Grinding method and apparatus, and electronic device and storage medium
By obtaining the preset grinding file of the object to be ground, the target thickness of each grinding stage is calculated in reverse, which solves the complexity and error problems caused by human modification and realizes a more efficient and accurate grinding process.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- JIANGSU JCA ELECTRONICS TECH CO LTD
- Filing Date
- 2025-12-15
- Publication Date
- 2026-06-25
Smart Images
Figure CN2025142420_25062026_PF_FP_ABST
Abstract
Description
Grinding methods, apparatus, electronic equipment and storage media
[0001] This application claims priority to Chinese Patent Application No. 202411882931.9, filed with the Chinese Patent Office on December 19, 2024, the entire contents of which are incorporated herein by reference. Technical Field
[0002] This application relates to the field of grinding technology, such as a grinding method, apparatus, electronic device, and storage medium. Background Technology
[0003] If the target thickness of each stage of the grinding formula is modified manually, problems are likely to occur (such as the target thickness of the previous grinding stage being smaller than that of the next grinding stage), and the changes are significant. Therefore, manual modification is prone to complexity and errors. Summary of the Invention
[0004] This application provides a grinding method, apparatus, electronic device, and storage medium to solve the problems that manual modification of target thickness is prone to complexity and errors, thereby reducing reliance on manual labor, reducing modification complexity to a certain extent, and improving modification accuracy.
[0005] According to one aspect of this application, a grinding method is provided, the method comprising:
[0006] Obtain a preset grinding file for the object to be ground, the preset grinding file including the initial thickness and target thickness of the object to be ground;
[0007] If it is determined that the current grinding operation is feasible, the target thickness of each grinding stage point in multiple grinding stage points is calculated in reverse based on the initial thickness, the target thickness and the preset grinding amount parameter.
[0008] The object to be ground is ground according to the target thickness of each grinding stage.
[0009] According to another aspect of this application, a grinding apparatus is provided, the apparatus comprising:
[0010] The grinding file acquisition module is configured to acquire a preset grinding file of the object to be ground, wherein the preset grinding file includes the initial thickness and target thickness of the object to be ground.
[0011] The stage target thickness calculation module is configured to, when it is determined that the current grinding operation is executable, reversely calculate the stage target thickness of each grinding stage point among multiple grinding stage points based on the initial thickness, the target thickness and the preset grinding amount parameter;
[0012] The grinding operation execution module is configured to grind the object to be ground according to the target thickness of each grinding stage point.
[0013] According to another aspect of this application, an electronic device is provided, the electronic device comprising:
[0014] At least one processor; and
[0015] A memory communicatively connected to the at least one processor; wherein the memory stores a computer program executable by the at least one processor, the computer program being executed by the at least one processor to enable the at least one processor to perform the grinding method described in any embodiment of this application.
[0016] According to another aspect of this application, a computer-readable storage medium is provided, the computer-readable storage medium storing computer instructions for causing a processor to execute and implement the grinding method described in any embodiment of this application. Attached Figure Description
[0017] Figure 1 is a flowchart of a grinding method provided in Embodiment 1 of this application;
[0018] Figure 2 is a schematic diagram of setting a grinding amount parameter according to Embodiment 1 of this application;
[0019] Figure 3 is a schematic diagram of the application process of a grinding method provided in an embodiment of this application;
[0020] Figure 4 is a schematic diagram of a grinding device provided in Embodiment 2 of this application;
[0021] Figure 5 is a schematic diagram of the structure of an electronic device that implements the grinding method of the present application. Detailed Implementation
[0022] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.
[0023] Example 1
[0024] Figure 1 is a flowchart of a grinding method provided in Embodiment 1 of this application. This embodiment is applicable to grinding objects to be ground. The method can be executed by a grinding device, which can be implemented in hardware and / or software and can be configured in the controller of a grinding equipment. As shown in Figure 1, the method includes:
[0025] S110. Obtain the preset grinding file of the object to be ground, which includes the initial thickness and target thickness of the object to be ground.
[0026] The object to be ground can refer to an industrial component that requires grinding. The preset grinding file can be a pre-designed file containing a grinding formula for the object to be ground; the grinding formula can refer to a grinding plan. The initial thickness of the object to be ground can refer to its original thickness before grinding. The target thickness of the object to be ground can refer to its final thickness after all grinding operations are performed according to the grinding requirements. For example, if the current grinding requirement is to grind object 1 from 1000µm to 500µm, then 1000µm is the initial thickness of object 1, and 500µm is the target thickness of object 1.
