Laser die cutting mechanism and laser die cutting method
By laser die-cutting the label material with the adhesive side facing up to form a tapered cut, the problem of yellow edges or white printing on the outer edge of the graphic after laser die-cutting is solved, achieving a better visual effect.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- ADA (GUANGDONG) INTELLIGENT EQUIPMENT CO LTD
- Filing Date
- 2024-12-31
- Publication Date
- 2026-05-15
AI Technical Summary
Existing laser die-cutting technology causes yellow edges or white marks to appear on the outer edges of the label material strip graphics, affecting the visual effect.
A laser die-cutting mechanism is used, with the adhesive side of the label tape facing upwards and the laser head facing the adsorption conveyor belt to perform die-cutting, forming a tapered cut piece, and removing the adhesive side to eliminate residual structure.
This achieves zero residue on the outer edge of the label tape graphic, improving the visual effect.
Smart Images

Figure CN2024144311_15052026_PF_FP_ABST
Abstract
Description
A laser die-cutting mechanism and laser die-cutting method Technical Field
[0001] This application relates to the technical field of label die-cutting, and in particular to a laser die-cutting mechanism and a laser die-cutting method. Background Technology
[0002] Self-adhesive label die-cutting can be done using rollers or lasers. When using laser die-cutting, the laser head is typically projected onto the top of the label strip, and the laser cuts the strip to form the desired pattern. During laser cutting, the laser beam is diffused rather than parallel, causing the upper pattern surface of the label strip to be cut at an angle. The cut portion of the label strip, i.e., the edge of the cut piece, is cut into a conical structure, as shown in Figure 1. A portion of the cut label remains at the bottom. When viewed from the front of the pattern surface, this residual structure causes yellow edges or white marks on the outer edge of the graphic, affecting the visual effect. This application proposes a solution to the problem of white marks on the outer edge of the graphic after laser die-cutting. Summary of the Invention
[0003] To address the shortcomings of existing technologies, this application provides a laser die-cutting mechanism and a laser die-cutting method, which utilizes laser die-cutting of self-adhesive labels with the adhesive side facing upwards to solve the problem of white marks on the outer edges of graphics after die-cutting.
[0004] The technical problem to be solved by this application is achieved through the following technical means: One aspect of this application is to propose a laser die-cutting mechanism, including an adsorption conveyor belt, a laser, and a label strip to be laser-die-cut, the label strip having an adhesive surface, the label strip being conveyed on the adsorption conveyor belt with the adhesive surface facing upward, the laser head of the laser facing the adsorption conveyor belt, and the laser head die-cutting the label strip on the adsorption conveyor belt into cut pieces.
[0005] In the above scheme, one side of the label tape is the adhesive side and the other side is the pattern side. The laser head die-cuts a preset pattern onto the label tape on the suction conveyor belt. The part of the label tape with the preset pattern cut out is defined as the cut piece, which continues to be conveyed along the suction conveyor belt. Since the label tape is laser-cut with the adhesive side facing up, when the label tape is cut obliquely by the laser, a portion of the adhesive side facing up is cut off. The outer edge of the cut piece forms a conical structure, and the lower pattern side of this cut piece is the lower end of this conical structure. Thus, when viewed from the front of the pattern side, the outer edge of the cut piece will have no residual structure, preventing yellow edges or white marks on the pattern side, resulting in a better visual effect. Here, "adhesive side facing up" refers to the adhesive side facing the perpendicular direction of the suction conveyor belt's conveying direction.
[0006] In one embodiment, a waste collection module is provided on the side of the laser located in the positive direction of the conveying direction of the adsorption conveyor belt, and the portion of the label tape after removing the cut pieces is recycled through the waste collection module.
[0007] In the above scheme, the waste collection module is a conventional component of label die-cutting. The waste collection module is used to recycle the label material with adhesive surface after laser die-cutting, so that the adsorption conveyor belt only retains the cut pieces in the subsequent process.
