An apparatus for separating an electronics component, such as an electronics component or a light emitting device, led, from a flexible, adhesive film, as well as a method for controlling such apparatus

Abstract

apparatus for separating an electronics component from a flexible, adhesive film is proposed comprising a support platform, a needle ejector unit comprising ejector needles, a component pick up unit mounted above the support platform and a control unit for operating at least the component pick up unit and the array of the plurality of ejector needles. It is also provided with a processing unit, which is structured to determine, in a virtual operation environment, a virtual pressure characteristic exerted on a virtual electronics component mounted on a virtual flexible, adhesive film based on position information of the ejector needles in a first operational condition with no flexible, adhesive film accommodated on the support platform and to control, in a second operational condition with the flexible, adhesive film accommodated on the support platform with the at least one electronics component to be separated being oriented at the component separation section, the separation of an electronics component from a flexible, adhesive film in response to the virtual pressure characteristic thus determined. The inline computed virtual pressure characteristic represents thin-die stress levels, which are based on the geometry of the pick-up apparatus, the dimensions of the electronics component to be separated, as well as its surface topology which interacts with the component pick up unit. Herewith the risk of diecrack during the pickup process by the component pick up unit are minimized.

Description

[0001] TITLE

[0002] An apparatus for separating an electronics component, such as an electronics component or a light emitting device, LED, from a flexible, adhesive film, as well as a method for controlling such apparatus.

[0003] TECHNICAL FIELD

[0004] The present disclosure relates to the field of electronics component handling, in particular to the separation of an individual electronics component from a flexible, adhesive tape.

[0005] BACKGROUND OF THE DISCLOSURE

[0006] Conventional semiconductor chip manufacturing involves the processing of semiconductor wafers with on one side an array of semiconductor devices. These wafers are then sliced into individual chips or dies using known dicing techniques after being mounted on flexible, adhesive wafer handling tape or film. The flexible, adhesive film holds the plurality of individual semiconductor dies and aids in transport during the subsequent semiconductor die handling and mounting process steps.

[0007] The individual semiconductor dies are separated from the flexible, adhesive tape by a separating apparatus, and the separated semiconductor dies are subsequently handled separated by pick-and-place equipment, e.g. placed on a lead frame etc.

[0008] The separation of an individual semiconductor die from the flexible, adhesive film and its subsequent handling is susceptible to die-crack. Die-crack is a well-known failure mode in thin chip die bonding applications. Wafers with a thickness smaller than 70 pm run a high risk of die-crack occurrences under mechanical or thermal stress from the handling or the processing. Because the wafer thickness relates to the product power performance, a thinner wafer improves the electrical resistance of the chip (RDSon) and minimizes the power loss.

[0009] Accordingly, in view of the need for semiconductor chips in MOSFET, SiC and GaN power applications having an even more thinner wafer thickness, it is a goal of the present disclosure to provide an improved apparatus and method forseparating an individual electronics component from a flexible, adhesive film and in particular in a methodology to ascertain or detect possible occurrence of die-crack in advance and to prevent die-crack from occurring during pickup of large thin semiconductor dies. It is noted, that the disclosure is not limited to separating semiconductor dies from a flexible, adhesive film, but is also applicable for any similar process of handling any fragile thin film device, which can suffer from die-crack if applied forces exceeds certain stress levels and accordingly applicable to any large number of individual electronics components, optical components and micromechanical components arranged on a flexible, adhesive film, such as capacitors, resistors, LEDs, memory chips, MEMS, etc. etc..

[0010] SUMMARY OF THE DISCLOSURE

[0011] According to a first example of the disclosure, an apparatus for separating an electronics component, such as an electronics component or a light emitting device, LED, from a flexible, adhesive film is proposed. The apparatus may comprise a support platform having a support surface provided with a component separation section having a plurality of through openings as well as a needle ejector unit comprising an array composed of a plurality of ejector needles; a component pick up unit mounted above the support platform and movable with respect to the component separation section. Additional the apparatus comprises a control unit for operating at least the component pick up unit and the array of the plurality of ejector needles.

[0012] Furthermore, according to the disclosure the apparatus is provided with a processing unit, which is structured to determine, in a virtual operation environment, a virtual pressure characteristic exerted on a virtual electronics component mounted on a virtual flexible, adhesive film based on position information of the plurality of ejector needles in a first operational condition with no flexible, adhesive film accommodated on the support platform.

[0013] Additionally, the processing unit controls, in a second operational condition with the flexible, adhesive film accommodated on the support platform with the at least one electronics component to be separated being oriented at the component separation section, the separation of an electronics component from a flexible, adhesive film in response to the virtual pressure characteristic thus determined.It should be noted, that the separation of the electronics component is performed by the processing unit by proper control of the control unit, which in turn properly operates at least the component pick up unit and the array of the plurality of ejector needles.

