Operation planning device, computer program, and method for laser ranging system

Abstract

The present invention provides a technology that makes it possible to reduce a cycle time in an operation planning device for a laser ranging system for shortening the cycle time. An operation planning device (80), which is for a laser ranging system (1) comprising a galvano scanner (10), is provided with: an acquisition part (801) that acquires position data of a measurement point, galvano scanner model information including mechanism information of the galvano scanner (10), and measurement unit model information including information related to a measurement range for measuring the measurement point by a measurement unit (30) connected to the galvano scanner (10); a calculation part (802) that calculates a measurement range adjustment value for the measurement unit model information on the basis of the information related to the measurement range; and an optimization part (803) that optimizes system operation planning for the laser ranging system (1) on the basis of an objective function related to the measurement range adjustment value.

Description

Operation Planning Device, Computer Program, and Method for a Laser Distance Measuring System

[0001] The present disclosure relates to an operation planning device, a computer program, and a method for a laser distance measuring system.

[0002] Conventionally, devices for measuring the distance to a workpiece using laser light for length measurement are known.

[0003] Japanese Patent Application Laid-Open No. 2022-110864, Japanese Patent Application Laid-Open No. 2016-10819

[0004] However, in a conventional OCT sensor (laser distance meter) using laser light for length measurement, the reference arm of the OCT sensor was adjusted every time a measurement was performed. For the adjustment of the reference arm, a stepping motor with low responsiveness was often used, and if the number of adjustments of the reference arm increased, the cycle time, which is the time required for the entire process, might become longer.

[0005] An object of the present disclosure is to provide an operation planning device, a computer program, and a method for a laser distance measuring system that shorten the cycle time.

[0006] The present disclosure is an operation planning device for a laser distance measuring system including a galvanometer scanner, the operation planning device including: an acquisition unit that acquires position data of measurement points, galvanometer scanner model information including mechanism information of the galvanometer scanner, and measurement system model information including information regarding a measurement range for the measurement system connected to the galvanometer scanner to measure the measurement points; a calculation unit that calculates a measurement range adjustment value of the measurement system model information based on the information regarding the measurement range; and an optimization unit that optimizes a system operation plan for the laser distance measuring system based on an objective function regarding the measurement range adjustment value.

[0007] According to the present disclosure, a technique capable of reducing the cycle time can be provided in a laser processing device that involves adjustment of a reference arm.

[0008] This figure shows the overall configuration including the motion planning device and related devices according to this embodiment. This figure shows the reference arm according to this embodiment. This figure shows the relationship between the processing beam, the measuring light, and the workpiece according to this embodiment. This figure shows the distances according to this embodiment. This figure shows the distances according to this embodiment. This figure shows each model according to the first control example. This figure shows an example of adjusting the reference arm according to this embodiment. This figure shows the number of adjustments to the reference arm according to this embodiment. This figure shows the processing flow of the motion planning device according to the first control example. This figure shows the number of adjustments to the reference arm according to the first control example. This figure shows an example of adjusting the reference arm according to the first control example. This figure shows the processing flow of the motion planning device according to the second control example. This figure shows a change in the route of the transport device according to the second control example. This figure shows the evaluation items of the system motion plan according to this embodiment. This figure shows the evaluation items of the system motion plan according to this embodiment. This figure shows the evaluation of on-the-fly operation according to this embodiment. This is a schematic block diagram showing the configuration of the computer according to this embodiment.

[0009] Embodiments of this disclosure will be described in detail below with reference to the drawings. The drawings used in this description may omit some of their components for illustrative purposes. Furthermore, the same reference numerals in the drawings and this specification indicate the same elements.

[0010] (Overall Configuration) Figure 1 is a schematic diagram showing the overall configuration of an action planning device 80 and related devices according to one embodiment of the present disclosure. The laser ranging system 1 comprises a galvanometer scanner device 10, a control device 20, a measurement system 30 (e.g., OCT (Optical Coherence Tomography)), and a transport device 70. The galvanometer scanner device 10 comprises a laser light source 11 and a processing head 12. The control device 20 communicates with the action planning device 80 and can acquire operation information for each device controlled by the control device 20. The action planning device 80 may be provided in the control device 20.

[0011] The motion planning device 80 is a device that plans the operation for each device controlled by the control device 20. The motion planning device 80 can pre-generate operation results, i.e., simulation results, based on the settings for each model. The motion planning device 80 provides these simulation results to the operator, who can then verify the simulation results, change various parameters, and re-verify the simulation results based on the changed parameters before actually operating each device.

[0012] The galvanometer scanner 10 performs welding by irradiating a workpiece on a moving stage with a processing beam. However, the configuration is not limited to placing the workpiece on a moving stage; the method of placing the workpiece can be changed as appropriate.

[0013] The laser light source 11 generates laser light by internally oscillating a laser in response to commands (such as laser power commands) from the control device 20. The laser light source 11 includes a fiber laser oscillator, a pulsed laser oscillator, a direct diode laser (DDL), and CO2. ２ Any type of laser oscillator may be used, such as a laser oscillator or a solid-state laser (YAG laser) oscillator. The laser light source 11 supplies the generated laser light to the processing head 12.

[0014] Optical components 50, such as lenses 51-53 and mirrors 54-56, are arranged on the processing head 12. Of the optical components 50, mirror 54 is a dichroic mirror that reflects the processing beam while transmitting measurement light.

[0015] The processing head 12 can be composed of a wobble head with a wobble function and a polygon mirror. Alternatively, the processing head 12 may be a device placed on a moving stage or a device connected to a robot. Thus, the configuration of the processing head 12 is not particularly limited.

[0016] The laser beam deflection mechanism 13 controls the irradiation position by adjusting the position and angle of optical components such as mirrors 55-56 based on commands from the control device 20.

[0017] The control device 20 is configured using a computer equipped with memory such as ROM (read-only memory) and RAM (random access memory), a CPU (Control Processing Unit), and a communication control unit, all connected to each other via a bus. The functions and operations of each functional unit, described later, are achieved through the cooperation of the CPU, memory, and control programs stored in the computer. The control device 20 may also be configured as a CNC (Computer Numerical Controller) or a PLC (Programmable Logic Controller), or it may be connected to a higher-level computer that outputs machining programs and other machining conditions.

[0018] The control device 20 of this embodiment has laser controller function, scanner controller function and transport device controller function, and is a control unit that controls the operation of the laser light source 11, laser beam deflection mechanism 13 and transport device 70.

[0019] Furthermore, various functions may be added to the control device 20. For example, a welding monitoring system using an image sensor such as a CMOS or CCD, or a welding monitoring system using a photodiode, may be connected to the control device 20.

[0020] Hardware related to various additional functions for the control device 20 may be mounted independently, or it may be mounted optically coupled to the processing head 12 or the OCT scanner 33.

[0021] The measurement system 30 is a sensor system that determines the difference in optical path length between the reflected light at the measurement point and the reference light from the interference fringes of the two lights. By measuring during welding, the measurement system 30 makes it possible to monitor the depth of the keyhole (≒weld depth). This allows for a direct determination of the quality of the weld.

[0022] The measurement system 30 may be an optical measurement unit such as a camera, photodiode, or optical component without a light receiver.

[0023] As an example, the measurement system 30 is an optical coherence interferometer unit comprising an OCT system controller 31, a measurement light source 32, an OCT scanner 33, and a measurement light deflection mechanism 34.

[0024] The OCT system controller 31 is a measurement light control unit that communicates with the control device 20 and controls the operation of the measurement light source 32 and the OCT scanner 33. The OCT system controller 31 in this embodiment also has a calculation unit 35 for analyzing keyholes.

[0025] The measurement light source 32 is a light source that generates measurement light used in the optical coherence interferometer. Optical components 60 such as lenses 57 and mirrors 58-59 are arranged in the OCT scanner 33.

