Semiconductor package module of cooling-channel insertion type

Abstract

The present invention relates to a semiconductor package module of a cooling-channel insertion type, which comprises: a case (100) having an accommodation space formed therein; a power semiconductor (200) mounted on the bottom surface of the case (100); and cooling fins (300) provided on the underside of the case (100) and positioned within a cooling channel to exchange heat with cooling fluid moving through the cooling channel.

Description

Semiconductor package module with cooling channel insertion type

[0001] The present invention relates to a semiconductor package module inserted into a cooling channel.

[0002]

[0003] Prior art documents 001 to 004 are inventions or papers that have a technical relationship with the present invention, prior art document 001 relates to a double-sided cooling semiconductor module, prior art document 002 relates to an edge ring cooling module of a chuck for semiconductor manufacturing, prior art document 003 relates to a method for manufacturing a cooling device for a power semiconductor module, and prior art document 004 relates to a cooler for a semiconductor module and a semiconductor module.

[0004] Prior art documents 001 to 004 all relate to devices and methods related to cooling semiconductor modules, and although they are similar to the present invention, they differ in that the module containing the power semiconductor is not inserted into the cooling channel.

[0005] (Patent Document 1) Prior Art 001: KR 10-2024-0021733 A (Publication Date 2024.02.19)

[0006] (Patent Document 2) Prior Art 002: KR 10-1317942 B1 (Publication Date 2013.10.07)

[0007] (Patent Document 3) Prior Art 003: KR ​​10-2023-0171136 A (Publication Date Dec. 20, 2023)

[0008] (Patent Document 4) Prior Art 004: KR 10-2014-0070589 A (Publication Date 2014.06.10)

[0009]

[0010] The present invention relates to a semiconductor package module inserted into a cooling channel.

[0011]

[0012] The present invention is devised to solve the problems of the prior art as described above, and comprises a case (100) that forms an internal receiving space, a power semiconductor (200) mounted on the bottom surface of the case (100), and a cooling fin (300) formed on the bottom surface of the case (100) and located in a cooling channel to exchange heat with a cooling fluid moving through the cooling channel.

[0013] The present invention is devised to solve the problems of the prior art as described above, and includes a locking part (110) extending outward from the side of the case (100), and a sealing part (120) located on one side of the locking part (110).

[0014] The present invention is devised to solve the problems of the prior art as described above, and includes a pattern layer (140) formed on the inner bottom surface of the case (100) and electrically connected to at least one of the power semiconductors (200).

[0015] The present invention is devised to solve the problems of the prior art as described above, and comprises a housing (10) in which a mounting hole (11) is formed, a cooling section (20) formed on one side of the housing (10) to be connected to the mounting hole (11) and through which a cooling fluid flows, and a semiconductor package module (30) inserted into the mounting hole (11) such that a cooling fin (300) faces toward the cooling section (20).

[0016] The present invention is devised to solve the problems of the prior art as described above, and the cooling unit (20) comprises a cooling unit body (23) located on one side of the housing (10) to form a cooling channel, a cooling fluid inlet (24) formed in the cooling channel (21) to form a path for a cooling fluid to flow into the cooling channel (21), and a cooling fluid outlet (25) formed in the cooling channel (21) to form a path for a cooling fluid to be discharged.

[0017]

[0018] According to the semiconductor package module with a cooling channel insertion type according to various embodiments of the present invention as described above, a part of the case and a cooling fin are directly inserted into the cooling channel, and the cooling fluid exchanges heat with one side of the case and the cooling fin to cool the heat generated in the power semiconductor, thereby improving heat dissipation performance.

[0019]

[0020] FIG. 1 is a perspective view of a semiconductor package module inserted into a cooling channel according to the present invention.

[0021] FIG. 2 is a partially opened perspective view of a semiconductor package module inserted into a cooling channel according to the present invention.

[0022] FIG. 3 is a lower perspective view of a semiconductor package module inserted into a cooling channel according to the present invention.

