Pixel packaging structure and display panel

Abstract

A pixel packaging structure and a display panel. The pixel packaging structure comprises a carrier substrate, a plurality of light-emitting chips, and an integrated circuit unit. A plurality of pixel regions are provided on the carrier substrate, with the centers of any two adjacent pixel regions being equally spaced. The plurality of light-emitting chips can emit light of at least three colors, and the light-emitting chips capable of emitting light of at most two colors are disposed in the same pixel region. The integrated circuit unit is disposed on the carrier substrate and is electrically connected to the light-emitting chips. The display panel comprises the pixel packaging structure.

Description

Pixel packaging structure and display panel

[0001] Cross-reference of related applications

[0002] This application claims priority to Chinese patent application No. 202423229706.3, filed on December 25, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application belongs to the field of display technology, and in particular relates to a pixel packaging structure and a display panel. Background Technology

[0004] Currently, a single-pixel package structure of a light-emitting diode (LED) controlled by a micro-integrated circuit typically contains three LED chips. The micro-integrated circuit can control these three LED chips based on grayscale data from the system, thereby realizing the light-emitting logic of the LED single-pixel package structure. Summary of the Invention

[0005] This application is defined by the appended independent claims, and the relevant improvements are set forth in the dependent claims.

[0006] One objective of this application is to provide a pixel packaging structure and a display panel to improve the LED single-pixel packaging structure.

[0007] According to one aspect of this application, a pixel packaging structure is provided. The pixel packaging structure may include: a carrier board having a plurality of pixel regions disposed thereon, wherein the center-to-center distance between any two adjacent pixel regions is equal; a plurality of light-emitting chips having at least three emission colors, and at most two emission colors of the light-emitting chips disposed on the same portion of the plurality of pixel regions; and an integrated circuit unit disposed on the carrier board, the integrated circuit unit being electrically connected to the plurality of light-emitting chips.

[0008] In a possible implementation, the plurality of pixel regions are arranged in a matrix, and the light-emitting chips in the plurality of pixel regions in the same column and / or the same row include light-emitting chips of at least three light-emitting colors.

[0009] In a possible implementation, the light-emitting chips in multiple pixel regions of the same column are arranged sequentially along a first straight line; or, the light-emitting chips in multiple pixel regions of the same row are arranged sequentially along a second straight line.

[0010] In a possible implementation, the plurality of pixel regions include a plurality of first pixel regions and a plurality of second pixel regions; the plurality of light-emitting chips include a plurality of first light-emitting chips, a plurality of second light-emitting chips, and a plurality of third light-emitting chips with different light-emitting colors; each first pixel region is provided with one or more first light-emitting chips and one or more second light-emitting chips, and each second pixel region is provided with one or more second light-emitting chips and one or more third light-emitting chips.

[0011] In a possible implementation, there are two first pixel regions and two second pixel regions, and the two first pixel regions and the two second pixel regions are arranged in a matrix of two rows and two columns.

[0012] In a possible implementation, a first pixel region and a second pixel region are provided in the same row of the pixel encapsulation structure; a first pixel region and a second pixel region are provided in the same column of the pixel encapsulation structure.

[0013] In a possible implementation, the plurality of pixel regions include a plurality of third pixel regions, a plurality of fourth pixel regions, and a plurality of fifth pixel regions; the plurality of light-emitting chips include a plurality of first light-emitting chips, a plurality of second light-emitting chips, and a plurality of third light-emitting chips with different light-emitting colors; one or more first light-emitting chips are disposed on each of the third pixel regions, one or more second light-emitting chips are disposed on each of the fourth pixel regions, and one or more third light-emitting chips are disposed on each of the fifth pixel regions.

[0014] In a possible implementation, the number of the third pixel region, the fourth pixel region, and the fifth pixel region are all three, and the three third pixel regions, the three fourth pixel regions, and the three fifth pixel regions are arranged in a matrix of three rows and three columns.

[0015] In a possible implementation, the three third pixel regions are disposed in the first row of the pixel encapsulation structure, the three fourth pixel regions are disposed in the second row of the pixel encapsulation structure, and the three fifth pixel regions are disposed in the third row of the pixel encapsulation structure.

[0016] According to another aspect of this application, a display panel is provided. The display panel may include any of the pixel encapsulation structures described above.