[0014] With the above configuration, in a virtual operation environment and under the conditions of the first operational condition, a virtual pressure characteristic is calculated. The inline computed virtual pressure characteristic represents thin-die stress levels, which are based on the geometry of the pick-up apparatus, the dimensions of the electronics component to be separated, as well as its surface topology which interacts with the component pick up unit. Herewith the risk of diecrack during the pickup process by the component pick up unit are minimized.

[0015] Accordingly, the quality of thin die pickup processing is improved, and the human factor for given assembly parameters, tools and die dimensions are eliminated.

[0016] In a further detail of the apparatus according to the disclosure, it further comprises a detection device which is structured to detect the positions of the plurality of ejector needles in the first operational condition and to convert the positions in corresponding position information. Detecting the actual positions of the plurality of ejector needles when activated in the first operational condition and inputting these actual needle positions in the virtual operation environment allowing the processing unit to determine the thin-die stress levels as the inline computed virtual pressure characteristic, ascertains a proper adaptation of the separating and picking up process with the component pick up unit minimizing any die-crack and yield loss caused by out-of-spec operational conditions or gradual drift or tool wear over time.

[0017] In two particular examples, the positions of the plurality of ejector needles in the first operational condition are detected by the detection device implementing a vision camera and / or implementing a voice coil linear actuator.

[0018] In particular, for a proper detection of the positions of the plurality of ejector needles in the first operational condition, the control unit is capable to actuate the plurality of ejector needles in such manner, causing the plurality of ejector needles to move through the corresponding through opening. Thus, with the plurality of ejector needles being actuated and displaced through their corresponding through opening, their actual position, in particular the actual height position of each needle tip, above the mounting surface of the support platform can be readily visualized and determined and subsequently inputted in the processing unit.A further example of the apparatus according to the disclosure constitutes the processing unit to detect, in the second operational condition, the separation of an electronics component from a flexible, adhesive film in response to the virtual pressure characteristic thus determined. Herewith it can be ascertained whether the actual real-life adaptation of the separating and picking up process with the component pick up unit as programmed by the processing unit based on the calculated virtual pressure characteristic is correct.

[0019] It should be noted that the actual real-life adaptation of the separating and picking up process with the component pick up unit in the second operational condition as programmed by the processing unit based on the calculated virtual pressure characteristic is achieved with the processing unit by proper adjustment or calibration of the actuation of the plurality of ejector needles, and / or by proper adjustment or calibration of the operation of the at least the component pick up unit, and / or by proper adjustment of the orientation of the at least one electronics component to be separated relative to the component separation section.

[0020] In particular, the processing unit is capable to adjust in the second operational condition the number of ejector needles to be actuated and / or the actuation height of the actuated ejector needles. As an explanation, due to the displacement of the plurality of ejector needles through their corresponding through opening, the needle tips will elevate above the mounting surface of the support platform and subsequently contact the flexible, adhesive film and accordingly elevate the electronics component to be separated.

[0021] It is noted that due to the displacement of the plurality of ejector needles through their corresponding through opening, the needle tips will elevate above the mounting surface of the support platform and subsequently contact the flexible, adhesive film and accordingly elevate the electronics component to be separated. The pressure contacts between the various needles and the electronics component may cause material stress levels which can be computed and identified in the initial, virtual pressure characteristic calculated on an identical, yet virtual, electronics component in the virtual operation environment.

[0022] Accordingly, in order to avoid these undesirable material stress levels in real-time, that is in the second operational condition when the actual electronics component is to be separated from the flexible, adhesive film, the processing unit and the control unit can be controlled such that the actuation of the plurality of ejector needles is adjusted e.g. by not activating a particular ejector needle or by activating aparticular ejector needle or by elevating a particular ejector needle till a lower (or higher) needle height, thereby preventing the occurrence of an undesirable material stress level at that particular needle location on the electronics component to be separated.

[0023] Alternatively or combined, the orientation of the electronics component to be separated can be adjusted relative to the component separation section and relative to the plurality of ejector needles, thereby relocating the pressure contacts between the various needles and the electronics component and accordingly minimizing or diminishing any material stress level from occurring. Additionally, the control unit may alter the operation of the component pick up unit thereby likewise avoiding or minimizing material stress levels from occurring due to the contact between the component pick up unit and the electronics component to be picked up.

[0024] The disclosure also pertains to a method for controlling an apparatus according to the disclosure as outlined above. The method comprises the steps of: i) determining, in a virtual operation environment, a virtual pressure characteristic exerted on a virtual electronics component mounted on a virtual flexible, adhesive film based on position information of the plurality of ejector needles in a first operational condition with no flexible, adhesive film accommodated on the support platform; and

[0025] ii) controlling, in a second operational condition with the flexible, adhesive film accommodated on the support platform with the at least one electronics component to be separated being oriented at the component separation section, the separation of an electronics component from a flexible, adhesive film in response to the virtual pressure characteristic thus determined.

