Optical connector, mounting structure, and device

Abstract

An optical connector according to the present disclosure optically connects an optical chip and an optical fiber, the optical connector comprising an upper part having a first surface facing the optical chip, a lower part having a second surface parallel to the first surface, an elastic structure disposed between the upper part and the lower part, a first light input / output part disposed on the first surface, and a second light input / output part disposed on a surface perpendicular to the first surface and optically connected to the optical fiber.

Description

Optical Connector, Mounting Structure, Device

[0001] The present disclosure relates to an optical connector, a mounting structure in which the optical connector and an optical chip are optically connected, and a device using the mounting structure.

[0002] With the increase in the amount of data processing, in data processing using only electrical wiring, the data transmission distance and the power consumption associated with data transmission increase. In a configuration using an optical fiber as a transmission medium instead of electrical wiring, a mounting structure (interface) in which an optical chip that converts a high-speed electrical signal into an optical signal and an optical connector are connected has been reported (Non-Patent Document 1).

[0003] In a conventional mounting structure using an optical connector, as shown in FIGS. 12A and 12B, an optical chip 42 is provided on a substrate 43, and an optical connector 41 is mounted so as to be optically connected to the optical chip 42. The optical input / output part 414 of the optical connector 41 and the optical input / output part 421 of the optical chip are optically connected, and the optical fiber 1 is led out from the optical input / output part 415 on the side surface of the optical connector 41. In this configuration, the convex part 417 of the optical connector 41 and the concave part 431 of the substrate 43 are fitted, and the optical connector 41 and the optical chip 42 are aligned.

[0004] D. Schoellner, S. Lutz, K. Wang, D. Kurtz, T. Kerr, and M. Wang, “A Mechanical-Optical Interface for 25+ Gbps VCSEL / PD Fiber Coupling”, Photonics West Optical Interconnects XVII, SPIE, 10109 (2017), https: / / www.usconec.com / media / bsrcthhd / a-mechanical-optical-interface-for-25-gbps-vcselpd-fiber-coupling.pdf. Problems to be Solved by the Present Disclosure

[0005] However, conventional mounting structures are designed for optical connection to multimode fibers, and when connecting to single-mode fibers, they suffer from problems such as low alignment positional accuracy and manufacturing tolerances that are outside the acceptable range.

[0006] Because multimode fibers have a large core diameter of several tens of micrometers, they are less sensitive to misalignment of the optical connection, and optical loss due to misalignment of about 10 micrometers is acceptable. On the other hand, single-mode fibers have a core diameter of 10 micrometers or less, so high alignment accuracy is required. When using single-mode fibers in conventional mounting structures, high positional accuracy is required for both the placement of the optical connector and the substrate, and the placement of the optical chip and the substrate.

[0007] However, even if the optical connector has high processing precision, the positional and shape precision of the protrusions (mating parts) on the substrate on which the optical connector is mounted is low, resulting in a positional misalignment of about 10 μm. The precision of connecting (die bonding) the optical chip to the substrate is also limited to about 5 μm. Manufacturing tolerances of several tens of μm also occur in the perpendicular arrangement of the optical chip and optical connector on the substrate.

[0008] As described above, conventional mounting structures have low alignment accuracy in the placement of optical chips and optical connectors, and manufacturing tolerances are outside the acceptable range, making them difficult to apply to single-mode optical signal transmission.

[0009] To solve the problems described above, the optical connector according to the present disclosure is an optical connector for optically connecting an optical chip and an optical fiber, comprising: an upper part having a first surface facing the optical chip; a lower part having a second surface parallel to the first surface; an elastic structure disposed between the upper part and the lower part; a first optical input / output unit disposed on the first surface; and a second optical input / output unit disposed on a surface perpendicular to the first surface and for optically connecting with the optical fiber.

[0010] Furthermore, the optical connector according to this disclosure is an optical connector for optically connecting an optical chip and an optical fiber, comprising: a body having a first surface on which the optical chip is arranged and a second surface opposite to the first surface; a first optical input / output section arranged on the first surface; a second optical input / output section arranged on a surface perpendicular to the first surface and for optically connecting with the optical fiber; a first elastic structure arranged on the first surface; and either a convex portion or a concave portion arranged on the surface of the first elastic structure on which the optical chip is arranged. Effects of this Disclosure

[0011] According to this disclosure, it is possible to provide an optical connector and mounting structure that can be easily and accurately mounted on an optical chip and that can transmit optical signals in single mode.

[0012] Figure 1A is a schematic diagram showing the configuration of an optical connector and mounting structure according to the first embodiment of this disclosure. Figure 1B is a schematic diagram showing the configuration of an optical connector and mounting structure according to the first embodiment of this disclosure. Figure 1C is a schematic diagram showing the configuration of an optical connector and mounting structure according to the first embodiment of this disclosure. Figure 2A is a diagram for explaining the manufacturing method of the mounting structure according to the first embodiment of this disclosure. Figure 2B is a diagram for explaining the manufacturing method of the mounting structure according to the first embodiment of this disclosure. Figure 2C is a diagram for explaining the manufacturing method of the mounting structure according to the first embodiment of this disclosure. Figure 2D is a diagram for explaining the manufacturing method of the mounting structure according to the first embodiment of this disclosure. Figure 3 is a schematic diagram showing an example of the configuration of an optical connector and mounting structure according to the first embodiment of this disclosure. Figure 4A is a perspective view from above of an optical connector according to the second embodiment of this disclosure. Figure 4B is a perspective view from the side of an optical connector according to the second embodiment of this disclosure. Figure 4C is a perspective view from below of an optical connector according to the second embodiment of this disclosure. Figure 4D is an IVD-IVD' cross-sectional view of an optical connector according to a second embodiment of the present disclosure. Figure 5A is a perspective view from above of the optical chip in the mounting structure according to a second embodiment of the present disclosure. Figure 5B is a perspective view from below of the optical chip in the mounting structure according to a second embodiment of the present disclosure. Figure 5C is a perspective view of the optical connector and surface mounting fixture according to a second embodiment of the present disclosure. Figure 5D is a schematic top view of the optical connector and surface mounting fixture according to a second embodiment of the present disclosure. Figure 5E is an enlarged schematic view of a part of the VE-VE' cross-section of the optical connector and surface mounting fixture according to a second embodiment of the present disclosure. Figure 5F is a VF-VF' cross-sectional view of the mounting structure according to a second embodiment of the present disclosure. Figure 5G is a VG-VG' cross-sectional view of the mounting structure according to a second embodiment of the present disclosure. Figure 6A is a diagram illustrating the operation of the mounting structure according to a second embodiment of the present disclosure. Figure 6B is a diagram illustrating the operation of the mounting structure according to a second embodiment of the present disclosure. Figure 7A is a diagram illustrating the operation of an optical connector according to a second embodiment of the present disclosure. Figure 7B is a diagram illustrating the operation of an optical connector according to a second embodiment of the present disclosure.Figure 7C is a diagram illustrating the operation of an optical connector according to a second embodiment of this disclosure. Figure 8A is a diagram illustrating the operation of a mounting structure according to a second embodiment of this disclosure. Figure 8B is a diagram illustrating the operation of a mounting structure according to a second embodiment of this disclosure. Figure 9A is a diagram illustrating the operation of an example of a mounting structure according to a second embodiment of this disclosure. Figure 9B is a diagram illustrating the operation of an example of a mounting structure according to a second embodiment of this disclosure. Figure 10A is a perspective view of an optical connector according to a third embodiment of this disclosure. Figure 10B is a cross-sectional perspective view showing the configuration of an optical connector according to a third embodiment of this disclosure. Figure 11A is a diagram illustrating the operation of an optical connector according to a third embodiment of this disclosure. Figure 11B is a diagram illustrating the operation of an optical connector according to a third embodiment of this disclosure. Figure 12A is a schematic diagram showing the configuration of a conventional optical connector and mounting structure. Figure 12B is a schematic diagram showing the configuration of a conventional optical connector and mounting structure. Forms for implementing this disclosure

[0013] <First Embodiment> The first embodiment of this disclosure will be described with reference to Figures 1A to 2D.