[0017] This summary is provided to introduce, in a simplified form, a selection of inventive concepts that will be further described in the detailed embodiments described below. This summary is not intended to identify key or essential features of the claimed subject matter, nor is it intended to help determine the scope of the claimed subject matter. The term "subject matter" can refer to the foregoing as well as components, structures, processes, methods, and / or operations described throughout this document. Attached Figure Description

[0018] Referring to the accompanying drawings, further features, details, and advantages of this application are illustrated in the description of exemplary embodiments, in which:

[0019] Figure 1 is a schematic diagram of a pixel encapsulation structure provided in an embodiment of this application;

[0020] Figure 2 is another schematic diagram of a pixel encapsulation structure provided in an embodiment of this application;

[0021] Figure 3 is another schematic diagram of a pixel encapsulation structure provided in an embodiment of this application;

[0022] Figure 4 is a schematic diagram of a driving circuit provided in an embodiment of this application;

[0023] Figure 5 is another schematic diagram of a pixel encapsulation structure provided in an embodiment of this application;

[0024] Figure 6 is a schematic diagram of another driving circuit provided in an embodiment of this application;

[0025] Figure 7 is a schematic diagram of a display panel provided in an embodiment of this application.

[0026] It should be clearly stated that the accompanying drawings are for illustrative purposes only, illustrating the technical solution of this application. The specific positions, directions, orientations, and sizes shown in the drawings are merely for reference in assisting understanding this application and are not intended to precisely limit the corresponding elements in the actual application or implementation of this application. In practical applications, the positions, directions, orientations, and sizes of each element can be reasonably adjusted and changed according to specific needs and actual circumstances. Detailed Implementation

[0027] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0028] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0029] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0031] Currently, single-pixel LED packages controlled by micro-integrated circuits typically contain three LED chips. The micro-integrated circuit can control these three LED chips based on grayscale data from the system, thus realizing the light-emitting logic of the single-pixel LED package. However, the requirement of at least three LED chips in a single-pixel LED package makes it difficult to reduce its cost.

[0032] Therefore, one objective of this application is to provide a pixel packaging structure and display panel to improve the LED single-pixel packaging structure, and in particular to solve the cost problem of the traditional LED single-pixel packaging structure.

[0033] Figure 1 shows a schematic diagram of a pixel encapsulation structure provided in an embodiment of this application. For ease of explanation, only the parts relevant to this embodiment are shown, and the details are as follows:

[0034] The pixel packaging structure 10 may include: a carrier board 100, multiple light-emitting chips 300 and an integrated circuit unit 400.

[0035] As shown in Figures 1 and 2, multiple pixel regions 200 can be disposed on the carrier 100, and the center-to-center spacing of adjacent pixel regions 200 can be equal. Multiple light-emitting chips 300 can have at least three emission colors. Light-emitting chips 300 with at most two emission colors can be disposed on the same pixel region 200. An integrated circuit unit 400 can be disposed on the carrier 100. The integrated circuit unit 400 can be electrically connected to the light-emitting chips 300. For example, one or two emission colors of light-emitting chips 300 can be disposed on a single pixel region 200, while different emission colors of light-emitting chips 300 can be disposed on different pixel regions 200. Thus, the entire pixel encapsulation structure 10 can have at least three emission colors. By way of example and not limitation, at least three emission colors can include red, green, and blue. Of course, at least three emission colors can also include other colors, such as yellow, white, etc., and this application does not impose any limitations on this.

[0036] Since light-emitting chips 300 of up to two different colors are disposed on the same pixel area 200, the number of light-emitting chips 300 in a single pixel area 200 can be reduced. By controlling the coordination between multiple pixel areas 200 through the integrated circuit unit 400, the original light-emitting effect can be achieved, thereby ultimately reducing manufacturing costs.

[0037] In the example, integrated circuit unit 400 may include a corresponding driver chip.

[0038] It is understood that a conventional pixel unit requires at least three light-emitting chips 300 of different colors. In this embodiment, by cooperating and mixing light from multiple adjacent pixel regions 200, at least three light-emitting colors can be combined to compensate for the lack of light-emitting colors in a single pixel region 200. For example, if a pixel region 200 lacks a red light-emitting chip 300, the lack of red light in that pixel region 200 can be compensated by using red light-emitting chips from other pixel regions 200 in the same pixel packaging structure 10.

[0039] In this example, the light-emitting chip 300 and the integrated circuit unit 400 can be bonded to the same surface of the carrier plate 100. Alternatively, the light-emitting chip 300 and the integrated circuit unit 400 can be bonded to different surfaces of the carrier plate 100.

