RF front-end module

Abstract

This RF front-end module comprises: an RF integrated circuit including a plurality of elements each having an amplifier; a power supply circuit for supplying a power supply voltage to the plurality of elements; and a plurality of electrical paths for electrically connecting the plurality of elements and the power supply circuit, wherein the difference between electrical resistance values of any two of the plurality of electrical paths is also a value within a range of -5% - +5%.

Description

RF Front-End Module

[0001] This disclosure relates to an RF front-end module.

[0002] As disclosed in Patent Document 1 below, phased array antennas are being developed. A phased array antenna includes an antenna module and an RF (Radio Frequency) front-end module. The antenna module includes a plurality of antennas each of which transmits or receives radio waves. The RF front-end module includes a plurality of elements that transmit signals to the plurality of antennas or receive signals from the plurality of antennas, and a power supply circuit that supplies a power supply voltage to the plurality of elements. Each of the plurality of elements includes at least an amplifier.

[0003] Japanese Patent Application Publication No. 2023-534018

[0004] In the above RF front-end module, the lengths of a plurality of electrical paths including a plurality of wirings provided between the plurality of elements and the power supply circuit are different. Therefore, variations in voltage drop occur in the relationship between the power supplies that apply voltage to each of the plurality of elements via the plurality of electrical paths from the power supply circuit.

[0005] Also, in order to increase the communication distance, it is preferable to increase the number of elements of the RF front-end module. However, when the number of elements increases, the distance of each of the plurality of electrical paths between the power supply circuit and the plurality of elements becomes longer. As a result, variations in voltage drop increase in the relationship between the plurality of power supplies that apply voltage to the plurality of elements via the plurality of electrical paths from the power supply circuit.

[0006] From the above, in the RF front-end module, there is a possibility that variations in the plurality of output powers of the plurality of elements will increase. As a result, there is a possibility that variations in the output of radio waves emitted from the plurality of antennas during transmission will increase. Also, in a phased array antenna, there is a possibility that the radiation pattern will collapse.

[0007] This disclosure has been made in view of the above-mentioned problems. This disclosure provides an RF front-end module that can reduce variations in multiple output powers of multiple elements and suppress distortion of the radiation pattern.

[0008] The RF front-end module of this disclosure comprises a radio frequency integrated circuit including a plurality of elements, each having an amplifier; a power supply circuit that supplies a power supply voltage to the plurality of elements; and a plurality of electrical paths that electrically connect the plurality of elements and the power supply circuit, wherein the difference between any two electrical resistance values ​​of the plurality of electrical paths is within the range of -5% to +5%.

[0009] This is a plan view of the antenna surface of the phased array antenna of Embodiment 1. This is a cross-sectional view of the phased array antenna of Embodiment 1, which is the cross-sectional view taken along line II in Figure 1. This is a plan view of the integrated circuit mounting surface of the phased array antenna of Embodiment 1. This is a plan view of the RF integrated circuit of Embodiment 1. This is a circuit diagram of the element of Embodiment 1. This is a diagram showing the configuration of multiple electrical paths of Embodiment 1. This is a diagram showing the configuration of multiple electrical paths of Embodiment 2. This is a diagram showing the configuration of multiple electrical paths of Embodiment 3. This is a diagram showing the configuration of multiple electrical paths of Embodiment 4. This is a diagram showing the configuration of multiple electrical paths of Embodiment 5. This is a diagram showing the configuration of multiple electrical paths of Embodiment 6. This is a cross-sectional view of the multiple electrical paths of Embodiment 6.

[0010] Hereinafter, the RF (Radio Frequency) front-end module of the embodiment of this disclosure will be described with reference to the drawings. In the drawings, the same or equivalent elements are denoted by the same reference numerals, and redundant descriptions will not be repeated.

[0011] (Embodiment 1) The RF front-end module of Embodiment 1 will be described using Figures 1 to 6.

