Inductor package for a multi-phase power converter

Abstract

The disclosure relates to an inductor package (100) for a multi-phase power converter. The inductor package (100) comprises: a printed circuit board (PCB) (104); at least two coils (103) placed next to each other on the PCB (104), each coil being associated to a respective phase of the multi-phase power converter; and a non-magnetic metal armature (101) placed on the PCB (104) above and between the at least two coils (103). The non-magnetic metal armature (101) is configured to reduce a magnetic coupling between the at least two coils (103) and to dissipate heat generated by the at least two coils (103) and the PCB (104). The disclosure further relates to a multi-phase power converter (700) comprising such inductor package (100).

Description

[0001] INDUCTOR PACKAGE FOR A MULTI PHASE POWER CONVERTER

[0002] TECHNICAL FIELD

[0003] The disclosure relates to the field of power converters, highly integrated converters and packaged inductors for multi-phase power converters. In particular, the disclosure relates to an inductor package for a multi-phase power converter and a multiphase power converter comprising such inductor package. Specifically, a package inductor for multi-phase power converters is disclosed.

[0004] BACKGROUND

[0005] Multiple inductors can be used for one converter or phase of a converter. Multiple phases can form a converter module. For highly integrated converters, a packaged inductor is an attractive solution. However, such packaged inductors have some drawbacks. In highly integrated systems with many packaged inductors issues with magnetic coupling and bad heat dissipation may occur. Currently, there exists no solution targeting both issues of magnetic coupling and heat dissipation for multi-phase converters.

[0006] SUMMARY

[0007] This disclosure provides a solution for overcoming the above-described problems of highly integrated systems with packaged inductors. In particular, a solution is presented for improving the magnetic decoupling and heat dissipation for highly packaged inductors for multi-phase power converters.

[0008] The foregoing and other objects are achieved by the features of the independent claims. Further implementation forms are apparent from the dependent claims, the description and the figures.

[0009] This disclosure presents a non-magnetic metal armature inserted on the top and in between the packaged inductors. The metal material can be chosen to be very good at heat dissipation and at generating eddy currents for shielding purposes.

[0010] The disclosure is related to power converters that contain several inductors (2 and more). The converter can use any electrical topology circuitry that can be routed in a printed circuit board (PCB) in one or more layers. The inductors may be composed of horizontal or vertical coils with any number of turns and any magnetic material type. One inductor can use less than one coil or more coils for example as coupled inductor or as transformer. The multi-phase system can work optimally when the magnetic couplings between inductors are neglectable. The converter may contain discrete surface mounted components and / or embedded semiconductor components, e.g., power management integrated circuits (PMIC) or any other semiconductor components, e.g., power switch dies, gate driver dies, etc.

[0011] The metal armature can be inserted in between all or some inductors. The latter is called armature walls. The walls’ thickness is dependent on how much mitigation is needed for shielding and / or removing heat. The metal armature may be made, for example, of Aluminum since Aluminum has very good thermal dissipation properties and good enough shielding properties. However, any other suitable metal can be used as well.

[0012] The disclosure presents a solution for packaged inductors for multi-phases power converters. In embodiments, the metal armature material can be Aluminum, Copper, or any other suitable material. The solution described in this disclosure improves magnetic decoupling and heat dissipation. In embodiments, the metal armature walls can be full or can contain holes with different geometries. The metal armature is configured to improve heat removal and / or magnetic decoupling. The metal armature can cover totally the multi-phase converter to decrease the electromagnetic compatibility (EMC) perturbations. In embodiments, the metal armature walls can be in contact with the heat source or not (close to it). Some of the metal walls can be in direct contact with an embedded semiconductor component, e.g., a power management integrated circuit (PMIC) as shown below in Figure 5a / b. In embodiments, the metal armature can cover totally or partially the multi-phase converter to replace the mold totally or partially and windows implemented in the walls allow the injection flow as shown below in Figure 4, for example. The inductors can handle any type of coils. In this disclosure, a coil and part of magnetic material can constitute an inductor as used for the inductor package (or packaged inductors) as described above.

[0013] The disclosed solution presents an inductor package for multi-phase systems. The inductor package provides dual functions, i.e., heat dissipation and magnetic decoupling. It provides use of non-magnetic material for magnetic shielding. The inductor package can be used in highly integrated multi-phases package inductors. In embodiments, the inductor package can be used as a Faraday cage which provides a third function. In embodiments, the inductor package can be used for injection molding.