[0040] In some embodiments, a pixel region 200 may include a plurality of light-emitting chips 300 of a first color and a plurality of light-emitting chips 300 of a second color. For example, a pixel region 200 may include two light-emitting chips 300 of the first color and two light-emitting chips 300 of the second color. It is understood that the number of light-emitting chips 300 of various colors in a pixel region 200 can be set according to actual needs, and this application does not impose any limitations on this.

[0041] In some embodiments, the area of ​​the pixel packaging structure 10 can be between 50μm*50μm and 5mm*5mm.

[0042] In one embodiment, the plurality of pixel regions 200 may be arranged in a matrix. In this case, the light-emitting chips 300 in the plurality of pixel regions 200 in the same column and / or the same row may include light-emitting chips 300 of at least three light-emitting colors.

[0043] It should be noted that for a single pixel, it typically needs to include light sources of at least three colors: red, green, and blue, in order to obtain any desired color.

[0044] When each pixel region 200 includes light-emitting chips 300 of up to two colors, the four light-emitting chips 300 in two pixel regions 200 of the same column and / or row include light-emitting chips 300 of at least three different colors. Therefore, any pixel region 200 in this embodiment can cooperate with the light-emitting chips 300 in adjacent pixel regions 200 to obtain the desired color. For example, if a pixel region 200 includes red and green light-emitting chips, these chips can cooperate with blue light-emitting chips in adjacent pixel regions 200 to emit light and obtain the desired color.

[0045] Compared to a conventional two-row, two-column pixel array that requires 12 light sources, the two-row, two-column pixel area 200 of this embodiment only requires 6 to 8 light-emitting chips 300, thus the cost of this embodiment is lower.

[0046] In one embodiment, the light-emitting chips 300 in the pixel region 200 of the same column can be arranged sequentially along a first straight line direction. Alternatively, the light-emitting chips 300 in the pixel region 200 of the same row can be arranged sequentially along a second straight line direction.

[0047] In the example, the directions of the first and second lines can be perpendicular to each other.

[0048] It is understandable that if each pixel region 200 includes two light-emitting chips 300, and if the light-emitting chips 300 in the same column of pixel regions 200 are arranged sequentially along the first straight line direction, then in the two-row, two-column pixel regions 200, the eight light-emitting chips 300 in the four pixel regions 200 can be distributed in a four-row, two-column square matrix.

[0049] In one embodiment, as shown in FIG3, the pixel region 200 may include a first pixel region 210 and a second pixel region 220. The light-emitting chip 300 may include a first light-emitting chip 310, a second light-emitting chip 320, and a third light-emitting chip 330 with different light-emitting colors. The first light-emitting chip 310 and the second light-emitting chip 320 may be disposed on the first pixel region 210, and the second light-emitting chip 320 and the third light-emitting chip 330 may be disposed on the second pixel region 220.

[0050] When the first light-emitting chip 310, the second light-emitting chip 320, and the third light-emitting chip 330 emit red, green, and blue light respectively, only one first pixel area 210 and one second pixel area 220 are needed to accommodate the three colors of light-emitting chips 300. By cooperating with the four light-emitting chips 300 in these two pixel areas 220, the desired emission color can be obtained.

[0051] In some embodiments, the first light-emitting chip 310, the second light-emitting chip 320, and the third light-emitting chip 330 can be a red LED chip, a green LED chip, and a blue LED chip, respectively. Of course, other combinations are also conceivable, and this application does not impose any limitations on them.

[0052] In one embodiment, the pixel encapsulation structure 10 may include two first pixel regions 210 and two second pixel regions 220. In this case, the two first pixel regions 210 and the two second pixel regions 220 may be arranged in a matrix of two rows and two columns.

[0053] Accordingly, such pixel packaging structure 10 may include two red LED chips, four green LED chips and two blue LED chips.

[0054] In one embodiment, the integrated circuit unit 400 may be disposed in the middle of the four pixel regions 200.

[0055] It is understood that each pixel region 200 may partially overlap with the integrated circuit unit 400 (e.g., each may overlap with one-quarter of the integrated circuit unit 400). The specific location of the integrated circuit unit 400 can be set according to actual needs and is not limited to what is illustrated and described.

[0056] By way of example and not limitation, the integrated circuit unit 400 can simultaneously drive eight light-emitting chips 300, such as two red LED chips, four green LED chips, and two blue LED chips. The light-emitting chips 300 can adopt a common cathode or common anode conduction mode.

