MEMS optical switch module and multi-port optical circuit switching device

Abstract

The present invention relates to the technical field of optical communications, and specifically relates to a MEMS optical switch module and a multi-port optical circuit switching device. The MEMS optical switch module comprises: at least one MEMS optical switch unit comprising a substrate and a MEMS optical path control mechanism arranged on the substrate, wherein a bond pad is provided on one side of the substrate, or alternatively bond pads are respectively provided on two adjacent sides of the substrate, the bond pad is configured to be bonded and connected to a circuit board, the bond pad is located on an outer ring of a formed tiled pattern, and the MEMS optical switch unit can collimate and / or deflect an incident light beam by means of the MEMS optical path control mechanism, so as to transmit the light beam to a target port. In this way, flexible tiling and use of the MEMS optical switch module can be achieved, thereby improving the scalability and replaceability, and reducing the production costs.

Description

MEMS optical switch module and multi-port optical circuit switching device Technical Field

[0001] This invention relates to the field of optical communication technology, and in particular to a MEMS optical switch module and a multi-port optical circuit switching device. Background Technology

[0002] With the rapid development of the Internet, the demand for high-speed, high-capacity optical communication networks is increasing daily. Optical Circuit Switching (OCS) is a technology that directly transmits data through optical paths in an optical fiber network, eliminating the need to convert optical signals into electrical signals, thus achieving end-to-end connections. It plays a crucial role in improving network resource utilization, enhancing network reliability, and increasing flexibility. Traditional OCS technologies, such as mechanical optical switch matrices, suffer from drawbacks such as large size, high power consumption, slow switching speed, and poor reliability, making it difficult to meet the ever-growing demands of modern optical communication networks.

[0003] The emergence of Micro-Electro-Mechanical Systems (MEMS) technology has brought new opportunities for the development of Optical Computer Systems (OCS). MEMS is a novel technology that integrates microelectronics and micromachining, enabling the integration of multiple functional components such as mechanical structures, sensors, actuators, and electronic circuits onto tiny chips. Applying MEMS technology in OCS enables the miniaturization, low power consumption, and high-speed switching of optical switches. MEMS optical switches utilize the movement of micromechanical structures to control the on / off switching of optical paths. Their basic principle is to use electrostatic, electromagnetic, or thermal actuation methods to displace or rotate micromechanical structures such as micromirrors and microcantilever beams, thereby altering the propagation path of the optical signal. Compared to traditional mechanical optical switches, MEMS optical switches offer advantages such as small size, light weight, low power consumption, fast response speed, and ease of integration. Technical issues

[0004] However, since the current MEMS chip wiring design is a four-sided pad design, and micromirrors are usually integrated on a single chip, when applied to multi-port cross connectors, more than a thousand micromirrors need to be integrated on a single chip. This increases the manufacturing difficulty of the micromirror array exponentially. At the same time, if any part is damaged, the entire chip will be scrapped, greatly increasing the cost. Technical solutions

[0005] The technical problem to be solved by the embodiments of the present invention is to provide a MEMS optical switch module and a multi-port optical circuit switching device, which can realize the flexible splicing and use of MEMS optical switch modules, improve scalability and replaceability, and reduce production costs.

[0006] The present invention discloses a MEMS optical switch module, comprising: at least one MEMS optical switch unit, wherein the MEMS optical switch unit includes a substrate, and a MEMS optical path control mechanism disposed on the substrate. A pad is provided on one side of the substrate, or pads are respectively provided on two adjacent sides of the substrate. The pads are used for bonding connection with a circuit board. The pads are located on the outer circle of the formed splicing pattern, and the MEMS optical switch unit can collimate and / or deflect an incident light beam through the MEMS optical path control mechanism to transmit it to a target port.

[0007] Optionally, two MEMS optical switch units are provided; a pad is provided on one side of one of the substrates, and pads are provided on two adjacent sides of the other substrate; or pads are provided on one side of the two substrates; or pads are provided on two adjacent sides of the two substrates.

[0008] Optionally, three MEMS optical switch units are provided; the splicing pattern formed by the MEMS optical switch units is in a "one" shape or an L shape.

[0009] Optionally, four MEMS optical switch units are provided; the splicing pattern formed by the MEMS optical switch units is in a "one" shape, a "field" shape or an L shape.

[0010] Optionally, 5 to 8 MEMS optical switch units are provided, and the sides of adjacent MEMS optical switch units are aligned.

[0011] Optionally, there are multiple MEMS optical switch units, and some of the MEMS optical switch units are arranged at an angle to each other.

[0012] Optionally, a pad is provided on one side of at least one of the substrates, or pads are provided on two adjacent sides of at least one of the substrates.