[0023] FIG. 4 is a schematic cross-sectional view of a semiconductor package module inserted into a cooling channel according to the present invention.

[0024] FIG. 5 is a schematic diagram of an exploded cross-sectional view of an electronic device package including a semiconductor package module inserted into a cooling channel according to the present invention.

[0025] FIG. 6 is a schematic diagram of an electronic device package including a semiconductor package module inserted into a cooling channel according to the present invention.

[0026] FIG. 7 is a schematic diagram of an embodiment in which the lower surface of a semiconductor package module of an electronic device package including a semiconductor package module inserted into a cooling channel according to the present invention is formed in a diagonal direction.

[0027] FIG. 8 is a schematic diagram of an embodiment in which an electronic device package including a semiconductor package module inserted into a cooling channel according to the present invention includes a guide portion.

[0028] FIG. 9 is a schematic diagram of an embodiment in which an electronic device package including a semiconductor package module inserted into a cooling channel according to the present invention includes a cooling fluid storage unit.

[0029] FIG. 10 is a schematic diagram of an embodiment in which the cooling fins of an electronic device package including a semiconductor package module inserted into a cooling channel according to the present invention are formed in a straight shape.

[0030] FIG. 11 is a schematic diagram of an embodiment in which an electronic device package including a cooling channel insertable semiconductor package module according to the present invention includes a temperature sensor.

[0031] FIG. 12 is a plan view of embodiments of the shape of a cooling fin of an electronic device package including a semiconductor package module inserted into a cooling channel according to the present invention.

[0032]

[0033] A semiconductor package module with a cooling channel insertion type according to the present invention will be described in detail below with reference to the attached drawings.

[0034]

[0035] [Example 1-1] The present invention relates to a semiconductor package module inserted into a cooling channel, comprising a case (100) that forms an internal receiving space, a power semiconductor (200) mounted on the bottom surface of the case (100), and a cooling fin (300) formed on the bottom surface of the case (100) and located in a cooling channel to exchange heat with a cooling fluid moving through the cooling channel.

[0036] [Example 1-2] The present invention relates to a semiconductor package module inserted into a cooling channel, wherein in Example 1-1, the case (100) comprises at least one of metal and synthetic resin.

[0037] [Examples 1-3] The present invention relates to a semiconductor package module inserted into a cooling channel, wherein in Example 1-2, the case (100) comprises a metal, and the metal comprises at least one of copper and aluminum.

[0038] [Examples 1-4] The present invention relates to a semiconductor package module inserted into a cooling channel, wherein in Example 1-1, the cooling fin (300) is made of the same material as the case (100).

[0039] [Examples 1-5] The present invention relates to a semiconductor package module inserted into a cooling channel, wherein in Example 1-1, the cooling fin (300) is made of a material different from that of the case (100).

[0040] [Examples 1-6] The present invention relates to a semiconductor package module inserted into a cooling channel, wherein in Example 1-5, the cooling fin (300) is made of a material having a higher thermal conductivity than the case (100).

[0041] [Examples 1-7] The present invention relates to a semiconductor package module inserted into a cooling channel, wherein in Example 1-1, a plurality of cooling fins (300) are installed spaced apart in the width direction.

[0042] [Examples 1-8] The present invention relates to a semiconductor package module inserted into a cooling channel, wherein in Example 1-1, the cooling fin (300) is installed in the direction of the flow of the cooling fluid.

[0043] [Example 1-9] The present invention relates to a semiconductor package module inserted into a cooling channel, wherein in Example 1-1, the cooling fin (300) is formed in a straight shape.

[0044] [Example 1-10] The present invention relates to a semiconductor package module inserted into a cooling channel, wherein in Example 1-1, the cooling fin (300) is formed in a wave shape.