[0014] <Configuration of Optical Connector and Mounting Structure> The mounting structure 10 according to this embodiment comprises an optical connector 11 and an optical chip 12, as shown in Figures 1A to 1C.

[0015] The optical chip 12 is equipped with an optical waveguide and electrodes on its upper surface and an optical input / output unit 121 on its lower surface.

[0016] The optical connector 11 comprises an upper part 111, a lower part 112, and an elastic structure 113 for electrical connection that is connected to the upper part 111 and the lower part 112.

[0017] In the optical connector 11, the upper part 111 may have a pair of protrusions (also called guide parts or "guide protrusions") 116 on its upper surface. The inner side walls of each guide protrusion 116 are inclined toward the outer side walls of the guide protrusion 116 as they move outward (upward in the figure) from the upper surface of the upper part 111. There may be multiple guide protrusions 116.

[0018] One or more guide projections 116 may be arranged symmetrically with respect to the center of the upper part 111. Alternatively, the guide projections 116 may be arranged continuously near the outer circumference of the upper surface of the upper part 111.

[0019] In the optical connector 11, the upper part 111 includes a first optical input / output unit 114 located on its upper surface and a second optical input / output unit 115 located on its side surface.

[0020] The upper part 111 is equipped with an optical waveguide structure so that light propagates between the first optical input / output section 114 and the second optical input / output section 115. For example, the optical waveguide structure is equipped with lenses in the first optical input / output section 114 and the second optical input / output section 115 to concentrate or diffuse the input / output light, and a mirror is provided to bend the optical path of the propagating light between the first optical input / output section 114 and the second optical input / output section 115.

[0021] The first optical input / output unit 114 is optically connected to the optical input / output unit 121 on the underside of the optical chip 12.

[0022] The second optical input / output unit 115 is connected to the optical fiber 1.

[0023] The material of the optical connector 11 is, for example, a resin that has high light transmittance in the 1.3 μm band and can be molded, such as polycarbonate, polymethyl methacrylate resin, cycloolefin copolymer, or polyetherimide.

[0024] The elastic structure 113 for electrical connection is connected to the lower surface of the upper part 111 and the upper surface of the lower part 112. The lower surface of the lower part 112 is flat.

[0025] Furthermore, the mounting structure 10 includes a first substrate 13 on the lower surface of the lower part 112 of the optical connector 11. The lower part 112 is not fixed to the first substrate 13 and can slide on the surface of the first substrate 13. The first substrate 13 has an electrical adapter (first electrical connector) 131 on its upper surface.

[0026] Furthermore, the mounting structure 10 includes a second substrate 14 on the upper surface of the optical chip 12. The optical chip 12 is fixed to the second substrate 14 by solder and is electrically connected to it. The second substrate 14 also includes an electrical receptacle (second electrical connector) 141 on its lower surface. The electrical receptacle 141 is fixed to the second substrate 14 by solder and is electrically connected to it.

[0027] The optical chip 12 is soldered to the underside of the second substrate 14 and electrically connected. The electrical receptacle 141 is also soldered to the underside of the second substrate 14 and electrically connected.

[0028] In the mounting structure 10, the optical chip 12 is electrically connected to the first substrate 13 by the mating of the electrical adapter 131 and the electrical receptacle 141.

[0029] <Method of connecting the optical connector and optical chip> The method of connecting the optical connector 11 and the optical chip 12 in this embodiment will be described with reference to Figures 2A to 2D.

[0030] First, the upper surface of the optical connector 11, which is placed on the first substrate 13, and the lower surface of the optical chip 12, which is placed on the second substrate 14, are positioned facing each other (Figure 2A). At this time, the electrical adapter 131, which is placed on the first substrate 13, and the electrical receptacle 141, which is placed on the second substrate 14, are also positioned facing each other.

[0031] Next, the optical chip 12 is brought close to the optical connector 11. At this time, the coupling between the electrical adapter 131 and the electrical receptacle 141 begins (Figure 2B). Also, the end of the optical chip 12 (or the ridge on the lower surface of the optical chip 12) comes into contact with the inclined side surface of the guide projection 116 of the optical connector 11.

[0032] On the first substrate 13, the electrical adapter 131 is mechanically fixed by being soldered. The misalignment of the soldered connection is about 10 μm, resulting in a tolerance of several tens of μm from the design value.

[0033] On the second substrate 14, the optical chip 12 and the electrical receptacle 141 are mechanically fixed by being soldered together. The misalignment of each soldered connection is about 10 μm, resulting in a tolerance of several tens of μm from the design value.

[0034] On the other hand, the optical connector 11 is mounted on the first substrate 13 without being fixed, and since its bottom surface is flat, it can slide on the substrate surface (for example, in the x direction in the figure). For example, as shown in Figure 2B, due to misalignment caused by soldering, the optical input / output section of the optical connector 11 and the optical input / output section 121 of the optical chip 12 are misaligned. As a result, the end of the optical chip 12 (or the ridge of the bottom surface of the optical chip 12) comes into contact with the inclined inner wall of the guide projection 116 of the optical connector 11.

[0035] Next, the optical chip 12 is brought even closer to the optical connector 11. This causes the edge of the optical chip 12 (or the ridge on the lower surface of the optical chip 12) to slide along the inclined side surface of the guide projection 116 of the optical connector 11, and the lower surface of the lower part 112 of the optical connector 11 to slide on the surface of the first substrate 13 (for example, in the x direction in the figure). In other words, the force in the downward direction (-y direction) in the figure can be converted into a force in the left direction (-x direction) in the figure via the inclined inner wall of the guide projection 116. As a result, the entire optical connector 11 moves in the left direction (-x direction) in the figure.

[0036] As a result, the edge (ridge) of the lower surface of the optical chip 12 is positioned in contact with the inner slope of the guide projection 116. A portion of the edge (ridge) of the lower surface of the optical chip 12 may be positioned in contact with the inner slope of the guide projection 116. In this case, the lower surface of the optical chip 12 and the upper surface of the optical connector 11 may be positioned parallel to each other.

[0037] As a result, the first optical input / output section 114 of the optical connector 11 is positioned to be optically coupled with the optical input / output section 121 of the optical chip 12 (Figure 2C). In this way, the optical connector 11 can be aligned with the optical chip 12.