[0008] In one embodiment, the laser die-cutting mechanism includes a raw material conveying module for conveying raw materials. The raw materials include a base paper and a label strip attached to the base paper. The raw material conveying module includes a raw material feeding cylinder for discharging the raw materials, a plurality of base paper traction shafts, and a plurality of label traction shafts. After the raw materials are discharged from the raw material feeding cylinder, the base paper and the label strip separate. The base paper is conveyed in conjunction with the base paper traction shaft, and the label strip is conveyed in conjunction with the label traction shaft. The label strip is transferred from the label traction shaft to the adsorption conveyor belt.
[0009] In one embodiment, a pressure roller is provided on one side of the laser located in the positive direction of the conveying direction of the adsorption conveyor belt. The pressure roller is located above the adsorption conveyor belt. The bottom paper passes under the pressure roller during conveying, and the bottom paper is bonded to the adhesive surface of the cut piece through the pressure roller.
[0010] In the above scheme, during the conveying process, the backing paper is scooped up to the side of the adsorption conveyor belt in the forward direction. Before the pressure roller, the backing paper adheres to the label material strip above the adhesive surface and is bonded together by the pressure roller to form a new strip. Specifically, when the raw material discharge cylinder is positioned on the side of the laser along the forward direction of the adsorption conveyor belt, several label traction shafts are arranged to bypass the laser; when the raw material discharge cylinder is positioned on the side of the laser opposite to the forward direction of the adsorption conveyor belt, several backing paper traction shafts are arranged to bypass the laser. Furthermore, during bonding, the conveying direction of the backing paper is the same as the conveying direction of the cutting.
[0011] In one embodiment, the laser die-cutting mechanism includes a receiving module for receiving the laminated base paper and cut pieces, the receiving module including a receiving tube.
[0012] In one embodiment, the laser head is oriented perpendicularly to the adsorption conveyor belt.
[0013] In one embodiment, the adsorption conveyor belt is a vacuum adsorption conveyor belt.
[0014] Another aspect of this application is to propose a laser die-cutting method, comprising the following steps:
[0015] Step S1: Separate the base paper and label tape from the raw materials and transport them in two separate paths;
[0016] Step S2: The label tape has an adhesive surface. The label tape passes through the adsorption conveyor belt with the adhesive surface facing up. A laser is provided on one side of the adsorption conveyor belt. The laser cuts out a preset pattern on the label tape on the adsorption conveyor belt. The part of the label tape with the preset pattern cut out is defined as the cut piece.
[0017] In step S3, the portion of the label tape that has been cut is recycled through the waste collection module, while the cut pieces continue to be conveyed along the adsorption conveyor belt.
[0018] Step S4: On the side of the laser located in the positive direction of the conveying direction of the adsorption conveyor belt, the base paper is conveyed to the adsorption conveyor belt and adheres to the adhesive surface of the cut piece, so that the base paper and the cut piece are bonded together.
[0019] In step S5, the laminated base paper and cut pieces are collected through the receiving tube.
[0020] In the above scheme, one side of the label tape is the adhesive side and the other side is the pattern side. The laser head cuts the label tape into pieces on the adsorption conveyor belt, and the pieces continue to be conveyed along the adsorption conveyor belt. Since the label tape is laser-cut with the adhesive side facing up, the label tape is cut at an angle by the laser to form a conical structure. A portion of the adhesive side facing up is cut off, and the lower side of the piece, which is the lower pattern side, is the lower end of the conical structure. When the cut piece is viewed from the front of the pattern side, there will be no residual structure on the outer edge of the piece, so there will be no yellow edges or white marks on the pattern side, thus achieving a better visual effect.
[0021] In one embodiment, in step S4, a pressure roller is provided on the side of the laser located in the positive direction of the adsorption conveyor belt. The pressure roller is located above the adsorption conveyor belt. During the conveying process, the base paper is attached to the adhesive surface of the cut piece by the pressure roller. When the base paper is attached, the conveying direction of the base paper is the same as the conveying direction of the cut piece.
