Semiconductor manufacturing system and installation method

Abstract

This semiconductor manufacturing system has an atmospheric transfer module that includes: a transfer robot for transferring a substrate; and a storage module that keeps a substrate on standby. The storage module comprises: a case body; a rod member that is provided to the case body and extends vertically; a lock mechanism that fixes the rod member to the case body; and an operating unit that is provided below the top plate of the case body and that allows an operator to operate the rod member. The rod member vertically rises upward on the basis of operation of the operating unit and is fixed by the lock mechanism, thereby fixing the storage module to the atmospheric transfer module while maintaining the state of being butted against a ceiling frame of the atmospheric transfer module.

Description

Semiconductor manufacturing system and installation method

[0001] The present disclosure relates to a semiconductor manufacturing system and an installation method.

[0002] Patent Document 1 discloses a semiconductor manufacturing system (substrate processing system) including an atmospheric transfer module for transferring a substrate. This atmospheric transfer module is provided with a transfer robot for transferring the substrate and a storage module for temporarily waiting for the substrate before and after processing. The transfer robot transfers the substrate among the FOUP arranged at the load port, the aligner module, the load lock module, and the storage module.

[0003] Japanese Unexamined Patent Application Publication No. 2021-141136

[0004] The present disclosure provides a technique capable of stably waiting for a substrate by simply and firmly fixing a storage module.

[0005] According to one aspect of the present disclosure, there is provided a semiconductor manufacturing system having an atmospheric transfer module including a transfer robot for transferring a substrate and a storage module for waiting for the substrate, wherein the storage module includes a case body capable of accommodating a plurality of the substrates arranged in the vertical direction, a rod member provided on the case body and extending in the vertical direction, a lock mechanism for fixing the rod member to the case body, and an operation unit provided below the top plate of the case body for an operator to operate the rod member. The rod member rises upward in the vertical direction based on the operation of the operation unit and is fixed by the lock mechanism, thereby maintaining a tensioned form against the ceiling frame of the atmospheric transfer module and fixing the storage module to the atmospheric transfer module.

[0006] According to one aspect, by simply and firmly fixing the storage module, the substrate can be stably waited for.

[0007] This is a plan view showing the configuration of a semiconductor manufacturing system according to an embodiment. This is a schematic side view showing the storage module installed inside the air transport container. This is a schematic longitudinal cross-sectional view showing each component of the first storage of the storage module. This is an enlarged longitudinal cross-sectional view showing the configuration of the upper locking mechanism. This is a flowchart showing the method of installing the storage module.

[0008] The following describes embodiments for implementing this disclosure with reference to the drawings. In each drawing, the same reference numerals are used for identical components, and redundant explanations may be omitted.

[0009] Figure 1 is a plan view showing the configuration of a semiconductor manufacturing system 1 according to an embodiment. Note that, for convenience, some internal components of the equipment are shown transparently in Figure 1. The semiconductor manufacturing system 1 is a substrate processing system that transports substrates W, which are transported materials, and performs various substrate processing on these substrates W. Examples of substrates W processed in the semiconductor manufacturing system 1 include silicon wafers such as single-crystal silicon, silicon carbide, and SOI wafers, and compound semiconductor wafers such as GaAs wafers, SiC wafers, GaN wafers, and InP wafers.

[0010] The semiconductor manufacturing system 1 comprises a plurality of processing modules 10, a vacuum transport module 20, a plurality of load lock modules 30, and an atmospheric transport module 40. The semiconductor manufacturing system 1 also includes a control device 90 for controlling each module.

[0011] Multiple processing modules 10 have processing vessels that can be reduced to a vacuum atmosphere, and perform various substrate processing (etching, film deposition, cleaning, ashing, etc.) on substrates W housed inside these processing vessels. In this specification, "vacuum" means a pressure lower than atmospheric pressure. A plasma processing apparatus that applies plasma processing to substrates W may be applied to the processing module 10. Figure 1 shows two processing modules 10, but the number of processing modules 10 may be one or three or more. Furthermore, each of the multiple processing modules 10 may perform the same type of substrate processing, or they may perform mutually different types of substrate processing.

