Electronic system providing method, electronic system providing apparatus, and electronic system providing program

Abstract

This electronic system providing method comprises: acquiring specification information required by a user for an electronic system incorporated in a contact lens; by referring to a manufacturing library having stored therein a configuration example of the electronic system, selecting a component constituting the electronic system, on the basis of the specification information; and, by referring to the manufacturing library, outputting a flexible substrate shape that includes the component and is deformable into a curved surface shape. Accordingly, the present invention provides an electronic system providing method with which it is possible to reduce the development cost of a contact lens-type device having an electronic system incorporated therein.

Description

Method for Providing Electronic System, Apparatus for Providing Electronic System, and Program for Providing Electronic System

[0001] The present invention relates to a method for providing an electronic system, an apparatus for providing an electronic system, and a program for providing an electronic system.

[0002] In recent years, contact lens type devices incorporating electronic systems have been developed. The electronic system incorporated in the contact lens is mounted on a flexible substrate. Further, the flexible substrate is deformed into a curved surface shape and sealed with a material such as resin.

[0003] Printed circuit boards such as flexible substrates are designed according to the specifications required by users. Patent Document 1 describes a technique for facilitating the design and management of printed circuit boards by using a manufacturing library of components to be mounted on the printed circuit boards.

[0004] Japanese Unexamined Patent Application Publication No. 2013-187307

[0005] However, in the contact lens type device, since it is necessary to deform the flexible substrate into a curved surface shape, a general printed circuit board manufacturing library cannot be used.

[0006] Therefore, the contact lens type device needs to design an application specific integrated circuit (ASIC) according to the specifications required by the user, and to design various devices driven by this ASIC, an antenna used for communication, a circuit necessary for transmitting and receiving signals, and wirings connecting them each time.

[0007] Further, in the contact lens type device, when deforming the flexible substrate on which the designed electronic system is mounted into a curved surface shape, it is required to surely avoid cracks in the substrate and to minimize wrinkles and creases. As a result, there has been a problem that a great deal of cost is required for the development of the contact lens type device.

[0008] The present invention has been made in view of the above, and provides an electronic system provision method, an electronic system provision device, and an electronic system provision program that can reduce the development cost of a contact lens type device incorporating an electronic system.

[0009] To solve the above-mentioned problems and achieve the objective, the electronic system provision method according to the present invention acquires specification information requested by a user for an electronic system to be embedded in a contact lens, selects components constituting the electronic system based on the specification information by referring to a manufacturing library that stores configuration examples of the electronic system, and outputs a flexible substrate shape that includes the components and can be deformed into a curved shape by referring to the manufacturing library.

[0010] Furthermore, in one aspect of the present invention, the method for providing an electronic system involves determining whether or not the flexible substrate shape exists, and if it is determined that the flexible substrate shape exists, outputting the flexible substrate shape.

[0011] Furthermore, in one aspect of the present invention, the method for providing an electronic system includes, in the above invention, the specification information includes permissible level information that is permissible for the electronic system, and if it is determined that there is no flexible substrate shape, the specification information is modified according to the permissible level information, the components constituting the electronic system are selected again based on the modified specification information by referring to the manufacturing library, and the presence or absence of the flexible substrate shape is determined again by referring to the manufacturing library.

[0012] Furthermore, in one aspect of the present invention, a method for providing an electronic system involves selecting an integrated circuit constituting the electronic system as the component based on the specification information described above.

[0013] Furthermore, in one aspect of the present invention, a method for providing an electronic system involves selecting an analog-to-digital converter that constitutes the electronic system based on the specification information, as the component in the above invention.

[0014] Furthermore, in one aspect of the present invention, a method for providing an electronic system involves selecting a wiring method based on the shape, arrangement, and number of electrode terminals of the components constituting the electronic system, based on the specification information described above.

[0015] Furthermore, in one aspect of the present invention, a method for providing an electronic system involves selecting a wiring pattern for electrically connecting the components constituting the electronic system based on the specification information described above.

