Josephson parametric amplifier packaging module and superconducting quantum computing system

Abstract

A Josephson parametric amplifier packaging module, relating to the technical field of quantum computing. The Josephson parametric amplifier packaging module comprises a substrate (1), a magnetic shield (2), a circulator (3) and a Josephson parametric amplifier (4). The magnetic shield (2) is fixed on the substrate (1), and the magnetic shield (2) comprises a first cavity (201) and a second cavity (202). The circulator (3) and the Josephson parametric amplifier (4) are respectively located in the first cavity (201) and the second cavity (202), the circulator (3) comprises a first port (31), a second port (32) and a third port (33), and the Josephson parametric amplifier (4) comprises a signal port (41) and a pump port (42). The second port (32) is coupled to the signal port (41) by means of a connector (5), and the first port (31), the third port (33) and the pump port (42) extend to the exterior of the magnetic shield (2).

Description

Josephson parametric amplifier packaging module and superconducting quantum computing system

[0001] This application claims priority to Chinese Patent Application No. 202411645450.6, filed on November 18, 2024, entitled "Josephson Parametric Amplifier Packaging Module and Superconducting Quantum Computing System", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of quantum computing technology, and in particular to a Josephson parametric amplifier packaging module and a superconducting quantum computing system. Background Technology

[0003] In superconducting quantum computing systems, to obtain the computational results from a superconducting quantum chip, it is necessary to acquire and analyze the signal output by the chip. Typically, the signal output by a superconducting quantum chip is very weak, requiring an amplifier circuit to amplify it.

[0004] In related technologies, amplification circuits typically employ Josephson parametric amplifiers (JPAs) to amplify signals. However, Josephson parametric amplifiers are highly susceptible to interference from external signals. Therefore, reducing the interference experienced by Josephson parametric amplifiers is a critical technical issue. Summary of the Invention

[0005] This application provides a Josephson parametric amplifier packaging module and a superconducting quantum computing system. The Josephson parametric amplifier packaging module includes a circulator and a Josephson parametric amplifier, which are connected and disposed in different chambers. This reduces interference to the Josephson parametric amplifier. The technical solutions of the Josephson parametric amplifier packaging module and the superconducting quantum computing system are described below.

[0006] In one aspect, this application provides a Josephson parametric amplifier packaging module. The Josephson parametric amplifier packaging module includes a substrate, a magnetic shield, a circulator, and a Josephson parametric amplifier. The magnetic shield is fixed to the substrate. The magnetic shield includes a first chamber, a second chamber, a first through-hole, two second through-holes, and a third through-hole. The first through-hole connects the first chamber and the second chamber. The second through-hole connects the interior and exterior of the first chamber, and the third through-hole connects the interior and exterior of the second chamber. The circulator and the Josephson parametric amplifier are located in the first chamber and the second chamber, respectively. The circulator includes a first connector, a second connector, and a third connector. The Josephson parametric amplifier includes a signal connector and a pump connector. The second connector directly mates with the signal connector or mates with it via a connector; the second connector, the signal connector, or the connector passes through the first through-hole. The first connector and the third connector pass through the two second through-holes, and the pump connector passes through the third through-hole.

[0007] The circulator's conduction directions are: connector 1 to connector 2, connector 2 to connector 3, and connector 3 to connector 1. Connectors 1, 2, and 3 correspond to ports 1, 2, and 3 of the three-port circulator, respectively. Connector 1 of the circulator receives the signal to be amplified, which is then transmitted to connector 2. Connector 2 of the circulator sends the signal to be amplified to the signal connector of the Josephson parametric amplifier. The Josephson parametric amplifier amplifies the signal and then sends it back to connector 2 of the circulator through the signal connector. The amplified signal is transmitted from connector 2 to connector 3 of the circulator and then sent to subsequent amplification circuits. The pump connector of the Josephson parametric amplifier receives the pump signal, which is used to adjust the operating state of the Josephson parametric amplifier.

[0008] The technical solution provided in this application directly connects the signal connector of the Josephson parametric amplifier to the second connector of the circulator, or connects them via a connector, instead of using a cable connection. This solves, on the one hand, the technical problem of standing wave interference signals generated during microwave signal transmission over cables interfering with the Josephson parametric amplifier. On the other hand, it reduces the loss of microwave signals transmitted between the circulator and the Josephson parametric amplifier.

[0009] Furthermore, since the Josephson parametric amplifier (JPA) is directly or indirectly connected to the circulator via a connector, the proximity of the JPA and circulator increases the interference of the circulator's magnetic field on the JPA. This application addresses this by using a magnetic shield comprising a separated first and second chamber, with the circulator and JPA respectively housed within these chambers, providing omnidirectional enclosure for both. This reduces the interference from the circulator's magnetic field on the JPA. Moreover, the omnidirectional enclosure of the JPA also reduces interference from the external environment, enabling the JPA packaging module provided by this application to be used in a wider variety of superconducting quantum computing systems.

[0010] In one implementation, the magnetic shield includes a base plate, a surrounding plate, a top plate, and a partition. The base plate, surrounding plate, and top plate form a receiving cavity. The partition is located within the receiving cavity and divides the cavity into a first chamber and a second chamber. The partition includes a first through-hole, and the surrounding plate or top plate includes a second and a third through-hole. A substrate is bonded to the outer surface of the base plate, and the circulator and Josephson parametric amplifier are bonded to the inner surface of the base plate to facilitate heat transfer from the circulator and Josephson parametric amplifier to the substrate. By integrating the circulator and Josephson parametric amplifier into a single magnetic shield, the integration density of the Josephson parametric amplifier packaging module is improved.

[0011] In one implementation, the enclosure includes a first enclosure and a second enclosure. The partition includes a first partition and a second partition. The magnetic shielding cover includes a base and a top cover. The base includes a bottom plate, a first enclosure, and a first partition. The top cover includes a top plate, a second enclosure, and a second partition.

[0012] In one implementation, the first enclosure includes at least one first opening, which opens on the side facing the top plate. The second enclosure includes at least one second opening, which opens on the side facing the bottom plate. The second enclosure surrounds the first enclosure, with a portion of the first opening and a portion of the second opening opposite each other, and a second or third through hole is formed between a portion of the wall of the first opening and a portion of the wall of the second opening.

[0013] The technical solution provided in this application includes a first opening on the side facing the top plate in the first enclosure, allowing connector No. 1, connector No. 3, or pump connector to pass through the opening of the first opening. Similarly, a second opening on the side facing the bottom plate in the second enclosure allows connector No. 1, connector No. 3, or pump connector to pass through the opening of the second opening during the assembly of the top cover. After the base and top cover are assembled, a portion of the wall of the first opening and a portion of the wall of the second opening form a second or third through-hole. Because the area of ​​the second or third through-hole is smaller than the areas of the first and second openings, and it is circumferentially closed, the gap between the wall of the second or third through-hole and the outer wall of the connector is smaller, improving the magnetic shielding effect of the enclosure and thus reducing the influence of the circulator's magnetic field on the Josephson parametric amplifier. Furthermore, since the second enclosure surrounds the first enclosure, the magnetic shielding cover actually includes two layers of enclosures, further improving the magnetic shielding effect of the magnetic shielding cover.