[0012] The vacuum transport module 20 has a vacuum transport container with a vacuum transport robot (not shown) installed inside for transporting substrates W. Multiple processing modules 10 and multiple load lock modules 30 are connected to the vacuum transport container. The vacuum transport module 20 reduces the pressure inside the vacuum transport container to a vacuum atmosphere and transports the substrates W between the processing modules 10 and the load lock modules 30, or between multiple processing modules 10 themselves, using the vacuum transport robot.

[0013] The load lock module 30 is connected to the vacuum transport module 20 via a gate valve 30G1 and to the atmospheric transport module 40 via a gate valve 30G2. In the semiconductor manufacturing system 1 shown in Figure 1, two load lock modules 30 are installed between the vacuum transport module 20 and the atmospheric transport module 40, but the number of load lock modules 30 may be one or three or more.

[0014] The load lock module 30 has an internally variable pressure chamber that can be switched between vacuum and atmospheric pressure. The internal pressure chamber is provided with a stage (not shown) on which a substrate W can be placed. When the load lock module 30 transports a substrate W from the atmospheric transport module 40 to the vacuum transport module 20, it receives the substrate W while maintaining the internal pressure chamber at atmospheric pressure, then reduces the pressure in the internal pressure chamber to create a vacuum atmosphere, and hands over the substrate W to the vacuum transport module 20. Also, when the load lock module 30 transports a substrate W from the vacuum transport module 20 to the atmospheric transport module 40, it receives the substrate W while maintaining the internal pressure chamber at vacuum, then increases the pressure in the internal pressure chamber to create an atmospheric pressure atmosphere, and hands over the substrate W to the atmospheric transport module 40.

[0015] The atmospheric transport module 40 constitutes a transport system for transporting substrates W on the atmospheric pressure side (atmospheric pressure atmosphere) relative to the vacuum transport module 20. The atmospheric transport module 40 has an atmospheric transport container 41 in which an atmospheric transport robot (hereinafter simply referred to as transport robot 43) is installed. The atmospheric transport container 41 has a rectangular shape in plan view. The atmospheric transport container 41 is provided with a plurality (five) load ports 42, as well as an aligner module 50 and a plurality of storage modules 60. The atmospheric transport module 40 may be, for example, an EFEM (Equipment Front End Module). The atmospheric transport module 40 may also have an FFU (Fan Filter Unit) that supplies clean air from the top of the atmospheric transport container 41, and an exhaust device that exhausts air.

[0016] Each of the multiple load ports 42 is equipped with a substrate storage container 49, such as a FOUP (Front Opening Unified Pod), capable of accommodating multiple (for example, 25) substrates W. An openable and closable gate 42G is provided between the atmospheric transport container 41 and each load port 42. In Figure 1, five load ports 42 are installed, but the number of load ports 42 is not particularly limited.

[0017] The transport robot 43 transports the substrate W inside the atmospheric transport container 41. The transport robot 43 includes, for example, a bifurcated pick 44 that directly holds the substrate W, a plurality of arms 45 that support the position of the pick 44 so as to be displaceable, and a base 46 that supports the arms 45. The transport robot 43 may be configured to reciprocate along the longitudinal direction of the atmospheric transport container 41 by a sliding mechanism (not shown) provided on the base 46. The base 46 is also provided with a lifting mechanism (not shown) that allows the arms 45 and the pick 44 to move integrally along the vertical direction. The plurality of arms 45 rotate relative to each other at the joints connecting the arms 45, moving each pick 44 that constitutes the end effector of the transport robot 43 to a predetermined horizontal position. The transport robot 43 according to this embodiment is equipped with a plurality (two) of picks 44, and each pick 44 can transport the substrate W individually.

[0018] Based on the control of the control device 90, the transport robot 43 transports the substrate W from the module to be received to the module to be transferred. The modules to be received and transferred include the substrate storage containers 49 of each load port 42, each load lock module 30, the aligner module 50, and each storage module 60.

[0019] The aligner module 50 is connected to one end of the atmospheric transport container 41 in the longitudinal direction and aligns the substrate W transported by the transport robot 43. The aligner module 50 includes, for example, a housing 51 capable of housing the substrate W, a rotating stage 52 provided inside the housing 51 on which the substrate W can be placed, and a rotational drive mechanism 53 for rotating the rotating stage 52. An optical sensor (not shown) is also provided on the outer circumference and above the rotating stage 52 to optically detect the outer edge of the substrate W. The optical sensor optically measures the outer edge of the rotating substrate W and detects the position of a notch (or orientation flat) formed on the substrate W.