[0026] Herewith, as explained above, in the virtual operation environment and under the conditions of the first operational condition, a virtual pressure characteristic is calculated. The inline computed virtual pressure characteristic represents thin-die stress levels, which are based on the geometry of the pick-up apparatus, the dimensions of the electronics component to be separated, as well as its surface topology which interacts with the component pick up unit. Herewith the risk of diecrack during the pickup process by the component pick up unit are minimized. Accordingly, the quality of thin die pickup processing is improved, and the human factor for given assembly parameters, tools and die dimensions are eliminated.

[0027] In a further step iii), with the use of a detection device, the positions of the plurality of ejector needles in the first operational condition are detected and instep iv) these positions as detected are converted in corresponding position information, which are in turn used, in the virtual operation environment and under the conditions of the first operational condition, to calculate the virtual pressure characteristic.

[0028] The step i) of determining is performed by either using a vision camera and / or by using voice coil linear actuator.

[0029] For a proper detection of the positions of the plurality of ejector needles in the first operational condition, allowing the processing unit to calculate the virtual pressure characteristic with a high degree of accuracy, the method according to the disclosure further comprises the step v) of actuating, in the first operational condition using the control device of the apparatus, the plurality of ejector needles, causing the plurality of ejector needles to move through the corresponding through opening. Herewith their actual position, in particular the actual height position of each needle tip, above the mounting surface of the support platform can be readily visualized and determined and subsequently inputted in the processing unit ascertaining a proper and accurate calculation of the virtual pressure characteristic.

[0030] In a further detail the method may comprise the step iv) of detecting, in the second operational condition by the processing unit of the apparatus the separation of an electronics component from a flexible, adhesive film in response to the virtual pressure characteristic thus determined. Herewith it can be ascertained whether the actual real-life adaptation of the separating and picking up process with the component pick up unit as programmed by the processing unit based on the calculated virtual pressure characteristic is correct.

[0031] The method further may employ the steps, performed by the processing unit of the apparatus in the second operational condition, vii) of adjusting the actuation of the plurality of ejector needles, and / or viii) of adjusting the operation of the at least the component pick up unit, and / or ix) of adjusting the orientation of the at least one electronics component to be separated relative to the component separation section.

[0032] Additionally the method may employ the step x) of adjusting, in the second operational condition by the processing unit of the apparatus, the number of ejector needles to be actuated and / or the actuation height of the actuated ejector needles. The adjusting step x) may also encompass the adjustment of the ejector speed (as viscoelastic forces of the adhesive tape film are higher for faster push-up actions, hence create more risk of die-crack). Or adjusting the synchronization between the ejector needles actuated ejector and the pick-up collet.It is noted that due to the displacement of the plurality of ejector needles through their corresponding through opening, the needle tips will elevate above the mounting surface of the support platform and subsequently contact the flexible, adhesive film and accordingly elevate the electronics component to be separated. The pressure contacts between the various needles and the electronics component may cause material stress levels which can be computed and identified in the initial, virtual pressure characteristic calculated on an identical, yet virtual, electronics component in the virtual operation environment.

[0033] Accordingly, in order to avoid these undesirable material stress levels in real-time, that is in the second operational condition when the actual electronics component is to be separated from the flexible, adhesive film, the processing unit and the control unit can be controlled such that the actuation of the plurality of ejector needles is adjusted e.g. by not activating a particular ejector needle or by activating a particular ejector needle or by elevating a particular ejector needle till a lower (or higher) needle height, thereby preventing the occurrence of an undesirable material stress level at that particular needle location on the electronics component to be separated.

[0034] Alternatively or combined, the orientation of the electronics component to be separated can be adjusted relative to the component separation section and relative to the plurality of ejector needles, thereby relocating the pressure contacts between the various needles and the electronics component and accordingly minimizing or diminishing any material stress level from occurring. Additionally, the control unit may alter the operation of the component pick up unit thereby likewise avoiding or minimizing material stress levels from occurring due to the contact between the component pick up unit and the electronics component to be picked up.

[0035] BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The disclosure will now be discussed with reference to the drawings, which show in:

[0037] Figure 1 an example of an apparatus according to the disclosure;

[0038] Figure 2a a detail of an apparatus according to the disclosure;

[0039] Figure 2b another detail of an apparatus according to the disclosure; Figures 3a and 3b further details of an apparatus according to the disclosure;Figure 4 a depiction of a virtual pressure characteristic exerted on a virtual electronics component mounted on a virtual flexible, adhesive film as determined in a virtual operation environment in accordance with the method according to the disclosure;

[0040] Figure 5 a further detail of the method and apparatus according to the disclosure.

