The invention provides an electroless tin plating solution, the components of which include stannous sulfate or stannous chloride, concentrated sulfuric acid, sodium hypophosphite, pyrithione hydrochloride, 4,4'-(2-pyridine methylene) di Phenol, Schiff base, polyethylene glycol 6000, amidinothiourea, etc. The tin plating solution is used to replace tin on the surface of steel, copper or copper alloy materials. The working temperature is 20-65°C, the plating time is 30-90 seconds, the thickness of the coating is 0.45-1.42μm, and the plating solution can be stored stably at room temperature. More than 90 days.