Backlight module and display device

Abstract

A backlight module (100) and a display device (1000), comprising a backplate (11), a light source assembly (12), a channel device (13), and a heat dissipation device (14), wherein the backplate (11) is provided with a plurality of first openings (11a), and the light source assembly (12) is arranged on the backplate (11); the channel device (13) is provided on a back surface of the backplate (11), a cavity channel (13v) is provided within the channel device (13), and the cavity channel (13v) is in communication with the plurality of first openings (11a); and the heat dissipation device (14) is provided on the back surface of the backplate (11), an input port of the heat dissipation device (14) is in communication with the cavity channel (13v), and the heat dissipation device (14) is configured to cause air within the cavity channel (13v) to flow.

Description

Backlight modules and display devices Technical Field

[0001] This application relates to the field of display technology, specifically to a backlight module and display device. Background Technology

[0002] Current automotive LCD display modules are used outdoors and require high brightness. Light-emitting diodes (LEDs) support the high brightness demands of large currents, but also consume a lot of power and generate significant heat. When the temperature reaches a certain critical value, the power consumption of the LEDs needs to be reduced, but this also leads to a decrease in brightness, affecting normal use by consumers inside the vehicle.

[0003] In the process of researching and practicing existing technologies, the inventors of this application discovered that current LCD module heat dissipation relies on thermal adhesive tape to conduct heat from the light-emitting diodes to the backplate of the backlight module, and then the backplate dissipates the high-temperature heat to the outside air through heat transfer, achieving the purpose of local heat dissipation. However, the thermal conductivity of thermal adhesive tape is generally between 0.6-1.2 W / (m•K), resulting in low heat dissipation efficiency. Invention Overview

[0004] This application provides a backlight module and display device that can improve heat dissipation efficiency.

[0005] In a first aspect, embodiments of this application provide a backlight module, including:

[0006] The back panel has multiple first openings, and the first openings penetrate the back panel in the thickness direction of the backlight module.

[0007] The light source assembly is mounted on the back plate;

[0008] A channel device is disposed on the side of the backplate away from the light source assembly, the channel device having a cavity channel communicating with a plurality of the first openings; and

[0009] A heat dissipation device is disposed on the side of the back plate away from the light source assembly. The heat dissipation device is connected to the cavity channel and is configured to allow airflow within the cavity channel.

[0010] Secondly, embodiments of this application also provide a display device, which includes a display panel and a backlight module as described in any of the above embodiments, wherein the display panel is disposed on one side of the backlight module. Attached Figure Description

[0011] Figure 1 is a schematic diagram of the planar structure of the backlight module provided in the embodiment of this application;

[0012] Figure 2 is a cross-sectional structural diagram of the backlight module provided in an embodiment of this application;

[0013] Figure 3 is an enlarged view of part A in Figure 2;

[0014] Figure 4 is a top plan view of a portion of the structure in the backlight module provided in the embodiment of this application;

[0015] Figure 5 is another top view schematic diagram of a portion of the structure in the backlight module provided in the embodiment of this application;

[0016] Figure 6 is a partial top view of the light source assembly and back plate in the backlight module provided in the embodiment of this application;

[0017] Figure 7 is a schematic diagram of the channel device in the backlight module provided in the embodiment of this application;

[0018] Figure 8 is a partial planar schematic diagram of the back side of the backplate in the backlight module provided in the embodiment of this application;

[0019] Figure 9 is a schematic diagram of another planar structure of the backlight module provided in the embodiment of this application;

[0020] Figure 10 is a schematic diagram of the structure of the display device provided in an embodiment of this application;

[0021] Figure 11 is a plan view of the back of the backlight module used with the display device in Comparative Example 1;

[0022] Figure 12 shows the simulated temperature gradient effect of the display device in Comparative Example 1;

[0023] Figure 13 is a plan view of the back of the backlight module of the display device in Comparative Example 2;

[0024] Figure 14 shows the simulated temperature gradient effect of the display device in Comparative Example 2;

[0025] Figure 15 is a schematic diagram of the rear planar structure of the display device of Embodiment 1 with the backlight module of Figure 9;

[0026] Figure 16 is a simulation temperature gradient effect diagram of the display device in Example 1;

[0027] Figure 17 is a schematic diagram of the rear planar structure of the display device of Embodiment 2 with the backlight module of Figure 1;

[0028] Figure 18 is a simulation temperature gradient effect diagram of the display device in Example 2. Embodiments of the present invention

[0029] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific implementation methods described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, the embodiments can be combined with each other but will not be described in detail one by one. Unless otherwise stated, the directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device; the terms "first," "second," "third," etc. are only used as markings and do not impose numerical requirements or establish a sequence.

[0030] In a first aspect, embodiments of this application provide a backlight module, including:

[0031] The back panel has multiple first openings, and the first openings penetrate the back panel in the thickness direction of the backlight module.

[0032] The light source assembly is mounted on the back plate;

[0033] A channel device is disposed on the side of the backplate away from the light source assembly, the channel device having a cavity channel communicating with a plurality of the first openings; and

[0034] A heat dissipation device is disposed on the side of the back plate away from the light source assembly. The heat dissipation device is connected to the cavity channel and is configured to allow airflow within the cavity channel.

