Inorganic light-weight heat insulation mortar composite XPS heat insulation plate

Abstract

The invention discloses an inorganic light-weight heat insulation mortar composite XPS heat insulation plate, which comprises an XPS base plate, an interface agent layer and an inorganic light-weight heat insulation mortar layer, wherein grooves are formed in the front side and the back side of the XPS base plate; the inorganic light-weight heat insulation mortar layer is compounded with gridding cloth; the interface agent layer is arranged on the XPS base plate provided with the grooves at the front side and the back side; and the inorganic light-weight heat insulation mortar layer compounded with the gridding cloth is arranged on the interface agent layer. Compared with the prior art, the inorganic light-weight heat insulation mortar composite XPS heat insulation plate has the advantages that the thermal performance of a prepared stage A fireproof heat insulation plate is uniform; the efficient heat insulation effect is achieved; good fireproof performance is also realized; and the inorganic light-weight heat insulation mortar composite XPS heat insulation plate can be used as a heat insulation plate material to be widely used for building wall bodies.

Description

technical field

[0001] The invention relates to building thermal insulation materials, in particular to an inorganic lightweight thermal insulation mortar composite XPS thermal insulation board. Background technique

[0002] In recent years, the fires of building external insulation materials have caused serious casualties and property losses. Building flammable and combustible external organic insulation materials have become a new type of fire hazard. Relevant national departments have issued documents to limit the use of flammable and combustible insulation materials. Although inorganic thermal insulation materials have many advantages such as high strength and fire prevention, their thermal insulation effect is far inferior to that of organic materials, and their construction techniques and methods are not as mature and convenient as organic materials.

[0003] Most of the A-grade materials on the market now have disadvantages such as poor thermal insulation performance,...

Examples

Embodiment 1

[0030] Inorganic lightweight thermal insulation mortar composite XPS thermal insulation board of the present embodiment is as figure 1 , 2 As shown; it includes an XPS substrate 3 with grooves 1 and 2 on the front and back sides, an interface agent layer 4, and an inorganic lightweight thermal insulation mortar layer; the interface agent layer 4 is arranged on the XPS substrate 3, and the inorganic lightweight thermal insulation mortar layer The mortar layer is set on the interface agent layer 4 . The inorganic lightweight thermal insulation mortar layer is an inorganic lightweight thermal insulation mortar layer of composite grid cloth, specifically including an inorganic lightweight thermal insulation mortar filling layer 5, an intermediate alkali-resistant coating grid cloth layer 6 and an inorganic lightweight thermal insulation mortar coating Layer 7; the interface agent layer 4 in the grooves 1 and 2 of the XPS substrate 3 is filled with an inorganic lightweight thermal...

Embodiment 2

[0043] Inorganic lightweight thermal insulation mortar composite XPS thermal insulation board of the present embodiment is as figure 1 , 3 Shown; Its structure is basically the same as embodiment 1, and difference is:

[0044] In this embodiment, the XPS substrate 3 with grooves 1 and 2 on the front and back is specifically: a plurality of continuous longitudinal V-shaped grooves 1 (5 mm ± 0.2 mm in depth and 5 mm ± 5 mm in width) respectively arranged on the front and back of the XPS substrate 3 0.2mm), perpendicular to the direction of the V-shaped groove 1, U-shaped grooves 2 with a spacing of 400mm (the depth is 10mm±0.2mm, and the width is 10mm±0.2mm); The grooves 1 correspond to the peaks and valleys, and the U-shaped grooves 2 are equidistant from each other. This XPS substrate 3 is a B1 grade XPS substrate with an average thickness of 40 mm.

[0045] The preparation method is as follows:

[0046]Step 1. Use the B1 grade XPS substrate with an average thickness of 40...

