Wearable electronic device including antenna

Abstract

An electronic device according to one disclosed embodiment may include a ring-shaped housing. The electronic device may include a printed circuit board disposed within the housing. The electronic device may include a wireless communication circuit provided on the printed circuit board. The housing may include a first conductive portion forming at least a portion of the outer circumferential surface of the housing. The housing may include a first gap formed by one end and the other end of the first conductive portion. The housing may include a second conductive portion disposed to overlap the first gap when the first gap is viewed from the center of the ring shape. One end of the second conductive portion may be connected to a first point of the first conductive portion. The other end of the second conductive portion and a second point of the first conductive portion may be electrically connected or disconnected by a first switching element. The first gap may be positioned between the first point and the second point. The wireless communication circuit may provide a feed signal to the second conductive portion through one end thereof. When the electronic device is in a first state, the second point of the first conductive portion and the other end of the second conductive portion are electrically connected by the first switching element, so that an RF signal can be radiated through a first antenna comprising at least a portion of the first conductive portion and the second conductive portion. When the electronic device is in a second state, the second point of the first conductive portion and the other end of the second conductive portion are electrically disconnected by the first switching element, so that an RF signal can be radiated through a second antenna comprising the second conductive portion.

Description

Wearable electronic device including an antenna

[0001] The present disclosure relates to a wearable electronic device and a method of operating the same.

[0002] As the functions of mobile electronic devices become increasingly diverse, they are being implemented in the form of multimedia devices, and their structural and software aspects are being improved. In particular, as portable electronic devices become smaller and their portability improves, wearable devices such as smart rings can be provided. Portable electronic devices with communication capabilities can provide mobile communication services using an antenna. The antenna may be placed in a portion of the interior and / or exterior of the housing of the portable electronic device.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0004] An electronic device according to one disclosed embodiment may include a ring-shaped housing. The electronic device may include a printed circuit board disposed within the housing. The electronic device may include a wireless communication circuit formed on the printed circuit board. The housing may include a first conductive portion forming at least a portion of the outer surface of the housing. The housing may include a first segmented portion formed by one end and the other end of the first conductive portion. The housing may include a second conductive portion disposed to overlap with the first segmented portion when viewed from the center of the ring shape. One end of the second conductive portion may be connected to a first point of the first conductive portion. The other end of the second conductive portion and the second point of the first conductive portion may be electrically connected or disconnected by a first switching element. The first segmented portion may be disposed between the first point and the second point. The wireless communication circuit may provide a power supply signal to the second conductive portion through one end of the second conductive portion. When the electronic device is in a first state, a second point of the first conductive part and the other end of the second conductive part are electrically connected by a first switching element, so that an RF signal can be radiated through a first antenna including at least a portion of the first conductive part and the second conductive part. When the electronic device is in a second state, a second point of the first conductive part and the other end of the second conductive part are electrically separated by a first switching element, so that an RF signal can be radiated through a second antenna including the second conductive part.

[0005] An electronic device according to one disclosed embodiment may include a ring-shaped housing. The electronic device may include a printed circuit board disposed within the housing. The electronic device may include a wireless communication circuit formed on the printed circuit board. The housing may include a first conductive portion forming a first portion of the outer surface of the housing. The housing may include a second conductive portion forming a second portion of the outer surface of the housing. The housing may include a first segmented portion formed by one end of the first conductive portion and one end of the second conductive portion. The housing may include a second segmented portion formed by the other end of the first conductive portion and the other end of the second conductive portion. The housing may include a first switching element that electrically connects or disconnects one end of the first conductive portion and one end of the second conductive portion. The housing may include a second switching element that electrically connects or disconnects the other end of the first conductive portion and the other end of the second conductive portion. The wireless communication circuit may provide a power supply signal to the second conductive portion through the printed circuit board. When the electronic device is in a first state, one end of the first conductive part and one end of the second conductive part are electrically connected by a first switching element, and the other end of the first conductive part and the other end of the second conductive part are electrically connected by a second switching element, so that an RF signal can be radiated through a first antenna including the first conductive part and the second conductive part. When the electronic device is in a second state, one end of the first conductive part and one end of the second conductive part are electrically separated by a first switching element, and the other end of the first conductive part and the other end of the second conductive part are electrically separated by a second switching element, so that an RF signal can be radiated through a second antenna including the second conductive part.

[0006] FIG. 1 is a block diagram illustrating an electronic device in a network environment according to various embodiments.

[0007] FIG. 2 is a drawing for explaining an electronic device that communicates with an external electronic device according to one embodiment.

[0008] FIG. 3a is an exploded perspective view of an electronic device according to one embodiment.

[0009] FIG. 3b is a cross-sectional view of an electronic device according to one embodiment.

[0010] FIG. 4 is a cross-sectional view and a partial plan view of an electronic device according to one embodiment.

[0011] FIG. 5 is a diagram for explaining a first switching element when an electronic device is in a first state, according to one embodiment.

[0012] FIG. 6 is a diagram illustrating a first switching element when the electronic device is in a second state, according to one embodiment.

[0013] FIG. 7 is a drawing showing an electronic device coupled to a phantom to test the performance of an antenna according to one embodiment.

[0014] FIG. 8 is a diagram showing the electric field (E-field) of an electronic device in a first state according to one embodiment.

[0015] FIG. 9 is a diagram showing the electric field (E-field) of an electronic device in a second state according to one embodiment.

[0016] FIG. 10 is a diagram showing the radiation pattern of an RF signal by an electronic device in a first state according to one embodiment.

[0017] FIG. 11 is a diagram showing the radiation pattern of an RF signal by an electronic device in a second state according to one embodiment.

[0018] FIG. 12 is a diagram for comparing the radiation pattern of an RF signal by an electronic device in a first state and the radiation pattern of an RF signal by an electronic device in a second state, according to one embodiment.

[0019] FIG. 13 is a drawing showing the efficiency graph of an electronic device in a first state and the efficiency graph of an electronic device in a second state according to one embodiment.

[0020] FIG. 14 is a diagram showing the resonance graph of an electronic device in a first state and the s-parameter of an electronic device in a second state according to one embodiment.

[0021] FIG. 15 is a diagram illustrating an experiment in which an electronic device confirms interference of an RF signal by an external electronic device according to one embodiment.

[0022] FIG. 16 is a diagram showing the electric field (E-field) of an electronic device in a first state adjacent to an external electronic device according to one embodiment.

[0023] FIG. 17 is a diagram showing the electric field (E-field) of a second state electronic device adjacent to an external electronic device according to one embodiment.

[0024] FIG. 18 is a diagram showing an efficiency graph of an electronic device in a first state adjacent to an external electronic device and an efficiency graph of an electronic device in a second state adjacent to an external electronic device, according to one embodiment.

[0025] FIG. 19 is a diagram showing the s-parameters of an external electronic device and an adjacent electronic device according to one embodiment.

[0026] FIG. 20 is a drawing showing the impedance of an electronic device in a first state and an electronic device in a second state according to one embodiment.

[0027] FIG. 21 is a cross-sectional view and a partial plan view of an electronic device according to one embodiment.

[0028] FIG. 22 is a cross-sectional view of an electronic device in a first state according to one embodiment.

[0029] FIG. 23 is a cross-sectional view of an electronic device in a second state according to one embodiment.

[0030] FIG. 24 is a cross-sectional view of an electronic device in a first state according to one embodiment.

[0031] FIG. 25 is a cross-sectional view of an electronic device in a second state according to one embodiment.

[0032] Figure 26 is a flowchart illustrating how an electronic device changes its state.

[0033] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0034] Users can utilize various types of electronic devices for verbs. Electronic devices can communicate wirelessly. When a user uses multiple electronic devices simultaneously, the wireless signals used by the electronic devices may interfere.

[0035] The technical problems intended to be solved in this document are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which this disclosure belongs from the description in this disclosure.

[0036] Hereinafter, embodiments are described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present disclosure. However, the disclosed embodiments may be implemented in various different forms and are not limited to the embodiments described herein.

[0037] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or may communicate with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0038] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0039] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0040] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0041] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0042] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0043] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0044] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0045] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0046] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0047] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0048] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0049] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0050] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0051] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0052] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0053] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0054] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0055] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0056] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0057] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0058] According to one embodiment, commands or data may be transmitted or received between an electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0059] FIG. 2 is a drawing for explaining an electronic device communicating with an external electronic device according to one embodiment. The electronic device (101) of FIG. 2 may correspond to the electronic device (101) described with reference to FIG. 1. The external electronic device (102) of FIG. 2 may correspond to the electronic device (102) described with reference to FIG. 1.

[0060] According to one embodiment, the electronic device (101) may be in the shape of a ring. For example, the housing of the electronic device (e.g., the housing (310) of FIG. 3a) may be formed in the shape of a ring.

[0061] According to one embodiment, an electronic device (101) can wirelessly communicate with an external electronic device (102). For example, the electronic device (101) can wirelessly communicate with the external electronic device (102) using a defined wireless communication standard. For example, the electronic device (101) can wirelessly communicate with the external electronic device (102) using a wireless communication standard such as Bluetooth™ or Wi-Fi (wireless fidelity, WIFI).

[0062] According to one embodiment, a user (1) may wear an electronic device (101). For example, the user (1) may wear the electronic device (101) on one of their fingers.

[0063] According to one embodiment, a user (1) may use an external electronic device (201) while wearing an electronic device (101). For example, the external electronic device (201) may be an electronic device having wireless communication capabilities. For example, the external electronic device (201) may be an electronic device having wireless communication capabilities, such as a laptop computer, a smart pad, or a smartphone. For example, the external electronic device (201) may be an electronic device that uses the wireless communication standard used by the electronic device (101). For example, the external electronic device (201) may be used by the user (1) using their hand. For example, the external electronic device (201) may be placed and used in the direction facing the user (1)'s palm.

[0064] According to one embodiment, when the electronic device (101) performs wireless communication, interference by an external electronic device (101) may occur. For example, a wireless signal generated by the electronic device (101) may be interfered with by a wireless signal generated by an external electronic device (101).

[0065] FIG. 3a is an exploded perspective view of an electronic device according to one embodiment, and FIG. 3b is a cross-sectional view of an electronic device according to one embodiment. FIG. 3b is a cross-sectional view of an electronic device (101) with respect to the xy plane. The electronic device (101) of FIG. 3a and FIG. 3b may correspond to the electronic device (101) described with reference to FIG. 1 and FIG. 2.

[0066] According to one embodiment, the electronic device (101) may include a housing (310). For example, the housing (310) may be formed in a ring shape. For example, the housing (310) may be formed so that the user's (1) finger is inserted into the inner diameter. For example, at least a portion of the housing (310) adjacent to the inner diameter may be formed of a non-conductive material. For example, the inner surface (311) of the housing (310) may be formed of a non-conductive material. For example, the portion of the housing (310) that the user's (1) finger touches may be formed of a non-conductive material.

[0067] According to one embodiment, the housing (310) may include a first conductive portion (312). For example, at least a portion of the outer surface of the housing (310) may be formed as the first conductive portion (312). For example, the first conductive portion (312) may be formed along the outer surface of the housing (310).

[0068] According to one embodiment, the first conductive portion (312) may include at least one opening. For example, the first conductive portion (312) may include a first opening (314). For example, the first conductive portion (312) may include a second opening (315). For example, the first opening (314) may be positioned in a second direction (e.g., +y direction) when the electronic device (101) is viewed in a first direction (e.g., +z direction). For example, the second opening (315) may be positioned in a second direction (e.g., +y direction) when the electronic device (101) is viewed in a first direction (e.g., +z direction). For example, the first opening (314) and the second opening (315) may be positioned to face each other in a third direction (e.g., x-axis direction) with respect to the segmented portion (313).

[0069] According to one embodiment, the housing (310) may include a segmented portion (313) on its outer surface. For example, the segmented portion (313) may be formed by one end of the first conductive portion (312) and the other end of the first conductive portion (312). For example, the segmented portion (313) may be positioned between one end and the other end of the first conductive portion (312) formed along the outer surface of the housing (310). For example, the segmented portion (313) may be positioned in the second direction (e.g., +y direction) of the housing (310) when the first opening (314) is viewed in the first direction (e.g., +z direction) of the electronic device (101). For example, the segmented portion (313) may be filled with a non-conductive material. For example, the segmented portion (313) may be positioned between the first opening (314) and the second opening (315).

[0070] According to one embodiment, the housing (310) may be formed to accommodate at least one component of the electronic device (101). For example, the housing (310) may accommodate at least one printed circuit board (320a, 320b). For example, the housing (310) may accommodate a first printed circuit board (320a) and a second printed circuit board (320b) inside.

[0071] According to one embodiment, printed circuit boards (320a, 320b) may be arranged such that at least a portion overlaps with at least a portion of the first opening (314) and the second opening (315). For example, at least a portion of the first printed circuit board (320a) may overlap with the first opening (314). For example, at least a portion of the second printed circuit board (320b) may overlap with the second opening (315).

[0072] According to one embodiment, the housing (310) may include a non-conductive portion (330). For example, the non-conductive portion (330) may be positioned in a second direction (e.g., +y direction) of the housing (310) when the electronic device (101) is viewed in a first direction (e.g., +z direction). For example, the non-conductive portion (330) may be positioned to overlap with the segment portion (313) when viewed from the center of the ring shape. For example, the non-conductive portion (330) may be formed so that a portion of it fills the segment portion (313). For example, a portion of the non-conductive portion (330) may be formed to be interlocked with the segment portion (313). For example, the non-conductive portion (330) may be formed to protrude in a second direction (e.g., +y direction) of the housing (310) when the electronic device (101) is viewed in a first direction (e.g., +z direction).