[0012] Figure 1 is a plan view of the antenna surface of the phased array antenna 100 according to this embodiment. Figure 2 is a cross-sectional view of the phased array antenna 100 according to this embodiment, and is a cross-sectional view taken along line II in Figure 1. Figure 3 is a plan view of the integrated circuit mounting surface of the phased array antenna 100 according to this embodiment.

[0013] As shown in Figures 1 to 3, the phased array antenna 100 comprises a module board 200, antennas 11, a first feed point 12, a second feed point 13, an RF (Radio Frequency) integrated circuit 14, a connector 15, and a power supply circuit 16. The phased array antenna 100 can not only transmit radio waves but also receive them. Let's consider the case where the phased array antenna 100 transmits radio waves. In this case, a signal input to the RF integrated circuit 14 from an external source via the connector 15 is amplified (including phase adjustment), and flows through the wiring 10 to the first feed point 12 and second feed point 13 of each of the multiple antennas 11. As a result, radio waves are emitted from each of the multiple antennas 11. On the other hand, when the multiple antennas 11 receive radio waves, the signal flows in the opposite direction to when the multiple antennas 11 transmit radio waves. Specifically, the radio waves received by the multiple antennas 11 are converted into electrical signals, and the converted electrical signals flow through the wiring 10 and the RF integrated circuit 14 to the connector 15, where they are extracted. The power supply circuit 16 supplies the power supply voltage to drive the RF integrated circuit 14.

[0014] Multiple antennas, for example, four antennas 11 are provided on the antenna surface of the module board 200, and a configuration including multiple antennas 11 is called an antenna module. An RF integrated circuit 14, a connector 15, and a power supply circuit 16 are provided on the integrated circuit mounting surface of the module board 200. In this specification, a configuration including the RF integrated circuit 14, connector 15, and power supply circuit 16 is called an RF front-end module. The antennas 11 are dual antennas compatible with both H and V polarization, and the number of antennas is 1 x 4. The antennas 11 and the RF integrated circuit 14 are electrically connected by wiring 10.

[0015] Figure 4 is a plan view of the RF integrated circuit 14 (RFIC (Radio Frequency Integration Circuit)) of this embodiment 1. Figure 5 is a circuit diagram of the element 17 of this embodiment. Figure 6 is a diagram showing the configuration of the multiple electrical paths 30 of this embodiment.

[0016] The RF integrated circuit 14 integrates, for example, amplifiers, power amplifiers, low-noise amplifiers, variable amplifiers, mixers, filters, frequency multipliers, phase-locked loops (PLLs), distributors (couplers), calibration circuits, SPIs (Serial Peripheral Interfaces), phase shifters, etc., all of which are not shown in the diagram, onto a single chip. The RF integrated circuit 14 includes multiple elements, for example, eight elements 17. Power supplied from the power supply circuit 16 to the RF integrated circuit 14 is supplied in a one-to-one relationship from the eight elements 17 to the first feed point 12 and second feed point 13 of the four antennas 11. Therefore, in this embodiment, the multiple antennas 11 and the multiple elements 17 are electrically connected in a one-to-two relationship. However, the multiple elements 17 and the multiple antennas 11 may be electrically connected in a one-to-one, one-to-many, or many-to-one relationship.

[0017] In addition to the multiple elements 17, the RF integrated circuit 14 includes, as a shared block, an amplifier, a variable amplifier, a mixer, a filter, a frequency multiplier, a phase-locked loop (PLL), a distributor (coupler), a calibration circuit, and an SPI (Serial Peripheral Interface), all of which are not shown in the figure. The RF integrated circuit 14 is an RFIC (4H / 4V element) that supports both H and V polarization. The RF integrated circuit 14 may also have a gain adjustment function using a low-noise amplifier and a buffer amplifier.

