Endoscope distal tip pressure and temperature sensors

Abstract

Various techniques are described for combining temperature and pressure sensors in the distal tip. In some examples, the temperature and pressure sensors are bonded together prior to assembly. In other examples, the temperature and pressure sensors are bonded to a carrier that provides rigidity. In yet other examples, temperature-sensing and pressure-sensing capabilities are combined into a sensor package.

Description

Docket No. 5409.984WO1ENDOSCOPE DISTAL TIP PRESSURE AND TEMPERATURE SENSORSCLAIM OF PRIORITY

[0001] This application claims the benefit of priority to U.S. Provisional Application Serial No. 63 / 719,194, titled “ENDOSCOPE DISTAL TIP PRESSURE AND TEMPERATURE SENSORS” to William J. Kane et al., filed November 12, 2024, which is incorporated by reference herein in its entirety.FIELD OF THE DISCLOSURE

[0002] This document pertains generally, but not by way of limitation, to medical devices and, in particular, to endoscope devices.BACKGROUND

[0003] Medical endoscopes are instruments used to visualize and access internal body cavities for both diagnostic and therapeutic procedures. These devices typically incorporate imaging capabilities through a camera and lighting elements at their distal tip to provide visualization of the treatment site. Endoscopes may also incorporate irrigation and drainage capabilities to maintain proper visualization of the treatment area and remove debris.Depending on the specific application and anatomical ta, endoscopes may be flexible or rigid in design, with various size constraints based on the intended use.SUMMARY OF THE DISCLOSURE

[0004] This disclosure describes various techniques for combining temperature and pressure sensors in the distal tip. In some examples, the temperature and pressure sensors are bonded together prior to assembly. In other examples, the temperature and pressure sensors are bonded to a carrier that provides rigidity. In yet other examples, one or more of temperature-sensing and pressure-sensing capabilities are combined into a sensor package, which may house single or multiple sensors or sensor combinations.

[0005] In some aspects, this disclosure is directed to a sensor assembly positioned in a distal tip of an endoscope, the sensor assembly comprising a pressure sensor; a temperature sensor; and a fixation platform, the pressure sensor and the temperature sensor being arranged on the fixation platform to produce a fixed spatial relationship.

[0006] In some aspects, this disclosure is directed to a method of assembling a sensor assembly in a distal end of an endoscope, wherein the sensor assembly includes a pressure sensor and a temperature sensor for providing pressure and temperature measurements during an endoscopic procedure, the method comprising: aligning the pressure sensor andDocket No. 5409.984WO1the temperature sensor in a mold configured to maintain a predetermined fixed spatial relationship between the pressure sensor and the temperature sensor; bonding the pressure sensor and temperature sensor together in the mold using a bonding agent; removing the sensor assembly from the mold; and positioning the sensor assembly into a cavity defined by the mold.

[0007] In some aspects, this disclosure is directed to an endoscope assembly comprising: an elongated endoscope body including a proximal end and a distal end, wherein the distal end defines a cavity and includes a distal tip; and a sensor assembly disposed in the cavity, the sensor assembly comprising: a pressure sensor; and a temperature sensor; wherein the pressure sensor and the temperature sensor are arranged in a fixed spatial relationship, and wherein the sensor assembly is formed by bonding the pressure sensor and the temperature sensor together using a bonding agent to maintain a fixed spatial relationship relative to one another, and wherein the sensor assembly is adapted to provide pressure and temperature measurements.BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In the drawings, which are not necessarily drawn to scale, like numerals may describe similar components in different views. The drawings illustrate generally, by way of example, but not by way of limitation, various embodiments discussed in the present document.

[0009] FIG. 1 shows a perspective view of an example of an endoscope that may implement various techniques of this disclosure.

[0010] FIG. 2 is a front view of an example of a distal tip of an endoscope that may implement various techniques of this disclosure.

[0011] FIG. 3 is a cross-sectional view of an example of a portion of a distal end of an endoscope that may implement various techniques of this disclosure.

