Substrate holding device
The substrate holding device addresses substrate warping by using rods with flexible suction cups to adhere to the back surface, stabilizing and flattening the substrate for precise handling and measurement in semiconductor package production.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- TAKAOKA TOKO
- Filing Date
- 2024-11-12
- Publication Date
- 2026-05-21
Smart Images
Figure JP2024040150_21052026_PF_FP_ABST
Abstract
Description
Substrate holding device
[0001] The present invention relates to a technique for flatly holding a substrate.
[0002] Attention has been focused on the technology of FOPL P (Fan Out Panel Level Package) that uses a rectangular substrate with a large work size such as 515 × 510 mm to improve the productivity of semiconductor packages. This FOPL P has a process of forming a composite substrate, in which a redistribution layer is provided on the surface of a support carrier, a plurality of semiconductor elements are mounted on this redistribution layer, and then a mold resin layer is provided. Thereafter, a semiconductor package is produced through a process of peeling the support carrier and a process of cutting the individual semiconductor elements (for example, Patent Document 1).
[0003] In the production of semiconductor packages, high levels of flatness and positional accuracy are required in various processes such as the formation of the redistribution layer, the mounting of semiconductor elements, and the formation of the mold resin layer. For this reason, the back surface of the support carrier on the opposite side from the surface on which the redistribution layer is formed is closely adhered and held to the mounting surface of the holder by suction (for example, Patent Document 2).
[0004] Japanese Patent Application Laid-Open No. 2024-064268, Japanese Patent Application Laid-Open No. 2006-54364, Japanese Patent Application Laid-Open No. 2021-093479
[0005] By the way, in a composite substrate as described above, concave or convex warping may occur in the whole due to differences in the thermal expansion coefficients of the materials constituting each layer. When such warping occurs, if it becomes necessary to replace the composite substrate in the production process, suction to the mounting surface does not act, and the close adhesion and holding of the composite substrate to the holder may become unstable.
[0006] In such a case, it is possible to suppress the warping by pressing the composite substrate from above with a contact member and stabilize the close adhesion and holding to the holder (for example, Patent Document 3). However, there has been a problem that if there are components or the like weakly fixed to the surface of the composite substrate, it is impossible to press the surface with the contact member even if it is desired to eliminate the warping.
[0007] This invention was made in consideration of these circumstances, and aims to provide a technology for holding a bent substrate flat without pressing down on its surface.
[0008] The present invention provides a substrate holding device comprising: a holder on which a substrate is placed; a rod that protrudes from the mounting surface of the holder and is displaced along the longitudinal direction toward the back surface of the substrate; and a tip portion provided at the tip of the rod that adheres to the back surface of the substrate by reducing the internal pressure.
[0009] The present invention provides a technology for holding a bent substrate flat without pressing down on its surface.
[0010] (A)(B)(C)(D) Diagrams illustrating the operation of a substrate holding device according to the first embodiment of the present invention. (A)(B)(C) Diagrams illustrating the operation of a substrate holding device according to the second embodiment of the present invention. (A)(B)(C) Diagrams illustrating the operation of a substrate holding device according to the third embodiment of the present invention. (A)(B)(C) Diagrams illustrating the operation of a substrate holding device according to the fourth embodiment of the present invention. Longitudinal cross-sectional views of semiconductor packages manufactured using the substrate holding devices according to each embodiment. (A)(B)(C) Diagrams illustrating the manufacturing process of semiconductor packages to which the substrate holding devices according to the embodiments are applied. (D)(E)(F) Diagrams illustrating the manufacturing process of semiconductor packages to which the substrate holding devices according to the embodiments are applied. (G)(H)(I) Diagrams illustrating the manufacturing process of semiconductor packages to which the substrate holding devices according to the embodiments are applied.
[0011] (First Embodiment) Hereinafter, embodiments of the present invention will be described based on the attached drawings. Figure 1 is a longitudinal cross-sectional view of a substrate holding device 10a (10) according to the first embodiment of the present invention. As shown, the substrate holding device 10a includes a holder 12 on which a substrate 11 is placed, a rod 16 that protrudes from the mounting surface 12a of the holder 12 and is displaced along the longitudinal direction toward the back surface 11a of the substrate 11, and a tip portion 15 provided at the tip of the rod 16 that is sucked onto the back surface 11a of the substrate 11 by reducing the pressure inside.
[0012] The substrate 11 that the problem to be solved by this embodiment is one that, when placed on a flat surface, has a cross-sectional shape that is concave or convex against gravity and has a natural degree of deflection. Generally, multilayer molded composite substrates have a natural degree of deflection unless special measures are taken, due to differences in the thermal expansion coefficients of the materials of each layer and the amount of shrinkage and expansion during the molding process.