[0073] According to one embodiment, the non-conductive portion (330) may be positioned to cover the first opening (314). For example, the non-conductive portion (330) may be formed to be interlocked with the first opening (314). For example, a portion of the non-conductive portion (330) may be formed to fill the first opening (314).

[0074] According to one embodiment, the non-conductive portion (330) may be positioned to cover the second opening (315). For example, the non-conductive portion (330) may be formed to be interlocked with the second opening (315). For example, a portion of the non-conductive portion (330) may be formed to fill the second opening (315).

[0075] According to one embodiment, the non-conductive portion (330) may include a coupling portion (331) for coupling with the first conductive portion (312). For example, the coupling portion (331) may be in the shape of a hook. For example, the coupling portion (331) may be coupled to a hooking projection of the first conductive portion (312).

[0076] According to one embodiment, the housing (310) may include a second conductive portion (340). For example, the second conductive portion (340) may be positioned in a second direction (e.g., +y direction) of the housing (310) when the electronic device (101) is viewed in a first direction (e.g., +z direction). For example, when the segmented portion (313) is viewed from the center of the ring shape, the second conductive portion (340) may be positioned to overlap with the segmented portion (313). For example, when the electronic device (101) is viewed in a first direction (e.g., +z direction), the second conductive portion (340) may be formed to protrude in a second direction (e.g., +y direction) of the housing (310).

[0077] According to one embodiment, the second conductive portion (340) may be disposed on the non-conductive portion (330). For example, when viewed from the center of the ring shape, the second conductive portion (340) may be disposed on the non-conductive portion (330) formed on the segmental portion (313). For example, the non-conductive portion (330) may be disposed between the second conductive portion (340) and the first conductive portion (312).

[0078] According to one embodiment, the second conductive portion (340) may include a first column portion (342) extended toward a first point of the first conductive portion (312). For example, the first column portion (342) may extend from one end of the second conductive portion (340) toward a first point of the first conductive portion (312). For example, the first column portion (342) may pass through a first through hole of the non-conductive portion (330) and be electrically connected to the first point. For example, the first point of the first conductive portion (312) may include a point adjacent to one end of the first conductive portion (312).

[0079] According to one embodiment, the second conductive portion (340) may include a second column portion (343) extended toward a second point of the first conductive portion (312). For example, the second column portion (343) may extend from the other end of the second conductive portion (340) toward a second point of the first conductive portion (312). For example, the second column portion (343) may pass through a second through hole of the non-conductive portion (330) and be electrically connected to the second point. For example, the second point of the first conductive portion (312) may include a point adjacent to the other end of the first conductive portion (312).

[0080] According to one embodiment, the second conductive portion (340) may include a ceiling portion (341). For example, the ceiling portion (341) may be placed on the non-conductive portion (330). For example, when the electronic device (101) is viewed in a first direction (e.g., +z direction), the ceiling portion (341) may be placed on a portion protruding in a second direction (e.g., +y direction) of the housing (310). For example, the ceiling portion (341) may be placed between the first column portion (342) and the second column portion (343).

[0081] According to one embodiment, a first connecting member (321a) may be disposed on the first printed circuit board (320a) and connected to a first pillar portion (342) of the second conductive portion (340). For example, the first connecting member (321a) may be a c-clip. For example, the first connecting member (321a) may be disposed within a first opening (314). For example, the first connecting member (321a) may be disposed on at least a portion of the first printed circuit board (320a) that overlaps with the first opening (314). For example, the first connecting member (321a) may connect the first pillar portion (342) of the second conductive portion (340) and a first point of the first conductive portion (312). For example, the first connecting member (321a) may electrically connect the feed portion (322) and the second conductive portion (340).

[0082] According to one embodiment, a second connecting member (321b) may be disposed on the second printed circuit board (320b) and connected to the second pillar portion (343) of the second conductive portion (340). For example, the second connecting member (321b) may be a c-clip. For example, the second connecting member (321b) may be disposed within the second opening (315). For example, the second connecting member (321b) may be disposed on at least a portion of the second printed circuit board (320b) that overlaps with the second opening (315). For example, the second connecting member (321b) may electrically connect the second pillar portion (343) of the second conductive portion (340) and the second point of the first conductive portion (312).

[0083] According to one embodiment, a first switching element (323) may be disposed on a second printed circuit board (320b). For example, the first switching element (323) may be disposed within the second opening (315). For example, the first switching element (323) may be disposed on at least a portion of the second printed circuit board (320b) that overlaps with the second opening (315). For example, the first switching element (323) may be disposed within the space enclosed by the second opening (315).

[0084] According to one embodiment, the first switching element (323) can electrically connect or disconnect the second pillar portion (343) and the first conductive portion (312). For example, the first switching element (323) can electrically connect the second pillar portion (343) to the first conductive portion (312) when the electronic device (101) is in a first state. For example, the first switching element (323) can electrically connect the second pillar portion (343) to a second point of the first conductive portion (312) when the electronic device (101) is in a first state. For example, the first switching element (323) can electrically disconnect the second pillar portion (343) from the first conductive portion (312) when the electronic device (101) is in a second state. For example, when the electronic device (101) is in a second state, the first switching element (323) can electrically disconnect the second pillar portion (343) from the second point of the first conductive portion (312) and electrically connect it to ground.

[0085] According to one embodiment, the printed circuit board (320a, 320b) may include a power supply unit (322). For example, the power supply unit (322) may be electrically connected to a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1). For example, the power supply unit (322) may provide a power supply signal to the second conductive part (340). For example, the power supply unit (322) may provide a power supply signal to the first pillar part (342) of the second conductive part (340) through the first connecting member (321a). For example, the power supply unit (322) may provide a power supply signal to the first conductive part (312).

[0086] According to one embodiment, the electronic device (101) may be in a first state or a second state. For example, the electronic device (101) may be in a first state or a second state by using a first switching element (323).

[0087] For example, a first state of the electronic device (101) may include a state in which the first conductive part (312) is electrically connected to the second conductive part (340) using the first switching element (323). For example, a first state of the electronic device (101) may include a normal operating state of the electronic device (101). For example, a first state of the electronic device (101) may include a state in which the electronic device (101) is not adjacent to an external electronic device (e.g., the external electronic device (201) of FIG. 2).

[0088] According to one embodiment, the electronic device (101) may include a display (350). For example, the display (350) may be placed on a non-conductive portion (330). For example, when the electronic device (101) is viewed in a first direction (e.g., +z direction), the display (350) may be placed on a non-conductive portion (330) that protrudes in a second direction (e.g., +y direction) of the housing (310). For example, the display (350) may be placed in the second direction (e.g., +y direction) of the non-conductive portion (330).

[0089] For example, a second state of the electronic device (101) may include a state in which the first conductive part (312) is electrically separated from the second conductive part (340) using the first switching element (323). For example, a second state of the electronic device (101) may include a state in which the electronic device (101) is adjacent to an external electronic device (e.g., the external electronic device (201) of FIG. 2). For example, a second state of the electronic device (101) may include a state in which the external electronic device (e.g., the external electronic device (201) of FIG. 2) is located near the palm of a user wearing the electronic device (101). For example, a second state of the electronic device (101) may include a state in which an RF signal radiated from the electronic device (101) is interfered with by the external electronic device (e.g., the external electronic device (201) of FIG. 2).

[0090] According to one embodiment, the first conductive portion (312) and the second conductive portion (340) can operate as radiators of the first antenna. For example, when the electronic device (101) is in a first state, the first conductive portion (312) and the second conductive portion (340) can operate as loop antennas.

[0091] According to one embodiment, the second conductive portion (340) can operate as a radiator of the second antenna. For example, the second conductive portion (340) can operate as a radiator of the second antenna by being electrically separated from the first conductive portion (312). For example, when the electronic device (101) is in a second state, the second conductive portion (340) can operate as a PIFA (planar inverted-F antenna).

[0092] FIG. 4 is a cross-sectional view and a partial plan view of an electronic device according to one embodiment. FIG. 4 is a cross-sectional view of the electronic device (101) described with reference to FIG. 3b and an xz plan view of the first conductive portion (312) of the electronic device (101).

[0093] The electronic device (101) of FIG. 4 may correspond to the electronic device (101) described with reference to FIG. 3a and FIG. 3b. The components of the electronic device (101) of FIG. 4 may be applied by analogy to the components of the electronic device (101) described with reference to FIG. 3a and FIG. 3b. The cross-sectional view of FIG. 4 may be applied by analogy to the cross-sectional view of the electronic device (101) described with reference to FIG. 3b. Redundant content is omitted.

[0094] According to one embodiment, the first conductive portion (312) may be disposed outside the inner surface (311) of the ring shape. For example, the first conductive portion (312) may be formed along the outer surface of the ring shape. For example, the segmented portion (313) may be disposed between one end and the other end of the first conductive portion (312).

[0095] According to one embodiment, the first conductive portion (312) may include a first opening (314) and a second opening (315). For example, in the xz plane, the first opening (314) and the second opening (315) may be positioned adjacent to the segmented portion (313). For example, in the xz plane, the first opening (314) and the second opening (315) may be positioned symmetrically with respect to the segmented portion (313). For example, in the xz plane, the first opening (314) may be positioned spaced apart in the +x direction with respect to the segmented portion (313), and the second opening (315) may be positioned spaced apart in the -x direction.

[0096] According to one embodiment, the first opening (314) may include a first connecting member (321a). For example, the first connecting member (321a) may be positioned within the space enclosed by the first opening (314). For example, in the xz plane, the first connecting member (321a) may be positioned in a portion of the first printed circuit board (320a) that overlaps with the first opening (314). For example, the first connecting member (321a) may be positioned adjacent to any one of the sides of the first opening (314).

[0097] According to one embodiment, the first opening (314) may include a power supply portion (322). For example, the power supply portion (322) may be placed within the space enclosed by the first opening (314). For example, the power supply portion (322) may be placed in a portion of the first printed circuit board (320a) that overlaps with the first opening (314). For example, in the xz plane, the power supply portion (322) may be placed adjacent to any one of the sides of the first opening (314). For example, the power supply portion (322) may be placed adjacent to the first connecting member (321a). For example, the power supply portion (322) may be electrically connected to the first connecting member (321a). For example, the power supply portion (322) may provide a power supply signal to the second conductive portion (340) through the first connecting member (321a).

[0098] According to one embodiment, the second opening (315) may include a second connecting member (321b). For example, the second connecting member (321b) may be positioned within the space enclosed by the second opening (315). For example, in the xz plane, the second connecting member (321b) may be positioned in a portion of the second printed circuit board (320b) that overlaps with the second opening (315). For example, the second connecting member (321b) may be positioned adjacent to any one of the sides of the second opening (315). For example, the second connecting member (321b) may be connected to the second pillar portion (343).

[0099] According to one embodiment, the second opening (315) may include a first switching element (323). For example, the first switching element (323) may be placed within the space enclosed by the second opening (315). For example, the first switching element (323) may be placed in a portion of the second printed circuit board (320b) that overlaps with the second opening (315). For example, in the xz plane, the first switching element (323) may be placed adjacent to any one of the sides of the second opening (315). For example, the first switching element (323) may be placed adjacent to the second connecting member (321b). For example, the first switching element (323) may be electrically connected to the second connecting member (321b). For example, the first switching element (323) may be electrically connected to the first conductive portion (312). For example, the first switching element (323) can electrically connect the second connecting member (321b) and the first conductive part (312). For example, the first switching element (323) can electrically disconnect the first conductive part (312) from the second connecting member (321b) and connect the first conductive part (312) to ground.

[0100] FIG. 5 is a diagram illustrating a first switching element when the electronic device is in a first state according to one embodiment, and FIG. 6 is a diagram illustrating a first switching element when the electronic device is in a second state according to one embodiment. For example, the first state of the electronic device (101) may include a state in which the first conductive part (312) is electrically connected to the second conductive part (340) using the first switching element (323). For example, the second state of the electronic device (101) may include a state in which the first conductive part (312) is electrically disconnected from the second conductive part (340) using the first switching element (323).

[0101] The electronic device (101) of FIG. 5 may correspond to the electronic device (101) described with reference to FIG. 3a and FIG. 3b. The components of the electronic device (101) of FIG. 5 may be applied by analogy to the components of the electronic device (101) described with reference to FIG. 3a and FIG. 3b. The cross-sectional view of FIG. 5 may be applied by analogy to the cross-sectional view of the electronic device (101) described with reference to FIG. 3b. Redundant content is omitted.

[0102] According to one embodiment, the first printed circuit board (320a) may be disposed within the first conductive portion (312). For example, the first printed circuit board (320a) may be disposed along a ring shape.

[0103] According to one embodiment, the first printed circuit board (320a) may include a first connecting member (e.g., the first connecting member (321a) of FIG. 3a). For example, the first connecting member (321a) may electrically connect the power supply portion (322) and the second conductive portion (340).

[0104] According to one embodiment, the first printed circuit board (320a) may be electrically connected to the first conductive portion (312) and the second conductive portion (340). For example, the power supply portion (322) of the first printed circuit board (320a) may be electrically connected to the first conductive portion (312) and the second conductive portion (340).

[0105] According to one embodiment, the power supply unit (322) may provide a power supply signal to the second conductive part (340). For example, current (301) may flow through the second conductive part (340) by the provided power supply signal. For example, current (301) may flow to the second column part (343) through the first column part (342) and the ceiling part (341) by the power supply signal provided from the power supply unit (322) to the first column part (342).

[0106] According to one embodiment, the second printed circuit board (320b) may be disposed within the first conductive portion (312). For example, the second printed circuit board (320b) may be disposed along a ring shape.