[0016] Furthermore, in one aspect of the present invention, a method for providing an electronic system determines whether or not the flexible substrate shape exists based on the size of the contact lens, the radius of curvature, and the size of the optical zone.

[0017] Furthermore, in one aspect of the present invention, a method for providing an electronic system outputs a drawing of a flexible substrate that includes the above-mentioned components and is deformable into a curved shape.

[0018] Furthermore, in one aspect of the present invention, the method for providing an electronic system outputs a material for sealing the flexible substrate and a sealing method in the above invention.

[0019] Furthermore, an electronic system providing device according to one aspect of the present invention includes: an acquisition unit that acquires specification information requested by a user for an electronic system built into a contact lens; a selection unit that selects components constituting the electronic system based on the specification information by referring to a manufacturing library storing examples of the configuration of the electronic system; and an output unit that refers to the manufacturing library and outputs a flexible substrate shape that includes the components and can be deformed into a curved shape.

[0020] Furthermore, an electronic system provision program according to one aspect of the present invention, in the above invention, causes the processor to obtain specification information requested by the user for an electronic system built into a contact lens, to refer to a manufacturing library storing configuration examples of the electronic system, to select components constituting the electronic system based on the specification information, and to refer to the manufacturing library to output a flexible substrate shape that includes the components and can be deformed into a curved shape.

[0021] According to the present invention, it is possible to realize an electronic system provision method, an electronic system provision device, and an electronic system provision program that can reduce the development cost of a contact lens type device incorporating an electronic system.

[0022] Figure 1 is a block diagram of an electronic system providing device according to an embodiment of the present invention. Figure 2 is a schematic configuration diagram of a contact lens type device. Figure 3 is a schematic configuration diagram of an electronic system. Figure 4 is a diagram showing an example of the configuration of an integrated circuit. Figure 5 is a diagram showing an example of the configuration of an integrated circuit. Figure 6 is a diagram showing an example of the configuration of an integrated circuit. Figure 7 is a diagram showing an example of the configuration of AB. Figure 8 is a diagram showing an example of the configuration of AB. Figure 9 is a diagram showing an example of the configuration of AB. Figure 10 is a diagram showing an example of the configuration of an ADC. Figure 11 is a diagram showing an example of the configuration of an ADC. Figure 12 is a diagram showing an example of the configuration of a necessary device. Figure 13 is a diagram showing an example of the configuration of a necessary device. Figure 14 is a diagram showing an example of the configuration of a necessary device. Figure 15 is a diagram showing an example of the configuration of a necessary device. Figure 16 is a diagram showing an example of the configuration of the BP of the annular part. Figure 17 is a diagram showing an example of the configuration of the BP of the annular part. Figure 18 is a diagram showing an example of the configuration of the BP of the annular part. Figure 19 is a diagram showing an example of the configuration of the BP of the annular part. Figure 20 is a diagram showing an example of the configuration of the BP of the annular part. Figure 21 is a diagram showing an example of the configuration of the BP of the annular part. Figure 22 shows an example of the configuration of the BP of the protruding part. Figure 23 shows an example of the configuration of the BP of the protruding part. Figure 24 shows an example of the configuration of the BP of the protruding part. Figure 25 is a flowchart showing the process by which an electronic system providing device provides an electronic system. Figure 26 is a flowchart showing the process of selecting components. Figure 27 is a flowchart showing the process of selecting the configuration of an integrated circuit. Figure 28 is a flowchart showing the process of selecting the configuration of an ADC.

[0023] The details of the electronic system provision method, electronic system provision apparatus, and electronic system provision program of the present invention will be described below in accordance with embodiments, but these descriptions are not intended to limit the present invention.