[0041] DETAILED DESCRIPTION OF THE DISCLOSURE

[0042] For a proper understanding of the disclosure, in the detailed description below corresponding elements or parts of the disclosure will be denoted with identical reference numerals in the drawings.

[0043] Figures 1 and 2a depict an example as well as a detail of an apparatus for separating an electronics component from a flexible, adhesive film according to the disclosure.

[0044] As outlined in the introduction, conventional semiconductor chip manufacturing involves the processing of semiconductor wafers with on one side an array of semiconductor devices. As depicted in Figure 2, these wafers are then sliced into individual chips or dies 11 using known dicing techniques after being mounted on flexible, adhesive wafer handling tape or film 10. The flexible, adhesive film 10 holds the plurality of individual semiconductor dies 11 and aids in transport during the subsequent semiconductor die handling and mounting process steps.

[0045] The individual semiconductor dies 11 are separated from the flexible, adhesive tape 10 by a separating apparatus, denoted reference numeral 100, and the separated semiconductor dies 11 are subsequently handled separated by pick-and-place equipment, e.g. placed on a lead frame etc. in an automated manner and there is ongoing need to avoid any damage to the separated electronics component during the separation process.

[0046] An improved apparatus and method for separating an individual electronics component from a flexible, adhesive film is herewith presented in detail, capable of ascertaining or detecting a possible (and unwanted) occurrence of diecrack in advance and to prevent die-crack from occurring during the pickup of large thin semiconductor dies.

[0047] As shown in Figure 1, the apparatus according to the disclosure is denoted with reference numeral 100 and is capable in separating an electronicscomponent 11 , such as an electronics component or a light emitting device, LED, from a flexible, adhesive film 10. The flexible, adhesive film 10 has a first, adhesive film surface 10a and a second, bottom film surface 10b, opposite to the first film surface 10a. The first, adhesive film surface 10a carries a large number of electronics components 11 often arranged in an array, e.g. a semiconductor die or another type of electronics component (resistor, LED, etc. etc.). For the sake of clarity, the disclosure will be explained with the processing or separation of semiconductors dies 11 from the flexible, adhesive film 10. Furthermore, for the sake of simplicity for clarifying the phenomenon of die-crack (or electronics component damage during separation) and the improved separation principle of the present disclosure, the Figures depict the flexible, adhesive film 10 having only one electronics component 11 to be separated.

[0048] The electronics component 11 (semiconductors die) has a first component side 11a and a second component side 11b, opposite to the first component side 11a. For a proper understanding of the disclosure, it is noted that the electronics component 11 is adhered to the first, adhesive film surface 10a of the flexible, adhesive film 10 with its second component side 11b, whereas the exposed first component side 11a is intended to be grasped in a suitable manner by a component pick up unit 120 and separated from the flexible, adhesive film 10.

[0049] The apparatus 100 is provided with a support platform 110 having a support surface 110a. The support surface 110a serve to receive and accommodate the flexible, adhesive film 10 holding the plurality of individual semiconductor dies 11 , as shown in Figure 2. The support surface 110a has a component separation section 111, which section is provided with a plurality of through openings 112 arranged in an array and passing from the support surface through the support platform 110. Reference numeral 130 denotes a needle ejector unit placed directly beneath the component separation section 111. The needle ejector unit 130 comprises an array composed of a plurality of ejector needles 131, with the array of needles 131 being conformal to the array of through openings 112.

[0050] A component pick up unit 120 is mounted above the support platform 110 and is movable with respect to the component separation section 111 with the assistance of a proper actuator unit 121. It implements a component pick up surface 120a which interacts with the exposed first component side 11a of the electronics component 11.Additionally, the apparatus 100 comprises a control unit 140 intended to operate at least the component pick up unit 120 I actuator unit 121 via the control line 120z and the array of the plurality of ejector needles 131 I needle ejector unit 130 via the control line 130z.

[0051] According to the disclosure the apparatus 100 is provided with a processing unit denoted with reference numeral 150. As depicted in Figure 2b and Figure 5, processing unit 150 implements computer software code representing a virtual operation environment 200 of the apparatus 100, denoted in the virtual environment with reference numeral 2100. The computer program code calculates a virtual pressure characteristic 201, to which a virtual electronics component 211 is subjected as if the virtual electronics component 211 is picked up for separation by a virtual component pick up unit 2120 from a virtual flexible, adhesive film 210 mounted on the virtual support platform 2110. The virtual flexible, adhesive film 210 is being actuated and lifted by one or more virtual ejector needles 2131 of the virtual ejector needle unit 2130.