[0018] As shown in Figure 5, each of the multiple elements 17 includes a power amplifier 18, a bidirectional phase shifter 19, an amplifier 20, and a low-noise amplifier 21. The electrical connections of the power amplifier 18, bidirectional phase shifter 19, amplifier 20, and low-noise amplifier 21 are not limited to those shown in Figure 5. Each of the multiple elements 17 includes at least an amplifier, but each of the multiple elements 17 may also include a phase shifter in addition to the amplifier.

[0019] As shown in Figure 6, the RF integrated circuit 14 includes a plurality of elements 17. The power supply circuit 16 supplies power to each of the plurality of elements 17. Multiple electrical paths 30 electrically connect each of the plurality of elements 17 to the power supply circuit 16 (PMIC (Power Management Integration Circuit)). The power supply circuit 16 (PMIC) includes a DC / DC converter and a regulator, etc. In the embodiment 4 described later, the regulator is provided within the RF integrated circuit 14C.

[0020] As can be seen from the above, the phased array antenna 100 comprises an RF integrated circuit 14, a power supply circuit 16, and a plurality of electrical paths 30. Each of the plurality of electrical paths 30 represents the length between the pads at both ends of a printed circuit provided on a printed circuit board, an example of a module board 200. In Figure 6, a portion of the wiring is shared by a portion of the plurality of electrical paths 30. However, each of the plurality of electrical paths 30 may be composed of a single independent wire that electrically connects the pads to each other.

[0021] The difference between any two electrical resistance values ​​in the multiple electrical paths 30 is within the range of -5% to +5%. Therefore, variations in the voltage drop of power supplied from the power supply circuit 16 to the multiple elements 17 can be reduced. As a result, variations in the multiple output powers of the multiple elements 17 can be reduced.

[0022] From the viewpoint of reducing voltage drop variations, it is preferable that the difference between any two electrical resistance values ​​in any of the multiple electrical paths 30 is within the range of -3% to +3%. It is even more preferable that the difference between any two electrical resistance values ​​in any of the multiple electrical paths 30 is within the range of -1% to +1%. It is most preferable that the difference between any two electrical resistance values ​​in any of the multiple electrical paths 30 is zero.

[0023] In the RF front-end module of this embodiment, the wiring materials constituting the multiple electrical paths 30 are made of substantially the same composition and have substantially the same cross-sectional area in all parts. In this specification, the word "substantially" is used to allow for manufacturing tolerances in the manufacturing process.

[0024] In the RF front-end module of this embodiment, the difference in length between any two of the multiple electrical paths 30 is within the range of -5% to +5%. This allows for a simple structure and reduces voltage drop variations in the relationship between multiple power supplies that apply voltage from the power supply circuit 16 to multiple elements 17. Regarding the antenna characteristics during transmission in the phased array antenna 100, it is desirable that the difference between the output characteristics of the multiple elements 17 be as small as possible. Therefore, the RF front-end module of this embodiment described above can emit radio waves with an ideal radiation pattern and small side lobes.

[0025] From the viewpoint of reducing voltage drop variations, it is preferable that the difference in length between any two of the multiple electrical paths 30 is within the range of -3% to +3%. It is even more preferable that the difference in length between any two of the multiple electrical paths 30 is within the range of -1% to +1%. It is most preferable that the difference in length between any two of the multiple electrical paths 30 is zero.

[0026] As shown in Figure 6, the multiple electrical paths 30 include a tournament bracket-shaped section 31. This simplifies the design process to ensure that the difference in length between any two of the multiple electrical paths 30 approaches zero. The tournament bracket shape is a configuration in which two adjacent wires from a large number of wires repeatedly merge into one wire, ultimately resulting in a single wire. When the multiple electrical paths 30 form a tournament bracket shape, the number of electrical paths 30 is 2n, where n is a natural number, and a portion of the multiple electrical paths 30 is composed of a single wire section.

[0027] In this embodiment of the radio frequency front-end module, the distance from the pad connected to the output terminal of the power supply circuit 16 to the pad of the input terminal of the element 17 is the length of one electrical path 30. The element 17 may be provided with multiple input terminal pads. In this case, the length of the electrical path 30 is the distance between the pad connected to the output terminal of the power supply circuit 16 and the pad closest to the output terminal among the multiple input terminal pads of the element 17.