[0045] The present invention relates to a semiconductor package module with an inserted cooling channel to improve heat dissipation performance. In conventional methods, when cooling a power semiconductor using a cooling channel, the semiconductor package module is housed in a housing, and a cooling channel through which a cooling fluid flows is located on the outer side of the housing. If necessary, cooling fins are located on one side of the housing facing the cooling channel. This is intended to cool the heat generated by the power semiconductor by transferring the heat generated by the power semiconductor in the order of the semiconductor package module's case, housing, and cooling fins, and by exchanging heat with the cooling fluid in contact with the cooling fins. However, this method has a problem in that heat is transferred in large portions from the semiconductor package module's case to the housing and then to the cooling fins, which acts as a kind of resistance to heat transfer and degrades heat dissipation performance.

[0046] The present invention is devised to solve the problems described above. A semiconductor package module inserted into a cooling channel according to the present invention comprises a case (100), a power semiconductor (200), and a cooling fin (300).

[0047] The case (100) is manufactured by including at least one of metal and synthetic resin. This is to more effectively transfer heat generated from the power semiconductor (200) housed inside the case (100). If the case (100) is manufactured of metal, the case (100) may be manufactured using aluminum, copper, etc., which have relatively high thermal conductivity.

[0048] The power semiconductor (200) is housed inside the case (100). For example, the power semiconductor (200) may be mounted on the bottom surface of the case (100). This may be to transfer heat generated from the power semiconductor (200) to the bottom of the case (100).

[0049] The cooling fin (300) is formed to protrude downward from the lower surface of the case (100). The cooling fin (300) receives heat transferred from the power semiconductor (200) and exchanges heat with the cooling fluid to which the cooling fin (300) is exposed to cool the heat generated from the power semiconductor (200). The cooling fin (300) may be manufactured from the same material as the case (100) or from a material distinct from the cooling fin (300). If the cooling fin (300) and the case (100) are manufactured from different materials, the material of the cooling fin (300) may be manufactured from a material with a higher thermal conductivity than the material used to manufacture the case (100). This is because the heat exchange in the cooling fin (300) has a relatively high influence on the heat dissipation performance of the semiconductor package module with a cooling channel insertion type according to the present invention.

[0050] A plurality of cooling fins (300) may be formed protruding downward from the lower surface of the case (100). A plurality of cooling fins (300) may be installed spaced apart from each other in the width direction, and a cooling fluid exchanges heat with the cooling fins (300) while moving between the cooling fins (300). The cooling fins (300) include one end and the other end based on the extended direction, and the one end and the other end may be installed based on the direction of flow of the cooling fluid.

[0051] The cross-section of the cooling fin (300) may be formed in a shape that extends to one side. In another embodiment, the cross-section of the cooling fin (300) may be wavy. This is to increase the contact area between the cooling fin (300) and the cooling fluid, thereby enhancing the heat dissipation performance of the semiconductor package module inserted into the cooling channel according to the present invention.

[0052]

[0053] [Example 2-1] The present invention relates to a semiconductor package module inserted into a cooling channel, wherein Example 1-1 includes a locking portion (110) extending outwardly from the side of the case (100) and a sealing portion (120) located on one side of the locking portion (110).

[0054] [Example 2-2] The present invention relates to a semiconductor package module inserted into a cooling channel, wherein in Example 2-1, the sealing portion (120) comprises an elastic material.

[0055] [Example 2-3] The present invention relates to a semiconductor package module inserted into a cooling channel, wherein in Example 2-2, the elastic material comprises at least one of rubber and silicone.

[0056] [Example 2-4] The present invention relates to a semiconductor package module inserted into a cooling channel, wherein in Example 2-2, the sealing portion (120) is positioned in a plurality of parts on at least two sides of a single locking portion (110).

[0057] [Example 2-5] The present invention relates to a semiconductor package module inserted into a cooling channel, wherein in Example 2-1, a sealing receiving portion (130) is formed by being recessed in the catch portion (110) and the sealing portion (120) is located therein.

[0058] [Example 2-6] The present invention relates to a semiconductor package module inserted into a cooling channel, wherein in Example 2-1, the coupling portion (110) and the case (100) are coupled to each other.