[0038] In this configuration, in the direction of the opposing guide protrusions 116, the length of the lower surface of the optical chip 12 is shorter than the distance between the tips of the opposing guide protrusions 116 and longer than the distance between their bottom surfaces.

[0039] Alternatively, the lower surface of the optical chip 12 may be disposed on the upper surface of the upper portion 111 of the optical connector 11 inside the guide convex portion 116. In this case, for example, a horizontal gap may occur between the end portion (ridge line portion) of the lower surface of the optical chip 12 and the ridge line portion of the bottom surface of the guide convex portion 116, and an alignment error may occur.

[0040] Further, the upper surface of the optical connector 11 and the lower surface of the optical chip 12 are in contact with each other, the upper surface of the optical connector 11 functions as a stopper, and the positional relationship between the first optical input / output portion 114 of the optical connector 11 and the optical input / output portion 121 of the optical chip 12 is maintained.

[0041] At this time, there is a gap (gap) between the electrical adapter 131 and the electrical receptacle 141, and the electrical adapter 131 and the electrical receptacle 141 are not completely fitted (FIG. 2C). This depends on the processing accuracy of the electrical receptacle and the amount of solder, and is caused by a manufacturing tolerance of about several tens of micrometers.

[0042] Finally, the second substrate 14 (optical chip 12) is pushed into the first substrate 13 (optical connector 11) (moved downward in the figure), and the electrical receptacle 141 is fitted into the electrical adapter 131 (FIG. 2D). At this time, the elastic structure 113 for electrical connection of the optical connector 11 contracts (deforms), so that the displacement during this pushing can be absorbed and the manufacturing tolerance can be absorbed. Further, the lengths of the electrical adapter 131 and the electrical receptacle 141 after fitting, that is, the distance between the first substrate 13 and the second substrate 14, are determined by the shapes of the electrical adapter 131 and the electrical receptacle 141 respectively. The elastic structure 113 for electrical connection contracts (deforms) according to this distance.

[0043] As described above, when a force in the -y direction in the figure is applied to the upper surface of the optical connector 11 via the optical chip 12, the elastic structure 113 for electrical connection receives the force and deforms, so that the position (y coordinate) of the lower surface of the lower portion 112 of the optical connector 11 is maintained, and the positional relationship between the first optical input / output portion 114 of the optical connector 11 and the optical input / output portion 121 of the optical chip 12 can be maintained. The elastic modulus in the horizontal direction (x direction) is smaller than the elastic modulus in the vertical direction (y direction) of the elastic structure 113 for electrical connection. That is, the elastic structure 113 for electrical connection has high rigidity in the x direction.

[0044] In this embodiment, an example in which the inclined inner wall of the guide convex portion 116 of the optical connector 11 is brought into contact with the end portion (or the ridge line portion of the lower surface) of the optical chip 12 is shown, but the present invention is not limited to this. As shown in FIG. 1A, the positions of the upper surface of the optical connector 11 and the lower surface of the optical chip 12 may be adjusted and determined. As shown in FIG. 3, a configuration in which the convex portion 117 on the upper surface of the optical connector 11 and the concave portion 122 on the lower surface of the optical chip 12 are fitted may be employed. The side surface of the convex portion 117 and the inner wall of the concave portion 122 are inclined. At least a part of the ridge line portion of the tip surface or the bottom surface of either the convex portion 117 or the concave portion 122 may be in contact with the side surface or the inner wall of the other (described later). The optical connector 11 may be provided with a concave portion, and the optical chip 12 may be provided with a convex portion.

[0045] Usually, since the position of the end portion of the optical chip is determined by dicing, it may be difficult to form an accurate shape due to the dicing width or chipping at the corner during dicing.

[0046] On the other hand, the concave portion 122 on the lower surface of the optical chip 12 can be formed with a positional accuracy of about 1 μm using a microfabrication technique by aligning with a pattern such as an optical waveguide on the upper surface of the optical chip 12 and an infrared camera. As a result, compared with the case where the inclined inner wall of the guide convex portion 116 of the optical connector 11 is brought into contact with the end portion (or the ridge line portion of the lower surface) of the optical chip 12, the optical chip 12 can be more easily and highly accurately aligned and arranged on the optical connector 11.

[0047] According to this embodiment, due to the force when the optical chip is brought close to the optical connector, the optical connector slides on the substrate surface through the guide convex portion having an inclined inner wall in the optical connector, so that the optical chip can be easily and highly accurately aligned and arranged on the optical connector.

[0048] Further, due to the elastic structure in the optical connector, misalignment of the electrical connection components due to manufacturing tolerances and the like can be absorbed, and the optical chip can be easily and highly accurately mounted on the optical connector.

[0049] As a result, in the optical connector and the mounting structure, optical signals can be transmitted in single mode.

[0050] <Second Embodiment> A second embodiment of the present disclosure will be described with reference to Figures 4A to 9B.

[0051] <Configuration of the Optical Connector> As shown in Figures 4A to 4D, the optical connector 21 according to this embodiment comprises a main body 211, an elastic structure for electrical connection (second elastic structure) 213 disposed on one surface (bottom surface) of the main body 211, and an elastic structure for optical connection (first elastic structure) 212 disposed on the other surface (top surface) of the main body 211.

[0052] The main body 211 is integrally molded from a resin material such as polycarbonate. This allows optical structures, such as optical input / output sections and lenses, to be molded with micron-level precision.

[0053] The main body 211 is roughly cylindrical, with a diameter of about 15 mm and a height of about 5 mm. However, considering mounting on a circuit board, the height may be between 1 mm and 5 mm.

[0054] As shown in Figure 4A, the upper surface of the main body 211 is provided with a first optical input / output section 214 at its center. The first optical input / output section 214 is equipped with eight lenses 2141, corresponding to eight optical input / output (fibers). The first optical input / output section 214 is also provided with a stopper 2142 that is convex on the side where the optical chip 22 is placed. A pair of stoppers 2142 are arranged symmetrically with respect to the row of eight lenses 2141. The stoppers 2142 may also be arranged around the eight lenses 2141.

[0055] The upper surface of the main body 211 is provided with an elastic structure (first elastic structure) 212 for optical connection. The elastic structure (first elastic structure) 212 for optical connection is, for example, an annular leaf spring with a thickness of about 100 μm. The first elastic structure 212 may be cross-shaped or radial in shape when viewed from above. Alternatively, the first elastic structure 212 may be rectangular in shape and positioned approximately on the diameter when viewed from above.

[0056] The elastic structure 212 for optical connection is provided with a pair of protrusions 215 near the outer circumference of its upper surface. There may be multiple protrusions 215. Preferably, the pair or more protrusions 215 are arranged symmetrically with respect to the center of the upper surface of the main body 211.

[0057] The protrusion 215 is, for example, frustum-shaped. The protrusion 215 may also be elliptical or polygonal. Alternatively, it may be cross-shaped when viewed from above. In the case of a shape other than a frustum-shaped cone, it may consist of a single protrusion.

[0058] As shown in Figure 4B, the main body 211 is provided with a second optical input / output section 216 on its side. The second optical input / output section 216 is equipped with eight lenses 2161 and corresponds to an eight-core optical input / output (fiber). The second optical input / output section 216 is also equipped with a positioning projection 2162. The second optical input / output section 216 may be configured to fit, for example, a standard-sized MT (Mechanically Transferable) connector.