[0014] In one implementation, the first enclosure includes at least one first opening, which opens on the side facing the top plate. The second enclosure includes at least one second opening, which opens on the side facing the bottom plate. Along a third direction, the second enclosure abuts against the first enclosure, and the walls of the first and second openings form a second or third through-hole. The third direction is perpendicular to the bottom plate.

[0015] The technical solution provided in this application includes a first opening on the side facing the top plate in the first enclosure, allowing connector No. 1, connector No. 3, or pump connector to pass through the opening of the first opening. Similarly, a second opening on the side facing the bottom plate in the second enclosure allows connector No. 1, connector No. 3, or pump connector to pass through the opening of the second opening during the assembly of the top cover. After the base and top cover are assembled, the walls of the first and second openings form a first through-hole. Because the first through-hole is circumferentially closed and not open on one side, the magnetic shielding effect of the enclosure is improved, thereby reducing the influence of the circulator's magnetic field on the Josephson parametric amplifier.

[0016] In one implementation, the second or third perforation is a circular hole, and the connector passing through the second or third perforation is cylindrical, with the circular hole and connector having a clearance fit. This reduces the gap between the second or third perforation and the connector, improving the magnetic shielding effect of the enclosure.

[0017] In one implementation, the first partition includes a third opening that opens on the side facing the top plate. The second partition includes a fourth opening that opens on the side facing the bottom plate. The first and second partitions are stacked along a first direction, with a portion of the third opening opposite a portion of the fourth opening, and a first perforation formed between a portion of the wall of the third opening and a portion of the wall of the second opening. The first and second chambers are arranged along the first direction.

[0018] The technical solution provided in this application includes a first partition plate with a third opening on the side facing the top plate, allowing a second connector, signal connector, or other connector to pass through the opening of the third opening. A second partition plate includes a fourth opening on the side facing the bottom plate, allowing the second connector, signal connector, or other connector to pass through the opening of the fourth opening during top cover assembly. After the base and top cover are assembled, the first and second partition plates are stacked, with a portion of the wall of the third opening and a portion of the wall of the fourth opening forming a first through-hole. Because the area of ​​the first through-hole is smaller than the areas of the third and fourth openings and is circumferentially closed, the gap between the wall of the first through-hole and the outer wall of the connector is smaller, improving the magnetic isolation effect of the partition plate and thus reducing the influence of the circulator's magnetic field on the Josephson parametric amplifier. Furthermore, the stacked arrangement of the first and second partition plates creates two layers of plates between the Josephson parametric amplifier and the circulator, which also improves the magnetic isolation effect of the partition plate.

[0019] In one implementation, the first partition includes a third opening that opens on the side facing the top plate. The second partition includes a fourth opening that opens on the side facing the bottom plate. Along a third direction, the first partition abuts against the second partition, and the walls of the third and fourth openings form a first through-hole. This third direction is perpendicular to the bottom plate.

[0020] The technical solution provided in this application includes a first partition with a third opening on the side facing the top plate, allowing a second connector, signal connector, or other connector to pass through the opening of the third opening. A second partition includes a fourth opening on the side facing the bottom plate, allowing the second connector, signal connector, or other connector to pass through the opening of the fourth opening during the assembly of the top cover. After the base and top cover are assembled, the walls of the third and fourth openings form a first through-hole. Because the first through-hole is circumferentially closed and not open on one side, the magnetic isolation effect of the partition is improved, thereby reducing the influence of the circulator's magnetic field on the Josephson parametric amplifier.

[0021] In one implementation, the first partition includes two first side panels, which are respectively connected to both sides of the first partition. Each of the two first side panels includes an opening that extends through the first side panel along its thickness and is open on the side facing the top panel. The two sides of the second partition extend into the two openings respectively.

[0022] The technical solution provided in this application reduces the gap between the two sides of the second partition and the two first side plates by setting the two sides of the second partition to extend into the openings of the two first side plates of the first enclosure, thereby enhancing the magnetic isolation effect of the second partition and reducing the influence of the circulator's magnetic field on the Josephson parametric amplifier.

[0023] In one implementation, the first perforation is circular, and the connector or appendage passing through the first perforation is cylindrical, with the circular perforation and the connector or appendage having a clearance fit. This reduces the gap between the first perforation and the connector, improving the magnetic shielding effect of the partition.

[0024] In one implementation, the Josephson parametric amplifier package module further includes multiple first screws. The first screws pass sequentially through the substrate and the base plate, and are tightened into the circulator or Josephson parametric amplifier, thereby fixing the base to the heat sink.

[0025] In one implementation, the second enclosure plate protrudes relative to the base plate. The substrate includes a boss that fits against the outer surface of the base plate, and the second enclosure plate surrounds the boss. The Josephson parametric amplifier package module also includes multiple second screws that pass through the second enclosure plate and are screwed into the boss. This secures the top cover to the heat sink, improving the reliability of the top cover's fixation.

[0026] In one implementation, one of the two second perforations is located in the surrounding panel, and the other is located in the top panel. The third perforation is located in the surrounding panel and is positioned opposite to the second perforation located in the surrounding panel.

[0027] In one implementation, the magnetic shield includes a first sub-magnetic shield and a second sub-magnetic shield, with two first perforations. The first sub-magnetic shield includes a first chamber, two second perforations, and one first perforation. The second sub-magnetic shield includes a second chamber, a third perforation, and another first perforation. The first and second sub-magnetic shields can also be considered as two separate magnetic shields.

[0028] In one implementation, the magnetic shielding also includes a third chamber and a fourth through-hole, the fourth through-hole connecting the interior and exterior of the third chamber. The Josephson parametric amplifier package module also includes an isolator located in the third chamber. The isolator includes an input connector and an output connector, the input connector passing through the fourth through-hole, and the output connector connected to a first connector. The isolator can be a two-section circulator. The input connector is used to connect to the superconducting quantum chip and receive the signal to be amplified from the superconducting quantum chip. The output connector is used to send the signal to be amplified to the first connector of the circulator.

[0029] The technical solution provided in this application further improves the integration of the Josephson parametric amplifier package module by integrating the isolator, circulator, and Josephson parametric amplifier together. Furthermore, it reduces the cable length between the isolator and circulator, thereby lowering signal transmission loss between them.

[0030] In one implementation, the magnetic shielding also includes a fifth through-hole, which connects the interior and exterior of the third chamber. An output connector passes through the fifth through-hole and is connected to a first connector via a cable.

[0031] In one implementation, the first chamber and the second chamber are arranged along a first direction, and the third chamber and either the first chamber or the second chamber are arranged along a second direction. The first direction is perpendicular to the second direction.

[0032] The technical solution provided in this application, through the above-described configuration, makes the projection of the Josephson parametric amplifier package module in the direction perpendicular to the heat sink tend to be circular or square. This facilitates the fixing of the Josephson parametric amplifier package module onto a circular cold plate.

[0033] In one implementation, the magnetic shielding cover includes a base plate, a surrounding plate, a top plate, a partition plate, and a third partition plate. The base plate, surrounding plate, and top plate form a receiving cavity, and the partition plate and third partition plate are located within the receiving cavity, dividing the receiving cavity into a first chamber, a second chamber, and a third chamber. The partition plate includes a first perforation, and the surrounding plate or top plate includes a second, third, and fourth perforation. The substrate is bonded to the outer surface of the base plate, and the circulator, Josephson parametric amplifier, and isolator are bonded to the inner surface of the base plate.