[0014] The inductor package as presented in this disclosure can be applied in multi-phase packaged inductors such as DC-DC converters for 5G (and beyond) antenna systems, datacenters, and other application that need high integration of multi-phase converters.

[0015] In order to describe the disclosure in detail, the following terms, abbreviations and notations will be used:

[0016] EMC Electro-Magnetic Compatibility

[0017] PCB Printed Circuit Board

[0018] PMIC Power Management Integrated Circuit

[0019] Al Aluminum

[0020] Cu Copper

[0021] HF High Frequency

[0022] According to a first aspect, the disclosure relates to an inductor package for a multi-phase power converter, the inductor package comprising: a PCB; at least two coils placed next to each other on the PCB, each coil being associated to a respective phase of the multi-phase power converter; and a non-magnetic metal armature placed on the PCB above and between the at least two coils; wherein the non-magnetic metal armature is configured to reduce a magnetic coupling between the at least two coils and to dissipate heat generated by the at least two coils and the PCB.

[0023] Such inductor package significantly improves the magnetic decoupling of the coils of the different phases of the power converter and improves heat dissipation for the coils of the multi-phase power converter. I.e., both issues for multi-phase power converters as described above can be improved at the same time.

[0024] In an exemplary implementation of the inductor package, the inductor package comprises magnetic material embedding the at least two coils, wherein the magnetic material is enclosed by the metal armature and the PCB. A coil and part of magnetic material may constitute an inductor as described in this disclosure. When a coil is described in this disclosure, an inductor is also meant since the coil is always embedded in magnetic material. By embedding the at least two coils in magnetic material, the coils are robust and stable. In an exemplary implementation of the inductor package, the inductor package comprises a top surface formed by the metal armature, a bottom surface formed by the PCB and four sides between the top surface and the bottom surface; wherein the metal armature is at least partially placed on one or more of the sides of the package. Such a design allows the mitigation of the magnetic coupling between inductors and heat dissipation. This design can be is easily implemented and has a reduced weight compared to a full coverage of the package by the metal armature.

[0025] In an exemplary implementation of the inductor package, the metal armature is at least partially placed on two opposite sides of the package. This allows reducing weight of the package without losing decoupling and heat dissipation efficiency.

[0026] In an exemplary implementation of the inductor package, the metal armature is placed alternately between one and the other one of the two opposite sides of the package. This allows to easily fabricate the metal armature, e.g., by cutting and bending a metal foil as described below.

[0027] In an exemplary implementation of the inductor package, the top surface and all sides of the package are fully covered by the metal armature. This allows mitigation of the magnetic coupling between the inductors (coils) and heat dissipation. The fully covered package reacts as a Faraday cage which improves the EMC.

[0028] In an exemplary implementation of the inductor package, at least one window is formed in the metal armature of one or more of the sides of the package, the at least one window being configured to inject magnetic material inside the package to embed the at least two coils. In case the magnetic material is processed by injection, the metal armature can play the role of the mold if the injection pressure can be handled by the metal armature cage and its soldering.

[0029] In an exemplary implementation of the inductor package, the at least one window is formed in the metal armature of a front side and of a lateral side and of top side of the package. This gives flexibility for injecting the magnetic material from the front side or from a lateral side or from top side of the package.

[0030] In an exemplary implementation of the inductor package, the metal armature comprises a top surface arranged above the at least two coils and side walls extending from the top surface of the metal armature towards the PCB; wherein the side walls of the metal armature are mounted on the PCB. This results in stable and robust package in which the metal armature is tightly connected to the PCB.

[0031] In an exemplary implementation of the inductor package, the side walls of the metal armature are placed in contact or at least close to a heat source of the PCB. This feature improves the heat dissipation from the PCB to the metal armature and further to the ambient.