[0012] FIG. 4A is a planar view of an example of a temperature and pressure sensor assembly in accordance with this disclosure.

[0013] FIG. 4B is a perspective view of the temperature and pressure sensor assembly of FIG. 4A after removal from the mold.

[0014] FIG. 5A is a perspective cross-sectional view of another example of a temperature and pressure sensor assembly in accordance with this disclosure.

[0015] FIG. 5B is a perspective cross-sectional view of another example of a temperature and pressure sensor assembly in accordance with this disclosure.Docket No. 5409.984WO1

[0016] FIG. 6 is a perspective view of an example of a temperature and pressure sensor assembly in accordance with this disclosure.

[0017] FIG. 7 is a simplified block diagram depicting a sensor assembly including a pressure sensor and a temperature sensor coupled with a display.

[0018] FIG. 8 is a flow diagram of an example of a method of assembling a sensor assembly in a distal end of an endoscope, wherein the sensor assembly includes a pressure sensor and a temperature sensor for providing pressure and temperature measurements during an endoscopic procedure.DETAILED DESCRIPTION

[0019] Endoscopes are specialized medical instruments used to visually examine the inside of various parts of the body, aiding in diagnosis and treatment without the need for large incisions. Endoscopes include flexible or rigid tubes that contain a light source and a camera to provide images of internal structures. Different types of endoscopes are designed for specific areas of the body: a gastroscope examines the upper digestive tract, a ureteroscope examines the urinary tract, a colonoscope inspects the colon, and a bronchoscope is used for the lungs and airways. Other examples include the cystoscope for the bladder, laparoscopy for abdominal surgeries, and hysteroscopy for the uterus. Each endoscope’s design and features are tailored to navigate its target region effectively, allowing healthcare providers to perform minimally invasive procedures, obtain biopsies, or treat various conditions directly.

[0020] To treat kidney stones that cannot pass naturally, flexible or rigid ureteroscopes may be used to gain access to the kidney and delivery therapy. These types of procedures include percutaneous nephrolithotomy (PCNL) and laser lithotripsy. In procedures that use ureteroscopy to treat kidney stones, irrigation and drainage are used to clear the treatment site for visualization as well as evacuate dust and / or fragments from the kidney. Irrigation may be done using an IV bag or through a dedicated pump, and drainage may occur around the scope or through a dedicated pump.

[0021] Including both temperature and pressure sensors at the distal tip of the endoscope provides the ability to monitor intrarenal pressure (IRP) and intrarenal temperature (IRT), such as to provide live feedback to the clinician. The clinician may use this information to make decisions during the procedure.

[0022] This disclosure describes various techniques for combining temperature and pressure sensors in the distal tip. In some examples, the temperature and pressure sensors are bonded together prior to assembly. In other examples, the temperature and pressureDocket No. 5409.984WO1sensors are bonded to a carrier that provides rigidity. In yet other examples, one or more of temperature-sensing and pressure-sensing capabilities are combined into a sensor package, which may house single or multiple sensors or sensor combinations.

[0023] FIG. 1 shows a perspective view of an example of an endoscope 100 that may implement various techniques of this disclosure. The endoscope 100 may be a ureteroscope, a bronchoscope, a laparoscope, a cystoscope, or the like. The endoscope 100 may include an elongated endoscope body 110. For instance, the endoscope body 110 may extend between a proximal end 111 and a distal end 112. The endoscope body 110 may be flexible. The endoscope body 110 may be rigid.

[0024] The endoscope 100 may include an optical sensor 120, e.g., a camera. For instance, the endoscope 100 may include the optical sensor 120 located at a distal tip 130 of the endoscope body 110. The distal tip 130 may include a first end 135 of the endoscope 100. The optical sensor 120 may provide a distal field of view from the distal tip 130.

[0025] The endoscope 100 may include a working channel 140 (shown in dashed lines in FIG. 1). The working channel 140 may be expandable and collapsible. The working channel 140 may receive an instrument. The working channel 140 may extend longitudinally along the endoscope body 110. For instance, the working channel 140 may extend to a channel opening 150 located at the distal tip 130 of the endoscope body 110.