[0013] Optionally, the structural forms of the MEMS optical path control mechanisms on each MEMS optical switch unit are different.

[0014] Optionally, the splicing pattern includes a solid pattern, a hollow pattern or a pattern with a notch. <000003...3>

[0015] The present invention also discloses a multi-port optical circuit switching device, comprising the MEMS optical switch module according to any one of the above. Beneficial effects

[0016] Compared with existing technologies, the MEMS optical switch module and multi-port optical circuit switching device provided in this invention have the following advantages: Depending on the number of ports, optical path control can be achieved using only one MEMS optical switch unit. If the number of ports is increased, the number of corresponding MEMS optical switch units can be increased as needed. This allows for the design of the MEMS optical path control mechanism corresponding to the additional MEMS optical switch units based on the existing MEMS optical switch unit structure, without altering the original MEMS optical switch units. This avoids the waste of previously produced MEMS optical switch units, improves the reuse rate of MEMS optical switch units, and reduces production costs. Furthermore, by configuring the MEMS optical switch units to be interconnected, the area occupied by a single MEMS optical switch unit is smaller. With a fixed wafer size, the wafer edges can be better utilized, facilitating the division of more substrates and thus increasing the output of MEMS optical switch units, further reducing production costs. Meanwhile, by using multiple MEMS optical switch units interconnected, fewer micromirrors can be placed on a single MEMS optical switch unit, reducing operational complexity, lowering process requirements, and facilitating production. Furthermore, if a single MEMS optical switch unit fails, it can be replaced directly without replacing the entire MEMS optical switch module, further reducing production costs. Understandably, having pads on one side of the substrate, or pads on adjacent sides of the substrate, facilitates the interconnection of multiple MEMS optical switch units, allowing for different configurations and enabling flexible interconnection of the MEMS optical switch module. This improves scalability and replaceability, and reduces production costs. Attached Figure Description

[0017] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. In the accompanying drawings:

[0018] Figure 1 is one of the structural schematic diagrams of the MEMS optical switch module provided in an embodiment of the present invention;

[0019] Figure 2 is one of the structural schematic diagrams of the MEMS optical switch unit provided in an embodiment of the present invention;

[0020] Figure 3 is a second schematic diagram of the structure of the MEMS optical switch unit provided in an embodiment of the present invention;

[0021] Figure 4 is a second schematic diagram of the structure of the MEMS optical switch module provided in an embodiment of the present invention;

[0022] Figure 5 is a third schematic diagram of the structure of the MEMS optical switch module provided in the embodiment of the present invention;

[0023] Figure 6 is a fourth structural schematic diagram of the MEMS optical switch module provided in an embodiment of the present invention;

[0024] Figure 7 is the fifth structural schematic diagram of the MEMS optical switch module provided in the embodiment of the present invention;

[0025] Figure 8 is a schematic diagram of the MEMS optical switch module provided in an embodiment of the present invention.

[0026] The labels for the attached figures are as follows:

[0027] 100. MEMS optical switch module; 110. MEMS optical switch unit; 112. Substrate; 114. Pad. The best embodiment of the present invention

[0028] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0029] As shown in Figures 1 to 5, this embodiment of the invention provides a MEMS optical switch module 100, including: at least one MEMS optical switch unit 110. The MEMS optical switch unit 110 includes a substrate 112 and a MEMS optical path control mechanism disposed on the substrate 112. A pad 114 is disposed on one side of the substrate 112, or pads 114 are respectively disposed on two adjacent sides of the substrate 112. The pads 114 are used for bonding with a circuit board. The pads 114 are located on the outer ring of the formed splicing pattern, and the MEMS optical switch unit 110 can collimate and / or deflect the incident light beam through the MEMS optical path control mechanism to transmit it to the target port.

[0030] It should be noted that the MEMS optical path control mechanism housing in this application embodiment is flexibly configured as needed to meet optical path requirements. The MEMS optical path control mechanism can adopt common configurations to control the optical path. For example, electrostatic drive can be used: an external voltage is applied to the micromirror, and the vibration and movement of the structure are achieved through electric field force. Voltage drive typically uses an adjustable voltage source or drive circuit, which can provide control over the application of different vibration frequencies and amplitudes to the micromirror. Thermal drive can also be used: the temperature change caused by thermal effects is used to drive the micromirror. For example, the combination of materials with different coefficients of thermal expansion or the use of electrothermal devices can be used to control the micromirror. Electromagnetic drive can also be used: an external magnetic field is used to apply force to the micromirror, thereby achieving its vibration and movement. Electromagnetic actuators or permanent magnet actuators are typically used to provide a stable magnetic field, and the micromirror is controlled by changing the direction and magnitude of the magnetic field. In practical applications, different MEMS driving methods can be reasonably selected and the micromirror can be designed in combination with the driving target, depending on the application scenario and process conditions. This application embodiment does not impose specific limitations in this regard.