[0032] In an exemplary implementation of the inductor package, the inductor package comprises: a semiconductor component embedded in the PCB, wherein the semiconductor component forms or comprises the heat source. The semiconductor component is an important source of heat which can be efficiently transported via the metal armature to the external ambient of the package. The semiconductor component can be, for example, a PMIC, or any other semiconductor components, e.g. power switch dies, gate driver dies, or any discrete semiconductor components, etc. Thus, different designs of semiconductor components can be supported by this package and the heat can be efficiently dissipated via the metal armature. Besides the magnetic decoupling of the coils, the metal armature walls may reduce disturbances from one semiconductor component to another semiconductor component of the power converter. In an exemplary implementation of the inductor package, the side walls of the metal armature comprise vertical and / or lateral wall extensions that are placed in contact or at least close to the heat source of the PCB. This feature improves the heat transfer via the wall extensions from the heat source to the metal armature and further to the ambient.

[0033] In an exemplary implementation of the inductor package, the metal armature is obtained from an armature foil that is cut and bent to form the top surface and the side walls of the metal armature. Such an inductor package can be easily manufactured, in particular by automatic fabrication.

[0034] In an exemplary implementation of the inductor package, the PCB comprises a ground layout for electrical connection of the PCB with a ground reference; wherein the side walls of the metal armature are mounted on the ground layout of the PCB. Such ground reference is arranged close to the coils which design reduces signal distortions and attenuation.

[0035] The inductor package 100 may have chambers, for example. Each chamber 111 or 112 can have a pair of inductors (coils embedded in magnetic material) without an inner wall in between as shown in Figure 6, for example. The chambers can be shielded against each other by inner walls 101 f. Such chambers allow to have a flexible design of the inductor package, e.g., for application in a high-side (HS) and / or low-side (LS) switch. In one chamber two (or more) coils can be connected together, for example.

[0036] In an exemplary implementation of the inductor package, the non-magnetic metal armature is made of Aluminum or Copper or any other material suitable to reduce the magnetic coupling and improve the heat dissipation. As mentioned, Aluminum and Copper are materials that can reduce the magnetic coupling of the phase coils and improve the heat dissipation.

[0037] According to a second aspect, the disclosure relates to a multi-phase power converter module, comprising: a plurality of power converter phase circuits, each one being associated to a power converter of the power converter module; wherein each power converter phase circuit comprises a switching circuitry and a coil of the at least two coils of the inductor package according to the first aspect described above, which coil is associated to the respective phase circuit of a power converter of the power converter module.

[0038] Such a multi-phase power converter module improves magnetic decoupling between the phases and heat dissipation by using high packaged inductors of the inductor package. The multi-phase power converter module can be applied in multi-phase systems such as DC-DC converters for 5G (and beyond) antenna systems, datacenters, and other application that need high integration of multi-phase converters.

[0039] The multi-phase power converter module is a set of multiple power converters (from 1 to n according to Figure 7). The power converter module includes at least two phase circuits as shown in Figure 7, for example.

[0040] According to a third aspect, the disclosure relates to a method for producing an inductor package for a multi-phase power converter according to the first aspect described above, the method comprising: placing at least two coils next to each other on a PCB, each coil being associated to a respective phase of the multi-phase power converter; cutting and bending anon-magnetic metal armature foil to form a top surface and side walls of a non-magnetic metal armature; and placing the non-magnetic metal armature on the PCB above and between the at least two coils.

[0041] Such a method allows easy manufacturing of an inductor package as described above with respect to the first aspect, for example by automatic fabrication. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Further embodiments of the disclosure will be described with respect to the following figures, in which:

[0043] Figure 1 shows an inductor package 100 according to an embodiment in a 3D view 100, an inside cut view 100c and left 100a and right 100b face views;

[0044] Figure 2 shows a schematic diagram illustrating exemplary manufacturing steps to fabricate an exemplary metal armature 101 of the inductor package 100 according to the disclosure;

[0045] Figure 3 shows an inductor package 100 fully covered by the metal armature according to an embodiment in a 3D view 100, an inside cut view 100c and left 100a and right 100b face views;

[0046] Figure 4 shows an inductor package 100 in a 3D view 100 according to an embodiment with front and lateral windows for magnetic material injection. It can also have windows in the top 8 (on lOOe side);

[0047] Figure 5a shows an inductor package 100 in an inside cut view with vertical wall extensions 106a in contact to a semiconductor component 105 according to an embodiment;

[0048] Figure 5b shows an inductor package 100 in an inside cut view with lateral wall extensions 106b in contact to a semiconductor component 105 according to an embodiment;

[0049] Figure 6 shows an inductor package 100 in an inside cut view with chambers 111, 112 accommodating a pair of inductors (or more) per chamber without inner wall in between according to an embodiment; and

[0050] Figure 7 shows a schematic diagram of an exemplary multi-phase power converter 700 with an inductor package 100 according to the disclosure.