[0028] (Embodiment 2) The RF front-end module of Embodiment 2 will be described using Figure 7. Note that the explanation of points that are the same as those of the RF front-end module of Embodiment 1 will not be repeated below. The RF front-end module of this embodiment differs from the RF front-end module of Embodiment 1 in the following respects.

[0029] Figure 7 shows the configuration of the multiple electrical paths 30 in this embodiment.

[0030] As shown in Figure 7, in this embodiment, of the eight electrical paths 30, six electrical paths 30 include a waveform portion 32. However, it is sufficient that at least one of the multiple electrical paths 30 includes a waveform portion 32. The waveform portion 32 can be any shape that can be recognized as a waveform, such as a sine wave, pulse wave, or sawtooth shape.

[0031] In this embodiment as well, a portion of the wiring is shared by a portion of the multiple electrical paths 30. At least one of the multiple electrical paths 30 in this embodiment only needs to include a wave-shaped portion 32.

[0032] In the RF front-end module of this embodiment, the difference in length between any two of the multiple electrical paths 30 is within the range of -5% to +5%. In the RF front-end module of this embodiment, the wiring material constituting the multiple electrical paths 30 is assumed to be substantially the same in composition and substantially the same in cross-sectional area in all parts. Therefore, in this embodiment as well, the difference in electrical resistance between any two of the multiple electrical paths 30 is within the range of -5% to +5%.

[0033] The phased array antenna 100 of this embodiment can also reduce voltage drop variations in the relationship between multiple power sources that apply voltage from the power supply circuit 16 to multiple elements 17. As a result, variations in the multiple output powers of the multiple elements 17 can be reduced.

[0034] The electrical path 30 of the element 17 closer to the power supply circuit 16, that is, the innermost electrical path 30 among the multiple electrical paths 30, has a greater number of waves in the waveform portion 32. However, the difference in length of the multiple electrical paths 30 between each of the multiple elements 17 and the power supply circuit 16 is within the range of -5% to +5%.

[0035] (Embodiment 3) The RF front-end module of Embodiment 3 will be described with reference to Figure 8. Note that the explanation of points that are the same as those of the RF front-end module of Embodiment 1 or 2 will not be repeated below. The RF front-end module of this embodiment differs from the RF front-end module of Embodiment 1 or 2 in the following respects.

[0036] Figure 8 shows the configuration of the multiple electrical paths 30 in this embodiment.

[0037] In this embodiment, as in the previous embodiment, six of the eight electrical paths 30 include a waveform portion 32. However, in this embodiment as well, it is sufficient that at least one of the multiple electrical paths 30 includes a waveform portion 32. The waveform portion 32 can be any shape that can be recognized as a waveform, such as a sine wave, pulse wave, or sawtooth shape.

[0038] Unlike the multiple electrical paths 30 in Embodiment 1 or 2, each of the multiple electrical paths 30 in this embodiment is composed of a single independent wire. In the RF front-end module of this embodiment as well, the difference in length between any two of the multiple electrical paths 30 is within the range of -5% to +5%. Therefore, in this embodiment as well, the difference in electrical resistance between any two of the multiple electrical paths 30 is within the range of -5% to +5%.

[0039] The RF front-end module of this embodiment also reduces voltage drop variations in the relationships between multiple power supplies that apply voltage from the power supply circuit 16 to multiple elements 17. As a result, variations in the multiple output powers of the multiple elements 17 can be reduced.

[0040] The element 17 closer to the power supply circuit 16 has a greater number of waves in the waveform portion 32 of one electrical path in the multiple electrical paths 30, i.e., an independent single wire. In other words, in this embodiment, unlike embodiments 1 and 2, the wiring from each of the multiple elements 17 to the power supply circuit 16 is independent. To put it another way, no part of the wiring is shared by any part of the multiple electrical paths 30.