Embodiment 3

[0056] Inorganic lightweight thermal insulation mortar composite XPS thermal insulation board of the present embodiment is as figure 1 , 4 Shown; Its structure is basically the same as embodiment 1, and difference is:

[0057] In this embodiment, the XPS substrate 3 with grooves 1 and 2 on the front and back sides is specifically: the front and back sides of the XPS substrate 3 are respectively provided with a number of continuous V-shaped grooves 1 at an oblique angle of 45 degrees (the depth is 5 mm ± 0.2 mm, The width is 5 mm ± 0.2 mm), and the U-shaped groove 2 with a distance of 440 mm is arranged perpendicular to the direction of the V-shaped groove 1 (the depth is 10 mm ± 0.2 mm, and the width is 10 mm ± 0.2 mm); the front and back sides of the XPS substrate 3 The peaks and valleys of the V-shaped grooves 1 correspond to each other, and the U-shaped grooves 2 are equidistant from each other. This XPS substrate 3 is a B1 grade XPS substrate with an average thickness of...

technical field

[0001] The invention relates to building thermal insulation materials, in particular to an inorganic lightweight thermal insulation mortar composite XPS thermal insulation board. Background technique

[0002] In recent years, the fires of building external insulation materials have caused serious casualties and property losses. Building flammable and combustible external organic insulation materials have become a new type of fire hazard. Relevant national departments have issued documents to limit the use of flammable and combustible insulation materials. Although inorganic thermal insulation materials have many advantages such as high strength and fire prevention, their thermal insulation effect is far inferior to that of organic materials, and their construction techniques and methods are not as mature and convenient as organic materials.

[0003] Most of the A-grade materials on the market now have disadvantages such as poor thermal insulation performance,...

Examples

Embodiment 1

[0030] Inorganic lightweight thermal insulation mortar composite XPS thermal insulation board of the present embodiment is as figure 1 , 2 As shown; it includes an XPS substrate 3 with grooves 1 and 2 on the front and back sides, an interface agent layer 4, and an inorganic lightweight thermal insulation mortar layer; the interface agent layer 4 is arranged on the XPS substrate 3, and the inorganic lightweight thermal insulation mortar layer The mortar layer is set on the interface agent layer 4 . The inorganic lightweight thermal insulation mortar layer is an inorganic lightweight thermal insulation mortar layer of composite grid cloth, specifically including an inorganic lightweight thermal insulation mortar filling layer 5, an intermediate alkali-resistant coating grid cloth layer 6 and an inorganic lightweight thermal insulation mortar coating Layer 7; the interface agent layer 4 in the grooves 1 and 2 of the XPS substrate 3 is filled with an inorganic lightweight thermal...

Embodiment 2

[0043] Inorganic lightweight thermal insulation mortar composite XPS thermal insulation board of the present embodiment is as figure 1 , 3 Shown; Its structure is basically the same as embodiment 1, and difference is:

[0044] In this embodiment, the XPS substrate 3 with grooves 1 and 2 on the front and back is specifically: a plurality of continuous longitudinal V-shaped grooves 1 (5 mm ± 0.2 mm in depth and 5 mm ± 5 mm in width) respectively arranged on the front and back of the XPS substrate 3 0.2mm), perpendicular to the direction of the V-shaped groove 1, U-shaped grooves 2 with a spacing of 400mm (the depth is 10mm±0.2mm, and the width is 10mm±0.2mm); The grooves 1 correspond to the peaks and valleys, and the U-shaped grooves 2 are equidistant from each other. This XPS substrate 3 is a B1 grade XPS substrate with an average thickness of 40 mm.

[0045] The preparation method is as follows:

[0046]Step 1. Use the B1 grade XPS substrate with an average thickness of 40...

Embodiment 3

[0056] Inorganic lightweight thermal insulation mortar composite XPS thermal insulation board of the present embodiment is as figure 1 , 4 Shown; Its structure is basically the same as embodiment 1, and difference is:

[0057] In this embodiment, the XPS substrate 3 with grooves 1 and 2 on the front and back sides is specifically: the front and back sides of the XPS substrate 3 are respectively provided with a number of continuous V-shaped grooves 1 at an oblique angle of 45 degrees (the depth is 5 mm ± 0.2 mm, The width is 5 mm ± 0.2 mm), and the U-shaped groove 2 with a distance of 440 mm is arranged perpendicular to the direction of the V-shaped groove 1 (the depth is 10 mm ± 0.2 mm, and the width is 10 mm ± 0.2 mm); the front and back sides of the XPS substrate 3 The peaks and valleys of the V-shaped grooves 1 correspond to each other, and the U-shaped grooves 2 are equidistant from each other. This XPS substrate 3 is a B1 grade XPS substrate with an average thickness of...

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