[0034] In one implementation, the Josephson parametric amplifier further includes a package and a Josephson parametric amplifier chip. A signal connector and a pump connector are fixed to two opposite sidewalls of the package. The package includes a central chamber into which a first center conductor of the signal connector and a second center conductor of the pump connector extend. The Josephson parametric amplifier chip is located within the central chamber and is wire-bonded to the first and second center conductors, respectively.

[0035] The technical solution provided in this application, by setting the Josephson parametric amplifier chip to the signal connector and pump connector via aluminum wire bonding, eliminates the need for microstrip lines and the soldering points between the connectors and microstrip lines, compared to the technical solution that uses microstrip lines to connect the Josephson parametric amplifier chip to the signal connector and pump connector. This results in smaller impedance fluctuations in the Josephson parametric amplifier and reduces the possibility of impedance mismatch between the Josephson parametric amplifier and the superconducting quantum chip.

[0036] Secondly, this application provides a superconducting quantum computing system. The superconducting quantum computing system includes a Josephson parametric amplifier package module as described in any of the first aspects. The Josephson parametric amplifier package module is used in the first-stage amplifier circuit of the superconducting quantum computing system, and the first-stage amplifier circuit is connected between the superconducting quantum chip and subsequent amplifier circuits. Attached Figure Description

[0037] Figure 1 is a schematic diagram of a superconducting quantum computing system;

[0038] Figure 2 is a schematic diagram of a first-stage amplifier circuit;

[0039] Figure 3 is a schematic diagram of the connection methods of isolators, circulators and Josephson parametric amplifiers in related technologies;

[0040] Figure 4 is a schematic diagram of a Josephson parametric amplifier packaging module provided in an embodiment of this application;

[0041] Figure 5 is an external view of a Josephson parametric amplifier packaging module provided in an embodiment of this application;

[0042] Figure 6 is an external view of a Josephson parametric amplifier packaging module provided in an embodiment of this application;

[0043] Figure 7 is a schematic diagram of the internal structure of a Josephson parametric amplifier packaging module provided in an embodiment of this application;

[0044] Figure 8 is a schematic diagram of another Josephson parametric amplifier packaging module provided in an embodiment of this application;

[0045] Figure 9 is an exploded view of a Josephson parametric amplifier packaging module provided in an embodiment of this application;

[0046] Figure 10 is a schematic diagram of a magnetic shielding cover provided in an embodiment of this application;

[0047] Figure 11 is a schematic diagram of a top cover provided in an embodiment of this application;

[0048] Figure 12 is a cross-sectional view of a magnetic shielding cover provided in an embodiment of this application;

[0049] Figure 13 is a schematic diagram of another magnetic shielding cover provided in an embodiment of this application;

[0050] Figure 14 is a cross-sectional view of another magnetic shielding cover provided in an embodiment of this application;

[0051] Figure 15 is an exploded view of a Josephson parametric amplifier packaging module provided in an embodiment of this application;

[0052] Figure 16 is a schematic diagram of the bottom of a Josephson parametric amplifier package module provided in an embodiment of this application;

[0053] Figure 17 is a schematic diagram of another Josephson parametric amplifier packaging module provided in an embodiment of this application;

[0054] Figure 18 is a schematic diagram of a first Josephson parametric amplifier package module including an isolator provided in an embodiment of this application;

[0055] Figure 19 is a schematic diagram of a second Josephson parametric amplifier package module including an isolator provided in an embodiment of this application;

[0056] Figure 20 is a schematic diagram of a third Josephson parametric amplifier package module including an isolator provided in an embodiment of this application;

[0057] Figure 21 is an external view of a Josephson parametric amplifier package module including an isolator provided in an embodiment of this application;

[0058] Figure 22 is a schematic diagram of the internal structure of a Josephson parametric amplifier package module including an isolator provided in an embodiment of this application;

[0059] Figure 23 is an exploded view of a Josephson parametric amplifier provided in an embodiment of this application;

[0060] Figure 24 is a schematic diagram of the internal structure of a Josephson parametric amplifier provided in an embodiment of this application.

[0061] Legend: 100. Measurement and control system; 200. Dilution refrigerator; 300. Superconducting quantum chip; 400. First-stage amplifier circuit; 500. Subsequent amplifier circuit; 1. Substrate; 11. Boss; 111. Boss perforation; 2. Magnetic shield; 2001. First sub-magnetic shield; 2002. Second sub-magnetic shield; 2a. Base; 2b. Top cover; 20. Receiving cavity; 201. First chamber; 202. Second chamber; 203. First perforation; 204. Second perforation; 205. Third perforation; 206. Third chamber; 207. Fourth perforation; 208. Fifth perforation; 21. Base plate; 22. Enclosure plate; 221. First enclosure panel, 2210, opening, 2211, first side panel, 2212, second side panel, 2213, first opening, 222, second enclosure panel, 2221, third side panel, 2222, fourth side panel, 2223, second opening, 23, top panel, 24, partition, 241, first partition, 2411, third opening, 242, second partition, 2421, fourth opening, 25, third partition; 3. Circulator; 31. Connector 1; 32. Connector 2; 33. Connector 3; 4. Josephson parametric amplifier; 41. Signal connector; 411. First center conductor; 42. Pump connector; 421. Second center conductor; 43. Package box; 430. Central chamber; 431. Package holder; 432. Package cover; 44. Josephson parametric amplifier chip; 45. Aluminum wire; 5. Connector; 6. First screw; 7. Second screw; 8. Isolator; 81. Input connector; 82. Output connector; 9. Cable; X, First direction; Y, Second direction; Z, Third direction. Detailed Implementation

[0062] Quantum computing is a novel computing method based on quantum mechanics, utilizing properties such as quantum superposition and entanglement. For certain specific problems, such as large number factorization and quantum chemical simulations, quantum computing offers an exponential speedup advantage over classical computing.

[0063] Superconducting quantum computing systems are one type of physical system for realizing quantum computing. Figure 1 shows a schematic diagram of a superconducting quantum computing system. As shown in Figure 1, the superconducting quantum computing system includes a control system 100, a dilution refrigerator 200, and a superconducting quantum chip 300. The control system 100 is used to manipulate the states of the qubits for computational operations and to read the states of the qubits. The dilution refrigerator 200 provides a low-temperature environment (approximately 10 mK) for the superconducting quantum chip 300 and related circuitry. The superconducting quantum chip 300 is used to encode and execute quantum computing information.

[0064] During the operation of the superconducting quantum computing system, the measurement and control system 100 controls the microwave source and digital-to-analog converter (DAC) to modulate microwave pulse signals according to the computational requirements. A series of microwave pulse signal sequences are input to the superconducting quantum chip 300 to manipulate the state of the qubits. After all operations are completed, the measurement and control system 100 outputs measurement pulse signals to the superconducting quantum chip 300, which then sends a return signal back to the measurement and control system 100. The measurement and control system 100 obtains the qubit state information and the computational result by observing the changes in the return signal from the superconducting quantum chip 300.