[0107] According to one embodiment, the second printed circuit board (320b) may include a second connecting member (321b), a first switching circuit (323), and a connecting element (328). For example, the second connecting member (321b) may be connected to the second pillar portion (343) of the second conductive portion (340). For example, the first switching circuit (323) may be electrically connected to the second connecting member (321b). For example, the first switching circuit (323) may be electrically connected to the connecting element (328). For example, the connecting element (328) may be electrically connected to the first conductive portion (312).

[0108] According to one embodiment, the first switching circuit (323) can electrically connect the second connecting member (321b) to the first conductive part (312). For example, when the electronic device (101) is in a first state, the first switching circuit (323) can electrically connect the second connecting member (321b) to the connecting element (328) so that current (329a) can flow from the second connecting member (321b) to the connecting element (328). For example, current (329a) can flow to the first conductive part (312) through the connecting element (328).

[0109] According to one embodiment, a power supply signal may be provided to the first conductive part (312). For example, when the electronic device (101) is in a first state, the power supply signal may be provided to the first conductive part (312) through the second conductive part (340). For example, the power supply signal provided to the second conductive part (340) may be provided to the first conductive part (312) through the connection element (328).

[0110] According to one embodiment, the first conductive portion (312) and the second conductive portion (340) may be radiators of the first antenna. For example, the first conductive portion (312) and the second conductive portion (340) may operate as loop antennas. For example, when the electronic device (101) is in a first state, the first conductive portion (312) and the second conductive portion (340) may be electrically connected by the first switching element (323) to form an electrical loop. For example, the first conductive portion (312) and the second conductive portion (340) may operate as loop antennas by allowing current (301) to flow along the loop by a feed signal provided by the feed portion (322).

[0111] According to one embodiment, the first switching circuit (323) can electrically separate the second connecting member (321b) from the first conductive part (312). For example, when the electronic device (101) is in a second state, the first switching circuit (323) can electrically separate the second connecting member (321b) from the connecting element (328) so that current (329b) does not flow from the second connecting member (321b) to the connecting element (328).

[0112] According to one embodiment, the second conductive portion (340) can operate as a PIFA (planar inverted-F antenna). For example, when the electronic device (101) is in a second state, the first conductive portion (312) and the second conductive portion (340) are electrically separated by the first switching element (323), so that the second conductive portion (340) can radiate an RF signal.

[0113] FIG. 7 is a drawing showing an electronic device coupled to a phantom to test the performance of an antenna according to one embodiment. The electronic device (101) of FIG. 7 may correspond to the electronic device (101) described with reference to FIG. 3a and FIG. 3b. The components of the electronic device (101) of FIG. 7 may be applied by analogy to the components of the electronic device (101) described with reference to FIG. 3a and FIG. 3b.

[0114] Referring to FIG. 7, an electronic device (101) according to one embodiment may be mounted on a phantom (2). For example, the phantom (2) may be a device that mimics a user's finger to test the performance of the antenna of the electronic device (101). For example, the electronic device (101) may be mounted on the phantom (2) as if it were worn on a user's finger. For example, the electronic device (101) may be inserted into the inner surface (for example, the inner surface (311) of FIG. 3a) of the phantom (2).

[0115] According to one embodiment, the electronic device (101) may be mounted on the phantom (2) such that a protruding part faces the back of the user's hand. For example, the electronic device (101) may be mounted on the phantom (2) such that a second conductive part (340) faces the first direction (e.g., the +y direction).

[0116] FIG. 8 is a diagram showing the electric field (E-field) of an electronic device in a first state according to one embodiment. FIG. 8 is a diagram showing the electric field for a 2.4 GHz band RF signal generated by an electronic device (101) mounted on the phantom (2) of FIG. 7. The electronic device (101) of FIG. 8 may correspond to the electronic device (101) described with reference to FIG. 3a and FIG. 3b.

[0117] Referring to FIG. 8, an electronic device (101) according to one embodiment may be in a first state. For example, the first state of the electronic device (101) may include a state in which a first conductive part (312) is electrically connected to a second conductive part (340) using a first switching element (323). For example, the first state of the electronic device (101) may include a state in which the first conductive part (312) and the second conductive part (340) form an electrical loop. For example, the first state of the electronic device (101) may include a state in which the first conductive part (312) and the second conductive part (340) operate as a loop antenna.

[0118] According to one embodiment, an electric field may be generated along a first conductive portion (312) and a second conductive portion (340) of an electronic device (101). For example, an electric field may be formed along the first conductive portion (312) and the second conductive portion (340) by current flowing along an electrical loop formed by the first conductive portion (312) and the second conductive portion (340).

[0119] Referring to FIG. 8, an electronic device (101) according to one embodiment may generate an electric field along the outer shape of a ring-shaped first conductive part (312). For example, the electric field may be radiated in all directions along the first conductive part (312).

[0120] Referring to FIG. 8, an electronic device (101) according to one embodiment may generate an electric field along the outer shape of a second conductive part (340) protruding in a first direction (e.g., +y direction). For example, the electric field may be radiated in all directions from the protruding second conductive part (340).

[0121] FIG. 9 is a diagram showing the electric field (E-field) of an electronic device in a second state according to one embodiment. FIG. 9 is a diagram showing the electric field for an RF signal in the 2.4 GHz band generated by an electronic device (101) mounted on the phantom (2) of FIG. 7. The electronic device (101) of FIG. 9 may correspond to the electronic device (101) described with reference to FIG. 3a and FIG. 3b.

[0122] Referring to FIG. 9, an electronic device (101) according to one embodiment may be in a second state. For example, the second state of the electronic device (101) may include a state in which the first conductive part (312) is electrically separated from the second conductive part (340) using a first switching element (e.g., the first switching element (323) of FIG. 3b). For example, the second state of the electronic device (101) may include a state in which the second conductive part (340) operates as a PIFA (planar inverted-F antenna).

[0123] According to one embodiment, an electric field may be generated along the second conductive portion (340) of the electronic device (101). For example, an electric field may be formed by current flowing along the second conductive portion (340).

[0124] Referring to FIG. 9, an electronic device (101) according to one embodiment may generate an electric field along the outline of a second conductive part (340) protruding in a first direction (e.g., +y direction). For example, the electric field may be radiated in all directions from the protruding second conductive part (340).

[0125] Referring to FIG. 9, in an electronic device (101) according to one embodiment, the first conductive portion (312) and the second conductive portion (340) are electrically separated by a first switching element (e.g., the first switching element (323) of FIG. 3b), so that current does not flow along the first conductive portion (312). Accordingly, the electronic device (101) can generate a weak electric field along the first conductive portion (312).

[0126] Comparing FIG. 8 and FIG. 9, the second state electronic device (101) may have a lower radiation efficiency of the RF signal than the first state electronic device (101). For example, the range of the electric field of the RF signal in the second state electronic device (101) may be weaker than that of the first state electronic device (101).

[0127] Comparing FIG. 8 and FIG. 9, the electronic device (101) in the second state may have more directivity regarding the radiation direction of the RF signal than the electronic device (101) in the first state. For example, the electric field may be formed weaker along the first conductive part (312) in the electronic device (101) in the second state than in the electronic device (101) in the first state.

[0128] Referring to FIGS. 8 and 9, the electronic device (101) can operate in a first state in which radiation efficiency is high when generally radiating an RF signal. The electronic device (101) can operate in a second state in which the RF signal has directionality when an external electronic device (e.g., the external electronic device (201) of FIG. 2) is present in the direction of the user's palm.

[0129] FIG. 10 is a drawing showing the radiation pattern of an RF signal by an electronic device in a first state according to one embodiment. FIG. 10 is a drawing showing the radiation pattern of an RF signal in the 2.4 GHz band generated by an electronic device (101) mounted on the phantom (2) of FIG. 7. The electronic device (101) of FIG. 10 may correspond to the electronic device (101) described with reference to FIG. 3a and FIG. 3b.

[0130] Referring to FIG. 10, a phantom (2) according to one embodiment can mimic a user's hand with the palm facing a first direction (-y direction). For example, a second conductive part (340) of an electronic device (101) can face a second direction (+y direction).

[0131] According to one embodiment, the electronic device (101) may be in a first state. For example, the first state of the electronic device (101) may include a state in which the first conductive part (312) is electrically connected to the second conductive part (340) using the first switching element (323). For example, the first state of the electronic device (101) may include a state in which the first conductive part (312) and the second conductive part (340) form an electrical loop. For example, the first state of the electronic device (101) may include a state in which the first conductive part (312) and the second conductive part (340) operate as a loop antenna.

[0132] According to one embodiment, the electronic device (101) can radiate an RF signal in a first pattern (1001). For example, the electronic device (101) can radiate an RF signal in a first direction (e.g., -y direction). For example, the electronic device (101) can radiate an RF signal in a second direction (e.g., +y direction) where the second conductive part (340) is positioned. For example, the electronic device (101) can radiate an RF signal in a third direction (e.g., -z direction) toward the fingertip.

[0133] Referring to FIG. 10, the peak beam of an RF signal radiated from an electronic device (101) according to one embodiment may be formed in a first direction (e.g., -y direction). For example, the peak beam of an RF signal radiated by the electronic device (101) in the first state may be directed toward the palm of the user.

[0134] FIG. 11 is a drawing showing the radiation pattern of an RF signal by an electronic device in a second state according to one embodiment. FIG. 11 is a drawing showing the radiation pattern of an RF signal in the 2.4 GHz band generated by an electronic device (101) mounted on the phantom (2) of FIG. 7. The electronic device (101) of FIG. 11 may correspond to the electronic device (101) described with reference to FIG. 3a and FIG. 3b.

[0135] Referring to FIG. 11, a phantom (2) according to one embodiment can mimic a user's hand with the palm facing a first direction (-y direction). For example, a second conductive part (340) of an electronic device (101) can face a second direction (+y direction).

[0136] Referring to FIG. 11, an electronic device (101) according to one embodiment may be in a second state. For example, the second state of the electronic device (101) may include a state in which the first conductive part (312) is electrically separated from the second conductive part (340) using a first switching element (e.g., the first switching element (323) of FIG. 3b). For example, the second state of the electronic device (101) may include a state in which the second conductive part (340) operates as a PIFA (planar inverted-F antenna).

[0137] According to one embodiment, the electronic device (101) can radiate an RF signal in a second pattern (1101). For example, the electronic device (101) can radiate an RF signal in a first direction (e.g., -y direction). For example, the electronic device (101) can radiate an RF signal in a second direction (e.g., +y direction) where the second conductive part (340) is positioned. For example, the electronic device (101) can radiate an RF signal in a third direction (e.g., -z direction) toward the fingertip.

[0138] Referring to FIG. 11, an RF signal radiated from an electronic device (101) according to one embodiment may generate a side lobe in a fourth direction (e.g., +z direction).

[0139] Referring to FIG. 11, the peak beam of an RF signal radiated from an electronic device (101) according to one embodiment may be directed toward a second direction (e.g., the +y direction). For example, the peak beam of an RF signal radiated by the electronic device (101) in a first state may be directed toward the back of the user's hand. For example, since the electronic device (101) radiates an RF signal using a second conductive part (340), the peak beam may be directed toward a second direction (e.g., the +y direction) where the second conductive part (340) is positioned.

[0140] FIG. 12 is a drawing for comparing the radiation pattern of an RF signal by an electronic device in a first state and the radiation pattern of an RF signal by an electronic device in a second state, according to one embodiment. FIG. 12 is a drawing in which the first radiation pattern (1001) and the second radiation pattern (1101) shown in FIG. 10 and FIG. 11 are shown together.

[0141] Referring to FIG. 12, the first radiation pattern (1001) may be wider in the first direction (-y direction) than the second radiation pattern (1101). The RF signal radiated from the first state electronic device (101) may be directed in the first direction (-y direction) than the RF signal radiated from the second state electronic device (101).

[0142] Referring to FIG. 12, the first radiation pattern (1001) may be wider in the third direction (-z direction) than the second radiation pattern (1101). The RF signal radiated from the first state electronic device (101) may be radiated more strongly in the main direction than the RF signal radiated from the second state electronic device (101).

[0143] Referring to FIG. 12, the second radiation pattern (1101) may be wider in the second direction (+y direction) than the first radiation pattern (1001). The RF signal radiated from the electronic device (101) in the second state may be directed in the second direction (+y direction) than the RF signal radiated from the electronic device (101) in the first state.

[0144] Referring to FIG. 12, the second radiation pattern (1101) may be wider in the fourth direction (+z direction) than the first radiation pattern (1001). The RF signal radiated from the second state electronic device (101) may have side lobes than the RF signal radiated from the first state electronic device (101).

[0145] Referring to FIG. 12, the first state electronic device (101) may have higher antenna performance than the second state electronic device (101). For example, the first state electronic device (101) may have higher antenna performance because it radiates RF signals in the main direction and the side lobes are reduced compared to the second state electronic device (101). It may be preferable for the first state electronic device (101) to be in a basic operating state compared to the second state electronic device (101).

[0146] Referring to FIG. 12, the electronic device (101) in the second state may have more RF signal directionality than the electronic device (101) in the first state. When an external electronic device (e.g., the external electronic device (201) of FIG. 2) is located near the electronic device (101), it may be preferable for the electronic device (101) to operate in the second state to avoid signal interference.

[0147] FIG. 13 is a diagram showing the efficiency graph of an electronic device in a first state and the efficiency graph of an electronic device in a second state according to one embodiment. FIG. 13 is a diagram showing the efficiency of an RF signal in the 2.4 GHz band generated by an electronic device (e.g., the electronic device (101) of FIG. 7) mounted on the phantom (2) of FIG. 7.