[0026] An instrument may be inserted into the working channel 140 of the endoscope 100. For instance, the endoscope 100 may include a proximal “control section” 160. The control section 160 may include one or more controls to operate the endoscope 100. A biopsy port 170 of the control section 160 may communicate with the working channel 140 of the endoscope 100. The biopsy port 170 may facilitate the reception of an instrument within the working channel 140. For instance, an instrument inserted into the biopsy port 170 may travel through the working channel 140 to the distal tip 130. The instrument may extend (e.g., project, discharge, protrude, or the like) from the channel opening 150 at the distal tip 130 of the endoscope 100.

[0027] FIG. 2 is a front view of an example of a distal tip 200 of an endoscope that may implement various techniques of this disclosure. The distal tip 200 is an example of the distal tip 130 of FIG. 1. The distal tip 200 includes an optical sensor 202, which is an example of the optical sensor 120 of FIG. 1, and a light source 204.

[0028] The distal tip 200 defines two openings: an opening 206 and an opening 208. The opening 206 is in communication with the working channel 140 of FIG. 1. The opening 208 is in communication with a lumen extending through the endoscope 100 of FIG. 1 and mayDocket No. 5409.984WO1be used for extending a laser to the treatment site, such as for laser lithotripsy. In accordance with this disclosure, the distal tip 200 further includes a temperature and pressure sensor assembly 210.

[0029] FIG. 3 is a cross-sectional view of an example of a portion of a distal end 300 of an endoscope that may implement various techniques of this disclosure. The distal end 300 is an example of the distal end 112 of the endoscope 100 of FIG. 1.

[0030] The distal end 300 defines a cavity 302 within which the temperature and pressure sensor assembly 210 of FIG. 2 may be positioned and secured. The temperature and pressure sensor assembly 210 includes a temperature sensor 304, e.g., a thermocouple, thermistor, etc., and a pressure sensor 306, e.g., a piezoresistive pressure sensor. The cavity 302 defines a fixation platform 310, e.g., shelf, groove, or other feature, to which at least a portion of the temperature sensor 304 and the pressure sensor 306 may be arranged and affixed to produce a fixed spatial relationship. The fixation platform 310 may help maintain the position and relationship of the pressure sensor 306 and the temperature sensor 304 relative to a front face 308 of the distal tip 200. An advantage offered by this approach includes reducing the number of assembly steps and improving consistency in sensor placement.

[0031] In some examples, the front face 308 of the distal tip 200 includes a fixture to act as a stop for the temperature sensor 304. In some examples, the temperature sensor 304 is flush or below the front face 308 of the distal tip 200 so as not to extend distally beyond the front face 308.

[0032] FIG. 4A is a planar view of an example of a temperature and pressure sensor assembly 400 in accordance with this disclosure. The temperature and pressure sensor assembly 400 is an example of the temperature and pressure sensor assembly 210 of FIG. 2.

[0033] The temperature and pressure sensor assembly 400 may be formed by bonding or potting the pressure sensor 402 and the temperature sensor 404 together using silicone or other adhesive, e.g., cyanoacrylate, epoxy, or UV adhesive, prior to assembly into the distal tip 200 of FIG. 2. In some examples, it is desirable that the silicone be insulating and soft. It is desirable that, in some examples, the silicone and adhesives of this disclosure be biocompatible.

[0034] In some examples, the width of the temperature and pressure sensor assembly 400 is approximately 0.5 millimeters (mm) and the length is approximately 2.5mm. In some examples, the temperature and pressure sensor assembly 400 is implemented with dimensions of about 1mm by 1mm by 3mm. In some examples, the temperature andDocket No. 5409.984WO1pressure sensor assembly 400 is implemented with a width in the range of about 0.5mm to about 1mm and a length in the range of about 2mm to about 3mm.

[0035] In this approach, the sensors are combined into a subassembly outside of the endoscope, which allows for accurate and repeatable placement of the pressure sensor 402 relative to the temperature sensor 404. The assembly process uses a mold 406 to maintain proper positioning between the sensors during potting.