[0024] (Embodiment) Figure 1 is a block diagram showing an electronic system providing device according to an embodiment of the present invention. The electronic system providing device 1 shown in Figure 1 provides drawings and manufacturing methods of an electronic system according to the specification information requested by the user. The electronic system provided by the electronic system providing device 1 is built into a contact lens type device. The detailed configuration of the electronic system providing device 1 will be described later.

[0025] Figure 2 is a schematic diagram of the contact lens type device. As shown in Figure 2, the contact lens type device 100 comprises a flexible substrate 200 on which the necessary devices are mounted, and a sealing member 300 that seals the flexible substrate.

[0026] The flexible substrate 200 is made of an insulating resin such as polyimide, and various materials used for flexible substrates can be employed. The flexible substrate 200 consists of an annular portion 201 and a protruding portion 202 that protrudes inward from the annular portion 201.

[0027] The sealing member 300 is formed from materials such as PMMA (Polymentyl Methacrylate), epoxy resin, silicone resin, polycarbonate, and polydimethylsiloxane (PDMS). The material and sealing method of the sealing member 300 are determined by referring to the manufacturing library LIB (see Figure 1) in order to limit the amount of metal ions eluted.

[0028] [Example of Electronic System Configuration] Figure 3 is a schematic diagram of the electronic system configuration. Various necessary devices are mounted on the flexible substrate 200 in Figure 2, forming the electronic system 400 shown in Figure 3.

[0029] The electronic system 400 includes, for example, an integrated circuit 11, four ABs (assist batteries) 21, an ADC (analog-to-digital converter) 31, an AD (active device) 41, and a PD (passive device) 51. The configuration of the electronic system 400 is appropriately selected by the electronic system provider 1 according to the specifications requested by the user.

[0030] The integrated circuit 11 is, for example, a general-purpose LSI (Large Scale Integration) or a CPU.

[0031] AB21 provides auxiliary power to the integrated circuit 11 when the power supply to the integrated circuit 11, which is directly connected to the power supply antenna, is interrupted.

[0032] The ADC31 converts analog signals into digital signals.

[0033] AD41 is an electronic component that provides internal power, and there are no particular restrictions on its type.

[0034] PD51 is an electronic component that does not have an internal power supply, and its type is not particularly limited.

[0035] [Configuration of the Electronic System Providing Device] The electronic system providing device 1 includes a processor consisting of a CPU, a DSP (Digital Signal Processor), an FPGA (Field-Programmable Gate Array), etc., and memory (main memory unit) consisting of RAM (Random Access Memory), ROM (Read Only Memory), etc.

[0036] As shown in Figure 1, the electronic system providing device 1 comprises an acquisition unit 2, a selection unit 3, a determination unit 4, an output unit 5, a display unit 6, and a storage unit 7.

[0037] The acquisition unit 2 acquires specification information requested by the user for the electronic system built into the contact lens. The specification information may also include information on the permissible level of the electronic system.

[0038] The selection unit 3 refers to the manufacturing library LIB and selects integrated circuits, ABs, ADCs, ADs, PDs, etc., that constitute the electronic system as components based on the specification information. The selection unit 3 also refers to the manufacturing library LIB and selects the wiring method and wiring pattern for electrically connecting the components based on the shape, arrangement, and number of electrode terminals of the components that constitute the electronic system based on the specification information.

[0039] The determination unit 4 refers to the manufacturing library LIB to determine whether or not there is a flexible substrate shape that includes components and can be deformed into a curved shape. The determination unit 4 also determines whether or not there is a flexible substrate shape based on the size of the contact lens, the radius of curvature, and the size of the optical zone.

[0040] If the determination unit 4 determines that a flexible substrate shape exists, the output unit 5 refers to the manufacturing library LIB and outputs a flexible substrate shape that includes components and can be deformed into a curved shape. On the other hand, if the determination unit 4 determines that there is no flexible substrate shape, the output unit 5 may output that there is no flexible substrate shape, or may notify the user to revise the specification information.

[0041] The display unit 6 is a display using liquid crystal or organic EL (Electroluminescence).