[0148] Referring to FIG. 13, the target frequency (1301) of the electronic device (101) according to one embodiment may be 2.4 GHz to 2.5 GHz. The first graph (1310) is a graph representing the total efficiency of the first antenna. The second graph (1320) is a graph representing the total efficiency of the second antenna. The third graph (1330) is a graph representing the radiation efficiency of the first antenna. The fourth graph (1340) is a graph representing the radiation efficiency of the second antenna. For example, the first antenna may include a loop antenna operated by a first conductive part (312) and a second conductive part (340) when the electronic device (101) is in a first state. For example, the second antenna may include a PIFA (planar inverted-F antenna) operated by a second conductive part (340) when the electronic device (101) is in a second state.

[0149] Referring to FIG. 13, the value of the first graph (1310) at the target frequency (1301) may be approximately -12.5 dB. The value of the second graph (1320) at the target frequency (1301) may be approximately -13.7 dB. The total efficiency value of the first antenna at -12.5 dB at the target frequency (1301) may be higher than the total efficiency value of the second antenna at -13.7 dB.

[0150] Referring to FIG. 13, the value of the third graph (1330) at the target frequency (1301) may be approximately -11.2 dB. For example, the value of the fourth graph (1340) at the target frequency (1301) may be approximately -11.8 dB. The radiation efficiency value of the first antenna at -11.2 dB at the target frequency (1301) may be higher than the radiation efficiency value of the second antenna at -11.8 dB.

[0151] Referring to FIG. 13, since the first antenna has higher efficiency than the second antenna, it may be preferable for the first antenna to be the primary antenna of the electronic device (101). It may be preferable for the electronic device (101) in the first state to be in the primary operating state rather than the electronic device (101) in the second state.

[0152] FIG. 14 is a diagram showing the resonance graph of an electronic device in a first state and the s-parameter of an electronic device in a second state according to one embodiment. FIG. 14 is a diagram showing the s-parameter for a 2.4 GHz band RF signal generated by an electronic device (e.g., the electronic device (101)) of FIG. 7 mounted on the phantom (2) of FIG. 7.

[0153] Referring to FIG. 14, the target frequency (1401) of the electronic device (101) according to one embodiment may be 2.4 GHz to 2.5 GHz. The first graph (1310) is a graph representing the S-parameters of the first antenna. The second graph (1320) is a graph representing the S-parameters of the second antenna. For example, the first antenna may include a loop antenna operated by the first conductive part (312) and the second conductive part (340) when the electronic device (101) is in a first state. For example, the second antenna may include a PIFA (planar inverted-F antenna) operated by the second conductive part (340) when the electronic device (101) is in a second state.

[0154] Referring to FIG. 14, at the target frequency (1401), the value of the first graph (1310) may be lower than the value of the second graph (1320). For example, at the target frequency (1401), the value of the first graph (1310) may be approximately -17.2 dB. For example, at the target frequency (1401), the value of the second graph (1320) may be approximately -13.8 dB. Thus, at the target frequency (1401), the S-parameter value of the first antenna at -17.2 dB may be lower than the S-parameter value of the second antenna at -13.8 dB.

[0155] Referring to FIG. 14, since the first antenna has a lower S-parameter value than the second antenna, it may be preferable for the first antenna to be the primary antenna of the electronic device (101). It may be preferable for the electronic device (101) in the first state to be in the primary operating state rather than the electronic device (101) in the second state.

[0156] FIG. 15 is a diagram illustrating an experiment in which an electronic device confirms interference of an RF signal by an external electronic device according to one embodiment. The electronic device (101) of FIG. 15 may correspond to the electronic device (101) described with reference to FIG. 3a and FIG. 3b. The external electronic device (201) of FIG. 15 may correspond to the external electronic device (201) described with reference to FIG. 2. The components of the electronic device (101) of FIG. 15 may be applied by analogy to the components of the electronic device (101) described with reference to FIG. 3a and FIG. 3b.

[0157] Referring to FIG. 15, an electronic device (101) according to one embodiment may be mounted on a phantom (2). For example, the phantom (2) may be a device that mimics a user's finger to test the performance of the antenna of the electronic device (101). For example, the electronic device (101) may be mounted on the phantom (2) as if it were worn on the user's finger. For example, the electronic device (101) may be inserted into the inner circumference of the phantom (2).

[0158] According to one embodiment, the electronic device (101) may be mounted on the phantom (2) such that a protruding part faces the back of the user's hand. For example, the electronic device (101) may be mounted on the phantom (2) such that a second conductive part (340) faces the first direction (e.g., the +y direction).

[0159] According to one embodiment, the electronic device (101) may be positioned adjacent to an external electronic device (201). For example, the external electronic device (201) may be a mobile electronic device (e.g., a smartphone) that a user holds in their hand and uses. For example, the external electronic device (201) may be positioned in a first direction (e.g., -y direction) from the electronic device (101). For example, the electronic device (101) may be positioned near the antenna area (210) of the external electronic device (201).

[0160] FIG. 16 is a diagram showing the electric field (E-field) of an electronic device in a first state adjacent to an external electronic device according to one embodiment. FIG. 16 is a diagram showing the electric field for a 2.4 GHz band RF signal generated by an electronic device (101) mounted on the phantom (2) of FIG. 15. The electronic device (101) of FIG. 16 may correspond to the electronic device (101) described with reference to FIG. 3a and FIG. 3b.

[0161] Referring to FIG. 16, an electronic device (101) according to one embodiment may be in a first state. For example, the first state of the electronic device (101) may include a state in which a first conductive part (for example, the first conductive part (312) of FIG. 3a) is electrically connected to a second conductive part (for example, the second conductive part (340) of FIG. 3a) using a first switching element (for example, the first switching element (323) of FIG. 3a). For example, the first state of the electronic device (101) may include a state in which the first conductive part (for example, the first conductive part (312) of FIG. 3a) and the second conductive part (for example, the second conductive part (340) of FIG. 3a) form an electrical loop. For example, a first state of the electronic device (101) may include a state in which a first conductive part (e.g., the first conductive part (312) of FIG. 3a) and a second conductive part (e.g., the second conductive part (340) of FIG. 3a) operate as a loop antenna.

[0162] According to one embodiment, an electric field may be generated along a first conductive part (e.g., the first conductive part (312) of FIG. 3A) and a second conductive part (e.g., the second conductive part (340) of FIG. 3A) of an electronic device (101). For example, an electric field may be formed along the first conductive part (e.g., the first conductive part (312) of FIG. 3A) and the second conductive part (e.g., the second conductive part (340) of FIG. 3A) by current flowing along an electrical loop formed by the first conductive part (e.g., the first conductive part (312) of FIG. 3A) and the second conductive part (e.g., the second conductive part (340) of FIG. 3A).

[0163] Comparing FIG. 8 and FIG. 16, a strong electric field may be generated between the antenna region (210) of the electronic device (101) and the external electronic device (201) according to one embodiment. The current flowing through the first conductive part of the electronic device (101) (e.g., the first conductive part (312) of FIG. 3a) may affect the antenna of the external electronic device (201).

[0164] FIG. 17 is a diagram showing the electric field (E-field) of a second state electronic device adjacent to an external electronic device according to one embodiment. FIG. 17 is a diagram showing the electric field for a 2.4 GHz band RF signal generated by an electronic device (101) mounted on the phantom (2) of FIG. 7. The electronic device (101) of FIG. 17 may correspond to the electronic device (101) described with reference to FIG. 3a and FIG. 3b.

[0165] Referring to FIG. 17, an electronic device (101) according to one embodiment may be in a second state. For example, the second state of the electronic device (101) may include a state in which a first conductive part (for example, the first conductive part (312) of FIG. 3a) is electrically separated from a second conductive part (for example, the second conductive part (340) of FIG. 3a) using a first switching element (for example, the first switching element (323) of FIG. 3b)). For example, the second state of the electronic device (101) may include a state in which the second conductive part (for example, the second conductive part (340) of FIG. 3a) operates as a PIFA (planar inverted-F antenna).

[0166] According to one embodiment, an electric field may be generated along a second conductive portion (e.g., the second conductive portion (340) of FIG. 3a) of the electronic device (101). For example, an electric field may be formed by current flowing along the second conductive portion (e.g., the second conductive portion (340) of FIG. 3a). For example, an electric field may be generated along the outer shape of the second conductive portion (e.g., the second conductive portion (340) of FIG. 3a) protruding in a first direction (e.g., the +y direction) of the electronic device (101).

[0167] Comparing FIG. 9 and FIG. 17, the electric field generated between the electronic device (101) and the external electronic device (201) according to one embodiment may be similar. When the electronic device (101) is in a second state, the antenna region (210) of the external electronic device (201) may be less affected by the current flowing through the second conductive part of the electronic device (101) (e.g., the second conductive part (340) of FIG. 3a).

[0168] Comparing FIG. 16 and FIG. 17, the electric field generated between the electronic device (101) in the first state and the external electronic device (201) may be stronger than the electric field generated between the electronic device (101) in the second state and the external electronic device (201). The interference caused by the external electronic device (201) to the electronic device (101) in the first state may be greater than the interference caused by the external electronic device (201) to the electronic device (101) in the second state. When the electronic device (101) is placed adjacent to the external electronic device (201), it may be preferable for the electronic device (101) to operate in the second state.

[0169] FIG. 18 is a diagram showing an efficiency graph of an electronic device in a first state adjacent to an external electronic device and an efficiency graph of an electronic device in a second state adjacent to an external electronic device, according to one embodiment.

[0170] FIG. 18 is a diagram showing the efficiency of a 2.4 GHz band RF signal generated by an electronic device (e.g., the electronic device (101) of FIG. 15) mounted on the phantom (2) of FIG. 15.

[0171] Referring to FIG. 18, the target frequency (1301) of the electronic device (101) according to one embodiment may be 2.4 GHz to 2.5 GHz.

[0172] The first graph (1811) is a graph showing the efficiency of the antenna of an external electronic device (e.g., the external electronic device (201) of FIG. 15). The second graph (1812) is a graph showing the efficiency of the antenna of an external electronic device (e.g., the external electronic device (201) of FIG. 15) adjacent to the electronic device in the second state (e.g., the electronic device (101) of FIG. 15). The third graph (1823) is a graph showing the efficiency of the antenna of an external electronic device (e.g., the external electronic device (201) of FIG. 15) adjacent to the electronic device in the first state (e.g., the electronic device (101) of FIG. 15).

[0173] The fourth graph (1821) is a graph showing the efficiency of a first antenna adjacent to an external electronic device (e.g., the external electronic device (201) of FIG. 15). The fifth graph (1822) is a graph showing the efficiency of a second antenna adjacent to an external electronic device (e.g., the external electronic device (201) of FIG. 15). The sixth graph (1823) is a graph showing the efficiency of a first antenna not adjacent to an external electronic device (e.g., the external electronic device (201) of FIG. 15). The seventh graph (1823) is a graph showing the efficiency of a second antenna not adjacent to an external electronic device (e.g., the external electronic device (201) of FIG. 15).

[0174] For example, the first antenna may include a loop antenna operated by the first conductive part (312) and the second conductive part (340) when the electronic device (101) is in a first state. For example, the second antenna may include a PIFA (planar inverted-F antenna) operated by the second conductive part (340) when the electronic device (101) is in a second state.

[0175] Referring to FIG. 18, the value of the first graph (1811) at the target frequency (1801) may be approximately -4dB. The value of the second graph (1812) at the target frequency (1801) may be approximately -5dB. The value of the third graph (1813) at the target frequency (1801) may be approximately -6.5dB. The value of the fourth graph (1821) at the target frequency (1801) may be approximately -15dB. The value of the fifth graph (1822) at the target frequency (1801) may be approximately -14dB. The value of the sixth graph (1823) at the target frequency (1801) may be approximately -13.8dB. The value of the seventh graph (1824) at the target frequency (1801) may be approximately -12.5dB.

[0176] By comparing the first graph (1811) to the third graph (1813), the first state electronic device (e.g., the electronic device (101) of FIG. 15) is adjacent to the external electronic device (e.g., the external electronic device (201) of FIG. 15) at the target frequency (1801), so that the efficiency of the antenna of the external electronic device (e.g., the external electronic device (201) of FIG. 15) can be reduced from about -4dB to -6.5dB. By the second state electronic device (e.g., the electronic device (101) of FIG. 15) is adjacent to the external electronic device (e.g., the external electronic device (201) of FIG. 15) at the target frequency (1801), so that the efficiency of the antenna of the external electronic device (e.g., the external electronic device (201) of FIG. 15) can be reduced from about -4dB to -5dB.

[0177] Referring to the first graph (1811) to the third graph (1813), when the second state electronic device (e.g., the electronic device (101) of FIG. 15) is adjacent to the external electronic device (e.g., the external electronic device (201) of FIG. 15), the efficiency value of the antenna of the external electronic device (e.g., the external electronic device (201) of FIG. 15) at the target frequency (1801) may be higher than when the first state electronic device (e.g., the electronic device (101) of FIG. 15) is adjacent to the external electronic device (e.g., the external electronic device (201) of FIG. 15).

[0178] When comparing the fourth graph (1821) and the seventh graph (1824), the efficiency of the first antenna can be reduced from about -12.5 dB to about 15 dB by having an external electronic device (e.g., the external electronic device (201) of FIG. 15) adjacent to the electronic device (e.g., the electronic device (101) of FIG. 15) at the target frequency (1801).

[0179] When comparing the 5th graph (1822) and the 6th graph (1823), the efficiency of the second antenna can be lowered from about -13.8 to about -14 dB by having an external electronic device (e.g., the external electronic device (201) of FIG. 15) adjacent to the electronic device (e.g., the electronic device (101) of FIG. 15) at the target frequency (1801).