[0059] As shown in Figure 4C, the lower surface of the main body 211 is provided with an elastic structure (second elastic structure) 213 for electrical connection and a mirror hole 217.

[0060] The elastic structure for electrical connection (second elastic structure) 213 is, for example, an annular leaf spring, similar to the elastic structure for optical connection (first elastic structure) 212, with a thickness of approximately 100 μm. The horizontal area of ​​the elastic structure for electrical connection (second elastic structure) 213 is smaller than the horizontal area of ​​the elastic structure for optical connection (first elastic structure) 212. As a result, the elastic modulus of the elastic structure for electrical connection (second elastic structure) 213 is adjusted to be higher than that of the elastic structure for optical connection (first elastic structure) 212, i.e., it is stiffer.

[0061] As shown in Figure 4D, the bottom surface 2171 of the mirror hole 217 is inclined. This inclined surface 2171 functions as a mirror and, for example, reflects light input from the first optical input / output unit 214 and propagating through the main body 211, which is made of resin material, toward the second optical input / output unit 216.

[0062] The elastic structure for electrical connection (second elastic structure) 213 is shorter in the x-direction than the elastic structure for optical connection (first elastic structure) 212. As a result, the elastic structure for electrical connection (second elastic structure) 213 is made rigider than the elastic structure for optical connection (first elastic structure) 212 so that deformation is suppressed.

[0063] The upper surface of the protrusion 215 of the elastic structure for optical connection (first elastic structure) 212 is positioned approximately 50 μm higher in the y-direction than the upper surface of the stopper 2142. When the optical chip 22 is brought close to the upper surface of the optical connector 21, and the lower surface of the optical chip 22 comes into contact with the protrusion 215, the optical chip 22 is pushed in the y-direction, that is, when an external force in the y-direction is applied to the protrusion 215, the elastic structure for optical connection (first elastic structure) 212 deforms.

[0064] When the optical chip 22 is further pushed in the y-direction, and the elastic structure for optical connection (first elastic structure) 212 deforms further, the lower surface of the optical chip 22 comes into contact with the stopper 2142, and the advance of the optical chip 22, i.e., the deformation of the elastic structure for optical connection (first elastic structure) 212, stops. At this time, the upper surface of the protrusion 215 is at the same height as the upper surface of the stopper 2142.

[0065] When the optical chip 22 is pushed further in the y direction, and a force in the negative y direction is directly applied to the stopper 2142, the elastic structure for electrical connection (second elastic structure) 213 deforms.

[0066] An anti-reflective coating of an inorganic material may be formed by vapor deposition on the upper surfaces of the lenses 2141 and 2161, which are arranged in the first optical input / output unit 214 and the second optical input / output unit 216. This reduces reflection and improves the transmittance of light at the interface.

[0067] In the mirror 2171, light input from the first or second optical input / output units 214 and 216 is reflected due to the difference in refractive index between the main body 211 (resin) and the air. A reflective film of metal or the like may be deposited on the upper surface of the mirror 2171 that faces the air. This further improves the reflectivity and prevents stray light from leaking out.

[0068] <Configuration of the mounting structure> The mounting structure 20 according to this embodiment will be described with reference to Figures 5A to 5E.

[0069] The mounting structure 20 includes an optical connector 21 and an optical chip 22. The optical connector 21 and the optical chip 22 are optically connected. The mounting structure 20 also includes a first substrate 23, a second substrate 24, a first electrical connector, and a second electrical connector.

[0070] The first substrate 23 is positioned on the lower side (second side) of the optical connector 21. The second substrate 24 is positioned on the side opposite to the side of the optical chip 22 that has the optical input / output section.

[0071] The first electrical connector is located on the upper surface of the first substrate 23 (the side with the optical connector 21). The second electrical connector is located on the lower surface of the second substrate 24 (the side with the optical chip 22). The first electrical connector and the second electrical connector are mated together.

[0072] The optical chip 22 includes a substrate (for example, silicon) and elemental components such as electrodes and optical waveguides on the upper surface of the substrate (not shown). Pads are redistributed as electrodes on the upper surface of the substrate by a redistribution layer, and solder balls 223 are arranged in a grid pattern on the pads as shown in Figure 5A. Thus, the optical chip 22 includes a ball grid array (BGA) 224 electrically provided with solder balls 223 in a grid pattern.

[0073] As shown in Figure 5B, the optical chip 22 has a mating recess 222 and an optical input / output section 221 on the underside of the substrate. For example, since 1.3 μm band light is transmitted through the silicon material without being absorbed, by selecting and designing an optical waveguide and optical elements on the upper side of the chip, light can be input and output from the underside of the optical chip 22 (substrate).

[0074] Furthermore, the recesses 222 are formed on the silicon substrate by resist patterning and etching, with precise alignment (approximately 1 μm) with the protrusions 215 on the upper surface of the optical connector 21. For example, the recesses 222 are circular holes with a diameter of 1 mm. The recesses 222 may be in pairs or in multiples, similar to the protrusions 215. This ensures that the recesses 222 are aligned with the position of the protrusions 215 on the upper surface of the optical connector 21.

[0075] As shown in Figure 5C, an MT connector 5 is attached to the second optical input / output section 115 of the optical connector 21. The multi-core fiber 6 connected to the MT connector 5 has, for example, eight fibers.

[0076] The mounting structure 20 includes a surface-mount fixing jig 242 on a first substrate 23 positioned on the lower side of the optical connector 21. Figures 5D and 5E show a top view and a VE-VE' cross-sectional view of the optical connector 21 positioned on the surface-mount fixing jig 242, respectively. In the figures, the optical connector 21 is indicated by a dotted line.

[0077] The surface mount fixing jig 242 comprises a mating portion 243 and a movable limiting portion 244. The mating portion 243 has a curved shape when viewed from above, and a part of the peripheral edge of the lower surface of the optical connector 21 fits into it. The movable limiting portion 244 is made of a thin plate member and is fixed to the first substrate 23 by solder reflow so as to surround the peripheral edge opposite to the peripheral edge that fits into the mating portion 243. As a result, in the mounting structure 20, the approximate position of the optical connector 21 can be defined by the contact between the side surface of the lower surface of the optical connector 21 and the side surface of the surface mount fixing jig 242.

[0078] When the optical connector 21 is mounted, the peripheral edge of the lower surface of the optical connector 21 (the peripheral edge of the leaf spring) is inserted into the mating portion 243 from the movable limiting portion 244 side of the fixing jig 242 for surface mounting, and mates. As a result, the peripheral edge of the lower surface of the optical connector 21 (the second elastic structure 213) is covered by the mating portion 243.

[0079] Here, a gap of about 0.5 mm is provided between the side surface of the optical connector 21 and the side surface of the fixing jig 242 for surface mounting. Within the range of this gap, the lower surface of the optical connector 21 can slide on the upper surface (xz plane in the figure) of the first substrate 23. In addition, a gap of about 0.5 mm is provided vertically between the mating portion 243 and the peripheral edge of the lower surface portion of the optical connector 21.