[0042] The storage unit 7 is composed of a storage medium selected from among EPROM (Erasable Programmable ROM), hard disk drive (HDD), and removable media. Removable media include, for example, USB (Universal Serial Bus) memory, or disk recording media such as CD (Compact Disc), DVD (Digital Versatile Disc), or BD (Blu-ray® Disc). The storage unit 7 can store an operating system (OS), various programs, various tables, various databases, and the like. The storage unit 7 also stores a manufacturing library (LIB) containing examples of electronic system configurations.

[0043] [Manufacturing Library] Next, the manufacturing library LIB will be described. In the manufacturing library LIB, configuration examples of each element constituting the electronic system 400 are stored. Then, the selection unit 3 selects a component from the manufacturing library LIB based on the specification information, and the electronic system 400 is provided. Hereinafter, configuration examples of each element constituting the electronic system 400 will be described. However, the configuration examples described below are just examples, and the manufacturing library LIB may include a wider range of configuration examples. In the manufacturing library LIB, for example, configuration examples of circuits having a communication function, antennas for wireless power feeding, various sensors, and various actuators may be stored. Also, in the manufacturing library LIB, algorithms, calculation formulas, etc. used by the determination unit 4 for determination are stored.

[0044] [Configuration Example of Integrated Circuit] In the manufacturing library LIB, a configuration example of an integrated circuit is stored. FIGS. 4 to 6 are diagrams showing configuration examples of an integrated circuit. The configuration example SB1 of the integrated circuit shown in FIG. 4 has one integrated circuit 11 which is a general-purpose LSI and does not have a CPU.

[0045] The configuration example SB2 of the integrated circuit shown in FIG. 5 has an integrated circuit 11 which is a general-purpose LSI and an integrated circuit 12 which is a CPU that operates as a slave with respect to the master integrated circuit 11.

[0046] The configuration example SB3 of the integrated circuit shown in FIG. 6 has an integrated circuit 11 which is a general-purpose LSI and a CPU as an integrated circuit 12 that operates as a master to make the integrated circuit 11 operate as a slave.

[0047] As configuration examples of the integrated circuit, in addition to the configuration examples SB1 to SB3 of the integrated circuit, a configuration having no arithmetic element, a configuration having two or more LSIs or CPUs, and a configuration having an arithmetic element other than an LSI and a CPU may be used.

[0048] [Configuration Example of AB] In the manufacturing library LIB, a configuration example of AB is stored. FIGS. 7 to 9 are diagrams showing configuration examples of AB. The configuration example AB1 of AB shown in FIG. 7 has two AB21s.

[0049] The configuration example AB2 of AB shown in FIG. 8 has three AB21s.

[0050] The example configuration AB3 shown in Figure 9 has four AB21 units.

[0051] As examples of AB configurations, in addition to configuration examples AB1 to AB3, there may also be configurations without AB, configurations with one AB, and configurations with five or more ABs.

[0052] [Example ADC Configuration] The manufacturing library LIB stores example ADC configurations. Figures 10 and 11 show example ADC configurations. The example ADC configuration AD1 shown in Figure 10 is a configuration without an ADC.

[0053] The example ADC configuration AD2 shown in Figure 11 has an ADC 31.

[0054] [Example Configuration of Required Devices] The manufacturing library LIB stores example configurations of required devices such as AD or PD. Figures 12 to 15 show example configurations of required devices. The example configuration DC1 of required devices shown in Figure 12 has one AD41.

[0055] The example configuration of the necessary devices shown in Figure 13, DC2, has one PD51.

[0056] The example configuration DC3 shown in Figure 14 has one AD41 and one PD51. In this configuration, the AD41 and PD51 are directly connected by wiring.

[0057] The example configuration of the necessary devices shown in Figure 15, DC4, has one AD41 and one PD51. In this configuration, AD41 and PD51 are not directly connected.