[0027] In this embodiment, before the grinding operation is planned for the object to be ground, a preset grinding file designed in advance for the object to be ground can be loaded first, and the initial thickness and target thickness of the object to be ground can be read from the preset grinding file.
[0028] S120. If it is determined that the current grinding operation is feasible, calculate the target thickness of each grinding stage point in multiple grinding stage points in reverse according to the initial thickness, target thickness and preset grinding amount parameters.
[0029] The preset grinding amount parameter refers to the grinding amount parameter value set on the grinding equipment for certain grinding stages. For example, referring to Figure 2, the grinding operation can include coarse grinding and fine grinding. The coarse grinding operation can include the grinding amount of stages P1-P2 and P2-P3, while the fine grinding operation can include the grinding amount of stages P1-P2, P2-P3, and the total grinding amount of the fine grinding stage. In Figure 2, the grinding amounts of 50µm for stage P1-P2 and 30µm for stage P2-P3 in the coarse grinding operation, 15µm for stage P1-P2 and 8µm for stage P2-P3 in the fine grinding operation, and the total grinding amount of 30µm in the fine grinding stage can be preset grinding amount parameters. The grinding stage point can be the start and end time points of the grinding stage. Referring to Figure 2, P1, P2, and P3 are the grinding stage points. The target thickness of a stage can refer to the thickness of the object to be ground at the end of the grinding stage. For example, in Figure 2, the thickness of the object to be ground corresponding to stage P2 in the coarse grinding operation is the target thickness of stage P1-P2, and the thickness of the object to be ground corresponding to stage P3 in the coarse grinding operation is the target thickness of stage P2-P3.
[0030] Since the grinding parameters cannot be completely limited in the actual grinding process, such as the stages before stage P1, the preset grinding amount parameters involved in this embodiment can be a part of the grinding amount parameters in the complete grinding process. In order to achieve the grinding requirement of the target thickness after grinding, the target thickness of each grinding stage can be calculated in reverse when it is determined that the current grinding operation corresponding to the current preset grinding file and the preset grinding amount parameters is executable, so as to perform grinding according to the target thickness of the stage.
[0031] In one scenario, determining that the current grinding operation is executable may include: determining the theoretical total grinding amount of the object to be ground based on the initial thickness and the target thickness; calculating the actual planned grinding amount based on preset grinding amount parameters, and determining the actual planned total grinding amount of the object to be ground based on the actual planned grinding amount; and determining that the current grinding operation of the object to be ground is executable if the theoretical total grinding amount is greater than or equal to the actual planned total grinding amount.
[0032] The theoretical grinding amount refers to the total grinding amount of the object to be ground corresponding to the grinding requirements. This theoretical grinding amount can be determined using the difference between the initial thickness and the target thickness of the object. The actual planned grinding amount refers to the planned grinding amount in the rough grinding stage and the planned grinding amount in the fine grinding stage. The actual planned total grinding amount refers to the sum of the planned grinding amounts in the rough grinding stage and the planned grinding amounts in the fine grinding stage.
[0033] For example, if the initial thickness of the object to be ground is 1000um and the target thickness is 500um, then the theoretical total grinding amount is 500um. Referring to Figure 2, the planned grinding amount in the rough grinding stage can be 50+30=80um, and the planned grinding amount in the fine grinding stage can be 30um. Therefore, the actual planned total grinding amount can be 80+30=110um. In this case, the theoretical total grinding amount is greater than the actual planned total grinding amount. Therefore, the actual grinding plan is executable, and it can be determined that the current grinding operation of the object to be ground is executable.
[0034] Based on the above, it may also include determining that the current grinding operation of the object to be ground is not feasible when the theoretical total grinding amount is less than the actual planned total grinding amount.
[0035] For example, if the initial thickness of the object to be polished is 1000um and the target thickness is 900um, the theoretical total polishing amount is 100um. However, referring to Figure 2, the actual planned total polishing amount is 110um. In this case, the theoretical total polishing amount is less than the actual planned total polishing amount. If polishing is carried out according to the actual planned total polishing amount, the target thickness of the object to be polished will be less than 900um. Therefore, the actual polishing plan is not feasible, and it can be determined that the current polishing operation of the object to be polished is not feasible.