[0065] Measurement pulse signals are easily affected by environmental noise, causing the signal to be typically less than -100 dBm after multiple attenuation stages before reaching the superconducting quantum chip 300. Therefore, the weak measurement pulse signal returning from the superconducting quantum chip 300 needs to be amplified by a multi-stage amplifier circuit before it can be detected by the measurement and control system 100. Thus, as shown in Figure 1, the superconducting quantum computing system also includes a multi-stage amplifier circuit, exemplarily comprising a first-stage amplifier circuit 400 and subsequent amplifier circuits 500. Since the amplifier circuits themselves introduce noise into the returning signal, and the overall noise of the multi-stage amplifier circuit is mainly determined by the noise of the first-stage amplifier circuit, the first-stage amplifier circuit 400 is particularly important.

[0066] Figure 2 shows a schematic diagram of a first-stage amplifier circuit 400. As shown in Figure 2, the first-stage amplifier circuit 400 includes an isolator 8, a circulator 3, and a Josephson parametric amplifier (JPA) 4. The input terminal of the isolator 8 is connected to the superconducting quantum chip 300, and the output terminal of the isolator 8 is connected to port 1 of the circulator 3. Port 2 of the circulator 3 is connected to the Josephson parametric amplifier 4. Port 3 of the circulator 3 is used to connect to the subsequent amplifier circuit 500. The isolator 8 is used to block noise from the Josephson parametric amplifier 4 from entering the superconducting quantum chip 300. The circulator 3 is used to guide the amplified signal from the Josephson parametric amplifier 4 to the subsequent amplifier circuit 500, preventing the amplified signal from returning to the superconducting quantum chip 300 and affecting the quantum state. The Josephson parametric amplifier 4 is a reflective amplifier that uses the nonlinear inductance of a Josephson junction to achieve microwave signal gain. The Josephson junction is a sandwich structure device composed of a superconducting gold layer, an insulating layer, and a superconducting metal layer, and is used as a nonlinear inductor.

[0067] During the operation of the first-stage amplifier circuit 400, the isolator 8 receives the signal to be amplified from the superconducting quantum chip 300 and sends the signal to be amplified to port 1 of the circulator 3. The circulator 3 sends the signal to be amplified to the Josephson parametric amplifier 4 through port 2. The Josephson parametric amplifier 4 amplifies the signal and sends the amplified signal to port 2 of the circulator 3. The amplified signal is then transmitted through port 2 of the circulator 3 to port 3, and finally output to the subsequent amplifier circuit 500.

[0068] Figure 3 is a schematic diagram of the connection between isolator 8, circulator 3, and Josephson parametric amplifier 4 in the related technology. As shown in Figure 3, isolator 8 and circulator 3, as well as circulator 3 and Josephson parametric amplifier 4, are connected by cables 9, each several centimeters long. During the transmission of microwave signals (such as the aforementioned measurement pulse signal) along the cable 9 between circulator 3 and Josephson parametric amplifier 4, standing wave interference signals are generated. The longer the cable 9, the more pronounced the interference from the standing wave signal in the operating frequency band of Josephson parametric amplifier 4. Furthermore, signal loss occurs during transmission along the cable 9, and the longer the cable 9, the more severe the loss. Moreover, Josephson parametric amplifier 4 is highly sensitive to environmental changes, which limits its application to a single superconducting quantum computing system.

[0069] In view of the above-mentioned technical problems, this application provides a Josephson parametric amplifier packaging module. This Josephson parametric amplifier packaging module can solve the above-mentioned technical problems. Figure 4 shows a schematic diagram of the Josephson parametric amplifier packaging module. Figures 5 and 6 show the external shape of the Josephson parametric amplifier packaging module. Figure 7 shows the internal structure of the Josephson parametric amplifier packaging module.

[0070] The Josephson parametric amplifier packaging module provided in this application embodiment will now be described. As shown in Figures 4-7, the Josephson parametric amplifier packaging module includes a substrate 1, a magnetic shield 2, a circulator 3, and a Josephson parametric amplifier 4. The magnetic shield 2 is fixed to the substrate 1. As shown in Figures 4 and 7, the magnetic shield 2 includes a first chamber 201 and a second chamber 202 separated from each other, and the first chamber 201 and the second chamber 202 are connected by a first through-hole 203. As shown in Figures 4-7, the magnetic shield 2 also includes two second through-holes 204 and a third through-hole 205. The second through-holes 204 connect the interior of the first chamber 201 and the exterior of the magnetic shield 2, and the third through-hole 205 connects the interior of the second chamber 202 and the exterior of the magnetic shield 2.

[0071] As shown in Figures 4 and 7, the circulator 3 and the Josephson parametric amplifier 4 are located in the first chamber 201 and the second chamber 202, respectively. The circulator 3 includes a first connector 31, a second connector 32, and a third connector 33. The Josephson parametric amplifier 4 includes a signal connector 41 and a pump connector 42. The second connector 32 directly connects to the signal connector 41 or connects to it via a connector 5. The second connector 32, the signal connector 41, or the connector 5 passes through the first through-hole 203. The first connector 31 and the third connector 33 pass through two second through-holes 204, respectively. The pump connector 42 passes through a third through-hole 205. This facilitates the external connection of the first connector 31, the third connector 33, and the pump connector 42.

[0072] The Josephson parametric amplifier package module can be connected to the dilution refrigerator 200 through copper structural components, so that the Josephson parametric amplifier package module can be placed in a low-temperature environment.

[0073] The substrate 1 is used to fix the magnetic shield 2, the circulator 3, and the Josephson parametric amplifier 4, and the substrate 1 can be thermally connected to the dilution refrigerator 200 to reduce the temperature of the circulator 3 and the Josephson parametric amplifier 4. In some examples, the substrate 1 is made of copper. For example, the substrate 1 is a copper substrate. The magnetic shield 2 is used to achieve magnetic shielding. In some examples, the magnetic shield 2 is made of nickel-iron alloy, specifically, a high-permeability nickel-iron alloy called cryoperm. The conduction direction of the circulator 3 is from connector 31 to connector 32, from connector 32 to connector 33, and from connector 33 to connector 31. Connectors 31, 32, and 33 correspond to ports 1, 2, and 3 of the three-port circulator, respectively. Connector 31 of the circulator 3 is used to receive the signal to be amplified, and the signal to be amplified is transmitted from connector 31 to connector 32. The second connector 32 of the circulator 3 sends the signal to be amplified to the signal connector 41 of the Josephson parametric amplifier 4. The Josephson parametric amplifier 4 amplifies the signal and then sends it back to the second connector 32 of the circulator 3 via the signal connector 41. The amplified signal is then transmitted from the second connector 32 to the third connector 33 of the circulator 3 and sent to the subsequent amplification circuit 500. Additionally, the pump connector 42 of the Josephson parametric amplifier 4 receives the pump signal, which is used to adjust the operating state of the Josephson parametric amplifier 4.

[0074] The technical solution provided in this application embodiment directly connects the signal connector 41 of the Josephson parametric amplifier 4 to the second connector 32 of the circulator 3, or connects them through the connector 5, instead of connecting them through the cable 9. This reduces the length of the cable 9 between the circulator 3 and the Josephson parametric amplifier 4 to zero. In this way, on the one hand, it solves the technical problem of standing wave interference signal generated during microwave signal transmission on the cable 9 interfering with the Josephson parametric amplifier 4. On the other hand, it reduces the loss of the microwave signal transmitted between the circulator 3 and the Josephson parametric amplifier 4.