[0020] The housing 51 has an opening toward the air transport container 41, allowing the transport robot 43 to access the interior. The rotating stage 52 has a diameter smaller than the diameter of the substrate W, and the center of the substrate W is placed on its upper surface. The aligner module 50 detects deviations, notches, etc., on the outer edge of the substrate W, which is rotated by the rotation drive mechanism 53, and calculates the misalignment and orientation of the substrate W. When the transport robot 43 receives the substrate from the aligner module 50, the control device 90 corrects the misalignment and orientation of the substrate W before receiving it.

[0021] The control device 90 of the semiconductor manufacturing system 1 is a computer that controls the entire system and includes a processor 91, memory 92, an input / output interface (not shown), and a communication interface. The processor 91 is a combination of one or more of the following: a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), an ASIC (Application Specific Integrated Circuit), an FPGA (Field-Programmable Gate Array), and a circuit consisting of multiple discrete semiconductors. The memory 92 includes a main memory and an auxiliary memory (for example, a compact disc, a DVD (Digital Versatile Disc), a hard disk, flash memory, etc.). The processor 91 controls the operation of the transport robot 43 of the atmospheric transport module 40 and the operation of each module by reading and executing programs stored in the memory 92.

[0022] Furthermore, the control device 90 has a user interface 95 that notifies the user of information from the semiconductor manufacturing system 1 and allows the user to input information from the semiconductor manufacturing system 1 based on user operations. Examples of the user interface 95 include a monitor, mouse, keyboard, touch panel, speaker, microphone, etc.

[0023] The multiple storage modules 60 installed in the atmospheric transport module 40 are structures for temporarily holding substrates W before processing and substrates W after processing. The multiple storage modules 60 include, for example, those connected to the long side of the atmospheric transport container 41 to which the load lock module 30 is connected, and those provided inside the short side of the atmospheric transport container 41. As an example, the storage module 60A inside the atmospheric transport container 41 is located at one end of the atmospheric transport container 41 in the longitudinal direction (the end opposite to the aligner module 50). In Figure 1, three storage modules 60 are installed, but the number of storage modules 60 may be one, two, or four or more.

[0024] The storage module 60A, which is placed inside the atmospheric transport container 41, extends longer in the vertical direction compared to the other storage modules 60, and is configured to hold a large number of substrates W. For example, storage module 60A is configured to hold 125 substrates W, while the other storage modules 60 are configured to hold 75 substrates W.

[0025] Figure 2 is a schematic side view showing the storage module 60A installed inside the atmospheric transport container 41. The storage module 60A extends vertically and has an opening 60o on one side for loading and unloading substrates W. The storage module 60A is installed on the frame 41f of the atmospheric transport container 41 such that the opening 60o faces the space of the atmospheric transport container 41 (see also Figure 1). This allows the transport robot 43 of the atmospheric transport module 40 to smoothly enter the interior of the storage module 60A through the opening 60o.

[0026] Furthermore, the storage module 60A according to the embodiment is configured to be separable into, for example, a first storage 61 and a second storage 62 positioned vertically below the first storage 61. This allows the first storage 61 and the second storage 62 to be transported individually when the semiconductor manufacturing system 1 is installed, and enables smooth installation of each component within the atmospheric transport container 41. However, the storage module 60A may not be divided into the first storage 61 and the second storage 62, but rather as a continuous structure. Alternatively, the storage module 60 may be divided into three or more storage units.

[0027] The semiconductor manufacturing system 1 has a fixing mechanism that secures the storage module 60A, which extends vertically as described above, inside the atmospheric transport container 41. The fixing mechanism prevents the substrate W held inside the storage module 60A from flying out by suppressing the shaking of the storage module 60A even when subjected to vibrations during the operation of the transport robot 43. In the embodiment, the fixing mechanism is provided on the storage module 60A side and uses a rod member 65 that can be braced vertically between itself and the frame 41f of the atmospheric transport container 41.

[0028] The frame 41f of the atmospheric transport container 41 includes a base frame 41f2 located vertically downward to support the storage module 60A, a ceiling frame 41f1 located vertically upward to cover the storage module 60A, and a side frame 41f3 extending vertically between the base frame 41f2 and the ceiling frame 41f1. The storage module 60A is positioned with a gap between it and the side frame 41f3 and is installed so as to be sandwiched between the base frame 41f2 and the ceiling frame 41f1. The storage module 60A, whose vibrations are suppressed by the fixing mechanism, can avoid contact with the side frame 41f3 during operation.