[0059] In the semiconductor package with a cooling channel insertion type according to the present invention, the case (100) and the cooling fin (300) must be inserted such that one side and the cooling fin are positioned on the cooling channel. This means that the entire case (100) is not positioned on the cooling channel, but only a part of the case (100) is positioned on the cooling channel. To this end, the semiconductor package module with a cooling channel insertion type according to the present invention may include a locking part (110).

[0060] The catch portion (110) has a shape that extends outward from the side of the case (100). The catch portion (110) is a part that contacts the bottom surface of the case (100) so that the case (100) is caught at a specific position when the case (100) is inserted into a structure that forms a cooling channel. The case (100) may have a shape of a rectangular prism, and the catch portion (110) may have a shape that protrudes outward from at least a part of the side of the case (100).

[0061] The locking part (110) can be joined to the case (100) using a predetermined means. Here, the predetermined means may include methods such as snap-fitting, bolts and nuts, riveting, and adhesive bonding, and the above-described means are referred to as the joining part.

[0062] The sealing portion (120) is provided to seal the cooling channel through which the case (100) is inserted and through which cooling fluid flows. The sealing portion (120) may be located on one side of the catch portion (110) and may be manufactured including an elastic material. When the case (100) is installed, the sealing portion (120) is located between the catch portion (110) and the installation structure, and seals the installed portion while being compressed to prevent leakage of the cooling fluid flowing in the cooling channel. Materials that can constitute the sealing portion (120) may include rubber and silicone.

[0063] In the present invention, the sealing portion (120) can seal the portion installed in at least two parts. To this end, based on the cross-section, the sealing portion (120) may have at least two parts located in different parts on one side of a catch portion (110).

[0064] The present invention may include a sealing receiving portion (130). The sealing receiving portion (130) is formed by being recessed on one side of the catch portion (110) and is the portion where the sealing portion (120) described above is located. The sealing receiving portion (130) may be formed in correspondence with the number of sealing portions (120). When two sealing portions (120) are located on one side of a single catch portion (110) based on a cross-section, the sealing receiving portion (130) may be formed by being recessed in the portion where each sealing portion (120) is located.

[0065]

[0066] [Example 3-1] The present invention relates to a semiconductor package module inserted into a cooling channel, wherein in Example 1-1, a pattern layer (140) is formed on the inner bottom surface of the case (100) and electrically connected to at least one of the power semiconductors (200).

[0067] [Example 3-2] The present invention relates to a semiconductor package module inserted into a cooling channel, wherein, in Example 3-1, it includes an electronic element housed inside the case (100).

[0068] [Example 3-3] The present invention relates to a semiconductor package module inserted into a cooling channel, wherein in Example 3-2, at least one electronic element is accommodated inside the case (100), and the pattern layer (140) is electrically connected to at least one of the electronic elements.

[0069] [Example 3-4] The present invention relates to a semiconductor package module inserted into a cooling channel, wherein, in Example 3-1, it includes a terminal (150) connected to at least one of the power semiconductor (200) and the pattern layer (140) and exposed to the outside of the case (100).

[0070] The semiconductor package with a cooling channel insertion type according to the present invention may further include a pattern layer (140). The pattern layer (140) is formed on the inner bottom surface of the case (100). That is, the pattern layer (140) is formed together with the power semiconductor (200) in the part where the power semiconductor (200) is installed. The pattern layer (140) can form a pattern necessary for driving the power semiconductor and can be electrically connected to at least one of a plurality of power semiconductors (200).

[0071] In addition, the present invention may include electronic components in addition to the power semiconductor (200) housed inside the case (100). Other electronic components housed inside the case (100) may be passive components such as resistors, capacitors, and inductors, or protective components such as integrated circuits, sensors, connectors, fuses, and surge suppressors. The inclusion of electronic components other than the power semiconductor (200) inside the case (100) of the present invention is because integrating multiple electronic components, including the power semiconductor (200), into a single package reduces the size of the system, reduces external connection parts to make it resistant to noise, and simplifies the manufacturing process to lower the defect rate. Furthermore, it is possible to improve the performance of the system by implementing various functions in a single package, and there is also the effect of reducing manufacturing costs by simplifying the manufacturing process through a reduction in the number of components.