[0051] DETAILED DESCRIPTION OF EMBODIMENTS

[0052] In the following detailed description, reference is made to the accompanying drawings, which form a part thereof, and in which is shown by way of illustration specific aspects in which the disclosure may be practiced. It is understood that other aspects may be utilized and structural or logical changes may be made without departing from the scope of the disclosure. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the disclosure is defined by the appended claims.

[0053] It is understood that comments made in connection with a described method may also hold true for a corresponding device or system configured to perform the method and vice versa. For example, if a specific method step is described, a corresponding device may include a unit to perform the described method step, even if such unit is not explicitly described or illustrated in the figures. Further, it is understood that the features of the various exemplary aspects described herein may be combined with each other, unless specifically noted otherwise.

[0054] Figure 1 shows an inductor package 100 according to an embodiment in a 3D view 100, an inside cut view 100c and left 100a and right 100b face views. The component 101 is the metal armature, 102 is the magnetic material, 103 is the coil, and 104 is the PCB.

[0055] The inductor package 100 for a multi-phase power converter comprises: a PCB 104: at least two coils 103 placed next to each other on the PCB 104, each coil being associated to a respective phase of the multi-phase power converter; and a non-magnetic metal armature 101 placed on the PCB 104 above and between the at least two coils 103.

[0056] The non-magnetic metal armature 101 is configured to reduce a magnetic coupling between the at least two coils 103 and to dissipate heat generated by the at least two coils 103 and the PCB 104.

[0057] The inductor package 100 may comprise magnetic material 102 embedding the at least two coils 103. The magnetic material 102 may be enclosed by the metal armature 101 and the PCB 104.

[0058] As described above, in this disclosure, a coil and part of magnetic material may constitute an inductor.

[0059] The inductor package 100 may comprise a top surface lOOe formed by the metal armature 101, a bottom surface lOOf formed by the PCB 104 and four sides 100a, 100b, 100c, lOOd between the top surface lOOe and the bottom surface lOOf as shown in Figure 1.

[0060] The metal armature 101 can be at least partially placed on one or more of the sides 100a, 100b, 100c, lOOd of the package 100.

[0061] For example, the metal armature 101 can be at least partially placed on two opposite sides 100a, 100b of the package 100 as shown in the left 100a and right 100b face views.

[0062] The metal armature 101 may be placed alternately between one 100a and the other one 100b of the two opposite sides 100a, 100b of the package 100 as can be seen from the left 100a and right 100b face views of F igure 1.

[0063] The metal armature 101 may comprise a top surface 101a arranged above the at least two coils 103 and side walls 101b extending from the top surface 101a of the metal armature 101 towards the PCB 104. The side walls 101b of the metal armature 101 may be mounted on the PCB 104.

[0064] The non-magnetic metal armature 101 can be made, for example, of Aluminum or Copper or any other material suitable to reduce the magnetic coupling and improve the heat dissipation.

[0065] In one embodiment, the armature walls between inductors (i.e., coils 103 embedded within magnetic material 102) can be connected to the armature top lOOe. The armature presence can be alternated between left 100a and right 100b side.

[0066] Such inductor package 100 as shown in Figure 1 enables mitigation of the magnetic coupling between inductors and heat dissipation. It can be easily implemented as explained below with respect to Figure 2.

[0067] Figure 2 shows a schematic diagram illustrating exemplary manufacturing steps to fabricate an exemplary metal armature 101 of the inductor package 100 according to the disclosure.

[0068] The metal armature 101 can be obtained from an armature foil 221 as shown on top left of Figure 2 that is cut and bent 222 to form the top surface 101a and the side walls 101b of the metal armature 101. After bending 222, 223 the respective parts A, B, C, D, E, F, G, H of the armature foil 221 the bent parts can be soldered 224 for mechanical and electrical connection as shown on top right of Figure 2. Then the correspondingly fabricated metal armature 101 can be mounted on a PCB 104 with coils 103 placed next to each other on the PCB 104 (or the PCB 104 can be mounted on the metal armature 101 ) as shown in bottom part of Figure 2.

[0069] Optionally, windows 225 can be formed in the sides of the metal armature 101 for injecting magnetic material 102 to embed the coils 103.