[0029] The base frame 41f2 houses the components (control board, driver, power supply, etc.) necessary to operate the transport robot 43 of the atmospheric transport module 40. Therefore, although the transport robot 43 is capable of moving the pick 44 up and down vertically, it is configured so that the pick 44 does not descend vertically below the bottom plate 632 of the second storage 62 installed on the base frame 41f2.

[0030] The vertical length (height) of the storage module 60 is sufficiently longer (higher) than the vertical length of the base frame 41f2. When the storage module 60A is installed on the base frame 41f2, its vertical length is set to approximately 1900 mm (or 1900 mm or more). The fixing mechanism (rod member 65) of the storage module 60A maintains the vertically long posture of the storage module 60 by bracing it against the ceiling frame 41f1.

[0031] Figure 3 is a longitudinal cross-sectional view schematically showing the configuration of the first storage 61 of the storage module 60A. The configuration of the storage module 60A according to this embodiment will be described in detail below with reference to Figure 3.

[0032] As described above, the storage module 60A (first storage 61) has an opening 60o at the front and includes a case body 63 capable of housing the substrates W inside. The case body 63 holds a plurality of substrates W at a certain interval in the vertical direction.

[0033] Specifically, the case body 63 is formed by assembling a top plate 631, a bottom plate 632, a pair of side plates 633, and a rear plate 634. The case body 63 also has one or more (two in Figure 3) intermediate plates 635 inside the space enclosed by the top plate 631, the bottom plate 632, and the pair of side plates 633. Each intermediate plate 635 is installed at equal intervals between the top plate 631 and the bottom plate 632 to reinforce the vertical upright position of the case body 63. However, the case body 63 does not necessarily have to have intermediate plates 635.

[0034] The top plate 631, bottom plate 632, and each intermediate plate 635 of the case body 63 are formed in a flattened hexagonal shape in plan view (see also Figure 1), and are widely open at the front opening 60o. The pair of side plates 633 and rear plate 634 have the same dimensions in the vertical direction and support the top plate 631, bottom plate 632, and each intermediate plate 635 so that they are parallel to each other (horizontally). The case body 63 maintains the shape of a vertically elongated box by fixing the top plate 631, bottom plate 632, and each intermediate plate 635 to the pair of side plates 633 with a plurality of screw members 64.

[0035] Furthermore, the storage module 60A has a shelf frame 66 (see Figure 4) with multiple vertically repeated protrusions and indentations to hold multiple substrates W. The shelf frame 66 supports a portion of the outer edge of the substrates W with each pair of protrusions that project shortly from the inner surface toward the center in the width direction. This shelf frame 66 is provided inside the pair of rod members 65 arranged in the width direction of the case body 63.

[0036] Multiple rod members 65 constituting the fixing mechanism are attached to the storage module 60A and are displaceable (movable up and down) relative to the ceiling frame 41f1 located above them. Each rod member 65 is provided, for example, in pairs (two) near the front open section 60o of the storage module 60A and in pairs (two) near the rear plate 634. The storage module 60A according to this embodiment has a total of four rod members 65. However, the number of rod members 65 is not limited and may be one to three, or five or more. Of course, the position of each rod member 65 can also be designed arbitrarily.

[0037] Each rod member 65 is pre-installed to penetrate the top plate 631, the bottom plate 632, and each intermediate plate 635. When assembling the semiconductor manufacturing system 1, the rod members 65 are manipulated by an operator and displaced vertically upward, contacting and pressing against the lower surface of the ceiling frame 41f1, thereby firmly fixing the storage module 60A to the air transport container 41.

[0038] Specifically, the rod member 65 has a rod body 651 and a contact portion 652 provided at the upper end of the rod body 651. The rod body 651 also includes a large-diameter portion 651a arranged inside the case body 63, an upper threaded portion 651b connected to the vertically upper side of the large-diameter portion 651a, and a lower threaded portion 651c connected to the vertically lower side of the large-diameter portion 651a. An upper locking mechanism 67 is provided at an intermediate position on the upper threaded portion 651b. The lower threaded portion 651c is screwed into a female threaded hole 632h formed in the bottom plate 632. A lower locking mechanism 68 is provided on the lower threaded portion 651c above the bottom plate 632.