[0041] Therefore, when all elements 17 are operating, in the RF front-end modules of embodiments 1 and 2, the current flowing through one wire near the power supply circuit 16 is the merger of the currents flowing through multiple wires near multiple elements 17. Consequently, the current flowing through one wire near the power supply circuit 16 becomes considerably larger than the currents flowing through each of the multiple wires near multiple elements 17. Therefore, if one wire near the power supply circuit 16 has the same wiring width (cross-sectional area) as each of the multiple wires near the elements 17, the voltage drop in one wire near the power supply circuit 16 becomes considerably larger than the voltage drop in each of the multiple wires near the elements 17. In order to suppress such a voltage drop in one wire near the power supply circuit 16 as much as possible, it is necessary to make the width (cross-sectional area) of one wire near the power supply circuit 16 sufficiently large. However, in the case of the RF front-end module of this embodiment, the magnitude of the current flowing from each element 17 to the power supply circuit 16 is almost the same at any point in the multiple wires, so the width (cross-sectional area) of each wire can be made relatively narrow (small).

[0042] (Embodiment 4) The RF front-end module of Embodiment 4 will be described using Figure 9. Note that the same points as the RF front-end modules of Embodiments 1 to 3 will not be repeated below. The RF front-end module of this embodiment differs from the RF front-end modules of Embodiments 1 to 3 in the following respects.

[0043] Figure 9 shows the configuration of the multiple electrical paths 30 in this embodiment.

[0044] As shown in Figure 9, in the RF front-end module of this embodiment, the power supply circuit 16 includes a regulator 22 (for example, an LDO (Low Drop Out) regulator) that adjusts the voltage supplied from the power supply unit including the PMIC. In the RF front-end module of this embodiment, the regulator 22 is located inside the RF integrated circuit 14 and outside the plurality of elements 17, but is considered to be part of the power supply circuit 16.

[0045] In the RF front-end module of the present embodiment, the plurality of electrical paths 30 are paths through which current flows between the plurality of elements 17 and the regulator 22. Also in the RF front-end module of the present embodiment, the difference in length between any two of the plurality of electrical paths 30 is a value within the range of -5% to +5%. Therefore, also in the present embodiment, the difference in electrical resistance between any two of the plurality of electrical paths 30 is a value within the range of -5% to +5%.

[0046] Also by the RF front-end module of the present embodiment, in the relationship between the plurality of power supplies that apply voltage from the power supply circuit 16 to the plurality of elements 17, the variation in voltage drop can be reduced. As a result, the variation in the plurality of output powers of the plurality of elements 17 can be reduced.

[0047] The plurality of electrical paths 30 of the present embodiment include the tournament table-shaped portion 31. Therefore, also by the RF front-end module of the present embodiment, the design for bringing the difference in length between any two of the plurality of electrical paths 30 closer to zero becomes simple.

[0048] By increasing the regulator 22, for example, if the regulator 22 is arranged for each element 17, the lengths of the respective electrical paths 30 between each element 17 and the regulator 22 can be made the same without adopting the wiring shape as in the present embodiment.

[0049] However, the area of the RF integrated circuit 14 increases as the number of regulators 22 increases. Also, the larger the output current, the larger the size of the regulator 22 tends to be, and the occupied area of the RF integrated circuit 14 in plan view increases. According to the RF front-end module of the present embodiment, in a configuration where the number of regulators 22 is less than the number of elements 17, the lengths of the respective electrical paths 30 between each element 17 and the regulator 22 can be made substantially the same.

[0050] (Embodiment 5) The RF front-end module of Embodiment 5 will be described using Figure 10. Note that the same points as the RF front-end modules of Embodiments 1 to 4 will not be repeated below. The RF front-end module of this embodiment differs from the RF front-end modules of Embodiments 1 to 4 in the following respects.