[0080] In this way, only the fixing jig 242 for surface mounting is solder-reflowed onto the upper surface of the first substrate 23, while the optical connector 21 is placed on the upper surface of the first substrate 23 without being solder-reflowed. As a result, the optical connector 21, which is made of resin material, can be mounted on the first substrate 23 without being deformed or altered by the heating during solder reflow.

[0081] Figure 5F shows a cross-sectional view of the mounting structure at VF-VF' in Figure 5C. The optical chip 22, which is connected and fixed to the lower surface of the second substrate 24 via solder balls 223, is optically connected to the optical connector 21.

[0082] Figure 5G shows a cross-sectional view of the mounting structure in the VG-VG' direction in Figure 5C. In the figure, an inset shows an enlarged cross-sectional view of the area around the protrusion 215 of the optical connector 21 and the recess 222 of the optical chip 22. The protrusion 215 of the optical connector 21 is fitted into the recess 222 of the optical chip 22.

[0083] <Alignment of Mounting Structure (Horizontal Direction)> The horizontal alignment of the optical connector 21 and the optical chip 22 in the mounting structure 20 according to this embodiment, that is, the fitting of the protrusion 215 of the optical connector 21 and the recess 222 of the optical chip 22, will be explained with reference to Figures 6A and 6B. Figures 6A and 6B show enlarged views of the protrusion 215 of the optical connector 21 and the recess 222 of the optical chip 22 in the VE-VE' cross-sectional view.

[0084] The recesses 222 are formed on the silicon substrate of the optical chip 22 by anisotropic dry etching, with an aperture diameter of 1 mm and a depth of approximately 150 μm. The recesses 222 are positioned to align with the position of the protrusions 215 of the optical connector 21. For example, one or more pairs of recesses 222 may be arranged symmetrically with respect to the center of the optical chip 22.

[0085] The inner wall of the recess 222 is inclined such that the opening is wider than the bottom surface due to the characteristics of dry etching. For example, the inclination angle of the inner wall (the inclination angle with respect to the direction perpendicular to the bottom surface of the recess 222, i.e., the upper surface of the optical connector 21) is 10 degrees or less. The recess 222 is, for example, a frustoconical shape that tapers towards the bottom surface. The recess 222 may also be a frustoconical shape. Alternatively, the recess 222 may be cylindrical or a polygonal prism, as long as its shape is compatible with the convex portion 215. In the recess 222, the circular opening has a processing tolerance of several micrometers due to the patterning conversion difference of the resist. The diameter of the opening of the recess 222 is 1 mm, and the depth of the recess 222 is 150 μm.

[0086] The protrusion 215 is formed by resin molding and is frustoconical in shape, tapering towards its tip. The inclination angle of the inclined side surface of the protrusion 215 is greater than the inclination angle of the inner wall of the recess 222. For example, the diameter of the base of the protrusion 215 is 1.01 mm, the height of the protrusion 215 is 100 μm, and the inclination angle of the inclined side surface is 45 degrees. The protrusion 215 may also be frustoconical in shape.

[0087] The shape of the opening of the recess 222 in the optical chip 22 may be the same as or narrower than the shape of the bottom surface of the protrusion 215 of the optical connector 21. As a result, the edge of the opening of the recess 222 in the optical chip 22 is positioned in contact with the side surface of the protrusion 215 of the optical connector 21. A portion of the edge of the opening of the recess 222 may be positioned in contact with the side surface of the protrusion 215.

[0088] The opening of the recess 222 of the optical chip 22 may be wider than the shape of the bottom surface of the protrusion 215 of the optical connector 21. In this configuration, the tip surface of the protrusion 215 of the optical connector 21 is positioned on the bottom surface of the recess 222 of the optical chip 22. In this case, for example, a horizontal gap may occur between the edge of the opening of the recess 222 and the edge of the bottom surface of the protrusion 215, which may cause alignment errors.

[0089] First, as shown in Figure 6A, the optical chip 22 is brought close to the optical connector 21. The tip of the protrusion 215 of the optical connector 21 is inserted into the opening of the recess 222 of the optical chip 22, so that the edge of the opening of the recess 222 of the optical chip 22 contacts the inclined side surface of the protrusion 215 of the optical connector 21. At this time, there is a positional displacement of about 40 μm in the horizontal direction.

[0090] Next, the optical chip 22 is brought even closer to the optical connector 21 and pressed against it (shaded arrow in Figure 6A). As a result, the edge of the opening of the recess 222 of the optical chip 22 (the ridge of the opening) slides along the inclined side surface of the convex portion 215 of the optical connector 21 (white arrow in Figure 6A), and the lower surface of the lower part 112 of the optical connector 21 slides on the first substrate surface (for example, in the x direction in the figure) (black arrow in Figure 6A). In other words, the force in the downward direction (-y direction) in the figure can be converted into a force in the left direction (-x direction) in the figure via the inclined side surface of the convex portion 215. As a result, the entire optical connector 21 moves.

[0091] As a result, the recess 222 of the optical chip 22 fits into the protrusion 215 of the optical connector 21 so that the central axis of the recess 222 and the central axis of the protrusion 215 coincide, completing the positioning (Figure 6B).

[0092] In this configuration, by making the contact area between the recess 222 and the protrusion 215, that is, the bottom surface of the recess 222 and the top surface of the protrusion 215, circular, the center position of the circle does not change due to the patterning conversion difference of the resist, and therefore the positional accuracy during alignment can be improved without depending on the machining tolerance.

[0093] In this way, the optical connector 21 and the optical chip 22 can be aligned with high precision in the horizontal direction (xz plane).

[0094] In this embodiment, an example is shown in which a protrusion 215 is arranged on the optical connector 21 and a recess 222 is arranged on the optical chip 22, but it is not limited to this. The recess 222 may be arranged on the optical connector 21 and a protrusion may be arranged on the optical chip 22.

[0095] Furthermore, although an example was shown where the inclination angle of the inclined side surface of the convex portion is greater than the inclination angle of the inner wall of the concave portion, the example is not limited to this. The inclination angle of the inner wall of the concave portion may be greater than the inclination angle of the inclined side surface of the concave portion. Thus, the inclination angle of the inner wall of the concave portion and the inclination angle of the side surface of the convex portion may be different. At least one portion of the edge of the tip surface or bottom surface of the other of the convex portion or concave portion may be in contact with the side surface or inner wall of either the convex portion or the concave portion.

[0096] In this embodiment, recesses can be easily formed on the silicon substrate of the optical chip 22 more easily than protrusions, and protrusions can be easily formed on the optical connector 21 made of resin. Therefore, the optical connector 21 may have protrusions and the optical chip 22 may have recesses. Furthermore, inclined inner walls (side surfaces) with a small inclination angle can be easily formed on the silicon substrate of the optical chip 22, and inclined inner walls (side surfaces) with a large inclination angle (for example, 45 degrees) can be easily formed on the optical connector 21 made of resin. Therefore, the inclination angle of the side surface of the protrusion of the optical connector 21 may be greater than the inclination angle of the inner wall of the recess of the optical chip 22.