[0072] The semiconductor package module with a cooling channel insertion type according to the present invention may include a terminal (150) connected to at least one of a power semiconductor (200) and a pattern layer (140). The terminal is exposed to the outside of the case (100) to connect the semiconductor package module with a cooling channel insertion type according to the present invention to an external circuit.

[0073]

[0074] [Example 4-1] The present invention relates to an electronic device package, and in any one of Examples 1-1 to 3-1, it comprises a housing (10) in which a mounting hole (11) is formed, a cooling section (20) formed on one side of the housing (10) to be connected to the mounting hole (11) and through which a cooling fluid flows, and a semiconductor package module (30) inserted into the mounting hole (11) such that a cooling fin (300) faces toward the cooling section (20).

[0075] [Example 4-2] The present invention relates to an electronic device package, and in Example 4-1, one side of the case (100) included in the semiconductor package module (30) is located on one side of the other side, which is in the direction of the flow of the cooling fluid, relative to the direction of the flow of the cooling fluid.

[0076] [Example 4-3] The present invention relates to an electronic device package, wherein in Example 4-1, the cooling portion (20) includes a guide portion (22) that guides the cooling fluid flowing in the cooling channel (21) to one side of the case (100).

[0077] [Example 4-4] The present invention relates to an electronic device package. In Example 4-1, the case (100) included in the semiconductor package module (30) has a shape in which the area becomes narrower toward the mounting hole (11).

[0078] The electronic device package according to the present invention includes a semiconductor package module (hereinafter referred to as the semiconductor package module) inserted into a cooling channel as previously described, and further includes a housing (10) and a cooling unit (20).

[0079] A housing (10) has a mounting hole (11) formed on one surface into which the above-described semiconductor package module (30) is inserted. The mounting hole (11) can be formed through one surface of the housing (10) and can be formed corresponding to the cross-sectional shape of the case (100).

[0080] A cooling unit (20) is formed on one side of the housing (10). The cooling unit (20) may include a cooling channel (21) formed on one side of the housing (10) through which a cooling fluid flows, a cooling unit body (23) forming the cooling channel (21), a cooling fluid inlet (24), and a cooling fluid outlet (25). Additionally, the cooling unit (20) may include a circulation channel (26) in which a cooling fluid circulates, with both ends connected to the cooling fluid inlet (24) and the cooling fluid outlet (25), respectively; a pump (27) installed on the circulation channel (26) to circulate the cooling fluid; and a condenser (28) installed on the circulation channel (26) to cool the cooling fluid whose temperature has risen through heat exchange. Here, the cooling fluid may generally be water, but the present invention does not limit the type of cooling fluid to water, and various types of cooling fluids may be used in the electronic device package according to the present invention.

[0081] When the semiconductor package module (30) is inserted into the mounting hole (11) formed in the housing (10), the position of the case (100) is maintained in the mounting hole (11) by the locking portion (110) formed on the side of the case (100), and thus only a part of the surface of the case (100) and the cooling fin (300) formed on the outer surface of the case (100) are located in the cooling channel (21). The part of the surface of the case (100) and the cooling fin (300) cool the heat generated in the semiconductor package module (30) through heat exchange with the cooling fluid flowing through the cooling channel (21).