[0035] Optionally, in some embodiments of this application, the backlight module further includes a light guide plate disposed on the back plate, and the light source assembly is disposed on one side of the light guide plate; the light source assembly includes a circuit board and a plurality of light-emitting devices disposed on the circuit board, the circuit board is connected to the side wall of the backlight module, and the plurality of light-emitting devices are arranged at intervals along the length direction of the circuit board;

[0036] Along the length of the circuit board, the first opening and the light-emitting device are arranged alternately.

[0037] Optionally, in some embodiments of this application, the backlight module further includes a light guide plate disposed on the back plate, and the light source assembly is disposed on one side of the light guide plate; the light source assembly includes a circuit board and a plurality of light-emitting devices disposed on the circuit board, the circuit board is connected to the side wall of the backlight module, and the plurality of light-emitting devices are arranged at intervals along the length direction of the circuit board;

[0038] In the thickness direction of the backlight module, one of the light-emitting devices corresponds to at least a portion of the first opening.

[0039] Optionally, in some embodiments of this application, the center of the first opening is equidistant from the centers of its two adjacent light-emitting devices.

[0040] Optionally, in some embodiments of this application, the backlight module further includes a reflective sheet disposed on the side of the light guide plate near the back plate, the reflective sheet being connected to the back plate through a first adhesive layer;

[0041] In the thickness direction of the backlight module, the reflective sheet partially covers the first opening, and the portion of the reflective sheet near the light source assembly is suspended and forms a gap space with the back plate, the gap space communicating with the first opening.

[0042] Optionally, in some embodiments of this application, the back plate includes a bottom and a sidewall connected to the periphery of the bottom. The sidewall and the bottom are connected to form a receiving groove. The light source assembly, the reflector and the light guide plate are disposed in the receiving groove. The light source assembly is disposed on the sidewall. The light guide plate is disposed on the bottom of the back plate away from the heat dissipation device.

[0043] Along the length of the circuit board, the reflector and the light guide plate each have a first gap space between themselves and the sidewall. Along the direction intersecting the length of the circuit board, the reflector and the light guide plate each have a second gap space between themselves and the light source assembly. The second gap space is connected to the first gap space, the gap space and the first opening.

[0044] Optionally, in some embodiments of this application, the light guide plate is connected to the reflective sheet through a second adhesive layer. The first adhesive layer has a plurality of first air channels, and the second adhesive layer has a plurality of second air channels. In the thickness direction of the backlight module, the first air channels penetrate the first adhesive layer, and the second air channels penetrate the second adhesive layer.

[0045] In the backlight module viewed from above, the first air duct and the second air duct extend along the length of the circuit board, and are alternately arranged in the direction intersecting with the length of the circuit board.

[0046] The first interval space is connected to multiple first airways and multiple second airways respectively.

[0047] Optionally, in some embodiments of this application, the heat dissipation device is configured to exhaust air from the cavity channel into the backlight module.

[0048] Optionally, in some embodiments of this application, the channel device has a plurality of second openings on the side facing the first opening, and each second opening is connected to a first opening.

[0049] Alternatively, the channel device may have a second opening on one side facing the first opening, and the second opening may connect to a plurality of the first openings.

[0050] Optionally, in some embodiments of this application, the channel device includes a first conduit and a second conduit, the first conduit extending along the length of the circuit board, and the first conduit and the second conduit communicating with each other.

[0051] The first pipe is connected to the first opening through the second opening, and at least one of the second pipes is connected to the heat dissipation device.

[0052] Optionally, in some embodiments of this application, each of the second pipes is connected to a heat dissipation device, and each of the second pipes intersects with the first pipe. In the length direction of the circuit board of the light source assembly, the distance from the edge of the first pipe to the nearest intersection is a first distance, and the distance between two adjacent intersections is a second distance, which is equal to twice the first distance.

[0053] Optionally, in some embodiments of this application, the heat dissipation device is configured to exhaust air from the cavity channel into the backlight module. The backlight module further includes an air intake device configured to input outside air into the backlight module. The second pipe includes an air intake pipe and an air outlet pipe. The air outlet pipe is connected to the heat dissipation device, the air intake pipe is connected to the air intake device, the air intake pipe is connected to one end of the first pipe, and the air outlet pipe is connected to the other end of the first pipe.

[0054] Optionally, in some embodiments of this application, at least one of the first pipe and the second pipe is formed by splicing together at least two sub-pipe segments.

[0055] Optionally, in some embodiments of this application, the back plate has a groove on the side near the channel device, and the channel device is disposed in the groove.

[0056] Optionally, in some embodiments of this application, the channel device and the groove are fixedly connected by a third adhesive layer, the third adhesive layer being provided with a plurality of third openings, one of which communicates with the first opening and the second opening.

[0057] Optionally, in some embodiments of this application, the diameter of the third opening is larger than the diameter of the first opening, and the diameter of the second opening is greater than or equal to the diameter of the third opening. The diameter of the first opening is greater than or equal to 1 mm.

[0058] Optionally, in some embodiments of this application, the depth of the groove is greater than 1 mm. The sidewall thickness of the channel device is greater than or equal to 0.15 mm.