[0026] The measurement light deflection mechanism 34 can be a device consisting of polygon mirrors. In this embodiment, the measurement light deflection mechanism 34 optically couples the measurement light to the optical path formed by the optical component 50 of the processing head 12 using mirrors 58 to 59. The measurement light deflection mechanism 34 operates based on commands from the OCT system controller 31.

[0027] The transport device 70 is a device for transporting the galvanometer scanner device 10 to the workpiece machining position. The transport device 70 may be a robot, a single-axis machining center, or a multi-axis machining center.

[0028] (Reference Arm) Figure 2 shows a reference mirror 323 and a reference arm 324 provided and used in the measurement system 30. The reference mirror 323 and the reference arm 324 may be provided, for example, in the measurement light source 32.

[0029] The reference arm 324 (also called the optical path length adjustment mechanism) performs optical path length adjustment, thereby adjusting the reference optical path length and / or the measured optical path length. Optical path length adjustment is performed by moving the position of the reference mirror 323 using a motor. The reference arm 324 is roughly like the focusing lens of a camera, and is a mechanism that adjusts the measurement range in which length is measured by optical interference when measuring length with an optical interferometer. For example, the adjustment is performed according to the distance to the object to be measured.

[0030] The measurement system 30 is a device for measuring optical interference, and its measurement range depends on the wavelength resolution of the line sensor 326. For example, the wavelength resolution of the line sensor 326 is 2048 pixels, and the detection range is 0 to 12 mm. If the optical path length difference falls outside this detection range, interference will not be measured.

[0031] The measurement of the optical path length difference will now be explained. In path 1 in Figure 2, the light from the light-emitting diode 321 travels in the following order: beam splitter 322, reference mirror 323, beam splitter 322, diffraction grating 325, and reaches the line sensor 326. In path 2 in Figure 2, the light from the light-emitting diode 321 travels in the following order: beam splitter 322, workpiece 40, beam splitter 322, diffraction grating 325, and reaches the line sensor 326. If there is an optical path length difference between the reference optical path length in path 1 and the measured optical path length in path 2, that optical path length difference is detected by the line sensor 326.

[0032] For example, when the measurement range adjustment value is set to 500 mm, the optical path length in path 1 is 500 mm. In this case, if the detection range is 0 to 12 mm, the measurement range is 500 mm to 512 mm. Here, when the optical path length in path 2 is 506 mm, the line sensor 326 measures the interference of light with an optical path length difference of 6 mm. As a result, the distance to the workpiece is measured to be 506 mm.

[0033] The distances actually used in the calculations may be converted using a coefficient for converting distances in a medium to distances in a vacuum (optical path length). The medium includes solids such as glass and lenses, gases such as air and nitrogen gas, liquids such as water and coolant (for example, when the entire system is submerged in water), and plasma generated during welding.

[0034] The optical path length or optical path difference may be converted to the length of the path. In this disclosure, for ease of understanding, the one-way optical path length or optical path difference is used, but in practice, the round-trip optical path length or optical path difference is used. The round-trip optical path length or optical path difference is twice the one-way optical path length or optical path difference.

[0035] (Definition of Terms) The measuring light is the light emitted from the measuring light source 32. The measuring light is used, for example, to measure the keyhole depth after keyhole creation on a workpiece by a processing beam, as shown in Figure 3. The detection range is the range of optical path length difference that the measurement system can detect. The detection range is also called the range in which interference under the OCT principle can be observed, or the focus range. For example, if the wavelength resolution of the line sensor 326 is 2048 pixels, the theoretical detection range is 0 to 12 mm. The detection range actually used is narrower than this, for example, set to 1 to 11 mm. The measurement range is the range of distance measured by the measurement system. The measurement range is determined by the measurement range adjustment value set by adjusting the reference arm and the detection range. For example, if the measurement range adjustment value is 500 mm and the detection range is 1 to 11 mm (i.e., the width is 10 mm), the measurement range is 500 mm to 510 mm. The measurement range adjustment value is the minimum value of the measurement range. The measurement range adjustment value is a value set by adjusting the reference arm. The measurement range adjustment value may also be determined by considering the length of the optical fiber or other path used.

[0036] The workpiece distance refers to the distance from the galvanometer scanner to the workpiece surface at a given point in time during the measurement of a single dot. One dot represents one laser welding pass. One laser welding pass performs processing on one welding path and generates one weld shape. Multiple weld shapes may be generated by one laser welding pass. The distance from the galvanometer scanner to the workpiece surface on the optical path of the measurement light is the distance from the reflection point of the measurement light at mirrors 55-56 inside the galvanometer scanner to the workpiece surface. Instead of the reflection point of the measurement light at mirrors 55-56, the position of the galvanometer scanner's output port or the position of the output port protection window may be used to calculate the workpiece distance. Furthermore, the length of the path inside the measurement light source and the optical fiber used may also be considered. This disclosure describes the process assuming a welding program, but it may also apply to a processing program that does not perform welding. In that case, the welding output may be set to 0 and the same operation may be assumed. When welding is not performed, this includes, for example, checking the condition of the workpiece in the pre-welding process, measuring the position of characteristic points (e.g., stepped areas) of the workpiece in the pre-welding process and performing position correction, or observing the weld bead shape after welding in the post-welding process. Alternatively, a distance range that is expected for the target can be set as an alternative to the welding depth. When considering the weld bead, it is expected that there may be convex parts in addition to concave parts. In this case, the distance range corresponding to the welding depth may be set to a negative value, and in the case of a negative value, the shortest workpiece distance is replaced by subtracting the distance range corresponding to the welding depth from the shortest workpiece distance. The welding path is simply replaced with the path, which is the scanning path of the galvanometer scanner. The welding shape is simply replaced with the shape, which is the scanning shape of the galvanometer scanner. The shortest workpiece distance means the shortest workpiece distance in the measurement of a single dot (see Figure 4). That is, the shortest workpiece distance means the distance from the galvanometer scanner to the workpiece surface on the optical path of the measurement light at the point in time when the distance from the galvanometer scanner to the workpiece surface on the optical path of the measurement light is the shortest in the measurement of a single dot. The shortest workpiece distance is defined similarly even in measurement operations involving on-the-fly movements, as shown in Figure 5.On-the-fly operation is the operation in which the galvanometer scanner operates while the transport device (robot) is moving, irradiating the laser along the shape of the processing point. The extension distance is the distance that needs to be extended from the shortest workpiece distance due to angled firing, etc., when measuring a dot point (see Figures 4 and 5). The extension distance is also called the distance obtained by subtracting the shortest workpiece distance from the workpiece distance. The extension distance changes depending on the movement of the processing head, the movement of the workpiece, the irradiation angle, the workpiece shape, etc. The extension distance may be set to a fixed value to reduce the amount of calculation. In on-the-fly operation, the extension distance may fluctuate depending on the position of the galvanometer scanner. The maximum extension distance is the longest extension distance in the measurement of a single dot point. The maximum extension distance is calculated by subtracting the shortest workpiece distance from the longest workpiece distance in a single measurement. The measurement distance is the depth of the object being measured (for example, a keyhole in welding) at a certain point in the measurement of a single dot point (see Figure 3). The measurement distance is also called the distance from the workpiece surface to the bottom of the keyhole (i.e., the measurement point). If no machining has been performed on the object to be measured, the measurement point is on the workpiece surface, and the measurement distance indicates the distance to the workpiece surface. The measurement distance is set for each machining point. The measurement distance is different from the actual machining distance. If the thickness of the workpiece is 2.5 mm and the expected welding depth is 2.0 mm, the measurement distance may be set to 3.0 mm to allow for a slight margin. Also, if the weld bead after welding is considered, the measurement distance may be the height of the bead. In this case, the measurement distance is set to a negative value. The measurement point distance is the distance from the galvanometer scanner on the optical path of the measurement light to the measurement point at a certain point in the measurement of a single dot. The measurement point distance is equal to the sum of the workpiece distance and the measurement distance. The longest measurement point distance is the longest measurement point distance in the measurement of a single dot. The longest measurement point distance may be calculated by the sum of the shortest workpiece distance, the longest extension distance, and the maximum measurement distance at a single dot. The optical path length difference can be measured if the range from the shortest workpiece distance to the longest measurement point distance is within the measurement range. Cycle time is the total time required for the entire process. Cycle time includes the time for adjusting the reference arm, the time for moving the transport device, and the time required for welding.