[0052] In order to properly and accurately calculate the virtual pressure characteristic 201, the processing unit 150 needs to be programmed or inputted with information, which at least comprises real time position information of the plurality of real ejector needles 131 in a first operational condition of the apparatus 100 with no flexible, adhesive film accommodated on the support platform 110 and force sensor data from the ejector needle unit 130 (or preferably associated with every individual ejector needle 131), which force sensor data is collected during real actual operation by suitable sensors (discussed below), which sensors collect the relevant force sensor data and pass the data through the signal input line 120q from the component pick up unit 120 or the signal input line 130q from the ejector needle unit 130.

[0053] Thus, the processing unit 150 provides with the virtual operation environment 200 a simulation model of an apparatus 100. The simulation model is composed and programmed amongst other with the geometry of the pick-up apparatus 100 (virtual version denoted with 2100 in Figure 2b), such as dimensions as to the support platform 110 (virtual version denoted with 2110), as to the needle ejector unit 130 (2130) (such as number of needles 131 / through openings 112, their needle / opening diameters and needle height as well as the needle push up force or push up speed when actuated), dimensions and characteristics of the flexible, adhesive film 10 (such as film material, film thickness, film flexibility, adhesive properties, etc.), as to the dimensions of the electronics component 11 (211) to beseparated (as well as its surface topology, and substrate technology e.g. trenched or structured, which interacts with the component pick up unit 120), as well as to the component pick up unit 120 (denoted as 2120, such as contact pressure exerted on the electronics component 11 by the pick up surface 120a).

[0054] With the simulation model 200 the operation of the apparatus 100 (2100) is simulated, as if it is processing an imaginary electronics component 211 to be separating from the imaginary flexible film 210. The simulation of the operation of the apparatus 100 (2100) results in the calculation of the virtual pressure characteristic 201 showing the pressure levels in the imaginary electronics component 211 caused by a simulated actuation of the ejector needle unit 2130 and the imaginary ejector needles 2131 pushing against the imaginary flexible film 210 and elevating the film 210 and the electronics component 211 from the imaginary support platform 2110 together with the interaction between the elevated electronics component 211 and the virtual component pick up unit 2120 as to contacting and picking up (separating) from the film 210 through vacuum.

[0055] Based on the virtual pressure characteristic 201 thus calculated, the processing unit 150 controls, in a second operational condition with the flexible, adhesive film 10 accommodated on the support platform 110 with the at least one electronics component 11 to be separated being oriented at the component separation section 111, the separation of the electronics component 11 from the flexible, adhesive film 10.

[0056] The separation of the electronics component 11 from the film 10 based on the virtual pressure characteristic 201 is performed by the processing unit 150 e.g. by proper control of the control unit 140 via the process control line 150z, which control unit 140 in turn properly operates at least the component pick up unit 120 (in particular the actuator unit 121) via the control line 120z and the array of the plurality of ejector needles 131 through proper actuation of the needle ejector unit 130 via the control line 130z.

[0057] The virtual pressure characteristic 201 as calculated by the processing unit 150 represents thin-die stress levels, which are based on the geometry of the pick-up apparatus 100, the dimensions of the electronics component 11 to be separated, as well as its surface and substrate topology (here is meant the semiconductor bulk material which composes the component 11). which interacts with the component pick up unit 120. These data are likewise inputted into the processing unit 150 and used for the calculation. As the apparatus 100 is subsequently operatedin accordance with the virtual pressure characteristic 201 as calculated any risk of diecrack during the pickup process by the component pick up unit 120 is minimized.

[0058] This improves the quality of thin die pickup processing, and the human factor for given assembly parameters, tools and die dimensions are eliminated. In addition, it also safeguards against any fluctuating external changes e.g. aging and wear of the various parts of the apparatus 100, such as broken needles 131, dirt particles, material defects in the film 10, etc.

[0059] In order to provide the processing unit 150 with the correct data to calculate the virtual pressure characteristic 201, the apparatus 100 implements a detection device 170, which is structured to detect the positions of the plurality of ejector needles 131 in the first operational condition and to convert these positions in corresponding position information for the processing unit 150. The detection of the actual positions of the plurality of ejector needles 131 when activated in the first operational condition and inputting these actual needle positions in the virtual operation environment 201 allows the processing unit 150 to determine the thin-die stress levels as the inline computed virtual pressure characteristic 201 and ascertains a proper adaptation of the actual separating and picking up process with the component pick up unit 120. This eliminates any die-crack and yield loss.

[0060] In two particular examples, the positions of the plurality of ejector needles 131 in the first operational condition are detected by the detection device implementing a vision camera 170 and / or implementing a voice coil linear actuator 171, the latter being implemented or being part of the needle ejector unit 130 and detecting the various actual height positions of the actuated individual ejector needles 131 (e.g. denoted with Az in Figure 1). In the first example, image data collected by the vision camera 170 and representing the corresponding position information of those actuated needles 131 is inputted via signal input line 170q to the processing unit 150, whereas in the latter example the position information as collected by the voice coil linear actuator 171 is inputted into the processing unit 150 via the signal input line 130q.

