The invention relates to the technical field of
silicon nitride etching, in particular to an ultra-low power
dry etching method for
silicon nitride, which comprises the following steps of: S1, fixing a workpiece to be etched on a chuck of a
plasma etching machine, closing a cavity, and vacuumizing until the background pressure of the cavity is less than or equal to 2mTorr; s2, composite
etching gas is introduced into the cavity; s3, starting a pulse
radio frequency power supply to excite the composite gas to generate
plasma; s4, regulating and controlling parameters of the chamber; s5, vacuumizing after etching is completed, and then introducing
helium gas to purge the chamber until the pressure of the chamber is recovered to
atmospheric pressure; s6,
mixed gas is introduced, H2
plasma is introduced after
ashing treatment, and etching is completed after dangling bonds on the surface of the
silicon nitride are repaired. The invention discloses a method for
dry etching of
silicon nitride with extremely low power, and relates to the technical field of
semiconductor manufacturing. According to the method, high-efficiency, high-selectivity and low-damage etching of the
silicon nitride layer is realized under the extremely low
radio frequency power through the
collaborative design of composite gas
system accurate proportioning, pulse
radio frequency excitation and multi-field
coupling process regulation and control.