[0039] The large-diameter portion 651a is formed to be thicker than other parts of the rod body 651 and penetrates the holes in each intermediate plate 635 of the case body 63. An operating portion 653 for operating the rod member 65 is provided on this large-diameter portion 651a. In this embodiment, the operating portion 653 is a polygonal (for example, hexagonal) portion formed by cutting out multiple faces from the circumferential surface of the circular large-diameter portion 651a in a plan cross-sectional view. A worker installing (or removing) the storage module 60A fits a wrench (a tool not shown) onto this polygonal operating portion 653 and rotates the entire rod member 65 around its axis by turning the wrench. The rod member 65 moves up and down vertically relative to the case body 63 by this rotation around the axis.

[0040] The upper threaded portion 651b has a contact portion 652 at its upper end, and an upper locking mechanism 67 is fixed at an intermediate position. Threads are formed on the circumferential surface of the upper threaded portion 651b, spirally arranged at an appropriate pitch. The upper threaded portion 651b works in cooperation with the upper locking mechanism 67 to enable the vertical movement of the rod member 65, and also restricts displacement even when subjected to a vertical load. The configuration of this upper locking mechanism 67 will be described later.

[0041] On the other hand, the lower threaded portion 651c can pass through the female threaded hole 632h of the base plate 632, and the lower locking mechanism 68 is fixed at an intermediate position. Threads are also formed on the circumferential surface of the lower threaded portion 651c, spirally arranged at an appropriate pitch. This lower threaded portion 651c is screwed into the female threaded hole 632h provided in the base plate 632 and is configured to move vertically up and down relative to the base plate 632.

[0042] For example, the lowest end of the lower threaded portion 651c protrudes slightly from the bottom surface of the bottom plate 632 when the rod member 65 is not in contact with the ceiling frame 41f1 (not displaced vertically upward). The protruding portion of the lower threaded portion 651c of the first storage 61 enters a hole (not shown) formed in the top plate 631 of the second storage 62.

[0043] Note that the first storage 61 and the second storage 62 can be positioned by a positioning structure formed therebetween. Specifically, the positioning structure includes a positioning pin (not shown) installed on the top plate 631 of the second storage 62 and a U-shaped groove (not shown) formed in the bottom plate 632 of the first storage 61. Then, the first storage 61 and the second storage 62 can be positioned relative to each other by pressing the positioning pin against the U-shaped groove and fixing them.

[0044] Also, the lower screw portion 651c is configured to be able to restrict the rotation and displacement of the rod member 65 by a lower locking mechanism 68 installed on the upper surface of the bottom plate 632. The lower locking mechanism 68 is constituted by, for example, a lock nut 681. The lock nut 681 is arranged so that the lower screw portion 651c of the rod member 65 passes therethrough. This lock nut 681 has an internal thread structure (not shown) that engages with the thread of the lower screw portion 651c. The lock nut 681 rises together with the lower screw portion 651c as the rod member 65 rises. The operator rotates and lowers the lock nut 681 screwed onto the lower screw portion 651c while bringing the contact portion 652 of the rod member 65 into contact with the ceiling frame 41f1, and brings it into contact with the upper surface of the bottom plate 632. By this backward movement, the lock nut 681 can be restricted from displacing downward and can firmly hold the screwed lower screw portion 651c in that position.

[0045] FIG. 4 is a longitudinal sectional view showing an enlarged configuration of the upper locking mechanism 67. As shown in FIG. 4, the upper locking mechanism 67 applies an adjuster screw to align the thread phase of the top plate 631 and the upper screw portion 651b based on the thread phase engaged between the bottom plate 632 and the lower screw portion 651c. This upper locking mechanism 67 includes an inner cylinder screw 671 that engages with the upper screw portion 651b, an upper lock nut 672 that engages with the inner cylinder screw 671 above the top plate 631, and a lower lock nut 673 that engages with the inner cylinder screw 671 below the top plate 631.