[0059] Optionally, in some embodiments of this application, the backlight module further includes an optical film and a support frame, wherein the optical film and the support frame are disposed in the receiving groove of the back plate;

[0060] The optical film is disposed on the bottom side of the light guide plate away from the back plate, and the support frame is detachably connected to the side wall of the back plate and located on the bottom side of the light source assembly away from the back plate.

[0061] Secondly, embodiments of this application also provide a display device, which includes a display panel and a backlight module as described in any of the above embodiments, wherein the display panel is disposed on one side of the backlight module.

[0062] The backlight module and display device of this application embodiment have a first opening on the back plate of the backlight module, and a channel device is disposed on the back side of the back plate and connected to the first opening, so that the heat dissipation device located on the outside of the back plate can exhaust the hot air in the backlight module through the channel device to improve the heat dissipation effect.

[0063] This application provides a backlight module and a display device, which will be described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments.

[0064] In Figures 1, 2, and 3, the first direction F1 can be a direction parallel to one side of the backlight module 100 in a plan view, and for example, it can be the lateral direction of the backlight module 100. The second direction F2 can be a direction parallel to the other side of the backlight module 100 in a plan view, and it can be the longitudinal direction of the backlight module 100. The third direction F3 can be the thickness direction of the backlight module 100.

[0065] In some embodiments, the first direction F1 and the second direction F2 may also be non-perpendicularly intersecting.

[0066] Please refer to Figures 1, 2 and 3. This application provides a backlight module 100, including a backplate 11, a light source assembly 12, a channel device 13 and a heat dissipation device 14.

[0067] The backplate 11 has multiple first openings 11a. The first openings 11a penetrate the backplate 11 in the thickness direction F3 of the backlight module 100. A light source assembly 12 is disposed on the backplate 11. A channel device 13 is disposed on the side of the backplate 11 away from the light source assembly 12. The channel device 13 has a cavity channel 13v that connects to the multiple first openings 11a. A heat dissipation device 14 is disposed on the side of the backplate 11 away from the light source assembly 12. The heat dissipation device 14 is connected to the cavity channel 13v and is configured to allow airflow within the cavity channel 13v.

[0068] In this embodiment, a first opening 11a is provided on the back plate 11 of the backlight module 100, and a channel device 13 is provided on the back side of the back plate 11 and communicates with the first opening 11a, so that the heat dissipation device 14 located on the outside of the back plate 11 can exhaust the hot air inside the backlight module 100 through the channel device 13, thereby improving the heat dissipation effect.

[0069] It should be understood that the heat dissipation device 14 can exhaust the hot air inside the backlight module 100 by suction, or it can blow the hot air out of the backlight module 100 by blowing.

[0070] It should be noted that although Figure 2 shows an edge-lit backlight module, in this application, the backlight module 100 can also be a direct-lit type. Both direct-lit and edge-lit types can achieve heat dissipation through the combination of a first opening 11a, a channel device 13, and a heat dissipation device 14. The following explanation will use the example of the heat dissipation device 14 being configured to expel air from the cavity channel 13v into the backlight module 100.

[0071] In some embodiments of this application, as shown in FIG2, the backlight module 100 further includes a light guide plate 15, a reflective sheet 16, an optical film 17, and a support frame 18. The light guide plate 15 is disposed on the back plate 11. The light source assembly 12 is disposed on one side of the light guide plate 15 and connected to the side wall of the backlight module 100. The reflective sheet 16 is disposed on the backlight side of the light guide plate 15. The optical film 17 is disposed on the light-emitting side of the light guide plate 15.

[0072] The backplate 11 includes a bottom 111 and a sidewall 112 connected to the periphery of the bottom 111. The sidewall 112 and the bottom 111 are connected to form a receiving groove 11b. The light source assembly 12, the light guide plate 15, the reflector 16, the optical film 17, and the support frame 18 are all disposed within the receiving groove 11b. The reflector 16 is disposed on the side of the light guide plate 15 near the bottom 111 of the backplate 11. The optical film 17 is disposed on the side of the light guide plate 15 away from the bottom 111 of the backplate 11. The support frame 18 is detachably connected to the sidewall 112 of the backplate 11 and is located on the side of the light source assembly 12 away from the bottom 111 of the backplate 11.

[0073] It should be noted that in the backlight module 100 shown in Figure 2, the back plate 11 is a frame-like structure with a bottom 111 and side walls 112. The support frame 18 is detachably connected to the side walls 112 of the back plate 11, but is not limited to this. For example, the back plate 11 can be a plate-like structure combined with a middle frame to support the display panel and place optical components (light source, light guide plate, optical film and reflector, etc.); or the back plate 11 can also integrate the functions of the middle frame, such as the back plate 11 and the support frame 18 being connected as one piece, so that the back plate 11 can both place optical components and support the display panel.

[0074] Optionally, the material of the backplate 11 may include one selected from metals, metal alloys, and plastics. For example, the material of the backplate 11 may be aluminum or aluminum alloy to improve the heat dissipation effect of the backplate 11.