[0097] <Alignment of Mounting Structure (Vertical Direction)> The alignment of the optical connector 21 and the optical chip 22 in the vertical direction (y direction) of the substrate in the mounting structure 20 according to this embodiment will be explained with reference to Figures 7A to 7C. In the figures, the dotted lines indicate the vicinity of the bottom surface of the optical chip 22 and the vicinity of the top surface of the first substrate 23. Also, in the figures, the inset shows an enlarged schematic diagram of the cross-section around the first elastic structure 212 and the second elastic structure 213. In this state, as described above, the optical connector 21 and the optical chip 22 are aligned horizontally with the convex portion 215 and the concave portion 222 fitted together.

[0098] The elastic structure for optical connection (first elastic structure) 212 is annular in shape. Furthermore, in the elastic structure for optical connection 212, the peripheral region 2121 including the area where the protrusion 215 is located is thick. The diametrical length of this region 2121 is 1.5 mm to 2.0 mm, and the thickness is 300 μm to 500 μm. As a result, the elastic structure for optical connection 212 has high rigidity in the horizontal direction (xz plane) and high flexibility in the vertical direction (y direction). This suppresses deformation of the area of ​​the protrusion 215 and suppresses the generation of horizontal forces due to the force applied from the optical chip 22 toward the optical connector 21.

[0099] As described above, when the protrusion 215 of the optical connector 21 and the recess 222 of the optical chip 22 are engaged, the upper surface of the optical connector 21, i.e., the upper surface of the first elastic structure 212, is in contact with the lower surface of the optical chip 22. At this time, in the optical connector 21, the upper surface of the optical connector 21 is located further away from the upper surface of the main body 211 than the upper surface of the stopper 2142 of the first optical input / output unit 114, and the vertical distance between the upper surface of the first elastic structure and the upper surface of the stopper 2142 is 50 μm (Figure 7A). Therefore, the optical input / output unit (not shown) of the optical chip 22 and the lens 2141 of the optical connector 21 are not arranged at an optimal distance.

[0100] When the optical chip 22 is pushed into the optical connector 21 in this state, in other words, when a force is applied from the optical chip 22 toward the optical connector 21 (in the -y direction), the elastic structure for optical connection (first elastic structure) 212 deforms, causing the height of the top surface of the optical connector 21 and the stopper 2142 to coincide, and the optical chip 22 comes into contact with the stopper 2142 (Figure 7B). As a result, the optical input / output section 221 of the optical chip 22 and the lens 2141 of the optical connector 21 are positioned at an optimal distance, and the lens 2141 can be brought closer to the optically designed optimal distance to the optical chip 22.

[0101] In this state, and similar to the first embodiment, when the optical chip 22 is pushed into the optical connector 21, a force is directly applied to the stopper 2142 from the optical chip 22 toward the optical connector 21 (-y direction) in order to absorb the gap between the electrical adapter (first electrical connector, not shown) of the first substrate 23 and the electrical receptacle (second electrical connector, not shown) of the second substrate 24, i.e., the manufacturing tolerance of the electrical connection portion. This force is applied to the elastic structure for electrical connection (second elastic structure) 213, and as shown in Figure 7C, the elastic structure for electrical connection (second elastic structure) 213 deforms. This allows the displacement of the optical chip 22 when it is pushed in to be absorbed, and the manufacturing tolerance of the electrical connection portion is absorbed. Also, the shape of the first electrical connector and the second electrical connector determines the length between the first electrical connector and the second electrical connector after mating, i.e., the distance between the first substrate 23 and the second substrate 24. Depending on this distance, the second elastic structure 213 contracts (deforms).

[0102] At this time, as shown in Figure 7C, the deformation state of the elastic structure for optical connection (first elastic structure) 212 is maintained, and only the elastic structure for electrical connection (second elastic structure) 213 deforms. The amount of deformation can be arbitrarily designed by adjusting the length L1 and thickness T1 of the elastic structure for electrical connection (second elastic structure) 213 and the length L2 and thickness T2 of the elastic structure for optical connection (first elastic structure) 212. For example, L1 = 3.8 mm, T1 = 100 μm, L2 = 2.5 mm, T2 = 100 μm.

[0103] Furthermore, when a force is applied from the optical chip 22 toward the optical connector 21 (in the -y direction), the central region of the lower surface of the optical connector 21 comes into contact with the upper surface of the first substrate 23, stopping the deformation of the elastic structure for electrical connection (second elastic structure) 213. This allows the deformation of the elastic structure for electrical connection (second elastic structure) 213 to be stopped at a predetermined amount of deformation, preventing mechanical damage.

[0104] According to this embodiment, the force applied when the optical chip 22 is brought close to the optical connector 21 and pressed into place causes the optical connector to slide on the substrate surface via the inclined side surface of the protrusion 215 in the optical connector, thereby enabling the optical chip to be easily and precisely aligned and positioned on the optical connector.

[0105] Furthermore, the elastic structure of the optical connector allows for the absorption of manufacturing tolerances, enabling the easy and highly accurate mounting of optical chips to the connector with a precision of approximately 1 μm. This makes single-mode optical propagation possible.

[0106] Furthermore, by making the optical connector a thin (approximately 5 mm thick) integrated structure using resin molding, the accumulation of manufacturing tolerances due to multiple structures is eliminated, allowing it to be mounted in the narrow area between the first and second substrates.

[0107] <Optical Effects of the Mounting Structure> The optical effects of the mounting structure 20 according to this embodiment will be explained with reference to Figures 8A to 9B.

[0108] As shown in Figure 8A, the optical chip 22 in the mounting structure 20 comprises an optical waveguide core 227, an optical waveguide cladding 226, and a folded mirror 228 on a silicon substrate 225. The optical waveguide core 227 and the optical waveguide cladding 226 are made of SiO, similar to the configuration of a PLC. ２ It consists of the following. The propagating light is reflected by the folding mirror, spreads according to the refractive index of the optical waveguide and substrate, passes through the silicon substrate 225, and is emitted from the bottom surface of the optical chip 22. In the figure, the main ray 3 is shown as a solid line, and the expanded beam 4 is shown as a dotted line.

[0109] As shown in Figure 8B, the light emitted from the bottom surface of the optical chip 22 spreads according to the refractive index of the propagation region and enters the lens 2141. The diameter of the lens 2141 is, for example, 240 μm. The incident light is converted into collimated light by the lens 2141, propagates inside the optical connector 21, is reflected at a 90-degree angle by the mirror 2171, and reaches the lens 2161 of the second optical input / output section. The propagated light is focused by the lens 2161 and optically coupled to the optical fiber core 2.

[0110] The folded mirror 228 is formed, for example, by etching the optical waveguide cladding 226 and the optical waveguide core 227 with the silicon substrate tilted, and then depositing a metal film to enhance reflection.

[0111] Furthermore, in order to improve the transmittance on the lower surface of the optical chip 22, the lower surface of the optical chip 22 may be mirror-polished, and then an anti-reflective film made of an inorganic material may be deposited on a part of the lower surface. A similar anti-reflective film may be formed on the upper surface of the lens of the optical connector 21 to improve transmittance. A metallic reflective film or the like may be formed on the mirror 2171.

[0112] The lens widens the beam diameter, improving the misalignment margin, and since the optical connector 21 is a single component with no connecting parts, it is possible to maintain high precision in resin molding.

[0113] If the formation of the folded mirror 228 on the upper surface of the optical chip 22 creates a step on the upper surface, making it difficult to form electrodes or solder balls, the step on the upper surface may be filled with resin or the like to flatten it, and then the normal rewiring process may be carried out.