[0180] Referring to graphs 4 (1821) through 7, when an external electronic device (e.g., external electronic device (201) of FIG. 15) is adjacent to an electronic device (e.g., electronic device (101) of FIG. 15), the efficiency of the second antenna may be lower than the efficiency of the first antenna.

[0181] When comparing the fourth graph (1821) and the fifth graph (1822), at the target frequency (1801), the value of the fifth graph (1822) may be approximately -14dB, and the value of the fourth graph (1821) may be approximately -15dB. When an external electronic device (e.g., the external electronic device (201) of FIG. 15) is adjacent to an electronic device (e.g., the electronic device (101) of FIG. 15), the efficiency value of the second antenna at the target frequency (1801) may be higher than the efficiency value of the first antenna.

[0182] Referring to the first graph (1811) through the seventh graph (1824), when an external electronic device (e.g., the external electronic device (201) of FIG. 15) is adjacent to an electronic device (e.g., the electronic device (101) of FIG. 15), it may be preferable for the electronic device to operate in a second state.

[0183] FIG. 19 is a diagram showing the s-parameters of an external electronic device and an adjacent electronic device according to one embodiment. FIG. 19 is a diagram showing the s-parameters for a 2.4 GHz band RF signal generated by an electronic device (e.g., the electronic device (101) of FIG. 15) mounted on the phantom (2) of FIG. 15.

[0184] Referring to FIG. 19, the target frequency (1401) of the electronic device (101) according to one embodiment may be 2.4 GHz to 2.5 GHz.

[0185] The first graph (1911) is a graph showing the s11 parameters of the first antenna of an electronic device that is not adjacent to an external electronic device (e.g., the external electronic device (201) of FIG. 15). The second graph (1912) is a graph showing the s11 parameters of the first antenna of an electronic device that is adjacent to an external electronic device (e.g., the external electronic device (201) of FIG. 15).

[0186] The third graph (1921) is a graph showing the s11 parameters of the second antenna of an electronic device that is not adjacent to an external electronic device (e.g., the external electronic device (201) of FIG. 15). The fourth graph (1922) is a graph showing the s11 parameters of the second antenna of an electronic device that is adjacent to an external electronic device (e.g., the external electronic device (201) of FIG. 15).

[0187] The fifth graph (1931) is a graph showing the s21 parameters of the first antenna and the antenna of the external electronic device (e.g., the external electronic device (201) of FIG. 15). The sixth graph (1932) is a graph showing the s21 parameters of the second antenna and the antenna of the external electronic device (e.g., the external electronic device (201) of FIG. 15).

[0188] For example, the first antenna may include a loop antenna operated by the first conductive part (312) and the second conductive part (340) when the electronic device (101) is in a first state. For example, the second antenna may include a PIFA (planar inverted-F antenna) operated by the second conductive part (340) when the electronic device (101) is in a second state.

[0189] Referring to FIG. 19, the value of the first graph (1911) at the target frequency (1901) may be approximately -14.2 dB. The value of the second graph (1912) at the target frequency (1901) may be approximately -9 dB. The value of the third graph (1921) at the target frequency (1901) may be -9.8 dB. The value of the fourth graph (1922) at the target frequency (1901) may be -10.2 dB. The value of the fifth graph (1931) at the target frequency (1901) may be -9.4 dB. The value of the sixth graph (1932) at the target frequency may be -13 dB.

[0190] Referring to FIG. 19, the resonant frequency of the first graph (1911) may be approximately 2.48 GHz. The resonant frequency of the second graph (1912) may be approximately 2.18 GHz. The resonant frequency of the third graph (1921) may be approximately 2.46 GHz. The resonant frequency of the fourth graph (1922) may be approximately 2.26 GHz.

[0191] By comparing the first graph (1911) and the second graph (1912), the s11 value of the first antenna can be increased from about -14.2 dB to about -9 dB by having the external electronic device (e.g., the external electronic device (201) of FIG. 15) adjacent to the electronic device (e.g., the electronic device (101) of FIG. 15) at the target frequency (1901). The resonant frequency of the first antenna can be shifted from about 2.48 GHz to about 2.18 GHz by having the external electronic device (e.g., the external electronic device (201) of FIG. 15) adjacent to the electronic device (e.g., the electronic device (101) of FIG. 15) at the target frequency (1901).

[0192] By comparing the third graph (1921) and the fourth graph (1922), the s11 value of the second antenna can be increased from about -9.8dB to about -10.2dB by having the external electronic device (e.g., the external electronic device (201) of FIG. 15) adjacent to the electronic device (e.g., the electronic device (101) of FIG. 15) at the target frequency (1901). The resonant frequency of the second antenna can be shifted from about 2.46GHz to about 2.26GHz by having the external electronic device (e.g., the external electronic device (201) of FIG. 15) adjacent to the electronic device (e.g., the electronic device (101) of FIG. 15) at the target frequency (1901).

[0193] When comparing the first graph (1911) to the fourth graph (1922), when an external electronic device (e.g., the external electronic device (201) of FIG. 15) is adjacent to an electronic device (e.g., the electronic device (101) of FIG. 15), the variation value of the resonant frequency of the second antenna is smaller than the variation value of the resonant frequency of the first antenna, and the variation of the s11 value may be smaller.

[0194] When comparing the fifth graph (1931) and the sixth graph (1932), when an external electronic device (e.g., the external electronic device (201) of FIG. 15) approaches an electronic device (e.g., the electronic device (101) of FIG. 15), the s21 value of the second antenna, which is about -13dB at the target frequency (1901), may be lower than the s21 value of the first antenna, which is about -9.8dB.

[0195] Referring to the first graph (1911) through the sixth graph (1932), when an external electronic device (e.g., the external electronic device (201) of FIG. 15) is adjacent to an electronic device (e.g., the electronic device (101) of FIG. 15), it may be preferable for the electronic device to operate in a second state.

[0196] FIG. 20 is a drawing showing the impedance of an electronic device in a first state and an electronic device in a second state according to one embodiment. FIG. 20 is a drawing showing the impedance for a 2.4 GHz band RF signal generated by an electronic device (e.g., the electronic device (101) of FIG. 15) mounted on the phantom (2) of FIG. 15.

[0197] Referring to FIG. 20, the first graph (2010) is a graph showing the impedance of a first antenna of an electronic device (e.g., the electronic device (101) of FIG. 15) that is not adjacent to an external electronic device (e.g., the external electronic device (201) of FIG. 15). The second graph (2020) is a graph showing the impedance of a first antenna of an electronic device (e.g., the electronic device (101) of FIG. 15) that is adjacent to an external electronic device (e.g., the external electronic device (201) of FIG. 15). The third graph (2030) is a graph showing the impedance of a second antenna of an electronic device (e.g., the electronic device (101) of FIG. 15) that is not adjacent to an external electronic device (e.g., the external electronic device (201) of FIG. 15). The fourth graph (2040) is a graph showing the impedance of the fourth antenna of an adjacent electronic device (e.g., the external electronic device (201) of FIG. 15) to an external electronic device (e.g., the external electronic device (201) of FIG. 15).

[0198] For example, the first antenna may include a loop antenna operated by the first conductive part (312) and the second conductive part (340) when the electronic device (101) is in a first state. For example, the second antenna may include a PIFA (planar inverted-F antenna) operated by the second conductive part (340) when the electronic device (101) is in a second state.

[0199] Referring to the first graph (2010), the first impedance (2011) of the first antenna, which is not adjacent to an external electronic device (e.g., the external electronic device (201) of FIG. 15), may be approximately 0.7 + 0.39i. Referring to the second graph (2020), the second impedance (2021) of the first antenna, which is adjacent to an external electronic device (e.g., the external electronic device (201) of FIG. 15), may be approximately 0.49 - 0.1i. Referring to the third graph (2030), the third impedance (2031) of the second antenna, which is not adjacent to an external electronic device (e.g., the external electronic device (201) of FIG. 15), may be approximately 0.5 + 0.1i. Referring to the fourth graph (2040), the fourth impedance (2041) of the second antenna adjacent to the external electronic device (e.g., the external electronic device (201) of FIG. 15) may be approximately 0.55+0.15i.

[0200] When comparing the first graph (2010) and the second graph (2020), the impedance of the first antenna can be changed from about 0.7+0.39i to about 0.49-0.1i by being adjacent to an external electronic device (e.g., the external electronic device (201) of FIG. 15).

[0201] When comparing the third graph (2030) and the fourth graph (2040), the impedance of the second antenna can be changed from about 0.5+0.1i to about 0.55+0.15i as the external electronic device (e.g., the external electronic device (201) of FIG. 15) is adjacent.

[0202] When comparing the first graph (2010) to the fourth graph (2040), the amount of change in the impedance of the first antenna may be greater than the amount of change in the impedance of the second antenna when the external electronic device (e.g., the external electronic device (201) of FIG. 15) is adjacent to the electronic device (e.g., the electronic device (101) of FIG. 15). When the external electronic device (e.g., the external electronic device (201) of FIG. 15) is adjacent to the electronic device (e.g., the electronic device (101) of FIG. 15), it may be preferable for the electronic device (e.g., the electronic device (101) of FIG. 15) to operate in a second state.

[0203] FIG. 21 is a cross-sectional view and a partial plan view of an electronic device according to one embodiment. FIG. 21 is a cross-sectional view of the electronic device (101) described with reference to FIG. 3b and an xz plan view of the first conductive portion (312) of the electronic device (101).

[0204] The electronic device (101) of FIG. 21 may correspond to the electronic device (101) described with reference to FIG. 3a and FIG. 3b. The components of the electronic device (101) of FIG. 21 may be applied by analogy to the components of the electronic device (101) described with reference to FIG. 3a and FIG. 3b. The cross-sectional view of FIG. 21 may be applied by analogy to the cross-sectional view of the electronic device (101) described with reference to FIG. 3b. Redundant content is omitted.

[0205] According to one embodiment, the electronic device (101) may include a second switching element (319). For example, the second switching element (319) may be placed in a segmented portion (313).

[0206] According to one embodiment, the second switching element (319) can electrically connect or disconnect one end of the first conductive portion (312) and the other end of the first conductive portion (312). For example, when the electronic device (101) is in a first state, the second switching element (319) can electrically disconnect one end of the first conductive portion (312) and the other end of the first conductive portion (312). For example, when the electronic device (101) is in a second state, the second switching element (319) can electrically connect one end of the first conductive portion (312) and the other end of the first conductive portion (312).

[0207] For example, a first state of the electronic device (101) may include a state in which the first conductive part (312) is electrically connected to the second conductive part (340) using the first switching element (323). For example, a first state of the electronic device (101) may include a normal operating state of the electronic device (101). For example, a first state of the electronic device (101) may include a state in which the electronic device (101) is not adjacent to an external electronic device (201).

[0208] For example, a second state of the electronic device (101) may include a state in which the first conductive part (312) is electrically separated from the second conductive part (340) using the first switching element (323). For example, a second state of the electronic device (101) may include a state in which the electronic device (101) is adjacent to an external electronic device (201). For example, a second state of the electronic device (101) may include a state in which the external electronic device (201) is located near the palm of a user wearing the electronic device (101). For example, a second state of the electronic device (101) may include a state in which an RF signal radiated from the electronic device (101) is interfered with by the external electronic device (101).

[0209] Referring to FIG. 21, when the electronic device (101) is in a second state, the second switching element (319) electrically connects one end of the first conductive part (312) and the other end of the first conductive part (312), so that the first conductive part (312) can operate as a reflector for an RF signal. By the first conductive part (312) operating as a reflector for an RF signal, the RF signal radiated by the second conductive part (340) can be directed in a first direction (e.g., +y direction).

[0210] FIG. 22 is a cross-sectional view of an electronic device in a first state according to one embodiment, and FIG. 23 is a cross-sectional view of an electronic device in a second state according to one embodiment. The electronic device (101) of FIG. 22 and FIG. 23 may correspond to the electronic device (101) described with reference to FIG. 3a through FIG. 21. The components of the electronic device (101) of FIG. 21 may be applied by analogy to the components of the electronic device (101) described with reference to FIG. 3a and FIG. 21. Redundant content is omitted.

[0211] Referring to FIGS. 22 and 23, the electronic device (101) may include a ring-shaped housing (310). For example, the housing (310) may be formed so that a user's finger is inserted into its inner diameter. For example, the inner surface (311) of the housing (310) may be formed of a non-conductive material. For example, the part of the housing (310) that is touched by the user's finger may be formed of a non-conductive material.

[0212] According to one embodiment, the housing (310) may include a first conductive portion (312). For example, at least a portion of the outer surface of the housing (310) may be formed as the first conductive portion (312). For example, the first conductive portion (312) may be formed along the outer surface of the housing (310).

[0213] According to one embodiment, the housing (310) may include a segmented portion (313) on its outer surface. For example, the segmented portion (313) may be formed by one end and the other end of a first conductive portion (312). For example, the segmented portion (313) may be positioned between one end and the other end of a first conductive portion (312) formed along the outer surface of the housing (310).

[0214] According to one embodiment, the housing (310) may be formed to accommodate at least one component of the electronic device (101). For example, the housing (310) may accommodate at least one printed circuit board (320a, 320b). For example, the housing (310) may accommodate a first printed circuit board (320a) and a second printed circuit board (320b) inside.