[0046] The inner cylinder screw 671 extends longer than the thickness of the top plate 631 and has a cylindrical shape with the upper screw portion 651b disposed on the inner side. On the inner peripheral surface of the inner cylinder screw 671, a female screw portion 671f into which the upper screw portion 651b is screwed is formed. On the outer peripheral surface of the inner cylinder screw 671, a male screw portion 671m into which the upper lock nut 672 and the lower lock nut 673 are screwed is formed. The inner cylinder screw 671 is disposed with a gap (non-contact) with respect to the through hole 631h formed in the top plate 631. Therefore, the inner cylinder screw 671 can be displaced in the vertical direction together with the rod member 65 (upper screw portion 651b).

[0047] The upper lock nut 672 and the lower lock nut 673 are respectively screwed onto the male screw portion 671m of the inner cylinder screw 671, thereby fastening the inner cylinder screw 671 above and below the top plate 631 and fixing the upper screw portion 651b of the rod member 65 via the inner cylinder screw 671. Thus, by fixing the upper and lower sides of the top plate 631 via the upper lock nut 672 and the lower lock nut 673, the rod member 65 can be rotated about its axis and displaced without considering the screw phase of the upper screw portion 651b of the rod member 65. Note that the upper lock mechanism 67 may be configured to include only one of the upper lock nut 672 and the lower lock nut 673.

[0048] Further, the lower lock nut 673 has a protruding cylinder 674 that protrudes below the upper end of the shelf plate frame 66 that supports the substrate W. The protruding cylinder 674 forms a labyrinth structure with the shelf plate frame 66. Thereby, it is possible to suppress particles that may occur in the screwing of the rod member 65 and the upper lock mechanism 67 from moving to the substrate W.

[0049] Returning to FIG. 3, the contact portion 652 of the rod member 65 is formed of a resin material having an appropriate elastic force and houses the upper end of the upper screw portion 651b. The upper end of the contact portion 652 makes surface contact with the ceiling frame 41f1 and contacts with a high frictional force. Therefore, the contact portion 652 is prevented from being displaced in the lateral direction even when a load is applied in the vertical direction.

[0050] The semiconductor manufacturing system 1 according to this embodiment is basically configured as described above. Below, the installation method for assembling the storage module 60A into the atmospheric transport container 41 will be explained with reference to Figure 5. Figure 5 is a flowchart showing the installation method for the storage module 60A.

[0051] In the installation method, the first storage 61 and second storage 62 of the storage module 60A are first provided to the workers at the work site of the semiconductor manufacturing system 1 (step S101). The first storage 61 has the case body 63 and rod member 65 assembled. The second storage 62 is provided with only the case body 63, without the rod member 65. Also, at the time of assembling the storage module 60A, the atmospheric transport module 40 of the semiconductor manufacturing system 1 is installed at the work site.

[0052] The worker opens a door (not shown) provided on the atmospheric transport container 41, brings the second storage 62 into the atmospheric transport container 41, and places the second storage 62 on the set position of the base frame 41f2 (step S102).

[0053] Furthermore, the worker carries the first storage 61 into the air transport container 41 and places the first storage 61 directly above the second storage 62 that was placed earlier (step S103: process (A)). As described above, when placing the first storage 61, the positioning pins of the second storage 62 are pressed against the U-shaped groove of the first storage 61 to fix it in place, thereby positioning the first storage 61 and the second storage 62.

[0054] Then, the worker operates the operating section 653 of each rod member 65 provided in the first storage 61 to raise each rod member 65 relative to the case body 63 and press the contact portion 652 against the ceiling frame 41f1 (step S104: (B)). In operating the operating section 653, the worker fits a tool such as a wrench onto the operating section 653 and rotates the rod member 65 around its axis. As a result, the lower threaded portion 651c of the rod member 65 rotates relative to the female threaded hole 632h of the bottom plate 632, raising the entire rod member 65. The amount of rise of each rod member 65 is, for example, about 10 mm to 20 mm.

[0055] As described above, the operating section 653 is located between a pair of intermediate plates 635 below the top plate 631 of the first storage 61. Therefore, the operator can easily access the operating section 653 and easily apply torque to the rod member 65 to rotate the entire rod member 65 around its axis.

[0056] Subsequently, the worker rotates the lock nut 681 of the lower locking mechanism 68 to fix the lower threaded portion 651c to the bottom plate 632 (step S105: (C)). This allows the rod member 65 to be braced between the ceiling frame 41f1 and the second storage 62, thereby firmly fixing the first storage 61. Furthermore, the worker rotates the upper lock nut 672 and lower lock nut 673 of the upper locking mechanism 67 to fix the upper threaded portion 651b to the top plate 631. That is, the upper locking mechanism 67 fixes the inner cylinder screw 671 to the top plate 631 by the upper lock nut 672 and lower lock nut 673. This makes it possible to displace the rod member 65 without considering the thread phase of the bottom plate 632 of the first storage 61.