[0013] The substrate 11 to which the present invention applies is not limited to such composite substrates, but also includes single-layer substrates. However, composite substrates (substrate 11) handled in the manufacturing process of FOPLP (Fan Out Panel Level Package), in which various electronic components are stacked on a support carrier 31 (Figure 5) described later to mass-produce multiple semiconductor packages, are particularly suitable targets.
[0014] The holder 12 has a flat mounting surface 12a. By bringing the flexible substrate 11 into close contact with the mounting surface 12a, the bending of the substrate 11 can be eliminated. A hole 17 is opened in this mounting surface 12a, and the tip 15 of the rod 16 protrudes from this hole 17 in the opposite direction to gravity.
[0015] Multiple rods 16 are arranged such that their longitudinal direction is perpendicular to the mounting surface 12a, and their tips support the back surface 11a of the substrate 11. Each of the multiple rods 16 may be displaced synchronously along its length, or it may be displaced independently. Below the holder 12, there is a drive unit (not shown) that drives each of the multiple rods 16 so that they protrude from the mounting surface 12a and are displaced along their length.
[0016] The tip portion 15 is a flexible, dish-shaped suction cup made of rubber or synthetic resin. The inner space formed when the tip portion 15 contacts the flat surface of the back surface 11a of the substrate 11 is connected to a vacuum pump (not shown) via the conduit 18 of the rod 16. When the pressure in the inner space is reduced, the flexibility of the tip portion 15 creates a pressure difference between the air pressure in the sealed inner space and atmospheric pressure, causing it to adhere to the back surface 11a of the substrate 11.
[0017] On the other hand, when the depressurized inner space is leaked to atmospheric pressure, the adsorption is released, and the tip portion 15 is released from the back surface 11a of the substrate 11. In this way, the tip portion 15 can repeatedly adsorb to and release from the back surface 11a of the substrate 11 by repeatedly depressurizing the inner space and leaking it to the atmosphere.
[0018] The operation of the substrate holding device 10a (10) according to the first embodiment of the present invention will be explained based on Figures 1(A) to (D). A substrate 11 having a concave cross-section as shown in Figure 1(A), or a substrate 11 having a convex cross-section as shown in Figure 1(B), is supported on its back surface 11a by the tips 15 of a plurality of rods 16.
[0019] Next, as shown in Figure 1(C), the tip portion 15 is attached to the back surface 11a of the substrate 11 by a depressurization operation. Furthermore, the multiple rods 16 supporting the substrate 11 are displaced in the longitudinal direction so that their heights are aligned, making the substrate 11 flat. This confirms that the attached tip portion 15 does not detach from the substrate 11.
[0020] Next, as shown in Figure 1(D), the multiple rods 16 are displaced so that the substrate 11 moves toward the mounting surface 12a. Then, after the substrate 11 makes contact with the mounting surface 12a, the multiple rods 16 are displaced a little more, and the elastic force of the flexible tip portion 15 applies a contact force to the substrate 11 toward the mounting surface 12a. As a result, the substrate 11 is stably held by the holder 12.
[0021] (Second Embodiment) Next, a second embodiment of the present invention will be described with reference to Figure 2. Figure 2 is an explanatory diagram of the operation of the substrate holding device 10b (10) according to the second embodiment of the present invention. Of these, Figure 2(A) shows a plan view of the substrate holding device 10b, and Figures 2(B) and 2(C) show longitudinal cross-sectional views of the substrate holding device 10b.
[0022] The substrate holding device 10b of the second embodiment has a configuration that further adds a suction unit 21 and a flow path 19 to the configuration of the first embodiment described above. In Figure 2, parts that have the same configuration or function as those in Figure 1 are indicated by the same reference numerals, and redundant explanations are omitted.
[0023] As shown in Figure 2(A), the suction unit 21 is provided on the holder 12 and sucks the back surface 11a of the substrate 11 with the rod 16 displaced so that the back surface 11a of the substrate 11, which has its tip 15 adsorbed, contacts the mounting surface 12a. The suction unit 21 has an opening inside a flow path 19 engraved on the mounting surface 12a. The opening of the suction unit 21 is connected to a vacuum pump (not shown) located below the holder 12.
[0024] As shown in Figure 2(B), the multiple rods 16 supporting the substrate 11 at their tip portions 15 are displaced downward, causing the substrate 11 to come into contact with the mounting surface 12a. Then, as shown in Figure 2(C), when the flow path 19 is sucked by the suction portion 21, a pressure difference is created between the air pressure in the flow path 19 and atmospheric pressure, causing the back surface 11a of the substrate 11 to adhere tightly to the mounting surface 12a. At this time, the suction of the back surface 11a of the substrate 11 by the suction portion 21 is continued, while the suction of the back surface 11a of the substrate 11 by the tip portions 15 is released. As a result, the substrate 11 is held more stably in the holder 12.