[0075] Optionally, the light source assembly 12 includes a circuit board 121 and a plurality of light-emitting devices 122 disposed on the circuit board 121. The light-emitting devices 122 may be light-emitting diode (LED) devices. Optionally, the circuit board 121 is connected to the sidewall 112 via a fourth adhesive layer 194.

[0076] Optionally, the optical film 17 can be a composite film with a single film layer or an optical film with multiple film layers stacked together. For example, the optical film 17 includes a diffusion film, a first brightness enhancement film, and a second brightness enhancement film.

[0077] Optionally, the heat dissipation device 14 can be an exhaust fan, exhaust pump, or other air extraction device. The heat dissipation device 14 can be fixed to the back of the back plate 11 by means of screws or clamps.

[0078] Optionally, referring to Figure 3, in some embodiments of this application, the reflective sheet 16 is connected to the back plate 11 via a first adhesive layer 191.

[0079] In the thickness direction F3 of the backlight module 100, the reflective sheet 16 covers a portion of the first opening 11a. The portion of the reflective sheet 16 near the light source assembly 12 is suspended and forms a gap space 11c with the back plate 11. The gap space 11c is connected to the first opening 11a.

[0080] Understandably, the design of the reflector 16 covering a portion of the first opening 11a not only enlarges the aperture of the first opening 11a to improve heat dissipation efficiency but also increases light utilization. Furthermore, since light also generates heat, the design of the gap space 11c between the reflector 16 and the bottom 111 of the back plate 11 increases the contact area between the air and the reflector 16, and extends the air exhaust path to dissipate more heat, thereby improving heat dissipation efficiency.

[0081] Please refer to Figures 3 and 4. Figure 4 shows a top plan view of part of the structure of the backlight module 100.

[0082] In some embodiments of this application, the light source assembly 12 is disposed on the sidewall 112 of the back plate 11. The light guide plate 15 is disposed on the bottom 111 of the back plate 11 away from the heat dissipation device 14.

[0083] Along the length of the circuit board 121, the reflector 16 and the light guide plate 15 have a first gap space 11d between them and the sidewall 112. Along the direction intersecting the length of the circuit board 121, the reflector 16 and the light guide plate 15 have a second gap space 11f between them and the light source assembly 12. The second gap space 11f connects the first gap space 11d, the gap space 11c, and the first opening 11a.

[0084] In some embodiments of this application, the direction of intersection with the length direction of the circuit board 121 can be a second direction F2. The design of the first spacing space 11d and the second spacing space 11f increases the contact area between the air and the optical components in the backlight module 100, and extends the air exhaust path to dissipate more heat, thereby further improving the heat dissipation effect.

[0085] Secondly, the first spacing space 11d and the second spacing space 11f are appropriately enlarged based on the requirements of device assembly (assembly tolerance), without the need for additional airflow path design, thus simplifying the structure. For example, the width of the first spacing space 11d and the second spacing space 11f is between 1.1 and 1.5 times the minimum assembly precision requirement of the light guide plate 15 and the back plate 11, such as 1.1, 1.2, 1.3, 1.4, or 1.5 times. Although the minimum assembly precision requirement of the light guide plate 15 and the back plate 11 varies depending on different backlight module designs, manufacturing processes, and application scenarios, it is typically between 0.1 mm and 0.5 mm, such as 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, or 0.5 mm.

[0086] Furthermore, the first interval space 11d and the second interval space 11f are located in the surrounding area inside the backlight module 100, which improves the uniformity of heat dissipation of the backlight module 100 as a whole.

[0087] In some embodiments, a third space 11g is provided between the bottom of the light source assembly 12 and the back plate 11. The third space 11g connects the second space 11f and the first opening 11a, which increases the contact area between the air and the light source assembly 12 and extends the air exhaust path to exhaust more heat, thereby further improving the heat dissipation effect.

[0088] In the thickness direction of the backlight module 100, the width of the third gap space 11g is greater than the width of the gap space 11c. It should be understood that the larger third gap space 11g allows for better heat dissipation for the light source assembly 12.

[0089] In some embodiments, the sidewall 112 of the backplate 11 has a first air inlet 11k that communicates with the receiving groove 11b. The first air inlet 11k is configured to allow cold air from the outside to pass through. The first air inlet 11k and the light source assembly 12 are disposed on the same sidewall 112, and the first air inlet 11k is located on the side of the light source assembly 12 away from the bottom 111 of the backplate 11.

[0090] Optionally, the first air inlets 11k are arranged at intervals along the length of the circuit board 121. It can be understood that, since the light source assembly 12 is the largest heat source, the first air inlets 11k are placed close to the light source assembly 12 and above the light source assembly 12, while the first opening 11a is located below the light source assembly 12. This greatly shortens the heat dissipation path and increases the exchange rate of cold and hot air, thereby improving the heat dissipation effect.

[0091] Please refer to Figures 3 and 5. Figure 5 shows another top plan view of a portion of the structure of the backlight module 100 according to an embodiment of this application.

[0092] In some embodiments of this application, the light guide plate 15 is connected to the reflector 16 via a second adhesive layer 192. The first adhesive layer 191 has a plurality of first air channels 19a, and the second adhesive layer 192 has a plurality of second air channels 19b. In the thickness direction F3 of the backlight module 100, the first air channels 19a penetrate the first adhesive layer 191, and the second air channels 19b penetrate the second adhesive layer 192.