[0082] In the present invention, the cooling fins (300) included in the semiconductor package module (30) are the primary cooling means, but a portion of the outer surface of the case (100) is also a part where heat exchange with the cooling fluid takes place. Therefore, one surface of the case (100) may not be formed in a flat shape, but may be formed obliquely in a diagonal direction. More specifically, regarding the direction of movement of the cooling fluid flowing through the cooling channel (21), among the two ends of the one surface of the case (100) located on the cooling channel (21), one end in the direction of movement of the cooling fluid is located further in the direction that narrows the cooling channel (21) than the other end. That is, one surface of the case (100) is not located parallel to the cooling channel (21), but is formed in an oblique diagonal direction. In this embodiment, the shape of one surface of the case (100) is in an oblique diagonal direction to increase the cooling efficiency by widening the contact area with one surface of the case (100) as the cooling fluid moves.

[0083] Alternatively, there may be an embodiment in which the cooling fluid flowing in the cooling channel (21) is directed toward one side of the case (100). To this end, the cooling section (20) in the present invention may include a guide section (22).

[0084] The guide portion (22) may have a shape that protrudes from the inside of the cooling channel (21) toward one side of the case (100). At least one guide portion (22) may be formed, and if multiple guide portions are formed inside the cooling channel (21), each guide portion (22) may be formed spaced apart from one another.

[0085] The case (100) included in the semiconductor package module (30) may be configured to include a section in which the area narrows toward the mounting hole (11). This allows the narrowing section to act as a guide when inserting the semiconductor package module (30) into the mounting hole (11), thereby enabling more stable insertion into the mounting hole (11).

[0086]

[0087] [Example 5-1] The present invention relates to an electronic device package, wherein in Example 4-1, the cooling unit (20) comprises a cooling unit body (23) located on one side of the housing (10) to form a cooling channel, a cooling fluid inlet (24) formed in the cooling channel (21) to form a path for a cooling fluid to flow into the cooling channel (21), and a cooling fluid outlet (25) formed in the cooling channel (21) to form a path for a cooling fluid to be discharged.

[0088] [Example 5-2] The present invention relates to an electronic device package, wherein in Example 5-1, the cooling unit (20) comprises a circulation channel (26) having both ends connected to the cooling fluid inlet (24) and the cooling fluid outlet (25), respectively, a pump (27) formed in the circulation channel (26) to move the cooling fluid on the circulation channel (26), and a condenser (28) installed in the circulation channel (26) to cool the cooling fluid that has undergone heat exchange.

[0089] [Example 5-3] The present invention relates to an electronic device package, wherein in Example 5-2, the cooling unit (20) includes a control unit (29) that controls the operation of at least one of the pump (27) and the condenser (28).

[0090] [Example 5-4] The present invention relates to an electronic device package, wherein in Example 5-3, a temperature sensor (40) is installed in at least one of the semiconductor package module (30) and the housing (10) to sense the temperature at the installed location, and the control unit (29) controls the operation of at least one of the pump (27) and the condenser (28) differently according to the temperature sensed by the temperature sensor (40).

[0091] As previously explained, in the electronic device package according to the present invention, the cooling unit (20) may include a cooling unit body (23), a cooling fluid inlet (24), and a cooling fluid outlet (25).

[0092] A cooling body (23) is formed on one side of a housing (10) to form a cooling channel (21). A cooling fluid inlet (24) and a cooling fluid outlet (25) are formed in the cooling body (23), and the cooling fluid inlet (24) and the cooling fluid outlet (25) are respectively connected to both ends of the cooling channel (21). Within the cooling channel (21), the cooling fluid is discharged through the cooling fluid inlet (24) to the cooling fluid outlet (25).

[0093] The cooling section (20) may further include a circulation channel (26) with both ends connected to a cooling fluid inlet (24) and a cooling fluid outlet (25), respectively. The cooling fluid cools the semiconductor package module (30) through heat exchange with the semiconductor package module (30) while circulating through the circulation channel (26) and the cooling channel (21) formed on one side of the housing (10).