[0061] In to detect of the various Az positions of the plurality of ejector needles 131 in the first operational condition in a correct manner, the control unit 140 is capable to actuate - via the signal control line 130z - the ejector needle unit 130 and thus the plurality of ejector needles 131 in such manner, that the later to move through their corresponding through opening 121 and through and above the support platform 110. Herewith it is possible to detect their actual position, in particularthe actual heightposition Az of each needle tip 131a, above the mounting surface 110a of the support platform 110, e.g. through visualization with the vision camera 170 or with the voice coil linear actuator 171. The position information thus determined can be inputted in the processing unit 150 via signal input lines 130q and / or 170q.

[0062] In the second operational condition, that is during the actual separation of an electronics component 11 from the flexible, adhesive film 10 in response to the virtual pressure characteristic 201 thus determined, the control unit 140 may detect whether the separation is successful or not. Accordingly, the apparatus 100 may implement sensors to measure forces applied or exerted on the electronics component 11, either by the actuated and elevated ejector needles 131 and / or the component pick up unit 120. Suitable force sensing sensors could include strain gauges, force transducers, motor induction or other technologies.

[0063] For example, the sensors (e.g. strain gauges or (compression) force sensors) are schematically denoted with reference numeral 172 and mounted on the connecting rod 122 interconnecting the component pick up unit 120 with the actuator unit 121. Alternatively, such sensors (strain gauges or (compression) force sensors) can be mounted or incorporated in the actuator of the needle ejector unit 130, such as the linear voice coil actuator 171 as depicted, each sensor detecting the actuation of an individual ejector needle 131 as to its actuation height, actuation speed, and force detected due to the contact between the actuated ejector needle 131 and the flexible, adhesive film 10 placed on the support platform 110. Alternatively, each sensor (now denoted as 173) could be mounted at the base of each individual ejector needle 131, capable of detecting its actuation as to its actuation height, actuation speed, and force detected. An alternative solution is to use the motor induction current induced in the actuation unit of the ejector needles 131 and / or the component pick up unit 120 as sensor signal.

[0064] In the above examples, the relevant force sensor data is being collected by sensors 171 and / or 172 and passed through the signal input lines 120q from the component pick up unit 120 or the signal input line 130q from the ejector needle unit 130 to the processing unit 150. Herewith it can be ascertained whether the actual real-life adaptation of the separating and picking up process with the component pick up unit 120 as programmed by the processing unit 150 and based on the calculated virtual pressure characteristic 201 is correct.

[0065] The actual real-life adaptation of the separating and picking up process with the component pick up unit 120 in the second operational condition asprogrammed by the processing unit 150 and based on the calculated virtual pressure characteristic 201 may be achieved with the processing unit 150 through proper adjustment of the actuation of the needle ejector unit 130 I the plurality of ejector needles 131, and / or by proper adjustment of the operation of the component pick up unit 120, and / or by proper adjustment of the orientation of the electronics component I I to be separated relative to the component separation section 111.

[0066] In the first adjustment possibility, the processing unit 150 may adjust in the second operational condition the number of ejector needles 131 to be actuated and / or the actuation height of the actuated ejector needles 131. As an explanation reference is made to Figures 3a and 3b which depict an electronics component 11 mounted on the flexible film 10 and positioned at the component separation section I I I just above the array of ejector needles 131.

[0067] Due to its orientation of the electronics component 11 relative to the array of ejector needles, certain ejector needles 131, through their elevation through their corresponding through opening and above the mounting surface 110a of the support platform 110, will contact the flexible, adhesive film 10 and accordingly elevate the electronics component 11 to be separated.

[0068] The elevation of the ejector needles 131 may result in unwanted pressure contacts at certain fragile areas of the electronics component 11. Such fragile area is e.g. denoted with reference numeral 11z in Figure 3a and may be formed by an corner part of the electronics component 11. Such material stress levels are computed and identified in the initial, virtual pressure characteristic 201 calculated on an identical, yet virtual, electronics component 211 in the virtual operation environment 200.

[0069] To avoid these undesirable material stress levels in real-time, that is in the second operational condition when the actual electronics component 11 is to be separated from the flexible, adhesive film 10 through needle actuation and elevation, the processing unit 150 and the control unit 140 can adjust the actuation of the plurality of ejector needles 131 such that the particular ejector needle 131, which will contact the fragile area 11z of the electronics component 11, is not activated. Alternatively, one or more particular ejector needles may be activated in order to equalize the material stress distribution over the electronics component 11. In another alternative, equalization of the material stress distribution forces can be achieved by actuating and elevating one or more particular ejector needles of the array till a lower (or higher) needle height or with an adjusted push up force or push up speed.In all adjustment principles outlined above, the occurrence of an undesirable material stress levels at particular needle locations on the electronics component 11 to be separated are avoided or even prevented.

