Optical module

Abstract

An optical module (200), comprising a circuit board (300) and a base (700b). A surface of the circuit board (300) has a first cutout portion (307a) and a second cutout portion (307b). A surface of the base (700b) is provided with a first optical transmitting component (400b) and a second optical transmitting component (400c). Since the first optical transmitting component (400b) and the second optical transmitting component (400c) are arranged on the same surface of the base (700b), the base (700b) has a relatively large area, which is more beneficial to the heat dissipation of devices. Since the circuit board (300) is connected between the first cutout portion (307a) and the second cutout portion (307b), the surface of the circuit board (300) between the first cutout portion (307a) and the second cutout portion (307b) can be fully used for wiring, thereby increasing the wiring area. A first modulation driving chip (406b) is connected, by means of wire bonding, to the surface of the circuit board (300) between the first cutout portion (307a) and the second cutout portion (307b). The surface of the circuit board (300) is provided with a first optical receiving component (500c) and a second optical receiving component (500d). The first optical receiving component (500c) comprises a first optical refractive element (510c) and a first optical receiving chip (520c). The first optical refractive element (510c) and the first optical receiving chip (520c) are both fixed on a surface of a first substrate (540c), which has a small thermal expansion coefficient, such that the first substrate (540c) is subjected to relatively small thermal deformation, thereby improving the stability of an optical path.

Description

optical module

[0001] This application claims priority to the following patent applications filed on November 29, 2024, China Patent Application No. 202411750552.4; 202411750563.2; 202411750597.1; and 202411752325.5, all of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Technology

[0003] With the development of new business and application models such as cloud computing, mobile internet, and video, advancements in optical communication technology have become increasingly important. In optical communication technology, the optical module, as one of the key components in optical communication equipment, enables photoelectric signal conversion; and in the development of optical communication technology, the data transmission rate of optical modules is required to continuously improve. Summary of the Invention

[0004] In some embodiments, an optical module is provided, comprising:

[0005] The circuit board has a first notch and a second notch;

[0006] The base has a first light emitting component and a second light emitting component respectively on its surface;

[0007] The first light-emitting component includes:

[0008] A first laser is disposed on the surface of the base and located within the first notch. The first laser is configured to output light that does not carry a signal.

[0009] The first optical modulation chip, located within the first notch, is configured to modulate light that does not carry a signal in order to generate an optical signal;

[0010] The first fiber array is located inside the first notch and is coupled to the end face of the first optical modulation chip to transmit optical signals.

[0011] The first modulation driver chip is electrically connected to the first optical modulation chip and is wire-connected to the circuit board surface between the first notch and the second notch.

[0012] The second light emitting component includes:

[0013] A second laser is disposed on the surface of the base and located within the second notch. The second laser is configured to output light that does not carry a signal.

[0014] The second optical modulation chip, located within the second notch, is configured to modulate light that does not carry a signal in order to generate an optical signal;

[0015] The second fiber array is located inside the second notch and is coupled to the end face of the second optical modulation chip to transmit optical signals.

[0016] The second modulation driver chip is electrically connected to the second optical modulation chip and is wire-connected to the circuit board surface between the first notch and the second notch.

[0017] A first optical receiving component, located on one side of the circuit board, includes:

[0018] A first refracting element is disposed on one side of the circuit board, and a first reflective end face is formed on the end face of the first refracting element;

[0019] The first optical receiving chip is disposed on one side surface of the circuit board and located in the reflected light path of the first reflective end face;

[0020] The second optical receiving component, located on one side of the circuit board, includes:

[0021] The second refracting element is disposed on one side of the circuit board, and the end face of the second refracting element forms a second reflective end face;

[0022] The second optical receiving chip is disposed on one side surface of the circuit board and located in the reflected light path of the second reflective end face;

[0023] Alternatively, the first optical receiving component includes:

[0024] The first lens assembly is projected onto the surface of the circuit board, and a first reflective surface is formed on the surface.

[0025] The first optical receiving chip is located on the surface of the circuit board and in the reflected light path of the first reflecting surface;

[0026] The second optical receiving component, disposed on the surface of the circuit board, includes:

[0027] The second lens assembly is projected onto the surface of the circuit board, and a second reflective surface is formed on the surface.

[0028] The second optical receiving chip is located on the surface of the circuit board and in the reflected light path of the second reflective surface. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are merely drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. Furthermore, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0030] Figure 1 is a partial architecture diagram of an optical communication system according to some embodiments of the present disclosure;

[0031] Figure 2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0032] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0033] Figure 4 is an exploded view of an optical module provided according to some embodiments of the present disclosure;

[0034] Figure 5 is an internal structure diagram of a coherent optical component according to some embodiments;

[0035] Figure 6a is an internal structure diagram of an optical module according to some embodiments;

[0036] Figure 6b is an exploded view of the interior of an optical module according to some embodiments;

[0037] Figure 7a is a diagram of the internal structure of another optical module according to some embodiments;

[0038] Figure 7b is an exploded view of another optical module according to some embodiments;

[0039] Figure 8a is an exploded view of the interior of an optical module according to some embodiments;

[0040] Figure 8b is a structural diagram of a refracting element according to some embodiments;

[0041] Figure 8c is an exploded view of a refracting element according to some embodiments;

[0042] Figure 8d is a structural diagram of an optical receiving component according to some embodiments;

[0043] Figure 8e is a structural diagram of a refracting element according to some embodiments;

[0044] Figure 9a is an assembly diagram of a light emitting component and a circuit board according to some embodiments;

[0045] Figure 9b is an exploded view of a light emitting component according to some embodiments;

[0046] Figure 9c is a cross-sectional view of an optical emitting component and a circuit board assembly according to some embodiments;

[0047] Figure 9d is a partial structural diagram of a light emitting component according to some embodiments;

[0048] Figure 10a is a cross-sectional structural diagram of an optical receiving component according to some embodiments;

[0049] Figure 10b is a cross-sectional structural diagram of an optical receiving component according to some embodiments;

[0050] Figure 10c is a cross-sectional structural diagram of an optical receiving component according to some embodiments;

[0051] Figure 10d is a cross-sectional structural diagram of an optical receiving component according to some embodiments;

[0052] Figure 11a is an exploded structural diagram of another optical receiving component according to some embodiments;

[0053] Figure 11b is a cross-sectional structural diagram of another optical receiving component according to some embodiments;

[0054] Figure 12a is a diagram of the internal structure of another optical module according to some embodiments;

[0055] Figure 12b is a second internal structure diagram of an optical module according to some embodiments;

[0056] Figure 13a is another internal structure diagram of an optical module according to some embodiments;

[0057] Figure 13b is an exploded view of another optical module assembly according to some embodiments;

[0058] Figure 13c is an exploded view of another optical module assembly according to some embodiments;

[0059] Figure 13d is an assembly diagram of a base and circuit board according to some embodiments;

[0060] Figure 13e is an exploded view of another optical module assembly according to some embodiments;

[0061] Figure 14a is a cross-sectional view of another optical module according to some embodiments;

[0062] Figure 14b is an exploded cross-sectional view of another optical module according to some embodiments;

[0063] Figure 14c is a cross-sectional view of another optical module according to some embodiments;

[0064] Figure 14d is an exploded cross-sectional view of another optical module according to some embodiments;

[0065] Figure 15 is a diagram of another optical module layout structure according to some embodiments;

[0066] Figure 16 is a side view of another optical module according to some embodiments;

[0067] Figure 17 is a cross-sectional structural diagram of another optical module according to some embodiments;

[0068] Figure 18 is a diagram of the upper surface structure of a circuit board according to some embodiments;

[0069] Figure 19 is a second diagram of the upper surface structure of a circuit board according to some embodiments;

[0070] Figure 20 is a diagram of the lower surface structure of a circuit board according to some embodiments;

[0071] Figure 21 is a second diagram of the lower upper surface structure of a circuit board according to some embodiments;

[0072] Figure 22 is an exploded view of another optical module according to some embodiments;

[0073] Figure 23a is a diagram of an upper surface assembly structure of a circuit board according to some embodiments;

[0074] Figure 23b is an exploded view of a base and light emitting component assembly according to some embodiments;

[0075] Figure 23c is a structural diagram of a first light emitting component according to some embodiments;

[0076] Figure 24 is an assembly diagram of the top and bottom surface structure of a base according to some embodiments;

[0077] Figure 25 is a diagram of the assembly structure of the bottom surface of a base according to some embodiments;

[0078] Figure 26a is an assembly structure diagram of a first refracting element and a first converging lens according to some embodiments;

[0079] Figure 26b is an exploded view of a first refracting element and a first converging lens assembly according to some embodiments;

[0080] Figure 27 is a diagram of the assembly structure of the bottom surface of a base according to some embodiments;

[0081] Figure 28 is a cross-sectional view of the bottom surface assembly of a base according to some embodiments;

[0082] Figure 29 is a structural diagram of the bottom surface of a base according to some embodiments;

[0083] Figure 30 is a cross-sectional structural diagram of another optical module according to some embodiments;

[0084] Figure 31 is a cross-sectional structural diagram of another optical module according to some embodiments;

[0085] Figure 32 is a partial cross-sectional view of another optical module according to some embodiments. Detailed Implementation

[0086] The embodiments of this disclosure will now be described clearly and in detail with reference to the accompanying drawings. However, the described embodiments are merely some, and not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0087] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0088] In optical communication technology, to establish information transmission between information processing devices, information needs to be loaded onto light, and the propagation of light is used to transmit the information. Here, the light carrying the information is called an optical signal. When optical signals are transmitted in information transmission equipment, optical power loss can be reduced, thus enabling high-speed, long-distance, and low-cost information transmission. Information processing devices can recognize and process electrical signals. Information processing devices typically include optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., while information transmission equipment typically includes optical fibers and optical waveguides.

[0089] An optical module enables the conversion between optical and electrical signals between information processing and transmission devices. For example, at least one of the optical signal input or output ports of the optical module is connected to an optical fiber, and at least one of the electrical signal input or output ports is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts it into a first electrical signal and transmits it to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts it into a second optical signal and transmits it back to the optical fiber. Since multiple information processing devices can transmit information via electrical signals, at least one of the devices needs to be directly connected to the optical module, rather than all devices. Here, the information processing device directly connected to the optical module is referred to as the host computer of the optical module. Furthermore, the optical signal input or output port of the optical module can be referred to as an optical port, and the electrical signal input or output port can be referred to as an electrical port.

[0090] Figure 1 is a partial structural diagram of an optical communication system according to some embodiments. As shown in Figure 1, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0091] One end of optical fiber 101 extends toward the remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. The optical signal can undergo total internal reflection in optical fiber 101, and the propagation of the optical signal in the direction of total internal reflection can almost maintain the original optical power. The optical signal undergoes multiple total internal reflections in optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to optical module 200, or to transmit the optical signal from optical module 200 to remote information processing device 1000, thereby realizing long-distance, low-power loss information transmission.

[0092] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0093] The host computer 100 includes a generally rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 so that the host computer 100 and the optical module 200 can establish a one-way or two-way electrical signal connection.

[0094] The host computer 100 also includes an external power interface that can connect to an electrical signal network. For example, this external power interface includes a Universal Serial Bus (USB) interface or a network cable interface 104, which is configured to connect a network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, thereby establishing an electrical signal connection between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. This second electrical signal from the host computer 100 is transmitted to the optical module 200, which converts the second electrical signal into a second optical signal and transmits it to the optical fiber 101. The second optical signal is then transmitted in the optical fiber 101 to the remote information processing device 1000. Alternatively, a first optical signal from the remote information processing device 1000 propagates through the optical fiber 101 and is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal and transmits it to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that an optical module is a tool for converting optical signals to electrical signals. During the conversion process, the information itself does not change, but the encoding and decoding methods can change.

[0095] In addition to optical network terminals, the host computer 100 also includes optical line terminals (OLTs), optical network equipment (ONTs), or data center servers.

[0096] Figure 2 is a partial structural diagram of a host computer according to some embodiments. To clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in Figure 2, the host computer 100 also includes a PCB circuit board 105 disposed within a housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has fins and other protruding structures to increase the heat dissipation area.

[0097] The optical module 200 is inserted into the cage 106 of the host computer 100, where it is secured. Heat generated by the optical module 200 is conducted to the cage 106 and then dissipated through the heat sink 107. After insertion into the cage 106, the optical module 200's electrical port connects to the electrical connector inside the cage 106, establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0098] Figure 3 is a structural diagram of an optical module according to some embodiments, and Figure 4 is an exploded view of an optical module according to some embodiments. As shown in Figures 3 and 4, in some embodiments, the optical module 200 includes a shell, which includes an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202, forming two openings 204 and 205, one of which is an electrical port and the other is an optical port. In some embodiments, the shell forms an opening that serves as both an electrical port and an optical port.

[0099] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0100] The assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of circuit boards 300 and other components into the housing. The upper housing 201 and the lower housing 202 can encapsulate and protect the aforementioned devices.

[0101] The direction of the line connecting the two openings 204 and 205 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200 (right end in Figure 3), and opening 205 is also located at the end of the optical module 200 (left end in Figure 3). Alternatively, opening 204 is located at the end of the optical module 200, while opening 205 is located on the side of the optical module 200.

[0102] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0103] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0104] As shown in Figures 3 and 4, in some embodiments, the optical module includes a circuit board 300 disposed within a housing. The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0105] In some embodiments, the circuit board includes a rigid circuit board, which, due to its relatively rigid material, can also serve a load-bearing function, such as being able to stably support the aforementioned electronic components and chips; the rigid circuit board can also be inserted into an electrical connector in the cage 106 of the host computer 100.

[0106] In some embodiments, the circuit board further includes a flexible circuit board, which can be used independently or in conjunction with a rigid circuit board.

[0107] In some embodiments, the circuit board further includes gold fingers formed on its end surface, the gold fingers consisting of a plurality of independent pins.

[0108] In some implementations, the gold fingers 301 are disposed on one side of the surface of the circuit board 300 (e.g., the upper surface shown in Figure 4); in some implementations, the gold fingers 301 are disposed on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to applications with a large number of pins required.

[0109] In some implementations, the gold fingers of the circuit board extend from the opening 204 and are inserted into the electrical connector of the host computer 100; the circuit board is inserted into the cage 106, and the gold fingers 301 are connected to the electrical connector inside the cage 106. The gold fingers 301 are configured to establish an electrical connection with the host computer, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission.

[0110] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0111] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the fixation between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the cage 106.

[0112] In some embodiments, the optical module includes a coherent optical component 302. The coherent optical component 302 is configured to modulate and demodulate optical signals to achieve the transmission and reception of optical signals.

[0113] In some embodiments, the optical module includes a tunable laser 303.

