The invention provides a multi-layer compound passivation film structure of a Bipolar circuit, which comprises a bottom silicon oxide film layer and a silicon nitride film layer, wherein the silicon oxide film layer is deposited on the surface of a silicon substrate, and the silicon nitride film layer is deposited on the silicon oxide film layer; a certain proportion of phosphine is doped in the silicon oxide film layer; and the silicon oxide film layer sequentially comprises an undoped silicon oxide layer, a doped phosphorosilicate glass layer and an undoped silicon oxide layer. Meanwhile, the invention also provides a manufacturing process of the multi-layer compound passivation film of the Bipolar circuit. The multi-layer compound passivation film structure of the Bipolar circuit has scratch resistance, moisture resistance, high density, low film stress, higher impurity absorbing ability, better step covering ability and excellent photoelectric properties, electrical characteristics and heat stability, reduces the soft breakdown, and solves the problems of poor reliability, and the like.