[0057] As shown in Figure 4, in a pixel package structure 10, the light-emitting chips D1 to D8 (each diode symbol is schematically represented) can adopt a common cathode conduction mode. Of course, the light-emitting chips D1 to D8 can also adopt a common anode conduction mode or a hybrid conduction mode of partially common cathode and partially common anode, and this application does not impose any restrictions on this.

[0058] In some embodiments, the integrated circuit unit 400 can determine the light emission grayscale of the pixel packaging structure 10 based on the control signal, and then control the light emission of each light emission chip 300 according to the light emission grayscale.

[0059] In this example, the control signal may include at least one timing signal and at least one data signal. It is understood that both the timing signal and the data signal can be pulse width modulation (PWM) signals. The integrated circuit unit 400 can determine the emission grayscale corresponding to the pixel package structure 10 based on the repetition frequency of the data signal. In this example, the repetition frequency of the data signal can range from 1MHz to 50MHz, the high level can range from 0.8V to 8V, and the low level can range from 0V to 0.2V.

[0060] In one embodiment, a first pixel region 210 and a second pixel region 220 may be provided in the same row of the pixel encapsulation structure 10. Furthermore, a first pixel region 210 and a second pixel region 220 may be provided in the same column of the pixel encapsulation structure 10. In other words, the two first pixel regions 210 may be respectively located at opposite diagonal positions of one diagonal of the matrix. Similarly, the two second pixel regions 220 may be respectively located at opposite diagonal positions of the other diagonal of the matrix.

[0061] In this embodiment, any pixel region 200 can cooperate with adjacent pixel regions 200 to obtain the desired emission color. When the pixel encapsulation structure 10 is observed from both sides, since the first pixel region 210 and the second pixel region 220 are staggered, no color loss phenomenon will appear on either side of the pixel encapsulation structure 10.

[0062] In one embodiment, four light-emitting chips 300 in two pixel regions 200 of the same column can be arranged sequentially along a first straight line direction. Alternatively, four light-emitting chips 300 in two pixel regions 200 of the same row can be arranged sequentially along a second straight line direction. In the example, the first and second straight line directions can be perpendicular to each other.

[0063] It is understandable that when four light-emitting chips 300 in two pixel regions 200 in the same column are arranged sequentially along the first straight line, the eight light-emitting chips 300 in the four pixel regions 200 can be distributed in a square matrix of four rows and two columns.

[0064] It is also understandable that when the four light-emitting chips 300 in the two pixel regions 200 in the same row are arranged sequentially along the second straight line, the eight light-emitting chips 300 in the four pixel regions 200 can be distributed in a square matrix of two rows and four columns.

[0065] In one embodiment, as shown in FIG5, pixel region 200 may include a third pixel region 230, a fourth pixel region 240, and a fifth pixel region 250. Light-emitting chip 300 may include a first light-emitting chip 310, a second light-emitting chip 320, and a third light-emitting chip 330, each emitting a different color. The first light-emitting chip 310 may be disposed on the third pixel region 230, the second light-emitting chip 320 may be disposed on the fourth pixel region 240, and the third light-emitting chip 330 may be disposed on the fifth pixel region 250.

[0066] Unlike the above embodiments, this embodiment achieves pixel color compensation through the cooperation of three pixel regions 200, thereby obtaining the desired color.

[0067] In one embodiment, as shown in FIG5, the pixel encapsulation structure 10 may include three third pixel regions 230, three fourth pixel regions 240, and three fifth pixel regions 250. In this case, the three third pixel regions 230, three fourth pixel regions 240, and three fifth pixel regions 250 may be arranged in a matrix of three rows and three columns.

[0068] Compared to the conventional nine pixels which require twenty-seven light sources, the nine pixel area 200 in this embodiment only requires nine light-emitting chips 300, thereby significantly reducing costs.

[0069] In one embodiment, as shown in FIG5, three third pixel regions 230 can be arranged in the first row of the pixel encapsulation structure 10, three fourth pixel regions 240 can be arranged in the second row of the pixel encapsulation structure 10, and three fifth pixel regions 250 can be arranged in the third row of the pixel encapsulation structure 10.

[0070] Understandably, in the actual operation of a pixel encapsulation structure 10, the nine pixel regions 200 can cooperate with each other to obtain the desired color. For example, the nine pixel regions 200 can emit light in columns.

[0071] In the example, one integrated circuit unit 400 can simultaneously drive the light-emitting chips 300 in nine pixel regions 200.