[0114] In some embodiments, the tunable laser 303 serves as an external light source, and its emitted beam is split into a first beam and a second beam. The first beam, as the light to be modulated, is transmitted to the coherent optical component 302. The coherent optical component 302 modulates the light to be modulated using a built-in optical chip, generating an optical signal. The second beam, as the local oscillator light, is transmitted to the coherent optical component 302. The coherent optical component 302 performs coherent demodulation on the received optical signal based on the second beam, generating an electrical signal.

[0115] In some embodiments, the coherent optical component 302 includes a cover plate 3021. The cover plate 3021 is located on top.

[0116] Figure 5 is an internal structural diagram of a coherent optical component according to some embodiments. As shown in Figure 5, in some embodiments, the coherent optical component 302 may include an optical modulation and demodulation chip 3022. The optical modulation and demodulation chip 3022 internally performs modulation and demodulation of optical signals, thereby realizing the transmission and reception of optical signals.

[0117] In some embodiments, the optical modem chip 3022 can be a silicon photonics chip. Both the transmission and reception of optical signals are implemented within the silicon photonics chip. Silicon material is easily etched, allowing for the integration of functional devices within the silicon photonics chip.

[0118] In some embodiments, when the optical modulation and demodulation chip 3022 is a silicon photonic chip, since silicon is an indirect bandgap material, it cannot achieve spontaneous emission of photons and therefore cannot realize a light source in the silicon photonic chip. Therefore, a tunable laser 303 can be used to provide a light source for the optical modulation and demodulation chip 3022.

[0119] In some embodiments, the optical modulation and demodulation chip 3022 can be a thin-film lithium niobate chip. Both the transmission and reception of optical signals are implemented within the thin-film lithium niobate chip. Thin-film lithium niobate exhibits a linear electro-optic effect; an applied electric field causes a linear change in its refractive index in the corresponding direction, allowing the light wave propagating in the medium to have adjustable intensity, phase, and other information. Therefore, thin-film lithium niobate can be selected as the material for the optical modulator to achieve higher modulation rates, etc.

[0120] In some embodiments, the optical modulation and demodulation chip 3022 can be a III-V / Si hybrid integrated optical chip. Both the transmission and reception of optical signals are implemented within the III-V / Si hybrid integrated optical chip. In the III-V / Si hybrid integrated optical chip, the growth material system of the optical modulator is a III-V semiconductor material. III-V are direct bandgap semiconductor materials with a strong quantum well-confined Stark effect. By controlling the change of the applied electric field, a change in charge carriers is induced, thereby causing a change in the refractive index and achieving optical signal modulation.

[0121] In some embodiments, the optical modulation and demodulation chip 3022 can be a thin-film lithium niobate / Si hybrid integrated optical chip. Both the transmission and reception of optical signals are implemented within the thin-film lithium niobate / Si hybrid integrated optical chip. Compared to III-V group / Si hybrid integrated optical chips, the optical modulator in the thin-film lithium niobate / Si hybrid integrated optical chip is a thin-film lithium niobate-based optical modulator.

[0122] In some embodiments, the coherent optical component 302 may include a driver chip 3023. The driver chip 3023 is located on one side of the optical modem chip 3022. The driver chip 3023 provides a drive signal for the modulation of the optical modem chip 3022.

[0123] In some embodiments, the coherent optical component 302 may include a TIA 3024. The TIA 3024 is located on one side of the optical modem chip 3022. The electrical signal generated after demodulation by the optical modem chip 3022 is amplified by the TIA 3024 and then transmitted in the subsequent stage.

[0124] In some embodiments, the coherent optical component 302 may include an optical fiber array 3025.

[0125] In some embodiments, the tunable laser 900 serves as an external light source, and the emitted beam is split into a first beam and a second beam. The first beam and the second beam are respectively coupled and transmitted to the optical modulation and demodulation chip 3022 via the fiber array 3025.

[0126] In some embodiments, the optical signal modulated by the optical modulation and demodulation chip 3022 is transmitted to the outside via the fiber optic array 3025.

[0127] In some embodiments, the optical modem chip 3022 integrates a Mach-Zehnder (MZ) modulator for modulating optical signals. The MZ modulator has a high modulation bandwidth, enabling it to handle high-speed data transmission. The MZ modulator has low insertion loss, maintaining signal integrity. It also has low power consumption and a fast response time.

[0128] In some embodiments, the modulation and demodulation of optical signals within the coherent optical component 302 can lead to crosstalk between signals. In some embodiments, the demodulation of the optical signal is separated from the coherent optical component 302 to reduce crosstalk. In this case, the optical modulation and demodulation chip 3022 is converted into an optical modulation chip to perform the modulation function of the optical signal. The demodulation of the optical signal can employ other packaging structures, such as micro-optical packaging structures or COB (chip on board) packaging.

[0129] Figure 6a is an internal structural diagram of an optical module according to some embodiments, and Figure 6b is an exploded view of the internal structure of an optical module according to some embodiments. As shown in Figures 6a-6b, in some embodiments, a signal processing chip 304 is provided on the surface of the circuit board 300. The signal processing chip 304 processes the electrical signals output / input from the optical module and is electrically connected to the gold fingers 301. The signal processing chip 304 can be a DSP chip.

[0130] In some embodiments, the optical module includes an optical emitting component 400a. The optical emitting component 400a is configured to emit optical signals. The optical emitting component 400a may be located on one side of the signal processing chip 304.

[0131] In some embodiments, the optical module includes an optical receiving component 500a. The optical receiving component 500a is configured to receive optical signals. The optical receiving component 500a may be located side-by-side with the optical emitting component 400a on one side of the signal processing chip 304.

[0132] In some embodiments, the light emitting component 400a includes a light modulation chip to modulate and generate an optical signal, thereby emitting the optical signal. The light receiving component 500a employs a micro-optical packaging scheme to receive the optical signal.

[0133] In some embodiments, the light emitting component 400a may include a laser 401a. In some embodiments, the light emitting component 400a may include an optical modulation chip 404a. In some embodiments, the light emitting component 400a may include an optical fiber array 405a. The light emitted by the laser 401a is transmitted to the optical modulation chip 404a, where it is modulated to generate an optical signal. The optical signal is then output from the optical modulation chip 404a and transmitted through the optical fiber array 405a. The optical modulation chip 404a may be a silicon-based chip or a thin-film lithium niobate-based chip.

[0134] In some embodiments, the optical receiving component 500a includes an optical fiber 513 extending toward the optical receiving chip until its end is exposed above the optical receiving chip. A reflective end face 514 is formed at the end of the optical fiber 513, which is exposed above the optical receiving chip. The reflective end face 514 is used to reflect and change the transmission direction of the optical signal transmitted through the optical fiber 513, thereby reflecting the optical signal transmitted through the optical fiber 513 to the optical receiving chip and achieving a reversal of the optical path.

[0135] Figure 7a is an internal structural diagram of another optical module according to some embodiments, and Figure 7b is an exploded view of another optical module according to some embodiments. As shown in Figures 7a and 7b, in some embodiments, a signal processing chip 304 is provided on the surface of the circuit board 300. The signal processing chip 304 processes the electrical signals output / input inside the optical module and is electrically connected to the gold fingers 301. The signal processing chip 304 can be a DSP chip.

[0136] In some embodiments, the optical module includes an optical emitting component 400a. The optical emitting component 400a is configured to emit optical signals. The optical emitting component 400a may be located on one side of the signal processing chip 304.

[0137] In some embodiments, the optical module includes an optical receiving component 500b. The optical receiving component 500b is configured to receive optical signals. The optical receiving component 500b may be located side-by-side with the optical emitting component 400a on one side of the signal processing chip 304.

[0138] In some embodiments, the optical emitting component 400a includes an optical modulation chip to modulate and generate an optical signal, thereby transmitting the optical signal. The optical receiving component 500b employs a COB packaging scheme to receive the optical signal.

[0139] In some embodiments, the light emitting component 400a of FIG7a may have the same structure as the light emitting component 400a of FIG6b. That is, the light emitting component 400a with the same structural features may be combined with the light receiving component 500a or the light receiving component 500b.

[0140] In some embodiments, the light receiving component 500b includes a lens assembly 510, which is disposed on the surface of the circuit board 300. A light receiving chip is located on the surface of the circuit board 300, and the lens assembly 510 is disposed above the light receiving chip. A reflective surface 511 is formed on the surface of the lens assembly 510, which is located above the light receiving chip. The reflective surface 511 can bend the light path towards the surface of the light receiving chip, thereby coupling the optical signal into the light receiving chip.

[0141] As shown in Figure 6b, in some embodiments, the optical module includes a cover plate 305. The cover plate 305 covers the surfaces of the light emitting component 400a and the light receiving component 500a, thereby protecting the light emitting component 400a and the light receiving component 500a.

[0142] In some embodiments, limiting holes 306 are formed on both sides of the surface of the circuit board 300. Limiting portions 3051 are formed on both sides of the bottom surface of the cover plate 305. The limiting portions 3051 are embedded in the limiting holes 306, thereby fixing the cover plate 305 to the circuit board 300 and facilitating the insertion and removal of the cover plate 305.

[0143] In some embodiments, when there is a trace on the inner layer of the circuit board 300 at the location of the limiting hole 306, the limiting hole 306 is a blind hole. When there is no trace on the inner layer of the circuit board 300 at the location of the limiting hole 306, the limiting hole 306 is a through hole.

[0144] In some embodiments, the optical module may include a base 700a for supporting and carrying the light emitting component 400a.

[0145] In some embodiments, a notch 307 is formed on the surface of the circuit board 300 to accommodate the base 700a.

[0146] In some embodiments, the light emitting component 400a may include a laser 401a. The laser 401a is located on the surface of the base 700a. The laser 401a can emit light along its side without modulating the light signal, so that the light emitted by the laser 401a does not carry an optical signal. Exemplarily, the laser 401a is a DFB laser.

[0147] In some embodiments, the light emitting component 400a may include a lens 402a. The lens 402a is located on the surface of the base 700a.

[0148] In some embodiments, lens 402a is located in the light output path of laser 401a. Lens 402a is a converging lens to focus the light emitted by laser 401a.

[0149] In some embodiments, the light emitting component 400a may include an isolator 403a. The isolator 403a is located on the surface of the base 700a. The isolator 403a is located in the light output path of the lens 402a to prevent light emitted by the laser 401a from returning to the laser 401a.

[0150] In some embodiments, the light emitting component 400a may include an optical modulation chip 404a. The optical modulation chip 404a is located on the surface of the base 700a. The optical modulation chip 404a is located in the light output path of the isolator 403a and receives the light output from the isolator 403a. The optical modulation chip 404a performs signal phase modulation on the light output from the isolator 403a to generate an optical signal.

[0151] In some embodiments, the optical modulation chip 404a integrates an MZ modulator to modulate the optical signal and transmit the optical signal. Exemplarily, the optical modulation chip 404a can be a silicon photonics chip, a thin-film lithium niobate chip, or a III-V group photonics chip.

[0152] In some embodiments, the optical path corresponding to the light receiver is separated from the optical modulation and demodulation chip by the light receiver 500a. Therefore, the laser 401a does not need to provide a local oscillator signal to the light receiver 500a, but only needs to provide the light source to be modulated to the light emitter 400a. Thus, the laser 401a is placed on the incident light path of the optical modulation chip 404a. This differs from the tunable laser 900, which provides both the light source to be modulated to the light emitter and the local oscillator signal to the light receiver.

[0153] In some embodiments, the optical emitting component 400a may include an optical fiber array 405a. The optical fiber array 405a is located on the surface of the base 700a. The optical fiber array 405a is end-face coupled to the optical modulation chip 404a. The optical fiber array 405a is located in the optical output path of the optical modulation chip 404a to transmit the optical signal modulated by the optical modulation chip 404a to the outside.

[0154] In some embodiments, the light emitted by the laser 401a is transmitted to the optical modulation chip 404a, where it is modulated to generate an optical signal. The optical signal is then output from the optical modulation chip 404a and transmitted through the fiber array 405a.

[0155] In some embodiments, the laser 401a, lens 402a, and isolator 403a are located in the incident optical path of the optical modulation chip 404a, providing the light source to be modulated to the optical modulation chip 404a. The fiber array 405a is coupled to the output optical port of the optical modulation chip 404a. Since the incident and output ports of the optical modulation chip 404a are formed on the same side, the laser 401a, lens 402a, isolator 403a, and fiber array 405a are located on the same side of the optical modulation chip 404a.

[0156] In some embodiments, if the optical modulation chip 404a is electrically connected to the signal processing chip 304, the modulation drive signal required by the optical modulation chip 404a can be provided by the signal processing chip 304. Alternatively, the modulation drive signal required by the optical modulation chip 404a can be provided by a separately configured drive chip.

[0157] Figure 8a is an exploded view of the interior of an optical module according to some embodiments. As shown in Figure 8a, in some embodiments, a notch 307 is formed on the surface of the circuit board 300 to accommodate the base 700a. The notch 307 is configured as a through hole.

[0158] In some embodiments, the light receiving component 500a may include a refracting element 510a.

[0159] In some embodiments, the light receiving component 500a may include a light receiving chip 520a.

[0160] In some embodiments, the light receiving component 500a may include TIA530a.

[0161] In some embodiments, the refracting element 510a includes an optical fiber 513 extending toward the optical receiving chip 520a, with the end of the optical fiber 513 exposed above the optical receiving chip 520a. A reflective end face 514 is formed at the end of the optical fiber 513, which is exposed above the optical receiving chip 520a. The reflective end face 514 is used to reflect and change the transmission direction of the optical signal transmitted through the optical fiber 513, thereby reflecting the optical signal transmitted through the optical fiber 513 to the optical receiving chip 520a, thus achieving a reversal of the optical path.

[0162] In some embodiments, TIA530a is located on the surface of circuit board 300 and is located on one side of optical receiver chip 520a. Optical receiver chip 520a converts the received optical signal into a photocurrent signal, TIA530a converts the photocurrent signal into a photovoltage signal, amplifies the photovoltage signal, and then transmits it to signal processing chip 304.

[0163] Figure 8b is a structural diagram of a refractive element according to some embodiments, and Figure 8c is an exploded view of a refractive element according to some embodiments. As shown in Figures 8b and 8c, in some embodiments, the refractive element 510a may include a first optical fiber support portion 511 and a second optical fiber support portion 512. The first optical fiber support portion 511 and the second optical fiber support portion 512 are arranged vertically opposite to each other, and a plurality of optical fibers 513 are sandwiched between them. The plurality of optical fibers 513 form an optical fiber array. A V-groove 517 is formed on the bottom surface of the first optical fiber support portion 511 to embed the optical fibers 513.

[0164] In some embodiments, the refracting element 510a may include an optical fiber fixing portion 515. The optical fiber fixing portion 515 is located at the tail of the second optical fiber support portion 512 to fix the optical fiber 513. The optical fiber fixing portion 515 protects and cushions the optical fiber 513, thereby preventing fiber breakage. Exemplarily, the optical fiber fixing portion 515 is made of soft rubber, which protects and cushions the optical fiber 513.