[0075] Furthermore, since the Josephson parametric amplifier 4 is directly connected to the circulator 3 or connected via the connector 5, the distance between the Josephson parametric amplifier 4 and the circulator 3 is relatively short, which increases the interference of the circulator 3's magnetic field on the Josephson parametric amplifier 4. However, this embodiment of the application, by setting a magnetic shield 2 including a separated first chamber 201 and a second chamber 202, ensures that after the circulator 3 and the Josephson parametric amplifier 4 are respectively placed in the first chamber 201 and the second chamber 202, the circulator 3 and the Josephson parametric amplifier 4 are omnidirectionally surrounded. This reduces the interference of the circulator 3's magnetic field on the Josephson parametric amplifier 4. Moreover, because the Josephson parametric amplifier 4 is omnidirectionally surrounded, the influence of the external environment on the Josephson parametric amplifier 4 is reduced, enabling the Josephson parametric amplifier packaging module provided in this embodiment of the application to be used in superconducting quantum computing systems in various environments.

[0076] It should be noted that the aforementioned connector 32 and signal connector 41 can be directly connected, or they can be connected through connector 5. For example, if one of connector 32 and signal connector 41 is male and the other is female, then connector 32 and signal connector 41 can be directly connected. As another example, if both connector 32 and signal connector 41 are male, then both ends of connector 5 are female, and both ends of connector 5 connect to connector 32 and signal connector 41 respectively. Again, if both connector 32 and signal connector 41 are female, then both ends of connector 5 are male, and both ends of connector 5 connect to connector 32 and signal connector 41 respectively.

[0077] This application does not limit the implementation of the magnetic shielding cover 2. In some examples, as shown in Figures 5 and 6, the magnetic shielding cover 2 includes a base plate 21, a surrounding plate 22, and a top plate 23, which together form a receiving cavity 20. As shown in Figures 4 and 7, the magnetic shielding cover 2 also includes a partition plate 24 located in the receiving cavity 20, dividing the receiving cavity 20 into a first chamber 201 and a second chamber 202. The partition plate 24 includes a first perforation 203. The surrounding plate 22 or the top plate 23 includes a second perforation 204 and a third perforation 205. The substrate 1 is attached to the outer surface of the base plate 21, and the circulator 3 and the Josephson parametric amplifier 4 are attached to the inner surface of the base plate 21. This facilitates the transfer of temperature from the circulator 3 and the Josephson parametric amplifier 4 to the substrate 1 through the base plate 21.

[0078] In this embodiment, there is no limitation on which plate of the magnetic shield 2 the first connector 31, the third connector 33, and the pump connector 42 penetrate, as long as they penetrate the magnetic shield 2 and allow each connector to connect externally. In some examples, as shown in Figures 4 and 7, the pump connector 42 and the signal connector 41 are arranged opposite each other, and the first connector 31 and the second connector 32 are arranged opposite each other. In this case, the pump connector 42 and the first connector 31 penetrate the enclosure plate 22, and the two plates they penetrate are arranged opposite each other. In addition, the third connector 33 penetrates the top plate 23. It should be noted that the positions of the first connector 31 and the third connector 33 in Figures 4 and 7 can be interchanged. In addition, in some examples, as shown in Figure 8, the first connector 31, the third connector 33, and the pump connector 42 can all penetrate the enclosure plate 22.

[0079] Figure 9 shows an exploded view of the Josephson parametric amplifier package module. In some examples, as shown in Figure 9, the magnetic shield 2 comprises a base 2a and a top cover 2b. The base 2a includes a base plate 21, a first enclosure plate 221, and a first partition plate 241. The top cover 2b includes a top plate 23, a second enclosure plate 222, and a second partition plate 242 (as shown in Figure 11). The first enclosure plate 221 and the second enclosure plate 222 together form the enclosure plate 22. The first partition plate 241 and the second partition plate 242 together form the partition plate 24. When assembling the Josephson parametric amplifier package module, the circulator 3 and the Josephson parametric amplifier 4 are first fixed in the base 2a, and then the top cover 2b is used to close the base 2a.

[0080] In some examples, the first enclosure 221 is perpendicular to the bottom plate 21, and the second enclosure 222 is perpendicular to the top plate 23.

[0081] Figure 10 shows a schematic diagram of a magnetic shield 2. In some examples, as shown in Figure 10, a second enclosure 222 surrounds a first enclosure 221. Thus, the magnetic shield 2 actually comprises two enclosures, thereby improving the magnetic shielding effect of the magnetic shield 2.

[0082] Figure 11 shows a schematic diagram of the top cover 2b. In some examples, as shown in Figure 10, the first enclosure 221 includes at least one first opening 2213, which is open on the side facing the top plate 23. Thus, connector 31, connector 33, or pump connector 42 can be inserted into the first opening 2213 through its opening (as shown in Figure 7). As shown in Figure 11, the second enclosure 222 includes at least one second opening 2223, which is open on the side facing the bottom plate 21. Thus, when assembling the top cover 2b, connector 31, connector 33, or pump connector 42 can be inserted into the second opening 2223 through its opening (as shown in Figures 5 and 6).

[0083] As shown in Figure 10, after the base 2a and the top cover 2b are assembled, a portion of the first opening 2213 and a portion of the second opening 2223 are opposite each other. The other portion of the first opening 2213 is blocked by the second enclosure 222, and the other portion of the second opening 2223 is blocked by the first enclosure 221. A portion of the wall of the first opening 2213 and a portion of the wall of the second opening 2223 form a second through hole 204 or a third through hole 205. The area of ​​the second through hole 204 (or the third through hole 205) is smaller than the areas of the first opening 2213 and the second opening 2223, and it is circumferentially closed. This results in a smaller gap between the wall of the second through hole 204 (or the third through hole 205) and the outer wall of the connector, improving the magnetic shielding effect of the enclosure 22 and thus reducing the influence of the circulator 3's magnetic field on the Josephson parametric amplifier 4.

[0084] In addition to the technical solution shown in Figure 12 where the second enclosure 222 surrounds the first enclosure 221, in other examples, as shown in Figure 13, after the base 2a and the top cover 2b are assembled, the first enclosure 221 and the second enclosure 222 abut against each other along the third direction Z, and the hole wall of the first opening 2213 and the hole wall of the second opening 2223 form a second through hole 204 or a third through hole 205.

[0085] In some examples, as shown in Figure 12, the second perforation 204 is a circular hole, and the connector passing through the second perforation 204 is cylindrical, with the circular hole and the connector having a clearance fit. This reduces the gap between the wall of the second perforation 204 and the connector.

[0086] In some examples, as shown in Figure 12, the third perforation 205 is a circular hole, and the connector passing through the third perforation 205 is cylindrical, with the circular hole and connector having a clearance fit. This reduces the gap between the wall of the third perforation 205 and the connector.

[0087] In some examples, as shown in Figure 10, the first enclosure 221 includes two first side panels 2211 and two second side panels 2212, with the two first side panels 2211 and the two second side panels 2212 arranged opposite to each other. The first side panels 2211 and the second side panels 2212 are perpendicular to each other and both are perpendicular to the bottom plate 21.