[0036] In FIG. 4A, the mold 406 includes cavities, such as the cavity 408, within which the sensors may be positioned for bonding. Then, RTV / low-pressure silicone is dispensed into the cavities of the mold 406 to encapsulate the sensors and their wire connections. The silicone coating serves multiple purposes, including insulating the electrical connections, providing a biocompatible barrier between the sensors and the patient, and protecting the sensors because they will be exposed to fluid during use. The silicone coating of the cable termination provides strain relief to the cable connection. Once cured, the sensor assembly may be removed from the mold and installed into the distal tip as a unit, e.g., a single unit.

[0037] The mold 406 is used to bond components together in a fixed relationship and is not itself positioned within the device. Rather, the bonded components are removed from the mold 406 and are then positioned within the device and the mold 406 may, in some examples, be reused to bond additional components together.

[0038] FIG. 4B is a perspective view of the temperature and pressure sensor assembly 400 of FIG. 4A after removal from the mold. As seen in FIG. 4B, the pressure sensor 402 and a portion of the temperature sensor 404 are encapsulated in silicone 410, for example, and ready to be positioned within the cavity 302 of the distal end 300 of FIG. 3 of an endoscope, such as the endoscope 100 of FIG. 1.

[0039] In some examples, rather than being fully encapsulated in silicone 410, a UV-cured adhesive is used to bond the wires of the pressure sensor 402 and the temperature sensor 404 together instead of completely coating them in silicone 410. In some such examples, a similar mold 406 is used to offset the pressure sensor 402 and the temperature sensor 404 from one another and keep them in a fixed relationship.

[0040] FIG. 5A is a perspective cross-sectional view of another example of a temperature and pressure sensor assembly 500 in accordance with this disclosure. The temperature and pressure sensor assembly 500 is an example of the temperature and pressure sensor assembly 210 of FIG. 2.

[0041] The temperature and pressure sensor assembly 500 includes a molded carrier 502, e.g., an injection molded carrier, to which the pressure sensor 402 and the temperatureDocket No. 5409.984WO1sensor 404 are bonded with an adhesive so as to create a subassembly prior to installation in the distal tip 200 of FIG. 2. In some examples, the molded carrier 502 is made of engineering grade polymer, such as liquid crystal polymer (LCP). The molded carrier 502 provides rigidity and includes specific features designed to contain liquid silicone or adhesive until it cures. In some examples, the adhesive is UV-cured.

[0042] The carrier-based approach of FIG. 5 A offers several advantages for the assembly process. It improves the assembly process by providing rigidity, proper orientation, and positive stop features. Like the techniques described above with respect to FIG. 4A and FIG. 4B, this design maintains a fixed spatial relationship between the pressure sensor 402 and temperature sensor 404, such as relative to a face of the distal tip, e.g., the front face 308 of the distal tip 200. An additional benefit is that it results in a smaller hole that may be sealed from the back compared to other approaches.

[0043] FIG. 5B is a perspective cross-sectional view of another example of a temperature and pressure sensor assembly 504 in accordance with this disclosure. The temperature and pressure sensor assembly 504 is similar to the temperature and pressure sensor assembly 500 of FIG. 5 A, except that silicone potting is used to secure the pressure sensor 402 and the temperature sensor 404 to the molded carrier 502 instead of adhesive.

[0044] Creating a subassembly using the molded carrier, such as the temperature and pressure sensor assembly 500 in FIG. 5A or the temperature and pressure sensor assembly 504 in FIG. 5B, provides improved control over sensor positioning by incorporating rigidity, proper orientation features, and positive stops that help maintain the spatial relationship between the temperature and pressure sensors.

[0045] In some examples, the spatial relationship includes the temperature sensor 404 positioned in front of the pressure sensor 402, such as relative to the front face 308 of the distal tip 200. In some examples, the temperature sensor 404 is offset from the pressure sensor 402. In some examples, the temperature sensor 404 and the pressure sensor 402 are positioned back-to-back. In some examples, the temperature sensor 404 and the pressure sensor 402 are axially aligned.