[0165] In some embodiments, the length of the first optical fiber support portion 511 is longer than that of the second optical fiber support portion 512, and there is a space between the end of the second optical fiber support portion 512 and the end of the first optical fiber support portion 511, which is reserved for coating space of the optical fiber fixing portion 515.

[0166] In some embodiments, a reflective end face 514 is formed at the end of the optical fiber 513. The reflective end face 514 is located above the optical receiver chip 520a. The reflective end face 514 is used to reflect and change the transmission direction of the optical signal transmitted by the optical fiber 513, so as to reflect the optical signal transmitted by the optical fiber 513 to the optical receiver chip 520a.

[0167] In some embodiments, the reflective end face 514 is an inclined surface, and the received optical signal transmitted by the optical fiber 513 undergoes total internal reflection at the reflective end face 514. For example, the inclination angle of the reflective end face 514 is 46-50°, such as 48°.

[0168] In some embodiments, the optical fiber 513 passes through one end of the first optical fiber support 511 and extends to the outside of the other end of the first optical fiber support 511, such that the reflective end face 514 is located outside the other end of the first optical fiber support 511. One end of the optical fiber fixing part 515 is connected to one end of the second optical fiber support 512, and the other end of the optical fiber fixing part 515 is fixedly connected to the end of the optical fiber 513 to support the end of the optical fiber 513.

[0169] In some embodiments, a protective surface 516 is formed on the end face of the first optical fiber support portion 511. The protective surface 516 surrounds the side of the reflective end face 514 to protect the reflective end face 514. For example, the protective surface 516 is an inclined surface with an inclination angle of 46-50°, such as 48°.

[0170] In some embodiments, the reflective end face 514 and the protective end face 516 are formed by grinding and polishing. The end face of the optical fiber 513 is ground to a certain tilt angle to form the reflective end face 514. The optical fiber 513 is cylindrical, and the cross-section of the reflective end face 514 after grinding is elliptical, so the bottom of the optical fiber 513 is exposed relative to the first optical fiber support portion 511.

[0171] Figure 8d is a structural diagram of an optical receiving component according to some embodiments. As shown in Figure 8d, in some embodiments, a certain gap is left between the optical fiber fixing part 515 and the surface of the circuit board 300 to prevent the optical fiber fixing part 515 from sticking to the optical adhesive used to fix the second optical fiber support part 512 on the surface of the circuit board 300, and to maintain the binding force of the optical fiber fixing part 515 on the optical fiber 513.

[0172] In some embodiments, the light receiver chip 520 is located on the surface of the circuit board 300. When the model of the light receiver chip 520 is fixed, its thickness is fixed, and therefore the distance from its photosensitive surface to the surface of the circuit board 300 is fixed.

[0173] In some embodiments, the preset distance between the reflective end face 514 and the light receiving chip 520a is small to ensure that the light signal reflected from the reflective end face 514 can be transmitted to the photosensitive surface of the light receiving chip 520a and then received by the light receiving chip 520a. The thickness of the second optical fiber support portion 512 is small to ensure that the distance between the reflective end face 514 and the light receiving chip 520a meets the preset distance. For example, the thickness of the second optical fiber support portion 512 is smaller than that of the first optical fiber support portion 511 to ensure that the distance between the reflective end face 514 and the light receiving chip 520a meets the preset distance.

[0174] In some embodiments, the length of the second optical fiber support portion 512 does not extend below the reflective end face 514, leaving space for the optical receiving chip 520a. Thus, while ensuring that the distance between the reflective end face 514 and the optical receiving chip 520a meets a preset distance, the thickness of the second optical fiber support portion 512 can be appropriately increased to increase the supporting force of the second optical fiber support portion 512 on the optical fiber 513, ensuring optical path stability. For example, the thickness of the second optical fiber support portion 512 is greater than the distance between the reflective end face 514 and the optical receiving chip 520a, and the bottom surface of the second optical fiber support portion 512 is below the top surface of the optical receiving chip 520a.

[0175] In some embodiments, the optical receiving chip 520 is located on the surface of the circuit board 300. A groove is formed on the surface of the circuit board 300 where the second optical fiber support 512 is located, so that the second optical fiber support 512 extends downward and increases the thickness of the second optical fiber support 512.

[0176] In some embodiments, the second fiber support 512 extends below the reflective end face 514, thereby protecting the end of the fiber optic cable 513. In this case, a groove is formed on the surface of the circuit board where the optical receiver chip 520a is located, allowing the optical receiver chip 520a to be recessed, ensuring that the distance between the reflective end face 514 and the optical receiver chip 520a meets a preset distance. Exemplarily, the bottom surface of the second fiber support 512 is above the top surface of the optical receiver chip 520a.

[0177] In some embodiments, when the second optical fiber support portion 512 has a small thickness and its material can ensure sufficient support, the length of the second optical fiber support portion 512 can be extended below the reflective end face 514.

[0178] Figure 8e is a second structural diagram of a refractive element according to some embodiments. As shown in Figure 8e, in some embodiments, the second optical fiber support 512 extends to below the reflective end face 514, so that the second optical fiber support 512 can protect the end of the optical fiber 513. At this time, the optical receiving chip 520a is located on the surface of the circuit board 300.

[0179] As shown in Figure 8b, the bottom of the reflective end face 514 of the optical fiber 513 is exposed relative to the first optical fiber support 511, while the second optical fiber support 512 does not extend to the bottom of the reflective end face 514, thus the bottom of the reflective end face 514 cannot be protected. When the length of the second optical fiber support 512 extends below the reflective end face 514, the second optical fiber support 512 can protect the end of the optical fiber 513.

[0180] In some embodiments, when the second optical fiber support 512 extends below the reflective end face 514, the bottom surface of the second optical fiber support 512 is above the top surface of the optical receiving chip 520a, increasing the distance between the reflective end face 514 and the optical receiving chip 520a. To ensure that the light signal reflected from the reflective end face 514 falls on the photosensitive surface of the optical receiving chip 520a, the second optical fiber support 512 extends to a point below it to support a converging lens 518. The converging lens 518 is located between the reflective end face 514 and the optical receiving chip 520a, and it can converge the light signal reflected from the reflective end face 514, thereby ensuring that the light signal reflected from the reflective end face 514 falls on the photosensitive surface of the optical receiving chip 520a.

[0181] Figure 9a is an assembly diagram of a light emitting component and a circuit board according to some embodiments, Figure 9b is an exploded view of a light emitting component according to some embodiments, and Figure 9c is a cross-sectional view of an assembly of a light emitting component and a circuit board according to some embodiments. As shown in Figures 9a-9c, in some embodiments, the surface of the base 700a carries a laser 401a, a lens 402a, an isolator 403a, an optical modulation chip 404a, and an optical fiber array 405a.

[0182] In some embodiments, the laser 401a, optical modulation chip 404a, etc., generate significant heat. The base 700a provides a large heat dissipation surface and excellent heat dissipation performance, allowing the heat generated by the laser 401a and optical modulation chip 404a to be dissipated through the base 700a. For example, the base 700a can be a metal base. Furthermore, the base 700a exhibits minimal thermal deformation, thereby ensuring optical path stability.

[0183] In some embodiments, a notch 307 is formed on the surface of the circuit board 300 to accommodate the base 700a. The notch 307 can accommodate the laser 401a, lens 402a, isolator 403a, optical modulation chip 404a, and fiber array 405a.

[0184] In some embodiments, a receiving portion 701 is formed at one end of the base 700a to receive the circuit board 300.

[0185] In some embodiments, the optical modulation chip 404a is electrically connected to the signal processing chip 304, and the signal processing chip 304 can provide a driving signal for the optical signal modulation of the optical modulation chip 404a.

[0186] In some embodiments, the signal processing chip 304 can be flip-chip mounted on the surface of the circuit board 300. Exemplarily, solder bumps on the bottom surface of the signal processing chip 304 are connected downwards to the surface of the circuit board 300. In some embodiments, after the solder bumps of the signal processing chip 304 are connected to the pads on the surface of the circuit board 300 by heating and pressurizing, a viscous filler is bidirectionally filled along the edge of the signal processing chip 304. The gap between the signal processing chip 304 and the circuit board 300 has a capillary effect, drawing in the viscous filler and flowing towards the center, thereby filling the gap between the signal processing chip 304 and the circuit board 300, achieving a stable fit between the signal processing chip 304 and the circuit board 300.

[0187] In some embodiments, one end of the signal processing chip 304 is electrically connected to the gold finger 301 from the solder bump through the traces on the surface of the circuit board 300.

[0188] In some embodiments, the optical modulation chip 404a is wired to the surface of the circuit board 300 via surface pads, and then electrically connected to the solder bumps of the signal processing chip 304 via traces on the surface of the circuit board 300, thereby realizing the electrical connection between the optical modulation chip 404a and the signal processing chip 304.

[0189] In some embodiments, a boss surface 703 is formed on the surface of the base 700a. The surface of the boss surface 703 protrudes from the surface of the receiving portion 701. For some models of optical modulation chip 404a, its thickness is less than the thickness of the circuit board 300. The boss surface 703 can compensate for the thickness difference between the optical modulation chip 404a and the circuit board 300, so that the surface of the optical modulation chip 404a is closer to the surface of the circuit board 300, shortening the wire bonding length between the optical modulation chip 404a and the circuit board 300, and optimizing the high-frequency signal transmission performance.

[0190] In some embodiments, the boss surface 703 may include surfaces of varying heights to match the optical axis heights between the laser 401a and the optical modulation chip 404a, and between the optical modulation chip 404a and the fiber array 405a. In some embodiments, to ensure compatibility with different types of optical devices, the boss surface 703 may also be a platform of uniform height to improve the applicability of the base 700a.

[0191] In some embodiments, the optical modulation chip 404a is fixed to the boss surface 703 with optical adhesive, and the fiber array 405a is also fixed to the boss surface 703 with optical adhesive. A recess 704 is formed between the boss surfaces where the optical modulation chip 404a and the fiber array 405a are located to collect the overflowing optical adhesive and reduce adhesive bridging.

[0192] In some embodiments, the boss surface 703 includes a cross surface 7031. The fiber array 405a is located on the surface of the cross surface 7031.

[0193] In some embodiments, the fiber array 405a may include a first support portion 415 and a second support portion 425. An optical fiber is held between the first support portion 415 and the second support portion 425 to support and fix the optical fiber. In some embodiments, the second support portion 425 is fixedly connected to the cross-section 7031 by applying optical adhesive.

[0194] In some embodiments, the fiber optic array 405a may include a fixing portion 435. The fixing portion 435 is connected to the end of the second support portion 425. The fixing portion 435 protects and cushions the optical fiber, thereby preventing fiber breakage. Exemplarily, the fixing portion 435 may be made of soft adhesive, which protects and cushions the optical fiber 513.

[0195] In some embodiments, the length of the first support portion 415 is longer than that of the second support portion 425, and there is space between the end of the second support portion 425 and the end of the first support portion 415, which provides a coating space for the fixing portion 435.

[0196] In some embodiments, if both ends of the second support portion 425 are exposed for a certain length relative to the cross surface 7031, then the two ends of the second support portion 425 will not be coated with optical adhesive, thereby preventing the two ends of the second support portion 425 from being broken due to stress. In some embodiments, the first support portion 415 and the second support portion 425 can be made of glass, which is fragile.

[0197] In some embodiments, the cross surface 7031 does not provide support for the fixing part 435, and the fixing part 435 is suspended relative to the cross surface 7031. This prevents the fixing part 435 from adhering to the optical adhesive on the surface of the cross surface 7031, thereby ensuring that the fixing part 435 continuously wraps around the optical fiber.

[0198] In some embodiments, the optical fiber should pass horizontally along the surface of the circuit board 300 to avoid stress and breakage when the optical fiber comes into contact with the circuit board 300. In some embodiments, the fiber outlet of the fixing part 435 can be raised by a certain amount so that the optical fiber can pass horizontally and buffered when it falls on the surface of the circuit board 300, reducing interference with the surface of the circuit board 300 and ensuring smooth horizontal fiber outlet.

[0199] In some embodiments, the optical fiber segment covered by the fixing part 435 is fixed inside, while the optical fiber segment exposed outside the fixing part 435 is movable. The fiber outlet of the fixing part 435 can be raised to a certain extent by using the tail of the fixing part 435 as a fulcrum, so that the optical fiber can pass through horizontally and with buffer when it falls on the surface of the circuit board 300.

[0200] In some embodiments, there is a distance between the end of the fixing part 435 and the circuit board 300, and the fiber outlet of the fixing part 435 is suspended relative to the surface of the base 700a. When the fiber outlet of the fixing part 435 is lifted upward, this distance can provide bending space for the optical fiber. The optical fiber is not subjected to stress in the bending space, thereby protecting the optical fiber.

[0201] In some embodiments, the base 700a may include an extension 702. The surface of the extension 702 is lower than the surface of the cross-section 7031. The fixing part 435 and the fiber outlet are located above the extension 702. There is a certain gap in the longitudinal direction between the fixing part 435 and the surface of the extension 702, providing bending space for the fiber outlet of the fixing part 435 and avoiding fiber breakage. The fiber outlet of the fixing part 435 passes through the upper part of the extension 702. Using the tail of the fixing part 435 as a fulcrum, the fiber outlet of the fixing part 435 is lifted upward by a certain amount, so that when the optical fiber falls on the surface of the circuit board 300, it can pass through horizontally and with buffer, thereby ensuring smooth horizontal fiber outlet.

[0202] Figure 9d is a partial structural diagram of an optical emitting component according to some embodiments. As shown in Figure 9d, in some embodiments, the optical modulation chip 404a is end-face coupled to the fiber array 405a. The optical modulation chip 404a has a built-in MZ modulator that loads a signal onto the light wave emitted by the laser 401a, modulating and generating an optical signal. The fiber array 405a transmits the optical signal modulated by the optical modulation chip 404a.

[0203] In some embodiments, the end face of the optical modulation chip 404a includes an input optical port 414 and an output optical port 424. The input optical port 414 faces the isolator 403a. The output optical port 424 faces the fiber array 405a. Taking a 400G transmission rate and a single-wavelength 100G transmission rate as an example, the end face of the optical modulation chip 404a forms four output optical ports 424 to output four optical carrier signals.

[0204] In some embodiments, the angle between the input waveguide corresponding to the input port 414 and the end face of the optical modulation chip 404a can be acute, thus the input waveguide is not perpendicular to the end face, thereby reducing end face reflection. The output waveguide corresponding to the output port 424 adopts the same arrangement to reduce end face reflection.