[0094] The cooling section (20) may further include a pump (27) and a condenser (28) installed in the circulation path (26). The pump (27) serves to move the cooling fluid within the circulation path (26), and the condenser (28) serves to cool the cooling fluid whose temperature has risen through heat exchange with the case (100) and the cooling fins (300). If necessary, the circulation path (26) or the pump (27) may include a cooling fluid receiving section (31) in which the cooling fluid is received. If the cooling fluid is insufficient within the circulation path (26) and the cooling path (21) due to a leakage of the cooling fluid, the pump (27) may supply the cooling fluid from the cooling fluid receiving section (31) to the circulation path (26). A separate valve (42) may be installed between the pump (27) and the cooling fluid receiving section (31), and when necessary, the valve (42) operates to connect the pump (27) and the cooling fluid receiving section (31), and in other conditions, that is, when replenishment of general cooling fluid is not required, the pump (27) and the cooling fluid receiving section (31) are not connected.

[0095] The cooling unit (20) may further include a control unit (29).

[0096] The control unit (29) is a type of electronic device or an electronic device containing an electronic device, and is connected to the pump (27), condenser (28), and the previously described valve (42) to control each device. To this end, the control unit (29) can be interconnected with the pump (27), condenser (28), and valve (42) via wired or wireless connection and can transmit control signals to each device.

[0097] In the present invention, the cooling unit (20) may further include a temperature sensor (40).

[0098] The temperature sensor (40) senses the temperature at the installed location and transmits it to the control unit (29). The temperature sensor (40) is installed in at least one of the semiconductor package module (30) and the housing (10). When the temperature sensed by the temperature sensor exceeds a reference value, in order to secure additional heat dissipation performance, the control unit (29) controls the pump (27) to increase the circulation speed of the cooling fluid and uses a condenser (28) to cool the heat-exchanged cooling fluid.

[0099]

[0100] The present invention is not limited to the embodiments described above and has a diverse scope of application. Furthermore, it is understood that anyone with ordinary knowledge in the field to which the present invention pertains can make various modifications without departing from the essence of the invention as claimed in the claims.

[0101] 10: Housing 11: Installation hole

[0102] 20: Cooling section 21: Cooling channel

[0103] 22: Guide section 23: Cooling section main body

[0104] 24: Cooling fluid inlet 25: Cooling fluid outlet

[0105] 26: Circulation path 27: Pump

[0106] 28: Capacitor 29: Control unit

[0107] 30: Semiconductor package module 31: Cooling fluid receiving section

[0108] 40: Temperature sensor 42: Valve

[0109] 100: Case 110: Locking part

[0110] 120: Sealing section 130: Sealing receiving section

[0111] 140: Pattern layer 150: Terminal

[0112] 200: Power semiconductor 300: Cooling fin

Claims

1. A case (100) that forms an internal receiving space; A power semiconductor (200) mounted on the bottom surface of the above case (100); A cooling fin (300) formed on the lower surface of the above case (100) and located in a cooling channel to exchange heat with a cooling fluid moving through the cooling channel; A semiconductor package module with an insertable cooling channel, comprising 2. In Paragraph 1, A locking portion (110) extending outward from the side of the above case (100); A sealing portion (120) located on one side of the catch portion (110); A semiconductor package module with an insertable cooling channel, comprising 3. In Paragraph 1, A pattern layer (140) formed on the inner bottom surface of the above case (100) and electrically connected to at least one of the power semiconductors (200); A semiconductor package module with an insertable cooling channel, comprising 4. Housing (10) in which a mounting hole (11) is formed; A cooling section (20) formed on one side of the housing (10) to be connected to the above-mentioned mounting hole (11) and through which a cooling fluid flows; A semiconductor package module (30) selected from any one of claims 1 to 3, wherein a cooling fin (300) is inserted into the mounting hole (11) so as to face the cooling section (20); An electronic device package including 5. In Paragraph 4, The above cooling unit (20) is, A cooling body (23) located on one side of the above housing (10) to form a cooling channel; A cooling fluid inlet (24) formed in the cooling channel (21) and forming a path for the cooling fluid to flow into the cooling channel (21); A cooling fluid outlet (25) formed in the above cooling channel (21) to form a path for discharging the cooling fluid; An electronic device package including

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