[0022] In one embodiment, the laser is located on a vertical line of the adsorption conveyor belt and is directly facing the adsorption conveyor belt. Attached Figure Description
[0023] Figure 1 is a schematic diagram of laser die-cutting of label tape in the prior art;
[0024] Figure 2 is a schematic diagram of laser die-cutting of the label tape of this application;
[0025] Figure 3 is a schematic diagram of the laser die-cutting mechanism;
[0026] Figure 4 is a schematic diagram of the laser die-cutting mechanism. Detailed Implementation
[0027] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the application and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the present application are shown in the drawings, not the entire structure.
[0028] As shown in Figures 1 to 4, the technical solution adopted in this application is as follows: one aspect of this application is to propose a laser die-cutting mechanism, including an adsorption conveyor belt 1, a laser 2, and a label material strip 3 to be laser-die-cut. The label material strip 3 has an adhesive surface 4, and the label material strip 3 is conveyed on the adsorption conveyor belt 1 with the adhesive surface 4 facing upward. The laser head of the laser 2 faces the adsorption conveyor belt 1, and the laser head die-cuts the label material strip 3 on the adsorption conveyor belt 1 into cut pieces 5.
[0029] In the above scheme, one side of the label tape 3 is the adhesive surface 4, and the other side is the pattern surface 16. The laser head die-cuts a preset pattern onto the label tape 3 on the adsorption conveyor belt 1. The part of the label tape 3 with the preset pattern cut out is defined as the cut piece 5. The cut piece 5 will continue to be conveyed along the adsorption conveyor belt 1. Since the label tape 3 is laser-cut with the adhesive surface 4 facing upwards, when the label tape 3 is cut obliquely by the laser, a portion of the adhesive surface facing upwards is cut off. The outer edge of the cut piece 5 forms a conical structure. The lower part of the pattern surface 16 of the cut piece 5 is the lower end face of this conical structure. When the cut piece 5 is viewed from the front of the pattern surface 16, there will be no residual structure on the outer edge of the cut piece 5. Therefore, the pattern surface 16 of the cut piece 5 will not have yellow edges or white marks, thus achieving a better visual effect. Here, "adhesive surface 4 facing upwards" means that the adhesive surface 4 is perpendicular to the conveying direction of the adsorption conveyor belt 1.
[0030] In one embodiment, a waste collection module 6 is provided on one side of the laser 2 in the positive direction of the conveying direction of the adsorption conveyor belt 1, and the portion of the label material belt 3 excluding the cut piece 5 is recycled through the waste collection module 6.
[0031] In the above scheme, the waste collection module 6 is a conventional component of label die-cutting. The waste collection module 6 is used to recycle the label material strip 3 with adhesive surface 4 after laser die-cutting, so that the adsorption conveyor belt 1 only has the cut pieces 5 left in the subsequent process.
[0032] In one embodiment, the laser die-cutting mechanism includes a material conveying module 8 for conveying raw material 7. The raw material 7 includes a base paper 9 and a label strip 3 attached to the base paper 9. The material conveying module 8 includes a material feeding cylinder 10 for discharging the raw material 7, a plurality of base paper traction shafts 11, and a plurality of label traction shafts 12. After the raw material 7 is discharged from the material feeding cylinder 10, the base paper 9 and the label strip 3 separate. The base paper 9 is conveyed in conjunction with the base paper traction shaft 11, and the label strip 3 is conveyed in conjunction with the label traction shaft 12. The label strip 3 is transferred from the label traction shaft 12 to the adsorption conveyor belt 1.
[0033] In one embodiment, a pressure roller 13 is provided on one side of the laser 2 in the positive direction of the conveying direction of the adsorption conveyor belt 1. The pressure roller 13 is located above the adsorption conveyor belt 1. The bottom paper 9 passes under the pressure roller 13 during conveying, and the bottom paper 9 is bonded to the adhesive surface 4 of the cut piece 5 through the pressure roller 13.