[0114] In the optical chip 22, instead of a folding mirror, a diffraction grating 2291 may be used as shown in Figure 9A to emit light propagating through the optical waveguide from the bottom surface. In silicon photonics, a top diffraction grating formed by microfabrication of Si or SiN can be used to emit light propagating horizontally through the waveguide in a vertical direction or in a direction tilted about 10 degrees from the vertical direction.

[0115] In this configuration, light propagating through the optical waveguide core 227 made of silicon material is diffracted by a diffraction grating 2291 made of a periodic Si pattern and emitted from the bottom surface of the substrate. The propagating light is diffracted by the diffraction grating 2291 in directions toward the top surface and toward the bottom surface. The light toward the top surface may be reflected by, for example, an upper surface mirror 2292 made of metal or the like, which is placed on the top surface. This allows all the diffracted light to be emitted toward the bottom surface. Furthermore, the direction and spread of the diffracted light can be adjusted by the configuration of the diffraction grating.

[0116] As shown in Figure 9B, the light diffracted by the diffraction grating 2291 is optically coupled to the optical fiber core 2 via the lens 2141 and mirror 2171 of the first optical input / output unit 214, and the lens 2161 of the second optical input / output unit 216. The propagation of this light can be adjusted by designing the shapes of the lenses and mirrors to match the diffraction grating 2291. This design has more design parameters compared to the folded mirror design, but it allows for control of beam diameter, angle, polarization, etc.

[0117] Thus, in the mounting structure 20, light propagating horizontally in the optical chip 22 is emitted from the bottom surface of the optical chip 22 and can be optically coupled in single mode to the optical fiber 1 connected to the side surface of the optical connector 21 via the lens 2141 and reflective mirror 2171 of the first optical input / output section and the lens 2161 of the second optical input / output section of the optical connector 21.

[0118] According to this embodiment, an optical chip can be easily and accurately aligned and positioned in an optical connector. Furthermore, the light propagating through the optical chip can be optically coupled in single mode to the optical fiber connected to the optical connector. Additionally, the optical connector can be miniaturized. As a result, single-mode transmission of optical signals is possible in the optical connector and its mounting structure.

[0119] <Third Embodiment> The optical connector according to the third embodiment of the present disclosure will be described with reference to Figures 10A to 11B.

[0120] <Configuration of the Optical Connector> The optical connector 31 according to this embodiment includes an arm portion 318, as shown in Figures 10A and 10B. The arm portion 318 is integrally formed from the end of the upper surface of the optical connector 31, through the side near the upper surface of the optical connector 31, to the side of the optical connector 31. One end face of the arm portion 318 is positioned at the end of the upper surface of the optical connector 31. A first optical input / output unit 314 is positioned on one end face of the arm portion 318. The other end face of the arm portion 318 is connected to the side of the optical connector 31. The other configuration is the same as in the second embodiment.

[0121] In the mounting structure according to this embodiment, light is output (or input) from the end face of the optical chip 32 and input (or output) from the first optical input / output unit 314 of the optical connector 31.

[0122] In the second embodiment, the optical input / output section 221 of the optical chip 22 and the first optical input / output section 214 of the optical connector 21 are aligned in the xz plane by the recess 222 of the optical chip 22 and the protrusion 215 of the optical connector 21, and the distance between the optical input / output section 221 of the optical chip 22 and the lens 2141 of the first optical input / output section 214 of the optical connector 21 is adjusted in the y direction by the deformation of the elastic structure for optical connection (first elastic structure) 212.

[0123] On the other hand, in this embodiment, the protrusion 215 aligns the distance between the optical input / output section of the optical chip 32 in the x direction and the lens 3141 of the first optical input / output section 314 of the optical connector 31, as well as the position of the optical axis in the z direction. The deformation of the elastic structure for optical connection (first elastic structure) aligns the optical axis in the y direction.

[0124] As shown in Figure 11A, the light emitted from the end face of the optical waveguide core 227 of the optical chip 32 is optically coupled to the lens 3141 of the first optical input / output section 314 in the arm portion 318 of the optical connector 31, and converted into collimated light.

[0125] As shown in Figure 11B, the collimated light propagates through the arm portion 318, is reflected by mirrors 3181 and 3182, propagates radially through the main body 211 via the arm portion 318, and is optically coupled to an optical fiber (not shown) via the lens 2161 of the second optical input / output unit 216.

[0126] This embodiment provides the same effects as the second embodiment.

[0127] In the embodiments of this disclosure, an example configuration using a planar mirror to change the optical path is shown, but a curved mirror may also be used. This reduces the dependence on temperature and wavelength.

[0128] In the embodiments of this disclosure, an example is shown in which an electrical adapter is used for the first electrical connector and an electrical receptacle is used for the second electrical connector. However, the invention is not limited to this, and an electrical receptacle may be used for the first electrical connector and an electrical adapter for the second electrical connector. Other electrical connectors may also be used, as long as the first electrical connector and the second electrical connector are mated together.

[0129] The implementation structure according to the embodiments of this disclosure may be used in communication devices. Alternatively, it may be used in devices such as arithmetic units, computing devices (computers), and signal processing devices. A device equipped with the implementation structure according to this embodiment may be used in a data center. Multiple devices may be connected to form a network.

[0130] In the embodiments of this disclosure, examples of the structure, dimensions, materials, etc. of each component in optical connectors, mounting structures, manufacturing methods thereof, devices, and data center configurations are shown, but the invention is not limited to these examples. Any configuration that performs the function and effect of the optical connector and mounting structure is acceptable.

[0131] It should be noted that this disclosure is not limited to the embodiments described above, and it is evident that many modifications and combinations are possible within the technical concept of this disclosure by a person with ordinary skill in the art.

[0132] Some or all of the embodiments described above, or examples thereof, may also be described as follows, but are not limited to these.

[0133] (Note 1) An optical connector for optically connecting an optical chip and an optical fiber, comprising: an upper part having a first surface facing the optical chip; a lower part having a second surface parallel to the first surface; an elastic structure disposed between the upper part and the lower part; a first optical input / output section disposed on the first surface; and a second optical input / output section disposed on a surface perpendicular to the first surface and for optically connecting with the optical fiber.

[0134] (Note 2) The optical connector according to Note 1, further comprising a protrusion disposed on the first surface.

[0135] (Note 3) An optical connector for optically connecting an optical chip and an optical fiber, comprising: a body having a first surface on which the optical chip is arranged and a second surface opposite to the first surface; a first optical input / output section arranged on the first surface; a second optical input / output section arranged on a surface perpendicular to the first surface and for optically connecting with the optical fiber; a first elastic structure arranged on the first surface; and either a convex portion or a concave portion arranged on the surface of the first elastic structure on which the optical chip is arranged.

[0136] (Note 4) The optical connector according to Note 3, further comprising a second elastic structure disposed on the second surface and a stopper disposed on the first surface, wherein the stopper is convex toward the side on which the optical chip is disposed.

[0137] (Note 5) The optical connector according to Note 3 or Note 4, further comprising an arm portion disposed on the main body.