[0205] In some embodiments, the light-incident end face of the fiber array 405a is beveled, and the light-incident end face of the internal fiber is also beveled to prevent the optical signal incident on the fiber array 405a from returning to the optical modulation chip 404a, thereby increasing return loss and allowing more light to be transmitted in the fiber. For example, the light-incident end face of the fiber array 405a is polished into an 8° bevel.

[0206] In some embodiments, referring to FIG9a, the optical modulation chip 404a is tilted, that is, the input and output light-emitting end faces of the optical modulation chip 404a are not perpendicular to the long side direction of the circuit board 300. By tilting the optical modulation chip 404a so that the input and output light-emitting waveguides are parallel to the long side direction of the circuit board 300, the laser 401a and the fiber array 405a can be arranged parallel to the surface of the circuit board 300. This reduces the area of ​​the notch 307 on the surface of the circuit board 300 and maximizes the signal transmission performance of the circuit board 300.

[0207] In some embodiments, the notch 307 is adapted to the structural features of the light emitting component 400a. The notch 307 may be a through hole, and the base 700a supports the circuit board 300 from the bottom surface upwards. The bearing surface of the base 700a faces the upper surface of the circuit board 300, thereby supporting the laser 401a, lens 402a, isolator 403a, optical modulation chip 404a, and fiber array 405a towards the upper surface of the circuit board 300, and establishing an electrical connection between each device and the upper surface of the circuit board 300.

[0208] In some embodiments, the notch 307 may include a first through-hole 3071. The first through-hole 3071 houses a laser 401a, a lens 402a, an isolator 403a, and a fiber array 405a. Since the laser 401a, lens 402a, isolator 403a, and fiber array 405a are arranged parallel to the surface of the circuit board 300, the first through-hole 3071 is also arranged parallel to the surface of the circuit board 300.

[0209] In some embodiments, the notch 307 may include a second through-hole 3072. The second through-hole 3072 houses the optical modulation chip 404a. The second through-hole 3072 is connected to one end of the first through-hole 3071. As shown in FIG. 9a, the second through-hole 3072 is inclined downwards relative to the first through-hole 3071 to accommodate the arrangement of the optical modulation chip 404a.

[0210] In some embodiments, the notch 307 may include a third through-hole 3073. The third through-hole 3073 is connected to the other end of the first through-hole 3071. Along the width direction of the circuit board 300, the third through-hole 3073 is smaller in size than the first through-hole 3071 to reduce the cut-out area. The fiber array 405a exits through the third through-hole 3073. As mentioned above, the third through-hole 3073 provides bending space for the fiber exit of the fixing part 435 to avoid fiber breakage. The fiber exit of the fixing part 435 passes through the third through-hole 3073, and the fiber exit of the fixing part 435 is lifted upward by a certain amount with the tail of the fixing part 435 as a fulcrum. When the fiber falls on the surface of the circuit board 300, it can pass through horizontally and with buffer, thereby ensuring smooth horizontal fiber exit.

[0211] Figure 10a is a cross-sectional structural diagram of a light receiving component according to some embodiments, and Figure 10b is a cross-sectional structural diagram of a light receiving component according to some embodiments. As shown in Figures 10a and 10b, in some embodiments, the light receiving component 500a may include a refracting element 510a.

[0212] In some embodiments, the refracting element 510a includes an optical fiber 513 extending toward the optical receiving chip 520a. A reflective end face 514 is formed at the end of the optical fiber 513, which is located above the optical receiving chip 520a. The reflective end face 514 is used to reflect and change the transmission direction of the optical signal transmitted by the optical fiber 513, so as to reflect the optical signal transmitted by the optical fiber 513 to the optical receiving chip 520a, thereby realizing the reversal of the optical path.

[0213] In some embodiments, the optical receiver chip 520a is located on the surface of the circuit board 300. The TIA 530a is located on the surface of the circuit board 300. The optical receiver chip 520a and the TIA 530a are connected by wire bonding, thereby transmitting the photocurrent signal converted by the optical receiver chip 520a to the TIA 530a.

[0214] In some embodiments, the circuit board 300 has a large coefficient of thermal expansion and relatively poor surface optical path stability.

[0215] In some embodiments, a recess 308a is formed on the surface of the circuit board 300, and a substrate 540a is disposed on the surface of the recess 308a. A refractive element 510a and a light-receiving chip 520a are supported on the surface of the substrate 540a. The coefficient of thermal expansion of the substrate 540a is relatively smaller than that of the circuit board 300, thereby ensuring the stability of the light-receiving optical path. The refractive element 510a and the light-receiving chip 520a can be fixed to the surface of the substrate 540a with optical adhesive.

[0216] In some embodiments, the reflective end face 514 is at a preset distance from the light receiving chip 520a, so that the light signal output from the reflective end face 514 can reach the photosensitive surface of the light receiving chip 520a.

[0217] In some embodiments, the recess depth of the groove 308a and the thickness of the substrate 540a are matched to satisfy a preset distance between the reflective end face 514 and the light receiving chip 520a. Simultaneously, the surfaces of the light receiving chip 520a and the TIA 530a are flush, shortening the wire bonding distance between them and facilitating high-frequency signal transmission between them.

[0218] In some embodiments, the refracting element 510a may include a first optical fiber support portion 511 and a second optical fiber support portion 512, with an optical fiber 513 sandwiched between them. The first optical fiber support portion 511 is thicker to facilitate clamping during coupling of the refracting element 510a. Since the preset distance between the reflective end face 514 and the light receiving chip 520a is usually small, the second optical fiber support portion 512 is thinner, making it difficult to support the first optical fiber support portion 511, resulting in the second optical fiber support portion 512 breaking.

[0219] In some embodiments, the surface of the substrate 540a used to support the refracting element 510a is recessed downward to form a concave surface 541. The thickness of the second optical fiber support 512 can be extended downward, thereby increasing the thickness of the second optical fiber support 512 and increasing the upward support force of the second optical fiber support 512, thereby maintaining the stable transmission performance of the optical fiber supported between the first optical fiber support 511 and the second optical fiber support 512.

[0220] In some embodiments, the concave surface 541 causes the surface of the substrate 540a used to support the light-receiving chip 520a to protrude relatively, forming a boss 542. The light-receiving chip 520a is located on the surface of the boss 542. The height of the surface where the boss 542 is located satisfies the following conditions: the distance between the reflective end face 514 and the light-receiving chip 520a conforms to a preset distance. At the same time, the light-receiving chip 520a is flush with the surface of the TIA 530a.

[0221] In some embodiments, the concave surface 541 and the boss 542 may also be configured as two independent structures, i.e., the boss 542 is located on the surface of the concave surface 541.

[0222] In some embodiments, the second optical fiber support 512 may be made of a hard material to increase the support strength, in which case there is no need to form a concave surface 541.

[0223] Figure 10c is a cross-sectional structural diagram of an optical receiving component according to some embodiments, and Figure 10d is a cross-sectional structural diagram of an optical receiving component according to some embodiments. As shown in Figures 10c and 10d, in some embodiments, the refracting element 510a may include an optical fiber fixing portion 515. The optical fiber fixing portion 515 protects and buffers the optical fiber 513, thereby preventing fiber breakage. Exemplarily, the optical fiber fixing portion 515 is a soft adhesive that can provide protection and buffering.

[0224] In some embodiments, the fiber fixing portion 515 is not disposed on the surface of the substrate 540a. The substrate 540a does not provide support for the fiber fixing portion 515, and the fiber fixing portion 515 is suspended relative to the substrate 540a. This prevents adhesion between the fiber fixing portion 515 and the optical adhesive on the surface of the substrate 540a used to fix the second fiber support portion 512, prevents the fiber from detaching from the fiber fixing portion 515, and thus ensures that the fixing portion 435 continuously wraps around the fiber.

[0225] In some embodiments, one end of the groove 308a extends close to the TIA 530a, and the other end extends a certain distance from the end of the substrate 540a, so that the fiber optic fixing part 515 can reach the surface of the circuit board 300 only after the fiber has exited a certain distance. In some embodiments, the fiber optic fixing part 515 can be lifted upward by a certain amount using the tail of the fiber optic fixing part 515 as a fulcrum, so that the fiber can pass horizontally and buffered when it falls on the surface of the circuit board 300, thereby ensuring smooth horizontal fiber exit.

[0226] In some embodiments, the fiber outlet of the fiber fixing part 515 is suspended relative to the groove part 308a. When the fiber outlet of the fiber fixing part 515 is lifted upward, a bending space can be provided for the fiber. The fiber is not subjected to stress in the bending space, thereby preventing fiber breakage.

[0227] Figure 11a is an exploded structural view of another optical receiving component according to some embodiments, and Figure 11b is a cross-sectional structural view of another optical receiving component according to some embodiments. As shown in Figures 11a and 11b, in some embodiments, the optical receiving component 500b is located on the surface of the circuit board 300. The optical receiving component 500b may be located side by side with the optical emitting component 400a on one side of the signal processing chip 304.

[0228] In some embodiments, the structure of the light emitting component 400a can be referred to, and will not be described in detail here.

[0229] In some embodiments, the light receiving component 500b may include a lens assembly 510, which is snapped onto the surface of the circuit board 300. A receiving cavity is formed between the inner wall of the lens assembly 510 and the surface of the circuit board 300. A reflective surface 511 is formed on the outer wall surface of the lens assembly 510. The reflective surface 511 is inclined, with its light-incident surface facing the optical fiber 540b, which transmits optical signals from the outside to the reflective surface 511. The light-exiting surface of the reflective surface 511 faces the surface of the circuit board 300.

[0230] In some embodiments, the light receiving component 500b may include a light receiving chip 520b. The light receiving chip 520b is located within a receiving cavity formed between the inner wall of the lens assembly 510 and the circuit board 300. The light receiving chip 520b is located on the surface of the circuit board 300.

[0231] In some embodiments, the lens assembly 510 is disposed above the light receiving chip 520b. A reflective surface 511 is formed above the light receiving chip 520b. The reflective surface 511 can bend the light path toward the surface of the light receiving chip 520b, thereby coupling the optical signal into the light receiving chip 520b.

[0232] In some embodiments, the light receiving component 500b may include a TIA 530b. The TIA 530b is located within a receiving cavity formed between the inner wall of the lens assembly 510 and the circuit board 300. The TIA 530b is located on the surface of the circuit board 300. The TIA 530b is located on one side of the light receiving chip 520b.

[0233] In some embodiments, the optical receiver chip 520b and TIA530b are electrically connected via wire bonding, thereby transmitting the photocurrent signal generated by the optical receiver chip 520b to the TIA530b. The TIA530b converts the photocurrent signal into a photovoltage signal and amplifies it. The TIA530b is electrically connected to the signal processing chip 304 via traces on the surface of the circuit board 300, transmitting the amplified photovoltage signal to the signal processing chip 304.

[0234] Figure 12a shows another internal structure of an optical module according to some embodiments. As shown in Figure 12a, in some embodiments, the surface of the circuit board 300 is provided with two sets of light emitting components: a first light emitting component 400b and a second light emitting component 400c. The surface of the circuit board 300 is provided with two sets of light receiving components: a first light receiving component 500c and a second light receiving component 500d. Compared with the combined structure of the light emitting component 400a and the light receiving component 500a described above, the transmission rate is doubled.

[0235] In some embodiments, the first light emitting component 400b and the second light emitting component 400c are disposed side by side on the same surface of the circuit board 300. In some embodiments, the first light receiving component 500c and the second light receiving component 500d are disposed side by side on the same surface of the circuit board 300.

[0236] In some embodiments, the first light emitting component 400b, the second light emitting component 400c, the first light receiving component 500c, and the second light receiving component 500d are designed in a planar manner, and they are all located on the same surface of the circuit board 300.

[0237] In some embodiments, the first light emitting component 400b and the second light emitting component 400c may each adopt the same structure as the light emitting component 400a. The first light receiving component 500c and the second light receiving component 500d may each adopt the same structure as the light receiving component 500a.

[0238] Figure 12b is another internal structure diagram of an optical module according to some embodiments. As shown in Figure 12b, in some embodiments, the surface of the circuit board 300 is provided with two sets of light emitting components: a first light emitting component 400b and a second light emitting component 400c. The surface of the circuit board 300 is provided with two sets of light receiving components: a first light receiving component 500e and a second light receiving component 500f. Compared with the combined structure of the light emitting component 400a and the light receiving component 500a described above, the transmission rate is doubled.

[0239] In some embodiments, the first light emitting component 400b and the second light emitting component 400c are arranged side by side on the same surface of the circuit board 300. In some embodiments, the first light receiving component 500e and the second light receiving component 500f are arranged side by side on the same surface of the circuit board 300.

[0240] In some embodiments, the first light emitting component 400b, the second light emitting component 400c, the first light receiving component 500e, and the second light receiving component 500f are designed in a planar manner, and they are all located on the same surface of the circuit board 300.

[0241] In some embodiments, the first light emitting component 400b and the second light emitting component 400c may each adopt the same structure as the light emitting component 400a. The first light receiving component 500e and the second light receiving component 500f may each adopt the same structure as the light receiving component 500b.

[0242] In some embodiments, the first light emitting component 400b and the second light emitting component 400c are a dual-emitting structure, which can be combined with a dual-receiving structure composed of the first light receiving component 500c and the second light receiving component 500d, or with a dual-receiving structure composed of the first light receiving component 500e and the second light receiving component 500f.

[0243] Figure 13a is a second internal structure diagram of an optical module according to some embodiments, and Figure 13b is an exploded assembly diagram of an optical module according to some embodiments. As shown in Figures 13a and 13b, in some embodiments, the first optical emitting component 400b, the second optical emitting component 400c, the first optical receiving component 500e, and the second optical receiving component 500f are all located on the same surface of the circuit board 300. Since the space on the circuit board 300 is limited, a reasonable design is needed to deploy them together on the same surface of the circuit board 300.

[0244] In some embodiments, a recess 308b is formed on the surface of the circuit board 300. The recess 308b is disposed near one edge of the circuit board 300. A first light receiving component 500c and a second light receiving component 500d are disposed on the surface of the recess 308b. Compared to disposing the first light receiving component 500c and the second light receiving component 500d on two separate recess surfaces, disposing the first light receiving component 500c and the second light receiving component 500d on the same recess 308b surface can reduce the area cut out in the recess 308b, thereby reducing the area occupied on the circuit board and reserving more circuit board space for the first light emitting component 400b and the second light emitting component 400c.

[0245] In some embodiments, the first light receiving component 500c and the second light receiving component 500d may be respectively disposed on the surfaces of two independent recesses. In this case, the groove walls of the two recesses have a certain thickness, and the two recesses are spaced apart by a certain distance to avoid damaging the groove walls of the milled recesses during the current milling process. The increased thickness of the adjacent groove walls and the increased distance between the adjacent groove walls increase the surface area occupied on the circuit board.