[0037] The galvanometer scanner operation plan is a plan for the operation of the galvanometer scanner. It includes location data of the welding points, welding depth, welding point path data, etc. The galvanometer scanner operation plan also includes a plan for the welding sequence performed by the galvanometer scanner. The galvanometer scanner operation plan depends on the galvanometer scanner model information. The measurement system operation plan is a plan for the operation of components included in the measurement system, such as the adjustment of the reference arm. It includes location data of the measurement points measured by the measurement system, measurement point path data, measurement point sequence data, etc. The measurement system operation plan may also include a plan for measurement range adjustment values ​​associated with the measurement points. The measurement system operation plan depends on the measurement system model information. The transport device operation plan is a plan for the operation of transport devices, such as robots, that transport the galvanometer scanner. The transport device operation plan includes a plan for the transport path (robot path) of the transport device. The transport device operation plan also includes the operating range of the transport device. The transport device operation plan depends on the transport device model information. The system operation plan is the overall system operation plan, including the galvanometer scanner operation plan, the transport device operation plan, and the measurement system operation plan.

[0038] (Description of Models) Referring to Figure 6, information about each model used in the system operation planning of the laser ranging system is described below. The laser ranging system includes a galvanoscanner model for the galvanoscanner 10, a transporter model for the transporter 70, a measurement system model for the measurement system 30, and a workpiece model for the workpiece. Each model has the following model information.

[0039] The galvanometer scanner model information includes the mechanism information of the galvanometer scanner. The galvanometer scanner model information includes A: holding point, B: laser emission point, C: laser emission range, and D: laser focal range.

[0040] The conveying device model information includes the mechanism information of the conveying device. The conveying device model information includes E: holding point, F: movable axis 1, and G: movable axis 2. The model of the conveying device 70 may be alternatively configured by a robot, a single-axis machining center (i.e., a linear motion machining center), or a multi-axis machining center.

[0041] The measurement system model information includes the mechanism information of the measurement system. The measurement system model information includes H: measurement range and I: measurement range adjustment value. When the measurement system 30 is a camera, the measurement range adjustment value is determined based on the focus lens position. When the measurement system is an OCT sensor, the measurement range adjustment value is determined based on the focus lens position and the reference arm position.

[0042] The machining target model information includes J: machining point center coordinates, K: machining point shape, L: 3D model of the machining target, and M: support device for the machining target workpiece. There may be a plurality of each of J, K, L, and M. L may not exist in the model of the machining target.

[0043] Each model information is not limited to the above information. For example, each model information may further have 3D-CAD information, current values, and respective conversion coefficients.

[0044] (Example of adjusting the reference arm) Referring to FIG. 7, an example of adjusting the reference arm will be described. In FIG. 7, measurements are performed in the order of the left measurement light, the middle measurement light, and the right measurement light. In this measurement method, every time a different measurement is performed, that is, every time a dot is measured, the reference arm is adjusted. In FIG. 7, three dots are measured, and a total of three adjustments of the reference arm are performed.

[0045] FIG. 8 shows the number of adjustments when the example of adjusting the reference arm shown in FIG. 7 is used in a welding program including 12 dots. The reference arm is adjusted during the measurement of all 12 dots in the welding program. Therefore, the total number of adjustments of the reference arm for dot numbers 1 to 12 is 12 times. In the first control example to the third control example described below, the cycle time is shortened by adopting a configuration that reduces the number of reference arm adjustments.

[0046] <First control example> (Configuration of the motion planning device) As shown in FIG. 1, the motion planning device 80 according to the first control example includes an acquisition unit 801, a calculation unit 802, and an optimization unit 803. These functions will be described later.

[0047] (Processing Flow of the Motion Planning Device) Referring to FIGS. 9 and 10, the processing flow executed by the motion planning device 80 will be described. For convenience, the processing of the control device 20 will also be described together. The dots 1 to 12 in FIG. 10 referred to in the description of the processing flow are assumed to represent all the measurement dots included in the conveyance path data.

[0048] The acquisition unit 801 acquires each model information, that is, galvanometer scanner model information, conveyance device model information, measurement system model information, and workpiece model information.

[0049] [Step S101] The control device 20 generates a welding program. By generating the welding program, the acquisition unit 801 acquires the position data of the welding dots and / or the dot path data of the welding dots.

[0050] When the galvanometer scanner motion plan is preset by the operator, the position data of the welding dots and / or the dot path data of the welding dots may be generated based on the constraints of the galvanometer scanner motion plan.

[0051] When the conveyance device motion plan is preset by the operator, the position data of the welding dots and / or the dot path data of the welding dots may be generated based on the constraints of the conveyance device motion plan.

[0052] [Step S102] The motion planning device 80 generates an OCT measurement program. The OCT measurement program is a program for measuring the measurement points on the workpiece such as the welded dots. By generating the OCT measurement program, the acquisition unit 801 acquires the position data of the measurement dots and / or the dot path data of the measurement dots. The position data of the measurement dots is, for example, coordinate data indicating the center position of the measurement dots. The dot path data of the measurement dots is, for example, indicated by a plurality of coordinate data on the dot path. The position data of the measurement dots and the dot path data of the measurement dots may be the same as the position data of the welding dots and the dot path data of the welding dots.

[0053] Furthermore, the generation of the OCT measurement program obtains information regarding the measurement range for measuring the measurement points. The information regarding the measurement range includes the detection range and distance data corresponding to each measurement point. The distance data includes the shortest workpiece distance, the longest extension distance, and the longest measurement point distance along the path of each measurement point. To simplify calculations for each measurement point, the shortest workpiece distance in the distance data may be replaced with the workpiece distance at the center position of the measurement point, and the longest measurement point distance in the distance data may be replaced with the measurement point distance at the center position of the measurement point.

[0054] In particular, the acquisition unit 801 pre-sets the detection range. For example, if the theoretical detection range determined according to the wavelength resolution of the line sensor 326 is 0 to 12 mm (i.e., a width of 12 mm), the detection range used in actual measurement is set to 1 to 11 mm (i.e., a width of 10 mm).

[0055] The acquisition unit 801 acquires information on all dots included in the transport path data. For each dot, the acquisition unit 801 acquires the shortest workpiece distance, the longest elongation distance, and the longest measurement point distance. Figure 10 shows the distances acquired for each of dots 1 to 12.

[0056] (Processing of point 1) At the end of step S102, the acquisition unit 801 acquires the shortest workpiece distance (500 mm) and the longest measurement point distance (506 mm) of point 1, and the processing of step S102 is completed.

[0057] (Processing of point 2) [Step S103] The motion planning device 80 determines whether processing has been completed for all points. Since processing for points 2 to 12 has not been completed (Step S103: No), the device proceeds to step S104.

[0058] [Step S104] The acquisition unit 801 acquires the shortest workpiece distance (498 mm) and the longest measurement point distance (503 mm) of the dotting point 2.

[0059] [Step S105] The motion planning device 80 determines whether dot point 2 can be measured in the current group. Specifically, it determines whether the previous dot point 1 and the current dot point 2 can be measured within the same measurement range.