[0215] According to one embodiment, the housing (310) may include a non-conductive portion (330). For example, the non-conductive portion (330) may be positioned in a second direction (e.g., +y direction) of the housing (310) when the electronic device (101) is viewed in a first direction (e.g., +z direction). For example, the non-conductive portion (330) may be positioned to overlap with the segment portion (313) when viewed from the center of the ring shape. For example, the non-conductive portion (330) may be formed so that a portion of it fills the segment portion (313). For example, a portion of the non-conductive portion (330) may be formed to be interlocked with the segment portion (313). For example, the non-conductive portion (330) may be formed to protrude in a second direction (e.g., +y direction) of the housing (310) when the electronic device (101) is viewed in a first direction (e.g., +z direction). For example, the non-conductive portion (330) may be formed along the outer surface of the electronic device (101) with a predetermined thickness.

[0216] According to one embodiment, the housing (310) may include a second conductive portion (340). For example, the second conductive portion (340) may be positioned in a second direction (e.g., +y direction) of the housing (310) when the electronic device (101) is viewed in a first direction (e.g., +z direction). For example, the second conductive portion (340) may be positioned to overlap with the segmented portion (313) when viewed from the center of the ring shape toward the segmented portion (313). For example, the second conductive portion (340) may be formed to protrude in a second direction (e.g., +y direction) of the housing (310) when the electronic device (101) is viewed in a first direction (e.g., +z direction). For example, the ceiling portion (341) of the second conductive portion (340) may be formed along the outer surface of the electronic device (101) with a predetermined thickness.

[0217] According to one embodiment, the second conductive portion (340) may be disposed on the non-conductive portion (330). For example, the second conductive portion (340) may be disposed on the non-conductive portion (330) formed on the segment portion (313) when viewed from the center of the ring shape toward the segment portion (313). For example, the non-conductive portion (330) may be disposed between the second conductive portion (340) and the first conductive portion (312).

[0218] According to one embodiment, the second conductive portion (340) may include a first column portion (342) extended toward a first point of the first conductive portion (312). For example, the first point of the first conductive portion (312) may include a point adjacent to one end of the first conductive portion (312).

[0219] According to one embodiment, the second conductive portion (340) may include a second column portion (343) extended toward a second point of the first conductive portion (312). For example, the second point of the first conductive portion (312) may include a point adjacent to the other end of the first conductive portion (312).

[0220] According to one embodiment, the second conductive portion (340) may include a ceiling portion (341). For example, the ceiling portion (341) may be placed on the non-conductive portion (330). For example, when the electronic device (101) is viewed in a first direction (e.g., +z direction), the ceiling portion (341) may be placed on a portion protruding in a second direction (e.g., +y direction) of the housing (310). For example, the ceiling portion (341) may be placed between the first column portion (342) and the second column portion (343).

[0221] According to one embodiment, a first switching element (323) may be disposed on the second printed circuit board (320b). The first switching element (323) may electrically connect or disconnect the second pillar portion (343) and the first conductive portion (312). For example, the first switching element (323) may electrically connect the second pillar portion (343) to the first conductive portion (312) when the electronic device (101) is in a first state. For example, the first switching element (323) may electrically disconnect the second pillar portion (343) from the first conductive portion (312) when the electronic device (101) is in a second state.

[0222] According to one embodiment, the printed circuit board (320a, 320b) may include a power supply unit (322). For example, the power supply unit (322) may be electrically connected to a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1). For example, the power supply unit (322) may provide a power supply signal to the second conductive part (340). For example, the power supply unit (322) may provide a power supply signal to the first pillar part (342) of the second conductive part (340) through the first connecting member (321a). For example, the power supply unit (322) may provide a power supply signal to the first conductive part (312).

[0223] According to one embodiment, the electronic device (101) may be in a first state or a second state. For example, the electronic device (101) may be in a first state or a second state by using a first switching element (323).

[0224] For example, a first state of the electronic device (101) may include a state in which the first conductive part (312) is electrically connected to the second conductive part (340) using the first switching element (323). For example, a first state of the electronic device (101) may include a normal operating state of the electronic device (101). For example, a first state of the electronic device (101) may include a state in which the electronic device (101) is not adjacent to an external electronic device (e.g., the external electronic device (201) of FIG. 2).

[0225] For example, a second state of the electronic device (101) may include a state in which the first conductive part (312) is electrically separated from the second conductive part (340) using the first switching element (323). For example, a second state of the electronic device (101) may include a state in which the electronic device (101) is adjacent to an external electronic device (e.g., the external electronic device (201) of FIG. 2). For example, a second state of the electronic device (101) may include a state in which the external electronic device (e.g., the external electronic device (201) of FIG. 2) is located near the palm of a user wearing the electronic device (101). For example, a second state of the electronic device (101) may include a state in which an RF signal radiated from the electronic device (101) is interfered with by the external electronic device (101).

[0226] According to one embodiment, the first conductive portion (312) and the second conductive portion (340) can operate as radiators of the first antenna. For example, when the electronic device (101) is in a first state, the first conductive portion (312) and the second conductive portion (340) can operate as loop antennas. For example, when the electronic device (101) is in a first state, current (301) can flow through the electrical loop formed by the first conductive portion (312) and the second conductive portion (340).

[0227] According to one embodiment, the second conductive portion (340) can operate as a radiator of the second antenna. For example, the second conductive portion (340) can operate as a radiator of the second antenna separated from the first conductive portion (312). For example, when the electronic device (101) is in a second state, the second conductive portion (340) can operate as a PIFA (planar inverted-F antenna). For example, when the electronic device (101) is in a second state, current (302) can flow through the first pillar portion (342), the ceiling portion (341), and the second pillar portion (343) of the second conductive portion (340).

[0228] FIG. 24 is a cross-sectional view of an electronic device in a first state according to one embodiment, and FIG. 25 is a cross-sectional view of an electronic device in a second state according to one embodiment. The electronic device (2400) of FIG. 24 and FIG. 25 may correspond to the electronic device (101) described with reference to FIG. 1 and FIG. 2.

[0229] According to one embodiment, the electronic device (2400) may include a housing (2410). For example, the housing (2410) may be formed in a ring shape. For example, the housing (2410) may be formed so that a user's finger is inserted into its inner diameter. For example, at least a portion of the housing (2410) adjacent to the inner diameter may be formed of a non-conductive material. For example, the inner surface (2411) of the housing (2410) may be formed of a non-conductive material. For example, the portion of the housing (2410) that is touched by the user's finger may be formed of a non-conductive material.

[0230] According to one embodiment, the housing (2410) may include a first conductive portion (2412). For example, the first portion of the outer surface of the housing (2410) may be formed as the first conductive portion (2412). For example, the first conductive portion (2412) may be formed along the outer surface of the housing (2410).

[0231] According to one embodiment, the housing (2410) may include a second conductive portion (2440). For example, the second portion of the outer surface of the housing (2410) may be formed as the second conductive portion (2440). For example, the second conductive portion (2440) may be formed along the outer surface of the housing (2410). For example, the second conductive portion (2440) may be positioned in the second direction (e.g., +y direction) of the housing (2410) when the electronic device (2400) is viewed in the first direction (e.g., +z direction).

[0232] According to one embodiment, the housing (2410) may include a first segmented portion (2413). For example, the first segmented portion (2413) may be formed by one end of the first conductive portion (2412) and one end of the second conductive portion (2440). For example, the first segmented portion (2413) may be filled with a non-conductive material.

[0233] According to one embodiment, the housing (2410) may include a second segmented portion (2414). For example, the second segmented portion (2414) may be formed by the other end of the first conductive portion (2412) and the other end of the second conductive portion (2440). For example, the second segmented portion (2414) may be filled with a non-conductive material.

[0234] According to one embodiment, the housing (2410) may be formed to accommodate at least one component of the electronic device (2400). For example, the housing (2410) may accommodate a printed circuit board (2420).

[0235] According to one embodiment, a power supply unit (2423) may be disposed on a printed circuit board (2420). For example, the power supply unit (2423) may be electrically connected to a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1). For example, the power supply unit (2423) may provide a power supply signal to a second conductive part (2440). For example, the power supply unit (2423) may provide a power supply signal to a first conductive part (2412).

[0236] According to one embodiment, a first switching element (2421) may be disposed on a printed circuit board (2420). For example, the first switching element (2421) may be disposed on a first segmented portion (2413). For example, the first switching element (2421) may electrically connect or disconnect the first conductive portion (2412) and the second conductive portion (2440). For example, when the electronic device (2400) is in a first state, the first switching element (2421) may electrically connect one end of the first conductive portion (2412) and one end of the second conductive portion (2440). For example, when the electronic device (2400) is in a second state, the first switching element (2421) may electrically disconnect one end of the first conductive portion (2412) and one end of the second conductive portion (2440).

[0237] According to one embodiment, a second switching element (2422) may be disposed on a printed circuit board (2420). For example, the second switching element (2422) may be disposed on a second segmented portion (2414). For example, the second switching element (2422) may electrically connect or disconnect the first conductive portion (2412) and the second conductive portion (2440). For example, when the electronic device (2400) is in a first state, the second switching element (2422) may electrically connect the other end of the first conductive portion (2412) and the other end of the second conductive portion (2440). For example, when the electronic device (2400) is in a second state, the second switching element (2422) may electrically disconnect the other end of the first conductive portion (2412) and the other end of the second conductive portion (2440).

[0238] According to one embodiment, the electronic device (2400) may be in a first state or a second state. For example, the electronic device (2400) may be in a first state or a second state by using a first switching element (2421) and a second switching element (2422).

[0239] For example, a first state of the electronic device (2400) may include a state in which the first conductive part (2412) is electrically connected to the second conductive part (2440) using the first switching element (2421) and the second switching element (2422). For example, a first state of the electronic device (2400) may include a general operating state of the electronic device (2400). For example, a first state of the electronic device (2400) may include a state in which the electronic device (2400) is not adjacent to an external electronic device (2400).

[0240] For example, a second state of the electronic device (2400) may include a state in which the first conductive part (2412) is electrically separated from the second conductive part (2440) using the first switching element (2421) and the second switching element (2422). For example, a second state of the electronic device (2400) may include a state in which the electronic device (2400) is adjacent to an external electronic device (2400). For example, a second state of the electronic device (2400) may include a state in which the external electronic device (2400) is located near the palm of a user wearing the electronic device (2400). For example, a second state of the electronic device (2400) may include a state in which an RF signal radiated from the electronic device (2400) is interfered with by the external electronic device (2400).

[0241] According to one embodiment, the first conductive portion (2412) and the second conductive portion (2440) may operate as radiators of the first antenna. For example, when the electronic device (2400) is in a first state, the first conductive portion (2412) and the second conductive portion (2440) may operate as the first antenna (e.g., a loop antenna). For example, when the electronic device (2400) is in a first state, current (2401) may flow along an electrical loop formed by the first conductive portion (2412) and the second conductive portion (2440).

[0242] According to one embodiment, the second conductive portion (2440) can operate as a radiator of the second antenna. For example, when the electronic device (2400) is in a second state, the second conductive portion (2440) can be separated from the first conductive portion (2412) and operate as a radiator of the second antenna (e.g., PIFA). For example, when the electronic device (2400) is in a second state, current (2402) can flow through the second conductive portion (2440).

[0243] FIG. 26 is a flowchart illustrating how an electronic device changes its state. FIG. 26 may correspond to an embodiment of the operation of the electronic device (101) described with reference to FIG. 1. The operation of the electronic device (e.g., the electronic device (101) of FIG. 1) illustrated in FIG. 26 may be performed by at least one processor (e.g., the processor (120) of FIG. 1) performing operations or by controlling a component of the electronic device (e.g., the electronic device (101) of FIG. 1).

[0244] In the following embodiments, each operation may be performed sequentially, but is not necessarily performed sequentially. For example, the order of each operation may be changed, and at least two operations may be performed in parallel. Additionally, some operations may be omitted.

[0245] According to one embodiment, the electronic device (e.g., the electronic device (101) of FIG. 1) may be in a first state or a second state.

[0246] For example, a first state of an electronic device (e.g., the electronic device (101) of FIG. 1) may include a state in which a first conductive part (e.g., the first conductive part (312) of FIG. 3a) is electrically connected to a second conductive part (e.g., the second conductive part (340) of FIG. 3a). For example, a first state of an electronic device (e.g., the electronic device (101) of FIG. 1) may include a normal operating state of the electronic device (e.g., the electronic device (101) of FIG. 1). For example, a first state of an electronic device (e.g., the electronic device (101) of FIG. 1) may include a state in which the electronic device (e.g., the electronic device (101) of FIG. 1) is not adjacent to an external electronic device (e.g., the external electronic device (201) of FIG. 2).

[0247] For example, a second state of an electronic device (e.g., the electronic device (101) of FIG. 1) may include a state in which a first conductive part (e.g., the first conductive part (312) of FIG. 3a) is electrically separated from a second conductive part (e.g., the second conductive part (340) of FIG. 3a). For example, a second state of an electronic device (e.g., the electronic device (101) of FIG. 1) may include a state in which the electronic device (e.g., the electronic device (101) of FIG. 1) is adjacent to an external electronic device (e.g., the external electronic device (201) of FIG. 2). For example, a second state of an electronic device (e.g., the electronic device (101) of FIG. 1) may include a state in which the external electronic device (e.g., the external electronic device (201) of FIG. 2) is located near the palm of a user wearing the electronic device (e.g., the electronic device (101) of FIG. 1). For example, a second state of an electronic device (e.g., the electronic device (101) of FIG. 1) may include a state in which an RF signal radiated from the electronic device (e.g., the electronic device (101) of FIG. 1) is interfered with by an external electronic device (e.g., the external electronic device (201) of FIG. 2).

[0248] Referring to operation 2610, an electronic device according to one embodiment (e.g., the electronic device (101) of FIG. 1) can transmit an RF signal in a first state by using at least a portion of a first conductive part (e.g., the first conductive part (312) of FIG. 3a) and a second conductive part (e.g., the second conductive part (340) of FIG. 3a) as a first antenna. For example, the electronic device (e.g., the electronic device (101) of FIG. 1) can transmit an RF signal by using at least a portion of a first conductive part (e.g., the first conductive part (312) of FIG. 3a) and a second conductive part (e.g., the second conductive part (340) of FIG. 3a) as a loop antenna.