[0031] The MEMS optical switch module 100 provided in this application embodiment can achieve optical path control using only one MEMS optical switch unit 110, depending on the number of ports. If the number of ports is increased, the number of corresponding MEMS optical switch units 110 can be increased as needed. In this way, when increasing the number of ports, the MEMS optical path control mechanism corresponding to the additional MEMS optical switch unit 110 can be designed based on the existing structure of the MEMS optical switch unit 110, without changing the original MEMS optical switch unit 110. This avoids the waste of previously produced MEMS optical switch units 110, improves the reuse rate of MEMS optical switch units 110, and reduces production costs. Furthermore, by setting the MEMS optical switch units 110 to a form that can be spliced ​​together, the area occupied by a single MEMS optical switch unit 110 can be reduced. With a fixed wafer size, the edges and corners of the wafer can be better utilized, which is beneficial for dividing more substrates 112, thereby increasing the output of MEMS optical switch units 110 and further reducing production costs. Meanwhile, by using multiple MEMS optical switch units 110 interconnected, fewer micromirrors can be placed on a single MEMS optical switch unit 110, reducing operational complexity, lowering process requirements, and facilitating production. Furthermore, if a single MEMS optical switch unit 110 fails, it can be replaced directly without replacing the entire MEMS optical switch module 100, further reducing production costs. It is understandable that the substrate 112 has pads 114 on one side, or pads 114 on adjacent sides of the substrate 112, which facilitates the interconnection of multiple MEMS optical switch units 110, allowing for different configurations and enabling flexible interconnection of the MEMS optical switch module 100. This improves scalability and replaceability, and reduces production costs.

[0032] The pads 114 serve as the input / output interfaces for the chip, connecting the internal circuitry of the MEMS optical switch unit 110 to external circuitry for data transmission and signal processing. The pads 114 are positioned on one side of the substrate 112 of the MEMS optical switch unit 110, or on adjacent sides of the substrate 112. This arrangement facilitates the splicing of multiple MEMS optical switch units 110 while reducing circuit board complexity and improving production efficiency and reliability. Furthermore, the bonding of the pads 114 to the circuit board enhances the convenience and reliability of the bonding connection. Additionally, the pads 114 are located on the outer edge of the formed splicing pattern, resulting in a closer fit between the MEMS optical switch units 110, improving space utilization and reducing overall size.

[0033] As shown in FIG. 6, in an alternative embodiment of the present application, two MEMS optical switch units 110 are provided; a pad 114 is provided on one side of one substrate 112, and pads 114 are provided on two adjacent sides of the other substrate 112; or pads 114 are provided on one side of the two substrates 112; or pads 114 are provided on two adjacent sides of the two substrates 112.

[0034] Specifically, when the MEMS optical switch module 100 is formed by splicing two MEMS optical switch units 110, the two MEMS optical switch units 110 can be arranged side by side, or can be arranged in a corner shape as shown in FIG. 6, and can be flexibly set according to actual needs. The present application embodiment does not make specific restrictions on this. In addition, the positions of the pads 114 on the substrates 112 corresponding to the two MEMS optical switch units 110 can also be flexibly selected according to actual needs and the design form of the circuit on the circuit board, as long as the overall processing and production process can be simplified.

[0035] As shown in FIG. 7, in an alternative embodiment of the present application, three MEMS optical switch units 110 are provided; the splicing pattern formed by the MEMS optical switch units 110 is a "one" shape or an L shape.

[0036] Specifically, in actual applications, due to different port numbers and different installation positions, the structural forms of multi-port optical circuit switching devices are also different. In order to better match different assembly environments, the splicing pattern formed by the MEMS optical switch units 110 can be set as a "one" shape or an L shape to meet different needs.

[0037] As shown in FIGS. 1, FIG. 4 and FIG. 5, in an alternative embodiment of the present application, four MEMS optical switch units 110 are provided; the splicing pattern formed by the MEMS optical switch units 110 is a "one" shape, a "field" shape or an L shape.

[0038] It can be understood that the more the number of MEMS optical switch units 110, the more it can cope with the increase in the number of ports, which is beneficial to ensuring the stability of optical communication. The specific splicing pattern can be set according to needs to meet the requirements of optical path transmission and specific space settings.

[0039] In an alternative embodiment of the present application, the number of MEMS optical switch units 110 is set to 5 to 8, and the sides of adjacent MEMS optical switch units 110 are aligned.