[0060] The detection range is 1 to 11 mm (i.e., a width of 10 mm). Therefore, if the measurement range adjustment value is set to the shortest workpiece distance of dot point 2 (498 mm), measurement becomes possible from 498 mm to 508 mm. This 498 mm to 508 mm range includes the shortest workpiece distance to the longest measurement point distance of dot point 1 (500 mm to 506 mm). Thus, by setting the measurement range adjustment value to a predetermined value (for example, 498 mm), dot point 1 and dot point 2 can be measured within the same measurement range without adjusting the reference arm. Since dot point 2 can be measured within the same measurement range as dot point 1, it is determined that dot point 2 can be measured in the same group as dot point 1, i.e., in the current group (step S105: yes), and the process proceeds to step S106.

[0061] [Step S106] The motion planning device 80 adds point 2 to the current group. Specifically, the motion planning device 80 adds point 2 to the current group 1, which includes point 1. The process then proceeds to step S103.

[0062] (Processing of point 3) [Step S103] The motion planning device 80 determines whether processing has been completed for all points. Since processing for points 3 to 12 has not been completed (Step S103: No), the process proceeds to step S104.

[0063] [Step S104] The acquisition unit 801 acquires the shortest workpiece distance (496 mm) and the longest measurement point distance (500 mm) of the dotting point 3.

[0064] [Step S105] The motion planning device 80 determines whether dot point 3 can be measured in the current group. Specifically, it determines whether dot points 1 and 2 included in the current group and the current dot point 3 can be measured within the same measurement range.

[0065] The detection range is 1 to 11 mm (i.e., a width of 10 mm). Therefore, if the measurement range adjustment value is set to the shortest workpiece distance of dot point 3 (496 mm), measurement becomes possible from 496 mm to 506 mm. This 496 mm to 506 mm range includes the shortest workpiece distance to the longest measurement point distance of dot point 1 (500 mm to 506 mm) and the shortest workpiece distance to the longest measurement point distance of dot point 2 (498 mm to 503 mm). Thus, by setting the measurement range adjustment value to a predetermined value (for example, 496 mm), dot points 1 to 3 can be measured within the same measurement range without adjusting the reference arm. Since dot point 3 can be measured within the same measurement range as dot points 1 to 2, it is determined that dot point 3 can be measured in the same group as dot points 1 to 2, i.e., in the current group (step S105: Yes), and the process proceeds to step S106.

[0066] [Step S106] The motion planning device 80 adds point 3 to the current group. Specifically, the motion planning device 80 adds point 3 to the current group 1, which includes points 1 and 2. The process then proceeds to step S103.

[0067] (Processing of point 4) [Step S103] The motion planning device 80 determines whether processing has been completed for all points. Since processing for points 4 to 12 has not been completed (Step S103: No), the process proceeds to step S104.

[0068] [Step S104] The acquisition unit 801 acquires the shortest workpiece distance (505 mm) and the longest measurement point distance (510 mm) of the dotting point 4.

[0069] [Step S105] The motion planning device 80 determines whether dot point 4 can be measured in the current group. Specifically, it determines whether dot points 1 to 3 included in the current group and the current dot point 4 can be measured within the same measurement range.

[0070] Since the detection range is 1 to 11 mm (i.e., a width of 10 mm), no matter what value the measurement range adjustment value is set to, it is not possible to include dots 1 to 3, where the minimum value of the shortest workpiece distance to the maximum value of the longest measurement point distance is 496 mm to 506 mm, and dot 4, where the shortest workpiece distance to the longest measurement point distance is 505 mm to 510 mm, within any measurement range of 10 mm. Therefore, it is determined that dots 1 to 3 and dot 4 cannot be measured within the same measurement range.

[0071] Therefore, in order to measure point 4, it is necessary to adjust the reference arm, and it is not possible to measure point 4 within the same measurement range as in the current group 1 (Step S105: No). Proceed to step S107.

[0072] [Step S107] The motion planning device 80 saves the current group 1. The calculation unit 802 sets the measurement range adjustment value for measuring dots 1 to dots 3 to 496 mm, which is the minimum of the shortest work distances between dots 1 to dots 3 included in the current group 1. This completes the processing for the current group 1.

[0073] Next, the motion planning device 80 creates a new group 2. The motion planning device 80 adds point 4 to group 2. Then, it returns to step S103.

[0074] (Processing of dots 5 to 12) Similarly, processing for dots 5 to 9 is performed, and dots 5 to 9 are added to the current group 2, which includes dot 4. Also, in processing dot 10, it is determined that dot 10 cannot be measured within the same measurement range as dots 4 to 9 included in group 2 (step S105: no), so dot 10 is added to a new group 3. Dots 11 and 12 are added to group 3.

[0075] [Step S103: After point 12] The motion planning device 80 determines whether processing has been completed for all points. After it is determined that processing has been completed for all points 1 to 12 (Step S103: Yes), the device proceeds to step S108.

[0076] [Step S108] The optimization unit 803 optimizes the operation of the entire laser ranging system, i.e., the system operation plan, based on the measurement range adjustment value. This optimizes the galvanometer scanner operation plan, the measurement system operation plan, and the transport device operation plan. After the above processing, the processing flow ends.

[0077] In the processing flow for dots 1 to 12 described above, dots 1 to 12 were classified into groups 1 to 3. The measurement range adjustment value for group 1 was set to 496 mm, for group 2 to 504 mm, and for group 3 to 496 mm. In measuring dots within each group, it is no longer necessary to change the measurement range adjustment value, thus eliminating the need to adjust the reference arm. In other words, the objective function of the cycle time related to the measurement range adjustment value is minimized, and each motion plan is created based on this, thus optimizing the system motion plan.

[0078] Figure 11 shows how the reference arm is adjusted by the processing of the first control example. As shown in Figure 11, even when moving from the current dot point to measuring a different dot point, adjustment of the reference arm is unnecessary. In Figure 7, the reference arm was adjusted when measurements were performed in the order of left, middle, and right, but in the example shown in Figure 11, adjustment of the reference arm is unnecessary when measuring the three dot points: left, middle, and right.

[0079] In the first control example described above, the measurement range adjustment value for at least two weld points included in the transport path was calculated based on the shortest workpiece distance and the longest measurement point distance for each weld point. Here, if the presence of a weld bead after welding is considered, the measurement range adjustment value for at least two weld points included in the transport path may be calculated based on the sum of the shortest workpiece distance and the negative minimum measurement distance (i.e., the maximum bead height) for each weld point, and the longest measurement point distance.

[0080] The following effects are achieved with the operation planning device 80 of this embodiment, which relates to the first control example described above.

[0081] The motion planning device 80 for the laser ranging system 1 equipped with the galvanometer scanner 10 of this embodiment, according to the first control example, includes an acquisition unit 801 that acquires position data of measurement points, galvanometer scanner model information including mechanism information of the galvanometer scanner 10, and measurement system model information including information on the measurement range for which the measurement system 30 connected to the galvanometer scanner 10 measures the measurement points; a calculation unit 802 that calculates a measurement range adjustment value for the measurement system model information based on the measurement range information; and an optimization unit 803 that optimizes the system motion plan for the laser ranging system 1 based on an objective function relating to the measurement range adjustment value. This reduces the number of reference arm adjustments and, therefore, shortens the overall processing time.

[0082] Furthermore, the acquisition unit 801 acquires dotting path data of the measured dotting points, and the calculation unit 802 calculates a measurement range adjustment value based on information regarding the measurement range corresponding to the dotting path data. This allows for consideration of distance changes due to welding shape factors, enabling more accurate calibration optimization.

[0083] Furthermore, the acquisition unit 801 acquires transport device model information, including the mechanism information of the transport device 70 of the galvanoscanner 10. By holding the galvanoscanner with the transport device, the degree of freedom regarding the measurement range of the measurement system is increased, and the processing range can be expanded.