[0070] In a further sophisticated adjustment principle, the orientation of the electronics component 11 to be separated can be adjusted relative to the component separation section 111 and relative to the array of plurality of ejector needles 131. To this end, the apparatus 100 may comprise a displacement unit 160 which can be properly controlled by the control unit 140 through control line 160z. Actuation of the displacement unit 160 results in a displacement of the flexible film 10 and the electronics components 11 mounted thereon relative to the support platform 110 in an xy-plane (see Figure 1 and more in particular Figure 2a, with the z-degree of freedom being considered the elevation direction of the film 10 and the component 11 perpendicular to the xy-plane formed by the support platform 110). The relocation of the electronics components 11 likewise relocates any pressure contacts between the various needles 131 and the electronics component 11. Thus, when the separation process is performed after relocation of the electronics component 11, any material stress level as previously predicted and calculated in the virtual pressure characteristic 201 in the virtual environment 200 will not be exerted on the electronics component 11, but minimized or even diminished.

[0071] In a further adjustment principle, the control unit 140 may adapt the operation of the component pick up unit 120, e.g. thereby likewise avoiding or minimizing material stress levels from occurring due to the contact between the component pick up unit 120 (in particular the pick up surface 120a) and the exposed surface 11 a of the electronics component 11 to be picked up.

[0072] The apparatus 100 according to the disclosure is thus capable of performing a separation method comprising the steps of:

[0073] i) determining, in a virtual operation environment 200, a virtual pressure characteristic 201 exerted on a virtual electronics component 211 mounted on a virtual flexible, adhesive film 210 based on position information of the plurality of ejector needles 131 in a first operational condition with no flexible, adhesive film accommodated on the support platform; and

[0074] ii) controlling, in a second operational condition with the flexible, adhesive film 10 accommodated on the support platform 110 with the at least one electronics component 11 to be separated being oriented at the component separation section111, the separation of the electronics component 11 from the flexible, adhesive film 10 in response to the virtual pressure characteristic 201 thus determined.

[0075] Herewith, as explained above, in the virtual operation environment 200 and under the conditions of the first operational condition, a virtual pressure characteristic 201 is calculated. The inline computed virtual pressure characteristic 201 represents thin-die stress levels, which are based on the geometry of the pick-up apparatus 100, the dimensions of the electronics component 11 to be separated, as well as its surface topology which interacts with the component pick up unit 120. Herewith the risk of die-crack during the pickup process by the component pick up unit are minimized. Accordingly, the quality and yield of thin die pickup processing is improved, and the human factor for given assembly parameters, tools and die dimensions are eliminated. Any drift and other external factors and wear of parts of the apparatus 100 and tear can be corrected for. Wirth the present disclosure, it is possible to optimize existing stable processes more efficiently, since the computational virtual operation environment 200 will be able to explore all parameters that influence the limits of a stable and fast process window.

[0076] In a further step iii), with the use of a detection device 170, the positions of the plurality of ejector needles 131 in the first operational condition are detected and in step iv) these positions as detected are converted in corresponding position information, which are in turn used, in the virtual operation environment 200 and under the conditions of the first operational condition, to calculate the virtual pressure characteristic 201.

[0077] The step i) of determining is performed by either using a vision camera 170 and / or by using voice coil linear actuator 171 and / or by another type of force sensor 171-172.LIST OF REFERENCE NUMERALS USED

[0078] 10 flexible, adhesive film

[0079] 10a first, adhesive film surface

[0080] 10b second, bottom film surface

[0081] 11 electronics component

[0082] 11 a first component surface

[0083] I I b second component surface

[0084] 100 electronics component separation apparatus according to the disclosure 110 support platform

[0085] 110a support surface

[0086] I I I component separation section

[0087] 112 through opening

[0088] 120 component pick up unit

[0089] 120a pick up surface

[0090] 120q signal input line of component pick up unit

[0091] 120z control line for component pick up unit

[0092] 121 actuator unit of component pick up unit

[0093] 122 connecting rod between actuator unit and component pick up unit 130 needle ejector unit

[0094] 130q signal input line of needle ejector unit

[0095] 130z control line for needle ejector unit

[0096] 131 ejector needle

[0097] 131a tip of ejector needle

[0098] 131b base of ejector needle

[0099] 140 control unit

[0100] 150 processing unit

[0101] 150z processing control line for control unit

[0102] 160 displacement unit for flexible, adhesive film (and electronics component) 160z control line for displacement unit

