface that bulges out in a direction away from the lead frame.
20. The light-emitting device according to claim 19, wherein, Along the direction perpendicular to the bottom surface of the cup of the housing, the cup-shaped space has a maximum height h1, and the encapsulating adhesive layer has a maximum height h2, where h1≤h2≤1.15h1.
21. The light-emitting device according to any one of claims 1-8, wherein, The lead frame includes pads and pins. The pads are at least partially located at the bottom of the cup-shaped space. One end of the pin is electrically connected to the pad, and the other end of the pin extends from the side of the housing and is snapped to the bottom of the housing opposite to the opening of the cup-shaped space.
22. A display device, comprising a circuit board and a plurality of light-emitting devices as described in any one of claims 1-21, wherein the plurality of light-emitting devices are spaced apart and disposed on the same side of the circuit board.