[0246] In some embodiments, the structural features of the first light receiving component 500c may be the same as those of the light receiving component 500a, and will not be described in detail here. The structural features of the second light receiving component 500d may be the same as those of the light receiving component 500a, and will not be described in detail here. The groove portion 308b has the same function as the groove portion 308a, and is designed to provide a substrate with a small coefficient of thermal expansion.

[0247] In some embodiments, when the first light receiving component 500c and the second light receiving component 500d are jointly disposed on the same surface of the recess 308b, the spacing between the first light receiving component 500c and the second light receiving component 500d is small. Therefore, the TIA530c in the first light receiving component 500c and the TIA530d in the second light receiving component 500d can share a pad on the surface of the circuit board 300, which is located between the TIA530c and the TIA530d. Since the pad is close to either the TIA530c or the TIA530d, the bonding distance between the pad and either the TIA530c or the TIA530d can be shortened.

[0248] In some embodiments, a first substrate 540c and a second substrate 540d are disposed on the surface of the recess 308b. The first substrate 540c is used to support the first refracting element 510c and the first light receiving chip 520c in the first light receiving component 500c. The second substrate 540d is used to support the second refracting element 510d and the second light receiving chip 520d in the second light receiving component 500d. The coefficients of thermal expansion of both the first substrate 540c and the second substrate 540d are less than the coefficient of thermal expansion of the circuit board 300.

[0249] In some embodiments, the first substrate 540c and the second substrate 540d may be connected together to form a single substrate.

[0250] In some embodiments, the bottom end of the first refracting element 510c is fixed to the surface of the first substrate 540c. The first light receiving chip 520c is disposed at the end of the first substrate 540c. Similarly, the bottom end of the second refracting element 510d is fixed to the surface of the second substrate 540d. The second light receiving chip 520d is disposed at the end of the second substrate 540d.

[0251] In some embodiments, a substrate is disposed on the surface of the recess 308b, a portion of which is used to support the refracting element 510c and the light receiving chip 520c in the first light receiving component 500c, and a portion of which is used to support the refracting element 510d and the light receiving chip 520d in the second light receiving component 500d.

[0252] In some embodiments, the width of the end through which the optical fiber passes in the groove 308b is relatively smaller, reserving space for the first light emitting component 400b and the second light emitting component 400c.

[0253] In some embodiments, the first substrate 540c is located on the upper surface of the circuit board 300, and the second substrate 540d is located on the upper or lower surface of the circuit board 300. The first substrate 540c and the second substrate 540d may be located on the same surface of the circuit board 300 or on different surfaces of the circuit board 300.

[0254] In some embodiments,

[0255] In some embodiments, the optical module may include a base 700b. The surface of the base 700b supports the first light emitting component 400b and the second light emitting component 400c, that is, the first light emitting component 400b and the second light emitting component 400c are located on the same base.

[0256] In some embodiments, a first boss surface 703a and a second boss surface 703b are formed on the surface of the base 700b. The first boss surface 703a and the second boss surface 703b are spaced apart. The first boss surface 703a supports a first light emitting component 400b. The second boss surface 703b supports a second light emitting component 400c. In some embodiments, the first light emitting component 400b is fixed to the first boss surface 703a by optical adhesive. The second light emitting component 400c is fixed to the second boss surface 703b by optical adhesive.

[0257] In some embodiments, a first notch 307a and a second notch 307b are formed on the surface of the circuit board 300. The first notch 307a and the second notch 307b are spaced apart and are not connected.

[0258] In some embodiments, the base 700b is embedded and connected to the circuit board 300. In the base 700b, a first boss surface 703a extends into a first notch 307a, and a second boss surface 703b extends into a second notch 307b, thereby embedding the base 700a onto the surface of the circuit board 300.

[0259] In some embodiments, the area of ​​the first notch 307a and the second notch 307b is minimized so that the first light emitting component 400b and the second light emitting component 400c can be deployed in a limited space.

[0260] In some embodiments, the first light emitting component 400b may include a first laser 401b. The second light emitting component 400c may include a second laser 401c.

[0261] In some embodiments, the first optical emitting component 400b may include a first optical modulation chip 404b and a first fiber array 405b. The second optical emitting component 400c may include a second optical modulation chip 404c and a second fiber array 405c. As described above, the first optical modulation chip 404b and the second optical modulation chip 404c have the same structural features as the optical modulation chip 404a, with the internal input waveguide and output waveguide being inclined relative to the end face.

[0262] In some embodiments, the end face of the first optical modulation chip 404b has an input optical port and multiple output optical ports. The multiple output optical ports output wavelengths of the same wavelength, meaning that the first optical modulation chip 404b can internally modulate an input beam of light without a signal to generate multiple optical signals with the same wavelength. The input optical port faces the first laser 401b to receive the beam of light without a signal output from the first laser 401b. The output optical ports face the first fiber array 405b to couple the multiple optical signals modulated by the first optical modulation chip to the first fiber array 405b and output them through the first fiber array 405b. The input and output waveguides of the first optical modulation chip 404b are not perpendicular to the end face of the first optical modulation chip 404b, thereby preventing reflection of the optical signal at the end face of the first optical modulation chip 404b. The input end face of the first fiber array 405b is beveled, thereby preventing reflection of the optical signal at the input end face of the first fiber array 405b.

[0263] In some embodiments, given the relatively long lengths of the first fiber array 405b and the second fiber array 405c, and the inclined arrangement of the first optical modulation chip 404b and the second optical modulation chip 404c relative to the surface of the circuit board 300, the first laser 401b and the first fiber array 405b can be arranged parallel to the surface of the circuit board 300, thereby reducing the hole area of ​​the first notch 307a. Similarly, the second laser 401c and the second fiber array 405c can also be arranged parallel to the surface of the circuit board 300, thereby reducing the hole area of ​​the second notch 307b.

[0264] In some embodiments, the first optical emitting component 400b may include a first modulation driving chip 406b. The first modulation driving chip 406b is located on one side of the first optical modulation chip 404b. The first modulation driving chip 406b is electrically connected to the first optical modulation chip 404b, thereby providing a modulation driving signal to the first optical modulation chip 404b to drive the first optical modulation chip 404b to perform optical signal modulation.

[0265] In some embodiments, the second optical emitting component 400c may include a second modulation driving chip 406c. The second modulation driving chip 406c is located on one side of the second optical modulation chip 404c. The second modulation driving chip 406c is electrically connected to the second optical modulation chip 404c, thereby providing a modulation driving signal to the second optical modulation chip 404c to drive the second optical modulation chip 404c to perform optical signal modulation.

[0266] In some embodiments, the first boss surface 703a and the second boss surface 703b have the same structure. Taking the first boss surface 703a as an example, its structural features are described.

[0267] In some embodiments, the first boss surface 703a may include a first support surface 713 to support the first optical modulation chip 404b.

[0268] In some embodiments, the first boss surface 703a may include a second support surface 723. The second support surface 723 includes a first cross-section 733 and a second cross-section 743. The first cross-section 733 is used to support the first laser 401b. The second cross-section 743 is used to support the first fiber array 405b.

[0269] In some embodiments, the length of the second cross surface 743 is less than that of the first cross surface 733, so that the fiber fixing part in the first fiber array 405b is suspended relative to the second cross surface 743, preventing the fiber fixing part from sticking to the optical adhesive on the surface of the second cross surface 743, thereby ensuring that the fiber fixing part continuously wraps the fiber.

[0270] In some embodiments, a certain gap is provided between the first supporting surface 713 and the second supporting surface 723 to collect optical adhesive overflowing when the first optical modulation chip 404b and the first fiber array 405b are coupled together. In some embodiments, a certain gap is provided between the first cross-section 733 and the second cross-section 743 to collect optical adhesive overflowing when the first laser 401b and the first fiber array 405b are bonded together.

[0271] In some embodiments, the gold finger 301 can be electrically connected to TIA530c and TIA530d respectively, or to the first modulation driver chip 406b and the second modulation driver chip 406c respectively, thereby eliminating the need for a signal processing chip, such as a DSP chip. This means that a linear-drive pluggable optical module (LPO) is used, reducing the power consumption of the optical module. Specifically, the LPO optical module removes the DSP / CDR chip from the optical module and integrates the relevant functions into the ASIC switching chip on the device side.

[0272] Figure 13c is an exploded view of another optical module assembly according to some embodiments. As shown in Figure 13c, in some embodiments, the base 700b simultaneously supports the first optical emitting component 400b and the second optical emitting component 400c. The base 700b has a large extension surface and a large heat dissipation area, allowing more heat to be conducted through the base 700b, thus improving heat dissipation efficiency and further facilitating the heat dissipation of the first optical emitting component 400b and the second optical emitting component 400c.

[0273] In some embodiments, the first modulation driving chip 406b is located on the surface of the circuit board 300. The first modulation driving chip 406b is located outside the first notch 307a.

[0274] In some embodiments, the second modulation driving chip 406c is located on the surface of the circuit board 300, and the second modulation driving chip 406c is located outside the second notch 307b.

[0275] In some embodiments, the surface of the base 700b is respectively provided with: a first laser 401b, a first optical modulation chip 404b, a first fiber array 405b, a first modulation driver chip 406b, a second laser 401c, a second optical modulation chip 404c, a second fiber array 405c, and a second modulation driver chip 406c. The first laser 401b, the first optical modulation chip 404b, and the first fiber array 405b are located within a first notch. The second laser 401c, the second optical modulation chip 404c, and the second fiber array 405c are located within a second notch.

[0276] Figure 13d is an assembly diagram of a base and circuit board according to some embodiments, and Figure 13e is an exploded view of another optical module assembly according to some embodiments. As shown in Figures 13d and 13e, in some embodiments, the surface of the base 700b used to support the first light emitting component 400b and the second light emitting component 400c faces the lower surface of the circuit board, i.e., the back of the circuit board, and the back of the circuit board faces the lower housing 202. The bottom surface of the base 700b faces the upper surface of the circuit board, i.e., the front of the circuit board, and the front of the circuit board faces the upper housing 201.

[0277] In some embodiments, the upper housing 201 of the optical module can form a heat dissipation channel with the cage 106 of the host computer 100, thus the upper housing 201 has a better heat dissipation effect than the lower housing 202. When the bottom surface of the base 700b faces the upper surface of the circuit board, the heat generated by the first light emitting component 400b and the second light emitting component 400c on the surface of the base 700b is conducted upward to the base 700b, and then upward to the upper housing 201 through the base 700b, and finally conducted to the outside through the heat dissipation channel. It can be seen that the heat dissipation path of the first light emitting component 400b and the second light emitting component 400c is upward and relatively smooth, and can make full use of the heat dissipation channel of the upper housing, thereby providing a better heat dissipation method.

[0278] Figure 14a is a cross-sectional view of another optical module according to some embodiments, and Figure 14b is an exploded cross-sectional view of another optical module according to some embodiments. As shown in Figures 14a and 14b, in some embodiments, the first light emitting component 400b, the second light emitting component 400c, the first light receiving component 500c, and the second light receiving component 500d are planarly deployed on the same surface of the circuit board 300. Exemplarily, they are planarly deployed on the lower surface of the circuit board 300.

[0279] In some embodiments, the first laser 401b, the first optical modulation chip 404b, and the first fiber array 405b are supported by the base 700b and embedded inside the first notch 307a. This is more conducive to heat dissipation of the first laser 401b, the first optical modulation chip 404b, and the first fiber array 405b, and to ensuring the stability of the optical path.

[0280] In some embodiments, the second laser 401c, the second optical modulation chip 404c, and the second fiber array 405c are supported by the base 700b and embedded inside the second notch 307b. This also facilitates heat dissipation for the second laser 401c, the second optical modulation chip 404c, and the second fiber array 405c, and ensures optical path stability.

[0281] In some embodiments, the location of the gold finger 301 extends along the length of the circuit board 300 as the routing direction of the high-frequency signal line. The first optical modulation chip 404b and the first modulation driver chip 406b are connected by wire bonding, and the first modulation driver chip 406b is wire bonded to the surface of the circuit board 300 along the direction toward the gold finger 301, thereby realizing high-frequency signal transmission between the first modulation driver chip 406b and the circuit board 300.

[0282] In some embodiments, a first optical modulation chip 404b is wired to the surface of the circuit board 300 along the width direction of the circuit board 300 to achieve low-frequency signal transmission between the first optical modulation chip 404b and the circuit board 300. A first modulation driving chip 406b is wired to the surface of the circuit board 300 along the width direction of the circuit board 300 to achieve low-frequency signal transmission between the first modulation driving chip 406b and the circuit board 300.

[0283] In some embodiments, the area of ​​the circuit board 300 between the first optical modulation chip 404b and the second optical modulation chip 404c is a wire bonding shared area. The first optical modulation chip 404b and the second optical modulation chip 404c are respectively wire bonded to the wire bonding shared area, thereby achieving electrical connection with the circuit board 300.

[0284] In some embodiments, the area of ​​the circuit board 300 between the first modulation driver chip 406b and the second modulation driver chip 406c is a wire bonding shared area. The first modulation driver chip 406b and the second modulation driver chip 406c are respectively wire bonded to the wire bonding shared area, thereby achieving electrical connection with the circuit board 300.

[0285] In some embodiments, from a heat dissipation perspective, the first modulation driver chip 406b can be supported by the base 700b and embedded inside the first notch 307a. The heat generated by the first modulation driver chip 406b is conducted through the base 700b, which is more conducive to the heat dissipation of the first modulation driver chip 406b. The second modulation driver chip 406c is similarly configured.

[0286] In some embodiments, the surface of the first modulation driver chip 406b is wire-connected in four directions. The surface of the first modulation driver chip 406b is electrically connected to the first optical modulation chip 404b via wire bonding, and the remaining three directions are wire-connected to the surface of the circuit board 300. For example, the first modulation driver chip 406b is wire-connected to the circuit board surface between the first notch 307a and the second notch 307b. Similarly, the second modulation driver chip 406c is wire-connected to the circuit board surface between the first notch 307a and the second notch 307b.

[0287] In some embodiments, when the first modulation driver chip 406b and the second modulation driver chip 406c are respectively embedded inside the first notch portion 307a and the second notch portion 307b, the surface of the circuit board 300 where the first modulation driver chip 406b and the second modulation driver chip 406c are located is hollowed out, and the area of ​​traceable inner layer of the circuit board 300 is reduced.

[0288] In some embodiments, when the first modulation driver chip 406b and the second modulation driver chip 406c are respectively embedded inside the first notch portion 307a and the second notch portion 307b, the area of ​​the first notch portion 307a and the second notch portion 307b used for embedding the first modulation driver chip 406b and the second modulation driver chip 406c will have a larger cutout range than the chip size of the first modulation driver chip 406b and the second modulation driver chip 406c, in order to avoid mounting interference with the first modulation driver chip 406b and the second modulation driver chip 406c. When the cutout range of the first notch portion 307a and the second notch portion 307b is expanded outward, the shared area for wire bonding between the first modulation driver chip 406b and the second modulation driver chip 406c will inevitably be reduced, making wiring impossible. In addition, when the cutout range of the second notch portion 307b is expanded outward, it may extend beyond the edge of the circuit board 300.