[0058] As examples of the configuration of the necessary devices, in addition to configuration examples DC1 to DC4, there may also be configurations that do not have AD41 and PD51, or configurations that have two or more AD41 or PD51.

[0059] [Example of BP configuration for the annular section] The manufacturing library LIB stores multiple configuration examples of the BPs of the annular section 201, differing in shape, number, arrangement, etc. Figures 16 to 21 show examples of BP configurations for the annular section. The BP f1 configuration example of the annular section 201 shown in Figure 16 has two BPs from which wiring is drawn out in both directions.

[0060] The example BPf2 configuration of the ring portion 201 shown in Figure 17 has two BPs from which wiring is drawn out on one side.

[0061] The example BPf3 of the ring portion 201 shown in Figure 18 has a configuration in which a wire is drawn out from one side, and the longer side is a rectangle perpendicular to the direction in which the wire extends.

[0062] The example BPf4 of the ring portion 201 shown in Figure 19 has a configuration in which six small BPs from which wiring is drawn out on one side.

[0063] The example BPf5 of the ring portion 201 shown in Figure 20 has a configuration in which 12 small BPs from which wiring is drawn out on one side.

[0064] The example BPf6 configuration of the ring portion 201 shown in Figure 21 has two rectangular BPs, one of which has wiring drawn out and the longer side is aligned with the direction in which the wiring extends. Wiring extends between the two BPs.

[0065] As an example of the configuration of the BP of the annular portion 201, in addition to the configuration examples BPf1 to 6 of the BP of the annular portion 201, an appropriate BP can be selected based on the number of required devices, the shape, arrangement, and number of electrode terminals of each required device.

[0066] [Example of BP configuration for the protruding part] The manufacturing library LIB stores multiple configuration examples of BP for the protruding part 202 with different shapes, numbers, arrangements, etc. Figures 22 to 24 show examples of BP configuration for the protruding part. The BP w1 configuration example for the protruding part 202 shown in Figure 22 has a configuration with six BPs from which wiring is drawn out on one side.

[0067] The example of the BP configuration of the protruding portion 202 shown in Figure 23, BPw2, has a configuration that includes two roughly square BPs from which wiring is drawn out on one side.

[0068] The example of the configuration of the BP of the protruding portion 202 shown in Figure 24, BPw3, has a configuration in which two BPs extend in an annular shape.

[0069] As an example of the configuration of the BP of the protruding portion 202, in addition to the example BPw1 to 3 of the BP configuration of the protruding portion 202, an appropriate BP can be selected based on the number of required devices, the shape, arrangement, and number of electrode terminals of each required device.

[0070] [Method for Providing Electronic Systems] Next, the method for providing electronic systems will be described. Figure 25 is a flowchart showing the process by which an electronic system providing device provides an electronic system. As shown in Figure 25, the acquisition unit 2 acquires specification information (step S1). The specification information includes permissible level information for the electronic system. The permissible level information includes k elements that are permissible in the specifications, with priority levels from 1 to k.

[0071] Next, the selection unit 3 sets the variable n to 0 (step S2).

[0072] Furthermore, the selection unit 3 refers to the manufacturing library LIB and selects components that constitute the electronic system based on the specification information (step S3). The method for selecting components will be described later.

[0073] Subsequently, the determination unit 4 refers to the manufacturing library LIB and determines whether there is a flexible substrate shape that includes components and can be deformed into a curved shape (step S4). Once components are selected, the shape and size of the flexible substrate are determined. Furthermore, the pattern shape to be printed on the flexible substrate material such as polyimide is finally determined. Then, it is determined whether this flexible substrate can be deformed into a curved shape. The conditions for being able to deform into a curved shape include constraints on the type and number of geometric elements constituting the substrate, and constraints on the radius of the small circle on the spherical surface included in the substrate pattern edge. This condition is determined by whether it is satisfied by constraints on the radius of curvature of the sphere (the radius of curvature required for the lens function) and the size of the optical zone for securing the field of view, which are input into the manufacturing library LIB.