[0034] In the above scheme, during the conveying process, the backing paper 9 is scooped up to the side of the positive direction of the conveying direction of the adsorption conveyor belt 1, and in front of the pressure roller 13, the backing paper 9 is attached to the label material strip 3 above the adhesive surface 4 and is bonded together by the pressure roller to form a new material strip. Specifically, when the raw material discharge cylinder 10 is positioned on the side of the laser 2 along the positive direction of the conveying direction of the adsorption conveyor belt 1, several label traction shafts 12 are arranged in a layout that bypasses the laser 2; when the raw material discharge cylinder 10 is positioned on the side of the laser 2 in the opposite direction of the conveying direction of the adsorption conveyor belt 1, several backing paper traction shafts 11 are arranged in a layout that bypasses the laser 2. Furthermore, during the bonding process, the conveying direction of the backing paper 9 is the same as the conveying direction of the cutter 5.
[0035] In one embodiment, the laser die-cutting mechanism includes a receiving module 14 for receiving the laminated base paper 9 and cut pieces 5, the receiving module 14 including a receiving tube 15.
[0036] In one embodiment, the laser head is oriented perpendicularly to the adsorption conveyor belt 1.
[0037] In one embodiment, the adsorption conveyor belt 1 is a vacuum adsorption conveyor belt.
[0038] Another aspect of this application is to propose a laser die-cutting method, comprising the following steps:
[0039] Step S1: Separate the base paper 9 and label tape 3 from the raw material 7 and transport them in two separate paths;
[0040] In step S2, the label strip 3 has an adhesive surface 4. The label strip 3 passes through the adsorption conveyor belt 1 with the adhesive surface 4 facing upward. A laser 2 is provided on one side of the adsorption conveyor belt 1. The laser 2 cuts out a preset pattern on the label strip 3 on the adsorption conveyor belt 1. The part of the label strip 3 with the preset pattern cut out is defined as the cut piece 5.
[0041] In step S3, the portion of the label material strip 3 that has been cut into pieces 5 is recycled through the waste collection module 6, while the pieces 5 continue to be conveyed along the adsorption conveyor belt 1.
[0042] In step S4, on the side of the laser 2 located in the positive direction of the conveying direction of the adsorption conveyor belt 1, the bottom paper 9 is conveyed to the adsorption conveyor belt 1 and adheres to the adhesive surface 4 of the cut piece 5, so that the bottom paper 9 and the cut piece 5 are composite.
[0043] In step S5, the laminated base paper 9 and the cut piece 5 are collected by the receiving tube 15.
[0044] In the above scheme, one side of the label strip 3 is the adhesive surface and the other side is the pattern surface 16. The laser head cuts the label strip 3 onto the adsorption conveyor belt 1 to form a cut piece 5, which continues to be conveyed along the adsorption conveyor belt 1. Since the label strip 3 is laser-cut with the adhesive surface 4 facing upwards, the label strip 3 is obliquely cut by the laser to form a conical structure. A portion of the adhesive surface 4 facing upwards on the cut piece 5 is cut off, and the lower side of the cut piece 5, which is the lower pattern surface 16, is the lower end of the conical structure. When viewed from the front of the pattern surface 16, the cut piece 5 will have no residual structure at its outer edge, thus preventing yellow edges or white marks on the pattern surface 16, achieving a better visual effect. Here, "adhesive surface 4 facing upwards" means that the adhesive surface 4 is perpendicular to the conveying direction of the adsorption conveyor belt 1.
[0045] In one embodiment, in step S4, a pressure roller 13 is provided on the side of the laser 2 located in the positive direction of the conveying direction of the adsorption conveyor belt 1. The pressure roller 13 is located above the adsorption conveyor belt 1. During the conveying process, the bottom paper 9 is attached to the adhesive surface 4 of the cut piece 5 through the pressure roller 13. When it is attached, the conveying direction of the bottom paper 9 is the same as the conveying direction of the cut piece 5.
[0046] In one embodiment, the laser 2 is located on the vertical line of the adsorption conveyor belt 1, and the laser 2 is directly facing the adsorption conveyor belt 1.
Claims
1. A laser die-cutting mechanism, characterized in that, The device includes an adsorption conveyor belt (1), a laser (2), and a label strip (3) to be laser-cut. The label strip (3) has an adhesive surface (4). The label strip (3) is conveyed on the adsorption conveyor belt (1) with the adhesive surface (4) facing upward. The laser head of the laser (2) faces the adsorption conveyor belt (1). The laser head cuts the label strip (3) on the adsorption conveyor belt (1) into cut pieces (5).