[0138] (Note 6) A mounting structure comprising an optical connector as described in Note 1 or Note 2 and the optical chip, wherein the optical chip has a third optical input / output section arranged on the surface facing the optical connector, and the first optical input / output section and the third optical input / output section of the optical chip are optically coupled.

[0139] (Note 7) A mounting structure comprising an optical connector as described in any of Notes 3 to 5, an optical chip, the optical chip having a third optical input / output section arranged on the surface facing the optical connector, and the other of the convex portion or the concave portion arranged on the surface of the optical chip having the third optical input / output section, wherein the first optical input / output section and the third optical input / output section of the optical chip are optically coupled.

[0140] (Note 8) An apparatus having the mounting structure described in Note 6 or Note 7.

[0141] (Note 9) The optical connector according to any one of Notes 2 to 5, wherein the inner side surface of the protrusion is an inclined surface that slopes toward the outer side wall of the protrusion as it moves outward from the first surface.

[0142] (Note 10) The optical connector according to any one of Notes 3 to 5, wherein the inner wall of the recess has an inclined surface such that the opening of the recess narrows toward the bottom surface of the recess, and the side surface of the protrusion has an inclined surface such that the tip surface of the protrusion narrows toward the tip of the protrusion.

[0143] (Note 11) The optical connector according to Note 5, wherein the arm portion is arranged from the end of the first surface through the side of the main body to a part of a surface perpendicular to the first surface, the first optical input / output unit is arranged at the end of the first surface, and light propagates between the first optical input / output unit and the second optical input / output unit through the arm portion and the inside of the main body.

[0144] (Note 12) The optical connector according to any one of Notes 2 to 5, 9 to 11, wherein the protrusions are at least one pair and are arranged symmetrically with respect to the center of the first surface.

[0145] (Note 13) The optical connector according to any one of Notes 3 to 5, 10 to 12, wherein the area around the region where the convex portion or the concave portion is located is thicker than the area outside the area.

[0146] (Note 14) The optical connector according to any one of Notes 3 to 5, 10 to 12, wherein the area of ​​the first elastic structure is larger than the area of ​​the second elastic structure.

[0147] (Note 15) The optical connector according to Note 2, wherein the protrusions are arranged continuously near the outer circumference of the first surface.

[0148] (Note 16) An optical connector according to any one of Notes 1 to 5, 9 to 15, comprising a mechanism for bending or curving the direction of light propagation between the first optical input / output section and the second optical input / output section.

[0149] (Note 17) An optical connector according to any one of Notes 1 to 5 or 9 to 16, wherein the second surface is provided with a hole, and the bottom surface of the hole is inclined with respect to a direction perpendicular to the first surface.

[0150] (Note 18) The mounting structure of Note 6 wherein the surface of the optical chip facing the optical connector has a ridge.

[0151] (Note 19) The mounting structure of Note 7, wherein the opening of the recess and the tip surface of the protrusion have ridges, the inclination angle of the inner wall of the recess and the inclination angle of the side surface of the protrusion are different, and the protrusion and the recess fit together.

[0152] (Note 20) The mounting structure according to any one of Notes 6, 7, 18, or 19, further comprising: a first substrate disposed on the side of the second surface of the optical connector; a second substrate disposed on the side of the optical chip opposite to the surface having the optical input / output section; a first electrical connector disposed on the side of the first substrate on the optical connector side; and a second electrical connector disposed on the side of the second substrate on the optical chip side, wherein the optical connector is movably disposed on the first substrate and the first electrical connector and the second electrical connector are mated together.

[0153] (Note 21) The mounting structure according to any of the notes 20, further comprising a surface mount fixing jig disposed on the optical connector side surface of the second substrate, wherein a portion of the outer edge of the second elastic structure is fitted into a portion of the surface mount fixing jig.

[0154] (Note 22) A data center equipped with the devices described in Note 8.

[0155] (Note 23) A method for manufacturing a mounting structure as described in any of Notes 6, 18 to 21, comprising the steps of: placing the surface of the optical chip having the optical input / output portion opposite the first surface; pushing the optical chip into the optical connector; sliding the ridge portion on the inclined surface; and forming the optical chip into the optical connector.

[0156] (Note 24) A method for manufacturing a mounting structure as described in any of Notes 7, 18 to 21, comprising: a second elastic structure disposed on the second surface; a stopper disposed on the first surface and convex on the side on which the optical chip is disposed; a step of placing the surface of the optical chip having the optical input / output portion opposite the first surface; pushing the optical chip into the optical connector; sliding the ridge portion on the inclined surface; and fitting the convex portion into the recess; and further pushing the optical chip into the optical connector; bending the first elastic structure; and bringing the surface of the optical chip having the optical input / output portion into contact with the stopper.

[0157] (Note 25) A method for manufacturing the mounting structure according to Note 24, further comprising: a first substrate disposed on the side of the second surface of the optical connector; a second substrate disposed on the side of the optical chip opposite to the side having the optical input / output portion; a first electrical connector disposed on the side of the first substrate on the optical connector side; and a second electrical connector disposed on the side of the second substrate on the optical chip side, further comprising the steps of pushing the optical chip into the optical connector, bending the second elastic structure, and mating the first electrical connector with the second electrical connector.

[0158] This disclosure can be applied to communication devices, computing devices, computers, signal processing devices and systems, networks, and data centers.

[0159] 11 Optical connector 111 Upper part 112 Lower part 113 Elastic structure 114 First optical input / output section 115 Second optical input / output section 116 Protrusion

Claims

1. An optical connector for optically connecting an optical chip and an optical fiber, comprising: an upper part having a first surface facing the optical chip; a lower part having a second surface parallel to the first surface; an elastic structure disposed between the upper part and the lower part; a first optical input / output section disposed on the first surface; and a second optical input / output section disposed on a surface perpendicular to the first surface and for optically connecting with the optical fiber.

2. The optical connector according to claim 1, further comprising a protrusion disposed on the first surface.

3. An optical connector for optically connecting an optical chip and an optical fiber, comprising: a body having a first surface on which the optical chip is arranged and a second surface opposite to the first surface; a first optical input / output section arranged on the first surface; a second optical input / output section arranged on a surface perpendicular to the first surface and for optically connecting with the optical fiber; a first elastic structure arranged on the first surface; and either a convex portion or a concave portion arranged on the surface of the first elastic structure on which the optical chip is arranged.

4. The optical connector according to claim 3, further comprising a second elastic structure disposed on the second surface and a stopper disposed on the first surface, wherein the stopper is convex toward the side on which the optical chip is disposed.

5. The optical connector according to claim 3 or claim 4, further comprising an arm portion disposed on the main body.

6. A mounting structure comprising the optical connector described in claim 1 and the optical chip, wherein the optical chip has a third optical input / output section arranged on a surface facing the optical connector, and the first optical input / output section and the third optical input / output section of the optical chip are optically coupled.

7. A mounting structure comprising: an optical connector according to claim 3; an optical chip; the optical chip having a third optical input / output section disposed on a surface facing the optical connector; and the other of the convex portion or the concave portion disposed on the surface of the optical chip having the third optical input / output section, wherein the first optical input / output section and the third optical input / output section of the optical chip are optically coupled.

8. An apparatus comprising the mounting structure described in claim 6 or claim 7.

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