[0040] The above approach is beneficial for improving space utilization. For example, as shown in Figure 8, there are 8 MEMS optical switch units 110. In order to improve space utilization, the sides of adjacent MEMS optical switch units 110 are aligned, and the pads 114 are located on the outer ring of the splicing pattern to avoid affecting the tight arrangement of adjacent MEMS optical switch units 110 when the pads 114 are bonded to the circuit board.

[0041] In an optional embodiment of this application, there are multiple MEMS optical switch units 110, and some of the MEMS optical switch units 110 are arranged at an angle to each other.

[0042] The presence of 2 to 8 MEMS optical switch units 110 is sufficient for current needs. When more ports are required, the number of MEMS optical switch units 110 can be increased as needed. Furthermore, when assembling MEMS optical switch units 110, some units can be arranged side-by-side, with adjacent units aligned side-by-side, or some units can be arranged at angles, with their sharp corners facing each other.

[0043] In an optional embodiment of this application, when multiple MEMS optical switch units 110 are configured, at least one substrate 112 is provided with a pad 114 on one side, or at least one substrate 112 is provided with pads 114 on two adjacent sides.

[0044] Specifically, in order to better ensure that the pad 114 is located on the outer ring of the splicing pattern, and to facilitate the compactness of the splicing of the MEMS optical switch unit 110 and the convenience of subsequent bonding, the position of the pad 114 can be flexibly set to better meet the required splicing requirements.

[0045] Understandably, the structure of the MEMS optical path control mechanism on each MEMS optical switch unit 110 is different. Depending on the position and number of ports, multiple MEMS optical switch units 110 need to cooperate with each other during optical transmission to realize the corresponding optical path. Therefore, the MEMS optical path control mechanisms on MEMS optical switch units 110 at different splicing positions are different. In practical applications, they can be flexibly set according to actual needs.

[0046] In optional embodiments of this application, the splicing pattern includes a solid pattern, a hollow pattern, or a pattern with notches. In practical applications, any pattern that can be better applied to multi-port optical circuit switching devices is acceptable.

[0047] The present invention also discloses a multi-port optical circuit switching device, including the MEMS optical switch module 100 in the foregoing embodiments. This multi-port optical circuit switching device has the same structure and beneficial effects as the MEMS optical switch module 100 in the foregoing embodiments. The structure and beneficial effects of the MEMS optical switch module 100 have been described in detail in the foregoing embodiments and will not be repeated here.

[0048] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit them. Those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some of the technical features; and all such modifications and substitutions should fall within the protection scope of the appended claims of the present invention.

Claims

1. A MEMS optical switch module, characterized in that, Comprising: At least one MEMS optical switch unit, the MEMS optical switch unit comprising a substrate, and a MEMS optical path control mechanism disposed on the substrate, wherein pads are provided on one side of the substrate, or pads are respectively provided on two adjacent sides of the substrate, the pads being used for bonding connection with a circuit board, the pads being located on the outer ring of the formed splicing pattern, and the MEMS optical switch unit being capable of collimating and / or deflecting an incident light beam through the MEMS optical path control mechanism to transmit to a target port.

2. The MEMS optical switch module according to claim 1, characterized in that, The MEMS optical switch units are provided as two; pads are provided on one side of one of the substrates, and pads are provided on two adjacent sides of the other substrate; or pads are provided on one side of the two substrates; or pads are provided on two adjacent sides of the two substrates.

3. The MEMS optical switch module according to claim 1, characterized in that, The MEMS optical switch units are provided as three; the splicing pattern formed by the MEMS optical switch units is in the shape of "one" or "L".

4. The MEMS optical switch module according to claim 1, characterized in that, The MEMS optical switch units are provided as four; the splicing pattern formed by the MEMS optical switch units is in the shape of "one", "field", or "L".

5. The MEMS optical switch module according to claim 1, characterized in that, The MEMS optical switch units are provided as 5 to 8, and the sides of adjacent MEMS optical switch units are aligned.

6. The MEMS optical switch module according to claim 1, characterized in that, The MEMS optical switch units are multiple, and some of the MEMS optical switch units are arranged at an angle to each other.

7. The MEMS optical switch module according to any one of claims 3-6, characterized in that, Pads are provided on one side of at least one of the substrates, or pads are provided on two adjacent sides of at least one of the substrates.

8. The MEMS optical switch module according to any one of claims 1-6, characterized in that, The structural forms of the MEMS optical path control mechanisms on each MEMS optical switch unit are different.

9. The MEMS optical switch module according to any one of claims 1-5, characterized in that, The splicing pattern includes a solid pattern, a hollow pattern, or a pattern with a notch.

10. A multi-port optical circuit switching device, characterized in that, Comprising the MEMS optical switch module according to any one of claims 1 - 9.

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