[0084] Furthermore, the operator has pre-set a galvanometer scanner operation plan for the galvanometer scanner 10, and the calculation unit 802 further calculates a measurement range adjustment value based on the measurement range information generated based on the galvanometer scanner operation plan. This allows the cycle time to be shortened for any path desired by the operator. In addition, since the path is set in advance, the computational resources required for path generation can be minimized, and the system can be simplified.

[0085] Furthermore, the operator has pre-set a transport device operation plan for the galvanoscanner 10 transport device 70, and the operator has pre-set a galvanoscanner operation plan for the galvanoscanner 10 based on the transport device operation plan. The calculation unit 802 further calculates a measurement range adjustment value based on the measurement range information generated based on the galvanoscanner operation plan. This makes it possible to shorten the cycle time for the transport device operation and any path desired by the operator. In addition, since the transport device operation and the galvanoscanner path are pre-set, the computational resources related to transport device operation setting and path generation can be minimized, and the system can be simplified.

[0086] The optimization unit 803 calculates the measurement distance at multiple measurement points, determines whether a single measurement range adjustment value can be set for multiple measurement points, calculates the optimal measurement range adjustment value for the multiple measurement points determined to be settable, and saves the data of the multiple measurement points measured using the optimal measurement range adjustment value. This reduces the number of reference arm adjustments, and therefore shortens the overall machining time.

[0087] The calculation unit 802 calculates measurement range adjustment values ​​for at least two dots based on the detection range set based on the wavelength resolution of the measurement system 30, and the shortest workpiece distance and longest measurement point distance associated with each measurement dot. This reduces the number of reference arm adjustments and, therefore, shortens the overall machining time.

[0088] The calculation unit 802 creates a dot group containing at least two dots based on the detection range, the shortest workpiece distance, and the longest measurement point distance, and calculates a measurement range adjustment value based on the minimum of the shortest workpiece distances of the multiple dots included in the dot group. This reduces the number of reference arm adjustments and, therefore, shortens the overall machining time.

[0089] <Second Control Example> (Processing Flow of the Motion Planning Device) Referring to Figure 12, the processing flow executed by the motion planning device 80 in the second control example will be explained.

[0090] [Step S201] The motion planning device 80 executes all the processing flow shown in Figure 9 of the first control example. That is, the motion planning device 80 completes the processing for points 1 to 12 in Figure 10. The motion planning device 80 records the number of groups created. For example, 3, which is the number of groups created by the processing for points 1 to 12 in Figure 10, is recorded.

[0091] The motion planning device 80 also calculates the cycle time. The cycle time includes the adjustment time of the reference arm. The adjustment time of the reference arm is calculated based on the number of adjustments made to the reference arm. For example, if the unit adjustment time of the reference arm is 100 ms, the adjustment time for the reference arms of points 1 to 12 in Figure 10, which have a group number of 3, is calculated as 300 ms (= 3 times × 100 ms).

[0092] [Step S202] The motion planning device 80 determines whether processing has been completed for all dot sequences. For example, in the example shown in the first control example, processing has been completed for the dot sequence dot 1, dot 2, dot 3, ..., dot 12, but processing has not been completed for the dot sequence dot 2, dot 1, dot 3, ..., dot 12. At this time, it is determined that processing has not been completed for all dot sequences (Step S202: No), and the process proceeds to Step S203.

[0093] [Step S203] The optimization unit 803 of the motion planning device 80 rearranges the order of weld points. For example, it rearranges the order of weld points 1, 2, 3, ..., 12 to 2, 1, 3, ..., 12. The motion planning device 80 generates the welding program (step 101) and the OCT measurement program (step S102) of the first control example for the rearranged order of weld points. Then it returns to step S201.

[0094] [Step S201: Regarding the rearranged dot order] The motion planning device 80 executes the processing flow of the first control example for dots 2, 1, 3, ..., 12 in the rearranged dot order. The motion planning device 80 calculates the number of groups created by the processing of the rearranged dot order and the cycle time.

[0095] [Steps S202, S203, S201: For all rearrangeable dot sequences] The motion planning device 80 repeats the process in steps S202 to S203 to S201 for all rearrangeable dot sequences. If there are 12 dots, there will be (12 factorial - 1) rearrangeable dot sequences. The process in steps S202 to S203 to S201 may be repeated for all of these dot sequences, but the optimization unit 803 may omit processing for some dot sequences according to an arbitrary objective function.

[0096] As an example, let's assume that the processing flow of the first control example (from step S103 to the end) is executed for the sequence of points 1, 2, 3, 10, 11, 12, 4, 5, 6, 7, 8, and 9 in Figure 10.

[0097] In this case, the detection range is 1 to 11 mm (i.e., a width of 10 mm). Therefore, if the measurement range adjustment value is set to 496 mm, which is the minimum of the shortest workpiece distances for dots 1, 2, 3, 10, 11, and 12, dots 1, 2, 3, 10, 11, and 12 can be measured within the same measurement range without adjusting the reference arm. Consequently, dots 1, 2, 3, 10, 11, and 12 are included in group 1.

[0098] Additionally, the subsequent RBIs from 4 to 9 are not added to Group 1, but are included in a different Group 2.

[0099] Therefore, the number of groups for the dotting sequence of dotting point 1, dotting point 2, dotting point 3, dotting point 10, dotting point 11, dotting point 12, dotting point 4, dotting point 5, dotting point 6, dotting point 7, dotting point 8, dotting point 9 is 2. The number of adjustments of the reference arm for the dotting sequence in this embodiment is 2, which is fewer than the 3 adjustments of the reference arm for the dotting sequence in the first control example. The adjustment time of the reference arm for the dotting sequence in this control example is 200 ms (= 2 times × 100 ms), which is shorter than the adjustment time of the reference arm for the dotting sequence in the first control example, which is 300 ms (= 3 times × 100 ms). Therefore, the cycle time for the dotting sequence in this control example is smaller than the cycle time for the dotting sequence in the first control example.

[0100] [Step S202: After processing all score order] After the number of groups for all score order and the cycle time have been calculated (Step S202: Yes), the processing flow proceeds to Step S204.

[0101] [Step S204] The optimization unit 803 of the motion planning device 80 selects a welding program and an OCT measurement program with a welding order that minimizes the cycle time. That is, the optimization unit 803 optimizes the system motion plan by selecting a program that minimizes the objective function, which is the cycle time, based on the set measurement range adjustment value.

[0102] Here, the number of adjustments to the reference arm for the welding sequence of points 1, 2, 3, 10, 11, 12, 4, 5, 6, 7, 8, and 9 described above is 2, and it is determined that this minimizes the cycle time. Therefore, the welding program and OCT measurement program for this welding sequence are selected to optimize the system operation plan. After the processing in step S204, the flow ends.

[0103] (Changes to welding sequence and transport device route) Figure 13 shows an example in the second control example where the number of reference arm adjustments or adjustment time is used as an evaluation item, and the transport device route is changed in addition to the welding point measurement sequence, and the optimal welding program and OCT measurement program are selected.

[0104] Figure 13(a) shows an example where the welding order is not changed, as in the first control example. Figure 13(b) shows an example where the welding order is changed from the example in Figure 13(a). In Figure 13(b), the transport device's path R and the grouping of welding group I are further changed.

[0105] The transporter's route shown in Figure 13(a) includes groups I1 to I6, but for the sake of explanation, we will first explain only groups I1 to I3 in relation to the description in Figure 10.

[0106] Group I1 includes hits 1-3 in Figure 10. Group I2 includes hits 4-9 in Figure 10. Group I3 includes hits 10-12 in Figure 10.

[0107] When measurements are taken in the order of welding points as in the first control example, measurements are taken in the order of I1, I2, and I3, as indicated by the arrows in the welding order in Figure 13(a). In this case, the reference arm needs to be adjusted for the first welding point of I1 to I3, so the total number of reference arm adjustments for I1 to I3 is three.