[0074] If the determination unit 4 determines that there is a flexible substrate shape that includes components and can be deformed into a curved shape (step S4: Yes), the flexible substrate shape is determined (step S5). If there are multiple flexible substrates that include components and can be deformed into a curved shape, one of the flexible substrates is selected.

[0075] Next, the output unit 5 refers to the manufacturing library LIB and outputs a drawing of the flexible circuit board (step S6). By outputting the drawing of the flexible circuit board, the effort required to create the drawing is eliminated, reducing development time and development costs. Furthermore, by utilizing existing photomasks, manufacturing costs can also be reduced.

[0076] Furthermore, the output unit 5 refers to the manufacturing library LIB and outputs the material and method for sealing the flexible substrate (step S7), thus ending the series of processes. By outputting the material and method for sealing the flexible substrate, the effort required to consider the material and method for sealing the flexible substrate is eliminated, thereby reducing development time and development costs. In addition, by utilizing existing photomasks, manufacturing costs can also be reduced.

[0077] In step S4, if the determination unit 4 determines that there is no flexible substrate shape that includes components and can be deformed into a curved shape (step S4: No), the determination unit 4 determines whether or not the variable n < k (step S8).

[0078] If the determination unit 4 determines that the variable n < k (step S8: Yes), the selection unit 3 increments the variable n to n + 1 (step S9) and returns to step S3. Then, in step S3, the selection unit 3 modifies the priority elements corresponding to the variable n in the specification information according to the tolerance level information, and, referring to the manufacturing library LIB, selects the components that constitute the electronic system again based on the modified specification information. Furthermore, in step S4, the determination unit 4, referring to the manufacturing library LIB, determines again whether or not there is a flexible substrate shape for the components that have been selected again.

[0079] The specification information is modified according to the priority order of the variable n. When the determination unit 4 determines that a flexible substrate exists, the output unit 5 outputs a flexible substrate that includes components selected based on the modified specification information and is capable of being deformed into a curved shape.

[0080] On the other hand, if the determination unit 4 determines that there is no flexible substrate even after modifying the specification information until the variable n = k, then in step S8, the determination unit 4 determines that the variable n < k is not true (step S8: No), and the output unit 5 outputs a candidate shape for the flexible substrate based on the specification information (step S10), ending the series of processes. By outputting a candidate shape for the flexible substrate, the output unit 5 allows the specifications to be reconsidered based on this candidate.

[0081] In this example, we have described how to repeatedly modify the specification information using tolerance level information, but this is not the only example. If, in step S4, the determination unit 4 determines that there is no flexible substrate shape that includes components and can be deformed into a curved shape (step S4: No), it may output that there is no flexible substrate shape, or it may notify the unit to modify the specification information.

[0082] [Method for selecting components of an electronic system] Next, the method for selecting components of an electronic system in step S3 will be described. Figure 26 is a flowchart of the process for selecting components. As shown in Figure 26, the selection unit 3 selects the configuration of an integrated circuit (step S11).

[0083] Figure 27 is a flowchart showing the process of selecting the configuration of an integrated circuit. As shown in Figure 27, the selection unit 3 determines whether a CPU is necessary based on the specification information (step S21). It determines whether or not to place a CPU that performs complex calculations within the electronic system 400 in order to design the electronic system 400 to be mounted on the contact lens type device 100.

[0084] If the selection unit 3 determines that a CPU is not required (step S21: No), the selection unit 3 selects the integrated circuit configuration example SB1 shown in Figure 4 (step S22) and returns to the main routine in Figure 26. When the electronic system 400 does not have a CPU, the integrated circuit 11, which is a general-purpose LSI, transmits information to the external device each time according to a predetermined algorithm, and calculations are performed by the CPU in the external device. By configuring the electronic system 400 without a CPU, the power consumption within the electronic system 400 can be reduced.