[0088] In some examples, as shown in Figure 10, the first side plate 2211 includes the aforementioned first opening 2213.

[0089] In some examples, as shown in Figure 11, the second enclosure 222 includes two third side panels 2221 and two fourth side panels 2222, with the two third side panels 2221 and the two fourth side panels 2222 facing each other. The third side panels 2221 and the fourth side panels 2222 are perpendicular to each other and both are perpendicular to the top panel 23.

[0090] In some examples, as shown in Figure 11, the third side plate 2221 includes the aforementioned second opening 2223.

[0091] The implementation of partition 24 is illustrated below. In some examples, as shown in FIG12 and with reference to FIGS. 10 and 11, the first partition 241 includes a third opening 2411, which is open on the side facing the top plate 23. Thus, the second connector 32, signal connector 41, or connector 5 can be inserted into the third opening 2411 through its opening (as shown in FIG. 7). As shown in FIG. 11, the second partition 242 includes a fourth opening 2421, which is open on the side facing the bottom plate 21. Thus, when assembling the top cover 2b, the second connector 32, signal connector 41, or connector 5 can be inserted into the fourth opening 2421 through its opening.

[0092] As shown in Figure 12, after the base 2a and the top cover 2b are assembled, the first partition 241 and the second partition 242 are stacked along the first direction X. A portion of the third opening 2411 and a portion of the fourth opening 2421 are opposite each other. The other portion of the third opening 2411 is blocked by the second partition 242, and the other portion of the fourth opening 2421 is blocked by the first partition 241. A portion of the hole wall of the third opening 2411 and a portion of the hole wall of the fourth opening 2421 form a first through hole 203. The area of ​​the first through hole 203 is smaller than the areas of the third opening 2411 and the fourth opening 2421 and is closed circumferentially. This makes the gap between the hole wall of the first through hole 203 and the outer wall of the connector (or connector) smaller, which improves the magnetic isolation effect of the partition 24 and thus reduces the influence of the magnetic field of the circulator 3 on the Josephson parametric amplifier 4. Furthermore, since the first partition 241 and the second partition 242 are stacked, there are two layers of plates between the Josephson parametric amplifier 4 and the circulator 3, which also improves the magnetic isolation effect of the partition 24.

[0093] In addition to the stacked arrangement of the first partition 241 and the second partition 242 shown in Figure 12, in other examples, as shown in Figure 14, after the base 2a and the top cover 2b are assembled, in the third direction Z, the first partition 241 and the second partition 242 abut against each other, and the third opening 2411 and the fourth opening 2421 form a first through hole 203 for the signal connector 41, the second connector 32 or the connector 5 to pass through.

[0094] In some examples, as shown in Figure 14, the first partition 241 is perpendicular to the bottom plate 21. The second partition 242 is perpendicular to the top plate 23.

[0095] In some examples, as shown in Figure 15, the first enclosure 221 includes two first side plates 2211, which are respectively connected to the two sides of the first partition 241. The second partition 242 needs to extend between the two first side plates 2211, inevitably creating gaps between the two sides of the second partition 242 and the two first side plates 2211. To reduce these gaps and improve the magnetic isolation effect of the partition 241, in some examples, as shown in Figure 15, each of the two first side plates 2211 includes an opening 2210. The opening 2210 extends through the first side plate 2211 along its thickness direction and is open on the side facing the top plate 23. The two sides of the second partition 242 extend into the two openings 2210. This reduces the gap between the second partition 242 and the first side plates 2211, enhancing the magnetic isolation effect of the second partition 242.

[0096] In addition, the second enclosure 222 surrounds the first enclosure 221, thereby blocking the openings 2210 of the two first side panels 2211 and improving the magnetic shielding effect of the magnetic shielding cover 2.

[0097] In some examples, as shown in Figure 11, the second enclosure 222 includes two third side panels 2221, which are respectively disposed opposite to the two first side panels 2211. The two sides of the second partition 242 are respectively fixedly connected to the two third side panels 2221.

[0098] The following describes the fixing method of the base 2a and the top cover 2b. Figure 16 shows a schematic diagram of the bottom of the Josephson amplifier package module. In some examples, as shown in Figure 16, the Josephson parametric amplifier package module also includes multiple first screws 6, which pass through the substrate 1 and the base plate 21 in sequence and are screwed into the circulator 3 or the Josephson parametric amplifier 4.

[0099] In some examples, as shown in Figures 10 and 12, the second enclosure 222 protrudes relative to the base plate 21. As shown in Figure 9, the substrate 1 includes a boss 11, which is attached to the outer surface of the base plate 21. The second enclosure 222 surrounds the boss 11. The Josephson parametric amplifier package module also includes a plurality of second screws 7, which pass through the second enclosure 222 and are screwed into the boss 11. By setting the second screws 7 to pass through the second enclosure 222 and be screwed into the boss 11, the upper cover 2b is fixed to the substrate 1, thereby improving the stability of the upper cover 2b.

[0100] In some examples, as shown in Figure 9, the sidewall of the boss 11 includes a boss through hole 111 for screwing in the second screw 7.

[0101] Besides the technical solution of dividing the receiving cavity 20 of the magnetic shield 2 into a first chamber 201 and a second chamber 202 by setting a partition 24 inside the shield 2, in other examples, as shown in Figure 17, the magnetic shield 2 includes a first sub-magnetic shield 2001 and a second sub-magnetic shield 2002. There are two first perforations 203. The first sub-magnetic shield 2001 includes a first chamber 201, two second perforations 204, and one first perforation 203. The second sub-magnetic shield 2002 includes a second chamber 202, a third perforation 205, and another first perforation 203. The first sub-magnetic shield 2001 and the second sub-magnetic shield 2002 can be considered as two shields 2. The relevant structures of the first sub-magnetic shield 2001 and the second sub-magnetic shield 2002 can be roughly the same as the structure of the magnetic shield 2 described above, the difference being that the sub-magnetic shield does not have a partition inside. That is, both the first sub-magnetic shield 2001 and the second sub-magnetic shield 2002 include a base 2a and an upper cover 2b (the upper cover 2b is hidden in Figure 17). The base 2a includes a bottom plate 21 and a first surrounding plate 221, and the upper cover 2b includes a top plate 23 and a second surrounding plate 222.

[0102] In addition to packaging the circulator 3 and the Josephson parametric amplifier 4 together, in some examples, the isolator 8, circulator 3, and Josephson parametric amplifier 4 can also be packaged together. This further improves the integration of the Josephson parametric amplifier package module. Furthermore, it reduces the length of the cable 9 between the isolator 8 and the circulator 3, thus reducing signal transmission loss between them.

[0103] Figures 18-20 show schematic diagrams of the Josephson parametric amplifier package module including isolator 8. Figure 21 shows the external view of the Josephson parametric amplifier package module including isolator 8. Figure 22 shows a schematic diagram of the internal structure of the Josephson parametric amplifier package module including isolator 8.