[0036] In another scenario, determining that the current grinding operation is executable may include: calculating the grinding amount for a specified stage of fine grinding based on the grinding amount for the third stage of fine grinding and the grinding amount for the second stage of fine grinding in the preset grinding amount parameters; and determining that the current grinding operation for the object to be ground is executable if the grinding amount for the specified stage of fine grinding is less than or equal to the total grinding amount for fine grinding operations in the preset grinding amount parameters.
[0037] Referring to Figure 2, the grinding amount in the third stage of fine grinding can refer to the grinding amount of stage P2-P3, which is 8µm. The grinding amount in the second stage of fine grinding can refer to the grinding amount of stage P1-P2, which is 15µm. The grinding amount in the specified stage of fine grinding can refer to 15+8=23µm. In this case, 23µm<30µm, so the grinding amount in the specified stage of fine grinding is less than the total grinding amount of the fine grinding operation. The remaining grinding space can be left for the stage before point P1 of fine grinding. Therefore, the grinding operation in this case is feasible, and it can be determined that the current grinding operation of the object to be ground is feasible.
[0038] Based on the above-mentioned alternative scenario, it may also include determining that the current grinding operation of the object to be ground is not executable if the grinding amount in the specified stage of fine grinding is greater than the total grinding amount in the preset grinding amount parameter.
[0039] For example, if the grinding amount in the specified stage of fine grinding in Figure 2 is 15+8=23um, and the total grinding amount of fine grinding operation is 20um, then 23um>20um. In this case, the grinding operation is not feasible, and thus it can be determined that the current grinding operation of the object to be ground is not feasible.
[0040] In one optional embodiment, the stage target thickness of each grinding stage point is calculated in reverse based on the initial thickness, target thickness, and preset grinding amount parameters. This may include: calculating the stage target thickness of the fourth stage point, the stage target thickness of the third stage point, the stage target thickness of the second stage point, the stage target thickness of the first stage point, and the grinding amount of the first stage of fine grinding based on the total grinding amount of the fine grinding operation, the grinding amount of the third stage of fine grinding, and the grinding amount of the second stage of fine grinding in the preset grinding amount parameters; and calculating the stage target thickness of the fourth stage point, the stage target thickness of the third stage point, the stage target thickness of the second stage point, and the grinding amount of the first stage of rough grinding based on the stage target thickness of the first stage point in the fine grinding operation, the grinding amount of the third stage of rough grinding, and the grinding amount of the second stage of rough grinding in the preset grinding amount parameters.
[0041] In this embodiment, referring to Figure 2, for example, the initial thickness of the object to be ground is 1000um and the target thickness is 500um. Based on the target thickness, the target thickness of the fine grinding operation at stage P3 is determined to be 500um. Combined with the grinding amount of the third stage of fine grinding, the target thickness of stage P2 is determined to be 508um. Combined with the grinding amount of the second stage of fine grinding, the target thickness of stage P1 is determined to be 523um. Combined with the total grinding amount of the fine grinding operation, the grinding amount of the first stage of fine grinding (i.e., the fine grinding stage before stage P1) is determined to be 7um. The target thickness of the first stage of fine grinding (stage P0) is 530um.
[0042] Referring to Figure 2, based on the target thickness of the fine grinding P0 stage, the target thickness of the coarse grinding P3 stage is determined to be 530 μm. Combined with the grinding amount of the third stage of coarse grinding, the target thickness of the coarse grinding P2 stage is determined to be 560 μm. Combined with the grinding amount of the second stage of coarse grinding, the target thickness of the coarse grinding P1 stage is determined to be 610 μm. Combined with the initial thickness of the object to be ground, the grinding amount of the first stage of coarse grinding (i.e., the coarse grinding stage before the coarse grinding P1 point) is determined to be 390 μm.
[0043] S130. Grind the object to be ground according to the target thickness of each grinding stage.
[0044] In this embodiment, the object to be ground can be ground according to the target thickness of each grinding stage point in the above example, the grinding amount of the first stage of coarse grinding, and the grinding amount of the first stage of fine grinding.