[0103] 170 detection device I vision camera

[0104] 170q signal input line of detection device

[0105] 171 force sensing sensor I voice coil linear actuator

[0106] 172 force sensing sensor I voice coil linear actuator

[0107] 173 force sensing sensor / voice coil linear actuator200 virtual operation environment 201 virtual pressure characteristic 210 virtual flexible, adhesive film 211 virtual electronics component 2100 virtual apparatus

[0108] 2110 virtual support platform 2120 virtual component pick up unit 2130 virtual ejector needle unit 2131 virtual ejector needle

Claims

CLAIMS1. An apparatus for separating an electronics component, such as an electronics component or a light emitting device, LED, from a flexible, adhesive film, the apparatus comprising:a support platform having a support surface provided with a component separation section having a plurality of through openings;a needle ejector unit comprising an array composed of a plurality of ejector needles;a component pick up unit mounted above the support platform and movable with respect to the component separation section, as well asa control unit for operating at least the component pick up unit and the array of the plurality of ejector needles, as well asa processing unit structured to determine, in a virtual operation environment, a virtual pressure characteristic exerted on a virtual electronics component mounted on a virtual flexible, adhesive film based on position information of the plurality of ejector needles in a first operational condition with no flexible, adhesive film accommodated on the support platform and for controlling, in a second operational condition with the flexible, adhesive film accommodated on the support platform with the at least one electronics component to be separated being oriented at the component separation section, the separation of an electronics component from a flexible, adhesive film in response to the virtual pressure characteristic thus determined.

2. The apparatus according to claim 1, further comprising a detection device structured to detect the positions of the plurality of ejector needles in the first operational condition and to convert the positions in corresponding position information.

3. The apparatus according to claim 1 or 2, wherein the detection device comprises a vision camera.

4. The apparatus according to claim 1 or 2, wherein the detection device comprises a voice coil linear actuator.

5. The apparatus according to any one or more of the preceding claims, wherein the control unit is structured, in the first operational condition, to actuate the plurality of ejector needles, causing the plurality of ejector needles to move through the corresponding through opening.

6. The apparatus according to any one or more of the preceding claims, wherein, in the second operational condition, the processing unit is structured to detect the separation of an electronics component from a flexible, adhesive film in response to the virtual pressure characteristic thus determined.

7. The apparatus according to any one or more of the preceding claims, wherein, in the second operational condition, the processing unit is structured to:to adjust the actuation of the plurality of ejector needles, and / or to adjust the operation of the at least the component pick up unit, and / or to adjust the orientation of the at least one electronics component to be separated relative to the component separation section.

8. The apparatus according to claim 7, wherein, in the second operational condition, the processing unit is structured to adjust the number of ejector needles to be actuated and / or the actuation height of the actuated ejector needles.

9. A method for controlling an apparatus according to any one or more of the claims 1-8, the method comprising the steps of:i) determining, in a virtual operation environment, a virtual pressure characteristic exerted on a virtual electronics component mounted on a virtual flexible, adhesive film based on position information of the plurality of ejector needles in a first operational condition with no flexible, adhesive film accommodated on the support platform; andii) controlling, in a second operational condition with the flexible, adhesive film accommodated on the support platform with the at least one electronics component to be separated being oriented at the component separation section, the separation of an electronics component from a flexible, adhesive film in response to the virtual pressure characteristic thus determined.

10. The method according to claim 9, further comprising the step of: iii) detecting, using a detection device, the positions of the plurality of ejector needles in the first operational condition andiv) converting the positions in corresponding position information.

11. The method according to claim 9 or 10, wherein the step i) of determining is performed using a vision camera.

12. The method according to claim 9 or 10, wherein the step i) of determining is performed using voice coil linear actuator.

13. The method according to any one or more of the claims 9-12, further comprising the step of:v) actuating, in the first operational condition using the control device of the apparatus, the plurality of ejector needles, causing the plurality of ejector needles to move through the corresponding through opening.

14. The method according to any one or more of the claims 9-13, further comprising the step of:vi) detecting, in the second operational condition by the processing unit of the apparatus the separation of an electronics component from a flexible, adhesive film in response to the virtual pressure characteristic thus determined.

15. The method according to any one or more of the claims 9-14, further comprising the steps of, by the processing unit of the apparatus in the second operational condition,vii) adjusting the actuation of the plurality of ejector needles, and / or viii) adjusting the operation of the at least the component pick up unit, and / or ix) adjusting the orientation of the at least one electronics component to be separated relative to the component separation section.

16. The method according to claim 15, further comprising the step of: x) adjusting, in the second operational condition by the processing unit of the apparatus, the number of ejector needles to be actuated and / or the actuation height of the actuated ejector needles.

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