[0057] Furthermore, in the installation method, it is determined whether all of the multiple rod members 65 have been fixed to the ceiling frame 41f1 (step S106). If there are still rod members 65 that have not been fixed (step S106: NO), the process returns to step S103 and the same process is repeated thereafter. On the other hand, if all of the rod members 65 have been fixed (step S106: YES), the installation method for the storage module 60A is terminated.

[0058] When the storage module 60A is installed in the atmospheric transport container 41, each rod member 65 maintains a form that is braced against the ceiling frame 41f1. As a result, the first storage 61 and the second storage 62 are integrally fixed by a vertical load applied between the base frame 41f2 and the ceiling frame 41f1. Therefore, even if vibrations are transmitted to the storage module 60A due to the operation of the transport robot 43 of the atmospheric transport module 40, for example, the storage module 60A will not shake excessively. Thus, the storage module 60A can prevent the substrates W housed inside from flying out of the case body 63 and keep each substrate W in a stable position.

[0059] Furthermore, since the rod member 65 extends linearly across the top plate 631 and bottom plate 632 of the case body 63, it can support the braced state of the rod member 65 within the case body 63. By screwing the rod member 65 into the female screw hole 632h of the bottom plate 632, the rod member 65 can be raised and lowered with the bottom plate 632 as a pivot point as the rod member 65 rotates around its axis, allowing for easy switching between fixing and releasing the storage module 60A. In addition, by providing an operating part 653 on the large diameter portion 651a of the rod member 65, the torque applied to the tool can be reduced, making it easier to rotate the rod member 65 around its axis.

[0060] It should be noted that the semiconductor manufacturing system 1 and installation method according to the embodiment are not limited to the above embodiment and can be modified in various ways. For example, in the above embodiment, a locking mechanism for fixing the rod member 65 is installed on the top plate 631 and the bottom plate 632, but the position of the locking mechanism is not limited to this, and may be installed on the intermediate plate 635, for example.

[0061] The embodiments disclosed above include, for example, the following aspects:

[0062] [Note 1] A semiconductor manufacturing system having a transport robot for transporting substrates and an air transport module including a storage module for storing the substrates, wherein the storage module comprises: a case body capable of accommodating a plurality of the substrates arranged vertically; a rod member provided on the case body and extending vertically; a locking mechanism for fixing the rod member to the case body; and an operating unit provided below the top plate of the case body for an operator to operate the rod member, wherein the rod member rises vertically upward based on the operation of the operating unit and is fixed by the locking mechanism, thereby maintaining a form that is braced against the ceiling frame of the air transport module, and fixing the storage module to the air transport module.

[0063] [Note 2] The semiconductor manufacturing system according to Note 1, wherein the rod member extends linearly across the top and bottom plates of the case body.

[0064] [Note 3] The semiconductor manufacturing system as described in Note 2, wherein the rod member is screwed into a female screw hole formed in the bottom plate of the case body, and the operation of the operating part is to rotate the rod member around its axis.

[0065] [Note 4] The semiconductor manufacturing system according to Note 3, wherein the rod member has a large-diameter portion that is thicker than the upper and lower ends, and the operating portion is formed in the large-diameter portion.

[0066] [Note 5] The semiconductor manufacturing system according to any one of Notes 1 to 4, wherein the locking mechanism includes an upper locking mechanism provided on the top plate of the case body and a lower locking mechanism provided on the bottom plate of the case body.

[0067] [Note 6] The semiconductor manufacturing system according to Note 5, wherein the upper locking mechanism comprises an inner cylinder screw that is screwed into the upper threaded portion of the rod member, and a lock nut that secures the inner cylinder screw on at least one of the upper or lower sides of the top plate of the case body.

[0068] [Note 7] The semiconductor manufacturing system according to Note 5 or Note 6, wherein the lower locking mechanism includes a lock nut that screws onto the lower threaded portion of the rod member and fixes the lower threaded portion to the bottom plate of the case body.