[0045] Optionally, if it is determined that the current grinding operation is not executable, mark the current grinding operation as unexecutable and switch to a preset grinding file to return to the operation that determines whether the current grinding operation is executable.
[0046] Figure 3 is a schematic diagram of the application process of a grinding method provided in this embodiment. The grinding file is loaded, and it is determined whether the grinding amount, initial thickness, and target thickness of the object to be ground are valid (i.e., whether it is executable). If valid, the target thickness of each stage point can be calculated in reverse, and the calculated target thickness can be displayed on the interface of the grinding equipment. Grinding operations are performed according to the target thickness. If invalid, it can be marked as unable to grind, and the grinding file can be switched back to determine its validity. Alternatively, after marking as unable to grind, the grinding amount, initial thickness, or target thickness can be modified and its validity determined.
[0047] The technical solution of this embodiment obtains a preset grinding file for the object to be ground, which includes the initial thickness and target thickness of the object. When it is determined that the current grinding operation is executable, the target thickness for each grinding stage is calculated in reverse based on the initial thickness, target thickness, and preset grinding amount parameters. The object to be ground is then ground according to the target thickness for each grinding stage. This automatic reverse calculation of the target thickness solves the problem that manual modification of the target thickness is prone to complexity and errors, reducing reliance on manual intervention, lowering the complexity of modification, and improving the accuracy of modification.
[0048] Example 2
[0049] Figure 4 is a schematic diagram of a grinding apparatus provided in Embodiment 2 of this application. As shown in Figure 4, the apparatus includes: a grinding file acquisition module 210, a stage target thickness calculation module 220, and a grinding operation execution module 230. Wherein:
[0050] The grinding file acquisition module 210 is configured to acquire a preset grinding file of the object to be ground, wherein the preset grinding file includes the initial thickness and target thickness of the object to be ground.
[0051] The stage target thickness calculation module 220 is configured to, when it is determined that the current grinding operation is executable, reversely calculate the stage target thickness of each grinding stage point among multiple grinding stage points based on the initial thickness, the target thickness and the preset grinding amount parameter.
[0052] The grinding operation execution module 230 is configured to grind the object to be ground according to the target thickness of each grinding stage point.
[0053] The technical solution of this embodiment obtains a preset grinding file for the object to be ground, which includes the initial thickness and target thickness of the object. When it is determined that the current grinding operation is executable, the target thickness for each grinding stage is calculated in reverse based on the initial thickness, target thickness, and preset grinding amount parameters. The object to be ground is then ground according to the target thickness for each grinding stage. This automatic reverse calculation of the target thickness solves the problem that manual modification of the target thickness is prone to complexity and errors, reducing reliance on manual intervention, lowering the complexity of modification, and improving the accuracy of modification.
[0054] Optionally, the stage target thickness calculation module 220 includes a first executable judgment unit, configured as follows:
[0055] The theoretical total grinding amount of the object to be ground is determined based on the initial thickness and the target thickness.
[0056] The actual planned grinding amount is calculated based on the preset grinding amount parameters, and the actual planned total grinding amount of the object to be ground is determined based on the actual planned grinding amount.
[0057] If the theoretical total grinding amount is greater than or equal to the actual planned total grinding amount, the current grinding operation of the object to be ground is determined to be executable.
[0058] Optionally, the stage target thickness calculation module 220 further includes a first non-executable judgment unit, configured as follows:
[0059] If the theoretical total grinding amount is less than the actual planned total grinding amount, the current grinding operation on the object to be ground is determined to be unexecutable.
[0060] Optionally, the stage target thickness calculation module 220 includes a second executable judgment unit, configured as follows:
[0061] Based on the grinding amounts of the third and second stages of fine grinding in the preset grinding amount parameters, calculate the grinding amount for the specified fine grinding stage.
[0062] If the grinding amount in the specified fine grinding stage is less than or equal to the total grinding amount in the preset grinding amount parameter, then the current grinding operation of the object to be ground is determined to be executable.
[0063] Optionally, the stage target thickness calculation module 220 further includes a second non-executable judgment unit, configured as follows:
[0064] If the grinding amount in the specified fine grinding stage is greater than the total grinding amount in the preset grinding amount parameter, the current grinding operation of the object to be ground is determined to be unexecutable.