[0051] Figure 10 is a diagram showing the configuration of the multiple electrical paths 30 in Embodiment 5.

[0052] As shown in Figure 10, one of the multiple electrical paths 30 includes a first wiring section 33 enclosed by a dotted line. Another of the multiple electrical paths 30 includes a second wiring section 34 enclosed by a dotted line. The length of the first wiring section 33 is shorter than the length of the second wiring section 34, and the cross-sectional area of ​​the first wiring section 33 is larger than the cross-sectional area of ​​the second wiring section 34. As a result, the difference between the electrical resistance (length × cross-sectional area) of the first wiring section 33 and the electrical resistance (length × cross-sectional area) of the second wiring section 34 is within the range of -5% to +5%. Therefore, in this embodiment as well, the difference between the electrical resistances of any two of the multiple electrical paths 30 is within the range of -5% to +5%. In addition, in the RF front-end module of this embodiment, the wiring material constituting the multiple electrical paths 30 is assumed to be substantially the same in composition and substantially the same in cross-sectional area in all parts. Furthermore, the multiple electrical paths 30 can be divided into a portion where part of the wiring is shared by part of the multiple electrical paths 30, and a portion where part of the wiring is not shared by part of the multiple electrical paths 30. The first wiring section 33 and the second wiring section 34 in this embodiment can be said to correspond to the portion that is not shared by part of the multiple electrical paths 30.

[0053] The phased array antenna 100 of this embodiment can also reduce voltage drop variations in the relationship between multiple power sources that apply voltage from the power supply circuit 16 to multiple elements. As a result, variations in the multiple output powers of the multiple elements 17 can be reduced.

[0054] Furthermore, a configuration may be adopted in which additional electrical resistance is added so that the electrical resistance of any two of the multiple electrical paths 30 between the element 17 and the power supply circuit 16 is the same.

[0055] (Embodiment 6) The RF front-end module of Embodiment 6 will be described with reference to Figures 11 and 12. Note that the same points as those of the RF front-end modules of Embodiments 1 to 5 will not be repeated below. The RF front-end module of this embodiment differs from the RF front-end modules of Embodiments 1 to 5 in the following respects.

[0056] Figure 11 is a diagram showing the configuration of the multiple electrical paths 30 in this embodiment. Figure 12 is a cross-sectional view of the multiple electrical paths 30 in this embodiment. Note that Figure 12 is a simplified diagram for explaining the connection relationship between the layer wiring section 35 and the via wiring section 36, and therefore the positional relationship of the actual module board 200, the layer wiring section 35, and the via wiring section 36 may differ from the structure shown in Figure 12.

[0057] As shown in Figures 11 and 12, each of the multiple electrical paths 30 includes two or more layered wiring sections 35 and one or more via wiring sections 36. The two or more layered wiring sections 35 extend along two opposing main surfaces 200A and 200B of the module substrate 200. The one or more via wiring sections 36 extend in a direction intersecting the two main surfaces 200A and 200B and electrically connect any two of the two or more layered wiring sections 35. In the RF front-end module of this embodiment, for the sake of simplicity of explanation, an example is described in which two of the two or more layered wiring sections 35 constitute the two opposing main surfaces 200A and 200B of the module substrate 200. However, when the module substrate 200 is composed of a multilayer wiring board, some of the two or more layered wiring sections 35 may not be exposed on the main surfaces 200A and 200B of the multilayer wiring board, but are provided inside the multilayer wiring board. Therefore, any two of the two or more layer wiring sections 35 extending along the main surfaces 200A and 200B include not only those exposed to form the main surfaces 200A and 200B of the module substrate 200, but also those provided inside the module substrate 200 substantially parallel to the main surfaces 200A and 200B. Note that extending along the main surfaces 200A and 200B means extending along the in-plane direction of the module substrate 200.