[0046] The carrier assembly may interface with an existing fixation platform 310 in the distal end 300 of FIG. 3 where the pressure sensor bottoms out, helping to maintain the proper relationship of the thermocouple relative to the front face 308 of the distal tip 200. This approach simplifies the overall assembly process while ensuring consistent and repeatable placement of both sensors in desired positions.Docket No. 5409.984WO1

[0047] FIG. 6 is a perspective view of an example of a temperature and pressure sensor assembly 600 in accordance with this disclosure. The temperature and pressure sensor assembly 600 combines both pressure and temperature sensing capabilities into a MEMS (microelectromechanical systems) sensor package, which may house single or multiple sensors or sensor combinations. This integrated approach reduces the number of assembly steps and decreases the overall package size compared to using separate sensors.

[0048] For pressure measurements, the temperature and pressure sensor assembly 600 may use a pi ezoresi stive sensor that responds to mechanical stress. When pressure is applied, the resistance of the sensor’s material changes, allowing detection of pressure variations.

[0049] For temperature measurements, a separate temperature-sensitive component may be used, such as a thermoresi stive element, where resistance varies predictably with temperature. This independent temperature sensor provides accurate temperature readings. This design offers several advantages including the potential use of a single cable connection, a smaller package size, and fewer assembly steps.

[0050] For the approach in FIG. 6, two or more wiring approaches are possible. In a first approach, the pressure and temperature sensor wires may be combined into a grouped wire bundle that terminates at one or more circuits. This combination may be achieved through several methods, such as wrapping the sensor wires with a jacket, combining them into a grouped wire bundle, or physically wrapping the separate wires together to prevent separation. The combined wire bundle may then be soldered to a single or multiple circuit boards at the proximal end.

[0051] Alternatively, a second approach maintains the pressure and temperature sensor wires as two separate and distinct wires, each with its own proximal connectors. The wire bundle approach offers advantages by reducing space for implementation and simplifying the assembly process of the endoscope.

[0052] FIG. 7 is a simplified block diagram depicting a sensor assembly including a pressure sensor and a temperature sensor coupled with a display. A control circuit 700 may include a processor and a memory device, and the control circuit 700 and be coupled to a display 702. The control circuit 700 is in electrical communication with a temperature and pressure sensory assembly 704, such as including the pressure sensor 402 of FIG. 4A and the temperature sensor 404 of FIG. 4A. The control circuit 700 may receive signals from the pressure sensor and the temperature sensor that are representative of pressure and temperature measurements. In some examples, the control circuit 700 controls the display ofDocket No. 5409.984WO1pressure and temperature values on a display 702 based on the signals, such as for a physician or other clinician during an endoscopic procedure.

[0053] FIG. 8 is a flow diagram of an example of a method 800 of assembling a sensor assembly in a distal end of an endoscope, wherein the sensor assembly includes a pressure sensor and a temperature sensor for providing pressure and temperature measurements during an endoscopic procedure. At block 802, the method includes aligning the pressure sensor and the temperature sensor in a mold configured to maintain a predetermined fixed spatial relationship between the pressure sensor and the temperature sensor. In some examples, the mold defines a cavity configured to receive the pressure sensor and the temperature sensor to maintain the predetermined fixed spatial relationship between the pressure sensor and the temperature sensor.

[0054] In some examples, the mold is an injection-molded carrier and the method further includes bonding the pressure sensor and the temperature sensor to the injection-molded carrier prior to removal from the mold, where the injection-molded carrier maintains the fixed spatial relationship between the pressure sensor and the temperature sensor.

[0055] At block 804, the method includes bonding the pressure sensor and temperature sensor together in the mold using a bonding agent. In some examples, bonding the pressure sensor and the temperature sensor in the mold includes dispensing silicone into the mold to encapsulate the pressure sensor and the temperature sensor and their respective wire connections.

[0056] At block 806, the method includes removing the sensor assembly from the mold.