[0070] The PCB 104 may comprise a ground layout 211 for electrical connection of the PCB 104 with a ground reference. The side walls 101b of the metal armature 101 can be mounted on the ground layout 211 of the PCB 104 as shown in the bottom part of Figure 2.

[0071] In particular, Figure 2 shows a method for producing an inductor package 100 for a multi-phase power converter according to the disclosure. The method comprises: placing at least two coils 103 next to each other on a PCB 104, each coil 103 being associated to a respective phase of the multi-phase power converter; cutting and bending 222 a non-magnetic metal armature foil 221 to form a top surface and side walls of a non-magnetic metal armature 101; and placing the non-magnetic metal armature 101 on the PCB 104 above and between the at least two coils 103.

[0072] Figure 3 shows an inductor package 100 fully covered by the metal armature according to an embodiment in a 3D view 100, an inside cut view 100c and left 100a and right 100b face views.

[0073] This embodiment represents a version where the whole multi-phase system is covered by the metal armature 101. The component 101 is the metal armature, 102 is the magnetic material, 103 is the coil, and 104 is the PCB.

[0074] This embodiment enables mitigation of the magnetic coupling between inductors and heat dissipation. The fully covered system reacts as a Faraday cage which improves the EMC. If the magnetic material 102 is processed by injection, in this case the metal armature 101 can play the role of the mold if the injection pressure can be handled by the metal armature cage and its soldering.

[0075] Figure 4 shows an inductor package 100 in a 3D view 100 according to an embodiment with front and lateral windows for magnetic material injection.

[0076] The metal armature 101 may contain front and / or lateral and / or top windows 225 for magnetic material injection. The windows 225 may have different shape, for example rectangular as shown in Figure 4 or square, circular, triangular, hexagonal or other regular or irregular geometric shapes.

[0077] Such inductor package 100 provides a quasi-Faraday cage with the possibility to inject magnetic material 102 from the front side, for example, or from any other side. This embodiment allows to save the mold usage.

[0078] In this embodiment of the inductor package 100, the top surface lOOe and all sides 100a, 100b, 100c, lOOd of the package 100 can be fully covered by the metal armature 101.

[0079] At least one window 225 may be formed in the metal armature 101 of one or more of the sides 100a, 100b, 100c, lOOd, lOOe, of the package 100. The at least one window 225 may be configured to inject magnetic material 102 inside the package 100 to embed the at least two coils 103. The at least one window 225 may be formed in the metal armature 101 of a front side 100c and / or a lateral side 100b and / or a top side lOOe of the package 100 as shown in Figure 4.

[0080] In the following, Figures 5a / b and 6 are described. These figures describe possible implementations for an exemplary fabrication process, also referred to as “maximum scenarios”. When touching the embedded components with the metal armature as shown in the following is complicated, an easier solution would be to connect dummy traces inside or on the PCB which are connected to the embedded electronic components.

[0081] Figure 5a shows an inductor package 100 in an inside cut view with vertical wall extensions 106a in contact to a semiconductor component 105 according to an embodiment. Figure 5b shows an inductor package 100 in an inside cut view with lateral wall extensions 106b in contact to a semiconductor component 105 according to an embodiment.

[0082] The side walls 101b of the metal armature 101 may be placed in contact (as shown in Figure 5a) or at least close to (as shown in Figure 5b) a heat source of the PCB 104 as shown in Figures 5a and 5b, for example.

[0083] The inductor package 100 shown in Figures 5a and 5b may comprise a semiconductor component 105 that may be embedded in the PCB 104. This semiconductor component 105 can form or comprise the heat source.

[0084] The semiconductor component 105 can be, for example, a power management integrated circuit, or any other semiconductor components, e.g. power switch dies, gate driver dies, etc.

[0085] The side walls 101b of the metal armature 101 may comprise vertical 106a (as shown in Figure 5a) and / or lateral 106b (as shown in Figure 5b) wall extensions that may be placed in contact or at least close to the heat source of the PCB 104.

[0086] The metal armature 101 thus improves heat dissipation by the closer contact to the heat source as well as magnetic coupling between the coils 103. The semiconductor component 105, in particular a PMIC, is an important heat source due to the switching losses.