[0108] When measurements are performed in the order of welding points as in the second control example, the points are grouped as shown in Figure 13(b), and measurements are performed in the order of I1, then I2, as indicated by the arrows in the welding order. In this case, adjustment of the reference arm is required for the measurement of the first welding point of I1 and the first welding point of I2, so the total number of reference arm adjustments between I1 and I2 is two.

[0109] Furthermore, when the dotting sequence that minimizes the cycle time in the second control example is selected, the path R of the conveying device may be changed in accordance with the change in the dotting sequence.

[0110] Figure 13(a) will be explained when groups I4 to I6 have been added. Figure 13(a) shows how measurements are carried out sequentially from group I1 to group I6.

[0111] As shown in Figure 13(a), when transitioning from group I3 to group I4, adjustment of the reference arm is necessary due to a step in the workpiece. Similarly, when transitioning from group I4 to group I5, and from group I5 to group I6, adjustment of the reference arm is necessary due to a step in the workpiece.

[0112] At this time, the reference arm is adjusted once for group I1, and then again when transitioning to each of groups I2 through I6. Therefore, the total number of reference arm adjustments in Figure 13(a) is six.

[0113] Figure 13(b) shows that, similar to Figure 13(a), measurements are performed sequentially, with the leftmost point designated as Group I1 and the rightmost point as Group I2.

[0114] As shown in Figure 13(b), during measurement of group I1, no adjustment of the reference arm is necessary because there are no steps in the workpiece. When transitioning from group I1 to group I2, adjustment of the reference arm is necessary because there are steps in the workpiece. During measurement of group I2, no adjustment of the reference arm is necessary because there are no steps in the workpiece.

[0115] In this case, the reference arm only needs to be adjusted at the beginning of groups I1 and I2. Therefore, the total number of reference arm adjustments in Figure 13(b) is two. Thus, it can be seen that by considering the order of dotting, the number of reference arm adjustments can be reduced and the cycle time can be optimized.

[0116] Furthermore, in Figure 13(a), the transport device moves along path R1, which is generated by applying the least squares method to a map plotting all points belonging to groups I1 to I6. In Figure 13(b), the transport device moves along path R2, which is generated by applying the least squares method to all points belonging to group I1, and path R3, which is generated by applying the least squares method to all points belonging to group I2. Therefore, it can be understood that the path of the transport device can change when the order of the points is changed.

[0117] As described above, in the second control example, the number of adjustments or adjustment time of the reference arm is used as an evaluation item, and not only the measurement order of the dots but also the path of the conveying device is changed to optimize the system operation plan. Note that, at the operator's discretion, the measurement order or the path of the conveying device may be changed as appropriate during the operation planning process.

[0118] Furthermore, the scoring order may be selected by considering evaluation criteria such as the movement speed of the conveying device, the energy consumption of the conveying device, and the cost of moving the conveying device. Examples of evaluation criteria that may be considered will be described later.

[0119] (Explanation of the second control example using a programming language) As described above, the operation of the motion planning device 80 in the second control example has been explained in detail, but in order to make it easier to understand, we will explain it using the description format of a programming language. The execution targets of if statements and for statements are the indented parts. The following program is an exemplary program for realizing the second control example and is not intended to limit the order of processing, etc.

[0120] (Main Program) Read each model information and allocate buffer space for operation time and motion plan. Rearrange all patterns of welding order for the weld points and save. For all the above weld point order patterns, execute the following in order: For this weld point order pattern, calculate and save all patterns of how to divide the welding groups. For all the above welding group patterns, execute the following in order: Execute function A. If the operation time calculated by function A is shorter than the buffer: Save operation time and motion plan to the buffer. Return Save operation time buffer and motion plan buffer and exit.

[0121] (Function A (Creation of motion plan based on a specific welding point sequence and welding group division)) Read the welding point sequence and group pattern For each welding group, execute the following from the beginning to the end of the processing sequence: Generate a path for the point cloud within this group using the least squares method Calculate the processing time based on the processed shape and robot speed according to the path length Create an on-the-fly processing program Save the motion plan individually Combine the individually created motion plans into a single processing program Optimize the reference arm adjustment using the method of the first control example Fine-tune the speed and time taking into account the reference arm adjustment time Return Save the motion plan and processing time *The operator may manually adjust the values ​​in each step.

[0122] <Evaluation Items for Operation Plan> In the first control example, an example was shown in which the number of reference arm adjustments was reduced by setting a measurement range adjustment value in order to shorten the cycle time. In the second control example, an example was shown in which the number of reference arm adjustments and adjustment time were further reduced by considering the dotting order. The operation plan of the entire laser ranging system may be optimized by adding evaluation items as shown in Figures 17A and 17B to the first and second control examples.

[0123] The constraints in Figure 17A are conditions related to the constraints on the operation of the system. The constraints are conditions for determining whether the set operation plan is OK or NG.

[0124] For example, regarding the evaluation item "interference with fixtures," in the set motion plan, paths where the processing laser is determined to hit the fixture are excluded, even if they result in a shorter cycle time.

[0125] The objective function in Figure 17B represents the conditions for numerically evaluating the system's operation plan, such as by assigning scores. Each item shown in Figure 17B is evaluated comprehensively based on its magnitude and other factors.

[0126] For example, in the first control example, the "calibration optimization (measurement grouping)" of the "cycle time" in the objective function was evaluated. In the second control example, the "machining order of machining points" in the "cycle time" in the objective function was further evaluated.

[0127] Furthermore, each objective function may be evaluated by normalizing or weighting it.

[0128] (Evaluation items related to elongation distance) As a further example of evaluation items, the evaluation related to elongation distance will be explained using Figure 15. The left side of Figure 15 shows that the galvanometer scanner is positioned directly above the starting point of the welding path, and the distance from the galvanometer scanner to the starting point of the welding path is the shortest workpiece distance. When welding is performed at an angle without on-the-fly operation, the elongation distance must be considered when measuring the distance from the galvanometer scanner to the end point of the welding path. When measuring the end point of the welding path, if the longest measurement point distance, including the elongation distance, exceeds the measurement range, the reference arm will need to be adjusted.

[0129] In contrast, when welding is performed using on-the-fly operation, for example, when measuring the end point of the welding path, the galvanometer scanner is positioned directly above the end point of the welding path (see the right side of Figure 15), so no adjustment of the reference arm is required as the extension distance increases.

[0130] Therefore, if the optimization unit 803 determines that adjustment of the reference arm will occur, it may optimize the system operation plan based on a determination of whether the use of on-the-fly operation reduces the number of adjustments or the adjustment time of the reference arm.

[0131] The following effects are achieved with the operation planning device 80 of this embodiment, which relates to the second control example described above.

[0132] In the second control example, the calculation unit 802 calculates the number of adjustments or adjustment time of the reference arm in the measurement system 30, the optimization unit 803 modifies the transport device operation plan for the galvanoscanner 10 transport device 70 using the number of adjustments or adjustment time as an evaluation item, the operator modifies the galvanoscanner operation plan for the galvanoscanner 10 based on the modified transport device operation plan, and the calculation unit 802 calculates the measurement range adjustment value based on the measurement range information generated based on the modified galvanoscanner operation plan. As a result, the transport device operation plan can also be modified, making it possible to optimize the entire system, including the transport device, with respect to the cycle time.

[0133] Furthermore, the operator has pre-set a transport device operation plan for the galvanoscanner 10 transport device 70. The calculation unit 802 calculates the number of adjustments or adjustment time for the reference arm in the measurement system 30. The optimization unit 803 uses the number of adjustments or adjustment time as an evaluation item and modifies the galvanoscanner operation plan for the galvanoscanner 10 based on the set transport device operation plan. The calculation unit 802 then calculates the measurement range adjustment value based on the measurement range information generated based on the modified galvanoscanner operation plan. As a result, the transport device operation plan can also be modified, allowing the entire system, including the transport device, to be optimized in terms of cycle time.