[0289] In some embodiments, the first modulation driver chip 406b is located on the surface of the circuit board 300, outside the first notch 307a. The second modulation driver chip 406c is located on the surface of the circuit board 300, outside the second notch 307b. The inner layer of the circuit board 300 where the first and second modulation driver chips 406b and 406c are located provides space for wiring, which is more suitable for scenarios where the space of the circuit board 300 is limited. Simultaneously, in the limited space of the circuit board 300, the cutout range of the first and second notches 307a and 307b allows for the shared wiring area between the first and second optical modulation chips 404b and 404c, and the shared wiring area between the first and second modulation driver chips 406b and 406c to meet wiring requirements.

[0290] In some embodiments, when the first light emitting component 400b, the second light emitting component 400c, the first light receiving component 500e, and the second light receiving component 500f are all deployed on the surface of the circuit board 300, the first modulation driving chip 406b can be optionally located on the surface of the circuit board 300, and the first modulation driving chip 406b is located outside the first notch 307a. Similarly, the second modulation driving chip 406c is located on the surface of the circuit board 300, and the second modulation driving chip 406c is located outside the second notch 307b.

[0291] In some embodiments, a first modulation driver chip 406b and a second modulation driver chip 406c are located on the surface of the circuit board 300. The circuit board 300 is disposed between the first modulation driver chip 406b and the base 700b. The supporting area in the base 700b corresponding to the first modulation driver chip 406b is relatively large to facilitate heat dissipation of the first modulation driver chip 406b. The heat dissipation path of the first modulation driver chip 406b is: first modulation driver chip 406b, circuit board 300, and base 700b.

[0292] In some embodiments, the first optical modulation chip 404b is located on the surface of the base 700b, and the first modulation driving chip 406b is located on the surface of the circuit board 300. The first optical modulation chip 404b is embedded in the first notch 307a so that the surface of the first optical modulation chip 404b is flush with the surface of the first modulation driving chip 406b, thereby shortening the wire bonding length between the surfaces of the first optical modulation chip 404b and the first modulation driving chip 406b, which is beneficial for high-frequency signal transmission.

[0293] Figure 14c is a cross-sectional view of another optical module according to some embodiments, and Figure 14d is an exploded cross-sectional view of another optical module according to some embodiments. As shown in Figures 14c and 14d, in some embodiments, the first light emitting component 400b, the second light emitting component 400c, the first light receiving component 500c, and the second light receiving component 500d are planarly deployed on the same surface of the circuit board 300. Exemplarily, they are planarly deployed on the lower surface of the circuit board 300.

[0294] In some embodiments, the base 700b supports the first laser 401b, the first optical modulation chip 404b, and the first fiber array 405b in the first optical emitting component 400b, as well as the second laser 401c, the second optical modulation chip 404c, and the second fiber array 405c in the second optical emitting component 400c.

[0295] In some embodiments, the first notch 307a and the second notch 307b are separated by a circuit board 300, and the first notch 307a and the second notch 307b are not connected, so as to retain the circuit board area between the first notch 307a and the second notch 307b, retain the wire bonding shared area between the first optical modulation chip 404b and the second optical modulation chip 404c, and retain the wire bonding shared area between the first modulation driving chip 406b and the second modulation driving chip 406c, so as to facilitate the deployment of wire bonding, and enable the first light emitting component 400b, the second light emitting component 400c, the first light receiving component 500c and the second light receiving component 500d to be deployed on the same surface of the circuit board 300.

[0296] In some embodiments, the first notch 307a and the second notch 307b are connected, i.e., they constitute a single notch. This is applicable to scenarios where no wire bonding is needed between the first optical modulation chip 404b and the second optical modulation chip 404c, and where no wire bonding is needed between the first modulation driver chip 406b and the second modulation driver chip 406c. For example, the wire bonding pads for low-frequency signal transmission in the first optical modulation chip 404b and the second optical modulation chip 404c are mirror images of each other, with the first optical modulation chip 404b wire bonding towards one edge of the circuit board 300, and the second optical modulation chip 404c wire bonding towards the other edge of the circuit board 300. The first modulation driver chip 406b and the second modulation driver chip 406c are designed similarly.

[0297] Figure 15 is a structural diagram of another optical module layout according to some embodiments. As shown in Figure 15, in some embodiments, a first light receiving component 500e and a second light receiving component 500f are provided on the surface of the circuit board 300. In some embodiments, the first light receiving component 500e and the second light receiving component 500f may adopt a structure of light receiving component 500b.

[0298] In some embodiments, the first light receiving component 500e may include a first lens assembly 510e. The first lens assembly 510e is projected onto the surface of the circuit board 300, and a first reflective surface is formed on the surface of the first lens assembly 510e. The first light receiving component 500e may include a first light receiving chip, which is located on the surface of the circuit board and in the reflected light path of the first reflective surface. For specific details, please refer to the structure of the light receiving component 500b.

[0299] In some embodiments, the second light receiving component 500f may include a second lens assembly 510f.

[0300] In some embodiments, the first lens assembly 510e and the second lens assembly 510f are relatively large, which may make it unsuitable to arrange them side by side along the width direction of the circuit board 300. In some embodiments, the first lens assembly 510e and the second lens assembly 510f are staggered and arranged on the same surface of the circuit board 300. This can make full use of the space on the circuit board 300 to arrange them simultaneously, while also preventing the fiber optic array connected to the first lens assembly 510e from passing through the second lens assembly 510f.

[0301] In some embodiments, the second lens assembly 510f is fastened to the surface of the circuit board 300, forming an enclosing cavity with the surface of the circuit board 300. A second reflective surface is formed on the surface of the second lens assembly 510f.

[0302] In some embodiments, the second light receiving component 500f may include a light receiving chip 520f. The light receiving chip 520f is located within the enclosed cavity formed by the second lens assembly 510f and the circuit board 300. The light receiving chip 520f is located on the surface of the circuit board 300 and is covered by the second lens assembly 510f. The light receiving chip 520f is located on the reflected light path of the second reflecting surface.

[0303] In some embodiments, the second light receiving component 500f may include TIA 530f. TIA 530f is located on one side of the light receiving chip 520f. TIA 530f is located within the enclosed cavity formed by the second lens assembly 510f and the circuit board 300. TIA 530f is located on the surface of the circuit board 300 and is covered by the second lens assembly 510f.

[0304] In some embodiments, a reflective surface 511f is formed on the surface of the second lens assembly 510f. The reflective surface 511f is formed above the light receiving chip 520f. The reflective surface 511f allows the light path to be deflected along the surface of the circuit board 300 towards the surface of the light receiving chip 520f, thereby coupling the light signal into the light receiving chip.

[0305] In some embodiments, the circuit board 300 has a relatively large coefficient of thermal expansion, resulting in relatively poor surface optical path stability. A groove 309 is formed on the surface of the circuit board 300, and a substrate 521 is disposed on the surface of the groove 309. A light receiver chip 520f is mounted on the surface of the substrate 521. The coefficient of thermal expansion of the substrate 521 is relatively smaller than that of the circuit board 300, thereby ensuring the stability of the optical path transmission of the light receiver chip 520f.

[0306] In some embodiments, the thickness of the substrate 521 makes the surfaces of the light receiving chip 520f and TIA530f flush, thereby shortening the wire bonding length between the substrate 521 and TIA530f.

[0307] In some embodiments, the first optical receiving component 500e may have the same structure as the second optical receiving component 500f.

[0308] Figure 16 is a side view of another optical module structure according to some embodiments. As shown in Figure 16, in some embodiments, the first light emitting component 400d and the second light emitting component 400e are disposed facing one surface of the circuit board, and the first light receiving component 500g and the second light receiving component 500h are disposed facing the other surface of the circuit board. This vertical arrangement fully utilizes the encapsulation space on the upper and lower surfaces of the circuit board 300.

[0309] In some embodiments, the first light emitting component 400d and the second light emitting component 400e are disposed facing the upper surface of the circuit board, and the first light receiving component 500g and the second light receiving component 500h are disposed facing the lower surface of the circuit board.

[0310] In some embodiments, the first light emitting component 400d and the second light emitting component 400e are located in the cavity formed by the circuit board 300 and the upper housing 201.

[0311] In some embodiments, the first light receiving component 500g and the second light receiving component 500h are located in the cavity formed by the circuit board 300 and the lower housing 202.

[0312] In some embodiments, a protective cover 400f is applied to the surfaces of the first light emitting component 400d and the second light emitting component 400e to protect them.

[0313] Figure 17 is a cross-sectional view of another optical module according to some embodiments. As shown in Figure 17, in some embodiments, the optical module may include a base 800. The base 800 is embedded inside the circuit board 300 and fixed to the circuit board 300.

[0314] In some embodiments, a surface of the base 800 faces the upper housing 201, and this surface is used to support the first light emitting component 400d and the second light emitting component 400e. Exemplarily, this surface is the top surface of the base 800.

[0315] In some embodiments, another surface of the base 800 faces the lower housing 202, and this surface is used to support the first light receiving component 500g and the second light receiving component 500h. Exemplarily, this surface is the bottom surface of the base 800.

[0316] Figure 18 is a diagram of a circuit board upper surface structure according to some embodiments, and Figure 19 is a diagram of a circuit board upper surface structure according to some embodiments. As shown in Figures 18 and 19, in some embodiments, a first light emitting component 400d and a second light emitting component 400e are disposed facing the upper surface of the circuit board 300. A protective cover 400f is coated on the surfaces of the first light emitting component 400d and the second light emitting component 400e.

[0317] In some embodiments, the first light emitting component 400d and the second light emitting component 400e are located on the surface of the base 800 facing the upper housing 201.

[0318] In some embodiments, a first signal processing chip 304a is provided on one side of the first optical emitting component 400d, and a second signal processing chip 304b is provided on one side of the second optical emitting component 400e. This prevents high-frequency signal crosstalk between the first optical emitting component 400d and the second optical emitting component 400e.

[0319] Figure 20 is a diagram of the lower surface structure of a circuit board according to some embodiments. As shown in Figure 20, in some embodiments, a first light receiving component 500g and a second light receiving component 500h are disposed facing the lower surface of the circuit board 300. A cover plate 305a is coated on the surfaces of the first light receiving component 500g and the second light receiving component 500h.

[0320] In some embodiments, the first light receiving component 500g and the second light receiving component 500h are located on the surface of the base 800 facing the lower housing 202.

[0321] Figure 21 is a diagram of the upper and lower surface structure of a circuit board according to some embodiments. As shown in Figure 21, in some embodiments, the first light receiving component 500i and the second light receiving component 500j are disposed facing the lower surface of the circuit board 300.

[0322] In some embodiments, the first light emitting component 400d and the second light emitting component 400e are located within the cavity formed by the circuit board 300 and the upper housing 201. The first light receiving component 500i and the second light receiving component 500j are located within the cavity formed by the circuit board 300 and the lower housing 201.

[0323] In some embodiments, the first light emitting component 400d and the second light emitting component 400e are located on the surface of the base 800 facing the upper housing 201. The first light receiving component 500g and the second light receiving component 500h are located on the surface of the base 800 facing the lower housing 202. Exemplarily, the first light receiving component 500g and the second light receiving component 500h employ a micro-optical packaging scheme.

[0324] In some embodiments, the first light emitting component 400d and the second light emitting component 400e are located on the surface of the base 800 facing the upper housing 201. The first light receiving component 500i and the second light receiving component 500j are located on the lower surface of the circuit board 300. Exemplarily, the first light receiving component 500i and the second light receiving component 500j are packaged using a COB (Chip-on-Board) packaging scheme.

[0325] In some embodiments, the optical fiber strips in the first optical receiving component 500i and the second optical receiving component 500j pass along the surface of the base 800 toward the lower housing 202.

[0326] Figure 22 is an exploded view of another optical module according to some embodiments. As shown in Figure 22, in some embodiments, a first notch 307c and a second notch 307d are formed on the surface of the circuit board 300. A first signal processing chip 304a is provided on one side of the first notch 307c, and a second signal processing chip 304b is provided on one side of the second notch 307d.

[0327] In some embodiments, the first notch 307c and the second notch 307d are independent of each other and are not connected, so as to retain the wiring space on the surface of the circuit board 300 between the first notch 307c and the second notch 307d.

[0328] In some embodiments, the top surface of the base 800 is formed with a first boss surface 810 and a second boss surface 820. The first boss surface 810 extends into the first notch portion 307c, and the second boss surface 820 extends into the second notch portion 307d, thereby embedding the base 800 onto the circuit board 300.

[0329] In some embodiments, the first boss surface 810 supports the first light emitting component 400d, and the second boss surface 820 supports the second light emitting component 400e. The first boss surface 810 extends into the first notch 307c, thereby positioning the first light emitting component 400d towards the upper surface of the circuit board 300. The second boss surface 820 extends into the second notch 307d, thereby positioning the second light emitting component 400e towards the upper surface of the circuit board 300. The base 800 has excellent heat dissipation characteristics, and the base 800 can conduct heat generated by the first light emitting component 400d and the second light emitting component 400e.

[0330] Figure 23a is a diagram of an assembly structure on the upper surface of a circuit board according to some embodiments, and Figure 23b is an exploded view of an assembly of a base and a light emitting component according to some embodiments. As shown in Figures 23a and 23b, in some embodiments, a first light emitting component 400d is embedded in a first notch 307c by a base 800, and a second light emitting component 400e is embedded in a second notch 307d by a base 800.

[0331] In some embodiments, the first optical emitting component 400d may include a first laser 401d. The first optical emitting component 400d may include a first lens 402d. The first optical emitting component 400d may include a first isolator 403d. The first optical emitting component 400d may include a first optical modulation chip 404d. The first optical emitting component 400d may include a first fiber array 405d. The first optical emitting component 400d may include a first modulation driver chip 406d. The optical path principle can be referred to the first optical emitting component 400b.

[0332] In some embodiments, the second optical emitting component 400e may include a second laser 401e. The second optical emitting component 400e may include a second lens 402e. The second optical emitting component 400e may include a second isolator 403e. The second optical emitting component 400e may include a second optical modulation chip 404e. The second optical emitting component 400e may include a second fiber array 405e. The second optical emitting component 400e may include a second modulation driver chip 406e. The optical path principle can be referred to that of the first optical emitting component 400b.

[0333] In some embodiments, the first isolator 403d is disposed on one side of the light inlet of the first optical modulation chip 404d, and the light output from the first isolator 403d is incident on the first optical modulation chip 404d through the air.