[0072] As shown in Figure 6, the light-emitting chips D9 to D17 (each diode symbol is schematically represented) can adopt a common cathode conduction mode. Of course, the light-emitting chips D9 to D17 can also adopt a common anode conduction mode or a hybrid conduction mode of partially common cathode and partially common anode, and this application does not impose any restrictions on this.

[0073] Figure 7 shows a schematic diagram of a display panel provided in an embodiment of this application. For ease of explanation, only the parts related to this embodiment are shown, which are described in detail below:

[0074] The display panel 20 may include a plurality of pixel encapsulation structures 10 as described in any of the exemplary embodiments above, and the plurality of pixel encapsulation structures 10 may be arranged in a square matrix. It is understood that the plurality of pixel encapsulation structures 10 may also be arranged in other forms, such as alternating adjacent rows or adjacent columns, and this application does not impose any limitations on this.

[0075] In the example, the number of rows and columns of the square matrix can be set according to actual needs, and is not limited to those illustrated and described in this application. This application does not impose any restrictions on this.

[0076] The beneficial effects of this application embodiment compared with the prior art are: since light-emitting chips of up to two light-emitting colors are set on the same pixel area, the number of light-emitting chips in a single pixel area can be reduced, and multiple pixel areas can be controlled to emit light to present an image through the integrated circuit unit, thereby achieving the effect of reducing manufacturing costs.

[0077] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0078] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0079] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A pixel encapsulation structure, comprising: A carrier plate, wherein multiple pixel regions are provided on the carrier plate, and the center-to-center distance between any two adjacent pixels is equal; Multiple light-emitting chips, wherein the multiple light-emitting chips have at least three light-emitting colors and at most two light-emitting colors are disposed on the same one of the multiple pixel regions; An integrated circuit unit is disposed on the carrier board and is electrically connected to the plurality of light-emitting chips.

2. The pixel encapsulation structure as described in claim 1, wherein, The plurality of pixel regions are arranged in a matrix, and the light-emitting chips in the plurality of pixel regions in the same column and / or the same row include light-emitting chips of at least three light-emitting colors.

3. The pixel encapsulation structure as described in claim 2, wherein, The light-emitting chips in multiple pixel regions of the same column are arranged sequentially along a first straight line direction; Alternatively, the light-emitting chips in multiple pixel regions of the same row are arranged sequentially along a second straight line.

4. The pixel encapsulation structure as described in any one of claims 1 to 3, wherein, The plurality of pixel regions includes a plurality of first pixel regions and a plurality of second pixel regions; The plurality of light-emitting chips includes a plurality of first light-emitting chips, a plurality of second light-emitting chips, and a plurality of third light-emitting chips with different light-emitting colors; Each first pixel region is provided with one or more first light-emitting chips and one or more second light-emitting chips, and each second pixel region is provided with one or more second light-emitting chips and one or more third light-emitting chips.

5. The pixel encapsulation structure as described in claim 4, wherein, The number of first pixel regions and second pixel regions are both two, and the two first pixel regions and the two second pixel regions are arranged in a matrix of two rows and two columns.

6. The pixel encapsulation structure as described in claim 5, wherein, The same row of the pixel encapsulation structure provides a first pixel region and a second pixel region; The same column of the pixel encapsulation structure is provided with a first pixel region and a second pixel region.

7. The pixel encapsulation structure according to any one of claims 1 to 3, wherein, The plurality of pixel regions includes a plurality of third pixel regions, a plurality of fourth pixel regions, and a plurality of fifth pixel regions; The plurality of light-emitting chips includes a plurality of first light-emitting chips, a plurality of second light-emitting chips, and a plurality of third light-emitting chips with different light-emitting colors; Each of the third pixel regions is provided with one or more of the first light-emitting chips, each of the fourth pixel regions is provided with one or more of the second light-emitting chips, and each of the fifth pixel regions is provided with one or more of the third light-emitting chips.

8. The pixel encapsulation structure as described in claim 7, wherein, The number of the third pixel region, the fourth pixel region, and the fifth pixel region are all three, and the three third pixel regions, the three fourth pixel regions, and the three fifth pixel regions are arranged in a matrix of three rows and three columns.

9. The pixel encapsulation structure as described in claim 8, wherein, The three third pixel regions are arranged in the first row of the pixel encapsulation structure, the three fourth pixel regions are arranged in the second row of the pixel encapsulation structure, and the three fifth pixel regions are arranged in the third row of the pixel encapsulation structure.

10. A display panel comprising a plurality of pixel encapsulation structures as claimed in any one of claims 1 to 9.

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