[0249] According to one embodiment, an electronic device (e.g., the electronic device (101) of FIG. 1) can form an electrical loop by electrically connecting a first conductive part (e.g., the first conductive part (312) of FIG. 3a) and a second conductive part (e.g., the second conductive part (340) of FIG. 3a). For example, current can flow along the electrical loop formed by at least a portion of the first conductive part (e.g., the first conductive part (312) of FIG. 3a) and the second conductive part (e.g., the second conductive part (340) of FIG. 3a) by providing a power supply signal to the second conductive part (e.g., the second conductive part (340) of FIG. 3a). For example, at least a portion of the first conductive part through which current flows (e.g., the first conductive part (312) of FIG. 3a) and the second conductive part (e.g., the second conductive part (340) of FIG. 3a) can operate as a loop antenna.

[0250] Referring to operation 2620, an electronic device according to one embodiment (e.g., the electronic device (101) of FIG. 1) can identify that the impedance of the first antenna is increased. For example, the impedance of the first antenna can be increased by the electronic device (e.g., the electronic device (101) of FIG. 1) being adjacent to an external electronic device (e.g., the external electronic device (201) of FIG. 2).

[0251] Referring to FIG. 20, for example, the impedance of an electronic device (e.g., the electronic device (101) of FIG. 1) can be increased from a first impedance of about 0.7+0.39i (e.g., the first impedance (2011) of FIG. 20) to a second impedance of about 0.49-0.1i (e.g., the second impedance (2021) of FIG. 20).

[0252] For example, an electronic device (e.g., the electronic device (101) of FIG. 1) can identify that the impedance of the first antenna has increased by using an impedance value obtained by a sensor (e.g., the sensor module (176) of FIG. 1) that measures the impedance of the antenna. For example, an electronic device (e.g., the electronic device (101) of FIG. 1) can identify that the impedance of the first antenna has increased based on the strength of an RF signal identified by an external electronic device (e.g., the external electronic device (102) of FIG. 2) that is in wireless communication with the electronic device (e.g., the electronic device (101) of FIG. 1).

[0253] Referring to operation 2630, an electronic device according to one embodiment (e.g., the electronic device (101) of FIG. 1) may be changed from a first state to a second state. For example, the electronic device (e.g., the electronic device (101) of FIG. 1) may be changed from a first state to a second state based on a control signal from a processor (e.g., the processor (120) of FIG. 1). For example, the electronic device (e.g., the electronic device (101) of FIG. 1) may be changed from a first state to a second state based on a control signal received from an external electronic device (e.g., the external electronic device (102) of FIG. 2).

[0254] Referring to FIG. 6, for example, an electronic device (e.g., the electronic device (101) of FIG. 1) can be changed to a second state by electrically separating the first conductive part (e.g., the first conductive part (312) of FIG. 3a) from the second conductive part (e.g., the second conductive part (340) of FIG. 3a) using a first switching element (e.g., the first switching element (323) of FIG. 3a).

[0255] Referring to FIG. 25, for example, an electronic device (e.g., the electronic device (101) of FIG. 1) can be changed to a second state by electrically separating a first conductive part (e.g., the first conductive part (2412) of FIG. 24) from a second conductive part (e.g., the second conductive part (2440) of FIG. 24) using a first switching element (e.g., the first switching element (2421) of FIG. 24) and a second switching element (e.g., the second switching element (2422) of FIG. 24).

[0256] Referring to operation 2640, an electronic device according to one embodiment (e.g., the electronic device (101) of FIG. 1) can transmit an RF signal in a second state by using a second conductive part (e.g., the second conductive part (340) of FIG. 3a) as a second antenna. For example, the electronic device (e.g., the electronic device (101) of FIG. 1) can transmit an RF signal by using the second conductive part (e.g., the second conductive part (340) of FIG. 3a) as a PIFA (planar inverted-F antenna).

[0257] Referring to operation 2650, an electronic device according to one embodiment (e.g., the electronic device (101) of FIG. 1) can identify that the impedance of the second antenna is reduced. For example, the impedance of the second antenna can be reduced by the electronic device (e.g., the electronic device (101) of FIG. 1) being separated from an external electronic device (e.g., the external electronic device (201) of FIG. 2).

[0258] Referring to FIG. 20, for example, the impedance of the second antenna can be reduced from a fourth impedance of about 0.55+0.15i (e.g., the fourth impedance (2041) of FIG. 20) to a third impedance of about 0.5+0.1i (e.g., the third impedance (2031) of FIG. 20).

[0259] For example, an electronic device (e.g., the electronic device (101) of FIG. 1) can identify that the impedance of the second antenna has decreased by using an impedance value obtained by a sensor (e.g., the sensor module (176) of FIG. 1) that measures the impedance of the second antenna. For example, an electronic device (e.g., the electronic device (101) of FIG. 1) can identify that the impedance of the second antenna has decreased based on the strength of an RF signal identified by an external electronic device (e.g., the external electronic device (102) of FIG. 2) that is in wireless communication with the electronic device (e.g., the electronic device (101) of FIG. 1).

[0260] Referring to operation 2660, an electronic device according to one embodiment (e.g., the electronic device (101) of FIG. 1) may be changed from a second state to a first state. For example, the electronic device (e.g., the electronic device (101) of FIG. 1) may be changed from a second state to a first state based on a control signal from a processor (e.g., the processor (120) of FIG. 1). For example, the electronic device (e.g., the electronic device (101) of FIG. 1) may be changed from a second state to a first state based on a control signal received from an external electronic device (e.g., the external electronic device (102) of FIG. 2).

[0261] Referring to FIG. 5, for example, an electronic device (e.g., the electronic device (101) of FIG. 1) can be changed to a first state by electrically connecting a first conductive part (e.g., the first conductive part (312) of FIG. 3a) to a second conductive part (e.g., the second conductive part (340) of FIG. 3a) using a first switching element (e.g., the first switching element (323) of FIG. 3a).

[0262] Referring to FIG. 24, for example, an electronic device (e.g., the electronic device (101) of FIG. 1) can be changed to a second state by electrically connecting a first conductive part (e.g., the first conductive part (2412) of FIG. 24) to a second conductive part (e.g., the second conductive part (2440) of FIG. 24) using a first switching element (e.g., the first switching element (2421) of FIG. 24) and a second switching element (e.g., the second switching element (2422) of FIG. 24).

[0263] The electronic device (e.g., the electronic device (101) of FIG. 1) can perform operation 2610 again after operation 2660.

[0264] According to the disclosed embodiment, the electronic device can enhance the radiation performance of an antenna by selecting an antenna and radiating an RF signal depending on the conditions. According to the disclosed embodiment, the electronic device can minimize interference of the wireless signal by an external electronic device.

[0265] An electronic device according to one disclosed embodiment (e.g., the electronic device (101) of FIG. 3a) may include a ring-shaped housing (e.g., the housing (310) of FIG. 3a). The electronic device (e.g., the electronic device (101) of FIG. 3a) may include a printed circuit board (e.g., the printed circuit board (320a, 320b) of FIG. 3a) disposed within the housing (e.g., the housing (310) of FIG. 3a). The electronic device (e.g., the electronic device (101) of FIG. 3a) may include a wireless communication circuit (e.g., the feed portion (322) of FIG. 3a) formed on the printed circuit board (e.g., the printed circuit board (320a, 320b) of FIG. 3a). A housing (e.g., the housing (310) of FIG. 3a) may include a first conductive portion (e.g., the first conductive portion (312) of FIG. 3a) forming at least a portion of the outer surface of the housing (e.g., the housing (310) of FIG. 3a). The housing (e.g., the housing (310) of FIG. 3a) may include a first segmented portion (e.g., the segmented portion (313) of FIG. 3a) formed by one end and the other end of the first conductive portion (e.g., the first conductive portion (312) of FIG. 3a). A housing (e.g., housing (310) of FIG. 3a) may include a second conductive part (e.g., second conductive part (340) of FIG. 3a) arranged to overlap with the first segment (e.g., segment (313) of FIG. 3a) when viewed from the center of the ring shape. One end of the second conductive part (e.g., second conductive part (340) of FIG. 3a) may be connected to a first point of the first conductive part (e.g., first conductive part (312) of FIG. 3a).The other end of the second conductive part (e.g., the second conductive part (340) of FIG. 3A) and the second point of the first conductive part (e.g., the first conductive part (312) of FIG. 3A) may be electrically connected or disconnected by a first switching element (e.g., the first switching element (323) of FIG. 3A). The first segmented part (e.g., the segmented part (313) of FIG. 3A) may be positioned between the first point and the second point. A wireless communication circuit (e.g., the feed part (322) of FIG. 3A) may provide a feed signal to the second conductive part (e.g., the second conductive part (340) of FIG. 3A) through one end of the second conductive part (e.g., the second conductive part (340) of FIG. 3A). When an electronic device (e.g., the electronic device (101) of FIG. 3a) is in a first state, a second point of a first conductive part (e.g., the first conductive part (312) of FIG. 3a) and the other end of a second conductive part (e.g., the second conductive part (340) of FIG. 3a) are electrically connected by a first switching element (e.g., the first switching element (323) of FIG. 3a), so that an RF signal can be radiated through a first antenna comprising at least a portion of the first conductive part (e.g., the first conductive part (312) of FIG. 3a) and the second conductive part (e.g., the second conductive part (340) of FIG. 3a). When the electronic device (e.g., the electronic device (101) of FIG. 3a) is in a second state, the second point of the first conductive part (e.g., the first conductive part (312) of FIG. 3a) and the other end of the second conductive part (e.g., the second conductive part (340) of FIG. 3a) are electrically separated by the first switching element (e.g., the first switching element (323) of FIG. 3a), so that an RF signal can be radiated through a second antenna including the second conductive part (e.g., the second conductive part (340) of FIG. 3a).

[0266] According to one embodiment, the second conductive portion (e.g., the second conductive portion (340) of FIG. 3A) may include a first column portion (e.g., the first column portion (342) of FIG. 3A) extending from one end of the second conductive portion (e.g., the second conductive portion (340) of FIG. 3A) toward a first point of the first conductive portion (e.g., the first conductive portion (312) of FIG. 3A). The second conductive portion (e.g., the second conductive portion (340) of FIG. 3A) may include a second column portion (e.g., the second column portion (343) of FIG. 3A) extending from the other end of the second conductive portion (e.g., the second conductive portion (340) of FIG. 3A) toward a second point of the first conductive portion (e.g., the first conductive portion (312) of FIG. 3A). The second conductive part (e.g., the second conductive part (340) of FIG. 3a) may include a ceiling part (e.g., the ceiling part (341) of FIG. 3a) disposed between the first column part (e.g., the first column part (342) of FIG. 3a) and the second column part (e.g., the second column part (343) of FIG. 3a). The housing (e.g., the housing (310) of FIG. 3a) may include a non-conductive part (e.g., the non-conductive part (330) of FIG. 3a) disposed between the ceiling part (e.g., the ceiling part (341) of FIG. 3a) of the first conductive part (e.g., the first conductive part (312) of FIG. 3a) and the second conductive part (e.g., the second conductive part (340) of FIG. 3a).

[0267] According to one embodiment, a first pillar portion (e.g., the first pillar portion (342) of FIG. 3a) may be connected to a first point of a first conductive portion (e.g., the first conductive portion (312) of FIG. 3a) by passing through a first through hole of a non-conductive portion (e.g., the non-conductive portion (330) of FIG. 3a). A second pillar portion (e.g., the second pillar portion (343) of FIG. 3a) may be connected to a first switching element (e.g., the first switching element (323) of FIG. 3a) by passing through a second through hole of a non-conductive portion (e.g., the non-conductive portion (330) of FIG. 3a).

[0268] According to one embodiment, the first conductive portion (e.g., the first conductive portion (312) of FIG. 3a) may include a first opening (e.g., the first opening (315) of FIG. 3a). The first switching element (e.g., the first switching element (323) of FIG. 3a) may be disposed on a printed circuit board (e.g., the printed circuit board (320b) of FIG. 3a) within a space enclosed by the first opening (e.g., the first opening (315) of FIG. 3a).

[0269] According to one embodiment, an electronic device (e.g., the electronic device (101) of FIG. 3a) may include a first connecting member (e.g., the first connecting member (321b) of FIG. 3a) which is disposed within a first opening (e.g., the first opening (315) of FIG. 3a) and connected to a first pillar portion (e.g., the first pillar portion (343) of FIG. 3a) on a printed circuit board (e.g., the printed circuit board (320b) of FIG. 3a). A first switching element (e.g., the first switching element (323) of FIG. 3a) may electrically connect or disconnect a second point of the first connecting member (e.g., the first connecting member (321b) of FIG. 3a) and a first conductive portion (e.g., the first conductive portion (312) of FIG. 3a).

[0270] According to one embodiment, the first conductive portion may include a second opening (e.g., the (opening) of FIG. 3a) (e.g., the second opening (314) of FIG. 3a). It may include a second connecting member (e.g., (321a) of FIG. 3a) disposed within the second opening (e.g., the second opening (314) of FIG. 3a)) and connected to a second pillar portion (e.g., the second pillar portion (342) of FIG. 3a) on a printed circuit board (e.g., (320a) of FIG. 3a). The second connecting member (e.g., the second connecting member (321a) of FIG. 3a)) may electrically connect a first point of the second pillar portion (e.g., the second pillar portion (342) of FIG. 3a) and the first conductive portion (e.g., the first conductive portion (312) of FIG. 3a).