[0104] In some examples, as shown in Figures 18-20, the magnetic shield 2 further includes a third chamber 206 and a fourth through-hole 207, the fourth through-hole 207 connecting the interior of the third chamber 206 and the exterior of the magnetic shield 2. The Josephson parametric amplifier package module also includes an isolator 8 located within the third chamber 206. The isolator 8 includes an input connector 81 and an output connector 82, the input connector 81 passing through the fourth through-hole 207, and the output connector 82 connected to a first connector 31. The isolator 8 can be a two-section circulator. The input connector 81 is used to connect to the superconducting quantum chip 300 and receive the signal to be amplified sent by the superconducting quantum chip 300. The output connector 82 is used to send the signal to be amplified to the first connector 31 of the circulator 3.

[0105] This application does not limit the connection method between the output connector 82 and the first connector 31. In some examples, as shown in FIG18, the magnetic shield 2 further includes a fifth through hole 208, which connects the interior and exterior of the third chamber 206. The output connector 82 passes through the fifth through hole 208 and is connected to the first connector 31 via cable 9. In other examples, as shown in FIG19 and FIG20, the output connector 82 and the first connector 31 are directly connected or connected via connector 5.

[0106] This application does not limit the arrangement of the first chamber 201, the second chamber 202, and the third chamber 206. Since the isolator 8, the circulator 3, and the Josephson parametric amplifier 4 are generally fixed on a circular cold plate, the projection of the Josephson parametric amplifier package module in the direction perpendicular to the plate (i.e., perpendicular to the substrate 1) is preferably circular or square to facilitate its arrangement on the circular cold plate. Therefore, in some examples, as shown in Figures 18 and 19, assuming the first chamber 201 and the second chamber 202 are arranged along the first direction X, the third chamber 206 is arranged along the second direction Y, where the first direction X is perpendicular to the second direction Y. Additionally, in some examples, the length direction of the isolator 8 is parallel to the first direction X.

[0107] In some examples, as shown in Figures 18 and 19, along the first direction X, the length of the third chamber 206 is greater than the length of the first chamber 201 and the length of the second chamber 202. A portion of the third chamber 206 is arranged with the first chamber 201 along the second direction Y, and another portion of the third chamber 206 is arranged with the second chamber 202 along the second direction Y.

[0108] Of course, in other examples, as shown in Figure 20, the first chamber 201, the second chamber 202 and the third chamber 206 can also be arranged along the first direction X.

[0109] The implementation of the third chamber 206 is described below by way of example. In some examples, as shown in FIG22, the magnetic shield 2 further includes a third partition 25. The third partition 25 is located in the receiving cavity 20, and the partition 24 and the third partition 25 divide the receiving cavity 20 into a first chamber 201, a second chamber 202 and a third chamber 206.

[0110] In some examples, as shown in Figure 22, the input connector 81 and the output connector 82 penetrate two opposing plates of the enclosure 22. In some examples, as shown in Figure 22, the partition 24 and the third partition 25 are perpendicular to each other.

[0111] The following is an exemplary description of the packaging method of the Josephson parametric amplifier 4. Figure 23 shows a three-dimensional schematic diagram of the Josephson parametric amplifier 4. Figure 24 shows a top view of the Josephson parametric amplifier 4.

[0112] In some examples, as shown in Figures 23 and 24, the Josephson parametric amplifier 4 includes a package 43, a Josephson parametric amplifier chip 44, a signal connector 41, and a pump connector 42. The signal connector 41 and the pump connector 42 are fixed to two opposite sidewalls of the package 43. The package 43 includes a central chamber 430, in which the Josephson parametric amplifier chip 44 is located and electrically connected to the first center conductor 411 of the signal connector 41 and the second center conductor 421 of the pump connector 42, respectively. The package 43 may be made of aluminum.

[0113] In some examples, as shown in Figure 23, the package 43 includes two parts: a package base 431 and a package cover 432. The package base 431 includes a central chamber 430, and the package cover 432 is used to close the central chamber 430. The signal connector 41 and the pump connector 42 can be fixed to the two opposite sidewalls of the package 43 by screws.

[0114] This application does not limit the implementation of the Josephson parametric amplifier chip 44 being electrically connected to the first center conductor 411 and the second center conductor 421. In some examples, the Josephson parametric amplifier 4 also includes a printed circuit board (PCB), on which microstrip lines are disposed. One end of the microstrip lines is electrically connected to the Josephson parametric amplifier chip 44, and the other end is soldered to the first center conductor 411 or the second center conductor 421.

[0115] It should be noted that the microstrip line, and the solder joint between the microstrip line and the connector, introduces uncertain impedance, which may lead to impedance mismatch between the Josephson parametric amplifier 4 and the superconducting quantum chip 300. To reduce the possibility of impedance mismatch, in some examples, as shown in Figure 24, the Josephson parametric amplifier chip 44 is bonded to the first center conductor 411 and the second center conductor 421 via aluminum wire 45. This eliminates the need for the microstrip line, and the solder joint between the connector and the microstrip line, resulting in smaller impedance fluctuations in the Josephson parametric amplifier 4 and reducing the possibility of impedance mismatch between the Josephson parametric amplifier 4 and the superconducting quantum chip 300.

[0116] In some examples, the aluminum wire 45 is a 17µm bonding wire. Since the joint planes of the first center conductor 411 and the second center conductor 421 are aligned with the height of the Josephson parametric amplifier chip 44, multiple aluminum wires 45 can be of the same height and span, which can be controlled by an automatic bonding machine program.

[0117] It should be noted that the types of the above connectors can be sub-miniature version A (SMA) microwave high-frequency connectors.

[0118] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this application should be included within the protection scope of this application.

Claims

1. A Josephson parametric amplifier package module, comprising: It includes a substrate (1), a magnetic shield (2), a circulator (3), and a Josephson parametric amplifier (4); The magnetic shield (2) is fixed to the substrate (1). The magnetic shield (2) includes a first chamber (201), a second chamber (202), a first through hole (203), two second through holes (204) and a third through hole (205). The first through hole (203) connects the first chamber (201) and the second chamber (202). The second through holes (204) connect the inside and outside of the first chamber (201). The third through hole (205) connects the inside and outside of the second chamber (202). The circulator (3) and the Josephson parametric amplifier (4) are located in the first chamber (201) and the second chamber (202) respectively. The circulator (3) includes a first connector (31), a second connector (32) and a third connector (33). The Josephson parametric amplifier (4) includes a signal connector (41) and a pump connector (42). The second connector (32) is directly connected to the signal connector (41) or connected through the connector (5). The second connector (32), the signal connector (41) or the connector (5) passes through the first through hole (203). The first connector (31) and the third connector (33) pass through the two second through holes (204) respectively. The pump connector (42) passes through the third through hole (205).

2. The Josephson parametric amplifier package module of claim 1, wherein, The magnetic shielding cover (2) includes a base plate (21), a surrounding plate (22), a top plate (23), and a partition plate (24); The bottom plate (21), the surrounding plate (22) and the top plate (23) form a receiving cavity (20), and the partition plate (24) is located in the receiving cavity (20) and divides the receiving cavity (20) into the first chamber (201) and the second chamber (202); The partition (24) includes the first perforation (203), and the surrounding panel (22) or the top panel (23) includes the second perforation (204) and the third perforation (205); The substrate (1) is attached to the outer surface of the base plate (21), and the circulator (3) and the Josephson parametric amplifier (4) are attached to the inner surface of the base plate (21).