[0057] At block 808, the method includes positioning the sensor assembly into a cavity defined by the distal end, the cavity including a feature configured to maintain the fixed spatial relationship of the sensor assembly relative to a face of a distal tip of the distal end. In some examples, positioning the sensor assembly into the cavity includes inserting the sensor assembly into a feature of the cavity, the feature being configured to receive at least a portion of the pressure sensor so as to maintain the fixed spatial relationship relative to a face of the distal tip.Various Notes

[0058] Each of the non-limiting claims or examples described herein may stand on its own, or may be combined in various permutations or combinations with one or more of the other examples.Docket No. 5409.984WO1

[0059] The above detailed description includes references to the accompanying drawings, which form a part of the detailed description. The drawings show, by way of illustration, specific embodiments in which the concepts discussed herein may be practiced. These embodiments are also referred to herein as “examples.” Such examples may include elements in addition to those shown or described. Examples in which those elements shown or described can be implemented. Moreover, examples using any combination or permutation of those elements shown or described (or one or more claims thereof), either with respect to a particular example (or one or more claims thereof), or with respect to other examples (or one or more claims thereof) shown or described herein can be implemented.

[0060] In the event of inconsistent usages between this document and any documents so incorporated by reference, the usage in this document controls.

[0061] In this document, the terms “a” or “an” are used, as is common in patent documents, to include one or more than one, independent of any other instances or usages of “at least one” or “one or more.” In this document, the term “or” is used to refer to a nonexclusive or, such that “A or B” includes “A but not B,” “B but not A,” and “A and B,” unless otherwise indicated. In this document, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein.” Also, in the following claims, the terms “including” and “comprising” are open-ended, that is, a system, device, article, composition, formulation, or process that includes elements in addition to those listed after such a term in a claim are still deemed to fall within the scope of that claim. Moreover, in the following claims, the terms “first,” “second,” and “third,” etc. are used merely as labels, and are not intended to impose numerical requirements on their objects.

[0062] Method examples described herein may be machine or computer-implemented at least in part. Some examples may include a computer-readable medium or machine-readable medium encoded with instructions operable to configure an electronic device to perform methods as described in the above examples. An implementation of such methods may include code, such as microcode, assembly language code, a higher-level language code, or the like. Such code may include computer readable instructions for performing various methods. The code may form portions of computer program products. Further, in an example, the code may be tangibly stored on one or more volatile, non-transitory, or nonvolatile tangible computer-readable media, such as during execution or at other times.Examples of these tangible computer-readable media may include, but are not limited to, hard disks, removable magnetic disks, removable optical disks (e.g., compact discs andDocket No. 5409.984WO1digital video discs), magnetic cassettes, memory cards or sticks, random access memories (RAMs), read only memories (ROMs), and the like.

[0063] The above description is intended to be illustrative, and not restrictive. For example, the above-described examples (or one or more claims thereof) may be used in combination with each other. Other embodiments may be used, such as by one of ordinary skill in the art upon reviewing the above description. The Abstract is provided to comply with 37 C.F.R. § 1.72(b), to allow the reader to quickly ascertain the nature of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. Also, in the above Detailed Description, various features may be grouped together to streamline the disclosure. This should not be interpreted as intending that an unclaimed disclosed feature is essential to any claim.Rather, inventive subject matter may lie in less than all features of a particular disclosed embodiment. Thus, the following claims are hereby incorporated into the Detailed Description as examples or embodiments, with each claim standing on its own as a separate embodiment, and it is contemplated that such embodiments may be combined with each other in various combinations or permutations. The scope of the invention should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.

Claims

Docket No. 5409.984WO1CLAIMSWhat is claimed is:

1. A sensor assembly positioned in a distal tip of an endoscope, the sensor assembly comprising:a pressure sensor;a temperature sensor; anda fixation platform, the pressure sensor and the temperature sensor being arranged on the fixation platform to produce a fixed spatial relationship.

2. The sensor assembly of claim 1, wherein the fixation platform further comprises:a carrier to which the pressure sensor and the temperature sensor are bonded.