[0058] Each of the multiple electrical paths 30 has the same number of via wiring sections 36, one or more of them. Furthermore, in any two of the multiple electrical paths 30, the difference in length between two layer wiring sections 35 belonging to the same layer out of two or more layer wiring sections 35 is within the range of -5% to +5%. Note that two layer wiring sections 35 belonging to the same layer are layer wiring sections located at approximately the same distance in the thickness direction of the module substrate 200 from the main surface 200A or 200B of the module substrate 200. Therefore, in this embodiment as well, the difference in electrical resistance between any two of the multiple electrical paths 30 is within the range of -5% to +5%. In the RF front-end module of this embodiment, the wiring material constituting the multiple electrical paths 30 is assumed to have substantially the same composition and substantially the same cross-sectional area in all parts.

[0059] For example, the difference between the length of one layer wiring section 35, for example, the layer wiring section 35 on the main surface 200B side, and the length of one layer wiring section 35, for example, the layer wiring section 35 on the main surface 200B side, among the two or more layer wiring sections 35 in one electrical path 30, is within the range of -5% to +5%.

[0060] Furthermore, the difference between the length of one layer wiring section 35, for example, the layer wiring section 35 on the main surface 200A side, and the length of one layer wiring section 35, for example, the layer wiring section 35 on the main surface 200A side, among the two or more layer wiring sections 35 in the other electrical path 30, is within the range of -5% to +5%.

[0061] In addition, among the multiple electrical paths 30, one electrical path 30 may contain multiple via wiring sections 36. In this case, one of the two or more layer wiring sections 35 described above is considered to be a layer wiring section 35 between via wiring sections 36 of adjacent layers in the thickness direction of the module substrate 200. In this case, the lengths of the layer wiring sections 35 between via wiring sections 36 are compared as the lengths of the two corresponding layer wiring sections.

[0062] The phased array antenna 100 of this embodiment can also reduce voltage drop variations in the relationship between multiple power sources that apply voltage from the power supply circuit 16 to multiple elements 17. As a result, variations in the multiple output powers of the multiple elements 17 can be reduced.

Claims

1. An RF (Radio Frequency) front-end module comprising: an RF (Radio Frequency) integrated circuit including a plurality of elements, each having an amplifier; a power supply circuit that supplies a power supply voltage to the plurality of elements; and a plurality of electrical paths that electrically connect the plurality of elements and the power supply circuit, wherein the difference between any two electrical resistance values ​​of the plurality of electrical paths is within the range of -5% to +5%.

2. The RF front-end module according to claim 1, wherein each of the plurality of elements has a phase shifter.

3. The RF front-end module according to claim 1, wherein the difference between any two lengths of the plurality of electrical paths is within the range of -5% to +5%.

4. The RF front-end module according to claim 1, wherein the plurality of electrical paths include a tournament bracket-shaped portion.

5. The RF front-end module according to claim 1, wherein at least one of the plurality of electrical paths includes a wave-shaped portion.

6. The RF front-end module according to claim 1, wherein the power supply circuit is provided within the RF integrated circuit and includes a regulator for adjusting the power supply voltage, and the plurality of electrical paths are paths between the plurality of elements and the regulator.

7. The RF front-end module according to claim 1, wherein any one of the plurality of electrical paths includes a first wiring section, any one of the plurality of electrical paths includes a second wiring section, the length of the first wiring section is shorter than the length of the plurality of wiring sections, and the cross-sectional area of ​​the first wiring section is larger than the cross-sectional area of ​​the second wiring section.

8. The RF front-end module according to claim 1, wherein each of the plurality of electrical paths includes two or more layer wiring sections extending along two opposing main surfaces of the module substrate, and one or more via wiring sections extending in a direction intersecting the two main surfaces and electrically connecting any two of the two or more layer wiring sections, the number of the one or more via wiring sections is the same for each of the plurality of electrical paths, and in any two of the plurality of electrical paths, the difference in length between two layer wiring sections belonging to the same layer among the two or more layer wiring sections is within the range of -5% to +5%.

Images