3. The Josephson parametric amplifier package module of claim 2, wherein, The enclosure (22) includes a first enclosure (221) and a second enclosure (222), and the partition (24) includes a first partition (241) and a second partition (242); The magnetic shielding cover (2) includes a base (2a) and a top cover (2b); The base (2a) includes the base plate (21), the first surrounding plate (221), and the first partition plate (241); The upper cover (2b) includes the top plate (23), the second enclosure plate (222), and the second partition plate (242).

4. The Josephson parametric amplifier package module of claim 3, wherein, The first enclosure (221) includes at least one first opening (2213), which is open on the side facing the top plate (23); The second enclosure (222) includes at least one second opening (2223), which is open on the side facing the bottom plate (21); The second enclosure (222) surrounds the first enclosure (221), a portion of the first opening (2213) and a portion of the second opening (2223) are opposite each other, and a portion of the hole wall of the first opening (2213) and a portion of the hole wall of the second opening (2223) form the second through hole (204) or the third through hole (205).

5. The Josephson parametric amplifier package module of claim 3, wherein, The first enclosure (221) includes at least one first opening (2213), which is open on the side facing the top plate (23); The second enclosure (222) includes at least one second opening (2223), which is open on the side facing the bottom plate (21); Along the third direction (Z), the second enclosure (222) abuts against the first enclosure (221), and the hole wall of the first opening (2213) and the hole wall of the second opening (2223) form the second through hole (204) or the third through hole (205), wherein the third direction (Z) is perpendicular to the bottom plate (21).

6. The Josephson parametric amplifier package module of any one of claims 1-5, wherein, The second through hole (204) or the third through hole (205) is a circular hole, and the connector passing through the second through hole (204) or the third through hole (205) is cylindrical, with the circular hole and the connector having a clearance fit.

7. The Josephson parametric amplifier package module of any one of claims 3-6, wherein, The first partition (241) includes a third opening (2411) which is open on the side facing the top plate (23); The second partition (242) includes a fourth opening (2421) which is open on the side facing the bottom plate (21); The first partition (241) and the second partition (242) are stacked along the first direction (X). A portion of the third opening (2411) is opposite to a portion of the fourth opening (2421), and a portion of the wall of the third opening (2411) and a portion of the wall of the second opening (2223) form the first through hole (203). The first chamber (201) and the second chamber (202) are arranged along the first direction (X).

8. The Josephson parametric amplifier package module of any one of claims 3-6, wherein, The first partition (241) includes a third opening (2411) which is open on the side facing the top plate (23); The second partition (242) includes a fourth opening (2421) which is open on the side facing the bottom plate (21); Along the third direction (Z), the first partition (241) abuts against the second partition (242), and the wall of the third opening (2411) and the wall of the fourth opening (2421) form the first through hole (203), wherein the third direction (Z) is perpendicular to the bottom plate (21).

9. The Josephson parametric amplifier package module of claim 7 or 8, wherein, The first enclosure (221) includes two first side panels (2211), which are respectively connected to the two sides of the first partition (241); Both of the first side plates (2211) include an opening (2210) that extends through the first side plate (2211) along the thickness direction and is open on the side facing the top plate (23). The two sides of the second partition (242) extend into the two openings (2210) respectively.

10. The Josephson parametric amplifier package module of any one of claims 7-9, wherein, The first through hole (203) is a circular hole, and the connector or connector (5) passing through the first through hole (203) is cylindrical, and the circular hole is clearance-fitted with the connector or connector (5).

11. The Josephson parametric amplifier package module of any one of claims 3-10, wherein, The Josephson parametric amplifier package module also includes a plurality of first screws (6), which pass through the substrate (1) and the base plate (21) in sequence and are screwed into the circulator (3) or the Josephson parametric amplifier (4).

12. The Josephson parametric amplifier package module of any one of claims 3-11, wherein, The second enclosure (222) protrudes relative to the base plate (21), the base plate (1) includes a boss (11), the boss (11) is attached to the outer surface of the base plate (21), and the second enclosure (222) surrounds the boss (11); The Josephson parametric amplifier package module also includes a plurality of second screws (7) that pass through the second enclosure (222) and are screwed into the boss (11).

13. The Josephson parametric amplifier package module of any one of claims 2-12, wherein, One of the two second perforations (204) is located in the surrounding plate (22), and the other is located in the top plate (23); The third perforation (205) is located on the enclosure (22) and is disposed opposite to the second perforation (204) located on the enclosure (22).

14. The Josephson parametric amplifier package module of claim 1, wherein, The magnetic shielding cover (2) includes a first sub-magnetic shielding cover (2001) and a second sub-magnetic shielding cover (2002), and there are two first perforations (203); The first sub-magnetic shield (2001) includes the first chamber (201), the two second perforations (204), and the first perforation (203); The second sub-magnetic shield (2002) includes the second chamber (202), the third perforation (205), and another of the first perforations (203).

15. The Josephson parametric amplifier package module of any one of claims 1-14, wherein, The magnetic shield (2) further includes a third chamber (206) and a fourth perforation (207), the fourth perforation (207) connecting the interior and exterior of the third chamber (206); The Josephson parametric amplifier package module also includes an isolator (8) located in the third chamber (203). The isolator (8) includes an input connector (81) and an output connector (82). The input connector (81) passes through the fourth through hole (207), and the output connector (82) is connected to the first connector (31).

16. The Josephson parametric amplifier package module of claim 15, wherein, The magnetic shield (2) also includes a fifth through hole (208), which connects the interior and exterior of the third chamber (206); The output connector (82) passes through the fifth through hole (208) and is connected to the first connector (31) via a cable (9).

17. The Josephson parametric amplifier package module of claim 15 or 16, wherein, The first chamber (201) and the second chamber (202) are arranged along a first direction (X), and the third chamber (203) and the first chamber (201) or the second chamber (202) are arranged along a second direction (Y), wherein the first direction (X) is perpendicular to the second direction (Y).

18. The Josephson parametric amplifier package module of any one of claims 15-17, wherein, The magnetic shielding cover (2) includes a bottom plate (21), a surrounding plate (22), a top plate (23), a partition plate (24), and a third partition plate (25); The bottom plate (21), the surrounding plate (22) and the top plate (23) form a receiving cavity (20), and the partition plate (24) and the third partition plate (25) are located in the receiving cavity (20) and divide the receiving cavity (20) into the first chamber (201), the second chamber (202) and the third chamber (206); The substrate (1) is attached to the outer surface of the base plate (21), and the circulator (3), the Josephson parametric amplifier (4), and the isolator (8) are attached to the inner surface of the base plate (21).

19. The Josephson parametric amplifier package module of any one of claims 1-18, wherein, The Josephson parametric amplifier (4) also includes a package (43) and a Josephson parametric amplifier chip (44); The signal connector (41) and the pump connector (42) are fixed to two opposite side walls of the encapsulation box (43). The encapsulation box (43) includes a central chamber (430). The first central conductor (411) of the signal connector (41) and the second central conductor (421) of the pump connector (42) extend into the central chamber (430). The Josephson parametric amplifier chip (44) is located in the central chamber (430) and is bonded to the first central conductor (411) and the second central conductor (421) respectively via aluminum wire bonding.

20. A superconducting quantum computing system, comprising: The superconducting quantum computing system includes the Josephson parametric amplifier package module as described in any one of claims 1-19.

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