[0085] If the selection unit 3 determines that the CPU is necessary (step S21: Yes), the selection unit 3 determines whether the CPU is the master or not (step S23).

[0086] If the selection unit 3 determines that the CPU is not the master (step S23: No), the selection unit 3 selects the integrated circuit configuration example SB2 shown in Figure 5 (step S24) and returns to the main routine in Figure 26. By configuring the electronic system 400 to have a CPU, the processing speed can be increased.

[0087] If the selection unit 3 determines that the CPU is the master (step S23: Yes), the selection unit 3 selects the integrated circuit configuration example SB3 shown in Figure 6 (step S25) and returns to the main routine in Figure 26. By configuring the electronic system 400 to have a CPU, the processing speed can be increased.

[0088] Returning to Figure 26, the selection unit 3 selects the necessary devices such as AD and PD (step S12). The necessary devices are selected first in order to determine whether or not an ADC is needed in the next step.

[0089] Next, the selection unit 3 selects the configuration of the ADC (step S13). Since ADCs that require chip area have a significant impact on the component layout on the flexible substrate, it is preferable to select them early. ADCs have a relatively large chip area because their versatility is improved by setting a high upper limit on the amount of processing information.

[0090] Figure 28 is a flowchart showing the process for selecting the configuration of the ADC. As shown in Figure 28, the selection unit 3 determines whether an ADC is necessary based on the specification information (step S31). If the required device is a PD or a sensor that measures some physical quantity, an ADC is necessary. Also, even if the required device is an AD, if it has a function that requires observational measurement of some kind, an ADC is necessary.

[0091] If the selection unit 3 determines that an ADC is not needed (step S31: No), the selection unit 3 selects the ADC configuration example DC1 shown in Figure 12 (step S32) and returns to the main routine in Figure 26.

[0092] If the selection unit 3 determines that an ADC is necessary (step S31: Yes), the selection unit 3 determines whether an AD is necessary based on the specification information (step S33).

[0093] If the selection unit 3 determines that AD is not needed (step S33: No), the selection unit 3 selects the ADC configuration example DC2 shown in Figure 13 (step S34) and returns to the main routine in Figure 26.

[0094] If the selection unit 3 determines that an AD is necessary (step S33: Yes), the selection unit 3 determines whether or not to connect the PD and the AD based on the specification information (step S35).

[0095] If the selection unit 3 determines that the PD and AD should be connected (step S35: Yes), the selection unit 3 selects the ADC configuration example DC3 shown in Figure 14 (step S36) and returns to the main routine in Figure 26.

[0096] If the selection unit 3 determines that the PD and AD should not be connected (step S35: No), the selection unit 3 selects the ADC configuration example DC4 shown in Figure 14 (step S37) and returns to the main routine in Figure 26.

[0097] Returning to Figure 26, the selection unit 3 selects the configuration of the BP (step S14). Specifically, the selection unit 3 selects an appropriate configuration of the annular portion 201 BP from the configuration examples BPf1 to 6 shown in Figures 16 to 21, according to the number of required devices and the shape, arrangement, and number of electrode terminals for each required device. Similarly, the selection unit 3 selects an appropriate configuration of the protruding portion 202 BP from the configuration examples BPw1 to 3 shown in Figures 22 to 24, according to the number of required devices and the shape, arrangement, and number of electrode terminals for each required device. In addition, the wiring material of the flexible substrate is determined according to the material of the electrode terminals of the required devices. Furthermore, the wiring width of the flexible substrate is determined according to the maximum current value and driving voltage to be supplied to the required devices.

[0098] Next, the selection unit 3 selects a power supply method (step S15). The power supply method is selected according to the current value, voltage value, and their time variation required by the required device. If the required power is small, power can be supplied by wirelessly transmitting power from an external source to the antenna in the electronic system 400. If wireless transmission alone is insufficient to supply the required power, the power supplied by wireless transmission is stored in chip capacitors, etc., within AB, and the stored power is supplied to the required device by the integrated circuit 11, which is an LSI.