[0093] In the backlight module 100 viewed from above, a first air duct 19a and a second air duct 19b extend along the length of the circuit board 121. The first air duct 19a and the second air duct 19b are arranged alternately in the direction intersecting the length of the circuit board 121.

[0094] The first space 11d connects to multiple first airways 19a and multiple second airways 19b.

[0095] It should be understood that the design of the first air duct 19a and the second air duct 19b increases the contact area between the air and the light guide plate 15 and the reflector 16, and extends the air exhaust path to dissipate more heat, thereby further improving the heat dissipation effect.

[0096] Secondly, the first air duct 19a and the second air duct 19b are located in the middle area inside the backlight module 100, which improves the uniformity of heat dissipation of the backlight module 100 as a whole.

[0097] In addition, in the backlight module 100 viewed from above, the first adhesive layer 191 and the second adhesive layer 192 are partially overlapped, which improves the stability of the connection between the light guide plate 15 and the reflective sheet 16, improves the flatness of the reflective sheet 16, and reduces the risk of the reflective sheet 16 falling down in the first air passage 19a due to gravity, thereby reducing the risk of the first air passage 19a shrinking.

[0098] Optionally, in the longitudinal direction (first direction F1) of the circuit board 121, the overlap width of the first adhesive layer 191 and the second adhesive layer 192 is greater than the width of the first air passage 19a, further reducing the risk of shrinkage of the first air passage 19a.

[0099] In some embodiments, a second air inlet 11v is also provided at the bottom 111 of the back panel 11, and the second air inlet 11v is connected to the first air passage 19a. The second air inlet 11v is an auxiliary air inlet, which is disposed in the support column 113 on the back side of the back panel 11 and penetrates the support column 113 in the thickness direction of the backlight module 100.

[0100] Please refer to Figure 6, which shows a plan view of the light source assembly 12 and the first opening 11a from a top viewpoint. In some embodiments, a plurality of light-emitting devices 122 are arranged at intervals along the length of the circuit board 121.

[0101] Along the length of the circuit board 121, the first opening 11a and the light-emitting device 122 are arranged alternately.

[0102] It should be understood that, optionally, the length direction of the circuit board 121 is the first direction F1. That is, a first opening 11a and a light-emitting device 122 are arranged alternately along the first direction F1. Since the heat source of the backlight module 100 mainly comes from the light-emitting device 122 in the light source assembly 12, a first opening 11a is provided between two adjacent light-emitting devices 122, so that the distance from the first opening 11a to the light-emitting device 122 becomes uniform. The heat emitted by the light-emitting device 122 can not only be quickly dissipated through the first opening 11a, but also the uniformity of heat dissipation is improved, and the risk of excessive local heat is reduced.

[0103] Optionally, in some embodiments of this application, a light-emitting device 122 covers at least a portion of a first opening 11a in the thickness direction F3 of the backlight module 100 to improve the heat dissipation effect of the light-emitting device 122.

[0104] That is, the light-emitting device 122 may partially cover the first opening 11a or fully cover the first opening 11a. In some embodiments, the area of ​​the first opening 11a may at least partially extend beyond the area where the light-emitting device 122 is installed.

[0105] In some embodiments of this application, the center of the first opening 11a is equidistant from the centers of its two adjacent light-emitting devices 122.

[0106] It is understandable that the center of the first opening 11a is equidistant from the center of its two adjacent light-emitting devices 122, so that the heat dissipation distance of each light-emitting device 122 is the same, thereby improving the uniformity of heat dissipation.

[0107] Optionally, the shape of the first opening 11a can be any shape, such as circular, square, or trapezoidal. This embodiment uses a circular first opening 11a as an example for illustration.

[0108] The aperture (diameter) of the first opening 11a is greater than or equal to 1 mm, such as 1 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, 1.5 mm, 1.6 mm, 1.7 mm, 1.8 mm, 1.9 mm, or 2 mm, etc.

[0109] Optionally, the aperture of the first opening 11a is less than or equal to 1.5 mm, which improves the waterproof and dustproof performance of the backlight module 100 and ensures the support performance of the back plate 11.

[0110] Please refer to Figures 3 and 7. Figure 7 shows a three-dimensional structural diagram of the channel device 13 in the backlight module 100.

[0111] In some embodiments of this application, the channel device 13 has a plurality of second openings 13a on the side facing the first opening 11a, and each second opening 13a is connected to a first opening 11a.

[0112] Of course, in some embodiments, the channel device 13 may also have a second opening 13a on the side facing the first opening 11a, and the second opening 13a connects to multiple first openings 11a.

[0113] Referring to Figures 1 and 7, in some embodiments of this application, the channel device 13 includes a first conduit 131 and a second conduit 132. The first conduit 131 extends along the length of the circuit board 121, and the first conduit 131 and the second conduit 132 are in cross communication.

[0114] The first conduit 131 is connected to the first opening 11a through the second opening 13a, and at least one second conduit 132 is connected to the heat dissipation device 14.