[0087] Figure 6 shows an inductor package 100 in an inside cut view with chambers 111, 112 which are accommodating a pair of inductors (or more) 103 per chamber without inner wall in between according to an embodiment.

[0088] The inductor package 100 may have chambers 111, 112, as shown in Figure 1 or here in Figure 6 for example. In the embodiment of Figure 6 each chamber 111 or 112 can have a pair of inductors (or more) (coils 103 embedded in magnetic material 102) without an inner wall 101 f in between as shown in Figure 6.

[0089] The chambers 111, 112 can be shielded against each other by inner walls lOlf. In this example, no (outer) side walls 101b can be seen, since Figure 6 is also an inside cut view corresponding to the representation in Figure 1. The (outer) side walls 101b can be placed at the left and right sides 100a, 100b as shown in Figure 1.

[0090] Figure 7 shows a schematic diagram of an exemplary multi-phase power converter 700 with an inductor package 100 according to the disclosure.

[0091] The multi-phase power converter 700, also referred to as multi-phase power converter module 700 or simply power converter module 700 comprises a set of multiple power converters 710a, 710b (from 1 to m according to Figure 7).

[0092] The power converter phase circuits (or simply referred to as phases of the multi-phase power converter 700 may include at least two phase circuits 721, 722, 723 as shown in Figure 7. The multi-phase power converter module 700 comprises: a plurality of power converter phase circuits 721, 722, 723 (i.e., at least two), each one being associated to a power converter 710a, 710b of the power converter module 700.

[0093] Each power converter phase circuit 721, 722, 723 comprises a switching circuitry 711, 712, 713 and a coil of the at least two coils 103 of the inductor package 100 as described above with respect to Figures 1 to 6, which coil is associated to the respective phase circuit 721, 722, 723 of a power converter 710a, 710b of the power converter module 700.

[0094] In one example, the multi-phase power converter module 700 may be designed in a multiphase buck topology (or any other topology) using a parallel set of buck regulators 721, 722, 723. Each regulator may run at a controlled duty cycle. The buck topology is just an example, it is understood that other topologies can be implemented as well.

[0095] Each buck regulator 721, 722, 723 may comprise a switching circuitry 711, 712, 713 and a corresponding inductor formed by a coil 103 and magnetic material 102 of the inductor package 100. A switching circuitry 711, 712, 713 may comprise a first switch (not shown here) between an input and the inductor and a second switch (not shown here) between the inductor and a ground reference 740. The switches may be implemented by field effect transistors or IGBTs, for example. The output of a respective switching circuitry 711, 712, 713 is electrically connected to the respective inductor 103 (or coil) of the inductor package 100. All inductor outputs are electrically connected to an output 731, 732 of the respective power converter 710a, 710b which is coupled via a respective output capacitor 751, 752 to the ground reference 740.

[0096] While a particular feature or aspect of the disclosure may have been disclosed with respect to only one of several implementations, such feature or aspect may be combined with one or more other features or aspects of the other implementations as may be desired and advantageous for any given or particular application. Furthermore, to the extent that the terms "include", "have", "with", or other variants thereof are used in either the detailed description or the claims, such terms are intended to be inclusive in a manner similar to the term "comprise". Also, the terms "exemplary", "for example" and "e.g." are merely meant as an example, rather than the best or optimal. The terms “coupled” and “connected”, along with derivatives may have been used. It should be understood that these terms may have been used to indicate that two elements cooperate or interact with each other regardless whether they are in direct physical or electrical contact, or they are not in direct contact with each other.

[0097] Although specific aspects have been illustrated and described herein, it will be appreciated by those of ordinary skill in the art that a variety of alternate and / or equivalent implementations may be substituted for the specific aspects shown and described without departing from the scope of the disclosure. This application is intended to cover any adaptations or variations of the specific aspects discussed herein.

[0098] Although the elements in the following claims are recited in a particular sequence with corresponding labeling, unless the claim recitations otherwise imply a particular sequence for implementing some or all of those elements, those elements are not necessarily intended to be limited to being implemented in that particular sequence.

[0099] Many alternatives, modifications, and variations will be apparent to those skilled in the art in light of the above teachings. Of course, those skilled in the art readily recognize that there are numerous applications of the disclosure beyond those described herein. While the disclosure has been described with reference to one or more particular embodiments, those skilled in the art recognize that many changes may be made thereto without departing from the scope of the disclosure. It is therefore to be understood that within the scope of the appended claims and their equivalents, the disclosure may be practiced otherwise than as specifically described herein.