[0271] According to one embodiment, a housing (e.g., housing (310) of FIG. 3a) may include a second switching element (e.g., second switching element (319) of FIG. 3a) that electrically connects or disconnects one end of a first conductive part (e.g., first conductive part (312) of FIG. 3a) and the other end of a first conductive part (e.g., first conductive part (312) of FIG. 3a). When an electronic device (e.g., electronic device (101) of FIG. 3a) is in a first state, the second switching element (e.g., second switching element (319) of FIG. 3a) may electrically disconnect one end of a first conductive part (e.g., first conductive part (312) of FIG. 3a) and the other end of a first conductive part (e.g., first conductive part (312) of FIG. 3a). When the electronic device (e.g., the electronic device (101) of FIG. 3a) is in a second state, the second switching element (e.g., the second switching element (319) of FIG. 3a) can electrically connect one end of the first conductive part (e.g., the first conductive part (312) of FIG. 3a) and the other end of the first conductive part (e.g., the first conductive part (312) of FIG. 3a).

[0272] According to one embodiment, when the electronic device (e.g., the electronic device (101) of FIG. 3a) is in a first state, an RF signal may be radiated by the first antenna operating as a loop antenna. When the electronic device (e.g., the electronic device (101) of FIG. 3a) is in a second state, an RF signal may be radiated by the second antenna operating as a PIFA (e.g., the (planar inverted-F antenna) of FIG. 3a).

[0273] According to one embodiment, in response to the increase in the impedance of the first antenna as the electronic device (e.g., the electronic device (101) of FIG. 3a) is adjacent to an external electronic device (e.g., the external electronic device (201) of FIG. 3a), the first switching element (e.g., the first switching element (323) of FIG. 3a) can electrically isolate a second point of the first conductive part (e.g., the first conductive part (312) of FIG. 3a) and the other end of the second conductive part (e.g., the second conductive part (340) of FIG. 3a).

[0274] According to one embodiment, in response to the reduction in the impedance of the second antenna as the electronic device (e.g., the electronic device (101) of FIG. 3a) is separated from the external electronic device (e.g., the external electronic device (102) of FIG. 3a), the first switching element (e.g., the first switching element (323) of FIG. 3a) can electrically connect a second point of the first conductive part (e.g., the first conductive part (312) of FIG. 3a) and the other end of the second conductive part (e.g., the second conductive part (340) of FIG. 3a).

[0275] An electronic device according to one disclosed embodiment (e.g., the electronic device (101) of FIG. 24) may include a ring-shaped housing (e.g., the housing (2410) of FIG. 24). The electronic device (e.g., the electronic device (101) of FIG. 24) may include a printed circuit board (e.g., the printed circuit board (2420) of FIG. 24) disposed within the housing. The electronic device (e.g., the electronic device (101) of FIG. 24) may include a wireless communication circuit formed on the printed circuit board. The housing (e.g., the housing (2410) of FIG. 24) may include a first conductive portion (e.g., the first conductive portion (2412) of FIG. 24) forming a first portion of the outer surface of the housing (e.g., the housing (2410) of FIG. 24). A housing (e.g., the housing (2410) of FIG. 24) may include a second conductive portion (e.g., the second conductive portion (2440) of FIG. 24) forming a second portion of the outer surface of the housing (e.g., the housing (2410) of FIG. 24). The housing (e.g., the housing (2410) of FIG. 24) may include a first segmented portion (e.g., the first segmented portion (2413) of FIG. 24) formed by one end of a first conductive portion (e.g., the first conductive portion (2412) of FIG. 24) and one end of a second conductive portion (e.g., the second conductive portion (2440) of FIG. 24). A housing (e.g., housing (2410) of FIG. 24) may include a second segmented portion (e.g., second segmented portion (2414) of FIG. 24) formed by the other end of a first conductive portion and the other end of a second conductive portion. A housing (e.g., housing (2410) of FIG. 24) may include a first switching element (e.g., first switching element (2421) of FIG. 24) that electrically connects or disconnects one end of a first conductive portion (e.g., first conductive portion (2412) of FIG. 24) and one end of a second conductive portion (e.g., second conductive portion (2440) of FIG. 24).A housing (e.g., housing (2410) of FIG. 24) may include a second switching element (e.g., second switching element (2422) of FIG. 24) that electrically connects or disconnects the other end of a first conductive part (e.g., first conductive part (2412) of FIG. 24) and the other end of a second conductive part (e.g., second conductive part (2440) of FIG. 24). A wireless communication circuit may provide a power supply signal to the second conductive part (e.g., second conductive part (2440) of FIG. 24) through a printed circuit board (e.g., printed circuit board (2420) of FIG. 24). When the electronic device is in a first state, one end of a first conductive part (e.g., the first conductive part (2412) of FIG. 24) and one end of a second conductive part (e.g., the second conductive part (2440) of FIG. 24) are electrically connected by a first switching element (e.g., the first switching element (2421) of FIG. 24), and the other end of the first conductive part (e.g., the first conductive part (2412) of FIG. 24) and the other end of the second conductive part (e.g., the second conductive part (2440) of FIG. 24) are electrically connected by a second switching element (e.g., the second switching element (2422) of FIG. 24), thereby comprising a first conductive part (e.g., the first conductive part (2412) of FIG. 24) and a second conductive part (e.g., the second conductive part (2440) of FIG. 24). RF signals can be radiated through the antenna.When the electronic device (e.g., the electronic device (101) of FIG. 24) is in a second state, one end of the first conductive part (e.g., the first conductive part (2412) of FIG. 24) and one end of the second conductive part (e.g., the second conductive part (2440) of FIG. 24) are electrically separated by a first switching element (e.g., the first switching element (2421) of FIG. 24), and the other end of the first conductive part (e.g., the first conductive part (2412) of FIG. 24) and the other end of the second conductive part (e.g., the second conductive part (2440) of FIG. 24) are electrically separated by a second switching element (e.g., the second switching element (2422) of FIG. 24), thereby allowing an RF signal to be radiated through a second antenna including the second conductive part (e.g., the second conductive part (2440) of FIG. 24). there is.

[0276] According to one embodiment, the first segment (e.g., the first segment (2413) of FIG. 24) and the second segment (e.g., the second segment (2414) of FIG. 24) may be formed by a non-conductive member.

[0277] According to one embodiment, when the electronic device (e.g., the electronic device (101) of FIG. 24) is in a first state, an RF signal may be radiated by the first antenna operating as a loop antenna. When the electronic device (e.g., the electronic device (101) of FIG. 24) is in a second state, an RF signal may be radiated by the second antenna operating as a PIFA (e.g., the (planar inverted-F antenna) of FIG. 24).

[0278] According to one embodiment, in response to the increase in the impedance of the first antenna as the electronic device (e.g., the electronic device (101) of FIG. 24) is adjacent to an external electronic device (e.g., the external electronic device (201) of FIG. 24), the first switching element (e.g., the first switching element (2421) of FIG. 24) electrically separates one end of the first conductive part (e.g., the first conductive part (2412) of FIG. 24) and one end of the second conductive part (e.g., the second conductive part (2440) of FIG. 24), and the second switching element (e.g., the second switching element (2422) of FIG. 24) electrically separates the other end of the first conductive part (e.g., the first conductive part (2412) of FIG. 24) and the other end of the second conductive part (e.g., the second conductive part (2440) of FIG. 24).

[0279] According to one embodiment, in response to the reduction in the impedance of the second antenna caused by the electronic device (e.g., the electronic device (101) of FIG. 24) being separated from the external electronic device (e.g., the external electronic device (201) of FIG. 24), the first switching element (e.g., the first switching element (2421) of FIG. 24) electrically connects one end of the first conductive part and one end of the second conductive part (e.g., the second conductive part (2440) of FIG. 24), and the second switching element (e.g., the second switching element (2422) of FIG. 24) electrically connects the other end of the first conductive part (e.g., the first conductive part (2412) of FIG. 24) and the other end of the second conductive part (e.g., the second conductive part (2440) of FIG. 24).

[0280] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0281] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0282] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0283] As used in this document, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0284] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' merely means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0285] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0286] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the components of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to the integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device, Ring-shaped housing; A printed circuit board disposed within the above housing; A wireless communication circuit formed on the above printed circuit board; comprising The above housing is, A first conductive portion forming at least a portion of the outer surface of the above housing, A segmented portion formed by one end and the other end of the first conductive portion; It includes a second conductive portion positioned to overlap with the segment portion when viewed from the center of the ring shape, One end of the second conductive part is connected to a first point of the first conductive part, and The other end of the second conductive part and the second point of the first conductive part are electrically connected or disconnected by a first switching element, and The above segmented portion is positioned between the first point and the second point, and The above wireless communication circuit provides a power supply signal to the second conductive part through one end of the second conductive part, and When the electronic device is in a first state, the second point of the first conductive part and the other end of the second conductive part are electrically connected by the first switching element, thereby radiating an RF signal through a first antenna comprising at least a portion of the first conductive part and the second conductive part, and When the electronic device is in a second state, the second point of the first conductive part and the other end of the second conductive part are electrically separated by the first switching element, thereby causing an RF signal to be radiated through a second antenna including the second conductive part. Electronic device.

2. In Claim 1, The above second conductive part A first column portion extending from one end of the second conductive portion toward the first point of the first conductive portion; A second column portion extending from the other end of the second conductive portion toward the second point of the first conductive portion; and A ceiling portion disposed between the first column portion and the second column portion; including The above housing includes a non-conductive portion disposed between the ceiling portion of the first conductive portion and the second conductive portion, Electronic device.

3. In Claim 2, The first column portion passes through the first through hole of the non-conductive portion and is connected to the first point of the first conductive portion, and The second pillar portion passes through the second through hole of the non-conductive portion and is connected to the first switching element. Electronic device.

4. In Claim 2, The above-mentioned first conductive portion includes a first opening, and The first switching element is disposed on the printed circuit board within the space enclosed by the first opening, Electronic device.

5. In Claim 4, The above electronic device It further includes a first connecting member disposed within the first opening and connected to the first pillar portion on the printed circuit board, The first switching element electrically connects or disconnects the first connecting member and the second point of the first conductive portion, Electronic device.

6. In Claim 2, The above-mentioned first conductive portion includes a second opening, and The electronic device further includes a second connecting member disposed within the second opening and connected to the second pillar portion on the printed circuit board, The second connecting member electrically connects the second column portion and the first point of the first conductive portion, Electronic device.

7. In Claim 1, The above housing is It further includes a second switching element that electrically connects or disconnects the one end of the first conductive portion and the other end of the first conductive portion, When the electronic device is in the first state, the second switching element electrically separates the first end of the first conductive portion and the other end of the first conductive portion, and When the electronic device is in the second state, the second switching element electrically connects the one end of the first conductive portion and the other end of the first conductive portion. Electronic device.

8. In Claim 1, When the electronic device is in the first state, the RF signal is radiated by the first antenna operating as a loop antenna, and When the electronic device is in the second state, the RF signal is radiated by the second antenna operating as a PIFA. Electronic device.

9. In Claim 1, In response to the increase in the impedance of the first antenna as the electronic device is adjacent to an external electronic device, the first switching element electrically separates the second point of the first conductive portion and the other end of the second conductive portion. Electronic device.

10. In Claim 1, In response to the reduction in the impedance of the second antenna as the electronic device is separated from an external electronic device, the first switching element electrically connects the second point of the first conductive portion and the other end of the second conductive portion. Electronic device.

11. In an electronic device, Ring-shaped housing; A printed circuit board disposed within the above housing; A wireless communication circuit formed on the above printed circuit board; comprising The above housing is, A first conductive portion forming a first portion of the outer surface of the housing; A second conductive portion forming a second portion of the outer surface of the housing; A first segment formed by one end of the first conductive portion and one end of the second conductive portion; A second segment formed by the other end of the first conductive part and the other end of the second conductive part; A first switching element that electrically connects or disconnects one end of the first conductive portion and one end of the second conductive portion; It includes a second switching element that electrically connects or disconnects the other end of the first conductive portion and the other end of the second conductive portion, The above wireless communication circuit provides a power supply signal to the second conductive part through the above printed circuit board, and When the electronic device is in a first state, the first end of the first conductive part and the first end of the second conductive part are electrically connected by the first switching element, and the other end of the first conductive part and the other end of the second conductive part are electrically connected by the second switching element, thereby radiating an RF signal through a first antenna including the first conductive part and the second conductive part. When the electronic device is in a second state, the one end of the first conductive part and the one end of the second conductive part are electrically separated by the first switching element, and the other end of the first conductive part and the other end of the second conductive part are electrically separated by the second switching element, thereby causing an RF signal to be radiated through a second antenna including the second conductive part. Electronic device.

12. In Claim 11, The above first segment and second segment portions are formed by a non-conductive member, Electronic device.

13. In Claim 11, When the electronic device is in the first state, the RF signal is radiated by the first antenna operating as a loop antenna, and When the electronic device is in the second state, the RF signal is radiated by the second antenna operating as a PIFA antenna. Electronic device.

14. In Claim 11, In response to the increase in the impedance of the first antenna as the above electronic device is adjacent to an external electronic device: The first switching element electrically separates the first end of the first conductive portion and the second end of the second conductive portion, and The second switching element electrically separates the other end of the first conductive portion and the other end of the second conductive portion. Electronic device.

15. In Claim 11, In response to the reduction in the impedance of the second antenna as the above electronic device is separated from the external electronic device: The first switching element electrically connects one end of the first conductive portion and one end of the second conductive portion, and The second switching element electrically connects the other end of the first conductive portion and the other end of the second conductive portion. Electronic device.

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