[0069] [Note 8] The semiconductor manufacturing system according to any one of Notes 1 to 7, wherein the storage module is divisible into a first storage and a second storage located vertically below the first storage, and the case body, the rod member, the locking mechanism, and the operating unit are located in the first storage.

[0070] [Note 9] An installation method for assembling a storage module for storing substrates on an air transport module equipped with a transport robot for transporting substrates, wherein the storage module comprises: a case body capable of accommodating a plurality of substrates arranged vertically; a rod member provided on the case body and extending vertically; a locking mechanism for fixing the rod member to the case body; and an operating unit provided below the top plate of the case body for an operator to operate the rod member, wherein the installation method comprises: (A) a step of placing the storage module on the air transport module; (B) a step of raising the rod member vertically upward based on the operation of the operating unit after step (A); and (C) a step of fixing the storage module to the air transport module by fixing the rod member with the locking mechanism, thereby maintaining a form that is braced against the ceiling frame of the air transport module.

[0071] The semiconductor manufacturing system 1 and installation method according to the embodiments disclosed herein are illustrative and not restrictive in all respects. The embodiments can be modified and improved in various ways without departing from the scope and spirit of the appended claims. The matters described in the above embodiments can be otherwise configured and combined in a non-consistent manner.

[0072] This application claims priority to Japanese Patent Application No. 2024-195073, which was filed with the Japan Patent Office on November 7, 2024, and the entire contents of that application are incorporated herein by reference.

[0073] 1 Semiconductor manufacturing system 40 Air transport module 41f1 Ceiling frame 43 Transport robot 60 Storage module 63 Case body 65 Rod member 67 Upper locking mechanism 68 Lower locking mechanism 631 Top plate 653 Operation unit W Circuit board

Claims

1. A semiconductor manufacturing system having a transport robot for transporting substrates and an air transport module including a storage module for storing the substrates, wherein the storage module comprises: a case body capable of accommodating a plurality of the substrates arranged vertically; a rod member provided on the case body and extending vertically; a locking mechanism for fixing the rod member to the case body; and an operating unit provided below the top plate of the case body for an operator to operate the rod member, wherein the rod member rises vertically upward based on the operation of the operating unit and is fixed by the locking mechanism, thereby maintaining a form that is braced against the ceiling frame of the air transport module, and fixing the storage module to the air transport module.

2. The semiconductor manufacturing system according to claim 1, wherein the rod member extends linearly across the top and bottom plates of the case body.

3. The semiconductor manufacturing system according to claim 2, wherein the rod member is screwed into a female screw hole formed in the bottom plate of the case body, and the operation of the operating part is performed by rotating the rod member around its axis.

4. The rod member has a large-diameter portion which is thicker than the upper and lower ends, and the operating portion is formed in the large-diameter portion, the semiconductor manufacturing system according to claim 3.

5. The semiconductor manufacturing system according to any one of claims 1 to 4, wherein the locking mechanism includes an upper locking mechanism provided on the top plate of the case body and a lower locking mechanism provided on the bottom plate of the case body.

6. The semiconductor manufacturing system according to claim 5, wherein the upper locking mechanism comprises an inner cylinder screw that is screwed into the upper threaded portion of the rod member, and a lock nut that secures the inner cylinder screw on at least one of the upper or lower sides of the top plate of the case body.

7. The semiconductor manufacturing system according to claim 5, wherein the lower locking mechanism includes a lock nut that is screwed onto the lower threaded portion of the rod member to fix the lower threaded portion to the bottom plate of the case body.

8. The semiconductor manufacturing system according to any one of claims 1 to 3, wherein the storage module is divisible into a first storage and a second storage located vertically below the first storage, and the case body, the rod member, the locking mechanism, and the operating unit are located in the first storage.

9. An installation method for assembling a storage module for storing substrates on an air transport module equipped with a transport robot for transporting substrates, wherein the storage module comprises: a case body capable of accommodating a plurality of substrates arranged vertically; a rod member provided on the case body and extending vertically; a locking mechanism for fixing the rod member to the case body; and an operating unit provided below the top plate of the case body for an operator to operate the rod member, the installation method comprising: (A) a step of placing the storage module on the air transport module; (B) a step of raising the rod member vertically upward based on the operation of the operating unit after step (A); and (C) a step of fixing the storage module to the air transport module by fixing the rod member with the locking mechanism, thereby maintaining a form that is braced against the ceiling frame of the air transport module.

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