Claims

CLAIMS1. An inductor package (100) for a multi-phase power converter, the inductor package (100) comprising: a printed circuit board (104); at least two coils (103) placed next to each other on the printed circuit board (104), each coil being associated to a respective phase of the multi-phase power converter; and a non-magnetic metal armature (101) placed on the printed circuit board (104) above and between the at least two coils (103); wherein the non-magnetic metal armature (101) is configured to reduce a magnetic coupling between the at least two coils (103) and to dissipate heat generated by the at least two coils (103) and the printed circuit board (104).

2. The inductor package (100) of claim 1, comprising magnetic material (102) embedding the at least two coils (103), wherein the magnetic material (102) is enclosed by the metal armature (101) and the printed circuit board (104).

3. The inductor package (100) of claim 1 or 2, comprising a top surface (lOOe) formed by the metal armature (101), a bottom surface (lOOf) formed by the printed circuit board (104) and four sides (100a, 100b, 100c, lOOd) between the top surface (lOOe) and the bottom surface (lOOf); wherein the metal armature (101) is at least partially placed on one or more of the sides (100a, 100b, 100c, lOOd) of the package (100).

4. The inductor package (100) of claim 3, wherein the metal armature (101) is at least partially placed on two opposite sides (100a, 100b) of the package (100).

5. The inductor package ( 100) of claim 4, wherein the metal armature is placed alternately between one (100a) and the other one (100b) of the two opposite sides (100a, 100b) of the package (100).

6. The inductor package (100) of any of claims 3 to 5, wherein the top surface (lOOe) and all sides (100a, 100b, 100c, lOOd) of the package (100) are fully covered by the metal armature (101).

7. The inductor package ( 100) of claim 6, wherein at least one window (225) is formed in the metal armature (101) of one or more of the sides (100a, 100b, 100c, lOOd) of the package (100), the at least one window (225) being configured to inject magnetic material (102) inside the package (100) to embed the at least two coils (103).

8. The inductor package (100) of claim 7, wherein the at least one window (225) is formed in the metal armature (101) of a front side (100c) and of a lateral side (100b) of the package (100).

9. The inductor package (100) of any of the preceding claims, wherein the metal armature (101) comprises a top surface (101a) arranged above the at least two coils (103) and side walls (101b) extending from the top surface (101a) of the metal armature (101) towards the printed circuit board (104); wherein the side walls (101b) of the metal armature (101) are mounted on the printed circuit board (104).

10. The inductor package (100) of claim 9, wherein the side walls (101b) of the metal armature (101) are placed in contact or at least close to a heat source of the printed circuit board (104).

11. The inductor package (100) of claim 10, comprising: a semiconductor component (105) embedded in the printed circuit board (104), wherein the semiconductor component (105) forms or comprises the heat source.

12. The inductor package (100) of claim 10 or 11, wherein the side walls (101b) of the metal armature (101) comprise vertical (106a) and / or lateral (106b) wall extensions that are placed in contact or at least close to the heat source of the printed circuit board (104).

13. The inductor package (100) of any of claims 9 to 12, wherein the metal armature (101) is obtained from an armature foil (221) that is cut and bent (222) to form the top surface (101a) and the side walls (101b) of the metal armature (101).

14. The inductor package (100) of any of claims 9 to 13, wherein the printed circuit board (104) comprises a ground layout (211) for electrical connection of the printed circuit board (104) with a ground reference; wherein the side walls (101b) of the metal armature ( 101 ) are mounted on the ground layout (211 ) of the printed circuit board (104).

15. The inductor package ( 100) of any of the preceding claims, wherein the non-magnetic metal armature (101) is made of Aluminum or Copper or any other material suitable to reduce the magnetic coupling and improve the heat dissipation.

16. A multi-phase power converter module (700), comprising: a plurality of power converter phase circuits (721, 722, 723), each one being associated to a power converter (710a, 710b) of the power converter module (700);wherein each power converter phase circuit (721, 722, 723) comprises a switching circuitry (711, 712, 713) and a coil of the at least two coils (103) of the inductor package (100) according to any of the preceding claims, which coil is associated to the respective phase circuit (721, 722, 723) of a power converter (710a, 710b) of the power converter module (700).

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