[0134] Furthermore, the calculation unit 802 calculates the number of adjustments or adjustment time of the reference arm in the measurement system 30, and the optimization unit 803 modifies the transport device operation plan for the galvanoscanner 10 transport device 70 and the galvanoscanner operation plan for the galvanoscanner 10, using the number of adjustments or adjustment time as evaluation items. The calculation unit 802 then calculates the measurement range adjustment value based on the measurement range information generated based on the modified galvanoscanner operation plan. As a result, the operation plan of the transport device may also be modified, making it possible to optimize the entire system, including the transport device, with respect to the cycle time.

[0135] Furthermore, if the optimization unit 803 determines that adjustment of the reference arm is required, it optimizes the system operation plan based on a determination of whether the use of on-the-fly operation reduces the number of adjustments or the adjustment time of the reference arm. As a result, the use or non-use of on-the-fly operation can be included in the operation plan, thereby optimizing the entire system in terms of cycle time.

[0136] <Computer Configuration> As shown in Figure 16, the computer 90 according to the embodiment of this disclosure comprises a processor 91, main memory 92, storage 93, and interface 94. The above-mentioned motion planning device 80 is implemented in the computer 90.

[0137] The operation instructions for each of the above-mentioned processing units are stored in storage 93 in the form of a program. The processor 91 reads the program from storage 93, expands it into main memory 92, and executes the above processing according to the program. If the program is distributed to computer 90 via a communication line or interface 94, the processor 91 may also expand the distributed program into main memory 92 and execute the above processing.

[0138] The program may be intended to implement a part of the functions that the processor 91 is to perform. For example, the program may perform its functions in combination with other programs already stored in the storage 93, or in combination with other programs implemented in other devices.

[0139] Storage 93 can be an HDD, SSD, magnetic disk, magneto-optical disk, CD-ROM (Compact Disc Read Only Memory), DVD-ROM (Digital Versatile Disc Read Only Memory), semiconductor memory, etc. Storage 93 may also be a tangible storage medium that is not temporary.

[0140] <Other Embodiments> Although the present disclosure has been described in detail, the present disclosure is not limited to the individual embodiments described above. These embodiments can be added, replaced, modified, partially deleted, etc., in any way that does not depart from the gist of the present disclosure or from the spirit of the present disclosure derived from the claims and their equivalents. Furthermore, these embodiments can be implemented in combination. For example, the order of operations and processes in the embodiments described above are shown as examples only and are not limited thereto. The same applies when numerical values ​​or mathematical formulas are used in the description of the embodiments described above.

[0141] (Configuration of the measurement system) As an example of the application of this disclosure, the optical coherence interferometer unit of the measurement system may be replaced with other optical measurement units, and the measurement range adjustment mechanism may be replaced with other measurement range adjustment mechanisms. For example, the measurement system 30 may have a configuration in which the optical coherence interferometer unit is replaced with a camera, a photodiode, or a lens unit without a light receiver. In this case, the measurement system 30 has a configuration in which the measurement range adjustment mechanism is replaced with a focus lens adjustment mechanism.

[0142] Furthermore, the measurement system 30 may have a configuration in which at least one of a camera, a photodiode, and a lens unit without a light receiver is continuously attached to the OCT unit. The order of connection in this case is not particularly limited. In addition, the operation plan may include optimizing the detection range in each unit.

[0143] (Execution body of the process) In the above embodiment, some or all of the processes performed by the motion planning device 80 may be performed by other devices. Each device in each embodiment may consist of multiple devices. Each device in each embodiment may be implemented using cloud computing.

[0144] (Examples of various embodiments) The following additional information is disclosed with respect to the above embodiments.

[0145] (Note 1) An action planning device (80) for a laser ranging system (1) equipped with a galvanometer scanner (10), comprising: an acquisition unit (801) that acquires: position data of a measurement point; galvanometer scanner model information including mechanism information of the galvanometer scanner (10); and measurement system model information including information regarding the measurement range for which a measurement system (30) connected to the galvanometer scanner (10) measures the measurement point; a calculation unit (802) that calculates a measurement range adjustment value for the measurement system model information based on the information regarding the measurement range; and an optimization unit (803) that optimizes the system action plan for the laser ranging system (1) based on an objective function relating to the measurement range adjustment value.

[0146] (Note 2) In the motion planning device (80) described above, the acquisition unit (801) further acquires the dot path data of the measurement dots, and the calculation unit (802) calculates the measurement range adjustment value based on information regarding the measurement range corresponding to the dot path data.

[0147] (Note 3) In the motion planning device (80) described above, the acquisition unit (801) further acquires transport device model information, including the mechanism information of the transport device (70) of the galvanoscanner (10).

[0148] (Note 4) In the above-described motion planning device (80), the operator has set a galvanoscanner motion plan for the galvanoscanner (10) in advance, and the calculation unit (802) calculates the measurement range adjustment value based on the information regarding the measurement range generated based on the galvanoscanner motion plan.

[0149] (Note 5) In the above-described motion planning device (80), the operator has set in advance a transport device motion plan for the transport device (70) of the galvanoscanner (10), and the operator has set in advance a galvanoscanner motion plan for the galvanoscanner (10) based on the transport device motion plan, and the calculation unit (802) calculates the measurement range adjustment value based on the information regarding the measurement range generated based on the galvanoscanner motion plan.

[0150] (Note 6) In the above-described motion planning device (80), the optimization unit (803) calculates the measurement distance at a plurality of measurement points, determines whether a single measurement range adjustment value can be set for the plurality of measurement points, calculates an optimal measurement range adjustment value for the plurality of measurement points that are determined to be settable, and saves the data of the plurality of measurement points measured using the optimal measurement range adjustment value.

[0151] (Note 7) In the above-described motion planning device (80), the calculation unit (802) calculates the number of adjustments or adjustment time of the reference arm in the measurement system (30), the optimization unit (803) modifies the transport device motion plan for the transport device (70) of the galvanoscanner (10) with the number of adjustments or adjustment time as an evaluation item, the operator modifies the galvanoscanner motion plan for the galvanoscanner (10) based on the modified transport device motion plan, and the calculation unit (802) calculates the measurement range adjustment value based on the measurement range information generated based on the modified galvanoscanner motion plan.

[0152] (Note 8) In the above motion planning device (80), the operator has set a transport device motion plan for the transport device (70) of the galvanoscanner (10) in advance, the calculation unit (802) calculates the number of adjustments or adjustment time of the reference arm in the measurement system (30), the optimization unit (803) modifies the galvanoscanner motion plan for the galvanoscanner (10) based on the set transport device motion plan, using the number of adjustments or adjustment time as an evaluation item, and the calculation unit (802) calculates a measurement range adjustment value based on the measurement range information generated based on the modified galvanoscanner motion plan.

[0153] (Note 9) In the above-described motion planning device (80), the calculation unit (802) calculates the number of adjustments or adjustment time of the reference arm in the measurement system (30), the optimization unit (803) modifies the transport device motion plan for the transport device (70) of the galvanoscanner (10) and the galvanoscanner motion plan for the galvanoscanner (10) using the number of adjustments or adjustment time as evaluation items, and the calculation unit (802) calculates the measurement range adjustment value based on the information regarding the measurement range generated based on the modified galvanoscanner motion plan.

[0154] (Note 10) In the above motion planning device (80), the measurement system (30) is one of the following: an OCT sensor, a camera, a photodiode, or an optical component without a light receiver.

[0155] (Note 11) In the motion planning device (80) described above, the transport device (70) is a robot, a single-axis machining center, or a multi-axis machining center.