[0065] Optionally, the stage target thickness calculation module 220 is configured as follows:
[0066] Based on the initial thickness, the target thickness, and the preset grinding amount parameters, the total grinding amount of the fine grinding operation, the grinding amount of the third stage of fine grinding, and the grinding amount of the second stage of fine grinding, the target thickness of the fourth stage of fine grinding, the target thickness of the third stage, the target thickness of the second stage, the target thickness of the first stage, and the grinding amount of the first stage of fine grinding are calculated in reverse.
[0067] Based on the target thickness of the first stage point in the fine grinding operation, the grinding amount of the third stage of coarse grinding and the grinding amount of the second stage of coarse grinding in the preset grinding amount parameters, the target thickness of the fourth stage point, the target thickness of the third stage point, the target thickness of the second stage point and the grinding amount of the first stage of coarse grinding are calculated in reverse.
[0068] Optionally, the grinding apparatus further includes an operation return execution module, configured as follows:
[0069] If it is determined that the current grinding operation is not executable, mark the current grinding operation as unexecutable, and switch the preset grinding file to return to the operation that determines whether the current grinding operation is executable.
[0070] The grinding apparatus provided in this application embodiment can perform the grinding method provided in any embodiment of this application, and has the corresponding functional modules and effects of the method.
[0071] Example 3
[0072] Figure 5 illustrates a schematic diagram of an electronic device 300 that can be used to implement embodiments of this application. The electronic device can be a variety of digital computers, such as laptops, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframes, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices (e.g., helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the application described and / or claimed herein.
[0073] As shown in Figure 5, the electronic device 300 includes at least one processor 301 and a memory, such as a read-only memory (ROM) 302 or a random access memory (RAM) 303, communicatively connected to the at least one processor 301. The memory stores computer programs executable by the at least one processor. The processor 301 can perform various appropriate actions and processes based on the computer program stored in the ROM 302 or loaded into the RAM 303 from storage unit 308. The RAM 303 can also store various programs and data required for the operation of the electronic device 300. The processor 301, ROM 302, and RAM 303 are interconnected via a bus 304. An input / output (I / O) interface 305 is also connected to the bus 304.
[0074] Multiple components in electronic device 300 are connected to I / O interface 305, including: input unit 306, such as keyboard, mouse, etc.; output unit 307, such as various types of displays, speakers, etc.; storage unit 308, such as disk, optical disk, etc.; and communication unit 309, such as network card, modem, wireless transceiver, etc. Communication unit 309 allows electronic device 300 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.
[0075] Processor 301 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of processor 301 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, digital signal processors (DSPs), and any suitable processor, controller, microcontroller, etc. Processor 301 performs several of the methods and processes described above, such as grinding methods.
[0076] In some embodiments, the polishing method may be implemented as a computer program tangibly contained in a computer-readable storage medium, such as storage unit 308. In some embodiments, part or all of the computer program may be loaded and / or mounted on electronic device 300 via ROM 302 and / or communication unit 309. When the computer program is loaded into RAM 303 and executed by processor 301, one or more steps of the polishing method described above may be performed. Alternatively, in other embodiments, processor 301 may be configured to perform the polishing method by any other suitable means (e.g., by means of firmware).
[0077] The various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems on chips (SOCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These implementations may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.
[0078] Computer programs used to implement the methods of this application may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when executed by the processor, the computer programs cause the functions / operations specified in the flowcharts and / or block diagrams to be performed. The computer programs may be executed entirely on a machine, partially on a machine, or as a standalone software package, partially on a machine and partially on a remote machine, or entirely on a remote machine or server.
[0079] In the context of this application, a computer-readable storage medium can be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, apparatus, or device. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. A machine-readable storage medium may include an electrical connection based on one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM) or flash memory, optical fiber, compact disc read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.
[0080] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device for displaying information to the user (e.g., a cathode ray tube (CRT) or liquid crystal display (LCD) monitor); and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).
[0081] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as data servers), or middleware components (e.g., application servers), or frontend components (e.g., user computers with graphical user interfaces or web browsers through which users can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., communication networks). Examples of communication networks include local area networks (LANs), wide area networks (WANs), blockchain networks, and the Internet.