[0115] It is understood that in this embodiment of the application, a first pipe 131 is used to connect all the first openings 11a, and a second pipe 132 is used to connect the first pipe 131, so that the heat exhaust channel is led to the space in the second direction F2, saving the layout space in the first direction F1, and making the first pipe 131 long enough to connect more first openings 11a, thereby improving the heat dissipation effect.

[0116] Optionally, in some embodiments of this application, each second pipe 132 is connected to a heat dissipation device 14, and each second pipe 132 intersects with the first pipe 131.

[0117] Along the length of the circuit board 121, the distance from the edge of the first pipe 131 to the nearest intersection is a first distance L1, and the distance between two adjacent intersections is a second distance L2. The second distance L2 is twice the first distance L1.

[0118] Understandably, the design that the second distance L2 is twice the first distance L1 allows each second pipe 132 to connect to the first pipe 131 at the same distance, thereby improving heat dissipation efficiency and heat dissipation uniformity.

[0119] Optionally, in some embodiments of this application, at least one of the first pipe 131 and the second pipe 132 is formed by splicing together at least two sub-pipe segments.

[0120] Understandably, at least one of the first conduit 131 and the second conduit 132 is spliced ​​together to form a sub-conduit, which can better accommodate backlight modules 100 of various sizes. The sub-conduits can be connected by welding, such as using ultrasonic welding. Optionally, the wall thickness of the sub-conduits is greater than or equal to 0.15 mm, for example, it can be 0.15 mm, 0.16 mm, 0.17 mm, 0.18 mm, 0.19 mm, 0.2 mm, 0.21 mm, 0.22 mm, 0.23 mm, 0.24 mm, or 0.25 mm, etc.

[0121] Optionally, the material of the channel device 13 may include a plastic tube, a metal, or a metal alloy. For example, it may be a metal or a metal alloy, based on the high thermal conductivity of the metal or metal alloy, in order to improve the heat dissipation effect.

[0122] In some embodiments of this application, please refer to Figures 3 and 8, where Figure 8 shows a partial planar schematic diagram of the back side of the back plate 11.

[0123] In Figure 8, a groove 11h is provided on the side of the back plate 11 near the channel device 13, and the channel device 13 is disposed in the groove 11h.

[0124] It is understandable that the groove 11h is opened on the back plate 11 and the channel device 13 is placed in the groove 11h. This not only protects the channel device 13, but also facilitates the positioning and installation of the channel device 13, and improves the stability of the fixed connection between the channel device 13 and the back plate 11.

[0125] Optionally, the depth of the groove 11h is greater than 1 mm. For example, it can be 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, 1.5 mm, 1.6 mm, 1.7 mm, 1.8 mm, 1.9 mm, or 2.0 mm. Optionally, the depth of the groove 11h is less than or equal to 1.5 mm to avoid the back plate 11 being too thin.

[0126] In some embodiments, the groove 11h includes a first sub-groove h1 configured to receive a first pipe 131 and a second sub-groove h2 configured to receive a second pipe 132. The first sub-groove h1 and the second sub-groove h2 are connected and intersected. A first opening 11a is arranged along the length direction of the first sub-groove h1.

[0127] In some embodiments of this application, the channel device 13 and the groove 11h are fixedly connected by a third adhesive layer 193. The third adhesive layer 193 is provided with a plurality of third openings 19c, one of which is connected to the first opening 11a and the second opening 13a.

[0128] It is understandable that a third adhesive layer 193 is used to connect the channel device 13 and the backplane 11 in order to improve the stability of the channel device 13.

[0129] Optionally, the thickness of the third adhesive layer 193 is greater than or equal to 0.04 mm and less than or equal to 0.06 mm, for example, it can be 0.04 mm, 0.05 mm or 0.06 mm. This arrangement is to balance the adhesion between the channel device 13 and the backplate 11 and to avoid the third adhesive layer 193 being too thick, which would affect the degree to which the channel device 13 sinks into the groove 11h.

[0130] Optionally, the third adhesive layer 193 can be a conventional fixing adhesive or a thermally conductive adhesive to improve heat dissipation efficiency.

[0131] In some embodiments of this application, the aperture of the third opening 19c is larger than the aperture of the first opening 11a, and the aperture of the second opening 13a is greater than or equal to the aperture of the third opening 19c.

[0132] Considering the adhesion accuracy, the aperture of the third opening 19c is set to be larger than that of the first opening 11a, so as to ensure that the third opening 19c fully covers the first opening 11a and avoid the third adhesive layer 193 from blocking the first opening 11a.

[0133] Optionally, the aperture of the third opening 19c is greater than or equal to the sum of the aperture of the first opening 11a and 0.2 mm, so as to avoid the third adhesive layer 193 blocking the first opening 11a.

[0134] Optionally, in some embodiments of this application, FIG9 shows another planar schematic diagram of the back of the backlight module 100 of this application embodiment.

[0135] In Figure 9, the parts that differ from the above embodiments will be described to avoid redundancy.

[0136] Referring to Figure 9, the backlight module 100 also includes an air intake device 101 configured to introduce outside air into the backlight module 100. The second conduit 132 includes an air intake conduit 13j and an air outlet conduit 13c. The air outlet conduit 13c is connected to the heat dissipation device 14, the air intake conduit 13j is connected to the air intake device 101, the air intake conduit 13j is connected to one end of the first conduit 131, and the air outlet conduit 13c is connected to the other end of the first conduit 131.