[0156] (Note 12) In the above-described motion planning device (80), the optimization unit (803) optimizes the system motion plan based on a determination of whether the use of on-the-fly motion reduces the number of adjustments or the adjustment time of the reference arm when it is determined that adjustment of the reference arm will occur.

[0157] (Note 13) In the motion planning device (80) described above, the calculation unit (802) calculates measurement range adjustment values ​​for at least two dots based on the detection range set based on the wavelength resolution of the measurement system (30), and the shortest workpiece distance and the longest measurement point distance associated with each measurement dot.

[0158] (Note 14) In the motion planning device (80) described above, the calculation unit (802) creates a dot group including at least two dots based on the detection range, the shortest work distance, and the longest measurement point distance, and calculates the measurement range adjustment value based on the minimum of the shortest work distances of the multiple dots included in the dot group.

[0159] (Note 15) A computer program for planning the operation of a laser ranging system (1) equipped with a galvanometer scanner (10), comprising: an acquisition unit (801) that acquires position data of measurement points; galvanometer scanner model information including mechanism information of the galvanometer scanner (10); and measurement system model information including information regarding the measurement range for which a measurement system (30) connected to the galvanometer scanner (10) measures the measurement points; a calculation unit (802) that calculates a measurement range adjustment value for the measurement system model information based on the information regarding the measurement range; and an optimization unit (803) that optimizes the system operation plan for the laser ranging system (1) based on an objective function relating to the measurement range adjustment value.

[0160] (Note 16) A method for planning the operation of a laser ranging system (1) equipped with a galvanometer scanner (10), comprising: acquiring position data of a measurement point; galvanometer scanner model information including mechanical information of the galvanometer scanner (10); and measurement system model information including information regarding the measurement range for which a measurement system (30) connected to the galvanometer scanner (10) measures the measurement point; calculating a measurement range adjustment value for the measurement system model information based on the information regarding the measurement range; and optimizing the system operation plan for the laser ranging system (1) based on an objective function relating to the measurement range adjustment value.

[0161] 1 Laser ranging system 10 Galvanometer scanner 11 Laser light source 12 Processing head 13 Laser light deflection mechanism 20 Control device 30 Measurement system, optical coherence interferometer unit 32 Measurement light source 33 Scanner 34 Measurement light deflection mechanism 35 Calculation unit 40 Workpiece 70 Transport device 80 Motion planning device 801 Acquisition unit 802 Calculation unit 803 Optimization unit 90 Computer 91 Processor 92 Main memory 93 Storage 94 Interface 321 Light-emitting diode 322 Beam splitter 323 Reference mirror 324 Reference arm, optical path length adjustment mechanism 325 Diffraction grating 326 Line sensor

Claims

1. An action planning device for a laser ranging system equipped with a galvanometer scanner, comprising: an acquisition unit that acquires position data of a measurement point; galvanometer scanner model information including mechanism information of the galvanometer scanner; and measurement system model information including information regarding the measurement range for which a measurement system connected to the galvanometer scanner measures the measurement point; a calculation unit that calculates a measurement range adjustment value for the measurement system model information based on the information regarding the measurement range; and an optimization unit that optimizes the system action plan for the laser ranging system based on an objective function relating to the measurement range adjustment value.

2. The motion planning device according to claim 1, wherein the acquisition unit further acquires dot path data of the measurement dot, and the calculation unit calculates the measurement range adjustment value based on information relating to the measurement range corresponding to the dot path data.

3. The motion planning device according to claim 1, wherein the acquisition unit further acquires transport device model information including mechanism information of the transport device of the galvanometer scanner.

4. The motion planning device according to claim 1, wherein a galvanoscanner motion plan for the galvanoscanner is pre-set by an operator, and the calculation unit calculates the measurement range adjustment value based on information regarding the measurement range generated based on the galvanoscanner motion plan.

5. The operation planning device according to claim 1, wherein an operator has pre-set an operation plan for the transport device of the galvanoscanner, and the operator has pre-set an operation plan for the galvanoscanner based on the transport device operation plan, and the calculation unit calculates the measurement range adjustment value based on information regarding the measurement range generated based on the galvanoscanner operation plan.

6. The motion planning device according to any one of claims 1 to 5, wherein the optimization unit calculates the measurement distance at a plurality of measurement points, determines whether a single measurement range adjustment value can be set for the plurality of measurement points, calculates an optimal measurement range adjustment value for the plurality of measurement points that are determined to be settable, and stores the data of the plurality of measurement points measured using the optimal measurement range adjustment value.

7. The operation planning device according to claim 3, wherein the calculation unit calculates the number of adjustments or adjustment time of the reference arm in the measurement system; the optimization unit modifies the transport device operation plan for the galvanoscanner transport device with the number of adjustments or adjustment time as an evaluation item; the operator modifies the galvanoscanner operation plan for the galvanoscanner based on the modified transport device operation plan; and the calculation unit calculates a measurement range adjustment value based on the measurement range information generated based on the modified galvanoscanner operation plan.

8. The operation planning device according to claim 3, wherein an operator has pre-set an operation plan for the transport device of the galvanoscanner, the calculation unit calculates the number of adjustments or adjustment time of the reference arm in the measurement system, the optimization unit modifies the galvanoscanner operation plan for the galvanoscanner based on the pre-set transport device operation plan, with the number of adjustments or adjustment time as an evaluation item, and the calculation unit calculates a measurement range adjustment value based on information regarding the measurement range generated based on the modified galvanoscanner operation plan.

9. The motion planning device according to claim 3, wherein the calculation unit calculates the number of adjustments or adjustment time of the reference arm in the measurement system; the optimization unit modifies the transport device operation plan for the galvanoscanner transport device and the galvanoscanner operation plan for the galvanoscanner, using the number of adjustments or adjustment time as evaluation items; and the calculation unit calculates a measurement range adjustment value based on the information regarding the measurement range generated based on the modified galvanoscanner operation plan.

10. The motion planning device according to claim 1, wherein the measurement system is one of an OCT sensor, a camera, a photodiode, or an optical component without a light receiver.

11. The motion planning device according to claim 1, wherein the optimization unit optimizes the system motion plan based on a determination of whether the use of on-the-fly motion reduces the number of adjustments or the adjustment time of the reference arm when it is determined that adjustment of the reference arm occurs.

12. The motion planning device according to claim 1, wherein the calculation unit calculates measurement range adjustment values ​​for at least two dots based on a detection range set based on the wavelength resolution of the measurement system and the shortest work distance and longest measurement point distance associated with each measurement dot.

13. The motion planning device according to claim 12, wherein the calculation unit creates a dot group including at least two dots based on the detection range, the shortest work distance, and the longest measurement point distance, and calculates the measurement range adjustment value based on the minimum of the shortest work distances of the plurality of dots included in the dot group.

14. A computer program for planning the operation of a laser ranging system equipped with a galvanometer scanner, comprising: an acquisition unit that acquires position data of measurement points; galvanometer scanner model information including mechanical information of the galvanometer scanner; and measurement system model information including information regarding the measurement range for which a measurement system connected to the galvanometer scanner measures the measurement points; a calculation unit that calculates a measurement range adjustment value for the measurement system model information based on the measurement range information; and an optimization unit that optimizes the system operation plan for the laser ranging system based on an objective function relating to the measurement range adjustment value.

15. A method for planning the operation of a laser ranging system equipped with a galvanometer scanner, comprising: acquiring position data of a measurement point; galvanometer scanner model information including mechanical information of the galvanometer scanner; measurement system model information including information about the measurement range for which a measurement system connected to the galvanometer scanner measures the measurement point; calculating a measurement range adjustment value for the measurement system model information based on the information about the measurement range; and optimizing a system operation plan for the laser ranging system based on an objective function relating to the measurement range adjustment value.

Images