[0099] Subsequently, the selection unit 3 selects the configuration of A and B (step S16). Specifically, the selection unit 3 selects the number of A and B according to the required power, and selects an appropriate A and B configuration from the A and B configuration examples AB1 to 3 shown in Figures 7 to 9.

[0100] According to the embodiment described above, since the flexible substrate shape is output according to the specification information by referring to the manufacturing library LIB, initial design can be omitted and development can be accelerated. As a result, the development cost of contact lens type devices with built-in electronic systems can be reduced.

[0101] Furthermore, if the specification information includes tolerance level information, the process is repeated until a flexible substrate shape that can be deformed into a curved shape is obtained, thereby improving the likelihood of outputting a flexible substrate shape that can be commercialized.

[0102] 1 Electronic system providing device 2 Acquisition unit 3 Selection unit 4 Judgment unit 5 Output unit 6 Display unit 7 Storage unit 11, 12 Integrated circuit 21, 22, 23, 24 AB 31 ADC 41 AD 51 PD 100 Contact lens type device 200 Flexible substrate 201 Annular part 202 Protruding part 300 Sealing member 400 Electronic system

Claims

1. A method for providing an electronic system, which involves obtaining specification information requested by a user for an electronic system embedded in a contact lens, selecting components for the electronic system based on the specification information by referring to a manufacturing library that stores examples of the configuration of the electronic system, and outputting a flexible substrate shape that includes the components and is deformable into a curved shape by referring to the manufacturing library.

2. The method for providing an electronic system according to claim 1, which determines whether or not the flexible substrate shape exists, and outputs the flexible substrate shape if it is determined that the flexible substrate shape exists.

3. The method for providing an electronic system according to claim 2, wherein the specification information includes tolerance level information that is permissible for the electronic system, and if it is determined that there is no flexible substrate shape, the specification information is modified according to the tolerance level information, the components constituting the electronic system are selected again based on the modified specification information by referring to the manufacturing library, and the presence or absence of the flexible substrate shape is determined again by referring to the manufacturing library.

4. The method for providing an electronic system according to claim 1, wherein an integrated circuit constituting the electronic system is selected as the component based on the specification information.

5. The method for providing an electronic system according to claim 1, wherein an analog-to-digital converter constituting the electronic system is selected as the component based on the specification information.

6. A method for providing an electronic system according to claim 1, wherein a wiring method is selected based on the shape, arrangement, and number of electrode terminals of the components constituting the electronic system, based on the specification information.

7. A method for providing an electronic system according to claim 1, wherein a wiring pattern is selected to electrically connect the components constituting the electronic system based on the specification information.

8. The method for providing an electronic system according to claim 2, wherein the presence or absence of the flexible substrate shape is determined based on the size, radius of curvature, and size of the optical zone of the contact lens.

9. The method for providing an electronic system according to claim 1, which outputs a drawing of a flexible substrate that includes the above-mentioned components and is deformable into a curved shape.

10. The method for providing an electronic system according to claim 1, which outputs a material for sealing the flexible substrate and a sealing method.

11. An electronic system providing device comprising: an acquisition unit that acquires specification information requested by a user for an electronic system embedded in a contact lens; a selection unit that selects components constituting the electronic system based on the specification information by referring to a manufacturing library storing examples of configurations of the electronic system; and an output unit that refers to the manufacturing library and outputs a flexible substrate shape that includes the components and can be deformed into a curved shape.

12. An electronic system providing program that causes a processor to perform the following processes: acquire specification information requested by a user for an electronic system embedded in a contact lens; refer to a manufacturing library storing configuration examples of the electronic system to select components that constitute the electronic system based on the specification information; and refer to the manufacturing library to output a flexible substrate shape that includes the components and can be deformed into a curved shape.

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