3. The sensor assembly of either of claims 1 or 2, further comprising:a control circuit configured to:receive signals from the pressure sensor and the temperature sensor that are representative of pressure and temperature measurements; anddisplay pressure and temperature values on a display based on the signals.

4. The sensor assembly of any of claims 1-3, wherein the pressure sensor and the temperature sensor are arranged on the fixation platform to produce a fixed spatial relationship relative to a face of the distal tip.

5. The sensor assembly of any of claims 1-4, wherein the sensor assembly is formed by bonding the pressure sensor and the temperature sensor together using a bonding agent to maintain a fixed spatial relationship relative to one another.

6. The sensor assembly of any of claims 1-5, wherein the sensor assembly width is about 0.5mm to about 1mm and the length is about 2mm to about 3mm.

7. The sensor assembly of any of claims 1-6, wherein the sensor assembly comprises an integrated MEMS sensor package configured to provide one or more of pressure or temperature measurements.

8. The sensor assembly of any of claims 1-7, wherein the fixation platform comprises a shelf.Docket No. 5409.984WO19. The sensor assembly of any of claims 1-8, wherein the temperature sensor is positioned flush with or recessed from a face of the distal tip.

10. A method of assembling a sensor assembly in a distal end of an endoscope, wherein the sensor assembly includes a pressure sensor and a temperature sensor for providing pressure and temperature measurements during an endoscopic procedure, the method comprising:aligning the pressure sensor and the temperature sensor in a mold configured to maintain a predetermined fixed spatial relationship between the pressure sensor and the temperature sensor;bonding the pressure sensor and temperature sensor together in the mold using a bonding agent;removing the sensor assembly from the mold; andpositioning the sensor assembly into a cavity defined by the distal end.

11. The method of claim 10, comprising:arranging the pressure sensor and the temperature sensor on a fixation platform within the cavity to produce the fixed spatial relationship between the pressure sensor and the temperature sensor.

12. The method of either of claims 10 or 11, wherein bonding the pressure sensor and the temperature sensor comprises dispensing silicone into the mold to encapsulate the pressure sensor and the temperature sensor and their respective wire connections.

13. The method of any of claims 10-12, wherein the mold is a carrier, the method further comprising:bonding the pressure sensor and the temperature sensor to the carrier prior to removal from the mold, wherein the carrier maintains the fixed spatial relationship between the pressure sensor and the temperature sensor.

14. The method of any of claims 10-13, wherein positioning the sensor assembly into the cavity comprises:inserting the sensor assembly into a feature of the cavity, the feature being configured to receive at least a portion of the pressure sensor so as to maintain the fixed spatial relationship relative to a face of a distal tip.

15. An endoscope assembly comprising:Docket No. 5409.984WO1an elongated endoscope body including a proximal end and a distal end, wherein the distal end defines a cavity and includes a distal tip; anda sensor assembly disposed in the cavity, the sensor assembly comprising:a pressure sensor; anda temperature sensor;wherein the pressure sensor and the temperature sensor are arranged in a fixed spatial relationship, andwherein the sensor assembly is formed by bonding the pressure sensor and the temperature sensor together using a bonding agent to maintain a fixed spatial relationship relative to one another, andwherein the sensor assembly is adapted to provide pressure and temperature measurements.

16. The endoscope assembly of claim 15, further comprising:a carrier to which the pressure sensor and the temperature sensor are bonded to form the sensor assembly.

17. The endoscope assembly of either of claims 15 or 16, further comprising:a control circuit configured to:receive signals from the pressure sensor and the temperature sensor that are representative of pressure and temperature measurements; anddisplay pressure and temperature values on a display based on the signals.

18. The endoscope assembly of any of claims 15-17, wherein the sensor assembly width is about 0.5mm to about 1mm and the length is about 2mm to about 3mm.

19. The endoscope assembly of any of claims 15-18, wherein the sensor assembly comprises an integrated MEMS sensor package configured to provide one or more of pressure or temperature measurements.

20. The endoscope assembly of any of claims 15-19, wherein the temperature sensor is positioned flush with or recessed from a face of the distal tip.

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