[0334] In some embodiments, an optical refractive index matching adhesive is provided between the end face of the first optical fiber array 405d and the first optical modulation chip 404d, and the optical signal generated by the modulation of the first optical modulation chip 404d is coupled into the first optical fiber array 405d through the optical refractive index matching adhesive.

[0335] In some embodiments, the surface of the first modulation driver chip 406d is wire-connected in four directions. The surface of the first modulation driver chip 406d is wire-connected to the first optical modulation chip 404d, and the other three directions are wire-connected to the circuit board 300. For example, the wires are wire-connected to the surface of the circuit board 300 between the first notch 307c and the second notch 307d. Similarly, the second modulation driver chip 406e is wire-connected to the surface of the circuit board 300 between the first notch 307c and the second notch 307d. Therefore, the first light emitting component 400d is embedded in the first notch 307c, and the second light emitting component 400e is embedded in the second notch 307d.

[0336] In some embodiments, the second boss surface 820 may include a first support surface 821. The first support surface 821 supports the second laser 401e, the second lens 402e, the second isolator 403e, and the second fiber array 405e.

[0337] In some embodiments, the second boss surface 820 may include a second support surface 822. The second support surface 822 supports the second optical modulation chip 404e.

[0338] In some embodiments, the second boss surface 820 may include a third support surface 823. The third support surface 823 supports the second modulation driver chip 406e.

[0339] Figure 23c is a structural diagram of a first optical emitting component according to some embodiments. As shown in Figure 23c, in some embodiments, the first optical modulation chip 404d is coupled to the end face of the first optical fiber array 405d.

[0340] In some embodiments, the input and output optical faces of the first optical modulation chip 404d include an input optical port 414d and an output optical port 424d. The input optical port 414d and the output optical port 424d are located on the same face. The input optical port 414d faces the first isolator 403d. The output optical port 424d faces the first fiber array 405d.

[0341] In some embodiments, the light-incident waveguide corresponding to the light-incident port 414d is arranged perpendicularly to the light-incident end face of the first optical modulation chip 404d. The light-exit waveguide corresponding to the light-exit port 424d is arranged at an angle relative to the light-exit end face of the first optical modulation chip 404d.

[0342] In some embodiments, the input and output light end faces of the first optical modulation chip 404d are arranged perpendicularly to the long side of the circuit board 300.

[0343] In some embodiments, the first laser 401d, the first lens 402d, and the first isolator 403d are arranged perpendicularly to the light-incident end face of the first optical modulation chip 404d, so that the light-out axis of the first laser 401d is aligned with the light-incident axis of the first optical modulation chip 404d, thereby improving the coupling efficiency of the light source emitted by the first laser 401d to the light-incident waveguide.

[0344] In some embodiments, the first fiber array 405d is tilted relative to the light-emitting end face of the first optical modulation chip 404d, so that the input optical axis of the first fiber array 405d is aligned with the output optical axis of the first optical modulation chip 404d, thereby improving the coupling efficiency between the first optical modulation chip 404d and the first laser 401d.

[0345] In some embodiments, the light-incident end face of the first fiber array 405d is beveled, and the light-incident end face of the internal fiber is also beveled, to prevent the optical signal incident on the first fiber array 405d from returning to the first optical modulation chip 404d, thereby increasing return loss and allowing more light to be transmitted in the fiber. For example, the light-incident end face of the fiber array 405a is polished into an 8° bevel.

[0346] In some embodiments, the first fiber array 405d is relatively long and is inclined relative to the light-emitting end face of the first optical modulation chip 404d. Therefore, the area of ​​the hole in the first notch 307c is larger to accommodate the inclined placement of the first fiber array 405d. Similarly, the area of ​​the hole in the second notch 307d is larger to accommodate the inclined placement of the second fiber array 405e. This results in a reduction of usable space on the upper surface of the circuit board 300, making it impossible to deploy the first optical receiving component 500g and the second optical receiving component 500h on the upper surface of the circuit board 300.

[0347] Figure 24 is an assembly diagram of the top and bottom surface structure of a base according to some embodiments. As shown in Figure 24, in some embodiments, the circuit board 300 is supported at both ends of the top surface of the base 800, and the circuit board 300 is embedded in the base 800.

[0348] In some embodiments, the second boss surface 820 is used to support the second light emitting component 400e. The second boss surface 820 extends into the second notch 307d, thereby positioning the second light emitting component 400e toward the upper surface of the circuit board 300.

[0349] In some embodiments, since the first light receiving component 500g and the second light receiving component 500h are located in the cavity formed by the circuit board 300 and the lower housing 201, the area of ​​the holes for the first notch 307c and the second notch 307d on the upper surface of the circuit board 300 is relatively large. This allows the first modulation driving chip 406d to be disposed on the surface of the base 800 and embedded in the first notch 307c, and the second modulation driving chip 406e to be disposed on the surface of the base 800 and embedded in the second notch 307d, which is beneficial for the heat dissipation of the first modulation driving chip 406d and the second modulation driving chip 406e.

[0350] In some embodiments, the second fiber array 405e is located on the surface of the first support surface 821. The second optical modulation chip 404e is located on the surface of the second support surface 822. The second modulation driving chip 406e is located on the surface of the third support surface 823.

[0351] In some embodiments, the height of the third support surface 823 is such that the surface of the second modulation driver chip 406e is flush with or as close as possible to the surface of the circuit board 300, in order to shorten the bonding length between the second modulation driver chip 406e and the surface of the circuit board 300. The second modulation driver chip 406e is electrically connected to the second signal processing chip through traces on the surface of the circuit board 300.

[0352] In some embodiments, the height difference between the third support surface 823 and the second support surface 822 causes the optical axis of the second modulation driving chip 406e to be aligned with that of the second optical modulation chip 404e. The height difference between the second support surface 822 and the first support surface 821 causes the optical axis of the second optical modulation chip 404e to be aligned with that of the second fiber array 405e.

[0353] In some embodiments, the second fiber array 405e is adhered to the surface of the first support surface 821 with adhesive. The second optical modulation chip 404e is adhered to the surface of the second support surface 822 with adhesive. A groove 824 is formed between the first support surface 821 and the second support surface 822 to collect adhesive overflowing from the surfaces of the first support surface 821 and the second support surface 822, as well as adhesive overflowing when the second fiber array 405e and the end face of the second optical modulation chip 404e are coupled.

[0354] In some embodiments, the top surface of the base 800 is used to support the first light emitting component 400d and the second light emitting component 400e. The bottom surface of the base 800 is used to support the first refracting element in the first light receiving component 500g and the second refracting element in the second light receiving component 500h. By fully utilizing the top and bottom surfaces of the base 800, a three-dimensional and integrated deployment can be achieved, which is more conducive to wiring and reduces the space occupied on the circuit board.

[0355] In some embodiments, a first light emitting component may be disposed on the top surface of the base 800. A first light receiving component may be disposed on the bottom surface of the base 800. For a specific structure, refer to the top surface of the base 800 which supports the first light emitting component and the second light emitting component. The bottom surface of the base 800 supports the first refractive element in the first light receiving component and also supports the second refractive element in the second light receiving component. The packaging structures can be mutually referenced and will not be described in detail further.

[0356] Figure 25 is a diagram of the assembly structure of the bottom surface of a base according to some embodiments. As shown in Figure 25, in some embodiments, the bottom surface of the base 800 carries optical devices, so that both the top and bottom surfaces of the base 800 carry optical devices, making full use of the base 800.

[0357] In some embodiments, the first light receiving component 500g may include a first refractive element 510g. The first light receiving component 500g may include a first converging lens 520g. The first light receiving component 500g may include a first light receiving chip array 530g. The first light receiving component 500g may include a first TIA 540g.

[0358] In some embodiments, the second light receiving component 500h may include a second refractive element 510h. The second light receiving component 500g may include a second converging lens 520h. The second light receiving component 500h may include a second light receiving chip array 530h. The second light receiving component 500h may include a second TIA 540h.

[0359] In some embodiments, the first refracting element 510g and the second refracting element 510h are located on the bottom surface of the base 800. The first TIA 540g and the second TIA 540h are located on the surface of the circuit board 300.

[0360] In some embodiments, as communication speeds increase, the overall power consumption of the optical module increases, leading to higher heat dissipation requirements. Currently, air cooling and liquid cooling are used for heat dissipation. Liquid cooling methods include immersion cooling and spray cooling, depending on the heat exchange mechanism. Immersion and spray liquid cooling systems achieve heat exchange through direct contact between the cooling medium and the heat dissipation device. In an immersion liquid cooling system, the host computer and optical module are directly immersed in the cooling medium. The cooling medium absorbs the heat generated by the heat dissipation device and transfers the heat to the water in the heat exchange process. The heat is then transferred to the heat dissipation device through water circulation. For example, the cooling medium is a refrigerant, such as a fluorinated liquid.

[0361] In some embodiments, the surfaces of the first light receiving component 500g and the second light receiving component 500h are covered with a cover plate 305a.

[0362] In some embodiments, the cover plate 305a may extend along the surfaces of the first light receiving component 500g and the second light receiving component 500h and bend toward the surface of the circuit board 300 to cover and wrap the first light receiving component 500g and the second light receiving component 500h, preventing the cooling medium from entering the first light receiving component 500g and the second light receiving component 500h and affecting their optical path.

[0363] In some embodiments, when liquid cooling is used to dissipate heat from the optical module, the cooling medium used in the liquid cooling may affect the optical path. To address this, a protective cover 400f is applied to the surfaces of the first optical emitting component 400d and the second optical emitting component 400e, thereby enclosing the first optical emitting component 400d and the second optical emitting component 400e and preventing the cooling medium from entering their interior and affecting their optical path.

[0364] In some embodiments, to protect the first light receiving component 500g and the second light receiving component 500h, the base 800 includes a retaining portion 830. A cover plate 305a is provided above the first light receiving component 500g and the second light receiving component 500h, with one end of the cover plate 305a disposed on the surface of the base 800 body and the other end disposed on the surface of the retaining portion 830. The first light receiving component 500g and the second light receiving component 500h are located within the enclosed cavity formed by the cover plate 305a and the retaining portion 830, thereby preventing the cooling medium from entering the interior of the first light receiving component and the second light receiving component during liquid cooling heat dissipation and affecting their optical path.

[0365] In some embodiments, the enclosure portion 830 rests on the surface of the circuit board 300 and exposes the surface of the circuit board 300 enclosed by the enclosure portion 830, thereby placing the first light receiving chip array and the second light receiving chip array on the surface of the circuit board enclosed by the enclosure portion 380.

[0366] In some embodiments, a barrier portion 830 is formed on one side of the first light receiving component 500g and the second light receiving component 500h. The barrier portion 830 may be a C-shaped frame. The barrier portion 830 encloses the first light receiving component 500g and the second light receiving component 500h to support the cover plate 305a, such that the cover plate 305a covers the surfaces of the first light receiving component 500g and the second light receiving component 500h, preventing the cooling medium from entering the first light receiving component 500g and the second light receiving component 500h and affecting their optical path.

[0367] In some embodiments, the cover plate 305a is disposed on the bottom surface of the main body structure of the base 800 and the bottom surface of the enclosure portion 830, thereby covering the surfaces of the first light receiving component 500g and the second light receiving component 500h.

[0368] In some embodiments, one end of the cover plate 305a covers the bottom surface of the main body structure of the base 800, and the other end covers the bottom surface of the enclosure portion 830, thereby shielding the first light receiving component 500g and the second light receiving component 500h. The first light receiving component 500g and the second light receiving component 500h are located in the enclosed cavity formed by the cover plate 305a and the enclosure portion 830, thereby preventing the cooling medium from entering the first light receiving component 500g and the second light receiving component 500h and affecting their optical path.

[0369] In some embodiments, an embedding groove 850 is formed along the bottom surface of the base 800 body structure and the bottom surface of the enclosure portion 830 to embed the cover plate 305a into the surface of the base 800 body structure and the surface of the enclosure portion 830, thereby fixing the cover plate 305a to the bottom surface of the base 800.

[0370] In some embodiments, the shaped groove 850 is adapted to the cover plate 305a to fix the cover plate 305a onto the base 800. Figure 26a is an assembly structure diagram of a first refracting element and a first converging lens according to some embodiments, and Figure 26b is an exploded view of an assembly of a first refracting element and a first converging lens according to some embodiments. As shown in Figures 26a and 26b, in some embodiments, the first refracting element 510g and the first converging lens 520g are fixedly connected.

[0371] In some embodiments, the first refracting element 510g may include a first optical fiber support portion 511g and a second optical fiber support portion 512g. An optical fiber 513g is held between the first optical fiber support portion 511g and the second optical fiber support portion 512g. The first optical fiber support portion 511g is thicker to facilitate clamping and coupling of the first refracting element 510g.

[0372] In some embodiments, a reflective end face 514g is formed at the end of the optical fiber 513g, and the reflective end face 514g is located above the first optical receiver chip array 530g. The reflective end face 514g is used to reflect and change the transmission direction of the optical signal transmitted in the optical fiber 513g, so as to reflect the optical signal transmitted in the optical fiber 513g to the first optical receiver chip array 530g. Exemplarily, the reflective end face 514g is an inclined surface, and the received optical signal transmitted in the optical fiber 513g undergoes total internal reflection at the reflective end face 514g. Exemplarily, the inclination angle of the reflective end face 514g is 46-50°, such as 48°.

[0373] In some embodiments, a protective surface 516g is formed on the end face of the first optical fiber support portion 511g. The protective surface 516g surrounds the side of the reflective end face 514g to protect the reflective end face 514g. Exemplarily, the protective surface 516g is an inclined surface with an inclination angle of 46-50°, such as 48°.

[0374] In some embodiments, the reflective end face 514g and the protective end face 516g are formed by grinding and polishing. The reflective end face 514g is formed by grinding the end face of the optical fiber 513g to a certain tilt angle. The optical fiber 513g is cylindrical, and the cross-section of the reflective end face 514g after grinding is elliptical, so the bottom of the optical fiber 513g is exposed relative to the first optical fiber support portion 511g. The optical fiber 513g is soft, and the optical fiber segment exposed relative to the first optical fiber support portion 511g may break when unprotected.

[0375] In some embodiments, the first refracting element 510g may include an optical fiber fixing portion 515g. The optical fiber fixing portion 515g is located below the first optical fiber support portion 511g and within the space enclosed by the end of the second optical fiber support portion 512g. The optical fiber fixing portion 515g protects and cushions the optical fiber 513g. The optical fiber fixing portion 515g may be made of soft rubber to protect and cushion the optical fiber 513g.

[0376] In some embodiments, the reflective end face 514g and the first light receiving chip array 530g are separated by a preset distance, such as a first preset value, to ensure that the light signal reflected from the reflective end face 514g falls within the photosensitive surface range of the light receiving chip in the first light receiving chip array 530g. For example, the first preset value is relatively small, such as 0.02 mm.