[0082] A computing system can include clients and servers. Clients and servers are generally located far apart and typically interact via communication networks. The client-server relationship is established by running computer programs on the respective computers. The server can be a cloud server, also known as a cloud computing server or cloud host, which is a hosting product within the cloud computing service system. It addresses the shortcomings of traditional physical hosts and Virtual Private Server (VPS) services, such as high management difficulty and weak business scalability.
[0083] It should be understood that the various processes shown above can be used to rearrange, add, or delete steps. For example, the multiple steps described in this application can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this application can be achieved, and this is not limited herein.
Claims
1. A grinding method, comprising: Obtain a preset grinding file for the object to be ground, the preset grinding file including the initial thickness and target thickness of the object to be ground; If it is determined that the current grinding operation is feasible, the target thickness of each grinding stage point in multiple grinding stage points is calculated in reverse based on the initial thickness, the target thickness and the preset grinding amount parameter. The object to be ground is ground according to the target thickness of each grinding stage.
2. The method of claim 1, wherein, To determine if the current grinding operation is feasible, the following steps are taken: The theoretical total grinding amount of the object to be ground is determined based on the initial thickness and the target thickness. The actual planned grinding amount is calculated based on the preset grinding amount parameters, and the actual planned total grinding amount of the object to be ground is determined based on the actual planned grinding amount. In response to a comparison result showing that the theoretical total grinding amount is greater than or equal to the actual planned total grinding amount, the current grinding operation of the object to be ground is determined to be executable.
3. The method of claim 2, further comprising: In response to the comparison result that the theoretical total grinding amount is less than the actual planned total grinding amount, it is determined that the current grinding operation of the object to be ground is not feasible.
4. The method of claim 1, wherein, To determine if the current grinding operation is feasible, the following steps are taken: Based on the grinding amounts of the third and second stages of fine grinding in the preset grinding amount parameters, calculate the grinding amount for the specified fine grinding stage. In response to the comparison result that the grinding amount in the specified fine grinding stage is less than or equal to the total grinding amount in the preset grinding amount parameter, it is determined that the current grinding operation of the object to be ground is executable.
5. The method of claim 4, further comprising: In response to the comparison result that the grinding amount in the specified fine grinding stage is greater than the total grinding amount in the preset grinding amount parameter, it is determined that the current grinding operation of the object to be ground is not executable.
6. The method of claim 1, wherein, The target thickness for each grinding stage is calculated in reverse based on the initial thickness, the target thickness, and the preset grinding amount parameters, including: Based on the initial thickness, the target thickness, and the preset grinding amount parameters, the total grinding amount of the fine grinding operation, the grinding amount of the third stage of fine grinding, and the grinding amount of the second stage of fine grinding, the target thickness of the fourth stage of fine grinding, the target thickness of the third stage, the target thickness of the second stage, the target thickness of the first stage, and the grinding amount of the first stage of fine grinding are calculated in reverse. Based on the target thickness of the first stage point in the fine grinding operation, the grinding amount of the third stage of coarse grinding and the grinding amount of the second stage of coarse grinding in the preset grinding amount parameters, the target thickness of the fourth stage point, the target thickness of the third stage point, the target thickness of the second stage point and the grinding amount of the first stage of coarse grinding are calculated in reverse.
7. The method of claim 3 or 5, further comprising: If it is determined that the current grinding operation is not executable, mark the current grinding operation as unexecutable, and switch the preset grinding file to return to the operation that determines whether the current grinding operation is executable.
8. A grinding apparatus, comprising: The grinding file acquisition module is configured to acquire a preset grinding file of the object to be ground, wherein the preset grinding file includes the initial thickness and target thickness of the object to be ground. The stage target thickness calculation module is configured to, when it is determined that the current grinding operation is executable, reversely calculate the stage target thickness of each grinding stage point among multiple grinding stage points based on the initial thickness, the target thickness and the preset grinding amount parameter; The grinding operation execution module is configured to grind the object to be ground according to the target thickness of each grinding stage point.
9. An electronic device, comprising: At least one processor; as well as A memory communicatively connected to the at least one processor; wherein the memory stores a computer program executable by the at least one processor, the computer program being executed by the at least one processor to enable the at least one processor to perform the grinding method according to any one of claims 1-7.
10. A computer readable storage medium, wherein, The computer-readable storage medium stores computer instructions that are used to cause a processor to execute the grinding method according to any one of claims 1-7.