[0137] In some embodiments, a baffle wall is provided inside the first pipe 131 to prevent the intake and exhaust from interfering with each other.

[0138] Accordingly, referring to FIG10, this application embodiment also provides a display device 1000, which includes a display panel 200 and a backlight module 100 as described in any of the above embodiments, wherein the display panel 200 is disposed on one side of the backlight module 100.

[0139] It should be noted that the structure of the backlight module 100 of the display device 1000 in this application embodiment is similar to or the same as the structure of the backlight module 100 of any of the above embodiments. Please refer to the descriptions in Figures 1 to 9 for details, which will not be repeated here.

[0140] Optionally, the display device 1000 also includes a cover plate 300 disposed on the light-emitting side of the display panel 200, which can be attached to the display panel 200 by optical adhesive. The cover plate 300 is overlapped on the side wall 112 of the back plate 11 by a fifth adhesive layer 195.

[0141] Optionally, the cover plate 300 can be a glass cover plate or other protective material.

[0142] Optionally, the display panel 200 is disposed within the receiving groove 11b and is attached to the support frame 18 by a sixth adhesive layer 196.

[0143] The display panel 200 is a liquid crystal display panel. The specific structure of the display panel 200 will not be described in detail here.

[0144] Optionally, the driving architecture of the display panel 200 can be an edge field switching technology driving architecture, a planar conversion technology driving architecture, a vertical alignment technology driving architecture, a twisted nematic technology driving architecture, and so on.

[0145] In addition, the display device 1000 of the present application achieves better heat dissipation by being equipped with the backlight module 100 of the above embodiment.

[0146] Specifically, Figure 11 shows the display device of Comparative Example 1, whose backlight module has no heat dissipation device on the back for heat dissipation treatment; Figure 12 shows the simulated temperature gradient effect of the display device of Comparative Example 1. Figure 13 shows the display device of Comparative Example 2, whose backlight module only uses heat dissipation device 14 for conventional surface heat dissipation; Figure 14 shows the simulated temperature gradient effect of the display device of Comparative Example 2. Figure 15 shows the display device 1000 of Embodiment 1, whose backlight module 100 corresponds to the backlight module 100 of the embodiment of this application in Figure 9; Figure 16 shows the simulated temperature gradient effect of the display device 1000 of Embodiment 1. Figure 17 shows the display device 1000 of Embodiment 2, whose backlight module 100 corresponds to the backlight module 100 of the embodiment of this application in Figure 1; Figure 18 shows the simulated temperature gradient effect of the display device 1000 of Embodiment 2.

[0147] It should be noted that, apart from the differences in the heat dissipation devices and their related structures, the structures of the backlight module 100 and the display panel 200 remain unchanged, and the temperature test locations and test points are the same in all four experimental cases. The test environment and test methods are also identical. The heat dissipation device 14 is a fan, and the backplate 11 is a cast aluminum component.

[0148] Test Location Comparison Example 1 Comparison Example 2 Example 1 Example 2 Optical Film 61.742℃ 60.627℃ 34.715℃ 30.596℃ Driver Chip 57.953℃ 56.261℃ 38.57℃ 34.886℃ Glass Cover Plate 49.211℃ 47.639℃ 33.272℃ 29.374℃

[0149] According to the simulation data above, compared with Comparative Example 1 and Comparative Example 2, the temperatures of Examples 1 and 2 both decreased significantly. Among them, Example 2 showed the largest temperature decrease compared with Comparative Example 1, with a temperature decrease of 31.146℃ at the optical film, 23.067℃ at the driving chip, and 19.837℃ at the glass cover.

[0150] As can be seen, the display device 1000 of this application embodiment achieves a significant cooling effect by setting a heat dissipation device 14 or by setting a heat dissipation device 14 in combination with an air intake device 101, and by combining a first opening 11a and a channel device 13.

[0151] The display device 1000 of this application embodiment has a first opening 11a on the back plate of the backlight module 100, and a channel device 13 is disposed on the back side of the back plate 11 and connected to the first opening 11a, so that the heat dissipation device 14 located on the outside of the back plate 11 can exhaust the hot air inside the backlight module 100 through the channel device 13 to improve the heat dissipation effect.

[0152] The foregoing has provided a detailed description of a backlight module and display device provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A backlight module, comprising: The back panel has multiple first openings, and the first openings penetrate the back panel in the thickness direction of the backlight module. The light source assembly is mounted on the back plate; A channel device is disposed on the side of the back plate away from the light source assembly. The channel device has a cavity channel that connects to a plurality of the first openings. as well as A heat dissipation device is disposed on the side of the back plate away from the light source assembly. The heat dissipation device is connected to the cavity channel and is configured to allow airflow within the cavity channel.

2. The backlight module according to claim 1, wherein, The backlight module also includes a light guide plate disposed on the back plate, and the light source assembly is disposed on one side of the light guide plate; the light source assembly includes a circuit board and a plurality of light-emitting devices disposed on the circuit board, the circuit board is connected to the side wall of the backlight module, and the plurality of light-emitting devices are arranged at intervals along the length direction of the circuit board; Along the length of the circuit board, the first opening and the light-emitting device are arranged alternately.