[0025] (Third Embodiment) Next, a third embodiment of the present invention will be described with reference to Figure 3. Figure 3 is an explanatory diagram of the operation of the substrate holding device 10c (10) according to the third embodiment. Of these, Figure 3(A) shows a plan view of the substrate holding device 10c, and Figures 3(B) and 3(C) show longitudinal cross-sectional views of the substrate holding device 10c.
[0026] The substrate holding device 10c of the third embodiment has a configuration that adds a transport unit 22 to the configurations of the first and second embodiments described above. In Figure 3, parts that have the same configuration or function as those in Figure 1 are indicated by the same reference numerals, and redundant explanations are omitted.
[0027] As shown in Figure 3(A), the transport unit 22 loads and unloads the substrate 11, which is supported by the tip of a protruding rod 16, into and out of the holder 12. The transport unit 22 has a fork-shaped holding structure that can hold the back surface 11a of the substrate 11 while avoiding interference with the rod 16 and its tip 15. Furthermore, the transport unit 22 can be moved at least horizontally while holding the substrate 11.
[0028] Then, as shown in Figure 3(B), with the multiple rods 16 supporting the substrate 11 displaced upward, the transport unit 22 is inserted below the substrate 11 and above the mounting surface 12a. As shown in Figure 3(C), by displacing the rods 16 downward, the substrate 11 can be held in the transport unit 22. This allows the substrate 11 to be transported out of the holder 12.
[0029] Conversely, as shown in Figure 3(C), by displacing the rod 16 downwards and inserting the transport unit 22 holding the substrate 11 onto the mounting surface 12a, and then displacing the multiple rods 16 upwards as shown in Figure 3(B), the substrate 11 can be supported by the rods 16. Subsequently, by moving the transport unit 22 away from the mounting surface 12a and displacing the rods 16 downwards, the substrate 11 can be transported into the holder 12 from the outside.
[0030] (Fourth Embodiment) Next, a fourth embodiment of the present invention will be described with reference to Figure 4. Figure 4 is an explanatory diagram of the operation of the substrate holding device 10d (10) according to the fourth embodiment. Of these, Figure 4(A) shows a plan view of the substrate holding device 10d, and Figures 4(B) and 4(C) show longitudinal cross-sectional views of the substrate holding device 10d.
[0031] The substrate holding device 10d of the fourth embodiment has a configuration that further adds a positioning mechanism 25 for positioning the substrate 11 relative to the holder 12 to the configuration of the first, second, and third embodiments described above. In Figure 4, parts that have the same configuration or function as those in Figure 1 are indicated by the same reference numerals, and redundant explanations are omitted.
[0032] As shown in Figure 4(A), the positioning mechanism 25 consists of a fixed end 26 (26x, 26y) fixed to one end of the holder 12, and a movable end 27 (27x, 27y) provided at the other end opposite to the fixed end 26. The set of fixed end 26x and movable end 27x and the set of fixed end 26y and movable end 27y are arranged in directions that intersect each other.
[0033] As shown in Figure 4(B), the movable end 27 is connected to the holder 12 via a linear actuator 28. Then, as shown in Figure 4(C), the movable end 27 is moved in a direction such that it contacts one end of the substrate 11 while the other end of the substrate 11 contacts the fixed end 26. This operation of the positioning mechanism 25 positions the substrate 11 in the holder 12.
[0034] It is preferable to position the bent substrate 11 while it is held in place by suction to the tip portion 15. In this case, the amount of movement of the substrate 11 accompanying the moving end 27 is absorbed by the amount of play between the rod 16 and the hole 17 or by the elastic deformation of the tip portion 15, as shown in Figure 4(C).
[0035] (Fifth Embodiment) Next, a fifth embodiment of the present invention will be described with reference to Figures 5, 6, 7, and 8. Here, Figure 5 is a longitudinal cross-sectional view of a semiconductor package 30 manufactured with the substrate holding device 10 according to each embodiment. Figures 6, 7, and 8 are explanatory diagrams of the manufacturing process of a semiconductor package 30 to which the substrate holding device 10 according to the fifth embodiment is applied.
[0036] As shown in Figure 5, the semiconductor package 30 has a structure in which multiple (two in the figure) semiconductor elements 32, a relay layer 33 that relays the electrical connection between the I / O electrodes of the semiconductor elements 32 and the electrodes of an external substrate (not shown), a molded resin layer 34 filled around these semiconductor elements 32 and the relay layer 33, and bumps 35 that join the electrodes of the external substrate to the relay layer 33 are stacked. Here, the relay layer 33 is a redistribution layer (RDL) made by stacking multiple wiring layers wired on a resin substrate. The relay layer 33 is sometimes called an interposer.