[0377] In some embodiments, since the optical devices are supported on both the top and bottom surfaces of the base 800, the base 800 is required to have strong support to ensure the stability of the optical path.

[0378] In some embodiments, the first converging lens 520g is fixed to the surface of the second optical fiber support 512g facing the first optical receiving chip array 530g. The second optical fiber support 512g extends below the reflective end face 514g, so that the first converging lens 520g is located between the reflective end face 514g and the first optical receiving chip array 530g, with the light-emitting surface of the first converging lens 520g facing the first optical receiving chip array 530g. The first converging lens 520g converges the light signal reflected from the reflective end face 514g, so that the light signal reflected from the reflective end face 514g falls within the photosensitive surface range of the optical receiving chip in the first optical receiving chip array 530g. This allows the reflective end face 514g to be moved away from the surface of the circuit board 300, increasing the distance between the reflective end face 514g and the first optical receiving chip array 530g, thereby increasing the thickness between the top and bottom surfaces of the base 800, increasing the support of the base 800 for the optical device, and ensuring optical path stability.

[0379] In some embodiments, the first converging lens 520g converges the light signal reflected from the reflective end face 514g to compensate for the optical path difference between the reflective end face 514g and the first light receiving chip array 530g caused by increasing the thickness of the base 800, thereby making the light signal reflected from the reflective end face 514g fall within the photosensitive surface range of the light receiving chip in the first light receiving chip array 530g.

[0380] In some embodiments, the thickness of the base 800 can ensure that the first converging lens 520g is disposed between the reflective end face 514g and the first light receiving chip array 530g, and can ensure the focal length from the first converging lens 520g to the first light receiving chip array 530g.

[0381] In some embodiments, the second fiber support 512g extends below the reflective end face 514g to cover the reflective end face 514g and prevent fiber breakage.

[0382] In some embodiments, the protective surface 516g, the reflective end face 514g, and the end face of the second optical fiber support portion 512g have the same inclination. The protective surface 516g and the second optical fiber support portion 512g are adapted to the inclination of the reflective end face 514g.

[0383] In some embodiments, the first optical receiving chip array 530g may be located on the surface of the first TIA 540g. This means the first optical receiving chip array 530g is at a certain distance from the surface of the circuit board 300, allowing the reflective end face 514g to be further away from the surface of the circuit board 300. This further increases the distance between the reflective end face 514g and the first optical receiving chip array 530g, thereby increasing the thickness between the top and bottom surfaces of the base 800 and increasing the support of the base 800 for the optical device. Simultaneously, it can shorten the distance between the first optical receiving chip array 530g and the first converging lens 520g, increasing coupling efficiency. This also improves the high-frequency signal transmission performance between the first optical receiving chip array 530g and the first TIA 540g.

[0384] Figure 27 is a structural diagram of the bottom surface assembly of a base according to some embodiments, Figure 28 is a cross-sectional view of the bottom surface assembly of a base according to some embodiments, and Figure 29 is a structural diagram of the bottom surface of a base according to some embodiments. As shown in Figures 27-29, in some embodiments, the bottom surface of the base 800 carries a first refracting element 510g and a second refracting element 510h.

[0385] In some embodiments, the surface of the second optical fiber support 512g is recessed into the surface through which the optical fiber 513g passes, thereby providing bending space for the optical fiber 513g and preventing fiber breakage.

[0386] In some embodiments, the optical fiber 513g passes through the interior of the optical fiber fixing portion 515g. The second optical fiber support portion 512g is fixed to the surface of the base 800 by adhesive.

[0387] In some embodiments, a groove 840 is formed on one side of the surface where the second optical fiber support 512g is located. The optical fiber fixing part 515g extends from the groove 840. The groove 840 allows the surface where the optical fiber fixing part 515g is located to be lower than the surface where the second optical fiber support 512g is located, thereby preventing the optical fiber fixing part 515g from adhering to the surface where the second optical fiber support 512g is located and maintaining the wrapping force of the optical fiber fixing part 515g on the optical fiber 513g.

[0388] In some embodiments, a spacer 860 is formed on the bottom surface of the base 800. The spacer 860 may be located in the middle and divide the surface through which the optical fiber 513g passes into a first channel 870 and a second channel 880, so as to provide shuttle channels for the optical fiber ribbons of the first optical receiving component 500g and the second optical receiving component 500h respectively, and avoid fiber entanglement.

[0389] Figure 30 is a cross-sectional view of another optical module according to some embodiments, Figure 31 is a cross-sectional view of another optical module according to some embodiments, and Figure 32 is a partial cross-sectional view of another optical module according to some embodiments. As shown in Figures 30-32, in some embodiments, the first light emitting component 400d and the second light emitting component 400e are located on the surface of the base 800 facing the upper housing 201. The first light receiving component 500i and the second light receiving component 500j are located on the lower surface of the circuit board 300.

[0390] In some embodiments, the first light receiving component 500i may include a first lens assembly 510i. The first lens assembly 510i is located on one side of the base 800. The first lens assembly 510i is snapped onto the lower surface of the circuit board 300.

[0391] In some embodiments, the second light receiving component 500j may include a second lens assembly 510j. The second lens assembly 510j is located on one side of the base 800. The second lens assembly 510j is snapped onto the lower surface of the circuit board 300.

[0392] In some embodiments, the optical fiber strips in the first optical receiving component 500i and the second optical receiving component 500j pass along the surface of the base 800 toward the lower housing 202.

[0393] In some embodiments, the first optical receiving component 500i and the second optical receiving component 500j may have the same structure. In some embodiments, both may have the same structure as optical receiving component 500b. In some embodiments, both may have the same structure as the second optical receiving component 500f. Further details will not be provided.

[0394] In some embodiments, the top surface of the base 800 is used to support the first light emitting component 400d and the second light emitting component 400e. The first light receiving component 500i and the second light receiving component 500j are located on the lower surface of the circuit board, realizing a three-dimensional and integrated deployment, which is more conducive to wiring and reduces the space occupied on the circuit board.

[0395] In some embodiments, a first light emitting component 400d may also be disposed on the top surface of the base 800. A first light receiving component 500i is located on the lower surface of the circuit board. For a specific structure, refer to the top surface of the base 800 used to support the first light emitting component 400d and the second light emitting component 400e. The first light receiving component 500i and the second light receiving component 500j are located on the lower surface of the circuit board. The packaging structures can be mutually referenced and will not be described in detail here.

[0396] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

An optical module, comprising: The circuit board has a first notch and a second notch; The base has a first light emitting component and a second light emitting component respectively on its surface; The first light-emitting component includes: A first laser is disposed on the surface of the base and located within the first notch, and the first laser is configured to output light that does not carry a signal. A first optical modulation chip, located within the first notch, is configured to modulate the light that does not carry a signal to generate an optical signal; A first optical fiber array is located within the first notch and is coupled to the end face of the first optical modulation chip to transmit the optical signal. The first modulation driver chip is electrically connected to the first optical modulation chip and is wire-connected to the circuit board surface between the first notch and the second notch. The second light emitting component includes: A second laser is disposed on the surface of the base and located within the second notch. The second laser is configured to output light that does not carry a signal. The second optical modulation chip, located within the second notch, is configured to modulate the signal-free light to generate an optical signal; The second fiber array is located inside the second notch and is coupled to the end face of the second optical modulation chip to transmit the optical signal. The second modulation driver chip is electrically connected to the second optical modulation chip and is wire-connected to the circuit board surface between the first notch and the second notch. A first optical receiving component, disposed on one side of the circuit board, includes: A first refracting element is disposed on one side of the circuit board, and a first reflective end face is formed on the end face of the first refracting element; The first optical receiving chip is disposed on one side surface of the circuit board and located in the reflected light path of the first reflective end face; A second optical receiving component, disposed on one side of the circuit board, includes: A second refracting element is disposed on one side of the circuit board, and a second reflective end face is formed on the end face of the second refracting element; The second optical receiving chip is disposed on one side surface of the circuit board and located in the reflected light path of the second reflective end face; Alternatively, the first optical receiving component includes: A first lens assembly is projected onto the surface of the circuit board, and a first reflective surface is formed on the surface. The first optical receiving chip is located on the surface of the circuit board and on the reflected light path of the first reflective surface; A second optical receiving component, disposed on the surface of the circuit board, includes: The second lens assembly covers the surface of the circuit board, and a second reflective surface is formed on the surface. The second light receiving chip is located on the surface of the circuit board and in the reflected light path of the second reflective surface. The optical module according to claim 1, wherein, The circuit board surface is provided with a first substrate and a second substrate, the first refracting element is disposed on the surface of the first substrate, and the thermal expansion coefficient of the first substrate is smaller than the thermal expansion coefficient of the circuit board. The first optical receiving chip is disposed on the surface of the first substrate; The second refracting element is disposed on the surface of the second substrate, and the coefficient of thermal expansion of the second substrate is smaller than that of the circuit board; The second optical receiving chip is disposed on the surface of the second substrate. The optical module according to claim 2, wherein, A first lens and a first isolator are provided between the first laser and the first optical modulation chip; the first isolator is located on one side of the light inlet of the first optical modulation chip, and the light output from the first isolator passes through the air and enters the first optical modulation chip. An optical refractive index matching adhesive is provided between the first optical fiber array and the end face of the first optical modulation chip. The optical signal generated by the modulation of the first optical modulation chip is coupled into the first optical fiber array through the optical refractive index matching adhesive. The optical module according to claim 2, wherein, The base surface has a first protrusion and a second protrusion; the first protrusion is embedded in the first notch to support the first light emitting component. The second protrusion is embedded in the second notch to support the second light emitting component; The first fiber array includes: First support section; The second support part holds multiple optical fibers between itself and the first support part; The fixing part is connected to the second support part; The first boss surface includes: The first supporting surface is used to support the first optical modulation chip; The second support surface includes a first cross surface and a second cross surface. The first cross surface is used to support the first laser, and the second cross surface is used to support the first fiber array. The optical module according to claim 4, wherein, The first optical modulation chip is fixed to the first support surface with adhesive, the first laser is fixed to the first cross surface with adhesive, and the first fiber array is fixed to the second cross surface with adhesive. The length of the second cross-section is less than that of the first cross-section, so that the fixing part is suspended relative to the second cross-section; There is a certain gap between the first supporting surface and the second supporting surface to collect the adhesive; There is a certain gap between the first cross surface and the second cross surface to collect the adhesive. The optical module according to claim 2, wherein, The first optical modulation chip has an input light port and multiple output light ports on its end face, and the multiple output light ports output the same wavelength. The light inlet is oriented toward the first laser to receive a beam of light that does not carry a signal output from the first laser; The optical output port faces the first optical fiber array so as to couple the multiple optical signals generated by the first optical modulation chip to the first optical fiber array; The input waveguide and the output waveguide of the first optical modulation chip are not perpendicular to the end face of the first optical modulation chip. The light-incident end face of the first fiber array is set as an inclined surface, and the inclined surface is coupled to the end face of the first optical modulation chip. The optical module according to claim 6, wherein, The first notch includes: The first through-hole portion is used to embed the first laser and the first fiber array; The second through-hole portion is connected to one end of the first through-hole portion. The second through-hole portion is used to embed the first optical modulation chip. The second through-hole portion is inclined relative to the first through-hole portion. The third through-hole is connected to the other end of the first through-hole, and the size of the third through-hole is smaller than that of the first through-hole; the first fiber array passes through the third through-hole. The optical module according to claim 2, wherein, The first substrate surface includes a concave surface and a protrusion, the concave surface being used to support the first refracting element, and the protrusion being used to support the first light receiving chip. The optical module according to claim 2, wherein, The first optical receiving component includes a first TIA, which is located on the surface of the circuit board; The circuit board surface has a groove, and the first substrate and the second substrate are respectively disposed in the groove so that the first light receiving chip is flush with the first TIA surface. The optical module according to claim 2, wherein, The first substrate and the second substrate can be connected together. The optical module according to claim 1, wherein, The first light receiving component and the second light receiving component may be located on different surfaces of the circuit board. The optical module according to claim 1 is characterized in that, The first lens assembly and the first light receiving chip are respectively located on the upper surface of the circuit board; The second lens assembly and the second light receiving chip are respectively located on the upper surface of the circuit board, or the second lens assembly and the second light receiving chip are respectively located on the lower surface of the circuit board. According to claim 1, the optical module wherein, The first refracting element is disposed on the bottom surface of the base; The first optical receiver chip is located on the lower surface of the circuit board; The second refracting element is disposed on the bottom surface of the base; The second optical receiver chip is located on the lower surface of the circuit board. The optical module according to claim 13, wherein, The surfaces of the first light emitting component and the second light emitting component are covered with protective covers; The base includes a enclosure; The enclosure is placed on the surface of the circuit board and exposes the surface of the circuit board enclosed by the enclosure, so that the first light receiving chip and the second light receiving chip are located on the surface of the circuit board enclosed by the enclosure. A cover plate is provided above the first light receiving component and the second light receiving component. One end of the cover plate is provided on the surface of the base body, and the other end is provided on the surface of the enclosure. The optical module according to claim 13, wherein, The first refracting element includes a first optical fiber support and a second optical fiber support, with an optical fiber sandwiched between the first optical fiber support and the second optical fiber support, and a reflective end face formed at the end of the optical fiber; The first optical receiving component includes: The first converging lens is attached to the second optical fiber support, which extends below the reflective end face, so that the first converging lens is fixed on the second optical fiber support and is located between the reflective end face and the first optical receiving chip. The optical module according to claim 13, wherein, The input waveguide of the first optical modulation chip is arranged perpendicular to the end face of the first optical modulation chip, and the output waveguide is not arranged perpendicular to the end face of the first optical modulation chip. The first laser is positioned perpendicular to the light input and output end face of the first optical modulation chip, so as to be consistent with the extension direction of the light input waveguide of the first optical modulation chip. The first fiber array is tilted relative to the input and output light end faces of the first optical modulation chip so as to be consistent with the extension direction of the output waveguide of the first optical modulation chip. The optical module according to claim 15, wherein, The first refracting element includes an optical fiber fixing part, which is connected to the second optical fiber support part, and the optical fiber passes through the interior of the optical fiber fixing part; A groove is formed on one side of the surface where the second optical fiber support is located, and the groove allows the surface where the optical fiber fixing part is located to be lower than the surface where the second optical fiber support is located. The optical module according to claim 13, wherein, The first optical receiving component includes: The first TIA is located on the surface of the circuit board, and the first optical receiver chip is mounted on the surface of the first TIA. The optical module according to claim 13, wherein, The first lens assembly includes a first optical fiber strip, and the second lens assembly includes a second optical fiber strip; The first optical receiving component and the second optical receiving component are located side by side on one side of the bottom surface of the base, and the first optical fiber ribbon and the second optical fiber ribbon pass through the bottom surface of the base.

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