3. The backlight module according to claim 1, wherein, The backlight module also includes a light guide plate disposed on the back plate, and the light source assembly is disposed on one side of the light guide plate; the light source assembly includes a circuit board and a plurality of light-emitting devices disposed on the circuit board, the circuit board is connected to the side wall of the backlight module, and the plurality of light-emitting devices are arranged at intervals along the length direction of the circuit board; In the thickness direction of the backlight module, one of the light-emitting devices corresponds to at least a portion of the first opening.

4. The backlight module according to claim 2 or 3, wherein, The center of the first opening is equidistant from the centers of its two adjacent light-emitting devices.

5. The backlight module according to claim 2 or 3, wherein, The backlight module also includes a reflective sheet disposed on the side of the light guide plate near the back plate, and the reflective sheet is connected to the back plate through a first adhesive layer; In the thickness direction of the backlight module, the reflective sheet partially covers the first opening, and the portion of the reflective sheet near the light source assembly is suspended and forms a gap space with the back plate, the gap space communicating with the first opening.

6. The backlight module according to claim 5, wherein, The back plate includes a bottom and a side wall connected to the periphery of the bottom. The side wall and the bottom are connected to form a receiving groove. The light source assembly, the reflector and the light guide plate are disposed in the receiving groove. The light source assembly is disposed on the side wall. The light guide plate is disposed on the bottom of the back plate away from the heat dissipation device. Along the length of the circuit board, the reflector and the light guide plate each have a first gap space between themselves and the sidewall. Along the direction intersecting the length of the circuit board, the reflector and the light guide plate each have a second gap space between themselves and the light source assembly. The second gap space is connected to the first gap space, the gap space and the first opening.

7. The backlight module according to claim 6, wherein, The light guide plate is connected to the reflective sheet through a second adhesive layer. The first adhesive layer has multiple first air channels, and the second adhesive layer has multiple second air channels. In the thickness direction of the backlight module, the first air channels penetrate the first adhesive layer, and the second air channels penetrate the second adhesive layer. In the backlight module viewed from above, the first air duct and the second air duct extend along the length of the circuit board, and are alternately arranged in the direction intersecting with the length of the circuit board. The first interval space is connected to multiple first airways and multiple second airways respectively.

8. The backlight module according to any one of claims 1-3, wherein, The heat dissipation device is configured to expel air from the cavity channel into the backlight module.

9. The backlight module according to claim 8, wherein, The channel device has a plurality of second openings on the side facing the first opening, and each second opening is connected to a first opening. Alternatively, the channel device may have a second opening on one side facing the first opening, and the second opening may connect to a plurality of the first openings.

10. The backlight module according to claim 9, wherein, The channel device includes a first pipe and a second pipe, the first pipe extending along the length of the circuit board and the first pipe and the second pipe intersecting and communicating with each other. The first pipe is connected to the first opening through the second opening, and at least one of the second pipes is connected to the heat dissipation device.

11. The backlight module according to claim 10, wherein, Each of the second pipes is connected to one of the heat dissipation devices, and each of the second pipes intersects with the first pipe at a point along the length of the circuit board of the light source assembly. The distance from the edge of the first pipe to the nearest intersection is the first distance, and the distance between two adjacent intersections is the second distance. The second distance is equal to twice the first distance.

12. The backlight module according to claim 10, wherein, The backlight module also includes an air intake device configured to input outside air into the backlight module. The second pipe includes an air intake pipe and an air outlet pipe. The air outlet pipe is connected to the heat dissipation device, and the air intake pipe is connected to the air intake device. The air intake pipe is connected to one end of the first pipe, and the air outlet pipe is connected to the other end of the first pipe.

13. The backlight module according to claim 10, wherein, At least one of the first pipe and the second pipe is formed by splicing together at least two sub-pipe segments.

14. The backlight module according to claim 9, wherein, The back plate has a groove on the side near the channel device, and the channel device is disposed in the groove.

15. The backlight module according to claim 14, wherein, The groove has a depth greater than 1 mm, and the sidewall thickness of the channel device is greater than or equal to 0.15 mm.

16. The backlight module according to claim 14, wherein, The channel device and the groove are fixedly connected by a third adhesive layer, which has a plurality of third openings, one of which is connected to the first opening and the second opening.

17. The backlight module according to claim 14, wherein, The backlight module also includes an optical film and a support frame, wherein the optical film and the support frame are disposed in the receiving groove of the back plate; The optical film is disposed on the bottom side of the light guide plate away from the back plate, and the support frame is detachably connected to the side wall of the back plate and located on the bottom side of the light source assembly away from the back plate.

18. The backlight module according to claim 7, wherein, In the backlight module viewed from above, the first adhesive layer and the second adhesive layer are partially overlapped.

19. The backlight module according to claim 18, wherein, Along the length of the circuit board, the overlap width of the first adhesive layer and the second adhesive layer is greater than the width of the first air passage.

20. A display device comprising a display panel and a backlight module as described in any one of claims 1-19, wherein the display panel is disposed on one side of the backlight module.

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