2. The laser die-cutting mechanism according to claim 1, characterized in that: A waste collection module (6) is provided on one side of the laser (2) in the positive direction of the conveying direction of the adsorption conveyor belt (1), and the part of the label material belt (3) after removing the cut piece (5) is recycled through the waste collection module (6).
3. The laser die-cutting mechanism according to claim 1, characterized in that: The laser die-cutting mechanism includes a material conveying module (8) for conveying raw materials (7). The raw materials (7) include a base paper (9) and a label strip (3) attached to the base paper (9). The material conveying module (8) includes a material feeding cylinder (10) for discharging the raw materials (7), several base paper traction shafts (11), and several label traction shafts (12). After the raw materials (7) are discharged from the material feeding cylinder (10), the base paper (9) and the label strip (3) are separated. The base paper (9) is conveyed in conjunction with the base paper traction shaft (11), and the label strip (3) is conveyed in conjunction with the label traction shaft (12). The label strip (3) is transferred from the label traction shaft (12) to the adsorption conveyor belt (1).
4. A laser die-cutting mechanism according to claim 3, characterized in that: A pressure roller (13) is provided on one side of the laser (2) in the positive direction of the conveying direction of the adsorption conveyor belt (1). The pressure roller (13) is located above the adsorption conveyor belt (1). The bottom paper (9) passes under the pressure roller (13) during conveying, and the bottom paper (9) is bonded to the adhesive surface (4) of the cut piece (5) through the pressure roller (13).
5. A laser die-cutting mechanism according to claim 4, characterized in that: The laser die-cutting mechanism includes a receiving module (14) for receiving the backing paper (9) and the cut piece (5) after lamination, and the receiving module (14) includes a receiving tube (15).
6. A laser die-cutting mechanism according to claim 1, characterized in that: The laser head is perpendicular to the adsorption conveyor belt (1).
7. A laser die-cutting mechanism according to claim 2, characterized in that: The adsorption conveyor belt (1) is a vacuum adsorption conveyor belt.
8. A laser die-cutting method, characterized in that, Includes the following steps: Step S1: Separate the base paper (9) and label tape (3) in the raw material (7) and transport them in two separate paths; Step S2, the label tape (3) has an adhesive surface (4), and the label tape (3) passes through the adsorption conveyor belt (1) with the adhesive surface (4) facing upward. A laser (2) is provided on one side of the adsorption conveyor belt (1), and the laser (2) cuts out a preset pattern on the label tape (3) on the adsorption conveyor belt (1). The part of the label tape (3) with the preset pattern cut out is defined as the cut piece (5). In step S3, the portion of the label tape (3) with the cut pieces (5) removed is recycled through the waste collection module (6), while the cut pieces (5) continue to be conveyed along the adsorption conveyor belt (1). In step S4, on the side of the laser (2) located in the positive direction of the conveying direction of the adsorption conveyor belt (1), the bottom paper (9) is conveyed to the adsorption conveyor belt (1) and adheres to the adhesive surface (4) of the cut piece (5), so that the bottom paper (9) and the cut piece (5) are combined. In step S5, the composite base paper (9) and cut pieces (5) are collected by the receiving tube (15).
9. A laser die-cutting method according to claim 8, characterized in that: In step S4, a pressure roller (13) is provided on the side of the laser (2) in the positive direction of the conveying direction of the adsorption conveyor belt (1). The pressure roller (13) is located above the adsorption conveyor belt (1). During the conveying process, the bottom paper (9) is attached to the adhesive surface (4) of the cut piece (5) through the pressure roller (13). When they are attached, the conveying direction of the bottom paper (9) is the same as the conveying direction of the cut piece (5).
10. A laser die-cutting method according to claim 8, characterized in that: The laser (2) is located on the vertical line of the adsorption conveyor belt (1), and the laser (2) is facing the adsorption conveyor belt (1).