[0037] The semiconductor package 30 shown in Figure 5 is manufactured through the following steps. First, as shown in Figure 6(A), a release agent 37 is applied to the surface of the support carrier 31a. Then, as shown in Figure 6(B), a relay layer 33 is formed on top of the release agent 37. Furthermore, as shown in Figure 6(C), a semiconductor element 32 is mounted on top of the relay layer 33.
[0038] Next, as shown in Figure 7(D), a molded resin layer 34 is filled around the semiconductor element 32 and the intermediate layer 33. Then, as shown in Figure 7(E), the laminate of the intermediate layer 33, semiconductor element 32, and molded resin layer 34 is separated from the support carrier 31a. Furthermore, as shown in Figure 7(F), this laminate is turned upside down and reattached to the surface of the support carrier 31b to which the release agent 37 has been applied.
[0039] Next, as shown in the longitudinal cross-sectional view of Figure 8(G) and the plan view of Figure 8(H), bumps 35 are provided on the surface of the relay layer 33 on the side opposite to the semiconductor element 32. These bumps 35 can be described as components that are weakly fixed to the surface of the substrate 11g. For this reason, in the production process, when it is necessary to transfer the substrate 11g to the holder 12, it is not possible to press down on the surface of the substrate 11g to eliminate the bending.
[0040] Then, as shown in Figure 8(I), the inspection device 36 is scanned across the surface of the substrate 11 to optically inspect the arranged bumps 35. The inspection items here include the size of the bumps 35 in the plan view of the substrate in Figure 8(H), the height of the bumps 35 in the longitudinal cross-sectional view of the substrate in Figure 8(I), and the height (thickness) of the laminate (relay layer 33, semiconductor element 32, and mold resin layer 34).
[0041] Here, the support carrier 31 (31a, 31b) has parallel and highly smooth surfaces on both sides and is in close contact with the mounting surface 12a of the holder 12, which also has a highly smooth surface. As a result, the net values of the thickness of the laminate (intermediate layer 33, semiconductor element 32, and mold resin layer 34) and the height of the bump 35 can be accurately measured by optical inspection.
[0042] Next, the substrate 11g shown in Figure 8(H) is separated into units of semiconductor packages 30 (Figure 5). Then, the semiconductor packages 30 that pass the inspection in Figure 8(I) are shipped out. Although the application of the substrate holding device 10 according to each embodiment was illustrated in the scene where the inspection process begins in Figure 8(I), the same procedure is followed in other processes where it is necessary to replace a warped substrate 11.
[0043] According to the substrate holding device of at least one embodiment described above, by adhering the tip portion provided at the end of the rod to the back surface of the substrate, it becomes possible to hold a bent substrate flat without pressing down on the surface.
[0044] 10 (10a, 10b, 10c, 10d)... Substrate holding device, 11... Substrate, 11a... Back surface, 12... Holder, 12a... Mounting surface, 15... Tip, 16... Rod, 17... Hole, 18... Conduit, 19... Flow channel, 21... Suction part, 22... Transport part, 25... Mechanism, 26... Fixed end, 27... Moving end, 28... Linear actuator, 30... Semiconductor package, 31 (31a, 31b)... Support carrier, 32... Semiconductor element, 33... Intermediate layer, 34... Molding resin layer, 35... Bump, 36... Inspection equipment, 37... Release agent.
Claims
1. A substrate holding device comprising: a holder on which a substrate is placed; a rod protruding from the mounting surface of the holder and displaced along the longitudinal direction toward the back surface of the substrate; and a tip provided at the tip of the rod, which adheres to the back surface of the substrate by reducing the internal pressure.
2. A substrate holding device according to claim 1, comprising a suction part provided in the holder, which sucks the back surface of the substrate while the rod is displaced so that the back surface of the substrate, whose tip is being sucked, is in contact with the aforementioned mounting surface.
3. A substrate holding device according to claim 2, wherein the suction portion continues to suck the back surface of the substrate while the tip portion releases the suction of the back surface of the substrate.
4. A substrate holding device according to any one of claims 1 to 3, comprising a transport unit for loading / unloading the substrate, which is supported by the tip of the protruding rod, into / out of the holder.
5. A substrate holding device according to any one of claims 1 to 3, comprising a positioning mechanism for positioning the substrate relative to the holder.
6. A substrate holding device according to any one of claims 1 to 3, wherein the substrate has at least one of the following laminated on a support carrier forming the back surface: a plurality of semiconductor elements, a relay layer that relays the electrical connection between the I / O electrodes of the semiconductor elements and the electrodes of an external substrate, a molded resin layer filled around the semiconductor elements and the relay layer, and bumps that join the electrodes of the external substrate and the relay layer.
7. A substrate holding device according to claim 6, wherein an inspection device for optically inspecting the bumps arranged on the surface of the substrate is positioned opposite the mounting surface described above.